ATWINC3400-MR210CAXXX [MICROCHIP]
IEEE® 802.11 b/g/n Network Controller with Integrated Bluetooth® Low Energy Module;
| 型号： | ATWINC3400-MR210CAXXX |
| 厂家： | 
MICROCHIP |
| 描述： | IEEE® 802.11 b/g/n Network Controller with Integrated Bluetooth® Low Energy Module |
| 文件： | 总59页 (文件大小：1386K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ATWINC3400-MR210xA
®
IEEE 802.11 b/g/n Network Controller with Integrated
®
Bluetooth Low Energy Module
Introduction
The ATWINC3400-MR210xA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network
controller with Bluetooth Low Energy module. The ATWINC3400-MR210xA modules are Bluetooth 5.0 certified.
This module is optimized for low power and high performance mobile applications. This module features small
form factor with integrated Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/Receive (T/R) switch (for
Wi-Fi® and Bluetooth) and Power Management Unit (PMU). The ATWINC3400-MR210CA integrates a chip antenna
while the ATWINC3400-MR210UA adds a micro co-ax (u.FL) connector for connecting to an external antenna. The
ATWINC3400-MR210xA module requires a 32.768 kHz clock for sleep operation.
The ATWINC3400-MR210xA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols, and
provides Serial Peripheral Interface (SPI) to interface with the host controller.
The references to the ATWINC3400-MR210xA module include the following devices:
•
•
ATWINC3400-MR210CA – Integrates a chip antenna
ATWINC3400-MR210UA – Adds a micro co-ax (u.FL) connector for connecting to an external antenna
Features
Wi-Fi features:
•
•
•
•
•
•
•
•
•
IEEE 802.11 b/g/n RF/PHY/MAC
IEEE 802.11 b/g/n (1x1) with Single Spatial Stream, up to 72 Mbps PHY Rate in a 2.4 GHz ISM Band
Integrated Chip Antenna or Micro Co-ax (U.FL) Connector for an External Antenna
Superior Sensitivity and Range via Advanced PHY Signal Processing
Advanced Equalization and Channel Estimation
Advanced Carrier and Timing Synchronization
Supports Soft-AP
Supports IEEE 802.11 WEP, WPA and WPA2 Personal and WPA2 Enterprise (firmware version 1.3.1 or later)
Superior MAC Throughput through Hardware Accelerated Two-Level A-MSDU/A-MPDU Frame Aggregation and
Block Acknowledgment
•
•
•
•
•
On-Chip Memory Management Engine to Reduce the Host Load
Operating Temperature Range from -40°C to +85°C
Input/Output voltage ranges from 2.7V to 3.6V
Power supply (VBAT) ranges from 3.0V to 4.2V
Wi-Fi Alliance® Certified for Connectivity and Optimizations
– ID: WFA62065
•
•
•
•
•
Integrated On-Chip Microcontroller
SPI Host Interface
Integrated Flash Memory for Wi-Fi and Bluetooth System Software
Low Leakage On-Chip Memory for State Variables
Fast AP Re-Association (150 ms)
DS70005350D-page 1
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
•
•
On-Chip Network Stack to Offload MCU
Network Features: Firmware version 1.2.0 or later
– TCP, UDP, DHCP, ARP, HTTP, TLS, DNS and SNTP
Bluetooth features:
•
•
•
ATWINC3400-MR210xA Bluetooth Low Energy Certification (end product) QD ID: 112092
Adaptive Frequency Hopping (AFH)
Superior Sensitivity and Range
DS70005350D-page 2
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Table of Contents
Introduction.....................................................................................................................................................1
Features......................................................................................................................................................... 1
1. Ordering Information and Module Marking..............................................................................................5
2. Block Diagram.........................................................................................................................................6
3. Pinout and Package Information.............................................................................................................7
3.1. Package Description.................................................................................................................. 10
4. Electrical Characteristics....................................................................................................................... 11
4.1. Absolute Maximum Ratings........................................................................................................11
4.2. Recommended Operating Conditions........................................................................................ 11
4.3. DC Characteristics..................................................................................................................... 12
4.4. IEEE 802.11 b/g/n Radio Performance...................................................................................... 12
4.5. Bluetooth Radio Performance.................................................................................................... 14
5. Power Management..............................................................................................................................17
5.1. Device States............................................................................................................................. 17
5.2. Controlling Device States...........................................................................................................17
5.3. Power-Up/Down Sequence........................................................................................................18
5.4. Digital I/O Pin Behavior During Power-Up Sequences...............................................................19
6. Clocking................................................................................................................................................ 20
6.1. Low-Power Clock....................................................................................................................... 20
7. CPU and Memory Subsystem...............................................................................................................21
7.1. Processor................................................................................................................................... 21
7.2. Memory Subsystem....................................................................................................................21
7.3. Nonvolatile Memory (eFuse)...................................................................................................... 21
8. WLAN Subsystem.................................................................................................................................23
8.1. MAC........................................................................................................................................... 23
8.2. PHY............................................................................................................................................24
8.3. Radio..........................................................................................................................................24
9. Bluetooth Low Energy...........................................................................................................................26
10. External Interfaces................................................................................................................................ 27
10.1. Interfacing with the Host Microcontroller.................................................................................... 27
10.2. SPI Client Interface.................................................................................................................... 28
10.3. UART Interface...........................................................................................................................30
10.4. I2C Client Interface.....................................................................................................................31
11. Application Reference Design...............................................................................................................33
11.1. Host Interface.............................................................................................................................33
12. Module Outline Drawings......................................................................................................................35
DS70005350D-page 3
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
13. Design Considerations..........................................................................................................................39
13.1. ATWINC3400-MR210CA............................................................................................................39
13.2. ATWINC3400-MR210UA External Antenna Connector............................................................. 42
13.3. Reflow Profile Information.......................................................................................................... 44
13.4. Module Assembly Considerations..............................................................................................44
13.5. Conformal Coating..................................................................................................................... 44
14. Appendix A: Regulatory Approval......................................................................................................... 45
14.1. United States..............................................................................................................................45
14.2. Canada.......................................................................................................................................47
14.3. Europe........................................................................................................................................49
14.4. Japan..........................................................................................................................................50
14.5. Korea..........................................................................................................................................50
14.6. Taiwan........................................................................................................................................ 51
14.7. China..........................................................................................................................................52
14.8. Other Regulatory Information.....................................................................................................52
15. Reference Documentation.................................................................................................................... 53
16. Document Revision History...................................................................................................................54
The Microchip Website.................................................................................................................................56
Product Change Notification Service............................................................................................................56
Customer Support........................................................................................................................................ 56
Microchip Devices Code Protection Feature................................................................................................56
Legal Notice................................................................................................................................................. 57
Trademarks.................................................................................................................................................. 57
Quality Management System....................................................................................................................... 58
Worldwide Sales and Service.......................................................................................................................59
DS70005350D-page 4
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Ordering Information and Module Marking
1.
Ordering Information and Module Marking
The following table provides the ordering details for the ATWINC3400-MR210xA module.
Table 1-1.ꢀOrdering Details
Regulatory
Information
Model Number
Ordering Code
Package
Description
ATWINC3400-MR210CA
ATWINC3400-MR210CAxxx(1)
22.43 x 14.73 Certified module FCC, IC, CE,
x 2.0 mm
with chip
antenna
MIC, KCC, NCC,
SRC
ATWINC3400-MR210UA
ATWINC3400-MR210UAxxx(1)
22.43 x 14.73 Certified module FCC, IC, CE
x 2.0 mm
with u.FL
connector for an
external antenna
Note:ꢀ
1. 'xxx' in the preceding table and following figure denotes the software version. For example, at the time of
publish, the software is v1.22, so its equivalent order code is ATWINC3400-MR210CA122. The order code
changes with the software version. For more information on the ordering code, refer to the ATWINC3400
product page.
The following figure illustrates the ATWINC3400-MR210xA module marking information.
Figure 1-1.ꢀMarking Information
MR
2
1
0
C/U
A
xxx
ATWINC3400
Device name
MR: Internal Code
2: OTA with shield
1: Reserved
0: Reserved
C: Chip antenna
U: External antenna
Revision letter
Software version
Blank: Tray Packing
T: Tape and Reel
DS70005350D-page 5
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Block Diagram
2.
Block Diagram
The following figure shows the block diagram of the ATWINC3400-MR210xA module.
Figure 2-1.ꢀATWINC3400-MR210xA Module Block Diagram
ATWINC3400-MR210xA
2.4 GHz
Chip Antenna
or
u.FL Connector for
an External Antenna
Discrete Balun
UART TXD/RXD
BT TXD/RXD
BT RTS/CTS
SPI
RX/TX
and
Filter
ATWINC3400 IC
I2C
26 MHz
Crystal
GPIOs
GND
DS70005350D-page 6
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Pinout and Package Information
3.
Pinout and Package Information
This package contains an exposed paddle that must be connected to the system board ground. The ATWINC3400-
MR210xA module pin assignment is shown in the following figure. This package contains an exposed paddle, Pin 37,
PADDLE VSS, that must be connected to the system board ground.
Figure 3-1.ꢀATWINC3400-MR210xA Module Pin Assignment
ATWINC3400-MR210xA
MODULE
GND
J1
GND
SPI_CFG
J2
J3
J36
I2C_SDA_M
I2C_SCL_M
IRQN
N/C
N/C
N/C
J35
J34
J33
J4
J5
J6
J7
GPIO20
N/C
J32
J31
J30
J29
GPIO19
RESETN
BT_TXD
BT_RXD
GPIO18
J8
J9
GPIO17
GND
I2C_SDA_S
I2C_SCL_S
VDDIO
J28
J27
J10
J11
GPIO7
SPI_MOSI
SPI_SSN
J12
J13
J26
J25
GND
The following table provides the ATWINC3400-MR210xA module pin description.
Table 3-1.ꢀATWINC3400-MR210xA Module Pin Description
Pin #
Pin Name
GND
Pin Type
Description
1
2
GND
Ground pin
SPI_CFG
Digital Input
Serial Peripheral Interface pin, which must be tied to
VDDIO
3
4
5
6
NC
NC
NC
NC
—
—
—
—
No connection
No connection
No connection
No connection
DS70005350D-page 7
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Pinout and Package Information
...........continued
Pin #
Pin Name
Pin Type
Digital Input
Description
7
RESETN
•
•
Active-low hard Reset pin
When the Reset pin is asserted low, the module
is in the Reset state. When the Reset pin is
asserted high, the module functions normally
•
This pin must connect to a host output that is
low by default on power-up. If the host output is
tri-stated, add a 1 MOhm pull-down resistor to
ensure a low level at power-up
8
9
BT_TXD
Digital I/O,
Programmable pull up
•
•
Bluetooth UART transmit data output pin
Used only during debug for DTM interface. SPI
is the data and control interface with the host
Microcontroller
•
It is recommended to add a test point for this pin
BT_RXD
Digital I/O,
Programmable pull up
•
•
Bluetooth UART receive data input pin
Used only during debug for the DTM interface.
SPI is the data and control interface with the
host Microcontroller
•
Adding a test point for this pin is recommended
10
11
I2C_SDA_S
I2C_SCL_S
Digital I/O,
Programmable pull up
•
•
I2C Client data pin
Used only for test purposes. Adding a test point
for this pin is recommended
Digital I/O,
Programmable pull up
•
•
I2C Client clock pin
Used only for test purposes. Adding a test point
for this pin is recommended
12
13
14
VDDIO
GND
Power
GND
Digital I/O power supply
Ground pin
GPIO3
Digital I/O,
General Purpose Input/Output pin(1)
Programmable pull up
15
16
GPIO4
Digital I/O,
Programmable pull up
General Purpose Input/Output pin(1)
UART_TXD
Digital I/O,
Programmable pull up
•
•
Wi-Fi UART TxD output pin
Used only for debug development purposes.
Adding a test point for this pin is recommended
17
18
UART_RXD
VBAT
Digital I/O,
Programmable pull up
•
•
Wi-Fi UART RxD input pin
Used only for debug development purposes.
Adding a test point for this pin is recommended
Power
Power supply pin for DC/DC converter and PA
DS70005350D-page 8
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Pinout and Package Information
...........continued
Pin #
Pin Name
Pin Type
Digital Input
Description
19
CHIP_EN
•
•
PMU enable pin
When the CHIP_EN pin is asserted high, the
module is enabled. When the CHIP_EN pin is
asserted low, the module is disabled or put into
Power-Down mode
•
Connect to a host output that is low by default
at power-up. If the host output is tri-stated, add
a 1 MOhm pull-down resistor, if necessary, to
ensure a low level at power-up
20
RTC_CLK
Digital I/O,
Programmable pull up
•
•
RTC Clock input pin
This pin must connect to a 32.768 kHz clock
source
21
22
GND
GND
Ground pin
GPIO8
Digital I/O,
General Purpose Input/Output pin(1)
Programmable pull up
23
24
25
26
27
SPI_SCK
SPI_MISO
SPI_SSN
SPI_MOSI
GPIO7
Digital I/O,
Programmable pull up
SPI clock pin
Digital I/O,
Programmable pull up
SPI MISO (Host In Client Out) pin
Active-low SPI SSN (Client Select) pin
SPI MOSI (Host Out Client In) pin
General Purpose Input/Output pin(1)
Digital I/O,
Programmable pull up
Digital I/O,
Programmable pull up
Digital I/O,
Programmable pull up
28
29
GND
GND
Ground pin
GPIO17
Digital I/O,
General Purpose Input/Output pin(1)
Programmable pull up
30
31
32
33
GPIO18
GPIO19
GPIO20
IRQN
Digital I/O,
Programmable pull up
General Purpose Input/Output pin(1)
General Purpose Input/Output pin(1)
General Purpose Input/Output pin(1)
Digital I/O,
Programmable pull up
Digital I/O,
Programmable pull up
Digital output,
Programmable pull up
•
•
ATWINC3400-MR210xA module host interrupt
request output pin
This pin must connect to a host interrupt pin
34
35
I2C_SCL_M
I2C_SDA_M
Digital I/O,
Programmable pull up
I2C Host clock pin
Digital I/O,
I2C Host data pin
Programmable pull up
36
37
GND
GND
GND
Ground pin
PADDLE VSS
Connect to the system board ground
DS70005350D-page 9
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Pinout and Package Information
Note:ꢀ
1. Usage of the GPIO functionality is not supported by the firmware. The data sheet will be updated once the
support for this feature is added.
3.1
Package Description
The following table provides the ATWINC3400-MR210xA module package dimensions.
Table 3-2.ꢀATWINC3400-MR210xA Module Package Information
Parameter
Value
37
Unit
Pad count
—
Package size
22.43 x 14.73
2.09
Total thickness
Pad pitch
1.20
mm
Pad width
0.81
Exposed pad size
4.4 x 4.4
DS70005350D-page 10
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
4.
Electrical Characteristics
This chapter provides an overview of the electrical characteristics of the ATWINC3400-MR210xA module.
4.1
Absolute Maximum Ratings
The following table provides the absolute maximum ratings for the ATWINC3400-MR210xA module.
Table 4-1.ꢀATWINC3400-MR210xA Module Absolute Maximum Ratings
Symbol
VDDIO
Parameter
I/O supply voltage
Min.
-0.3
-0.3
-0.3
-0.3
Max.
5.0
Unit
VBAT
VIN
Battery supply voltage
Digital input voltage
Analog input voltage
5.0
VDDIO
1.5
V
VAIN
Electrostatic discharge
Human Body Model (HBM)
-1000, -2000 (see notes +1000, +2000 (see notes
VESDHBM
below)
below)
TA
—
—
Storage temperature
Junction temperature
RF input power
-65
150
ºC
—
125
—
23
dBm
1. VIN corresponds to all the digital pins.
2. For VESDHBM, each pin is classified as Class 1, Class 2 or both:
2.1.
2.2.
2.3.
The Class 1 pins include all the pins (both analog and digital).
The Class 2 pins include all digital pins only.
VESDHBM is ±1 kV for Class 1 pins. VESDHBM is ± 2 kV for Class 2 pins.
Stresses beyond those listed under “Absolute Maximum Ratings” cause permanent damage to the device.
This is a stress rating only. The functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods affects the device reliability.
CAUTION
4.2
Recommended Operating Conditions
The following table provides the recommended operating conditions for the ATWINC3400-MR210xA module.
Table 4-2.ꢀATWINC3400-MR210xA Module Recommended Operating Conditions
Symbol
VDDIO
Parameter
Min.
2.7
Typ.
3.3
3.3
—
Max.
3.6
4.2
85
Units
V
I/O supply voltage (1)
Battery supply voltage(2)(3)
Operating temperature
VBAT
—
3.0
V
-40
ºC
DS70005350D-page 11
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
Notes:ꢀ
1. I/O supply voltage is applied to the VDDIO pin.
2. Battery supply voltage is applied to the VBAT pin.
3. The ATWINC3400-MR210xA module is functional across this range of voltages; however, optimal RF
performance is ensured for VBAT of 3.3V.
4.3
DC Characteristics
The following table provides the DC characteristics for the ATWINC3400-MR210xA module digital pads.
Table 4-3.ꢀDC Electrical Characteristics
Symbol
Parameter
Min
Typ
Max
Unit
VIL
Input Low
Voltage
-0.30
—
0.60
VIH
VOL
VOH
—
Input High
Voltage
VDDIO - 0.60
—
—
—
—
—
VDDIO + 0.30
V
Output Low
Voltage
—
0.45
—
Output High
Voltage
VDDIO - 0.50
Output Load
Capacitance
—
—
20
6
pF
—
Digital Input Load
Capacitance
4.4
IEEE 802.11 b/g/n Radio Performance
4.4.1
Receiver Performance
The receiver performance is tested under the following conditions:
•
•
•
•
VBAT = 3.3V
VDDIO = 3.3V
Temp = 25°C
Measured after RF matching network
The following table provides the receiver performance characteristics for the ATWINC3400-MR210xA module.
Table 4-4.ꢀIEEE 802.11 Receiver Performance Characteristics
Parameter
Frequency
Description
Min.
2,412
—
Typ.
—
Max.
2,484
—
Unit
—
MHz
1 Mbps DSSS
2 Mbps DSSS
-95.0
-94.0
-90.0
-86.0
—
—
Sensitivity 802.11b
dBm
5.5 Mbps DSSS
11 Mbps DSSS
—
—
—
—
DS70005350D-page 12
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
...........continued
Parameter
Description
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ.
-90.0
-89.0
-87.0
-85.0
-82.0
-79.0
-75.0
-73.0
-89.0
-87.0
-84.0
-82.0
-78.0
-75.0
-73.0
-71.0
0
Max.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unit
6 Mbps OFDM
9 Mbps OFDM
12 Mbps OFDM
18 Mbps OFDM
Sensitivity 802.11g
dBm
24 Mbps OFDM
36 Mbps OFDM
48 Mbps OFDM
54 Mbps OFDM
MCS 0
MCS 1
MCS 2
Sensitivity 802.11n
(BW = 20 MHz, 800
ns GI)
MCS 3
dBm
MCS 4
MCS 5
MCS 6
MCS 7
1-11 Mbps DSSS
6-54 Mbps OFDM
MCS 0 – 7 (800 ns GI)
1 Mbps DSSS (30 MHz offset)
11 Mbps DSSS (25 MHz offset)
6 Mbps OFDM (25 MHz offset)
54 Mbps OFDM (25 MHz offset)
MCS 0 – 20 MHz BW (25 MHz offset)
MCS 7 – 20 MHz BW (25 MHz offset)
Maximum receive
signal level
0
dBm
0
50
43
40
Adjacent channel
rejection
dB
25
40
20
4.4.2
Transmitter Performance
The transmitter performance is tested under the following conditions:
•
•
•
VBAT = 3.3V
VDDIO = 3.3V
Temp = 25°C
The following table provides the transmitter performance characteristics for the ATWINC3400-MR210xA module.
Table 4-5.ꢀIEEE 802.11 Transmitter Performance Characteristics
Parameter
Frequency
Description
Minimum
Typical
Max.
Unit
—
2,412
—
2,484
MHz
DS70005350D-page 13
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
...........continued
Parameter
Description
802.11b 1 Mbps
Minimum
Typical
16.7(1)
17.5(1)
18.3(1)
13.0(1)
17.5(1)
12.5 (1)(2)
±1.5(3)
30.0
Max.
—
Unit
—
—
—
—
—
—
—
—
—
—
802.11b 11 Mbps
—
802.11g OFDM 6 Mbps
—
Output power
dBm
802.11g OFDM 54 Mbps
—
802.11n HT20 MCS 0 (800 ns GI)
—
802.11n HT20 MCS 7 (800 ns GI)
—
TX power accuracy
Carrier suppression
—
—
dB
—
—
dBc
Harmonic output power
(Radiated, Regulatory
mode)
2nd
3rd
—
-41
-41
dBm/MHz
—
Notes:ꢀ
1. Measured as per IEEE 802.11 specifications.
2. The typical output power is 10 dBm only for channel-10 (2.457 GHz). Values mentioned in the preceding table
are applicable for all the other channels.
3. Measured after RF matching network.
4. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of
25°C with a 2-3 dB change at the boundary conditions.
5. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas
and/or enclosures, in which case re-certification may be required.
6. The availability of some specific channels and/or operational frequency bands are country-dependent and
must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit
exposing the settings to the end user. This requirement needs to be taken care of via the host implementation.
7. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table.
This insertion loss accounts for PCB trace losses, and the filter network loss to the U.FL connector.
4.5
Bluetooth Radio Performance
4.5.1
Receiver Performance
The receiver performance is tested under the following conditions:
•
•
•
•
VBAT = 3.3V
VDDIO = 3.3V
Temp: 25°C
Measured after RF matching network
The following table provides the Bluetooth receiver performance characteristics for the ATWINC3400-MR210xA
module.
Table 4-6.ꢀBluetooth Receiver Performance Characteristics
Parameter
Frequency
Sensitivity (ideal Tx)
Description
Min.
2,402
—
Typ.
—
Max.
2,480
—
Unit
—
MHz
Bluetooth Low Energy (GFSK)
-92.5
dBm
Maximum receive signal level Bluetooth Low Energy (GFSK)
—
-2
—
DS70005350D-page 14
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
...........continued
Parameter
Description
Co-channel
Min.
—
Typ.
9
Max.
—
Unit
adjacent + 1 MHz
adjacent - 1 MHz
—
-4
—
—
-2
—
adjacent + 2 MHz (image
frequency)
—
-24
—
adjacent - 2 MHz
—
—
-25
-27
—
—
Interference performance
(Bluetooth Low Energy)
adjacent + 3 MHz (adjacent to
image)
dB
adjacent - 3 MHz
adjacent + 4 MHz
adjacent - 4 MHz
adjacent + 5 MHz
adjacent - 5 MHz
—
—
—
—
—
-27
-28
-27
-27
-27
—
—
—
—
—
4.5.2
Transmitter Performance
The transmitter performance is tested under the following conditions:
•
•
•
•
VBAT = 3.3V
VDDIO = 3.3V
Temp: 25°C
Measured after RF matching network
The following table provides the Bluetooth transmitter performance characteristics for the ATWINC3400-MR210xA
module.
Table 4-7.ꢀBluetooth Transmitter Performance Characteristics
Parameter
Frequency
Description
Min.
2,402
Typ.
Max.
2,480
Unit
—
—
MHz
Output power
Bluetooth Low Energy (GFSK)
N + 2 (Image frequency)
—
—
—
3.3
-33
-32
3.8
—
N + 3 (Adjacent to image
frequency)
—
dBm
In-band spurious emission
(Bluetooth Low Energy)
N - 2
N - 3
—
—
-48
-47
—
—
DS70005350D-page 15
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Electrical Characteristics
Notes:ꢀ
1. Measured after RF matching network.
2. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of
25°C with a 2-3 dB change at the boundary conditions.
3. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas
and/or enclosures, in which case re-certification may be required.
4. The availability of some specific channels and/or operational frequency bands are country-dependent and
must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit
exposing the settings to the end user. This requirement needs to be taken care of via the host implementation.
5. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table.
This insertion loss accounts for PCB trace losses and the filter network loss to the u.FL connector.
DS70005350D-page 16
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Power Management
5.
Power Management
5.1
Device States
The ATWINC3400-MR210xA module has multiple device states, based on the state of the IEEE 802.11 and Bluetooth
subsystems. It is possible for both subsystems to be active at the same time. To simplify the device power
consumption breakdown, the following basic states are defined. One subsystem can be active at a time:
•
•
•
•
•
•
WiFi_ON_Transmit – Device actively transmits IEEE 802.11 signal
WiFi_ON_Receive – Device actively receives IEEE 802.11 signal
BT_ON_Transmit – Device actively transmits Bluetooth signal
BT_ON_Receive – Device actively receives Bluetooth signal
Doze – Device is powered on but it does not actively transmit or receive data
Power_Down – Device core supply is powered off
5.2
Controlling Device States
The following table shows different device states and their power consumption for the ATWINC3400-MR210xA . The
device states can be switched using the following:
•
•
CHIP_EN – Module pin (pin 19) enables or disables the DC/DC converter
VDDIO – I/O supply voltage from external supply
In the ON states, VDDIO is ON and CHIP_EN is high (at VDDIO voltage level). To change from the ON states
to Power_Down state, connect the RESETN and CHIP_EN pin to logic low (GND) by following the power-down
sequence mentioned in Figure 5-1. When VDDIO is OFF and CHIP_EN is low, the chip is powered off with no
leakage.
Table 5-1.ꢀDevice States Current Consumption
Current Consumption(1)
Output Power
Device State
Code Rate
(dBm)
IVBAT
IVDDIO
24 mA
ON_WiFi_Transmit
802.11b 1 Mbps
802.11b 11 Mbps
802.11g 6 Mbps
802.11g 54 Mbps
802.11n MCS 0
802.11n MCS 7
802.11b 1 Mbps
802.11b 11 Mbps
802.11g 6 Mbps
802.11g 54 Mbps
802.11n MCS 0
802.11n MCS 7
BLE 1 Mbps
16.7
17.5
18.3
13.0
17.5
12.5
N/A
N/A
N/A
N/A
N/A
N/A
3.3
271 mA
265 mA
275 mA
235 mA
272 mA
232 mA
63.9 mA
63.9 mA
63.9 mA
63.9 mA
63.9 mA
63.9 mA
79.37 mA
24 mA
24 mA
24 mA
24 mA
24 mA
ON_WiFi_Receive
23.7 mA
23.7 mA
23.7 mA
23.7 mA
23.7 mA
23.7 mA
23.68 mA
ON_BT_Transmit
ON_BT_Receive
BLE 1 Mbps
N/A
51.36 mA
23.68 mA
DS70005350D-page 17
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Power Management
...........continued
Device State
Current Consumption(1)
Output Power
(dBm)
Code Rate
IVBAT
IVDDIO
Doze (Bluetooth Low
Energy Idle)
N/A
N/A
N/A
N/A
N/A
N/A
53 mA (2)
1 mA (2)
Doze (Bluetooth Low
Energy Low Power)
Power_Down
10.5 uA(2)
Notes:ꢀ
1. Conditions: VBAT = 3.3V, VDDIO = 3.3V, at 25°C.
2. Current consumption mentioned for these states is the sum of current consumed in VDDIO and VBAT voltage
rails.
When power is not supplied to the device (DC/DC converter output and VDDIO are OFF, at ground potential), voltage
cannot be applied to the ATWINC3400-MR210xA module pins because each pin contains an ESD diode from the pin
to supply. This diode turns on when voltage higher than one diode-drop is supplied to the pin.
If voltage must be applied to the signal pads when the chip is in a low-power state, the VDDIO supply must be ON,
so the Power_Down state must be used. Similarly, to prevent the pin-to-ground diode from turning ON, do not apply
voltage that is more than one diode-drop below the ground to any pin.
5.3
Power-Up/Down Sequence
The following figure illustrates the power-up/down sequence for the ATWINC3400-MR210xA.
Figure 5-1.ꢀ Power-Up/Down Sequence
VBATT
tA
tA'
VDDIO
tB
tB'
CHIP_EN
RESETN
tC
tC'
XO Clock
The following table provides power-up/down sequence timing parameters.
Table 5-2.ꢀ Power-Up/Down Sequence Timing
Paramet
Min. Max. Units
Description
Notes
er
tA
0
0
—
—
ms VBAT rise to VDDIO VBAT and VDDIO can rise simultaneously or connected
rise
together. VDDIO must not rise before VBAT.
tB
ms VDDIO rise to
CHIP_EN rise
CHIP_EN must not rise before VDDIO. CHIP_EN must
be driven high or low and must not be left floating.
DS70005350D-page 18
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Power Management
...........continued
Paramet
Min. Max. Units
Description
Notes
er
tC
5
—
ms CHIP_EN rise to
RESETN rise
This delay is required to stabilize the XO clock before
RESETN removal. RESETN must be driven high or low
and must not be left floating.
tA’
tB’
tC’
0
0
0
—
—
—
ms VDDIO fall to VBAT
fall
VBAT and VDDIO must fall simultaneously or be
connected together. VBAT must not fall before VDDIO.
ms CHIP_EN fall to
VDDIO fall
VDDIO must not fall before CHIP_EN. CHIP_EN and
RESETN must fall simultaneously.
ms RESETN fall to
VDDIO fall
VDDIO must not fall before RESETN. RESETN and
CHIP_EN fall simultaneously.
5.4
Digital I/O Pin Behavior During Power-Up Sequences
The following table represents the digital I/O pin states corresponding to the device power modes.
Table 5-3.ꢀDigital I/O Pin Behavior in Different Device States
Pull Up/Down
Resistor (96
kOhm)
Input
Driver
Device State
VDDIO CHIP_EN RESETN Output Driver
Power_Down: core supply
OFF
High
Low
High
High
Low
Low
High
Disabled (Hi-Z)
Disabled (Hi-Z)
Disabled (Hi-Z)
Disabled Disabled
Disabled Enabled
Power-On Reset: core supply High
and hard reset ON
Power-On Default: core supply High
ON, device out of reset and
not programmed
Enabled
Enabled
On_Doze/ On_Transmit/
On_Receive: core supply
ON, device programmed by
firmware
High
High
High
Programmed by Opposite Programmed by
firmware for
each pin:
enabled or
disabled
of Output firmware for each
Driver
state
pin: enabled or
disabled
DS70005350D-page 19
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Clocking
6.
Clocking
6.1
Low-Power Clock
The ATWINC3400-MR210xA module requires an external 32.768 kHz clock to be supplied at the module pin 20. This
clock is used during the sleep operation. The frequency accuracy of this external clock must be within ±200 ppm.
DS70005350D-page 20
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
CPU and Memory Subsystem
7.
CPU and Memory Subsystem
7.1
Processor
The ATWINC3400-MR210xA module has two Cortus APS3 32-bit processors, one is used for Wi-Fi and the other
is used for Bluetooth. In IEEE 802.11 mode, the processor performs many of the MAC functions, including but
not limited to: association, authentication, power management, security key management and MSDU aggregation/de-
aggregation. In addition, the processor provides flexibility for various modes of operation, such as Station (STA) and
Access Point (AP) modes. In Bluetooth mode, the processor handles multiple tasks of the Bluetooth protocol stack.
7.2
7.3
Memory Subsystem
The APS3 core uses a 256 KB instruction/boot ROM (160 KB for IEEE 802.11 and 96 KB for Bluetooth) along with
a 420 KB instruction RAM (128 KB for IEEE 802.11 and 292 KB for Bluetooth), and a 128 KB data RAM (64 KB for
IEEE 802.11 and 64 KB for Bluetooth). In addition, the device uses a 160 KB shared/exchange RAM (128 KB for
IEEE 802.11 and 32 KB for Bluetooth), accessible by the processor and MAC, which allows the processor to perform
various data management tasks on the Tx and Rx data packets.
Nonvolatile Memory (eFuse)
The ATWINC3400-MR210xA modules have 768 bits of nonvolatile eFuse memory that can be read by the CPU after
a device reset. The eFuse is partitioned into six 128-bit banks (Bank 0 – Bank 5). Each bank has the same bit map
(see the following figure). The purpose of the first 108 bits in each bank is fixed, and the remaining 20 bits are
general-purpose software dependent bits, or reserved for future use. Currently, the Bluetooth address is derived from
the Wi-Fi MAC address such that the Bluetooth address = Wi-Fi MAC address + 1.
Note:ꢀ If IQ Amp Used, IQ Amp Correction, IQ Pha Used, and IQ Pha Correction bit fields are programmed, Bank 0
and Bank 1 must not be programmed with any values, and only the Bank Invalid bit must be programmed.
This nonvolatile one-time-programmable (OTP) memory can be used for storing the following customer-specific
parameters:
•
•
•
MAC address
Calibration information (crystal frequency offset (XO offset) and so on)
Other software-specific configuration parameters
Each bank can be programmed independently, which allows for several updates of the device parameters following
the initial programming. For example, if the MAC address is currently programmed in Bank 3, and to update the new
MAC address, perform the following steps:
1. Invalidate the contents of Bank 3 by programming the Bank Invalid bit field of Bank 3.
2. Program Bank 4 with the new MAC address along with the values of ADC Calib (if used in Bank 3), Frequency
Offset (from Bank 3), IQ Amp Correction (from Bank 3) and IQ Pha Correction (from Bank 3). The Used bit
field for each corresponding value bit field must also be programmed.
3. Validate the contents of Bank 4 by programming the Bank Used bit field of Bank 4.
Each bit field (i.e., MAC Address, ADC Calibration, Frequency Offset, IQ Amp Correction, and IQ Pha Correction) has
its corresponding Used bit field. Each Used bit field indicates to the firmware that the value in the related bit field is
valid. A value of '0' in the Used bit field indicates that the following bit field is invalid and a value of '1' programmed to
the Used bit field indicates that the corresponding bit field is valid and can be used by firmware.
By default, all the ATWINC3400-MR210xA modules are programmed with the MAC address, Frequency Offset bits,
IQ Amp and IQ Phase fields of Bank 3.
DS70005350D-page 21
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
CPU and Memory Subsystem
Figure 7-1.ꢀBitmap for ATWINC3400-MR210xA eFuse Bank
Width
1
1
3
2
1
48
1
7
1
15
1
13
1
13
20
Bit
31
30
29:27 26:25
Word 0
24
23:0
31:8
7
6:0
31
30:16
15
14:2
1
0 - 31:20 19
0
Word
Word 1
Word 2
Word 3
Note:ꢀ The bit map has been updated with the IQ Amp Correction and IQ Pha Correction fields from firmware version
1.4 onwards. Earlier, these bit fields were reserved for future use. For customers using firmware older than 1.4, the
IQ Amp Correction and IQ Pha Correction bit fields will not be used by the firmware.
The matrix table below provides details on how different versions of the firmware would handle the IQ Amp Used, IQ
Amp Correction, IQ Pha Used and IQ Pha Correction bit fields during Initialization.
IQ Amp Used and IQ Pha Used Bit Status
Firmware Version
Used by
Customer
Device with IQ Amp Used and IQ Pha Used
Bits with Value ‘1’
Device with IQ Amp Used and IQ Pha
Used Bits with Value ‘0’
1.4 or later
The firmware loads the IQ calibration values
from the IQ Amp Correction and IQ Pha
The firmware ignores the values in the IQ
Amp Correction and IQ Pha Correction bit
Correction bit fields of the corresponding eFuse fields and proceeds with Initialization.
bank and proceeds with Initialization.
Prior to 1.4
The firmware does not check for the IQ Amp Used and IQ Pha Used bit fields and proceeds
with Initialization.
DS70005350D-page 22
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
WLAN Subsystem
8.
WLAN Subsystem
The WLAN subsystem is composed of the Media Access Controller (MAC), Physical Layer (PHY) and the radio.
8.1
MAC
The ATWINC3400-MR210xA module is designed to operate at low power, while providing high data throughput. The
IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control
logic and a low power, high-efficiency microprocessor. The combination of dedicated logic with a programmable
processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate
evolving standards and future feature enhancements.
The dedicated datapath engines are used to implement datapath functions with heavy computational requirements.
For example, a Frame Check Sequence (FCS) engine checks the Cyclic Redundancy Check (CRC) of the
transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption
operations for the WEP, WPA-TKIP and WPA2 CCMP-AES security requirements.
Control functions, which have real-time requirements, are implemented using hardwired control logic modules.
These logic modules offer real-time response while maintaining configurability through the processor. Examples
of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX
control, interframe spacing and so on), protocol timer module (responsible for the Network Access vector, back-off
timing, timing synchronization function and slot management), MAC Protocol Data Unit (MPDU) handling module,
aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block
communication) and TX/RX control Finite State Machine (FSM) (coordinates data movement between PHY and MAC
interface, cipher engine and the Direct Memory Access (DMA) interface to the TX/RX FIFOs).
The following are the characteristics of the MAC functions implemented solely in the software on the microprocessor:
•
•
•
Functions with high memory requirements or complex data structures. Examples include association table
management and power save queuing.
Functions with low computational load or without critical real-time requirements. Examples include
authentication and association.
Functions that require flexibility and upgradeability. Examples include beacon frame processing and QoS
scheduling.
Features
The ATWINC3400-MR210xA MAC supports the following functions:
•
•
•
IEEE 802.11b/g/n
IEEE 802.11e WMM QoS EDCA/HCCA/PCF multiple access categories traffic scheduling
Advanced IEEE 802.11n features:
– Transmission and reception of aggregated MPDUs (A-MPDU)
– Transmission and reception of aggregated MSDUs (A-MSDU)
– Immediate block acknowledgment
– Reduced Interframe Spacing (RIFS)
IEEE 802.11i and WFA security with key management:
– WEP 64/128
•
•
– WPA-TKIP
– 128-bit WPA2 CCMP (AES)
Advanced power management:
– Standard IEEE 802.11 power save mode
RTS-CTS and CTS-self support
•
•
Either STA or AP mode in the infrastructure basic service set mode
DS70005350D-page 23
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
WLAN Subsystem
8.2
PHY
The ATWINC3400-MR210xA module WLAN PHY is designed to achieve the reliable and power-efficient physical
layer communication specified by the IEEE 802.11 b/g/n in single stream mode with 20 MHz bandwidth. The
advanced algorithms are used to achieve maximum throughput in a real-world communication environment with
impairments and interference. The PHY implements all the required functions such as Fast Fourier Transform (FFT),
filtering, Forward Error Correction (FEC) that is a Viterbi decoder, frequency, timing acquisition and tracking, channel
estimation and equalization, carrier sensing, clear channel assessment and automatic gain control.
Features
The IEEE 802.11 PHY supports the following functions:
•
•
•
•
Single antenna 1x1 stream in 20 MHz channels
Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5 and 11 Mbps
Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48 and 54 Mbps
Supports IEEE 802.11n HT modulations MCS0-7, 20 MHz, 800 and 400 ns guard interval: 6.5, 7.2, 13.0, 14.4,
19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0 and 72.2 Mbps(1)
•
•
•
IEEE 802.11n mixed mode operation
Per packet TX power control
Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery and frame
detection
Note:ꢀ
1. Short GI is currently not supported by the firmware. The data sheet will be updated when the feature is
supported.
8.3
Radio
This section presents information describing the properties and characteristics of the ATWINC3400-MR210xA and
Wi-Fi radio transmit and receive performance capabilities of the device.
The performance measurements are taken at the RF pin assuming 50Ω impedance; the RF performance is ensured
for a room temperature of 25oC with a derating of 2-3 dB at the boundary conditions.
The measurements were taken under typical conditions: VBATT = 3.3V; VDDIO = 3.3V; temperature: +25ºC
Table 8-1.ꢀFeatures and Properties
Feature
Description
Part Number
WLAN Standard
Host Interface
Dimension
ATWINC3400-MR210xA
IEEE 802.11 b/g/n, Wi-Fi Compliant
SPI
22.4 x 14.7 x 2.0 mm
Frequency Range
Number of Channels
Modulation
2.412 GHz ~ 2.472 GHz (2.4 GHz ISM Band)
11 for North America and 13 for Europe and Japan
802.11b: DQPSK, DBPSK, CCK
802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK
Data Rate
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps
Data Rate
(20 MHz, normal GI, 800 ns)
DS70005350D-page 24
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
WLAN Subsystem
...........continued
Feature
Description
Data Rate
(20 MHz, short GI, 400 ns)(1)
802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2 Mbps
Operating Temperature
-40 to +85oC
Note:ꢀ
1. Currently, short GI is not supported by the firmware. The data sheet will be updated when the feature is
supported.
DS70005350D-page 25
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Bluetooth Low Energy
9.
Bluetooth Low Energy
The Bluetooth subsystem implements all the mission critical real-time functions. It encodes/decodes HCI packets,
constructs baseband data packages; and manages and monitors the connection status, slot use, data flow, routing,
segmentation and buffer control. The Bluetooth subsystem supports Bluetooth Low Energy modes of operation.
The following advanced low energy applications are supported:
•
•
•
•
•
•
•
•
Smart energy
Consumer wellness
Home automation
Security
Proximity detection
Entertainment
Sports and fitness
Automotive
Coexistence Mechanism
The ATWINC3400-MR210xA supports simultaneous use of both Bluetooth Low Energy and Wi-Fi via a coexistence
mechanism that allows the protocols to share the same radio. The radio defaults to Wi-Fi use until a Bluetooth Low
Energy event occurs (such as connection or advertising), in which case the radio is gracefully switched over for
Bluetooth Low Energy use. For the duration of the Bluetooth Low Energy event, the radio is switched back and forth
between Wi-Fi and Bluetooth Low Energy, as demanded by the Bluetooth Low Energy activity, before returning to
Wi-Fi until the next Bluetooth Low Energy event.
DS70005350D-page 26
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
10.
External Interfaces
The ATWINC3400-MR210CA external interfaces include:
•
•
•
•
I2C for debugging
SPI for control and data transfer
UART for debugging
General Purpose Input/Output pins(1)
Note:ꢀ
1. Usage of the GPIO functionality is not supported by the ATWINC3400 firmware. The data sheet will be
updated once the support for this feature is added.
10.1
Interfacing with the Host Microcontroller
This section describes interfacing the ATWINC3400-MR210xA module with the host microcontroller. The interface is
comprised of a client SPI and additional control signals, as shown in the following figure. For more information on SPI
interface specification and timing, refer to the SPI Interface. Additional control signals are connected to the GPIO/IRQ
interface of the microcontroller.
Figure 10-1.ꢀInterfacing with Host Microcontroller
CHIP_EN
RESET
Host
Microcontroller
Wi-Fi Controller
Module
SPI
IRQN
Table 10-1.ꢀHost Microcontroller Interface Pins
Pin Number
Pin Name
RESETN
IRQN
7
33
19
25
26
24
CHIP_EN
SPI_SSN
SPI_MOSI
SPI_MISO
DS70005350D-page 27
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
...........continued
Pin Number
Pin Name
SPI_SCK
23
10.2
SPI Client Interface
10.2.1 Overview
The ATWINC3400-MR210xA has a Serial Peripheral Interface (SPI) that operates as an SPI client. The SPI interface
can be used for control and for serial I/O of 802.11 and Bluetooth Low Energy data. The SPI pins are mapped as
shown in the following table. The SPI is a full-duplex, client-synchronous serial interface that is available immediately
following a Reset when pin 2 (SPI_CFG) is tied to VDDIO.
Table 10-2.ꢀSPI Interface Pin Mapping
Pin #
2
SPI function
CFG: Must be tied to VDDIO
SSN: Active-Low Client Select
MOSI(RXD): Serial Data Receive
SCK: Serial Clock
25
26
23
24
MISO(TXD): Serial Data Transmit
When the SPI is not selected, that is, when the SSN is high, the SPI interface will not interfere with data transfers
between the serial-host and other serial-client devices. When the serial-client is not selected, its transmitted data
output is buffered, resulting in a high impedance drive onto the MISO line.
The SPI interface responds to a protocol that allows an external host to read or write any register in the chip, as well
as, initiate DMA transfers.
The SPI SSN, MOSI, MISO and SCK pins of the ATWINC3400-MR210xA have internal programmable pull-up
resistors. These resistors must be programmed to be disabled; otherwise, if any of the SPI pins are driven to a low
level while the ATWINC3400-MR210xA is in the low-power sleep state, the current will flow from the VDDIO supply
through the pull-up resistors, increasing the current consumption of the module.
10.2.2 SPI Timing
The SPI Client interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase
(CPHA) settings. These modes are illustrated in the following table and figure.
Table 10-3.ꢀSPI Client Modes
Mode
CPOL
CPHA
0
1
2
3
0
0
1
1
0
1
0
1
Note:ꢀ The ATWINC3400-MR210xA firmware uses “SPI MODE 0” to communicate with the host.
The red lines in the following figure correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1.
DS70005350D-page 28
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
Figure 10-2.ꢀSPI Client Clock Polarity and Clock Phase Timing
CPOL = 0
SCK
CPOL = 1
SSN
CPHA = 0
CPHA = 1
z
1
2
3
4
5
6
7
8
z
RXD/TXD
(MOSI/MISO)
z
1
2
3
4
5
6
7
8
z
The SPI timing is provided in the following figure and table.
Figure 10-3.ꢀSPI Timing Diagram (SPI Mode CPOL = 0, CPHA = 0)
f
SCK
t
t
t
WL
LH
WH
HL
SCK
TXD
t
t ODLY
RXD
SSN
t
t
ISU
IHD
t SUSSN
Table 10-4.ꢀSPI Client Timing Parameters(
t
HDSSN
Parameter
Symbol
fSCK
Min.
Max.
Units
Clock Input Frequency(2)
—
48
MHz
DS70005350D-page 29
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
...........continued
Parameter
Symbol
tWL
Min.
Max.
Units
Clock Low Pulse Width
Clock High Pulse Width
Clock Rise Time
4
5
—
—
7
tWH
tLH
0
Clock Fall Time
tHL
0
7
TXD Output Delay(3)
RXD Input Setup Time
RXD Input Hold Time
SSN Input Setup Time
SSN Input Hold Time
tODLY
tISU
4
9 from SCK fall
ns
1
—
—
—
—
tIHD
5
tSUSSN
tHDSSN
3
5.5
Notes:ꢀ
1. The timing is applicable to all SPI modes.
2. The maximum clock frequency specified is limited by the SPI Client interface internal design; the actual
maximum clock frequency can be lower and depends on the specific PCB layout.
3. The timing is based on 15 pF output loading. Under all conditions, tLH + tWH + tHL + tWL must be less than or
equal to 1/ fSCK
.
10.3
UART Interface
The ATWINC3400-MR210xA supports the Universal Asynchronous Receiver/Transmitter (UART) interface. Wi-Fi and
Bluetooth Low Energy interfaces must be used for debug purposes only. Wi-Fi UART pins are available on pins 16
(TXD) and 17 (RXD). Bluetooth Low Energy UART pins are available on pins 8 (TXD) and 9 (RXD). The UART is
compatible with the RS-232 standard.
The default configuration for accessing the Wi-Fi UART interface of the ATWINC3400-MR210xA is mentioned below:
•
•
•
•
•
Baud rate: 460800
Data: 8-bit
Parity: None
Stop bit: 1-bit
Flow control: None
It also has RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead transmission.
FIFO size is 4 x 8 for both RX and TX direction. The UART also has status registers showing the number of received
characters available in the FIFO and various error conditions, as well as, the ability to generate interrupts based on
these status bits.
An example of the UART receiving or transmitting a single packet is shown in the following figure. This example
shows 7-bit data (0x45), odd parity and two stop bits.
Figure 10-4.ꢀExample of UART RX of TX Packet
Current Packet
Data
Previous
Packets or
Leading
Next
Packet
Parity
Bit
Start
Bit
Stop Bits
Idle Bits
DS70005350D-page 30
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
10.4
I2C Client Interface
The I2C client interface is a two-wire serial interface consisting of a serial data line (SDA) on module Pin 10 and a
serial clock line (SCL) on module Pin 11. This interface is used for debugging of ATWINC3400-MR210xA modules.
The I2C client responds to the seven bit address value 0x60. The ATWINC3400-MR210xA I2C supports I2C bus
version 2.1 - 2000 and can operate in Standard mode (with data rates up to 100 Kb/s) and Fast mode (with data rates
up to 400 Kb/s).
Note:ꢀ For specific information on I2C bus, refer to Philips Specification entitled “The I2C-Bus Specification, Version
2.1”. The I2C client is a synchronous serial interface. The SDA line is a bidirectional signal and changes only
while the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to
perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the maximum
capacitance specification of 400 pF. Data is transmitted in byte packages.
10.4.1 I2C Client Timing
The I2C Client timing diagram for the ATWINC3400-MR210xA module is shown in the following figure.
Figure 10-5.ꢀI2C Client Timing Diagram
The following table provides the I2C Client timing parameters for the ATWINC3400-MR210xA module.
Table 10-5.ꢀI2C Client Timing Parameters
Parameter
SCL Clock Frequency
SCL Low Pulse Width
SCL High Pulse Width
SCL, SDA Fall Time
Symbol
Min.
0
Max.
400
—
Units
Remarks
fSCL
tWL
tWH
tHL
kHz
—
—
—
—
1.3
0.6
—
µs
ns
µs
—
300
This is dictated by external
components
SCL, SDA Rise Time
tLH
—
300
START Setup Time
START Hold Time
SDA Setup Time
tSUSTA
tHDSTA
tSUDAT
0.6
0.6
100
0
—
—
—
—
—
—
—
—
ns
ns
µs
Client and Host Default
Host Programming Option
SDA Hold Time
tHDDAT
40
DS70005350D-page 31
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
External Interfaces
...........continued
Parameter
Symbol
tSUSTO
Min.
Max.
Units
µs
Remarks
STOP Setup Time
0.6
—
—
Bus Free Time Between STOP
and START
tBUF
tPR
1.3
0
—
—
—
Glitch Pulse Reject
50
ns
DS70005350D-page 32
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Application Reference Design
11.
Application Reference Design
The ATWINC3400-MR210xA module application schematics for different supported host interfaces are shown in this
section.
11.1
Host Interface
Figure 11-1.ꢀATWINC3400-MR210xA Reference Schematic
Note:ꢀ It is recommended to add test points for module pins J8, J9, J10, J11, J16 and J17 in the design.
The following table provides the reference Bill of Material (BoM) details for the ATWINC3400-MR210xA module with
SPI as host interface.
Table 11-1.ꢀATWINC3400-MR210xA Reference Bill of Materials for SPI Operation
Item
Quantity Referenc Value
e
Description
Manufacturer
Part Number Footprint
1
1
U1
ATWINC3400- Wi-Fi/
Microchip
ATWINC3400 Custom
-MR210xA
MR210xA
Bluetooth/BLE Technology
®
Combo Module Inc.
®
2
1
U2
ASH7KW-32.76 Oscillator,
Abracon
ASH7KW-32. OSCCC320
8kHZ-L-T
32.768 kHz,
+0/-175 ppm,
1.2V - 5.5V,
-40°C - +85°C
Corporation
768kHZ-L-T
X150X100-4
N
DS70005350D-page 33
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Application Reference Design
...........continued
Item
Quantity Referenc Value
Description
Manufacturer
Part Number Footprint
e
®
3
1
R1
1M
0
RESISTOR,
Thick Film, 1
MOhm, 0201
Panasonic
ERJ-1GEJ10 RS0201
5C
®
4
13
R2-R14
RESISTOR,
Thick Film, 0
Ohm, 0201
Panasonic
ERJ-1GN0R0 RS0201
0C
DS70005350D-page 34
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Module Outline Drawings
12.
Module Outline Drawings
The ATWINC3400-MR210xA module package details are outlined in the following figure.
Figure 12-1.ꢀATWINC3400-MR210CA Footprint and Module Package Drawings - Top, Bottom and Side View
22.428
1.981
METAL SHIELD
1.30
13
1
14
1.346
14.732
ANTENNA
5.21
1.204
PITCH
24
25
36
1.341
1.204 PITCH
0.787
2.09
TOP VIEW
SIDE VIEW
THIS PAD MUST BE
SOLDERED TO GROUND
25 26 27 28 29 30 31 32 33 34 35 36
24
23
22
21
20
19
18
17
16
15
14
4.40
0.94
13 12 11 10
9
8
7
6
5
4
3
2
1
4.40
6.13
BOTTOM VIEW
DS70005350D-page 35
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Module Outline Drawings
Figure 12-2.ꢀATWINC3400-MR210CA Module Package Drawings - 3D View and Recommended Land Pattern
RECOMMENDED LAND PATTERN
1.204
PITCH
SILK
SCREEN
6.128
4.400
13
1
1.880
14
5.118
4.400
14.732
12.045
EDGE OF
PC BOARD
5.214
24
25
36
1.985
0.813
13.244
22.428
DS70005350D-page 36
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Module Outline Drawings
Figure 12-3.ꢀATWINC3400-MR210UA Footprint and Module Package Drawings - Top, Bottom and Side View
22.428
1.981
RF CONNECTOR
3.64
1.30
13
1
14
2.72
1.346
14.732
1.204
PITCH
24
25
36
METAL
SHIELD
1.341
1.204 PITCH
0.787
2.09
TOP VIEW
SIDE VIEW
THIS PAD MUST BE
SOLDERED TO GROUND
25 26 27 28 29 30 31 32 33 34 35 36
24
23
22
21
20
19
18
17
16
15
14
5.21
4.40
0.94
13 12 11 10
9
8
7
6
5
4
3
2
1
4.40
6.13
BOTTOM VIEW
DS70005350D-page 37
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Module Outline Drawings
Figure 12-4.ꢀATWINC3400-MR210UA Module Package Drawings - 3D View and Recommended Land Pattern
RECOMMENDED LAND PATTERN
1.204
PITCH
SILK
SCREEN
6.128
4.400
13
1
1.880
14
5.118
4.400
14.732
12.045
EDGE OF
PC BOARD
5.214
24
25
36
1.985
0.813
13.244
22.428
Notes:ꢀ
1. Dimensions are in mm.
2. Having a 5x5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane
on the inner/other layers of the host board is recommended. This will provide a good ground and thermal
transfer for the ATWINC3400-MR210xA module.
DS70005350D-page 38
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
13.
Design Considerations
This chapter provides the guidelines on module placement and routing to achieve the best performance.
13.1
ATWINC3400-MR210CA
13.1.1 ATWINC3400-MR210CA Module Placement and Routing Guidelines
It is critical to follow the recommendations listed below to achieve the best RF performance:
•
The module must be placed on the host board and the chip antenna area must not overlap with the host board.
The following figure on placement reference shows the best, poor and worst case module placements in the
host board.
Figure 13-1.ꢀATWINC3400-MR210CA Placement Example
Do not place the module in the middle of the host board or far away from the host board edge.
CAUTION
•
Follow the host board mechanical recommendation, ground plane and keepout recommendations, as shown in
the following figure. Module chip antenna is specifically tuned for this host board mechanical recommendation,
as shown in the following figure. The host PCB must have a thickness of 1.5 mm.
– Follow the module placement and keepout recommendation, as shown in the following figure.
•
•
•
Avoid routing any traces on the top layer of the host board, which is directly below the module area.
In the keepout region, there must be no copper traces in all signal layers.
Avoid placing any components (like mechanical spacers, bumpon and so on) on the host board close
to the chip antenna region.
•
Place the GND polygon pour below the module on the top layer of the host board. Avoid breaks in this
GND plane and ensure continuous GND plane for better RF performance.
DS70005350D-page 39
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
•
•
•
The GND polygon pour in the top layer of the host board must have a minimum area of 20 x 40 mm.
Place sufficient GND vias on the host board edge and below the module for better RF performance.
Having a 5 x 5 grid of GND vias solidly connecting the exposed GND paddle of the module to
the ground plane of the host board is recommended. This will act as a good ground and thermal
conduction path for the ATWINC3400-MR210CA module. The GND vias must have a minimum via
hole size of 0.2 mm.
•
The antenna on the module must not be placed in direct contact or close proximity to plastic casing/
objects. Keep a minimum clearance of > 7 mm in all directions around the chip antenna.
Figure 13-2.ꢀATWINC3400-MR210CA Best Case Placement Reference Example
13.1.2 ATWINC3400-MR210CA Antenna Performance
The ATWINC3400-MR210CA uses a chip antenna, which is fed via matching network. The table below lists the
technical specification of the chip antenna.
Table 13-1.ꢀChip antenna specification
Parameter
Value
Peak gain
0.5 dBi
Operating frequency
Antenna P/N
Antenna vendor
2400 – 2500 MHz
2450AT18A100
Johanson Technology Inc.
13.1.2.1 Radiation Pattern
Following figures illustrate the antenna radiation pattern measured for the ATWINC3400-MR210CA module mounted
in the ATWINC3400-Xpro evaluation kit. During the measurement, the module is placed in the XZ plane with Y axis
being perpendicular to the module and pointing to the front of the module.
DS70005350D-page 40
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
Figure 13-3.ꢀAntenna Radiation Pattern - XY Plane
Figure 13-4.ꢀAntenna Radiation Pattern - ZY Plane
Figure 13-5.ꢀAntenna Radiation Pattern - ZX Plane
DS70005350D-page 41
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
13.2
ATWINC3400-MR210UA External Antenna Connector
13.2.1 ATWINC3400-MR210UA Module Placement and Routing Guidelines
The ATWINC3400-MR210UA module has an Ultra Small Miniature RF Connector (u.FL) for the external antenna.
The choice of antenna is limited to the antenna types for which the module was tested and approved. For a list of
tested and approved antennas that may be used with the module, refer to the respective country in the Regulatory
Approval section.
An approved list of external antennas tested and certified with the ATWINC3400-MR210UA module is shown in
13.2.2 ATWINC3400-MR210UA Approved External Antennas.
It is critical to follow the recommendations listed below to achieve the best RF performance:
•
•
•
•
Avoid routing any traces on the top layer of the host board, which is directly below the module area.
Place the GND polygon pour below the complete module area. Do not have any breaks in this GND plane.
Place sufficient GND vias in the GND polygon pour below the module area for better RF performance.
Having a 3 x 3 grid of GND vias solidly connecting the exposed GND paddle of the module to the inner layer
ground plane of the host board is recommended. This will act as a good ground and thermal conduction path for
the ATWINC3400-MR210UB module. The GND vias must have a minimum via hole size of 0.3 mm.
•
•
Keep large metal objects away from the external antenna to avoid electromagnetic field blocking.
Make sure the width of the traces routed to GND, VDDIO and VBAT rails are sufficiently larger for handling the
peak TX current consumption.
13.2.1.1 Antenna Placement Recommendations for ATWINC3400-MR210UA
The following recommendations must be applied for the placement of antenna and its cable:
•
The antenna cable must not be routed over circuits generating electrical noise on the host board or alongside or
underneath the module. It is preferable that the cable be routed straight out of the module.
•
The antenna must not be placed in direct contact or in close proximity of the plastic casing/objects.
– Do not enclose the antenna within a metal shield.
•
Keep any components that may radiate noise, signals or harmonics within the 2.4 GHz to 2.5 GHz frequency
band away from the antenna and, if possible, shield those components. Any noise radiated from the host board
in this frequency band degrades the sensitivity of the module.
•
•
It is recommended that the antenna be placed at a distance greater than 5 cm away from the module. The
following figure shows the antenna keepout area; the antenna must not be placed in this area.
This recommendation is based on an open-air measurement and does not take into account any metal shielding
of the customer end product. When a metal enclosure is used, the antenna can be located closer to the
ATWINC3400-MR210UA module.
•
The drawing provides an option for routing the antenna cable depending on the location of the antenna with
respect to the ATWINC3400-MR210UA PCB. There are two possible options for the optimum routing of the
cable.
DS70005350D-page 42
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
Figure 13-6.ꢀAntenna Placement Guideline
Note:ꢀ These guidelines are generic and it is recommended that customers check and fine-tune the antenna
positioning in the final host product based on RF performance.
13.2.2 ATWINC3400-MR210UA Approved External Antennas
The ATWINC3400-MR210UA module is approved for use with the antennas listed in the following table. It is
permissible to use a different antenna, provided the antenna is of the same type, gain (equal or less than), and
has similar in-band and out-of-band characteristics are present (refer to specification sheet for cutoff frequencies).
If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize
the antenna with respective regulatory agencies and ensure compliance. For more details on the corresponding
regulatory approval sections, 14. Appendix A: Regulatory Approval.
Table 13-2.ꢀList of Approved External Antennas
List Items
Part Number
Manufacturer
Antenna Gain at 2.4 Antenna type
GHz band
1
2
RFA-02-P33
RFA-02-D3
Aristotle
Aristotle
2
2
PCB
Dipole
DS70005350D-page 43
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Design Considerations
...........continued
List Items
Part Number
Manufacturer
Antenna Gain at 2.4 Antenna type
GHz band
3
4
5
6
7
RFA-02-L2H1
RFA-02-P05
RFA-02-C2M2
W3525B039
Aristotle
2
Dipole
PCB
Aristotle
2
Aristotle
2
Dipole
PCB
Pulse Electronics
2
RFDPA870920IMLB3 WALSIN
01
1.84
Dipole
8
RN-SMA-S
Microchip
0.56
Dipole
Notes:ꢀ
1. If the end-product using the module is designed to have an antenna port that is accessible to the end user,
then the unique antenna connector (permissible by FCC) must be used (for example, Reverse Polarity (RP)-
SMA).
2. If an RF coaxial cable is used between the module RF output and the enclosure, then the unique antenna
connector must be used in the enclosure wall to interface with an antenna.
3. Contact the antenna vendor for detailed antenna specifications to review suitability to end-product operating
environment and to identify alternatives.
13.3
13.4
Reflow Profile Information
For information on the reflow process guidelines, refer to the “Solder Reflow Recommendation” Application Note
(AN233).
Module Assembly Considerations
The ATWINC3400-MR210xA module is assembled with an EMI shield to ensure compliance with EMI emission and
immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions such as
IPA and similar solvents can be used to clean this module. Cleaning solutions containing acid must never be used on
the module.
13.5
Conformal Coating
The modules are not intended for use with a conformal coating and the customer assumes all risks (such as the
module reliability, performance degradation and so on) if a conformal coating is applied to the modules.
DS70005350D-page 44
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
14.
Appendix A: Regulatory Approval
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received regulatory approval for the
following countries:
•
ATWINC3400-MR210CA
– United States/FCC ID: 2ADHKWINC3400
– Canada/ISED:
•
•
•
IC: 20266-ATWINC3400
HVIN: ATWINC3400-MR210CA
PMN: Wi-Fi and Bluetooth Module
– Europe/CE
– Japan/MIC: 005-101794
– Korea/KCC: R-CRM-mcp-WINC3400MR210C
– Taiwan/NCC: CCAN18LP0450T0
– China/SRRC: CMIIT ID: 2018DJ2733
ATWINC3400-MR210UA
•
– United States/FCC ID: 2ADHKWINC3400U
– Canada/ISED:
•
•
•
IC: 20266-WINC3400UA
HVIN: ATWINC3400-MR210UA
PMN: ATWINC3400-MR210UA
– Europe/CE
Gain Table for Individual Regulatory Region
The ATWINC3400-MR210CA module has received regulatory approvals for many regions in the world, namely
United States/FCC, Canada/ISED, Europe/CE, Japan/MIC, Korea/KCC, Taiwan/NCC, and China/SRRC. The
ATWINC3400-MR210UA module has received regulatory approvals for United States/FCC, Canada/ISED and
Europe/CE.
The default firmware uses a common gain table that meets IEEE 802.11 specifications, and regulatory region limits
for both ATWINC3400-MR210CA and ATWINC3400-MR210UA as noted above. In some cases, the output power
is reduced by limits of regulatory region with stringent transmit power limits. To optimize performance, and if end
products’ destination is known, the specific gain table for that region can be optionally embedded into the firmware.
The regulatory region certified gain table for individual regulatory region is available on ATWINC3400-MR210CA and
ATWINC3400-MR210UA product page. Customers can update the gain table in firmware by following the instructions
in section 6. Updating Application Gain Table into WINC3400 of ATWINC3400 – Deriving Application Gain Table
Application Note
14.1
United States
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received Federal Communications
Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval
in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a
complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate
compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed
in different end-use products (referred to as a host, host product or host device) by the grantee or other equipment
manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter
function provided by that specific module or limited module device.
The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating
conditions necessary for compliance.
A host product itself is required to comply with all other applicable FCC equipment authorization regulations,
requirements, and equipment functions that are not associated with the transmitter module portion. For example,
DS70005350D-page 45
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
compliance must be demonstrated: to regulations for other transmitter components within a host product; to
requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio
receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter
module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi
transmitter modules may also contain digital logic functions).
14.1.1 Labeling and User Information Requirements
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been labeled with its own FCC ID number,
and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished
product into which the module is installed must display a label referring to the enclosed module. This exterior label
must use the following wording:
•
For ATWINC3400-MR210CA
Contains Transmitter Module FCC ID: 2ADHKWINC3400
or
Contains FCC ID: 2ADHKWINC3400
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
•
For ATWINC3400-MR210UA
Contains Transmitter Module FCC ID: 2ADHKWINC3400U
or
Contains FCC ID: 2ADHKWINC3400U
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
The user's manual for the finished product must include the following statement:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio/TV technician for help
Additional information on labeling and user information requirements for Part 15 devices can be found in KDB
Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division
Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm.
DS70005350D-page 46
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
14.1.2 RF Exposure
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure
Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations
or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal
Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted. This transmitter is restricted for use with the specific
antenna(s) tested in this application for Certification.
The antenna(s) used with this transmitter must be installed to provide a separation distance of at least 6.5 cm from
all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and
installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying
RF exposure compliance.
14.1.3 Approved External Antennas
To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It
is permissible to use different antenna, provided the same antenna type, antenna gain (equal to or less than), with
similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies).
For ATWINC3400-MR210CA, the approval is received using the integral chip antenna.
For ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA Approved
External Antennas.
14.1.4 Helpful Web Sites
•
Federal Communications Commission (FCC): www.fcc.gov.
•
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/
oetcf/kdb/index.cfm.
14.2
Canada
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been certified for use in Canada under
Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards
Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits
the installation of a module in a host device without the need to recertify the device.
14.2.1 Labeling and User Information Requirements
Labeling Requirements (from RSP-100 - Issue 12, Section 5): The host product shall be properly labeled to identify
the module within the host device.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible
at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation,
Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or
similar wording expressing the same meaning, as follows:
•
For ATWINC3400-MR210CA
Contains IC: 20266-ATWINC3400
For ATWINC3400-MR210UA
•
Contains IC: 20266-WINC3400UA
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, March 2019): User
manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location
in the user manual or alternatively on the device or both:
DS70005350D-page 47
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and
Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two
conditions:
(1) This device may not cause interference;
(2) This device must accept any interference, including interference that may cause undesired operation of
the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts
de licence. L’exploitation est autorisée aux deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.
Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, March 2019): User manuals, for transmitters shall display
the following notice in a conspicuous location:
This radio transmitter [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] has been approved by
Innovation, Science and Economic Development Canada to operate with the antenna types listed below,
with the maximum permissible gain indicated. Antenna types not included in this list that have a gain
greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device.
Le présent émetteur radio [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] a été approuvé par
Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne
énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste,
et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement
interdits pour l'exploitation de l'émetteur.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use
with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each.
14.2.2 RF Exposure
All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF
exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication
Apparatus (All Frequency Bands).
This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not
be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in
accordance with Canada multi-transmitter product procedures.
The installation of the transmitter must ensure that the antenna has a separation distance of at least 6.5 cm from all
persons or compliance must be demonstrated according to the ISED SAR procedures.
14.2.3 Approved Antenna Types
For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna.
For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA
Approved External Antennas.
14.2.4 Helpful Web Sites
Innovation, Science and Economic Development Canada (ISED): www.ic.gc.ca/.
DS70005350D-page 48
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
14.3
Europe
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules is/are a Radio Equipment Directive (RED)
assessed radio module that is CE marked and has been manufactured and tested with the intention of being
integrated into a final product.
The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules has/have been tested to RED 2014/53/EU
Essential Requirements mentioned in the following European Compliance table.
Table 14-1.ꢀEuropean Compliance
Certification
Safety
Standards
EN 62368
Article
3.1a
Health
EN 62311
EMC
EN 301 489-1
EN 301 489-17
EN 300 328
3.1b
3.2
Radio
The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards
covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and non-
radio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/
eg_203367v010101p.pdf.
Note:ꢀ To maintain conformance to the standards listed in the preceding European Compliance table, the module
shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When
integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and
is therefore responsible for demonstrating compliance of the final product with the essential requirements against the
RED.
14.3.1 Labeling and User Information Requirements
The label on the final product that contains the ATWINC3400-MR210CA and ATWINC3400-MR210UA modules must
follow CE marking requirements.
14.3.2 Conformity Assessment
From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product:
If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent
assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to
the installation instructions for the radio product, then no additional assessment of the combined equipment against
article 3.2 of the RED is required.
14.3.2.1 Simplified EU Declaration of Conformity
Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC3400-MR210xA is in compliance
with Directive 2014/53/EU.
The full text of the EU declaration of conformity for this product is available at www.microchip.com/ATWINC3400
(available under Documents > Certifications).
14.3.3 Approved Antenna Types
For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna.
For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA
Approved External Antennas.
14.3.4 Helpful Websites
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is
the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from
the European Communications Committee (ECC) at: http://www.ecodocdb.dk/.
DS70005350D-page 49
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
Additional helpful web sites are:
•
•
•
•
Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
The Radio Equipment Directive Compliance Association (REDCA):
http://www.redca.eu/
14.4
Japan
The ATWINC3400-MR210CA module has/have received type certification and is required to be labeled with its own
technical conformity mark and certification number as required to conform to the technical standards regulated by the
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.
Integration of this module into a final product does not require additional radio certification provided installation
instructions are followed and no modifications of the module are allowed. Additional testing may be required:
•
If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the
host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should
contact their conformance laboratory to determine if this testing is required
•
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI:
www.vcci.jp/vcci_e/index.html
14.4.1 Labeling and User Information Requirements
The label on the final product which contains the ATWINC3400-MR210CA module must follow Japan marking
requirements. The integrator of the module should refer to the labeling requirements for Japan available at the
Ministry of Internal Affairs and Communications (MIC) website.
For the ATWINC3400-MR210CA module, due to a limited module size, the technical conformity logo and ID is
displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in
which this module is being used must have a label referring to the type certified module inside:
005-101794
14.4.2 Helpful Web Sites
•
•
Ministry of Internal Affairs and Communications (MIC): www.tele.soumu.go.jp/e/index.htm.
Association of Radio Industries and Businesses (ARIB): www.arib.or.jp/english/.
14.5
Korea
The ATWINC3400-MR210CA module has/have received certification of conformity in accordance with the Radio
Waves Act. Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.
14.5.1 Labeling and User Information Requirements
The label on the final product which contains the ATWINC3400-MR210CA module must follow KC marking
requirements. The integrator of the module should refer to the labeling requirements for Korea available on the
Korea Communications Commission (KCC) website.
DS70005350D-page 50
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
For ATWINC3400-MR210CA, due to a limited module size, the KC mark and ID are displayed in the data sheet
and/or packaging and cannot be displayed on the module label. The final product requires the KC mark and
certificate number of the module:
R-CRM-mcp-WINC3400MR210C
14.5.2 Helpful Websites
•
Korea Communications Commission (KCC): www.kcc.go.kr.
National Radio Research Agency (RRA): rra.go.kr.
•
14.6
Taiwan
The ATWINC3400-MR210CA module has/have received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product should contact
Microchip Technology sales or distribution partners to obtain a Letter of Authority.
Integration of this module into a final product does not require additional radio certification provided installation
instructions are followed and no modifications of the module are allowed.
14.6.1 Labeling and User Information Requirements
For the ATWINC3400-MR210CA module, due to the limited module size, the NCC mark and ID are displayed in the
data sheet only and cannot be displayed on the module label:
CCAN18LP0450T0
The user's manual should contain following warning (for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許 可，
公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性
電機設備之干擾。
14.6.2 Helpful Web Sites
National Communications Commission (NCC): www.ncc.gov.tw
DS70005350D-page 51
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Appendix A: Regulatory Approval
14.7
China
The ATWINC3400-MR210CA modules has/have received certification of conformity in accordance with the China
MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module
into a final product does not require additional radio certification, provided installation instructions are followed and no
modifications of the module are allowed. Refer to SRRC certificate available in ATWINC3400-MR210xA product page
for expiry date.
14.7.1 Labeling and User Information Requirements
The ATWINC3400-MR210CA module is labeled with its own CMIIT ID as follows:
CMIIT ID: 2018DJ2733
When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing
the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ2733”.
14.8
Other Regulatory Information
•
For information about other countries' jurisdictions, refer to www.microchip.com/wwwproducts/en/ATWINC3400
(available under Documents > Certifications).
•
Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify
the module for other reasons, contact Microchip for the required utilities and documentation
DS70005350D-page 52
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Reference Documentation
15.
Reference Documentation
For further details, refer to the following documents:
•
•
•
•
•
•
•
•
•
ATWINC3400A-MU Datasheet
Wi-Fi Network Controller Software Design Guide Application Note
Integrated Serial Flash Memory Download Procedure Application Note
Wi-Fi Network Controller Software Programming Guide Application Note
ATWINC3400 XPro User Guide
BLE Profiles Application User Guide
Solder Reflow Recommendation Application Note
ATWINC3400A/ATWINC3400-MR110xA Errata
ATWINC3400 – Deriving Application Gain Table Application Note
Note:ꢀ For a complete listing of development-support tools and documentation, visit http://www.microchip.com/
wwwproducts/en/ATWINC3400 or refer to the customer support section for details on the nearest Microchip field
representative.
DS70005350D-page 53
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Document Revision History
16.
Document Revision History
Revision Date
Section
Changes
D
04/2021 Document
Replaced Master/Slave with the new terminologies. For more details, see the
following note.
1. Ordering Information and Module
Updated Figure 1-1 with tape and reel information.
Marking
14.3 Europe
Updated EN 301 489 in EMC to EN 301 489-1 and EN 301 489-17.
C
12/2020 Document
•
•
•
Updated ATWINC3400-MR210CA to ATWINC3400-MR210xA
Added ATWINC3400-MR210UA module information
Minor edits
2. Block Diagram
Updated Figure 2-1
3. Pinout and Package Information
•
•
•
Updated Figure 3-1
Updated pin descriptions of Pin 8, 9, 14, 15, 22,27, 28,29, 30, 31, 32 and 37
Added Note
4. Electrical Characteristics
8. WLAN Subsystem
10.2.2 SPI Timing
Updated VBAT specification in 4.2 Recommended Operating Conditions
Added footnotes for Short GI feature
•
•
Updated Note
Added description in 10.4 I2C Client Interface
13.1.1 ATWINC3400-MR210CA
Module Placement and Routing
Guidelines
•
•
Added ATWINC3400-MR210CA for the section name
Updated Figure 13-2
13.2.1 ATWINC3400-MR210UA
Module Placement and Routing
Guidelines
Added
Added
13.2.2 ATWINC3400-MR210UA
Approved External Antennas
1. Ordering Information and Module
Marking
•
•
Updated Table 1-1
Updated Figure 1-1
10.3 UART Interface
Updated with Wi-Fi and Bluetooth Low Energy data information
Updated Figure 11-1
11.1 Host Interface
14. Appendix A: Regulatory Approval
•
•
Updated Japan, Korea, Taiwan and China regulatory IDs for ATWINC3400-
MR210CA
Updated USA, Canada and Europe regulatory IDs for ATWINC3400-
MR210UA
•
•
Added 14. Gain Table for Individual Regulatory Region
Updated 14.1 United States, 14.2 Canada and 14.3 Europe with the
details of antennas used for approval
•
•
•
•
Revamped 14.3 Europe
Updated module label information in 14.5 Korea
Updated expiry date information in 14.7 China
Updated contents of 14.8 Other Regulatory Information
B
08/2018 Document
Features
Updated from Bluetooth 4.0 to Bluetooth 5.0 throughout the document
•
•
Removed Bluetooth Host and Controller QD ID
Added QD ID for an end product
DS70005350D-page 54
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Document Revision History
...........continued
Revision Date
Section
Changes
1. Ordering Information and Module
Marking
Updated product web page link
Table 10-1 and Table 10-2
Reflow profile information
Updated pin numbers
•
•
Removed Reflow Profile information sections
Added link to Solder Reflow Recommendation Application Note
14. Appendix A: Regulatory Approval Added PMN details under Canada/ISED
15. Reference Documentation
•
•
Updated web links
Added Solder Reflow Recommendation
Radiation Pattern
Newly added
Initial Release
A
11/2017 Document
Note:ꢀ Microchip is aware that some terminologies used in the technical documents and existing software codes of
this product are outdated and unsuitable. This document may use these new terminologies, which may or may not
reflect on the source codes, software GUIs, and the documents referenced within this document. The following table
shows the relevant terminology changes made in this document.
Table 16-1.ꢀTerminology Related Changes
Old Terminology
Master
New Terminology
Description
Host
The following sections are updated with new terminology:
•
•
•
•
•
•
3. Pinout and Package Information
10.1 Interfacing with the Host Microcontroller
10.2 SPI Client Interface
Slave
Client
10.2.1 Overview
10.2.2 SPI Timing
10.4 I2C Client Interface
DS70005350D-page 55
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
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Note the following details of the code protection feature on Microchip devices:
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Microchip products meet the specifications contained in their particular Microchip Data Sheet.
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DS70005350D-page 56
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Legal Notice
Information contained in this publication is provided for the sole purpose of designing with and using Microchip
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ISBN: 978-1-5224-8269-7
DS70005350D-page 57
Datasheet
© 2021 Microchip Technology Inc.
ATWINC3400-MR210xA
Quality Management System
For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
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Datasheet
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Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Tel: 972-9-744-7705
Italy - Milan
Tel: 86-186-6233-1526
China - Wuhan
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 86-27-5980-5300
China - Xian
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-72884388
Tel: 281-894-5983
Indianapolis
Tel: 86-29-8833-7252
China - Xiamen
Noblesville, IN
Tel: 86-592-2388138
China - Zhuhai
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS70005350D-page 59
Datasheet
© 2021 Microchip Technology Inc.
相关型号：
ATWINC3400-MR210UAXXX
IEEE® 802.11 b/g/n Network Controller with Integrated Bluetooth® Low Energy Module
MICROCHIP
ATWINC3400-MR210XA
IEEE® 802.11 b/g/n Network Controller with Integrated Bluetooth® Low Energy Module
MICROCHIP
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