DSA6101MA1B-T [MICROCHIP]
Ultra-Small, Low Power MEMS Oscillator for Automotive;
| 型号： | DSA6101MA1B-T |
| 厂家： | 
MICROCHIP |
| 描述： | Ultra-Small, Low Power MEMS Oscillator for Automotive |
| 文件： | 总24页 (文件大小：416K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSA61XX
Ultra-Small, Low Power MEMS Oscillator for Automotive
Features
General Description
• Automotive AEC-Q100 Qualified
The DSA61xx family of MEMS oscillators combines the
industry leading low power consumption and
ultra-small packages with exceptional frequency
stability and jitter performance over temperature. The
single-output DSA61xx MEMS oscillators are excellent
choices for use as clock references in automotive
applications in which small size, low power
consumption, and long-term reliability are paramount.
The family of devices are AEC-Q100 qualified.
• Wide Frequency Range: 3.5 kHz to 100 MHz
• Ultra-Low Power Consumption: 3 mA/1 μA
(Active/Standby)
• Ultra-Small Footprints
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
• Frequency Select Input Supports Two
Pre-Defined Frequencies
The DSA61xx family is available in ultra-small
1.6 mm x 1.2 mm,
2.0 mm x 1.6 mm,
and
2.5 mm x 2.0 mm packages. These packages are
“drop-in” replacements for standard 4-pin CMOS
quartz crystal oscillators.
• High Stability: ±20 ppm, ±25 ppm, ±50 ppm
• Wide Temperature Range
- Automotive Grade 1: –40°C to +125°C
- Automotive Grade 2: –40°C to +105°C
- Automotive Grade 3: –40°C to +85°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
Package Types
DSA61XX
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <1 week
• Lead Free & RoHS Compliant
OE/STDBY/FS
GND
4
1
VDD
OUT
Applications
• Automotive Infotainment
2
3
• Automotive ADAS, Surround View Cameras
• In-Vehicle Networking, CAN bus, Ethernet
2019 Microchip Technology Inc.
DS20006222A-page 1
DSA61XX
Block Diagram
DSA61XX
DIGITAL
CONTROL
SUPPLY
REGULATION
OE/STDBY/FS
PIN 1
VDD
PIN 4
MEMS
RESONATOR
PLL
TEMP SENSOR
CONTROL &
COMPENSATION
OUTPUT
DIVIDER
VCO
DRIVER
GND
PIN 2
OUTPUT
PIN 3
DS20006222A-page 2
2019 Microchip Technology Inc.
DSA61XX
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (VIN) ............................................................................................................................. –0.3V to VDD+0.3V
ESD Protection .............................................................................................................4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Supply Voltage
Sym.
Min.
Typ.
Max.
Units
Conditions
VDD
tPU
1.71
0.1
—
—
3.63
100
V
Note 1
Note 8
Power Supply Ramp
Active Supply Current
ms
fOUT = 27 MHz, VDD = 1.8V, No
Load
IDD
—
3.0
—
mA
μA
—
—
1
—
—
VDD = 1.8/2.5V, Note 2
ISTBY
Standby Supply Current
1.5
—
—
VDD = 3.3V, Note 2
Output Duty Cycle
Frequency
SYM
f0
45
55
%
—
—
0.0035
100
MHz
±20
±25
±50
Frequency Stability
Δf
—
—
ppm All temp ranges, Note 3
—
—
—
—
±5
±1
1st year @ 25°C
ppm
Aging
Δf
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
Startup Time
tSU
—
—
1.5
ms
VIH
VIL
0.7 x VDD
—
—
—
—
V
V
Input Logic High, Note 4
Input Logic Low, Note 4
Input Logic Levels
Output Disable Time
0.3 x VDD
200 +
2 Periods
tDA
—
—
ns
Note 5
Output Enable Time
tEN
—
—
—
—
1
μs
Note 6
Enable Pull-up Resistor
300
—
kΩ
If configured, Note 7
Note 1: Pin 4 VDD should be filtered with 0.1 μF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
2019 Microchip Technology Inc.
DS20006222A-page 3
DSA61XX
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output Logic High, I = 3 mA,
Std. Drive
VOH
0.8 x VDD
—
—
V
Output Logic High, I = 6 mA,
High Drive
Output Logic Levels
Output Logic Low, I = –3 mA,
Std. Drive
VOL
—
—
0.2 x VDD
V
Output Logic Low, I = –6 mA,
High Drive
DSC61x2
—
—
—
—
1
1.5
1.0
2.0
1.2
ns
ns
ns
ns
VDD = 1.8V
High Drive,
20% to 80%
CL = 15 pF
tRX/tFX
0.5
1.2
0.6
VDD = 2.5V/3.3V
VDD = 1.8V
Output Transition Time
Rise Time/Fall Time
DSC61x1
Std Drive,
20% to 80%
CL = 10 pF
tRY/tFY
VDD = 2.5V/3.3V
—
—
—
—
—
—
8.5
7
—
—
70
60
—
—
VDD = 1.8V
fOUT
27 MHz
=
Period Jitter, RMS
JPER
JCy–Cy
JPP
psRMS
VDD = 2.5V/3.3V
VDD = 1.8V
50
35
70
60
Cycle-to-Cycle Jitter
(Peak)
fOUT
27 MHz
=
ps
VDD = 2.5V/3.3V
VDD = 1.8V
Period Jitter
(Peak-to-Peak)
fOUT
27 MHz
=
ps
VDD = 2.5V/3.3V
Note 1: Pin 4 VDD should be filtered with 0.1 μF capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temp. and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to two periods of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
DS20006222A-page 4
2019 Microchip Technology Inc.
DSA61XX
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Storage Ambient Temperature Range
Soldering Temperature
TJ
TA
TS
–40
–55
—
—
—
+150
+150
—
°C
°C
°C
—
—
+260
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2019 Microchip Technology Inc.
DS20006222A-page 5
DSA61XX
2.0
PIN DESCRIPTIONS
The DSA61xx is a highly configurable device and can be factory programmed in many different ways to meet the
customer’s needs. Microchip’s ClockWorks® Configurator http://clockworks.microchip.com/Timing/ must be used to
choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins
are listed in Table 2-1.
TABLE 2-1:
DSA61XX PIN FUNCTION TABLE
Pin Name
Pin Number
Description
OE
STDBY
FS
Output Enable: H = Active, L = Disabled (High Impedance).
Standby: H = Device is active, L = Device is in standby (Low Power Mode).
Frequency Select: H = Output Frequency 1, L = Output Frequency 2.
Ground.
1
(Note 1)
2
3
4
GND
Output
VDD
Oscillator clock output.
Power supply: 1.71V to 3.63V.
Note 1: DSC610xB/1xB/3xB has a 300 kΩ internal pull-up resistor on pin 1. DSC614xB/5xB/7xB has no internal
pull-up resistor on pin 1 and needs an external pull-up or to be driven by another chip.
An explanation of the different options listed in Table 2-1 follows.
2.1
Pin 1
2.3
Output Buffer Options
This is a control pin and may be configured to fulfill one
of three different functions. If not actively driven, a
10 kΩ pull-up resistor is recommended.
The DSC61xx family is available in multiple output
driver configurations.
The standard-drive (61x1) and high-drive (61x2)
deliver respective output currents of greater than 3 mA
and 6 mA at 20%/80% of the supply voltage. For heavy
loads of 15 pF or higher, the high-drive option is
recommended.
2.1.1
OUTPUT ENABLE (OE)
Pin 1 may be configured as OE. Oscillator output may
be turned on and off according to the state of this pin.
2.1.2
STDBY
Pin 1 may be configured as Standby. When the pin is
low, both output buffer and PLL will be off and the
device will enter a low power mode.
2.1.3
FREQUENCY SELECT (FS)
Pin 1 may be configured as FS. The output may be set
to one of two pre-programmed frequencies. The output
clock frequencies can only be set to either kHz or MHz.
A combination of kHz and MHz cannot be set.
2.2
Pins 2 through 4
Pins 2 and 4 are the supply terminals, GND and VDD
respectively. Pin 3 is the clock output, programmable to
Standard and High Drive strength settings. Visit
ClockWorks® Configurator to customize your device.
DS20006222A-page 6
2019 Microchip Technology Inc.
DSA61XX
3.0
DIAGRAMS
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
VIL
FIGURE 3-1:
Output Waveform.
IDD
4
1
3
2
VDD
0.1μF
CL
VDA
FIGURE 3-2:
Test Circuit.
Via to GND Layer
C1
VDD
Enable
Output
GND
Via to GND Layer
FIGURE 3-3:
Recommended Board Layout.
2019 Microchip Technology Inc.
DS20006222A-page 7
DSA61XX
4.0
SOLDER REFLOW PROFILE
20-40
Seconds
260°C
60-150
Seconds
217°C
200°C
Reflow
60-180
150°C
25°C
Seconds
Pre-Heat
Cool
Time
8 minutes max.
FIGURE 4-1:
Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Preheat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
3°C/sec. max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20006222A-page 8
2019 Microchip Technology Inc.
DSA61XX
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
4-Lead VLGA*
2.5 x 2.0
Example
XXXXXXX
XXXYYWW
SSS
0400000
DCP1834
287
4-Lead VFLGA*
2.0 x 1.6/1.6 x 1.2
Example
XXXX
SSS
011H
502
Legend: XX...X Product code or customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
SSS
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
e
3
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2019 Microchip Technology Inc.
DS20006222A-page 9
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
DS20006222A-page 10
2019 Microchip Technology Inc.
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
Substrate Thickness (with Terminals) A3
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
N
4
e
1.20 BSC
0.75 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
0.20 REF
1.60 BSC
1.20 BSC
0.30
0.375
0.35
D
E
b1
b2
L
0.25
0.325
0.30
-
0.35
0.425
0.40
-
CH
0.125
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006222A-page 11
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
1.20 BSC
1.16 BSC
0.75
MAX
Contact Pitch
Contact Pitch
E1
E2
C
Contact Spacing
Contact Width (X3)
Contact Width
X1
X2
Y
0.35
0.43
0.50
Contact Pad Length (X6)
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
DS20006222A-page 12
2019 Microchip Technology Inc.
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006222A-page 13
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
Substrate Thickness (with Terminals) A3
Overall Length
Overall Width
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
N
6
e
1.55 BSC
0.95 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
D
E
b1
b2
L
0.30
0.40
0.50
-
0.40
0.50
0.60
-
CH
0.15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
DS20006222A-page 14
2019 Microchip Technology Inc.
DSA61XX
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
1.55 BSC
0.95
MAX
Contact Pitch
E
C
Contact Spacing
Contact Width (X4)
Contact Width (X2)
Contact Pad Length (X6)
X1
X2
Y
0.50
0.40
0.70
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
2019 Microchip Technology Inc.
DS20006222A-page 15
DSA61XX
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
C
A
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
4X b1
0.07
0.03
C A B
C
CH
1
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
DS20006222A-page 16
2019 Microchip Technology Inc.
DSA61XX
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
Substrate Thickness (with Terminals) A3
Overall Length
Overall Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
N
4
e
1.65 BSC
1.25 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
D
E
b1
L
0.60
0.60
-
0.70
0.70
-
CH
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006222A-page 17
DSA61XX
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
1.65 BSC
1.25
MAX
Contact Pitch
Contact Spacing
E
C
X
Y
Contact Width (X4)
Contact Pad Length (X6)
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
0.70
0.80
G1
G2
CH
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
DS20006222A-page 18
2019 Microchip Technology Inc.
DSA61XX
APPENDIX A: REVISION HISTORY
Revision A (June 2019)
• Initial creation of DSA61xx Microchip data sheet
DS20006222A.
2019 Microchip Technology Inc.
DS20006222A-page 19
DSA61XX
NOTES:
DS20006222A-page 20
2019 Microchip Technology Inc.
DSA61XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
X
X
X
X
X
-XXX.XXXX
X
XXX
Device
Pin 1
Definition
Output
Drive
Package
Temperature
Range
Frequency
Stability
Revision
Frequency
Media
Type
Automotive
Suffix
Strength
Examples:
Device:
DSA61:
Ultra-Small, Low Power MEMS Oscillator
a) DSA6112JI2B-100.0000VAO:
Ultra-Small, Low Power MEMS Oscillator,
Pin 1 = STDBY with Internal Pull-Up, High Drive
Strength, 4-Lead 2.5 mm x 2.0 mm VLGA,
Automotive Grade 3 Temperature,
±25 ppm Stability, Revision B, 100 MHz Frequency,
140/Tube
Pin 1 Definition:
Selection
Pin 1
Internal Pull-Up Register
0
1
2
4
5
6
OE
Pull-up
Pull-up
Pull-up
None
STDBY
FS
OE
b) DSA6101HL1B-016.0000TVAO:
STDBY
FS
None
Ultra-Small, Low Power MEMS Oscillator,
Pin 1 = OE with Internal Pull–Up, Standard Drive
Strength, 4-Lead 1.6 mm x 1.2 mm VFLGA,
Automotive Grade 2 Temperature, ±50 ppm Stability,
Revision B, 16 MHz Frequency, 1,000/Reel
None
Output Drive
Strength:
1
2
Standard
High
c) DSA6121MA2B-0101BVAO:
Ultra-Small, Low Power MEMS Oscillator,
Pin 1 = Freq. Select with Internal Pull-Up,
Standard Drive Strength, 4-Lead 2.0 mm x 1.6 mm
VFLGA, Automotive Grade 1 Temperature,
±25 ppm Stability, Revision B, Two Frequencies
Configured through ClockWorks, 3,000/Reel
Package:
J
M
H
=
=
=
4-Lead 2.5 mm x 2.0 mm VLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
A
L
I
=
=
=
–40C to +125C (Automotive Grade 1)
–40C to +105C (Automotive Grade 2)
–40C to +85C (Automotive Grade 3)
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
Frequency
Stability:
1
2
3
=
=
=
± 50 ppm
± 25 ppm
± 20 ppm
Revision:
B
=
Revision B
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 80.0000 MHz
xxxKxxx = User-Defined Frequency between 002.000 kHz
and 999.999 kHz
xxxx
=
Frequency configuration code when pin 1 = FS.
Configure the part online through ClockWorks®
configurator.
Media Type:
<blank>= 140/Tube (J Package Option)
<blank>= 100/Bag (M & H Package Options)
T
B
=
=
1,000/Reel
3,000/Reel
Automotive Suffix: Vxx
=
The “xx” is assigned by Microchip.
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-
quency. http://clockworks.microchip.com/timing/.
2019 Microchip Technology Inc.
DS20006222A-page 21
DSA61XX
NOTES:
DS20006222A-page 22
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4709-2
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 Microchip Technology Inc.
DS20006222A-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-72400
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006222A-page 24
2019 Microchip Technology Inc.
05/14/19
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