24AA32AX-I/SM中文资料_数据手册_规格书

24AA32A/24LC32A

32K I²C^™Serial EEPROM

Device Selection Table

Description

The Microchip Technology Inc. 24AA32A/24LC32A

Part

VCC

Max Clock

Temp

(24XX32A*) is a 32 Kbit Electrically Erasable PROM.

The device is organized as four blocks of 8K x 8-bit

memory with a 2-wire serial interface. Low-voltage

design permits operation down to 1.8V, with standby

and active currents of only 1 µA and 1 mA,

respectively. It has been developed for advanced, low-

power applications such as personal communications

or data acquisition. The 24XX32A also has a page write

capability for up to 32 bytes of data. Functional address

lines allow up to eight devices on the same bus, for up

to 256 Kbits address space. The 24XX32A is available

in the standard 8-pin PDIP, surface mount SOIC,

TSSOP and MSOP packages.

Number

Range

Frequency

Ranges

24AA32A

24LC32A

1.8-5.5

2.5-5.5

400 kHz⁽¹⁾

400 kHz

I

I, E

Note 1: 100 kHz for VCC <2.5V

Features

• Single supply with operation down to 1.8V

• Low-power CMOS technology

- 1 mA active current typical

- 1 µA standby current (max.) (I-temp)

• Organized as 4 blocks of 8K bits (32K bit)

• 2-wire serial interface bus, I²C™ compatible

• Cascadable for up to eight devices

Package Types

ROTATED TSSOP

(24AA32AX/24LC32AX)

PDIP/SOIC/TSSOP/MSOP

• Schmitt Trigger inputs for noise suppression

• Output slope control to eliminate ground bounce

A0 1

A1 2

A2 3

Vss 4

8 Vcc

7 WP

6 SCL

5 SDA

8

7

6

5

1

2

3

4

WP

Vcc

A0

SCL

SDA

Vss

A2

• 100 kHz (<2.5V) and 400 kHz (≥2.5V)

compatibility

A1

• Self-timed write cycle (including auto-erase)

• Page write buffer for up to 32 bytes

• 2 ms typical write cycle time for page write

• Hardware write-protect for entire memory

• Can be operated as a serial ROM

• Factory programming (QTP) available

• ESD protection > 4,000V

Block Diagram

A0

WP

A1 A2

HV Generator

• 1,000,000 erase/write cycles

I/O

Control

Logic

Memory

Control

Logic

• Data retention > 200 years

EEPROM

XDEC

Array

• 8-lead PDIP, SOIC, TSSOP and MSOP packages

• Standard and Pb-free finishes available

• Available temperature ranges:

Page Latches

I/O

- Industrial (I): -40°C to +85°C

SCL

YDEC

- Automotive (E): -40°C to +125°C

SDA

Vcc

Sense Amp.

R/W Control

VSS

*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.

 2003 Microchip Technology Inc.

DS21713D-page 1

24AA32A/24LC32A

1.0

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

VCC.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied................................................................................................-65°C to +125°C

ESD protection on all pins ......................................................................................................................................................≥ 4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to

the device. This is a stress rating only and functional operation of the device at those or any other conditions

above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

TABLE 1-1:

DC CHARACTERISTICS

VCC = +1.8V to +5.5V

DC CHARACTERISTICS

Industrial (I):

TA = -40°C to +85°C

Automotive (E): TA = -40°C to +125°C

Param.

Symbol

No.

Characteristic

Min

Typ

Max

Units

Conditions

D1

D2

D3

D4

VIH

—

WP, SCL and SDA pins

High-level input voltage

Low-level input voltage

—

V

—

0.7 VCC

—

VIL

0.3 VCC

—

V

—

VHYS

Hysteresis of Schmitt

Trigger inputs

0.05 VCC

V

(Note 1)

D5

D6

D7

D8

VOL

ILI

Low-level output voltage

Input leakage current

Output leakage current

—

0.40

±1

V

IOL = 3.0 mA, VCC = 2.5V

VIN =.1V to VCC

µA

pF

ILO

±1

VOUT =.1V to VCC

CIN,

Pin capacitance

10

VCC = 5.0V (Note 1)

COUT

(all inputs/outputs)

TA = 25°C, FCLK = 1 MHz

D9

ICC write Operating current

—

0.1

3

1

mA

VCC = 5.5V, SCL = 400 kHz

—

D10

D11

ICC read

0.05

ICCS

Standby current

—

0.01

—

1

5

µA

Industrial

Automotive

SDA = SCL = VCC

WP = VSS

Note 1: This parameter is periodically sampled and not 100% tested.

2: Typical measurements taken at room temperature.

DS21713D-page 2

 2003 Microchip Technology Inc.

24AA32A/24LC32A

TABLE 1-2:

AC CHARACTERISTICS

VCC = +1.8V to +5.5V

AC CHARACTERISTICS

Industrial (I):

Automotive (E):

TA = -40°C to +85°C

TA = -40°C to +125°C

Param.

Symbol

No.

Characteristic

Clock frequency

Min

Max

Units

Conditions

1

2

3

4

FCLK

THIGH

TLOW

TR

—

400

100

kHz

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

Clock high time

Clock low time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

1300

4700

—

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

SDA and SCL rise time

(Note 1)

—

300

1000

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

5

6

TF

SDA and SCL fall time

—

300

ns

(Note 1)

THD:STA Start condition hold time

600

4000

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

7

TSU:STA Start condition setup time

600

4700

—

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

8

9

THD:DAT Data input hold time

TSU:DAT Data input setup time

0

—

ns

(Note 2)

100

250

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

10

11

12

TSU:STO Stop condition setup time

600

4000

—

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

TAA

Output valid from clock

—

900

3500

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

(Note 2)

TBUF

Bus free time: Time the bus

must be free before a new

transmission can start

1300

4700

—

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

13

14

15

16

TOF

TSP

TWC

—

Output fall time from VIH

minimum to VIL maximum

20+0.1CB

—

250

ns

2.5V ≤ VCC ≤ 5.5V

1.8V ≤ VCC < 2.5V (24AA32A)

Input filter spike suppression

(SDA and SCL pins)

—

50

(Notes 1 and 3)

Write cycle time (byte or

page)

—

5

ms

—

Endurance

1M

—

cycles 25°C, (Note 4)

Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.

2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region

(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a TI specification for standard operation.

4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific

application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site:

www.microchip.com.

 2003 Microchip Technology Inc.

DS21713D-page 3

24AA32A/24LC32A

FIGURE 1-1:

BUS TIMING DATA

5

4

2

3

SCL

7

8

9

10

6

SDA

IN

14

12

11

SDA

OUT

FIGURE 1-2:

BUS TIMING START/STOP

D4

SCL

SDA

6

7

10

Start

Stop

DS21713D-page 4

 2003 Microchip Technology Inc.

24AA32A/24LC32A

3.4

Data Valid (D)

2.0

FUNCTIONAL DESCRIPTION

The state of the data line represents valid data when,

after a Start condition, the data line is stable for the

duration of the high period of the clock signal.

The 24XX32A supports a bidirectional, 2-wire bus and

data transmission protocol. A device that sends data

onto the bus is defined as transmitter, while a device

receiving data is defined as a receiver. The bus has to

be controlled by a master device which generates the

serial clock (SCL), controls the bus access and gener-

ates the Start and Stop conditions, while the 24XX32A

works as slave. Both master and slave can operate as

transmitter or receiver, but the master device deter-

mines which mode is activated.

The data on the line must be changed during the low

period of the clock signal. There is one clock pulse per

bit of data.

Each data transfer is initiated with a Start condition and

terminated with a Stop condition. The number of data

bytes transferred between Start and Stop conditions is

determined by the master device and is, theoretically

unlimited, (although only the last thirty two bytes will be

stored when doing a write operation). When an over-

write does occur it will replace data in a first-in first-out

(FIFO) fashion.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

• Data transfer may be initiated only when the bus

is not busy.

3.5

Acknowledge

• During data transfer, the data line must remain

stable whenever the clock line is high. Changes in

the data line while the clock line is high will be

interpreted as a Start or Stop condition.

Each receiving device, when addressed, is obliged to

generate an acknowledge after the reception of each

byte. The master device must generate an extra clock

pulse which is associated with this Acknowledge bit.

Accordingly, the following bus conditions have been

defined (Figure 3-1).

Note: The 24XX32A does not generate any

Acknowledge

bits

if

an

internal

programming cycle is in progress.

3.1

Bus not Busy (A)

The device that acknowledges, has to pull down the

SDA line during the Acknowledge clock pulse in such a

way that the SDA line is stable low during the high

period of the acknowledge related clock pulse. Of

course, setup and hold times must be taken into

account. During reads, a master must signal an end of

data to the slave by not generating an Acknowledge bit

on the last byte that has been clocked out of the slave.

In this case, the slave (24XX32A) will leave the data

line high to enable the master to generate the Stop

condition.

Both data and clock lines remain high.

3.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock

(SCL) is high determines a Start condition. All com-

mands must be preceded by a Start condition.

3.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock

(SCL) is high determines a Stop condition. All opera-

tions must be ended with a Stop condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

(A)

(B)

(D)

(C) (A)

SCL

SDA

START

CONDITION

STOP

CONDITION

ADDRESS OR

ACKNOWLEDGE ALLOWED

VALID TO CHANGE

DATA

 2003 Microchip Technology Inc.

DS21713D-page 5

24AA32A/24LC32A

FIGURE 3-2:

CONTROL BYTE FORMAT

3.6

Device Addressing

Read/Write Bit

A control byte is the first byte received following the

Start condition from the master device (Figure 3-2).

The control byte consists of a four-bit control code. For

the 24XX32A, this is set as ‘1010’ binary for read and

write operations. The next three bits of the control byte

are the Chip Select bits (A2, A1, A0). The Chip Select

bits allow the use of up to eight 24XX32A devices on

the same bus and are used to select which device is

accessed. The Chip Select bits in the control byte must

correspond to the logic levels on the corresponding A2,

A1, and A0 pins for the device to respond. These bits

are in effect the three Most Significant bits of the word

address.

Chip Select

Control Code

Bits

S

1

0

1

0

A2 A1 A0 R/W ACK

Slave Address

Acknowledge Bit

Start Bit

3.7

Contiguous Addressing Across

Multiple Devices

The last bit of the control byte defines the operation to

be performed. When set to a ‘1’, a read operation is

selected. When set to a zero, a write operation is

selected. The next two bytes received define the

address of the first data byte (Figure 3-3). Because

only A11 to A0 are used, the upper four address bits are

don’t care bits. The upper address bits are transferred

first, followed by the less significant bits.

The Chip Select bits A2, A1, A0 can be used to expand

the contiguous address space for up to 256K bits by

adding up to eight 24XX32A's on the same bus. In this

case, software can use A0 of the control byte as

address bit A12, A1 as address bit A13, and A2 as

address bit A14. It is not possible to sequentially read

across device boundaries.

Following the Start condition, the 24XX32A monitors

the SDA bus checking the device type identifier being

transmitted and, upon receiving a ‘1010’ code and

appropriate device select bits, the slave device outputs

an Acknowledge signal on the SDA line. Depending on

the state of the R/W bit, the 24XX32A will select a read

or write operation.

FIGURE 3-3:

ADDRESS SEQUENCE BIT ASSIGNMENTS

ADDRESS HIGH BYTE

CONTROL BYTE

ADDRESS LOW BYTE

A

1

A

•

1

0

1

0

R/W

X

2

0

11 10

9

8

7

0

CONTROL

CODE

CHIP

SELECT

BITS

X = Don’t Care Bit

DS21713D-page 6

 2003 Microchip Technology Inc.

24AA32A/24LC32A

4.2

Page Write

4.0

4.1

WRITE OPERATIONS

Byte Write

The write control byte, word address and the first data

byte are transmitted to the 24XX32A in the same way

as in a byte write. However, instead of generating a

Stop condition, the master transmits up to 31 additional

bytes which are temporarily stored in the on-chip page

buffer and will be written into memory once the master

has transmitted a Stop condition. Upon receipt of each

word, the five lower-address pointer bits are internally

incremented by ‘1’. If the master should transmit more

than 32 bytes prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten. As with the byte write

operation, once the Stop condition is received, an

internal write cycle will begin (Figure 4-2). If an attempt

is made to write to the array with the WP pin held high,

the device will acknowledge the command but no write

cycle will occur, no data will be written and the device

will immediately accept a new command.

Following the Start condition from the master, the

control code (4 bits), the Chip Select (3 bits), and the

R/W bit (which is a logic low) are clocked onto the bus

by the master transmitter. This indicates to the

addressed slave receiver that the address high byte

will follow once it has generated an Acknowledge bit

during the ninth clock cycle. Therefore, the next byte

transmitted by the master is the high-order byte of the

word address and will be written into the address

pointer of the 24XX32A. The next byte is the Least

Significant Address Byte. After receiving another

Acknowledge signal from the 24XX32A, the master

device will transmit the data word to be written into the

addressed memory location. The 24XX32A acknowl-

edges again and the master generates a Stop

condition. This initiates the internal write cycle and,

during this time, the 24XX32A will not generate

Acknowledge signals (Figure 4-1). If an attempt is

made to write to the array with the WP pin held high,

the device will acknowledge the command but no

write cycle will occur. No data will be written and the

device will immediately accept a new command. After

a byte Write command, the internal address counter

will point to the address location following the one that

was just written.

Note:

Page write operations are limited to writing

bytes within a single physical page,

regardless of the number of bytes

actually being written. Physical page

boundaries start at addresses that are

integer multiples of the page buffer size (or

‘page size’) and, end at addresses that are

integer multiples of [page size - 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

4.3

Write-Protection

The WP pin allows the user to write-protect the entire

array (0000-0FFFF) when the pin is tied to VCC. If tied

to VSS or left floating, the write protection is disabled.

The WP pin is sampled at the Stop bit for every write

command (Figure 3-1) Toggling the WP pin after the

Stop bit will have no effect on the execution of the write

cycle.

 2003 Microchip Technology Inc.

DS21713D-page 7

24AA32A/24LC32A

FIGURE 4-1:

BYTE WRITE

S

BUS ACTIVITY

MASTER

T

A

R

T

S

T

O

P

CONTROL

BYTE

ADDRESS

HIGH BYTE

ADDRESS

LOW BYTE

DATA

A AA

SDA LINE

X X X X

S 1 0 1 0

0

P

2 1 0

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

X = don’t care bit

FIGURE 4-2:

PAGE WRITE

S

T

A

R

T

S

T

O

P

CONTROL

BYTE

ADDRESS

HIGH BYTE

ADDRESS

LOW BYTE

BUS ACTIVITY

MASTER

DATA BYTE 0

DATA BYTE 31

A A A

SDA LINE

X X X X

P

S 1 0 1 0

0

2 1 0

A

C

K

A

C

K

A

C

K

A

C

K

A

C

K

BUS ACTIVITY

X = don’t care bit

DS21713D-page 8

 2003 Microchip Technology Inc.

24AA32A/24LC32A

FIGURE 5-1:

ACKNOWLEDGE POLLING

FLOW

5.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write

cycle, this can be used to determine when the cycle is

complete (this feature can be used to maximize bus

throughput). Once the Stop condition for a write

command has been issued from the master, the device

initiates the internally-timed write cycle. ACK polling

can then be initiated immediately. This involves the

master sending a Start condition followed by the control

byte for a Write command (R/W = 0). If the device is still

busy with the write cycle, then no ACK will be returned.

If no ACK is returned, the Start bit and control byte must

be re-sent. If the cycle is complete, the device will

return the ACK and the master can then proceed with

the next Read or Write command. See Figure 5-1 for

flow diagram of this operation.

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W = 0

Did Device

Acknowledge

(ACK = 0)?

NO

YES

 2003 Microchip Technology Inc.

DS21713D-page 9

24AA32A/24LC32A

6.3

Sequential Read

6.0

READ OPERATION

Sequential reads are initiated in the same way as a

random read, except that once the 24XX32A transmits

the first data byte, the master issues an acknowledge

as opposed to the Stop condition used in a random

read. This acknowledge directs the 24XX32A to

transmit the next sequentially addressed 8-bit word

(Figure 6-3). Following the final byte transmitted to the

master, the master will NOT generate an acknowledge

but will generate a Stop condition. To provide sequen-

tial reads, the 24XX32A contains an internal address

pointer which is incremented by ‘1’ upon completion of

each operation. This address pointer allows the entire

memory contents to be serially read during one

operation. The internal address pointer will automati-

cally roll over from address FFF to address 0000 if the

master acknowledges the byte received from the array

address 0FFF.

Read operations are initiated in the same way as write

operations, with the exception that the R/W bit of the

control byte is set to ‘1’. There are three basic types of

read operations: current address read, random read,

and sequential read.

6.1

Current Address Read

The 24XX32A contains an address counter that main-

tains the address of the last word accessed, internally

incremented by ‘1’. Therefore, if the previous read

access was to address n (n is any legal address), the

next current address read operation would access data

from address n + 1.

Upon receipt of the control byte with R/W bit set to ‘1’,

the 24XX32A issues an acknowledge and transmits the

8- bit data word. The master will not acknowledge the

transfer but does generate a Stop condition and the

24XX32A discontinues transmission (Figure 6-1).

6.2

Random Read

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, the word address must

first be first. This is accomplished by sending the word

address to the 24XX32A as part of a write operation

(R/W bit set to ‘0’). Once the word address is sent, the

master generates a Start condition following the

acknowledge. This terminates the write operation, but

not before the internal address pointer is set. The

master issues the control byte again, but with the R/W

bit set to a ‘1’. The 24XX32A will then issue an

acknowledge and transmit the 8-bit data word. The

master will not acknowledge the transfer but does

generate a Stop condition which causes the 24XX32A

to discontinue transmission (Figure 6-2). After a ran-

dom Read command, the internal address counter will

point to the address location following the one that

was just read.

FIGURE 6-1:

CURRENT ADDRESS READ

S

T

A

R

BUS ACTIVITY

MASTER

CONTROL

BYTE

S

T

DATA (n)

O

P

T

SDA LINE

S

P

A

C

K

N

O

BUS ACTIVITY

A

C

K

DS21713D-page 10

 2003 Microchip Technology Inc.

24AA32A/24LC32A

FIGURE 6-2:

RANDOM READ

S

T

A

R

T

S

BUS ACTIVITY

MASTER

T

A

R

T

S

T

CONTROL

BYTE

ADDRESS

HIGH BYTE

ADDRESS

LOW BYTE

CONTROL

BYTE

DATA

BYTE

O

P

A A A

2 1 0

A A A

2 1 0

SDA LINE

X X X X

0

S 1 0 1 0

1

P

A

C

K

A

C

K

A

C

K

A

C

K

N

O

A

C

K

BUS ACTIVITY

X = Don’t Care Bit

FIGURE 6-3:

SEQUENTIAL READ

S

BUS ACTIVITY

MASTER

T

CONTROL

DATA n

BYTE

DATA n + 1

DATA n + 2

DATA n + X

O

P

SDA LINE

A

C

K

A

C

K

A

C

K

A

C

K

N

O

BUS ACTIVITY

A

C

K

 2003 Microchip Technology Inc.

DS21713D-page 11

24AA32A/24LC32A

7.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 7-1.

TABLE 7-1:

Name

PIN FUNCTION TABLE

ROTATED

TSSOP

PDIP

SOIC

TSSOP

MSOP

Description

Chip Address Input

A0

A1

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

3

4

5

6

7

8

1

2

Chip Address Input

Ground

A2

VSS

SDA

SCL

WP

VCC

Serial Address/Data I/O

Serial Clock

Write-Protect Input

+1.8V to 5.5V Power Supply

7.1

A0, A1, A2 Chip Address Inputs

7.3

Serial Clock (SCL)

The A0, A1, A2 inputs are used by the 24XX32A for

multiple device operation. The levels on these inputs

are compared with the corresponding bits in the slave

address. The chip is selected if the compare is true.

The SCL input is used to synchronize the data transfer

to and from the device.

7.4

Write-Protect (WP)

Up to eight devices may be connected to the same bus

by using different Chip Select bit combinations. These

inputs must be connected to either VCC or VSS.

The WP pin can be connected to either VSS, VCC or left

floating. An internal pull-down resistor on this pin will

keep the device in the unprotected state if left floating.

If tied to VSS, or left floating, normal memory operation

is enabled (read/write the entire memory 000-FFF).

7.2

Serial Data (SDA)

SDA is a bidirectional pin used to transfer addresses

and data into and out of the device. It is an open-drain

terminal, therefore, the SDA bus requires a pull-up

resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for

400 kHz)

If tied to VCC, write operations are inhibited. Read

operations are not affected.

For normal data transfer, SDA is allowed to change

only during SCL low. Changes during SCL high are

reserved for indicating Start and Stop conditions.

DS21713D-page 12

 2003 Microchip Technology Inc.

24AA32A/24LC32A

8.0

8.1

PACKAGING INFORMATION

Package Marking Information

Example:

8-Lead PDIP (300 mil)

24LC32A

I/P13F

XXXXXXXX

T/XXXNNN

0327

YYWW

Example:

8-Lead SOIC (150 mil)

24LC32A

I/SN0327

XXXXXXXX

T/XXYYWW

13F

NNN

Example:

8-Lead SOIC (208 mil)

XXXXXXXX

T/XXXXXX

YYWWNNN

24LC32A

I/SM

032713F

TSSOP

Marking Codes

Example:

8-Lead TSSOP

Device

4LA

I327

13F

XXXX

TYWW

NNN

STD

Rot

Pb-free

Rot

24AA32A 4AA

24LC32A 4LA

4AAX

4LAX

G4AA G4AAX

G4LA G4LAX

Example:

8-Lead MSOP

MSOP

Marking Codes

Device

XXXXXT

4L32AI

32713F

STD

Pb-free

YWWNNN

24AA32A

24LC32A

4A32

G4AA

G4LA

4L32A

Note:

Pb-free part number using “G” suffix

is marked on carton

Legend: XX...X Customer specific information*

T

Temperature grade (I, E)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.

 2003 Microchip Technology Inc.

DS21713D-page 13

24AA32A/24LC32A

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

Top to Seating Plane

A

.140

.170

3.56

2.92

3.94

3.30

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

3.68

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21713D-page 14

 2003 Microchip Technology Inc.

24AA32A/24LC32A

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

 2003 Microchip Technology Inc.

DS21713D-page 15

24AA32A/24LC32A

8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)

E

E1

p

D

2

n

1

B

α

c

A2

A

φ

A1

L

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.075

.074

.005

.313

.208

.205

.025

4

1.27

Overall Height

A

.070

.080

1.78

1.75

1.97

1.88

0.13

7.95

5.28

5.21

0.64

4

2.03

Molded Package Thickness

Standoff

A2

A1

E

.069

.002

.300

.078

.010

.325

.212

.210

.030

8

1.98

0.25

8.26

5.38

5.33

0.76

8

§

0.05

7.62

5.11

5.13

0.51

0

Overall Width

Molded Package Width

Overall Length

E1

D

.201

.202

.020

0

Foot Length

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.014

0

.009

.017

12

.010

.020

15

0.20

0.36

0

0.23

0.43

12

0.25

0.51

15

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

Drawing No. C04-056

DS21713D-page 16

 2003 Microchip Technology Inc.

24AA32A/24LC32A

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

E

E1

p

D

2

1

n

B

α

A

c

A1

A2

φ

β

L

Units

INCHES

NOM

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026

0.65

Overall Height

A

.043

1.10

0.95

0.15

6.50

4.50

3.10

0.70

8

Molded Package Thickness

Standoff

A2

A1

E

.033

.035

.004

.251

.173

.118

.024

4

.037

.006

.256

.177

.122

.028

8

0.85

0.05

0.90

0.10

6.38

4.40

3.00

0.60

4

§

.002

.246

.169

.114

.020

0

Overall Width

6.25

4.30

2.90

0.50

0

Molded Package Width

Molded Package Length

Foot Length

E1

D

L

φ

Foot Angle

c

Lead Thickness

.004

.007

0

.006

.010

5

.008

.012

10

0.09

0.19

0

0.15

0.25

5

0.20

0.30

10

Lead Width

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.005” (0.127mm) per side.

JEDEC Equivalent: MO-153

Drawing No. C04-086

 2003 Microchip Technology Inc.

DS21713D-page 17

24AA32A/24LC32A

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n

1

α

A2

A

c

φ

A1

(F)

L

β

Units

Dimension Limits

INCHES

NOM

MILLIMETERS*

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.026 BSC

0.65 BSC

Overall Height

A

A2

A1

E

-

.043

-

0.85

-

1.10

Molded Package Thickness

Standoff

.030

.000

.033

-

.037

.006

0.75

0.95

0.15

0.00

Overall Width

.193 TYP.

4.90 BSC

Molded Package Width

Overall Length

Foot Length

E1

D

.118 BSC

3.00 BSC

L

.016

.024

.037 REF

.031

0.40

0.60

0.95 REF

0.80

Footprint (Reference)

Foot Angle

F

φ

c

0°

.003

.009

5°

-

8°

.009

.016

15°

0°

0.08

0.22

5°

-

8°

0.23

0.40

15°

Lead Thickness

Lead Width

.006

B

α

β

.012

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

Notes:

-

5°

15°

5°

15°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

DS21713D-page 18

 2003 Microchip Technology Inc.

24AA32A/24LC32A

APPENDIX A: REVISION HISTORY

Revision D

Corrections to Section 1.0, Electrical Characteristics.

 2003 Microchip Technology Inc.

DS21713D-page 19

24AA32A/24LC32A

NOTES:

DS21713D-page 20

 2003 Microchip Technology Inc.

24AA32A/24LC32A

ON-LINE SUPPORT

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

Microchip provides on-line support on the Microchip

World Wide Web site.

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits. The Hot Line

Numbers are:

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

and a web browser, such as Netscape^®or Microsoft^®

Internet Explorer. Files are also available for FTP

download from our FTP site.

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

Connecting to the Microchip Internet

Web Site

042003

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP

service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A vari-

ety of Microchip specific business information is also

available, including listings of Microchip sales offices,

distributors and factory representatives. Other data

available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

 2003 Microchip Technology Inc.

DS21713D-page 21

24AA32A/24LC32A

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

24AA32A/24LC32A

DS21713D

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21713D-page 22

 2003 Microchip Technology Inc.

24AA32A/24LC32A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

X

/XX

X

PART NO.

Device

a) 24AA32A-I/P: Industrial Temperature,1.8V,

PDIP package

Temperature Package Lead Finish

Range

b) 24AA32A-I/SN: Industrial Temperature,1.8V,

SOIC package

2

Device:

24AA32A: 1.8V, 32 Kbit I C Serial EEPROM

24AA32AT: 1.8V, 32 Kbit I C Serial EEPROM

c) 24AA32A-I/SM: Industrial Temperature.,1.8V,

SOIC (208 mil) package

2

(Tape and Reel)

d) 24AA32AX-I/ST: Industrial Temp.,1.8V,

Rotated TSSOP package

2

24AA32AX 1.8V, 32 Kbit I C Serial EEPROM in

alternate pinout (ST only)

2

e) 24AA32A-I/ST: Industrial Temperature.,1.8V,

TSSOP package

24AA32AXT 1.8V, 32 Kbit I C Serial EEPROM in

alternate pinout (ST only)

2

24LC32A: 2.5V, 32 Kbit I C Serial EEPROM

24LC32AT: 2.5V, 32 Kbit I C Serial EEPROM

f)

24AA32A-I/PG: Industrial Temperature.,1.8V,

PDIP package. Pb-free

2

(Tape and Reel)

2

24LC32AX 2.5V, 32 Kbit I C Serial EEPROM in

g) 24LC32A-I/P: Industrial Temperature, 2.5V,

PDIP package

alternate pinout (ST only)

24LC32AXT 2.5V, 32 Kbit I C Serial EEPROM in

2

alternate pinout (ST only)

h) 24LC32A-E/SN: Automotive Temperature,

2.5V SOIC package

i)

24LC32A-E/SM: Automotive Temperature,

2.5V SOIC (208 mil) package

Tempera-

ture

I

E

=

-40°C to +85°C

-40°C to +125°C

j)

24LC32AX-E/ST: Automotive Temperature,

2.5V, Rotated TSSOP package

Range:

k) 24LC32AT-I/ST: Industrial Temperature, 2.5V,

TSSOP package, Tape and Reel

Package:

P

=

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

Plastic SOIC (208 mil body), 8-lead

Plastic TSSOP (4.4 mm), 8-lead

SN

SM

ST

MS

l)

24LC32AT-I/SNG: Industrial Temperature,

2.5V, SOIC package, Tape and Reel, Pb-free

Plastic Micro Small Outline (MSOP), 8-lead

Lead Finish Blank = Standard 63% / 37% SnPb

Pb-free (Matte Tin - Pure Sn)

G

=

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2003 Microchip Technology Inc.

DS21713D-page 23

24AA32A/24LC32A

NOTES:

DS21713D-page 24

 2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,

ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,

In-Circuit Serial Programming, ICSP, ICEPIC, microPort,

Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,

PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,

SmartSensor, SmartShunt, SmartTel and Total Endurance are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received QS-9000 quality system

certification for its worldwide headquarters,

design and wafer fabrication facilities in

Chandler and Tempe, Arizona in July 1999

and Mountain View, California in March 2002.

The Company’s quality system processes and

procedures are QS-9000 compliant for its

PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals,

non-volatile memory and analog products. In

addition, Microchip’s quality system for the

design and manufacture of development

systems is ISO 9001 certified.

 2003 Microchip Technology Inc.

DS21713D-page 25

WORLDWIDE SALES AND SERVICE

Korea

AMERICAS

ASIA/PACIFIC

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Corporate Office

Australia

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

China - Beijing

Unit 915

Bei Hai Wan Tai Bldg.

No. 6 Chaoyangmen Beidajie

Beijing, 100027, No. China

Tel: 86-10-85282100

Fax: 86-10-85282104

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Boston

China - Chengdu

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Chicago

333 Pierce Road, Suite 180

Itasca, IL 60143

Tel: 630-285-0071

Fax: 630-285-0075

Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Dallas

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

Lautrup hoj 1-3

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423

Fax: 972-818-2924

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Fax: 248-538-2260

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

Kokomo

France

2767 S. Albright Road

Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Germany

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Phoenix

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966

Fax: 480-792-4338

Room 401, Hongjian Building

No. 2 Fengxiangnan Road, Ronggui Town

Shunde City, Guangdong 528303, China

Tel: 86-765-8395507 Fax: 86-765-8395571

Italy

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

San Jose

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

2107 North First Street, Suite 590

San Jose, CA 95131

Tel: 408-436-7950

Fax: 408-436-7955

India

Toronto

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Fax: 905-673-6509

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

07/28/03

DS21713D-page 26

 2003 Microchip Technology Inc.

型号	制造商	描述	价格	文档
24AA32AX-I/SMG	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AX-I/SN	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AX-I/SNG	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AX-I/ST	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AX-I/STG	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AXI/ST	MICROCHIP	4K X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8	获取价格
24AA32AXT	MICROCHIP	32KIC Serial EEPROM	获取价格
24AA32AXT-E/CS16K	MICROCHIP	32K I2Câ¢ Serial EEPROM	获取价格
24AA32AXT-E/MC	MICROCHIP	32K I2Câ¢ Serial EEPROM	获取价格
24AA32AXT-E/MNY	MICROCHIP	32K I2Câ¢ Serial EEPROM	获取价格

24AA32AX-I/SM

24AA32AX-I/SM 概述

24AA32AX-I/SM 数据手册

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