24AA04BT-I/MC [MICROCHIP]
4K I2C⑩ Serial EEPROM; 4K I2C ™串行EEPROM
| 型号： | 24AA04BT-I/MC |
| 厂家： | 
MICROCHIP |
| 描述： | 4K I2C⑩ Serial EEPROM |
| 文件： | 总26页 (文件大小：403K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
24AA04/24LC04B
4K I2C™ Serial EEPROM
Description:
Device Selection Table
Part
Number
Vcc
Range
Max. Clock
Frequency
Temp.
Ranges
The Microchip Technology Inc. 24AA04/24LC04B
(24XX04*) is a 4 Kbit Electrically Erasable PROM. The
device is organized as two blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low-voltage
design permits operation down to 1.7V, with standby
and active currents of only 1 μA and 1 mA,
respectively. The 24XX04 also has a page write
capability for up to 16 bytes of data. The 24XX04 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages and is
also available in the 5-lead SOT-23 package.
24AA04
1.7-5.5
2.5-5.5
400 kHz(1)
400 kHz
I
24LC04B
I, E
Note 1: 100 kHz for VCC <2.5V
Features:
• Single supply with operation down to 1.7V for
24AA04 devices, 2.5V for 24LC04B devices
• Low-power CMOS technology:
- Read current 1 mA, typical
Package Types
- Standby current 1 μA, typical
SOIC, TSSOP
PDIP, MSOP
• 2-wire serial interface, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 3 ms, typical
A0
1
8
VCC
1
2
3
4
8
7
6
5
A0
A1
VCC
WP
A1
A2
2
3
4
7
6
5
WP
SCL
A2
SCL
SDA
VSS
SDA VSS
• Self-timed erase/write cycle
SOT-23-5
DFN
• 16-byte page write buffer
• Hardware write-protect
1
VCC
WP
A0
8
7
6
5
WP
Vcc
1
5
4
SCL
2
3
4
A1
• ESD protection >4,000V
SCL
SDA
2
3
A2
VSS
Vss
• More than 1 million erase/write cycles
• Data retention >200 years
SDA
• Factory programming available
Note:
Pins A0, A1 and A2 are not used by the 24XX04. (No
internal connections).
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, MSOP and 5-lead SOT-23
• Pb-free and RoHS compliant
• Temperature ranges:
Block Diagram
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
HV
Generator
WP
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
Page
Latches
I/O
SCL
YDEC
SDA
VCC
VSS
Sense Amp.
R/W Control
© 2007 Microchip Technology Inc.
DS21708G-page 1
24AA04/24LC04B
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
DC CHARACTERISTICS
Automotive (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
Sym.
No.
Characteristic
Min.
Typ.
Max.
Units
Conditions
D1
D2
D3
D4
VIH
—
WP, SCL and SDA pins
High-level input voltage
Low-level input voltage
—
—
—
—
—
—
—
—
V
—
0.7 VCC
—
—
VIL
0.3 VCC
—
V
—
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
V
(Note)
D5
D6
D7
D8
VOL
ILI
Low-level output voltage
Input leakage current
Output leakage current
—
—
—
—
—
—
—
—
0.40
±1
V
IOL = 3.0 mA, VCC = 2.5V
VIN = VSS or VCC
μA
μA
pF
ILO
±1
VOUT = VSS or VCC
CIN,
Pin capacitance
10
VCC = 5.0V (Note)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D9
ICC write Operating current
—
—
0.1
3
1
mA
mA
VCC = 5.5V, SCL = 400 kHz
—
D10
D11
ICC read
0.05
ICCS
Standby current
—
—
0.01
—
1
5
μA
μA
Industrial
Automotive
SDA = SCL = VCC
WP = VSS
Note:
This parameter is periodically sampled and not 100% tested.
DS21708G-page 2
© 2007 Microchip Technology Inc.
24AA04/24LC04B
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = +1.7V to +5.5V
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
AC CHARACTERISTICS
Param.
Sym.
No.
Characteristic
Clock frequency
Min.
Typ.
Max.
Units
Conditions
1
2
3
4
FCLK
THIGH
TLOW
TR
—
—
—
—
400
100
kHz 2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
Clock high time
Clock low time
600
4000
—
—
—
—
ns
ns
ns
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
1300
4700
—
—
—
—
SDA and SCL rise time
(Note 1)
—
—
—
—
300
1000
2.5V ≤ VCC ≤ 5.5V (Note 1)
1.7V ≤ VCC < 2.5V (24AA04)
(Note 1)
5
TF
SDA and SCL fall time
—
—
—
300
ns
ns
ns
ns
ns
ns
ns
ns
(Note 1)
6
THD:STA Start condition hold time
600
4000
—
—
—
—
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
7
TSU:STA Start condition setup
time
600
4700
—
—
—
—
8
THD:DAT Data input hold time
0
—
—
—
(Note 2)
9
TSU:DAT Data input setup time
100
250
—
—
—
—
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
10
11
12
TSU:STO Stop condition setup
time
600
4000
—
—
—
—
TAA
Output valid from clock
(Note 2)
—
—
—
—
900
3500
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
TBUF
Bus free time: Time the
bus must be free before
a new transmission can
start
1300
4700
—
—
—
—
2.5V ≤ VCC ≤ 5.5V
1.7V ≤ VCC < 2.5V (24AA04)
13
14
TOF
TSP
Output fall time from VIH 20+0.1CB
—
—
250
250
ns
ns
2.5V ≤ VCC ≤ 5.5V
minimum to VIL
maximum
—
1.7V ≤ VCC < 2.5V (24AA04)
Input filter spike
suppression
—
—
50
(Notes 1 and 3)
(SDA and SCL pins)
15
16
TWC
—
Write cycle time
(byte or page)
—
—
—
5
ms
—
Endurance
1M
—
cycles 25°C, (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
© 2007 Microchip Technology Inc.
DS21708G-page 3
24AA04/24LC04B
FIGURE 1-1:
BUS TIMING DATA
5
4
2
3
SCL
7
8
9
10
6
SDA
IN
14
12
11
SDA
OUT
FIGURE 1-2:
BUS TIMING START/STOP
D4
SCL
SDA
6
7
10
Start
Stop
DS21708G-page 4
© 2007 Microchip Technology Inc.
24AA04/24LC04B
3.4
Data Valid (D)
2.0
FUNCTIONAL DESCRIPTION
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The 24XX04 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX04 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of data
bytes transferred between Start and Stop conditions is
determined by the master device and is, theoretically,
unlimited (although only the last sixteen will be stored
when doing a write operation). When an overwrite does
occur, it will replace data in a first-in first-out (FIFO)
fashion.
3.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
3.5
Acknowledge
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
Note:
The 24XX04 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
3.1
Bus Not Busy (A)
The device that acknowledges has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX04) will leave the data line
high to enable the master to generate the Stop
condition.
Both data and clock lines remain high.
3.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
FIGURE 3-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
© 2007 Microchip Technology Inc.
DS21708G-page 5
24AA04/24LC04B
FIGURE 3-2:
CONTROL BYTE
ALLOCATION
3.6
Device Addressing
A control byte is the first byte received following the
Start condition from the master device. The control byte
consists of a four-bit control code. For the 24XX04, this
is set as ‘1010’ binary for read and write operations.
The next two bits of the control byte are “don’t cares” for
the 24XX04. The last bit, B0, is used by the master
device to select which of the two 256-word blocks of
memory are to be accessed. This bit is, in effect, the
Most Significant bit of the word address.
Read/Write Bit
Block
Select
Bits
Control Code
1
0
1
0
S
x
x
B0 R/W ACK
The last bit of the control byte defines the operation to
be performed. When set to ‘1’, a read operation is
selected. When set to ‘0’, a write operation is selected.
Following the Start condition, the 24XX04 monitors the
SDA bus checking the device type identifier being
transmitted and, upon receiving a ‘1010’ code, the
slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX04 will select a read or write operation.
Slave Address
Acknowledge Bit
Start Bit
x = “don’t care”
Control
Code
Operation
Block Select
R/W
Read
Write
Block Address
Block Address
1010
1010
1
0
DS21708G-page 6
© 2007 Microchip Technology Inc.
24AA04/24LC04B
4.2
Page Write
4.0
4.1
WRITE OPERATION
Byte Write
The write control byte, word address and the first data
byte are transmitted to the 24XX04 in the same way as
in a byte write. But instead of generating a Stop condi-
tion the master transmits up to 16 data bytes to the
24XX04, which are temporarily stored in the on-chip
page buffer and will be written into memory once the
master has transmitted a Stop condition. Upon receipt
of each word, the four lower-order Address Pointer bits
are internally incremented by ‘1’. The higher-order 7
bits of the word address remain constant. If the master
should transmit more than 16 words prior to generating
the Stop condition, the address counter will roll over
and the previously received data will be overwritten. As
with the byte write operation, once the Stop condition is
received an internal write cycle will begin (Figure 4-2).
Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the Address Pointer of the 24XX04. After
receiving another Acknowledge signal from the
24XX04, the master device will transmit the data word
to be written into the addressed memory location. The
24XX04 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX04 will not
generate Acknowledge signals (Figure 4-1).
Note:
Page write operations are limited to writing
bytes within single physical page
a
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
‘page size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
FIGURE 4-1:
BYTE WRITE
S
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
Byte
Word
Address
Data
x
x
0
SDA Line
1
0
S
1
0
B0
P
A
C
K
A
C
K
A
C
K
Bus Activity
Block
Select
Bits
x= “don’t care”
FIGURE 4-2:
PAGE WRITE
S
S
T
O
P
T
Bus Activity
Master
Control
Byte
Word
Address (n)
A
Data (n)
Data (n + 1)
Data (n + 15)
R
T
x x
1
SDA Line
0
0
0
B0
1
S
P
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
Block
Select
Bits
Bus Activity
x= “don’t care”
© 2007 Microchip Technology Inc.
DS21708G-page 7
24AA04/24LC04B
5.0
ACKNOWLEDGE POLLING
6.0
WRITE PROTECTION
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W = 0). If the device is still
busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 5-1 for a flow diagram of
this operation.
The WP pin allows the user to write-protect the entire
array (000-1FF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled.
FIGURE 5-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
DS21708G-page 8
© 2007 Microchip Technology Inc.
24AA04/24LC04B
7.3
Sequential Read
7.0
READ OPERATION
Sequential reads are initiated in the same way as a
random read, except that once the 24XX04 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX04 to transmit the next sequentially-
addressed 8-bit word (Figure 7-3).
Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
7.1
Current Address Read
To provide sequential reads, the 24XX04 contains an
internal Address Pointer that is incremented by one
upon completion of each operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
The 24XX04 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous access
(either a read or write operation) was to address n, the
next current address read operation would access data
from address n + 1. Upon receipt of the slave address
with R/W bit set to ‘1’, the 24XX04 issues an acknowl-
edge and transmits the 8-bit data word. The master will
not acknowledge the transfer, but does generate a Stop
condition and the 24XX04 discontinues transmission
(Figure 7-1).
7.4
Noise Protection
The 24XX04 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V at nominal conditions.
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.
7.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX04 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This termi-
nates the write operation, but not before the internal
Address Pointer is set. The master then issues the
control byte again, but with the R/W bit set to a ‘1’. The
24XX04 will then issue an acknowledge and transmit
the 8-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX04, will discontinue transmission (Figure 7-2).
FIGURE 7-1:
CURRENT ADDRESS READ
S
Bus Activity
Master
T
A
R
Control
Byte
S
T
Data (n)
O
P
T
x
x
B0
0
SDA Line
0
1
1
1
S
P
A
C
K
N
o
Bus Activity
x= “don’t care”
Block
Select
Bits
A
C
K
© 2007 Microchip Technology Inc.
DS21708G-page 9
24AA04/24LC04B
FIGURE 7-2:
RANDOM READ
S
S
T
A
R
T
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
Byte
Word
Address (n)
Control
Byte
Data (n)
xx
B0
x x
0
0 1 0
1
10
0
B0
1
1
S
P
S
SDA Line
A
C
K
A
C
K
A
C
K
N
o
Block
Select
Bits
Block
Select
Bits
Bus Activity
A
C
K
x= “don’t care”
FIGURE 7-3:
SEQUENTIAL READ
S
T
O
P
Control
Byte
Bus Activity
Master
Data (n)
Data (n + 1)
Data (n + 2)
Data (n + x)
1
P
SDA Line
A
C
K
A
C
K
A
C
K
A
C
K
N
o
Bus Activity
A
C
K
DS21708G-page 10
© 2007 Microchip Technology Inc.
24AA04/24LC04B
8.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 8-1.
TABLE 8-1:
Name
PIN FUNCTION TABLE
PDIP
SOIC
TSSOP
DFN
MSOP
SOT23
Description
Not Connected
A0
A1
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
—
—
—
2
Not Connected
A2
Not Connected
VSS
SDA
SCL
WP
VCC
Ground
3
Serial Address/Data I/O
Serial Clock
1
5
Write-Protect Input
+1.7V to 5.5V Power Supply
4
8.1
Serial Address/Data Input/Output
(SDA)
8.3
Write-Protect (WP)
The WP pin must be connected to either VSS or VCC.
SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for 400 kHz).
If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-1FF).
If tied to VCC, write operations are inhibited. The entire
memory will be write-protected. Read operations are
not affected.
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.
This feature allows the user to use the 24XX04 as a
serial ROM when WP is enabled (tied to VCC).
8.2
Serial Clock (SCL)
8.4
A0, A1, A2
The SCL input is used to synchronize the data transfer
to and from the device.
The A0, A1 and A2 pins are not used by the 24XX04.
They may be left floating or tied to either VSS or VCC.
© 2007 Microchip Technology Inc.
DS21708G-page 11
24AA04/24LC04B
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24LC04B
XXXXXXXX
T/XXXNNN
I/P
13F
e
3
YYWW
0527
8-Lead SOIC (3.90 mm)
Example:
24LC04BI
XXXXXXXT
e
3
XXXXYYWW
SN 0527
NNN
13F
Example:
8-Lead TSSOP
XXXX
4L04
TYWW
NNN
I527
13F
Example:
8-Lead MSOP
XXXXXT
4L4BI
52713
YWWNNN
Example:
5-Lead SOT-23
XXNN
M33F
Example:
8-Lead 2x3 DFN
234
527
13
XXX
YWW
NN
DS21708G-page 12
© 2007 Microchip Technology Inc.
24AA04/24LC04B
1st Line Marking Codes
SOT-23
Part Number
DFN
TSSOP
MSOP
I Temp.
E Temp.
I Temp.
E Temp.
24AA04
4A04
4L04
4A04T
4L4BT
B3NN
M3NN
—
231
234
—
24LC04B
N3NN
235
Note:
T = Temperature grade (I, E)
NN = Alphanumeric traceability code
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2007 Microchip Technology Inc.
DS21708G-page 13
24AA04/24LC04B
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
INCHES
Dimension Limits
MIN
NOM
8
MAX
Number of Pins
Pitch
N
e
.100 BSC
–
Top to Seating Plane
A
–
.210
.195
–
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
.325
.280
.400
.150
.015
.070
.022
.430
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing §
eB
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21708G-page 14
© 2007 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
A
–
–
1.75
–
Molded Package Thickness
Standoff
A2
A1
E
1.25
0.10
–
§
–
0.25
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
E1
D
h
3.90 BSC
4.90 BSC
0.25
0.40
–
0.50
1.27
L
–
Footprint
L1
φ
1.04 REF
Foot Angle
0°
0.17
0.31
5°
–
–
–
–
–
8°
Lead Thickness
Lead Width
c
0.25
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS21708G-page 15
24AA04/24LC04B
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
0.65 BSC
Overall Height
A
–
–
1.20
1.05
0.15
Molded Package Thickness
Standoff
A2
A1
E
0.80
0.05
1.00
–
Overall Width
6.40 BSC
Molded Package Width
Molded Package Length
Foot Length
E1
D
4.30
2.90
0.45
4.40
4.50
3.10
0.75
3.00
L
0.60
Footprint
L1
φ
1.00 REF
Foot Angle
0°
–
–
–
8°
Lead Thickness
c
0.09
0.20
0.30
Lead Width
b
0.19
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21708G-page 16
© 2007 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
2
b
1
e
c
φ
A2
A
L
L1
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
0.65 BSC
Overall Height
A
–
–
1.10
0.95
0.15
Molded Package Thickness
Standoff
A2
A1
E
0.75
0.00
0.85
–
4.90 BSC
3.00 BSC
3.00 BSC
0.60
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
L
0.40
0.80
Footprint
L1
φ
0.95 REF
–
Foot Angle
0°
8°
Lead Thickness
Lead Width
c
0.08
–
0.23
0.40
b
0.22
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
DS21708G-page 17
24AA04/24LC04B
5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Lead Pitch
N
e
5
0.95 BSC
Outside Lead Pitch
Overall Height
e1
A
1.90 BSC
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0°
–
–
–
–
–
–
–
–
–
–
–
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
Molded Package Thickness
Standoff
A2
A1
E
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
L
Footprint
L1
φ
Foot Angle
Lead Thickness
Lead Width
c
0.08
0.20
0.26
0.51
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-091B
DS21708G-page 18
© 2007 Microchip Technology Inc.
24AA04/24LC04B
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
Number of Pins
Pitch
N
e
0.50 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
D
0.02
Contact Thickness
Overall Length
Overall Width
0.20 REF
2.00 BSC
3.00 BSC
–
E
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
D2
E2
b
1.30
1.50
0.18
0.30
0.20
1.75
1.90
0.30
0.50
–
–
0.25
L
0.40
K
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS21708G-page 19
24AA04/24LC04B
APPENDIX A: REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Revision D
Added DFN package.
Revision E
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read.
Revision F (01/2007)
Revised Features section; Changed 1.8V to 1.7V in
Tables and text; Revised Ambient Temperature,
Section 1.0; Replaced Package Drawings; Revised
Product ID section.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
DS21708G-page 20
© 2007 Microchip Technology Inc.
24AA04/24LC04B
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
DS21708G-page 21
24AA04/24LC04B
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
24AA04/24LC04B
DS21708G
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21708G-page 22
© 2007 Microchip Technology Inc.
24AA04/24LC04B
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Examples:
Temperature Package
Range
a) 24AA04-I/P: Industrial Temperature,
1.7V, PDIP package
b) 24AA04-I/SN: Industrial Temperature,
1.7V, SOIC package
2
Device:
24AA04:
24AA04T:
=
=
1.7V, 4 Kbit I C Serial EEPROM
2
c)
24AA04T-I/OT: Industrial Temperature,
1.7V, SOT-23 package, tape and reel
1.7V, 4 Kbit I C Serial EEPROM
(Tape and Reel)
2
d) 24LC04B-I/P: Industrial Temperature,
2.5V, PDIP package
24LC04B:
=
2.5V, 4 Kbit I C Serial EEPROM
2
24LC04BT: = 2.5V, 4 Kbit I C Serial EEPROM
(Tape and Reel)
e) 24LC04B-E/SN: Extended Temperature,
2.5V, SOIC package
f)
24LC04BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, tape and reel
Temperature
Range:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
Package:
MC
P
SN
ST
MS
OT
=
2x3 DFN, 8-lead
=
=
=
=
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
Plastic TSSOP (4.4 mm), 8-lead
Plastic Micro Small Outline (MSOP), 8-lead
SOT-23, 5-lead (Tape and Reel only)
© 2007 Microchip Technology Inc.
DS21708G-page23
24AA04/24LC04B
NOTES:
DS21708G-page 24
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21708G-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
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Tel: 49-89-627-144-0
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Tel: 86-10-8528-2100
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Kokomo
Kokomo, IN
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Tel: 86-755-8203-2660
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Tel: 886-7-536-4818
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Tel: 949-462-9523
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Tel: 86-757-2839-5507
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Taiwan - Taipei
Tel: 886-2-2500-6610
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Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
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Thailand - Bangkok
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Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21708G-page 26
© 2007 Microchip Technology Inc.
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