MLX92251LSE-AXA [MELEXIS]

Dual Hall Effect Latch with Speed & Direction Detection;
MLX92251LSE-AXA
型号: MLX92251LSE-AXA
厂家: Melexis Microelectronic Systems    Melexis Microelectronic Systems
描述:

Dual Hall Effect Latch with Speed & Direction Detection

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MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction Detection  
Features and Benefits  
Applications  
.
.
Operating Voltage from 2.7V to 24V  
Two Integrated Hall plates for Direction  
Detection  
Latching Magnetic Characteristics  
Speed & Direction Open-Drain Outputs  
Direction Output updated prior Speed  
Output  
.
.
.
.
.
Windows lifter with Anti-Pinch feature  
Rotation speed & direction detection  
Linear speed & direction detection  
Angular position detection  
.
.
.
Power closures with Anti-Pinch features  
.
.
.
.
Excellent Temperature Stability  
Reverse Supply Voltage Protection  
Output Current Limitation and Auto-Shutoff  
Under-Voltage Lockout Protection  
Ordering information  
Part No.  
MLX92251LSE-AAA-000-RE  
MLX92251LSE-ABA-000-RE  
Temperature Code  
L (-40°C to 150°C)  
L (-40°C to 150°C)  
Sensitivity  
± 7.5 mT  
± 2.5 mT  
Package Code  
SE (TSOT-5L)  
SE (TSOT-5L)  
Packing Form  
RE (Tape & Reel)  
RE (Tape & Reel)  
Legend:  
Temperature Code:  
Package Code:  
L for Temperature Range -40°C to 150°C  
SE for TSOT,  
Packing Form:  
RE for Reel  
Ordering example:  
MLX92251LSE-AAA-000-RE  
1. Functional Diagram  
spacing of 1.45mm between the sensing elements. The  
first Hall plate signal is used to provide the speed signal  
output. The combination of both the first and second Hall  
plate signals is then internally processed to directly deliver  
a direction signal output.  
VDD  
Voltage Regulator  
with Reverse Polarity  
Protection  
Switched  
Hall  
Plate  
CDS  
SP  
Amplifier  
Open-Drain  
Output  
The MLX92251 shares the MLX922xx-based platform,  
synonym of high performance in terms of electrical  
specification, magnetic specification and protection level.  
Switched  
Hall  
Plate  
CDS  
Amplifier  
DIR  
Open-Drain  
Output  
Direction  
Detection  
With latching magnetic characteristics, the speed (SP)  
output is turned low or high respectively with a sufficiently  
strong South or North pole facing the package top side.  
When removing the magnetic field, the device keeps its  
previous state.  
Timing  
Logic  
Reference  
GND  
2. General Description  
The direction (DIR) output is latched in Low or High state  
depending on the movement direction of the applied  
magnetic field, as a result of certain magnetic pulse  
sequence on both Hall sensors.  
The Melexis MLX92251 is a second generation Hall-effect  
dual latch designed in mixed signal CMOS technology. The  
device integrates a voltage regulator, two Hall sensors with  
advanced offset cancellation system and two open-drain  
output drivers, all in a single package.  
The MLX92251 is delivered in a Green compliant 5-pin Thin  
Small Outline Transistor (TSOT) for surface-mount process.  
Two Hall plates are integrated on the same piece of silicon,  
thus using the high precision of the wafer fabrication  
process to ensure a fixed  
REVISION 004 JUNE 03, 2019  
Page 1 of 13  
 
 
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
Contents  
1. Functional Diagram................................................................................................................................1  
2. General Description ...............................................................................................................................1  
3. Glossary of Terms...................................................................................................................................3  
4. Absolute Maximum Ratings....................................................................................................................3  
5. General Electrical Specifications.............................................................................................................4  
6. Magnetic Specifications .........................................................................................................................5  
6.1. MLX92251LSE-AAA-000 ..................................................................................................................... 5  
6.2. MLX92251LSE-ABA-000...................................................................................................................... 5  
7. Output Behaviour versus Magnetic Pole ................................................................................................6  
8. Application Information .........................................................................................................................7  
8.1. Default Application Schematic........................................................................................................... 7  
8.2. Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b)..................................... 7  
8.3. Speed (SP) Output Behavior vs. BOP/BRP......................................................................................... 7  
8.4. Output Jitter, Speed Signal Delay and Direction Detection ............................................................. 8  
8.5. UV lockout and POR behaviour.......................................................................................................... 8  
9. Performance Graphs..............................................................................................................................9  
9.1. Magnetic parameters vs. TA ............................................................................................................... 9  
9.2. Magnetic parameters vs. VDD............................................................................................................. 9  
9.3. VDSON vs. TA .......................................................................................................................................... 9  
9.4. VDSON vs. VDD ........................................................................................................................................ 9  
9.5. IDD vs. TA............................................................................................................................................... 9  
9.6. IDD vs. VDD ............................................................................................................................................ 9  
9.7. ILEAK vs. TA .......................................................................................................................................... 10  
9.8. ILEAK vs. VDD ........................................................................................................................................ 10  
9.9. Power Derating vs. TA ....................................................................................................................... 10  
10. Standard information regarding manufacturability of Melexis products with different soldering  
processes ............................................................................................................................................11  
11. ESD Precautions.................................................................................................................................11  
12. SE Package Information......................................................................................................................12  
12.1. Pin Definitions and Descriptions.................................................................................................... 12  
13. Contact ..............................................................................................................................................13  
14. Disclaimer ..........................................................................................................................................13  
REVISION 004 JUNE 03, 2019  
Page 2 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
3. Glossary of Terms  
MilliTesla (mT), Gauss  
Units of magnetic flux density: 1mT = 10 Gauss  
RoHS  
TSOT  
Restriction of Hazardous Substances  
Thin Small Outline Transistor (TSOT package) also referred with the Melexis package code  
“SE”  
ESD  
Electro-Static Discharge  
4. Absolute Maximum Ratings  
Parameter  
Symbol  
Value  
Units  
Supply Voltage  
VDD  
+27  
V
Supply Current  
IDD  
VDDREV  
IDDREV  
VOUT  
IOUT  
VOUTREV  
IOUTREV  
TA  
+20  
-27  
mA  
V
Reverse Supply Voltage  
Reverse Supply Current  
Output Voltage  
-20  
mA  
V
+27  
Output Current  
+20  
mA  
V
Reverse Output Voltage  
Reverse Output Current  
Operating Temperature Range  
Storage Temperature Range  
-0.5  
-50  
mA  
C  
C  
C  
V
-40 to +150  
-55 to +165  
+165  
TS  
Maximum Junction Temperature  
ESD Sensitivity HBM (1)  
ESD Sensitivity CDM (2)  
TJ  
-
2500  
-
1000  
V
Magnetic Flux Density  
B
Unlimited  
mT  
Table 1. Absolute maximum ratings  
Exceeding the absolute maximum ratings may cause permanent damage.  
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
__________________  
1 Human Body Model according AEC-Q100-002 standard.  
2 Charged Device Model according AEC-Q100-011 standard.  
REVISION 004 JUNE 03, 2019  
Page 3 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
5. General Electrical Specifications  
DC Operating Parameters TA = -40°C to 150°C, VDD = 2.7V to 24V (unless otherwise specified)  
Parameter  
Supply Voltage  
Supply Current  
Reverse Supply Current  
Output Leakage Current  
Output Saturation Voltage  
Symbol Test Conditions  
Min  
2.7  
3
Typ (1) Max Units  
VDD  
IDD  
IDDREV  
IOFF  
Operating  
VDD = 12V  
VDD = -18V  
-
24  
7
1
10  
0.5  
V
4.5  
mA  
mA  
µA  
V
VOUT = 12V, VDD = 12V, B < BRP  
B > BOP, IOUT = 10mA  
0.1  
0.2  
VOUTS  
VDD = 12V, VPU (4) = 5V,  
(2,3)  
Output Rise/Fall Time  
tR / tF  
ICL  
0.1  
14  
0.3  
25  
1
µs  
mA  
µs  
RPU = 1kΩ, CL = 50pF  
Output Current Limit  
B > BOP, VOUT = 12V  
44  
Output ON Time under Current  
tCLON  
150  
230  
Limit conditions(5)  
B > BOP, VPU = 12V, RPU = 100Ω  
B > BOP, VPU = 12V, RPU = 100Ω  
Output OFF Time under Current  
Limit conditions(5)  
tCLOFF  
3.5  
ms  
Chopping Frequency  
Speed Signal Delay (2,6)  
Output Refresh Period  
fCHOP  
tSPD  
tPER  
400  
0.85  
5
kHz  
µs  
0.4  
3.2  
1.6  
8.4  
µs  
Over 1000 successive output  
switching  
events @1kHz square wave, BPEAK  
50mT, tRISE=tFALL ≤100μs  
30mT square wave magnetic  
field  
tJITTER  
±2.6  
µs  
Output Jitter (p-p value) (2)  
=
Maximum Switching Frequency (2,7)  
40  
66  
kHz  
fSW  
Power-On Time (8)  
16  
2.4  
1
35  
μs  
V
tPON  
VUVL  
tUVL  
RTH  
VDD= 5V, dVDD/dt > 2V/µs  
Under-voltage Lockout Threshold  
Under-voltage Lockout Reaction time (2)  
SE Package Thermal Resistance  
2.2  
2.7  
µs  
Single layer (1S) JEDEC board  
300  
°C/W  
Table 2: electrical specifications  
1 Typical values are defined at TA = +25°C and VDD = 12V  
2 Based on device characterization results, not subject to production test  
3 Measured between 0.1*VPU and 0.9*VPU  
4 RPU and VPU are respectively the external pull-up resistor and pull-up power supply  
5 If the Output is in Current Limitation longer than tCLON the Output is switched off in high-impedance state. The Output returns back in  
active state at next reaching of BOP or after tCLOFF time interval  
6 Controlled delay between direction (DIR) signal update and speed (SP) signal update  
7 Maximum switching frequency corresponds to the maximum frequency of the applied magnetic field which is detected without loss of  
pulses  
8 The Power-On Time represents the time from reaching VDD = 2.7V to the first refresh of the SP output  
REVISION 004 JUNE 03, 2019  
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MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
6. Magnetic Specifications  
6.1. MLX92251LSE-AAA-000  
DC Operating Parameters VDD = 2.7V to 24V and TA =-40°C to 150°C (unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Units  
Operating Point  
Release Point  
BOP  
BRP  
5
7.5  
10  
-5  
2
mT  
mT  
-10  
-7.5  
Magnetic Matching  
BOP1 BOP2 or BRP1 BRP2, TA = 25°C  
BOP1 BOP2 or BRP1 BRP2  
-2  
-3  
-2  
mT  
BMATCH  
3
mT  
Magnetic Offset  
BOFF  
TC  
-
(BOP1 + BRP1) / 2, (BOP2 + BRP2) / 2  
2
mT  
Temperature Coefficient  
Hall Plates Spacing  
0
ppm/°C  
mm  
1.45  
Table 3: Magnetic specifications  
6.2. MLX92251LSE-ABA-000  
DC Operating Parameters VDD = 2.7V to 24V and TA =-40°C to 150°C (unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Units  
Operating Point  
Release Point  
BOP  
BRP  
0.6  
2.5  
4.5  
-0.6  
2
mT  
mT  
-4.5  
-2  
-2.5  
Magnetic Matching  
BOP1 BOP2 or BRP1 BRP2, TA = 25°C  
BOP1 BOP2 or BRP1 BRP2  
mT  
BMATCH  
-3  
3
mT  
Magnetic Offset  
BOFF  
TC  
-
(BOP1 + BRP1) / 2, (BOP2 + BRP2) / 2  
-2  
2
mT  
Temperature Coefficient  
Hall Plates Spacing  
-1100  
1.45  
ppm/°C  
mm  
Table 3: Magnetic specifications  
Note: Temperature coefficient value is guaranteed by design and verified by characterization and is calculated using the  
following formula:  
BT 2 BT1  
TC   
*106, ppm/o C; T  40oC; T2 150oC  
1
B25o C  
T2 T1  
REVISION 004 JUNE 03, 2019  
Page 5 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
7. Output Behavior versus Magnetic Pole  
DC Operating Parameters T = -40 C to 150 C, VDD = 2.7V to 24V (unless otherwise specified)  
°
°
A
Parameter  
South pole  
North pole  
Test Conditions  
B > BOP  
B < BRP  
SP Output State  
Low  
High (1)  
(2)  
Table 4: Output behavior versus magnetic pole  
Direction  
Step  
nx  
H1  
N
H2  
S
DIR Output State  
n(x + 1)  
n(x + 2)  
n(x + 3)  
N
S
S
N
N
N
S
S
CCW  
Low  
3
4
2
1
5
n(x + 4) nx  
Direction  
Step  
nx  
H1  
N
S
S
N
H2  
S
S
N
N
DIR Output State  
n(x + 1)  
n(x + 2)  
n(x + 3)  
CW  
High (3)  
N
S
n(x + 4) nx  
1 Default SP output state during power-up  
2 Magnetic pole applied perpendicularly to Hall plate H1, facing the branded/top side of the package  
3 Default magnetic and DIR output state during power-up  
REVISION 004 JUNE 03, 2019  
Page 6 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
8. Application Information  
8.1. Default Application Schematic  
RPU1  
10k  
RPU2  
10k  
VDD  
GND  
SP  
V
ou  
t
SP  
C1  
10nF  
VDD  
DIR  
VoutDIR  
MLX92251  
8.2. Recommended Application Schematic for ISO7637-2 (pulses 5a and 5b)  
Notes:  
R1  
D1  
200Ohm  
see note  
1
RPU1  
10k  
RPU2  
10k  
VDD  
GND  
SP  
V
ou  
t
SP  
C1  
10nF  
Z1  
VDD  
see note 2  
DIR  
VoutDIR  
MLX92251  
1. Recommended for conducted transients on supply line above 32V with duration above 500ms.  
2. Recommended for conducted transients on supply line above 36V.  
3. Recommended zener diode Z1 is BZX55C27 or equivalent.  
8.3. Speed (SP) Output Behavior vs. BOP/BRP  
REVISION 004 JUNE 03, 2019  
Page 7 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
8.4. Output Jitter, Speed Signal Delay and Direction Detection  
8.5. UV lockout and POR behaviour  
REVISION 004 JUNE 03, 2019  
Page 8 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
9. Performance Graphs  
9.2. Magnetic parameters vs. VDD  
9.1. Magnetic parameters vs. TA  
Bop- MLX92251LSE-ABA  
Brp- MLX92251LSE-ABA  
Bop- MLX92251LSE-AAA  
Brp- MLX92251LSE-AAA  
Bop- MLX92251LSE-ABA  
Brp- MLX92251LSE-ABA  
Bop- MLX92251LSE-AAA  
Brp- MLX92251LSE-AAA  
Temp (DegC)  
9.3. VDSON vs. TA  
9.4. VDSON vs. VDD  
9.5. IDD vs. TA  
9.6. IDD vs. VDD  
REVISION 004 JUNE 03, 2019  
Page 9 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
9.7. ILEAK vs. TA  
9.8. ILEAK vs. VDD  
9.9. Power Derating vs. TA  
TA(c)  
REVISION 004 JUNE 03, 2019  
Page 10 of 13  
MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
10. Standard information regarding manufacturability of Melexis products  
with different soldering processes  
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level  
according to following test methods:  
Reflow Soldering SMD’s (Surface Mount Devices)  
IPC/JEDEC J-STD-020  
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices  
(classification reflow profiles according to table 5-2)  
EIA/JEDEC JESD22-A113  
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing  
(reflow profiles according to table 2)  
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  
EN60749-20  
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat  
EIA/JEDEC JESD22-B106 and EN60749-15  
Resistance to soldering temperature for through-hole mounted devices  
Iron Soldering THD’s (Through Hole Devices)  
EN60749-15  
Resistance to soldering temperature for through-hole mounted devices  
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  
EIA/JEDEC JESD22-B102 and EN60749-21  
Solderability  
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,  
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with  
Melexis.  
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive  
strength between device and board.  
Melexis recommends reviewing on our web site the General Guidelines soldering recommendation  
(http://www.melexis.com/Quality_soldering.aspx) as well as trim&form recommendations  
(http://www.melexis.com/Assets/Trim-and-form-recommendations-5565.aspx).  
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on  
qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous  
Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx  
11. ESD Precautions  
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).  
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.  
REVISION 004 JUNE 03, 2019  
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MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
12. SE Package Information  
e1  
X 1 5  
1
a
b
Notes:  
1.Dimension “D” and “E1” do not include mold flash  
or protrusions. Mold flash or protrusion shall not  
exceed 0.15mm on “D” and 0.25mm on “E” per  
side.  
2. Dimension “b” does not include dambar  
protrusion.  
3. This part is compliant with JEDEC specification  
MO-193.  
This part is full compliance to EIAJ specification  
SC-74.  
e
Marking:  
Top Side:  
D
51A MLX92251LSE-AAA-000  
51C MLX92251LSE-ABA-000  
Bottom Side: xyww x = last digit of lot number  
y = last digit of year  
ww = week  
Hall plate location  
G
F
1
N
END VIEW  
TOP VIEW  
This table in mm  
A
A1  
0.025  
0.10  
A2  
0.85  
0.90  
D
E
E1  
L
b
c
e
e1  
0.95 1.90  
BSC BSC  
F
G
H
I
α
0°  
8°  
min  
2.80 2.60 1.50 0.30 0.30 0.10  
3.00 3.00 1.70 0.50 0.45 0.20  
1.45 0.525 0.6 0.562  
1.45 0.925 0.622  
max 1.00  
1
12.1. Pin Definitions and Descriptions  
4
SE Pin №  
Name  
VDD  
GND  
SP  
Type  
Function  
1
2,3  
4
Supply  
Ground  
Output  
Output  
Power Supply  
Ground pin  
Speed Open-Drain Output  
5
3
5
DIR  
Direction Open-Drain Output  
2
1
REVISION 004 JUNE 03, 2019  
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MLX92251LSE-AxA  
Dual Hall Effect Latch with Speed & Direction  
13. Contact  
For the latest version of this document, go to our website at www.melexis.com.  
For additional information, please contact our Direct Sales team and get help for your specific needs:  
Europe, Africa  
Telephone: +32 13 67 04 95  
Email : sales_europe@melexis.com  
Telephone: +1 603 223 2362  
Email : sales_usa@melexis.com  
Email : sales_asia@melexis.com  
Americas  
Asia  
14. Disclaimer  
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the  
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,  
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-  
infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.  
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to  
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.  
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a  
particular purpose.  
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to  
any party any patent rights, licenses, or any other intellectual property rights.  
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.  
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be  
suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-  
sustaining equipment are specifically not recommended by Melexis.  
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,  
recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil  
firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone  
or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any  
similar violent situation.  
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-  
conditions.  
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.  
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)  
ISO/TS 16949 and ISO14001 Certified  
REVISION 004 JUNE 03, 2019  
Page 13 of 13  

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MLXV3019B-1E3

Zener Diode, 9.1V V(Z), 5%, 1W, Silicon, Unidirectional, DO-213AB, SURFACE MOUNT PACKAGE-2
MICROSEMI

MLXV3019BE3

Zener Diode, 9.1V V(Z), 1.5W, Silicon, Unidirectional, DO-213AB,
MICROSEMI

MLXV3020B-1

Zener Diode, 10V V(Z), 5%, 1W, Silicon, Unidirectional, DO-213AB, SURFACE MOUNT PACKAGE-2
MICROSEMI