AT24C16C-SSHM-B-899 [MICROCHIP]
EEPROM, 2KX8, Serial, CMOS, PDSO8;
| 型号： | AT24C16C-SSHM-B-899 |
| 厂家： | 
MICROCHIP |
| 描述： | EEPROM, 2KX8, Serial, CMOS, PDSO8 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路 |
| 文件： | 总23页 (文件大小：1058K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AT24C16C
I2C-Compatible, (2-Wire) Serial EEPROM
16-Kbit (2048 x 8)
DATASHEET
Standard Features
Low-voltage and Standard-voltage Operation
VCC = 1.7V to 5.5V
̶
Internally Organized as 2,048 x 8 (16K)
I2C-compatible (2-wire) Serial Interface
Schmitt Trigger, Filtered Inputs for Noise Suppression
Bidirectional Data Transfer Protocol
1MHz (2.5V, 2.7V, 5V), 400kHz (1.7V) Compatibility
Write Protect Pin for Hardware Data Protection
16-byte Page Write Mode
̶
Partial Page Writes Allowed
Self-timed Write Cycle (5ms Max)
High-reliability
̶
̶
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Green Package Options (Pb/Halide-free/RoHS Compliant)
̶
8-lead PDIP, 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN,
5-lead SOT23, and 8-ball VFBGA
Die Options: Wafer Form and Tape and Reel
Description
The Atmel® AT24C16C provides 16,384 bits of Serial Electrically Erasable and
Programmable Read-Only Memory (EEPROM) organized as 2,048 words of 8 bits
each. The device is optimized for use in many industrial and commercial
applications where low-power and low-voltage operation are essential.
AT24C16C is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead
TSSOP, 8-pad UDFN, 8-pad XDFN, 5-lead SOT23, and 8-ball VFBGA packages
and is accessed via a 2-wire serial interface.
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
1.
Pin Configurations and Pinouts
Table 1.
Pin Configuration
8-lead PDIP
8-lead SOIC
Pin Name
NC
Function
1
2
3
4
8
7
6
5
NC
NC
V
CC
1
2
3
4
8
7
6
5
V
CC
NC
NC
No Connect
Serial Data
Serial Clock Input
Write Protect
Ground
WP
WP
SDA
SCL
SCL
SDA
NC
NC
SCL
SDA
GND
GND
WP
Top View
Top View
GND
VCC
Power Supply
8-lead TSSOP
8-pad UDFN/XDFN
8
7
6
5
1
2
3
4
V
NC
CC
NC
NC
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
WP
SCL
SDA
NC
NC
NC
GND
GND
Top View
Bottom View
5-lead SOT23
8-ball VFBGA
8
7
6
5
1
2
3
4
NC
NC
NC
V
1
2
3
5
CC
WP
V
SCL
GND
SDA
WP
SCL
SDA
4
CC
GND
Top View
Bottom View
Note: Drawings are not to scale.
2.
Absolute Maximum Ratings
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.
Operating Temperature . . . . . . . . . . .-55C to +125C
Storage Temperature . . . . . . . . . . . . .-65C to +150C
Voltage on any pin
with respect to ground . . . . . . . . . . . . . -1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . .5.0mA
2
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
3.
Block Diagram
VCC
GND
WP
Start
Stop
Logic
SCL
SDA
Serial
Control
Logic
High Voltage
Pump & Timing
Enable
Data Latches
Device
Load
COMP
Address
INC
Comparator
Data Word
ADDR/Counter
Read/Write
EEPROM
Array
A2
A1
Column
Decoder
Serial MUX
DOUT / ACK
Logic
DIN
DOUT
4.
Pin Description
Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative
edge clock data out of each device.
Serial Data (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-drain driven and may
be wire-ORed with any number of other open-drain or open-collector devices.
Device/Page Addresses: The AT24C16C does not use the device address pins, which limits the number of
devices on a single bus to one (see Section 7. “Device Addressing” on page 9).
Write Protect (WP): AT24C16C has a Write Protect pin that provides hardware data protection. The Write
Protect pin allows normal Read/Write operations when connected to Ground (GND). When the Write Protect pin
is connected to VCC, the Write Protection feature is enabled and operates as shown in Table 4-1.
Table 4-1.
Write Protect
WP Pin Status
Part of the Array Protected
Full Array
At VCC
At GND
Normal Read/Write Operations
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
3
5.
Memory Organization
AT24C16C, 16K Serial EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires a
11-bit data word address for random word addressing.
5.1
Pin Capacitance
Table 5-1.
Applicable over recommended operating range from TA = 25°C, f = 1.0MHz, VCC = 5.5V.
Pin Capacitance(1)
Symbol
CI/O
Test Condition
Max
8
Units
pF
Conditions
VI/O = 0V
VIN = 0V
Input/Output capacitance (SDA)
Input capacitance (A0, A1, A2, SCL)
CIN
6
pF
Note:
1. This parameter is characterized and is not 100% tested.
5.2
DC Characteristics
Table 5-2.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = 1.7V to 5.5V (unless otherwise noted).
Symbol
VCC1
ICC
Parameter
Test Condition
Min
Typ
Max
5.5
Units
V
Supply Voltage
1.7
Supply Current VCC = 5.0V
Supply Current VCC = 5.0V
Standby Current VCC = 1.7V
Standby Current VCC = 5.5V
Input Leakage Current
Output Leakage Current
Input Low Level(1)
Read at 100kHz
Write at 100kHz
VIN = VCC or VSS
VIN = VCC or VSS
VIN = VCC or VSS
VOUT = VCC or VSS
0.4
2.0
1.0
mA
mA
μA
μA
μA
μA
V
ICC
3.0
ISB1
ISB2
ILI
1.0
6.0
0.10
0.05
3.0
ILO
3.0
VIL
–0.6
VCC x 0.3
VCC + 0.5
0.4
VIH
Input High Level(1)
VCC x 0.7
V
VOL2
VOL1
Output Low Level VCC = 3.0V
Output Low Level VCC = 1.7V
IOL = 2.1mA
V
IOL = 0.15mA
0.2
V
Note:
1. VIL min and VIH max are reference only and are not tested.
4
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
5.3
AC Characteristics
Table 5-3.
AC Characteristics
Applicable over recommended operating range from TAI = -40C to 85C, VCC = +1.7V to 5.5V, CL = 1TTL Gate and 100pF
(unless otherwise noted).
1.7V
2.5V, 2.7V, 5.0V
Symbol
fSCL
Parameter
Min
Max
Min
Max
Units
kHz
μs
Clock Frequency, SCL
Clock Pulse Width Low
Clock Pulse Width High
Noise Suppression Time
Clock Low to Data Out Valid
400
1000
tLOW
tHIGH
tI
1.2
0.6
0.4
0.4
μs
100
0.9
50
ns
tAA
0.1
1.2
0.05
0.5
0.55
μs
Time the bus must be free before a new
transmission can start.
tBUF
μs
tHD.STA
tSU.STA
tHD.DAT
tSU.DAT
tR
Start Condition Hold Time
Start Condition Setup Time
Data In Hold Time
0.6
0.6
0
0.25
0.25
0
μs
μs
μs
Data In Setup Time
100
100
ns
Inputs Rise Time(1)
0.3
0.3
μs
tF
Inputs Fall Time(1)
300
100
ns
tSU.STO
tDH
Stop Condition Setup Time
Data Out Hold Time
Write Cycle Time
0.6
50
.25
50
μs
ns
tWR
5
5
ms
Endurance(1)
3.3V, 25C, Page Mode
1,000,000
Write Cycles
Note:
1. This parameter is ensured by characterization only.
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
5
6.
Device Operation
Clock and Data Transitions: The SDA pin is normally pulled high with an external device. Data on the SDA pin
may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or
Stop Condition as defined below.
Figure 6-1.
Data Validity
SDA
SCL
Data Stable
Data Stable
Data
Change
Start Condition: A high-to-low transition of SDA with SCL high is a Start Condition which must precede any
other command.
Stop Condition: A low-to-high transition of SDA with SCL high is a Stop Condition. After a read sequence, the
Stop Condition command will place the EEPROM in a standby power mode.
Figure 6-2.
Start Condition and Stop Condition Definition
SDA
SCL
Start
Condition
Stop
Condition
6
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Acknowledge: All addresses and data words are serially transmitted to and from the EEPROM in eight bit
words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the
ninth clock cycle.
Figure 6-3.
Output Acknowledge
1
8
9
SCL
DATA IN
DATA OUT
Start
Condition
Acknowledge
Standby Mode: The AT24C16C features a low-power standby mode which is enabled:
Upon power-up.
After the receipt of the Stop Condition and the completion of any internal operations.
2-wire Software Reset: After an interruption in protocol, power loss or system reset, any 2-wire part can be
reset by following these steps:
1. Create a Start Condition (if possible).
2. Clock nine cycles.
3. Create another Start Condition followed by Stop Condition as shown below.
The device should be ready for the next communication after above steps have been completed. In the event
that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset
the device.
Figure 6-4.
Software Reset
Dummy Clock Cycles
3
SCL
1
2
8
9
Start
Condition
Stop
Start
Condition
Condition
SDA
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
7
Figure 6-5.
Bus Timing
SCL: Serial Clock, SDA: Serial Data I/O
tHIGH
tF
tR
tLOW
tLOW
SCL
tSU.STA
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Figure 6-6.
Write Cycle Timing
SCL: Serial Clock, SDA: Serial Data I/O
SCL
ACK
SDA
8th bit
WORDn
(1)
t
WR
Start
Stop
Condition
Condition
Note:
1. The write cycle time tWR is the time from a valid Stop Condition of a Write sequence to the end of the internal
clear/write cycle.
8
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
7.
Device Addressing
Standard EEPROM Access: The 16K EEPROM device requires an 8-bit device address word following a Start
Condition to enable the chip for a Read or Write operation. The device address word consists of a mandatory
“1010” (Ah) sequence for the first four Most Significant Bits (MSB) as shown in Figure 10. on page 12. This is
common to all the EEPROM devices.
The next three bits used for memory page addressing are the most significant bits of the data word address
which follows.
The eighth bit of the device address is the Read/Write operation select bit. A Read operation is initiated if this bit
is high and a Write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will
return to a standby state.
Figure 7-1.
Device Address
Density
Access Area
Bit 7
1
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
R/W
LSB
16K
EEPROM
0
1
0
P2
P1
P0
MSB
8.
Write Operations
Byte Write: A Write operation requires an 8-bit data word address following the device address word and
acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in
the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the
addressing device, such as a microcontroller, must terminate the Write sequence with a Stop Condition. At this
time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled
during this write cycle and the EEPROM will not respond until the Write is complete.
Figure 8-1.
Byte Write
S
T
A
R
T
W
R
I
S
T
Device
Address
T
E
O
P
Word Address
Data
SDA Line
M
S
B
R A
A
C
K
A
C
K
/
C
W K
Page Write: The 16K EEPROM devices are capable of a 16-byte Page Write.
A Page Write is initiated in the same way as a Byte Write, but the microcontroller does not send a Stop
Condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first
data word, the microcontroller can transmit up to fifteen more data words. The EEPROM will respond with a
zero after each data word received. The microcontroller must terminate the Page Write sequence with a Stop
Condition (see Figure 8-2).
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
9
The data word address lower four bits are internally incremented following the receipt of each data word. The
higher data word address bits are not incremented, retaining the memory page row location. When the word
address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the
same page. If more than eight data words are transmitted to the EEPROM, the data word address will roll-over
and previous data will be overwritten.
Figure 8-2.
Page Write
S
T
A
R
T
W
R
I
S
T
Device
Address
Word
Address (n)
T
E
O
P
Data (n)
Data (n + 1)
Data (n + x)
SDA Line
M
R A
A
C
K
A
C
K
A
C
K
A
C
K
S
B
/ C
W K
Acknowledge Polling: Once the internally timed write cycle has started and the EEPROM inputs are disabled,
Acknowledge Polling can be initiated. This involves sending a Start Condition followed by the device address
word. The Read/Write bit is representative of the operation desired. Only if the internal write cycle has
completed will the EEPROM respond with a zero allowing the Read or Write sequence to continue.
9.
Read Operations
Read operations are initiated in the same way as Write operations with the exception that the Read/Write select
bit in the device address word is set to one. There are three read operations:
Current Address Read
Random Address Read
Sequential Read.
Current Address Read: The internal data word address counter maintains the last address accessed during
the last Read or Write operation, incremented by one. This address stays valid between operations as long as
the chip power is maintained. The address roll-over during Read is from the last byte of the last memory page to
the first byte of the first page. The address roll-over during Write is from the last byte of the current page to the
first byte of the same page.
Once the device address with the Read/Write select bit set to one is clocked in and acknowledged by the
EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an
input zero but does generate a following Stop Condition (see Figure 9-1).
Figure 9-1.
Current Address Read
S
T
A
R
T
R
E
S
T
Device
Address
A
D
O
P
Data
SDA Line
M
S
B
R A
N
O
/
C
W K
A
C
K
10
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
Random Read: A Random Read requires a Dummy Byte Write sequence to load in the data word address.
Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the
microcontroller must generate another Start Condition. The microcontroller now initiates a Current Address
Read by sending a device address with the Read/Write select bit high. The EEPROM acknowledges the device
address and serially clocks out the data word. The microcontroller does not respond with a zero but does
generate a following Stop Condition.
Figure 9-2.
Random Read
S
T
A
R
T
W
R
I
S
T
A
R
T
R
E
A
D
S
T
Device
Address
Word
Address (n)
Device
Address
T
E
O
P
Data (n)
SDA Line
M
S
B
R A
A
C
K
A
C
K
N
O
/
C
W K
A
C
K
Dummy Write
Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address
Read. After the microcontroller receives a data word, it responds with an Acknowledge. As long as the
EEPROM receives an Acknowledge, it will continue to increment the data word address and serially clock out
sequential data words. When the memory address limit is reached, the data word address will roll-over and the
Sequential Read will continue. The Sequential Read operation is terminated when the microcontroller does not
respond with a zero but does generate a following Stop Condition.
Figure 9-3.
Sequential Read
R
E
S
T
Device
Address
A
D
O
P
Data (n)
Data (n + 1)
Data (n + 2)
Data (n + x)
SDA Line
R A
/ C
N
O
A
C
K
A
C
K
A
C
K
W K
A
C
K
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
11
10. Ordering Code Detail
A T 2 4 C 1 6 C - S S H M - B
Atmel Designator
Product Family
Shipping Carrier Option
B
T
E
= Bulk (Tubes)
= Tape and Reel, Standard Quantity Option
= Tape and Reel, Expanded Quantity Option
24C = Standard
Serial EEPROM
Operating Voltage
M
= 1.7V to 5.5V
Device Density
Package Device Grade or
Wafer/Die Thickness
16 = 16K
H
= Green, NiPdAu Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
Device Revision
U
= Green, Matte Sn Lead Finish,
Industrial Temperature Range
(-40˚C to +85˚C)
11
= 11mil Wafer Thickness
Package Option
P
= PDIP
SS
X
= JEDEC SOIC
= TSSOP
MA = UDFN
ME = XDFN
ST
C
= SOT23
= VFBGA
WWU = Wafer Unsawn
12
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
11. Product Markings
AT24C16C: Package Marking Information
8-lead TSSOP
8-lead SOIC
8-pad UDFN
8-lead PDIP
2.0 x 3.0 mm Body
ATHYWW
###% @
###
ATMLUYWW
###%
AAAAAAAA
ATMLHYWW
###%
AAAAAAAA
@
H%@
YXX
@
AAAAAAA
8-pad XDFN
8-ball VFBGA
5-lead SOT-23
1.8 x 2.2 mm Body
1.5 x 2.0 mm Body
###
YXX
###U
YMXX
##@%U
YMXX
PIN 1
Note 1:
designates pin 1
Note 2: Package drawings are not to scale
Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (@) mark on the top line.
Catalog Number Truncation
AT24C16C
Truncation Code ###: 16C / ##: AC
Date Codes
Voltages
Y = Year
6: 2016
7: 2017
8: 2018
9: 2019
M = Month
A: January
B: February
...
WW = Work Week of Assembly
% = Minimum Voltage
M: 1.7V min
0: 2020
1: 2021
2: 2022
3: 2023
02: Week 2
04: Week 4
...
L: December
52: Week 52
Country of Assembly
Lot Number
AAA...A = Atmel Wafer Lot Number
Grade/Lead Finish Material
@ = Country of Assembly
H: Industrial/NiPdAu
U: Industrial/Matte Tin/SnAgCu
Trace Code
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
12/6/16
TITLE
DRAWING NO.
REV.
24C16CSM, AT24C16C Package Marking Information
Package Mark Contact:
24C16CSM
E
DL-CSO-Assy_eng@atmel.com
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13
12. Ordering Information
Delivery Information
Operation
Range
Atmel Ordering Code
Lead Finish
Package
Form
Quantity
AT24C16C-SSHM-B
Bulk (Tubes)
Tape and Reel
Bulk (Tubes)
100 per Tube
8S1
AT24C16C-SSHM-T
AT24C16C-XHM-B
AT24C16C-XHM-T
AT24C16C-MAHM-T
AT24C16C-MAHM-E
AT24C16C-PUM
4,000 per Reel
100 per Tube
5,000 per Reel
5,000 per Reel
NiPdAu
(Lead-free/Halogen-free)
8X
Tape and Reel
Tape and Reel
8MA2
Industrial
Temperature
(-40C to 85C)
Tape and Reel 15,000 per Reel
8P3
5TS1
Bulk (Tubes)
Tape and Reel
Tape and Reel
Tape and Reel
50 per Tube
5,000 per Reel
5,000 per Reel
5,000 per Reel
Matte Sn
(Lead-free/Halogen-free)
AT24C16C-STUM-T
AT24C16C-CUM-T
AT24C16C-MEHM-T
AT24C16C-WWU11M(1)
SnAgCu
(Lead-free/Halogen-free)
8U3-1
N/A
N/A
8ME1
Wafer Sale
Note 1
Note:
1. For Wafer sales, please contact Atmel Sales.
Package Type
8-lead, 0.300" wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8P3
8S1
8X
8MA2
8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN)
8-lead, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN)
5-lead, 2.90mm x 1.60mm body, Plastic Thin Shrink Small Outline (SOT23)
8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA)
8ME1
5TS1
8U3-1
14
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13. Packaging Information
13.1 8P3 — 8-lead PDIP
E
1
E1
.381
Gage Plane
N
Top View
c
eA
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
D
e
MIN
MAX
5.334
-
NOM
-
NOTE
SYMBOL
D1
A2 A
A
-
2
A1
A2
b
0.381
2.921
0.356
1.143
0.762
0.203
9.017
0.127
7.620
6.096
-
3.302
0.457
1.524
0.991
0.254
9.271
0.000
7.874
6.350
2.540 BSC
7.620 BSC
3.302
4.953
0.559
1.778
1.143
0.356
10.160
0.000
8.255
7.112
5
6
6
b2
b3
c
A1
b2
D
3
3
4
3
L
b3
D1
E
m
b
4 PLCS
0.254
C
v
E1
e
Side View
eA
L
4
2
2.921
3.810
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
07/31/14
TITLE
GPC
PTC
DRAWING NO.
8P3
REV.
E
8P3, 8-lead, 0.300” Wide Body, Plastic Dual
In-line Package (PDIP)
Package Drawing Contact:
packagedrawings@atmel.com
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
15
13.2 8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
–
–
NOTE
SYMBOL
A1
A
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.05
3.99
6.20
C
D
E1
E
e
–
–
D
–
–
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
1.27 BSC
L
0.40
0°
–
–
1.27
8°
Ø
6/22/11
DRAWING NO. REV.
8S1
TITLE
GPC
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
G
Package Drawing Contact:
packagedrawings@atmel.com
16
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.3 8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
A
b
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
e
A2
D
SYMBOL
MIN
-
NOM
-
MAX
1.20
0.15
1.05
3.10
NOTE
2, 5
A
Side View
A1
A2
D
0.05
0.80
2.90
-
Notes: 1. This drawing is for general information only.
1.00
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
3.00
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
E
6.40 BSC
4.40
E1
b
4.30
0.19
4.50
0.30
3, 5
4
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
0.25
e
0.65 BSC
0.60
L
0.45
0.09
0.75
0.20
L1
C
1.00 REF
-
2/27/14
TITLE
GPC
TNR
DRAWING NO.
REV.
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
8X
E
Package Drawing Contact:
packagedrawings@atmel.com
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
17
13.4 8MA2 — 8-pad UDFN
E
1
8
7
6
5
Pin 1 ID
2
3
4
D
C
TOP VIEW
E2
SIDE VIEW
A2
A
A1
b (8x)
8
1
2
3
4
COMMON DIMENSIONS
(Unit of Measure = mm)
7
6
5
Pin#1 ID
D2
MIN
0.50
MAX
0.60
NOM
0.55
NOTE
SYMBOL
A
A1
A2
D
0.0
-
0.02
-
0.05
0.55
2.10
1.60
3.10
1.40
0.30
e (6x)
L (8x)
BOTTOM VIEW
K
1.90
1.40
2.90
1.20
0.18
2.00
D2
E
1.50
3.00
Notes:
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
E2
b
1.30
0.25
3
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
C
1.52 REF
0.35
L
0.30
0.20
0.40
-
e
0.50 BSC
-
K
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
11/26/14
TITLE
DRAWING NO.
REV.
GPC
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
YNZ
8MA2
G
Package Drawing Contact:
packagedrawings@atmel.com
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
18
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.5 8ME1 — 8-pad XDFN
D
7
5
4
6
3
8
E
PIN #1 ID
2
1
A1
Top View
A
Side View
e1
b
L
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
–
NOM
–
MAX
0.40
0.05
1.90
2.30
0.25
NOTE
A
A1
D
E
0.10
PIN #1 ID
0.00
1.70
2.10
0.15
–
1.80
0.15
2.20
b
0.20
b
e
0.40 TYP
1.20 REF
0.30
e
e1
L
0.35
0.26
End View
9/10/2012
TITLE
DRAWING NO.
REV.
GPC
8ME1, 8-pad (1.80mm x 2.20mm body)
Extra Thin DFN (XDFN)
8ME1
B
DTP
Package Drawing Contact:
packagedrawings@atmel.com
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
19
13.6 5TS1 — 5-lead SOT23
e1
C
4
5
E1
C
L
E
L1
3
1
2
TOP VIEW
END VIEW
b
A2
A
SEATING
PLANE
A1
e
D
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
MIN
MAX
NOM
NOTE
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
SYMBOL
A
A1
A2
c
D
E
E1
L1
e
e1
b
-
-
-
1.00
0.10
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
0.00
0.70 0.90 1.00
0.08
-
0.20
3
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
-
1,2
1,2
1,2
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
0.30
0.50
3,4
5/31/12
REV.
TITLE
GPC
TSZ
DRAWING NO.
5TS1
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
D
Package Drawing Contact:
packagedrawings@atmel.com
20
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
13.7 8U3-1 — 8-ball VFBGA
E
D
2.
b
PIN 1 BALL PAD CORNER
A1
A2
A
TOP VIEW
SIDE VIEW
PIN 1 BALL PAD CORNER
4
3
1
2
d
(d1)
6
5
8
7
COMMON DIMENSIONS
(Unit of Measure - mm)
e
(e1)
SYMBOL
NOM
MIN
MAX
NOTE
2
0.73
0.09
0.40
0.20
0.79
0.85
0.19
0.50
0.30
A
A1
A2
b
BOTTOM VIEW
8 SOLDER BALLS
0.14
0.45
Notes:
0.25
1. This drawing is for general information only.
1.50 BSC
2.0 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
D
E
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
e
e1
d
d1
6/11/13
REV.
TITLE
DRAWING NO.
8U3-1
GPC
GXU
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
F
Package Drawing Contact:
packagedrawings@atmel.com
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
21
14. Revision History
Doc. Rev.
Date
Comments
Part marking SOT23:
8719D
12/2016
- Moved backside mark (YMXX) to front side line2.
- Added @ = Country of Assembly.
Add the UDFN Expanded Quantity Option.
8719C
01/2015
Update the 8X, 8MA2, 8P3, and 8U3-1 package outline drawings, the ordering information
section, and the disclaimer page.
Minor grammatical corrections.
Update Atmel logos and template.
8719B
8719A
07/2013
09/2010
Initial document release.
22
AT24C16C [DATASHEET]
Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016
X X
X X X X
Atmel Corporation
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T: (+1)(408) 441.0311
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© 2015 Atmel Corporation. / Rev.: Atmel-8719D-SEEPROM-AT24C16C-Datasheet_122016.
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