MDF5N50FTH [MGCHIP]

N-Channel MOSFET 500V, 4.5 A, 1.58ohm;
MDF5N50FTH
型号: MDF5N50FTH
厂家: MagnaChip    MagnaChip
描述:

N-Channel MOSFET 500V, 4.5 A, 1.58ohm

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MDP5N50F / MDF5N50F  
N-Channel MOSFET 500V, 4.5 A, 1.58  
General Description  
Features  
The MDP5N50F/MDF5N50F use advanced Magnachips  
VDS = 500V  
MOSFET Technology, which provides low on-state resistance,  
high switching performance and excellent quality.  
ID = 4.5A  
RDS(ON) 1.58Ω @VGS = 10V  
@VGS = 10V  
MDP5N50F/MDF5N50F are suitable device for SMPS, HID  
and general purpose applications.  
Applications  
Power Supply  
PFC  
Ballast  
G
TO-220  
TO-220F  
MDP Series  
MDF Series  
S
Absolute Maximum Ratings (Ta = 25oC)  
Characteristics  
Symbol  
VDSS  
MDP5N50F  
500  
MDF5N50F  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
VGSS  
±30  
V
TC=25oC  
4.5  
2.8  
18  
4.5*  
2.8*  
18*  
27  
A
Continuous Drain Current  
Pulsed Drain Current(1)  
Power Dissipation  
ID  
TC=100oC  
A
IDM  
PD  
A
TC=25oC  
93  
W
W/ oC  
Derate above 25 oC  
0.74  
0.22  
Repetitive Avalanche Energy(1)  
Peak Diode Recovery dv/dt(3)  
Single Pulse Avalanche Energy(4)  
EAR  
dv/dt  
EAS  
93  
4.5  
230  
mJ  
V/ns  
mJ  
Junction and Storage Temperature Range  
* Id limited by maximum junction temperature  
TJ, Tstg  
-55~150  
oC  
Thermal Characteristics  
Characteristics  
Thermal Resistance, Junction-to-Ambient(1)  
Thermal Resistance, Junction-to-Case(1)  
Symbol  
MDP5N50F  
MDF5N50F  
62.5  
Unit  
RθJA  
RθJC  
62.5  
1.35  
oC/W  
4.6  
1
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
Ordering Information  
Part Number  
MDP5N50FTH  
MDF5N50FTH  
Temp. Range  
-55~150oC  
-55~150oC  
Package  
TO-220  
Packing  
Tube  
RoHS Status  
Halogen Free  
Halogen Free  
TO-220F  
Tube  
Electrical Characteristics (Ta =25oC)  
Characteristics  
Static Characteristics  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Drain-Source Breakdown Voltage  
Gate Threshold Voltage  
Drain Cut-Off Current  
Gate Leakage Current  
Drain-Source ON Resistance  
Forward Transconductance  
Dynamic Characteristics  
Total Gate Charge  
BVDSS  
VGS(th)  
IDSS  
ID = 250μA, VGS = 0V  
VDS = VGS, ID = 250μA  
VDS = 500V, VGS = 0V  
VGS = ±20V, VDS = 0V  
VGS = 10V, ID = 2.5A  
VDS = 30V, ID = 2.5A  
500  
2.5  
-
-
-
V
-
-
4.5  
10  
μA  
nA  
Ω
IGSS  
-
-
100  
1.58  
-
RDS(ON)  
gfs  
1.25  
3.3  
-
S
Qg  
Qgs  
Qgd  
Ciss  
Crss  
Coss  
td(on)  
tr  
-
-
-
-
-
-
-
-
-
-
12.1  
3.6  
4.3  
500  
1.5  
65  
15.73  
-
Gate-Source Charge  
Gate-Drain Charge  
VDS = 500V, ID = 5.0A, VGS = 10V(3)  
VDS = 25V, VGS = 0V, f = 1.0MHz  
nC  
pF  
-
Input Capacitance  
650  
2.25  
84.5  
48.3  
60  
Reverse Transfer Capacitance  
Output Capacitance  
Turn-On Delay Time  
Rise Time  
23  
30  
VGS = 10V, VDS = 250V, ID = 5.0A,  
ns  
RG = 25Ω(3)  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
37  
77.7  
60.9  
29  
Drain-Source Body Diode Characteristics  
Maximum Continuous Drain to  
Source Diode Forward Current  
Source-Drain Diode Forward  
Voltage  
Body Diode Reverse Recovery  
Time  
IS  
VSD  
trr  
-
-
-
-
4.5  
-
A
V
IS = 5.0A, VGS = 0V  
1.4  
80  
ns  
μC  
IF = 5.0A, dl/dt = 100A/μs(3)  
Body Diode Reverse Recovery  
Charge  
Qrr  
1.6  
Note :  
1. Pulse width is based on R θJC & R θJA and the maximum allowed junction temperature of 150°C.  
2. Pulse test: pulse width 300us, duty cycle2%, pulse width limited by junction temperature TJ(MAX)=150°C.  
3. ISD 4.5A, di/dt200A/us, V =50V, R =25Ω, Starting TJ=25°C  
DD  
g
4. L=20.5mH, IAS=4.5A, VDD=50V, , R =25Ω, Starting TJ=25°C  
g
2
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
11  
10  
9
2.5  
2.0  
1.5  
1.0  
Vgs=5.5V  
=6.0V  
Notes  
1. 250Pulse Test  
2. TC=25℃  
=6.5V  
=7.0V  
8
=8.0V  
=10.0V  
=15.0V  
7
6
VGS=10.0V  
5
VGS=20V  
4
3
2
1
0
5
10  
15  
20  
0
2
4
6
8
10  
12  
VDS,Drain-Source Voltage [V]  
ID,Drain Current [A]  
Fig.2 On-Resistance Variation with  
Drain Current and Gate Voltage  
Fig.1 On-Region Characteristics  
1.2  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Notes :  
1. VGS = 0 V  
2. ID = 250㎂  
Notes :  
1. VGS = 10 V  
2. ID = 2.25A  
1.1  
1.0  
0.9  
0.8  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Fig.3 On-Resistance Variation with  
Temperature  
Fig.4 Breakdown Voltage Variation vs.  
Temperature  
Notes :  
1. VGS = 0 V  
2. 250Pulse Test  
* Notes ;  
1. VDS=30V  
10  
10  
150  
25℃  
1
0.0  
1
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
2
3
4
5
6
7
8
9
10  
VSD, Source-Drain Voltage [V]  
VGS [V]  
Fig.5 Transfer Characteristics  
Fig.6 Body Diode Forward Voltage  
Variation with Source Current and  
Temperature  
3
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
1400  
1200  
1000  
800  
600  
400  
200  
0
10  
8
Ciss = Cgs + Cgd (Cds = shorted)  
Coss = Cds + Cgd  
Crss = Cgd  
100V  
250V  
Coss  
Note : ID = 4.5A  
400V  
Notes ;  
1. VGS = 0 V  
2. f = 1 MHz  
6
Ciss  
4
Crss  
2
0
1
10  
0
2
4
6
8
10  
12  
14  
VDS, Drain-Source Voltage [V]  
QG, Total Gate Charge [nC]  
Fig.7 Gate Charge Characteristics  
Fig.8 Capacitance Characteristics  
102  
101  
100  
10-1  
10-2  
6
4
2
0
Operation in This Area  
is Limited by R DS(on)  
100 s  
1 ms  
10 ms  
100 ms  
DC  
Single Pulse  
TJ=Max rated  
TC=25  
10-1  
100  
101  
102  
25  
50  
75  
100  
125  
150  
TC, Case Temperature []  
VDS, Drain-Source Voltage [V]  
Fig.9 Maximum Safe Operating Area  
MDP5N50F (TO-220)  
Fig.10 Maximum Drain Current vs. Case  
Temperature  
10000  
8000  
6000  
4000  
2000  
0
single Pulse  
RthJC = 1.35/W  
TC = 25℃  
100  
D=0.5  
0.2  
0.1  
10-1  
0.05  
0.02  
0.01  
Notes :  
Duty Factor, D=t1/t2  
PEAK TJ = PDM * Zθ JC* Rθ (t) + TC  
JC  
RΘ =1.35/W  
JC  
single pulse  
10-3  
10-2  
10-5  
10-4  
10-2  
10-1  
100  
101  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
1
10  
t1, Rectangular Pulse Duration [sec]  
Pulse Width (s)  
Fig.12 Single Pulse Maximum Power  
Dissipation MDP5N50F (TO-220)  
Fig.11 Transient Thermal Response Curve  
MDP5N50F (TO-220)  
4
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
102  
101  
100  
10-1  
10-2  
Operation in This Area  
is Limited by R DS(on)  
10000  
8000  
6000  
4000  
2000  
0
single Pulse  
RthJC = 4.6/W  
TC = 25℃  
10 s  
100 s  
1 ms  
10 ms  
100 ms  
1 s  
DC  
Single Pulse  
TJ=Max rated  
TC=25  
10-1  
100  
101  
102  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
1
10  
Pulse Width (s)  
VDS, Drain-Source Voltage [V]  
Fig.12 Single Pulse Maximum Power  
Dissipation- MDF5N50F (TO-220F)  
Fig.13 Maximum Safe Operating Area  
MDF5N50F (TO-220F)  
D=0.5  
100  
0.2  
0.1  
0.05  
10-1  
0.02  
0.01  
Notes :  
Duty Factor, D=t1/t2  
PEAK TJ = PDM * Zθ JC* Rθ (t) + TC  
JC  
RΘ =4.6/W  
JC  
single pulse  
10-3  
10-2  
10-5  
10-4  
10-2  
10-1  
100  
101  
t1, Rectangular Pulse Duration [sec]  
Fig.11 Transient Thermal Response Curve  
MDF5N50F (TO-220F)  
5
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
Physical Dimension  
3 Leads, TO-220  
Dimensions are in millimeters unless otherwise specified  
6
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
Physical Dimension  
3 Leads, TO-220F  
Dimensions are in millimeters unless otherwise specified  
Symbol  
Min  
4.50  
0.63  
1.15  
0.33  
15.47  
9.60  
Nom  
Max  
4.93  
0.91  
1.47  
0.63  
A
b
b1  
C
D
E
16.13  
10.71  
e
2.54  
F
G
L
L1  
Q
2.34  
6.48  
12.24  
2.79  
2.52  
3.10  
3.00  
2.84  
6.90  
13.72  
3.67  
2.96  
3.50  
3.55  
Q1  
¢R  
7
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  
DISCLAIMER:  
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power  
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be  
expected to result in a personal injury. Seller’s customers using or selling Seller’s products for use in such  
applications do so at their own risk and agree to fully defend and indemnify Seller.  
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility  
for use of any circuitry other than circuitry entirely included in a MagnaChip product.  
Semiconductor Ltd.  
is a registered trademark of MagnaChip  
8
Jun. 2018 Version 1.3  
MagnaChip Semiconductor Ltd.  

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