HV56264T-E/QEX-VAO [MICROCHIP]
Quad High Voltage Amplifier Array;
| 型号： | HV56264T-E/QEX-VAO |
| 厂家： | 
MICROCHIP |
| 描述： | Quad High Voltage Amplifier Array |
| 文件： | 总26页 (文件大小：744K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HV56264
Quad High Voltage Amplifier Array
Features
General Description
• Four Independent High Voltage Amplifiers
• 219V Output Voltage Swing
The HV56264 is an AEC-Q100 rated, Quad High
Voltage Amplifier Array integrated circuit. The device
operates on a 225V high voltage supply and a 5.0V low
voltage supply. Amplifiers input voltage range from 0V
to 3.3V and output swing ranges from 1.0V to VPP – 6V
with a 3 mA sink/source current capability.
• 11 V/s Output Slew Rate
• 410 A Maximum Operating Current for High
Voltage Supply
• Wide Operating Close Loop Gain Range: 50 to
100V/V
The HV56264 is designed for maximum performance
with minimal high voltage current. The high voltage
current for each amplifier is typically less than 75 A.
• 150 kHz, -3 dB Bandwidth with 15 pF Load
• AEC-Q100 Qualified
• TSSOP and TFBGA Packages
Related Devices
Application
HV264
• Tunable Laser
Packages
• Micro-Electromechanical Systems (MEMS) Driver
• Test Equipment
• TSSOP 24L
• Piezoelectric Transducer Driver
• TFBGA 60-Ball
Package Types
24-Lead TSSOP
60-Ball TFBGA
TOP VIEW
TOP VIEW
SEE THROUGH
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
G
H
J
NC
IN1P
IN1N
IN2P
IN2N
VDD
GND
IN3P
IN3N
IN4P
NC
HVOUT1
IN1P
GND
GND
HVGND HVGND HVGND HVGND HVGND
HVGND HVGND HVGND HVGND HVGND
HVOUT1
NC
IN1N
IN2P
IN2N
GND
GND
GND
GND
GND
HVOUT2
HVOUT2
NC
NC
VDD
NC
GND
GND
GND
HVGND HVGND HVGND
HVGND HVGND HVGND
HVGND
VPP
VPP
HVGND
HVOUT3
NC
HVGND
IN3P
GND
GND
GND
HVOUT4
IN3N
IN4P
GND
GND
HVOUT3
IN4N
NC
NC
NC
K
L
HVGND HVGND HVGND HVGND HVGND
HVGND HVGND HVGND HVGND
IN4N
GND
GND
HVOUT4
2021 Microchip Technology Inc.
DS20006477B-page 1
HV56264
Block Diagram
VDD VPP
+
-
VIN1P
VIN1N
HVOUT1
HVOUT2
+
-
VIN2P
VIN2N
+
-
VIN3P
VIN3N
HVOUT3
HVOUT4
+
-
VIN4P
VIN4N
GND
HVGND
DS20006477B-page 2
2021 Microchip Technology Inc.
HV56264
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VINXP,N High Voltage Amplifiers Inputs......................................................................................................–0.3V to 5.5V
VDD Low Output Voltage Supply..................................................................................................................–0.3V to 5.5V
VPP High Voltage Supply for Op-Amps.......................................................................................................–0.5V to 250V
Storage Temperature............................................................................................................................–55°C to +150°C
Operating Junction Temperature...........................................................................................................–40°C to +125°C
ESD Rating HBM High Voltage Pins...........................................................................................................................1kV
ESD Rating HBM Low Voltage Pins............................................................................................................................2kV
ESD Rating CDM Corner Pins................................................................................................................................. 750V
ESD Rating CDM all Other Pins.............................................................................................................................. 500V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1:
RECOMMENDED OPERATING RATINGS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
High Voltage Supply
VPP
50
—
225
V
Low Voltage Supply
Inputs for Amplifiers
VDD
4.5
0
5
5.5
3.3
V
V
VINXP,N
—
POWER SEQUENCE
Power-Up Sequence
1. Connect Ground
2. Apply VDD
3. Set all inputs to ground
4. Apply VPP
Power-Down Sequence
Reverse order of Power-Up Sequence
2021 Microchip Technology Inc.
DS20006477B-page 3
HV56264
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, VDD = 5.0V, VPP = 225V, TA= TJ= +25°C.
Boldface specifications apply over the full operating temperature range of TA= TJ = -40°C to 125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
All inputs at 0V,
RF = 5.36 M
R1 = 79.6 k
VDD = 5.5V
—
300
—
V
PP Supply Current
IPP
µA
—
—
—
—
410
6.6
8.3
All inputs at 0V,
RF = 5.36 M
R1 = 79.6 k
VDD = 5.5V
—
—
VDD Supply Current
IDD
mA
VIN = 3.3V
RF = 536 k
R1 = 7.97 k
(Note 1)
HVOUT VOH1 Voltage Swing
HVOUT VOH2 Voltage Swing
VOH1
VOH2
VPP-3
VPP-6
—
—
—
—
VIN = 3.3V
RF = 5.36 M
R1 = 79.6 k
V
VIN = 0V
RF = 536 k
R1 = 7.97 k
(Note 1)
HVOUT VOL1 Voltage Swing
HVOUT VOL2 Voltage Swing
VOL1
VOL2
—
—
—
—
1
VIN = 0V
RF = 5.36 M
R1 = 79.6 k
1.7
Input Voltage Range
VINXP,N
IIN
0
VDD-1.5
50
V
nA
V
Note 2
VIN = 1V
(Note 1)
Input Current into VINXP,N pins
High Voltage Output Offset Voltage
—
—
—
HVOS
–1.9
1.9
Note 1: Specification is obtained by characterization and is not 100% tested.
2: Design guidance only.
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, VDD = 5.0V, VPP = 225V, TA= TJ = +25°C,
RF = 5.36 M, R1 = 79.6 k
Boldface specifications apply over the full operating temperature range of TA= TJ = -40°C to 125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Load = 15 pF
10%-90%
VIN = 0 to 3.3V
Square Wave
HVOUT Slew Rate-Rising Edge
4
11
20
SR
V/µs
HVOUT Slew Rate-Falling Edge
4
11
—
20
External Resistor Network
RFB= RF+RI
Total External Feedback Resistance
FB
700k
7M
(Note 2)
Load = 15pF
VIN= 1.5V DC + 150 mV AC
(Note 1)
Bandwidth (–3dB)
BW
150
—
—
kHz
Note 1: Specification is obtained by characterization and is not 100% tested.
2: Design guidance only.
3: Excluding package parasitic capacitance.
DS20006477B-page 4
2021 Microchip Technology Inc.
HV56264
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, VDD = 5.0V, VPP = 225V, TA= TJ = +25°C,
RF = 5.36 M, R1 = 79.6 k
Boldface specifications apply over the full operating temperature range of TA= TJ = -40°C to 125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
External Resistor Network
(Note 2)
Closed Loop Gain Range
AV
50
—
100
V/V
(Note 2)
(Note 3)
HVOUT Capacitive Load
Output Referred Noise
CLOAD
0
—
—
15
10
pF
Measured at HVOUT,
mVrms VIN = 0.2V
(Note 1)
VN
—
VDD = 4.5V to 5.5V
VPP = 225V,
VIN = 0.1V,
DC Measurement
(Note 1)
VDD Power Supply Rejection Ratio PSRR1
VPP Power Supply Rejection Ratio PSRR2
40
60
—
—
—
—
—
—
dB
dB
dB
VDD = 5V
VPP = 50 to 225V,
VIN = 0.1V
DC Measurement
(Note 1)
Output Referred.
VIN 0 to 3.3V sine wave at
100 Hz
Crosstalk
Xtalk
-80
with CL = 15 pF
(Note 1)
Note 1: Specification is obtained by characterization and is not 100% tested.
2: Design guidance only.
3: Excluding package parasitic capacitance.
2021 Microchip Technology Inc.
DS20006477B-page 5
HV56264
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, VDD = 5.0V, VPP = 225V
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Junction Temperature
Storage Temperature
TJ
–40
–55
—
—
125
150
°C
°C
TS
Package Thermal Resistances
Thermal Resistance - TSSOP
JC
JA
JC
JA
—
—
—
—
11.8
55
—
—
—
—
°C/W Note 1
°C/W
Thermal Resistance - TFBGA
12.4
47
°C/W
°C/W
Note 1: 4 Layers FR4 4”X4” PCB
DS20006477B-page 6
2021 Microchip Technology Inc.
HV56264
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VDD = 5.0V, VPP = 225V, VIN = 0V, RF = 5.36 M, RI = 79.6 kCLOAD = 15 pF.
FIGURE 2-1:
IDD Variation Over
FIGURE 2-4:
IPP Variation Over
Temperature.
Temperature.
FIGURE 2-2:
VOH2 Distribution at
FIGURE 2-5:
VOL2 Distribution at
TA = 25°C.
TA = 25°C.
FIGURE 2-3:
HVOS Distribution at
FIGURE 2-6:
HVOUT Drift Over Time at
TA = 25°C.
TA = 25 °C (VIN = 0.2V).
2021 Microchip Technology Inc.
DS20006477B-page 7
HV56264
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VDD = 5.0V, VPP = 225V, VIN = 0V, RF = 5.36 M, RI = 79.6 kCLOAD = 15 pF.
FIGURE 2-7:
Typical Small Signal Pulse
FIGURE 2-10:
Typical Small Signal Pulse
Response (VIN = 1.5V to 1.75V, RF = 5.36 M,
RI = 79.6 k).
Response (VIN = 1.5V to 1.75V, RF = 536 k,
RI = 7.97 k).
FIGURE 2-8:
Typical Small Signal Pulse
FIGURE 2-11:
Typical Small Signal Pulse
Response (VIN = 0V to 3.3V, RF = 5.36 M,
RI = 79.6 k).
Response (VIN = 0V to 3.3V, RF = 536 k,
RI = 7.97 k).
FIGURE 2-9:
Typical Bode Plot of Small
FIGURE 2-12:
Slew Rate Rising-Edge
Signal Gain (VIN = 1.5V + 0.2AC).
Variation Over Temperature.
DS20006477B-page 8
2021 Microchip Technology Inc.
HV56264
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VDD = 5.0V, VPP = 225V, VIN = 0V, RF = 5.36 M, RI = 79.6 kCLOAD = 15 pF.
FIGURE 2-13:
Slew Rate Falling-Edge
FIGURE 2-15:
PSRR1-VDD (VDD = 5.0V +
Variation Over Temperature.
0.1 V AC).
FIGURE 2-14:
PSRR2-VPP (VPP = 225V +
1V AC).
2021 Microchip Technology Inc.
DS20006477B-page 9
HV56264
3.0
PACKAGE PIN CONFIGURATION AND DESCRIPTION
NC
IN1P
IN1N
IN2P
IN2N
VDD
GND
IN3P
IN3N
IN4P
NC
HVOUT1
NC
HVOUT2
NC
VPP
HVGND
HVOUT3
NC
HVOUT4
IN4N
NC
NC
NC
FIGURE 3-1:
TSSOP Pinout.
DS20006477B-page 10
2021 Microchip Technology Inc.
HV56264
TOP VIEW
SEE THROUGH
1
2
3
4
5
6
7
8
9
10
11
A
B
C
D
E
F
G
H
J
HVOUT1
IN1P
GND
GND
HVGND HVGND HVGND HVGND HVGND
HVGND HVGND HVGND HVGND HVGND
IN1N
IN2P
IN2N
GND
GND
GND
GND
GND
HVOUT2
NC
VDD
NC
GND
GND
GND
HVGND HVGND HVGND
HVGND HVGND HVGND
HVGND
VPP
HVGND
IN3P
GND
GND
GND
IN3N
IN4P
GND
GND
HVOUT3
K
L
HVGND HVGND HVGND HVGND
HVGND HVGND HVGND HVGND
HVGND
IN4N
GND
GND
HVOUT4
FIGURE 3-2:
TFBGA Pinout.
2021 Microchip Technology Inc.
DS20006477B-page 11
HV56264
TABLE 3-1:
PINOUT CONFIGURATION
TSSOP PIN #
TFBGA PIN #
NAME
FUNCTION
No Connection
1,12,13,14,16,20,22,24
E1,G1
A1
NC
2
3
4
5
6
7
IN1P
IN1N
IN2P
IN2N
VDD
GND
Amplifier 1 Non-inverting Input
Amplifier 1 Inverting Input
Amplifier 2 Non-inverting Input
Amplifier 2 Inverting Input
Low Voltage Supply
B1
C1
D1
F1
A2,A3,B2,B3,C2,C3,D2,E2,
F2,G2,H2,J2,J3,K2,K3,L2,L3
Ground
8
H1
J1
IN3P
IN3N
Amplifier 3 Non-inverting Input
Amplifier 3 Inverting Input
Amplifier 4 Non-inverting Input
Amplifier 4 Inverting Input
Amplifier 4 Output
9
10
11
15
17
18
K1
IN4P
L1
IN4N
L10
J11
HVOUT4
HVOUT3
HVGND
Amplifier 3 Output
A4,A5,A6,A7,A8,B4,B5,B6,B7,B8,
E5,E6,E7,F5,F6,F7,G6,G10,
K4,K5,K6,K7,K8,L4,L5,L6,L7
High Voltage Ground
19
21
23
E11
C10
A11
VPP
High Voltage Positive Supply
Amplifier 2 Output
HVOUT2
HVOUT1
Amplifier 1 Output
3.1
IN1P, IN1N, IN2P, IN2N, IN3P, IN3N,
IN4P, IN4N Input pins
3.5
High Voltage Amplifiers Outputs
(HVOUT4, HVOUT3, HVOUT2,
HVOUT1)
Input pins for the amplifiers.
Amplifiers output pins.
3.2
Low Voltage Supply Input Pin
(VDD)
3.6
Ground (GND)
Low voltage supply input pin for the amplifiers.
Ground reference for input signals and low voltage
supplies.
3.3
High Voltage Positive Supply Input
Pin (VPP)
High voltage supply input pin for the amplifiers.
3.4
High Voltage Ground (HVGND)
Ground reference pins for the high voltage amplifiers.
DS20006477B-page 12
2021 Microchip Technology Inc.
HV56264
4.0
FUNCTIONAL DESCRIPTION
The HV56264 is a Quad High Voltage Amplifier Array
that can operate up to 225V with a source/sink
capability of 3 mA. Amplifiers are designed to deliver a
11 V/s typical output slew rate and sustain a 150 kHz
–3 dB Bandwidth for a 15 pF capacitive load.
VDD VPP
+
-
Vx
0 to 3.3V
CLOAD
RI
RF
FIGURE 4-1:
Functional Block Diagram.
2021 Microchip Technology Inc.
DS20006477B-page 13
HV56264
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
24-Lead TSSOP
Example
HV56264
e
3
QEX 123
e
3
3825
60-Lead TFBGA (6 x 6 mm)
Example
HV56264
XXXXXXXXXX
XXXXXXXXXX
e
3
3825123
Legend: XX...X Product Code or Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
DS20006477B-page 14
2021 Microchip Technology Inc.
HV56264
24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP]
Supertex Legacy & Micrel Legacy Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
(DATUM A)
(DATUM B)
E1
2X N2 TIPS
0.20
C
1
2
24X b
0.10
C A-B D
e
TOP VIEW
A
A
A1
0.05 C
C
A2
A
SEATING
PLANE
24X
0.10 C
SIDE VIEW
SEE DETAIL B
SHEET 2
VIEW A-A
Microchip Technology Drawing C04-284A Sheet 1 of 2
2021 Microchip Technology Inc.
DS20006477B-page 15
HV56264
24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP]
Supertex Legacy & Micrel Legacy Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
H
T
L
(L1)
DETAIL B
Units
Dimension Limits
MILLIMETERS
MIN
NOM
24
0.65 BSC
-
0.10
1.00
MAX
Number of Leads
Lead Pitch
Overall Height
Standoff
Molded Package Thickness
Foot Length
N
e
A
A1
A2
L
0.85
0.05
0.80
0.45
1.20
0.15
1.15
0.75
0.60
Footprint
Foot Angle
L1
T
1.00 REF
4°
0°
8°
Overall Width
E
D
E1
b
D
6.40 BSC
7.80
4.40
Overall Length
Molded Package Width
Lead Width
7.70
4.30
0.19
7.90
4.50
0.30
-
Mold Draft Angle Top
12° REF
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-284A Sheet 2 of 2
DS20006477B-page 16
2021 Microchip Technology Inc.
HV56264
24-Lead Thin Shrink Small Outline Package (QE) - 4.40 mm Body [TSSOP]
Supertex Legacy & Micrel Legacy Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
G
24
C
SILK SCREEN
Y1
1 2
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
0.65 BSC
5.80
MIN
0.20
MAX
Contact Pitch
Contact Pad Spacing
Contact Pad Width (X24)
Contact Pad Length (X24)
E
C
X1
Y1
G1
0.45
1.50
Contact Pad to Center Pad (X20)
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2284A
2021 Microchip Technology Inc.
DS20006477B-page 17
HV56264
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DS20006477B-page 18
2021 Microchip Technology Inc.
HV56264
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2021 Microchip Technology Inc.
DS20006477B-page 19
HV56264
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DS20006477B-page 20
2021 Microchip Technology Inc.
HV56264
APPENDIX A: REVISION HISTORY
Revision B (January 2021)
The following is the list of modifications:
• Updated the DC Electrical Characteristics table.
• Minor typographical and layout edits.
Revision A (December 2020)
• Initial Release of this Document.
2021 Microchip Technology Inc.
DS20006477B-page 21
HV56264
NOTES:
DS20006477B-page 22
2021 Microchip Technology Inc.
HV56264
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
(1)
Examples:
-X
PART NO.
Device
X
/XXX
-XXX
a) HV56264T-E/QEX-VAO: Quad High-Voltage Amplifier Array,
Tape and Reel Temperature
Package
Option
Automotive Grade,
24-Lead TSSOP package,
2500 Reel
Option
Range
b) HV56264T-E/AKA-VAO: Quad High-Voltage Amplifier Array,
Automotive Grade,
Device:
HV56264: Quad High Voltage Amplifier Array
60-Terminal Count TFBGApackage,
3000/Reel
Media Type
T
E
=
=
2500/Reel for QEX Package
3000/Reel for AKA Package
Temperature
Range:
=
-40°C to +125°C (Extended)
RoHS Compliant
Package:
Option
QEX = 24LD TSSOP 6.4x4.4 mm
Note 1:
Tape and Reel identifier only appears in the catalog part
number description. This identifier is used for ordering
purposes and is not printed on the device package. Check
with your Microchip Sales Office for package availability with
the Tape and Reel option.
AKA = 60-Ball Count TFBGA 6x6x1.2 mm
VAO = Automotive Grade
2021 Microchip Technology Inc.
DS20006477B-page 23
HV56264
NOTES:
DS20006477B-page 24
2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
•
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable". Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Infor-
mation regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED
NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS
FOR PARTICULAR PURPOSE OR WARRANTIES
RELATED TO ITS CONDITION, QUALITY, OR PERFOR-
MANCE.
TO ANY
IMPLIED
WARRANTIES
OF
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo,
Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium,
TimeHub, TimePictra, TimeProvider, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
A
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-
RECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUEN-
TIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life sup-
port and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP,
INICnet, Intelligent Paralleling, Inter-Chip Connectivity,
JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi,
MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK,
NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE,
Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O,
simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2021, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-7480-7
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2021 Microchip Technology Inc.
DS20006477B-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
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Tel: 61-2-9868-6733
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Tel: 91-80-3090-4444
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Web Address:
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Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006477B-page 26
2021 Microchip Technology Inc.
02/28/20
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