ATMEGA3208-AFR [MICROCHIP]
Microcontroller;
| 型号： | ATMEGA3208-AFR |
| 厂家： | 
MICROCHIP |
| 描述： | Microcontroller 时钟 微控制器 外围集成电路 |
| 文件： | 总79页 (文件大小：882K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ATmega808/1608/3208/4808 –
32-Pin
®
32-Pin Data Sheet – megaAVR 0-series
Introduction
®
®
The ATmega808/1608/3208/4808 microcontrollers of the megaAVR 0-series are using the AVR processor with
hardware multiplier, running at up to 20 MHz, with a wide range of Flash sizes up to 48 KB, up to 6 KB of SRAM, and
256 bytes of EEPROM in 28-, 32-, 40-, or 48-pin package. The series uses the latest technologies from Microchip
with a flexible and low-power architecture including Event System and SleepWalking, accurate analog features and
advanced peripherals.
The devices described here offer Flash sizes from 8 KB to 48 KB in a 32-pin package.
Features
®
•
AVR CPU:
– Single-cycle I/O access
– Two-level interrupt controller
– Two-cycle hardware multiplier
Memories:
•
– Up to 48 KB In-system self-programmable Flash memory
– 256B EEPROM
– Up to 6 KB SRAM
– Write/Erase endurance:
•
•
Flash 10,000 cycles
EEPROM 100,000 cycles
– Data retention: 40 Years at 55°C
System:
•
– Power-on Reset (POR) circuit
– Brown-out Detector (BOD)
– Clock options:
•
•
•
•
16/20 MHz low-power internal oscillator
32.768 kHz Ultra Low-Power (ULP) internal oscillator
32.768 kHz external crystal oscillator
External clock input
– Single pin Unified Program Debug Interface (UPDI)
– Three Sleep modes:
•
•
Idle with all peripherals running for immediate wake-up
Standby
– Configurable operation of selected peripherals
– SleepWalking peripherals
•
Power-Down with limited wake-up functionality
•
Peripherals:
– One 16-bit Timer/Counter type A (TCA) with a dedicated period register and three compare channels
– Three 16-bit Timer/Counter type B with input capture (TCB)
DS40002017C-page 1
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
– One 16-bit Real-Time Counter (RTC) running from an external crystal or an internal RC oscillator
– Three USART with fractional baud rate generator, auto-baud, and start-of-frame detection
– Master/slave Serial Peripheral Interface (SPI)
– Dual mode Master/Slave TWI with dual address match
•
•
•
Standard mode (Sm, 100 kHz)
Fast mode (Fm, 400 kHz)
Fast mode plus (Fm+, 1 MHz)
– Event System for CPU independent and predictable inter-peripheral signaling
– Configurable Custom Logic (CCL) with up to four programmable Look-up Tables (LUT)
– One Analog Comparator (AC) with a scalable reference input
– One 10-bit 150 ksps Analog-to-Digital Converter (ADC)
– Five selectable internal voltage references: 0.55V, 1.1V, 1.5V, 2.5V, and 4.3V
– CRC code memory scan hardware
•
Optional automatic scan before code execution is allowed
– Watchdog Timer (WDT) with Window mode, with separate on-chip oscillator
– External interrupt on all general purpose pins
I/O and Packages:
•
•
•
– 27 programmable I/O lines
– 32-pin VQFN 5x5 and TQFP 7x7
Temperature Ranges:
– Industrial: -40°C to +85°C
– Extended: -40°C to +125°C
Speed Grades -40°C to +105°C:
– 0-5 MHz @ 1.8V – 5.5V
– 0-10 MHz @ 2.7V – 5.5V
– 0-20 MHz @ 4.5V – 5.5V
•
Speed Grades -40°C to +125°C:
– 0-8 MHz @ 2.7V - 5.5V
– 0-16 MHz @ 4.5V - 5.5V
DS40002017C-page 2
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Table of Contents
Introduction.....................................................................................................................................................1
Features......................................................................................................................................................... 1
1. Block Diagram.........................................................................................................................................5
2. Pinout......................................................................................................................................................6
2.1. 32-Pin VQFN/TQFP..................................................................................................................... 6
3. I/O Multiplexing and Considerations....................................................................................................... 7
3.1. Multiplexed Signals...................................................................................................................... 7
4. Electrical Characteristics.........................................................................................................................8
4.1. Disclaimer.....................................................................................................................................8
4.2. Absolute Maximum Ratings .........................................................................................................8
4.3. General Operating Ratings ..........................................................................................................8
4.4. Power Considerations.................................................................................................................. 9
4.5. Power Consumption...................................................................................................................10
4.6. Peripherals Power Consumption................................................................................................11
4.7. BOD and POR Characteristics...................................................................................................12
4.8. External Reset Characteristics...................................................................................................13
4.9. Oscillators and Clocks................................................................................................................13
4.10. I/O Pin Characteristics................................................................................................................15
4.11. USART....................................................................................................................................... 16
4.12. SPI..............................................................................................................................................17
4.13. TWI.............................................................................................................................................18
4.14. VREF..........................................................................................................................................20
4.15. ADC............................................................................................................................................21
4.16. AC.............................................................................................................................................. 24
4.17. UPDI Timing............................................................................................................................... 25
4.18. Programming Time.....................................................................................................................26
5. Typical Characteristics.......................................................................................................................... 27
5.1. Power Consumption...................................................................................................................27
5.2. GPIO.......................................................................................................................................... 35
5.3. VREF Characteristics.................................................................................................................42
5.4. BOD Characteristics...................................................................................................................44
5.5. ADC Characteristics...................................................................................................................47
5.6. AC Characteristics......................................................................................................................57
5.7. OSC20M Characteristics............................................................................................................59
5.8. OSCULP32K Characteristics..................................................................................................... 61
6. Ordering Information............................................................................................................................. 63
7. Online Package Drawings.....................................................................................................................65
8. Package Drawings................................................................................................................................ 66
8.1. 32-Pin TQFP.............................................................................................................................. 66
DS40002017C-page 3
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
8.2. 32-Pin VQFN..............................................................................................................................70
9. Conventions.......................................................................................................................................... 74
9.1. Memory Size and Type...............................................................................................................74
9.2. Frequency and Time...................................................................................................................74
10. Data Sheet Revision History................................................................................................................. 75
10.1. Rev.C - 08/2019......................................................................................................................... 75
10.2. Rev.B - 03/2019..........................................................................................................................75
10.3. Rev. A - 02/2018.........................................................................................................................75
The Microchip Website.................................................................................................................................76
Product Change Notification Service............................................................................................................76
Customer Support........................................................................................................................................ 76
Product Identification System.......................................................................................................................77
Microchip Devices Code Protection Feature................................................................................................77
Legal Notice................................................................................................................................................. 77
Trademarks.................................................................................................................................................. 77
Quality Management System....................................................................................................................... 78
Worldwide Sales and Service.......................................................................................................................79
DS40002017C-page 4
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Block Diagram
1.
Block Diagram
UPDI
UPDI
CPU
CRC
OCD
Flash
M
M
M
S
S
SRAM
BUS Matrix
EEPROM
S
S
NVMCTRL
I
N
/
O
U
T
PAn
PBn
PCn
PDn
PEn
PFn
PORTS
GPIOR
AINPn
AINNn
OUT
ACn
D
A
T
AINn
D
A
T
A
B
U
S
ADCn
E
V
E
N
T
VREFA
A
B
U
S
CPUINT
Detectors/
References
EVOUTx
EVSYS
CCL
R
O
U
T
I
RESET
RST
POR
System
Management
LUTn-INn
LUTn-OUT
BOD/
VLM
Bandgap
N
G
RSTCTRL
CLKCTRL
SLPCTRL
WOn
WO
TCAn
N
E
T
TCBn
W
O
R
K
Clock Generation
OSC20M
RXD
TXD
XCK
XDIR
CLKOUT
EXTCLK
USARTn
WDT
RTC
OSC32K
MISO
MOSI
SCK
SS
TOSC1
SPIn
TWIn
XOSC32K
TOSC2
SDA (master)
SCL (master)
SDA (slave)
SCL (slave)
DS40002017C-page 5
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Pinout
2.
Pinout
2.1
32-Pin VQFN/TQFP
PA3
PA4
PA5
PA6
PA7
PC0
PC1
PC2
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
PF4
PF3
PF2
PF1 (TOSC2)
PF0 (TOSC1)
GND
AVDD
PD7
Power
Functionality
Input supply
Programming, debug
Clock, crystal
Ground
GPIO on VDD power domain
GPIO on AVDD power domain
TWI
Digital functions only
Analog functions
Note:ꢀ The center pad underneath the QFN packages can be connected to PCB ground or left electrically
unconnected. Solder or glue it to the board to ensure good mechanical stability. If the center pad is not attached, the
package might loosen from the board.
DS40002017C-page 6
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
I/O Multiplexing and Considerations
3.
I/O Multiplexing and Considerations
3.1
Multiplexed Signals
(1,2)
VQFN32/
TQFP32
Pin name
Special
ADC0
AC0
USARTn
SPI0
TWI0
TCA0
TCBn
EVSYS
CCL-LUTn
30
31
32
1
PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7
PC0
PC1
PC2
PC3
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
AVDD
GND
PF0
PF1
PF2
PF3
PF4
PF5
PF6
UPDI
VDD
GND
EXTCLK
0,TxD
0,RxD
0,XCK
0,XDIR
0-WO0
0-WO1
0-WO2
0-WO3
0-WO4
0-WO5
0-IN0
0-IN1
0-IN2
0-OUT
TWI
TWI
SDA(MS)
SCL(MS)
0-WO
1-WO
EVOUTA
(3)
2
0,TxD
MOSI
MISO
SCK
SS
(3)
3
0,RxD
(3)
(3)
4
0,XCK
0-OUT
(3)
(3)
5
CLKOUT
OUT
0,XDIR
EVOUTA
(3)
(3)
6
1,TxD
1,RxD
1,XCK
1,XDIR
MOSI
MISO
0-WO0
0-WO1
0-WO2
0-WO3
0-WO0
0-WO1
0-WO2
0-WO3
0-WO4
0-WO5
2-WO
1-IN0
1-IN1
1-IN2
1-OUT
2-IN0
2-IN1
2-IN2
2-OUT
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
3-WO
7
(3)
(3)
8
TWI
TWI
SCK
(3)
SDA(MS)
EVOUTC
(3)
9
SS
SCL(MS)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
AIN0
AIN1
AIN2
AIN3
AIN4
AIN5
AIN6
AIN7
P3
P0
N0
P1
N1
P2
N2
EVOUTD
(3)
2-OUT
(3)
EVOUTD
VREFA
(3)
(3)
(3)
(3)
(3)
(3)
TOSC1
TOSC2
TWI
2,TxD
2,RxD
2,XCK
2,XDIR
0-WO0
0-WO1
0-WO2
0-WO3
0-WO4
0-WO5
3-IN0
3-IN1
3-IN2
3-OUT
(3)
AIN12
AIN13
AIN14
AIN15
SDA(S)
EVOUTF
(3)
TWI
SCL(S)
(3)
(3)
(3)
2,TxD
0-WO
1-WO
(3)
2,RxD
(3)
(3)
RESET
2,XCK
3-OUT
Note:ꢀ
1. Pin names are of type Pxn, with x being the PORT instance (A,B,C, ...) and n the pin number. Notation for
signals is PORTx_PINn. All pins can be used as event input.
2. All pins can be used for external interrupt, where pins Px2 and Px6 of each port have full asynchronous
detection.
3. Alternate pin positions. For selecting the alternate positions, refer to the PORTMUX documentation.
DS40002017C-page 7
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
4.
Electrical Characteristics
4.1
Disclaimer
All typical values are measured at T = 25°C and VDD = 3V unless otherwise specified. All minimum and maximum
values are valid across operating temperature and voltage unless otherwise specified.
Typical values given should be considered for design guidance only, and actual part variation around these values is
expected.
4.2
Absolute Maximum Ratings
Stresses beyond those listed in this section may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or other conditions beyond those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 4-1.ꢀAbsolute Maximum Ratings
Symbol
Description
Conditions
TA=[-40, 85]°C
Min.
Max.
6
Unit
V
VDD
IVDD
Power Supply Voltage
Current into a VDD pin
-0.5
-
-
200
100
200
100
VDD+0.5
40
mA
mA
mA
mA
V
TA=[85, 125]°C
TA=[-40, 85]°C
TA=[85, 125]°C
IGND
Current out of a GND pin
-
-
VPIN
IPIN
Pin voltage with respect to GND
-0.5
-40
-1
I/O pin sink/source current
mA
mA
(1)
Ic1
I/O pin injection current except for the RESET pin
Vpin<GND-0.6V or
5.5V<Vpin≤6.1V
4.9V<VDD≤5.5V
1
(1)
Ic2
I/O pin injection current except for the RESET pin
Storage temperature
Vpin<GND-0.6V or
Vpin≤5.5V
VDD≤4.9V
-15
-65
15
mA
°C
Tstorage
150
Note:ꢀ
1.
– If VPIN is lower than GND-0.6V, then a current limiting resistor is required. The negative DC injection
current limiting resistor is calculated as R = (GND-0.6V – Vpin)/ICn
– If VPIN is greater than VDD+0.6V, then a current limiting resistor is required. The positive DC injection
current limiting resistor is calculated as R = (Vpin-(VDD+0.6))/ICn
.
.
4.3
General Operating Ratings
The device must operate within the ratings listed in this section in order for all other electrical characteristics and
typical characteristics of the device to be valid.
Table 4-2.ꢀGeneral Operating Conditions
Symbol
VDD
TA
Description
Operating Supply Voltage
Operating temperature range
Condition
Min.
1.8(1)
-40
Max.
5.5
Unit
V
125
°C
DS40002017C-page 8
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Note:ꢀ
1. Operation is ensured down to 1.8V or VBOD with BODLEVEL0, whichever is lower.
Table 4-3.ꢀOperating Voltage and Frequency
Symbol
Description
Condition
Min. Max. Unit
fCLK_CPU
Nominal operating system clock frequency
VDD=[1.8, 5.5]V
0
0
0
0
0
5
MHz
TA=[-40, 105]°C(1)(4)
VDD=[2.7, 5.5]V
TA=[-40, 105]°C(2)(4)
10
20
8
VDD=[4.5, 5.5]V
TA=[-40, 105]°C(3)(4)
VDD=[2.7, 5.5]V
TA=[-40, 125]°C(2)
VDD=[4.5, 5.5]V
TA=[-40, 125]°C(2)
16
Note:ꢀ
1. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL0.
2. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL2.
3. Operation is ensured down to BOD triggering level, VBOD with BODLEVEL7.
4. These specifications do not apply to automotive range parts (-VAO).
The maximum CPU clock frequency depends on VDD. As shown in the figure below, the maximum frequency vs. VDD
is linear between 1.8V < VDD < 2.7V and 2.7V < VDD < 4.5V.
Figure 4-1.ꢀMaximum Frequency vs. VDD for [-40, 105]°C
20MHz
10MHz
Safe Operating Area
5MHz
1.8V
2.7V
4.5V
5.5V
4.4
Power Considerations
The average die junction temperature, TJ (in °C) is given from the formula:
TJ = TA+PD * RθJA
where PD is the total power dissipation.
The total thermal resistance of a package (RθJA) can be separated into two components, RθJC and RθCA, representing
the barrier to heat flow from the semiconductor junction to the package (case) surface (RθJC) and from the case to the
outside ambient air (RθCA). These terms are related by the equation:
RθJA = RθJC + RθCA
.
DS40002017C-page 9
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
RθJC is device related and cannot be influenced by the user. However, RθCA is user-dependent and can be minimized
by thermal management techniques such as heat sinks, ambient air cooling, and thermal convection. Thus, good
thermal management on the part of the user can significantly reduce RθCA so that RθJA approximately equals RθJC
.
The power dissipation curve is negatively sloped as ambient temperature increase. The maximum power dissipation
is, therefore, at minimum ambient temperature while the highest junction temperature occurs at the maximum
ambient temperature.
Table 4-4.ꢀPower Dissipation and Junction Temperature vs Temperature
Package
VQFN32
TQFP32
TA Range
RθJA (°C/W)
PD (W) Typical
TJ - TA(°C) Typical
-40°C to 125°C
-40°C to 125°C
1.0
1.0
4.5
Power Consumption
The values are measured power consumption under the following conditions, except where noted:
•
•
•
•
VDD=3V
TA=25°C
OSC20M used as system clock source, except where otherwise specified
System power consumption measured with peripherals disabled and I/O ports driven low with inputs disabled
Table 4-5.ꢀPower Consumption in Active and Idle Mode
Mode
Description
Condition
fCLK_CPU=20 MHz (OSC20M)
Typ. Max. Unit
Active Active power consumption
VDD=5V
VDD=5V
VDD=3V
VDD=5V
VDD=3V
8.5
4.3
2.3
2.2
1.2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
mA
mA
mA
mA
mA
mA
µA
fCLK_CPU=10 MHz (OSC20M div2)
fCLK_CPU=5 MHz (OSC20M div4)
VDD=2V 0.75
VDD=5V 16.4
fCLK_CPU=32.768 kHz (OSCULP32K)
VDD=3V
VDD=2V
VDD=5V
VDD=5V
VDD=3V
VDD=5V
VDD=3V
9.0
6.0
2.8
1.4
0.8
0.7
0.4
µA
µA
Idle
Idle power consumption
fCLK_CPU=20 MHz (OSC20M)
mA
mA
mA
mA
mA
mA
µA
fCLK_CPU=10 MHz (OSC20M div2)
fCLK_CPU=5 MHz (OSC20M div4)
VDD=2V 0.25
fCLK_CPU=32.768 kHz (OSCULP32K)
VDD=5V
VDD=3V
VDD=2V
5.6
2.8
1.8
µA
µA
DS40002017C-page 10
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Table 4-6.ꢀPower Consumption in Power-Down, Standby and Reset Mode
Mode
Description
Condition
Typ.
25°C
Max.
85°C(1)
Max.
125°C
Unit
Standby
Standby power
consumption
RTC running at 1.024
kHz from external
XOSC32K (CL=7.5 pF)
VDD=3V
VDD=3V
VDD=3V
0.7
0.7
0.1
-
-
µA
RTC running at 1.024
kHz from internal
OSCULP32K
6.0
5.0
16.0
15.0
µA
µA
Power-
Down/
Standby
Power-down/Standby
power consumption are
the same when all
All peripherals stopped
peripherals are stopped
Reset
Reset power
consumption
RESET line pulled low
VDD=3V
100
-
-
µA
Note:ꢀ
1. These parameters are for design guidance only and are not tested.
4.6
Peripherals Power Consumption
The table below can be used to calculate the additional current consumption for the different I/O peripherals in the
various operating modes.
Some peripherals will request the clock to be enabled when operating in STANDBY. See the peripheral chapter for
further information.
Operating conditions:
•
•
•
•
VDD=3V
T=25°C
OSC20M at 1 MHz used as system clock source, except where otherwise specified
In Idle Sleep mode, except where otherwise specified
Table 4-7.ꢀPeripherals Power Consumption
Peripheral
Conditions
Typ.(1)
19
Unit
BOD
Continuous
Sampling @ 1 kHz
µA
1.2
TCA
16-bit count @ 1 MHz
13.0
7.4
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
TCB
16-bit count @ 1 MHz
RTC
16-bit count @ OSCULP32K
1.2
WDT (including OSCULP32K)
0.7
OSC20M
AC
130
92
Fast mode(2)
Low-Power mode(2)
50 ksps
45
ADC(3)
330
340
0.5
100 ksps
XOSC32K
CL=7.5 pF
DS40002017C-page 11
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Peripheral
Conditions
Typ.(1)
0.4
Unit
µA
OSCULP32K
USART
Enable @ 9600 Baud
13.0
2.1
µA
SPI (Master)
TWI (Master)
TWI (Slave)
Flash programming
Enable @ 100 kHz
Enable @ 100 kHz
Enable @ 100 kHz
Erase Operation
Write Operation
µA
24.0
17.0
1.5
µA
µA
mA
3.0
Note:ꢀ
1. Current consumption of the module only. To calculate the total internal power consumption of the
microcontroller, add this value to the base power consumption given in “Power Consumption” section in
electrical characteristics.
2. CPU in Standby mode.
3. Average power consumption with ADC active in Free-Running mode.
4.7
BOD and POR Characteristics
Table 4-8.ꢀPower Supply Characteristics
Symbol
SRON(1)
Description
Power-on Slope
Condition
Min.
Typ.
Max.
Unit
-
-
100(2)
V/ms
Note:ꢀ
1. For design guidance only and not tested in production.
2. A slope faster than the maximum rating can trigger a Reset of the device if changing the voltage level after an
initial power-up.
Table 4-9.ꢀPower-on Reset (POR) Characteristics
Symbol
Description
Condition
Min. Typ. Max. Unit
VPOR
POR threshold voltage on VDD falling
POR threshold voltage on VDD rising
VDD falls/rises at 0.5V/ms or slower
0.8(1)
1.4(1)
-
-
1.6(1)
1.8
V
Note:ꢀ
1. For design guidance only and not tested in production.
Table 4-10.ꢀBrown-out Detector (BOD) Characteristics
Symbol
Description
BOD detection level (falling/rising) BODLEVEL0
BODLEVEL2
Condition
Min. Typ. Max. Unit
VBOD
1.7 1.8
2.4 2.6
3.9 4.3
2.0
2.9
4.5
-
V
BODLEVEL7
VHYS
Hysteresis
BODLEVEL0
BODLEVEL2
BODLEVEL7
-
-
-
25
40
80
mV
-
-
DS40002017C-page 12
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Condition
Min. Typ. Max. Unit
tBOD
Detection time
Continuous
-
-
-
-
-
-
-
7
1
-
-
-
-
-
-
-
µs
Sampled, 1 kHz
ms
Sampled, 125 Hz
8
tstartup
VINT
Start-up time
Time from enable to ready
Percentage above the selected BOD level
40
4
µs
%
Interrupt level 0
Interrupt level 1
Interrupt level 2
13
25
4.8
External Reset Characteristics
Table 4-11.ꢀExternal Reset Characteristics
Mode
VVIH_RST
VVIL_RST
tMIN_RST
Rp_RST
Description
Input Voltage for RESET
Condition
Min.
0.7×VDD
-0.2
Typ.
Max.
Unit
-
-
VDD+0.2
0.3×VDD
2.5
V
Input Low Voltage for RESET
Minimum pulse width on RESET pin(1)
RESET pull-up resistor
-
-
µs
VReset=0V
20
35
50
kΩ
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
4.9
Oscillators and Clocks
Operating conditions:
•
VDD=3V, except where specified otherwise
Table 4-12.ꢀ20 MHz Internal Oscillator (OSC20M) Characteristics
Symbol
Description
Condition
TA=25°C, 3.0V
Min. Typ. Max. Unit
fOSC20M Factory calibration frequency
FREQSEL=0
FREQSEL=1
OSC16M(2)
OSC20M(2)
16
20
MHz
fCAL
Frequency calibration range
14.5
18.5
-1.5
-2.0
17.5 MHz
21.5 MHz
ETOTAL
Total error with 16 MHz and 20 MHz From target
frequency selection frequency
TA=25°C, 3.0V
1.5
2.0
%
%
TA=[0, 70]°C,
VDD=[1.8, 3.6]V
Full operation
range
-4.0
-1.8
4.0
1.8
EDRIFT
Accuracy with 16 MHz and 20 MHz Factory calibrated
frequency selection relative to the
factory-stored frequency value
TA=[0, 70]°C,
%
%
VDD=3V(1)
VDD=[1.8, 5.5]V
ΔfOSC20M Calibration step size
-
0.75
-
DS40002017C-page 13
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Condition
Min. Typ. Max. Unit
DOSC20M Duty cycle
-
-
50
12
-
-
%
tstartup
Start-up time
Within 2% accuracy
µs
Note:ꢀ
1. See also the description of OSC20M on calibration.
2. Oscillator frequencies above speed specification must be divided so the CPU clock is always within
specification.
Table 4-13.ꢀ32.768 kHz Internal Oscillator (OSCULP32K) Characteristics
Symbol
Description
Condition
Min.
Typ.
Max. Unit
fOSCULP32K
Factory calibration frequency
Factory calibration accuracy
Total error from target frequency
32.768
kHz
TA=25°C, 3.0V
-3
3
%
%
ETOTAL
TA=[0, 70]°C, VDD=[1.8, 3.6]V
Full operation range
-10
-20
+10
+20
DOSCULP32K Duty cycle
tstartup Start-up time
50
%
-
250
-
µs
Table 4-14.ꢀ32.768 kHz External Crystal Oscillator (XOSC32K) Characteristics
Symbol
Description
Condition Min.
Typ.
Max. Unit
fout
Frequency
-
32.768
-
-
kHz
ms
pF
tstartup
Start-up time
CL=7.5 pF
-
300
CL
Crystal load capacitance(1)
7.5
-
5.5
-
12.5
-
CTOSC1/TOSC2
ESR(1)
Parasitic pin capacitance
-
-
-
pF
Equivalent Series Resistance - Safety Factor=3
CL=7.5 pF
80
40
kΩ
CL=12.5 pF
-
Note:ꢀ
1. This parameter is for design guidance only and not production tested.
Figure 4-2.ꢀExternal Clock Waveform Characteristics
VIH1
VIL1
Table 4-15.ꢀExternal Clock Characteristics
Symbol
Description
Condition VDD=[1.8, 5.5]V VDD=[2.7, 5.5]V VDD=[4.5, 5.5]V Unit
Min.
Max.
Min.
Max.
Min.
Max.
fCLCL
Frequency
0
5.0
0.0
10.0
0.0
20.0 MHz
DS40002017C-page 14
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Condition VDD=[1.8, 5.5]V VDD=[2.7, 5.5]V VDD=[4.5, 5.5]V Unit
Min.
200
80
Max.
Min.
100
40
Max.
Min.
50
20
20
-
Max.
tCLCL
Clock Period
-
-
-
-
-
-
ns
ns
ns
ns
(1)
tCHCX
High Time
Low Time
(1)
tCLCX
tCLCH
80
-
40
-
-
(1)
Rise Time (for maximum
frequency)
-
40
-
20
10
(1)
tCHCL
Fall Time (for maximum
frequency)
-
-
40
20
-
-
20
20
-
-
10
20
ns
%
(1)
ΔtCLCL
Change in period from one clock
cycle to the next
Note:ꢀ
1. This parameter is for design guidance only and not production tested.
4.10
I/O Pin Characteristics
Table 4-16.ꢀI/O Pin Characteristics (TA=[-40, 85]°C, VDD=[1.8, 5.5]V unless otherwise noted)
Symbol
VIL
Description
Input Low Voltage
Condition
Min.
Typ.
Max.
Unit
V
-0.2
-
0.3×VDD
VIH
Input High Voltage
0.7×VDD
-
VDD+0.2V
V
IIH / IIL
I/O pin Input Leakage Current
VDD=5.5V, pin high
VDD=5.5V, pin low
-
< 0.05
-
µA
-
< 0.05
-
0.36
0.6
1
VOL
VOH
Itotal
I/O pin drive strength
I/O pin drive strength
VDD=1.8V, IOL=1.5 mA
VDD=3.0V, IOL=7.5 mA
VDD=5.0V, IOL=15 mA
VDD=1.8V, IOH=1.5 mA
VDD=3.0V, IOH=7.5 mA
VDD=5.0V, IOH=15 mA
TA=125°C
-
-
-
-
-
-
-
-
V
V
-
-
1.44
2.4
4
-
-
-
Maximum combined I/O sink/source
current per pin group(1,2)
-
100
mA
Maximum combined I/O sink/source
current per pin group(1,2)
TA=25°C
-
-
200
tRISE
Rise time
VDD=3.0V, load=20 pF
VDD=5.0V, load=20 pF
-
-
-
2.5
1.5
19
-
-
-
ns
VDD=3.0V, load=20 pF,
slew rate enabled
VDD=5.0V, load=20 pF,
slew rate enabled
-
9
-
DS40002017C-page 15
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Condition
Min.
Typ.
2.0
1.3
21
Max.
Unit
tFALL
Fall time
VDD=3.0V, load=20 pF
VDD=5.0V, load=20 pF
-
-
-
-
-
-
ns
VDD=3.0V, load=20 pF,
slew rate enabled
VDD=5.0V, load=20 pF,
slew rate enabled
-
-
11
-
-
Cpin
I/O pin capacitance except for TOSC,
VREFA, and TWI pins
3.5
pF
Cpin
Cpin
Cpin
Rp
I/O pin capacitance on TOSC pins
I/O pin capacitance on TWI pins
I/O pin capacitance on VREFA pin
Pull-up resistor
-
-
4
-
-
pF
pF
pF
kΩ
10
14
35
-
-
20
50
Note:ꢀ
1. Pin group A (PA[7:0]), PF[6:2]), pin group B (PB[7:0], PC[7:0]), pin group C (PD:7:0, PE[3:0], PF[1:0]). For 28-
pin and 32-pin devices pin group A and B should be seen as a single group. The combined continuous sink/
source current for each individual group should not exceed the limits.
2. These parameters are for design guidance only and are not production tested.
4.11
USART
Figure 4-3.ꢀUSART in SPI Mode - Timing Requirements in Master Mode
SS
tMOS
tSCKR
tSCKF
SCK
(CPOL = 0)
tSCKW
SCK
(CPOL = 1)
tSCKW
tMIS
tMIH
tSCK
MISO
(Data Input)
MSb
LSb
tMOH
tMOH
MOSI
(Data Output)
MSb
LSb
Table 4-17.ꢀUSART in SPI Master Mode - Timing Characteristics
Symbol(1)
fSCK
Description
SCK clock frequency
SCK period
Condition
Master
Min.
Typ.
Max.
Unit
MHz
ns
-
-
-
10
-
tSCK
Master
Master
Master
100
tSCKW
tSCKR
SCK high/low width
SCK rise time
-
-
0.5×tSCK
2.7
-
ns
-
ns
DS40002017C-page 16
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol(1)
Description
SCK fall time
Condition
Master
Min.
Typ.
2.7
Max.
Unit
ns
tSCKF
tMIS
-
-
-
-
-
-
-
-
-
-
MISO setup to SCK
MISO hold after SCK
MOSI setup to SCK
MOSI hold after SCK
Master
Master
Master
Master
10
ns
tMIH
10
ns
tMOS
tMOH
0.5×tSCK
1.0
ns
ns
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
4.12
SPI
Figure 4-4.ꢀSPI - Timing Requirements in Master Mode
SS
tMOS
tSCKR
tSCKF
SCK
(CPOL = 0)
tSCKW
SCK
(CPOL = 1)
tSCKW
tMIS
tMIH
tSCK
MISO
(Data Input)
MSb
LSb
tMOH
tMOH
MOSI
(Data Output)
MSb
LSb
Figure 4-5.ꢀSPI - Timing Requirements in Slave Mode
SS
tSSCKR
tSSS
tSSCKF
tSSH
SCK
(CPOL = 0)
tSSCKW
SCK
(CPOL = 1)
tSSCKW
tSIS
tSIH
tSSCK
MOSI
(Data Input)
MSb
LSb
tSOSS
tSOS
tSOSH
MISO
(Data Output)
MSb
LSb
DS40002017C-page 17
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Table 4-18.ꢀSPI - Timing Characteristics
Symbol(1)
fSCK
Description
SCK clock frequency
Condition
Master
Min.
Typ.
Max.
Unit
MHz
ns
-
-
10
tSCK
SCK period
Master
Master
Master
Master
Master
Master
Master
Master
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
Slave
100
-
-
tSCKW
tSCKR
tSCKF
tMIS
SCK high/low width
SCK rise time
-
0.5*SCK
-
ns
-
2.7
-
ns
SCK fall time
-
2.7
-
ns
MISO setup to SCK
MISO hold after SCK
MOSI setup to SCK
MOSI hold after SCK
Slave SCK clock frequency
Slave SCK period
SCK high/low width
SCK rise time
-
10
-
ns
tMIH
-
10
-
ns
tMOS
tMOH
fSSCK
tSSCK
tSSCKW
tSSCKR
tSSCKF
tSIS
-
0.5*SCK
-
ns
-
1.0
-
ns
-
-
-
5
MHz
ns
4*t Clkper
-
2*t Clkper
-
-
ns
-
-
1600
ns
SCK fall time
-
-
1600
ns
MOSI setup to SCK
MOSI hold after SCK
SS setup to SCK
3.0
-
-
-
-
-
-
-
-
-
ns
tSIH
t Clkper
-
ns
tSSS
21
20
-
-
ns
tSSH
SS hold after SCK
MISO setup to SCK
MISO hold after SCK
MISO setup after SS low
MISO hold after SS low
-
ns
tSOS
8.0
13
11
8.0
ns
tSOH
-
ns
tSOSS
tSOSH
-
ns
-
ns
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
4.13
TWI
Figure 4-6.ꢀTWI - Timing Requirements
t
HIGH
t
t
r
of
t
t
LOW
LOW
SCL
t
t
t
HD;DAT
SU;STA
HD;STA
t
SU;DAT
t
SU;STO
SDA
t
BUF
DS40002017C-page 18
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Table 4-19.ꢀTWI - Timing Characteristics
Symbol(1)
Description
Condition
Min.
Typ.
Max.
Unit
fSCL
SCL clock frequency
Max. frequency requires system
clock at 10 MHz, which, in turn,
requires VDD=[2.7, 5.5]V and
T=[-40, 105]°C
0
-
1000
kHz
VIH
Input high voltage
Input low voltage
0.7×VDD
-
-
-
-
V
V
V
VIL
0.3×VDD
0.4×VDD
VHYS
Hysteresis of Schmitt
Trigger inputs
0.1×VDD
VOL
Output low voltage
Iload=20 mA, Fast mode+
-
-
-
-
0.2xVDD
0.4V
V
Iload=3 mA, Normal mode,
VDD>2V
Iload=3 mA, Normal mode,
VDD≤2V
-
-
0.2×VDD
IOL
Low-level output
current
fSCL≤400 kHz, VOL=0.4V
fSCL≤1 MHz, VOL=0.4V
fSCL≤100 kHz
3
-
-
-
-
-
-
-
-
-
-
-
mA
pF
20
-
CB
Capacitive load for
each bus line
-
400
400
550
1000
300
120
300
120
fSCL≤400 kHz
-
fSCL≤1 MHz
-
tR
Rise time for both SDA fSCL≤100 kHz
and SCL
-
ns
ns
fSCL≤400 kHz
20
-
fSCL≤1 MHz
tOF
Output fall time from
VIHmin to VILmax
10 pF <
capacitance of
bus line < 400 pF
fSCL≤400 kHz
fSCL≤1 MHz
20+0.1×CB
20+0.1×CB
tSP
Spikes suppressed by
the input filter
0
-
-
-
-
-
-
-
50
1
ns
µA
pF
Ω
IL
Input current for each 0.1×VDD<VI<0.9×VDD
I/O pin
CI
Capacitance for each
I/O pin
-
10
RP
Value of pull-up
resistor
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
(VDD
VOL(max)) /IOL
-
1000 ns/
(0.8473×CB)
-
300 ns/
(0.8473×CB)
-
120 ns/
(0.8473×CB)
tHD;STA
Hold time (repeated)
Start condition
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
4.0
0.6
-
-
-
-
-
-
µs
0.26
DS40002017C-page 19
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol(1)
Description
Condition
fSCL≤100 kHz
Min.
4.7
1.3
0.5
4.0
0.6
0.26
4.7
0.6
0.26
0
Typ.
Max.
Unit
tLOW
Low period of SCL
Clock
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
µs
fSCL≤400 kHz
fSCL≤1 MHz
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
fSCL≤100 kHz
fSCL≤400 kHz
fSCL≤1 MHz
-
-
tHIGH
High period of SCL
Clock
-
µs
µs
µs
ns
µs
µs
-
-
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
tBUF
Setup time for a
repeated Start
condition
-
-
-
Data hold time
3.45
0
0.9
0
0.45
Data setup time
250
100
50
-
-
-
-
-
-
-
-
-
Setup time for Stop
condition
4
0.6
0.26
4.7
1.3
0.5
Bus free time between fSCL≤100 kHz
a Stop and Start
fSCL≤400 kHz
condition
fSCL≤1 MHz
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
4.14
VREF
Table 4-20.ꢀInternal Voltage Reference Characteristics
Symbol(1)
tstart
Description
Min.
-
Typ.
Max.
-
Unit
Start-up time
25
-
µs
V
VDD
Power supply voltage range for 0V55
Power supply voltage range for 1V1
Power supply voltage range for 1V5
Power supply voltage range for 2V5
Power supply voltage range for 4V3
1.8
1.8
1.8
3.0
4.8
5.5
5.5
5.5
5.5
5.5
-
-
-
-
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
DS40002017C-page 20
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Table 4-21.ꢀADC Internal Voltage Reference Characteristics(1)
Symbol(2)
1V1
Description
Condition
Min.
Typ.
Max.
Unit
Internal reference voltage
VDD=[1.8V, 5.5V]
T=[0 - 105]°C
-2.0
2.0
%
0V55
1V5
2V5
4V3
Internal reference voltage
Internal reference voltage
VDD=[1.8V, 5.5V]
T=[0 - 105]°C
-3.0
-5.0
3.0
5.0
0V55
1V1
1V5
2V5
4V3
VDD=[1.8V, 5.5V]
T=[-40 - 125]°C
Note:ꢀ
1. These values are based on characterization and not covered by production test limits.
2. The symbols xxxx refer to the respective values of the ADC0REFSEL bit field in the VREF.CTRLA register.
Table 4-22.ꢀAC Internal Voltage Reference Characteristics(1)
Symbol(2)
Description
Condition
Min.
Typ.
Max.
Unit
0V55
Internal reference voltage
VDD=[1.8V, 5.5V]
T=[0 - 105]°C
-3.0
3.0
%
1V1
1V5
2V5
0V55
1V1
1V5
2V5
4V3
Internal reference voltage
VDD=[1.8V, 5.5V]
T=[-40 - 125]°C
-5.0
5.0
Note:ꢀ
1. These values are based on characterization and not covered by production test limits.
2. The symbols xxxx refer to the respective values of the AC0REFSEL bit field in the VREF.CTRLA register.
4.15
ADC
4.15.1 Internal Reference Characteristics
Operating conditions:
•
•
•
•
•
•
VDD = 1.8 to 5.5V
Temperature = -40°C to 125°C
DUTYCYC = 25%
CLKADC = 13 * fADC
SAMPCAP is 10 pF for 0.55V reference, while it is set to 5 pF for VREF≥1.1V
Applies for all allowed combinations of VREF selections and Sample Rates unless otherwise noted
DS40002017C-page 21
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
Table 4-23.ꢀPower Supply, Reference, and Input Range
Symbol
VDD
Description
Supply voltage
Conditions
CLKADC ≤1.5 MHz
Min.
1.8
2.7
0.55
1.1
1.8
-
Typ.
Max.
5.5
Unit
-
-
-
V
CLKADC >1.5 MHz
5.5
VREF
Reference voltage
Input capacitance
REFSEL = Internal reference
REFSEL = External reference
REFSEL = VDD
VDD-0.5
VDD
5.5
V
-
5
10
-
CIN
SAMPCAP=5 pF
-
pF
SAMPCAP=10 pF
-
-
VIN
Input voltage range
Input bandwidth
0
VREF
57.5
V
IBAND
1.1V≤VREF
-
-
kHz
Table 4-24.ꢀClock and Timing Characteristics(1)
Symbol
Description
Sample rate
Conditions
1.1V≤VREF
Min. Typ. Max.
Unit
fADC
15
15
-
-
115
150
20
ksps
1.1V≤VREF (8-bit resolution)
VREF=0.55V (10 bits)
7.5
100
200
200
2
-
CLKADC Clock frequency
VREF=0.55V (10 bits)
-
260
1500
2000
33
kHz
1.1V≤VREF (10 bits)
-
1.1V≤VREF (8-bit resolution)
-
Ts
Sampling time
2
-
CLKADC cycles
TCONV
TSTART
Conversion time (latency)
Start-up time
Sampling time = 2 CLKADC
Internal VREF
8.7
-
50
µs
µs
22
-
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
Table 4-25.ꢀAccuracy Characteristics Internal Reference(2)
Symbol
Res
Description
Conditions
Min.
Typ.
10
Max.
Unit
bit
Resolution
-
-
-
-
INL
Integral Non-
linearity
REFSEL =
INTERNAL
fADC=7.7 ksps
1.0
LSB
VREF=0.55V
REFSEL =
fADC=15 ksps
-
1.0
-
INTERNAL or VDD
REFSEL =
INTERNAL or VDD
fADC=77 ksps
fADC=115 ksps
-
-
1.0
1.2
-
-
1.1V≤VREF
DS40002017C-page 22
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Conditions
fADC=7.7 ksps
Min.
Typ.
Max.
Unit
DNL(1)
Differential Non- REFSEL =
-
0.6
-
LSB
linearity
INTERNAL
VREF = 0.55V
REFSEL =
INTERNAL
fADC=15 ksps
fADC=15 ksps
fADC=77 ksps
fADC=115 ksps
fADC=115 ksps
-
-
-
-
0.4
0.4
0.4
0.5
-
-
-
-
VREF = 1.1V
REFSEL =
INTERNAL or VDD
1.5V≤VREF
REFSEL =
INTERNAL or VDD
1.1V≤VREF
REFSEL =
INTERNAL
1.1V≤VREF
REFSEL = VDD
1.8V≤VREF
-
-
0.9
-
-
EABS
EGAIN
EOFF
Absolute
accuracy
REFSEL =
INTERNAL
T=[0-105]°C
<10
LSB
VDD = [1.8V-3.6V]
VDD = [1.8V-3.6V]
VREF = 1.1V
-
-
-
<15
2.5
-
-
-
REFSEL = VDD
REFSEL =
INTERNAL
<35
Gain error
REFSEL =
INTERNAL
T=[0-105]°C
-
±15
-
LSB
VDD = [1.8V-3.6V]
VDD = [1.8V-3.6V]
VREF = 1.1V
-
-
-
±20
2
-
-
-
REFSEL = VDD
REFSEL =
INTERNAL
±35
Offset error
REFSEL =
INTERNAL
-
-
-1
-
-
LSB
LSB
VREF = 0.55V
REFSEL =
INTERNAL
-0.5
1.1V ≤ VREF
Note:ꢀ
1. A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing codes.
2. These parameters are for design guidance only and are not production tested.
3. Reference setting and fADC must fulfill the specification in “Clock and Timing Characteristics” and “Power
Supply, Reference, and Input Range” tables.
DS40002017C-page 23
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
4.15.2 External Reference Characteristics
Operating conditions:
•
•
•
•
•
VDD = 1.8 to 5.5V
Temperature = -40°C to 125°C
DUTYCYC = 25%
CLKADC = 13 * fADC
SAMPCAP is 5 pF
The accuracy characteristics numbers are based on the characterization of the following input reference levels and
VDD ranges:
•
•
•
•
Vref = 1.8V, VDD = 1.8 to 5.5V
Vref = 2.6V, VDD = 2.7 to 5.5V
Vref = 4.096V, VDD = 4.5 to 5.5V
Vref = 4.3V, VDD = 4.5 to 5.5V
Table 4-26.ꢀADC Accuracy Characteristics External Reference(2)
Symbol
Res
Description
Conditions
Min.
Typ.
10
0.9
0.9
1.2
0.2
0.4
0.8
2
Max.
Unit
bit
Resolution
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
INL
Integral Non-
linearity
fADC=15 ksps
LSB
fADC=77 ksps
fADC=115 ksps
fADC=15 ksps
fADC=77 ksps
fADC=115 ksps
fADC=15 ksps
fADC=77 ksps
fADC=115 ksps
fADC=15 ksps
fADC=77 ksps
fADC=115 ksps
DNL(1)
EABS
EGAIN
Differential Non-
linearity
LSB
LSB
LSB
LSB
Absolute
accuracy
2
2
Gain error
2
2
2
EOFF
Offset error
-0.5
Note:ꢀ
1. A DNL error of less than or equal to 1 LSB ensures a monotonic transfer function with no missing codes.
2. These parameters are for design guidance only and are not production tested.
4.16
AC
Table 4-27.ꢀAnalog Comparator Characteristics, Low-Power Mode Disabled
Symbol
VIN
CIN
Description
Input voltage
Input pin capacitance
Condition
Min.
Typ.
-
Max.
Unit
V
-0.2
VDD
PD1 to PD6
PD7
-
-
3.5
14
-
-
pF
DS40002017C-page 24
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
...........continued
Symbol
Description
Condition
0.7V<VIN<(VDD-0.7V)
VIN=[-0.2V, VDD
Min.
Typ.
±5
±20
5
Max.
Unit
VOFF
Input offset voltage
-20
+20
mV
]
-40
+40
IL
Input leakage current
Start-up time
-
-
-
-
-
-
-
-
-
-
-
-
-
-
nA
µs
TSTART
VHYS
1.3
0
Hysteresis
HYSMODE=0x0
mV
HYSMODE=0x1
10
25
50
50
HYSMODE=0x2
HYSMODE=0x3
tPD
Propagation delay
25 mV Overdrive, VDD≥2.7V
ns
Table 4-28.ꢀAnalog Comparator Characteristics, Low-Power Mode Enabled
Symbol
VIN
Description
Input voltage
Condition
Min.
Typ.
-
Max.
Unit
V
-0.2
VDD
CIN
Input pin capacitance
PD1 to PD6
PD7
-
3.5
14
±10
±30
5
-
pF
-
-
VOFF
Input offset voltage
0.7V<VIN<(VDD-0.7V)
VIN=[0V, VDD
-30
+30
mV
]
-50
+50
IL
Input leakage current
Start-up time
-
-
-
-
-
-
-
-
-
-
-
-
-
-
nA
µs
TSTART
VHYS
1.3
0
Hysteresis
HYSMODE=0x0
mV
HYSMODE=0x1
10
25
50
150
HYSMODE=0x2
HYSMODE=0x3
tPD
Propagation delay
25 mV overdrive, VDD≥2.7V
ns
4.17
UPDI Timing
UPDI Enable Sequence (1)
Symbol
Description
Min.
Max.
Unit
µs
TRES
TUPDI
TDeb0
TDebZ
Duration of Handshake/Break on RESET
10
10
200
200
1
Duration of UPDI.txd=0
µs
Duration of Debugger.txd=0
Duration of Debugger.txd=z
0.2
200
µs
14000
µs
Note:ꢀ
1. These parameters are for design guidance only and are not production tested.
DS40002017C-page 25
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Electrical Characteristics
4.18
Programming Time
See the table below for typical programming times for Flash and EEPROM.
Table 4-29.ꢀProgramming Times
Symbol
Typical Programming Time
7 CLK_CPU cycles
Page Buffer Clear
Page Write
2 ms
2 ms
4 ms
4 ms
4 ms
Page Erase
Page Erase-Write
Chip Erase
EEPROM Erase
DS40002017C-page 26
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
5.
Typical Characteristics
5.1
Power Consumption
5.1.1
Supply Currents in Active Mode
Figure 5-1.ꢀ Active Supply Current vs. Frequency (1-20 MHz) at T=25°C
VDD [V]
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1.8
2.2
2.7
3
3.6
4.2
5
5.5
0
2
4
6
8
10
12
14
16
18
20
Frequency [MHz]
Figure 5-2.ꢀ Active Supply Current vs. Frequency [0.1, 1.0] MHz at T=25°C
VDD [V]
600
550
500
450
400
350
300
250
200
150
100
50
1.8
2.2
2.7
3
3.6
4.2
5
5.5
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Frequency [MHz]
DS40002017C-page 27
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-3.ꢀ Active Supply Current vs. Temperature (f=20 MHz OSC20M)
VDD [V]
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
4.5
5
5.5
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
Figure 5-4.ꢀ Active Supply Current vs. VDD (f=[1.25, 20] MHz OSC20M) at T=25°C
Frequency [MHz]
12.0
11.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1.25
2.5
5
10
20
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 28
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-5.ꢀActive Supply Current vs. VDD (f=32.768 kHz OSCULP32K)
Temperature [°C]
32
28
24
20
16
12
8
-40
-20
0
25
70
85
105
125
4
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
5.1.2
Supply Currents in Idle Mode
Figure 5-6.ꢀ Idle Supply Current vs. Frequency (1-20 MHz) at T=25°C
VDD [V]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.8
2.2
2.7
3
3.6
4.2
5
5.5
0
2
4
6
8
10
12
14
16
18
20
Frequency [MHz]
DS40002017C-page 29
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-7.ꢀ Idle Supply Current vs. Low Frequency (0.1-1.0 MHz) at T=25°C
VDD [V]
250
225
200
175
150
125
100
75
1.8
2.2
2.7
3
3.6
4.2
5
5.5
50
25
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Frequency [MHz]
Figure 5-8.ꢀ Idle Supply Current vs. Temperature (f=20 MHz OSC20M)
VDD [V]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
4.5
5
5.5
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 30
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-9.ꢀ Idle Supply Current vs. VDD (f=32.768 kHz OSCULP32K)
Temperature [°C]
20
18
16
14
12
10
8
-40
-20
0
25
70
85
105
125
6
4
2
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
5.1.3
Supply Currents in Power-Down Mode
Figure 5-10.ꢀ Power-Down Mode Supply Current vs. Temperature (all functions disabled)
VDD [V]
8.0
1.8
2.2
7.0
2.7
3
6.0
5.0
4.0
3.0
2.0
1.0
0.0
3.6
4.2
5
5.5
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 31
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-11.ꢀ Power-Down Mode Supply Current vs. VDD (all functions disabled)
Temperature [°C]
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
Figure 5-12.ꢀ Power-Down Mode Supply Current vs. VDD (all functions disabled)
Temperature [°C]
8.0
-40
-20
0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
25
70
85
105
125
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 32
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
5.1.4
Supply Currents in Standby Mode
Figure 5-13.ꢀ Standby Mode Supply Current vs. VDD (RTC running with internal OSCULP32K)
Temperature [°C]
10.0
-40
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
Figure 5-14.ꢀ Standby Mode Supply Current vs. VDD (Sampled BOD running at 125 Hz)
Temperature [°C]
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 33
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-15.ꢀ Standby Mode Supply Current vs. VDD (Sampled BOD running at 1 kHz)
Temperature [°C]
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
5.1.5
Power-on Supply Currents
Figure 5-16.ꢀPower-on Supply Current vs. VDD (BOD enabled at 4.3V level)
Temperature [°C]
400
360
320
280
240
200
160
120
80
-40
-20
0
25
70
85
105
125
40
0
0.0
0.5
1.0
1.5
2.0
Vdd [V]
2.5
3.0
3.5
4.0
4.5
DS40002017C-page 34
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
5.2
GPIO
GPIO Input Characteristics
Figure 5-17.ꢀI/O Pin Input Hysteresis vs. VDD
Temperature[°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
Figure 5-18.ꢀI/O Pin Input Threshold Voltage vs. VDD (T=25°C)
Treshold
75
70
65
60
55
50
45
40
35
30
25
Vih
Vil
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 35
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-19.ꢀI/O Pin Input Threshold Voltage vs. VDD (VIH)
Temperature[°C]
75
70
65
60
55
50
45
40
35
30
25
-40
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
Figure 5-20.ꢀI/O Pin Input Threshold Voltage vs. VDD (VIL)
Temperature[°C]
75
70
65
60
55
50
45
40
35
30
25
-40
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 36
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
GPIO Output Characteristics
Figure 5-21.ꢀI/O Pin Output Voltage vs. Sink Current (VDD=1.8V)
Temperature[°C]
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-40
-20
0
25
70
85
105
125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Sink current [mA]
Figure 5-22.ꢀI/O Pin Output Voltage vs. Sink Current (VDD=3.0V)
Temperature [°C]
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-40
-20
0
25
70
85
105
125
0
1
2
3
4
5
6
7
8
9
10
Sink current [mA]
DS40002017C-page 37
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-23.ꢀI/O Pin Output Voltage vs. Sink Current (VDD=5.0V)
Temperature [°C]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-40
-20
0
25
70
85
105
125
0
2
4
6
8
10
12
14
16
18
20
Sink current [mA]
Figure 5-24.ꢀI/O Pin Output Voltage vs. Sink Current (T=25°C)
Vdd [V]
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.8
2
2.2
3
4
5
0
2
4
6
8
10
12
14
16
18
20
Sink current [mA]
DS40002017C-page 38
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-25.ꢀI/O Pin Output Voltage vs. Source Current (VDD=1.8V)
Temperature [°C]
1.80
1.75
1.70
1.65
1.60
1.55
1.50
1.45
1.40
1.35
1.30
-40
-20
0
25
70
85
105
125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Source current [mA]
Figure 5-26.ꢀI/O Pin Output Voltage vs. Source Current (VDD=3.0V)
Temperature [°C]
3.0
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
-40
-20
0
25
70
85
105
125
0
1
2
3
4
5
6
7
8
9
10
Source current [mA]
DS40002017C-page 39
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-27.ꢀI/O Pin Output Voltage vs. Source Current (VDD=5.0V)
Temperature [°C]
5.0
4.9
4.8
4.7
4.6
4.5
4.4
4.3
4.2
4.1
4.0
-40
-20
0
25
70
85
105
125
0
2
4
6
8
10
12
14
16
18
20
Source current [mA]
Figure 5-28.ꢀI/O Pin Output Voltage vs. Source Current (T=25°C)
Vdd [V]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.8
2
2.2
3
4
5
0
2
4
6
8
10
12
14
16
18
20
Source current [mA]
DS40002017C-page 40
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
GPIO Pull-Up Characteristics
Figure 5-29.ꢀI/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=1.8V)
Temperature [°C]
2.0
-40
-20
0
1.8
1.5
1.3
1.0
0.8
0.5
0.3
0.0
25
70
85
105
125
0
5
10
15
20
25
30
35
40
45
50
Pull-up resistor current [µA]
Figure 5-30.ꢀI/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=3.0V)
Temperature [°C]
3.0
-40
-20
0
2.8
2.5
2.3
2.0
1.8
1.5
1.3
1.0
25
70
85
105
125
0
5
10
15
20
25
30
35
40
45
50
Pull-up resistor current [µA]
DS40002017C-page 41
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-31.ꢀI/O Pin Pull-Up Resistor Current vs. Input Voltage (VDD=5.0V)
Temperature [°C]
5.0
4.8
4.5
4.3
4.0
3.8
3.5
3.3
3.0
-40
-20
0
25
70
85
105
125
0
5
10
15
20
25
30
35
40
45
50
Pull-up resistor current [µA]
5.3
VREF Characteristics
Figure 5-32.ꢀInternal 0.55V Reference vs. Temperature
Vdd [V]
1.0
0.8
2
3
5
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 42
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-33.ꢀInternal 1.1V Reference vs. Temperature
Vdd [V]
1.0
0.8
2
3
5
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
Figure 5-34.ꢀInternal 2.5V Reference vs. Temperature
Vdd [V]
1.0
0.8
3
5
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 43
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-35.ꢀInternal 4.3V Reference vs. Temperature
Vdd [V]
5
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
5.4
BOD Characteristics
BOD Current vs. VDD
Figure 5-36.ꢀBOD Current vs. VDD (Continuous Mode Enabled)
Temperature [°C]
50
45
40
35
30
25
20
15
10
5
-40
0
25
70
85
105
125
0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 44
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-37.ꢀBOD Current vs. VDD (Sampled BOD at 125 Hz)
Temperature [°C]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
Figure 5-38.ꢀBOD Current vs. VDD (Sampled BOD at 1 kHz)
Temperature [°C]
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 45
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
BOD Threshold vs. Temperature
Figure 5-39.ꢀBOD Threshold vs. Temperature (Level 1.8V)
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
Falling VDD
Rising VDD
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
Figure 5-40.ꢀBOD Threshold vs. Temperature (Level 2.6V)
Falling VDD
Rising VDD
2.74
2.72
2.70
2.68
2.66
2.64
2.62
2.60
2.58
2.56
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 46
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-41.ꢀBOD Threshold vs. Temperature (Level 4.3V)
Falling VDD
Rising VDD
4.34
4.32
4.30
4.28
4.26
4.24
4.22
4.20
4.18
4.16
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
5.5
ADC Characteristics
Figure 5-42.ꢀAbsolute Accuracy vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
Vref [V]
10.0
1.1
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1.5
2.5
4.3
VDD
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 47
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-43.ꢀAbsolute Accuracy vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
Temperature [°C]
10.0
-40
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
25
85
105
1.1
1.5
2.5
4.3
VDD
Vref [V]
Figure 5-44.ꢀDNL Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
Vref [V]
2.0
1.1
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.5
2.5
4.3
VDD
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 48
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-45.ꢀDNL vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
Temperature [°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
25
85
105
1.1
1.5
2.5
4.3
VDD
Vref [V]
Figure 5-46.ꢀGain Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
Vref [V]
8.0
1.1
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
1.5
2.5
4.3
VDD
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 49
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-47.ꢀGain Error vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
Temperature [°C]
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
25
85
105
1.1
1.5
2.5
4.3
VDD
Vref [V]
Figure 5-48.ꢀINL vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
Vref [V]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.1
1.5
2.5
4.3
VDD
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 50
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-49.ꢀINL vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
Temperature [°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
25
85
105
1.1
1.5
2.5
4.3
VDD
Vref [V]
Figure 5-50.ꢀOffset Error vs. VDD (fADC=115 ksps) at T=25°C, REFSEL = Internal Reference
Vref [V]
2.0
1.1
1.6
1.2
1.5
2.5
4.3
VDD
0.8
0.4
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 51
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-51.ꢀOffset Error vs. Vref (VDD=5.0V, fADC=115 ksps), REFSEL = Internal Reference
Temperature [°C]
2.0
1.6
-40
25
85
1.2
105
0.8
0.4
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
1.1
1.5
2.5
4.3
VDD
Vref [V]
Figure 5-52.ꢀAbsolute Accuracy vs. VDD (fADC=115 ksps, T=25°C), REFSEL = External Reference
Vref [V]
10.0
1.8
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
2.6
4.096
4.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 52
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-53.ꢀAbsolute Accuracy vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)
Temperature [°C]
10.0
-40
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
25
85
105
1.8
2.6
4.096
4.3
Vref [V]
Figure 5-54.ꢀDNL vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)
Vref [V]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.8
2.6
4.096
4.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 53
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-55.ꢀDNL vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)
Temperature [°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
25
85
105
1.8
2.6
4.096
4.3
Vref [V]
Figure 5-56.ꢀGain vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)
Vref [V]
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
1.8
2.6
4.096
4.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 54
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-57.ꢀGain vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)
Temperature [°C]
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
25
85
105
1.8
2.6
4.096
4.3
Vref [V]
Figure 5-58.ꢀINL vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)
Vref [V]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.8
2.6
4.096
4.3
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 55
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-59.ꢀINL vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)
Temperature [°C]
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
25
85
105
1.8
2.6
4.096
4.3
Vref [V]
Figure 5-60.ꢀOffset vs. VDD (fADC=115 ksps, T=25°C, REFSEL = External Reference)
Vref [V]
2.0
1.6
1.8
2.6
4.096
4.3
1.2
0.8
0.4
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 56
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-61.ꢀOffset vs. VREF (VDD=5.0V, fADC=115 ksps, REFSEL = External Reference)
Temperature [°C]
2.0
1.6
-40
25
85
1.2
105
0.8
0.4
0.0
-0.4
-0.8
-1.2
-1.6
-2.0
1.8
2.6
4.096
4.3
Vref [V]
5.6
AC Characteristics
Figure 5-62.ꢀHysteresis vs. VCM - 10 mV (VDD=5V)
Temperature [°C]
20
18
16
14
12
10
8
-40
-20
0
25
55
85
105
125
6
4
2
0
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vcommon mode [V]
DS40002017C-page 57
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-63.ꢀHysteresis vs. VCM - 10 mV to 50 mV (VDD=5V, T=25°C)
HYSMODE
80
72
64
56
48
40
32
24
16
8
10mV
25mV
50mV
0
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vcommon mode [V]
Figure 5-64.ꢀOffset vs. VCM - 10 mV (VDD=5V)
Temperature [°C]
10.0
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-40
-20
0
25
55
85
105
125
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vcommon mode [V]
DS40002017C-page 58
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-65.ꢀOffset vs. VCM - 10 mV to 50 mV (VDD=5V, T=25°C)
HYSMODE
10
9
8
7
6
5
4
3
2
1
0
10mV
25mV
50mV
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vcommon mode [V]
5.7
OSC20M Characteristics
Figure 5-66.ꢀOSC20M Internal Oscillator: Calibration Stepsize vs. Calibration Value (VDD=3V)
Temperature [°C]
1.4
-40
-20
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
25
70
85
105
125
0
16
32
48
64
80
96
112
128
OSCCAL [x1]
DS40002017C-page 59
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-67.ꢀOSC20M Internal Oscillator: Frequency vs. Calibration Value (VDD=3V)
Temperature [°C]
32
30
28
26
24
22
20
18
16
14
12
10
-40
-20
0
25
70
85
105
125
0
16
32
48
64
80
96
112
128
OSCCAL [x1]
Figure 5-68.ꢀOSC20M Internal Oscillator: Frequency vs. Temperature
Vdd [V]
20.5
20.4
20.3
20.2
20.1
20.0
19.9
19.8
19.7
19.6
19.5
1.8
2.2
2.7
3
3.6
5
5.5
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 60
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-69.ꢀOSC20M Internal Oscillator: Frequency vs. VDD
Temperature [°C]
20.5
20.4
20.3
20.2
20.1
20.0
19.9
19.8
19.7
19.6
19.5
-40
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
5.8
OSCULP32K Characteristics
Figure 5-70.ꢀOSCULP32K Internal Oscillator Frequency vs. Temperature
Vdd [V]
40.0
39.0
38.0
37.0
36.0
35.0
34.0
33.0
32.0
31.0
30.0
1.8
2.2
2.7
3
3.6
5
5.5
-40
-20
0
20
40
60
80
100
120
Temperature [°C]
DS40002017C-page 61
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Typical Characteristics
Figure 5-71.ꢀOSCULP32K Internal Oscillator Frequency vs. VDD
Temperature [°C]
40.0
39.0
38.0
37.0
36.0
35.0
34.0
33.0
32.0
31.0
30.0
-40
-20
0
25
70
85
105
125
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Vdd [V]
DS40002017C-page 62
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Ordering Information
6.
Ordering Information
•
Available ordering options can be found by:
– Clicking on one of the following product page links:
•
•
•
•
ATmega808 Product Page
ATmega1608 Product Page
ATmega3208 Product Page
ATmega4808 Product Page
– Searching by product name at microchipDIRECT.com
– Contacting your local sales representative
Table 6-1.ꢀAvailable Product Numbers
Ordering Code(1)
ATmega808-MUR
ATmega808-MFR
ATmega808-MU
ATmega808-MF
Flash/SRAM Pin Count Package Type(2)
Carrier Type
Temperature Range
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
8 KB/1 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
16 KB/2 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
48 KB/6 KB
32 KB/4 KB
32 KB/4 KB
32 KB/4 KB
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
32
VQFN
VQFN
VQFN
VQFN
TQFP
TQFP
TQFP
TQFP
VQFN
VQFN
VQFN
VQFN
TQFP
TQFP
TQFP
TQFP
VQFN
VQFN
VQFN
VQFN
TQFP
TQFP
TQFP
TQFP
VQFN
VQFN
VQFN
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
ATmega808-AUR
ATmega808-AFR
ATmega808-AU
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
ATmega808-AF
ATmega1608-MUR
ATmega1608-MFR
ATmega1608-MU
ATmega1608-MF
ATmega1608-AUR
ATmega1608-AFR
ATmega1608-AU
ATmega1608-AF
ATmega4808-MUR
ATmega4808-MFR
ATmega4808-MU
ATmega4808-MF
ATmega4808-AUR
ATmega4808-AFR
ATmega4808-AU
ATmega4808-AF
ATmega3208-MUR
ATmega3208-MFR
ATmega3208-MU
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
-40°C to +85°C
DS40002017C-page 63
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Ordering Information
...........continued
Ordering Code(1)
Flash/SRAM Pin Count Package Type(2)
Carrier Type
Temperature Range
ATmega3208-MF
ATmega3208-AUR
ATmega3208-AFR
ATmega3208-AU
ATmega3208-AF
32 KB/4 KB
32 KB/4 KB
32 KB/4 KB
32 KB/4 KB
32 KB/4 KB
32
32
32
32
32
VQFN
TQFP
TQFP
TQFP
TQFP
Tray
-40°C to +125°C
Tape and Reel -40°C to +85°C
Tape and Reel -40°C to +125°C
Tray
Tray
-40°C to +85°C
-40°C to +125°C
Note:ꢀ
1. Pb-free packaging complies to the European Directive for Restriction of Hazardous Substances (RoHS
directive). Also Halide free and fully Green.
2. Package outline drawings can be found in the Package Drawings section.
Figure 6-1.ꢀProduct Identification System
To order or obtain information, for example on pricing or delivery, refer to the factory or the listed sales office.
AT mega 4809 - MFR
Carrier Type
AVR product family
R=Tape & Reel
Blank=Tube or Tray
Flash size in KB
Temperature Range
Series name
Pin count
F=-40°C to +125°C (extended)
U=-40°C to +85°C (industrial)
Package Type
9=48 pins (PDIP: 40 pins)
A=TQFP
8=32 pins (SSOP: 28 pins)
M=QFN (UQFN/VQFN)
P=PDIP
X=SSOP
Note:ꢀ Tape and Reel identifier only appears in the catalog part number description. This identifier is used for
ordering purposes. Check with your Microchip Sales Office for package availability with the Tape and Reel option.
DS40002017C-page 64
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Online Package Drawings
7.
Online Package Drawings
For the most recent package drawings:
1. Go to http://www.microchip.com/packaging.
2. Go to the package type specific page, for example VQFN.
3. Search for either Drawing Number or Style to find the most recent package drawings.
Table 7-1.ꢀDrawing Numbers
Package Type
Drawing Number
C04-21395
C04-074
Style
VQFN32
TQFP32
UBB
PT
DS40002017C-page 65
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
8.
Package Drawings
8.1
32-Pin TQFP
32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
2.00 mm Footprint; Also Atmel Legacy Global Package Code AUT
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
D
32X TIPS
0.20 C A-B D
A
B
E1
E
A
A
N
NOTE 1
1
2
4X
0.20 H A-B D
32X b
0.20
C A-B D
e
TOP VIEW
0.10 C
32X
C
A2
A1
A
SEATING
PLANE
0.10 C
SIDE VIEW
Microchip Technology Drawing C04-074 Rev C Sheet 1 of 2
DS40002017C-page 66
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
2.00 mm Footprint; Also Atmel Legacy Global Package Code AUT
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
H
L
(L1)
SECTION A-A
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
Lead Pitch
N
e
32
0.80 BSC
Overall Height
Standoff
Molded Package Thickness
Foot Length
A
A1
A2
L
-
-
-
1.20
0.15
1.05
0.75
0.05
0.95
0.45
1.00
0.60
Footprint
Foot Angle
L1
1.00 REF
-
0°
7°
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Width
E
D
E1
D1
b
9.00 BSC
9.00 BSC
7.00 BSC
7.00 BSC
0.37
0.30
11°
0.45
13°
Mold Draft Angle Top
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-074 Rev C Sheet 2 of 2
DS40002017C-page 67
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
32-Lead Thin Plastic Quad Flatpack (PT) - 7x7 mm Body [TQFP]
2.00 mm Footprint; Also Atmel Legacy Global Package Code AUT
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
G
C2
Y
X
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
0.80 BSC
8.40
MAX
Contact Pitch
E
C1
C2
X
Contact Pad Spacing
Contact Pad Spacing
Contact Pad Width (Xnn)
8.40
0.55
1.55
Contact Pad Length (Xnn)
Y
Contact Pad to Contact Pad (Xnn)
G
0.25
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2074 Rev C
Table 8-1.ꢀDevice and Package Maximum Weight
100
mg
DS40002017C-page 68
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
Table 8-2.ꢀPackage Characteristics
Moisture Sensitivity Level
MSL3
Table 8-3.ꢀPackage Reference
JEDEC Drawing Reference
J-STD-609 Material Code
MO-220
e3
Table 8-4.ꢀPackage Code
T5X
DS40002017C-page 69
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
8.2
32-Pin VQFN
32-Lead Very Thin Plastic Quad Flat, No Lead Package (RXB) - 5x5x0.9 mm Body [VQFN]
With 3.1x3.1 mm Exposed Pad; Atmel Legacy Global Package Code ZMF
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
32X
0.08 C
0.10 C
D
A
B
NOTE 1
N
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
A1
0.10 C
(A3)
TOP VIEW
A
0.10
C A B
SEATING
PLANE
C
D2
SIDE VIEW
0.10
C A B
L
E2
e2
2
2
1
NOTE 1
K
N
32X b
SEE
DETAIL A
0.10
0.05
C A B
e
C
BOTTOM VIEW
Microchip Technology Drawing C04-21395-RXB Rev B Sheet 1 of 2
DS40002017C-page 70
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
32-Lead Very Thin Plastic Quad Flat, No Lead Package (RXB) - 5x5x0.9 mm Body [VQFN]
With 3.1x3.1 mm Exposed Pad; Atmel Legacy Global Package Code ZMF
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DETAIL A
ALTERNATE TERMINAL
CONFIGURATIONS
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
Terminal Length
N
e
32
0.50 BSC
0.85
A
A1
A3
D
D2
E
E2
b
L
0.80
0.00
0.90
0.05
0.02
0.203 REF
5.00 BSC
3.10
5.00 BSC
3.10
3.00
3.20
3.00
0.18
0.30
0.20
3.20
0.30
0.50
-
0.25
0.40
-
Terminal-to-Exposed-Pad
K
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21395-RXB Rev B Sheet 2 of 2
DS40002017C-page 71
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
32-Lead Very Thin Plastic Quad Flat, No Lead Package (RXB) - 5x5x0.9 mm Body [VQFN]
With 3.1x3.1 mm Exposed Pad; Atmel Legacy Global Package Code ZMF
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
32
1
2
ØV
G2
C2
Y2
EV
G1
Y1
X1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Contact Pitch
E
0.50 BSC
Center Pad Width
Center Pad Length
Contact Pad Spacing
Contact Pad Spacing
Contact Pad Width (X32)
Contact Pad Length (X32)
Contact Pad to Center Pad (X32)
Contact Pad to Contactr Pad (X28) G2
X2
Y2
C1
C2
X1
3.20
3.20
5.00
5.00
0.30
0.80
Y1
G1
0.20
0.20
Thermal Via Diameter
Thermal Via Pitch
V
EV
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-23395-RXB Rev B
Table 8-5.ꢀDevice and Package Maximum Weight
61
mg
DS40002017C-page 72
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Package Drawings
Table 8-6.ꢀPackage Characteristics
Moisture Sensitivity Level
MSL3
Table 8-7.ꢀPackage Reference
JEDEC Drawing Reference
J-STD-609 Material Code
N/A
e3
Table 8-8.ꢀPackage Code
RXB
DS40002017C-page 73
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Conventions
9.
Conventions
9.1
Memory Size and Type
Table 9-1.ꢀMemory Size and Bit Rate
Symbol
KB
Description
kilobyte (210B = 1024B)
MB
megabyte (220B = 1024 KB)
gigabyte (230B = 1024 MB)
bit (binary ‘0’ or ‘1’)
byte (8 bits)
GB
b
B
1 kbit/s
1 Mbit/s
1 Gbit/s
word
1,000 bit/s rate
1,000,000 bit/s rate
1,000,000,000 bit/s rate
16-bit
9.2
Frequency and Time
Table 9-2.ꢀFrequency and Time
Symbol
kHz
MHz
GHz
ms
Description
1 kHz = 103 Hz = 1,000 Hz
1 MHz = 106 Hz = 1,000,000 Hz
1 GHz = 109 Hz = 1,000,000,000 Hz
1 ms = 10-3s = 0.001s
µs
1 µs = 10-6s = 0.000001s
ns
1 ns = 10-9s = 0.000000001s
DS40002017C-page 74
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Data Sheet Revision History
10.
Data Sheet Revision History
Note:ꢀ The data sheet revision is independent of the die revision and the device variant (last letter of the ordering
number).
10.1
Rev.C - 08/2019
Chapter
Changes
Entire Document
•
•
•
Editorial updates
Features
Added industrial temperature range -40°C to +85°C
Added note about QFN center pad attachment
2. Pinout
6. Ordering Information
•
•
Added table of available product numbers
Updated Product Information System figure
8. Package Drawings
•
Updated TQFP package drawing
10.2
10.3
Rev.B - 03/2019
Chapter
Changes
Entire Document
•
•
Added ATmega808/ATmega1608
Updated Electrical Characteristics section and
Typical Characteristics section
•
Updated package drawings
Rev. A - 02/2018
Initial release.
DS40002017C-page 75
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
The Microchip Website
Microchip provides online support via our website at http://www.microchip.com/. This website is used to make files
and information easily available to customers. Some of the content available includes:
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Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will
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family or development tool of interest.
To register, go to http://www.microchip.com/pcn and follow the registration instructions.
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Users of Microchip products can receive assistance through several channels:
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Distributor or Representative
Local Sales Office
Embedded Solutions Engineer (ESE)
Technical Support
Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to
help customers. A listing of sales offices and locations is included in this document.
Technical support is available through the website at: http://www.microchip.com/support
DS40002017C-page 76
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
AT mega 4809 - MFR
Carrier Type
AVR product family
R=Tape & Reel
Blank=Tube or Tray
Flash size in KB
Temperature Range
Series name
Pin count
F=-40°C to +125°C (extended)
U=-40°C to +85°C (industrial)
Package Type
9=48 pins (PDIP: 40 pins)
A=TQFP
8=32 pins (SSOP: 28 pins)
M=QFN (UQFN/VQFN)
P=PDIP
X=SSOP
Note:ꢀ Tape and Reel identifier only appears in the catalog part number description. This identifier is used for
ordering purposes. Check with your Microchip Sales Office for package availability with the Tape and Reel option.
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today,
when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these
methods, to our knowledge, require using the Microchip products in a manner outside the operating
specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of
intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code
protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection
features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital
Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you
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Information contained in this publication regarding device applications and the like is provided only for your
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Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime,
BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox,
DS40002017C-page 77
Preliminary Datasheet
© 2019 Microchip Technology Inc.
ATmega808/1608/3208/4808 – 32-Pin
KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST,
MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer,
QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control,
HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus,
ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider,
Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom,
CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP,
INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM,
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ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
©
2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-4906-5
Quality Management System
For information regarding Microchip’s Quality Management Systems, please visit http://www.microchip.com/quality.
DS40002017C-page 78
Preliminary Datasheet
© 2019 Microchip Technology Inc.
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Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS40002017C-page 79
Preliminary Datasheet
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