DSC6301CE1MA-T
更新时间：2024-10-29 22:31:53
品牌：MICROCHIP
描述：Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
概述
数据手册DSC6301CE1MA-T 概述
Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
DSC6301CE1MA-T 数据手册
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PDF下载DSC63XX
Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
Features
General Description
• Output Frequency: 1 MHz to 100 MHz LVCMOS
• Spread Spectrum Options:
The DSC63xx family of devices is the industry’s
smallest and lowest-power spread-spectrum MEMS
oscillators. Available in four different package sizes
with operation as low as 3 mA, the smallest 4-pin
package is a mere 1.6 mm x 1.2 mm in size. The
devices support up to ±2.5% or –3% spread spectrum
that can achieve up to 15 dB electromagnetic
interference (EMI) reduction. Because of industry
standard package and pin options, customers can
solve last minute EMI problems simply by putting the
new DSC63xx on their current board layout with no
redesign required.
- Center Spread: ±0.25%, ±0.5%, ±1.0%,
±1.5%, ±2.0%, ±2.5%
- Down Spread: –0.5%, –1.0%, –1.5%, –2.0%,
–2.5%, –3.0%
• Ultra-Low Power Consumption: 3 mA (Active),
12 A (Standby)
• Wide Supply Voltage Range: 1.71V ~ 3.63V VDD
• Ultra-Small Package Sizes:
- 1.6 mm 1.2 mm
The DSC63xx family is available in ultra-small 1.6 mm
x 1.2 mm and 2.0 mm x 1.6 mm packages. Other
package sizes include: 2.5 mm x 2.0 mm and 3.2 mm x
2.5 mm. These packages are “drop-in” replacements
for standard 4-pin CMOS quartz crystal oscillators.
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
- 3.2 mm 2.5 mm
• Industrial Temperature Range: –40°C to 85°C
• Excellent Shock and Vibration Immunity
• High Reliability
• Lead Free and RoHS Compliant
Applications
• Flat Panel Display/Monitor
• Multi-Function Printer
• Digital Signage
• Consumer Electronics
2017 Microchip Technology Inc.
DS20005808A-page 1
DSC63XX
Package Types
DSC63XX
3.2 mm x 2.5 mm DFN
2.5 mm x 2.0 mm LGA
2.0 mm x 1.6 mm LGA
1.6 mm x 1.2 mm LGA
(Top View)
1
OE/STDBY/SSEN
4
3
VDD
OUT
2
GND
Block Diagram
DSC63XX
DIGITAL
CONTROL
SUPPLY
REGULATION
OE/STBY/SSEN
PIN 1
VDD
PIN 4
SST
MEMS
RESONATOR
PLL
TEMP SENSOR
CONTROL &
COMPENSATION
OUTPUT
DIVIDER
VCO
DRIVER
GND
PIN 2
OUTPUT
PIN 3
DS20005808A-page 2
2017 Microchip Technology Inc.
DSC63XX
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage.......................................................................................................................................... –0.3V to +4.0V
Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
DSC63XX ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage, Note 1
Power Supply Ramp
VDD
tPU
1.71
0.1
—
—
3.63
100
V
—
ms
Note 8
F
OUT = 27 MHz, VDD = 1.8V,
Active Supply Current
IDD
—
3.0
—
mA
µA
No Load
—
—
12
80
—
—
VDD = 1.8/2.5V
Standby Supply Current
Note 2
ISTBY
VDD = 3.3V
±25
±50
Frequency Stability Note 3
Aging
∆f
∆f
—
—
ppm
ppm
ms
All temp ranges
—
—
—
—
±5
±1
1st year @25°C
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
Startup Time
tSU
—
—
1.3
VIH
VIL
0.7 x VDD
—
—
—
—
V
V
Input Logic High
Input Logic Low
Input Logic Levels Note 4
0.3 x VDD
Output Disable Time
Note 5
tDA
tEN
—
—
—
—
—
—
200+Period
ns
µs
kΩ
—
—
Output Enable Time
Note 6
1
OE/STDBY/SSEN Pull-up
Resistor Note 7
300
—
If configured
Output Logic High, I = 3 mA,
Std. Drive
VOH
0.8 x VDD
—
—
—
V
V
Output Logic High, I = 6 mA,
High Drive
Output Logic Levels
Output Logic Low, I = –3 mA,
Std. Drive
VOL
—
0.2 x VDD
Output Logic Low, I = –6 mA,
High Drive
Note 1: Pin 4 VDD should be filtered with 0.1 µf capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temperature, and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to one period of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
2017 Microchip Technology Inc.
DS20005808A-page 3
DSC63XX
DSC63XX ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
DSC63x2
—
1
1.5
ns
VDD = 1.8V
VDD = 2.5V/3.3V
VDD = 1.8V
High Drive,
20% to 80%
CL = 15 pF
tRX/tFX
—
—
—
0.5
1.2
1
1.0
2.0
1.6
ns
ns
ns
Output Transition Time
Rise Time/Fall Time
DSC63x1
Std Drive,
20% to 80%
CL = 10 pF
tRY/tFY
VDD = 2.5V/3.3V
Frequency
f0
1
—
—
14
11
75
53
100
55
—
MHz
%
—
—
Output Duty Cycle
SYM
45
—
—
—
—
VDD = 1.8V
FOUT
27 MHz
=
Period Jitter, RMS
JPER
psRMS
—
VDD = 2.5V/3.3V
VDD = 1.8V
—
Cycle-to-Cycle Jitter
(peak)
FOUT
27 MHz
=
JCy–Cy
ps
—
VDD = 2.5V/3.3V
Spread Spectrum
Modulation Frequency
fSS
—
33
—
kHz
—
—
—
—
—
—
—
—
—
—
—
—
—
±0.25
±0.5
±1
—
—
—
—
—
—
—
—
—
—
—
—
%
Center Spread
±1.5
±2
±2.5
–0.25
–0.5
–1
Spread Spectrum
Modulation and Type
—
%
Down Spread
–1.5
–2
–3
Note 1: Pin 4 VDD should be filtered with 0.1 µf capacitor.
2: Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD
.
3: Includes frequency variations due to initial tolerance, temperature, and power supply voltage.
4: Input waveform must be monotonic with rise/fall time < 10 ms
5: Output Disable time takes up to one period of the output waveform + 200 ns.
6: For parts configured with OE, not Standby.
7: Output is enabled if pad is floated or not connected.
8: Time to reach 90% of target VDD. Power ramp rise must be monotonic.
DS20005808A-page 4
2017 Microchip Technology Inc.
DSC63XX
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Ambient Operating Temperature
Ambient Operating Temperature
Storage Ambient Temperature Range
Soldering Temperature
TJ
TA
TA
TA
TS
—
–40
–20
–55
—
—
—
+150
+85
+70
+150
—
°C
°C
°C
°C
°C
—
Industrial
—
Extended Commercial
—
—
+260
40 sec. max.
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the max-
imum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2017 Microchip Technology Inc.
DS20005808A-page 5
DSC63XX
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin Number
DSC63XX PIN FUNCTION TABLE (OUTPUT FREQUENCY ≥1 MHZ)
Pin Name
Pin Type
Description
Output Enable: H = Specified Frequency Output, Note 1,
OE
Note 2
L = Output is high impedance
Standby: H = Specified Frequency Output, Note 1, Note 2
L = Output is high impedance. Device is in low power
mode, supply current is at ISTBY
1
I
STDBY
SSEN
Spread Spectrum Enable: H = Enabled
L = Disabled, Note 1
2
3
4
GND
Output
VDD
Power
O
Power supply ground
Oscillator clock output
Power supply, Note 3
Power
Note 1: DSC630x/1x/3x has 300 kꢀ internal pull-up resistor on pin 1. DSC634x/5x/7x has no internal pull-up resis-
tor on pin 1 and needs an external pull-up or to be driven by other chip.
2: If pin 1 is configured as either OE or STDBY, then the Spread Spectrum is enabled by default.
3: Bypass with 0.1 µF capacitor placed as close to VDD pin as possible.
2.1
Output Buffer Options
The DSC63xx family is available in multiple output driver configurations.
The standard-drive (63x1) and high-drive (63x2) deliver respective output currents of greater than 3 mA and 6 mA at
20%/80% of the supply voltage. For heavy loads of 15 pF or higher, the high-drive option is recommended.
DS20005808A-page 6
2017 Microchip Technology Inc.
DSC63XX
3.0
DIAGRAMS
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
VIL
FIGURE 3-1:
Output Waveform.
IDD
4
1
3
2
VDD
0.1μF
CL
VDA
FIGURE 3-2:
Test Circuit.
Via to GND Layer
C1
VDD
Enable
Output
GND
Via to GND Layer
FIGURE 3-3:
Recommended Board Layout.
2017 Microchip Technology Inc.
DS20005808A-page 7
DSC63XX
4.0
SPREAD SPECTRUM
Spread spectrum is a slow modulation of the clock
frequency over time. The PLL inside the MEMS
oscillator is modulated with a triangular wave at
33 kHz. With such a slow modulation, the peak spectral
energy of both the fundamental and all the harmonics
is spread over a wider frequency range and such an
energy is significantly reduced, thus providing an EMI
reduction. The triangular wave is chosen because of its
flat spectral density.
The DSC63xx MEMS oscillator family offers several
modulation options: the spreading is either center
spread or down spread with respect to the clock
frequency. Center spreading ranges from ±0.25% to
±2.5%, while down spreading ranges from –0.25% to –
3%.
FIGURE 4-2:
33.333 MHz with Modulation Turned On.
DSC6331 Spectrum at
If the clock frequency is 100 MHz and center spreading
with ±1% is chosen, the output clock will range from
99 MHz to 101 MHz. If down spreading with –2% is
chosen, the output clock will range from 98 MHz to
100 MHz.
It is noticeable that the spread spectrum provides a
reduction of about 10 dB from the peak power. Such a
reduction may also be estimated by the following
equation:
EQUATION 4-1:
Figure 4-1 and Figure 4-2 show a spectrum example of
the DSC6331 with a 33.333 MHz clock, modulated with
central spread of ±1%.
EMI Reduction = 10 Log10 S fc RBW
Where:
S
Peak-to-peak spread percentage (0.01,
this example).
fc
Carrier frequency (33.333 Mhz, this
example).
RBW Resolution bandwidth of the spectrum
analyzer (30 kHz, this example).
The theoretical calculation for this example provides
10.45 dB, which is consistent with the measurement.
Similarly to the fundamental frequency, all the
harmonics are spread and attenuated in similar
fashion. Figure 4-3 shows how the DSC6331
fundamental at 33.333 MHz and its odd harmonics are
attenuated when various types of modulations are
selected. For picture clarity, only the center spread
options are shown. However, down spread with
corresponding percentage provides the same level of
harmonic attenuation (e.g. central spread of ±1%
provides the same harmonics attenuation of down
spread with –2%).
FIGURE 4-1:
33.333 MHz with Modulation Turned Off.
DSC6331 Spectrum at
DS20005808A-page 8
2017 Microchip Technology Inc.
DSC63XX
FIGURE 4-3:
DSC6331 Harmonic Levels with Various Spread Spectrum Options.
2017 Microchip Technology Inc.
DS20005808A-page 9
DSC63XX
5.0
SOLDER REFLOW
20-40
Seconds
260°C
60-150
Seconds
217°C
200°C
Reflow
60-180
150°C
25°C
Seconds
Pre-Heat
Cool
Time
8 minutes max.
FIGURE 5-1:
Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
Pre-heat Time 150°C to 200°C
Time maintained above 217°C
Peak Temperature
3°C/sec max.
60 to 180 sec.
60 to 150 sec.
255°C to 260°C
20 to 40 sec.
Time within 5°C of actual Peak
Ramp-Down Rate
6°C/sec. max.
8 minutes max.
Time 25°C to Peak Temperature
DS20005808A-page 10
2017 Microchip Technology Inc.
DSC63XX
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Example
4-Lead DFN*
XXXXXXX
DCPYYWW
SSS
0333333
DCP1734
943
4-Lead VFLGA*
Example
XXXW
SSS
0069
SSS
Legend: XX...X Product code, customer-specific information, or frequency in MHz
without printed decimal point
Y
Year code (last digit of calendar year)
YY
WW
NN
e3
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
e3
*
)
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2017 Microchip Technology Inc.
DS20005808A-page 11
DSC63XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
DS20005808A-page 12
2017 Microchip Technology Inc.
DSC63XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.20 BSC
0.75 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
1.60 BSC
1.20 BSC
0.30
0.375
0.35
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.25
0.325
0.30
-
0.35
0.425
0.40
-
CH
0.125
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
2017 Microchip Technology Inc.
DS20005808A-page 13
DSC63XX
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.20 BSC
1.16 BSC
0.75
MAX
Contact Pitch
Contact Pitch
E1
E2
C
Contact Spacing
Contact Width (X3)
Contact Width
X1
X2
Y
0.35
0.43
0.50
Contact Pad Length (X6)
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
DS20005808A-page 14
2017 Microchip Technology Inc.
DSC63XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
1
3X b1
0.07
0.03
C A B
C
CH
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
2017 Microchip Technology Inc.
DS20005808A-page 15
DSC63XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
6
e
1.55 BSC
0.95 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
Overall Length
Overall Width
D
E
Terminal Width
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
b2
L
0.30
0.40
0.50
-
0.40
0.50
0.60
-
CH
0.15
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
DS20005808A-page 16
2017 Microchip Technology Inc.
DSC63XX
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.55 BSC
0.95
MAX
Contact Pitch
Contact Spacing
E
C
Contact Width (X4)
Contact Width (X2)
Contact Pad Length (X6)
X1
X2
Y
0.50
0.40
0.70
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
2017 Microchip Technology Inc.
DS20005808A-page 17
DSC63XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
NOTE 1
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
0.10 C
A1
C
A
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
4X b1
0.07
0.03
C A B
C
CH
1
2
CH
NOTE 1
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
DS20005808A-page 18
2017 Microchip Technology Inc.
DSC63XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Terminal Pitch
Terminal Pitch
Overall Height
Standoff
N
4
e
1.65 BSC
1.25 BSC
0.84
e1
A
A1
0.79
0.00
0.89
0.05
0.02
Substrate Thickness (with Terminals) A3
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
Overall Length
Overall Width
D
E
Terminal Width
Terminal Length
Terminal 1 Index Chamfer
b1
L
CH
0.60
0.60
-
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
2017 Microchip Technology Inc.
DS20005808A-page 19
DSC63XX
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
MILLIMETERS
Dimension Limits
MIN
NOM
1.65 BSC
1.25
MAX
Contact Pitch
Contact Spacing
Contact Width (X4)
Contact Pad Length (X6)
E
C
X
Y
0.70
0.80
Space Between Contacts (X4)
Space Between Contacts (X3)
Contact 1 Index Chamfer
G1
G2
CH
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
DS20005808A-page 20
2017 Microchip Technology Inc.
DSC63XX
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TITLE
4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING #
UNIT
MM
CDFN3225-4LD-PL-1
NOTE:
1. Green shaded rectangles in Recommended Land Pattern are solder stencil opening.
2017 Microchip Technology Inc.
DS20005808A-page 21
DSC63XX
NOTES:
DS20005808A-page 22
2017 Microchip Technology Inc.
DSC63XX
APPENDIX A: REVISION HISTORY
Revision A (September 2017)
• Initial release of DSC63xx Microchip data sheet
DS20005808A.
2017 Microchip Technology Inc.
DS20005808A-page 23
DSC63XX
NOTES:
DS20005808A-page 24
2017 Microchip Technology Inc.
DSC63XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
X
PART NO.
X
X
X
X – XXX.XXXX
X
X
X
a) DSC6332JI2AA-100.0000:
Device Pin 1
Definition
Output Package
Drive
Strength
Temp.
Range
Revision Frequency
Spectrum
Freq.
Stability
Spread
Tape
and
Reel
Ultra–Low Power MEMS Oscillator, Pin1 = Spread
Spectrum Enable with Internal Pull-Up, High Drive
Strength, 4-Lead 2.5 mm x 2.0 mm VFLGA, Industrial
Temperature, ±25 ppm Stability, ±0.25% Spread
Spectrum, Revision A, 100 MHz Frequency,
110/Tube
Device:
DSC63xx:
Ultra-Low Power MEMS Oscillator
Pin Definition:
Selection Pin 1
Internal Pull Register
b) DSC6301HE1HA-016.0000T:
0
1
3
4
5
7
OE
Pull-up
Pull-up
Pull-up
None
Ultra–Low Power MEMS Oscillator, Pin1 = OE
with Internal Pull–Up, Standard Drive Strength,
4-Lead 1.6 mm x 1.2 mm VFLGA, Extended
Commercial Temp., ±50 ppm Stability,
–0.5% Spread Spectrum Revision A, 16 MHz
Frequency, 1,000/Reel
STDBY
SSEN
OE
STDBY
SSEN
None
None
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
Output Drive
Strength:
1
2
Standard
High
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Packages:
C
J
M
H
=
=
=
=
4-Lead 3.2 mm x 2.5 mm DFN
4-Lead 2.5 mm x 2.0 mm VFLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
E
I
=
=
–20C to +70C (Extended Commercial)
–40C to +85C (Industrial)
Frequency
Stability:
1
2
=
=
± 50 ppm
± 25 ppm
Spread Spectrum:
A
B
C
D
E
F
G
H
I
=
=
=
=
=
=
=
=
=
=
=
=
=
±0.25%
±0.5%
±1.0%
±1.5%
±2.0%
±2.5%
–0.25%
–0.5%
–1.0%
–1.5%
–2.0%
–3.0%
Custom
J
K
L
M
Revision:
A
=
Revision A
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 100.0000 MHz
Tape and Reel:
<blank>= 110/Tube
T
=
1,000/Reel
Note 1: Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized fre-
quency. http://clockworks.microchip.com/timing/.
2017 Microchip Technology Inc.
DS20005808A-page 25
DSC63XX
NOTES:
DS20005808A-page 26
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENAare trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2146-7
== ISO/TSꢀ16949ꢀ==ꢀ
2017 Microchip Technology Inc.
DS20005808A-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
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Web Address:
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DS20005808A-page 28
2017 Microchip Technology Inc.
11/07/16
DSC6301CE1MA-T 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| DSC6301CE2AA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2BA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2CA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2DA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2EA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2FA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2GA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2HA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2IA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
|
| DSC6301CE2JA-T | MICROCHIP | Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum | 获取价格 |
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