25LC640T-E/ST [MICROCHIP]
64K SPI Bus Serial EEPROM; 64K SPI总线串行EEPROM
| 型号： | 25LC640T-E/ST |
| 厂家： | 
MICROCHIP |
| 描述： | 64K SPI Bus Serial EEPROM |
| 文件： | 总24页 (文件大小：342K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
25AA640/25LC640
64K SPI™ Bus Serial EEPROM
Device Selection Table
Description
The Microchip Technology Inc. 25AA640/25LC640
Part
Number
VCC
Range
Max Clock
Frequency
Temp
Ranges
(25XX640*) is a 64 Kbit Serial Electrically Erasable
PROM [EEPROM]. The memory is accessed via a
simple Serial Peripheral Interface (SPI) compatible
serial bus. The bus signals required are a clock input
(SCK) plus separate data in (SI) and data out (SO)
lines. Access to the device is controlled through a Chip
Select (CS) input.
25AA640
25LC640
25LC640
1.8-5.5V
2.5-5.5V
4.5-5.5V
1 MHz
2 MHz
I
I
3/2.5 MHz
I, E
Features
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
• Low-power CMOS technology
- Write current: 3 mA typical
- Read current: 500 µA typical
- Standby current: 500 nA typical
• 8192 x 8 bit organization
• 32 byte page
Block Diagram
Status
• Write cycle time: 5 ms max.
• Self-timed erase and write cycles
• Block write protection
HV Generator
Register
- Protect none, 1/4, 1/2 or all of array
• Built-in write protection
EEPROM
- Power on/off data protection circuitry
- Write enable latch
Memory
Control
Logic
I/O Control
Logic
Array
XDEC
- Write-protect pin
Page
Latches
• Sequential read
• High reliability
- Data retention: > 200 years
- ESD protection: > 4000V
• 8-pin PDIP, SOIC and TSSOP packages
• Temperature ranges supported:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
SI
SO
Y Decoder
CS
SCK
Sense Amp.
R/W Control
HOLD
WP
VCC
VSS
Package Types
PDIP/SOIC
TSSOP
VCC
HOLD
SCK
SI
CS
SO
1
2
3
4
8
7
6
5
8
7
6
5
1
2
3
4
SCK
SI
VSS
WP
HOLD
VCC
CS
SO
WP
VSS
*25XX640 is used in this document as a generic part number for the 25AA640/25LC640 devices.
SPI is a registered trademark of Motorola Corporation.
2004 Microchip Technology Inc.
DS21223G-page 1
25AA640/25LC640
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ........................................................................................................ -0.6V to VCC + 1.0V
Storage temperature .................................................................................................................................-65°C to 150°C
Ambient temperature under bias...............................................................................................................-65°C to 125°C
ESD protection on all pins..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an
extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I):
TA = -40°C to +85°C VCC = 1.8V to 5.5V
Automotive (E): TA = -40°C to +125°C VCC = 4.5V to 5.5V
DC CHARACTERISTICS
Param.
Sym
VIH1
Characteristics
Min
Max
Units
Conditions
VCC ≥ 2.7V (Note 1)
No.
D1
High-level input
voltage
2.0
0.7 VCC
-0.3
VCC + 1
VCC + 1
0.8
V
V
V
V
V
V
V
D2
D3
D4
D5
VIH2
VIL1
VIL2
VOL
VCC < 2.7V (Note 1)
VCC ≥ 2.7V (Note 1)
VCC < 2.7V (Note 1)
IOL = 2.1 mA
Low-level input
voltage
-0.3
0.2 VCC
0.4
Low-level output
voltage
—
—
0.2
IOL = 1.0 mA, VCC = < 2.5V
IOH = -400 µA
D6
VOH
High-level output
voltage
VCC - 0.5
—
D7
D8
ILI
Input leakage current
—
—
±1
±1
µA
µA
CS = VCC, VIN = VSS TO VCC
CS = VCC, VOUT = VSS TO VCC
ILO
Output leakage
current
D9
CINT
Internal Capacitance
(all inputs and
outputs)
—
7
pF
TA = 25°C, CLK = 1.0 MHz,
VCC = 5.0V (Note 1)
D10
ICC Read Operating Current
—
—
1
500
mA
µA
VCC = 5.5V; FCLK = 3.0 MHz;
SO = Open
VCC = 2.5V; FCLK = 2.0 MHz;
SO = Open
D11
D12
ICC Write
—
—
5
3
mA
mA
VCC = 5.5V
VCC = 2.5V
ICCS
Standby Current
—
—
5
1
µA
µA
CS = VCC = 5.5V, Inputs tied to VCC or
VSS
CS = VCC = 2.5V, Inputs tied to VCC or
VSS
Note 1: This parameter is periodically sampled and not 100% tested.
DS21223G-page 2
2004 Microchip Technology Inc.
25AA640/25LC640
TABLE 1-2:
AC CHARACTERISTICS
Industrial (I):
Automotive (E): TA = -40°C to +125°C
TA = -40°C to +85°C
VCC = 1.8V to 5.5V
VCC = 4.5V to 5.5V
AC CHARACTERISTICS
Param.
Sym
Characteristic
Min
Max
Units
Conditions
No.
1
2
3
FCLK
TCSS
TCSH
Clock Frequency
CS Setup Time
CS Hold Time
—
—
—
3
2
1
MHz
MHz
MHz
VCC = 4.5V to 5.5V (Note 2)
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
100
250
500
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
150
250
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
4
5
TCSD
TSU
CS Disable Time
Data Setup Time
500
—
ns
30
50
50
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
6
THD
Data Hold Time
50
100
100
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
7
8
9
TR
TF
CLK Rise Time
CLK Fall Time
Clock High Time
—
—
2
2
µs
µs
(Note 1)
(Note 1)
THI
150
230
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
10
TLO
Clock Low Time
150
230
475
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
11
12
13
TCLD
TCLE
TV
Clock Delay Time
Clock Enable Time
50
50
—
—
ns
ns
Output Valid from
Clock Low
—
—
—
150
230
475
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
14
15
THO
TDIS
Output Hold Time
0
—
ns
(Note 1)
Output Disable Time
—
—
—
200
250
500
ns
ns
ns
VCC = 4.5V to 5.5V (Note 1)
VCC = 2.5V to 5.5V (Note 1)
VCC = 1.8V to 5.5V (Note 1)
16
17
18
19
THS
THH
THZ
THV
HOLD Setup Time
HOLD Hold Time
100
100
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
100
100
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
HOLD Low to Output
High-Z
100
150
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V (Note 1)
VCC = 2.5V to 5.5V (Note 1)
VCC = 1.8V to 5.5V (Note 1)
HOLD High to Output
Valid
100
150
200
—
—
—
ns
ns
ns
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V
VCC = 1.8V to 5.5V
20
21
TWC
—
Internal Write Cycle
Time
—
5
ms
Endurance
1M
—
E/W
(Note 3)
Cycles
Note 1: This parameter is periodically sampled and not 100% tested.
2: FCLK max. = 2.5 MHz for TA > 85°C.
3: This parameter is not tested but established by characterization. For endurance estimates in a specific application,
please consult the Total Endurance™ Model which can be obtained from our web site.
2004 Microchip Technology Inc.
DS21223G-page 3
25AA640/25LC640
FIGURE 1-1:
HOLD TIMING
CS
17
16
16
17
SCK
SO
18
19
High-impedance
Don’t Care
n
n + 2
n + 2
n + 1
n
n - 1
5
n
n + 1
n
n - 1
SI
HOLD
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS
12
2
11
7
3
8
Mode 1,1
Mode 0,0
SCK
SI
5
6
MSB In
LSB In
High-impedance
SO
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS
3
9
10
Mode 1,1
Mode 0,0
SCK
13
15
LSB Out
14
MSB Out
SO
SI
Don’t Care
DS21223G-page 4
2004 Microchip Technology Inc.
25AA640/25LC640
TABLE 1-3:
AC Waveform:
VLO = 0.2V
AC TEST CONDITIONS
FIGURE 1-4:
AC TEST CIRCUIT
VCC
VHI = VCC – 0.2V
(Note 1)
2.25 kΩ
1.8 kΩ
VHI = 4.0V
(Note 2)
Timing Measurement Reference Level
Input
SO
0.5 VCC
0.5 VCC
100 pF
Output
Note 1: For VCC ≤ 4.0V
2: For VCC > 4.0V
2004 Microchip Technology Inc.
DS21223G-page 5
25AA640/25LC640
2.4
Serial Input (SI)
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
The SI pin is used to transfer data into the device. It
receives instructions, addresses, and data. Data is
latched on the rising edge of the serial clock.
TABLE 2-1:
PIN FUNCTION TABLE
2.5
Serial Clock (SCK)
Name PDIP
SOIC
TSSOP
Description
The SCK is used to synchronize the communication
between a master and the 25XX640. Instructions,
addresses, or data present on the SI pin are latched on
the rising edge of the clock input, while data on the SO
pin is updated after the falling edge of the clock input.
CS
SO
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
3
4
5
6
7
8
1
2
Chip Select Input
Serial Data Output
Write-Protect Pin
Ground
WP
VSS
SI
2.6
Hold (HOLD)
Serial Data Input
Serial Clock Input
Hold Input
SCK
HOLD
VCC
The HOLD pin is used to suspend transmission to the
25XX640 while in the middle of a serial sequence with-
out having to retransmit the entire sequence over
again. It must be held high any time this function is not
being used. Once the device is selected and a serial
sequence is underway, the HOLD pin may be pulled
low to pause further serial communication without
resetting the serial sequence. The HOLD pin must be
brought low while SCK is low, otherwise the HOLD
function will not be invoked until the next SCK high-to-
low transition. The 25XX640 must remain selected
during this sequence. The SI, SCK, and SO pins are in
a high-impedance state during the time the device is
paused and transitions on these pins will be ignored. To
resume serial communication, HOLD must be brought
high while the SCK pin is low, otherwise serial
communication will not resume. Lowering the HOLD
line at any time will tri-state the SO line.
Supply Voltage
2.1
Chip Select (CS)
A low level on this pin selects the device. A high level
deselects the device and forces it into Standby mode.
However, a programming cycle which is already
initiated or in progress will be completed, regardless of
the CS input signal. If CS is brought high, or remains
high during a program cycle, the device will go into
Standby mode when the programming cycle is
complete. When the device is deselected, SO goes to
the high-impedance state, allowing multiple parts to
share the same SPI bus. A low-to-high transition on CS
after a valid write sequence initiates an internal write
cycle. After power-up, a high-to-low transition on CS is
required prior to any sequence being initiated.
2.2
Serial Output (SO)
The SO pin is used to transfer data out of the 25XX640.
During a read cycle, data is shifted out on this pin after
the falling edge of the serial clock.
2.3
Write-Protect (WP)
This pin is used in conjunction with the WPEN bit in the
Status register to prohibit writes to the nonvolatile bits
in the Status register. When WP is low and WPEN is
high, writing to the nonvolatile bits in the Status register
is disabled. All other operations function normally.
When WP is high, all functions, including writes to the
nonvolatile bits in the Status register operate normally.
If the WPEN bit is set, WP low during a Status register
write sequence will disable writing to the Status regis-
ter. If an internal write cycle has already begun, WP
going low will have no effect on the write.
The WP pin function is blocked when the WPEN bit in
the Status register is low. This allows the user to install
the 25XX640 in a system with WP pin grounded and
still be able to write to the Status register. The WP pin
functions will be enabled when the WPEN bit is set
high.
DS21223G-page 6
2004 Microchip Technology Inc.
25AA640/25LC640
3.3
Write Sequence
3.0
3.1
FUNCTIONAL DESCRIPTION
Principles Of Operation
Prior to any attempt to write data to the 25XX640 array
or Status register, the write enable latch must be set by
issuing the WRENinstruction (Figure 3-4). This is done
by setting CS low and then clocking out the proper
instruction into the 25XX640. After all eight bits of the
instruction are transmitted, the CS must be brought
high to set the write enable latch. If the write operation
is initiated immediately after the WRENinstruction with-
out CS being brought high, the data will not be written
to the array because the write enable latch will not have
been properly set.
The 25XX640 is a 8192 byte Serial EEPROM designed
to interface directly with the Serial Peripheral Interface
(SPI) port of many of today’s popular microcontroller
families, including Microchip’s PIC16C6X/7X micro-
controllers. It may also interface with microcontrollers
that do not have a built-in SPI port by using discrete
I/O lines programmed properly with the software.
The 25XX640 contains an 8-bit instruction register. The
device is accessed via the SI pin, with data being
clocked in on the rising edge of SCK. The CS pin must
be low and the HOLD pin must be high for the entire
operation.
Once the write enable latch is set, the user may
proceed by setting the CS low, issuing a WRITE
instruction, followed by the address, and then the data
to be written. Up to 32 bytes of data can be sent to the
25XX640 before a write cycle is necessary. The only
restriction is that all of the bytes must reside in the
same page. A page address begins with XXX0 0000
and ends with XXX1 1111. If the internal address
counter reaches XXX1 1111and the clock continues,
the counter will roll back to the first address of the page
and overwrite any data in the page that may have been
written.
Table 3-1 contains a list of the possible instruction
bytes and format for device operation. All instructions,
addresses, and data are transferred MSB first, LSB
last.
Data is sampled on the first rising edge of SCK after CS
goes low. If the clock line is shared with other
peripheral devices on the SPI bus, the user can assert
the HOLD input and place the 25XX640 in ‘HOLD’
mode. After releasing the HOLD pin, operation will
resume from the point when the HOLD was asserted.
For the data to be actually written to the array, the CS
must be brought high after the Least Significant bit (D0)
of the nth data byte has been clocked in. If CS is
brought high at any other time, the write operation will
not be completed. Refer to Figure 3-2 and Figure 3-3
for more detailed illustrations on the byte write
sequence and the page write sequence respectively.
While the write is in progress, the Status register may
be read to check the status of the WPEN, WIP, WEL,
BP1, and BP0 bits (Figure 3-6). A read attempt of a
memory array location will not be possible during a
write cycle. When the write cycle is completed, the
write enable latch is reset.
3.2
Read Sequence
The device is selected by pulling CS low. The 8-bit read
instruction is transmitted to the 25XX640 followed by
the 16-bit address with the three MSBs of the address
being don’t care bits. After the correct read instruction
and address are sent, the data stored in the memory at
the selected address is shifted out on the SO pin. The
data stored in the memory at the next address can be
read sequentially by continuing to provide clock pulses.
The internal address pointer is automatically incre-
mented to the next higher address after each byte of
data is shifted out. When the highest address is
reached (1FFFh), the address counter rolls over to
address 0000h allowing the read cycle to be continued
indefinitely. The read operation is terminated by raising
the CS pin (Figure 3-1).
TABLE 3-1:
INSTRUCTION SET
Instruction Name
Instruction Format
Description
READ
WRITE
WREN
WRDI
RDSR
WRSR
0000 0011
0000 0010
0000 0110
0000 0100
0000 0101
0000 0001
Read data from memory array beginning at selected address
Write data to memory array beginning at selected address
Set the write enable latch (enable write operations)
Reset the write enable latch (disable write operations)
Read Status register
Write Status register
2004 Microchip Technology Inc.
DS21223G-page 7
25AA640/25LC640
FIGURE 3-1:
READ SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
SCK
SI
Instruction
16 Bit Address
1 15 14 13 12
0
0
0
0
0
0
1
2
1
0
Data Out
High-impedance
7
6
5
4
3
2
1
0
SO
FIGURE 3-2:
BYTE WRITE SEQUENCE
CS
Twc
Instruction
16 Bit Address
0 15 14 13 12
Data Byte
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI
High-impedance
SO
FIGURE 3-3:
PAGE WRITE SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Data Byte 1
SCK
Instruction
16 Bit Address
0 15 14 13 12
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI
CS
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
SCK
SI
Data Byte 2
Data Byte 3
Data Byte n (32 max)
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS21223G-page 8
2004 Microchip Technology Inc.
25AA640/25LC640
The following is a list of conditions under which the
write enable latch will be reset:
3.4
Write Enable (WREN) and
Write Disable (WRDI)
• Power-up
The 25XX640 contains a write enable latch. See
Table 3-3 for the Write-Protect Functionality Matrix.
This latch must be set before any write operation will be
completed internally. The WRENinstruction will set the
latch, and the WRDIwill reset the latch.
• WRDIinstruction successfully executed
• WRSRinstruction successfully executed
• WRITEinstruction successfully executed
FIGURE 3-4:
WRITE ENABLE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
0
0
0
0
0
1
1
0
SI
High-impedance
SO
FIGURE 3-5:
WRITE DISABLE SEQUENCE
CS
0
1
2
3
4
5
6
7
SCK
0
0
0
0
0
0
1
0
SI
High-impedance
SO
2004 Microchip Technology Inc.
DS21223G-page 9
25AA640/25LC640
The Write Enable Latch (WEL) bit indicates the status
of the write enable latch. When set to a ‘1’, the latch
allows writes to the array and Status register, when set
to a ‘0’, the latch prohibits writes to the array and Status
register. The state of this bit can always be updated via
the WREN or WRDI commands regardless of the state
of write protection on the Status register. This bit is
read-only.
3.5
Read Status Register Instruction
(RDSR)
The Read Status Register instruction (RDSR) provides
access to the Status register. The Status register may
be read at any time, even during a write cycle. The
Status register is formatted as follows:
7
6
5
4
3
2
1
0
The Block Protection (BP0 and BP1) bits indicate
which blocks are currently write-protected. These bits
are set by the user issuing the WRSRinstruction. These
bits are nonvolatile.
WPEN
X
X
X
BP1 BP0 WEL WIP
The Write-In-Process (WIP) bit indicates whether the
25XX640 is busy with a write operation. When set to a
‘1’, a write is in progress, when set to a ‘0’, no write is
in progress. This bit is read-only.
See Figure 3-6 for RDSR timing sequence.
FIGURE 3-6:
READ STATUS REGISTER TIMING SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
SI
Instruction
0
0
0
0
0
1
0
1
Data from Status Register
High-impedance
SO
7
6
5
4
3
2
1
0
DS21223G-page 10
2004 Microchip Technology Inc.
25AA640/25LC640
TABLE 3-2:
ARRAY PROTECTION
3.6
Write Status Register Instruction
(WRSR)
Array Addresses
Write-Protected
BP1
BP0
The Write Status Register instruction (WRSR) allows the
user to select one of four levels of protection for the
array by writing to the appropriate bits in the Status reg-
ister. The array is divided up into four segments. The
user has the ability to write-protect none, one, two, or
all four of the segments of the array. The partitioning is
controlled as shown in Table 3-2.
0
0
0
1
none
upper 1/4
(1800h-1FFFh)
1
1
0
1
upper 1/2
(1000h-1FFFh)
The Write-Protect Enable (WPEN) bit is a nonvolatile
bit that is available as an enable bit for the WP pin. The
Write-Protect (WP) pin and the Write-Protect Enable
(WPEN) bit in the Status register control the program-
mable hardware write-protect feature. Hardware write
protection is enabled when the WP pin is low and the
WPEN bit is high. Hardware write protection is disabled
when either the WP pin is high or the WPEN bit is low.
When the chip is hardware write-protected, only writes
to nonvolatile bits in the Status register are disabled.
See Table 3-3 for a matrix of functionality on the WPEN
bit.
all
(0000h-1FFFh)
See Figure 3-7 for WRSR timing sequence.
FIGURE 3-7:
WRITE STATUS REGISTER TIMING SEQUENCE
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1
15
0
SCK
SI
Instruction
Data to Status Register
7
6
5
4
3
2
0
0
0
0
0
0
0
1
High-impedance
SO
2004 Microchip Technology Inc.
DS21223G-page 11
25AA640/25LC640
3.7
Data Protection
3.8
Power-On-State
The following protection has been implemented to
prevent inadvertent writes to the array:
The 25XX640 powers on in the following state:
• The device is in low-power Standby mode
(CS= 1)
• The write enable latch is reset
• SO is in high-impedance state
• A high-to-low transition on CS is required to enter
the active state
• The write enable latch is reset on power-up
• A write enable instruction must be issued to set
the write enable latch
• After a byte write, page write, or Status register
write, the write enable latch is reset
• CS must be set high after the proper number of
clock cycles to start an internal write cycle
• Access to the array during an internal write cycle
is ignored and programming is continued
.
TABLE 3-3:
WPEN
WRITE-PROTECT FUNCTIONALITY MATRIX
WP
WEL
Protected Blocks
Unprotected Blocks
Status Register
X
0
1
X
X
0
1
1
1
Protected
Protected
Protected
Protected
Protected
Writable
Writable
Writable
Protected
Writable
Protected
Writable
X
Low
High
DS21223G-page 12
2004 Microchip Technology Inc.
25AA640/25LC640
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
25LC640
/P017
YYWW
0410
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
25LC640
I/SN0410
NNN
017
Example:
8-Lead TSSOP
XXXX
YYWW
5LCX
0410
NNN
017
Legend: XX...X Customer specific information*
YY
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
2004 Microchip Technology Inc.
DS21223G-page 13
25AA640/25LC640
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21223G-page 14
2004 Microchip Technology Inc.
25AA640/25LC640
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
Overall Height
A
.053
.069
1.35
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21223G-page 15
25AA640/25LC640
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21223G-page 16
2004 Microchip Technology Inc.
25AA640/25LC640
APPENDIX A: REVISION HISTORY
Revision F
Corrections to Section 1.0, Electrical Characteristics.
Revision G
Product ID System, Example C: Corrected part
number, added “Alternate Pinout” and corrected part
number in Header.
Updated Trademark and Sales List pages.
2004 Microchip Technology Inc.
DS21223G-page 17
25AA640/25LC640
NOTES:
DS21223G-page 18
2004 Microchip Technology Inc.
25AA640/25LC640
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21223G-page 19
25AA640/25LC640
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
25AA640/25LC640
DS21223G
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21223G-page 20
2004 Microchip Technology Inc.
25AA640/25LC640
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Examples:
Temperature Package
Range
a) 25AA640-I/SN: Industrial Temp.,
SOIC package
b) 25AA640T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
c) 25AA640X-I/ST: Alternate Pinout
Industrial Temp., TSSOP package
d) 25LC640-I/SN: Industrial Temp.,
SOIC package
Device
25AA640:
64K bit 1.8V SPI Serial EEPROM
25AA640T: 64K bit 1.8V SPI Serial EEPROM
(Tape and Reel)
25AA640X: 64K bit 1.8V SPI Serial EEPROM
in alternate pinout (ST only)
25AA640XT: 64K bit 1.8V SPI Serial EEPROM
in alternate pinout Tape and Reel (ST only)
25LC640:
e) 25LC640T-I/SN: Tape and Reel,
Industrial Temp., SOIC package
64K bit 2.5V SPI Serial EEPROM
25LC640T: 64K bit 2.5V SPI Serial EEPROM
(Tape and Reel)
25LC640X: 64K bit 2.5V SPI Serial EEPROM
in alternate pinout (ST only)
f)
25LC640X-I/ST: Alternate Pinout,
Industrial Temp., TSSOP package
25LC640XT: 64K bit 2.5V SPI Serial EEPROM
in alternate pinout Tape and Reel (ST only)
Temperature Range
Package
I
E
=
=
-40°C to +85°C
-40°C to +125°C
P
SN
ST
=
=
=
Plastic DIP (300 mil Body), 8-lead
Plastic SOIC (150 mil Body), 8-lead
Plastic TSSOP (4.4 mm Body), 8-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21223G-page 21
25AA640/25LC640
NOTES:
DS21223G-page 22
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart and rfPIC are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode,
SmartSensor, SmartTel and Total Endurance are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003. The Company’s quality system processes and procedures are for
its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21223G-page 23
WORLDWIDE SALES AND SERVICE
China - Beijing
Korea
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Unit 706B
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Fax: 86-28-86766599
Boston
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
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Tel: 852-2401-1200
Fax: 852-2401-3431
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
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Detroit
Tri-Atria Office Building
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Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
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Kokomo, IN 46902
Tel: 765-864-8360
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Parc d’Activite du Moulin de Massy
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91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Room 401, Hongjian Building, No. 2
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
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District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Toronto
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
02/17/04
DS21223G-page 24
2004 Microchip Technology Inc.
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