93LCS66-I/OT [MICROCHIP]

2K/4K 2.5V Microwire Serial EEPROM with Software Write Protect; 2K / 4K 2.5V Microwire串行EEPROM与软件写保护
93LCS66-I/OT
型号: 93LCS66-I/OT
厂家: MICROCHIP    MICROCHIP
描述:

2K/4K 2.5V Microwire Serial EEPROM with Software Write Protect
2K / 4K 2.5V Microwire串行EEPROM与软件写保护

可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器
文件: 总14页 (文件大小:183K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Obsolete Device  
93LCS56/66  
®
2K/4K 2.5V Microwire Serial EEPROM with Software Write Protect  
FEATURES  
BLOCK DIAGRAM  
• Single supply with programming operation down  
to 2.5V  
• Low power CMOS technology  
- 1 mA active current typical  
- 5 µA standby current (typical) at 3.0V  
• x16 memory organization  
V
CC  
VSS  
ADDRESS  
DECODER  
MEMORY  
ARRAY  
- 128x16 (93LCS56)  
- 256x16 (93LCS66)  
• Software write protection of user defined memory  
space  
ADDRESS  
COUNTER  
OUTPUT  
BUFFER  
• Self timed erase and write cycles  
• Automatic ERAL before WRAL  
• Power on/off data protection  
• Industry standard 3-wire serial I/O  
• Device status signal during E/W  
• Sequential READ function  
DATA REGISTER  
DO  
DI  
MODE  
DECODE  
LOGIC  
PRE  
PE  
CS  
CLOCK  
CLK  
GENERATOR  
• 1,000,000 E/W cycles guaranteed  
• Data retention > 200 years  
• 8-pin PDIP/SOIC and 14-pin SOIC packages  
DESCRIPTION  
The Microchip Technology Inc. 93LCS56/66 are low volt-  
age Serial Electrically Erasable PROMs with memory  
capacities of 2K bits/4K bits respectively. A write protect  
register is included in order to provide a user defined  
region of write protected memory. All memory locations  
greater than or equal to the address placed in the write  
protect register will be protected from any attempted write  
or erase operation. It is also possible to protect the  
address in the write protect register permanently by using  
a one time only instruction (PRDS). Any attempt to alter  
data in a register whose address is equal to or greater  
than the address stored in the protect register will be  
aborted. Advanced CMOS technology makes this device  
ideal for low power non-volatile memory applications.  
Temperature ranges supported  
- Commercial (C):  
- Industrial (I):  
0°C to +70°C  
-40°C to +85°C  
PACKAGE TYPES  
SOIC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
NC  
CS  
CLK  
NC  
DI  
NC  
VCC  
PRE  
NC  
DIP  
SOIC  
1
2
3
4
8
7
6
5
VCC  
PRE  
PE  
CS  
CLK  
DI  
1
8
CS  
VCC  
2
7
CLK  
PRE  
PE  
3
6
DI  
PE  
DO  
NC  
VSS  
NC  
4
5
VSS  
DO  
8
DO  
VSS  
93LCS56  
93LCS66  
93LCS56  
93LCS66  
93LCS56  
93LCS66  
Microwire is a registered trademark of National Semiconductor Incorporated.  
2004 Microchip Technology Inc.  
DS11181E-page 1  
93LCS56/66  
TABLE 1-1:  
Name  
PIN FUNCTION TABLE  
Function  
1.0  
ELECTRICAL CHARACTERISTICS  
1.1  
Maximum Ratings*  
CS  
CLK  
DI  
Chip Select  
VCC...................................................................................7.0V  
All inputs and outputs w.r.t. VSS ............... -0.6V to VCC +1.0V  
Storage temperature .....................................-65°C to +150°C  
Ambient temp. with power applied ................-65°C to +125°C  
Soldering temperature of leads (10 seconds) .............+300°C  
ESD protection on all pins................................................4 kV  
Serial Data Clock  
Serial Data Input  
Serial Data Output  
Ground  
DO  
VSS  
PE  
Program Enable  
Protect Register Enable  
Power Supply  
*Notice: Stresses above those listed under “Maximum ratings”  
may cause permanent damage to the device. This is a stress rat-  
ing only and functional operation of the device at those or any  
other conditions above those indicated in the operational listings  
of this specification is not implied. Exposure to maximum rating  
conditions for extended periods may affect device reliability.  
PRE  
VCC  
TABLE 1-2:  
DC AND AC ELECTRICAL CHARACTERISTICS  
VCC = +2.5V to +6.0V  
Commercial(C): Tamb = 0°C to +70°C  
Industrial (I):  
Tamb = -40°C to +85°C  
Parameter  
Symbol  
Min  
Max  
Units  
Conditions  
High level input voltage  
Low level input voltage  
Low level output voltage  
VIH  
VIL  
2.0  
-0.3  
VCC +1  
0.8  
0.4  
0.2  
V
V
VCC 2.5V  
VCC 2.5V  
VOL1  
VOL2  
VOH1  
VOH2  
ILI  
V
IOL = 2.1 mA; VCC = 4.5V  
IOL = 100 µA; VCC = 2.5V  
IOH = -400µA; VCC = 4.5V  
IOH = -100µA; VCC = 2.5V  
VIN = 0.1V to VCC  
V
High level output voltage  
2.4  
V
VCC-0.2  
-10  
V
Input leakage current  
Output leakage current  
10  
µA  
µA  
pF  
ILO  
-10  
10  
VOUT = 0.1V to Vcc  
Pin capacitance  
(all inputs/outputs)  
CIN, COUT  
7
VIN/VOUT = 0V (Note 1 & 2)  
Tamb = +25°C; FCLK = 1 MHz  
Operating current  
ICC Write  
ICC Read  
3
mA  
FCLK = 2 MHz; VCC = 3.0V (Note 2)  
1
500  
mA  
µA  
FCLK = 2 MHz; VCC = 6.0V  
FCLK = 1 MHz; VCC = 3.0V  
Standby current  
Clock frequency  
ICCS  
100  
30  
µA  
µA  
CLK = CS = 0V; VCC = 6.0V  
CLK = CS = 0V; VCC = 3.0V  
DI = PE = PRE = VSS  
FCLK  
2
1
MHz  
MHz  
VCC 4.5V  
VCC < 4.5V  
Clock high time  
TCKH  
TCKL  
TCSS  
TCSH  
TCSL  
TPRES  
TPES  
TPREH  
TPEH  
TDIS  
250  
250  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Clock low time  
Chip select setup time  
Chip select hold time  
Chip select low time  
PRE setup time  
Relative to CLK  
Relative to CLK  
0
250  
100  
100  
0
Relative to CLK  
Relative to CLK  
Relative to CLK  
Relative to CLK  
Relative to CLK  
Relative to CLK  
CL=100 pF  
PE setup time  
PRE hold time  
PE hold time  
500  
100  
100  
Data input setup time  
Data input hold time  
Data output delay time  
Data output disable time  
TDIH  
TPD  
400  
100  
TCZ  
CL=100 pF (Note 2)  
Note 1: This parameter is tested at Tamb = 25°C and FCLK = 1 MHz.  
2: This parameter is periodically sampled and not 100% tested.  
DS11181E-page 2  
2004 Microchip Technology Inc.  
93LCS56/66  
(Continued)  
TABLE 1-2:  
DC AND AC ELECTRICAL CHARACTERISTICS  
VCC = +2.5V to +6.0V  
Commercial(C): Tamb = 0°C to +70°C  
Industrial (I):  
Tamb = -40°C to +85°C  
Parameter  
Symbol  
Min  
Max  
Units  
Conditions  
Status valid time  
TSV  
TWC  
TEC  
TWL  
500  
10  
15  
30  
ns  
ms  
CL=100 pF  
Program cycle time  
ERASE/WRITE mode (Note 3)  
ERAL mode  
ms  
ms  
WRAL mode  
Endurance  
1M  
cycles  
25°C, Vcc = 5.0V, Block Mode  
(Note 4)  
3: Typical program cycle time is 4 ms per word.  
4: This parameter is not tested but guaranteed by characterization. For endurance estimates in a specific appli-  
cation, please consult the Total Endurance Model which can be obtained on our BBS or website.  
TABLE 1-3:  
INSTRUCTION SET FOR 93LCS56*/66  
93LCS56/66 (x 16 organization)  
Data In Data Out PRE PE  
Instruction SB Opcode  
Address  
Comments  
READ  
EWEN  
ERASE  
1
1
1
10  
00  
11  
A7 - A0  
D15-D0  
0
X
1
1
Reads data stored in memory, start-  
ing at specified address (.Note).  
11XXXXXX  
A7 - A0  
High-Z  
0
Erase/Write Enable must precede all  
programming modes.  
(RDY/  
BSY)  
Erase data at specified address  
location if address is unprotected  
(Note).  
ERAL  
1
1
1
1
1
1
00  
01  
00  
00  
10  
00  
10XXXXXX  
A7 - A0*  
(RDY/  
BSY)  
0
0
0
0
1
1
1
1
1
X
X
1
Erase all registers to “FF”. Valid only  
when Protect Register is cleared.  
WRITE  
WRAL  
EWDS  
PRREAD  
PREN  
D15 - D0  
(RDY/  
BSY)  
Writes register if address is unpro-  
tected.  
01XXXXXX D15 - D0  
(RDY/  
BSY)  
Writes all registers. Valid only when  
Protect Register is cleared.  
00XXXXXX  
XXXXXXXX  
11XXXXXX  
High-Z  
A7-A0  
High-Z  
Erase/Write Disable deactivates all  
programming instructions.  
Reads address stored in Protect  
Register.  
Must immediately precede  
PRCLEAR, PRWRITE and PRDS  
instructions.  
PRCLEAR  
PRWRITE  
1
1
11  
01  
11111111  
A7 - A0*  
(RDY/  
BSY)  
1
1
1
1
Clears the Protect Register such that  
all data are NOT write-protected.  
(RDY/  
BSY)  
Programs address into Protect Reg-  
ister. Thereafter, memory addresses  
greater than or equal to the address  
in Protect Register are write-pro-  
tected.  
PRDS  
1
00  
00000000  
(RDY/  
BSY)  
1
1
ONE TIME ONLY instruction after  
which the address in the Protect  
Register cannot be altered.  
Note:  
Address A7 bit is a “don’t care” on 93LCS56.  
2004 Microchip Technology Inc.  
DS11181E-page 3  
93LCS56/66  
2.4  
READ  
2.0  
FUNCTIONAL DESCRIPTION  
The 93LCS56/66 is organized as 128/256 registers by  
16 bits. Instructions, addresses and write data are  
clocked into the DI pin on the rising edge of the clock  
(CLK). The DO pin is normally held in a high-Z state  
except when reading data from the device, or when  
checking the ready/busy status during a programming  
operation. The ready/busy status can be verified during  
an Erase/Write operation by polling the DO pin; DO low  
indicates that programming is still in progress, while  
DO high indicates the device is ready. The DO will enter  
the high-Z state on the falling edge of the CS.  
The READ instruction outputs the serial data of the  
addressed memory location on the DO pin. A dummy  
zero bit precedes the 16 bit output string. The output  
data bits will toggle on the rising edge of the CLK and  
are stable after the specified time delay (TPD). Sequen-  
tial read is possible when CS is held high. The memory  
data will automatically cycle to the next register and  
output sequentially.  
2.5  
Erase/Write Enable and Disable  
(EWEN, EWDS)  
2.1  
START Condition  
The 93LCS56/66 powers up in the Erase/Write Disable  
(EWDS) state. All programming modes must be pre-  
ceded by an Erase/Write Enable (EWEN) instruction.  
The PE pin MUST be held “high” while loading the  
EWEN instruction. Once the EWEN instruction is exe-  
cuted, programming remains enabled until an EWDS  
instruction is executed or VCC is removed from the  
device. To protect against accidental data disturb, the  
EWDS instruction can be used to disable all Erase/  
Write functions and should follow all programming  
operations. Execution of a READ instruction is inde-  
pendent of both the EWEN and EWDS instructions.  
The START bit is detected by the device if CS and DI  
are both HIGH with respect to the positive edge of CLK  
for the first time.  
Before a START condition is detected, CS, CLK, and DI  
may change in any combination (except to that of a  
START condition), without resulting in any device oper-  
ation (READ, WRITE, ERASE, EWEN, EWDS, ERAL,  
WRAL, PRREAD, PREN, PRCLEAR, PRWRITE, and  
PRDS). As soon as CS is HIGH, the device is no longer  
in the standby mode.  
An instruction following a START condition will only be  
executed if the required amount of opcode, address  
and data bits for any particular instruction is clocked in.  
2.6  
ERASE  
The ERASE instruction forces all data bits of the spec-  
ified address to the logical “1” state. CS is brought low  
following the loading of the last address bit. This falling  
edge of the CS pin initiates the self-timed programming  
cycle. The PE pin MUST be latched “high” during load-  
ing the ERASE instruction but becomes a “don't care”  
after loading the instruction.  
After execution of an instruction (i.e., clock in or out of  
the last required address or data bit) CLK and DI  
become don't care bits until a new start condition is  
detected.  
2.2  
DI/DO  
The DO pin indicates the READY/BUSY status of the  
device if CS is brought high after a minimum of 250 ns  
low (TCLS). DO at logical “0” indicates that program-  
ming is still in progress. DO at logical “1” indicates that  
the register at the specified address has been erased  
and the device is ready for another instruction. ERASE  
instruction is valid if specified address is unprotected.  
It is possible to connect the Data In and Data Out pins  
together. However, with this configuration it is possible  
for a “bus conflict” to occur during the “dummy zero”  
that precedes the READ operation, if A0 is a logic  
HIGH level. Under such a condition the voltage level  
seen at Data Out is undefined and will depend upon the  
relative impedances of Data Out and the signal source  
driving A0. The higher the current sourcing capability of  
A0, the higher the voltage at the Data Out pin.  
The ERASE cycle takes 4 ms per word typical.  
2.7  
WRITE  
2.3  
Data Protection  
The WRITE instruction is followed by 16 bits of data  
which are written into the specified address. After the  
last data bit is put on the DI pin, CS must be brought  
low before the next rising edge of the CLK clock. Both  
CS and CLK must be low to initiate the self-timed auto-  
erase and programming cycle. The PE pin MUST be  
latched “high” while loading the WRITE instruction but  
becomes a “don't care” thereafter.  
During power-up, all programming modes of operation  
are inhibited until VCC has reached a level greater than  
1.4V. During power-down, the source data protection  
circuitry acts to inhibit all programming modes when  
VCC has fallen below 1.4V.  
The EWEN and EWDS commands give additional pro-  
tection against accidentally programming during nor-  
mal operation.  
After power-up, the device is automatically in the  
EWDS mode. Therefore, an EWEN instruction must be  
performed before any ERASE or WRITE instruction  
can be executed.  
DS11181E-page 4  
2004 Microchip Technology Inc.  
93LCS56/66  
The DO pin indicates the READY/BUSY status of the  
device if CS is brought high after a minimum of 250 ns  
(TCSL) and before the entire write cycle is complete. DO  
at logical “0” indicates that programming is still in  
progress. DO at logical “1” indicates that the register at  
the specified address has been written with the data  
specified and the device is ready for another instruc-  
tion. WRITE instruction is valid only if specified address  
is unprotected.  
2.10  
Protect Register Read (PRREAD)  
The Protect Register Read (PRREAD) instruction out-  
puts the address stored in the Protect Register on the  
DO pin. The PRE pin MUST be held HIGH when load-  
ing the instruction and remains HIGH until CS goes  
LOW. A dummy zero bit precedes the 8-bit output  
string. The output data bits in the memory Protect Reg-  
ister will toggle on the rising edge of the CLK as in the  
READ mode.  
The WRITE cycle takes 4 ms per word typical.  
2.11  
Protect Register Enable (PREN)  
2.8  
Erase All (ERAL)  
The Protect Register Enable (PREN) instruction is  
used to enable the PRCLEAR, PRWRITE, and PRDS  
modes. Before the PREN mode can be entered, the  
device must be in the EWEN mode. Both PRE and PE  
pins MUST be held “high” while loading the instruction.  
The PREN instruction MUST immediately precede a  
PRCLEAR, PRWRITE, or PRDS instruction.  
The ERAL instruction will erase the entire memory  
array to the logical “1”. The ERAL cycle is identical to  
the ERASE cycle except for the different opcode. The  
ERAL cycle is completely self-timed and commences  
at the falling edge of the CS. PE pin MUST be held  
“high” while loading the instruction but becomes “don't  
care” thereafter. Clocking of the CLK pin is not neces-  
sary after the device has entered the self clocking  
mode. The ERAL instruction is guaranteed at VCC = 4.5  
to 6V and valid only when Protect Register is cleared.  
2.12  
Protect Register Clear (PRCLEAR)  
The Protect Register Clear (PRCLEAR) instruction  
clears the address stored in the Protect Register and,  
therefore, enables all registers for programming  
instructions such as ERASE, ERAL, WRITE, and  
WRAL. The PRE and PE pin MUST be held HIGH  
when loading the instruction. Thereafter, PRE and PE  
pins become “don't care”. A PREN instruction must  
immediately precede a PRCLEAR instruction.  
The DO pin indicates the READY/BUSY status of the  
device if CS is brought high after a minimum of 250 ns  
low (TCSL) and before the entire write cycle is complete.  
The ERAL cycle takes 15 ms maximum (8 ms typical).  
2.9  
Write All (WRAL)  
The WRAL instruction will write the entire memory  
array with the data specified in the command. The  
WRAL cycle is completely self-timed and commences  
at the falling edge of the CS. PE pin MUST be held  
“high” while loading the instruction but becomes “don't  
care” thereafter. Clocking of the CLK pin is not neces-  
sary after the device has entered the self clocking  
mode. The WRAL command does include an automatic  
ERAL cycle for the device. Therefore, the WRAL  
instruction does not require an ERAL instruction but the  
chip must be in the EWEN status. The WRAL instruc-  
tion is guaranteed at VCC = 4.5 to 6V and valid only  
when Protect Register is cleared.  
2.13  
Protect Register Write (PRWRITE)  
The Protect Register Write (PRWRITE) instruction  
writes into the Protect Register the address of the first  
register to be protected. After this instruction is exe-  
cuted, all registers whose memory addresses are  
greater than or equal to the address pointer specified in  
the Protect register are protected from any program-  
ming instructions. Note that a PREN instruction must  
be executed before a PRWRITE instruction and, the  
Protect Register must be cleared (by a PRCLEAR  
instruction) before executing the PRWRITE instruction.  
The PRE and PE pins MUST be held HIGH while load-  
ing PRWRITE instruction. After the instruction is  
loaded, they become “don't care”.  
The DO pin indicates the READY/BUSY status of the  
device if CS is brought high after a minimum of 250 ns  
low (TCSL).  
2.14  
Protect Register Disable (PRDS)  
The WRAL cycle takes 30 ms maximum (16 ms typi-  
cal).  
The Protect Register Disable (PRDS) instruction is a  
ONE TIME ONLY instruction to permanently set the  
address specified in the Protect Register. Any attempts  
to change the address pointer will be aborted. The PRE  
and PE pins MUST be held HIGH while loading PRDS  
instruction. After the instruction is loaded, they become  
“don't care”. Note that a PREN instruction must be exe-  
cuted before a PRDS instruction.  
Note: In order to execute either READ, EWEN,  
ERAL, WRITE, WRAL, or EWDS instruc-  
tions, the Protect Register Enable (PRE)  
pin must be held LOW.  
2004 Microchip Technology Inc.  
DS11181E-page 5  
93LCS56/66  
FIGURE 2-1: SYNCHRONOUS DATA TIMING  
V
IH  
PRE  
V
IL  
T
T
PRES  
T
PREH  
V
IH  
PE  
V
V
IL  
T
PEH  
PES  
IH  
CS  
T
CSS  
T
CKH  
T
CKL  
V
IL  
T
CSH  
V
IH  
CLK  
V
IL  
T
DIH  
T
DIS  
V
IH  
DI  
V
IL  
T
T
CZ  
CZ  
T
PD  
T
PD  
V
OH  
DO  
(READ)  
V
V
OL  
T
SV  
OH  
DO  
(PROGRAM)  
STATUS VALID  
V
OL  
FIGURE 2-2: READ TIMING  
TCSL  
CS  
CLK  
DI  
1
1
0
A2  
• • •  
A0  
TRI-STATE  
DO  
0
D15  
• • •  
D0  
D15*  
• • •  
D0  
D15*  
• • •  
PRE = 0  
PE = X  
* The memory automatically cycles to the next register.  
Tri-State is a registered trademark of National Semiconductor.  
FIGURE 2-3: EWEN TIMING  
DS11181E-page 6  
2004 Microchip Technology Inc.  
93LCS56/66  
FIGURE 2-4: EWDS TIMING  
T
CSL  
CS  
CLK  
DI  
† † †  
1
0
0
0
0
X
X
PRE = 0  
PE = X  
6 DON'T CARE BITS  
DO = TRI-STATE  
FIGURE 2-5: WRITE TIMING  
PE  
T
CSL  
CS  
CLK  
† † †  
† † †  
1
0
1
A7  
A0  
D15  
D0  
DI  
BUSY  
TRI-STATE  
READY  
DO  
† Address bit A7 becomes a "don't care" for 93LCS56.  
PRE = 0  
T
WC  
FIGURE 2-6: WRAL TIMING  
PE  
TCSL  
CS  
CLK  
1
0
0
0
1
X
• • •  
X
D15  
• • •  
D0  
DI  
6 DON'T CARE BITS  
TRI-STATE  
BUSY  
TRISTATE  
READY  
DO  
Guaranteed at VCC = 4.5V to 6.0V  
Protect Register must be cleared  
PRE = 0  
TWL  
2004 Microchip Technology Inc.  
DS11181E-page 7  
93LCS56/66  
FIGURE 2-7: ERASE TIMING  
PE  
CS  
T
CSL  
STANDBY  
CHECK STATUS  
CLK  
DI  
A7  
1
1
1
† † †  
A0  
T
CZ  
T
SV  
TRI-STATE  
TRI-STATE  
DO  
READY  
BUSY  
T
WC  
† Address bit A7 is a "don't care" for 93LCS56.  
PRE = 0  
FIGURE 2-8: ERAL TIMING  
PE  
CS  
T
CSL  
STANDBY  
CHECK STATUS  
CLK  
DI  
1
0
0
1
0
† † †  
X
X
T
CZ  
T
SV  
6 DON'T CARE BITS  
TRI-STATE  
TRI-STATE  
READY  
BUSY  
DO  
T
EC  
Guarantee at V  
CC = 4.5V to 6.0V  
PRE = 0  
Protect Register must be cleared  
FIGURE 2-9: PRREAD TIMING  
PRE  
CS  
T
CSL  
CLK  
X
† † †  
X
1
1
0
DI  
8 DON'T CARE BITS  
PE = X  
0
A7  
A6  
† † †  
A0  
DO  
† X †  
† Address bit A7 is a "don't care" for 93LCS56.  
DS11181E-page 8  
2004 Microchip Technology Inc.  
93LCS56/66  
FIGURE 2-10: PREN TIMING  
PRE  
PE  
CS  
T
CSL  
CLK  
1
0
0
1
1
X
† † †  
X
DI  
DO = TRI-STATE  
6 DON'T CARE BITS  
A EWEN cycle must precede a PREN cycle.  
FIGURE 2-11: PRCLEAR TIMING  
PRE  
PE  
CS  
TCSL  
CLK  
1
1
1
1
• • •  
1
1
1
1
DI  
8 BITS OF "1"  
TRI-STATE  
READY  
BUSY  
DO  
A PREN cycle must immediately precede a PRCLEAR cycle.  
TWC  
FIGURE 2-12: PRWRITE TIMING  
PRE  
PE  
CS  
T
CSL  
CLK  
1
0
1
A7  
• • •  
A0  
DI  
READY  
BUSY  
DO  
T
WC  
Protect Register MUST be cleared before a PRWRITE cycle.  
A PREN cycle must immediately precede a PRWRITE cycle.  
Address bit A7 is a "don't care" for 93LCS56.  
2004 Microchip Technology Inc.  
DS11181E-page 9  
93LCS56/66  
FIGURE 2-13: PRDS TIMING  
PRE  
PE  
CS  
TCSL  
CLK  
1
0
0
0
• • •  
0
0
0
0
DI  
8 BITS OF "0"  
READY  
BUSY  
DO  
TWC  
ONE TIME ONLY instruction. A PREN cycle must immediately precede a PRDS cycle.  
data bits before an instruction is executed (see instruc-  
tion set truth table). CLK and DI then become don't care  
inputs waiting for a new start condition to be detected.  
3.0  
PIN DESCRIPTION  
3.1  
Chip Select (CS)  
Note: CS must go LOW between consecutive  
A HIGH level selects the device. A LOW level deselects  
the device and forces it into standby mode. However, a  
programming cycle which is already initiated and/or in  
progress will be completed, regardless of the CS input  
signal. If CS is brought LOW during a program cycle,  
the device will go into standby mode as soon as the  
programming cycle is completed.  
instructions.  
3.3  
Data In (DI)  
Data In is used to clock in a START bit, opcode,  
address, and data synchronously with the CLK input.  
3.4  
Data Out (DO)  
CS must be LOW for 250 ns minimum (TCSL) between  
consecutive instructions. If CS is LOW, the internal  
control logic is held in a RESET status.  
Data Out is used in the READ and PRREAD mode to  
output data synchronously with the CLK input (TPD  
after the positive edge of CLK).  
3.2  
Serial Clock (CLK)  
This pin also provides READY/BUSY status informa-  
tion during ERASE and WRITE cycles. READY/BUSY  
status information is available on the DO pin if CS is  
brought HIGH after held LOW for minimum chip select  
low time (TCSL) and an ERASE or WRITE operation  
has been initiated.  
The Serial Clock is used to synchronize the communi-  
cation between a master device and the 93LCS56/66.  
Opcode, address, and data bits are clocked in on the  
positive edge of CLK. Data bits are also clocked out on  
the positive edge of CLK.  
CLK can be stopped anywhere in the transmission  
sequence (at HIGH or LOW level) and can be contin-  
ued anytime with respect to clock HIGH time (TCDD)  
and clock LOW time (TCKL). This gives the controlling  
master freedom in preparing opcode, address, and  
data.  
The status signal is not available on DO, if CS is held  
LOW or HIGH during the entire WRITE or ERASE  
cycle. In all other cases DO is in the HIGH-Z mode. If  
status is checked after the WRITE/ERASE cycle, a  
pull-up resistor on DO is required to read the READY  
signal.  
CLK is a “Don't Care” if CS is LOW (device deselected).  
If CS is HIGH, but START condition has not been  
detected, any number of clock cycles can be received  
by the device without changing its status (i.e., waiting  
for START condition).  
3.5  
Program Enable (PE)  
This pin should be held HIGH in the programming  
mode or when executing the Protect Register program-  
ming instructions.  
CLK cycles are not required during the self-timed  
WRITE (i.e., auto ERASE/WRITE) cycle.  
3.6  
Protect Register Enable (PRE)  
After detection of a start condition the specified number  
of clock cycles (respectively LOW to HIGH transitions  
of CLK) must be provided. These clock cycles are  
required to clock in all required opcode, address, and  
This pin should be held HIGH when executing all Pro-  
tect Register instructions. Otherwise, it must be held  
LOW for normal operations.  
DS11181E-page 10  
2004 Microchip Technology Inc.  
93LCS56/66  
93LCS56/66 Product Identification System  
To order or to obtain information, e.g., on pricing or delivery, please use the listed part numbers, and refer to the factory or the listed  
sales offices.  
93LCS56/66  
/P  
P = Plastic DIP (300 mil Body), 8-lead  
SN = Plastic SOIC (150 mil Body), 8-lead  
SM = Plastic SOIC (207 mil Body), 8-lead  
SL = Plastic SOIC (150 mil Body), 14-lead  
Package:  
Temperature  
Range:  
Blank = 0°C to +70°C  
I = -40°C to +85°C  
93LCS56/66 Microwire Serial EEPROM  
93LCS56T/66T Microwire Serial EEPROM (Tape and Reel)  
Device:  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
1. Your local Microchip sales office  
2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277  
3. The Microchip Worldwide Web Site (www.microchip.com)  
2004 Microchip Technology Inc.  
DS11181E-page 11  
93LCS56/66  
NOTES:  
DS11181E-page 12  
2004 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is intended through suggestion only  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect  
to the accuracy or use of such information, or infringement of  
patents or other intellectual property rights arising from such  
use or otherwise. Use of Microchip’s products as critical  
components in life support systems is not authorized except  
with express written approval by Microchip. No licenses are  
conveyed, implicitly or otherwise, under any intellectual  
property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,  
PRO MATE, PowerSmart, rfPIC, and SmartShunt are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,  
SmartSensor and The Embedded Control Solutions Company  
are registered trademarks of Microchip Technology  
Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,  
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,  
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial  
Programming, ICSP, ICEPIC, Migratable Memory, MPASM,  
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,  
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,  
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,  
SmartTel and Total Endurance are trademarks of Microchip  
Technology Incorporated in the U.S.A. and other countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2004, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 quality system certification for  
its worldwide headquarters, design and wafer fabrication facilities in  
Chandler and Tempe, Arizona and Mountain View, California in  
October 2003. The Company’s quality system processes and  
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping  
devices, Serial EEPROMs, microperipherals, nonvolatile memory and  
analog products. In addition, Microchip’s quality system for the design  
and manufacture of development systems is ISO 9001:2000 certified.  
2004 Microchip Technology Inc.  
DS11181E-page 13  
WORLDWIDE SALES AND SERVICE  
China - Beijing  
Singapore  
AMERICAS  
Corporate Office  
2355 West Chandler Blvd.  
Chandler, AZ 85224-6199  
Tel: 480-792-7200  
Fax: 480-792-7277  
Technical Support: 480-792-7627  
Web Address: www.microchip.com  
Unit 706B  
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Wan Tai Bei Hai Bldg.  
No. 6 Chaoyangmen Bei Str.  
Beijing, 100027, China  
Tel: 86-10-85282100  
Fax: 86-10-85282104  
#07-02 Prime Centre  
Singapore, 188980  
Tel: 65-6334-8870 Fax: 65-6334-8850  
Taiwan  
Kaohsiung Branch  
30F - 1 No. 8  
Min Chuan 2nd Road  
Kaohsiung 806, Taiwan  
Tel: 886-7-536-4816  
Fax: 886-7-536-4817  
China - Chengdu  
Rm. 2401-2402, 24th Floor,  
Ming Xing Financial Tower  
No. 88 TIDU Street  
Chengdu 610016, China  
Tel: 86-28-86766200  
Atlanta  
3780 Mansell Road, Suite 130  
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Tel: 770-640-0034  
Fax: 770-640-0307  
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Fax: 86-28-86766599  
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Fuzhou 350001, China  
Tel: 86-591-7503506  
Fax: 86-591-7503521  
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Fax: 978-692-3821  
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Tel: 886-2-2717-7175 Fax: 886-2-2545-0139  
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Tel: 43-7242-2244-399  
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Tel: 49-89-627-144-0  
Fax: 49-89-627-144-44  
Fax: 949-462-9608  
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Tel: 650-215-1444  
Italy  
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Tel: 91-80-22290061 Fax: 91-80-22290062  
Japan  
Fax: 650-961-0286  
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Fax: 39-0331-466781  
Netherlands  
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ASIA/PACIFIC  
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Tel: 44-118-921-5869  
Fax: 44-118-921-5820  
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or  
82-2-558-5934  
07/12/04  
2004 Microchip Technology Inc.  

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