25LC640XT [MICROCHIP]

64K SPI Bus Serial EEPROM; 64K SPI总线串行EEPROM
25LC640XT
型号: 25LC640XT
厂家: MICROCHIP    MICROCHIP
描述:

64K SPI Bus Serial EEPROM
64K SPI总线串行EEPROM

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总24页 (文件大小:361K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Not recommended for new designs –  
Please use 25AA640A or 25LC640A.  
25AA640/25LC640  
64K SPI Bus Serial EEPROM  
Description:  
Device Selection Table  
Part  
Number  
VCC  
Range  
Max Clock  
Frequency  
Temp  
Ranges  
The Microchip Technology Inc. 25AA640/25LC640  
(25XX640*) is a 64 Kbit Serial Electrically Erasable  
PROM [EEPROM]. The memory is accessed via a  
simple Serial Peripheral Interface (SPI) compatible  
serial bus. The bus signals required are a clock input  
(SCK) plus separate data in (SI) and data out (SO)  
lines. Access to the device is controlled through a Chip  
Select (CS) input.  
25AA640  
25LC640  
25LC640  
1.8-5.5V  
2.5-5.5V  
4.5-5.5V  
1 MHz  
2 MHz  
I
I
3/2.5 MHz  
I, E  
Features:  
Communication to the device can be paused via the  
hold pin (HOLD). While the device is paused,  
transitions on its inputs will be ignored, with the  
exception of Chip Select, allowing the host to service  
higher priority interrupts.  
• Low-Power CMOS Technology  
- Write current: 3 mA, typical  
- Read current: 500 μA, typical  
- Standby current: 500 nA, typical  
• 8192 x 8 Bit Organization  
• 32 Byte Page  
Block Diagram  
• Write Cycle Time: 5 ms max.  
• Self-Timed Erase and Write Cycles  
• Block Write Protection  
STATUS  
HV Generator  
Register  
- Protect none, 1/4, 1/2 or all of array  
• Built-in Write Protection  
EEPROM  
- Power on/off data protection circuitry  
- Write enable latch  
Memory  
Control  
Logic  
I/O Control  
Logic  
Array  
XDEC  
- Write-protect pin  
• Sequential Read  
Page  
Latches  
• High Reliability  
- Data retention: > 200 years  
- ESD protection: > 4000V  
• 8-pin PDIP, SOIC and TSSOP Packages  
Temperature Ranges Supported:  
- Industrial (I): -40°C to +85°C  
- Automotive (E): -40°C to +125°C  
SI  
SO  
Y Decoder  
CS  
SCK  
Sense Amp.  
R/W Control  
HOLD  
WP  
VCC  
VSS  
Package Types  
PDIP/SOIC  
TSSOP  
VCC  
HOLD  
SCK  
SI  
CS  
SO  
1
2
3
4
8
7
6
5
8
7
6
5
1
2
3
4
SCK  
SI  
VSS  
WP  
HOLD  
VCC  
CS  
WP  
VSS  
SO  
*25XX640 is used in this document as a generic part number for the 25AA640/25LC640 devices.  
© 2008 Microchip Technology Inc.  
DS21223H-page 1  
25AA640/25LC640  
1.0  
ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
VCC.............................................................................................................................................................................7.0V  
All inputs and outputs w.r.t. VSS ........................................................................................................ -0.6V to VCC + 1.0V  
Storage temperature .................................................................................................................................-65°C to 150°C  
Ambient temperature under bias...............................................................................................................-65°C to 125°C  
ESD protection on all pins..........................................................................................................................................4 kV  
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at those or any other conditions above those  
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an  
extended period of time may affect device reliability.  
TABLE 1-1:  
DC CHARACTERISTICS  
Industrial (I):  
TA = -40°C to +85°C VCC = 1.8V to 5.5V  
Automotive (E): TA = -40°C to +125°C VCC = 4.5V to 5.5V  
DC CHARACTERISTICS  
Param.  
Sym  
VIH1  
Characteristics  
Min  
Max  
Units  
Conditions  
VCC 2.7V (Note 1)  
No.  
D1  
High-level input  
voltage  
2.0  
0.7 VCC  
-0.3  
VCC + 1  
VCC + 1  
0.8  
V
V
V
V
V
V
V
D2  
D3  
D4  
D5  
VIH2  
VIL1  
VIL2  
VOL  
VCC < 2.7V (Note 1)  
VCC 2.7V (Note 1)  
VCC < 2.7V (Note 1)  
IOL = 2.1 mA  
Low-level input  
voltage  
-0.3  
0.2 VCC  
0.4  
Low-level output  
voltage  
0.2  
IOL = 1.0 mA, VCC = < 2.5V  
IOH = -400 μA  
D6  
VOH  
High-level output  
voltage  
VCC - 0.5  
D7  
D8  
ILI  
Input leakage current  
±1  
±1  
μA  
μA  
CS = VCC, VIN = VSS TO VCC  
CS = VCC, VOUT = VSS TO VCC  
ILO  
Output leakage  
current  
D9  
CINT  
Internal Capacitance  
(all inputs and  
outputs)  
7
pF  
TA = 25°C, CLK = 1.0 MHz,  
VCC = 5.0V (Note 1)  
D10  
ICC Read Operating Current  
1
500  
mA  
μA  
VCC = 5.5V; FCLK = 3.0 MHz;  
SO = Open  
VCC = 2.5V; FCLK = 2.0 MHz;  
SO = Open  
D11  
D12  
ICC Write  
5
3
mA  
mA  
VCC = 5.5V  
VCC = 2.5V  
ICCS  
Standby Current  
5
1
μA  
μA  
CS = VCC = 5.5V, Inputs tied to VCC or  
VSS  
CS = VCC = 2.5V, Inputs tied to VCC or  
VSS  
Note 1: This parameter is periodically sampled and not 100% tested.  
DS21223H-page 2  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
TABLE 1-2:  
AC CHARACTERISTICS  
Industrial (I):  
Automotive (E): TA = -40°C to +125°C  
TA = -40°C to +85°C  
VCC = 1.8V to 5.5V  
VCC = 4.5V to 5.5V  
AC CHARACTERISTICS  
Param.  
Sym  
Characteristic  
Min  
Max  
Units  
Conditions  
No.  
1
2
3
FCLK  
TCSS  
TCSH  
Clock Frequency  
CS Setup Time  
CS Hold Time  
3
2
1
MHz  
MHz  
MHz  
VCC = 4.5V to 5.5V (Note 2)  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
100  
250  
500  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
150  
250  
475  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
4
5
TCSD  
TSU  
CS Disable Time  
Data Setup Time  
500  
ns  
30  
50  
50  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
6
THD  
Data Hold Time  
50  
100  
100  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
7
8
9
TR  
TF  
CLK Rise Time  
CLK Fall Time  
Clock High Time  
2
2
μs  
μs  
(Note 1)  
(Note 1)  
THI  
150  
230  
475  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
10  
TLO  
Clock Low Time  
150  
230  
475  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
11  
12  
13  
TCLD  
TCLE  
TV  
Clock Delay Time  
Clock Enable Time  
50  
50  
ns  
ns  
Output Valid from  
Clock Low  
150  
230  
475  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
14  
15  
THO  
TDIS  
Output Hold Time  
0
ns  
(Note 1)  
Output Disable Time  
200  
250  
500  
ns  
ns  
ns  
VCC = 4.5V to 5.5V (Note 1)  
VCC = 2.5V to 5.5V (Note 1)  
VCC = 1.8V to 5.5V (Note 1)  
16  
17  
18  
19  
THS  
THH  
THZ  
THV  
HOLD Setup Time  
HOLD Hold Time  
100  
100  
200  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
100  
100  
200  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
HOLD Low to Output  
High-Z  
100  
150  
200  
ns  
ns  
ns  
VCC = 4.5V to 5.5V (Note 1)  
VCC = 2.5V to 5.5V (Note 1)  
VCC = 1.8V to 5.5V (Note 1)  
HOLD High to Output  
Valid  
100  
150  
200  
ns  
ns  
ns  
VCC = 4.5V to 5.5V  
VCC = 2.5V to 5.5V  
VCC = 1.8V to 5.5V  
20  
21  
TWC  
Internal Write Cycle  
Time  
5
ms  
Endurance  
1M  
E/W  
(Note 3)  
Cycles  
Note 1: This parameter is periodically sampled and not 100% tested.  
2: FCLK max. = 2.5 MHz for TA > 85°C.  
3: This parameter is not tested but established by characterization. For endurance estimates in a specific application,  
please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at: www.microchip.com.  
© 2008 Microchip Technology Inc.  
DS21223H-page 3  
25AA640/25LC640  
FIGURE 1-1:  
HOLD TIMING  
CS  
17  
16  
16  
17  
SCK  
SO  
18  
19  
High-Impedance  
Don’t Care  
n
n + 2  
n + 2  
n + 1  
n
n - 1  
5
n
n + 1  
n
n - 1  
SI  
HOLD  
FIGURE 1-2:  
SERIAL INPUT TIMING  
4
CS  
12  
2
11  
7
3
8
Mode 1,1  
Mode 0,0  
SCK  
SI  
5
6
MSB In  
LSB In  
High-Impedance  
SO  
FIGURE 1-3:  
SERIAL OUTPUT TIMING  
CS  
3
9
10  
Mode 1,1  
Mode 0,0  
SCK  
13  
15  
LSB Out  
14  
MSB Out  
SO  
SI  
Don’t Care  
DS21223H-page 4  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
TABLE 1-3:  
AC Waveform:  
VLO = 0.2V  
AC TEST CONDITIONS  
FIGURE 1-4:  
AC TEST CIRCUIT  
VCC  
VHI = VCC – 0.2V  
(Note 1)  
2.25 kΩ  
1.8 kΩ  
VHI = 4.0V  
(Note 2)  
Timing Measurement Reference Level  
Input  
SO  
0.5 VCC  
0.5 VCC  
100 pF  
Output  
Note 1: For VCC 4.0V  
2: For VCC > 4.0V  
© 2008 Microchip Technology Inc.  
DS21223H-page 5  
25AA640/25LC640  
The WP pin function is blocked when the WPEN bit in  
the STATUS register is low. This allows the user to  
install the 25XX640 in a system with WP pin grounded  
and still be able to write to the STATUS register. The  
WP pin functions will be enabled when the WPEN bit is  
set high.  
2.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 2-1.  
TABLE 2-1:  
PIN FUNCTION TABLE  
Name PDIP  
SOIC  
TSSOP  
Description  
2.4  
Serial Input (SI)  
CS  
SO  
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
3
4
5
6
7
8
1
2
Chip Select Input  
Serial Data Output  
Write-Protect Pin  
Ground  
The SI pin is used to transfer data into the device. It  
receives instructions, addresses, and data. Data is  
latched on the rising edge of the serial clock.  
WP  
VSS  
SI  
2.5  
Serial Clock (SCK)  
Serial Data Input  
Serial Clock Input  
Hold Input  
The SCK is used to synchronize the communication  
between a master and the 25XX640. Instructions,  
addresses, or data present on the SI pin are latched on  
the rising edge of the clock input, while data on the SO  
pin is updated after the falling edge of the clock input.  
SCK  
HOLD  
VCC  
Supply Voltage  
2.1  
Chip Select (CS)  
2.6  
Hold (HOLD)  
A low level on this pin selects the device. A high level  
deselects the device and forces it into Standby mode.  
However, a programming cycle which is already  
initiated or in progress will be completed, regardless of  
the CS input signal. If CS is brought high, or remains  
high during a program cycle, the device will go into  
Standby mode when the programming cycle is  
complete. When the device is deselected, SO goes to  
the high-impedance state, allowing multiple parts to  
share the same SPI bus. A low-to-high transition on CS  
after a valid write sequence initiates an internal write  
cycle. After power-up, a high-to-low transition on CS is  
required prior to any sequence being initiated.  
The HOLD pin is used to suspend transmission to the  
25XX640 while in the middle of a serial sequence with-  
out having to retransmit the entire sequence over  
again. It must be held high any time this function is not  
being used. Once the device is selected and a serial  
sequence is underway, the HOLD pin may be pulled  
low to pause further serial communication without  
resetting the serial sequence. The HOLD pin must be  
brought low while SCK is low, otherwise the HOLD  
function will not be invoked until the next SCK high-to-  
low transition. The 25XX640 must remain selected  
during this sequence. The SI, SCK, and SO pins are in  
a high-impedance state during the time the device is  
paused and transitions on these pins will be ignored. To  
resume serial communication, HOLD must be brought  
high while the SCK pin is low, otherwise serial  
communication will not resume. Lowering the HOLD  
line at any time will tri-state the SO line.  
2.2  
Serial Output (SO)  
The SO pin is used to transfer data out of the 25XX640.  
During a read cycle, data is shifted out on this pin after  
the falling edge of the serial clock.  
2.3  
Write-Protect (WP)  
This pin is used in conjunction with the WPEN bit in the  
STATUS register to prohibit writes to the nonvolatile  
bits in the STATUS register. When WP is low and  
WPEN is high, writing to the nonvolatile bits in the STA-  
TUS register is disabled. All other operations function  
normally. When WP is high, all functions, including  
writes to the nonvolatile bits in the STATUS register  
operate normally. If the WPEN bit is set, WP low during  
a STATUS register write sequence will disable writing  
to the STATUS register. If an internal write cycle has  
already begun, WP going low will have no effect on the  
write.  
DS21223H-page 6  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
3.3  
Write Sequence  
3.0  
FUNCTIONAL DESCRIPTION  
Prior to any attempt to write data to the 25XX640 array  
or STATUS register, the write enable latch must be set  
by issuing the WREN instruction (Figure 3-4). This is  
done by setting CS low and then clocking out the  
proper instruction into the 25XX640. After all eight bits  
of the instruction are transmitted, the CS must be  
brought high to set the write enable latch. If the write  
operation is initiated immediately after the WREN  
instruction without CS being brought high, the data will  
not be written to the array because the write enable  
latch will not have been properly set.  
3.1  
Principles Of Operation  
The 25XX640 is a 8192 byte Serial EEPROM designed  
to interface directly with the Serial Peripheral Interface  
(SPI) port of many of today’s popular microcontroller  
families, including Microchip’s PIC16C6X/7X micro-  
controllers. It may also interface with microcontrollers  
that do not have a built-in SPI port by using discrete  
I/O lines programmed properly with the software.  
The 25XX640 contains an 8-bit instruction register. The  
device is accessed via the SI pin, with data being  
clocked in on the rising edge of SCK. The CS pin must  
be low and the HOLD pin must be high for the entire  
operation.  
Once the write enable latch is set, the user may  
proceed by setting the CS low, issuing a WRITE  
instruction, followed by the address, and then the data  
to be written. Up to 32 bytes of data can be sent to the  
25XX640 before a write cycle is necessary. The only  
restriction is that all of the bytes must reside in the  
same page. A page address begins with XXX0 0000  
and ends with XXX1 1111. If the internal address  
counter reaches XXX1 1111and the clock continues,  
the counter will roll back to the first address of the page  
and overwrite any data in the page that may have been  
written.  
Table 3-1 contains a list of the possible instruction  
bytes and format for device operation. All instructions,  
addresses, and data are transferred MSB first, LSB  
last.  
Data is sampled on the first rising edge of SCK after CS  
goes low. If the clock line is shared with other  
peripheral devices on the SPI bus, the user can assert  
the HOLD input and place the 25XX640 in ‘HOLD’  
mode. After releasing the HOLD pin, operation will  
resume from the point when the HOLD was asserted.  
For the data to be actually written to the array, the CS  
must be brought high after the Least Significant bit (D0)  
of the nth data byte has been clocked in. If CS is  
brought high at any other time, the write operation will  
not be completed. Refer to Figure 3-2 and Figure 3-3  
for more detailed illustrations on the byte write  
sequence and the page write sequence, respectively.  
While the write is in progress, the STATUS register may  
be read to check the status of the WPEN, WIP, WEL,  
BP1, and BP0 bits (Figure 3-6). A read attempt of a  
memory array location will not be possible during a  
write cycle. When the write cycle is completed, the  
write enable latch is reset.  
3.2  
Read Sequence  
The device is selected by pulling CS low. The 8-bit  
READ instruction is transmitted to the 25XX640 fol-  
lowed by the 16-bit address with the three MSBs of the  
address being “don’t care” bits. After the correct READ  
instruction and address are sent, the data stored in the  
memory at the selected address is shifted out on the  
SO pin. The data stored in the memory at the next  
address can be read sequentially by continuing to pro-  
vide clock pulses. The internal Address Pointer is auto-  
matically incremented to the next higher address after  
each byte of data is shifted out. When the highest  
address is reached (1FFFh), the address counter rolls  
over to address 0000h allowing the read cycle to be  
continued indefinitely. The read operation is terminated  
by raising the CS pin (Figure 3-1).  
TABLE 3-1:  
INSTRUCTION SET  
Instruction Name  
Instruction Format  
Description  
READ  
WRITE  
WREN  
WRDI  
RDSR  
WRSR  
0000 0011  
0000 0010  
0000 0110  
0000 0100  
0000 0101  
0000 0001  
Read data from memory array beginning at selected address  
Write data to memory array beginning at selected address  
Set the write enable latch (enable write operations)  
Reset the write enable latch (disable write operations)  
Read STATUS register  
Write STATUS register  
© 2008 Microchip Technology Inc.  
DS21223H-page 7  
25AA640/25LC640  
FIGURE 3-1:  
READ SEQUENCE  
CS  
0
1
2
3
4
5
6
7
8
9 10 11  
21 22 23 24 25 26 27 28 29 30 31  
SCK  
SI  
Instruction  
16-bit Address  
1 15 14 13 12  
0
0
0
0
0
0
1
2
1
0
Data Out  
High-Impedance  
7
6
5
4
3
2
1
0
SO  
FIGURE 3-2:  
BYTE WRITE SEQUENCE  
CS  
Twc  
Instruction  
16-bit Address  
0 15 14 13 12  
Data Byte  
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI  
High-Impedance  
SO  
FIGURE 3-3:  
PAGE WRITE SEQUENCE  
CS  
0
1
2
3
4
5
6
7
8
9 10 11  
21 22 23 24 25 26 27 28 29 30 31  
Data Byte 1  
SCK  
Instruction  
16-bit Address  
0 15 14 13 12  
0
0
0
0
0
0
1
2
1
0
7
6
5
4
3
2
1
0
SI  
CS  
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47  
SCK  
SI  
Data Byte 2  
Data Byte 3  
Data Byte n (32 max)  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
DS21223H-page 8  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
The following is a list of conditions under which the  
write enable latch will be reset:  
3.4  
Write Enable (WREN) and  
Write Disable (WRDI)  
• Power-up  
The 25XX640 contains a write enable latch. See  
Table 3-3 for the Write-Protect Functionality Matrix.  
This latch must be set before any write operation will be  
completed internally. The WRENinstruction will set the  
latch, and the WRDIwill reset the latch.  
WRDIinstruction successfully executed  
WRSRinstruction successfully executed  
WRITEinstruction successfully executed  
FIGURE 3-4:  
WRITE ENABLE SEQUENCE  
CS  
0
1
2
3
4
5
6
7
SCK  
0
0
0
0
0
1
1
0
SI  
High-Impedance  
SO  
FIGURE 3-5:  
WRITE DISABLE SEQUENCE  
CS  
0
1
2
3
4
5
6
7
SCK  
0
0
0
0
0
0
1
0
SI  
High-Impedance  
SO  
© 2008 Microchip Technology Inc.  
DS21223H-page 9  
25AA640/25LC640  
The Write Enable Latch (WEL) bit indicates the status  
of the write enable latch. When set to a ‘1’, the latch  
allows writes to the array and STATUS register, when  
set to a ‘0’, the latch prohibits writes to the array and  
STATUS register. The state of this bit can always be  
updated via the WREN or WRDI commands regardless  
of the state of write protection on the STATUS register.  
This bit is read-only.  
3.5  
Read Status Register Instruction  
(RDSR)  
The Read Status Register instruction (RDSR) provides  
access to the STATUS register. The STATUS register  
may be read at any time, even during a write cycle. The  
STATUS register is formatted as follows:  
7
6
5
4
3
2
1
0
The Block Protection (BP0 and BP1) bits indicate  
which blocks are currently write-protected. These bits  
are set by the user issuing the WRSRinstruction. These  
bits are nonvolatile.  
WPEN  
X
X
X
BP1 BP0 WEL WIP  
The Write-In-Process (WIP) bit indicates whether the  
25XX640 is busy with a write operation. When set to a  
1’, a write is in progress, when set to a ‘0’, no write is  
in progress. This bit is read-only.  
See Figure 3-6 for RDSR timing sequence.  
FIGURE 3-6:  
READ STATUS REGISTER TIMING SEQUENCE  
CS  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
SCK  
SI  
Instruction  
0
0
0
0
0
1
0
1
Data from STATUS Register  
High-Impedance  
SO  
7
6
5
4
3
2
1
0
DS21223H-page 10  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
TABLE 3-2:  
ARRAY PROTECTION  
3.6  
Write Status Register Instruction  
(WRSR)  
Array Addresses  
Write-Protected  
BP1  
BP0  
The Write Status Register instruction (WRSR) allows the  
user to select one of four levels of protection for the  
array by writing to the appropriate bits in the STATUS  
register. The array is divided up into four segments.  
The user has the ability to write-protect none, one, two,  
or all four of the segments of the array. The partitioning  
is controlled as shown in Table 3-2.  
0
0
0
1
none  
upper 1/4  
(1800h-1FFFh)  
1
1
0
1
upper 1/2  
(1000h-1FFFh)  
The Write-Protect Enable (WPEN) bit is a nonvolatile  
bit that is available as an enable bit for the WP pin. The  
Write-Protect (WP) pin and the Write-Protect Enable  
(WPEN) bit in the STATUS register control the pro-  
grammable hardware write-protect feature. Hardware  
write protection is enabled when the WP pin is low and  
the WPEN bit is high. Hardware write protection is dis-  
abled when either the WP pin is high or the WPEN bit  
is low. When the chip is hardware write-protected, only  
writes to nonvolatile bits in the STATUS register are dis-  
abled. See Table 3-3 for a matrix of functionality on the  
WPEN bit.  
all  
(0000h-1FFFh)  
See Figure 3-7 for WRSR timing sequence.  
FIGURE 3-7:  
WRITE STATUS REGISTER TIMING SEQUENCE  
CS  
0
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
1
15  
0
SCK  
SI  
Instruction  
Data to STATUS Register  
7
6
5
4
3
2
0
0
0
0
0
0
0
1
High-Impedance  
SO  
© 2008 Microchip Technology Inc.  
DS21223H-page 11  
25AA640/25LC640  
3.7  
Data Protection  
3.8  
Power-On-State  
The following protection has been implemented to  
prevent inadvertent writes to the array:  
The 25XX640 powers on in the following state:  
• The device is in low-power Standby mode  
(CS= 1)  
• The write enable latch is reset  
• SO is in high-impedance state  
• A high-to-low transition on CS is required to enter  
the active state  
• The write enable latch is reset on power-up  
• A write enable instruction must be issued to set  
the write enable latch  
• After a byte write, page write, or STATUS register  
write, the write enable latch is reset  
• CS must be set high after the proper number of  
clock cycles to start an internal write cycle  
• Access to the array during an internal write cycle  
is ignored and programming is continued  
.
TABLE 3-3:  
WPEN  
WRITE-PROTECT FUNCTIONALITY MATRIX  
WP  
WEL  
Protected Blocks  
Unprotected Blocks  
STATUS Register  
X
0
1
X
X
0
1
1
1
Protected  
Protected  
Protected  
Protected  
Protected  
Writable  
Writable  
Writable  
Protected  
Writable  
Protected  
Writable  
X
Low  
High  
DS21223H-page 12  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
4.0  
4.1  
PACKAGING INFORMATION  
Package Marking Information  
8-Lead PDIP (300 mil)  
Example:  
XXXXXXXX  
XXXXXNNN  
25LC640  
/P017  
YYWW  
0410  
8-Lead SOIC (150 mil)  
Example:  
XXXXXXXX  
XXXXYYWW  
25LC640  
I/SN0410  
NNN  
017  
Example:  
8-Lead TSSOP  
XXXX  
YYWW  
5LCX  
0410  
NNN  
017  
Legend: XX...X Customer-specific information  
Y
Year code (last digit of calendar year)  
YY  
Year code (last 2 digits of calendar year)  
WW  
NNN  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility  
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please  
check with your Microchip Sales Office.  
© 2008 Microchip Technology Inc.  
DS21223H-page 13  
25AA640/25LC640  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢐꢁꢂꢋꢐꢃꢆꢑꢇꢒꢆMꢆꢓꢔꢔꢆꢕꢋꢈꢆꢖꢗꢅꢘꢆꢙꢇꢍꢏꢇꢚ  
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
N
NOTE 1  
E1  
3
1
2
D
E
A2  
A
L
A1  
c
e
eB  
b1  
b
6ꢄꢃ&!  
ꢚ7,8.ꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
<
ꢁꢀꢕꢕꢅ1ꢐ,  
M
ꢁꢀ-ꢕ  
M
ꢁ-ꢀꢕ  
ꢁꢎꢘꢕ  
ꢁ-?ꢘ  
ꢁꢀ-ꢕ  
ꢁꢕꢀꢕ  
ꢁꢕ?ꢕ  
ꢁꢕꢀ<  
M
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
ꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
1ꢆ!ꢈꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
ꢐꢍꢋ"ꢇ#ꢈꢉꢅ&ꢋꢅꢐꢍꢋ"ꢇ#ꢈꢉꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
7
ꢗꢎ  
ꢗꢀ  
.
.ꢀ  
9
)ꢀ  
)
ꢈ1  
M
ꢁꢎꢀꢕ  
ꢁꢀꢛꢘ  
M
ꢁꢀꢀꢘ  
ꢁꢕꢀꢘ  
ꢁꢎꢛꢕ  
ꢁꢎꢖꢕ  
ꢁ-ꢖ<  
ꢁꢀꢀꢘ  
ꢁꢕꢕ<  
ꢁꢕꢖꢕ  
ꢁꢕꢀꢖ  
M
ꢁ-ꢎꢘ  
ꢁꢎ<ꢕ  
ꢁꢖꢕꢕ  
ꢁꢀꢘꢕ  
ꢁꢕꢀꢘ  
ꢁꢕꢜꢕ  
ꢁꢕꢎꢎ  
ꢁꢖ-ꢕ  
ꢙꢃꢓꢅ&ꢋꢅꢐꢈꢆ&ꢃꢄꢑꢅꢂꢇꢆꢄꢈ  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
6ꢓꢓꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
9ꢋ*ꢈꢉꢅ9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅꢝꢋ*ꢅꢐꢓꢆꢌꢃꢄꢑꢅꢅꢏ  
ꢛꢗꢊꢃꢉꢜ  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢁꢕꢀꢕ/ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2ꢅ1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢀ<1  
DS21223H-page 14  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ  
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D
e
N
E
E1  
NOTE 1  
1
2
3
α
h
b
h
c
φ
A2  
A
L
A1  
L1  
β
6ꢄꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
7
<
ꢀꢁꢎꢜꢅ1ꢐ,  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
ꢐ&ꢆꢄ#ꢋ%%ꢅꢅ  
M
ꢀꢁꢎꢘ  
ꢕꢁꢀꢕ  
M
M
M
ꢀꢁꢜꢘ  
M
ꢕꢁꢎꢘ  
ꢗꢎ  
ꢗꢀ  
.
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
?ꢁꢕꢕꢅ1ꢐ,  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
: ꢈꢉꢆꢇꢇꢅ9ꢈꢄꢑ&ꢍ  
,ꢍꢆ'%ꢈꢉꢅ@ꢋꢓ&ꢃꢋꢄꢆꢇA  
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ  
.ꢀ  
-ꢁꢛꢕꢅ1ꢐ,  
ꢖꢁꢛꢕꢅ1ꢐ,  
ꢕꢁꢎꢘ  
ꢕꢁꢖꢕ  
M
M
ꢕꢁꢘꢕ  
ꢀꢁꢎꢜ  
9
3ꢋꢋ&ꢓꢉꢃꢄ&  
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ  
ꢔꢋꢇ#ꢅꢒꢉꢆ%&ꢅꢗꢄꢑꢇꢈꢅ1ꢋ&&ꢋ'  
9ꢀ  
ꢀꢁꢕꢖꢅꢝ.3  
ꢕꢟ  
ꢕꢁꢀꢜ  
ꢕꢁ-ꢀ  
ꢘꢟ  
M
M
M
M
M
<ꢟ  
)
ꢕꢁꢎꢘ  
ꢕꢁꢘꢀ  
ꢀꢘꢟ  
ꢘꢟ  
ꢀꢘꢟ  
ꢛꢗꢊꢃꢉꢜ  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢏꢅꢐꢃꢑꢄꢃ%ꢃꢌꢆꢄ&ꢅ,ꢍꢆꢉꢆꢌ&ꢈꢉꢃ!&ꢃꢌꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
ꢖꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕꢘꢜ1  
© 2008 Microchip Technology Inc.  
DS21223H-page 15  
25AA640/25LC640  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ ꢛꢒꢆMꢆꢛꢄ""ꢗ#$ꢆꢓ%&ꢔꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ !ꢏ'ꢚ  
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
DS21223H-page 16  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ()ꢋꢐꢆ )"ꢋꢐ*ꢆ ꢕꢄꢈꢈꢆ!ꢎꢊꢈꢋꢐꢃꢆꢑ (ꢒꢆMꢆ+%+ꢆꢕꢕꢆꢖꢗꢅꢘꢆꢙ(  !ꢇꢚ  
ꢛꢗꢊꢃꢜ 3ꢋꢉꢅ&ꢍꢈꢅ'ꢋ!&ꢅꢌ"ꢉꢉꢈꢄ&ꢅꢓꢆꢌ4ꢆꢑꢈꢅ#ꢉꢆ*ꢃꢄꢑ!(ꢅꢓꢇꢈꢆ!ꢈꢅ!ꢈꢈꢅ&ꢍꢈꢅꢔꢃꢌꢉꢋꢌꢍꢃꢓꢅꢂꢆꢌ4ꢆꢑꢃꢄꢑꢅꢐꢓꢈꢌꢃ%ꢃꢌꢆ&ꢃꢋꢄꢅꢇꢋꢌꢆ&ꢈ#ꢅꢆ&ꢅ  
ꢍ&&ꢓ255***ꢁ'ꢃꢌꢉꢋꢌꢍꢃꢓꢁꢌꢋ'5ꢓꢆꢌ4ꢆꢑꢃꢄꢑ  
D
N
E
E1  
NOTE 1  
1
2
b
e
c
φ
A
A2  
A1  
L
L1  
6ꢄꢃ&!  
ꢔꢚ99ꢚꢔ.ꢙ.ꢝꢐ  
ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢅ9ꢃ'ꢃ&!  
ꢔꢚ7  
7:ꢔ  
ꢔꢗ;  
7"')ꢈꢉꢅꢋ%ꢅꢂꢃꢄ!  
ꢂꢃ&ꢌꢍ  
7
<
ꢕꢁ?ꢘꢅ1ꢐ,  
: ꢈꢉꢆꢇꢇꢅ8ꢈꢃꢑꢍ&  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅꢙꢍꢃꢌ4ꢄꢈ!!  
ꢐ&ꢆꢄ#ꢋ%%ꢅ  
M
ꢕꢁ<ꢕ  
ꢕꢁꢕꢘ  
M
ꢀꢁꢕꢕ  
M
ꢀꢁꢎꢕ  
ꢀꢁꢕꢘ  
ꢕꢁꢀꢘ  
ꢗꢎ  
ꢗꢀ  
.
: ꢈꢉꢆꢇꢇꢅ>ꢃ#&ꢍ  
?ꢁꢖꢕꢅ1ꢐ,  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ>ꢃ#&ꢍ  
ꢔꢋꢇ#ꢈ#ꢅꢂꢆꢌ4ꢆꢑꢈꢅ9ꢈꢄꢑ&ꢍ  
3ꢋꢋ&ꢅ9ꢈꢄꢑ&ꢍ  
.ꢀ  
9
ꢖꢁ-ꢕ  
ꢎꢁꢛꢕ  
ꢕꢁꢖꢘ  
ꢖꢁꢖꢕ  
-ꢁꢕꢕ  
ꢕꢁ?ꢕ  
ꢖꢁꢘꢕ  
-ꢁꢀꢕ  
ꢕꢁꢜꢘ  
3ꢋꢋ&ꢓꢉꢃꢄ&  
3ꢋꢋ&ꢅꢗꢄꢑꢇꢈ  
9ꢈꢆ#ꢅꢙꢍꢃꢌ4ꢄꢈ!!  
9ꢈꢆ#ꢅ>ꢃ#&ꢍ  
9ꢀ  
ꢀꢁꢕꢕꢅꢝ.3  
ꢕꢟ  
ꢕꢁꢕꢛ  
ꢕꢁꢀꢛ  
M
M
M
<ꢟ  
)
ꢕꢁꢎꢕ  
ꢕꢁ-ꢕ  
ꢛꢗꢊꢃꢉꢜ  
ꢀꢁ ꢂꢃꢄꢅꢀꢅ ꢃ!"ꢆꢇꢅꢃꢄ#ꢈ$ꢅ%ꢈꢆ&"ꢉꢈꢅ'ꢆꢊꢅ ꢆꢉꢊ(ꢅ)"&ꢅ'"!&ꢅ)ꢈꢅꢇꢋꢌꢆ&ꢈ#ꢅ*ꢃ&ꢍꢃꢄꢅ&ꢍꢈꢅꢍꢆ&ꢌꢍꢈ#ꢅꢆꢉꢈꢆꢁ  
ꢎꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄ!ꢅꢒꢅꢆꢄ#ꢅ.ꢀꢅ#ꢋꢅꢄꢋ&ꢅꢃꢄꢌꢇ"#ꢈꢅ'ꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢁꢅꢔꢋꢇ#ꢅ%ꢇꢆ!ꢍꢅꢋꢉꢅꢓꢉꢋ&ꢉ"!ꢃꢋꢄ!ꢅ!ꢍꢆꢇꢇꢅꢄꢋ&ꢅꢈ$ꢌꢈꢈ#ꢅꢕꢁꢀꢘꢅ''ꢅꢓꢈꢉꢅ!ꢃ#ꢈꢁ  
-ꢁ ꢒꢃ'ꢈꢄ!ꢃꢋꢄꢃꢄꢑꢅꢆꢄ#ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢃꢄꢑꢅꢓꢈꢉꢅꢗꢐꢔ.ꢅ0ꢀꢖꢁꢘꢔꢁ  
1ꢐ,2 1ꢆ!ꢃꢌꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄꢁꢅꢙꢍꢈꢋꢉꢈ&ꢃꢌꢆꢇꢇꢊꢅꢈ$ꢆꢌ&ꢅ ꢆꢇ"ꢈꢅ!ꢍꢋ*ꢄꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ!ꢁ  
ꢝ.32 ꢝꢈ%ꢈꢉꢈꢄꢌꢈꢅꢒꢃ'ꢈꢄ!ꢃꢋꢄ(ꢅ"!"ꢆꢇꢇꢊꢅ*ꢃ&ꢍꢋ"&ꢅ&ꢋꢇꢈꢉꢆꢄꢌꢈ(ꢅ%ꢋꢉꢅꢃꢄ%ꢋꢉ'ꢆ&ꢃꢋꢄꢅꢓ"ꢉꢓꢋ!ꢈ!ꢅꢋꢄꢇꢊꢁ  
ꢔꢃꢌꢉꢋꢌꢍꢃꢓ ꢌꢍꢄꢋꢇꢋꢑꢊ ꢒꢉꢆ*ꢃꢄꢑ ,ꢕꢖꢞꢕ<?1  
© 2008 Microchip Technology Inc.  
DS21223H-page 17  
25AA640/25LC640  
APPENDIX A: REVISION HISTORY  
Revision F  
Corrections to Section 1.0, Electrical Characteristics.  
Revision G  
Product ID System, Example C: Corrected part  
number, added “Alternate Pinout” and corrected part  
number in Header.  
Updated Trademark and Sales List pages.  
Revision H (June 2008)  
Added “Not Recommended” note; Updated Packaging;  
General updates.  
DS21223H-page 18  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
THE MICROCHIP WEB SITE  
CUSTOMER SUPPORT  
Microchip provides online support via our WWW site at  
www.microchip.com. This web site is used as a means  
to make files and information easily available to  
customers. Accessible by using your favorite Internet  
browser, the web site contains the following  
information:  
Users of Microchip products can receive assistance  
through several channels:  
• Distributor or Representative  
• Local Sales Office  
• Field Application Engineer (FAE)  
Technical Support  
Product Support – Data sheets and errata,  
application notes and sample programs, design  
resources, user’s guides and hardware support  
documents, latest software releases and archived  
software  
• Development Systems Information Line  
Customers  
should  
contact  
their  
distributor,  
representative or field application engineer (FAE) for  
support. Local sales offices are also available to help  
customers. A listing of sales offices and locations is  
included in the back of this document.  
General Technical Support – Frequently Asked  
Questions (FAQ), technical support requests,  
online discussion groups, Microchip consultant  
program member listing  
Technical support is available through the web site  
at: http://support.microchip.com  
Business of Microchip – Product selector and  
ordering guides, latest Microchip press releases,  
listing of seminars and events, listings of  
Microchip sales offices, distributors and factory  
representatives  
CUSTOMER CHANGE NOTIFICATION  
SERVICE  
Microchip’s customer notification service helps keep  
customers current on Microchip products. Subscribers  
will receive e-mail notification whenever there are  
changes, updates, revisions or errata related to a  
specified product family or development tool of interest.  
To register, access the Microchip web site at  
www.microchip.com, click on Customer Change  
Notification and follow the registration instructions.  
© 2008 Microchip Technology Inc.  
DS21223H-page 19  
25AA640/25LC640  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.  
Please list the following information, and use this outline to provide us with your comments about this document.  
To:  
Technical Publications Manager  
Reader Response  
Total Pages Sent ________  
RE:  
From:  
Name  
Company  
Address  
City / State / ZIP / Country  
Telephone: (_______) _________ - _________  
FAX: (______) _________ - _________  
Application (optional):  
Would you like a reply?  
Y
N
25AA640/25LC640  
DS21223H  
Literature Number:  
Device:  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this document easy to follow? If not, why?  
4. What additions to the document do you think would enhance the structure and subject?  
5. What deletions from the document could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
DS21223H-page 20  
© 2008 Microchip Technology Inc.  
25AA640/25LC640  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
PART NO.  
Device  
X
/XX  
XXX  
Examples:  
Temperature  
Range  
Package  
Pattern  
a) 25AA640-I/SN: Industrial Temp.,  
SOIC package  
b) 25AA640T-I/SN: Tape and Reel,  
Industrial Temp., SOIC package  
c) 25AA640X-I/ST: Alternate Pinout  
Industrial Temp., TSSOP package  
d) 25LC640-I/SN: Industrial Temp.,  
SOIC package  
Device  
25AA640:  
64K bit 1.8V SPI Serial EEPROM  
25AA640T: 64K bit 1.8V SPI Serial EEPROM  
(Tape and Reel)  
25AA640X: 64K bit 1.8V SPI Serial EEPROM  
in alternate pinout (ST only)  
25AA640XT: 64K bit 1.8V SPI Serial EEPROM  
in alternate pinout Tape and Reel (ST only)  
25LC640:  
25LC640T: 64K bit 2.5V SPI Serial EEPROM  
(Tape and Reel)  
25LC640X: 64K bit 2.5V SPI Serial EEPROM  
in alternate pinout (ST only)  
e) 25LC640T-I/SN: Tape and Reel,  
Industrial Temp., SOIC package  
64K bit 2.5V SPI Serial EEPROM  
f)  
25LC640X-I/ST: Alternate Pinout,  
Industrial Temp., TSSOP package  
25LC640XT: 64K bit 2.5V SPI Serial EEPROM  
in alternate pinout Tape and Reel (ST only)  
Temperature Range  
Package  
I
E
=
=
-40°C to +85°C  
-40°C to +125°C  
P
SN  
ST  
=
=
=
Plastic DIP (300 mil Body), 8-lead  
Plastic SOIC (150 mil Body), 8-lead  
Plastic TSSOP (4.4 mm Body), 8-lead  
© 2008 Microchip Technology Inc.  
DS21223H-page 21  
25AA640/25LC640  
NOTES:  
DS21223H-page 22  
© 2008 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,  
PICSTART, PRO MATE, rfPIC and SmartShunt are registered  
trademarks of Microchip Technology Incorporated in the  
U.S.A. and other countries.  
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,  
SEEVAL, SmartSensor and The Embedded Control Solutions  
Company are registered trademarks of Microchip Technology  
Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,  
ECONOMONITOR, FanSense, In-Circuit Serial  
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB  
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,  
32  
PICDEM.net, PICtail, PIC logo, PowerCal, PowerInfo,  
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total  
Endurance, UNI/O, WiperLock and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2008, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona; Gresham, Oregon and design centers in California  
and India. The Company’s quality system processes and procedures  
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
© 2008 Microchip Technology Inc.  
DS21223H-page 23  
WORLDWIDE SALES AND SERVICE  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
Tower 6, The Gateway  
Harbour City, Kowloon  
Hong Kong  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
India - Bangalore  
Tel: 91-80-4182-8400  
Fax: 91-80-4182-8422  
Austria - Wels  
Tel: 43-7242-2244-39  
Fax: 43-7242-2244-393  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support:  
http://support.microchip.com  
Web Address:  
www.microchip.com  
Denmark - Copenhagen  
Tel: 45-4450-2828  
Fax: 45-4485-2829  
India - New Delhi  
Tel: 91-11-4160-8631  
Fax: 91-11-4160-8632  
France - Paris  
Tel: 33-1-69-53-63-20  
Fax: 33-1-69-30-90-79  
India - Pune  
Tel: 91-20-2566-1512  
Fax: 91-20-2566-1513  
Australia - Sydney  
Tel: 61-2-9868-6733  
Fax: 61-2-9868-6755  
Atlanta  
Duluth, GA  
Tel: 678-957-9614  
Fax: 678-957-1455  
Germany - Munich  
Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Japan - Yokohama  
Tel: 81-45-471- 6166  
Fax: 81-45-471-6122  
China - Beijing  
Tel: 86-10-8528-2100  
Fax: 86-10-8528-2104  
Italy - Milan  
Tel: 39-0331-742611  
Fax: 39-0331-466781  
Korea - Daegu  
Tel: 82-53-744-4301  
Fax: 82-53-744-4302  
Boston  
China - Chengdu  
Tel: 86-28-8665-5511  
Fax: 86-28-8665-7889  
Westborough, MA  
Tel: 774-760-0087  
Fax: 774-760-0088  
Netherlands - Drunen  
Tel: 31-416-690399  
Fax: 31-416-690340  
Korea - Seoul  
China - Hong Kong SAR  
Tel: 852-2401-1200  
Fax: 852-2401-3431  
Tel: 82-2-554-7200  
Fax: 82-2-558-5932 or  
82-2-558-5934  
Chicago  
Itasca, IL  
Tel: 630-285-0071  
Fax: 630-285-0075  
Spain - Madrid  
Tel: 34-91-708-08-90  
Fax: 34-91-708-08-91  
China - Nanjing  
Tel: 86-25-8473-2460  
Fax: 86-25-8473-2470  
Malaysia - Kuala Lumpur  
Tel: 60-3-6201-9857  
Fax: 60-3-6201-9859  
Dallas  
Addison, TX  
Tel: 972-818-7423  
Fax: 972-818-2924  
UK - Wokingham  
Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
China - Qingdao  
Tel: 86-532-8502-7355  
Fax: 86-532-8502-7205  
Malaysia - Penang  
Tel: 60-4-227-8870  
Fax: 60-4-227-4068  
Detroit  
Farmington Hills, MI  
Tel: 248-538-2250  
Fax: 248-538-2260  
China - Shanghai  
Tel: 86-21-5407-5533  
Fax: 86-21-5407-5066  
Philippines - Manila  
Tel: 63-2-634-9065  
Fax: 63-2-634-9069  
Kokomo  
Kokomo, IN  
Tel: 765-864-8360  
Fax: 765-864-8387  
China - Shenyang  
Tel: 86-24-2334-2829  
Fax: 86-24-2334-2393  
Singapore  
Tel: 65-6334-8870  
Fax: 65-6334-8850  
China - Shenzhen  
Tel: 86-755-8203-2660  
Fax: 86-755-8203-1760  
Taiwan - Hsin Chu  
Tel: 886-3-572-9526  
Fax: 886-3-572-6459  
Los Angeles  
Mission Viejo, CA  
Tel: 949-462-9523  
Fax: 949-462-9608  
China - Wuhan  
Tel: 86-27-5980-5300  
Fax: 86-27-5980-5118  
Taiwan - Kaohsiung  
Tel: 886-7-536-4818  
Fax: 886-7-536-4803  
Santa Clara  
Santa Clara, CA  
Tel: 408-961-6444  
Fax: 408-961-6445  
China - Xiamen  
Tel: 86-592-2388138  
Fax: 86-592-2388130  
Taiwan - Taipei  
Tel: 886-2-2500-6610  
Fax: 886-2-2508-0102  
Toronto  
Mississauga, Ontario,  
Canada  
Tel: 905-673-0699  
Fax: 905-673-6509  
China - Xian  
Tel: 86-29-8833-7252  
Fax: 86-29-8833-7256  
Thailand - Bangkok  
Tel: 66-2-694-1351  
Fax: 66-2-694-1350  
China - Zhuhai  
Tel: 86-756-3210040  
Fax: 86-756-3210049  
01/02/08  
DS21223H-page 24  
© 2008 Microchip Technology Inc.  

相关型号:

25LC640XT-E/P

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-E/SN

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-E/ST

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-E/STG

8K X 8 SPI BUS SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, MO-153, TSSOP-8
MICROCHIP

25LC640XT-I/P

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-I/SN

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-I/ST

64K SPI Bus Serial EEPROM
MICROCHIP

25LC640XT-I/STG

8K X 8 SPI BUS SERIAL EEPROM, PDSO8, 4.40 MM, PLASTIC, TSSOP-8
MICROCHIP

25LCW

Electric Fuse, 25A, 250VAC, 250VDC, 160000A (IR), Inline/holder
IXYS

25LET

Electrical Characteristics, Total Clearing I2t, Arc Voltage, Power Losses
COOPER

25LEW

Electric Fuse, ELECTRIC FUSE, 25A, 250VAC, 250VDC, 160000A (IR), INLINE/HOLDER
IXYS

25LEWI

Electric Fuse, 25A, 250VAC, 250VDC, 160000A (IR), Inline/holder
IXYS