ATSAM3S1CB-AUR_技术文档

AT91SAM ARM-based Flash MCU

SAM3S

SUMMARY

Description

Atmel's SAM3S series is a member of a family of 32-bit Flash microcontrollers based on the high performance ARM

Cortex-M3 processor. It operates at a maximum speed of 64 MHz and features up to 256 Kbytes of Flash and up to 48

Kbytes of SRAM. The peripheral set includes a Full Speed USB Device port with embedded transceiver, a High Speed MCI

for SDIO/SD/MMC, an External Bus Interface featuring a Static Memory Controller providing connection to SRAM,

PSRAM, NOR Flash, LCD Module and NAND Flash, 2x USARTs, 2x UARTs, 2x TWIs, 3x SPI, an I2S, as well as 1 PWM

timer, 6x general-purpose 16-bit timers, an RTC, an ADC, a 12-bit DAC and an analog comparator.

The SAM3S series is ready for capacitive touch thanks to the QTouch library, offering an easy way to implement buttons,

wheels and sliders

The SAM3S device is a medium range general purpose microcontroller with the best ratio in terms of reduced power

consumption, processing power and peripheral set. This enables the SAM3S to sustain a wide range of applications

including consumer, industrial control, and PC peripherals.

It operates from 1.62V to 3.6V and is available in 48-, 64- and 100-pin QFP, 48- and 64-pin QFN, and 100-pin BGA

packages.

The SAM3S series is the ideal migration path from the SAM7S series for applications that require more performance. The

SAM3S series is pin-to-pin compatible with the SAM7S series.

This is a summary document.

The complete document is

available on the Atmel website

at www.atmel.com.

6500ES–ATARM–11-Feb-13

1.

Features

• Core

®

– ARM^®Cortex-M3 revision 2.0 running at up to 64 MHz

– Memory Protection Unit (MPU)

– Thumb^®-2 instruction set

• Pin-to-pin compatible wAithT91SAM7S series (48- and 6v4e-rpsinons)

• Memories

– From 64 to 256 Kebmybteesdded Flash, 128-bit wide acmcemsso,ry accelerator, single plane

– From 16 toKb4y8tes embedded SRAM

– 16 Kbytes ROM with embedded bootloraoduetrines (UART, USB) and IAP routines

– 8-bit Static Memory Controller (SMC): SRAM, PSRAM, NOR andsuNppAoNrDt Flash

– Memory Protection Unit (MPU)

• System

– Embedded voltage regulatfor singlesupply operation

– Power-on-Reset (POR)B, rown-out Detector (BOD) Wanatdchdog for safe operation

– Quartz or ceramic resonator oscillators:

kHz foRr TC odrevice clock

3

to 20powMeHrz wmithain Failure Detection and olopwtionpaol wer 32.768

– High precision 8/12 fMacHtzory trimmed internal RC oscillator with

application trimming accefsosr frequency adjustment

– Slow Clock Internal RC oscillator as perlmowan-peonwt er modedevice clock

– Two PLLs up to 130 dMeHvzicefcolrock andfor USB

– Temperature Sensor

4

MfrHezquednecfyaufoltr device startup. In-

– Up to 22 peripheral DMA (PDC) channels

• Low Power Modes

– Sleep and Backup modes, down to 1.8 µA in Backup mode

– Ultra low poweRr TC

• Peripherals

– USB 2.0Device: 12 Mbps, 2668 FIbFyOt,e up to

8

bidirectional Endpoints. TOrann-sCcheiipver

– Up to US2ARTs with ISO781Ir6D,A^®, RS-485, SPI, Manchester and Modem Mode

– Two 2-wireUARTs

– Up to Tw2o Wire Interface (I2C compatible),

Interface (SDIO/SD Card/MMC)

1

SPSI,yn1chroSneoriuasl Controller (I2S),

1

High Speed MCualtrimd edia

– Up to

6

Three-Channel 16-bit Timer/Counctearptuwreit,h waveform, compare and PWM mode. Quadrature Decoder

Logic and 2-Gbirtay Up/Down Countefror Stepper Motor

– 4-channel 16-bit PWM Cwoitmhplementary Output, Fault Input, 12-bit Dead Time Generatfoorr CMooutonrterControl

– 32-bit Real-time Timer RaTnCd with calendar and alarm features

– Up to 15-channel, 1Msps ADC with differential inputpromgroadmemaabnlde gainstage

– One 2-channel 12-bit 1MDsApCs

– One Analog Comparator fwleixthible input selection, Selectable input hysteresis

– 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU)

– Write Protected Registers

• I/O

– Up to 79 I/O lines with external interrup(tedgcaepaoblrielivtyel sensitivity), debouncinggli,tch filtering and on-die

Series Resistor Termination

– Three 32-biPtarallel Input/Output ControllePrse,ripheral DMA assistPeadrallel Capture Mode

• Packages

– 100-lead LQFP, 14

– 64-lead LQFP, 10

– 48-lead LQFP,

x

14 pimtcmh , 0.5 mm/100-ball TFBGA,

10 pimtcmh , 0.5 mm/64-pad QFN 9xp9itcmh m,0.5 mm

7 pimtcmh , 0.5 mm/48-pad QFN 7xp7itcmhm,0.5 mm

9

xpitc9h m0.m8 , mm

7

x

SAM3S [SUMMARY]

2

6500ES–ATARM–11-Feb-13

1.1

Configuration Summary

The SAM3S microcontrollers differ in memory size, package and features list. Table 1-1 below summarizes the

configurations of the device family

Table 1-1. Configuration Summary

Timer

Counter

Channels

12-bit

DAC

Output

UART/

USARTs

External Bus

Interface

Device

Flash

SRAM

GPIOs

ADC

HSMCI

Package

8-bit data,

4 chip selects,

24-bit address

256 Kbytes

single plane

1 port

4 bits

LQFP100

BGA100

SAM3S4C

48 Kbytes

6

79

2/2⁽¹⁾

15 ch.

2

256 Kbytes

single plane

1 port

4 bits

LQFP64

QFN 64

SAM3S4B

SAM3S4A

48 Kbytes

3

47

34

2/2⁽¹⁾

2/1

10 ch.

8 ch.

2

-

256 Kbytes

single plane

LQFP48

QFN 48

-

8-bit data,

4 chip selects,

24-bit address

128 Kbytes

single plane

1 port

4 bits

LQFP100

BGA100

SAM3S2C

32 Kbytes

6

79

2/2⁽¹⁾

15 ch.

2

128 Kbytes

single plane

1 port

4 bits

LQFP64

QFN 64

SAM3S2B

SAM3S2A

32 Kbytes

3

47

34

2/2⁽¹⁾

2/1

10 ch.

8 ch.

2

-

128 Kbytes

single plane

LQFP48

QFN 48

-

8-bit data,

4 chip selects,

24-bit address

64 Kbytes

single plane

1 port

4 bits

LQFP100

BGA100

SAM3S1C

16 Kbytes

6

79

2/2⁽¹⁾

15 ch.

2

64 Kbytes

single plane

1 port

4 bits

LQFP64

QFN 64

SAM3S1B

SAM3S1A

16 Kbytes

3

47

34

2/2⁽¹⁾

2/1

10 ch.

8 ch.

2

-

64 Kbytes

single plane

LQFP48

QFN 48

-

Note: 1. Full Modem support on USART1.

SAM3S [SUMMARY]

3

6500ES–ATARM–11-Feb-13

2.

SAM3S Block Diagram

Figure 2-1. SAM3S 100-pin Version Block Diagram

SystemController

TS T

Voltage

Regulator

PCK0-PCK2

PLLA

PMC

JTAG & Serial Wire

PLLB

Flash

Unique

Identifier

RC

12/8/4 M

In-Circuit Emulator

24-Bit

SysTick Counter

N

V

I

3-20 MHz

Osc.

XIN

Cortex-M3 Processor

Fmax 64 MHz

XOUT

FLASH

SRAM

ROM

16 KBytes

256 KBytes

128 KBytes

64 KBytes

48 KBytes

32 KBytes

16 KBytes

C

SUPC

MPU

I/D

XIN32

XOUT32

OSC 32k

RC 32k

8 GPBREG

RTT

S

ERASE

4-layer AHB Bus Matrix Fmax 64 MHz

VDDIO

VDDCORE

VDDPLL

RTC

POR

RSTC

NRST

2668

Bytes

FIFO

USB 2.0

Full

Speed

Peripheral

Bridge

DDP

DDM

WDT

SM

PIOA / PIOB / PIOC

D[7:0]

A[0:23]

TWCK0

TWD0

External Bus

Interface

TWI0

TWI1

PDC

TWCK1

TWD1

A21/NANDALE

A22/NANDCLE

NCS0

NAND Flash

Logic

URXD0

UTXD0

UART0

NCS1

NCS2

URXD1

UTXD1

RXD0

TXD0

SCK0

RTS0

CTS0

UART1

NCS3

NRD

Static Memory

Controller

NWE

USART0

NANDOE

NANDWE

NWAIT

PDC

RXD1

TXD1

SCK1

RTS 1

CTS1

DSR1

DTR1

RI1

PDC

PIODC[7:0]

PIODCEN1

PIODCEN2

USART1

PIO

PIODCCLK

PDC

DCD1

TCLK[0:2]

Timer Counter A

TC[0..2]

NPCS0

NPCS1

NPCS2

NPCS3

MISO

PDC

TIOA[0:2]

TIOB[0:2]

SPI

MOSI

SPCK

TCLK[3:5]

Timer Counter B

TC[3..5]

PDC

TF

TK

TD

RD

RK

RF

TIOA[3:5]

TIOB[3:5]

SSC

PWMH[0:3]

PWM

PWML[0:3]

PWMFI0

ADTRG

MCCK

MCCDA

MCDA[0..3]

PDC

High Speed MCI

Temp. Sensor

AD[0..14]

ADC

DAC

Temp Sensor

ADVREF

Analog

ADC

PDC

ADVREF

DAC0

DAC1

DATRG

Comparator

DAC

PDC

CRC Unit

SAM3S [SUMMARY]

4

6500ES–ATARM–11-Feb-13

Figure 2-2. SAM3S 64-pin Version Block Diagram

SystemController

TS T

Voltage

Regulator

PCK0-PCK2

PLLA

PMC

JTAG & Serial Wire

In-Circuit Emulator

PLLB

Flash

Unique

Identifier

RC

12/8/4 M

24-Bit

SysTick Counter

N

V

I

Cortex-M3 Processor

Fmax 64 MHz

3-20 MHz

Osc.

XIN

XOUT

FLASH

SRAM

256 KBytes

128 KBytes

64 KBytes

48 KBytes

32 KBytes

16 KBytes

ROM

16 KBytes

C

SUPC

MPU

I/D

XIN32

XOUT32

OSC 32K

RC 32k

8 GPBREG

RTT

S

ERASE

4-layer AHB Bus Matrix Fmax 64 MHz

VDDIO

VDDCORE

VDDPLL

RTC

POR

USB 2.0

Full

2668

Bytes

FIFO

Peripheral

Bridge

DDP

DDM

RSTC

NRST

Speed

WDT

SM

PIOA / PIOB

TWCK0

TWD0

TWI0

TWI1

PDC

PIODC[7:0]

TWCK1

TWD1

PIODCEN1

PIODCEN2

PIODCCLK

PIO

SPI

SSC

URXD0

UTXD0

UART0

UART1

URXD1

UTXD1

RXD0

TXD0

SCK0

RTS0

CTS0

NPCS0

NPCS1

NPCS2

PDC

USART0

NPCS3

PDC

MISO

MOSI

SPCK

RXD1

TXD1

SCK1

RTS1

CTS1

DSR1

DTR1

RI1

TF

TK

TD

RD

PDC

USART1

PDC

DCD1

RK

RF

TCLK[0:2]

TIOA[0:2]

TIOB[0:2]

Timer Counter A

TC[0..2]

PDC

MCCK

MCCDA

High Speed MCI

PWMH[0:3]

PWML[0:3]

PWMFI0

PWM

MCDA[0..3]

PDC

ADC

DAC

Temp Sensor

ADVREF

ADTRG

AD[0..9]

Temp. Sensor

Analog

Comparator

ADC

PDC

ADVREF

DAC0

CRC Unit

DAC1

DATRG

DAC

PDC

SAM3S [SUMMARY]

5

6500ES–ATARM–11-Feb-13

Figure 2-3. SAM3S 48-pin Version Block Diagram

SystemController

TST

Voltage

Regulator

PCK0-PCK2

PLLA

PMC

JTAG & Serial Wire

In-Circuit Emulator

PLLB

Flash

Unique

Identifier

RC

12/8/4 M

24-Bit

SysTick Counter

N

V

I

XIN

XOUT

3-20 MHz

Osc.

Cortex-M3 Processor

Fmax 64 MHz

FLASH

SRAM

256 KBytes

128 KBytes

64 KBytes

48 KBytes

32 KBytes

16 KBytes

ROM

16 KBytes

C

SUPC

MPU

I/D

XIN32

OSC

32K

XOUT32

S

RC 32k

8 GPBREG

RTT

ERASE

4-layer AHB Bus Matrix Fmax 64 MHz

VDDIO

RTC

POR

VDDCORE

VDDPLL

USB 2.0

Full

Speed

2668

Bytes

FIFO

Peripheral

Bridge

DDP

DDM

RSTC

WDT

SM

PIOA / PIOB

TWCK0

TWD0

TWI0

TWI1

PDC

NPCS0

NPCS1

NPCS2

PDC

TWCK1

TWD1

NPCS3

SPI

URXD0

UTXD0

MISO

MOSI

SPCK

UART0

URXD1

UTXD1

UART1

PDC

RXD0

TXD0

SCK0

TF

TK

TD

RD

RK

RF

PDC

USART0

SSC

RTS0

CTS0

PDC

Timer Counter A

TC[0..2]

TCLK[0:2]

TIOA[0:2]

TIOB[0:2]

Analog

ADC

Comparator

Temp Sensor

ADVREF

PWMH[0:3]

PWML[0:3]

PWMFI0

PWM

PDC

CRC Unit

ADTRG

AD[0..7]

Temp. Sensor

ADC

PDC

ADVREF

SAM3S [SUMMARY]

6

6500ES–ATARM–11-Feb-13

3.

Signal Description

Table 3-1 gives details on the signal names classified by peripheral.

Table 3-1. Signal Description List

Active

Level

Voltage

reference Comments

Signal Name

Function

Type

Power Supplies

Peripherals I/O Lines and USB transceiver

Power Supply

VDDIO

VDDIN

Power

1.62V to 3.6V

1.8V to 3.6V⁽⁴⁾

Voltage Regulator Input, ADC, DAC and

Analog Comparator Power Supply

VDDOUT

VDDPLL

Voltage Regulator Output

Power

1.8V Output

Oscillator and PLL Power Supply

1.62 V to 1.95V

1.62V to 1.95V

Power the core, the embedded memories

and the peripherals

VDDCORE

GND

Power

Ground

Clocks, Oscillators and PLLs

XIN

Main Oscillator Input

Input

Output

Input

Reset State:

- PIO Input

XOUT

XIN32

XOUT32

Main Oscillator Output

- Internal Pull-up disabled

- Schmitt Trigger enabled⁽¹⁾

Slow Clock Oscillator Input

Slow Clock Oscillator Output

Output

VDDIO

Reset State:

- PIO Input

PCK0 - PCK2

Programmable Clock Output

Output

- Internal Pull-up enabled

- Schmitt Trigger enabled⁽¹⁾

Serial Wire/JTAG Debug Port - SWJ-DP

TCK/SWCLK

TDI

Test Clock/Serial Wire Clock

Input

Reset State:

Test Data In

- SWJ-DP Mode

Test Data Out / Trace Asynchronous Data

Out

- Internal pull-up disabled⁽⁵⁾

- Schmitt Trigger enabled⁽¹⁾

TDO/TRACESWO

TMS/SWDIO

JTAGSEL

Output

Input / I/O

Input

VDDIO

Test Mode Select /Serial Wire Input/Output

JTAG Selection

Permanent Internal

pull-down

High

Flash Memory

Reset State:

- Erase Input

Flash and NVM Configuration Bits Erase

Command

ERASE

Input

VDDIO

- Internal pull-down enabled

- Schmitt Trigger enabled⁽¹⁾

Reset/Test

Permanent Internal

pull-up

NRST

TST

Synchronous Microcontroller Reset

Test Select

I/O

Low

Permanent Internal

pull-down

Input

SAM3S [SUMMARY]

7

6500ES–ATARM–11-Feb-13

Table 3-1. Signal Description List (Continued)

Active

Level

Voltage

reference Comments

Signal Name

Function

Type

Universal Asynchronous Receiver Transmitter - UARTx

URXDx

UTXDx

UART Receive Data

UART Transmit Data

Input

Output

PIO Controller - PIOA - PIOB - PIOC

PA0 - PA31

PB0 - PB14

Parallel IO Controller A

Parallel IO Controller B

I/O

Reset State:

- PIO or System IOs⁽²⁾

- Internal pull-up enabled

- Schmitt Trigger enabled⁽¹⁾

VDDIO

PC0 - PC31

Parallel IO Controller C

I/O

PIO Controller - Parallel Capture Mode (PIOA Only)

PIODC0-PIODC7

PIODCCLK

Parallel Capture Mode Data

Input

Parallel Capture Mode Clock

Parallel Capture Mode Enable

Input

PIODCEN1-2

Input

External Bus Interface

D0 - D7

A0 - A23

NWAIT

Data Bus

I/O

Address Bus

Output

Input

External Wait Signal

Low

Static Memory Controller - SMC

NCS0 - NCS3

NRD

Chip Select Lines

Read Signal

Output

Low

NWE

Write Enable

Output

NAND Flash Logic

Output

NANDOE

NANDWE

NAND Flash Output Enable

NAND Flash Write Enable

Low

Output

High Speed Multimedia Card Interface - HSMCI

MCCK

Multimedia Card Clock

I/O

MCCDA

Multimedia Card Slot A Command

Multimedia Card Slot A Data

MCDA0 - MCDA3

Universal Synchronous Asynchronous Receiver Transmitter USARTx

SCKx

TXDx

RXDx

RTSx

CTSx

DTR1

DSR1

DCD1

RI1

USARTx Serial Clock

I/O

USARTx Transmit Data

USARTx Receive Data

Input

Output

Input

I/O

USARTx Request To Send

USARTx Clear To Send

USART1 Data Terminal Ready

USART1 Data Set Ready

USART1 Data Carrier Detect

USART1 Ring Indicator

Input

SAM3S [SUMMARY]

8

6500ES–ATARM–11-Feb-13

Table 3-1. Signal Description List (Continued)

Active

Level

Voltage

reference Comments

Signal Name

Function

Type

Synchronous Serial Controller - SSC

TD

RD

TK

RK

TF

RF

SSC Transmit Data

SSC Receive Data

SSC Transmit Clock

SSC Receive Clock

Output

Input

I/O

SSC Transmit Frame Sync

SSC Receive Frame Sync

I/O

Timer/Counter - TC

TCLKx

TIOAx

TIOBx

TC Channel x External Clock Input

TC Channel x I/O Line A

Input

I/O

TC Channel x I/O Line B

I/O

Pulse Width Modulation Controller- PWMC

PWMHx

PWMLx

PWMFI0

PWM Waveform Output High for channel x

Output

Input

only output in

complementary mode when

dead time insertion is

enabled

PWM Waveform Output Low for channel x

PWM Fault Input

Serial Peripheral Interface - SPI

MISO

Master In Slave Out

Master Out Slave In

SPI Serial Clock

I/O

MOSI

SPCK

SPI_NPCS0

SPI Peripheral Chip Select 0

Low

SPI_NPCS1 -

SPI_NPCS3

SPI Peripheral Chip Select

Output

Two-Wire Interface- TWI

TWDx

TWIx Two-wire Serial Data

TWIx Two-wire Serial Clock

I/O

TWCKx

Analog

ADC, DAC and Analog Comparator

Reference

ADVREF

Analog

Analog-to-Digital Converter - ADC

Analog,

Digital

AD0 - AD14

ADTRG

Analog Inputs

ADC Trigger

Input

VDDIO

12-bit Digital-to-Analog Converter - DAC

Analog,

Digital

DAC0 - DAC1

DACTRG

Analog output

DAC Trigger

Input

SAM3S [SUMMARY]

9

6500ES–ATARM–11-Feb-13

Table 3-1. Signal Description List (Continued)

Signal Name Function

Active

Level

Voltage

reference Comments

Type

Fast Flash Programming Interface - FFPI

PGMEN0-PGMEN2 Programming Enabling

Input

I/O

VDDIO

PGMM0-PGMM3

PGMD0-PGMD15

PGMRDY

Programming Mode

Programming Data

Programming Ready

Data Direction

Output

High

Low

PGMNVALID

PGMNOE

Output

Programming Read

Programming Clock

Programming Command

Input

PGMCK

PGMNCMD

Input

Low

USB Full Speed Device

DDM

DDP

USB Full Speed Data -

USB Full Speed Data +

Reset State:

Analog,

Digital

VDDIO

- USB Mode

- Internal Pull-down⁽³⁾

Notes: 1. Schmitt Triggers can be disabled through PIO registers.

2. Some PIO lines are shared with System IOs.

3. Refer to the USB sub section in the product Electrical Characteristics Section for Pull-down value in USB Mode.

4. See Section 5.3 “Typical Powering Schematics” for restriction on voltage range of Analog Cells.

5. TDO pin is set in input mode when the Cortex-M3 Core is not in debug mode. Thus the internal pull-up corresponding

to this PIO line must be enabled to avoid current consumption due to floating input.

SAM3S [SUMMARY]

10

6500ES–ATARM–11-Feb-13

4.

Package and Pinout

4.1

SAM3S4/2/1C Package and Pinout

Figure 4-2 shows the orientation of the 100-ball TFBGA Package

4.1.1 100-lead LQFP Package Outline

Figure 4-1. Orientation of the 100-lead LQFP Package

75

51

76

50

100

26

1

25

4.1.2 100-ball TFBGA Package Outline

The 100-Ball TFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimensions are 9 x 9 x 1.1 mm.

Figure 4-2. Orientation of the 100-BALL TFBGA Package

TOP VIEW

10

9

8

7

6

5

4

3

2

1

A B C D E F G H J K

BALL A1

SAM3S [SUMMARY]

11

6500ES–ATARM–11-Feb-13

4.1.3 100-Lead LQFP Pinout

Table 4-1. 100-lead LQFP SAM3S4/2/1C Pinout

TDO/TRACESWO/PB

5

1

ADVREF

26

GND

51

TDI/PB4

76

2

3

GND

PB0/AD4

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

VDDIO

PA16/PGMD4

PC7

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

PA6/PGMNOE

PA5/PGMRDY

PC28

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

JTAGSEL

PC18

4

PC29/AD13

PB1/AD5

TMS/SWDIO/PB6

PC19

5

PA15/PGMD3

PA14/PGMD2

PC6

PA4/PGMNCMD

VDDCORE

PA27/PGMD15

PC8

6

PC30/AD14

PB2/AD6

PA31

7

PC20

8

PC31

PA13/PGMD1

PA24/PGMD12

PC5

TCK/SWCLK/PB7

PC21

9

PB3/AD7

PA28

10

11

12

13

14

15

16

17

18

19

20

21

22

VDDIN

NRST

VDDCORE

PC22

VDDOUT

VDDCORE

PC4

TST

PA17/PGMD5/AD0

PC26

PC9

ERASE/PB12

DDM/PB10

DDP/PB11

PC23

PA25/PGMD13

PA26/PGMD14

PC3

PA29

PA18/PGMD6/AD1

PA21/PGMD9/AD8

VDDCORE

PC27

PA30

PC10

PA12/PGMD0

PA11/PGMM3

PC2

PA3

VDDIO

PA2/PGMEN2

PC11

PC24

PA19/PGMD7/AD2

PC15/AD11

PA22/PGMD10/AD9

PC13/AD10

PA23/PGMD11

PB13/DAC0

PC25

PA10/PGMM2

GND

VDDIO

GND

PA9/PGMM1

PC1

PC14

PB8/XOUT

PB9/PGMCK/XIN

PA1/PGMEN1

PA8/XOUT32/

PGMM0

23

PC12/AD12

48

73

PC16

98

VDDIO

PA7/XIN32/

24

25

PA20/PGMD8/AD3

PC0

49

50

74

75

PA0/PGMEN0

PC17

99

PB14/DAC1

VDDPLL

PGMNVALID

VDDIO

100

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

4.1.4 100-ball TFBGA Pinout

Table 4-2. 100-ball TFBGA SAM3S4/2/1C Pinout

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

B1

B2

B3

B4

B5

B6

B7

B8

B9

PB1/AD5

PC29

C6

C7

C8

C9

C10

D1

D2

D3

D4

D5

D6

D7

D8

D9

D10

E1

E2

E3

E4

TCK/SWCLK/PB7

PC16

F1

F2

PA18/PGMD6/AD1

PC26

H6

H7

H8

H9

H10

J1

PC4

PA11/PGMM3

PC1

VDDIO

PA1/PGMEN1

PC17

F3

VDDOUT

GND

PB9/PGMCK/XIN

PB8/XOUT

PB13/DAC0

DDP/PB11

DDM/PB10

TMS/SWDIO/PB6

JTAGSEL

PC30

F4

PA6/PGMNOE

TDI/PB4

PA0/PGMEN0

PB3/AD7

PB0/AD4

PC24

F5

VDDIO

F6

PA27/PGMD15

PC8

PC15/AD11

PC0

F7

J2

F8

PA28

J3

PA16/PGMD4

PC6

PC22

F9

TST

J4

GND

F10

G1

G2

G3

G4

G5

G6

G7

G8

G9

PC9

J5

PA24/PGMD12

PA25/PGMD13

PA10/PGMM2

GND

PA21/PGMD9/AD8

PC27

J6

ADVREF

GNDANA

PB14/DAC1

PC21

VDDCORE

PA2/PGMEN2

PC11

J7

PA15/PGMD3

VDDCORE

PA26/PGMD14

PA12/PGMD0

PC28

J8

J9

VDDCORE

VDDIO

PC14

J10

K1

K2

K3

K4

PC20

PA17/PGMD5/AD0

PC31

PA22/PGMD10/AD9

PC13/AD10

PC12/AD12

PA20/PGMD8/AD3

PA31

PC19

VDDIN

PC18

GND

PA4/PGMNCMD

TDO/TRACESWO/

PB5

B10

E5

GND

G10

PA5/PGMRDY

K5

PC5

C1

C2

C3

C4

PB2/AD6

VDDPLL

PC25

E6

E7

E8

E9

NRST

PA29/AD13

PA30/AD14

PC10

H1

H2

H3

H4

PA19/PGMD7/AD2

PA23/PGMD11

PC7

K6

K7

K8

PC3

PC2

PA9/PGMM1

PC23

PA14/PGMD2

K9 PA8/XOUT32/PGMM0

PA7/XIN32/

K10

C5

ERASE/PB12

E10

PA3

H5

PA13/PGMD1

PGMNVALID

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

4.2

SAM3S4/2/1B Package and Pinout

Figure 4-3. Orientation of the 64-pad QFN Package

64

1

49

48

16

17

33

32

TOP VIEW

Figure 4-4. Orientation of the 64-lead LQFP Package

48

33

49

32

64

17

1

16

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

4.2.1 64-Lead LQFP and QFN Pinout

64-pin version SAM3S devices are pin-to-pin compatible with AT91SAM7S legacy products. Furthermore, SAM3S

products have new functionalities shown in italic in Table 4-3.

Table 4-3.

64-pin SAM3S4/2/1B Pinout

1

2

3

4

5

6

7

8

ADVREF

GND

17

18

19

20

21

22

23

24

GND

33

34

35

36

37

38

39

40

TDI/PB4

PA6/PGMNOE

PA5/PGMRDY

PA4/PGMNCMD

PA27/PGMD15

PA28

49

50

51

52

53

54

55

56

TDO/TRACESWO/PB5

JTAGSEL

VDDIO

PB0/AD4

PB1/AD5

PB2/AD6

PB3/AD7

VDDIN

PA16/PGMD4

PA15/PGMD3

PA14/PGMD2

PA13/PGMD1

PA24/PGMD12

VDDCORE

TMS/SWDIO/PB6

PA31

TCK/SWCLK/PB7

VDDCORE

NRST

ERASE/PB12

DDM/PB10

VDDOUT

TST

PA17/PGMD5/

9

25

26

PA25/PGMD13

PA26/PGMD14

41

42

PA29

PA30

57

58

DDP/PB11

VDDIO

AD0

PA18/PGMD6/

AD1

10

PA21/PGMD9/

AD8

11

12

13

27

28

29

PA12/PGMD0

PA11/PGMM3

PA10/PGMM2

43

44

45

PA3

59

60

61

PB13/DAC0

GND

VDDCORE

PA2/PGMEN2

VDDIO

PA19/PGMD7/

AD2

XOUT/PB8

PA22/PGMD10/

AD9

14

15

30

31

32

PA9/PGMM1

46

47

48

GND

62

63

64

XIN/PGMCK/PB9

PB14/DAC1

VDDPLL

PA8/XOUT32/

PA23/PGMD11

PA1/PGMEN1

PA0/PGMEN0

PGMM0

PA20/PGMD8/

AD3

PA7/XIN32/

16

PGMNVALID

Note:

The bottom pad of the QFN package must be connected to ground.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

4.3

SAM3S4/2/1A Package and Pinout

Figure 4-5. Orientation of the 48-pad QFN Package

48

37

1

36

25

12

13

24

TOP VIEW

Figure 4-6. Orientation of the 48-lead LQFP Package

36

25

37

24

13

48

1

12

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

4.3.1 48-Lead LQFP and QFN Pinout

Table 4-4.

48-pin SAM3S4/2/1A Pinout

TDO/TRACESWO/

PB5

1

ADVREF

13

VDDIO

25

TDI/PB4

37

2

3

4

5

6

7

8

GND

14

15

16

17

18

19

20

PA16/PGMD4

PA15/PGMD3

PA14/PGMD2

PA13/PGMD1

VDDCORE

26

27

28

29

30

31

32

PA6/PGMNOE

PA5/PGMRDY

PA4/PGMNCMD

NRST

38

39

40

41

42

43

44

JTAGSEL

TMS/SWDIO/PB6

TCK/SWCLK/PB7

VDDCORE

PB0/AD4

PB1/AD5

PB2/AD6

PB3/AD7

VDDIN

TST

ERASE/PB12

DDM/PB10

PA12/PGMD0

PA11/PGMM3

PA3

VDDOUT

PA2/PGMEN2

DDP/PB11

PA17/PGMD5/

AD0

9

21

22

23

24

PA10/PGMM2

PA9/PGMM1

33

34

35

36

VDDIO

GND

45

46

47

48

XOUT/PB8

XIN/PB9/PGMCK

VDDIO

PA18/PGMD6/

AD1

10

11

PA19/PGMD7/

AD2

PA8/XOUT32/

PA1/PGMEN1

PA0/PGMEN0

PGMM0

PA7/XIN32/

12

PA20/AD3

VDDPLL

PGMNVALID

Note:

The bottom pad of the QFN package must be connected to ground.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

5.

Power Considerations

5.1

Power Supplies

The SAM3S product has several types of power supply pins:

z

VDDCORE pins: Power the core, the embedded memories and the peripherals; voltage ranges from 1.62V and

1.95V.

VDDIO pins: Power the Peripherals I/O lines (Input/Output Buffers); USB transceiver; Backup part, 32kHz crystal

oscillator and oscillator pads; ranges from 1.62V and 3.6V

VDDIN pin: Voltage Regulator Input, ADC, DAC and Analog Comparator Power Supply; Voltage ranges from 1.8V

to 3.6V

VDDPLL pin: Powers the PLLA, PLLB, the Fast RC and the 3 to 20 MHz oscillator; voltage ranges from 1.62V and

1.95V.

5.2

Voltage Regulator

The SAM3S embeds a voltage regulator that is managed by the Supply Controller.

This internal regulator is intended to supply the internal core of SAM3S. It features two different operating modes:

z

In Normal mode, the voltage regulator consumes less than 700 μA static current and draws 80 mA of output

current. Internal adaptive biasing adjusts the regulator quiescent current depending on the required load current.

In Wait Mode quiescent current is only 7 μA.

• In Backup mode, the voltage regulator consumes less than 1 μA while its output (VDDOUT) is driven internally to GND.

The default output voltage is 1.80V and the start-up time to reach Normal mode is inferior to 100 μs.

For adequate input and output power supply decoupling/bypassing, refer to the Voltage Regulator section in the

Electrical Characteristics section of the datasheet.

5.3

Typical Powering Schematics

The SAM3S supports a 1.62V-3.6V single supply mode. The internal regulator input connected to the source and its

output feeds VDDCORE. Figure 5-1 shows the power schematics.

As VDDIN powers the voltage regulator, the ADC/DAC and the analog comparator, when the user does not want to use

the embedded voltage regulator, it can be disabled by software via the SUPC (note that it is different from Backup mode).

Figure 5-1. Single Supply

VDDIO

USB

Transceivers.

Main Supply

(1.8V-3.6V)

ADC, DAC

Analog Comp.

VDDIN

VDDOUT

Voltage

Regulator

VDDCORE

VDDPLL

Note: For USB, VDDIO needs to be greater than 3.0V.

For ADC, VDDIN needs to be greater than 2.0V.

For DAC, VDDIN needs to be greater than 2.4V.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

Figure 5-2. Core Externally Supplied

Main Supply

(1.62V-3.6V)

VDDIO

VDDIN

USB

Transceivers.

Can be the

same supply

ADC, DAC

Analog Comp.

ADC, DAC, Analog

Comparator Supply

(2.0V-3.6V)

VDDOUT

Voltage

Regulator

VDDCORE

VDDCORE Supply

(1.62V-1.95V)

VDDPLL

Note: For USB, VDDIO needs to be greater than 3.0V.

For ADC, VDDIN needs to be greater than 2.0V

For DAC, VDDIN needs to be greater than 2.4V.

Figure 5-3 below provides an example of the powering scheme when using a backup battery. Since the PIO state is

preserved when in backup mode, any free PIO line can be used to switch off the external regulator by driving the PIO line

at low level (PIO is input, pull-up enabled after backup reset). External wake-up of the system can be from a push button

or any signal. See Section 5.6 “Wake-up Sources” for further details.

Figure 5-3. Backup Battery

ADC, DAC, Analog

Comparator Supply

(2.0V-3.6V)

VDDIO

USB

Transceivers.

Backup

Battery

ADC, DAC

Analog Comp.

-

VDDIN

Main Supply

VDDOUT

IN

OUT

Voltage

Regulator

3.3V

LDO

VDDCORE

VDDPLL

ON/OFF

PIOx (Output)

WAKEUPx

External wakeup signal

Note: The two diodes provide a “switchover circuit” (for illustration purpose)

between the backup battery and the main supply when the system is put in

backup mode.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

5.4

Active Mode

Active mode is the normal running mode with the core clock running from the fast RC oscillator, the main crystal oscillator

or the PLLA. The power management controller can be used to adapt the frequency and to disable the peripheral clocks.

5.5

Low Power Modes

The various low power modes of the SAM3S are described below:

5.5.1 Backup Mode

The purpose of backup mode is to achieve the lowest power consumption possible in a system which is performing

periodic wake-ups to perform tasks but not requiring fast startup time (<0.1ms). Total current consumption is 3 μA typical.

The Supply Controller, zero-power power-on reset, RTT, RTC, Backup registers and 32 kHz oscillator (RC or crystal

oscillator selected by software in the Supply Controller) are running. The regulator and the core supply are off.

Backup mode is based on the Cortex-M3 deepsleep mode with the voltage regulator disabled.

The SAM3S can be awakened from this mode through WUP0-15 pins, the supply monitor (SM), the RTT or RTC wake-

up event.

Backup mode is entered by using WFE instructions with the SLEEPDEEP bit in the System Control Register of the

Cortex-M3 set to 1. (See the Power management description in The ARM Cortex M3 Processor section of the

product datasheet).

Exit from Backup mode happens if one of the following enable wake up events occurs:

• WKUPEN0-15 pins (level transition, configurable debouncing)

• Supply Monitor alarm

• RTC alarm

• RTT alarm

5.5.2 Wait Mode

The purpose of the wait mode is to achieve very low power consumption while maintaining the whole device in a

powered state for a startup time of less than 10 µs. Current Consumption in Wait mode is typically 15 µA (total cur-

rent consumption) if the internal voltage regulator is used or 8 µA if an external regulator is used.

In this mode, the clocks of the core, peripherals and memories are stopped. However, the core, peripherals and

memories power supplies are still powered. From this mode, a fast start up is available.

This mode is entered via Wait for Event (WFE) instructions with LPM = 1 (Low Power Mode bit in PMC_FSMR).

The Cortex-M3 is able to handle external events or internal events in order to wake-up the core (WFE). This is

done by configuring the external lines WUP0-15 as fast startup wake-up pins (refer to Section 5.7 “Fast Startup”).

RTC or RTT Alarm and USB wake-up events can be used to wake up the CPU (exit from WFE).

Entering Wait Mode:

• Select the 4/8/12 MHz fast RC oscillator as Main Clock

• Set the LPM bit in the PMC Fast Startup Mode Register (PMC_FSMR)

• Execute the Wait-For-Event (WFE) instruction of the processor

Note: Internal Main clock resynchronization cycles are necessary between the writing of MOSCRCEN bit and the

effective entry in Wait mode. Depending on the user application, Waiting for MOSCRCEN bit to be cleared is

recommended to ensure that the core will not execute undesired instructions.

The bit MOSCRCEN should be automatically set to '0'. So you have to add after this instruction the following: while

(MOSCRCEN ==0); so that you are sure to stay in the loop until you awake from the wait mode. In that case you are sure

the core will not continue to fetch the code but once you have exited the wait mode (in that case MOSCRCEN will be

automatically set to '1').

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

5.5.3 Sleep Mode

The purpose of sleep mode is to optimize power consumption of the device versus response time. In this mode,

only the core clock is stopped. The peripheral clocks can be enabled. The current consumption in this mode is

application dependent.

This mode is entered via Wait for Interrupt (WFI) or Wait for Event (WFE) instructions with LPM = 0 in PMC_FSMR.

The processor can be woke up from an interrupt if WFI instruction of the Cortex M3 is used, or from an event if the

WFE instruction is used to enter this mode.

5.5.4 Low Power Mode Summary Table

The modes detailed above are the main low power modes. Each part can be set to on or off separately and wake

up sources can be individually configured. Table 5-1 below shows a summary of the configurations of the low

power modes.

Table 5-1. Low Power Mode Configuration Summary

SUPC,

32 kHz

Oscillator

RTC RTT

Backup

Registers,

Core

POR

(Backup

Region)

PIO State

Memory

Potential Wake Up Core at while in Low PIOStateat Consumption Wake-up

(2) (3)

Mode

Regulator Peripherals Mode Entry

Sources

Wake Up Power Mode Wake Up

Time⁽¹⁾

PIOA &

PIOB &

PIOC

Inputs with

pull ups

WUP0-15 pins

SM alarm

RTC alarm

RTT alarm

WFE

OFF

Backup

Mode

ON

OFF

Reset

3 μA typ⁽⁴⁾

< 0.1 ms

+SLEEPDEEP

(Not powered)

bit = 1

Any Event from:

Fast startup through

+SLEEPDEEP WUP0-15 pins

WFE

Powered

Wait

Mode

Clocked Previous

back state saved

ON

Unchanged 5 μA/15 μA ⁽⁵⁾< 10 μs

bit = 0

RTC alarm

RTT alarm

USB wake-up

(Not clocked)

+LPM bit = 1

Entry mode =WFI

Interrupt Only; Entry

mode =WFE Any

Enabled Interrupt

and/or Any Event

from: Fast start-up

through WUP0-15

pins

WFE or WFI

Powered⁽⁷⁾

Sleep

Mode

+SLEEPDEEP

bit = 0

Clocked Previous

back state saved

(6)

ON

Unchanged

(Not clocked)

+LPM bit = 0

RTC alarm

RTT alarm

USB wake-up

Notes: 1. When considering wake-up time, the time required to start the PLL is not taken into account. Once started, the device

works with the 4/8/12 MHz fast RC oscillator. The user has to add the PLL start-up time if it is needed in the system.

The wake-up time is defined as the time taken for wake up until the first instruction is fetched.

2. The external loads on PIOs are not taken into account in the calculation.

3. Supply Monitor current consumption is not included.

4. Total Current consumption.

5. 5 μA on VDDCORE, 15 μA for total current consumption (using internal voltage regulator), 8 μA for total current con-

sumption (without using internal voltage regulator).

6. Depends on MCK frequency.

7. In this mode the core is supplied and not clocked but some peripherals can be clocked.

SAM3S [SUMMARY]

21

6500ES–ATARM–11-Feb-13

5.6

Wake-up Sources

The wake-up events allow the device to exit the backup mode. When a wake-up event is detected, the Supply Controller

performs a sequence which automatically reenables the core power supply and the SRAM power supply, if they are not

already enabled.

Figure 5-4. Wake-up Source

SMEN

sm_out

RTCEN

rtc_alarm

Core

Supply

Restart

RTTEN

rtt_alarm

WKUPT0

WKUPEN0

WKUPEN1

WKUPIS0

WKUPIS1

Falling/Rising

Edge

Detector

WKUP0

WKUP1

WKUPDBC

Debouncer

SLCK

WKUPS

WKUPT1

Falling/Rising

Edge

Detector

WKUPT15

WKUPEN15

WKUPIS15

Falling/Rising

Edge

WKUP15

Detector

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

5.7

Fast Startup

The device allows the processor to restart in a few microseconds while the processor is in wait mode. A fast start up can

occur upon detection of a low level on one of the 19 wake-up inputs (WKUP0 to 15 + SM + RTC + RTT).

The fast restart circuitry, as shown in Figure 5-5, is fully asynchronous and provides a fast start-up signal to the Power

Management Controller. As soon as the fast start-up signal is asserted, the PMC automatically restarts the embedded

4/8/12 MHz fast RC oscillator, switches the master clock on this 4MHz clock and reenables the processor clock.

Figure 5-5. Fast Start-Up Circuitry

FSTT0

WKUP0

FSTP0

FSTP1

FSTT1

WKUP1

FSTT15

WKUP15

fast_restart

FSTP15

RTTAL

RTCAL

USBAL

RTT Alarm

RTC Alarm

USB Alarm

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

6.

Input/Output Lines

The SAM3S has several kinds of input/output (I/O) lines such as general purpose I/Os (GPIO) and system I/Os. GPIOs

can have alternate functionality due to multiplexing capabilities of the PIO controllers. The same PIO line can be used

whether in IO mode or by the multiplexed peripheral. System I/Os include pins such as test pins, oscillators, erase or

analog inputs.

6.1

General Purpose I/O Lines

GPIO Lines are managed by PIO Controllers. All I/Os have several input or output modes such as pull-up or pull-down,

input Schmitt triggers, multi-drive (open-drain), glitch filters, debouncing or input change interrupt. Programming of these

modes is performed independently for each I/O line through the PIO controller user interface. For more details, refer to

the product PIO controller section.

The input output buffers of the PIO lines are supplied through VDDIO power supply rail.

The SAM3S embeds high speed pads able to handle up to 32 MHz for HSMCI (MCK/2), 45 MHz for SPI clock lines and

35 MHz on other lines. See AC Characteristics Section in the Electrical Characteristics Section of the datasheet for more

details. Typical pull-up and pull-down value is 100 kΩ for all I/Os.

Each I/O line also embeds an ODT (On-Die Termination), see Figure 6-1. It consists of an internal series resistor

termination scheme for impedance matching between the driver output (SAM3S) and the PCB trace impedance

preventing signal reflection. The series resistor helps to reduce IOs switching current (di/dt) thereby reducing in turn,

EMI. It also decreases overshoot and undershoot (ringing) due to inductance of interconnect between devices or

between boards. In conclusion ODT helps diminish signal integrity issues.

Figure 6-1. On-Die Termination

Z0 ~ Zout + Rodt

ODT

36 Ohms Typ.

Rodt

Receiver

SAM3 Driver with

PCB Trace

Zout ~ 10 Ohms

Z0 ~ 50 Ohms

6.2

System I/O Lines

System I/O lines are pins used by oscillators, test mode, reset and JTAG to name but a few. Described below are the

SAM3S system I/O lines shared with PIO lines:

These pins are software configurable as general purpose I/O or system pins. At startup the default function of these pins

is always used.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

Table 6-1. System I/O Configuration List

SYSTEM_IO

bit number

Default function

after reset

Constraints for

normal start

Other function

Configuration

Low Level at

startup⁽¹⁾

12

ERASE

PB12

10

11

7

6

5

4

-

DDM

DDP

PB10

PB11

PB7

-

In Matrix User Interface Registers

(Refer to the SystemIO

Configuration Register in the Bus

Matrix section of the product

datasheet.)

TCK/SWCLK

TMS/SWDIO

TDO/TRACESWO

TDI

PB6

PB5

PB4

PA7

XIN32

XOUT32

XIN

See footnote ⁽²⁾below

See footnote ⁽³⁾below

-

PA8

-

PB9

-

PB8

XOUT

Notes: 1. If PB12 is used as PIO input in user applications, a low level must be ensured at startup to prevent Flash erase before

the user application sets PB12 into PIO mode,

2. In the product Datasheet Refer to: Slow Clock Generator of the Supply Controller section.

3. In the product Datasheet Refer to: 3 to 20 MHZ Crystal Oscillator information in PMC section.

6.2.1 Serial Wire JTAG Debug Port (SWJ-DP) Pins

The SWJ-DP pins are TCK/SWCLK, TMS/SWDIO, TDO/SWO, TDI and commonly provided on a standard 20-pin JTAG

connector defined by ARM. For more details about voltage reference and reset state, refer to Table 3-1 on page 7.

At startup, SWJ-DP pins are configured in SWJ-DP mode to allow connection with debugging probe. Please refer to the

Debug and Test Section of the product datasheet.

SWJ-DP pins can be used as standard I/Os to provide users more general input/output pins when the debug port is not

needed in the end application. Mode selection between SWJ-DP mode (System IO mode) and general IO mode is

performed through the AHB Matrix Special Function Registers (MATRIX_SFR). Configuration of the pad for pull-up,

triggers, debouncing and glitch filters is possible regardless of the mode.

The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. It integrates a permanent

pull-down resistor of about 15 kΩ to GND, so that it can be left unconnected for normal operations.

By default, the JTAG Debug Port is active. If the debugger host wants to switch to the Serial Wire Debug Port, it must

provide a dedicated JTAG sequence on TMS/SWDIO and TCK/SWCLK which disables the JTAG-DP and enables the

SW-DP. When the Serial Wire Debug Port is active, TDO/TRACESWO can be used for trace.

The asynchronous TRACE output (TRACESWO) is multiplexed with TDO. So the asynchronous trace can only be used

with SW-DP, not JTAG-DP. For more information about SW-DP and JTAG-DP switching, please refer to the Debug and

Test Section.

6.3

Test Pin

The TST pin is used for JTAG Boundary Scan Manufacturing Test or Fast Flash programming mode of the SAM3S

series. The TST pin integrates a permanent pull-down resistor of about 15 kΩ to GND, so that it can be left uncon-

nected for normal operations. To enter fast programming mode, see the Fast Flash Programming Interface (FFPI)

section. For more on the manufacturing and test mode, refer to the “Debug and Test” section of the product

datasheet.

SAM3S [SUMMARY]

25

6500ES–ATARM–11-Feb-13

6.4

6.5

NRST Pin

The NRST pin is bidirectional. It is handled by the on-chip reset controller and can be driven low to provide a reset signal

to the external components or asserted low externally to reset the microcontroller. It will reset the Core and the

peripherals except the Backup region (RTC, RTT and Supply Controller). There is no constraint on the length of the reset

pulse and the reset controller can guarantee a minimum pulse length. The NRST pin integrates a permanent pull-up

resistor to VDDIO of about 100 kΩ. By default, the NRST pin is configured as an input.

ERASE Pin

The ERASE pin is used to reinitialize the Flash content (and some of its NVM bits) to an erased state (all bits read as

logic level 1). It integrates a pull-down resistor of about 100 kΩ to GND, so that it can be left unconnected for normal

operations.

This pin is debounced by SCLK to improve the glitch tolerance. When the ERASE pin is tied high during less than 100

ms, it is not taken into account. The pin must be tied high during more than 220 ms to perform a Flash erase operation.

The ERASE pin is a system I/O pin and can be used as a standard I/O. At startup, the ERASE pin is not configured as a

PIO pin. If the ERASE pin is used as a standard I/O, startup level of this pin must be low to prevent unwanted erasing.

Please refer to Section 11.2 “Peripheral Signal Multiplexing on I/O Lines” on page 41. Also, if the ERASE pin is used as

a standard I/O output, asserting the pin to low does not erase the Flash.

SAM3S [SUMMARY]

26

6500ES–ATARM–11-Feb-13

7.

Processor and Architecture

7.1

ARM Cortex-M3 Processor

z

Version 2.0

Thumb-2 (ISA) subset consisting of all base Thumb-2 instructions, 16-bit and 32-bit

Harvard processor architecture enabling simultaneous instruction fetch with data load/store

Three-stage pipeline

Single cycle 32-bit multiply

Hardware divide

Thumb and Debug states

Handler and Thread modes

Low latency ISR entry and exit

7.2

7.3

APB/AHB bridge

The SAM3S product embeds one peripheral bridge:

The peripherals of the bridge are clocked by MCK.

Matrix Masters

The Bus Matrix of the SAM3S product manages 4 masters, which means that each master can perform an access

concurrently with others, to an available slave.

Each master has its own decoder, which is defined specifically for each master. In order to simplify the addressing, all the

masters have the same decodings.

Table 7-1. List of Bus Matrix Masters

Master 0

Master 1

Master 2

Master 3

Cortex-M3 Instruction/Data

Cortex-M3 System

Peripheral DMA Controller (PDC)

CRC Calculation Unit

7.4

Matrix Slaves

The Bus Matrix of the SAM3S product manages 5 slaves. Each slave has its own arbiter, allowing a different arbitration

per slave.

Table 7-2. List of Bus Matrix Slaves

Slave 0

Slave 1

Slave 2

Slave 3

Slave 4

Internal SRAM

Internal ROM

Internal Flash

External Bus Interface

Peripheral Bridge

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

7.5

Master to Slave Access

All the Masters can normally access all the Slaves. However, some paths do not make sense, for example allowing

access from the Cortex-M3 S Bus to the Internal ROM. Thus, these paths are forbidden or simply not wired and shown

as “-” in the following table.

Table 7-3. SAM3S Master to Slave Access

Masters

0

1

2

3

Cortex-M3 I/D

Bus

Cortex-M3 S

Bus

PDC

CRCCU

Slaves

0

1

2

3

4

Internal SRAM

Internal ROM

Internal Flash

-

X

-

X

-

X

-

X

-

External Bus Interface

Peripheral Bridge

X

-

7.6

Peripheral DMA Controller

z

Handles data transfer between peripherals and memories

z

Low bus arbitration overhead

z

One Master Clock cycle needed for a transfer from memory to peripheral

Two Master Clock cycles needed for a transfer from peripheral to memory

z

Next Pointer management for reducing interrupt latency requirement

The Peripheral DMA Controller handles transfer requests from the channel according to the following priorities (Low to

High priorities):

Table 7-4. Peripheral DMA Controller

Instance Name

PWM

Channel T/R

Transmit

Receive

100 & 64 Pins

48 Pins

x

TWI1

TWI0

x

UART1

UART0

USART1

USART0

DAC

x

N/A

x

N/A

x

SPI

SSC

x

HSMCI

PIOA

N/A

x

TWI1

x

TWI0

x

UART1

UART0

N/A

x

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

Table 7-4. Peripheral DMA Controller (Continued)

Instance Name

USART1

USART0

ADC

Channel T/R

Receive

100 & 64 Pins

48 Pins

x

SPI

x

SSC

x

HSMCI

PIOA

N/A

x

7.7

Debug and Test Features

z

Debug access to all memory and registers in the system, including Cortex-M3 register bank when the core is

running, halted, or held in reset.

z

Serial Wire Debug Port (SW-DP) and Serial Wire JTAG Debug Port (SWJ-DP) debug access

Flash Patch and Breakpoint (FPB) unit for implementing breakpoints and code patches

Data Watchpoint and Trace (DWT) unit for implementing watchpoints, data tracing, and system profiling

Instrumentation Trace Macrocell (ITM) for support of printf style debugging

IEEE1149.1 JTAG Boundary-can on All Digital Pins

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

8.

Product Mapping

Figure 8-1. SAM3S Product Mapping

Address memory space

Code

Peripherals

HSMCI

Code

0x40000000

0x40004000

0x40008000

0x4000C000

0x40010000

+0x40

0x00000000

0x20000000

0x00000000

Boot Memory

18

22

21

0x00400000

SSC

SPI

Internal Flash

0x00800000

SRAM

Internal ROM

1 MByte

bit band

region

0x22000000

0x23FFFFFF

0x00C00000

0x1FFFFFFF

Reserved

TC0

Reserved

Undefined

TC0

TC1

0x24000000

0x40000000

32 MBytes

bit band alias

23

24

25

26

27

28

19

20

31

14

15

TC1

+0x80

Peripherals

TC2

External RAM

0x60000000

0x61000000

0x60000000

0xA0000000

0x40014000

+0x40

TC3

SMC Chip Select 0

SMC Chip Select 1

External SRAM

TC4

0x62000000

0x63000000

0x64000000

+0x80

Reserved

System

SMC Chip Select 2

TC5

0x40018000

0x4001C000

0x40020000

0x40024000

0x40028000

0x4002C000

0x40030000

0x40034000

0x40038000

0x4003C000

0x40040000

0x40044000

0x40048000

0x400E0000

0xE0000000

0xFFFFFFFF

SMC Chip Select 3

Reserved

TWI0

0x9FFFFFFF

TWI1

1 MByte

bit band

regiion

System Controller

PWM

0x400E0000

0x400E0200

0x400E0400

0x400E0600

0x400E0740

0x400E0800

0x400E0A00

0x400E0C00

0x400E0E00

0x400E1000

0x400E1200

0x400E1400

SMC

USART0

USART1

Reserved

UDP

10

MATRIX

offset

block

peripheral

ID

PMC

5

UART0

8

CHIPID

33

29

30

34

35

UART1

ADC

9

EFC

DACC

ACC

6

Reserved

PIOA

CRCCU

Reserved

11

PIOB

12

PIOC

System Controller

Reserved

13

0x400E2600

0x40100000

RSTC

1

+0x10

+0x30

+0x50

+0x60

+0x90

SUPC

Reserved

0x40200000

0x40400000

RTT

32 MBytes

bit band alias

3

WDT

Reserved

4

0x60000000

RTC

2

GPBR

0x400E1600

0x4007FFFF

Reserved

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

9.

Memories

9.1

Embedded Memories

9.1.1 Internal SRAM

The ATSAM3S4 product (256-Kbyte internal Flash version) embeds a total of 48 Kbytes high-speed SRAM.

The ATSAM3S2 product (128-Kbyte internal Flash version) embeds a total of 32 Kbytes high-speed SRAM.

The ATSAM3S1 product (64-Kbyte internal Flash version) embeds a total of 16 Kbytes high-speed SRAM.

The SRAM is accessible over System Cortex-M3 bus at address 0x2000 0000.

The SRAM is in the bit band region. The bit band alias region is mapped from 0x2200 0000 to 0x23FF FFFF.

9.1.2 Internal ROM

The SAM3S product embeds an Internal ROM, which contains the SAM Boot Assistant (SAM-BA), In Application

Programming routines (IAP) and Fast Flash Programming Interface (FFPI).

At any time, the ROM is mapped at address 0x0080 0000.

9.1.3 Embedded Flash

9.1.3.1 Flash Overview

The Flash of the ATSAM3S4 (256-Kbytes internal Flash version) is organized in one bank of 1024 pages (Single plane)

of 256 bytes.

The Flash of the ATSAM3S2 (128-Kbytes internal Flash version) is organized in one bank of 512 pages (Single plane) of

256 bytes.

The Flash of the ATSAM3S1 (64-Kbytes internal Flash version) is organized in one bank of 256 pages (Single plane) of

256 bytes.

The Flash contains a 128-byte write buffer, accessible through a 32-bit interface.

9.1.3.2 Flash Power Supply

The Flash is supplied by VDDCORE.

9.1.3.3 Enhanced Embedded Flash Controller

The Enhanced Embedded Flash Controller (EEFC) manages accesses performed by the masters of the system. It

enables reading the Flash and writing the write buffer. It also contains a User Interface, mapped on the APB.

The Enhanced Embedded Flash Controller ensures the interface of the Flash block with the 32-bit internal bus. Its 128-bit

wide memory interface increases performance.

The user can choose between high performance or lower current consumption by selecting either 128-bit or 64-bit

access. It also manages the programming, erasing, locking and unlocking sequences of the Flash using a full set of

commands.

One of the commands returns the embedded Flash descriptor definition that informs the system about the Flash

organization, thus making the software generic.

9.1.3.4 Flash Speed

The user needs to set the number of wait states depending on the frequency used.

For more details, refer to the AC Characteristics sub section in the product Electrical Characteristics Section.

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6500ES–ATARM–11-Feb-13

9.1.3.5 Lock Regions

Several lock bits used to protect write and erase operations on lock regions. A lock region is composed of several

consecutive pages, and each lock region has its associated lock bit.

Table 9-1. Number of Lock Bits

Product

Number of Lock Bits

Lock Region Size

16 kbytes (64 pages)

ATSAM3S4

ATSAM3S2

ATSAM3S1

16

8

4

If a locked-region’s erase or program command occurs, the command is aborted and the EEFC triggers an interrupt.

The lock bits are software programmable through the EEFC User Interface. The command “Set Lock Bit” enables the

protection. The command “Clear Lock Bit” unlocks the lock region.

Asserting the ERASE pin clears the lock bits, thus unlocking the entire Flash.

9.1.3.6 Security Bit Feature

The SAM3S features a security bit, based on a specific General Purpose NVM bit (GPNVM bit 0). When the security is

enabled, any access to the Flash, SRAM, Core Registers and Internal Peripherals either through the ICE interface or

through the Fast Flash Programming Interface, is forbidden. This ensures the confidentiality of the code programmed in

the Flash.

This security bit can only be enabled, through the command “Set General Purpose NVM Bit 0” of the EEFC User

Interface. Disabling the security bit can only be achieved by asserting the ERASE pin at 1, and after a full Flash erase is

performed. When the security bit is deactivated, all accesses to the Flash, SRAM, Core registers, Internal Peripherals

are permitted.

It is important to note that the assertion of the ERASE pin should always be longer than 200 ms.

As the ERASE pin integrates a permanent pull-down, it can be left unconnected during normal operation. However, it is

safer to connect it directly to GND for the final application.

9.1.3.7 Calibration Bits

NVM bits are used to calibrate the brownout detector and the voltage regulator. These bits are factory configured and

cannot be changed by the user. The ERASE pin has no effect on the calibration bits.

9.1.3.8 Unique Identifier

Each device integrates its own 128-bit unique identifier. These bits are factory configured and cannot be changed by the

user. The ERASE pin has no effect on the unique identifier.

9.1.3.9 Fast Flash Programming Interface

The Fast Flash Programming Interface allows programming the device through a multiplexed fully-handshaked parallel

port. It allows gang programming with market-standard industrial programmers.

The FFPI supports read, page program, page erase, full erase, lock, unlock and protect commands.

The Fast Flash Programming Interface is enabled and the Fast Programming Mode is entered when TST is tied high and

PA0 and PA1 are tied low.

9.1.3.10 SAM-BA^®Boot

The SAM-BA Boot is a default Boot Program which provides an easy way to program in-situ the on-chip Flash memory.

The SAM-BA Boot Assistant supports serial communication via the UART and USB.

The SAM-BA Boot provides an interface with SAM-BA Graphic User Interface (GUI).

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6500ES–ATARM–11-Feb-13

9.1.3.11 GPNVM Bits

The SAM3S features two GPNVM bits that can be cleared or set respectively through the commands “Clear GPNVM Bit”

and “Set GPNVM Bit” of the EEFC User Interface.

Table 9-2. General Purpose Non-volatile Memory Bits

GPNVMBit[#]

Function

0

1

Security bit

Boot mode selection

9.1.4 Boot Strategies

The system always boots at address 0x0. To ensure maximum boot possibilities, the memory layout can be changed via

GPNVM.

A general-purpose NVM (GPNVM) bit is used to boot either on the ROM (default) or from the Flash.

The GPNVM bit can be cleared or set respectively through the commands “Clear General-purpose NVM Bit” and “Set

General-purpose NVM Bit” of the EEFC User Interface.

Setting GPNVM Bit 1 selects the boot from the Flash, clearing it selects the boot from the ROM. Asserting ERASE clears

the GPNVM Bit 1 and thus selects the boot from the ROM by default.

9.2

External Memories

The SAM3S features an External Bus Interface to provide the interface to a wide range of external memories and to any

parallel peripheral.

9.2.1 Static Memory Controller

z

8-bit Data Bus

Up to 24-bit Address Bus (up to 16 MBytes linear per chip select)

Up to 4 chip selects, Configurable Assignment

Multiple Access Modes supported

z

Chip Select, Write enable or Read enable Control Mode

Asynchronous read in Page Mode supported (4- up to 32-byte page size)

z

Multiple device adaptability

Control signals programmable setup, pulse and hold time for each Memory Bank

Multiple Wait State Management

z

Programmable Wait State Generation

External Wait Request

Programmable Data Float Time

z

Slow Clock mode supported

Additional Logic for NAND Flash

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

10. System Controller

The System Controller is a set of peripherals, which allow handling of key elements of the system, such as power, resets,

clocks, time, interrupts, watchdog, etc...

See the system controller block diagram in Figure 10-1 on page 34.

Figure 10-1. System Controller Block Diagram

VDDIO

VDDOUT

vr_on

vr_mode

Software Controlled

Voltage Regulator

VDDIN

VDDIO

Supply

Controller

Zero-Power

Power-on Reset

PIOA/B/C

Input/Output Buffers

PIOx

ON

out

Supply

Monitor

(Backup)

Analog

Comparator

WKUP0 - WKUP15

ADx

General Purpose

Backup Registers

ADC Analog

Circuitry

ADVREF

DACx

rtc_nreset

rtc_alarm

DAC Analog

Circuitry

SLCK

RTC

VDDIO

rtt_nreset

rtt_alarm

RTT

DDP

DDM

USB

Transeivers

osc32k_xtal_en

XTALSEL

vddcore_nreset

XIN32

Xtal 32 kHz

Slow Clock

SLCK

bod_core_on

Brownout

Detector

(Core)

Oscillator

XOUT32

lcore_brown_out

VDDCORE

Embedded

32 kHz RC

Oscillator

osc32k_rc_en

SRAM

vddcore_nreset

Backup Power Supply

Peripherals

proc_nreset

periph_nreset

ice_nreset

Reset

Controller

Matrix

Peripheral

Bridge

NRST

Cortex-M3

Flash

FSTT0 - FSTT15

SLCK

Main Clock

Embedded

12 / 8 / 4 MHz

RC

Oscillator

MAINCK

Power

Management

Controller

Master Clock

MCK

XIN

3 - 20 MHz

XTAL Oscillator

XOUT

PLLACK

PLLBCK

MAINCK

PLLA

PLLB

Watchdog

Timer

SLCK

VDDIO

Core Power Supply

FSTT0 - FSTT15 are possible Fast Startup Sources, generated by WKUP0-WKUP15 Pins,

but are not physical pins.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

10.1 System Controller and Peripheral Mapping

Please refer to Section 8-1 “SAM3S Product Mapping” on page 30.

All the peripherals are in the bit band region and are mapped in the bit band alias region.

10.2 Power-on-Reset, Brownout and Supply Monitor

The SAM3S embeds three features to monitor, warn and/or reset the chip:

• Power-on-Reset on VDDIO

• Brownout Detector on VDDCORE

• Supply Monitor on VDDIO

10.2.1 Power-on-Reset

The Power-on-Reset monitors VDDIO. It is always activated and monitors voltage at start up but also during power down.

If VDDIO goes below the threshold voltage, the entire chip is reset. For more information, refer to the Electrical

Characteristics section of the datasheet.

10.2.2 Brownout Detector on VDDCORE

The Brownout Detector monitors VDDCORE. It is active by default. It can be deactivated by software through the Supply

Controller (SUPC_MR). It is especially recommended to disable it during low-power modes such as wait or sleep modes.

If VDDCORE goes below the threshold voltage, the reset of the core is asserted. For more information, refer to the

Supply Controller (SUPC) and Electrical Characteristics sections of the datasheet.

10.2.3 Supply Monitor on VDDIO

The Supply Monitor monitors VDDIO. It is not active by default. It can be activated by software and is fully programmable

with 16 steps for the threshold (between 1.9V to 3.4V). It is controlled by the Supply Controller (SUPC). A sample mode

is possible. It allows to divide the supply monitor power consumption by a factor of up to 2048. For more information,

refer to the SUPC and Electrical Characteristics sections of the datasheet.

10.3 Reset Controller

The Reset Controller is based on a Power-on-Reset cell, and a Supply Monitor on VDDCORE.

The Reset Controller is capable to return to the software the source of the last reset, either a general reset, a wake-up

reset, a software reset, a user reset or a watchdog reset.

The Reset Controller controls the internal resets of the system and the NRST pin input/output. It is capable to shape a

reset signal for the external devices, simplifying to a minimum connection of a push-button on the NRST pin to implement

a manual reset.

The configuration of the Reset Controller is saved as supplied on VDDIO.

10.4 Supply Controller (SUPC)

The Supply Controller controls the power supplies of each section of the processor and the peripherals (via Voltage

regulator control)

The Supply Controller has its own reset circuitry and is clocked by the 32 kHz Slow clock generator.

The reset circuitry is based on a zero-power power-on reset cell and a brownout detector cell. The zero-power power-on

reset allows the Supply Controller to start properly, while the software-programmable brownout detector allows detection

of either a battery discharge or main voltage loss.

The Slow Clock generator is based on a 32 kHz crystal oscillator and an embedded 32 kHz RC oscillator. The Slow Clock

defaults to the RC oscillator, but the software can enable the crystal oscillator and select it as the Slow Clock source.

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

The Supply Controller starts up the device by sequentially enabling the internal power switches and the Voltage

Regulator, then it generates the proper reset signals to the core power supply.

It also enables to set the system in different low power modes and to wake it up from a wide range of events.

10.5 Clock Generator

The Clock Generator is made up of:

z

One Low Power 32768Hz Slow Clock oscillator with bypass mode

One Low-Power RC oscillator

One 3-20 MHz Crystal Oscillator, which can be bypassed

One Fast RC oscillator factory programmed, 3 output frequencies can be selected: 4, 8 or 12 MHz. By default 4

MHz is selected.

z

One 60 to 130 MHz PLL (PLLB) providing a clock for the USB Full Speed Controller

One 60 to 130 MHz programmable PLL (PLLA), capable to provide the clock MCK to the processor and to the

peripherals. The PLLA input frequency is from 3.5 to 20 MHz.

Figure 10-2. Clock Generator Block Diagram

Clock Generator

XTALSEL

On Chip

32 kHz

RC OSC

Slow Clock

SLCK

XIN32

Slow Clock

Oscillator

XOUT32

XIN

3-20 MHz

Main

Oscillator

Main Clock

MAINCK

XOUT

On Chip

12/8/4 MHz

RC OSC

MAINSEL

PLLB Clock

PLLBCK

PLL and

Divider B

PLL and

Divider A

PLLA Clock

PLLACK

Status Control

Power

Management

Controller

10.6 Power Management Controller

The Power Management Controller provides all the clock signals to the system. It provides:

z

the Processor Clock, HCLK

the Free running processor clock, FCLK

the Cortex SysTick external clock

the Master Clock, MCK, in particular to the Matrix and the memory interfaces

the USB Clock, UDPCK

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

z

independent peripheral clocks, typically at the frequency of MCK

three programmable clock outputs: PCK0, PCK1 and PCK2

The Supply Controller selects between the 32 kHz RC oscillator or the crystal oscillator. The unused oscillator is disabled

automatically so that power consumption is optimized.

By default, at startup the chip runs out of the Master Clock using the fast RC oscillator running at 4 MHz.

The user can trim the 8 and 12 MHz RC Oscillator frequency by software.

Figure 10-3. SAM3S Power Management Controller Block Diagram

Processor

Clock

Controller

HCK

int

Sleep Mode

Divider

/8

SystTick

FCLK

Master Clock Controller

SLCK

MAINCK

PLLACK

PLLBCK

Prescaler

/1,/2,/4,...,/64

MCK

Peripherals

Clock Controller

periph_clk[..]

ON/OFF

Programmable Clock Controller

SLCK

MAINCK

PLLACK

PLLBCK

ON/OFF

Prescaler

/1,/2,/4,...,/64

pck[..]

USB Clock Controller

ON/OFF

PLLBCK

UDPCK

The SysTick calibration value is fixed at 8000 which allows the generation of a time base of 1 ms with SystTick clock at 8

MHz (max HCLK/8 = 64 MHz/8).

10.7 Watchdog Timer

z

16-bit key-protected only-once-Programmable Counter

z

Windowed, prevents the processor to be in a dead-lock on the watchdog access.

10.8 SysTick Timer

z

24-bit down counter

Self-reload capability

Flexible System timer

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

10.9 Real Time Timer

z

Real Time Timer, allowing backup of time with different accuracies

z

32-bit free-running back-up counter

Integrates a 16-bit programmable prescaler running on slow clock

Alarm register capable to generate a wake-up of the system through the Shut Down Controller

10.10 Real Time Clock

z

Low power consumption

Full asynchronous design

Two hundred year calendar

Programmable Periodic Interrupt

Alarm and update parallel load

Control of alarm and update Time/Calendar Data In

10.11 General Purpose Backup Registers

z

Eight 32-bit general-purpose backup registers

10.12 Nested Vectored Interrupt Controller

z

Thirty maskable external interrupts

Sixteen priority levels

Processor state automatically saved on interrupt entry, and restored on

Dynamic reprioritization of interrupts

Priority grouping.

z

selection of preempting interrupt levels and non-preempting interrupt levels.

Support for tail-chaining and late arrival of interrupts.

back-to-back interrupt processing without the overhead of state saving and restoration between interrupts.

Processor state automatically saved on interrupt entry, and restored on interrupt exit, with no instruction overhead.

z

10.13 Chip Identification

z

Chip Identifier (CHIPID) registers permit recognition of the device and its revision.

Table 10-1. SAM3S Chip IDs Register

Flash Size

Chip Name

(KBytes)

256

128

64

Pin Count

48

DBGU_CIDR

0x28800960

0x288A0760

0x28890560

0x28900960

0x289A0760

0x28990560

0x28A00960

0x28AA0760

0x28A90560

CHIPID_EXID

ATSAM3S4A (Rev A)

ATSAM3S2A (Rev A)

ATSAM3S1A (Rev A)

ATSAM3S4B (Rev A)

ATSAM3S2B (Rev A)

ATSAM3S1B (Rev A)

ATSAM3S4C (Rev A)

ATSAM3S2C (Rev A)

ATSAM3S1C (Rev A)

JTAG ID: 0x05B2D03F

0x0

48

256

128

64

256

128

64

100

z

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

10.14 UART

z

Two-pin UART

z

Implemented features are 100% compatible with the standard Atmel USART

Independent receiver and transmitter with a common programmable Baud Rate Generator

Even, Odd, Mark or Space Parity Generation

Parity, Framing and Overrun Error Detection

Automatic Echo, Local Loopback and Remote Loopback Channel Modes

Support for two PDC channels with connection to receiver and transmitter

10.15 PIO Controllers

z

3 PIO Controllers, PIOA, PIOB and PIOC (100-pin version only) controlling a maximum of 79 I/O Lines

z

Fully programmable through Set/Clear Registers

Table 10-2. PIO available according to pin count

Version

PIOA

48 pin

64 pin

100 pin

32

21

13

-

32

15

-

PIOB

15

PIOC

32

z

Multiplexing of four peripheral functions per I/O Line

For each I/O Line (whether assigned to a peripheral or used as general purpose I/O)

z

Input change, rising edge, falling edge, low level and level interrupt

Debouncing and Glitch filter

Multi-drive option enables driving in open drain

Programmable pull-up or pull-down on each I/O line

Pin data status register, supplies visibility of the level on the pin at any time

z

Synchronous output, provides Set and Clear of several I/O lines in a single write

SAM3S [SUMMARY]

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6500ES–ATARM–11-Feb-13

11. Peripherals

11.1 Peripheral Identifiers

Table 11-1 defines the Peripheral Identifiers of the SAM3S. A peripheral identifier is required for the control of the

peripheral interrupt with the Nested Vectored Interrupt Controller and for the control of the peripheral clock with the

Power Management Controller.

Table 11-1. Peripheral Identifiers

PMC Clock

Instance ID

Instance Name

SUPC

RSTC

RTC

NVIC Interrupt

Control

Instance Description

Supply Controller

Reset Controller

0

X

-

1

2

Real Time Clock

3

RTT

Real Time Timer

4

WDT

PMC

EEFC

-

Watchdog Timer

5

Power Management Controller

Enhanced Embedded Flash Controller

Reserved

6

7

8

UART0

UART1

SMC

PIOA

PIOB

PIOC

USART0

USART1

-

X

-

X

-

UART 0

9

UART 1

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

SMC

Parallel I/O Controller A

Parallel I/O Controller B

Parallel I/O Controller C

USART 0

USART 1

Reserved

-

Reserved

HSMCI

TWI0

TWI1

SPI

X

High Speed Multimedia Card Interface

Two Wire Interface 0

Two Wire Interface 1

Serial Peripheral Interface

Synchronous Serial Controller

Timer/Counter 0

SSC

TC0

TC1

Timer/Counter 1

TC2

Timer/Counter 2

TC3

Timer/Counter 3

TC4

Timer/Counter 4

TC5

Timer/Counter 5

ADC

Analog-to-Digital Converter

Digital-to-Analog Converter

Pulse Width Modulation

CRC Calculation Unit

Analog Comparator

USB Device Port

DACC

PWM

CRCCU

ACC

UDP

SAM3S [SUMMARY]

40

6500ES–ATARM–11-Feb-13

11.2 Peripheral Signal Multiplexing on I/O Lines

The SAM3S product features 2 PIO controllers on 48-pin and 64-pin versions (PIOA, PIOB) or 3 PIO controllers on the

100-pin version, (PIOA, PIOB, PIOC), that multiplex the I/O lines of the peripheral set.

The SAM3S 64-pin and 100-pin PIO Controllers control up to 32 lines. (See, Table 10-2.) Each line can be assigned to

one of three peripheral functions: A, B or C. The multiplexing tables in the following pages define how the I/O lines of the

peripherals A, B and C are multiplexed on the PIO Controllers. The column “Comments” has been inserted in this table

for the user’s own comments; it may be used to track how pins are defined in an application.

Note that some peripheral functions which are output only, might be duplicated within the tables.

SAM3S [SUMMARY]

41

6500ES–ATARM–11-Feb-13

11.2.1 PIO Controller A Multiplexing

Table 11-2. Multiplexing on PIO Controller A (PIOA)

I/O Line

PA0

Peripheral A

PWMH0

PWMH1

PWMH2

TWD0

Peripheral B

TIOA0

Peripheral C

A17

Extra Function

WKUP0

System Function

Comments

High drive

PA1

TIOB0

A18

WKUP1

PA2

SCK0

DATRG

WKUP2

PA3

NPCS3

TCLK0

PA4

TWCK0

RXD0

WKUP3

WKUP4

PA5

NPCS3

PCK0

PA6

TXD0

PA7

RTS0

PWMH3

ADTRG

NPCS1

NPCS2

PWMH0

PWMH1

PWMH2

PWMH3

XIN32

PA8

CTS0

WKUP5

WKUP6

XOUT32

PA9

URXD0

UTXD0

NPCS0

MISO

PWMFI0

PA10

PA11

PA12

PA13

PA14

WKUP7

MOSI

SPCK

WKUP8

WKUP14/PIODCEN1

PA15

TF

TIOA1

PWML3

PA16

PA17

PA18

PA19

PA20

PA21

PA22

PA23

PA24

PA25

PA26

PA27

PA28

PA29

PA30

PA31

TK

TD

TIOB1

PCK1

PWML2

PWMH3

A14

WKUP15/PIODCEN2

AD0

RD

PCK2

AD1

RK

PWML0

PWML1

PCK1

A15

AD2/WKUP9

AD3/WKUP10

AD8

RF

A16

RXD1

TXD1

SCK1

RTS1

CTS1

DCD1

DTR1

DSR1

RI1

64/100-pin versions

NPCS3

PWMH0

PWMH1

PWMH2

TIOA2

TIOB2

TCLK1

TCLK2

NPCS2

PCK2

NCS2

A19

AD9

PIODCCLK

PIODC0

A20

A23

PIODC1

MCDA2

MCDA3

MCCDA

MCCK

MCDA0

MCDA1

PIODC2

PIODC3

PIODC4

PIODC5

PWML2

NPCS1

WKUP11/PIODC6

PIODC7

SAM3S [SUMMARY]

42

6500ES–ATARM–11-Feb-13

11.2.2 PIO Controller B Multiplexing

Table 11-3. Multiplexing on PIO Controller B (PIOB)

I/O Line

PB0

Peripheral A

PWMH0

PWMH1

URXD1

Peripheral B

Peripheral C

Extra Function

AD4

System Function

Comments

PB1

AD5

PB2

NPCS2

PCK2

AD6/ WKUP12

AD7

PB3

UTXD1

PB4

TWD1

PWMH2

PWML0

TDI

TDO/TRACESWO

TMS/SWDIO

TCK/SWCLK

XOUT

PB5

TWCK1

WKUP13

PB6

PB7

PB8

PB9

XIN

PB10

PB11

PB12

PB13

PB14

DDM

DDP

PWML1

PWML2

NPCS1

ERASE

PCK0

DAC0

DAC1

64/100-pin versions

PWMH3

SAM3S [SUMMARY]

43

6500ES–ATARM–11-Feb-13

11.2.3 PIO Controller C Multiplexing

Table 11-4. Multiplexing on PIO Controller C (PIOC)

I/O Line

PC0

Peripheral A

Peripheral B

PWML0

PWML1

PWML2

PWML3

NPCS1

Peripheral C

Extra Function System Function

Comments

D0

100-pin version

PC1

D1

PC2

D2

PC3

D3

PC4

D4

PC5

D5

PC6

D6

PC7

D7

PC8

NWE

PC9

NANDOE

PC10

PC11

PC12

PC13

PC14

PC15

PC16

PC17

PC18

PC19

PC20

PC21

PC22

PC23

PC24

PC25

PC26

PC27

PC28

PC29

PC30

PC31

NANDWE

NRD

NCS3

AD12

AD10

NWAIT

PWML0

PWML1

NCS0

NCS1

AD11

A21/NANDALE

A22/NANDCLE

A0

A1

PWMH0

PWMH1

PWMH2

PWMH3

PWML3

TIOA3

A2

A3

A4

A5

A6

TIOB3

A7

TCLK3

TIOA4

A8

A9

TIOB4

A10

A11

A12

A13

TCLK4

TIOA5

AD13

AD14

TIOB5

TCLK5

SAM3S [SUMMARY]

44

6500ES–ATARM–11-Feb-13

12. Embedded Peripherals Overview

12.1 Serial Peripheral Interface (SPI)

z

Supports communication with serial external devices

z

Four chip selects with external decoder support allow communication with up to 15 peripherals

Serial memories, such as DataFlash and 3-wire EEPROMs

Serial peripherals, such as ADCs, DACs, LCD Controllers, CAN Controllers and Sensors

External co-processors

z

Master or slave serial peripheral bus interface

z

8- to 16-bit programmable data length per chip select

Programmable phase and polarity per chip select

Programmable transfer delays between consecutive transfers and between clock and data per chip select

Programmable delay between consecutive transfers

Selectable mode fault detection

z

Very fast transfers supported

z

Transfers with baud rates up to MCK

The chip select line may be left active to speed up transfers on the same device

12.2 Two Wire Interface (TWI)

z

Master, Multi-Master and Slave Mode Operation

Compatibility with Atmel two-wire interface, serial memory and I²C compatible devices

One, two or three bytes for slave address

Sequential read/write operations

Bit Rate: Up to 400 kbit/s

General Call Supported in Slave Mode

Connecting to PDC channel capabilities optimizes data transfers in Master Mode only

z

One channel for the receiver, one channel for the transmitter

Next buffer support

12.3 Universal Asynchronous Receiver Transceiver (UART)

z

Two-pin UART

z

Independent receiver and transmitter with a common programmable Baud Rate Generator

Even, Odd, Mark or Space Parity Generation

Parity, Framing and Overrun Error Detection

Automatic Echo, Local Loopback and Remote Loopback Channel Modes

Support for two PDC channels with connection to receiver and transmitter

12.4 Universal Synchronous Asynchronous Receiver Transceiver (USART)

z

Programmable Baud Rate Generator with Fractional Baud rate support

z

5- to 9-bit full-duplex synchronous or asynchronous serial communications

z

1, 1.5 or 2 stop bits in Asynchronous Mode or 1 or 2 stop bits in Synchronous Mode

Parity generation and error detection

Framing error detection, overrun error detection

MSB- or LSB-first

Optional break generation and detection

SAM3S [SUMMARY]

45

6500ES–ATARM–11-Feb-13

z

By 8 or by-16 over-sampling receiver frequency

Hardware handshaking RTS-CTS

Receiver time-out and transmitter timeguard

Optional Multi-drop Mode with address generation and detection

Optional Manchester Encoding

Full modem line support on USART1 (DCD-DSR-DTR-RI)

z

RS485 with driver control signal

ISO7816, T = 0 or T = 1 Protocols for interfacing with smart cards

z

NACK handling, error counter with repetition and iteration limit

z

SPI Mode

z

Master or Slave

Serial Clock programmable Phase and Polarity

SPI Serial Clock (SCK) Frequency up to MCK/4

z

IrDA modulation and demodulation

Communication at up to 115.2 Kbps

Test Modes

Remote Loopback, Local Loopback, Automatic Echo

z

12.5 Synchronous Serial Controller (SSC)

z

Provides serial synchronous communication links used in audio and telecom applications (with CODECs in Master

or Slave Modes, I²S, TDM Buses, Magnetic Card Reader)

Contains an independent receiver and transmitter and a common clock divider

Offers configurable frame sync and data length

z

Receiver and transmitter can be programmed to start automatically or on detection of different event on the frame

sync signal

z

Receiver and transmitter include a data signal, a clock signal and a frame synchronization signal

12.6 Timer Counter (TC)

z

Six 16-bit Timer Counter Channels

z

Wide range of functions including:

z

Frequency Measurement

Event Counting

Interval Measurement

Pulse Generation

Delay Timing

Pulse Width Modulation

Up/down Capabilities

z

Each channel is user-configurable and contains:

z

Three external clock inputs

Five internal clock inputs

Two multi-purpose input/output signals

z

Two global registers that act on all three TC Channels

Quadrature decoder

z

Advanced line filtering

Position / revolution / speed

z

2-bit Gray Up/Down Counter for Stepper Motor

SAM3S [SUMMARY]

46

6500ES–ATARM–11-Feb-13

12.7 Pulse Width Modulation Controller (PWM)

z

One Four-channel 16-bit PWM Controller, 16-bit counter per channel

z

Common clock generator, providing Thirteen Different Clocks

z

A Modulo n counter providing eleven clocks

Two independent Linear Dividers working on modulo n counter outputs

z

Independent channel programming

z

Independent Enable Disable Commands

Independent Clock Selection

Independent Period and Duty Cycle, with Double Buffering

Programmable selection of the output waveform polarity

Programmable center or left aligned output waveform

Independent Output Override for each channel

Independent complementary Outputs with 12-bit dead time generator for each channel

Independent Enable Disable Commands

Independent Clock Selection

Independent Period and Duty Cycle, with Double Buffering

z

Synchronous Channel mode

z

Synchronous Channels share the same counter

Mode to update the synchronous channels registers after a programmable number of periods

Connection to one PDC channel

Offers Buffer transfer without Processor Intervention, to update duty cycle of synchronous channels

z

independent event lines which can send up to 4 triggers on ADC within a period

Programmable Fault Input providing an asynchronous protection of outputs

Stepper motor control (2 Channels)

12.8 High Speed Multimedia Card Interface (HSMCI)

z

4-bit or 1-bit Interface

Compatibility with MultiMedia Card Specification Version 4.3

Compatibility with SD and SDHC Memory Card Specification Version 2.0

Compatibility with SDIO Specification Version V1.1.

Compatibility with CE-ATA Specification 1.1

Cards clock rate up to Master Clock divided by 2

Boot Operation Mode support

High Speed mode support

Embedded power management to slow down clock rate when not used

HSMCI has one slot supporting

z

One MultiMediaCard bus (up to 30 cards) or

One SD Memory Card

One SDIO Card

z

Support for stream, block and multi-block data read and write

12.9 USB Device Port (UDP)

z

USB V2.0 full-speed compliant,12 Mbits per second.

Embedded USB V2.0 full-speed transceiver

Embedded 2688-byte dual-port RAM for endpoints

SAM3S [SUMMARY]

47

6500ES–ATARM–11-Feb-13

z

Eight endpoints

z

Endpoint 0: 64 bytes

Endpoint 1 and 2: 64 bytes ping-pong

Endpoint 3: 64 bytes

Endpoint 4 and 5: 512 bytes ping-pong

Endpoint 6 and 7: 64 bytes ping-pong

Ping-pong Mode (two memory banks) for Isochronous and bulk endpoints

z

Suspend/resume logic

Integrated Pull-up on DDP

Pull-down resistor on DDM and DDP when disabled

12.10 Analog-to-Digital Converter (ADC)

z

up to 16 Channels,

10/12-bit resolution

up to 1 MSample/s

programmable sequence of conversion on each channel

Integrated temperature sensor

Single ended/differential conversion

Programmable gain: 1, 2, 4

12.11 Digital-to-Analog Converter (DAC)

z

Up to 2 channel 12-bit DAC

Up to 2 mega-samples conversion rate in single channel mode

Flexible conversion range

Multiple trigger sources for each channel

2 Sample/Hold (S/H) outputs

Built-in offset and gain calibration

Possibility to drive output to ground

Possibility to use as input to analog comparator or ADC (as an internal wire and without S/H stage)

Two PDC channels

Power reduction mode

12.12 Static Memory Controller

z

16-Mbyte Address Space per Chip Select

8- bit Data Bus

Word, Halfword, Byte Transfers

Programmable Setup, Pulse And Hold Time for Read Signals per Chip Select

Programmable Setup, Pulse And Hold Time for Write Signals per Chip Select

Programmable Data Float Time per Chip Select

External Wait Request

Automatic Switch to Slow Clock Mode

Asynchronous Read in Page Mode Supported: Page Size Ranges from 4 to 32 Bytes

NAND FLASH additional logic supporting NAND Flash with Multiplexed Data/Address buses

Hardware Configurable number of chip select from 1 to 4

Programmable timing on a per chip select basis

SAM3S [SUMMARY]

48

6500ES–ATARM–11-Feb-13

12.13 Analog Comparator

z

One analog comparator

High speed option vs. low power option

Selectable input hysteresis:

z

0, 20 mV, 50 mV

z

Minus input selection:

z

DAC outputs

Temperature Sensor

ADVREF

AD0 to AD3 ADC channels

z

Plus input selection:

All analog inputs

output selection:

z

Internal signal

external pin

selectable inverter

z

Interrupt on:

Rising edge, Falling edge, toggle

z

12.14 Cyclic Redundancy Check Calculation Unit (CRCCU)

z

32-bit cyclic redundancy check automatic calculation

z

CRC calculation between two addresses of the memory

SAM3S [SUMMARY]

49

6500ES–ATARM–11-Feb-13

13. Package Drawings

The SAM3S series devices are available in LQFP, QFN and TFBGA packages.

Figure 13-1. 100-lead LQFP Package Mechanical Drawing

Note : 1. This drawing is for general information only. Refer to JEDEC Drawing MS-026 for additional information.

SAM3S [SUMMARY]

50

6500ES–ATARM–11-Feb-13

Figure 13-2. 100-ball TFBGA Package Drawing

SAM3S [SUMMARY]

51

6500ES–ATARM–11-Feb-13

Figure 13-3. 64- and 48-lead LQFP Package Drawing

SAM3S [SUMMARY]

52

6500ES–ATARM–11-Feb-13

Table 13-1. 48-lead LQFP Package Dimensions (in mm)

Millimeter

Inch

Symbol

Min

–

Nom

Max

1.60

0.15

1.45

Min

–

Nom

Max

0.063

0.006

0.057

A

A1

A2

D

–

0.05

1.35

–

1.40

0.002

0.053

–

0.055

0.354 BSC

0.276 BSC

0.354 BSC

0.276 BSC

–

9.00 BSC

7.00 BSC

9.00 BSC

7.00 BSC

–

D1

E

E1

R2

R1

q

0.08

0°

0.20

–

0.003

0°

0.008

–

3.5°

7°

3.5°

7°

θ₁

θ₂

θ₃

c

0°

–

0°

–

11°

0.09

0.45

12°

13°

0.20

0.75

11°

12°

13°

0.008

0.030

12°

11°

12°

–

0.004

0.018

–

L

0.60

0.024

0.039 REF

–

L1

S

1.00 REF

–

0.20

0.17

–

0.008

0.007

–

b

0.20

0.27

0.008

0.020 BSC.

0.217

0.011

e

0.50 BSC.

5.50

D2

E2

5.50

Tolerances of Form and Position

aaa

bbb

ccc

ddd

0.20

0.08

0.008

0.003

SAM3S [SUMMARY]

53

6500ES–ATARM–11-Feb-13

Table 13-2. 64-lead LQFP Package Dimensions (in mm)

Millimeter

Inch

Symbol

Min

–

Nom

Max

1.60

0.15

1.45

Min

–

Nom

Max

0.063

0.006

0.057

A

A1

A2

D

–

0.05

1.35

–

0.002

0.053

–

0.055

0.472 BSC

0.383 BSC

0.472 BSC

0.383 BSC

–

1.40

12.00 BSC

D1

E

10.00 BSC

12.00 BSC

E1

R2

R1

q

10.00 BSC

0.08

0°

–

0.20

–

0.003

0°

0.008

–

3.5°

–

7°

3.5°

7°

θ₁

θ₂

θ₃

c

0°

–

0°

–

11°

0.09

0.45

12°

13°

0.20

0.75

11°

12°

13°

0.008

0.030

12°

11°

12°

–

0.004

0.018

–

L

0.60

1.00 REF

–

0.024

0.039 REF

–

L1

S

0.20

0.17

–

0.008

0.007

–

b

0.20

0.50 BSC.

7.50

0.27

0.008

0.020 BSC.

0.285

0.011

e

D2

E2

Tolerances of Form and Position

aaa

bbb

ccc

ddd

0.20

0.08

0.008

0.003

SAM3S [SUMMARY]

54

6500ES–ATARM–11-Feb-13

Figure 13-4. 48-pad QFN Package

SAM3S [SUMMARY]

55

6500ES–ATARM–11-Feb-13

Table 13-3. 48-pad QFN Package Dimensions (in mm)

Millimeter

Inch

Nom

Symbol

Min

–

Nom

–

Max

090

Min

–

Max

0.035

0.002

0.028

A

A1

A2

A3

b

–

0.050

0.70

–

0.65

–

0.026

0.008 REF

0.008

0.276 bsc

0.220

0.276 bsc

0.220

0.016

0.020 bsc

–

0.20 REF

0.20

0.18

5.45

0.23

5.75

0.007

0.215

0.009

0.226

D

7.00 bsc

5.60

D2

E

7.00 bsc

5.60

E2

L

5.45

0.35

5.75

0.45

0.215

0.014

0.226

0.018

0.40

e

0.50 bsc

–

R

0.09

–

0.004

–

Tolerances of Form and Position

aaa

bbb

ccc

0.10

0.05

0.004

0.002

SAM3S [SUMMARY]

56

6500ES–ATARM–11-Feb-13

Figure 13-5. 64-pad QFN Package Drawing

SAM3S [SUMMARY]

57

6500ES–ATARM–11-Feb-13

14. Ordering Information

Table 14-1. Ordering Codes for SAM3S Series Devices

Flash

(Kbytes)

Package

(Kbytes)

Package

Type

Temperature

Operating Range

Ordering Code

MRL A

MRL B

Industrial

-40°C to 85°C

ATSAM3S4CA-AU

A

–

256

QFP100

BGA100

QFP64

QFN64

QFP48

QFN48

QFP100

BGA100

QFP64

QFN64

QFP48

QFN48

QFP100

BGA100

QFP64

QFN64

QFP48

QFN48

QFP100

BGA100

QFP64

QFN64

QFP48

QFN48

Green

Industrial

-40°C to 85°C

ATSAM3S4CA-CU

ATSAM3S4BA-AU

ATSAM3S4BA-MU

ATSAM3S4AA-AU

ATSAM3S4AA-MU

ATSAM3S2CA-AU

ATSAM3S2CA-CU

ATSAM3S2BA-AU

ATSAM3S2BA-MU

ATSAM3S2AA-AU

ATSAM3S2AA-MU

ATSAM3S1CA-AU

ATSAM3S1CA-CU

ATSAM3S1BA-AU

ATSAM3S1BA-MU

ATSAM3S1AA-AU

ATSAM3S1AA-MU

ATSAM3S1CB-AU

ATSAM3S1CB-CU

ATSAM3S1BB-AU

ATSAM3S1BB-MU

ATSAM3S1AB-AU

ATSAM3S1AB-MU

A

–

B

256

128

64

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

64

Industrial

-40°C to 85°C

–

64

Industrial

-40°C to 85°C

–

64

Industrial

-40°C to 85°C

–

64

Industrial

-40°C to 85°C

–

64

Industrial

-40°C to 85°C

–

64

SAM3S [SUMMARY]

58

6500ES–ATARM–11-Feb-13

Revision History

Change

Doc. Rev

Comments

Request Ref.

Section 1. “Features”updated, “Low Power Modes” , Sleep and Backup modes, down to 1.8 µA in

rfo

Backup mode

Figure 8-1, "SAM3S Product Mapping", SRAM associated 1 MByte bit band region mapping changed:

0x22000000 to 0x23FFFFFF.

6500ES

Document format updated, subsequently pagination changed

8545

Section 14. “Ordering Information” Introduced MRL B for SAM3S1 parts..

8044

Replace all mention to 100-ball LFBGA into 100-ball TFBGA.

7632

Add table note 5 in Table 3-1, “Signal Description List”.

7639

Add MOSCRCEN bit details in Section 5.5.2 “Wait Mode”.

7668-7901

7887

Section 9.1.3.9 “Fast Flash Programming Interface” updated.

Notes under Figure 5-1, "Single Supply" and Figure 5-2, "Core Externally Supplied" modified.

Cross-References (1) added for 64-pin packages in table Table 1-1, “Configuration Summary”.

Pin 22 value changed for PA23/PGMD11 in Table 4-1, “100-lead LQFP SAM3S4/2/1C Pinout”.

6500DS

8033

8093

8095

"High Frequency Asynchronous clocking mode" removed from Section 12.7 “Pulse Width Modulation

Controller (PWM)”

“Write Protected Registers” added in “Description” , in Peripherals list.

ADC column values updated in Table 1-1, “Configuration Summary”.

8213

rfo

Missing PGMD8 to 15 added to Table 4-1, “100-lead LQFP SAM3S4/2/1C Pinout” and Table 4-2,

“100-ball TFBGA SAM3S4/2/1C Pinout”.

rfo

Section 5.7 “Fast Startup” updated.

7536

7524

Typo fixed on back page: ‘techincal’ --> ‘technical’.

Typos fixed in Section 1. “Features”.

Missing title added to Table 14-1.

6500CS

7494

7492

7428

PLLA input frequency range updated in Section 10.5 “Clock Generator”.

A sentence completed in Section 5.5.2 “Wait Mode”.

Last sentence removed from Section 9.1.3.10 “SAM-BA^®Boot”.

‘three GPNVM bits’ replaced by ‘two GPNVM bits’ in Section 9.1.3.11 “GPNVM Bits”.

Leftover sentence removed from Section 4.1 “SAM3S4/2/1C Package and Pinout”.

7394

“Packages” on page 2, package size or pitch updated.

7214

Table 1-1, “Configuration Summary”, ADC column updated, footnote gives precision on reserved

channel.

6981

Table 4-2, “100-ball TFBGA SAM3S4/2/1C Pinout”, pinout information is available.

7201

Figure 5-1, "Single Supply",Figure 5-2, "Core Externally Supplied" , updated notes below figures.

7243/rfo

6500BS

6500AS

Figure 5-2, "Core Externally Supplied", Figure 5-3, "Backup Battery", ADC, DAC, Analog Comparator

supply is 2.0V-3.6V.

Section 12.13 “Analog Comparator”, “Peripherals” on page 2, reference to “window function”

removed.

7103

7307

Section 9.1.3.8 “Unique Identifier”, Each device integrates its own 128-bit unique identifier.

First issue

SAM3S [SUMMARY]

59

6500ES–ATARM–11-Feb-13

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型号：	ATSAM3S1CB-AUR
厂家：	MICROCHIP
描述：	IC MCU 32BIT 64KB FLASH 100LQFP 时钟外围集成电路
文件：	总60页 (文件大小：1946K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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