ST1825XR104F631
更新时间:2024-09-18 12:14:56
品牌:MERITEK
描述:Soft Termination Multilayer Ceramic Chip Capacitors
ST1825XR104F631 概述
Soft Termination Multilayer Ceramic Chip Capacitors 软终端多层陶瓷芯片电容器
ST1825XR104F631 数据手册
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PDF下载Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
F
EATURES
•
•
Wide capacitance range in a given size
High performance to withstanding 5mm of substrate bending
test guarantee
•
•
•
•
•
Reduction in PCB bend failure
Lead free terminations
High reliability and stability
RoHS compliant
HALOGEN compliant
A
PPLICATIONS
MERITEK Multilayer Ceramic Chip Capacitors supplied in
bulk or tape & reel package are ideally suitable for thick-film
hybrid circuits and automatic surface mounting on any
printed circuit boards, All of MERITEK's MLCC products meet
RoHS directive.
ST series use a special material between nickel-barrier
and ceramic body. It provides excellent performance to
against bending stress occurred during process and
provide more security for PCB process.
•
•
•
•
•
High flexure stress circuit board
DC to DC converter
High voltage coupling/DC blocking
Back-lighting inverters
Snubbers in high frequency power convertors
The nickel-barrier terminations are consisted of a nickel
barrier layer over the silver metallization and then finished by
electroplated solder layer to ensure the terminations have
good solderability. The nickel barrier layer in terminations
prevents the dissolution of termination when extended
immersion in molten solder at elevated solder temperature.
PART NUMBER SYSTEM
DIMENSION
ST 0805 XR 104 K 101
Meritek Series
Size
0603 0805 1206 1210 1812 1825 2220 2225
Dielectric
Code
XR
CG
X7R
COG(NPO)
Capacitance
Code
pF
nF
8R2
8.2
--
101
223
22000
22
104
100000
100
100
0.1
--
Size Inch (mm) L(mm)
W(mm)
0.8±0.15
1.25±0.2
1.6±0.2
2.5±0.4
3.2±0.3
6.3±0.4
5.0±0.4
6.3±0.4
Tmax(mm) MB min (mm)
0603(1608)
0805(2012)
1206(3216)
1210(3225)
1812(4532)
1825(4563)
2220(5750)
2225(5763)
1.6±0.2
2.1±0.2
3.3±0.3
3.3±0.4
4.5±0.4
4.6±0.3
5.7±0.4
5.7±0.4
0.95
1.45
1.80
2.90
2.80
2.80
2.80
2.80
0.20
0.30
0.30
0.30
0.26
0.26
0.30
0.30
uF
--
0.022
0.1
Tolerance
Code
Tolerance
±0.1pF
±1%
Code
C
G
Tolerance
Code
Tolerance
±0.5pF
±5%
B
F
K
±0.25pF
±2%
D
J
±10%
M
±20%
Rated Voltage – 2 significant digits + number of zeros.
Code
101
201
251
501
631
100Vdc
200Vdc
250Vdc
500Vdc
630Vdc
Rev.7
GENERAL ELECTRICAL DATA
Item
Dielectric
Characteristic
NPO
1206
X7R
Size
0603,0805,1206,1210,1808,1812,1825,2
220,2225
Capacitance range*
1.5pF to 220pF
100pF to 4.7uF
Capacitance tolerance
C: ±0.25pF @cap≤5pF
J: ±5%,K: ±10%,M: ±20%
D: ±0.5pF @5pF≤cap≤10pF
J: ±5%, K: ±10% @cap≥10pF
Rated voltage (WVDC)
100V, 200V, 250V, 500V, 630V
Tan δ*
Q < 400+20C @cap<30pF
Q ≤ 2.5%
Q ≥ 1000 @cap≥30pF
Insulation resistance at Ur**
≥10GΩ or RxC ≥100Ω-F whichever is
smaller @Ur=100~630V
≥10GΩ or RxC ≥500Ω-F whichever is
smaller
≥10GΩ @Ur=1000~3000V
Operating temperature
Capacitance characteristic
Termination
-55 to +125°C
±30ppm
±15%
Cu(or Ag)/Ni/Sn (lead-free termination)
*Measured at the condition of 30%~70% related humidity.
NPO: Apply 1.0±0.2Vrms, 1.0MHz±10% for cap ≤ 1000pF and 1.0±0.2Vrms, 1.0kHz±10% for cap>1000pF, 25°C at ambient temperature
X7R: Apply 1.0±0.2Vrms, 1.0kHz±10%, at 25°C ambient temperature
**Measured at 500VDC for 60sec, for Ur > 500VDC
S
TRUCTURE
Meritek ST series is added a special termination material
( Ultra-Buffer or Anti-Bend) between ceramic body and Ni-barrier
that can absorb mechanical stress to prevent bending crack
occured.
100% Sn External Termination
100% Sn External Termination
Ni-Barrier
Ultra-Buffer
Cu or Ag Termination
Inner Electrode
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
CAPACITANCE RANGE
DIELECTRIC
SIZE
NP0
1206
250
RATED VOLTAGE (VDC)
0.5pF (0R5)
1.0pF (1R0)
1.2pF (1R2)
1.5pF (1R5)
1.8pF (1R8)
2.2pF (2R2)
2.7pF (2R7)
3.3pF (3R3)
3.9pF (3R9)
4.7pF (4R7)
5.6pF (5R6)
6.8pF (6R8)
8.2pF (8R2)
10pF (100)
100
200
500
630
12pF (120)
15pF (150)
18pF (180)
22pF (220)
27pF (270)
33pF (330)
39pF (390)
47pF (470)
56pF (560)
68pF (680)
82pF (820)
100pF (101)
120pF (121)
150pF (151)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
820pF (821)
1,000pF (102)
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
3,300pF (332)
3,900pF (392)
4,700pF (472)
5,600pF (562)
6,800pF (682)
8,200pF (822)
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
DIELECTRIC
X7R
SIZE
0603
0805
1206
1210
RATED VOLTAGE (VDC) 100 200 250 100 200 250 500 100 200 250 500 630 100 200 250 500 630
100pF (101)
120pF (121)
150pF (151)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
820pF (821)
1,000pF (102)
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
3,300pF (332)
3,900pF (392)
4,700pF (472)
5,600pF (562)
6,800pF (682)
8,200pF (822)
0.010ꢀF (103)
0.012ꢀF (123)
0.015ꢀF (153)
0.018ꢀF (183)
0.022ꢀF (223)
0.027ꢀF (273)
0.033ꢀF (333)
0.039ꢀF (393)
0.047ꢀF (473)
0.056ꢀF (563)
0.068ꢀF (683)
0.082ꢀF (823)
0.10ꢀF (104)
0.12ꢀF (124)
0.15ꢀF (154)
0.18ꢀF (184)
0.22ꢀF (224)
0.27ꢀF (274)
0.33ꢀF (334)
0.39ꢀF (394)
0.47ꢀF (474)
0.56ꢀF (564)
0.68ꢀF (684)
0.82ꢀF (824)
1.00ꢀF (105)
1.20ꢀF (125)
1.50ꢀF (155)
1.80ꢀF (185)
2.20ꢀF (225)
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
DIELECTRIC
X7R
1825
2220
2225
SIZE
1812
RATED VOLTAGE
100 200 250 500 630 100 200 250 500 630 100 200 250 500 630
100 200 250 500 630
100pF (101)
120pF (121)
150pF (151)
180pF (181)
220pF (221)
270pF (271)
330pF (331)
390pF (391)
470pF (471)
560pF (561)
680pF (681)
820pF (821)
1,000pF (102)
1,200pF (122)
1,500pF (152)
1,800pF (182)
2,200pF (222)
2,700pF (272)
3,300pF (332)
3,900pF (392)
4,700pF (472)
5,600pF (562)
6,800pF (682)
8,200pF (822)
0.010ꢀF (103)
0.012ꢀF (123)
0.015ꢀF (153)
0.018ꢀF (183)
0.022ꢀF (223)
0.027ꢀF (273)
0.033ꢀF (333)
0.039ꢀF (393)
0.047ꢀF (473)
0.056ꢀF (563)
0.068ꢀF (683)
0.082ꢀF (823)
0.10ꢀF (104)
0.12ꢀF (124)
0.15ꢀF (154)
0.18ꢀF (184)
0.22ꢀF (224)
0.27ꢀF (274)
0.33ꢀF (334)
0.39ꢀF (394)
0.47ꢀF (474)
0.56ꢀF (564)
0.68ꢀF (684)
0.82ꢀF (824)
1.0ꢀF (105)
1.2ꢀF (125)
1.5ꢀF (155)
1.8ꢀF (185)
2.2ꢀF (225)
2.7ꢀF (275)
3.3ꢀF (335)
3.9ꢀF (395)
4.7ꢀF (475)
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
P
ACKAGE
D
IMENSION AND QUANTITY
Thickness
Paper tape
Plastic tape
Size
(mm)
7” reel
13” reel
7” reel
13” reel
0.80+0.15/-0.10
0.80+0.15/-0.10
1.25±0.10
1.25±0.20
0.80±0.10
0.95±0.10
1.25±0.10
1.60±0.20
0.95±0.10
1.25±0.10
1.60±0.20
2.00±0.20
2.50±0.40
1.25±0.10
1.60±0.20
2.00±0.20
2.50±0.30
1.60±0.20
2.00±0.20
2.50±0.30
1.60±0.20
2.00±0.20
2.50±0.30
2.00±0.20
2.50±0.30
0603 (1608)
0805 (2012)
4k
4k
-
15k
15k
-
3k
-
-
10k
-
-
3k
-
4k
-
15k
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
3k
10k
1206 (3216)
1210 (3225)
-
3k
10k
-
2k
-
-
3k
10k
-
3k
10k
-
2k
-
-
-
1k
-
1k
-
-
1k
-
-
1k
-
1812 (4532)
1825 (4563)
-
1k
-
-
0.5k
1k
3k
-
-
-
1k
-
-
0.5k
1k
-
-
-
2220 (5750)
2225 (5763)
-
1k
-
-
0.5k
1k
-
-
-
-
0.5k
-
Unit: pieces
Size
Reel size
0603, 0805, 1206, 1210
1812,1825 ,2220 ,2225
7”
7”
10”
13”
C
W1
A
13.0+0.5/-0.2
8.4+1.5/-0
178.0±0.10
60.0±1.0/-0
13.0+0.5/-0.2
8.4+1.5/-0
250.0±1.0
13.0+0.5/-0.2
8.4+1.5/-0
330.0±1.0
100±1.0
13.0+0.5/-0.2
12.4+2.0/-0
178.0±0.10
80.0±1.0
N
100.0±1.0
Fig. 4 The dimension of reel
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
CARDBOARD TAPE DIMESIONS
EMBOSSED TAPE DIMENSIONS
Fig. 2 The dimension of paper tape
Fig. 3 The dimension of plastic tape
Size
0603
0805
1206
1210
0.95±0.10
1.25±0.10
1.60±0.20
2.00±0.20
<3.05
Chip
1.25±0.10
1.25±0.20
0.95±0.10
1.25±0.10
0.80+0.15/-0.10 0.80+0.15/-0.10
0.80±0.10
1.60±0.20
2.50±0.40
Thickness
A0
B0
T
1.02+0.05/-0.10
1.80±0.10
0.97±0.05
-
1.50±0.10
2.30±0.10
0.95±0.05
-
<1.65
<2.40
2.00±0.10
3.50±0.10
0.95±0.05
-
<2.00
<3.60
<2.00
<3.70
<3.10
<4.00
<3.80
0.23±0.05
<2.50
0.23±0.05
<2.50
0.23±0.05
<2.50
0.23±0.05
<2.50
0.23±0.05
<3.50
K0
W
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.55±0.05
-
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.55±0.05
-
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.50±0.10/-0
1.00±0.10
1.75±0.10
3.50±0.05
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.55±0.05
-
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.50±0.10/-0
1.00±0.10
1.75±0.10
3.50±0.05
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.50±0.10/-0
1.00±0.10
1.75±0.10
3.50±0.05
8.00±0.10
4.00±0.100
40.00±0.20
4.00±0.10
2.00±0.05
1.50±0.10/-0
1.00±0.10
1.75±0.10
3.50±0.05
8.00±0.10
4.00±0.10
40.00±0.20
4.00±0.10
2.00±0.05
1.50±0.10/-0
1.00±0.10
1.75±0.10
3.50±0.05
P0
10xP0
P1
P2
D0
D1
E
1.75±0.05
3.50±0.05
1.75±0.05
3.50±0.05
1.75±0.10
3.50±0.05
F
Size
1812
1825
2220
2225
1.25±0.10
1.60±0.20
2.00±0.20
<3.90
Chip
1.60±0.20
2.00±0.20
1.60±0.20
2.00±0.20
2.50±0.30
2.50±0.30
2.50±0.30
2.00±0.20
2.50±0.30
Thickness
A0
B0
T
<3.90
<5.30
<6.80
<5.30
<6.80
<5.30
<5.80
<6.50
<5.80
<6.50
<6.80
<6.50
<6.80
<6.50
<5.30
0.25±0.05
<2.50
0.25±0.05
<3.00
0.30±0.10
<2.50
0.30±0.10
<3.10
0.30±0.10
<2.50
0.30±0.10
<3.10
0.30±0.10
<2.50
0.30±0.10
<3.10
K0
W
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.10
5.50±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50+/-0.10
1.75+/-0.1
5.50+/-0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.1
5.50±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.10
5.50±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.1
5.50±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.10
5.50±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
12.0±0.20
4.00±0.10
40.00±0.20
8.00±0.10
2.00±0.05
P0
10xP0
P1
P2
D0
D1
E
1.50+0.10/-0
1.50±0.10
1.75±0.10
5.50±0.05
1.50+0.10/-0
1.50±0.10
1.75±0.10
5.50±0.05
F
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
APPLICATION NOTES
STORAGE
To prevent the damage of solderability of terminations, the following storage conditions are
recommended:
Indoors under 5 ~ 40℃ and 20% ~ 70% RH.
No harmful gases containing sulfuric acid, ammonia, hydrogen sulfide or chlorine.
Packaging should not be opened until the capacitors are required for use. If opened, the pack should be
re-sealed as soon as is practicable. Taped product should be stored out of direct sunlight, which might
promote deterioration in tape or adhesion performance. The capacitors should be used within 6 months and
checked the solderability before use.
HANDLING
Chip capacitors are dense, hard, brittle, and abrasive materials. They are liable to suffer mechanical
damage, in the form of cracks or chips. Chip Capacitors should be handled with care to avoid contamination
or damage. To use vacuum or plastic tweezers to pick up or plastic tweezers is recommended for manual
placement. Tape and reeled packages are suitable for automatic pick and placement machine.
PREHEAT
In order to minimize the risk of thermal shock during soldering, a carefully controlled preheat is required.
The rate of preheat should not exceed 4℃ per second and the final preheat temperature should be within
100℃ of the soldering temperature for small chips such as 0603, 0805 and 1206, within 50℃ of the
soldering temperature for bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc.
SOLDERING
Use middy activated rosin RA and RMA fluxes do not use activated flux. The amount of solder in each
solder joint should be controlled to prevent the damage of chip capacitors caused by the stress between
solder, chips, and substrate.
Hand soldering with temperature-controlled iron not exceeding 30 watts and diameter of tip less than 1.2
mm is recommended, tip of iron should not contact the ceramic body directly, and the temperature of iron
should be set to not more than 260℃.
For bigger chips such as 1210, 1808, 1812, 1825, 2220 and 2225, etc. wave soldering and hand
soldering are no recommended.
Recommended soldering profiles as following:
Soldering Solder Temp.(T) Soldering Time (t)
(℃)
soldering
235 – 260 ℃
230 – 260 ℃
Reflow
Wave
< 15 sec.
< 5 sec.
preheat
cooling
200
100
ΔT
ΔT
Chip Size
100 ℃
0603, 0805, 1206
50 ℃
1210, 1808, 1812, 1825, 2220, 2225
t
120 sec.
60 sec.
COOLING
After soldering, cool the chips and the substrate gradually to room temperature. Natural cooling in air is
recommended to minimize stress in the solder joint. A cooling rate not exceeding 4℃ per second should be
used when forced cooling is necessary.
CLEANING
All flux residues must be removed by using suitable electronic-grade vapor-cleaning solvents to
eliminate contamination that could cause electrolytic surface corrosion. Good results can be obtained by
using ultrasonic cleaning of the solvent. The choice of the proper system is depends upon many factors such
as component mix, flux, and solder paste and assembly method. The ability of the cleaning system to remove
flux residues and contamination from under the chips is very important.
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
RELIABILITY
TEST
CONDITIONS AND
REQUIREMENTS
No.
Item
Test Condition
Requirements
1. Visual and
Mechanical
---
* No remarkable defect.
* Dimensions to conform to individual specification sheet.
* Shall not exceed the limits given in the detailed spec.
NP0: Cap≥30pF, Q≥1000; Cap<30pF, Q≥400+20C
X7R: ≤2.5%
2. Capacitance Class I: (NP0)
Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10%
Cap>1000pF, 1.0±0.2Vrms, 1KHz±10%
Class II: (X7R)
3. Q/ D.F.
(Dissipation
Factor)
1.0±0.2Vrms, 1kHz±10%
4. Temperature With no electrical load.
T.C.
NP0
X7R
Operating Temp
-55~125°C at 25°C
-55~125°C at 25°C
T.C.
NPO
X7R
Capacitance Change
Within ±30ppm/°C
Within ±15%
Coefficient
5. Insulation
U =100V: To apply voltage at U for max. 120 sec.
Class I (NP0)
Class II (X7R)
: ≥100Gꢀ or RxC≥1000ꢀ-F whichever is smaller.
: ≥10Gꢀ or RxC≥500ꢀ-F whichever is smaller.
R
R
Resistance U >100V: To apply voltage at U (500V max.) for 60
R
R
sec.
6. Dielectric
Strength
* To apply voltage:
100V
* No evidence of damage or flashover during test.
=2.5 times of U
R
200V/250V
500V
=2 times of U
R
=1.5 times of U
=1.2 times of U
R
> 500V
R
* Duration: 1 to 5 sec.
7. Solderability * Solder temperature: 235±5°C
NPO:95% min. coverage of all metalized area.
* Dipping time: 2±0.5 sec.
X7R:75% min. coverage of all metalized area.
8. Resistance * Solder temperature: 260±5°C
to Soldering * Dipping time: 10±1 sec
* No remarkable damage.
* Cap change:
Heat
* Preheating: 120 to 150°C for 1 minute before
immerse the capacitor in a eutectic solder.
* Before initial measurement : Perform 150+0/-10°C
for 1 hr and then set for 48±4 hrs at room temp.
* Measurement to be made after keeping at room
temp. for 24±2hrs (Class I) or 48±4 hrs (Class II)
NP0: within ±2.5% or ±0.25pF whichever is larger.
* Q/D.F., I.R. and dielectric strength: To meet initial requirements.
X7R:
within ±15%
* 25% max. leaching on each edge.
9. Temperature * Conduct the five cycles according to the
* No remarkable damage.
Cycle
temperatures and time.
* Cap change:
Step
Temp. (°C)
Min. operating temp. +0/-3
Room temp.
Max. operating temp. +3/-0
Room temp.
Time (min.)
30±3
2~3
30±3
2~3
NP0: within ±2.5% or ±0.25pF whichever is larger.
X7R: within ±15%
1
2
3
4
* Q/D.F.:
X7R: ≤1.5 × Initial requirement
* I.R.≥ 0.25 × initial requirements.
* Before initial measurement : Perform 150+0/-10°C
for 1 hr and then set for 48±4 hrs at room temp.
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)
10. Humidity
* Test temp.: 40±2°C
* No remarkable damage.
* Cap change:
NP0: within ±5.0% or ±0.5pF whichever is larger.
X7R :within ±15%
(Damp Heat) * Humidity: 90~95% RH
Steady State * Test time: 500+24/-0hrs.
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)
Q/D.F Value:
NP0: Cap≥30pF, Q≥350; 10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF; Q≥200+10C
X7R:
≤7.0%
* I.R.: ≥1Gꢀ or RxC≥50ꢀ-F whichever is smaller.
Rev.7
Soft Termination Multilayer
Ceramic Chip Capacitors
STSeries
MERITEK
RoHS
No.
Item
Test Condition
* Test temp.: 40±2°C
* Humidity: 90~95%RH
* Test time: 500+24/-0 hrs.
* To apply voltage:rated voltage (Max. 500V)
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I).
Requirements
Humidity
(Damp Heat)
Load
* No remarkable damage.
* Cap change: NP0: within ±7.5% or ±0.75pF whichever is larger.
* Q/D.F. value:
NP0: Cap≥30pF, Q≥200; Cap<30pF, Q≥100+10/3C
* I.R.: ≥500Mꢀ or RxC≥25ꢀ-F whichever is smaller.
11.
12.
Vibration
* Vibration frequency: 10~55 Hz/min.
* Total amplitude: 1.5mm
* No remarkable damage.
Resistance
* Cap change and Q/D.F.: To meet initial spec.
* Test time: 6 hrs. (Two hrs each in three mutually
perpendicular directions.)
13. High
Load
* Test temp.:
Temperature 125±3°C
* No remarkable damage.
* Cap change:
NP0: within ±3.0% or ±0.3pF whichever is larger.
X7R :within ±15%
* To apply voltage:
(Endurance)
(1) U ≤ 250V:
200% of rated voltage.
R
Exception item: To apply 150% of rated voltage
* Q/D.F Value:
UR
Size
1206
1210
1210
1812
1825
2220
2225
Cap. Range
NP0: Cap≥30pF, Q≥350
10pF≤Cap<30pF, Q≥275+2.5C
Cap<10pF, Q≥200+10C
100V
> 224
200V / 250V
> 224
> 474
> 105
> 105
> 105
X7R:
≤7.0%
* I.R.: ≥1Gꢀ or RxC≥50ꢀ-F whichever is smaller.
(2) 250 < U ≤500V:
150% of rated voltage.
120% of rated voltage.
R
(3) U > 500V:
R
* Test time: 1000+24/-0 hrs.
* Measurement to be made after keeping at room
temp. for 24±2 hrs. (Class I) or 48±4 hrs (Class II)
14. Resistance
to Flexure of
Substrate
* No remarkable damage.
* Cap change:
* The middle part of substrate shall be pressurized by
means of the pressurizing rod at a rate of about 1mm
per second until the deflection becomes 5mm.
20
X7R:
within ±10%
(This capacitance change means the change of capacitance under
specified flexure of substrate from the capacitance measured before the
test.)
R = 230
50
5mm
45±1
45±1
15. Adhesive
Strength of
Termination
* Capacitors mounted on a substrate. A force of 10N * No remarkable damage or removal of the terminations.
applied perpendicular to the place of substrate and
parallel the line joining the center of terminations for
10±1 second.
10N
PC Board
Capacitor
Rev.7
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