24AA256EP [MICROCHIP]
256K IC CMOS Serial EEPROM; 256K IC的CMOS串行EEPROM型号: | 24AA256EP |
厂家: | MICROCHIP |
描述: | 256K IC CMOS Serial EEPROM |
文件: | 总42页 (文件大小:1254K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
24AA256/24LC256/24FC256
256K I2C™ CMOS Serial EEPROM
• Temperature Ranges:
Device Selection Table
- Industrial (I):
- Automotive (E):
-40C to +85C
-40C to +125C
Part
VCC
Max. Clock
Frequency
Temp.
Ranges
Number
Range
Description:
24AA256
24LC256
24FC256
1.7-5.5V
2.5-5.5V
1.7-5.5V
400 kHz(1)
400 kHz
1 MHz(2)
I, E
I, E
I
The Microchip Technology Inc. 24AA256/24LC256/
24FC256 (24XX256*) is a 32K x 8 (256 Kbit) Serial
Electrically Erasable PROM, capable of operation
across a broad voltage range (1.7V to 5.5V). It has
been developed for advanced, low-power applications
such as personal communications or data acquisition.
This device also has a page write capability of up to 64
bytes of data. This device is capable of both random
and sequential reads up to the 256K boundary.
Functional address lines allow up to eight devices on
the same bus, for up to 2 Mbit address space. This
device is available in the standard 8-pin plastic DIP,
SOIC, TSSOP, MSOP, DFN and TDFN packages. The
24AA256 is also available in the 8-lead Chip Scale
package.
Note 1: 100 kHz for VCC < 2.5V.
2: 400 kHz for VCC < 2.5V.
Features:
• Single Supply with Operation Down to 1.7V for
24AA256 and 24FC256 Devices, 2.5V for
24LC256 Devices
• Low-Power CMOS Technology:
- Active current 400 uA, typical
- Standby current 100 nA, typical
• 2-Wire Serial Interface, I2C™ Compatible
• Cascadable up to Eight Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 5 ms Max.
Block Diagram
A0 A1A2WP
HV Generator
I/O
Control
Logic
• Self-Timed Erase/Write Cycle
Memory
Control
Logic
EEPROM
Array
XDEC
• 64-Byte Page Write Buffer
• Hardware Write-Protect
Page Latches
• ESD Protection >4000V
I/O
• More than One Million Erase/Write Cycles
• Data Retention >200 years
SCL
YDEC
SDA
• Factory Programming Available
• Packages Include 8-lead PDIP, SOIC, DFN,
TDFN, TSSOP and MSOP
VCC
Sense Amp.
R/W Control
VSS
• Pb-Free and RoHS Compliant
Package Types
TSSOP/MSOP(1)
DFN/TDFN
CS (Chip Scale)(2)
VCC A1 A0
PDIP/SOIC
A0
1
8
VCC
1
2
3
4
A0
A1
8
7
6
5
VCC
WP
1
2
8
7
A0
A1
VCC
WP
1
2
3
A1
A2
2
3
4
7
6
5
WP
4
5
WP
A2
A2
SCL
SDA
8
6
7
SCL
SDA
3
4
6
5
A2
SCL
SDA
SDA SCL VSS
VSS
VSS
VSS
(TOP DOWN VIEW,
BALLS NOT VISIBLE)
Note 1: * Pins A0 and A1 are no connects for the MSOP package only.
Note 2: Available in I-temp, “AA” only.
*24XX256 is used in this document as a generic part number for the 24AA256/24LC256/24FC256 devices.
1998-2013 Microchip Technology Inc.
DS20001203T-page 1
24AA256/24LC256/24FC256
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics:
DC CHARACTERISTICS
Industrial (I):
Automotive (E): VCC = +1.7V to 5.5V
VCC = +1.7V to 5.5V
TA = -40°C to +85°C
TA = -40°C to +125°C
Param.
Sym.
No.
Characteristic
Min.
Max.
Units
Conditions
—
A0, A1, A2, SCL, SDA
and WP pins:
—
—
—
—
—
D1
D2
VIH
VIL
High-level input voltage
Low-level input voltage
0.7 VCC
—
—
V
0.3 VCC
0.2 VCC
V
V
VCC 2.5V
VCC < 2.5V
D3
VHYS
Hysteresis of Schmitt
Trigger inputs
0.05 VCC
—
V
VCC 2.5V (Note)
(SDA, SCL pins)
D4
D5
VOL
ILI
Low-level output voltage
Input leakage current
Output leakage current
—
—
0.40
±1
V
IOL = 3.0 ma @ VCC = 4.5V
IOL = 2.1 ma @ VCC = 2.5V
A
VIN = VSS or VCC, WP = VSS
VIN = VSS or VCC, WP = VCC
D6
D7
ILO
—
—
±1
10
A
VOUT = VSS or VCC
CIN,
Pin capacitance
pF
VCC = 5.0V (Note)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D8
D9
ICC Read Operating current
ICC Write
—
—
—
400
3
A
mA
A
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V
ICCS
Standby current
1
TA = -40°C to +85°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS
—
5
A
TA = -40°C to +125°C
SCL = SDA = VCC = 5.5V
A0, A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
DS20001203T-page 2
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
TABLE 1-2:
AC CHARACTERISTICS
Electrical Characteristics:
AC CHARACTERISTICS
Industrial (I):
Automotive (E): VCC = +1.7V to 5.5V
VCC = +1.7V to 5.5V
TA = -40°C to +85°C
TA = -40°C to +125°C
Param.
Sym.
No.
Characteristic
Clock frequency
Min.
Max.
Units
Conditions
1
2
3
4
FCLK
—
—
—
—
100
400
400
kHz 1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
1000
THIGH
TLOW
Clock high time
Clock low time
4000
600
600
500
—
—
—
—
ns
ns
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
4700
1300
1300
500
—
—
—
—
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
TR
TF
SDA and SCL rise time
(Note 1)
—
—
—
1000
300
300
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC256
5
6
SDA and SCL fall time
(Note 1)
—
—
300
100
ns
ns
All except, 24FC256
1.7V VCC 5.5V 24FC256
THD:STA Start condition hold time
4000
600
600
250
—
—
—
—
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
7
TSU:STA Start condition setup time
4700
600
600
250
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
8
9
THD:DAT Data input hold time
TSU:DAT Data input setup time
0
—
ns
ns
(Note 2)
250
100
100
—
—
—
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC256
10
TSU:STO Stop condition setup time
4000
600
600
250
—
—
—
—
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
11
12
TSU:WP WP setup time
THD:WP WP hold time
4000
600
600
—
—
—
ns
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC256
4700
1300
1300
—
—
—
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 5.5V 24FC256
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site
at www.microchip.com.
1998-2013 Microchip Technology Inc.
DS20001203T-page 3
24AA256/24LC256/24FC256
Electrical Characteristics:
AC CHARACTERISTICS (Continued)
Industrial (I):
Automotive (E): VCC = +1.7V to 5.5V
VCC = +1.7V to 5.5V
TA = -40°C to +85°C
TA = -40°C to +125°C
Param.
Sym.
Characteristic
Min.
Max.
Units
Conditions
No.
13
TAA
Output valid from clock
(Note 2)
—
—
—
—
3500
900
900
400
ns
1.7 V VCC 2.5V
2.5 V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5 V VCC 5.5V 24FC256
14
15
TBUF
TOF
Bus free time: Time the bus
must be free before a new
transmission can start
4700
1300
1300
500
—
—
—
—
ns
ns
1.7V VCC 2.5V
2.5V VCC 5.5V
1.7V VCC 2.5V 24FC256
2.5V VCC 5.5V 24FC256
Output fall time from VIH
minimum to VIL maximum
CB 100 pF
10 + 0.1CB
250
250
All except, 24FC256 (Note 1)
16
17
18
TSP
TWC
—
Input filter spike suppression
(SDA and SCL pins)
—
—
50
5
ns
All except, 24FC256 (Notes 1
and 3)
Write cycle time (byte or
page)
ms
—
Endurance
1,000,000
—
cycles Page mode, 25°C, 5.5V (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which can be obtained from Microchip’s web site
at www.microchip.com.
FIGURE 1-1:
BUS TIMING DATA
5
4
D3
2
SCL
7
3
10
8
9
SDA
IN
6
16
14
12
13
SDA
OUT
(protected)
WP
11
(unprotected)
DS20001203T-page 4
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Name
PIN FUNCTION TABLE
8-pin
PDIP
8-pin
SOIC
8-pin
TSSOP
8-pin
MSOP
8-pin
DFN/TDFN
CS
Function
A0
1
2
1
2
1
2
—
—
1, 2
3
1
2
3
2
User Configurable Chip Select
User Configurable Chip Select
Not Connected
A1
(NC)
A2
—
3
—
3
—
3
—
3
—
5
User Configurable Chip Select
Ground
VSS
SDA
SCL
(NC)
WP
VCC
4
4
4
4
4
8
5
5
5
5
5
6
Serial Data
6
6
6
6
6
7
Serial Clock
—
7
—
7
—
7
—
7
—
7
—
4
Not Connected
Write-Protect Input
8
8
8
8
8
1
+1.7V to 5.5V (24AA256)
+2.5V to 5.5V (24LC256)
+1.7V to 5.5V (24FC256)
Note:
Exposed pad on DFN/TDFN can be connected to VSS or left floating.
2.1
A0, A1, A2 Chip Address Inputs
2.3
Serial Clock (SCL)
The A0, A1 and A2 inputs are used by the 24XX256 for
multiple device operations. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the compare is true.
This input is used to synchronize the data transfer to
and from the device.
2.4
Write-Protect (WP)
For the MSOP package only, pins A0 and A1 are not
connected.
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited but read operations are
not affected.
Up to eight devices (two for the MSOP package) may
be connected to the same bus by using different Chip
Select bit combinations. These inputs must be
connected to either VCC or VSS.
3.0
FUNCTIONAL DESCRIPTION
In most applications, the chip address inputs A0, A1
and A2 are hard-wired to logic ‘0’ or logic ‘1’. For
applications in which these pins are controlled by a
microcontroller or other programmable device, the chip
address pins must be driven to logic ‘0’ or logic ‘1’
before normal device operation can proceed.
The 24XX256 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter and a device
receiving data as a receiver. The bus must be
controlled by a master device which generates the
Serial Clock (SCL), controls the bus access, and
generates the Start and Stop conditions while the
24XX256 works as a slave. Both master and slave can
operate as a transmitter or receiver, but the master
device determines which mode is activated.
2.2
Serial Data (SDA)
This is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open drain
terminal. Therefore, the SDA bus requires a pull-up
resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz and 1 MHz).
For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
1998-2013 Microchip Technology Inc.
DS20001203T-page 5
24AA256/24LC256/24FC256
4.4
Data Valid (D)
4.0
BUS CHARACTERISTICS
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line, while the clock line is high, will be
interpreted as a Start or Stop condition.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Bus Not Busy (A)
4.5
Acknowledge
Both data and clock lines remain high.
Each receiving device, when addressed, is obliged to
generate an Acknowledge signal after the reception of
each byte. The master device must generate an extra
clock pulse which is associated with this Acknowledge
bit.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high, determines a Start condition. All
commands must be preceded by a Start condition.
Note:
The 24XX256 does not generate any
Acknowledge bits if an internal
programming cycle is in progress.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line, while the clock
(SCL) is high, determines a Stop condition. All
operations must end with a Stop condition.
A device that acknowledges must pull down the SDA
line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge related clock pulse. Of course, setup
and hold times must be taken into account. During
reads, a master must signal an end of data to the slave
by NOT generating an Acknowledge bit on the last byte
that has been clocked out of the slave. In this case, the
slave (24XX256) will leave the data line high to enable
the master to generate the Stop condition.
DS20001203T-page 6
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point,
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
Receiver must release the SDA line
at this point so the Transmitter can
continue sending data.
1998-2013 Microchip Technology Inc.
DS20001203T-page 7
24AA256/24LC256/24FC256
FIGURE 5-1:
CONTROL BYTE
FORMAT
5.0
DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a 4-bit control code. For the
24XX256, this is set as ‘1010’ binary for read and
write operations. The next three bits of the control byte
are the Chip Select bits (A2, A1, A0). The Chip Select
bits allow the use of up to eight 24XX256 devices on
the same bus and are used to select which device is
accessed. The Chip Select bits in the control byte must
correspond to the logic levels on the corresponding A2,
A1 and A0 pins for the device to respond. These bits
are, in effect, the three Most Significant bits of the word
address.
Read/Write Bit
Chip Select
Bits
Control Code
S
1
0
0
A2 A1 A0 R/W ACK
1
Slave Address
Start Bit
Acknowledge Bit
For the MSOP package, the A0 and A1 pins are not
connected. During device addressing, the A0 and A1
Chip Select bits (Figures 5-1 and 5-2) should be set to
‘0’. Only two 24XX256 MSOP packages can be
connected to the same bus.
5.1
Contiguous Addressing Across
Multiple Devices
The Chip Select bits A2, A1 and A0 can be used to
expand the contiguous address space for up to 2 Mbit
by adding up to eight 24XX256 devices on the same
bus. In this case, software can use A0 of the control
byte as address bit A15; A1 as address bit A16; and A2
as address bit A17. It is not possible to sequentially
read across device boundaries.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected. When set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). Because
only A14…A0 are used, the upper address bits are a
“don’t care.” The upper address bits are transferred
first, followed by the Less Significant bits.
For the MSOP package, up to two 24XX256 devices
can be added for up to 512 Kbit of address space. In
this case, software can use A2 of the control byte as
address bit A17. Bits A0 (A15) and A1 (A16) of the
control byte must always be set to a logic ‘0’ for the
MSOP.
Following the Start condition, the 24XX256 monitors
the SDA bus checking the device type identifier being
transmitted. Upon receiving a ‘1010’ code and
appropriate device select bits, the slave device outputs
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX256 will select a read
or write operation.
FIGURE 5-2:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Control Byte
Address High Byte
Address Low Byte
A
A
A
A
2
A
1
A
0
A
A
A
9
A
8
A
7
A
0
•
•
•
•
•
•
1
0
1
0
R/W
x
12 11 10
14 13
Control
Code
Chip
Select
Bits
x = “don’t care” bit
DS20001203T-page 8
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
6.3
Write Protection
6.0
6.1
WRITE OPERATIONS
Byte Write
The WP pin allows the user to write-protect the entire
array (0000-7FFF) when the pin is tied to VCC. If tied to
VSS the write protection is disabled. The WP pin is
sampled at the Stop bit for every Write command
(Figure 1-1). Toggling the WP pin after the Stop bit will
have no effect on the execution of the write cycle.
Following the Start condition from the master, the
control code (four bits), the Chip Select (three bits) and
the R/W bit (which is a logic low) are clocked onto the
bus by the master transmitter. This indicates to the
addressed slave receiver that the address high byte will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte
transmitted by the master is the high-order byte of the
word address and will be written into the Address
Pointer of the 24XX256. The next byte is the Least
Significant Address Byte. After receiving another
Acknowledge signal from the 24XX256, the master
device will transmit the data word to be written into the
addressed memory location. The 24XX256 acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle and
during this time, the 24XX256 will not generate
Acknowledge signals (Figure 6-1). If an attempt is
made to write to the array with the WP pin held high, the
device will acknowledge the command but no write
cycle will occur, no data will be written, and the device
will immediately accept a new command. After a byte
Write command, the internal address counter will point
to the address location following the one that was just
written.
Note:
Page write operations are limited to
writing bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size
(or ‘page size’) and end at addresses that
are integer multiples of [page size – 1]. If
a Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is, therefore, necessary for
the application software to prevent page
write operations that would attempt to
cross a page boundary.
Note:
When doing a write of less than 64 bytes
the data in the rest of the page is
refreshed along with the data bytes being
written. This will force the entire page to
endure a write cycle, for this reason
endurance is specified per page.
6.2
Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX256 in much the same
way as in a byte write. The exception is that instead of
generating a Stop condition, the master transmits up to
63 additional bytes, which are temporarily stored in the
on-chip page buffer, and will be written into memory
once the master has transmitted a Stop condition.
Upon receipt of each word, the six lower Address
Pointer bits are internally incremented by one. If the
master should transmit more than 64 bytes prior to
generating the Stop condition, the address counter will
roll over and the previously received data will be over-
written. As with the byte write operation, once the Stop
condition is received, an internal write cycle will begin
(Figure 6-2). If an attempt is made to write to the array
with the WP pin held high, the device will acknowledge
the command, but no write cycle will occur, no data will
be written and the device will immediately accept a new
command.
1998-2013 Microchip Technology Inc.
DS20001203T-page 9
24AA256/24LC256/24FC256
FIGURE 6-1:
BYTE WRITE
S
T
A
R
T
Bus Activity
Master
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
Data
SDA Line
A A A
x
S 1 0 1 0
0
P
2 1 0
Bus Activity
A
C
K
A
C
K
A
C
K
A
C
K
x = “don’t care” bit
FIGURE 6-2:
PAGE WRITE
S
T
A
R
T
Bus Activity
Master
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
Data Byte 0
Data Byte 63
SDA Line
A A A
x
P
S 1 0 1 0
0
2 1 0
Bus Activity
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
x = “don’t care” bit
DS20001203T-page 10
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (This feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition, followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, the Start bit and control byte must
be resent. If the cycle is complete, then the device will
return the ACK and the master can then proceed with
the next Read or Write command. See Figure 7-1 for
flow diagram.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
NO
Did Device
Acknowledge
(ACK = 0)?
YES
Next
Operation
1998-2013 Microchip Technology Inc.
DS20001203T-page 11
24AA256/24LC256/24FC256
8.2
Random Read
8.0
READ OPERATION
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
24XX256 as part of a write operation (R/W bit set to
‘0’). Once the word address is sent, the master gener-
ates a Start condition following the acknowledge. This
terminates the write operation, but not before the
internal Address Pointer is set. The master then issues
the control byte again, but with the R/W bit set to a one.
The 24XX256 will then issue an acknowledge and
transmit the 8-bit data word. The master will not
acknowledge the transfer, though it does generate a
Stop condition, which causes the 24XX256 to discon-
tinue transmission (Figure 8-2). After a random Read
command, the internal address counter will point to the
address location following the one that was just read.
Read operations are initiated in much the same way as
write operations, with the exception that the R/W bit of
the control byte is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX256 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by ‘1’. Therefore, if the previous read
access was to address ‘n’ (n is any legal address), the
next current address read operation would access data
from address n + 1.
Upon receipt of the control byte with R/W bit set to ‘1’,
the 24XX256 issues an acknowledge and transmits the
8-bit data word. The master will not acknowledge the
transfer, but does generate a Stop condition and the
24XX256 discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24XX256 transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX256 to
transmit the next sequentially addressed 8-bit word
(Figure 8-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge,
but will generate a Stop condition. To provide sequen-
tial reads, the 24XX256 contains an internal Address
Pointer which is incremented by one at the completion
of each operation. This Address Pointer allows the
entire memory contents to be serially read during one
operation. The internal Address Pointer will
automatically roll over from address 7FFF to address
0000 if the master acknowledges the byte received
from the array address 7FFF.
FIGURE 8-1:
CURRENT ADDRESS
READ
S
T
A
R
T
S
T
O
P
Bus Activity
Master
Control
Byte
Data
Byte
A A A
2 1 0
SDA Line
S 1 0 1 0
1
P
A
C
K
N
O
Bus Activity
A
C
K
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
Bus Activity
Master
T
A
R
T
S
T
O
P
Control
Byte
Address
High Byte
Address
Low Byte
Control
Byte
Data
Byte
A A A
2 1 0
A A A
2 1 0
SDA Line
x
S 1 0 1 0
0
S 1 0 1 0
1
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
Bus Activity
x = “don’t care” bit
DS20001203T-page 12
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
Control
Byte
Bus Activity
Master
Data (n)
Data (n + 1)
Data (n + x)
Data (n + 2)
P
SDA Line
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
Bus Activity
1998-2013 Microchip Technology Inc.
DS20001203T-page 13
24AA256/24LC256/24FC256
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24AA256
I/P 017
XXXXXXXX
T/XXXNNN
YYWW
e
3
0510
8-Lead SOIC (150 mil)
Example:
24LC256I
XXXXXXXT
e
3
XXXXYYWW
SN
0510
NNN
017
8-Lead SOIC (208 mil)
Example:
24LC256
XXXXXXXX
T/XXXXXX
YYWWNNN
e
3
I/SM
0510017
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
YY
WW
NNN
e
3
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
*Standard device marking consists of Microchip part number, year code, week code, and traceability code. For
device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
DS20001203T-page 14
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Package Marking Information (Continued)
Example:
8-Lead TSSOP
XXXX
4LD
I510
TYWW
NNN
017
8-Lead MSOP
Example:
XXXXXT
4L256I
510017
YWWNNN
8-Lead DFN-S
Example:
24LC256
XXXXXXX
T/XXXXX
YYWW
e
3
I/MF
0510
017
NNN
8-Lead TDFN
Example:
EF4
0510
017
XXX
YWW
NN
Example:
8-Lead Chip Scale
249
A051
0017
XXX
XYYW
WNNN
First Line Marking Codes
TSSOP Package Codes MSOP Package Codes
Part No.
24AA256
24LC256
24FC256
TDFN Package Codes
4AD
4LD
4FD
4A256T
4L256T
4F256T
—
EF4
—
1998-2013 Microchip Technology Inc.
DS20001203T-page 15
24AA256/24LC256/24FC256
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆꢓꢆꢔꢕꢕꢆꢖꢋꢈꢆꢗꢘꢅꢙꢆꢚꢇꢍꢏꢇꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
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N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢯꢄꢃꢏꢇ
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ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢁꢀꢣꢣꢅꢩꢛꢝ
ꢷ
ꢁꢀꢞꢣ
ꢷ
ꢁꢞꢀꢣ
ꢁꢙꢨꢣ
ꢁꢞꢺꢨ
ꢁꢀꢞꢣ
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ꢷ
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ꢂꢃꢏꢖꢘ
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ꢩꢉꢇꢌꢅꢏꢕꢅꢛꢌꢉꢏꢃꢄꢜꢅꢂꢊꢉꢄꢌ
ꢛꢘꢕꢈꢊꢋꢌꢐꢅꢏꢕꢅꢛꢘꢕꢈꢊꢋꢌꢐꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢱ
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ꢠꢀ
ꢟ
ꢳ
ꢖ
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ꢯꢡꢡꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢕꢗꢌꢐꢅꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢼꢕꢗꢅꢛꢡꢉꢖꢃꢄꢜꢅꢅꢚ
ꢜꢘꢊꢃꢉꢝ
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ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢀꢶꢩ
DS20001203T-page 16
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 17
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 18
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢖꢄꢈꢈꢆꢟꢎꢊꢈꢋꢐꢃꢆꢑꢞꢜꢒꢆꢓꢆꢜꢄꢠꢠꢘꢡꢢꢆꢔꢣꢤꢕꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢞꢟꢏꢥꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
1998-2013 Microchip Technology Inc.
DS20001203T-page 19
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 20
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 21
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 22
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
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D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
ꢯꢄꢃꢏꢇ
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ꢌ
ꢶ
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ꢷ
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ꢷ
ꢀꢁꢣꢣ
ꢷ
ꢀꢁꢙꢣ
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ꢣꢁꢀꢨ
ꢦꢙ
ꢦꢀ
ꢠ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢺꢁꢥꢣꢅꢩꢛꢝ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢹꢃꢋꢏꢘ
ꢢꢕꢊꢋꢌꢋꢅꢂꢉꢖꢭꢉꢜꢌꢅꢳꢌꢄꢜꢏꢘ
ꢬꢕꢕꢏꢅꢳꢌꢄꢜꢏꢘ
ꢠꢀ
ꢟ
ꢳ
ꢥꢁꢞꢣ
ꢙꢁꢸꢣ
ꢣꢁꢥꢨ
ꢥꢁꢥꢣ
ꢞꢁꢣꢣ
ꢣꢁꢺꢣ
ꢥꢁꢨꢣ
ꢞꢁꢀꢣ
ꢣꢁꢻꢨ
ꢬꢕꢕꢏꢡꢐꢃꢄꢏ
ꢬꢕꢕꢏꢅꢦꢄꢜꢊꢌ
ꢳꢌꢉꢋꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢳꢌꢉꢋꢅꢹꢃꢋꢏꢘ
ꢳꢀ
ꢀ
ꢀꢁꢣꢣꢅꢼꢠꢬ
ꢣꢾ
ꢣꢁꢣꢸ
ꢣꢁꢀꢸ
ꢷ
ꢷ
ꢷ
ꢶꢾ
ꢖ
ꢔ
ꢣꢁꢙꢣ
ꢣꢁꢞꢣ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢇꢅꢟꢅꢉꢄꢋꢅꢠꢀꢅꢋꢕꢅꢄꢕꢏꢅꢃꢄꢖꢊꢈꢋꢌꢅꢑꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢁꢅꢢꢕꢊꢋꢅꢎꢊꢉꢇꢘꢅꢕꢐꢅꢡꢐꢕꢏꢐꢈꢇꢃꢕꢄꢇꢅꢇꢘꢉꢊꢊꢅꢄꢕꢏꢅꢌꢍꢖꢌꢌꢋꢅꢣꢁꢀꢨꢅꢑꢑꢅꢡꢌꢐꢅꢇꢃꢋꢌꢁ
ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢣꢶꢺꢩ
1998-2013 Microchip Technology Inc.
DS20001203T-page 23
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 24
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 25
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 26
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 27
24AA256/24LC256/24FC256
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢪꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢬꢪꢒꢆꢓꢆꢭꢮꢯꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢍꢪꢜꢁꢞꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
ꢅ
e
D
L
b
N
N
K
E
E2
EXPOSED PAD
NOTE 1
NOTE 1
1
2
1
2
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
ꢯꢄꢃꢏꢇ
ꢢꢰꢳꢳꢰꢢꢠꢫꢠꢼꢛ
ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢅꢳꢃꢑꢃꢏꢇ
ꢢꢰꢱ
ꢱꢴꢢ
ꢶ
ꢀꢁꢙꢻꢅꢩꢛꢝ
ꢣꢁꢶꢨ
ꢢꢦꢵ
ꢱꢈꢑꢔꢌꢐꢅꢕꢎꢅꢂꢃꢄꢇ
ꢂꢃꢏꢖꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢲꢌꢃꢜꢘꢏ
ꢛꢏꢉꢄꢋꢕꢎꢎꢅ
ꢝꢕꢄꢏꢉꢖꢏꢅꢫꢘꢃꢖꢭꢄꢌꢇꢇ
ꢴꢆꢌꢐꢉꢊꢊꢅꢳꢌꢄꢜꢏꢘ
ꢴꢆꢌꢐꢉꢊꢊꢅꢹꢃꢋꢏꢘ
ꢱ
ꢌ
ꢦ
ꢦꢀ
ꢦꢞ
ꢟ
ꢣꢁꢶꢣ
ꢣꢁꢣꢣ
ꢀꢁꢣꢣ
ꢣꢁꢣꢨ
ꢣꢁꢣꢀ
ꢣꢁꢙꢣꢅꢼꢠꢬ
ꢨꢁꢣꢣꢅꢩꢛꢝ
ꢺꢁꢣꢣꢅꢩꢛꢝ
ꢥꢁꢣꢣ
ꢙꢁꢞꢣ
ꢣꢁꢥꢣ
ꢠ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢳꢌꢄꢜꢏꢘ
ꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢹꢃꢋꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢅꢳꢌꢄꢜꢏꢘ
ꢝꢕꢄꢏꢉꢖꢏꢽꢏꢕꢽꢠꢍꢡꢕꢇꢌꢋꢅꢂꢉꢋ
ꢟꢙ
ꢠꢙ
ꢔ
ꢳ
U
ꢞꢁꢸꢣ
ꢙꢁꢙꢣ
ꢣꢁꢞꢨ
ꢣꢁꢨꢣ
ꢣꢁꢙꢣ
ꢥꢁꢀꢣ
ꢙꢁꢥꢣ
ꢣꢁꢥꢶ
ꢣꢁꢻꢨ
ꢷ
ꢣꢁꢺꢣ
ꢷ
ꢜꢘꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢀꢅꢆꢃꢇꢈꢉꢊꢅꢃꢄꢋꢌꢍꢅꢎꢌꢉꢏꢈꢐꢌꢅꢑꢉꢒꢅꢆꢉꢐꢒꢓꢅꢔꢈꢏꢅꢑꢈꢇꢏꢅꢔꢌꢅꢊꢕꢖꢉꢏꢌꢋꢅꢗꢃꢏꢘꢃꢄꢅꢏꢘꢌꢅꢘꢉꢏꢖꢘꢌꢋꢅꢉꢐꢌꢉꢁ
ꢙꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢡꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ
ꢞꢁ ꢂꢉꢖꢭꢉꢜꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢜꢈꢊꢉꢏꢌꢋꢁ
ꢥꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢜꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢜꢅꢡꢌꢐꢅꢦꢛꢢꢠꢅꢧꢀꢥꢁꢨꢢꢁ
ꢩꢛꢝꢪ ꢩꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢫꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ
ꢼꢠꢬꢪ ꢼꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢡꢈꢐꢡꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ
ꢢꢃꢖꢐꢕꢖꢘꢃꢡ ꢫꢌꢖꢘꢄꢕꢊꢕꢜꢒ ꢟꢐꢉꢗꢃꢄꢜ ꢝꢣꢥꢽꢀꢙꢙꢩ
DS20001203T-page 28
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
1998-2013 Microchip Technology Inc.
DS20001203T-page 29
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 30
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 31
24AA256/24LC256/24FC256
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢪꢈꢄꢊꢢꢆꢜꢘꢆꢂꢃꢄꢅꢆꢇꢄꢌꢨꢄꢫꢃꢆꢑꢬꢜꢒꢆꢓꢆꢰꢮꢔꢮꢕꢣꢱꢯꢆꢖꢖꢆꢗꢘꢅꢙꢆꢚꢦꢍꢪꢜꢛ
ꢜꢘꢊꢃꢝ ꢬꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢡꢉꢖꢭꢉꢜꢌꢅꢋꢐꢉꢗꢃꢄꢜꢇꢓꢅꢡꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢡꢅꢂꢉꢖꢭꢉꢜꢃꢄꢜꢅꢛꢡꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ
ꢘꢏꢏꢡꢪꢮꢮꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢡꢁꢖꢕꢑꢮꢡꢉꢖꢭꢉꢜꢃꢄꢜ
DS20001203T-page 32
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 33
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001203T-page 34
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1998-2013 Microchip Technology Inc.
DS20001203T-page 35
24AA256/24LC256/24FC256
APPENDIX A: REVISION HISTORY
Revision L
Corrections to Section 1.0, Electrical Characteristics.
Revision M
Added 1.8V 400 kHz option for 24FC256.
Revision N
Revised Sections 2.1 and 2.4. Removed 14-Lead
TSSOP Package.
Revision P
Revised Features; Changed 1.8V voltage to 1.7V;
Replaced Package Drawings; Revised markings (8-lead
SOIC); Revised Product ID System.
Revision Q (05/10)
Revised Table 1-1, Table 1-2, Section 6.1; Updated
Package Drawings.
Revision R (07/2011)
Added Chip Scale package.
Revision S (12/2012)
Revise Automotive E temp.
Revision T (04/2013)
Added TDFN Package.
DS20001203T-page 36
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
1998-2013 Microchip Technology Inc.
D20001203T-page 37
24AA256/24LC256/24FC256
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
RE:
Technical Publications Manager
Reader Response
Total Pages Sent ________
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Literature Number: D20001203T
Application (optional):
Would you like a reply?
Y
N
Device: 24AA256/24LC256/24FC256
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
D20001203T-page 38
1998-2013 Microchip Technology Inc.
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a) 24AA256-I/P:
Industrial Temp.,
Temperature
Range
Package
1.7V, PDIP package.
b) 24AA256T-I/SN: Tape and Reel,
Industrial Temp., 1.7V, SOIC
package.
Device:
24AA256:
256 Kbit 1.7V I2C Serial
EEPROM
c) 24AA256-I/ST:
Industrial Temp.,
24AA256T: 256 Kbit 1.7V I2C Serial
EEPROM Tape and Reel)
24LC256:
1.7V, TSSOP package.
256 Kbit 2.5V I2C Serial
EEPROM
d) 24AA256-I/MS: Industrial Temp.,
1.7V, MSOP package.
24LC256T: 256 Kbit 2.5V I2C Serial
EEPROM Tape and Reel)
24FC256:
e) 24LC256-E/P:
Extended Temp.,
2.5V, PDIP package.
256 Kbit High Speed I2C Serial
EEPROM
f) 24LC256-I/SN: Industrial Temp.,
2.5V, SOIC package.
24FC256T: 256 Kbit High Speed I2C Serial
EEPROM Tape and Reel)
g) 24LC256T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
Temperature
Range:
I
E
=
=
-40C to +85C
-40C to +125C
h) 24LC256-I/MS: Industrial Temp,
2.5V, MSOP package.
i) 24FC256-I/P:
Industrial Temp,
Package:
P
= Plastic DIP (300 mil body), 8-lead
1.7V, High Speed, PDIP package.
SN = Plastic SOIC (3.90 mm body), 8-lead
SM = Plastic SOIJ (5.28 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MF = Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
j) 24FC256-I/SN: Industrial Temp,
1.7V, High Speed, SOIC package.
k) 24FC256T-I/SN: Tape and Reel,
Industrial Temp, 1.7V, High Speed,
SOIC package.
MS = Plastic Micro Small Outline (MSOP),
8-lead
l) 24AA256T-CS16K: Industrial Temp,
1.7V, CS package, Tape and Reel.
MNY(2)=Dual, Flat, No Lead (TDFN) (2x3 mm
body), 8-lead
m) 24AA256T-E/SN: Tape and Reel,
Extended Temp., 1.7V, SOIC
package.
CS16K(1) = Chip Scale (CS), 8-lead (I-temp,
“AA”, Tape and Reel only)
Note 1: “16K” indicates 160K technology.
2: “Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
1998-2013 Microchip Technology Inc.
DS20001203T-page 39
24AA256/24LC256/24FC256
NOTES:
DS20001203T-page 40
1998-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 1998-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620771426
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
1998-2013 Microchip Technology Inc.
DS20001203T-page 41
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS20001203T-page 42
1998-2013 Microchip Technology Inc.
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