AT27C256R-12JK [MICROCHIP]
OTP ROM, 32KX8, 120ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32;
| 型号： | AT27C256R-12JK |
| 厂家： | 
MICROCHIP |
| 描述： | OTP ROM, 32KX8, 120ns, CMOS, PQCC32, PLASTIC, MS-016AE, LCC-32 OTP只读存储器 内存集成电路 |
| 文件： | 总12页 (文件大小：250K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
• Fast Read Access Time - 45 ns
• Low-Power CMOS Operation
– 100 µA max. Standby
– 20 mA max. Active at 5 MHz
• JEDEC Standard Packages
– 28-Lead 600-mil PDIP
– 32-Lead PLCC
– 28-Lead TSOP and SOIC
• 5V ± 10% Supply
• High Reliability CMOS Technology
– 2,000V ESD Protection
256K (32K x 8)
OTP EPROM
– 200 mA Latchup Immunity
• Rapid™ Programming Algorithm - 100 µs/byte (typical)
• CMOS and TTL Compatible Inputs and Outputs
• Integrated Product Identification Code
• Commercial, Industrial and Automotive Temperature Ranges
AT27C256R
Description
The AT27C256R is a low-power, high-performance 262,144-bit one-time programma-
ble read only memory (OTP EPROM) organized 32K by 8 bits. It requires only one 5V
power supply in normal read mode operation. Any byte can be accessed in less than
45 ns, eliminating the need for speed reducing WAIT states on high-performance
microprocessor systems.
Atmel’s scaled CMOS technology provides low-active power consumption, and fast
programming. Power consumption is typically only 8 mA in Active Mode and less than
10 µA in Standby.
(continued)
PDIP, SOIC Top View
Pin Configurations
VPP
A12
A7
1
2
3
4
5
6
7
8
9
28 VCC
27 A14
26 A13
25 A8
24 A9
23 A11
22 OE
21 A10
20 CE
19 O7
18 O6
17 O5
16 O4
15 O3
Pin Name
A0 - A14
O0 - O7
CE
Function
Addresses
Outputs
A6
A5
A4
A3
Chip Enable
Output Enable
No Connect
A2
A1
OE
A0 10
O0 11
O1 12
O2 13
GND 14
256K EPROM
NC
PLCC Top View
TSOP Top View
Type 1
A6
A5
A4
A3
A2
5
6
7
8
9
29 A8
28 A9
27 A11
26 NC
25 OE
24 A10
23 CE
22 O7
21 O6
OE
A11
A9
22
23
24
25
26
27
28
1
21
20
19
18
17
16
15
14
13
12
11
10
9
A10
CE
O7
O6
O5
O4
O3
GND
O2
O1
O0
A0
A8
A1 10
A0 11
NC 12
O0 13
A13
A14
VCC
VPP
A12
A7
2
3
A6
4
A5
5
A4
6
A1
Rev. 0014H–07/98
Note:
PLCC Package Pins 1 and
17 are DON’T CONNECT.
A3
7
8
A2
The AT27C256R is available in a choice of industry stan-
dard JEDEC-approved one time programmable (OTP)
plastic DIP, PLCC, SOIC, and TSOP packages. All devices
feature two-line control (CE, OE) to give designers the flex-
ibility to prevent bus contention.
System Considerations
Switching between active and standby conditions via the
Chip Enable pin may produce transient voltage excursions.
Unless accommodated by the system design, these tran-
sients may exceed data sheet limits, resulting in device
non-conformance. At a minimum, a 0.1 µF high frequency,
low inherent inductance, ceramic capacitor should be uti-
lized for each device. This capacitor should be connected
between the VCC and Ground terminals of the device, as
close to the device as possible. Additionally, to stabilize the
supply voltage level on printed circuit boards with large
EPROM arrays, a 4.7 µF bulk electrolytic capacitor should
be utilized, again connected between the VCC and Ground
terminals. This capacitor should be positioned as close as
possible to the point where the power supply is connected
to the array.
With 32K byte storage capability, the AT27C256R allows
firmware to be stored reliably and to be accessed by the
system without the delays of mass storage media.
Atmel’s 27C256R has additional features to ensure high
quality and efficient production use. The Rapid™ Program-
ming Algorithm reduces the time required to program the
part and guarantees reliable programming. Programming
time is typically only 100 µs/byte. The Integrated Product
Identification Code electronically identifies the device and
manufacturer. This feature is used by industry standard
programming equipment to select the proper programming
algorithms and voltages.
Block Diagram
AT27C256R
2
AT27C256R
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to
the device. This is a stress rating only and func-
tional operation of the device at these or any other
conditions beyond those indicated in the opera-
tional sections of this specification is not implied.
Exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Temperature Under Bias................................ -55°C to +125°C
Storage Temperature..................................... -65°C to +150°C
Voltage on Any Pin with
Respect to Ground .........................................-2.0V to +7.0V(1)
Voltage on A9 with
Respect to Ground ......................................-2.0V to +14.0V(1)
VPP Supply Voltage with
Respect to Ground .......................................-2.0V to +14.0V(1)
Note:
1. Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns.Maximum output pin voltage is
VCC + 0.75V dc which may overshoot to +7.0 volts for pulses of less than 20 ns.
Operating Modes
Mode\Pin
CE
VIL
VIL
VIH
VIL
OE
VIL
VIH
Ai
Ai
VPP
VCC
VCC
VCC
VPP
VPP
VCC
VPP
Outputs
DOUT
Read
Output Disable
X(1)
X(1)
Ai
High Z
High Z
DIN
Standby
X(1)
Rapid Program(2)
PGM Verify(2)
Optional PGM Verify(2)
PGM Inhibit(2)
VIH
VIL
VIL
VIH
X(1)
Ai
DOUT
VIL
VIH
Ai
DOUT
X(1)
High Z
(3)
A9 = VH
Product Identification(4)
VIL
VIL
A0 = VIH or VIL
A1 - A14 = VIL
VCC
Identification Code
Notes: 1. X can be VIL or VIH.
2. Refer to Programming Characteristics.
3. VH = 12.0 ± 0.5V.
4. Two identifier bytes may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low
(VIL) to select the Manufacturer’s Identification byte and high (VIH) to select the Device Code byte.
3
DC and AC Operating Conditions for Read Operation
AT27C256R
-45
-55
-70
-90
-12
-15
Com.
Ind.
0°C - 70°C
-40°C - 85°C
0°C - 70°C
-40°C - 85°C
0°C - 70°C
-40°C - 85°C
-40°C - 125°C
5V ± 10%
0°C - 70°C
-40°C - 85°C
-40°C - 125°C
5V ± 10%
0°C - 70°C
-40°C - 85°C
-40°C - 125°C
5V ± 10%
0°C - 70°C
-40°C - 85°C
-40°C - 125°C
5V ± 10%
Operating
Temp. (Case)
Auto.
V
CC Supply
5V ± 10%
5V ± 10%
DC and Operating Characteristics for Read Operation
Symbol
Parameter
Condition
Min
Max
±1
Units
µA
µA
µA
µA
µA
µA
mA
mA
V
Com., Ind.
Auto.
ILI
Input Load Current
VIN = 0V to VCC
±5
Com., Ind.
Auto.
±5
ILO
Output Leakage Current
VPP(1) Read/Standby Current
VCC(1) Standby Current
VOUT = 0V to VCC
±10
10
(2)
IPP1
VPP = VCC
ISB1 (CMOS), CE = VCC ± 0.3V
100
1
ISB
I
SB2 (TTL), CE = 2.0 to VCC + 0.5V
ICC
VCC Active Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
f = 5 MHz, IOUT = 0 mA, E = VIL
20
VIL
-0.6
2.0
0.8
VIH
VOL
VOH
VCC + 0.5
0.4
V
IOL = 2.1 mA
V
IOH = -400 µA
2.4
V
Notes: 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP..
2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP.
.
AC Characteristics for Read Operation
AT27C256R
-70 -90
-45
-55
-12
-15
Symbol
Parameter
Condition
CE = OE = VIL
OE = VIL
Min Max Min Max Min Max Min Max Min Max Min Max Units
(3)
tACC
Address to Output Delay
CE to Output Delay
OE to Output Delay
OE or CE High to Output
45
45
20
55
55
25
70
70
30
90
90
30
120
120
35
150
150
40
ns
ns
ns
(2)
tCE
(2)(3)
tOE
CE = VIL
(4)(5)
tDF
20
20
25
25
30
35
ns
ns
Float, whichever occurred first
Output Hold from Address, CE or OE,
whichever occurred first
tOH
7
7
7
0
0
0
Note:
2, 3, 4, 5. - see AC Waveforms for Read Operation.
AT27C256R
4
AT27C256R
AC Waveforms for Read Operation(1)
Notes: 1. Timing measurement reference level is 1.5V for -45 and -55 devices. Input AC drive levels are VIL = 0.0V and VIH = 3.0V.
Timing measurement reference levels for all other speed grades are VOL = 0.8V and VOH = 2.0V. Input AC drive levels are
VIL = 0.45V and VIH = 2.4V.
2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE
.
3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC
.
4. This parameter is only sampled and is not 100% tested.
5. Output float is defined as the point when data is no longer driven.
Input Test Waveforms and
Measurement Levels
For -45 and -55 devices only:
Output Test Load
tR, tF < 5 ns (10% to 90%)
For -70, -90, -12, and -15 devices:
Note:
CL = 100 pF including jig
capacitance, except for
the -45 and -55 devices,
where CL = 30 pF.
tR, tF < 20 ns (10% to 90%)
Pin Capacitance
f = 1 MHz, T = 25°C(1)
Symbol
CIN
Typ
4
Max
6
Units
Conditions
pF
pF
VIN = 0V
COUT
8
12
VOUT = 0V
Note:
1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested.
5
Programming Waveforms(1)
Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH.
2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer.
3. When programming the AT27C256R a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage
transients.
DC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
Symbol
ILI
Parameter
Test Conditions
Min
Max
±10
Units
µA
V
Input Load Current
Input Low Level
VIN = VIL,VIH
VIL
-0.6
2.0
0.8
VIH
Input High Level
VCC + 1
0.4
V
VOL
VOH
ICC2
IPP2
VID
Output Low Volt
IOL = 2.1 mA
V
Output High Volt
IOH = -400 µA
2.4
V
VCC Supply Current (Program and Verify)
VPP Current
25
25
mA
mA
V
CE = VIL
A9 Product Identification Voltage
11.5
12.5
AT27C256R
6
AT27C256R
AC Programming Characteristics
TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V
Limits
Symbol
tAS
Parameter
Test Conditions(1)
Min
Max
Units
µs
Address Setup Time
OE Setup Time
Data Setup Time
Address Hold Time
Data Hold Time
2
2
2
0
2
tOES
tDS
µs
Input Rise and Fall Times
µs
(10% to 90%) 20ns
tAH
µs
tDH
µs
Input Pulse Levels
0.45V to 2.4V
OE High to
tDFP
0
130
ns
Output Float Delay(2)
Input Timing Reference Level
0.8V to 2.0V
tVPS
tVCS
tPW
tOE
VPP Setup Time
2
2
µs
µs
µs
ns
VCC Setup Time
CE Program Pulse Width(3)
Data Valid from OE(2)
95
105
150
Output Timing Reference Level
0.8V to 2.0V
VPP Pulse Rise Time
During Programming
tPRT
50
ns
Notes: 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP..
2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven—
see timing diagram.
3. Program Pulse width tolerance is 100 µsec ± 5%.
Atmel’s 27C256R Integrated Product Identification Code
Pins
Hex
Codes
A0
0
O7
0
O6
0
O5
0
O4
1
O3
1
O2
1
O1
1
O0
0
Data
Manufacturer
Device Type
1E
1
1
0
0
0
1
1
0
0
8C
7
RapidProgramming Algorithm
A 100 µs CE pulse width is used to program. The address
is set to the first location. VCC is raised to 6.5V and VPP is
raised to 13.0V. Each address is first programmed with one
100 µs CE pulse without verification. Then a verifica-
tion/reprogramming loop is executed for each address. In
the event a byte fails to pass verification, up to 10 succes-
sive 100 µs pulses are applied with a verification after each
pulse. If the byte fails to verify after 10 pulses have been
applied, the part is considered failed. After the byte verifies
properly, the next address is selected until all have been
checked. VPP is then lowered to 5.0V and VCC to 5.0V. All
bytes are read again and compared with the original data to
determine if the device passes or fails.
AT27C256R
8
AT27C256R
Ordering Information
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
45
55
70
20
0.1
AT27C256R-45JC
AT27C256R-45PC
AT27C256R-45RC
AT27C256R-45TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
20
20
20
20
20
20
0.1
0.1
0.1
0.1
0.1
0.1
AT27C256R-45JI
AT27C256R-45PI
AT27C256R-45RI
AT27C256R-45TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
AT27C256R-55JC
AT27C256R-55PC
AT27C256R-55RC
AT27C256R-55TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
AT27C256R-55JI
AT27C256R-55PI
AT27C256R-55RI
AT27C256R-55TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
AT27C256R-70JC
AT27C256R-70PC
AT27C256R-70RC
AT27C256R-70TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
AT27C256R-70JI
AT27C256R-70PI
AT27C256R-70RI
AT27C256R-70TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
AT27C256R-70JA
AT27C256R-70PA
AT27C256R-70RA
32J
Automotive
28P6
28R
(-40°C to 125°C)
(continued)
Package Type
32J
32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
28P6
28R
28T
28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC)
28-Lead, Thin Small Outline Package (TSOP)
9
Ordering Information (Continued)
I
CC (mA)
tACC
(ns)
Active
Standby
Ordering Code
Package
Operation Range
90
20
0.1
AT27C256R-90JC
AT27C256R-90PC
AT27C256R-90RC
AT27C256R-90TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
20
0.1
AT27C256R-90JI
AT27C256R-90PI
AT27C256R-90RI
AT27C256R-90TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
20
20
0.1
0.1
AT27C256R-90JA
AT27C256R-90PA
AT27C256R-90RA
32J
Automotive
28P6
28R
(-40°C to 125°C)
120
AT27C256R-12JC
AT27C256R-12PC
AT27C256R-12RC
AT27C256R-12TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
20
0.1
AT27C256R-12JI
AT27C256R-12PI
AT27C256R-12RI
AT27C256R-12TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
20
20
0.1
0.1
AT27C256R-12JA
AT27C256R-12PA
AT27C256R-12RA
32J
Automotive
28P6
28R
(-40°C to 125°C)
150
AT27C256R-15JC
AT27C256R-15PC
AT27C256R-15RC
AT27C256R-15TC
32J
Commercial
28P6
28R
28T
(0°C to 70°C)
20
20
0.1
0.1
AT27C256R-15JI
AT27C256R-15PI
AT27C256R-15RI
AT27C256R-15TI
32J
Industrial
28P6
28R
28T
(-40°C to 85°C)
AT27C256R-15JA
AT27C256R-15PA
AT27C256R-15RA
32J
Automotive
28P6
28R
(-40°C to 125°C)
Package Type
32J
32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
28P6
28R
28T
28-Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28-Lead, 0.330" Wide, Plastic Gull Wing Small Outline (SOIC)
28-Lead, Thin Small Outline Package (TSOP)
AT27C256R
10
AT27C256R
Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
28P6, 28-Lead, 0.600" Wide, Plastic Dual Inline
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
Package (PDIP)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-011 AB
1.47(37.3)
1.44(36.6)
.025(.635) X 30˚ - 45˚
PIN
1
.045(1.14) X 45˚ PIN NO. 1
.012(.305)
IDENTIFY
.008(.203)
.566(14.4)
.530(13.5)
.530(13.5)
.553(14.0)
.490(12.4)
.547(13.9)
.032(.813)
.026(.660)
.021(.533)
.013(.330)
.595(15.1)
.585(14.9)
.090(2.29)
MAX
1.300(33.02) REF
.030(.762)
.015(.381)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.220(5.59)
MAX
.050(1.27) TYP
.005(.127)
MIN
.300(7.62) REF
.430(10.9)
.390(9.90)
SEATING
PLANE
AT CONTACT
POINTS
.065(1.65)
.015(.381)
.022(.559)
.014(.356)
.161(4.09)
.125(3.18)
.065(1.65)
.041(1.04)
.110(2.79)
.090(2.29)
.022(.559) X 45˚ MAX (3X)
.630(16.0)
.590(15.0)
.453(11.5)
.447(11.4)
0
15
REF
.012(.305)
.008(.203)
.495(12.6)
.485(12.3)
.690(17.5)
.610(15.5)
28R, 28-Lead, 0.330" Wide, Plastic Gull Wing Small
Outline (SOIC)
28T, 28-Lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Inches and (Millimeters)
Dimensions in Millimeters and (Inches)*
INDEX
MARK
AREA
13.7 (0.539)
13.1 (0.516)
11.9 (0.469)
11.7 (0.461)
0.27 (0.011)
0.18 (0.007)
0.55 (0.022)
BSC
7.15 (0.281)
REF
8.10 (0.319)
7.90 (0.311)
1.25 (0.049)
1.05 (0.041)
0.20 (0.008)
0.10 (0.004)
0
REF
5
0.20 (0.008)
0.15 (0.006)
0.70 (0.028)
0.30 (0.012)
*Controlling dimension: millimeters
11
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© Atmel Corporation 1998.
Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard war-
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®
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Printed on recycled paper.
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