SY89542UMI [MICREL]

2.5V, 3.2Gbps DUAL, DIFFERENTIAL 2:1 LVDS MULTIPLEXER WITH INTERNAL TERMINATION; 2.5V , 3.2Gbps的双差分2 : 1 LVDS与内部终端复用器
SY89542UMI
型号: SY89542UMI
厂家: MICREL SEMICONDUCTOR    MICREL SEMICONDUCTOR
描述:

2.5V, 3.2Gbps DUAL, DIFFERENTIAL 2:1 LVDS MULTIPLEXER WITH INTERNAL TERMINATION
2.5V , 3.2Gbps的双差分2 : 1 LVDS与内部终端复用器

解复用器 逻辑集成电路
文件: 总10页 (文件大小:340K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2.5V, 3.2Gbps DUAL, DIFFERENTIAL  
2:1 LVDS MULTIPLEXER WITH  
INTERNAL TERMINATION  
®
Precision Edge  
SY89542U  
FEATURES  
Dual 2:1 multiplexer  
®
Precision Edge  
Guaranteed AC performance over temp and voltage:  
• DC-to > 3.2Gbps data rate throughput  
DESCRIPTION  
• < 600ps In-to-Out t  
pd  
• < 150ps t /t  
r f  
The SY89542U includes two precision, high-speed 2:1  
differential Muxes with LVDS (350mV) compatible outputs  
with a guaranteed data rate throughput of 3.2Gbps over  
temperature and voltage.  
Ultra-low jitter design:  
• < 1ps  
random jitter  
RMS  
• < 10ps deterministic jitter  
PP  
• < 10ps total jitter (clock)  
PP  
The SY89542U differential inputs include a unique, 3-pin  
internal termination that allows access to the termination  
• < 0.7ps  
crosstalk-induced jitter  
RMS  
Unique input isolation design minimizes crosstalk  
Internal input termination  
network through a V pin. This feature allows the device to  
T
easily interface to different logic standards, both AC- and  
DC-coupled without external resistor-bias and termination  
networks. The result is a clean, stub-free, low jitter interface  
solution.  
Unique input termination and V pin accepts  
T
DC-Coupled and AC-coupled inputs (LVDS, LVPECL,  
CML)  
The SY89542U operates from a single 2.5V supply, and  
is guaranteed over the full industrial temperature range  
(–40°C to +85°C). For applications that require a 3.3V supply,  
consider the SY89543L. The SY89542U is part of Micrel’s  
350mV LVDS output swing  
CMOS/TTL compatible MUX select  
Power supply 2.5V ±5%  
®
–40°C to +85°C temperature range  
Precision Edge product family.  
®
Available in 32-pin (5mm x 5mm) MLF package  
All support documentation can be found on Micrel’s web  
site at www.micrel.com.  
APPLICATIONS  
Redundant clock/data switchover  
SONET/SDH multi-channel select applications  
Fibre Channel applications  
GigE applications  
FUNCTIONAL BLOCK DIAGRAM  
INA0  
INB0  
50  
50Ω  
VTA0  
VTB0  
50Ω  
50Ω  
2:1 MUX  
2:1 MUX  
/INA0  
/INB0  
0
0
LVDS  
LVDS  
QA  
/QA  
QB  
MUX A  
MUX B  
/QB  
1
1
S
S
INA1  
VTA1  
INB1  
VTB1  
50Ω  
50Ω  
50Ω  
50Ω  
/INA1  
/INB1  
SELA (CMOS/TTL)  
SELB (CMOS/TTL)  
Precision Edge is a registered trademark of Micrel, Inc.  
MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.  
Rev.: D  
Amendment: /0  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
1
Issue Date: August 2007  
Precision Edge®  
SY89542U  
Micrel, Inc.  
PACKAGE/ORDERING INFORMATION  
Ordering Information(1)  
Package Operating  
Package  
Marking  
Lead  
Finish  
32 31 30 29 28 27 26 25  
Part Number  
Type  
Range  
1
24  
23  
VCC  
VCC  
/INA0  
VTA0  
INA0  
VCC  
SELA  
GND  
VCC  
SY89542UMI  
MLF-32  
MLF-32  
MLF-32  
Industrial  
Industrial  
Industrial  
SY89542U  
SY89542U  
Sn-Pb  
Sn-Pb  
2
3
4
5
6
7
INB1  
VTB 1  
/INB1  
VCC  
SELB  
GND  
VCC  
22  
21  
20  
19  
18  
SY89542UMITR(2)  
SY89542UMG(3)  
SY89542U with  
Pb-Free bar-line indicator  
Pb-Free  
NiPdAu  
SY89542UMGTR(2,3) MLF-32  
Industrial  
SY89542U with  
Pb-Free bar-line indicator  
Pb-Free  
NiPdAu  
8
17  
9
10 11 12 13 14 15 16  
Notes:  
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.  
2. Tape and Reel.  
®
32-Pin MLF  
3. Recommended for new designs.  
PIN DESCRIPTION  
Pin Number  
Pin Name  
Pin Function  
4, 2, 32, 30,  
27, 25, 23, 21  
INA0, /INA0,  
INA1, /INA1,  
INB0, /INB0,  
INB1, /INB1  
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs  
accept AC- or DC-coupled signals as small as 100mV. Each pin of a pair internally  
terminates to a VT pin through 50. Note that these inputs will default to an indeterminate  
state if left open. Unused differential input pairs can be terminated by connecting one input  
to VCC and the complementary input to GND through a 1kresistor. The VT pin is to be  
left open in this configuration. Please refer to the “Input Interface Applications” section for  
more details.  
3, 31, 26, 22  
6, 19  
VTA0 , VTA1,  
VTB0, VTB1  
Input Termination Center-Tap: Each side of the differential input pair, terminates to a VT  
pin. The VTA0, VTA1, VTB0, VTB1 pins provide a center-tap to a termination network for  
maximum interface flexibility. See “Input Interface Applications” section for more details.  
SELA, SELB  
VCC  
These single-ended TTL/CMOS-compatible inputs select the inputs to the multiplexers.  
Note that these inputs are internally connected to a 25kpull-up resistor and will default  
to logic HIGH state if left open. Input switching threshold is VCC/2.  
1, 5, 8, 17, 20,  
24, 28, 29  
Positive Power Supply: Bypass with 0.1µF||0.01µF low ESR capacitors. The 0.01µF  
capacitor should be as close to VCC pin as possible.  
10, 11, 14, 15  
QA, /QA,  
QB, /QB  
Differential Outputs: This differential LVDS output pair provides a copy of the selected  
input. It is a logic function of the INA0, INA1, INB0, INB1 and SELA and SELB inputs.  
Please refer to the “Truth Table” for details. Unused output pairs must be terminated with  
100across the differential pair.  
7, 9, 12, 13, 16, 18  
GND,  
Ground: Ground pin and exposed pad must be connected to the same ground plane.  
Exposed pad  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
2
®
Precision Edge  
SY89542U  
Micrel, Inc.  
Absolute Maximum Ratings(1)  
Operating Ratings(2)  
Supply Voltage (V ) ................................. –0.5V to +4.0V  
Supply Voltage (V ) ............................. 2.375V to 2.625V  
CC  
CC  
Input Voltage (V ) ........................................ –0.5V to V  
Ambient Temperature (T ) ........................ –40°C to +85°C  
IN  
CC  
A
(3)  
(4)  
Termination Current  
Package Thermal Resistance  
®
MLF (θ )  
JA  
Source or sink current on V ..................................... ±100mA  
T
Input Current  
Still-Air ................................................................ 35°C/W  
Source or sink current on IN, /IN .......................... ±50mA  
500lfpm .............................................................. 28°C/W  
®
Lead Temperature (soldering, 20 sec.) ................... +260°C  
MLF (ψ )  
JB  
Storage Temperature (T ) ....................... –65°C to +150°C  
Junction-to-Board ................................................20°C/W  
S
(5)  
DC ELECTRICAL CHARACTERISTICS  
TA = –40°C to +85°C; Unless otherwise stated.  
Symbol  
VCC  
Parameter  
Condition  
Min  
Typ  
2.5  
70  
Max  
2.625  
95  
Units  
V
Power Supply  
2.375  
(6)  
ICC  
Power Supply Current  
No Load, Max. VCC  
mA  
RDIFF_IN  
Differential Input Resistance  
(IN-to-/IN)  
80  
40  
100  
120  
RIN  
Input Resistance  
50  
60  
(IN-to-VT, /IN-to-VT)  
VIH  
Input High Voltage (IN, /IN)  
Input Low Voltage (IN, /IN)  
Input Voltage Swing (IN, /IN)  
1.2  
0
VCC  
VIH–0.1  
VCC  
V
V
V
V
VIL  
VIN  
Notes 7  
Notes 7  
0.1  
0.2  
VDIFF_IN  
Differential Input Voltage Swing  
|IN - /IN|  
IN-to-VT  
Voltage from Input to VT  
1.8  
V
Notes:  
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not  
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Ratings” conditions for  
extended periods may affect device reliability.  
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.  
3. Due to the limited drive capability use for input of the same package only.  
4. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. Ψ uses 4-layer  
JB  
θ
in still-air unless otherwise stated.  
JA  
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.  
6. Includes current through internal 50pull-ups.  
7. See “Single-Ended and Differential Swings” section for V and V  
definition.  
IN  
DIFF_IN  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
3
Precision Edge®  
SY89542U  
Micrel, Inc.  
(9)  
LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS  
VCC = 2.5V ±5%; TA = –40°C to +85°C; RL = 100across Q and /Q, unless otherwise stated.  
Symbol  
VOH  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
V
Output HIGH Voltage (Q, /Q)  
Output LOW Voltage (Q, /Q)  
Output Voltage Swing (Q, /Q)  
See Figure 5a  
See Figure 5a  
See Figures 1a, 5a  
See Figure 1b  
1.475  
VOL  
0.925  
250  
V
VOUT  
350  
700  
mV  
mV  
VDIFF-OUT  
Differential Output Voltage Swing  
|Q - /Q|  
500  
VOCM  
Output Common Mode Voltage  
(Q, /Q)  
See Figure 5b  
See Figure 5b  
1.125  
–50  
1.275  
+50  
V
VOCM  
Change in Common Mode Voltage  
(Q, /Q)  
mV  
(9)  
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS  
VCC = 2.5V ±5%; TA = –40°C to +85°C; unless otherwise stated.  
Symbol  
VIH  
Parameter  
Condition  
Min  
Typ  
Max  
VCC  
0.8  
Units  
V
Input HIGH Voltage  
Input LOW Voltage  
Input HIGH Current  
Input LOW Current  
2.0  
VIL  
V
IIH  
40  
µA  
µA  
IIL  
–300  
Note:  
9. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
4
®
Precision Edge  
SY89542U  
Micrel, Inc.  
(10)  
AC ELECTRICAL CHARACTERISTICS  
VCC = 2.5V ±5%; TA = –40°C to +85°C; RL = 100across Q and /Q, unless otherwise stated.  
Symbol  
Parameter  
Condition  
Min  
Typ  
Max  
Units  
Gbps  
GHz  
ps  
fMAX  
Maximum Operating Frequency  
NRZ Data  
Clock  
3.2  
VOUT > 200mV  
IN-to-Q  
4
tpd  
Differential Propagation Delay  
250  
200  
350  
350  
450  
600  
20  
SEL-to-Q  
Note 11  
ps  
tSKEW  
Input-to-Input Skew  
Bank-to-Bank Skew  
Part-to-Part Skew  
ps  
Note 12  
25  
ps  
Note 13  
200  
1
ps  
tJITTER  
Data  
Random Jitter (RJ) Note 14  
Deterministic Jitter (DJ) Note 15  
psRMS  
psPP  
psPP  
psRMS  
psRMS  
ps  
10  
Clock  
Total Jitter (TJ ) Note 16  
Cycle-to-Cycle Jitter Note 17  
Crosstalk-Induced Jitter Note 18  
10  
1
0.7  
150  
tr, tf  
Output Rise / Fall Time  
(20% to 80%)  
At full output swing  
35  
80  
Notes:  
10. Measured with 100mV input swing. See “Timing Diagrams ” section for definition of parameters. High frequency AC-parameters are guaranteed by  
design and characterization.  
11. Input-to-input skew is the difference in time from an input-to-output in comparison to any other input-to-output. In addition, the input-to-input skew  
does not include the output skew.  
12. Bank-to-bank skew is the difference in time from input to the output between banks.  
13. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the  
respective inputs. Total skew is calculated as the RMS (Root Mean Square) of the input skew and output skew.  
14. Random jitter is measured with a K28.7 comma detect character pattern, measured at 1.25Gbps and 3.2Gbps.  
23  
15. Deterministic jitter is measured at 1.25Gbps and 3.2Gbps, with both K28.5 and 2 –1 PRBS pattern.  
12  
16. Total jitter definition: with an ideal clock input of frequency f  
, no more than one output edge in 10 output edges will deviate by more than the  
MAX  
specified peak-to-peak jitter value.  
17. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, T -T where T is the time between rising edges of the output signal.  
n
n-1  
18. Crosstalk is measured at the output while applying two similar frequencies to adjacent inputs that are asynchronous with respect to each other at the  
inputs.  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
5
Precision Edge®  
SY89542U  
Micrel, Inc.  
SINGLE-ENDED AND DIFFERENTIAL SWINGS  
VDIFF_IN  
,
VIN,  
VOUT  
VDIFF_OUT 700mV (Typ.)  
350mV (Typ.)  
Figure 1a. Single-Ended Voltage Swing  
Figure 1b. Differential Voltage Swing  
TIMING DIAGRAM  
IN  
/IN  
tpd  
Q
/Q  
SEL  
SEL-to-Q  
tpd  
Q
/Q  
Figure 2. Timing Diagram  
TRUTH TABLE  
IN0  
0
IN1  
X
SEL  
Q
0
1
0
1
/Q  
1
0
0
1
1
1
X
0
X
0
1
X
1
0
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
6
®
Precision Edge  
SY89542U  
Micrel, Inc.  
FUNCTIONAL CHARACTERISTICS  
V
= 2.5V, T = 25°C.  
CC  
A
200MHz Output  
1.6GHz Output  
Q
Q
/Q  
/Q  
TIME (600ps/div.)  
2.5GHz Output  
TIME (80ps/div.)  
3.2GHz Output  
Q
Q
/Q  
/Q  
TIME (50ps/div.)  
TIME (40ps/div.)  
OC-12 Mask (223–1 PRBS)  
2xGBE Mask (223–1 PRBS)  
TIME (270ps/div.)  
TIME (67ps/div.)  
3.2Gbps Data Output (223-1 PRBS)  
Output Amplitude  
vs. Frequency  
400  
350  
300  
250  
200  
150  
100  
50  
0
0
1
2
3
4
5
6
FREQUENCY (GHz)  
TIME (80ps/div.)  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
7
Precision Edge®  
SY89542U  
Micrel, Inc.  
INPUT AND OUTPUT STAGE INTERNAL TERMINATION  
VCC  
IN  
50  
VT  
GND  
50Ω  
/IN  
Figure 3. Simplified Differential Input Stage  
INPUT INTERFACE APPLICATIONS  
VCC  
VCC  
VCC  
IN  
LVPECL  
IN  
/IN  
CML  
IN  
VCC  
0.01µF  
SY89542U  
/IN  
CML  
/IN  
SY89542U  
GND  
GND  
VT  
SY89542U  
VCC –1.4V  
Rp  
GND  
VT  
NC  
VT  
For VCC = 2.5V, Rp = 19  
GND  
Figure 4c. LVPECL  
Interface (DC-Coupled)  
Figure 4a. CML  
Interface (DC-Coupled)  
Figure 4b. CML  
Interface (AC-Coupled)  
VCC  
VCC  
IN  
LVPECL  
IN  
/IN  
LVDS  
/IN  
Rp  
Rp  
VCC  
SY89542U  
GND  
1.4V  
SY89542U  
VT  
GND  
GND  
NC  
VT  
GND  
For VCC = 2.5V, Rp = 50Ω  
Figure 4e. LVDS Interface  
Figure 4d. LVPECL  
Interface (AC-Coupled)  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
8
®
Precision Edge  
SY89542U  
Micrel, Inc.  
OUTPUT INTERFACE APPLICATIONS  
ground between an LVDS driver and receiver. Also, change  
in common mode voltage, as a function of data input, is  
kept to a minimum, to keep EMI low.  
LVDS specifies a small swing of 350mV typical, on a  
nominal 1.25V common mode above ground. The common  
mode voltage has tight limits to permit large variations in  
50  
50Ω  
VOCM  
,
VOCM  
,
VOCM  
VOCM  
50Ω  
50Ω  
GND  
GND  
Figure 5a. LVDS Differential Measurement  
Figure 5b. LVDS Common Mode Measurement  
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION  
Part Number  
Function  
Data Sheet Link  
SY89543L  
3.3V, 3.2Gbps Dual, Differential 2:1 LVDS  
Multiplexer with Internal Input Termination  
http://www.micrel.com/_pdf/HBW/sy89543l.pdf  
SY89544U  
SY89545L  
SY89546U  
SY89547L  
2.5V, 3.2Gbps 4:1 LVDS Multiplexer with Internal http://www.micrel.com/_pdf/HBW/sy89544u.pdf  
Input Termination  
3.3V, 3.2Gbps 4:1 LVDS Multiplexer with Internal http://www.micrel.com/_pdf/HBW/sy89545l.pdf  
Input Termination  
2.5V 3.2Gbps, Differential 4:1 LVDS Multiplexer  
with 1:2 Fanout and Internal Input Termination  
http://www.micrel.com/_pdf/HBW/sy89546u.pdf  
3.3V 3.2Gbps, Differential 4:1 LVDS Multiplexer  
with 1:2 Fanout and Internal Input Termination  
http://www.micrel.com/_pdf/HBW/sy89547l.pdf  
MLF® Application Note  
www.amkor.com/products/notes_papers/LF_AppNote_0902.pdf  
www.micrel.com/product-info/products/solutions.shtml  
HBW Solutions  
New Products and Applications  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
9
Precision Edge®  
SY89542U  
Micrel, Inc.  
®
32-PIN MicroLeadFrame (MLF-32)  
Package  
EP- Exposed Pad  
Die  
CompSide Island  
Heat Dissipation  
Heat Dissipation  
VEE  
Heavy Copper Plane  
Heavy Copper Plane  
®
VEE  
PCB Thermal Consideration for 32-Pin MLF Package  
(Always solder, or equivalent, the exposed pad to the PCB)  
Package Notes:  
1. Package meets Level 2 qualification.  
2. All parts are dry-packaged before shipment.  
3. Exposed pads must be soldered to a ground for proper thermal management.  
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA  
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com  
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.  
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.  
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can  
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into  
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s  
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify  
Micrel for any damages resulting from such use or sale.  
© 2006 Micrel, Incorporated.  
M9999-082407  
hbwhelp@micrel.com or (408) 955-1690  
10  

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