MIC2829-B0YAB [MICREL]
3G/4G HEDGE/LTE PMIC with Six Buck Converters, Eleven LDOs and SIM Card Level Translation; 3G / 4G HEDGE / LTE PMIC与六降压转换器， LDO的十一和SIM卡电平转换
| 型号： | MIC2829-B0YAB |
| 厂家： | 
MICREL SEMICONDUCTOR |
| 描述： | 3G/4G HEDGE/LTE PMIC with Six Buck Converters, Eleven LDOs and SIM Card Level Translation |
| 文件： | 总52页 (文件大小：3646K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MIC2829
3G/4G HEDGE/LTE PMIC with
Six Buck Converters, Eleven LDOs
and SIM Card Level Translation
General Description
Features
The MIC2829 is a highly integrated Power Management
Integrated Circuit (PMIC) designed for 3G/4G
(HEDGE/LTE and WiMAX) USB wireless applications. It is
a complete power management solution which provides
power to processors, dual standard RF (such as
HEDGE/LTE or WiMAX) transceivers and power
amplifiers, memory, USB-PHY associated I/O interfaces
and other system requirements.
• Input voltage range: 2.7V to 5.5V
Six DC Step-Down Regulators
• Four HyperLight LoadTM step-down regulators
- Low quiescent current – typical 40µA
- DC1: 4MHz / 1000mA
- DC2: 4MHz / 300mA (with voltage scaling)
- DC3: 2.5MHz / 600mA
The MIC2829 incorporates six DC/DC buck converters,
eleven LDOs and digital level shifters for SIM Card support
inside a single package. Four of the six integrated DC/DC
buck converters incorporate HyperLight LoadTM (HLL)
technology. Each of these buck regulators operate at high
switching speed in PWM mode (4MHz/2.5MHz) and
maintain high efficiency in light load conditions. The high
speed PWM operation allows the use of very small
inductors and capacitors minimizing board area while the
HLL mode enables 87% efficiency at 1mA. HyperLight
LoadTM technology also has unmatched load transient
response to support advance portable processor
requirements.
- DC4: 4MHz / 600mA (with adjustable delay POR)
• Two PWM step-down regulators
- DC5 and DC6: Fixed 2MHz / 800mA
- 100% duty cycle
Eleven Low Dropout Regulators (LDOs)
• Five general purpose 200mA LDOs (LDO1-4, LDO11)
- LDO3: 38mV dropout at 100mA
- LDO2 and LDO4: 80mV dropout at 100mA
- LDO1 and LDO11: 115mV dropout at 100mA
- Output accuracy ± 3%
- 40µA ground current
• Six high performance 200mA LNRs (LDO5-10)
- High PSRR 70dB at 1kHz
The remaining two DC/DC buck converters support 100%
duty cycle operation and can deliver greater than 96%
efficiency. This allows pre-regulation of system LDOs for
high efficiency power system partitioning.
- Low noise: 20µVRMS
- 40mV dropout at 100mA
- Output accuracy ± 3%
- 20µA ground current
The MIC2829 has eleven low dropout regulators (LDOs).
Five general purpose LDOs provide low dropout, excellent
output accuracy of ±3% and only require 40µA of ground
current for each to operate. The remaining six are high
performance Low Noise Regulators (LNRs) which provide
high PSRR and low output noise for sensitive RF
subsystems. Each LNR requires only 20µA of ground
current to operate. The MIC2829 also has three high
speed level shifters for digital SIM Card signal translation
and a 50mA SIM power supply.
• SIM card level translator
• SIM card power supply (50mA)
• Thermal shutdown and current limit protection
• UVLO – under voltage lockout protection
• 76-pin 5.5mm x 5.5mm LGA package
• 85-pin 5.5mm x 5.5mm FBGA package
• –40°C to +125°C operating junction temperature range
Applications
• 4G LTE USB modems
• 3G/4G (HEDGE/LTE) wireless chipsets
• WiMAX modems
• Express card modems
The MIC2829 is available in a 76-pin 5.5mm x 5.5mm LGA
and an 85-pin 5.5mm x 5.5mm FBGA package. The
operating junction temperature range for both packages is
from –40°C to +125°C.
Data sheets and support documentation can be found on
Micrel’s website at: www.micrel.com.
• UMPC/notebook PC wireless data communications
• Portable applications
HyperLight Load is a trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
M9999-051410-B
May 2010
MIC2829
Micrel Inc.
Typical Application
VIN
AVIN1
AGND1
AVIN2
AGND2
AVIN3
AGND3
AVIN4
AGND4
C1
BYP
1µF
C7
0.1µF
LDO10
LDO9
C18
1µF
C10
2.2µF
C8
2.2µF
ENL910
C23
1µF
INLDO910
C9
1µF
C28
1µF
PVIN6
SW6
ENGLB
C32
1µF
L6
2.2µH
DC6
PVIN1
SW1
FB6
PGND6
ENDC6
C40
120pF
R10
20k
C20
1µF
L1
2.2µH
DC1
C31
4.7µF
R16
20k
FB1
C19
4.7µF
PGND1
PVIN2
SW2
C21
1µF
L2
2.2µH
DC2
INLDO8
ENL8
FB2
C14
1µF
C22
4.7µF
PGND2
ENDC2
VSC2
LDO8
C13
2.2µF
PVIN3
SW3
INLDO7
ENL7
L3
1µH
C25
1µF
C12
1µF
MIC2829
DC3
FB3
LDO7
C24
4.7µF
C11
2.2µF
PGND3
PVIN4
SW4
PVIN5
SW5
FB5
C26
1µF
L4
C29
1µF
L5
DC4
2.2µH
2.2µH
DC5
FB4
R7
C39
120pF
R23
10k
46.4k
C27
4.7µF
PGND4
C30
4.7µF
PGND5
ENDC5
R8
20k
RESETB
SETDLY
C35
1µF
LDO1
INLDO6
ENL6
C34
1µF
C2
1µF
LDO11
INLDO23
LDO2
C33
1µF
LDO6
C3
C16
1µF
2.2µF
C17
INLDO45
ENL5
1µF
LDO3
ENL3
C5
1µF
C15
1µF
LDO5
C6
LDO4
ENL4
2.2µF
C4
1µF
SIMRST
SIMCLK
SIMIO
LSPWR
RSTIN
CLKIN
DATA
VSLS
C37
1µF
SIMPWR
C36
1µF
SUB1
SUB2
ENLS
M9999-051410-B
May 2010
2
MIC2829
Micrel Inc.
Ordering Information
Part Number
Junction
Temperature Range
Marking Code
Package
Lead Finish
MIC2829-A0YAL
MIC2829-B0YAB(1)
MIC2829-A0
MIC2829-B0
-40°C to +125°C
-40°C to +125°C
76-Pin 5.5mm x 5.5mm LGA
85-Pin 5.5mm x 5.5mm FBGA
Pb-Free
Pb-Free
Output
Output Voltage
(A0 Option)
Output Voltage
(B0 Option)
DC1
DC2
1.2V
1.0V / 1.2V
3.0V
1.15V
1.0V / 1.2V
3.0V
DC3
DC4
1.8V
1.8V
DC5
ADJ
ADJ
DC6
ADJ
ADJ
LDO1
LDO2
LDO3
LDO4
LNR5
LNR6
LNR7
LNR8
LNR9
LNR10
LDO11
Note:
3.3V
3.3V
2.5V
2.5V
2.8V
2.8V
2.85V
2.8V
2.85V
2.8V
2.5V
2.5V
1.8V
1.8V
1.5V
1.35V
1.2V
1.2V
1.2V
1.2V
2.8V
2.8V
1. Contact Micrel Marketing for details.
M9999-051410-B
May 2010
3
MIC2829
Micrel Inc.
Pin Configuration
76-Pin 5.5mm x 5.5mm LGA Package (AL)
(Top View)
85-Pin 5.5mm x 5.5mm FBGA Package (AB)
(Top View)
Pin Description
Pin # A Pin # B Pin # G
Pin name
AVIN1
INLDO6
LDO6
Description
A1
A2
A3
B1
A4
B2
A5
B3
A6
B4
A7
B5
A8
B6
A9
A10
A11
A12
Analog supply to chip. All AVIN pins should be tied together.
Supply input to LNR6.
LNR6 output.
LDO4
LDO4 output.
INLDO45
LDO5
Supply input to LDO4 and LNR5.
LNR5 output.
BYP
Reference bypass pin. Connect a 0.1µF capacitor-to-ground.
LNR9 output.
LDO9
INLDO910
LDO10
LDO7
Supply input to LNR9 and LNR10.
LNR10 output.
LNR7 output.
INLDO7
LDO8
Supply input to LNR7.
LNR8 output.
INLDO8
LDO3
Supply input to LNR8.
LDO3 output.
INLDO23
LDO2
Supply input to LDO2 and LDO3.
LDO2 output.
AVIN2
Analog supply to chip. All AVIN pins should be tied together.
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
Pin # A Pin # B Pin # G
Pin name
SETDLY
AGND2
ENL6
Description
B7
A13
B8
Set delay pin for RESETB output (1sec/µF).
Analog ground. Connect all AGND pins together.
Enable LNR6. Do not leave floating.
Enable LNR7. Do not leave floating.
Guard ring ground connection. Connect to AGND1 and AGND2.
Enable LNR8. Do not leave floating.
Open drain RESETB output (POR function).
Power ground of DC1.
A14
ENL7
B9
SUB2
A15
B10
A16
B11
A17
B12
A18
B13
A19
B14
A20
B15
A21
B16
A22
A23
A24
A25
B17
A26
B18
A27
B19
A28
B20
A29
B21
A30
B22
A31
A32
A33
A34
B23
A35
B24
A36
ENL8
RESETB
PGND1
FB1
Output sense pin of DC1.
SW1
Switch output of DC1.
ENL910
PVIN1
AGND3
PVIN2
ENDC2
SW2
Enable LNR9 and LNR 10. Do not leave floating.
Power input of DC1.
Analog ground. Connect all AGND pins together.
Power input of DC2.
Enable DC2. Do not leave floating.
Switch output of DC2.
FB2
Output sense pin of DC2.
PGND2
FB3
Power ground of DC2.
Output sense pin of DC3.
AVIN3
PGND3
SW3
Analog supply to chip. All AVIN pins should be tied together.
Power ground of DC3.
Switch output of DC3.
PVIN3
VSC2
Power input of DC3.
Voltage Scaling pin DC2 (High sets 1.2V, Low sets 1.0V). Do not leave floating.
Power input of DC4.
PVIN4
ENLS
Enable level shifter. Do not leave floating.
Switch output of DC4.
SW4
FB4
Output sense pin of DC4.
PGND4
LSPWR
DATA
CLKIN
SIMCLK
SIMIO
AGND4
SIMRST
SIMPWR
AVIN4
VSLS
Power ground of DC4.
Power input for level shifter input (1.8V).
Digital data for SIM card.
Digital input clock for SIM card.
Level shifted Clock to SIM card.
Level shifted digital input/output to SIM card.
Analog ground. Connect all AGND pins together.
Level shifted reset to SIM card.
Power supply to SIM card
Analog supply to chip. All AVIN pins should be tied together.
Level shift voltage select for SIM card. Do not leave floating.
Power input of DC5.
PVIN5
FB5
Output sense pin of DC5 (Adjustable regulator).
Switch output of DC5.
SW5
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
Pin # A Pin # B Pin # G
Pin name
ENDC5
PGND5
RSTIN
PGND6
ENDC6
SW6
Description
B25
A37
B26
A38
B27
A39
B28
A40
B29
A41
B30
A42
B31
A43
B32
A44
G1
Enable DC5. Do not leave floating.
Power ground of DC5.
Digital reset input for SIM card.
Power ground of DC6.
Enable DC6. Do not leave floating.
Switch output of DC6.
FB6
Output sense pin of DC6 (Adjustable regulator).
Power input of DC6.
PVIN6
ENL3
Enable LDO3. Do not leave floating.
ENGLB
SUB1
Global enable for DC1, DC3, DC4 and LDO1, LDO2, LDO11. Do not leave floating.
Guard ring ground connection. Connect to AGND1 and AGND2.
Enable LNR5. Do not leave floating.
ENL5
ENL4
Enable LDO4. Do not leave floating.
AGND1
LDO11
LDO1
Analog ground. Connect all AGND pins together.
LDO11 output.
LDO1 output.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
Thermal Via Thermal via. Connect to ground.
G2
G3
G4
G5
G6
G7
G8
G9
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
Absolute Maximum Ratings(1)
All Power Input Supplies……………………….….-0.3 to 6V
All Logic Inputs…….............................................-0.3 to 6V
Operating Ratings(2)
Supply and Bias Voltage (VPVIN, VAVIN).………..2.7V to 5.5V
Supply Voltage (VINLDO).. ……………………….1.8V to VAVIN
Supply Voltage (VLSPWR) ........………………….1.6V to VAVIN
All Logic Inputs .........................………………….0V to VAVIN
All Feedback Inputs ..................………………….0V to VAVIN
Junction Temperature Range (TJ)... ….-40°C ≤ TJ ≤ +125°C
Thermal Resistance
All Feedback Inputs
.....................-0.3 to (VAVIN + 0.3V)
Ambient Storage Temperature ……………-65°C to +150°C
ESD Rating(3).................................................ESD Sensitive
ESD Rating (SIMRST, CLK, IO, PWR pins)......8kV to GND
5.5mm x 5.5mm LGA (θJA)..............................38.7°C/W
5.5mm x 5.5mm FBGA (θJA)...........................38.7°C/W
Electrical Characteristics – General(4)
TA = 25°C; AVINX = 4.3V unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted.
Parameter
Condition
Min
2.7
Typ
Max
5.5
Unit
Supply Voltage Range
All VAVIN and VPVIN
V
V
IN = 5.0V
Shutdown Current
1
μA
All outputs disabled
High
1.1
V
V
Enable (ENx) & Voltage Scaling
Threshold (VSC2, VSLS)
0.2
Low
VIL < 0.2V
VIH > 1.1V
2
2
μA
μA
Enable & Voltage Scaling Input
Current
Over-Temperature Shutdown
Threshold
150
°C
Over-Temperature Hysteresis
Under-voltage Lockout
10
°C
V
VAVIN rising
2.4
2.55
300
2.7
When Out_x disabled; IOUT = 3mA.
Ω
Auto-Discharge NFET
Resistance(5)
When Out_x disabled; IOUT = 3mA.
DC5 & 6 pull down on feedback pin.
700
Ω
Electrical Characteristics – Quiescent Current(6)
TA=25oC, AVINx = PVINx = INLDOx = ENGLB = 4.3V; ENx = 0V ; All IOUT = 0mA unless otherwise noted.
Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
Typ
Max
Unit
DC1, 3, 4 Non switching, No loads
LDO 1, 2, 11 IOUT = 100μA
Initial Sequence IQ
220
μA
DC2 enabled. ENDC2 = 4.3V
VFB > VOUTNOM x 1.2 (Non switching)
Per enabled DC. ENDCx = 4.3V
DC2 Additional IQ
10
945
40
μA
μA
μA
μA
DC 5, 6 Additional IQ
V
FB > 1.2V; IOUT = 0mA (Non switching)
Per enabled LDO. ENLx = 4.3V
OUT =100µA
LDO 3, 4, LSPWR Additional IQ
LNR 5 – 10 Additional IQ
I
Per enabled LNR. ENLx = 4.3V
IOUT =100µA
20
M9999-051410-B
May 2010
7
MIC2829
Micrel Inc.
Electrical Characteristics – Buck Regulator (DC1 – DC4)
TA=25°C, AVINx = VSC2 = ENGLB = ENDC2 = 4.3V, L3 = 1.0µH, L1, 2, 4 = 2.2µH, COUT = 4.7µF, IOUT = 20mA, unless
noted. Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
1
Typ
1.4
1.5
1.1
Max
Unit
VOUT = VOUTNOM x 0.9, DC1
VOUT = VOUTNOM x 0.9, DC3 & 4
Switch Current Limit
0.65
0.33
-3
A
VOUT = VOUTNOM x 0.9, DC2
Output Voltage Accuracy
Line Regulation
3
%
%/V
%
4.3V ≤ AVIN ≤ 5.5V, Iout = 20mA
150mA ≤ IOUT ≤ 400mA
0.4
0.5
Load Regulation
ISW1,3 = -100mA NMOS, DC1 & 3
ISW4 = -100mA NMOS, DC4
ISW2 = -100mA NMOS, DC2
0.4
0.45
0.6
HLL Buck Switch ON Resistance
ꢀ
I
I
SW3 = +100mA PMOS, DC3
0.5
SW1, 4 = +100mA PMOS, DC1 & 4
0.6
ISW2 = +100mA PMOS, DC2
VOUT = 90%
1.1
Soft Start Time
600
100
4
µs
µs
Scale Transition Time DC2
DC2 only. Time to reach 90% target.
DC1, 2, 4 ILOAD = 120mA
Frequency
MHz
DC3
ILOAD = 120mA
2.5
RESETB on DC4
VTH Falling
Low Threshold, % of nominal DC4 output (Flag ON)
High Threshold, % of nominal DC4 output (Flag OFF)
RESETB logic low voltage; IL = 250µA
85
%
%
V
96
0.05
+1
VTH Rising
VOL
0.02
0.1
IRESETB
Flag Leakage Current, Flag OFF
-1
µA
SETDLY input on DC4
SETDLY Current Source
SETDLY Threshold Voltage
VSETDLY = 0V
0.75
1.45
1.75
µA
V
RESETB = High
1.241
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
Electrical Characteristics – Buck Regulator (DC5, DC6)
TA=25oC, AVINx = ENGLB = ENDC5 = ENDC6 = 4.3V, L = 2.2µH, COUT = 2.2µF, IOUT = 100mA, unless otherwise noted.
Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
0.86
0.97
Typ
1.3
1.0
0.12
0.2
100
0.4
0.5
2
Max
Unit
A
Switch Current Limit
FB Voltage Accuracy
Line Regulation
Load Regulation
Soft Start Time
VFB = 0.9 V
1.03
V
3.0V ≤ AVIN ≤ 5V , ILOAD = 100mA
20mA ≤ IOUT ≤ 300mA
%
%
VOUT = 90%; ILOAD = 5mA
ISW = +100mA PMOS
µs
ꢀ
DC Switch ON Resistance
I
SW = -100mA NMOS
ꢀ
Switching Frequency
FB Pin Input Current
1.6
2.4
MHz
nA
1
Electrical Characteristics – Low Dropout Regulators (LDO1 – LDO4, LDO11)
TA=25oC, AVINx = ENGLB = ENLx = 4.3V, VINLDOx = Vout+1V, COUT = 1µF, IOUT = 100µA, unless noted.
Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
1.8
200
-3
Typ
Max
Unit
V
AVIN
Supply Voltage Range
Current Limit
mA
%
Output Voltage Accuracy
3
125
100
210
LDO2, 4; IOUT = 100mA;
LDO3; IOUT = 100mA;
LDO1, 11; IOUT = 100mA;
80
38
Dropout Voltage
mV
115
0.2
2
Line Regulation
Load Regulation
VOUT + 1V ≤ VINLDO ≤ 5.5V
0.02
0.4
%/V
%
100µA ≤ IOUT ≤ 100mA
100Hz to 100kHz;
Output Noise
65
µVrms
COUT = 2.2µF
Ripple Rejection
Turn On Time
f = 1kHz, COUT = 2.2µF
55
25
dB
µs
Enable to 90% nominal VOUT
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
Electrical Characteristics – Low Noise Regulators (LNR5 – LNR10)
TA=25oC, AVINx = ENx= 4.3V, VINLDOx = Vout+1V, COUT = 2.2µF, IOUT = 100µA, unless noted.
Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
Typ
Max
Unit
AVIN
AVIN
LNR5, 6, 7
1.8
1.7
Supply Voltage Range
V
LNR8, 9 ,10
200
Current Limit
mA
%
Output Voltage Accuracy
-3
3
75
LNR5, 6, 7; IOUT = 100mA;
LNR8, 9, 10
40
Dropout Voltage
mV
N/A
0.2
Line Regulation
Load Regulation
Output Noise
VOUT + 1V ≤ VINLDOx ≤ VAVIN
0.02
0.4
20
%/V
%
100µA ≤ IOUT ≤ 100mA
2
100Hz to 100kHz; COUT = 2.2µF, CBYP = 0.1µF
f = 1kHz, COUT = 2.2µF, CBYP = 0.1µF
Enable to 90% nominal VOUT
µVrms
dB
Ripple Rejection
Turn On Time
70
100
µs
Electrical Characteristics – SIM power supply and level translator
TA=25oC, AVINx = ENGLB = ENLS = 4.3V, COUT = 1.0µF, IOUT = 100µA, unless otherwise noted.
Bold values indicate -40°C ≤ TJ ≤ 125°C.
Parameter
Condition
Min
1.62
60
Typ
Max
Unit
V
Controller Voltage Input
Current Limit (SIMPWR)
1.8
1.98
mA
2.7
1.7
3.3
2.0
3V Output , IOUT = 50mA
1.8V Output, IOUT = 50mA
3
Output Voltage Accuracy
V
1.8
SIMPWR Turn On Time
High Input Threshold
Low Input Threshold
500
µs
V
0.7*Y
RSTIN, CLKIN (Y = VLSPWR
)
)
0.2*Y
0.8*X
RSTIN, CLKIN (Y = VLSPWR
V
SIMIO (VOH
SIMIO (VOL
SIMRST, SIMCLK (VOH
SIMRST, SIMCLK (VOL
DATA (VOH
DATA (VOL
)
IOH = 20µA, DATA = VLSPWR (X = VSIMPWR
)
V
0.4
0.4
)
IOL = -1mA, DATA = 0V
V
0.9*X
0.7*Y
)
IOH = 20µA, (X = VSIMPWR
)
V
)
IOL = -200µA
V
)
IOH = 20µA, SIMIO = VSIMPWR (Y = VLSPWR
)
V
0.4
30
14
)
IOL = -200µA, SIMIO = 0V
V
DATA Pull Up Resistance
SIMIO Pull Up Resistance
SIMCLK Rise/Fall Time
Between DATA and LSPWR
Between SIMIO and SIMPWR
CRSTIN, CSMIIO = 30pF (20-80%)
CRSTIN, CSMIIO = 30pF (20-80%)
13
20
10
18
25
kꢀ
kꢀ
ns
ns
6.5
SIMRST, SIMIO Rise/Fall Time
M9999-051410-B
May 2010
10
MIC2829
Micrel Inc.
Notes:
1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5kꢀ in series with 100pF.
4. Specification for packaged product only.
5. All outputs are auto discharged with an internal NMOS when output is disabled.
6. Quiescent current is the total supply current minus any enabled LDO/LNR/LSPWR load current.
M9999-051410-B
May 2010
11
MIC2829
Micrel Inc.
Typical Characteristics
DC1 HLL Buck Efficiency
DC2 HLL Buck Efficiency
vs. Output Current
DC3 HLL Buck Efficiency
vs. Output Current
vs. Output Current
100
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
V
IN = 4.3V
V
IN = 3.6V
90
80
70
60
50
40
30
20
10
0
VIN = 5V
V
IN = 5V
V
IN = 5V
V
IN = 3.6V
VIN = 4.3V
VIN = 4.3V
VOUT_NOM = 3V
L = 1.0µH
VOUT_NOM = 1.2V
L = 2.2µH
VOUT_NOM = 1V
L = 2.2µH
C
OUT = 4.7µF
COUT = 4.7µF
COUT = 4.7µF
1
10
100
1000
1
10
100
1000
1
10
100
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
DC4 HLL Buck Efficiency
vs. Output Current
DC5 PWM Buck Efficiency
vs. Output Current
DC6 PWM Buck Efficiency
vs. Output Current
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN = 4.3V
VIN = 3.6V
VIN = 3.6V
VIN = 4.3V
VIN = 5V
VIN = 5V
VIN = 3.6V
VIN = 5V
VOUT_NOM = 1.8V
L = 2.2µH
VOUT_NOM = 3.3V
L = 2.2µH
VOUT_NOM = 2V
L = 2.2µH
VIN = 4.3V
C
OUT = 4.7µF
C
OUT = 4.7µF
C
OUT = 4.7µF
1
10
100
1000
1000
800
1
10
100
1000
1
10
100
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
DC1 Output Voltage
vs. Output Current
DC2 Output Voltage
vs. Output Current
DC3 Output Voltage
vs. Output Current
1.60
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
3.50
3.40
3.30
3.20
3.10
3.00
2.90
2.80
2.70
2.60
2.50
1.60
1.50
1.40
1.30
1.20
1.10
1.00
0.90
0.80
0.70
0.60
VSC2 = VIN
VPVIN = 5V
VPVIN = 5V
VPVIN = 5V
VOUT_NOM = 1V / 1.2V
V
OUT_NOM = 3V
VOUT_NOM = 1.2V
VSC2 = 0V
L = 1µH
L = 2.2µH
L = 2.2µH
COUT = 4.7µF
COUT = 4.7µF
COUT = 4.7µF
0
100 200 300 400 500 600 700 800
0
200
400
600
800
0
50
100
150
200
250
300
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
DC4 Output Voltage
vs. Output Current
DC5 Output Voltage
vs. Output Current
DC6 Output Voltage
vs. Output Current
2.20
2.10
2.00
1.90
1.80
1.70
1.60
1.50
1.40
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
2.10
2.08
2.06
2.04
2.02
2.00
1.98
1.96
1.94
1.92
1.90
VPVIN = 5V
VPVIN = 5V
VPVIN = 5V
V
OUT_NOM = 3.3V
V
OUT_NOM = 1.8V
VOUT_NOM = 2V
L = 2.2µH
L = 2.2µH
L = 2.2µH
C
OUT = 4.7µF
COUT = 4.7µF
C
OUT = 4.7µF
0
200
400
600
800
1000
0
200
400
600
0
200
400
600
800
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
M9999-051410-B
May 2010
12
MIC2829
Micrel Inc.
Typical Characteristics (Continued)
Typical HLL Output Voltage
vs. Input Voltage
Typical PWM Output Voltage
vs. Input Voltage
Typical PWM Output Voltage
vs. Input Voltage
1.30
1.28
1.26
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
2.010
2.008
2.010
2.008
2.006
2.004
2.002
2.000
1.998
1.996
1.994
1.992
1.990
VOUT_NOM = 2V
VOUT_NOM = 1.2V
L = 2.2µH
VOUT_NOM = 2V
L = 2.2µH
COUT = 4.7µF
IOUT = 1mA
IOUT = 800mA
L = 2.2µH
2.006
2.004
2.002
2.000
1.998
1.996
1.994
1.992
1.990
COUT = 4.7µF
C
OUT = 4.7µF
IOUT = 1mA
IOUT = 350mA
IOUT = 600mA
IOUT = 100mA
IOUT = 100mA
IOUT = 450mA
IOUT = 800mA
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LDO1 Output Voltage
vs. Input Voltage
LDO2 Output Voltage
vs. Input Voltage
LDO3 Output Voltage
vs. Input Voltage
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
2.54
IOUT = 1mA
IOUT = 100mA
2.52 IOUT = 1mA
IOUT = 1mA
2.50
2.48
2.46
2.44
2.42
IOUT = 200mA
2.40
IOUT = 100mA
IOUT = 100mA
IOUT = 200mA
IOUT = 200mA
2.38
2.36
2.34
2.32
2.30
VOUT_NOM = 2.8V
VOUT_NOM = 3.3V
COUT = 1µF
VOUT_NOM = 2.5V
COUT = 1µF
C
OUT = 1µF
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
3
3.5
4
4.5
5
5.5
3.6
4
4.4
4.8
5.2
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LNR5 Output Voltage
vs. Input Voltage
LNR6 Output Voltage
vs. Input Voltage
LDO4 Output Voltage
vs. Input Voltage
2.54
2.52
2.50
2.48
2.46
2.44
2.42
2.40
2.91
2.89
2.87
2.85
2.83
2.81
2.79
2.77
2.75
2.73
2.71
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
IOUT = 1mA
IOUT = 1mA
IOUT = 1mA
IOUT = 100mA
IOUT = 200mA
IOUT = 100mA
IOUT = 200mA
IOUT = 200mA
IOUT = 100mA
VOUT_NOM = 2.5V
COUT = 2.2µF
VOUT_NOM = 2.8V
COUT = 2.2µF
VOUT_NOM = 2.85V
OUT = 1µF
C
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
3
3.5
4
4.5
5
5.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LNR7 Output Voltage
vs. Input Voltage
LNR9/10 Output Voltage
vs. Input Voltage
LNR8 Output Voltage
vs. Input Voltage
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
1.54
1.52
1.50
1.48
1.46
1.44
1.42
1.40
IOUT = 1mA
IOUT = 1mA
IOUT = 1mA
IOUT = 100mA
IOUT = 200mA
IOUT = 200mA
IOUT = 200mA
IOUT = 100mA
IOUT = 100mA
VOUT_NOM = 1.8V
OUT = 2.2µF
VOUT_NOM = 1.5V
COUT = 2.2µF
VOUT_NOM = 1.2V
COUT = 2.2µF
C
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
M9999-051410-B
May 2010
13
MIC2829
Micrel Inc.
Typical Characteristics (Continued)
LDO11 Output Voltage
vs. Input Voltage
DC1 Output Voltage
vs. Temperature
DC2 Output Voltage
vs. Temperature
1.40
1.36
1.32
1.28
1.24
1.20
1.16
1.12
1.08
1.04
1.00
1.10
1.08
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0.92
0.90
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
VIN = 5V
IOUT = 1mA
IOUT = 100mA
IOUT = 120mA
VOUT_NOM = 1.2V
L = 2.2µH
IOUT = 120mA
COUT = 4.7µF
VIN = 5V
VOUT_NOM = 1V
IOUT = 300mA
VSC2 = 0V
L = 2.2µH
IOUT = 400mA
IOUT = 200mA
VOUT_NOM = 2.8V
IOUT = 800mA
C
OUT = 2.2µF
COUT = 4.7µF
-40 -20
0
20 40 60 80 100 120
3
3.5
4
4.5
5
5.5
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
INPUT VOLTAGE (V)
TEMPERATURE (°C)
DC3 Output Voltage
vs. Temperature
DC4 Output Voltage
vs. Temperature
DC5/6 Output Voltage
vs. Temperature
3.20
3.16
3.12
3.08
3.04
3.00
2.96
2.92
2.88
2.84
2.80
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
VIN = 5V
VIN = 5V
VOUT_NOM = 3V
L = 1µH
IOUT = 120mA
VOUT_NOM = 1.8V
L = 2.2µH
IOUT = 120mA
IOUT = 800mA
COUT = 4.7µF
C
OUT = 4.7µF
VIN = 5V
IOUT = 120mA
VOUT_NOM = 3.3V
L = 2.2µH
IOUT = 300mA
IOUT = 400mA
IOUT = 800mA
IOUT = 600mA
C
OUT = 4.7µF
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
Typical LDO Output Voltage
vs. Temperature
Typical LNR Output Voltage
vs. Temperature
SIMPWR Output Voltage
vs. Temperature
2.90
2.88
2.86
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
2.90
2.88
2.86
2.84
2.82
2.80
2.78
2.76
2.74
2.72
2.70
3.10
3.08
3.06
3.04
3.02
3.00
2.98
2.96
2.94
2.92
2.90
IOUT = 100µA
IOUT = 50mA
IOUT = 100µA
VIN = 5V
IOUT = 100mA
VOUT_NOM = 2.8V
COUT = 1µF
IOUT = 100mA
VOUT_NOM = 2.8V
COUT = 2.2µF
VOUT_NOM = 3V
VSLS = HIGH
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
ENGLB Quiescent Current
vs. Input Voltage
DC2 Quiescent Current
vs. Input Voltage
SIMPWR Output Voltage
vs. Temperature
20
18
16
14
12
10
8
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
300
250
200
150
100
ENGLB = V
IN
All other enables = 0V
IOUT = 50mA
6
VIN = 5V
Switching, No Load
DC1, DC3, DC4, LDO1,
LDO2, LDO11 = ON
4
VOUT_NOM = 1.8V
Not Switching
No Load
2
VSLS = LOW
0
3.3
3.7
4.1
4.5
4.9
5.3
-40 -20
0
20 40 60 80 100 120
3.3
3.7
4.1
4.5
4.9
5.3
INPUT VOLTAGE (V)
TEMPERATURE (°C)
INPUT VOLTAGE (V)
M9999-051410-B
May 2010
14
MIC2829
Micrel Inc.
Typical Characteristics (Continued)
DC5/6 Quiescent Current
vs. Input Voltage
Typical LDO Quiescent
Current vs. Input Voltage
Typical LNR Quiescent
Current vs. Input Voltage
60
50
40
30
20
10
0
40
30
20
10
0
1200
1100
1000
900
800
700
Not Switching
No Load
IOUT = 100µA
IOUT = 100µA
600
3.3
3.8
4.3
4.8
5.3
3.3
3.7
4.1
4.5
4.9
5.3
3.3
3.8
4.3
4.8
5.3
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
LDO1/11 Dropout
vs. Temperature
LDO3 Dropout
vs. Temperature
LNR5/6/7 Dropout
vs. Temperature
180
160
140
120
100
80
80
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
IOUT = 100mA
IOUT = 100mA
IOUT = 100mA
60
40
VOUT = 2.8V
OUT = 1µF
20
C
COUT = 1µF
20 40 60 80 100 120
COUT = 2.2µF
0
-40 -20
0
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
LDO2/4 Dropout
vs. Temperature
DC1 Current Limit
vs. Temperature
DC2 Current Limit
vs. Temperature
140
120
100
80
2200
2100
2000
1900
1800
1700
1600
1500
1400
1300
1200
1400
1300
1200
1100
1000
900
IOUT = 100mA
60
800
V
IN = 5V
OUT_NOM = 1.2V
L = 2.2µH
OUT = 4.7µF
V
IN = 5V
OUT_NOM = 1V
L = 2.2µH
COUT = 4.7µF
40
700
V
V
600
20
C
COUT = 1µF
500
0
400
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
DC3/4 Current Limit
vs. Temperature
DC5/6 Current Limit
vs. Temperature
Typical LDO Current Limit
vs. Temperature
1600
1500
1400
1300
1200
1100
1000
900
1500
1400
1300
1200
1100
1000
900
1000
900
800
700
600
500
400
300
200
100
0
VIN = 5V
800
V
IN = 5V
V
IN = 5V
VIN = 4.3V
700
L = 2.2µH
L = 2.2µH
COUT = 1µF
C
OUT = 4.7µF
600
C
OUT = 4.7µF
800
500
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
M9999-051410-B
May 2010
15
MIC2829
Micrel Inc.
Typical Characteristics (Continued)
Typical LNR Current Limit
vs. Temperature
SIMPWR Current Limit
vs. Temperature
Typical LDO Current Limit
vs. Input Voltage
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
200
180
160
140
120
100
80
VIN = 5V
60
VIN = 4.3V
V
IN = 5V
40
COUT = 2.2µF
VOUT_NOM = 1.8V
20
COUT = 1µF
0
-40 -20
0
20 40 60 80 100 120
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
-40 -20
0
20 40 60 80 100 120
TEMPERATURE (°C)
INPUT VOLTAGE (V)
TEMPERATURE (°C)
Typical LNR Current Limit
vs. Input Voltage
DC1 HLL SW Frequency
vs. Output Current
DC2 HLL SW Frequency
vs. Output Current
7.0
7.0
1000
900
800
700
600
500
400
300
200
100
0
VOUT = 1.2V
VOUT = 1.0V
VIN = 3.6V
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN = 3.6V
L = 2.2µH
L = 2.2µH
COUT = 4.7µF
COUT = 4.7µF
VSC2 = 0V
VIN = 4.3V
VIN = 4.3V
VIN = 5V
VIN = 5V
COUT = 2.2µF
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
1
10
100
1000
1
10
100
1000
INPUT VOLTAGE (V)
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
DC3 HLL SW Frequency
vs. Output Current
DC4 HLL SW Frequency
vs. Output Current
4MHz HLL SW Frequency
vs. Temperature
4.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
VIN = 3.6V
IOUT = 800mA
IOUT = 400mA
VOUT = 3V
L = 1.0µH
VOUT = 1.8V
L = 2.2µH
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0 COUT = 4.7µF
COUT = 4.7µF
VIN = 4.3V
2.0
1.0
0.0
VIN = 4.3V
IOUT = 120mA
V
IN = 5V
OUT_NOM = 1.2V
L = 2.2µH
OUT = 4.7µF
V
VIN = 5V
C
VIN = 5V
1
10
100
1000
-40 -20
0
20 40 60 80 100 120
1
10
100
1000
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
OUTPUT CURRENT (mA)
2.5MHz HLL SW Frequency
vs. Temperature
DC5/6 PWM SW Frequency
vs. Temperature
Typical LDO PSRR
-100
5.0
2.20
2.16
2.12
2.08
2.04
2.00
1.96
1.92
1.88
1.84
1.80
IOUT = 100µA
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
IOUT = 600mA
IOUT = 400mA
IOUT = 800mA
IOUT = 100mA
VIN = 5V
VIN = 5V
V
IN = 4.3V
V
OUT_NOM = 3.3V
V
OUT_NOM = 3V
IOUT = 120mA
IOUT = 800mA
VOUT_NOM = 2.5V
COUT = 1µF
L = 2.2µH
L = 1µH
COUT = 4.7µF
COUT = 4.7µF
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
10
1000
100000
10000000
TEMPERATURE (°C)
TEMPERATURE (°C)
FREQUENCY (Hz)
M9999-051410-B
May 2010
16
MIC2829
Micrel Inc.
Typical Characteristics (Continued)
Typical LDO Output Noise
Spectral Density
Typical LNR Output Noise
Spectral Density
Typical LNR PSRR
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
10
Noise (10Hz- 100kHz) = 64.9µVrms
Noise (10Hz- 100kHz) = 17.7µVrms
IOUT = 100µA
1
0.1
IOUT = 100mA
1
VIN = 5V
V
OUT = 2.5V
Load = 36ꢀ
COUT = 2.2µF
0.1
0.01
VIN = 5V
0.01
0.001
V
IN = 4.3V
VOUT = 2.5V
Load = 36ꢀ
COUT = 2.2µF
VOUT_NOM = 2.8V
COUT = 2.2µF
C
BYP = 0.1µF
10
100
1,000
10,000 100,000
10
100
1,000
10,000 100,000
10
1000
100000
10000000
FREQUENCY (Hz)
FREQUENCY (Hz)
FREQUENCY (Hz)
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MIC2829
Micrel Inc.
Functional Characteristics
M9999-051410-B
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Characteristics (Continued)
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MIC2829
Micrel Inc.
Functional Diagram
AVIN1,2,3,4
ENGLB
BYP
MIC2829
PVIN1
LDO10
LDO10
SW1
FB1
DC1
Low Noise
PGND1
LDO9
LDO9
ENL910
Low Noise
IN
V2
2
F2
W
INLDO910
B
DC2
G
N
D
2
S 6
B6
W
ENDC2
SC2
DC6
VIN6
PGND6
NDC6
PVIN3
INLDO8
3
SW
FB3
DC3
G
N
D
3
LDO8
ENL8
owNoise
LDO8
IN
V4
4
W
B4
LDO7
ENL7
LowNoise
LDO7
DC4
GND4
INLDO7
POR
Delay
RESETB
SETDLY
5
5
SW
AVIN1
FB
LDO1 LDO1
DC5
PGVIN5
ND5
LDO11
ENDC5
LDO11
INLDO23
INLDO6
LDO2
LDO6
ENL6
LowNoise
LDO2
LDO6
LDO3
LDO5
LDO3
LDO5
ENL3
ENL5
Low Noise
LDO4
ENL4
INLDO45
LDO4
LSPWR
RSTIN
CLKIN
DATA
SIMRST
SIMCLK
SIMIO
Level
Shifter
1.8V/3.0V
VSLS
ENLS
SIMPWR
AGND1,2,3,4
SUB1,2
MIC2829 Simplified Block Diagram
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MIC2829
Micrel Inc.
the layout, AGND3 should be connected to the PGND
plane near the PGND3 pin. Similarly, AGND4 should be
connected to the PGND plane near the PGND4 pin. This
allows the AGND3 and AGND4 ground voltage to be as
close to the PGND ground voltage as possible. Should
the AGND3 and AGND4 connect further from the
PGND3 and PGND4 pins, then the effects of parasitic
inductance and resistance would reduce the
performance by altering the accuracy of ground. Refer to
the layout recommendations for more details.
Functional Description
AVIN1 and AVIN2
The input supply pins (AVIN1 and AVIN2) provide bias to
the internal LDO circuitry and the input voltage to LDO1
and LDO11. The AVIN operating range is 2.7V to 5.5V
so a minimum 1µF input capacitor with a 6.3V voltage
rating placed as close to the AVIN and ground (AGND1
and AGND2) is required. Capacitance decreases as the
DC bias across the capacitor increases and should be
considered when selecting a suitable capacitor. AVIN1
and AVIN2 are internally connected. All AVINs should be
tied together and connected to the PVINs of the device.
Refer to the layout recommendations for details.
PGND1 to PGND6
The power ground pins (PGND1 to PGND6) are the
ground path for the high current ground path for DC1
through DC6. The current loop for the power ground
should be as small as possible and separate from the
analog ground (AGND3, AGND4) loop. All power
grounds (PGND1 to PGND6) should be connected on
the same plane. Refer to the layout recommendations
for more details.
AVIN3 and AVIN4
The input supply pins (AVIN3 and AVIN4) provide bias to
the internal circuitry for the switch mode regulators (DC1
through DC6) and power to SIMPWR. The AVIN
operating range is 2.7V to 5.5V, so a minimum 1µF input
capacitor with a minimum voltage rating of 6.3V placed
close to AVIN and ground (AGND3 and AGND4) is
required. AVIN3 and AVIN4 are internally connected. All
AVINs should be tied together and connected to the
PVINs of the device. Refer to the layout
recommendations for details.
INLDO
The INLDO pins (INLDO23, INLDO45, INLDO6,
INLDO7, INLDO8, and INLDO910) are the power input
for the respective LDOs. Due to line inductance, a
minimum of 1µF input capacitor with a minimum voltage
rating of 6.3V should be placed as close as possible to
the INLDO pin and ground (AGND1, AGND2). Refer to
the layout recommendations for more details.
PVIN1 to PVIN6
The power input supply pins (PVIN1 to PVIN6) provide
power to the switch mode regulators (DC1 to DC6). Due
to high switching currents, a minimum 1µF input
capacitor with a minimum voltage rating of 6.3V placed
close to PVIN and the power ground is required. The
PVIN tracks should be as wide as possible and the 1µF
capacitor should be placed from PVIN1 to PGND1 due
to the proximity of their pin location. The same should be
done with each PVIN and PGND combination. All AVINs
should be tied together and connected to the PVINs of
the device. Refer to the layout recommendations for
details.
LDO
The LDO pins (LDO1 to LDO11) are the output of the
LDO and LNR regulators. For LDO1, LDO2, LDO3,
LDO4 and LDO11, a minimum of 1µF output capacitor
with a minimum voltage rating of 6.3V placed as close to
the LDO pin and ground (AGND1 and AGND2) as
possible is required. For the LNRs (LDO5 to LDO10), a
2.2µF output capacitor with a minimum voltage rating of
6.3V placed as close as possible to the LDO pin and
ground (AGND1 and AGND2) is recommended. Refer to
the layout recommendations for more details.
AGND1 and AGND2
BYP
The ground pins (AGND1 and AGND2) are the ground
path for the biasing, the control circuitry and the power
ground for all LDOs. AGND1 and AGND2 are internally
connected. The current loop for the ground should be
kept as short as possible. Connect AGND1 and AGND2
together. Refer to the layout recommendations for more
details.
The reference bypass pin (BYP) acts as a filter for the
reference voltage of LNR5 to LNR10. A 0.1µF bypass
capacitor connected to ground (AGND1 and AGND2) is
recommended.
SUB
The SUB pin (SUB1, SUB2) is connected internally to
the guard ring ground protection. The guard ring
prevents interaction between regulators inside the die
package. Connect SUB1 and SUB2 pins to ground
(AGND1, AGND2) externally.
AGND3 and AGND4
The analog ground pins (AGND3 and AGND4) are the
ground path for the biasing and the control circuitry for
all buck regulators. This is a low current ground path and
should not be mixed with high current paths such as
PGND. To reduce the effects of parasitic interference in
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MIC2829
ENDC HIGH (>1.1V) LOW (<0.2V)
Micrel Inc.
ENGLB
ENDC2
ENDC5
ENDC6
DC2 ON
DC5 ON
DC6 ON
DC2 OFF
DC5 OFF
DC6 OFF
The global enable pin (ENGLB) must be pulled high in
order for the MIC2829 to function. When ENGLB is
pulled high, a startup sequence begins. The regulators
DC1, DC3, DC4/LDO2, LDO1/LDO11 turn on in
sequence. See Turn-ON Sequence Flow Chart in Figure
1.
Table 1. Buck Regulator Enable
ENL
ENGLB needs to be high in order for any other enables
to function. A logic high signal on the enable pin (ENL3
to ENL8, ENL910) activates the output voltage of LDO3,
LDO4 and LNR5 to LNR10 as shown in Table 2. A logic
low signal on the enable pin deactivates the output of the
respective LDO. Do not leave floating, as it would leave
the regulator in an unknown state.
ENL
HIGH (>1.1V)
LOW (<0.2V)
ENL3
LDO3 ON
LDO3 OFF
ENL4
ENL5
ENL6
ENL7
ENL8
LDO4 ON
LNR5 ON
LNR6 ON
LNR7 ON
LNR8 ON
LDO4 OFF
LNR5 OFF
LNR6 OFF
LNR7 OFF
LNR8 OFF
ENL910 LNR9, LNR10 ON LNR9, LNR10 OFF
Table 2. LDO Regulator Enable
SETDLY
If the output voltage of DC4 is greater than 90% of
nominal, the Power On Reset (POR) delay circuit begins
to source a current to the set-delay pin (SETDLY). The
SETDLY pin is used to adjust the delay time of the
RESETB flag. A capacitor may be placed from SETDLY
to ground (AGND1, AGND2) to adjust the delay time at a
rate of 1 second/µF.
RESETB
The RESETB is an open drain output and can, for
instance, be tied to the output of DC4 through a 100k
resistor. When DC4 output voltage is greater than 96%,
then the RESETB voltage will be pulled high after a
delay set by the capacitor on the SETDLY pin. A
capacitor at the SETDLY pin will delay the RESETB flag
at a rate of 1 second / µF. When the output of DC4 is
below 90%, RESETB is pulled low.
Figure 1. Turn-ON Sequence Flow Chart
ENDC
FB1 to FB4
The feedback pin (FB1 to FB4) is connected to the
output of the HyperLight LoadTM circuit to provide
feedback to the control circuitry. The FB connection
should be connected close to the output capacitor. Refer
to the layout recommendations for more details.
ENGLB needs to be high in order for any other enables
to function. A logic high signal on the enable pin
(ENDC2, ENDC5, ENDC6) activates the output voltage
of its respective buck regulator shown in Table 1. A logic
low signal on the enable pin deactivates the output of the
buck regulator. Do not leave floating, as it would leave
the regulator in an unknown state.
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MIC2829
Micrel Inc.
FB5 and FB6
VSLS
The feedback pin (FB5, FB6) allows DC5 and DC6
output voltage to be set by applying an external resistor
network. The internal reference voltage is 1V and the
recommended value of RBOTTOM is 20kΩ or below. A
feed-forward capacitor (CFF) of 120pF should be placed
parallel to RTOP to improve stability and transient
response. This does not impact the output voltage
setting. The output voltage is calculated from the
equation below.
VSLS selects the level shifted voltage for the SIM Card.
A high logic voltage on VSLS selects the level shifter to
3V. A low logic voltage on VSLS selects the level shifter
to 1.8V. Do not leave floating.
RSTIN, SIMRST
RSTIN is the digital reset input for the SIM Card and
translates to SIMRST through the digital level shifter. It is
one directional. If VSLS is low, then the input at RSTIN
will be level shifted to 1.8V at the SIMRST output. If
VSLS is high, then the input at RSTIN will be level
shifted to 3V at the SIMRST output.
R
⎛
⎜
⎞
⎟
TOP
VOUT =1V
+1
20kΩ
⎝
⎠
CLKIN, SIMCLK
CLKIN is the digital input clock for SIM card. The CLKIN
translates to SIMCLK and is one directional. If VSLS is
low, then the input at CLKIN will be level shifted to 1.8V
at the SIMCLK output. If VSLS is high, then the input at
CLKIN will be level shifted to 3V at the SIMCLK output.
V
OUT
C
FF
R
TOP
R
BOTTOM
DATA, SIMIO
DATA is the digital data for the SIM Card. The DATA
translate to SIMIO through the digital level shifter and is
bi-directional using internal pull ups. If VSLS is low, then
the level shifted output is 1.8V at the SIMIO output. If
VSLS is high, then the level shifted output is 3V at the
SIMIO output. Since DATA and SIMIO are bi-directional,
the input at SIMIO is level shifted to equal the LSPWR
voltage at the DATA output.
Figure 2. Feedback Resistor Network
SW
The switch pin (SW1 to SW6) connects directly to one
end of the inductor and provides the current path during
switching cycles. The other end of the inductor is
connected to the output of the buck regulator. Due to the
high speed switching on this pin, the switch node should
be routed away from sensitive nodes whenever possible.
G1 – G9
The G1 through G9 pins are not internally connected.
They serve as thermal relief and should be connected to
ground (AGND1, AGND2) to maximize the heat
dissipation. See layout recommendations for details.
VSC2
The voltage scaling pin (VSC2) is used to switch the
output of DC2 between two different voltage levels. A
high on the VSC2 pin will set the output voltage of DC2
to the higher voltage. A low on the VSC2 pin will set the
output voltage to the lower voltage. Do not leave floating.
LSPWR
The level shifter input supply pin (LSPWR) provides
power to the level shifter. A minimum 1µF input capacitor
with a minimum voltage rating of 6.3V placed close to
LSPWR and ground (AGND1, AGND2) is required.
Refer to the layout recommendations for details.
SIMPWR
SIM power (SIMPWR) provides power to the SIM Card.
A minimum 1µF input capacitor with a minimum voltage
rating of 6.3V to ground (AGND1, AGND2) is required.
Refer to the layout recommendations for details.
M9999-051410-B
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MIC2829
Ideal Ground
Micrel Inc.
Pin Name Capacitance
Application Information
PVIN2
PVIN3
PVIN4
PVIN5
PVIN6
1 µF
1 µF
1 µF
1 µF
1 µF
PGND2
PGND3
PGND4
PGND5
PGND6
The MIC2829 is a Power Management Integrated Circuit
(PMIC) designed for 3G/4G (HEDGE/LTE or WiMAX)
modules. It incorporates six buck converters, eleven
LDOs and a SIM card level translator in a 5.5mm x
5.5mm package designed to support 3G/4G
(HEDGE/LTE or WiMAX) wireless modems. A typical
power source for the MIC2829 can be from a USB host
or a single cell lithium ion battery.
Table 3. Recommended Input Capacitance
A case size 0402, 1µF ceramic capacitor (Samsung
CL05A105KP5NNN) is recommended based upon
performance, size and cost. A X5R or X7R temperature
rating is recommended for the input capacitor. Y5V
temperature rating capacitors, aside from losing most of
their capacitance over temperature, can also become
resistive at high frequencies. This reduces their ability to
filter out high frequency noise.
The MIC2829 has six integrated step-down regulators.
Four of the six integrated step-down converters
incorporate HyperLight LoadTM (HLL) technology. The
DC1, DC2, and DC4 operate at 4MHz switching
frequency range and can support 1A, 300mA and
600mA respectively. DC3 operates at 2.5MHz and can
support up to 600mA.
DC5 and DC6 operate at a 2MHz switching frequency,
can support 100% duty cycle operation and can maintain
800mA on each output. They both have adjustable
output voltages using external resistors.
Output Capacitor
The buck regulators (DC1 to DC6) are designed for use
with a 4.7µF or greater ceramic output capacitor. A case
size 0402, 4.7µF ceramic capacitor (Samsung,
CL05A475MQ5NRN) is recommended based upon
performance, size and cost. A case size 0402, 1µF
ceramic capacitor (Samsung, CL05A105KP5NNN) is
recommended for each LDO (LDO1 to LDO4, LDO11,
and SIMPWR) output. Each LNR (LNR5 to LNR10) is
designed for low noise operation; therefore, a case size
The MIC2829 has eleven low dropout regulators (LDOs).
Five general purpose LDOs (LDO1 to LDO4, LDO11)
have low dropout, output accuracy of ±3% and drawing
40µA of ground current. The other six are high
performance LNRs (LNR5-LNR10) with a PSRR of over
70dB at 1kHz and 20µVrms Output Noise. The LNRs
require just 20µA to operate.
0402,
2.2µF
ceramic
capacitor
(Samsung,
The MIC2829 also has three level shifters and a 50mA
power supply for digital SIM Card signal translations.
CL05A225MP5NSN) is recommended. Table 4 below
indicates the recommended capacitance needed for
each output and their ideal grounding points.
Input Capacitor
Output Capacitance
Ideal Ground
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
PGND1
The MIC2829 has many input pins that are externally
connected. A 1µF ceramic capacitor or greater should
be placed close to the power input pin and ground. The
following chart indicates the minimum capacitance
needed for each input pin and their ideal grounding
points.
LDO1
LDO2
LDO3
LDO4
LDO5
LDO6
LDO7
LDO8
LDO9
LDO10
LDO11
SIMPWR
DC1
1 µF
1 µF
1 µF
1 µF
2.2 µF
2.2 µF
2.2 µF
2.2 µF
2.2 µF
2.2 µF
1 µF
Pin Name Capacitance
Ideal Ground
AGND1
AVIN1
AVIN2
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
1 µF
AGND2
AVIN3
AGND3
AVIN4
AGND4
INLDO23
INLDO45
INLDO6
INLDO7
INLDO8
INLDO910
LSPWR
PVIN1
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
AGND1 or AGND2
PGND1
1 µF
4.7 µF
4.7 µF
4.7 µF
4.7 µF
4.7 µF
4.7 µF
DC2
PGND2
DC3
PGND3
DC4
PGND4
DC5
PGND5
DC6
PGND6
Table 4. Recommended Output Capacitance
M9999-051410-B
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MIC2829
Micrel Inc.
Although all grounds eventually connect externally, it is
important to place the capacitors close to their ideal
ground for the load to minimize parasitic inductance and
resistance. This is especially important for a PMIC with
multiple regulators. Increasing the output capacitance
will lower output ripple and improve load transient
response, but could increase solution size or cost. Both
the X7R or X5R temperature rated capacitors are
recommended. The Y5V and Z5U temperature rated
capacitors are not recommended due to their wide
variation in capacitance over temperature and increased
resistance at high frequencies.
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
VOUT × IOUT
VIN × IIN
Efficiency % =
×100
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply, reducing
the need for heat sinks and thermal design
considerations and it reduces consumption of current for
battery powered applications. Reduced current draw
from a battery increases the devices operating time
which is critical in hand held devices.
Inductor Selection
When selecting an inductor, it is important to consider
the following factors (not necessarily in the order of
importance):
There are two types of losses in switching converters;
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high side switch during the on cycle. Power loss is equal
to the high side MOSFET RDSON multiplied by the Switch
Current squared. During the off cycle, the low side N-
channel MOSFET conducts, also dissipating power.
Device operating current also reduces efficiency. The
product of the quiescent (operating) current and the
supply voltage represents another DC loss. The current
required for driving the gates on and off at the constant
switching frequency and other internal switching
transitions make up the switching losses.
•
•
•
•
Inductance
Rated current value
Size requirements
DC resistance (DCR)
The MIC2829 was designed for use with an inductance
range from 1µH to 2.2µH. Typically, a 2.2µH inductor is
recommended for a balance of transient response,
efficiency and output ripple. For faster transient
response, a 1µH inductor will yield the best result. For
lower output ripple, a 2.2µH inductor is recommended.
Maximum current ratings of the inductor are generally
given in two methods; permissible DC current and
saturation current. Permissible DC current can be rated
either for a 40°C temperature rise or a 10% to 20% loss
in inductance. Ensure the inductor selected can handle
the maximum operating current. When saturation current
is specified, make sure that there is margin so that the
peak current does not cause the inductor to saturate.
Peak current can be calculated as follows:
DC4 Buck Efficiency
vs. Output Current
100
V
IN = 4.3V
90
80
70
60
50
40
30
20
10
0
VIN = 5V
V
IN = 3.6V
VOUT_NOM = 1.8V
L = 2.2µH
COUT = 4.7µF
⎡
⎤
⎥
⎦
1 −VOUT /VIN
2 ×f × L
⎛
⎜
⎞
⎟
IPEAK = I
⎢ OUT
+VOUT
1
10
100
1000
⎝
⎠
⎣
OUTPUT CURRENT (mA)
As shown by the calculation above, the peak inductor
current is inversely proportional to the switching
frequency (f) and the inductance (L); the lower the
switching frequency or the inductance the higher the
peak current. As input voltage increases, the peak
current also increases.
Figure 3. HLL Efficiency vs. Output Current
Figure 3 shows an efficiency curve. From an output
current of 1mA to 100mA, efficiency losses are
dominated by quiescent current losses, gate drive and
transition losses. By lowering the switching frequency,
the HyperLight Load™ buck regulator (DC1 to DC4) is
able to maintain high efficiency at low output currents.
The size of the inductor depends on the requirements of
the application. Refer to the Typical Application Circuit
and Bill of Materials for details.
DC resistance (DCR) is also important. While DCR is
inversely proportional to size, DCR can represent a
significant efficiency loss. Refer to the Efficiency
Considerations.
Over 100mA, efficiency loss is dominated by MOSFET
RDSON and inductor losses. Higher input supply voltages
will increase the Gate-to-Source overdrive on the
internal MOSFETs, thereby reducing the internal RDSON
.
This improves efficiency by reducing conduction losses
in the device. All but the inductor losses are inherent to
the device. For higher current levels, inductor selection
M9999-051410-B
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MIC2829
Micrel Inc.
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant. The DCR losses
can be calculated as follows:
If each regulator on the MIC2829 is turned on at its
maximum load capability, the power dissipation into the
device will cause excessive temperature rise. In order to
avoid excessive temperature rise and unexpected
thermal shutdown the total power dissipation should be
considered.
PL_LOSS ≈ IOUT2 × DCR
From that, the loss in efficiency due to inductor
resistance can be calculated as follows:
LDO Power Dissipation
⎡
⎤
⎥
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
The power dissipation of a LDO can be calculated with
the input voltage, the output voltage and the output
current, as shown in the following equation.
VOUT × IOUT
VOUT × IOUT + P
Efficiency Loss ≈ 1−
×100
⎢
⎢
⎣
L _ LOSS
⎥
⎦
PD_LDO ≈ (VIN – VOUT) IOUT + VIN IGND
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
Since the ground current (IGND) is relatively low, it can be
ignored for this calculation. For example, if the input
voltage is 3.3V, the output voltage is 2.8V and the output
current of the LDO is 200mA, the power dissipation of the
LDO can be calculated as follow:
Partitioning for Optimal System Efficiency
PD_LDO ≈ (3.3V – 2.8V) × 200mA
Many of the LDOs can be post-regulated from the DC
regulator output to increase system efficiency. For
example, DC4 output can be used to power low output
voltage LNRs in order to reduce power loss during
voltage conversion.
PD_LDO ≈ 0.1W
Buck Regulator Power Dissipation
Neglecting some minor losses, the power dissipation in a
MIC2829 buck regulator (DC1 to DC6) is approximately
the switcher’s input power minus the switcher’s output
power and minus the power loss in the inductor.
Thermal Considerations
Whenever there is power dissipation, there will be
thermal considerations. In order to account for the
temperature rise in a PMIC with multiple regulators, the
power dissipation in each regulator must be accounted
for. The current rating of each regulator is shown below:
PD_SWITCHER ≈ PIN x IIN – POUT x IOUT – PL_LOSS
Total Power Dissipation
The total power dissipation in the MIC2829 package is
equal to the sum of the power loss of each regulator.
Output
DC1
Maximum Load (mA)
PD_TOTAL ≈ SUM (PD_LDOS + PD_SWITCHERS
)
1000
300
600
600
800
800
200
200
200
200
200
200
200
200
200
200
200
50
The maximum power dissipation of the package can be
calculated by the following equation.
DC2
DC3
DC4
T
−TA
⎛
⎞
J( max )
⎜
⎜
⎟
⎟
PD( max )
≈
DC5
θJA
⎝
⎠
DC6
TJ(MAX) is the maximum junction temperature (125°C), TA
is the ambient temperature and θJA is the junction-to-
ambient thermal resistance of the package (38.7°C/W).
LDO1
LDO2
LDO3
LDO4
LDO5
LDO6
LDO7
LDO8
LDO9
LDO10
LDO11
SIMPWR
The following table shows the
maximum power
dissipation versus the ambient temperature.
Table 5. Output Current Rating
M9999-051410-B
May 2010
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MIC2829
Micrel Inc.
switching frequency versus the output current. Since the
inductance range of MIC2829 is from 1µH to 2.2µH, the
device may then be tailored to enter HyperLight Load™
mode or PWM mode at a specific load current by
selecting the appropriate inductance. For example, in
Figure 4, when the inductance is 2.2µH the HLL
regulator will transition into PWM mode at a load of
approximately 30mA. Under the same condition, if 1µH
inductance is used, the MIC2829 will transition into PWM
mode at approximately 100mA.
PD(MAX) (W) TA (°C)
4.26
3.75
3.23
2.71
2.20
1.68
1.16
0.65
0.13
-40
-20
0
20
40
60
80
100
120
DC4 Switching Frequency
vs. Output Current
7.0
VIN = 5V
6.0
Table 6. Maximum Power Dissipation
L = 2.2µH
VOUT = 1.8V
COUT = 4.7µF
5.0
4.0
3.0
2.0
1.0
0.0
It is good practice to not exceed the maximum power
dissipation of the device in order to avoid excessive
temperature rise or unexpected thermal shutdown.
HyperLight Load™ Mode
L = 1µH
The HyperLight Load™ (HLL) buck regulators on the
MIC2829 use a proprietary control loop (patented by
Micrel). It has two modes of operation (HLL mode and
PWM mode).
1
10
100
1000
OUTPUT CURRENT (mA)
Figure 4. Switching Frequency with Various Inductance
The transition from HLL mode to PWM mode is
determined by the inductor ripple current. If the inductor
ripple current reaches below zero it is considered to be
in discontinuous mode (DCM). The HLL control loop will
control the switching in DCM using pulse frequency
modulation (PFM). As the load pulls the output voltage
below the monitored threshold, the HLL control loop
In CCM, the HLL regulator works in pulse width
modulation (PWM) by controlling the PMOS transistor
off-time. To regulate the output voltage, the PMOS
transistor off-time is controlled. As the output voltage
decreases, the PMOS transistor off-time is decreased.
As the output voltage increases, the off-time is
increased. This method of controlling the off-time
achieves the same goal as controlling the on-time as in
other PWM regulators by increasing or decreasing the
duty cycle of the PMOS transistor. In CCM, the
synchronous switching between the PMOS and the
NMOS is modulated at 4MHz for DC1, DC2 and DC4.
Due to the higher output voltage of DC3 (3V), the
switching frequency in CCM is at 2.5MHz. The HLL
regulators may reach the minimum-off-time limit at lower
input voltage and higher load currents. In order to
regulate at such high duty cycles, the HLL regulator
transitions into the on-time control scheme. During the
on-time control scheme, the off-time is set constant at
around (65ns), and the on-time is increased to deliver
more energy. By doing so, the duty cycle is increased,
and the output voltage maintains regulation even at
lower input voltages and extreme load situations. As a
result of increasing the on-time and fixing the off-time,
the switching frequency is lowered. In CCM, the
switching frequency is relatively constant, but at higher
output voltage and output current levels, the control may
transition into on-time control to regulate the output and
thus, lower the switching frequency.
turns on the topside PMOS transistor for
a
predetermined time until the output voltage rises above
the monitored threshold. Once the upper threshold is
reached, the topside PMOS is switched off and the
voltage will then be slowly pulled down by the load. As
the load increases, the switching frequency increases.
By varying the switching frequency, the regulator only
switches when needed which improves efficiency by
reducing switching losses.
As the load increases and the inductor ripple current
rises above zero, the HLL regulator switches into
continuous conduction mode (CCM). The equation to
calculate the load when the HLL regulator goes into
continuous conduction mode may be approximated by
the following formula:
⎛(VIN −VOUT )× D ⎞
⎜
⎜
⎟
⎟
ILOAD
>
2L × f
⎝
⎠
As shown in the equation, the load at which HLL
regulators transitions from HyperLight Load™ mode to
PWM mode is a function of the input voltage (VIN), the
output voltage (VOUT), the duty cycle (D), the inductance
(L) and the switching frequency (f). Note that the duty
cycle is approximately VOUT divided by VIN for buck
converters. The following graph shows the HLL regulator
M9999-051410-B
May 2010
36
MIC2829
Micrel Inc.
Typical Application Circuit
VIN
AVIN1
AGND1
AVIN2
C1
BYP
1µF
C7
0.1µF
LDO10
LDO9
C18
1µF
AGND2
AVIN3
AGND3
AVIN4
C10
2.2µF
C8
2.2µF
ENL910
C23
1µF
INLDO910
C9
1µF
C28
1µF
AGND4
PVIN6
SW6
ENGLB
C32
1µF
L6
2.2µH
DC6
PVIN1
SW1
FB6
PGND6
ENDC6
C40
120pF
R10
20k
C20
1µF
L1
2.2µH
DC1
C31
4.7µF
R16
20k
FB1
C19
4.7µF
PGND1
PVIN2
SW2
C21
1µF
L2
2.2µH
DC2
INLDO8
ENL8
FB2
C14
1µF
C22
4.7µF
PGND2
ENDC2
VSC2
LDO8
C13
2.2µF
PVIN3
SW3
INLDO7
ENL7
L3
1µH
C25
1µF
C12
1µF
MIC2829
DC3
FB3
LDO7
C24
4.7µF
C11
2.2µF
PGND3
PVIN4
SW4
PVIN5
SW5
FB5
C26
1µF
L4
C29
1µF
L5
DC4
2.2µH
2.2µH
DC5
FB4
R7
C39
120pF
R23
10k
46.4k
C27
4.7µF
PGND4
C30
PGND5
ENDC5
4.7µF
R8
20k
RESETB
SETDLY
C35
1µF
LDO1
INLDO6
ENL6
C34
1µF
C2
1µF
LDO11
INLDO23
LDO2
C33
1µF
LDO6
C3
C16
1µF
2.2µF
C17
1µF
INLDO45
ENL5
LDO3
ENL3
C5
1µF
C15
1µF
LDO5
C6
LDO4
ENL4
2.2µF
C4
1µF
SIMRST
SIMCLK
SIMIO
LSPWR
RSTIN
CLKIN
DATA
VSLS
C37
1µF
SIMPWR
C36
1µF
SUB1
SUB2
ENLS
M9999-051410-B
May 2010
37
MIC2829
Micrel Inc.
Bill of Material
Item
Part Number
Manufacturer
Samsung(1)
Description
Qty.
C1, C2, C4, C9,
CL05A105KP5NNN
1.0µF Ceramic Capacitor, 10V, X5R, Size 0402
22
C14 – C18, C20,
C21, C23, C25, C26,
C28, C29, C32 – C37
C3, C5, C6, C8,
C10 – C13
CL05A225MP5NSN
CL05A475MQ5NRN
Samsung
Samsung
2.2µF Ceramic Capacitor, 10V, X5R, Size 0402
8
C19, C22, C24, C27,
C30, C31
4.7µF Ceramic Capacitor, 6.3V, X5R, Size 0402
100nF Ceramic Capacitor, 16V, X7R, Size 0402
6
1
C7
CL05B104K05NNNC
CL05C121JB5NNNC
CIG21L2R2MNE
Samsung
Samsung
Samsung
C39, C40
L1, L2, L4, L5, L6
120pF, Ceramic Capacitor, 50V, C0G, Size 0402
2
5
2.2µH 950mA, 160mꢀ, L2.0mm x W1.25mm x
H1.0mm
L3
CIG21L1R0MNE
Samsung
1.0µH 1.15A 110mꢀ, L2.0mm x W1.25mm x
1
H1.0mm
R7, R10
R8, R16
R23
CRCW040246K4FKED
CRCW040220KFKED
CRCW040210KFKED
MIC2829-xxYAL
or
Vishay(2)
Vishay
Vishay
46.4 kꢀ, 1%, 0402
20 kꢀ, 1%, 0402
10kꢀ, 1%, 0402
1
3
1
U1
Micrel, Inc.(3)
3G/4G HEDGE/LTE PMIC
1
MIC2829-xxYAB
Notes:
1. Samsung: www.sem.samsung.com.
2. Vishay: www.vishay.com.
3. Micrel, Inc: www.micrel.com.
M9999-051410-B
May 2010
38
MIC2829
Micrel Inc.
PCB Layout Recommendations
FBGA Top (Layer 1)
M9999-051410-B
May 2010
39
MIC2829
Micrel Inc.
LGA Top (Layer 1)
M9999-051410-B
May 2010
40
MIC2829
Micrel Inc.
FBGA/LGA LDO GND (Layer 2)
M9999-051410-B
May 2010
41
MIC2829
Micrel Inc.
FBGA/LGA Power and Signal (Layer 3)
M9999-051410-B
May 2010
42
MIC2829
Micrel Inc.
FBGA/LGA DC Regulator PGND (Layer 4)
M9999-051410-B
May 2010
43
MIC2829
Micrel Inc.
FBGA/LGA DC Regulator AGND (Layer 5)
M9999-051410-B
May 2010
44
MIC2829
Micrel Inc.
FBGA/LGA Signal (Layer 6)
M9999-051410-B
May 2010
45
MIC2829
Micrel Inc.
FBGA/LGA LDO GND (Layer 7)
M9999-051410-B
May 2010
46
MIC2829
Micrel Inc.
FBGA/LGA Bottom (Layer 8)
M9999-051410-B
May 2010
47
MIC2829
Micrel Inc.
Package Information (LGA)
76-pin 5.5mm x 5.5mm LGA Package (AL)
M9999-051410-B
May 2010
48
MIC2829
Micrel Inc.
Package Information (FBGA)
85-pin 5.5mm x 5.5mm FBGA Package (AB)
M9999-051410-B
May 2010
49
MIC2829
Micrel Inc.
Recommended Land Pattern (LGA)
76-pin 5.5mm x 5.5mm LGA Land Pattern
M9999-051410-B
May 2010
50
MIC2829
Micrel Inc.
Recommended Land Pattern (FBGA)
85-pin 5.5mm x 5.5mm FBGA Land Pattern
M9999-051410-B
May 2010
51
MIC2829
Micrel Inc.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant
into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A
Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully
indemnify Micrel for any damages resulting from such use or sale.
© 2010 Micrel, Incorporated.
M9999-051410-B
May 2010
52
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