MMC34166PJ [MEMSIC]

±16 Gauss, Ultra Small, Low Noise 3-axis Magnetic Sensor;
MMC34166PJ
型号: MMC34166PJ
厂家: Memsic    Memsic
描述:

±16 Gauss, Ultra Small, Low Noise 3-axis Magnetic Sensor

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中文:  中文翻译
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±16 Gauss, Ultra Small, Low  
Noise 3-axis Magnetic Sensor  
MMC3416xPJ  
FEATURES  
Fully integrated 3-axis magnetic sensor and  
electronic circuits requiring fewer external  
components  
Superior Dynamic Range and Accuracy:  
9
9
±16 G FSR with 16/14 bits operation  
0.5 mG/2 mG per LSB resolution in 16/14  
bits operation mode  
9
9
1.5 mG total RMS noise  
Enables heading accuracy of ±1º  
Max output data rate of 800 Hz (12 bits mode)  
Ultra Small Low profile package  
1.6x1.6x0.6 mm  
FUNCTIONAL BLOCK DIAGRAM  
SET/RESET function  
noise level, enabling heading accuracy of 1º in  
electronic compass applications. Contact Memsic for  
access to advanced calibration and tilt-compensation  
algorithms.  
9
Allows for elimination of temperature  
variation induced offset error (Null field  
output)  
9
Clears the sensors of residual  
magnetization resulting from strong  
external fields  
An integrated SET/RESET function provides for the  
elimination of error due to Null Field output change  
with temperature. In addition it clears the sensors of  
any residual magnetic polarization resulting from  
exposure to strong external magnets. The  
SET/RESET function can be performed for each  
measurement or periodically as the specific  
application requires.  
On-chip sensitivity compensation  
Low power consumption (140 µA @ 7 Hz )  
1 µA (max) power down function  
I2C Slave, FAST (400 KHz) mode  
1.62 V~3.6 V wide power supply operation  
supported, 1.8 V I/O compatibility.  
RoHS compliant  
The MMC3416xPJ is packaged in an ultra small low  
profile BGA package (1.6 x 1.6 x 0.65 mm,) and with  
an operating temperature range from -40 °C to +85  
°C.  
APPLICATIONS  
Electronic Compass & GPS Navigation  
Position Sensing  
The MMC3416xPJ provides an I2C digital output with  
400 KHz, fast mode operation.  
DESCRIPTION  
The MMC3416xPJ is a complete 3-axis magnetic  
sensor with on-chip signal processing and integrated  
I2C bus. The device can be connected directly to a  
microprocessor, eliminating the need for A/D  
converters or timing resources. It can measure  
magnetic fields within the full scale range of ±16  
Gauss (G), with 0.5 mG/2 mG per LSB resolution for  
16/14 bits operation mode and 1.5 mG total RMS  
©MEMSIC, Inc.  
One Technology Drive, Suite 325, Andover, MA01810, USA  
Tel: +1 978 738 0900  
Information furnished by MEMSIC is believed to be accurate and reliable.  
However, no responsibility is assumed by MEMSIC for its use, or for any  
infringements of patents or other rights of third parties which may result from  
its use. No license is granted by implication or otherwise under any patent or  
patent rights of MEMSIC.  
Fax: +1 978 738 0196  
www.memsic.com  
MEMSIC MMC3416xPJ Rev.C  
Page 1 of 14  
10/18/2013  
SPECIFICATIONS (Measurements @ 25 °C, unless otherwise noted; VDA = VDD= 1.8 V unless otherwise specified)  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
Field Range (Each Axis)  
Total applied field  
VDA  
G
V
±16  
1.8  
1.8  
1.621  
1.621  
3.6  
3.6  
5.0  
Supply Voltage  
VDD (I2C interface)  
V
Supply Voltage Rise Time  
mS  
µA  
µA  
µA  
µA  
µA  
°C  
°C  
BW[1:0]=00, 16 bits mode  
BW[1:0]=01, 16 bits mode  
BW[1:0]=10, 14 bits mode  
BW[1:0]=11, 12 bits mode  
140  
70  
Supply Current2  
(7measurements/second)  
35  
18  
Power Down Current  
Operating Temperature  
Storage Temperature  
1.0  
85  
-40  
-55  
125  
Linearity Error  
(Best fit straight line)  
FS=±16 G  
Happlied=±10 G  
0.25  
%FS  
Hysteresis  
3 sweeps across ±16 G  
3 sweeps across ±16 G  
0.1  
0.1  
%FS  
Repeatability Error  
Alignment Error  
Transverse Sensitivity  
%FS  
degrees  
%
mG  
mG  
±1.0  
±2.0  
1.5  
2.0  
4.0  
±3.0  
±5.0  
BW[1:0]=00, 16 bits mode  
BW[1:0]=01, 16 bits mode  
BW[1:0]=10, 14 bits mode  
BW[1:0]=11, 12 bits mode  
Total RMS Noise  
mG  
mG  
6.0  
Output resolution  
16/14/12  
125  
bits  
Hz  
Hz  
Hz  
BW[1:0]=00, 16 bits mode  
BW[1:0]=01, 16 bits mode  
BW[1:0]=10, 14 bits mode  
BW[1:0]=11, 12 bits mode  
250  
450  
800  
Max Output data rate  
Hz  
Heading accuracy3  
Sensitivity  
degrees  
%
counts/G  
counts/G  
counts/G  
±1.0  
-10  
+10  
±16 G  
16 bits mode  
14 bits mode  
12 bits mode  
-40~85°C  
2048  
512  
128  
Sensitivity Change Over  
Temperature  
%
Delta from 25°C  
±3  
±16 G  
-0.2  
+0.2  
G
16 bits mode  
14 bits mode  
12 bits mode  
32768  
8192  
2048  
counts  
counts  
counts  
Null Field Output  
Null Field Output Change Over  
Temperature using SET/RESET  
Disturbing Field4  
-40~85 °C  
Delta from 25 °C  
mG  
±5  
25  
G
G
Maximum Exposed Field  
SET/RESET Repeatability5  
10000  
3
mG  
1
2
1.62 V is the minimum operation voltage, or VDA / VDD should not be lower than 1.62 V.  
Supply current is proportional to how many measurements performed per second, for example, at one measurement per second, the power consumption will be 140  
uA/7=20 µA.  
3
4
is  
MEMSIC product enables users to utilize heading accuracy to be 1.0 degree typical when using MEMSIC’s proprietary software or algorithm  
This is the magnitude of external field that can be tolerated without changing the sensor characteristics. If the disturbing field is exceeded, a SET/RESET operation  
required to restore proper sensor operation.  
5
Perform SET/RESET alternately. SET repeatability is defined as the difference in measurement between multiple SET events. RESET repeatability is defined  
similarly.  
MEMSIC MMC3416xPJ Rev C  
Page 2 of 14  
10/18/2013  
I2C INTERFACE I/O CHARACTERISTICS (VDD=1.8 V)  
Parameter  
Symbol  
Test Condition  
Min.  
Typ.  
Max.  
Unit  
Logic Input Low Level  
Logic Input High Level  
Hysteresis of Schmitt input  
Logic Output Low Level  
Input Leakage Current  
SCL Clock Frequency  
VIL  
VIH  
Vhys  
VOL  
Ii  
-0.5  
0.7*VDD  
0.2  
0.3* VDD  
VDD  
V
V
V
0.4  
10  
V
0.1VDD<Vin<0.9VDD  
-10  
0
µA  
kHz  
fSCL  
400  
START Hold Time  
START Setup Time  
LOW period of SCL  
HIGH period of SCL  
Data Hold Time  
Data Setup Time  
Rise Time  
tHD;STA  
tSU;STA  
tLOW  
tHIGH  
tHD;DAT  
tSU;DAT  
tr  
0.6  
0.6  
1.3  
0.6  
0
µS  
µS  
µS  
µS  
µS  
µS  
µS  
µS  
µS  
0.9  
0.1  
From VIL to VIH  
From VIH to VIL  
0.3  
0.3  
Fall Time  
tf  
Bus Free Time Between STOP and  
START  
STOP Setup Time  
tBUF  
1.3  
0.6  
tSU;STO  
µS  
SDA  
tSP  
tf  
tf  
tSU;DAT  
tLOW  
tHD;STA  
tr  
t
tr  
BUF  
SCL  
tSU;STA  
tSU;STO  
tHD;STA  
tHIGH  
Sr  
P
S
tHD;DAT  
S
Timing Definition  
MEMSIC MMC3416xPJ Rev C  
Page 3 of 14  
10/18/2013  
ABSOLUTE MAXIMUM RATINGS*  
Supply Voltage (VDD) ………………...-0.5 to +3.6 V  
Storage Temperature ……….……-55 °C to +125 °C  
Maximum Exposed Field ………………..10000 G  
*Stresses above those listed under Absolute Maximum Ratings may  
cause permanent damage to the device. This is a stress rating only; the  
functional operation of the device at these or any other conditions above  
those indicated in the operational sections of this specification is not  
implied. Exposure to absolute maximum rating conditions for extended  
periods may affect the device’s reliability.  
Pin Description: BGA Package  
Pin  
Name  
TEST  
NC  
Description  
Factory Use Only, Leave  
Open/Not connected  
Not Connected  
I/O  
NC  
NC  
I
1
2
3
4
5
Serial Clock Line for I2C  
bus  
SCL  
SDA  
Vpp  
Serial Data Line for I2C bus  
Factory Use Only, Leave  
Open  
I/O  
NC  
Number  
Part number  
MMC34160PJ  
MMC34161PJ  
MMC34162PJ  
MMC34163PJ  
MMC34164PJ  
MMC34165PJ  
MMC34166PJ  
MMC34167PJ  
0
1
2
3
4
5
6
7
6
7
VDD  
NC  
Power Supply for I2C bus  
Not Connected  
P
NC  
Connect to External  
Capacitor  
Not Connected  
Not Connected  
Connect to Ground  
Power Supply  
8
CAP  
I
9
NC  
NC  
VSA  
VDA  
NC  
NC  
P
10  
11  
12  
“Number” represents the character of the 1st line in the  
marking, the black dot indicates pin one (1).The 2nd line  
represents Lot Number.  
P
All parts are shipped in tape and reel packaging with  
9000pcs per 13” reel or 3000pcs per 7” reel.  
THEORY OF OPERATION  
Caution: ESD (electrostatic discharge) sensitive  
device.  
The Anisotropic Magneto-Resistive (AMR) sensors  
are special resistors made of permalloy thin film  
deposited on a silicon wafer. During manufacturing, a  
strong magnetic field is applied to the film to orient its  
magnetic domains in the same direction, establishing  
a magnetization vector. Subsequently, an external  
magnetic field applied perpendicularly to the sides of  
the film causes the magnetization to rotate and  
change angle. This effect causes the film’s resistance  
to vary with the intensity of the applied magnetic field.  
The MEMSIC AMR sensor is incorporated into a  
Wheatstone bridge configuration to maximize Signal  
to Noise ratio. A change in magnetic field produces a  
proportional change in differential voltage across the  
Wheatstone bridge  
Ordering Guide:  
MMC3416xPJ  
Package type:  
Code  
J
Type  
BGA12  
RoHS compliant  
Performance Grade:  
Code  
P
Performance Grade  
Temp compensated  
Address code: 0~7  
Code  
7 bit I2C Address  
However, the influence of a strong magnetic field  
(more than 25 G) in any direction could upset, or flip,  
the polarity of the film, thus changing the sensor  
characteristics. A strong restoring magnetic field must  
be applied momentarily to restore, or set, the sensor  
characteristics. The MEMSIC magnetic sensor has an  
on-chip magnetically coupled strap: a SET/RESET  
strap pulsed with a high current, to provide the  
restoring magnetic field.  
0
1
2
3
4
5
6
7
0110000b  
0110001b  
0110010b  
0110011b  
0110100b  
0110101b  
0110110b  
0110111b  
Marking illustration:  
MEMSIC MMC3416xPJ Rev C  
Page 4 of 14  
10/18/2013  
PIN DESCRIPTIONS  
9
Do not place the device opposite magnetized  
material or material that may become magnetized  
located on the other side of the PCB.  
VDA – This is the supply input for the circuits and the  
magnetic sensor. The DC voltage should be between  
1.62 and 3.6 volts. A 1uF by-pass capacitor is strongly  
recommended.  
Please refer to MEMSIC application note: AN-200-20-  
0018 (MEMSIC Magnetic Sensor Hardware Design  
Layout Guideline for Electronic Device).  
VSA – This is the ground pin for the magnetic sensor.  
SDA – This pin is the I2C serial data line, and  
operates in FAST (400 KHz) mode.  
POWER CONSUMPTION  
The power consumed by the device is proportional to  
the number of measurements taken per second. For  
example, when BW<1:0>=00, that is, 16-bit mode with  
7.92 mS per measurement, MMC3416xPJ consumes  
140 µA (typical) at 1.8 V with 7 measurements per  
second. If only 2 measurements are performed per  
second, the current will be 140*2/7=40 µA.  
SCL– This pin is the I2C serial clock line, and operates  
in FAST (400 KHz) mode.  
V
DD – This is the power supply input for the I2C bus,  
and is 1.8 V compatible (1.62 V to 3.6 V). VDD is  
independent of VDA.  
TEST – Factory use only, Leave Open/Not connected  
I2C INTERFACE DESCRIPTION  
A slave mode I2C circuit has been implemented into  
the MEMSIC magnetic sensor as a standard interface  
for customer applications. The A/D converter and  
MCU functionality have been added to the MEMSIC  
sensor, thereby increasing ease-of-use, and lowering  
power consumption, footprint and total solution cost.  
CAP –Connect a 4.7 µF low ESR (typically smaller  
than 0.2 ohm) ceramic capacitor.  
Vpp – Factory use only, Leave Open  
EXTERNAL CIRCUITRY CONNECTION  
The I2C (or Inter IC bus) is an industry standard bi-  
directional two-wire interface bus. A master I2C  
device can operate READ/WRITE controls to an  
unlimited number of devices by device addressing.  
The MEMSIC magnetic sensor operates only in a  
slave mode, i.e. only responding to calls by a master  
device.  
I2C BUS CHARACTERISTICS  
VDD  
Rp  
Rp  
SDA (Serial Data Line)  
SCL (Serial Clock Line)  
(Top View)  
HARDWARE DESIGN CONSIDERATION  
9
Provide adequate separation distance to devices  
that contain permanent magnets or generate  
magnetic fields (IE speakers, coils, inductors...)  
The combined magnetic field to be measured and  
interference magnetic field should be less than the  
full scale range of the MMC3416xPJ (±16 G).  
DEVICE 2  
DEVICE 1  
I2C Bus  
The two wires in the I2C bus are called SDA (serial  
data line) and SCL (serial clock line). In order for a  
data transfer to start, the bus has to be free, which is  
defined by both wires in a HIGH output state. Due to  
the open-drain/pull-up resistor structure and wired  
Boolean “AND” operation, any device on the bus can  
pull lines low and overwrite a HIGH signal. The data  
9
9
Provide adequate separation distance to current  
carrying traces. Do not route current carrying  
traces under the sensor or on the other side of the  
PCB opposite the device.  
Do not cover the sensor with magnetized material  
or material that may become magnetized, (IE,  
shield box, LCD, battery, iron bearing material…).  
MEMSIC MMC3416xPJ Rev C  
Page 5 of 14  
10/18/2013  
on the SDA line has to be stable during the HIGH  
period of the SCL line. In other words, valid data can  
only change when the SCL line is LOW.  
Note: Rp selection guide: 4.7 Kohm for a short I2C  
bus length (less than 10 cm), and 10Kohm for a bus  
length less than 5 cm.  
REGISTER MAP  
Register Name  
Xout Low  
Xout High  
Yout Low  
Yout High  
Zout Low  
Zout High  
Status  
Internal control 0  
Internal control 1  
R0  
R1  
R2  
Address  
00H  
01H  
02H  
03H  
04H  
05H  
06H  
07H  
08H  
1BH  
1CH  
1DH  
1EH  
1FH  
20H  
Description  
Xout LSB  
Xout MSB  
Yout LSB  
Yout MSB  
Zout LSB  
Zout MSB  
Device status  
Control register 0  
Control register 1  
Factor used register  
Factory used register  
Factory used register  
Factory used register  
Factory used register  
Product ID  
R3  
R4  
Product ID 1  
Register Details  
Xout High, Xout Low  
Xout Low  
7
6
5
5
4
3
2
1
0
0
Addr: 00H  
Mode  
Xout[7:0]  
R
7
6
4
3
2
1
Xout High  
Addr: 01H  
Mode  
Xout[15:8]  
R
X-axis output, unsigned format, the 2 LSB of Xout Low will be fixed as “0” when in 12 bit mode, the 2 LSB of  
Xout Low will be fixed as “0” when in 14 bit mode.  
Yout High, Yout Low  
7
6
5
4
3
2
1
0
0
Yout Low  
Addr: 02H  
Mode  
Yout[7:0]  
R
7
6
5
4
3
2
1
Yout High  
Addr: 03H  
Mode  
Yout[15:8]  
R
Y-axis output, unsigned format, the 2 LSB of Yout Low will be fixed as “0” when in 12 bit mode, the 2 LSB of  
Yout Low will be fixed as “0” when in 14 bit mode.  
Zout High, Zout Low  
7
6
5
4
3
2
2
1
1
0
0
Zout Low  
Addr: 04H  
Mode  
Zout[7:0]  
R
7
6
5
4
3
Zout High  
Addr: 05H  
Mode  
Zout[15:7]  
R
Z-axis output, unsigned format, the 2 LSB of Zout Low will be fixed as “0” when in 12 bit mode, the 2 LSB of  
Zout Low will be fixed as “0” when in 14 bit mode.  
MEMSIC MMC3416xPJ Rev C  
Page 6 of 14  
10/18/2013  
Status  
Device Status  
7
0
6
0
5
0
4
0
3
2
1
Pump  
On  
0
Addr: 06H  
Reserved  
ST_XYZ Rd_Don  
_OK  
Meas  
Done  
0
e
Reset Value  
Mode  
0
0
0
R
Bit Name  
Description  
Meas Done  
Indicates measurement event is completed. This bit should be checked before  
reading the output  
Pump On  
Indicates the charge pump status, after Refill Cap command, the charge pump will  
start running, and this bit will stays high, it will be reset low after the cap reaches its  
target voltage and the charge pump is shut off.  
Rd_Done  
ST_XYZ_OK  
Indicates the chip was able to successfully read its memory.  
Indicate selftest OK once this bit is “1”.  
Internal Control 0  
7
6
5
4
3
2
1
0
Control  
Register 0  
Addr: 07H  
Refill  
Cap  
RESET  
SET  
No  
Boost  
CM  
Freq1  
CM  
Freq0  
Cont  
Mode  
On  
TM  
Reset Value  
Mode  
0
W
0
W
0
W
0
W
0
W
0
W
0
W
0
W
Description  
Take measurement, set ‘1’ will initiate measurement.  
Bit Name  
TM  
Cont Mode On When set to a 1 this enables the Continuous Measurement Mode. The chip will  
periodically take measurements of the magnetic field; the frequency of these  
measurements is determined by bits CM Freq<1:0>.  
CM Freq0  
CM Freq1  
These bits determine how often the chip will take measurements in Continuous  
Measurement Mode.  
CM Freq1  
CM Freq0  
Frequency  
1.5 Hz  
13 Hz  
0
0
1
1
0
1
0
1
25 Hz  
50 Hz  
No Boost  
Setting this bit high will disable the charge pump and cause the storage capacitor to  
be charged off VDD.  
SET  
RESET  
Writing “1” will set the sensor by passing a large current through Set/Reset Coil  
Writing “1” will reset the sensor by passing a large current through Set/Reset Coil in  
a reversed direction  
Refill Cap  
Writing “1” will recharge the capacitor at CAP pin, it is requested to be issued  
before SET/RESET command.  
MEMSIC MMC3416xPJ Rev C  
Page 7 of 14  
10/18/2013  
Internal Control 1  
7
6
5
4
3
2
1
0
Control  
Register 1  
Addr: 08H  
SW_  
RST  
0
Temp_  
ST_XYZ Z-inhibit Y-inhibit X-inhibit  
BW1  
BW0  
tst  
0
W
Reset Value  
Mode  
0
0
0
0
0
W
0
W
W
W
W
W
W
Description  
Bit Name  
BW0  
Output resolution  
BW1  
BW1  
BW0  
Output Resolution  
16 bits  
16 bits  
14 bits  
12 bits  
Measurement Time  
7.92 mS  
4.08 mS  
2.16 mS  
1.20 mS  
0
0
1
1
0
1
0
1
Note: X/Y/Z channel measurements are taken sequentially. Delay Time among  
those measurements is 1/3 of the Measurement Time defined in the table.  
Factory-use Register  
X-inhibit  
Y-inhibit  
Z-inhibit  
ST_XYZ  
Selftest check, write “1” to this bit and execute a TM command, after TM is  
completed the result can be read as bit ST_XYZ_OK.  
Factory-use Register  
Writing “1”will cause the part to reset, similar to power-up. It will clear all registers  
and also re-read OTP as part of its startup routine.  
Temp_tst  
SW_RST  
Product ID 1  
7
6
5
4
3
2
1
0
Product ID 1  
Addr: 20H  
Reset Value  
Mode  
Product ID1[7:0]  
0
R
0
R
0
R
0
R
0
R
1
R
1
R
0
R
conflict, either by ICs from other manufacturers or by  
other MEMSIC devices on the same bus  
DATA TRANSFER  
The initial addressing of the slave is always followed  
by the master writing the number of the slave register  
to be read or written, so this initial addressing always  
indicates a WRITE operation by sending [0110xxx1].  
After being addressed, the MEMSIC device being  
called should respond by an “Acknowledge” signal by  
pulling SDA line LOW. Subsequent communication  
bytes can either be:  
A data transfer is started with a “START” condition  
and ended with a “STOP” condition. A “START”  
condition is defined by a HIGH to LOW transition on  
the SDA line while SCL line is HIGH. A “STOP”  
condition is defined by a LOW to HIGH transition on  
the SDA line while the SCL line is held HIGH. All data  
transfer in I2C system are 8-bits long. Each byte has  
to be followed by an acknowledge bit. Each data  
transfer involves a total of 9 clock cycles. Data is  
transferred starting with the most significant bit (MSB).  
a) the data to be written to the device register, or  
b) Another START condition followed by the  
device address indicating a READ operation  
[0110xxx0], and then the master reads the  
register data.  
After a START condition, the master device calls a  
specific slave device by sending its 7-bit address with  
the 8th bit (LSB) indicating that either a READ or  
WRITE operation will follow, [1] for READ and [0] for  
WRITE. The MEMSIC device 7-bit device address is  
[x110xxx] where the three LSB’s are pre-  
programmed into the MMC3416xPJ by the factory and  
they are indicated on the package as shown in the  
previous section “Package Marking Illustration”.  
Multiple data bytes can be written or read to  
numerically sequential registers without the need of  
another START condition. Data transfer is terminated  
by a STOP condition or another START condition.  
Two detailed examples of communicating with the  
MEMSIC device are listed below for the actions of  
acquiring a magnetic field measurement and  
magnetizing the sensor.  
A total of 8 different addresses can be pre-  
programmed into MEMSIC device by the factory. This  
variation of I2C address avoids a potential address  
MEMSIC MMC3416xPJ Rev C  
Page 8 of 14  
10/18/2013  
POWER STATE  
MEMSIC MR Sensor will enter power down mode  
automatically after data acquisition is finished.  
VDA  
VDD  
Power State  
OFF(0 V)  
OFF(0V)  
OFF(0 V), no power  
consumption  
OFF(0 V)  
1.62~3.6 V  
OFF(0 V), power  
consumption is less than  
1 uA.  
1.62~3.6 V OFF(0 V)  
1.62~3.6 V 1.62~3.6 V  
Power consumption is not  
predictable, not  
recommended state.  
Normal operation mode,  
device will enter into  
power down mode  
automatically after data  
acquisition is finished  
EXAMPLE MEASUREMENT  
First cycle: A START condition is established by the  
Master Device followed by a call to the slave address  
[0110xxx] with the eighth bit held low to indicate a  
WRITE request. Note: [xxx] is determined by factory  
programming and a total of 8 different addresses are  
available.  
Second cycle: After an acknowledge signal is received  
by the master device (MEMSIC device pulls SDA line  
low during 9th SCL pulse), the master device sends  
the address of Control Register 0 or [00000111] as  
the target register to be written. The MEMSIC device  
should acknowledge receipt of the address (9th SCL  
pulse, SCL pulled low).  
Third cycle: The Master device writes to the Internal  
Control Register 0 the code [00000001] (TM high) to  
initiate data acquisition. The MEMSIC device should  
send an Acknowledge and internally initiate a  
measurement (collect x, y and z data). A STOP  
condition indicates the end of the write operation.  
Fourth cycle: The Master device sends a START  
command followed by the MEMSIC device’s seven bit  
address, and finally the eighth bit set low to indicate a  
WRITE. An Acknowledge should be send by the  
MEMSIC device in response.  
Fifth cycle: The Master device sends the MEMSIC  
device’s Status Register [00000110] as the address to  
read.  
Sixth cycle: The Master device sends a START  
command followed by the MEMSIC device’s seven bit  
address, and finally the eighth bit set high to indicate a  
READ. An Acknowledge should be send by the  
MEMSIC device in response.  
Seventh cycle: The Master device cycles the SCL line.  
This causes the Status Register data to appear on  
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SDA line. Continuously read the Status Register until  
the Meas Done bit (bit 0) is set to ‘1’. This indicates  
that data for the x, y, and z sensors is available to be  
read.  
Fourth cycle: The Master device writes to the  
MEMSIC device’s Internal Control 0 register the code  
[00100000] (SET bit) to initiate a SET action. The  
MEMSIC device should send an Acknowledge.  
Eighth cycle: The Master device sends a START  
command followed by the MEMSIC device’s seven bit  
address, and finally the eighth bit set low to indicate a  
WRITE. An Acknowledge should be send by the  
MEMSIC device in response.  
EXAMPLE OF RESET*  
First cycle: A START condition is established by the  
Master Device followed by a call to the slave address  
[0110xxx] with the eighth bit held low to indicate a  
WRITE request. Note: [xxx] is determined by factory  
programming and a total of 8 different addresses are  
available.  
Ninth cycle: The Master device sends a [00000000]  
(Xout LSB register address) as the register address to  
read.  
Second cycle: After an acknowledge signal is received  
by the master device (The MEMSIC device pulls the  
SDA line low during the 9th SCL pulse), the master  
device sends [00000111] as the target address  
(Internal Control Register 0). The MEMSIC device  
should acknowledge receipt of the address (9th SCL  
pulse).  
Tenth cycle: The Master device calls the MEMSIC  
device’s address with a READ (8th SCL cycle SDA line  
high). An Acknowledge should be send by the  
MEMSIC device in response.  
Eleventh cycle: Master device continues to cycle the  
SCL line, and each consecutive byte of data from the  
X, Y and Z registers should appear on the SDA line.  
The internal memory address pointer automatically  
moves to the next byte. The Master device  
acknowledges each. Thus:  
Third cycle: The Master device writes to the MEMSIC  
device’s Internal Control Register 0 the code  
[10000000] (Refill Cap) to prepare for RESET action.  
A minimum of 50ms wait should be provided to allow  
the MEMSIC device to finish its preparation for the  
RESET action.  
Eleventh cycle: LSB of X channel.  
Twelfth cycle: MSB of X channel.  
Thirteenth cycle: LSB of Y channel.  
Fourteenth cycle: MSB of Y channel.  
Fifteenth cycle: LSB of Z channel.  
Sixteenth cycle: MSB of Z channel.  
Fourth cycle: The Master device writes to the  
MEMSIC device’s Internal Control 0 register the code  
[01000000] (RESET bit) to initiate a RESET action.  
The MEMSIC device should send an Acknowledge.  
At this point, the MEMSIC AMR sensors have been  
conditioned for optimum performance and data  
measurements can commence.  
Master ends communications by NOT sending an  
‘Acknowledge’ and also follows with a ‘STOP’  
command.  
Note *: The RESET action can be skipped for most  
applications  
EXAMPLE OF SET  
First cycle: A START condition is established by the  
Master Device followed by a call to the slave address  
[0110xxx] with the eighth bit held low to indicate a  
WRITE request. Note: [xxx] is determined by factory  
programming and a total of 8 different addresses are  
available.  
Second cycle: After an acknowledge signal is received  
by the master device (The MEMSIC device pulls the  
SDA line low during the 9th SCL pulse), the master  
device sends [00000111] as the target address  
(Internal Control Register 0). The MEMSIC device  
should acknowledge receipt of the address (9th SCL  
pulse).  
Third cycle: The Master device writes to the MEMSIC  
device’s Internal Control Register 0 the code  
[10000000] (Refill Cap) to prepare for SET action.*  
A minimum of 50ms wait should be provided to allow  
the MEMSIC device to finish its preparation for the  
SET action.  
MEMSIC MMC3416xPJ Rev C  
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3) Perform RESET. This resets the internal  
magnetization of the sensing resistors in the  
direction of the RESET field, which is opposite to  
the SET field (180o opposed).  
USING SET AND RESET TO REMOVE BRIDGE  
OFFSET  
The integrated SET and RESET functions of the  
MMC3416xPJ enables the user to remove the error  
associated with bridge Offset change as a function of  
temperature, thereby enabling more precise heading  
measurements over a wider temperature than  
competitive technologies. The SET and RESET  
functions effectively alternately flip the magnetic  
sensing polarity of the sensing elements of the device.  
4) Perform MEASUREMENT. This measurement  
will contain both the sensors response to the  
external field and also the Offset. In other words,  
Output2 = -H + Offset.  
5) Finally, calculate H by subtracting the two  
measurements and dividing by 2. This procedure  
effectively eliminates the Offset from the  
measurement and therefore any changes in the  
Offset over temperature.  
1)  
The most accurate magnetic field measurements  
can be obtained by using the protocol described  
as follows: Perform SET. This sets the internal  
magnetization of the sensing resistors in the  
direction of the SET field.  
Note: To calculate and store the offset; add the two  
measurements and divide by 2. This calculated offset  
value can be subtracted from subsequent  
measurements to obtain H directly from each  
measurement.  
2) Perform MEASUREMENT. This measurement  
will contain not only the sensors response to the  
external magnetic field, H, but also the Offset; in  
other words,  
Output1 = +H + Offset.  
OPERATING TIMING  
VDD  
I2C  
S
T
R
T
R
T
R
S
T
R
top  
tRF  
tSR  
tTM  
tSR  
tTM  
tTM  
tTM  
SET/RESET  
S
Take Measurement  
Read data  
T
R
Repeat T & R  
Wait the device to be ready for next operation  
MEMSIC MMC3416xPJ Rev C  
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10/18/2013  
Operating Timing Diagram  
Parameter  
Symbol  
top  
Min.  
Typ.  
Max.  
Unit  
mS  
mS  
mS  
mS  
mS  
mS  
mS  
Time to operate device after VDD valid  
Time from Refill Cap to SET/RESET  
Wait time to complete SET/RESET  
10  
50  
1
tRF  
tSR  
tTM BW=00  
tTM BW=01  
tTM BW=10  
tTM BW=11  
10  
5
Wait time to complete measurement  
3
1.5  
MEMSIC MMC3416xPJ Rev C  
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STORAGE CONDITIONS  
Temperature: <30 ºC  
Humidity:  
Period:  
<60%RH  
1 year (after delivery)  
Moisture Sensitivity Level: 3  
Bake Prior to Reflow: storage period more than 1 year, or humidity indicator card reads >60% at 23±5 ºC  
Bake Procedure:  
Bake to Soldering:  
refer to J-STD-033  
<1 week under 30 ºC, 60%RH condition  
SOLDERING RECOMMENDATIONS  
MEMSIC magnetic sensor is capable of withstanding an MSL3 / 260solder reflow. Following is the reflow profile:  
Note:  
Reflow is limited by 2 times  
The second reflow cycle should be applied after device has cooled down to 25 ºC (room temperature)  
This is the reflow profile for Pb free process  
The peak temperature on the sensor surface should be limited under 260 ºC for 10 seconds.  
Solder paste’s reflow recommendation should be followed to get the best SMT quality.  
If the part is mounted manually, please ensure the temperature could not exceed 260 ºC for 10 seconds.  
MEMSIC MMC3416xPJ Rev C  
Page 13 of 14  
10/18/2013  
PACKAGE DRAWING (BGA package)  
LAND PATTERN  
2
MEMSIC MMC3416xPJ Rev C  
Page 14 of 14  
10/18/2013  

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