24LC00TE/SN
更新时间:2024-09-18 12:58:50
品牌:MICROCHIP
描述:16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
24LC00TE/SN 概述
16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 EEPROM
24LC00TE/SN 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.14 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 0.4 MHz |
数据保留时间-最小值: | 200 | 耐久性: | 1000000 Write/Erase Cycles |
I2C控制字节: | 1010XXXR | JESD-30 代码: | R-PDSO-G8 |
JESD-609代码: | e3 | 长度: | 4.9 mm |
内存密度: | 128 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 16 words | 字数代码: | 16 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 16X8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装等效代码: | SOP8,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 并行/串行: | SERIAL |
峰值回流温度(摄氏度): | 260 | 电源: | 3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.75 mm |
串行总线类型: | I2C | 最大待机电流: | 0.000001 A |
子类别: | EEPROMs | 最大压摆率: | 0.002 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 3.9 mm |
最长写入周期时间 (tWC): | 4 ms | Base Number Matches: | 1 |
24LC00TE/SN 数据手册
通过下载24LC00TE/SN数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载24AA00/24LC00/24C00
128-Bit I2C™ Bus Serial EEPROM
Device Selection Table
Package Types
Device
VCC Range
Temp Range
8-PIN PDIP/SOIC
24AA00
24LC00
24C00
1.7-5.5
2.5-5.5
4.5-5.5
I
I
NC
NC
NC
Vss
1
2
3
4
8
7
6
5
VCC
NC
I,E
SCL
SDA
Features:
8-PIN TSSOP
• Single supply with operation down to 1.7V for
24AA00 devices, 2.5V for 24LC00 devices
1
8
7
6
5
NC
NC
VCC
NC
2
3
4
• Low-power CMOS technology:
- Read current 500 μA, typical
NC
SCL
SDA
VSS
- Standby current 100 nA, typical
• 2-wire serial interface, I2C™ compatible
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz and 400 kHz clock compatibility
• Page write time 3 ms, typical
5-PIN SOT-23
DFN
VCC
NC
SCL
1
1
NC
VCC
NC
5
4
8
7
6
5
2
3
4
NC
VSS
2
3
SCL
SDA
NC
VSS
SDA
• Self-timed erase/write cycle
• ESD protection >4000V
• More than 1 million erase/write cycles
• Data retention >200 years
Block Diagram
HV Generator
• Factory programming available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN and 5-lead SOT-23
I/O
Control
Logic
Memory
Control
Logic
EEPROM
Array
• Pb-free and RoHS compliant
• Temperature ranges available:
XDEC
- Industrial (I):
-40°C to +85°C
SCL
SDA
- Automotive (E): -40°C to +125°C
YDEC
Description:
VCC
VSS
Sense AMP
R/W Control
The Microchip Technology Inc. 24AA00/24LC00/
24C00 (24XX00*) is a 128-bit Electrically Erasable
PROM memory organized as 16 x 8 with a 2-wire
serial interface. Low-voltage design permits operation
down to 1.7 volts for the 24AA00 version, and every
version maintains a maximum standby current of only
1 μA and typical active current of only 500 μA. This
device was designed for where a small amount of
EEPROM is needed for the storage of calibration
values, ID numbers or manufacturing information, etc.
The 24XX00 is available in 8-pin PDIP, 8-pin SOIC
(3.90 mm), 8-pin TSSOP, 8-pin 2x3 DFN and the 5-pin
SOT-23 packages.
Pin Function Table
Name
Function
VSS
SDA
SCL
VCC
Ground
Serial Data
Serial Clock
+1.7V to 5.5V (24AA00)
+2.5V to 5.5V (24LC00)
+4.5V to 5.5V (24C00)
No Internal Connection
NC
*24XX00 is used in this document as a generic part number for
the 24AA00/24LC00/24C00 devices.
2
I C is a trademark of Philips Corporation.
© 2007 Microchip Technology Inc.
DS21178G-page 1
24AA00/24LC00/24C00
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All Parameters apply across the
recommended operating ranges unless
otherwise noted
Industrial (I):
Automotive (E)
TA = -40°C to +85°C,
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
VCC = 1.8V to 5.5V
Parameter
Symbol
Min.
Max.
Units
Conditions
SCL and SDA pins:
VIH
0.7 VCC
—
V
(Note)
(Note)
High-level input voltage
Low-level input voltage
VIL
—
0.3 VCC
—
V
V
Hysteresis of Schmitt Trigger
inputs
VHYS
.05 VCC
VCC ≥ 2.5V (Note)
Low-level output voltage
VOL
—
0.4
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
Input leakage current
ILI
—
—
—
±1
±1
10
μA
μA
pF
VIN = VCC or VSS
Output leakage current
ILO
VOUT = VCC or VSS
Pin capacitance (all inputs/outputs)
CIN,
VCC = 5.0V (Note)
COUT
TA = 25°C, FCLK = 1 MHz
Operating current
ICC Write
ICC Read
ICCS
—
—
—
2
1
1
mA
mA
μA
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SDA = SCL = VCC
Standby current
Note:
This parameter is periodically sampled and not 100% tested.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
TR
TSU:STA
SCL
TSU:STO
THD:DAT
TSU:DAT
TLOW
THD:STA
SDA
IN
TSP
TBUF
TAA
SDA
OUT
DS21178G-page 2
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
TABLE 1-2:
AC CHARACTERISTICS
All Parameters apply across all
recommended operating ranges
unless otherwise noted
Industrial (I):
Automotive (E):
TA = -40°C to +85°C, VCC = 1.8V to 5.5V
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
Parameter
Symbol
Min
Max
Units
Conditions
Clock frequency
FCLK
—
—
—
100
100
400
kHz
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Clock high time
Clock low time
THIGH
TLOW
TR
4000
4000
600
—
—
—
ns
ns
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
4700
4700
1300
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL rise time
(Note 1)
—
—
—
1000
1000
300
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
SDA and SCL fall time
Start condition hold time
TF
—
300
ns
ns
(Note 1)
THD:STA
4000
4000
600
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Start condition setup time
TSU:STA
4700
4700
600
—
—
—
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Data input hold time
Data input setup time
THD:DAT
TSU:DAT
0
—
ns
ns
(Note 2)
250
250
100
—
—
—
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Stop condition setup time
TSU:STO
TAA
4000
4000
600
—
—
—
ns
ns
ns
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Output valid from clock
(Note 2)
—
—
—
3500
3500
900
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
4.5V ≤ Vcc ≤ 5.5V (E Temp range)
1.7V ≤ Vcc ≤ 4.5V
4.5V ≤ Vcc ≤ 5.5V
Bus free time: Time the bus must TBUF
be free before a new transmis-
sion can start
4700
4700
1300
—
—
—
Output fall time from VIH
minimum to VIL maximum
TOF
TSP
TWC
20+0.1
CB
250
ns
ns
(Note 1), CB ≤ 100 pF
Input filter spike suppression
(SDA and SCL pins)
—
50
(Notes 1, 3)
Write cycle time
Endurance
—
4
ms
1M
—
cycles (Note 4)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.
© 2007 Microchip Technology Inc.
DS21178G-page 3
24AA00/24LC00/24C00
2.0
2.1
PIN DESCRIPTIONS
SDA Serial Data
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 kΩ for 100 kHz, 2 kΩ for
400 kHz).
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Bus Not Busy (A)
2.2
SCL Serial Clock
Both data and clock lines remain high.
This input is used to synchronize the data transfer from
and to the device.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
2.3
Noise Protection
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation even on a noisy bus.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
3.0
FUNCTIONAL DESCRIPTION
The 24XX00 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data as a receiver. The bus has to be
controlled by a master device which generates the
Serial Clock (SCL), controls the bus access, and
generates the Start and Stop conditions, while the
24XX00 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited.
DS21178G-page 4
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this
case, the slave must leave the data line high to enable
the master to generate the Stop condition (Figure 4-2).
4.5
Acknowledge
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
The 24XX00 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(C)
(D)
(C) (A)
SCL
SDA
Start
Condition
Stop
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
FIGURE 4-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
© 2007 Microchip Technology Inc.
DS21178G-page 5
24AA00/24LC00/24C00
5.0
DEVICE ADDRESSING
6.0
6.1
WRITE OPERATIONS
Byte Write
After generating a Start condition, the bus master
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of
operation is to be performed. The slave address for the
24XX00 consists of a 4-bit device code ‘1010’ followed
by three “don’t care” bits.
Following the Start signal from the master, the device
code (4 bits), the “don’t care” bits (3 bits), and the R/W
bit (which is a logic low) are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the Address Pointer of the 24XX00. Only
the lower four address bits are used by the device, and
the upper four bits are “don’t cares.” The 24XX00 will
acknowledge the address byte and the master device
will then transmit the data word to be written into the
addressed memory location. The 24XX00 acknowl-
edges again and the master generates a Stop
condition. This initiates the internal write cycle, and
during this time the 24XX00 will not generate Acknowl-
edge signals (Figure 7-2). After a byte Write command,
the internal address counter will not be incremented
and will point to the same address location that was just
written. If a Stop bit is transmitted to the device at any
point in the Write command sequence before the entire
sequence is complete, then the command will abort
and no data will be written. If more than 8 data bits are
transmitted before the Stop bit is sent, then the device
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a Stop bit is sent before a
full eight data bits have been transmitted, then the
Write command will abort and no data will be written.
The 24XX00 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)
at nominal conditions.
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is
selected, and when set to a zero a write operation is
selected (Figure 5-1). The 24XX00 monitors the bus for
its corresponding slave address all the time. It
generates an Acknowledge bit if the slave address was
true and it is not in a programming mode.
FIGURE 5-1:
CONTROLBYTEFORMAT
Read/Write Bit
Device Select
Bits
Don’t Care
Bits
S
1
0
1
0
x
x
x R/W ACK
Slave Address
Acknowledge Bit
Start Bit
DS21178G-page 6
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
Figure 7-1 for flow diagram.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
FIGURE 7-2:
BYTE WRITE
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Word
Address
Data
SDA LINE
P
S
1
0
1
0
x
x
x
0
x
x
x
x
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
x = “don’t care” bit
© 2007 Microchip Technology Inc.
DS21178G-page 7
24AA00/24LC00/24C00
After the word address is sent, the master generates a
Start condition following the acknowledge. This termi-
nates the write operation, but not before the internal
Address Pointer is set. Then the master issues the
control byte again, but with the R/W bit set to a one.
The 24XX00 will then issue an acknowledge and trans-
mits the eight bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition and the device discontinues transmission
(Figure 8-2). After this command, the internal address
counter will point to the address location following the
one that was just read.
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX00 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address n, the next current address read
operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the device issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
device discontinues transmission (Figure 8-1).
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the device transmits the
first data byte, the master issues an acknowledge as
opposed to a Stop condition in a random read. This
directs the device to transmit the next sequentially
addressed 8-bit word (Figure 8-3).
8.2
Random Read
To provide sequential reads the 24XX00 contains an
internal Address Pointer which is incremented by one
at the completion of each read operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
device as part of a write operation.
FIGURE 8-1:
CURRENT ADDRESS READ
S
T
S
BUS ACTIVITY
A
Control
Byte
T
Data
MASTER
R
O
P
T
SDA LINE
S 1 0 1 0 x x x 1
P
A
C
K
N
O
BUS ACTIVITY
A
C
K
x = “don’t care” bit
DS21178G-page 8
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 8-2:
RANDOM READ
S
T
A
R
T
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Word
Address(n)
Control
Byte
Data (n)
x x x x
P
S 1 0 1 0 x x x 0
S 1 0 1 0 x x x 1
SDA LINE
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY
A
C
K
x = “don’t care” bit
FIGURE 8-3:
SEQUENTIAL READ
S
T
O
P
BUS ACTIVITY
MASTER
Control
Byte
Data n
Data n + 1
Data n + 2
Data n + x
SDA LINE
P
A
C
K
A
C
K
A
C
K
A
C
K
N
O
BUS ACTIVITY
A
C
K
© 2007 Microchip Technology Inc.
DS21178G-page 9
24AA00/24LC00/24C00
9.0
9.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
24LC00
XXXXXXXX
T/XXXNNN
I/P
13F
e
3
YYWW
0527
8-Lead SOIC (3.90 mm)
Example:
24LC00I
XXXXXXXT
XXXXYYWW
e
3
SN
0527
NNN
13F
Example:
8-Lead TSSOP
XXXX
4L00
I527
13F
TYWW
NNN
Example:
8-Lead 2x3 DFN
204
527
13
XXX
YWW
NN
Example:
M03F
5-Lead SOT-23
XXNN
DS21178G-page 10
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
1st Line Marking Codes
SOT-23
Part Number
DFN
TSSOP
I Temp.
E Temp.
I Temp.
E Temp.
24AA00
4A00
4L00
4C00
B0NN
M0NN
D0NN
—
—
201
204
207
—
—
24LC00
24C00
Note:
E0NN
208
NN = Alphanumeric traceability code
Legend: XX...X Part number or part number code
T
Temperature (I, E)
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
e
3
Note:
For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Note:
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2007 Microchip Technology Inc.
DS21178G-page 11
24AA00/24LC00/24C00
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
INCHES
Dimension Limits
MIN
NOM
8
MAX
Number of Pins
Pitch
N
e
.100 BSC
–
Top to Seating Plane
A
–
.210
.195
–
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.290
.240
.348
.115
.008
.040
.014
–
.130
–
.310
.250
.365
.130
.010
.060
.018
–
.325
.280
.400
.150
.015
.070
.022
.430
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing §
eB
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-018B
DS21178G-page 12
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Small Outline (SN or OA) – Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
c
φ
A2
A
L
A1
L1
β
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
1.27 BSC
Overall Height
A
–
–
1.75
–
Molded Package Thickness
Standoff
A2
A1
E
1.25
0.10
–
§
–
0.25
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
E1
D
h
3.90 BSC
4.90 BSC
0.25
0.40
–
0.50
1.27
L
–
Footprint
L1
φ
1.04 REF
Foot Angle
0°
0.17
0.31
5°
–
–
–
–
–
8°
Lead Thickness
Lead Width
c
0.25
0.51
15°
b
Mold Draft Angle Top
Mold Draft Angle Bottom
α
β
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc.
DS21178G-page 13
24AA00/24LC00/24C00
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
c
φ
A
A2
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
8
0.65 BSC
Overall Height
A
–
–
1.20
1.05
0.15
Molded Package Thickness
Standoff
A2
A1
E
0.80
0.05
1.00
–
Overall Width
6.40 BSC
Molded Package Width
Molded Package Length
Foot Length
E1
D
4.30
2.90
0.45
4.40
4.50
3.10
0.75
3.00
L
0.60
Footprint
L1
φ
1.00 REF
Foot Angle
0°
–
–
–
8°
Lead Thickness
c
0.09
0.20
0.30
Lead Width
b
0.19
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21178G-page 14
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
e
D
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
NOTE 1
2
1
1
2
D2
BOTTOM VIEW
TOP VIEW
A
NOTE 2
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
Number of Pins
Pitch
N
e
0.50 BSC
0.90
Overall Height
Standoff
A
0.80
0.00
1.00
0.05
A1
A3
D
0.02
Contact Thickness
Overall Length
Overall Width
0.20 REF
2.00 BSC
3.00 BSC
–
E
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
D2
E2
b
1.30
1.50
0.18
0.30
0.20
1.75
1.90
0.30
0.50
–
–
0.25
L
0.40
K
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS21178G-page 15
24AA00/24LC00/24C00
5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Lead Pitch
N
e
5
0.95 BSC
Outside Lead Pitch
Overall Height
e1
A
1.90 BSC
0.90
0.89
0.00
2.20
1.30
2.70
0.10
0.35
0°
–
–
–
–
–
–
–
–
–
–
–
1.45
1.30
0.15
3.20
1.80
3.10
0.60
0.80
30°
Molded Package Thickness
Standoff
A2
A1
E
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
L
Footprint
L1
φ
Foot Angle
Lead Thickness
Lead Width
c
0.08
0.20
0.26
0.51
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-091B
DS21178G-page 16
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
APPENDIX A: REVISION HISTORY
Revision E
Added DFN package.
Revision F (02/2007)
Revised Device Selection Table; Features Section;
Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2;
Revised Product ID System; Replaced Package
Drawings; Replaced On-line Support page.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
© 2007 Microchip Technology Inc.
DS21178G-page 17
24AA00/24LC00/24C00
NOTES:
DS21178G-page 18
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://support.microchip.com
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.
© 2007 Microchip Technology Inc.
DS21178G-page 19
24AA00/24LC00/24C00
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
24AA00/24LC00/24C00
DS21178G
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21178G-page 20
© 2007 Microchip Technology Inc.
24AA00/24LC00/24C00
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
/XX
PART NO.
Device
Examples:
a) 24AA00-I/P: Industrial Temperature,1.8V
PDIP package
Temperature Package
Range
b) 24AA00-I/SN: Industrial Temperature,
1.8V, SOIC package
2
Device:
24AA00:
24AA00T:
=
=
1.7V, 128 bit I C™ Serial EEPROM
2
1.7V, 128 bit I C Serial EEPROM
c)
24AA00T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, tape and reel
(Tape and Reel)
2
24LC00:
24LC00T:
=
=
2.5V, 128 bit I C Serial EEPROM
d) 24LC00-I/P: Industrial Temperature,
2.5V, PDIP package
2
2.5V, 128 bit I C Serial EEPROM
(Tape and Reel)
5V, 128 bit I C™ Serial EEPROM
5V, 128 bit I C™ Serial EEPROM
(Tape and Reel)
e) 24C00-E/SN: Extended Temperature,
5V, SOIC package
2
24C00:
24C00T:
=
=
2
f)
24LC00T-I/OT: Industrial Temperature,
2.5V, SOT-23 package, tape and reel
Temperature
Range:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
Package:
P
= Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (3.90 mm body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
OT = SOT-23, 5-lead (Tape and Reel only)
MC = 2x3 DFN, 8-lead
© 2007 Microchip Technology Inc.
DS21178G-page21
24AA00/24LC00/24C00
NOTES:
DS21178G-page 22
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21178G-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21178G-page 24
© 2007 Microchip Technology Inc.
24LC00TE/SN 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
24LC00TI/OT | ETC | (115.48 k) | 获取价格 | |
24LC00TI/SN | MICROCHIP | 16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 获取价格 | |
24LC00TI/SNG | MICROCHIP | 16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 获取价格 | |
24LC00TI/ST | MICROCHIP | 16 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 获取价格 | |
24LC01 | HOLTEK | 1K/2K 2-Wire CMOS Serial EEPROM | 获取价格 | |
24LC01-E/MSG | MICROCHIP | 1K I2C Serial EEPROM | 获取价格 | |
24LC01-E/OTG | MICROCHIP | 1K I2C Serial EEPROM | 获取价格 | |
24LC01-E/PG | MICROCHIP | 1K I2C Serial EEPROM | 获取价格 | |
24LC01-E/SNG | MICROCHIP | 1K I2C Serial EEPROM | 获取价格 | |
24LC01-E/STG | MICROCHIP | 1K I2C Serial EEPROM | 获取价格 |
24LC00TE/SN 相关文章
- 2024-09-20
- 5
- 2024-09-20
- 8
- 2024-09-20
- 8
- 2024-09-20
- 6