AT25320B-SSHL-T [MICROCHIP]
IC EEPROM 32KBIT 20MHZ 8SOIC;
| 型号： | AT25320B-SSHL-T |
| 厂家： | 
MICROCHIP |
| 描述： | IC EEPROM 32KBIT 20MHZ 8SOIC 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 时钟 光电二极管 内存集成电路 |
| 文件： | 总23页 (文件大小：825K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AT25320B and AT25640B
SPI Serial EEPROM
32Kb (4096 x 8) and 64Kb (8192 x 8)
DATASHEET
Features
Serial Peripheral Interface (SPI) Compatible
Supports SPI Modes 0 (0,0) and 3 (1,1)
̶
Datasheet Describes Mode 0 Operation
Low-voltage and standard-voltage Operation
1.8V (VCC = 1.8V to 5.5V)
̶
20MHz Clock Rate (5V)
32-byte Page Mode
Block Write Protection
̶
Protect 1/4, 1/2, or Entire Array
Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and
Software Data Protection
Self-timed Write Cycle (5ms Max)
High Reliability
̶
̶
Endurance: 1,000,000 Write Cycles
Data Retention: 100 Years
Green (Pb/Halide-free/RoHS Compliant) Packaging Options
Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers
Description
The Atmel® AT25320B/640B provides 32,768-/65,536-bits of Serial
Electrically-Erasable Programmable Read-Only Memory (EEPROM) organized as
4,096/8,192 words of 8 bits each. The device is optimized for use in many
industrial and commercial applications where low-power and low-voltage
operation are essential. The AT25320B/640B is available in space-saving 8-lead
JEDEC SOIC, 8-lead TSSOP, 8-lead UDFN, 8-lead XDFN, and 8-ball VFBGA
packages.
The AT25320B/640B is enabled through the Chip Select pin (CS) and accessed
via a 3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO),
and Serial Clock (SCK). All programming cycles are completely self-timed, and no
separate erase cycle is required before Write.
Block Write Protection is enabled by programming the status register with one of
four blocks of write protection. Separate Program Enable and Program Disable
instructions are provided for additional data protection. Hardware data protection
is provided via the WP pin to protect against inadvertent write attempts to the
status register. The HOLD pin may be used to suspend any serial communication
without resetting the serial sequence.
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
1.
Pin Configurations and Pinouts
Table 1-1.
Pin Configurations
8-lead SOIC
8-lead TSSOP
Pin Name
CS
Function
CS
SO
VCC
HOLD
SCK
SI
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
CS
SO
VCC
HOLD
SCK
SI
Chip Select
WP
WP
GND
SCK
SI
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
GND
Top View
Top View
SO
8-pad UDFN
8-pad XDFN
GND
VCC
VCC
HOLD
SCK
SI
8
1
2
3
4
CS
SO
WP
GND
VCC
HOLD
SCK
SI
8
1
CS
SO
WP
GND
Power Supply
Write Protect
7
6
5
7
6
5
2
3
4
WP
HOLD
Suspends Serial Input
Bottom View
Bottom View
8-ball VFBGA
8
7
6
5
1
2
3
4
CS
VCC
SO
HOLD
SCK
SI
WP
GND
Bottom View
Note:
Drawings are not to scale.
2.
Absolute Maximum Ratings*
*Notice: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent
damage to the device. This is a stress rating
only and functional operation of the device at
these or any other conditions beyond those
indicated in the operational sections of this
specification is not implied. Exposure to
Operating Temperature . . . . . . . . . . . . . . . -55C to +125C
Storage Temperature . . . . . . . . . . . . . . . . . -65C to +150C
Voltage on Any Pin
with Respect to Ground . . . . . . . . . . . . . . . . .-1.0V to +7.0V
Maximum Operating Voltage . . . . . . . . . . . . . . . . . . . 6.25V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.0mA
absolute maximum rating conditions for
extended periods may affect device reliability.
2
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
3.
Block Diagram
Figure 3-1.
Block Diagram
VCC
GND
Status
Register
Memory Array
4,096/8,192 x 8
Address
Decoder
Data
Register
Output
Buffer
SI
Mode
Decode
Logic
CS
WP
Clock
Generator
SO
SCK
HOLD
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
3
4.
Electrical Characteristics
4.1
Pin Capacitance
Table 4-1.
Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 5.0V (unless otherwise noted).
Pin Capacitance(1)
Symbol
COUT
CIN
Test Conditions
Max
8
Units
pF
Conditions
VOUT = 0V
VIN = 0V
Output Capacitance (SO)
Input Capacitance (CS, SCK, SI, WP, HOLD)
6
pF
Note:
1. This parameter is characterized and is not 100% tested.
4.2
DC Characteristics
Table 4-2.
DC Characteristics
Applicable over recommended operating range from: TAI = -40C to +85C, VCC = 1.8V to 5.5V (unless otherwise noted).
Symbol Parameter
Test Condition
Min
1.8
2.5
4.5
Typ
Max
5.5
Units
V
VCC1
VCC2
VCC3
ICC1
ICC2
ICC3
ISB1
ISB2
ISB3
IIL
Supply Voltage
Supply Voltage
5.5
V
Supply Voltage
5.5
V
Supply Current
VCC = 5.0V at 20MHz, SO = Open, Read
VCC = 5.0V at 20MHz, SO = Open, Read, Write
VCC = 5.0V at 5MHz, SO = Open, Read, Write
VCC = 1.8V, CS = VCC
7.5
4.0
10.0
mA
mA
mA
μA
μA
μA
μA
μA
V
Supply Current
10.0
Supply Current
4.0
6.0
Standby Current
Standby Current
Standby Current
Input Leakage
< 0.1
0.3
6.0(2)
7.0(2)
10.0(2)
3.0
VCC = 2.5V, CS = VCC
VCC = 5.0V, CS = VCC
2.0
VIN = 0V to VCC
-3.0
-3.0
IOL
Output Leakage
Input Low-voltage
Input High-voltage
Output Low-voltage
Output High-voltage
Output Low-voltage
Output High-voltage
VIN = 0V to VCC, TAC = 0°C to 70°C
3.0
(1)
VIL
-0.6
VCC x 0.3
VCC + 0.5
0.4
(1)
VIH
VCC x 0.7
V
VOL1
VOH1
VOL2
VOH2
IOL = 3.0mA
3.6V VCC 5.5V
V
IOH = -1.6mA
VCC - 0.8
VCC - 0.2
V
IOL = 0.15mA
1.8V VCC 3.6V
0.2
V
IOH = 100μA
V
Notes: 1. VIL min and VIH max are reference only and are not tested.
2. Worst case measured at 85°C.
4
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
4.3
AC Characteristics
Table 4-3.
AC Characteristics
Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30pF
(unless otherwise noted).
Symbol
Parameter
Voltage
Min
Max
Units
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
0
0
0
20
10
5
fSCK
SCK Clock Frequency
MHz
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
2
2
2
tRI
Input Rise Time
Input Fall Time
μs
μs
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
2
2
2
tFI
20
40
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
tWH
SCK High Time
SCK Low Time
ns
ns
80
20
40
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
tWL
80
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
25
50
100
tCS
tCSS
tCSH
tSU
tH
CS High Time
ns
ns
ns
ns
ns
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
25
50
100
CS Setup Time
CS Hold Time
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
25
50
100
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
5
10
20
Data In Setup Time
Data In Hold Time
HOLD Setup Time
HOLD Hold Time
Output Valid
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
5
10
20
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
5
10
20
tHD
tCD
tV
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
5
10
20
ns
ns
ns
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
0
0
0
20
40
80
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
0
0
0
tHO
Output Hold Time
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
5
Table 4-3.
AC Characteristics (Continued)
Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30pF
(unless otherwise noted).
Symbol
Parameter
Voltage
Min
Max
Units
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
0
0
0
25
50
100
tLZ
HOLD to Output Low Z
ns
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
40
80
200
tHZ
HOLD to Output High Z
Output Disable Time
Write Cycle Time
ns
ns
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
40
80
200
tDIS
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
5
5
5
tWC
ms
4.5 – 5.5
2.5 – 5.5
1.8 – 5.5
Endurance(1)
3.3V, 25°C, Page Mode
1,000,000
Write Cycles
Note:
1. This parameter is characterized and is not 100% tested.
5.
Serial Interface Description
Master: The device that generates the serial clock.
Slave: Because the Serial Clock pin (SCK) is always an input, the AT25320B/640B always operates as a slave.
Transmitter/receiver: The AT25320B/640B has separate pins designated for data transmission (SO) and
reception (SI).
MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.
Serial Opcode: After the device is selected with CS going low, the first byte will be received. This byte contains
the opcode that defines the operations to be performed.
Invalid Opcode: If an invalid opcode is received, no data will be shifted into the AT25320B/640B, and the Serial
Output pin (SO) will remain in a high-impedance state until the falling edge of CS is detected again. This will
reinitialize the serial communication.
Chip Select: The AT25320B/640B is selected when the CS pin is low. When the device is not selected, data will
not be accepted via the SI pin, and the Serial Output pin (SO) will remain in a high-impedance state.
Hold: The HOLD pin is used in conjunction with the CS pin to pause the AT25320B/640B. When the device is
selected and a serial sequence is underway, HOLD can be used to pause the serial communication with the
master device without resetting the serial sequence. To pause, the HOLD pin must be brought low while the SCK
pin is low. To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK may still
toggle during HOLD). Inputs to the SI pin will be ignored while the SO pin is in the high-impedance state.
Write Protect: The Write Protect pin (WP) will allow normal read/write operations when held high. When the
WP pin is brought low and WPEN bit is one, all write operations to the status register are inhibited. WP going
low while CS is still low will interrupt a Write to the status register. If the internal write cycle has already been
initiated, WP going low will have no effect on any write operation to the status register. The WP pin function is
blocked when the WPEN bit in the status register is zero. This will allow the user to install the AT25320B/640B
in a system with the WP pin tied to ground and still be able to write to the status register. All WP pin functions
are enabled when the WPEN bit is set to one.
6
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
Figure 5-1.
SPI Serial Interface
Master:
Slave:
Microcontroller
Data Out (MOSI)
Data In (MISO)
Serial Clock (SPI CK)
SS0
AT25320B/640B
SI
SO
SCK
CS
SS1
SI
SS2
SO
SCK
CS
SS3
SI
SO
SCK
CS
SI
SO
SCK
CS
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
7
6.
Functional Description
The AT25320B/640B is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of
the 6805 and 68HC11 series of microcontrollers.
The AT25320B/640B utilizes an 8-bit instruction register. The list of instructions and their operation codes are
contained in Table 6-1. All instructions, addresses, and data are transferred with the MSB first and start with a
high-to-low CS transition.
Table 6-1.
Instruction Set
Instruction Name
Instruction Format
0000 X110
Operation
WREN
WRDI
Set Write Enable Latch
Reset Write Enable Latch
Read Status Register
Write Status Register
Read Data from Memory Array
Write Data to Memory Array
0000 X100
RDSR
WRSR
READ
WRITE
0000 X101
0000 X001
0000 X011
0000 X010
Write Enable (WREN): The device will power-up in the write disable state when VCC is applied. All
programming instructions must therefore be preceded by a Write Enable instruction.
Write Disable (WRDI): To protect the device against inadvertent writes, the Write Disable instruction disables
all programming modes. The WRDI instruction is independent of the status of the WP pin.
Read Status Register (RDSR): The Read Status Register instruction provides access to the status register.
The Ready/Busy and Write Enable status of the device can be determined by the RDSR instruction. Similarly,
the Block Write Protection Bits indicate the extent of protection employed. These bits are set by using the
WRSR instruction.
Table 6-2.
Status Register Format
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WPEN
X
X
X
BP1
BP0
WEN
RDY
Table 6-3.
Read Status Register Bit Definition
Definition
Bit
Bit 0 (RDY)
Bit 1 (WEN)
Bit 2 (BP0)
Bit 3 (BP1)
Bit 0 = 0 (RDY) indicates the device is READY. Bit 0 = 1 indicates the write cycle is in progress.
Bit 1= 0 indicates the device is not WRITE ENABLED. Bit 1 = 1 indicates the device is write enabled.
See Table 6-4 on page 9.
See Table 6-4 on page 9.
Bits 4 – 6 are zeros when device is not in an internal write cycle.
Bit 7 (WPEN) See Table 6-5 on page 9.
Bits 0 – 7 are ones during an internal write cycle.
8
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
Write Status Register (WRSR): The WRSR instruction allows the user to select one of four levels of protection.
The AT25320B/640B is divided into four array segments. One-quarter, one-half, or all of the memory segments
can be protected. Any of the data within any selected segment will therefore be read-only. The Block Write
Protection levels and corresponding status register control bits are shown in Table 6-4.
The three bits BP0, BP1, and WPEN are nonvolatile cells that have the same properties and functions as the
regular memory cells (e.g., WREN, tWC, RDSR).
Table 6-4.
Block Write Protect Bits
Status Register Bits
Array Addresses Protected
Level
BP1
BP0
AT25320B
AT25640B
None
0
0
0
1
1
0
1
0
1
None
1(1/4)
2(1/2)
3(All)
0C000FFF
08000FFF
00000FFF
18001FFF
10001FFF
00001FFF
The WRSR instruction also allows the user to enable or disable the Write Protect (WP) pin through the use of
the Write Protect Enable (WPEN) bit. Hardware Write Protection is enabled when the WP pin is low and the
WPEN bit is one. Hardware Write Protection is disabled when either the WP pin is high or the WPEN bit is zero.
When the device is hardware write protected, writes to the status register, including the Block Protect bits and
the WPEN bit, and the block-protected sections in the memory array are disabled. Writes are only allowed to
sections of the memory that are not block-protected.
Note: When the WPEN bit is Hardware Write Protected, it cannot be changed back to zero as long as the WP
pin is held low.
Table 6-5.
WPEN Operation
Protected
Blocks
Unprotected
Blocks
Status
Register
WPEN
WP
X
WEN
0
0
1
1
X
X
0
1
0
1
0
1
Protected
Protected
Protected
Protected
Protected
Protected
Protected
Writeable
Protected
Writeable
Protected
Writeable
Protected
Writeable
Protected
Protected
Protected
Writeable
X
Low
Low
High
High
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
9
Read Sequence (READ): Reading the AT25320B/640B via the Serial Output (SO) pin requires the following
sequence. After the CS line is pulled low to select a device, the Read opcode is transmitted via the SI line
followed by the byte address to be read (A15 – A0, see Table 6-6). Upon completion, any data on the SI line will
be ignored. The data (D7 – D0) at the specified address is then shifted out onto the SO line. If only one byte is to
be read, the CS line should be driven high after the data comes out. The read sequence can be continued since
the byte address is automatically incremented and data will continue to be shifted out. When the highest
address is reached, the address counter will roll over to the lowest address allowing the entire memory to be
read in one continuous read cycle.
Write Sequence (WRITE): In order to program the AT25320B/640B, two separate instructions must be
executed. First, the device must be write enabled via the WREN instruction. Then a Write instruction may be
executed. Also, the address of the memory location(s) to be programmed must be outside the protected
address field location selected by the Block Write Protection level. During an internal write cycle, all commands
will be ignored except the RDSR instruction.
A Write instruction requires the following sequence. After the CS line is pulled low to select the device, the Write
opcode is transmitted via the SI line followed by the byte address (A15 – A0) and the data (D7 – D0) to be
programmed (see Table 6-6). Programming will start after the CS pin is brought high. The low-to-high transition
of the CS pin must occur during the SCK low-time immediately after clocking in the D0 (LSB) data bit.
The Ready/Busy status of the device can be determined by initiating a Read Status Register (RDSR)
instruction. If Bit 0 = 1, the write cycle is still in progress. If Bit 0 = 0, the write cycle has ended. Only the RDSR
instruction is enabled during the write programming cycle.
The AT25320B/640B is capable of a 32-byte page write operation. After each byte of data is received, the five
low-order address bits are internally incremented by one; the high-order bits of the address will remain constant.
If more than 32-bytes of data are transmitted, the address counter will rollover and the previously written data
will be overwritten. The AT25320B/640B is automatically returned to the write disable state at the completion of
a write cycle.
Note: If the device is not Write-enabled (WREN), the device will ignore the write instruction and will return to
the standby state, when CS is brought high. A new CS falling edge is required to reinitiate the serial
communication.
Table 6-6.
Address Key
Address
AN
AT25320B
A11–A0
AT25640B
A12–A0
Don’t Care Bits
A15–A12
A15–A13
10
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
7.
Timing Diagrams
Figure 7-1.
Synchronous Data Timing (for Mode 0)
tCS
VIH
VIL
CS
tCSS
tCSH
VIH
VIL
tWH
tWL
SCK
SI
tSU
tH
VIH
VIL
Valid In
tHO
tDIS
tV
VOH
VOL
HI-Z
HI-Z
SO
Figure 7-2.
WREN Timing
CS
SCK
SI
WREN Opcode
HI-Z
SO
Figure 7-3.
WRDI Timing
CS
SCK
SI
WRDI Opcode
HI-Z
SO
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
11
Figure 7-4.
RDSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
SI
Instruction
Data Out
High-impedance
SO
7
6
5
4
3
2
1
0
MSB
Figure 7-5.
WRSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SCK
SI
Data In
Instruction
7
6
5
4
3
2
1
0
High-impedance
SO
Figure 7-6.
Read Timing
CS
0
1
2
3
4
5
6
7
8
9
10 11 20 21 22 23 24 25 26 27 28 29 30 31
SCK
SI
Byte Address
...
Instruction
15 14 13
3
2
1
0
Data Out
High-impedance
SO
7
6
5
4
3
2
1
0
MSB
12
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
Figure 7-7.
Write Timing
CS
0
1
2
3
4
5
6
7
8
9 10 11 20 21 22 23 24 25 26 27 28 29 30 31
SCK
Byte Address
...
Data In
Instruction
15 14 13
3
2
1
0
7
SI
6
5
4
3
2
1
0
High-impedance
SO
Figure 7-8.
HOLD Timing
CS
t
t
CD
CD
SCK
HOLD
SO
t
HD
t
HD
t
HZ
t
LZ
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
13
8.
Ordering Code Detail
A T 2 5 3 2 0 B - S S H L - B
Atmel Designator
Product Family
Shipping Carrier Option
B
T
E
= Bulk (Tubes)
= Tape and Reel, Standard Quantity Option
= Tape and Reel, Expanded Quantity Option
25 = Standard SPI
Serial EPPROM
Operating Voltage
L
= 1.8V to 5.5V
Packaged Device Grade or
Wafer/Die Thickness
Device Density
320 = 32-kilobit
640 = 64-kilobit
H
= Green, NiPdAu Lead Finish
Industrial Temperature Range
(-40°C to +85°C)
U
= Green, Matte Sn Lead Finish
Industrial Temperature Range
(-40°C to +85°C)
Device Revision
11
= 11mil Wafer Thickness
Package Option
SS = JEDEC SOIC
X
= TSSOP
MA = UDFN
ME = XDFN
C
= VFBGA
WWU = Wafer Unsawn
WDT = Die in Tape and Reel
14
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
9.
Part Markings
AT25320B and AT25640B: Package Marking Information
8-lead SOIC
8-lead TSSOP
8-lead UDFN
2.0 x 3.0 mm Body
###
ATHYWW
AAAAAAA
ATMLHYWW
###L
AAAAAAAA
HL@
YXX
###L @
@
8-ball VFBGA
2.35 x 3.73 mm Body
8-lead XDFN
1.8 x 2.2 mm Body
###
YXX
###U
@YMXX
Note 1:
designates pin 1
Note 2: Package drawings are not to scale
Catalog Number Truncation
AT25320B
AT25640B
Truncation Code ###: 5BB
Truncation Code ###: 5CB
Date Codes
Voltages
Y = Year
2: 2012
3: 2013
4: 2014
5: 2015
M = Month
WW = Work Week of Assembly
L: 1.8V min
6: 2016
7: 2017
8: 2018
9: 2019
A: January
B: February
...
02: Week 2
04: Week 4
...
L: December
52: Week 52
Country of Assembly
Lot Number
AAA...A = Atmel Wafer Lot Number
Grade/Lead Finish Material
@ = Country of Assembly
U: Industrial/Matte Tin
H: Industrial/NiPdAu
Trace Code
Atmel Truncation
XX = Trace Code (Atmel Lot Numbers Correspond to Code)
Example: AA, AB.... YZ, ZZ
AT: Atmel
ATM: Atmel
ATML: Atmel
11/5/12
REV.
DRAWING NO.
TITLE
25320-640BSM, AT25320B and AT25640B Package
Marking Information
Package Mark Contact:
DL-CSO-Assy_eng@atmel.com
25320-640BSM
B
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
15
10. Ordering Information
Delivery Information
Operation
Range
Atmel Ordering Code
Lead Finish
Package
Form
Quantity
AT25320B-SSHL-B
Bulk (Tubes)
Tape and Reel
Bulk (Tubes)
100 per Tube
8S1
AT25320B-SSHL-T
AT25320B-XHL-B
AT25320B-XHL-T
AT25320B-MAHL-T
AT25320B-MAHL-E
AT25320B-MEHL-T
4,000 per Reel
100 per Tube
5,000 per Reel
5,000 per Reel
8X
NiPdAu
(Lead-free/Halogen-free)
Tape and Reel
Tape and Reel
Industrial
Temperature
(-40C to 85C)
8MA2
Tape and Reel 15,000 per Reel
8ME1
8U2-1
Tape and Reel
Tape and Reel
5,000 per Reel
5,000 per Reel
SnAgCu
(Lead-free/Halogen-free)
AT25320B-CUL-T
AT25320B-WWU11L(1)
N/A
Wafer Sale
Note 1
AT25640B-SSHL-B
AT25640B-SSHL-T
AT25640B-XHL-B
AT25640B-XHL-T
AT25640B-MAHL-T
AT25640B-MAHL-E
AT25640B-MEHL-T
Bulk (Tubes)
Tape and Reel
Bulk (Tubes)
100 per Tube
4,000 per Reel
100 per Tube
5,000 per Reel
5,000 per Reel
8S1
8X
NiPdAu
(Lead-free/Halogen-free)
Tape and Reel
Tape and Reel
Industrial
Temperature
(-40C to 85C)
8MA2
Tape and Reel 15,000 per Reel
8ME1
8U2-1
Tape and Reel
Tape and Reel
5,000 per Reel
5,000 per Reel
SnAgCu
(Lead-free/Halogen-free)
AT25640B-CUL-T
AT25640B-WWU11L(1)
N/A
Wafer Sale
Note 1
Note:
1. Contact Atmel Sales for Wafer sales
Package Type
8S1
8X
8-lead, 0.15” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP)
8MA2
8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Ultra Thin, Dual No Lead (UDFN)
8-pad, 1.80mm x 2.20mm body, Ultra Lead Frame Land Grid Array (XDFN)
8-ball, 2.35mm x 3.73mm body, 0.75mm pitch (VFBGA)
8ME1
8U2-1
16
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
11. Packaging Information
11.1 8S1 — 8-lead JEDEC SOIC
C
1
E
E1
L
N
Ø
TOP VIEW
END VIEW
e
b
COMMON DIMENSIONS
(Unit of Measure = mm)
A
MIN
1.35
0.10
MAX
1.75
0.25
NOM
–
–
NOTE
SYMBOL
A1
A
A1
b
0.31
0.17
4.80
3.81
5.79
–
0.51
0.25
5.05
3.99
6.20
C
D
E1
E
e
–
–
D
–
–
SIDE VIEW
Notes: This drawing is for general information only.
Refer to JEDEC Drawing MS-012, Variation AA
for proper dimensions, tolerances, datums, etc.
1.27 BSC
L
0.40
0°
–
–
1.27
8°
Ø
6/22/11
DRAWING NO. REV.
8S1
TITLE
GPC
8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
SWB
G
Package Drawing Contact:
packagedrawings@atmel.com
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
17
11.2 8X — 8-lead TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
L
Top View
End View
A
b
A1
COMMON DIMENSIONS
(Unit of Measure = mm)
e
A2
D
SYMBOL
MIN
-
NOM
-
MAX
1.20
0.15
1.05
3.10
NOTE
2, 5
A
Side View
A1
A2
D
0.05
0.80
2.90
-
Notes: 1. This drawing is for general information only.
1.00
Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
3.00
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
E
6.40 BSC
4.40
E1
b
4.30
0.19
4.50
0.30
3, 5
4
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
0.25
e
0.65 BSC
0.60
L
0.45
0.09
0.75
0.20
L1
C
1.00 REF
-
2/27/14
TITLE
GPC
TNR
DRAWING NO.
REV.
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
8X
E
Package Drawing Contact:
packagedrawings@atmel.com
18
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
11.3 8MA2 — 8-pad UDFN
E
1
8
7
6
5
Pin 1 ID
2
3
4
D
C
TOP VIEW
E2
SIDE VIEW
A2
A
A1
b (8x)
8
1
2
3
4
COMMON DIMENSIONS
(Unit of Measure = mm)
7
6
5
Pin#1 ID
D2
MIN
0.50
MAX
0.60
NOM
0.55
NOTE
SYMBOL
A
A1
A2
D
0.0
-
0.02
-
0.05
0.55
2.10
1.60
3.10
1.40
0.30
e (6x)
L (8x)
BOTTOM VIEW
K
1.90
1.40
2.90
1.20
0.18
2.00
D2
E
1.50
3.00
Notes:
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
E2
b
1.30
0.25
3
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
C
1.52 REF
0.35
L
0.30
0.20
0.40
-
e
0.50 BSC
-
K
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
11/26/14
TITLE
DRAWING NO.
REV.
GPC
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
YNZ
8MA2
G
Package Drawing Contact:
packagedrawings@atmel.com
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
19
11.4 8ME1 — 8-pad XDFN
D
7
5
4
6
3
8
E
PIN #1 ID
2
1
A1
Top View
A
Side View
e1
b
L
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
–
NOM
–
MAX
0.40
0.05
1.90
2.30
0.25
NOTE
A
A1
D
E
0.10
PIN #1 ID
0.00
1.70
2.10
0.15
–
1.80
0.15
2.20
b
0.20
b
e
0.40 TYP
1.20 REF
0.30
e
e1
L
0.35
0.26
End View
9/10/2012
TITLE
DRAWING NO.
REV.
GPC
8ME1, 8-pad (1.80mm x 2.20mm body)
Extra Thin DFN (XDFN)
8ME1
B
DTP
Package Drawing Contact:
packagedrawings@atmel.com
20
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
11.5 8U2-1 — 8-ball VFBGA
f 0.10
C
d 0.10
(4X)
d 0.08
C
A1 BALL
PAD
CORNER
C
D
A
E
B
A1 BALL PAD CORNER
2
1
Øb
A
B
C
D
j n0.15 m C A B
j n0.08 m C
e
(e1)
A1
A2
A
d
(d1)
TOP VIEW
BOTTOM VIEW
SIDE VIEW
8 SOLDER BALLS
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
MAX
NOM
NOTE
SYMBOL
A
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
2.35 BSC
A1
A2
b
D
Notes:
E
e
3.73 BSC
0.75 BSC
1. This drawing is for general
e1
d
d1
0.74 REF
0.75 BSC
0.80 REF
2. Dimension 'b' is measured at the maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
6/11/13
TITLE
GPC
DRAWING NO.
8U2-1
REV.
G
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package
(VFBGA)
GWW
Package Drawing Contact:
packagedrawings@atmel.com
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
21
12. Revision History
Doc. Rev.
Date
Comments
Add the UDFN Expanded Quantity Option.
8535H
01/2015
Update the 8X, 8MA2, and 8ME1 package outline drawings and the ordering information.
Update part markings to single page part marking.
Update package drawings.
8535G
11/2012
Replace 8A2 package with 8X package.
Update template and Atmel logos.
Update 8A2 and 8S1 package drawings.
Remove Preliminary.
8535F
8535E
8535D
06/2010
04/2010
08/2009
Update Ordering Code Detail, Ordering Information, template.
Change Catalog Numbering.
Add new Part Marking Information.
8535C
8535B
8535A
05/2009
07/2008
04/2008
Add Part Marking information; changed to Preliminary status.
Modify ‘Endurance’ parameter on page 6.
Initial document release.
22
AT25320B/640B [DATASHEET]
Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015
X X
X X X X
Atmel Corporation
1600 Technology Drive, San Jose, CA 95110 USA
T: (+1)(408) 441.0311
F: (+1)(408) 436.4200
|
www.atmel.com
© 2015 Atmel Corporation. / Rev.: Atmel-8535H-SEEPROM-AT25320B-640B-Datasheet_012015.
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