93LC46AT-E/MCX [MICROCHIP]
128 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8;型号: | 93LC46AT-E/MCX |
厂家: | MICROCHIP |
描述: | 128 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
文件: | 总20页 (文件大小:330K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Not recommended for new designs –
Please use 93LC46C, 93LC56C or 93LC66C.
93LC46/56/66
1K/2K/4K 2.5V Microwire Serial EEPROM
Features:
Package Types
PDIP/SOIC
• Single supply with programming operation down
to 2.5V
• Low-power CMOS technology
CS
CLK
DI
VCC
NU
1
2
3
4
8
7
6
5
• 100 µA typical active read current at 2.5V
• 3 µA typical standby current at 2.5V
ORG
VSS
• ORG pin selectable memory configuration
• 128 x 8- or 64 x 16-bit organization (93LC46)
• 256 x 8- or 128 x 16-bit organization (93LC56)
• 512 x 8 or 256 x 16 bit organization (93LC66)
DO
ROTATED SOIC
NU
VCC
CS
ORG
VSS
DO
DI
1
2
3
4
8
7
6
5
• Self-timed erase and write cycles
(including auto-erase)
• Automatic ERAL before WRAL
• Power on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device status signal during erase/write cycles
• Sequential read function
CLK
Block Diagram
• 1,000,000 E/W cycles ensured
• Data retention > 200 years
VCC
VSS
• 8-pin PDIP/SOIC
(SOIC in JEDEC standards)
Address
Decoder
Memory
Array
• Temperature ranges supported:
- Industrial (I):
-40°C to +85°C
Address
Counter
Description:
DO
Output
Buffer
Data Register
The Microchip Technology Inc. 93LC46/56/66 are 1K,
2K and 4K low voltage serial Electrically Erasable
PROMs (EEPROM). The device memory is configured
as x8 or x16 bits depending on the external logic of
levels of the ORG pin. Advanced CMOS technology
makes these devices ideal for low power nonvolatile
memory applications. The 93LC Series is available in
standard 8-pin PDIP and surface mount SOIC
packages. The rotated pin-out 93LC46X/56X/66X are
offered in the “SN” package only.
DI
Mode
Decode
Logic
ORG
CS
Clock
Register
CLK
2004 Microchip Technology Inc.
DS21712B-page 1
93LC46/56/66
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ........................................................................................................ -0.6V to VCC + 1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
VCC = +2.5V to +5.5V
DC CHARACTERISTICS
Industrial (I): TA = -40°C to +85°C
Param.
No.
Sym
VIH1
Characteristic
Min
Typ
Max
Units
Conditions
VCC ≥ 2.7V
D1
High-level input voltage
2.0
0.7 VCC
-0.3
-0.3
—
—
—
—
—
—
—
—
—
—
—
—
VCC +1
VCC +1
0.8
V
V
VIH2
VIL1
VIL2
VOL1
VOL2
VOH1
VOH2
ILI
VCC ≥ 2.7V
D2
D3
D4
Low-level input voltage
Low-level output voltage
High-level output voltage
V
VCC ≥ 2.7V
0.2 VCC
0.4
V
VCC ≥ 2.7V
V
IOL = 2.1 mA, VCC = 4.5V
IOL = 100 µA, VCC = 2.5V
IOL = 400 µA, VCC = 4.5V
IOL = 100 µA, VCC = 2.5V
VIN = 0.1V to VCC
VOUT = 0.1V to VCC
—
0.3
V
2.4
—
V
VCC -0.2
—
—
V
D5
D6
D7
Input leakage current
Output leakage current
±10
±10
7
µA
µA
pF
ILO
—
CIN,
Pin capacitance
—
VIN/VOUT = 0V (Note 1 & 2)
COUT
(all inputs/outputs)
TA = 25°C, FCLK = 1 MHz
D8
D9
ICC write Operating current
ICC read
—
—
3
mA
FCLK = 2 MHz, VCC = 5.5V
(Note 2)
—
—
—
—
—
100
1
500
—
mA
µA
µA
FCLK = 2 MHz, VCC = 5.5V
FCLK = 1 MHz, VCC = 3.0V
FCLK = 1 MHz, VCC = 2.5V
D10
ICCS
Standby current
—
—
—
—
—
3
100
30
—
µA
µA
µA
CLK = CS = 0V; VCC = 5.5V
CLK = CS = 0V; VCC = 3.0V
CLK = CS = 0V; VCC = 2.5V
ORG, DI = VSS or VCC
Note 1: This parameter is tested at TA = 25°C and FCLK = 1 MHz.
2: This parameter is periodically sampled and not 100% tested.
DS21712B-page 2
2004 Microchip Technology Inc.
93LC46/56/66
AC CHARACTERISTICS
VCC = +2.5V to +5.5V
Industrial (I): TA = -40°C to +85°C
AC CHARACTERISTICS
Param.
Sym
Characteristic
Min
Typ
Max
Units
Conditions
No.
1
FCLK
Clock frequency
—
—
—
—
2
1
MHz VCC ≥ 4.5V
MHz VCC < 4.5V
2
3
4
5
6
7
8
9
TCKH
TCKL
TCSS
TCSH
TCSL
TDIS
TDIH
TPD
TCZ
Clock high time
250
250
50
—
—
—
—
—
—
—
—
—
—
4
—
—
ns
ns
Clock low time
Chip select setup time
Chip select hold time
Chip select low time
Data input setup time
Data input hold time
Data output delay time
Data output disable time
Status valid time
—
ns
ns
ns
ns
ns
ns
ns
ns
ms
ms
ms
Relative to CLK
0
—
Relative to CLK
250
100
100
—
—
—
Relative to CLK
—
Relative to CLK
400
100
500
10
15
30
1M
CL = 100 pF
10
11
12
13
14
15
—
CL = 100 pf (Note 2)
CL = 100 pF
TSV
—
TWC
TEC
Program cycle time
—
Erase/Write mode
ERAL mode (VCC=5V ±10%)
WRAL mode (VCC=5V ±10%)
—
8
TWL
—
—
16
—
Endurance
1M
cycles 25°C, VCC = 5.0V, Block
mode (Note 3)
Note 1: This parameter is tested at TA = 25°C and FCLK = 1 MHz.
2: This parameter is periodically sampled and not 100% tested.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at: www.microchip.com.
FIGURE 1-1:
SYNCHRONOUS DATA TIMING
VIH
VIL
VIH
CS
4
7
2
3
5
CLK
VIL
8
VIH
VIL
DI
10
10
9
9
VOH
DO
(Read)
VOL
VOH
11
DO
(Write)
Status Valid
VOL
2004 Microchip Technology Inc.
DS21712B-page 3
93LC46/56/66
TABLE 1-1:
Instruction
INSTRUCTION SET FOR 93LC46: ORG = 1 (X 16 ORGANIZATION)
Req. CLK
Cycles
SB
Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
A5 A4 A3 A2 A1 A0
1 1 XXXX
—
—
D15 - D0
High-Z
25
9
A5 A4 A3 A2 A1 A0
1 0 XXXX
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
9
—
9
A5 A4 A3 A2 A1 A0
0 1 XXXX
D15 - D0
D15 - D0
—
25
25
9
0 0 XXXX
TABLE 1-2:
Instruction
INSTRUCTION SET FOR 93LC46: ORG = 0 (X 8 ORGANIZATION)
Req. CLK
Cycles
SB
Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
A6 A5 A4 A3 A2 A1 A0
1 1 X X X X X
—
—
D7 - D0
High-Z
18
10
10
10
18
18
10
A6 A5 A4 A3 A2 A1 A0
1 0 X X X X X
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
—
A6 A5 A4 A3 A2 A1 A0
0 1 X X X X X
D7 - D0
D7 - D0
—
0 0 X X X X X
TABLE 1-3:
INSTRUCTION SET FOR 93LC56: ORG = 1 (X 16 ORGANIZATION)
Instruction
SB
Opcode
Address
Data In
Data Out
Req. CLK
Cycles
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X A6 A5 A4 A3 A2 A1 A0
1 1 X X X X X X
—
—
D15 - D0
High-Z
27
11
11
11
27
27
11
X A6 A5 A4 A3 A2 A1 A0
1 0 X X X X X X
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
—
X A6 A5 A4 A3 A2 A1 A0
0 1 X X X X X X
D15 - D0
D15 - D0
—
0 0 X X X X X X
TABLE 1-4:
Instruction
INSTRUCTION SET FOR 93LC56: ORG = 0 (X 8 ORGANIZATION)
Req. CLK
Cycles
SB
Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X A7 A6 A5 A4 A3 A2 A1 A0
1 1 X X X X X X X
—
—
D7 - D0
High-Z
20
12
12
12
20
20
12
X A7 A6 A5 A4 A3 A2 A1 A0
1 0 X X X X X X X
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
—
X A7 A6 A5 A4 A3 A2 A1 A0
0 1 X X X X X X X
D7 - D0
D7 - D0
—
0 0 X X X X X X X
DS21712B-page 4
2004 Microchip Technology Inc.
93LC46/56/66
TABLE 1-5:
Instruction
INSTRUCTION SET FOR 93LC66: ORG = 1 (X 16 ORGANIZATION)
Req. CLK
Cycles
SB
Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
A7 A6 A5 A4 A3 A2 A1 A0
1 1 X X X X X X
—
—
D15 - D0
High-Z
27
11
11
11
27
27
11
A7 A6 A5 A4 A3 A2 A1 A0
1 0 X X X X X X
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
—
A7 A6 A5 A4 A3 A2 A1 A0
0 1 X X X X X X
D15 - D0
D15 - D0
—
0 0 X X X X X X
TABLE 1-6:
Instruction
INSTRUCTION SET FOR 93LC66: ORG = 0 (X 8 ORGANIZATION)
Req. CLK
Cycles
SB
Opcode
Address
Data In
Data Out
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
A8 A7 A6 A5 A4 A3 A2 A1 A0
1 1 X X X X X X X
—
—
D7 - D0
High-Z
20
12
12
12
20
20
12
A8 A7 A6 A5 A4 A3 A2 A1 A0
1 0 X X X X X X X
—
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
(RDY/BSY)
High-Z
—
A8 A7 A6 A5 A4 A3 A2 A1 A0
0 1 X X X X X X X
D7 - D0
D7 - D0
—
0 0 X X X X X X X
2004 Microchip Technology Inc.
DS21712B-page 5
93LC46/56/66
After power-up, the device is automatically in the
EWDS mode. Therefore, an EWEN instruction must be
performed before any ERASE or WRITE instruction can
be executed.
2.0
FUNCTIONAL DESCRIPTION
When the ORG pin is connected to VCC, the (x16)
organization is selected. When it is connected to
ground, the (x8) organization is selected. Instruc-
tions, addresses and write data are clocked into the
DI pin on the rising edge of the clock (CLK). The DO
pin is normally held in a high-Z state except when
reading data from the device, or when checking the
Ready/Busy status during a programming operation.
The Ready/Busy status can be verified during an
erase/write operation by polling the DO pin; DO low
indicates that programming is still in progress, while
DO high indicates the device is ready. The DO will
enter the high-Z state on the falling edge of the CS.
2.4
Read
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 16-bit (x16 organization) or 8-bit
(x8 organization) output string. The output data bits will
toggle on the rising edge of the CLK and are stable
after the specified time delay (TPD). Sequential read is
possible when CS is held high. The memory data will
automatically cycle to the next register and output
sequentially.
2.1
Start Condition
2.5
Erase/Write Enable and Disable
(EWEN, EWDS)
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
The 93LC46/56/66 power up in the Erase/Write Disable
(EWDS) state. All programming modes must be
preceded by an Erase/Write Enable (EWEN) instruction.
Once the EWEN instruction is executed, programming
remains enabled until an EWDS instruction is executed
or VCC is removed from the device. To protect against
accidental data disturb, the EWDS instruction can be
used to disable all erase/write functions and should
follow all programming operations. Execution of a READ
instruction is independent of both the EWEN and EWDS
instructions.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device opera-
tion (Read, Write, Erase, EWEN, EWDS, ERAL and
WRAL). As soon as CS is high, the device is no longer
in the Standby mode.
An instruction following a Start condition will only be
executed if the required amount of opcode, address
and data bits for any particular instruction is clocked in.
After execution of an instruction (i.e., clock in or out of
the last required address or data bit) CLK and DI
become “don't care” bits until a new Start condition is
detected.
2.6
Erase
The ERASE instruction forces all data bits of the speci-
fied address to the logical “1” state. CS is brought low
following the loading of the last address bit. This falling
edge of the CS pin initiates the self-timed programming
cycle.
2.2
Data In/Data Out (DI/DO)
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation, if A0 is a logic high
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of A0,
the higher the voltage at the Data Out pin.
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical “0” indicates that program-
ming is still in progress. DO at logical “1” indicates that
the register at the specified address has been erased
and the device is ready for another instruction.
The erase cycle takes 4 ms per word typical.
2.3
Data Protection
During power-up, all programming modes of operation
are inhibited until VCC has reached a level greater than
1.4V. During power-down, the source data protection
circuitry acts to inhibit all programming modes when
VCC has fallen below 1.4V at nominal conditions.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
DS21712B-page 6
2004 Microchip Technology Inc.
93LC46/56/66
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL) and before the entire write cycle is complete.
2.7
Write
The WRITE instruction is followed by 16 bits (or by 8
bits) of data which are written into the specified
address. After the last data bit is put on the DI pin,
CS must be brought low before the next rising edge
of the CLK clock. This falling edge of CS initiates the
self-timed auto-erase and programming cycle.
The ERAL cycle takes (8 ms typical).
2.9
Write All (WRAL)
The WRAL instruction will write the entire memory array
with the data specified in the command. The WRAL
cycle is completely self-timed and commences at the
falling edge of the CS. Clocking of the CLK pin is not
necessary after the device has entered the self clock-
ing mode. The WRAL command does include an auto-
matic ERAL cycle for the device. Therefore, the WRAL
instruction does not require an ERAL instruction but the
chip must be in the EWEN status. The WRAL instruction
is ensured at 5V ±10%.
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL) and before the entire write cycle is complete.
DO at logical “0” indicates that programming is still in
progress. DO at logical “1” indicates that the register at
the specified address has been written with the data
specified and the device is ready for another
instruction.
The write cycle takes 4 ms per word typical.
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (Tcsl).
2.8
Erase All (ERAL)
The ERAL instruction will erase the entire memory array
to the logical “1” state. The ERAL cycle is identical to
the ERASE cycle except for the different opcode. The
ERAL cycle is completely self-timed and commences
at the falling edge of the CS. Clocking of the CLK pin is
not necessary after the device has entered the self
clocking mode. The ERAL instruction is ensured at 5V
±10%.
The WRAL cycle takes 16 ms typical.
FIGURE 2-1:
READ TIMING
CS
CLK
DI
A0
An •••
1
1
0
High-Z
DO
0
Dx ••• D0 Dx
••• D0 Dx
••• D0
2004 Microchip Technology Inc.
DS21712B-page 7
93LC46/56/66
FIGURE 2-2:
EWEN TIMING
6
CS
1
0
0
1
1
X
•••
X
DI
FIGURE 2-3:
CS
EWDS TIMING
6
CLK
•••
1
0
0
0
0
X
X
DI
FIGURE 2-4:
WRITE TIMING
6
CS
CLK
0
1
1
An
A0 Dx
D0
•••
•••
DI
11
High-Z
Busy
Ready
DO
12
DS21712B-page 8
2004 Microchip Technology Inc.
93LC46/56/66
FIGURE 2-5:
WRAL TIMING
6
CS
CLK
DI
1
X
1
0
•••
Dx
•••
0
X
D0
0
10
11
High-Z
Busy
Ready
DO
High-Z
14
Ensured by Characterization at VCC = 4.5V to +5.5V.
FIGURE 2-6:
ERASE TIMING
6
CS
Check Status
CLK
DI
1
1
An
An-1 An-2
•••
A0
1
11
10
High-Z
DO
Busy
Ready
High-Z
12
FIGURE 2-7:
ERAL TIMING
6
CS
Check Status
CLK
DI
1
0
0
1
0
X
X
•••
11
10
High-Z
DO
Busy
Ready
High-Z
Ensured by Characterization at Vcc = 4.5V to +5.5V.
13
2004 Microchip Technology Inc.
DS21712B-page 9
93LC46/56/66
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Name
PIN FUNCTION TABLE
PDIP
ROTATED
TSSOP
SOIC
Description
CS
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
3
4
5
6
7
8
1
2
Chip Select
CLK
DI
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
DO
VSS
ORG
NU
Memory Configuration
Not Utilized
Vcc
+1.8V to 5.5V Power Supply
3.1
Chip Select (CS)
Note:
CS must go low between consecutive
instructions.
A high level selects the device. A low level deselects
the device and forces it into Standby mode. However, a
programming cycle which is already initiated and/or in
progress will be completed, regardless of the CS input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
3.3
Data In (DI)
Data In is used to clock in a Start bit, opcode, address
and data synchronously with the CLK input.
3.4
Data Out (DO)
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
Data Out is used in the Read mode to output data syn-
chronously with the CLK input (TPD after the positive
edge of CLK).
3.2
Serial Clock (CLK)
This pin also provides Ready/Busy status information
during erase and write cycles. Ready/Busy status infor-
mation is available on the DO pin if CS is brought high
after being low for minimum chip select low time (TCSL)
and an erase or write operation has been initiated.
The serial clock is used to synchronize the communica-
tion between a master device and the 93LC46/56/66.
Opcode, address and data bits are clocked in on the
positive edge of CLK. Data bits are also clocked out on
the positive edge of CLK.
The Status signal is not available on DO, if CS is held
low or high during the entire write or erase cycle. In all
other cases DO is in the High-Z mode. If status is
checked after the write/erase cycle, a pull-up resistor
on DO is required to read the Ready signal.
CLK can be stopped anywhere in the transmission
sequence (at high or low level) and can be continued
anytime with respect to clock high time (TCKH) and
clock low time (TCKL). This gives the controlling master
freedom in preparing opcode, address and data.
3.5
Organization (ORG)
CLK is a “don't care” if CS is low (device deselected). If
CS is high, but Start condition has not been detected,
any number of clock cycles can be received by the
device without changing its status (i.e., waiting for Start
condition).
When ORG is connected to VCC, the (x16) memory
organization is selected. When ORG is tied to VSS, the
(x8) memory organization is selected. ORG can only be
floated for clock speeds of 1 MHz or less for the (x16)
memory organization. For clock speeds greater than
1 MHz, ORG must be tied to VCC or VSS.
CLK cycles are not required during the self-timed write
(i.e., auto erase/write) cycle.
After detection of a Start condition the specified number
of clock cycles (respectively low-to-high transitions of
CLK) must be provided. These clock cycles are required
to clock in all required opcode, address and data bits
before an instruction is executed (see instruction set
truth table). CLK and DI then become “don't care” inputs
waiting for a new Start condition to be detected.
DS21712B-page 10
2004 Microchip Technology Inc.
93LC46/56/66
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
93LC46
I/PNNN
YYWW
YYWW
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
93LC46
XXXXYYWW
I/SNYYWW
NNN
NNN
8-Lead Rotated SOIC (150 mil)
Example:
XXXXXXXX
93LC46X
XXXXYYWW
I/SNYYWW
NNN
NNN
Legend: XX...X Customer specific information*
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
2004 Microchip Technology Inc.
DS21712B-page 11
93LC46/56/66
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21712B-page 12
2004 Microchip Technology Inc.
93LC46/56/66
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45×
c
A2
A
f
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
Overall Height
A
.053
.069
1.35
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
h
Chamfer Distance
Foot Length
L
f
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21712B-page 13
93LC46/56/66
APPENDIX A: REVISION HISTORY
Revision B
Added note to page 1 header (Not recommended for
new designs).
Updated document format.
DS21712B-page 14
2004 Microchip Technology Inc.
93LC46/56/66
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits. The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21712B-page 15
93LC46/56/66
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
93LC46/56/66
DS21712B
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21712B-page 16
2004 Microchip Technology Inc.
93LC46/56/66
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
XXX
Examples:
Temperature
Range
Package
Pattern
a) 93LC46-I/P: 1K, 128x8 or 64x16 Serial
EEPROM, PDIP package
b) 93LC46-I/SN: 1K, 128x8 or 64x16 Serial
EEPROM, SOIC package
Device
93LC46: 1K 2.5V Microwire Serial EEPROM
93LC46X: 1K 2.5V Microwire Serial EEPROM in
alternate pinouts (SN package only)
93LC46T: 1K 2.5V Microwire Serial EEPROM
(Tape and Reel)
c) 93LC46T-I/SN: 1K, 128x8 or 64x16
Serial EEPROM, SOIC package, tape
and reel
d) 93LC46X-I/SN: 1K, 128x8 or 64x16
Serial EEPROM, Rotated SOIC package
93LC46XT: 1K 2.5V Microwire Serial EEPROM
(Tape and Reel)
e) 93LC56-I/P: 2K, 256x8 or 128x16 Serial
EEPROM, PDIP package
93LC56: 2K 2.5V Microwire Serial EEPROM
93LC56X: 2K 2.5V Microwire Serial EEPROM in
alternate pinouts (SN package only)
93LC56T: 2K 2.5V Microwire Serial EEPROM
(Tape and Reel)
f)
93LC56-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, SOIC package
g) 93LC56T-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, SOIC package, tape
and reel
93LC56XT:2K 2.5V Microwire Serial EEPROM
(Tape and Reel)
h) 93LC56X-I/SN: 2K, 256x8 or 128x16
Serial EEPROM, Rotated SOIC package
93LC66: 4K 2.5V Microwire Serial EEPROM
93LC66X: 4K 2.5V Microwire Serial EEPROM in
alternate pinouts (SN package only)
93LC66T: 4K 2.5V Microwire Serial EEPROM
(Tape and Reel)
i)
93LC66-I/P: 4K, 512x8 or 256x16 Serial
EEPROM, PDIP package
j)
93LC66-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, SOIC package
93LC66XT: 4K 2.5V Microwire Serial EEPROM
(Tape and Reel)
k) 93LC66T-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, SOIC package, tape
and reel
Temperature
Range
I
= -40°C to +85°C
l)
93LC66X-I/SN: 4K, 512x8 or 256x16
Serial EEPROM, Rotated SOIC package
Package
P
SN
=
=
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21712B-page 17
93LC46/56/66
NOTES:
DS21712B-page 18
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21712B-page 19
WORLDWIDE SALES AND SERVICE
China - Beijing
Singapore
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: www.microchip.com
Unit 706B
200 Middle Road
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4816
Fax: 886-7-536-4817
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Taiwan Branch
Fax: 86-28-86766599
Boston
11F-3, No. 207
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Taiwan
Taiwan Branch
13F-3, No. 295, Sec. 2, Kung Fu Road
Hsinchu City 300, Taiwan
Tel: 886-3-572-9526
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Fax: 886-3-572-6459
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
16200 Addison Road, Suite 255
Addison Plaza
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Room 401, Hongjian Building, No. 2
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Los Angeles
25950 Acero St., Suite 200
Mission Viejo, CA 92691
Tel: 949-462-9523
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Fax: 949-462-9608
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Salvatore Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-22290061 Fax: 91-80-22290062
Japan
Fax: 650-961-0286
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
Waegenburghtplein 4
NL-5152 JR, Drunen, Netherlands
Tel: 31-416-690399
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Yusen Shin Yokohama Building 10F
3-17-2, Shin Yokohama, Kohoku-ku,
Yokohama, Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Fax: 905-673-6509
Fax: 31-416-690340
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Unit 32 41 Rawson Street
Epping 2121, NSW
Sydney, Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
United Kingdom
505 Eskdale Road
Winnersh Triangle
Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
07/12/04
DS21712B-page 20
2004 Microchip Technology Inc.
相关型号:
93LC46AT-E/MSX
128 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8
MICROCHIP
93LC46AT-E/OTX
128 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO6, ROHS COMPLIANT, PLASTIC, SOT-23, 6 PIN
MICROCHIP
©2020 ICPDF网 联系我们和版权申明