93LC76CI/OTG [MICROCHIP]
8K Microwire Compatible Serial EEPROM; 8K的Microwire兼容串行EEPROM型号: | 93LC76CI/OTG |
厂家: | MICROCHIP |
描述: | 8K Microwire Compatible Serial EEPROM |
文件: | 总26页 (文件大小:396K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
93AA76A/B/C, 93LC76A/B/C,
93C76A/B/C
8K Microwire Compatible Serial EEPROM
Device Selection Table
Part Number
VCC Range
ORG Pin
PE Pin
Word Size
Temp Ranges
Packages
93AA76A
93AA76B
93LC76A
93LC76B
93C76A
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
No
No
No
No
8-bit
16-bit
I
OT
I
OT
OT
No
No
8-bit
I, E
I, E
I, E
I, E
I
No
No
16-bit
OT
No
No
8-bit
OT
93C76B
No
No
16-bit
OT
93AA76C
93LC76C
93C76C
Yes
Yes
Yes
Yes
Yes
Yes
8 or 16-bit
8 or 16-bit
8 or 16-bit
P, SN, ST, MS
P, SN, ST, MS
P, SN, ST, MS
I, E
I, E
Features
Description
• Low-power CMOS technology
• ORG pin to select word size for ‘76C’ version
The Microchip Technology Inc. 93XX76A/B/C devices
are 8K bit, low-voltage, serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic
levels driving the ORG pin to set word size. For
dedicated 8-bit communication, the 93XX76A devices
are available, while the 93XX76B devices provide
dedicated 16-bit communication, available on SOT-23
devices only. A Program Enable (PE) pin allows the
user to write-protect the entire memory array.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory applications.
The 93XX Series is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, 6-lead SOT-23,
and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is
also available.
• 1024 x 8-bit organization ‘A’ devices (no ORG)
• 512 x 16-bit organization ‘B’ devices (no ORG)
• Program Enable pin to write-protect the entire
array (except on SOT-23 packages)
• Self-timed ERASE/WRITE cycles (including
auto-erase)
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device Status signal (READY/BUSY)
• Sequential READ function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Temperature ranges supported:
Package Types (not to scale)
- Industrial (I)
-40°C to +85°C
-40°C to +125°C
SOT-23
(OT)
PDIP/SOIC
(P, SN)
- Automotive (E)
Pin Function Table
CS
CLK
DI
1
2
3
4
8
7
6
5
V
CC
1
2
3
6
5
4
DO
V
CC
PE
VSS
CS
Name
Function
ORG
DI
CLK
CS
CLK
DI
Chip Select
DO
VSS
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
TSSOP/MSOP
(ST, MS
)
DO
1
8
7
6
5
CS
CLK
DI
VCC
VSS
PE
2
3
4
PE
ORG
VSS
Program Enable
Memory Configuration
Power Supply
DO
ORG
VCC
2004 Microchip Technology Inc.
DS21796D-page 1
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
VCC = 1.8V to 5.5V
All parameters apply over the specified
ranges unless otherwise noted.
Industrial (I):
TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
Param.
No.
Symbol
Parameter
Min
Typ
Max
Units
Conditions
VCC ≥ 2.7V
D1
VIH1
VIH2
High-level input voltage
2.0
0.7 VCC
—
—
VCC +1
VCC +1
V
V
VCC < 2.7V
D2
D3
D4
VIL1
VIL2
Low-level input voltage
Low-level output voltage
High-level output voltage
-0.3
-0.3
—
—
0.8
0.2 VCC
V
V
VCC ≥ 2.7V
VCC < 2.7V
VOL1
VOL2
—
—
—
—
0.4
0.2
V
V
IOL = 2.1 mA, VCC = 4.5V
IOL = 100 µA, VCC = 2.5V
VOH1
VOH2
2.4
VCC - 0.2
—
—
—
—
V
V
IOH = -400 µA, VCC = 4.5V
IOH = -100 µA, VCC = 2.5V
D5
D6
D7
ILI
Input leakage current
Output leakage current
—
—
—
—
—
—
±1
±1
7
µA
µA
pF
VIN = VSS to VCC
ILO
VOUT = VSS to VCC
CIN,
COUT
Pin capacitance (all inputs/
outputs)
VIN/VOUT = 0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D8
D9
ICC write Write current
—
—
—
500
3
—
mA
µA
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 2.5V
ICC read Read current
—
—
—
—
—
100
1
500
—
mA
µA
µA
FCLK = 3 MHz, VCC = 5.5V
FCLK = 2 MHz, VCC = 3.0V
FCLK = 2 MHz, VCC = 2.5V
D10
D11
ICCS
Standby current
—
—
—
—
1
5
µA
µA
I – Temp
E – Temp
CLK = Cs = 0V
ORG = DI = VSS or VCC
(Note 2) (Note 3)
VPOR
VCC voltage detect
93AA76A/B/C, 93LC76A/B/C
93C76A/B/C
—
—
1.5V
3.8V
—
—
V
V
(Note 1)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ORG pin not available on ‘A’ or ‘B’ versions.
3: READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”.
DS21796D-page 2
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
TABLE 1-2:
AC CHARACTERISTICS
VCC = 1.8V to 5.5V
All parameters apply over the specified
ranges unless otherwise noted.
Industrial (I):
TA = -40°C to +85°C
Automotive (E): TA = -40°C to +125°C
Param.
No.
Symbol
Parameter
Clock frequency
Min
Max
Units
Conditions
A1
FCLK
—
3
2
1
MHz 4.5V ≤ VCC < 5.5V
MHz 2.5V ≤ VCC < 4.5V
MHz 1.8V ≤ VCC < 2.5V
A2
A3
A4
TCKH
TCKL
TCSS
Clock high time
200
250
450
—
—
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
Clock low time
100
200
450
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
Chip Select setup time
50
100
250
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A5
A6
A7
TCSH
TCSL
TDIS
Chip Select hold time
Chip Select low time
Data input setup time
0
—
—
—
ns
ns
1.8V ≤ VCC < 5.5V
1.8V ≤ VCC < 5.5V
250
50
100
250
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
A8
A9
TDIH
TPD
Data input hold time
50
100
250
—
ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ VCC < 4.5V
1.8V ≤ VCC < 2.5V
Data output delay time
—
100
250
400
ns
ns
ns
4.5V ≤ VCC < 5.5V, CL = 100 pF
2.5V ≤ VCC < 4.5V, CL = 100 pF
1.8V ≤ VCC < 2.5V, CL = 100 pF
A10
A11
TCZ
TSV
Data output disable time
Status valid time
—
—
100
200
ns
ns
4.5V ≤ VCC < 5.5V, (Note 1)
1.8V ≤ VCC < 4.5V, (Note 1)
200
300
500
ns
ns
ns
4.5V ≤ VCC < 5.5V, CL = 100 pF
2.5V ≤ VCC < 4.5V, CL = 100 pF
1.8V ≤ VCC < 2.5V, CL = 100 pF
A12
A13
TWC
TWC
Program cycle time
—
—
5
ms
Erase/Write mode (AA and LC
versions)
2
ms
Erase/Write mode
(93C versions)
A14
A15
A16
TEC
TWL
—
—
—
6
ms
ms
ERAL mode, 4.5V ≤ VCC ≤ 5.5V
WRAL mode, 4.5V ≤ VCC ≤ 5.5V
15
—
Endurance
1M
cycles 25°C, VCC = 5.0V, (Note 2)
Note 1: This parameter is periodically sampled and not 100% tested.
2: This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which may be obtained from
www.microchip.com.
2004 Microchip Technology Inc.
DS21796D-page 3
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
FIGURE 1-1:
SYNCHRONOUS DATA TIMING
VIH
VIL
VIH
CS
TCSS
TCKH
TCKL
TCSH
CLK
DI
VIL
TDIS
TDIH
VIH
VIL
TCZ
TCZ
TPD
TPD
VOH
DO
(READ)
VOL
VOH
TSV
DO
(PROGRAM)
STATUS VALID
VOL
Note: TSV is relative to CS.
TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)
Req. CLK
Instruction SB Opcode
Address
Data In
Data Out
Cycles
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X
1
X
1
X
0
0
A8 A7 A6 A5 A4 A3 A2 A1 A0
—
—
—
—
D15 – D0
HIGH-Z
29
13
13
13
29
29
13
1
X
X
X
X
X
X
X
X
A8 A7 A6 A5 A4 A3 A2 A1 A0
(RDY/BSY)
(RDY/BSY)
0
X
X
X
X
X
X
X
X
A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0 (RDY/BSY)
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D15 – D0 (RDY/BSY)
HIGH-Z
—
TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)
Req. CLK
Instruction SB Opcode
Address
Data In
Data Out
Cycles
READ
EWEN
ERASE
ERAL
WRITE
WRAL
EWDS
1
1
1
1
1
1
1
10
00
11
00
01
00
00
X
1
X
1
X
0
0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
—
—
—
—
D7 – D0
HIGH-Z
22
14
14
14
22
22
14
1
X
X
X
X
X
X
X
X
X
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
(RDY/BSY)
(RDY/BSY)
0
X
X
X
X
X
X
X
X
X
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0 (RDY/BSY)
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
D7 – D0 (RDY/BSY)
HIGH-Z
—
DS21796D-page 4
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.2
Data In/Data Out (DI/DO)
2.0
FUNCTIONAL DESCRIPTION
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation, if A0 is a logic high-
level. Under such a condition the voltage level seen at
Data Out is undefined and will depend upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be
connected between DI and DO.
When the ORG* pin is connected to VCC, the (x16)
organization is selected. When it is connected to
ground, the (x8) organization is selected. Instructions,
addresses and write data are clocked into the DI pin on
the rising edge of the clock (CLK). The DO pin is
normally held in a HIGH-Z state except when reading
data from the device, or when checking the READY/
BUSY status during a programming operation. The
READY/BUSY status can be verified during an Erase/
Write operation by polling the DO pin; DO low indicates
that programming is still in progress, while DO high
indicates the device is ready. DO will enter the HIGH-Z
state on the falling edge of CS.
2.3
Data Protection
All modes of operation are inhibited when VCC is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
2.1
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (READ, WRITE, ERASE, EWEN, EWDS,
ERAL or WRAL). As soon as CS is high, the device is
no longer in Standby mode.
Note: For added protection, an EWDS command
should be performed after every write
operation.
After power-up, the device is automatically in the
EWDS mode. Therefore, an EWENinstruction must be
performed before the initial ERASEor WRITEinstruction
can be executed.
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
Block Diagram
VCC
VSS
Address
Decoder
Memory
Array
Address
Counter
DO
Output
Buffer
Data Register
DI
Mode
Decode
Logic
ORG*
CS
PE*
Clock
Register
CLK
*ORG and PE inputs are not available on
A/B devices.
2004 Microchip Technology Inc.
DS21796D-page 5
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the READY/BUSY status of the
2.4
ERASE
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
The ERASEinstruction forces all data bits of the
specified address to the logical ‘1’ state. The rising
edge of CLK before the last address bit initiates the
write cycle.
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
FIGURE 2-1:
ERASE TIMING
TCSL
CS
CHECK STATUS
CLK
DI
1
1
AN
AN-1 AN-2
A0
•••
1
TSV
TCZ
HIGH-Z
BUSY
READY
DO
HIGH-Z
TWC
DS21796D-page 6
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
2.5
ERASE ALL (ERAL)
The Erase All (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle is
identical to the ERASE cycle, except for the different
opcode. The ERAL cycle is completely self-timed. The
rising edge of CLK before the last data bit initiates the
write cycle. Clocking of the CLK pin is not necessary
after the device has entered the ERAL cycle.
low (TCSL).
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
VCC must be ≥ 4.5V for proper operation of ERAL.
FIGURE 2-2:
ERAL TIMING
TCSL
CS
CHECK STATUS
CLK
DI
1
0
0
1
0
X
X
•••
TSV
TCZ
HIGH-Z
BUSY
READY
DO
HIGH-Z
TEC
2004 Microchip Technology Inc.
DS21796D-page 7
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.6
ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)
The 93XX76A/B/C powers up in the ERASE/WRITE
Disable (EWDS) state. All programming modes must be
preceded by an ERASE/WRITE Enable (EWEN) instruc-
tion. Once the EWENinstruction is executed, program-
ming remains enabled until an EWDS instruction is
executed or VCC is removed from the device.
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all ERASE/
WRITE functions and should follow all programming
operations. Execution of a READ instruction is
independent of both the EWENand EWDSinstructions.
FIGURE 2-3:
EWDS TIMING
TCSL
CS
CLK
DI
•••
X
1
0
0
0
0
X
FIGURE 2-4:
EWEN TIMING
TCSL
CS
CLK
DI
•••
1
0
0
1
1
X
X
devices) output string. The output data bits will toggle on
the rising edge of the CLK and are stable after the spec-
ified time delay (TPD). Sequential read is possible when
CS is held high. The memory data will automatically cycle
to the next register and output sequentially.
2.7
READ
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-Version
devices) or 16-bit (If ORG pin is high or B-version
FIGURE 2-5:
READ TIMING
CS
CLK
DI
An
•••
A0
0
1
1
0
HIGH-Z
DO
Dx
D0
Dx
D0
Dx
D0
•••
•••
•••
DS21796D-page 8
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the READY/BUSY status of the
device, if CS is brought high after a minimum of 250 ns
2.8
WRITE
The WRITEinstruction is followed by 8 bits (If ORG is
low or A-version devices) or 16 bits (If ORG pin is high
or B-version devices) of data which are written into the
specified address. The self-timed auto-erase and
programming cycle is initiated by the rising edge of CLK
on the last data bit.
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
FIGURE 2-6:
WRITE TIMINGS
TCSL
CS
CLK
DI
0
1
1
An
A0
Dx
D0
•••
•••
TSV
TCZ
HIGH-Z
BUSY
READY
DO
HIGH-Z
Twc
2004 Microchip Technology Inc.
DS21796D-page 9
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
The DO pin indicates the READY/BUSY status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
2.9
WRITE ALL (WRAL)
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
The self-timed auto-erase and programming cycle is
initiated by the rising edge of CLK on the last data bit.
Clocking of the CLK pin is not necessary after the
device has entered the WRAL cycle. The WRAL
command does include an automatic ERAL cycle for
the device. Therefore, the WRAL instruction does not
require an ERALinstruction but the chip must be in the
EWEN status.
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
VCC must be ≥ 4.5V for proper operation of WRAL.
FIGURE 2-7:
WRAL TIMING
TCSL
CS
CLK
DI
0
0
1
X
1
0
•••
Dx
•••
X
D0
TSV
TCZ
HIGH-Z
BUSY
READY
DO
HIGH-Z
TWL
DS21796D-page 10
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.0
PIN DESCRIPTIONS
TABLE 3-1:
Name
PIN DESCRIPTIONS
SOIC/PDIP/MSOP/
TSSOP
SOT-23
Function
CS
CLK
DI
1
2
3
4
5
6
7
8
5
4
Chip Select
Serial Clock
Data In
3
DO
1
Data Out
Ground
VSS
ORG
PE
2
N/A
N/A
6
Organization / 93XX76C
Program Enable
VCC
Power Supply
3.1
Chip Select (CS)
3.3
Data In (DI)
A high level selects the device; a low level deselects
the device and forces it into Standby mode. However, a
programming cycle which is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
3.4
Data Out (DO)
Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (TPD after the
positive edge of CLK).
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
This pin also provides READY/BUSY status informa-
tion during ERASE and WRITE cycles. READY/BUSY
status information is available on the DO pin if CS is
brought high after being low for minimum Chip Select
low time (TCSL) and an erase or write operation has
been initiated.
3.2
Serial Clock (CLK)
The Serial Clock is used to synchronize the communi-
cation between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of CLK. Data bits are also clocked
out on the positive edge of CLK.
The Status signal is not available on DO, if CS is held
low during the entire ERASE or WRITE cycle. In this
case, DO is in the HIGH-Z mode. If status is checked
after the ERASE/WRITE cycle, the data line will be high
to indicate the device is ready.
CLK can be stopped anywhere in the transmission
sequence (at high or low-level) and can be continued
anytime with respect to clock high time (TCKH) and
clock low time (TCKL). This gives the controlling master
freedom in preparing opcode, address and data.
Note:
Issuing a Start bit and then taking CS low
will clear the READY/BUSY status from
DO.
CLK is a “don't care” if CS is low (device deselected). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status (i.e.,
waiting for a Start condition).
3.5
Organization (ORG)
When the ORG pin is connected to VCC or Logic HI, the
(x16) memory organization is selected. When the ORG
pin is tied to VSS or Logic LO, the (x8) memory
organization is selected. For proper operation, ORG
must be tied to a valid logic level.
CLK cycles are not required during the self-timed
WRITE (i.e., auto ERASE/WRITE) cycle.
93XX76A devices are always x8 organization and
93XX76B devices are always x16 organization.
After detection of a Start condition the specified number
of clock cycles (respectively low to high transitions of
CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
data bits before an instruction is executed. CLK and DI
then become don't care inputs waiting for a new Start
condition to be detected.
2004 Microchip Technology Inc.
DS21796D-page 11
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.6
Program Enable (PE)
This pin allows the user to enable or disable the ability
to write data to the memory array. If the PE pin is tied
to VCC, the device can be programmed. If the PE pin is
tied to VSS, programming will be inhibited. PE is not
available on 93XX76A or 93XX76B. On those devices,
programming is always enabled. This pin cannot be
floated, it must be tied to VCC or VSS.
DS21796D-page 12
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
MSOP 1st Line Marking Codes
Pb-free
8-Lead MSOP (150 mil)
Example:
Device
93AA76C
93LC76C
93C76C
std mark
3A76CT
3L76CT
3C76CT
mark
3L76I
2281L7
XXXXXXT
YWWNNN
GA76CT
GL76CT
GC76CT
T = blank for commercial, “I” for Industrial,
“E” for Extended.
Example:
4EL7
6-Lead SOT-23
XXNN
SOT23 Marking Codes
Device
I-temp
E-temp
93AA76A
93AA76B
93LC76A
93LC76B
93C76A
4BNN
4LNN
4ENN
4PNN
4HNN
4TNN
–
–
4FNN
4RNN
4JNN
4UNN
Example:
8-Lead PDIP
93C76B
93LC76
I/P 1L7
XXXXXXXX
XXXXXNNN
Pb-free topside mark is same; Pb-free
noted only on carton label.
0228
YYWW
Example:
8-Lead SOIC
93LC76
XXXXXXXX
I/SN 0228
XXXXYYWW
1L7
NNN
TSSOP 1st Line Marking Codes
Pb-free
Device
std mark
mark
93AA76C
93LC76C
93C76C
A76C
L76C
C76C
GADC
GLDC
GCDC
Example:
8-Lead TSSOP
L76
I228
1L7
XXXX
TYWW
NNN
Temperature grade is marked on line 2.
Legend: XX...X Part number
T
Temperature
Blank Commercial
I
E
Industrial
Extended
YY
Year code (last 2 digits of calendar year) except TSSOP
and MSOP which use only the last 1 digit
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
WW
NNN
Note: Custom marking available.
2004 Microchip Technology Inc.
DS21796D-page 13
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
INCHES
NOM
MILLIMETERS*
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
0.85
-
1.10
Molded Package Thickness
Standoff
.030
.000
.033
-
.037
.006
0.75
0.95
0.15
0.00
Overall Width
.193 TYP.
4.90 BSC
Molded Package Width
Overall Length
Foot Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint (Reference)
Foot Angle
F
φ
c
0°
.003
.009
5°
-
8°
.009
.016
15°
0°
0.08
0.22
5°
-
-
-
-
-
8°
0.23
0.40
15°
Lead Thickness
Lead Width
.006
B
α
β
.012
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
-
-
5°
15°
5°
15°
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21796D-page 14
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
6-Lead Plastic Small Outline Transistor (OT) (SOT-23)
E
E1
B
p1
D
n
1
α
c
A
A2
φ
A1
L
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
6
MAX
n
p
Number of Pins
Pitch
6
.038
.075
.046
.043
.003
.110
.064
.116
.018
5
0.95
1.90
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.057
0.90
0.90
1.18
1.10
0.08
2.80
1.63
2.95
0.45
5
1.45
1.30
0.15
3.00
1.75
3.10
0.55
10
Molded Package Thickness
Standoff
.035
.000
.102
.059
.110
.014
0
.051
.006
.118
.069
.122
.022
10
0.00
2.60
1.50
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.004
.014
0
.006
.017
5
.008
.020
10
0.09
0.35
0
0.15
0.43
5
0.20
0.50
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
0
5
10
0
5
10
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
2004 Microchip Technology Inc.
DS21796D-page 15
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Du8-Lead Plastic Small Outline (al In-line (P) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.100
.155
.130
2.54
Top to Seating Plane
A
.140
.170
3.56
2.92
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
3.68
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21796D-page 16
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
Overall Height
A
.053
.069
1.35
1.32
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
0.10
5.79
3.71
4.80
0.25
0.48
0
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
β
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2004 Microchip Technology Inc.
DS21796D-page 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
E
E1
p
D
2
1
n
B
α
A
c
A1
A2
φ
β
L
Units
INCHES
NOM
MILLIMETERS*
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
8
.026
0.65
Overall Height
A
.043
1.10
Molded Package Thickness
Standoff
A2
A1
E
.033
.035
.004
.251
.173
.118
.024
4
.037
.006
.256
.177
.122
.028
8
0.85
0.05
0.90
0.10
6.38
4.40
3.00
0.60
4
0.95
0.15
6.50
4.50
3.10
0.70
8
§
.002
.246
.169
.114
.020
0
Overall Width
6.25
4.30
2.90
0.50
0
Molded Package Width
Molded Package Length
Foot Length
E1
D
L
φ
Foot Angle
c
Lead Thickness
.004
.007
0
.006
.010
5
.008
.012
10
0.09
0.19
0
0.15
0.25
5
0.20
0.30
10
Lead Width
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
DS21796D-page 18
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
APPENDIX A: REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision D
Corrections to Device Selection Table, Table 1-1, Table
1-2, Section 2.4, Section 2.5, Section 2.8 and Section
2.9. Added note to Figure 2-7.
2004 Microchip Technology Inc.
DS21796D-page 19
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
NOTES:
DS21796D-page 20
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ON-LINE SUPPORT
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
Microchip provides on-line support on the Microchip
World Wide Web site.
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:
The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape® or Microsoft®
Internet Explorer. Files are also available for FTP
download from our FTP site.
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
Connecting to the Microchip Internet
Web Site
042003
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for products, Development Systems,
technical information and more
• Listing of seminars and events
2004 Microchip Technology Inc.
DS21796D-page 21
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
Reader Response
Total Pages Sent ________
RE:
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
FAX: (______) _________ - _________
Application (optional):
Would you like a reply?
Y
N
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D
Literature Number:
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21796D-page 22
2004 Microchip Technology Inc.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
/XX
X
PART NO.
X
X
Examples:
a)
93AA76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 1.8V
Package
Device Tape & Reel
Lead Finish
Temperature
Range
b)
93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V
Device
93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)
93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)
93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG
c)
93AA76CT-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, tape and reel, 1.8V
a)
b)
c)
93LC76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 2.5V
93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,
SOT-23 package, tape and reel, 2.5V
93LC76CXT-I/SNG: 8K, 1024x8 or 512x16
Serial EEPROM, SOIC package, Industrial
temperature, tape and reel, Pb-free finish, 2.5V
93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)
93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)
93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG
93C76A: 8K 5.0V Microwire Serial EEPROM (x8)
93C76B: 8K 5.0V Microwire Serial EEPROM (x16)
93C76C: 8K 5.0V Microwire Serial EEPROM w/ORG
a)
b)
93C76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 5.0V
93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V
Tape & Reel:
Temperature Range
Package
Blank
T
=
=
Standard pinout
Tape & Reel
I
E
=
=
-40°C to +85°C
-40°C to +125°C
MS
OT
P
SN
ST
=
=
=
=
=
Plastic MSOP (Micro Small outline, 8-lead)
SOT-23, 6-lead (Tape & Reel only)
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (150 mil body), 8-lead
TSSOP, 8-lead
Lead Finish:
Blank
G
=
=
Standard 63% / 37% SnPb
Pb-free (Matte Tin - Pure Sn)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21796D-page 23
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
NOTES:
DS21796D-page 24
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,
Select Mode, SmartSensor, SmartTel and Total Endurance
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003. The Company’s quality system processes and procedures are for
its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21796D-page 25
WORLDWIDE SALES AND SERVICE
China - Beijing
Korea
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Unit 706B
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: 86-10-85282100
Fax: 86-10-85282104
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or
82-2-558-5934
Singapore
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
China - Chengdu
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034
Fax: 770-640-0307
Taiwan
Kaohsiung Branch
30F - 1 No. 8
Fax: 86-28-86766599
Boston
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Fuzhou
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506
Fax: 86-591-7503521
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848
Fax: 978-692-3821
Taiwan
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071
Fax: 630-285-0075
China - Hong Kong SAR
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Dallas
EUROPE
Austria
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Regus Business Centre
Lautrup hoj 1-3
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250
Tel: 86-21-6275-5700
Fax: 86-21-6275-5060
China - Shenzhen
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380
Fax: 86-755-8295-1393
China - Shunde
Fax: 248-538-2260
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
Kokomo
France
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360
Fax: 765-864-8387
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Room 401, Hongjian Building, No. 2
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888
Fax: 949-263-1338
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: 86-757-28395507 Fax: 86-757-28395571
Germany
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
San Jose
1300 Terra Bella Avenue
Mountain View, CA 94043
Tel: 650-215-1444
Italy
India
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Fax: 650-961-0286
Toronto
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands
P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: 31-416-690399
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699
Fax: 905-673-6509
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Fax: 31-416-690340
United Kingdom
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869
Fax: 44-118-921-5820
01/26/04
DS21796D-page 26
2004 Microchip Technology Inc.
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