24LC00T-EST [MICROCHIP]
128 Bit I 2 C? Bus Serial EEPROM; 128位I 2 C ?总线串行EEPROM型号: | 24LC00T-EST |
厂家: | MICROCHIP |
描述: | 128 Bit I 2 C? Bus Serial EEPROM |
文件: | 总18页 (文件大小:254K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
24AA00/24LC00/24C00
128 Bit I2C™ Bus Serial EEPROM
Device Selection Table
Package Types
8-PIN PDIP/SOIC
Device
VCC Range
Temp Range
1
8
NC
NC
NC
Vss
VCC
NC
24AA00
24LC00
24C00
1.8 - 5.5
2.5 - 5.5
4.5 - 5.5
C,I
C,I
2
3
7
6
5
C,I,E
SCL
SDA
4
Features
8-PIN TSSOP
• Low-power CMOS technology
- 500 µA typical active current
- 250 nA typical standby current
• Organized as 16 bytes x 8 bits
• 2-wire serial interface bus, I2C™ compatible
• 100 kHz (1.8V) and 400 kHz (5V) compatibility
• Self-timed write cycle (including auto-erase)
• 4 ms maximum byte write cycle time
• 1,000,000 erase/write cycles
1
8
7
6
5
NC
NC
VCC
NC
2
3
4
NC
SCL
SDA
VSS
5-PIN SOT-23
VCC
1
2
5
4
SCL
VSS
SDA
• ESD protection > 4 kV
3
NC
• Data retention > 200 years
• 8L DIP, SOIC, TSSOP and 5L SOT-23 packages
• Standard or Pb-free finish available
• Temperature ranges available:
Block Diagram
HV Generator
- Commercial (C):
- Industrial (I):
- Automotive (E):
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
XDEC
Description
SCL
SDA
YDEC
The Microchip Technology Inc. 24AA00/24LC00/
24C00 (24XX00*) is a 128-bit Electrically Erasable
PROM memory organized as 16 x 8 with a 2-wire serial
interface. Low voltage design permits operation down
to 1.8 volts for the 24XX00 version, and every version
maintains a maximum standby current of only 1 µA and
typical active current of only 500 µA. This device was
designed for where a small amount of EEPROM is
needed for the storage of calibration values, ID
numbers or manufacturing information, etc. The
24XX00 is available in 8-pin PDIP, 8-pin SOIC (150
mil), 8-pin TSSOP and the 5-pin SOT-23 packages.
VCC
VSS
Sense AMP
R/W Control
Pin Function Table
Name
Function
VSS
SDA
SCL
VCC
Ground
Serial Data
Serial Clock
+1.8V to 5.5V (24AA00)
+2.5V to 5.5V (24LC00)
+4.5V to 5.5V (24C00)
No Internal Connection
2
I C is a trademark of Philips Corporation.
*24XX00 is used in this document as a generic part number for
the 24AA00/24LC00/24C00 devices.
NC
2003 Microchip Technology Inc.
DS21178D-page 1
24AA00/24LC00/24C00
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-65°C to +125°C
ESD protection on all pins..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All Parameters apply across the
recommended operating ranges unless Industrial (I):
Commercial (C): TA = 0°C to +70°C,
TA = -40°C to +85°C,
VCC = 1.8V to 5.5V
VCC = 1.8V to 5.5V
otherwise noted
Parameter
Automotive (E)
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
Symbol
Min.
Max.
Units
Conditions
SCL and SDA pins:
VIH
0.7 VCC
.05 VCC
V
(Note)
(Note)
High-level input voltage
Low-level input voltage
VIL
0.3 VCC
—
V
V
Hysteresis of Schmitt Trigger
inputs
VHYS
VCC ≥ 2.5V (Note)
Low-level output voltage
VOL
0.4
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
—
—
±1
±1
10
µA
µA
pF
VIN = VCC or VSS
Output leakage current
ILO
VOUT = VCC or VSS
Pin capacitance (all inputs/outputs)
CIN,
VCC = 5.0V (Note)
COUT
TA = 25°C, f = 1 MHz
Operating current
ICC Write
ICC Read
ICCS
—
—
—
2
1
1
mA
mA
µA
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SDA = SCL = VCC
Standby current
Note:
This parameter is periodically sampled and not 100% tested.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
TR
TSU:STA
SCL
TSU:STO
THD:DAT
TSU:DAT
TLOW
THD:STA
SDA
IN
TSP
TBUF
TAA
SDA
OUT
DS21178D-page 2
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
TABLE 1-2:
AC CHARACTERISTICS
All Parameters apply across all
recommended operating ranges Industrial (I):
unless otherwise noted
Commercial (C):
TA = 0°C to +70°C, VCC = 1.8V to 5.5V
TA = -40°C to +85°C, VCC = 1.8V to 5.5V
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
Automotive (E):
Parameter
Symbol
Min
Max
Units
Conditions
Clock frequency
FCLK
—
—
—
100
100
400
kHz
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock high time
Clock low time
THIGH
TLOW
TR
4000
4000
600
—
—
—
ns
ns
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
4700
4700
1300
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time
(Note 1)
—
—
—
1000
1000
300
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time
Start condition hold time
TF
—
300
ns
ns
(Note 1)
THD:STA
4000
4000
600
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Start condition setup time
TSU:STA
4700
4700
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Data input hold time
Data input setup time
THD:DAT
TSU:DAT
0
—
ns
ns
(Note 2)
250
250
100
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Stop condition setup time
TSU:STO
TAA
4000
4000
600
—
—
—
ns
ns
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Output valid from clock
(Note 2)
—
—
—
3500
3500
900
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must TBUF
be free before a new transmis-
sion can start
4700
4700
1300
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.8V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Output fall time from VIH
minimum to VIL maximum
TOF
TSP
TWC
20+0.1
CB
250
ns
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression
(SDA and SCL pins)
—
50
(Notes 1, 3)
Write cycle time
Endurance
—
4
ms
1M
—
cycles (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained on www.microchip.com.
2003 Microchip Technology Inc.
DS21178D-page 3
24AA00/24LC00/24C00
2.0
2.1
PIN DESCRIPTIONS
SDA Serial Data
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Bus Not Busy (A)
2.2
SCL Serial Clock
Both data and clock lines remain high.
This input is used to synchronize the data transfer from
and to the device.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
2.3
Noise Protection
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation even on a noisy bus.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
3.0
FUNCTIONAL DESCRIPTION
The 24XX00 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data as a receiver. The bus has to be
controlled by a master device which generates the
serial clock (SCL), controls the bus access, and
generates the Start and Stop conditions, while the
24XX00 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited.
DS21178D-page 4
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this
case, the slave must leave the data line high to enable
the master to generate the Stop condition (Figure 4-2).
4.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
The 24XX00 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(C)
(D)
(C)
(A)
SCL
SDA
START
CONDITION
STOP
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
DATA
ALLOWED
TO CHANGE
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
2003 Microchip Technology Inc.
DS21178D-page 5
24AA00/24LC00/24C00
5.0
DEVICE ADDRESSING
6.0
6.1
WRITE OPERATIONS
Byte Write
After generating a Start condition, the bus master
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of
operation is to be performed. The slave address for the
24XX00 consists of a 4-bit device code ‘1010’ followed
by three don't care bits.
Following the Start signal from the master, the device
code (4 bits), the don't care bits (3 bits), and the R/W bit
(which is a logic low) are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the address pointer of the 24XX00. Only the
lower four address bits are used by the device, and the
upper four bits are don’t cares. The 24XX00 will
acknowledge the address byte and the master device
will then transmit the data word to be written into the
addressed memory location. The 24XX00 acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle, and
during this time the 24XX00 will not generate Acknowl-
edge signals (Figure 7-2). After a byte Write command,
the internal address counter will not be incremented
and will point to the same address location that was just
written. If a Stop bit is transmitted to the device at any
point in the Write command sequence before the entire
sequence is complete, then the command will abort
and no data will be written. If more than 8 data bits are
transmitted before the Stop bit is sent, then the device
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a Stop bit is sent before a
full eight data bits have been transmitted, then the
Write command will abort and no data will be written.
The 24XX00 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)
at nominal conditions.
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is
selected, and when set to a zero a write operation is
selected. (Figure 5-1). The 24XX00 monitors the bus
for its corresponding slave address all the time. It
generates an Acknowledge bit if the slave address was
true and it is not in a Programming mode.
FIGURE 5-1:
CONTROLBYTEFORMAT
Read/Write Bit
Device Select
Bits
Don’t Care
Bits
S
1
0
1
0
X
X
X R/W ACK
Slave Address
Acknowledge Bit
Start Bit
DS21178D-page 6
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
Figure 7-1 for flow diagram.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
NO
YES
Next
Operation
FIGURE 7-2:
BYTE WRITE
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
CONTROL
BYTE
WORD
ADDRESS
DATA
SDA LINE
P
S
1
0
1
0
X
X
X
0
X
X
X X
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
X = Don’t Care Bit
2003 Microchip Technology Inc.
DS21178D-page 7
24AA00/24LC00/24C00
After the word address is sent, the master generates a
Start condition following the acknowledge. This termi-
nates the write operation, but not before the internal
address pointer is set. Then the master issues the
control byte again but with the R/W bit set to a one. The
24XX00 will then issue an acknowledge and transmits
the eight bit data word. The master will not acknowl-
edge the transfer but does generate a Stop condition
and the device discontinues transmission (Figure 8-2).
After this command, the internal address counter will
point to the address location following the one that was
just read.
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read,
and sequential read.
8.1
Current Address Read
The 24XX00 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address n, the next current address read
operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the device issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the transfer but does generate a Stop condition and the
device discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the device transmits the
first data byte, the master issues an acknowledge as
opposed to a Stop condition in a random read. This
directs the device to transmit the next sequentially
addressed 8-bit word (Figure 8-3).
8.2
Random Read
To provide sequential reads the 24XX00 contains an
internal address pointer which is incremented by one at
the completion of each read operation. This address
pointer allows the entire memory contents to be serially
read during one operation.
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
device as part of a write operation.
FIGURE 8-1:
CURRENT ADDRESS READ
S
T
S
BUS ACTIVITY
A
CONTROL
BYTE
T
DATA
MASTER
R
O
P
T
SDA LINE
S 1 0 1 0 X X X 1
P
A
C
K
N
O
BUS ACTIVITY
A
C
K
X = Don’t Care Bit
DS21178D-page 8
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
CONTROL
BYTE
WORD
ADDRESS (n)
CONTROL
BYTE
DATA (n)
X X X X
P
S 1 0 1 0 X X X 0
S 1 0 1 0 X X X 1
SDA LINE
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY
X = Don’t Care Bit
A
C
K
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
BUS ACTIVITY
MASTER
CONTROL
DATA n
BYTE
DATA n + 1
DATA n + 2
DATA n + X
SDA LINE
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY
A
C
K
2003 Microchip Technology Inc.
DS21178D-page 9
24AA00/24LC00/24C00
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
T/XXXNNN
24LC00
I/P13F
YYWW
0327
8-Lead SOIC (150 mil)
Example:
24LC00
XXXXXXXX
T/XXYYWW
I/SN0327
NNN
13F
Example:
8-Lead TSSOP
4L00
I327
13F
XXXX
TYWW
NNN
TSSOP Marking
Code
Part
Number
STD
Pb-Free
24AA00
24LC00
4A00
4L00
G4A0
G4L0
SOT-23 Marking Code
I
Example:
5-Lead SOT-23
Part Number
C
E
24AA00
24LC00
A0
L0
C0
B0
M0
D0
—
N0
E0
24C00
XXNN
M03F
Note:
Pb-free parts are marked same as
standard finish. Pb-free part number using
“G” suffix is marked on carton..
Legend: XX...X Customer specific information*
T
Temperature grade (I,E)
YY
Y
WW
NNN
Year code (last 2 digits of calendar year)
Year code (last digit of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard QTP marking consists of Microchip part number, year code, week code, and traceability code.
DS21178D-page 10
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
2003 Microchip Technology Inc.
DS21178D-page 11
24AA00/24LC00/24C00
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21178D-page 12
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
2003 Microchip Technology Inc.
DS21178D-page 13
24AA00/24LC00/24C00
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
p
B
p1
D
n
1
α
c
A
A2
φ
A1
L
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
5
MAX
n
p
Number of Pins
5
Pitch
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
0.95
1.90
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.035
.000
.102
.059
.110
.014
0
.057
0.90
0.90
1.18
1.10
0.08
2.80
1.63
2.95
0.45
5
1.45
Molded Package Thickness
.051
.006
.118
.069
.122
.022
10
1.30
0.15
3.00
1.75
3.10
0.55
10
Standoff
§
0.00
2.60
1.50
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.004
.014
0
.006
.017
5
.008
.020
10
0.09
0.35
0
0.15
0.43
5
0.20
0.50
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
DS21178D-page 14
2003 Microchip Technology Inc.
24AA00/24LC00/24C00
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
/XX
X
PART NO.
Device
Examples:
a) 24AA00-I/P: Industrial Temperature,1.8V
PDIP package
Temperature Package Lead Finish
Range
b) 24AA00-I/SN: Industrial Temperature,
1.8V, SOIC package
2
Device:
24AA00:
24AA00T:
=
=
1.8V, 128 bit I C™ Serial EEPROM
2
1.8V, 128 bit I C Serial EEPROM
c)
24AA00T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, tape and reel
(Tape and Reel)
2
24LC00:
24LC00T:
=
=
2.5V, 128 bit I C Serial EEPROM
d) 24LC00-I/P: Industrial Temperature,
2.5V, PDIP package
2
2.5V, 128 bit I C Serial EEPROM
(Tape and Reel)
5V, 128 bit I C™ Serial EEPROM
5V, 128 bit I C™ Serial EEPROM
(Tape and Reel)
e) 24C00-E/SN: Extended Temperature,
5V, SOIC package
2
24C00:
24C00T:
=
=
2
f)
24LC00T-I/OT: Industrial Temperature,
2.5V, SOT-23 package, tape and reel
g)
h)
24LC00-I/PG: Industrial Temperature, 2.5V
PDIP package, Pb-free
Temperature Blank
=
=
=
0°C to 70°C
-40°C to +85°C
-40°C to +125°C
Range:
I
24LC00T-I/OTG: Industrial Temperature,
2.5V, SOT-23 package, tape and reel,
Pb-free
E
Package:
P
= Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
OT = SOT-23, 5-lead (Tape and Reel only)
Lead finish
Blank =Standard 63/37 SnPb
G
=Matte Tin (pure Sn)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2003 Microchip Technology Inc.
DS21178D-page15
24AA00/24LC00/24C00
NOTES:
DS21178D-page 16
2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
2003 Microchip Technology Inc.
DS21178D-page 17
WORLDWIDE SALES AND SERVICE
Korea
AMERICAS
ASIA/PACIFIC
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Beijing
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100
Fax: 86-10-85282104
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Boston
China - Chengdu
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
Fax: 86-28-86766599
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Dallas
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Germany
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Phoenix
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966
Fax: 480-792-4338
Room 401, Hongjian Building
No. 2 Fengxiangnan Road, Ronggui Town
Shunde City, Guangdong 528303, China
Tel: 86-765-8395507 Fax: 86-765-8395571
Italy
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
San Jose
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950
Fax: 408-436-7955
India
Toronto
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Fax: 905-673-6509
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
07/28/03
DS21178D-page 18
2003 Microchip Technology Inc.
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