23LCV1024-IST [MICROCHIP]
1 Mbit SPI Serial SRAM with Battery Backup and SDI Interface; 1兆位的SPI串行SRAM ，带有备用电池和SDI接口
| 型号： | 23LCV1024-IST |
| 厂家： | 
MICROCHIP |
| 描述： | 1 Mbit SPI Serial SRAM with Battery Backup and SDI Interface |
| 文件： | 总30页 (文件大小：700K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
23LCV1024
1 Mbit SPI Serial SRAM with Battery Backup and SDI Interface
Device Selection Table
Part
Number
Dual I/O
(SDI)
Battery
Backup
Max. Clock
Frequency
VCC Range
Packages
SN, ST, P
23LCV1024
2.5-5.5V
Yes
Yes
20 MHz
Features:
Description:
• SPI-Compatible Bus Interface:
- 20 MHz Clock rate
The Microchip Technology Inc. 23LCV1024 is a 1 Mbit
Serial SRAM device. The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input. Additionally, SDI (Serial Dual Inter-
face) is supported if your application needs faster data
rates.
- SPI/SDI mode
• Low-Power CMOS Technology:
- Read Current: 3 mA at 5.5V, 20 MHz
- Standby Current: 4 A at +85°C
• Unlimited Read and Write Cycles
• External Battery Backup Support
• Zero Write Time
This device also supports unlimited reads and writes to
the memory array, and supports data backup via an
external battery/coin cell connected to VBAT (pin 7).
• 128K x 8-bit Organization:
- 32-byte page
The 23LCV1024 is available in standard packages
including 8-lead SOIC, PDIP and advanced 8-lead
TSSOP.
• Byte, Page and Sequential mode for Reads and
Writes
• High Reliability
• Temperature Range Supported:
Package Types (not to scale)
- Industrial (I):
-40C to +85C
• Pb-Free and RoHS Compliant, Halogen Free
• 8-Lead SOIC, TSSOP and PDIP Packages
Pin Function Table
SOIC/TSSOP/PDIP
Name
Function
CS
1
8
Vcc
CS
Chip Select Input
SO/SIO1
NC
2
3
4
7
6
5
VBAT
SO/SIO1
Vss
Serial Output/SDI Pin
Ground
SCK
Vss
SI/SIO0
SI/SIO0
SCK
Serial Input/SDI Pin
Serial Clock
VBAT
External Backup Supply Input
Power Supply
Vcc
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 1
23LCV1024
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature under bias...............................................................................................................-40°C to +85°C
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C
DC CHARACTERISTICS
Param.
No.
Sym.
Characteristic
Min.
Typ.(1)
Max.
Units
Test Conditions
23LCV1024
D001
D002
VCC
Supply voltage
2.5
—
—
5.5
V
V
VIH
VIL
VOL
VOH
ILI
High-level input
voltage
.7 VCC
VCC +0.3
D003
D004
D005
D006
D007
Low-level input
voltage
-0.3
—
—
—
—
—
—
0.10xVCC
V
V
23LCV1024
Low-level output
voltage
0.2
—
IOL = 1 mA
High-level output
voltage
VCC -0.5
—
V
IOH = -400 A
Input leakage
current
±1
±1
A
A
CS = VCC, VIN = VSS OR VCC
CS = VCC, VOUT = VSS OR VCC
ILO
Output leakage
current
—
D008
D009
ICC Read Operating current
—
—
3
4
10
10
mA FCLK = 20 MHz; SO = O, 5.5V
ICCS
Standby current
A CS = VCC = 5.5V, Inputs tied to
VCC or VSS
D010
D011
D012
CINT
VDR
Input capacitance
—
—
—
7
pF VCC = 0V, f = 1 MHz, Ta = 25°C
(Note 1)
RAM data retention
voltage
1.0
1.8
—
V
V
V
(Note 2)
VTRIP
VBAT Change Over
1.6
2.0
Typical at Ta = 25°C
(Note 1)
D013
D014
VBAT
IBAT
VBAT Voltage Range
VBAT Current
1.4
—
—
1
3.6
—
(Note 1)
A Typical at 2.5V, Ta = 25°C
(Note 1)
Note 1: This parameter is periodically sampled and not 100% tested. Typical measurements taken at room
temperature (25°C).
2: This is the limit to which VDD can be lowered without losing RAM data. This parameter is periodically
sampled and not 100% tested.
DS25156A-page 2
Preliminary
2012 Microchip Technology Inc.
23LCV1024
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Industrial (I):
TA = -40°C to +85°C
Sym.
Characteristic
Min.
Max.
Units
Test Conditions
No.
1
2
3
4
5
6
7
8
9
FCLK Clock frequency
TCSS CS setup time
TCSH CS hold time
TCSD CS disable time
—
25
50
25
10
10
—
—
25
25
25
—
0
20
—
—
—
—
—
20
20
—
—
—
25
—
20
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Tsu
THD
TR
Data setup time
Data hold time
CLK rise time
CLK fall time
Note 1
Note 1
TF
THI
TLO
Clock high time
Clock low time
10
11
12
13
14
TCLD Clock delay time
TV
Output valid from clock low
THO
TDIS
Output hold time
Note 1
Output disable time
—
Note 1: This parameter is periodically sampled and not 100% tested.
TABLE 1-3:
AC TEST CONDITIONS
AC Waveform:
Input pulse level
Input rise/fall time
0.1 VCC to 0.9 VCC
5 ns
-40°C to +85°C
—
Operating temperature
CL = 30 pF
Timing Measurement Reference Level:
Input
0.5 VCC
0.5 VCC
Output
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 3
23LCV1024
FIGURE 1-1: SERIAL INPUT TIMING (SPI MODE)
4
CS
2
11
7
3
8
SCK
5
6
SI
MSB in
LSB in
High-Impedance
SO
FIGURE 1-2: SERIAL OUTPUT TIMING (SPI MODE)
CS
3
9
10
SCK
12
14
13
MSB out
LSB out
SO
SI
Don’t Care
DS25156A-page 4
Preliminary
2012 Microchip Technology Inc.
23LCV1024
If operating in Sequential mode, the data stored in the
memory at the next address can be read sequentially
by continuing to provide clock pulses. The internal
Address Pointer is automatically incremented to the
next higher address after each byte of data is shifted
out. When the highest address is reached (1FFFFh),
the address counter rolls over to address 00000h,
allowing the read cycle to be continued indefinitely.
The read operation is terminated by raising the CS
pin.
2.0
2.1
FUNCTIONAL DESCRIPTION
Principles of Operation
The 23LCV1024 is an 1 Mbit Serial SRAM designed to
interface directly with the Serial Peripheral Interface
(SPI) port of many of today’s popular microcontroller
families, including Microchip’s PIC® microcontrollers. It
may also interface with microcontrollers that do not
have a built-in SPI port by using discrete I/O lines
programmed properly in firmware to match the SPI
protocol. In addition, the 23LCV1024 is also capable of
operating in SDI (or dual SPI) mode.
2.4
Write Sequence
Prior to any attempt to write data to the 23LCV1024, the
device must be selected by bringing CS low.
The 23LCV1024 contains an 8-bit instruction register.
The device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low for the entire operation.
Once the device is selected, the Write command can
be started by issuing a WRITE instruction, followed by
the 24-bit address, with the first seven MSB’s of the
address being a “don’t care” bit, and then the data to be
written. A write is terminated by the CS being brought
high.
Table 2-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses and data are transferred MSB first, LSB last.
If operating in Page mode, after the initial data byte is
shifted in, additional bytes can be shifted into the
device. The Address Pointer is automatically
incremented. This operation can continue for the entire
page (32 bytes) before data will start to be overwritten.
2.2
Modes of Operation
The 23LCV1024 has three modes of operation that are
selected by setting bits 7 and 6 in the MODE register.
The modes of operation are Byte, Page and Burst.
If operating in Sequential mode, after the initial data
byte is shifted in, additional bytes can be clocked into
the device. The internal Address Pointer is automati-
cally incremented. When the Address Pointer reaches
the highest address (1FFFFh), the address counter
rolls over to (00000h). This allows the operation to
continue indefinitely, however, previous data will be
overwritten.
Byte Operation – is selected when bits 7 and 6 in the
MODE register are set to 00. In this mode, the read/
write operations are limited to only one byte. The
command followed by the 24-bit address is clocked into
the device and the data to/from the device is transferred
on the next eight clocks (Figure 2-1, Figure 2-2).
Page Operation – is selected when bits 7 and 6 in the
MODE register are set to 10. The 23LCV1024 has 4096
pages of 32 bytes. In this mode, the read and write oper-
ations are limited to within the addressed page (the
address is automatically incremented internally). If the
data being read or written reaches the page boundary,
then the internal address counter will increment to the
start of the page (Figure 2-3, Figure 2-4).
Sequential Operation – is selected when bits 7 and 6
in the MODE register are set to 01. Sequential opera-
tion allows the entire array to be written to and read
from. The internal address counter is automatically
incremented and page boundaries are ignored. When
the internal address counter reaches the end of the
array, the address counter will roll over to 0x00000
(Figure 2-5, Figure 2-6).
2.3
Read Sequence
The device is selected by pulling CS low. The 8-bit
READ instruction is transmitted to the 23LCV1024
followed by the 24-bit address, with the first seven
MSB’s of the address being a “don’t care” bit. After the
correct READinstruction and address are sent, the data
stored in the memory at the selected address is shifted
out on the SO pin.
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 5
23LCV1024
TABLE 2-1:
INSTRUCTION SET
Hex
Code
Instruction Name Instruction Format
Description
READ
WRITE
EDIO
RSTIO
RDMR
WRMR
0000 0011
0000 0010
0011 1011
1111 1111
0000 0101
0000 0001
0x03
0x02
0x3B
0xFF
0x05
0x01
Read data from memory array beginning at selected address
Write data to memory array beginning at selected address
Enter Dual I/O access
Reset Dual I/O access
Read Mode Register
Write Mode Register
FIGURE 2-1: BYTE READ SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
SI
Instruction
24-bit Address
0 0 0 0 0 0 1 1 23 22 21 20
2
1
0
Data Out
High-Impedance
7
6
5
4
3
2
1
0
SO
FIGURE 2-2: BYTE WRITE SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
SI
Instruction
24-bit Address Data Byte
0 0 0 0 0 0 1 0 23 22 21 20
2
1
0
7
6
5
4
3
2
1
0
High-Impedance
SO
DS25156A-page 6
Preliminary
2012 Microchip Technology Inc.
23LCV1024
FIGURE 2-3: PAGE READ SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
SI
Instruction
0 0 0 0 0 0 1 1 23 22 21 20
Page X, Word Y
24-bit Address
2
1
0
Page X, Word Y
High-Impedance
SO
7
6
5
4
3
2
1
0
CS
40 41 42 43 44 45 46 47
SCK
SI
Page X, Word Y+1
Page X, Word 31
Page X, Word 0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
FIGURE 2-4:
PAGE WRITE SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
0 0 0 0 0 0 1 0 23 22 21 20
Page X, Word Y
24-bit Address
Page X, Word Y
2
1
0
7
6
5
4
3
2
1
0
SI
CS
SCK
SI
40 41 42 43 44 45 46 47
Page X, Word Y+1
Page X, Word 31
Page X, Word 0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 7
23LCV1024
FIGURE 2-5:
SEQUENTIAL READ SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
24-bit Address
23 22 21 20
0 0 0 0 0 0 1 1
2
1
0
SI
Page X, Word Y
7
6
5
4
3
2
1
0
SO
CS
SCK
SI
Page X, Word 31
Page X+1, Word 0
Page X+1, Word 1
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
CS
SCK
SI
Page X+1, Word 31
Page X+n, Word 1
Page X+n, Word 31
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
SO
DS25156A-page 8
Preliminary
2012 Microchip Technology Inc.
23LCV1024
FIGURE 2-6:
SEQUENTIAL WRITE SEQUENCE (SPI MODE)
CS
0
1
2
3
4
5
6
7
8
9 10 11
29 30 31 32 33 34 35 36 37 38 39
SCK
Instruction
24-bit Address
Data Byte 1
5
0 0 0 0 0 0 1 0 23 22 21 20
2
1
0
7
6
4
3
2
1
0
SI
CS
40 41 42 43 44 45 46 47
Data Byte 2
49 50 51 52 53 54 55
Data Byte 3
48
7
SCK
SI
Data Byte n
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 9
23LCV1024
The mode bits indicate the operating mode of the
SRAM. The possible modes of operation are:
2.5
Read Mode Register Instruction
(RDMR)
0 0= Byte mode
The Read Mode Register instruction (RDMR) provides
access to the MODE register. The MODE register may
be read at any time. The MODE register is formatted as
follows:
1 0= Page mode
0 1= Sequential mode (default operation)
1 1= Reserved
Bits 0 through 5 are reserved and should always be set
to ‘0’.
TABLE 2-2:
MODE REGISTER
7
6
5
–
4
–
3
–
2
–
1
–
0
–
0
See Figure 2-7 for the RDMRtiming sequence.
W/R
W/R
MODE MODE 0 0 0 0 0
W/R = writable/readable
FIGURE 2-7: READ MODE REGISTER TIMING SEQUENCE (RDMR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
Instruction
0
0
0
0
0
1
0
1
SI
Data from MODE Register
High-Impedance
7
6
5
4
3
2
1
0
SO
DS25156A-page 10
Preliminary
2012 Microchip Technology Inc.
23LCV1024
2.6
Write Mode Register Instruction
(WRMR)
The Write Mode Register instruction (WRMR) allows the
user to write to the bits in the MODE register as shown
in Table 2-2. This allows for setting of the Device
operating mode. Several of the bits in the MODE
register must be cleared to ‘0’. See Figure 2-8 for the
WRMRtiming sequence.
FIGURE 2-8: WRITE MODE REGISTER TIMING SEQUENCE (WRMR)
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1
15
0
SCK
SI
Instruction
Data to MODE Register
7
6
5
4
3
2
0
0
0
0
0
0
0
1
High-Impedance
SO
2.7
Power-On State
The 23LCV1024 powers on in the following state:
• The device is in low-power Standby mode
(CS= 1)
• A high-to-low-level transition on CS is required to
enter active state
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 11
23LCV1024
3.6
VBAT Supply Input
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
The VBAT pin is used as an input for external backup
supply to maintain SRAM data when VCC is below the
VTRIP point. If the VBAT function is not being used it is
recommended to connect this pin to VSS.
TABLE 3-1:
Name
PIN FUNCTION TABLE
SOIC/
PDIP
Function
3.7
SPI and SDI Pin Designations
TSSOP
CS
1
2
3
4
5
6
7
8
Chip Select Input
SPI Mode:
SO/SIO1
NC
Serial Data Output/SDI Pin
No Connect
CS
1
8
Vcc
VSS
Ground
SO
NC
2
3
4
7
6
5
VBAT
SCK
SI
SI/SIO0
SCK
Serial Data Input/SDI Pin
Serial Clock Input
External Backup Supply
Power Supply
Vss
VBAT
VCC
SDI Mode:
3.1
Chip Select (CS)
CS
1
8
Vcc
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
When the device is deselected, SO goes to the high-
impedance state, allowing multiple parts to share the
same SPI bus. After power-up, a low level on CS is
required, prior to any sequence being initiated.
SIO1
NC
2
3
7
6
VBAT
SCK
Vss
4
5
SIO0
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the
23LCV1024. During a read cycle, data is shifted out on
this pin after the falling edge of the serial clock.
3.3
Serial Input (SI)
The SI pin is used to transfer data into the device. It
receives instructions, addresses, and data. Data is
latched on the rising edge of the serial clock.
3.4
Serial Dual Interface Pins(SIO0,
SIO1)
The SIO0 and SIO1 pins are used for SDI mode of
operation. Functionality of these I/O pins is shared with
SO and SI.
3.5
Serial Clock (SCK)
The SCK is used to synchronize the communication
between a master and the 23LCV1024. Instructions,
addresses or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
DS25156A-page 12
Preliminary
2012 Microchip Technology Inc.
23LCV1024
4.1
Dual Interface Mode
4.0
DUAL SERIAL MODE
The 23LCV1024 supports SDI (Serial Dual) mode of
operation. To enter SDI mode the EDIO command must
be clocked in (Figure 4-1). It should be noted that if the
MCU resets before the SRAM, the user will need to
determine the serial mode of operation of the SRAM
and reset it accordingly. Byte read and write sequence
in SDI mode is shown in Figure 4-2 and Figure 4-3.
The 23LCV1024 also supports SDI (Serial Dual) mode
of operation when used with compatible master
devices. As a convention for SDI mode of operation,
two bits are entered per clock using the SIO0 and SIO1
pins. Bits are clocked MSB first.
FIGURE 4-1: ENTER SDI MODE (EDIO) FROM SPI MODE
CS
0
1
2
3
4
5
6
7
SCK
SI
0
0
1
1
1
0
1
1
High-Impedance
SO
FIGURE 4-2:
BYTE READ MODE SDI
CS
0
2
4
5
13
14 15
1
3
6
18
20 21 22 23
19
16 17
SCK
0
1
0
0
0
0
1
6
7
4
2
22 20 18
4
2
3
0
1
SIO0
Dummy Byte
Data Out
Instruction
24-Bit Address
0
0
1
5
3
23 21 19
5
SIO1
Note:
Note:
Page and Sequential mode are similar in that additional bytes can be clocked out before CS is brought high.
The first byte read after the address will be a dummy byte.
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 13
23LCV1024
FIGURE 4-3:
BYTE WRITE MODE SDI
CS
5
0
1
2
3
4
6
13 14 15 16
19
17 18
SCK
SIO0
0
0
0
0
0
0
1
22 20 18
4
2
3
0
6
7
4
2
Data In
Instruction
24-Bit Address
0
0
1
23 21 19
5
1
5
3
SIO1
Note:
Page and Sequential mode are similar in that additional bytes can be clocked in before CS is brought high.
4.2
Exit SDI Mode
To exit from SDI mode, the RSTIO command must be
issued. The command must be entered in the current
device configuration see (Figure 4-4)
FIGURE 4-4:
RESET SDI MODE (RSTIO) – FROM SDI MODE
CS
3
2
0
1
SCK
1 1 1 1
SIO0
SIO1
1 1 1 1
DS25156A-page 14
Preliminary
2012 Microchip Technology Inc.
23LCV1024
The VBAT trip point is the point at which the internal
switch operates the device from the VBAT supply and
is typically 1.8V (VTRIP specification D012). When VCC
falls below the VTRIP point the system will continue to
maintain the SRAM contents.
5.0
VBAT
The 23LCV1024 features an internal switch that will
maintain the SRAM contents. In the event that the VCC
supply is not available, the voltage applied to the VBAT
pin serves as the backup supply.
The following conditions apply:
Supply Condition
Read/Write Access
Powered By
VCC < VTRIP, VCC < VBAT
VCC > VTRIP, VCC < VBAT
VCC > VTRIP, VCC > VBAT
No
Yes
Yes
VBAT
VCC
VCC
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 15
23LCV1024
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example
23LCVB
I/P 1L7
XXXXXXXX
XXXXXNNN
e
3
0528
YYWW
8-Lead SOIC (3.90 mm)
Example:
23LCVBI
XXXXXXXT
XXXXYYWW
SN
0528
e
3
NNN
1L7
Example:
3LVB
8-Lead TSSOP
XXXX
TYWW
I837
1L7
NNN
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
YY
WW
NNN
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS25156A-page 16
Preliminary
2012 Microchip Technology Inc.
23LCV1024
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆꢓꢆꢔꢕꢕꢆꢖꢋꢈꢆꢗꢘꢅꢙꢆꢚꢇꢍꢏꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢯꢄꢃꢏꢇ
ꢰꢱꢝꢲꢠꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢁꢀꢣꢣꢅꢩꢛꢝ
ꢷ
ꢁꢀꢞꢣ
ꢷ
ꢁꢞꢀꢣ
ꢁꢙꢨꢣ
ꢁꢞꢺꢨ
ꢁꢀꢞꢣ
ꢁꢣꢀꢣ
ꢁꢣꢺꢣ
ꢁꢣꢀꢶ
ꢷ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢫꢕꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢩꢉꢇꢌꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢛꢘꢕꢈꢊꢋꢌꢐꢅꢏꢕꢅꢛꢘꢕꢈꢊꢋꢌꢐꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢙ
ꢦꢀ
ꢠ
ꢠꢀ
ꢟ
ꢳ
ꢖ
ꢔꢀ
ꢔ
ꢌꢩ
ꢷ
ꢁꢙꢀꢣ
ꢁꢀꢸꢨ
ꢷ
ꢁꢀꢀꢨ
ꢁꢣꢀꢨ
ꢁꢙꢸꢣ
ꢁꢙꢥꢣ
ꢁꢞꢥꢶ
ꢁꢀꢀꢨ
ꢁꢣꢣꢶ
ꢁꢣꢥꢣ
ꢁꢣꢀꢥ
ꢷ
ꢁꢞꢙꢨ
ꢁꢙꢶꢣ
ꢁꢥꢣꢣ
ꢁꢀꢨꢣ
ꢁꢣꢀꢨ
ꢁꢣꢻꢣ
ꢁꢣꢙꢙ
ꢁꢥꢞꢣ
ꢫꢃꢡꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢯꢡꢡꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢕꢗꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢼꢕꢗꢅꢛꢡꢉꢖꢃꢄꢜꢅꢅꢚ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢚꢅꢛꢃꢜꢄꢃꢎꢃꢖꢉꢄꢏꢅꢝꢘꢉꢐꢉꢖꢏꢌꢐꢃꢇꢏꢃꢖꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢁꢣꢀꢣꢤꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪꢅꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢀꢶꢩ
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 17
23LCV1024
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25156A-page 18
Preliminary
2012 Microchip Technology Inc.
23LCV1024
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 19
23LCV1024
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢜꢒꢆꢓꢆꢜꢄꢠꢠꢘꢡꢢꢆꢔꢣꢤꢕꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢞꢟꢏꢥꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
DS25156A-page 20
Preliminary
2012 Microchip Technology Inc.
23LCV1024
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢦꢧꢋꢐꢆꢞꢧꢠꢋꢐꢨꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢦꢒꢆꢓꢆꢩꢣꢩꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢞꢞꢟꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢱ
ꢌ
ꢶ
ꢣꢁꢺꢨꢅꢩꢛꢝ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢦ
ꢷ
ꢣꢁꢶꢣ
ꢣꢁꢣꢨ
ꢷ
ꢀꢁꢣꢣ
ꢷ
ꢀꢁꢙꢣ
ꢀꢁꢣꢨ
ꢣꢁꢀꢨ
ꢦꢙ
ꢦꢀ
ꢠ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢺꢁꢥꢣꢅꢩꢛꢝ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢠꢀ
ꢟ
ꢳ
ꢥꢁꢞꢣ
ꢙꢁꢸꢣ
ꢣꢁꢥꢨ
ꢥꢁꢥꢣ
ꢞꢁꢣꢣ
ꢣꢁꢺꢣ
ꢥꢁꢨꢣ
ꢞꢁꢀꢣ
ꢣꢁꢻꢨ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢀ
ꢀ
ꢀꢁꢣꢣꢅꢼꢠꢬ
ꢣꢾ
ꢣꢁꢣꢸ
ꢣꢁꢀꢸ
ꢷ
ꢷ
ꢷ
ꢶꢾ
ꢖ
ꢔ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢨꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢶꢺꢩ
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 21
23LCV1024
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25156A-page 22
Preliminary
2012 Microchip Technology Inc.
23LCV1024
APPENDIX A: REVISION HISTORY
Revision A (09/2012)
Initial release.
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 23
23LCV1024
NOTES:
DS25156A-page 24
Preliminary
2012 Microchip Technology Inc.
23LCV1024
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 25
23LCV1024
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
RE:
Technical Publications Manager
Reader Response
Total Pages Sent ________
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Literature Number: DS25156A
Application (optional):
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Device: 23LCV1024
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS25156A-page 26
Preliminary
2012 Microchip Technology Inc.
23LCV1024
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not all possible ordering options
are shown below..
PART NO.
Device
X
/XX
X
–
Examples:
Tape & Reel
Package
Temp Range
a)
b)
c)
23LCV1024-I/ST = 1 Mbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., TSSOP package
23LCV1024-I/SN = 1 Mbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., SOIC package
23LCV1024-I/P = 1 Mbit, 2.5 - 5.5V Serial
SRAM, Industrial temp., PDIP package
Device:
23LCV1024=
1 Mbit, 2.5 - 5.5V, SPI Serial SRAM
Tape & Reel: Blank
=
=
Standard packaging (tube)
Tape & Reel
T
Temperature
Range:
I
=
-40C to+85C
Package:
SN
ST
P
=
=
=
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm body), 8-lead
Plastic PDIP (300 mil body), 8-lead
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 27
23LCV1024
NOTES:
DS25156A-page 28
Preliminary
2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620765999
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2012 Microchip Technology Inc.
Preliminary
DS25156A-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/11
DS25156A-page 30
Preliminary
2012 Microchip Technology Inc.
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