C1411NCUA [MICROCHIP]
1A High-Speed MOSFET Drivers; 1A高速MOSFET驱动器
| 型号： | C1411NCUA |
| 厂家： | 
MICROCHIP |
| 描述： | 1A High-Speed MOSFET Drivers |
| 文件： | 总18页 (文件大小：762K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1411/TC1411N
1A High-Speed MOSFET Drivers
Features
Description
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
The TC1411/TC1411N are 1A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 1A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 25 nsec
As MOSFET drivers, the TC1411/TC1411N can easily
charge a 1000 pF gate capacitance in 25 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
• Short Delay Time: 30 nsec Typ.
• Matched Delay Times
• Low Supply Current
-
-
With Logic ‘1’ Input: 500 µA
With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 8Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1412/TC1413
Package Types
Applications
8-Pin MSOP/PDIP/SOIC
• Switch Mode Power Supplies
• Pulse Transformer Drive
• Line Drivers
VDD
VDD
VDD
1
8 VDD
8
7
6
5
1
IN 2
NC 3
IN 2
7
OUT
OUT
GND
OUT
TC1411
TC1411N
NC
3
4
6
5
OUT
GND
• Relay Driver
GND 4
GND
6,7
2
6,7
Inverting
NC = No Internal Connection
2
Non-Inverting
Note:
Duplicate pins must be connected
together for proper operation.
© 2006 Microchip Technology Inc.
DS21390D-page 1
TC1411/TC1411N
Functional Block Diagram
VDD
TC1411
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
TC1411N
Effective
4.7V
Input C = 10 pF
GND
DS21390D-page 2
© 2006 Microchip Technology Inc.
TC1411/TC1411N
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage .....................................................+20V
Input Voltage ......................VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP..........................................................340 mW
PDIP............................................................730 mW
SOIC............................................................470 mW
Storage Temperature Range..............-65°C to +150°C
Maximum Junction Temperature...................... +150°C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input
Logic ‘1’, High Input Voltage
Logic ‘0’, Low Input Voltage
Input Current
VIH
VIL
IIN
2.0
—
—
—
—
—
—
0.8
1.0
10
V
V
-1.0
-10
µA 0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
Low Output Voltage
Output Resistance
VOH
VOL
RO
VDD – 0.025
—
—
—
0.025
11
V
V
Ω
DC Test
—
—
—
—
—
—
DC Test
8
VDD = 16V, IO = 10 mA, TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
VDD = 16V
10
10
1.0
0.5
14
14
Peak Output Current
IPK
—
A
A
Latch-Up Protection
IREV
—
Duty cycle ≤ 2%, t ≤ 300 µs,
Withstand Reverse Current
VDD = 16V
Switching Time (Note 1)
Rise Time
tR
—
—
—
—
—
—
—
—
—
—
—
—
25
27
29
25
27
29
30
33
35
30
33
35
35
40
40
35
40
40
40
45
45
40
45
45
ns
ns
ns
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C
Fall Time
tF
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C,
Delay Time
Delay Time
tD1
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C
tD2
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
Power Supply
Power Supply Current
IS
—
—
0.5
0.1
1.0
mA VIN = 3V, VDD = 16V
VIN = 0V
0.15
Note 1: Switching times ensured by design.
© 2006 Microchip Technology Inc.
DS21390D-page 3
TC1411/TC1411N
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (C)
Specified Temperature Range (E)
Specified Temperature Range (V)
Maximum Junction Temperature
Storage Temperature Range
TA
TA
TA
TJ
TA
0
—
—
—
—
—
+70
+85
ºC
ºC
ºC
ºC
ºC
-40
-40
—
+125
+150
+150
-65
Package Thermal Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
θJA
θJA
θJA
—
—
—
206
125
155
—
—
—
ºC/W
ºC/W
ºC/W
DS21390D-page 4
© 2006 Microchip Technology Inc.
TC1411/TC1411N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
400
300
200
100
0
500
400
300
200
100
0
V
= 16V
T
= +25°C
SUPPLY
A
V
= 3V
IN
V
IN
= 3V
V
= 0V
IN
V
= 0V
IN
4
6
8
10
(V)
12
14
16
-40
-20
0
20
40
60
80
V
TEMPERATURE (°C)
DD
FIGURE 2-1:
Quiescent Supply Current
FIGURE 2-4:
Quiescent Supply Current
vs. Supply Voltage.
vs. Temperature.
1.6
1.6
T
= +25°C
A
V
= 16V
SUPPLY
1.5
1.4
1.3
1.2
1.1
1.5
1.4
1.3
1.2
1.1
V
IH
V
IH
V
V
IL
IL
4
6
8
10
(V)
12
14
16
-40
-20
0
20
40
60
80
V
TEMPERATURE (°C)
DD
FIGURE 2-2:
Input Threshold vs. Supply
FIGURE 2-5:
Input Threshold vs.
Voltage.
Temperature.
25
25
20
T
= +85°C
A
20
15
10
5
T
= +25°C
A
T
= +85°C
A
15
10
5
T
= +25°C
A
T
= -40°C
A
T
= -40°C
A
0
0
4
6
8
10
(V)
12
14
16
4
6
8
10
12
14
16
V
V
(V)
DD
DD
FIGURE 2-3:
High-State Output
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
Resistance vs. Supply Voltage.
© 2006 Microchip Technology Inc.
DS21390D-page 5
TC1411/TC1411N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
100
80
60
40
20
0
100
80
60
40
20
0
C
= 1000 pF
C
= 1000 pF
LOAD
LOAD
T
= +85°C
A
T
= +85°C
A
T
= +25°C
A
T
= +25°C
A
T
= -40°C
A
T
= -40°C
A
4
6
8
10
12
14
16
4
6
8
10
(V)
12
14
16
V
V
(V)
DD
DD
FIGURE 2-7:
Rise Time vs. Supply
FIGURE 2-10:
Fall Time vs. Supply
Voltage.
Voltage.
100
C
100
= 1000 pF
C
= 1000 pF
LOAD
LOAD
80
60
40
20
0
80
60
40
20
0
T
= +85°C
A
T
= +85°C
A
T
= +25°C
A
T
= +25°C
A
T
= -40°C
A
T
= -40°C
A
4
6
8
10
(V)
12
14
16
4
6
8
10
(V)
12
14
16
V
V
DD
DD
FIGURE 2-8:
Propagation Delay vs.
FIGURE 2-11:
Propagation Delay vs.
Supply Voltage.
Supply Voltage.
100
36
T
V
= +25°C
DD
A
T
V
= +25°C
DD
A
= 16V
= 16V
t
80
60
40
20
34
32
30
28
26
t
D2
RISE
tD1
t
FALL
0
0
500
1000
1500
C
2000
(pF)
2500
3000
3500
0
500
1000
1500
C
2000
(pF)
2500
3000
3500
LOAD
LOAD
FIGURE 2-9:
Rise and Fall Times vs.
FIGURE 2-12:
Propagation Delays vs.
Capacitive Load.
Capacitive Load.
DS21390D-page 6
© 2006 Microchip Technology Inc.
TC1411/TC1411N
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin
PIN FUNCTION TABLE
Symbol
Description
No.
1
2
3
4
5
6
7
8
VDD
Supply input, 4.5V to 16V
INPUT
NC
Control input
No connection
Ground
GND
GND
Ground
OUTPUT
OUTPUT
VDD
CMOS push-pull output, common to pin 7
CMOS push-pull output, common to pin 6
Supply input, 4.5V to 16V
3.1
Supply Input (VDD
)
3.3
CMOS Push-pull Output (OUTPUT)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
The MOSFET driver output is a low impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 1A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents which discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds that
prevents output glitching even when the rise and fall
time of the input signal is very slow.
3.5
No Connect (NC)
No internal connection.
© 2006 Microchip Technology Inc.
DS21390D-page 7
TC1411/TC1411N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
10%
0V
tD1
tD2
tF
tR
0.1 µF
4.7 µF
VDD
Output
0V
90%
90%
1, 8
2
6, 7
10%
10%
Input
Output
CL = 1000 pF
Inverting Driver
TC1411
TC1411N
TC1411
+5V
90%
Input
4, 5
10%
0V
VDD
Input: 100 kHz,
square wave,
RISE = tFALL ≤ 10 nsec
90%
tD2
90%
tD1
tF
tR
Output
0V
t
10%
10%
Non-Inverting Driver
TC1411N
FIGURE 4-1:
Switching Time Test Circuit.
DS21390D-page 8
© 2006 Microchip Technology Inc.
TC1411/TC1411N
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Example:
8-Lead MSOP
1411NE
XXXXXXX
YWWNNN
635256
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
TC1411
CPA^256
e
3
YYWW
0635
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
TC1411C
e
3
OA0635
NNN
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2006 Microchip Technology Inc.
DS21390D-page 9
TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
n
1
B
α
c
φ
A2
A
L
F
A1
β
Units
INCHES
NOM
MILLIMETERS
*
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.026 BSC
0.65 BSC
Overall Height
A
A2
A1
E
-
-
.043
-
-
1.10
0.95
0.15
Molded Package Thickness
Standoff
.030
.033
.037
.006
0.75
0.85
.000
-
0.00
-
Overall Width
.193 BSC
4.90 BSC
Molded Package Width
Overall Length
E1
D
.118 BSC
.118 BSC
3.00 BSC
3.00 BSC
Foot Length
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint (Reference)
Foot Angle
F
φ
0°
-
8°
0°
-
-
-
-
-
8°
c
Lead Thickness
Lead Width
.003
.009
.006
.012
.009
.016
0.08
0.22
0.23
0.40
B
α
Mold Draft Angle Top
Mold Draft Angle Bottom
5°
5°
-
15°
15°
5°
5°
15°
15°
β
-
*
Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Revised 07-21-05
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21390D-page 10
© 2006 Microchip Technology Inc.
TC1411/TC1411N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
B
p
eB
Units
INCHES*
NOM
8
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.100
2.54
Top to Seating Plane
A
.140
.155
.130
.170
3.56
3.94
3.30
4.32
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
A2
A1
E
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
.145
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
5
3.68
.313
.250
.373
.130
.012
.058
.018
.370
10
.325
.260
.385
.135
.015
.070
.022
.430
15
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
E1
D
Tip to Seating Plane
Lead Thickness
L
c
Upper Lead Width
B1
B
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
© 2006 Microchip Technology Inc.
DS21390D-page 11
TC1411/TC1411N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
1
B
n
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
8
MAX
MIN
NOM
8
MAX
n
p
Number of Pins
Pitch
.050
1.27
Overall Height
A
.053
.061
.056
.007
.237
.154
.193
.015
.025
4
.069
1.35
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
0
12
15
0
12
15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21390D-page 12
© 2006 Microchip Technology Inc.
TC1411/TC1411N
APPENDIX A: REVISION HISTORY
Revision D (September 2006)
• Added -40°C to +125°C temperature range to
Temperature Characteristics table and Product
Information System page.
• Added disclaimer to package outline drawings.
Revision C (March 2003)
• Added 8-Lead MSOP Package.
Revision B (May 2002)
• Converted TELCOM data sheet for Embedded
Control Handbook
Revision A (March 2001)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS21390D-page 13
TC1411/TC1411N
NOTES:
DS21390D-page 14
© 2006 Microchip Technology Inc.
TC1411/TC1411N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
/XX
a)
b)
c)
TC1411COA:
1A Single MOSFET driver,
8LD SOIC pkg,
0°C to +70°C.
1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
Temperature Package
Range
TC1411CPA:
Device:
TC1411: 1 A Single MOSFET Driver, Inverting
TC1411N: 1 A Single MOSFET Driver, Non-Inverting
TC1411EUA713: Tape and Reel,
1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
TC1411VOA713: Tape and Reel,
Temperature Range:
C
E
V
=
=
=
0°C to +70°C
-40°C to +85°C
-40°C to +125°C
d)
1A Single MOSFET driver,
8LD SOIC pkg,
-40°C to +125°C.
Package:
OA
=
Plastic SOIC, (150 mil Body), 8-lead
a)
b)
c)
d)
TC1411NCPA:
TC1411NEPA:
TC1411NEUA:
TC1411NVPA:
1A Single MOSFET driver,
8LD PDIP package,
0°C to +70°C.
1A Single MOSFET driver,
8LD PDIP package,
-40°C to +85°C.
1A Single MOSFET driver,
8LD MSOP package,
-40°C to +85°C.
1A Single MOSFET driver,
8LD PDIP package,
-40°C to +125°C
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
* MSOP package is only available in E-Temp.
© 2006 Microchip Technology Inc.
DS21390D-page 15
TC1411/TC1411N
NOTES:
DS21390D-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21390D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
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EUROPE
Corporate Office
Asia Pacific Office
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Technical Support:
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Web Address:
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Thailand - Bangkok
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Toronto
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Canada
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Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
08/29/06
DS21390D-page 18
© 2006 Microchip Technology Inc.
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