LAN7431-I/YXX [MICROCHIP]
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY;
| 型号： | LAN7431-I/YXX |
| 厂家： | 
MICROCHIP |
| 描述： | Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY 通信 时钟 以太网：16GBASE-T 数据传输 PC 外围集成电路 |
| 文件： | 总77页 (文件大小：1384K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LAN7430/LAN7431
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
Highlights
Product Features
• Single Chip PCIe to 10/100/1000 Ethernet Con-
• Gigabit Ethernet PHY (LAN7430)
troller with integrated:
- Auto-Negotiation and Auto-MDIX support
- On-chip termination resistors for differential
pairs
- PCIe 3.1 PHY supporting 1 Lane at 2.5GT/s
- PCIe 3.1 Endpoint Controller
- Gigabit Ethernet PHY (LAN7430)
- RGMII v1.3 and v2.0 / MII (LAN7431)
• IEEE Std 1588TM-2008 PTP
®
- LinkMD TDR-Based cable diagnostic to iden-
tify faulty copper cabling
- Signal Quality Indicator
®
- Quiet-WIRE technology to reduce line emis-
- Master and Slave Ordinary clock support
- End-to-end or peer-to-peer support
- PTP multicast and unicast message support
- PTP message transport over IPv4/v6, IEEE
802.3
sions and enhance immunity for 100BASE-TX
- Programmable LED Outputs for Link, Activity,
Speed
- Signal Quality Indicator (SQI) support
- IEEE 802.3az Energy Efficient Ethernet (EEE)
• Power Management
• MAC with External Ethernet PHY (LAN7431)
- PCI-PM and ASPM L0s and L1
- L1.1 and L1.2 PCIe sub-states support
- D3 hot / cold with VAUX detection for PME
wakeup
- Wake on LAN support (WoL, AOAC)
- IEEE 802.3az Energy Efficient Ethernet (EEE)
with 100BASE-TX/1000BASE-T Low Power Idle
and 10BASE-Te TX Amplitude Reduction
(LAN7430)
- RGMII supporting Internal Delay, Non-Internal
Delay and Hybrid modes
- MII supporting Fast Ethernet PHY
- Flexibility to operate at 1.8V, 2.5V, or 3.3V
- 9220 Byte Maximum Frame Size
• Gigabit Ethernet MAC includes
- 10/100/1000Mbps half/full-duplex operation
(only full-duplex operation at 1000Mbps)
- Flow control with pause frame for full-duplex
mode
Target Applications
• Automotive Infotainment / Telematics
• PCIe to Gigabit Ethernet Adapter / Bridge
• PCIe to Gigabit Ethernet on Embedded System
• Gigabit Backplane
- 100/1000Mbps Low Power Idle for EEE
- MDC/MDIO management for external PHY
- RX frame, link status, EEE wakeup for WoL
• DMA Controller
- Scatter-gather based for efficient data transfer
to/from multiple on-chip RAM locations
- Multi-channel for RX prioritization
• LTE Modem
• Networked Cameras
• FIFO Controller
• Industrial PC (IPC)
- Utilize internal SRAMs to buffer RX and TX traf-
fic between PCIe and Ethernet
- TX LSO and TX Checksum Offload
• Test Instrumentation / Industrial
System Considerations
• Power and I/Os
• Receive Ethernet Packet Filtering
- IP, TCP/UDP, L3, ICMP/IGMP Checksum off-
load
- IEEE 802.1Q VLAN
- Unicast, Multicast, Broadcast
- Perfect / Hash Address
- Priority based channel selection
- Receive Side Scaling (RSS)
- Single 3.3V supply operation with on-chip
Switching and LDO Regulators for core and I/
Os
- GPIOs: 4 (LAN7430), 12 (LAN7431)
- Variable voltage I/O supply (1.8V, 2.5V, or 3.3V)
• Software Support
• PME Support
- Windows 7, 8, 8.1, 10, and OneCore drivers
- Linux driver
- PCIe WAKE# and Beaconing
- PCIe PME Messaging
- GPIO, Link Change, Ethernet Frame for wakeup
• EEPROM / OTP
- Android driver
- Windows command line OTP / EEPROM
programming and testing utility
• Packaging
- External EEPROM support for MAC address
and PCIe configuration
- Integrated OTP memory for EEPROM displace-
ment
- LAN7430: 48-pin SQFN (7 x 7 mm)
- LAN7431: 72-pin SQFN (10 x 10 mm)
• Environmental
• 1149.1 (JTAG) boundary scan
- Commercial temp. range (0°C to +70°C)
- Industrial temp. range (-40°C to +85°C)
- AEC-Q100 Grade 2 Automotive Qualified temp.
range (-40°C to +105°C)
2018-2019 Microchip Technology Inc.
DS00002631D-page 1
LAN7430/LAN7431
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of
your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our pub-
lications will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications
Department via E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner
of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of
document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may
exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The
errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature
number) you are using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS00002631D-page 2
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
Table of Contents
1.0 Preface ............................................................................................................................................................................................ 4
2.0 Introduction ..................................................................................................................................................................................... 8
3.0 Pin Descriptions and Configuration ............................................................................................................................................... 12
4.0 Power Connectivity ....................................................................................................................................................................... 26
5.0 Device Configuration ..................................................................................................................................................................... 30
6.0 Functional Descriptions ................................................................................................................................................................. 31
7.0 Operational Characteristics ........................................................................................................................................................... 48
8.0 Package Information ..................................................................................................................................................................... 69
Appendix A: Data Sheet Revision History ........................................................................................................................................... 73
Product Identification System ............................................................................................................................................................. 74
The Microchip Web Site ...................................................................................................................................................................... 75
Customer Change Notification Service ............................................................................................................................................... 75
Customer Support ............................................................................................................................................................................... 75
2018-2019 Microchip Technology Inc.
DS00002631D-page 3
LAN7430/LAN7431
1.0
1.1
PREFACE
General Terms
TABLE 1-1:
GENERAL TERMS
Term
Description
1000BASE-T
1 Gbps Ethernet over twisted pair, IEEE 802.3 compliant
100 Mbps Ethernet over twisted pair, IEEE 802.3 compliant
10 Mbps Ethernet over twisted pair, IEEE 802.3 compliant
Analog-to-Digital Converter
100BASE-TX
10BASE-T
ADC
AFE
Analog Front End
AN, ANEG
Auto-Negotiation
AOAC
Always on Always Connected
Address Resolution Protocol
Best Effort Latency Tolerance
8-bits
ARP
BELT
BYTE
CSMA/CD
Carrier Sense Multiple Access/Collision Detect
Control and Status Register
CSR
DA
Destination Address
DWORD
32-bits
EC
Embedded Controller
EEE
Energy Efficient Ethernet
FCS
Frame Check Sequence
FIFO
First In First Out buffer
FSM
Finite State Machine
FW
Firmware
GMII
Gigabit Media Independent Interface
General Purpose I/O
GPIO
HOST
External system (Includes processor, application software, etc.)
Hardware. Refers to function implemented by digital logic.
Internet Group Management Protocol
Linear Drop-Out Regulator
HW
IGMP
LDO
Level-Triggered Sticky Bit
This type of status bit is set whenever the condition that it represents is asserted. The
bit remains set until the condition is no longer true, and the status bit is cleared by
writing a zero.
LFSR
LPM
lsb
Linear Feedback Shift Register
Link Power Management
Least Significant Bit
LSB
LTM
MAC
MDI
Least Significant Byte
Latency Tolerance Messaging
Media Access Controller
Medium Dependent Interface
Media Independent Interface with Crossover
Multiple Ethernet Frames
MDIX
MEF
MII
Media Independent Interface
MLT-3
Multi-Level Transmission Encoding (3-Levels). A tri-level encoding method where a
change in the logic level represents a code bit “1” and the logic output remaining at
the same level represents a code bit “0”.
DS00002631D-page 4
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 1-1:
GENERAL TERMS (CONTINUED)
Term
Description
MSI / MSI-X
N/A
Message Signaled Interrupt
Not Applicable
OTP
One Time Programmable
Physical Coding Sublayer
Phase Locked Loop
Power Management IC
Power on Reset.
PCS
PLL
PMIC
POR
PTP
Precision Time Protocol
64-bits
QWORD
RESERVED
Refers to a reserved bit field or address. Unless otherwise noted, reserved bits must
always be zero for write operations. Unless otherwise noted, values are not guaran-
teed when reading reserved bits. Unless otherwise noted, do not read or write to
reserved addresses.
RGMII
RMII
RMON
SA
Reduced Gigabit Media Independent Interface
Reduced Media Independent Interface
Remote Monitoring
Source Address
SCSR
SEF
System Control and Status Registers
Single Ethernet Frame
SFD
Start of Frame Delimiter - The 8-bit value indicating the end of the preamble of an
Ethernet frame
SMNP
TMII
Simple Network Management Protocol
Turbo Media Independent Interface
UDP
User Datagram Protocol - A connectionless protocol run on top of IP networks
16-bits
WORD
2018-2019 Microchip Technology Inc.
DS00002631D-page 5
LAN7430/LAN7431
1.2
Buffer Types
TABLE 1-2:
Buffer
BUFFER TYPE DESCRIPTIONS
Description
AI
AO
Analog input
Analog output
AIO
Analog bi-directional
ICLK
OCLK
RGMII_I
RGMII_O
IS
Crystal oscillator input pin
Crystal oscillator output pin
RGMII compliant input
RGMII compliant output
Input with Schmitt trigger
Open-drain output with 4 mA sink
OD4
VIS
Variable voltage input with Schmitt trigger
VO8
Variable voltage output with 8 mA sink and 8 mA source
Variable voltage open-drain output with 8 mA sink
Variable voltage output with 12 mA sink and 12 mA source
Variable voltage open-drain output with 12 mA sink
Variable voltage open-source output with 12 mA source
VOD8
VO12
VOD12
VOS12
PU
Internal pull-up with 47μA (typical @ 3.3V). Unless otherwise noted in the pin description,
internal pull-ups are always enabled.
Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal
resistors to drive signals external to the device. When connected to a load that must be
pulled high, an external resistor must be added.
PD
P
Internal pull-down with 47μA (typical @ 3.3V). Unless otherwise noted in the pin
description, internal pull-downs are always enabled.
Internal pull-down resistors prevent unconnected inputs from floating. Do not rely on
internal resistors to drive signals external to the device. When connected to a load that
must be pulled low, an external resistor must be added.
Power pin
DS00002631D-page 6
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
1.3
Register Bit Types
Table 1-3 describes the register but attributes used throughout this document.
TABLE 1-3: REGISTER BIT TYPES
Register Bit Type Notation
Register Bit Description
R
W
Read: A register or bit with this attribute can be read.
Write: A register or bit with this attribute can be written.
Read only: Read only. Writes have no effect.
RO
WO
W1S
W1C
WAC
RC
Write only: If a register or bit is write-only, reads will return unspecified data.
Write One to Set: Writing a one sets the value. Writing a zero has no effect.
Write One to Clear: Writing a one clears the value. Writing a zero has no effect.
Write Anything to Clear: Writing anything clears the value.
Read to Clear: Contents is cleared after the read. Writes have no effect.
Latch Low: Clear on read of register.
LL
LH
Latch High: Clear on read of register.
SC
Self-Clearing: Contents is self-cleared after being set. Writes of zero have no effect.
Contents can be read.
RO/LH
Read Only, Latch High: This mode is used by the Ethernet PHY registers. Bits with
this attribute will stay high until the bit is read. After it a read, the bit will remain high, but
will change to low if the condition that caused the bit to go high is removed. If the bit has
not been read the bit will remain high regardless of if its cause has been removed.
NALR
NASR
Not Affected by Lite Reset. The state of NALR bits does not change on assertion of a
lite reset.
Not Affected by Software Reset. The state of NASR bits does not change on asser-
tion of a software reset.
STKY
This field is “Sticky” in that it is neither initialized nor modified by hot reset or Function
Level Reset.
RESERVED
Reserved Field: Reserved fields must be written with zeros, unless otherwise indi-
cated, to ensure future compatibility. The value of reserved bits is not guaranteed on a
read.
1.4
Reference Documents
1. IEEE 802.3TM-2015 IEEE Standard for Ethernet, http://standards.ieee.org/about/get/802/802.3.html
2. IEEE 802.1DTM-2004 IEEE Standard for Local and Metropolitan Area Networks - Media Access Control (MAC)
Bridges, http://standards.ieee.org/about/get/802/802.1.html
3. IEEE 802.1QTM-2014 IEEE Standard for Local and Metropolitan Area Networks - Bridges and Bridged Networks,
http://standards.ieee.org/about/get/802/802.1.html
4. IEEE 1149.1-2013 IEEE Standard for Test Access Port and Boundary-Scan Architecture,
https://standards.ieee.org/findstds/standard/1149.1-2013.html
5. IEEE 1588-2008 IEEE Standard for Precision Clock Synchronization Protocol for Networked Measurement and
Control Systems, https://standards.ieee.org/findstds/standard/1588-2008.html
6. Reduced Gigabit Media Independent Interface (RGMII) Specification Version 2.0,
https://web.archive.org/web/20160303171328/http://www.hp.com/rnd/pdfs/RGMIIv2_0_final_hp.pdf
7. PCI Express® Base Specification Revision 3.1a, https://pcisig.com/specifications
8. PCI Bus Power Management Interface Specification Revision 1.2, https://pcisig.com/specifications
2018-2019 Microchip Technology Inc.
DS00002631D-page 7
LAN7430/LAN7431
2.0
INTRODUCTION
2.1
General Description
The LAN7430/LAN7431 is a highly integrated PCIe to Gigabit Ethernet Controller, with IEEE Std 1588TM-2008 and
advanced power management features, that provides a high performance and cost effective PCIe/Ethernet bridging
solution for automotive and industrial applications.
The PCIe 3.1 PHY supports 1 Lane at 2.5GT/s for chip-to-chip and card-to-card connectivity across a combination of
printed circuit boards, connectors, backplane wirings, and cables.
The LAN7430 has an integrated 10/100/1000 Ethernet PHY port with IEEE 802.3az Energy Efficient Ethernet (EEE)
and 10BASE-Te support, while the LAN7431 supports either a RGMII (v1.3 and v2.0) or a MII MAC port for direct con-
nectivity to transceivers, such as 100BASE-T1 or HDBaseT.
The LAN7430/LAN7431 further integrates PCIe Endpoint Controller, DMA Controller, Receive Filtering Engine, FIFO
Controller, Ethernet MAC, EEPROM Controller, OTP Memory, TAP Controller, PME, and Clock/Reset/Power Manage-
ment functions.
The IEEE1588-2008 PTP functions provide hardware support for the IEEE Std 1588-2008 (v2) Precision Time Protocol
(PTP), allowing clock synchronization with remote Ethernet devices, packet time stamping, and time driven event gen-
eration. The device may function as a master or a slave clock per the IEEE Std 1588-2008 specification. End-to-end
and peer-to-peer link delay mechanisms are supported as are one-step and two-step operations.
Power Management functions include:
• Enabling the host to place the device in a reduced power state, by selectively disabling internal clocks, placing it
into EEE Low Power Idle mode, and powering down the Ethernet PHY (LAN7430 only).
• Providing for detection of various wakeup events.
• Providing a host-readable READY flag which is set when the device is fully operational.
• Controlling the loading of OTP or EEPROM values after a system reset.
• Supporting D0 and D3hot and D3cold states
• Supporting L0s, L1 states and L1.1 and L1.2 Sub-states
Single 3.3V supply operation is achieved by enabling the on-chip Switching and LDO Regulators to supply the core and
I/O voltages.
An internal EEPROM controller exists to load PCIe and MAC Address configuration parameters. For EEPROM-less
applications, the LAN7430/LAN7431 provides 1K Bytes of OTP memory that can be used to preload this same config-
uration data before enumeration.
The integrated IEEE 1149.1 compliant TAP controller provides boundary scan via JTAG.
Device specific features that do not pertain to the entire LAN7430/LAN7431 family are called out independently through-
out this document. Table 2-1 provides a summary of the feature differences between family members:
TABLE 2-1:
LAN7430/LAN7431 FAMILY FEATURE MATRIX
LAN7430
LAN7431
48-SQFN
72-SQFN
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DS00002631D-page 8
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
An internal block diagram of the LAN7430/LAN7431 is shown in Figure 2-1.
FIGURE 2-1:
LAN7430/LAN7431 BLOCK DIAGRAM
MII / RGMII + 0',2
25 MHz
(LAN7431)
LAN7430//$1ꢀꢁꢂ1
Ethernet MAC with IEEE1588ꢃ2008
Integrated
Clock Tree
PCIe v3.1
2.5 GT / s PHY
++L1SS
DMA & FIFO
Controller
Tx Ch0
Rx Filtering Engine
Checksum Offload
VLAN
PCIe
Endpoint
Controller
RxCh 0...3
Priority | RSS
1v2 Switching
Regulator
NS / ARP
AOAC
Tx Offload
Engine
Ethernet PHY
++802.3az (EEE)
ꢀꢀꢀꢀꢀꢁ/$1ꢂꢃꢄꢅꢆꢀ
2v5 LDO
Regulator
OTP
Memory
GPIO
1588
JTAG
TAP
EEPROM
Loader
VDDVARIO
Single 3v3 Supply
The following system-level block diagrams detail the LAN7430/LAN7431 in typical applications.
2018-2019 Microchip Technology Inc.
DS00002631D-page 9
LAN7430/LAN7431
Figure 2-2 details the LAN7430’s integrated Ethernet PHY port connected across a backplane to an application proces-
sor.
FIGURE 2-2:
LAN7430 CONNECTED ACROSS BACKPLANE TO APPLICATION PROCESSOR
Plug-in Board
Application Processor
GbE
PHY
Backplane Connector
GbE
PHY
LAN7430
PCIe PHY
PCIe
Host
Processor
Main System Board
DS00002631D-page 10
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
Figure 2-3 details the LAN7431’s RGMII MAC port connected to the RGMII MAC of an application processor.
FIGURE 2-3:
LAN7431 CONNECTED VIA RGMII TO APPLICATION PROCESSOR
Application Processor
RGMII MAC
RGMII MAC
LAN7431
PCIe PHY
PCIe
Host
Processor
System Board
2018-2019 Microchip Technology Inc.
DS00002631D-page 11
LAN7430/LAN7431
3.0
PIN DESCRIPTIONS AND CONFIGURATION
The pin assignments for the LAN7430 are detailed in Section 3.1, "LAN7430 Pin Assignments". The pin assignments
for the LAN7431 are detailed in Section 3.2, "LAN7431 Pin Assignments". Pin descriptions are provided in Section 3.3,
"Pin Descriptions".
3.1
LAN7430 Pin Assignments
The device pin diagram for the LAN7430 can be seen in Figure 3-1. Table 3-1 provides a LAN7430 pin assignments
table. Pin descriptions are provided in Section 3.3, "Pin Descriptions".
FIGURE 3-1:
LAN7430 PIN ASSIGNMENTS
1
36
35
34
33
32
31
30
29
28
27
26
25
AVDDH_1
EECLK/GPIO2/LED2/TMS/ADV_PM_DISABLE
VAUX_DET/GPIO3/LED3/TCK
VDD12_SW_FB
2
TXRXP_A
3
TXRXM_A
4
AVDDL_1
VDD_SW_IN
5
TXRXP_B
VDD12_SW_OUT
VDD12CORE
6
TXRXM_B
LAN7430
48-SQFN
7
8
TXRXP_C
TXRXM_C
AVDDL_2
TXRXP_D
TXRXM_D
AVDDH_2
TEST
RESET_N
9
VDD_REG_IN
10
11
12
VDD25_REG_OUT
PCIE_CLK_M
VSS
(Connectexposed pad to ground with a via field
)
PCIE_CLK_P
Note: Exposed pad (VSS) on bottom of package must be connected to ground with a via field
.
Note:
Configuration straps are identified by an underlined symbol name. Signals that function as configuration
straps must be augmented with an external resistor when connected to a load.
DS00002631D-page 12
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-1:
Pin
LAN7430 PIN ASSIGNMENTS
Pin Name
Pin
Pin Name
1
2
AVDDH_1
TXRXP_A
TXRXM_A
AVDDL_1
TXRXP_B
TXRXM_B
TXRXP_C
TXRXM_C
AVDDL_2
TXRXP_D
TXRXM_D
AVDDH_2
25
26
27
28
29
30
31
32
33
34
35
36
PCIE_CLK_P
PCIE_CLK_M
3
VDD25_REG_OUT
VDD_REG_IN
4
5
RESET_N
6
TEST
7
VDD12CORE
8
VDD12_SW_OUT
VDD_SW_IN
9
10
11
12
VDD12_SW_FB
VAUX_DET/GPIO3/LED3/TCK
EECLK/GPIO2/LED2/TMS/
ADV_PM_DISABLE
13
14
15
16
17
18
19
20
21
22
23
24
VDD12CORE
VP
37
38
39
40
41
42
43
44
45
46
47
48
EEDIO/GPIO1/LED1/TDO
EECS/GPIO0/LED0/TDI
VDDVARIO
VDD12CORE
VDD_OTP
CLKREQ#
WAKE#
GD_1
PCIE_RX_P
PCIE_RX_M
GD_2
PCIE_TX_P
VPTX
PERST#
PCIE_TX_M
GD_3
AVDD12
XO
VPH
XI
RESREF
ISET
Exposed Pad (VSS) must be connected to ground.
2018-2019 Microchip Technology Inc.
DS00002631D-page 13
LAN7430/LAN7431
3.2
LAN7431 Pin Assignments
The device pin diagram for the LAN7431 can be seen in Figure 3-2. Table 3-2 provides a LAN7431 pin assignments
table. Pin descriptions are provided in Section 3.3, "Pin Descriptions".
FIGURE 3-2:
LAN7431 PIN ASSIGNMENTS
AVDDH_1
1
2
54 GPIO6/TDO
53
VDD12_SW_FB
AVDDL_1
VDDVARIO_B
TXD3
3
52
VDD_SW_IN
4
51
VDD12_SW_OUT
5
50
TXD2
GPIO7/TMS
6
49
TXD1
GPIO8/TDI
7
48
VDDVARIO_B
TXD0
VDDVARIO
8
47 GPIO9/TCK
46 VDD12CORE
9
TX_ER/MII_EN
TX_CTL/TX_EN
TXC/TX_CLK
VDDVARIO_B
RXC/RX_CLK
RX_CTL/RX_DV
RXD0
LAN7431
72-SQFN
10
11
12
13
14
15
16
17
18
45
TEST
44
RESET_N
43
VDDVARIO
42
PHY_RESET_N
VSS
41
PHY_INT_N
(Connect exposed pad to ground with a via field )
40
DUPLEX
39 VDD_REG_IN
RXD1
38
RXD2
VDD25_REG_OUT
37
RXD3
PCIE_CLK_M
NOTE: Exposed pad (VSS) on bottomofpackage mustbe connected to ground
Note:
Configuration straps are identified by an underlined symbol name. Signals that function as configuration
straps must be augmented with an external resistor when connected to a load.
DS00002631D-page 14
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-2:
Pin
LAN7431 PIN ASSIGNMENTS
Pin Name
Pin
Pin Name
1
AVDDH_1
AVDDL_1
VDDVARIO_B
TXD3
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
PCIE_CLK_M
VDD25_REG_OUT
VDD_REG_IN
DUPLEX
2
3
4
5
TXD2
PHY_INT_N
PHY_RESET_N
VDDVARIO
RESET_N
6
TXD1
7
VDDVARIO_B
TXD0
8
9
TX_ER/MII_EN
TX_CTL/TX_EN
TXC/TX_CLK
VDDVADIO_B
RXC/RX_CLK
RX_CTL/RX_DV
RXD0
TEST
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
VDD12CORE
GPIO9/TCK
VDDVARIO
GPIO8/TDI
GPIO7/TMS
VDD12_SW_OUT
VDD_SW_IN
VDD12_SW_FB
GPIO6/TDO
GPIO5
RXD1
RXD2
RXD3
VDDVARIO_B
CLK125/RX_ER
REFCLK_25/GPIO11
COL/GPIO10
CRS
GPIO4
VAUX_DET/GPIO3
EECLK/GPIO2/ADV_PM_DISABLE
EEDIO/GPIO1
EECS/GPIO0
VDDVARIO
VDD12CORE
MDIO
VDD12CORE
VP
GD_1
PCIE_RX_P
PCIE_RX_M
GD_2
MDC
VDD_OTP
PCIE_TX_P
VPTX
CLKREQ#
WAKE#
PCIE_TX_M
GD_3
PERST#
AVDD12
VPH
XO
RESREF
XI
PCIE_CLK_P
ISET
Exposed Pad (VSS) must be connected to ground.
2018-2019 Microchip Technology Inc.
DS00002631D-page 15
LAN7430/LAN7431
3.3
Pin Descriptions
This section provides descriptions of each individual pin function. Buffer type definitions are detailed in Table 1-2.
TABLE 3-3:
Name
PIN DESCRIPTIONS
Symbol
Buffer
Type
Description
Gigabit Ethernet PHY Interface (LAN7430 only)
Ethernet TX/RX
Positive
TXRXP_A
AIO
Media Dependent Interface[0], positive signal of differen-
tial pair
Channel A
1000BT mode: TXRXP_A corresponds to BI_DA+ for
MDI configuration and BI_DB+ for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXP_A is the positive transmit
signal (TX+) for MDI configuration and the positive
receive signal (RX+) for MDI-X configuration, respec-
tively.
Ethernet TX/RX
Negative
TXRXM_A
TXRXP_B
TXRXM_B
TXRXP_C
AIO
AIO
AIO
AIO
Media Dependent Interface[0], negative signal of differen-
tial pair
Channel A
1000BT mode: TXRXM_A corresponds to BI_DA- for
MDI configuration and BI_DB- for MDI-X configuration,
respectively.
10BT/100BT-TX mode: TXRXM_A is the negative trans-
mit signal (TX-) for MDI configuration and the negative
receive signal (RX-) for MDI-X configuration, respectively.
Ethernet TX/RX
Positive
Media Dependent Interface[1], positive signal of differen-
tial pair
Channel B
1000BT mode: TXRXP_B corresponds to BI_DB+ for
MDI configuration and BI_DA+ for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXP_B is the positive receive sig-
nal (RX+) for MDI configuration and the positive transmit
signal (TX+) for MDI-X configuration, respectively.
Ethernet TX/RX
Negative
Media Dependent Interface[1], negative signal of differen-
tial pair
Channel B
1000BT mode: TXRXM_B corresponds to BI_DB- for
MDI configuration and BI_DA- for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXP_B is the negative receive
signal (RX-) for MDI configuration and the negative trans-
mit signal (TX-) for MDI-X configuration, respectively.
Ethernet TX/RX
Positive
Media Dependent Interface[2], positive signal of differen-
tial pair
Channel C
1000BT mode: TXRXP_C corresponds to BI_DC+ for
MDI configuration and BI_DD+ for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXP_C is not used.
DS00002631D-page 16
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Type
Description
Ethernet TX/RX
Negative
TXRXM_C
TXRXP_D
TXRXM_D
AIO
AIO
AIO
Media Dependent Interface[2], negative signal of differen-
tial pair
Channel C
1000BT mode: TXRXM_C corresponds to BI_DC- for
MDI configuration and BI_DD- for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXM_C is not used.
Ethernet TX/RX
Positive
Media Dependent Interface[3], positive signal of differen-
tial pair
Channel D
1000BT mode: TXRXP_D corresponds to BI_DD+ for
MDI configuration and BI_DC+ for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXP_D is not used.
Ethernet TX/RX
Negative
Media Dependent Interface[3], negative signal of differen-
tial pair
Channel D
1000BT mode: TXRXM_D corresponds to BI_DD- for
MDI configuration and BI_DC- for MDI-X configuration,
respectively.
10BT/100BT mode: TXRXM_D is not used.
External Gigabit Ethernet PHY RGMII (LAN7431 only)
Transmit Data
TXD3 RGMII_O The MAC transmits data to the external Ethernet PHY
TXD2
TXD1
TXD0
using these signals.
Transmit Control
TX_CTL
RGMII_O Indicates both the transmit data enable (TXEN) and
transmit error (TXER) functions per the RGMII specifica-
tion.
RGMII Transmit
Clock
TXC
RGMII_O Used to latch data from the MAC into the external Ether-
net PHY in RGMII mode.
1000BASE-T: 125MHz
100BASE-TX: 25MHz
10BASE-T: 2.5MHz
Receive Data
RXD3
RXD2
RXD1
RXD0
RGMII_I The external Ethernet PHY transfers data to the MAC
using these signals.
Receive Control
RX_CTL
RGMII_I Indicates both the receive data valid (RXDV) and receive
error (RXER) functions per the RGMII specification.
RGMII Receive
Clock
RXC
RGMII_I Used to transfer data from the external Ethernet PHY to
the MAC in RGMII mode.
1000BASE-T: 125MHz
100BASE-TX: 25MHz
10BASE-T: 2.5MHz
25 MHz Refer-
ence Clock
REFCLK_25
VO12
25 MHz reference clock to be provided to and used as a
reference by the external Gigabit Ethernet PHY.
2018-2019 Microchip Technology Inc.
DS00002631D-page 17
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
CLK125 MHz
CLK125
VIS
Used as an input from external Ethernet PHY. This signal
may be used by the controller to generate the RGMII TX
clock.
PHY Interrupt
PHY Reset
PHY_INT_N
PHY_RESET_N
DUPLEX
VIS
VO12
VIS
Interrupt from external Ethernet PHY.
Reset to external Ethernet PHY.
Duplex Mode
Duplex Mode. This signal connects to the Duplex Mode
output from external Ethernet PHY.
When set the external Ethernet PHY is in Full Duplex
mode.
Note:
If the Ethernet PHY does not have a duplex
output signal, then it is recommended that this
signal should be tied to VDDVARIO to force full
duplex operation
Management
Interface Data
MDIO
VIS/
VO8
(PU)
This is the management data to/from an external Ether-
net PHY.
Note:
An external pull-up is required when the MII
management interface is used, to ensure that
the IDLE state of the MDIO signal is a logic
one.
Note:
An external pull-up is recommended when the
MII management interface is not used, to avoid
a floating signal.
Management
Interface Clock
MDC
VO8
This is the management clock output to an external
Ethernet PHY
External Fast Ethernet PHY MII (LAN7431 only)
Transmit Data
TXD3
VO12
The MAC transmits data to the external Ethernet PHY
TXD2
TXD1
TXD0
using these signals.
Transmit Enable
Transmit Error
Transmit Clock
TX_EN
TX_ER
TX_CLK
VO12
VO12
VIS
Indicates the presence of valid data on TXD[3:0]
Indicates a transmit error condition.
Used to transfer data from the MAC to the external Ether-
net PHY in MII mode.
100BASE-TX: 25MHz
10BASE-T: 2.5MHz
Collision Detect
COL
CRS
VIS
Asserted by external Ethernet PHY to indicate detection
of a collision condition.
Note:
Indicates detection of carrier by external Ethernet PHY.
Note: Used in half-duplex mode only.
Used in half-duplex mode only.
Carrier Sense
Receive Data
VIS
VIS
RXD3
RXD2
RXD1
RXD0
The external Ethernet PHY transfers data to the MAC
using these signals.
Receive Data
Valid
RX_DV
VIS
Indicates that recovered and decoded data is being pre-
sented on the receive data pins.
DS00002631D-page 18
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Type
Description
Receive Error
RX_ER
VIS
Asserted to indicate an error has been detected in the
frame presently being transferred from the external
Ethernet PHY.
Receive Clock
RX_CLK
VIS
Used to transfer data from the external Ethernet PHY to
the MAC in MII mode.
100BASE-TX: 25MHz
10BASE-T: 2.5MHz
25 MHz Refer-
ence Clock
REFCLK_25
VO12
25 MHz reference clock to be provided to and used as a
reference by the external Fast Ethernet PHY.
PHY Interrupt
PHY Reset
PHY_INT_N
PHY_RESET_N
DUPLEX
VIS
VO12
VIS
Interrupt from external Ethernet PHY.
Reset to external Ethernet PHY.
Duplex Mode
Duplex Mode. This signal connects to the Duplex Mode
output from external Ethernet PHY.
When set the external Ethernet PHY is in Full Duplex
mode.
Note:
If the external Ethernet PHY does not have a
duplex output signal, then it is recommended
that this signal should be tied to VDDVARIO to
force full duplex operation
Management
Interface Data
MDIO
VIS/
VO8
(PU)
This is the management data to/from an external Ether-
net PHY.
Note:
An external pull-up is required when the MII
management interface is used, to ensure that
the IDLE state of the MDIO signal is a logic
one.
Note:
An external pull-up is recommended when the
MII management interface is not used, to avoid
a floating signal.
APPLICATION NOTE: A pull-up (internal or external)
will result in a return value of
FFFFh when a non-existent or
non-addressed PHY is read. If a
value of 0000h is desired
instead, a pull-down may be
used.
Management
Interface Clock
MDC
VO8
AO
This is the management clock output to an external
Ethernet PHY
PCIe
TX Positive
PCIE_TX_P
PCIe Serial Data Output positive.
Serial differential output link in the PCIe interface running
at 2.5 GT/s.
A series capacitor in the range of 100nF to 200nF is
required.
2018-2019 Microchip Technology Inc.
DS00002631D-page 19
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
TX Negative
PCIE_TX_M
AO
PCIe Serial Data Output negative.
Serial differential output link in the PCIe interface running
at 2.5 GT/s.
A series capacitor in the range of 100nF to 200nF is
required.
RX Positive
RX Negative
PCIE_RX_P
PCIE_RX_M
AI
AI
PCIe Serial Data Input positive.
Serial differential input link in the PCIe interface running
at 2.5 GT/s.
PCIe Serial Data Input negative.
Serial differential input link in the PCIe interface running
at 2.5 GT/s.
External Refer-
ence Clock
Positive
PCIE_CLK_P
PCIE_CLK_M
AI
AI
AI
PCIe Differential Reference Clock In positive
This pin receives a 100 MHz differential clock input.
PCIe Differential Reference Clock In negative
External Refer-
ence Clock
Negative
This pin receives a 100 MHz differential clock input.
External Refer-
ence Resistor
RESREF
WAKE#
This pin should be connect to ground through a 200 ohm
1% 100 ppm / C resistor.
Wake up
IS / OD4 Wake
This signal is driven low when the device detects a
wakeup.
In OBFF mode, OBFF events are signaled using the
WAKE# pin as an input.
Note:
When the device is powered down, this pin is
isolated from the PCIe bus and does not
present any significant loading or provide any
drive.
PCIe Reset
PERST#
IS
Power and Clock Good Indication
The PERST# signal indicates that both PCIe power and
clock are available.
Note:
When the device is powered down, this pin is
isolated from the PCIe bus and does not
present any significant loading or provide any
drive.
Clock Request
CLKREQ#
IS / OD4 Clock Request
The CLKREQ# signal is used to power manage the Link
clock. It is also used for L1 power management Sub state
control.
Note:
When the device is powered down, this pin is
isolated from the PCIe bus and does not
present any significant loading or provide any
drive.
DS00002631D-page 20
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Type
Description
Auxiliary Voltage
Detect
VAUX_DET
VIS
(PD)
Auxiliary Voltage Detection
The VAUX_DET is used to indicate when PME from
D3cold is supported.
When tied to VSS, PME from D3cold is not supported.
The weak pull-down will create a logic low when plugged
into a system board that does not support the delivery of
the auxiliary voltage (the auxiliary voltage connection is
floating).
When the device is powered exclusively from auxiliary
voltage, this pin is tied to the auxiliary voltage (3.3V) to
indicate PME from D3cold is supported.
When the device is powered from a multiplexed main
voltage / auxiliary voltage, this pin is tied to the auxiliary
voltage (3.3V) to indicate PME from D3cold is supported
and to monitor the presence of the auxiliary voltage.
Note:
If alternate usage of this pin (GPIO3, LED3 or
TCK) is enabled, the pull-down is disabled and
the input value of the pin is overridden to a low
value.
Since this pin is shared with GPIO3, LED3 and TCK, a
series resistor is recommended to prevent an accidental
conflict with the auxiliary voltage. This resistor must be
low enough in value to override the on chip pull-down.
Crystal / Oscillator / External Reference Clock
Crystal / Oscilla-
tor / External Ref-
erence Clock
Input
XI
ICLK
When using a 25MHz crystal, this input is connected to
one lead of the crystal.
When using a 3.3V oscillator or external reference clock,
this is the input from the clock source.
The crystal, oscillator, or external reference clock should
have a tolerance of ±50ppm.
Crystal Output
XO
OCLK
When using a 25MHz crystal, this output is connected to
one lead of the crystal.
When using an oscillator or external clock source, this pin
is not connected.
EEPROM
EEPROM Chip
Select
EECS
VO12
(PD)
This pin drives the chip select input of the external
EEPROM.
Note:
The internal pull-down holds a low on the
output pin during reset.
2018-2019 Microchip Technology Inc.
DS00002631D-page 21
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
EEPROM Data In
/ Out
EEDIO
VIS / VO12 This bidirectional pin is used for the EEPROM data. This
(PD)
pin directly drives the data input of the external EEPROM.
The data output of the external EEPROM drives this pin
through an external resistor.
Note:
The internal pull-down holds a low on the pin
during reset and provides a low on the input if
an EEPROM is not connected.
Note:
An external resistor, on the EEPROM’s data
output, must be used to prevent contention
during data read operations.
EEPROM Clock
EECLK
VO12
(PD)
This pin drives the clock input of the external EEPROM.
Note:
The internal pull-down holds a low on the
output pin during reset.
Miscellaneous
General
Purpose I/O x
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
VIS/
VO8/
VOD8
(PU)
Each of these general purpose I/O pins is fully program-
mable as either a push-pull output, an open-drain output,
or a Schmitt-triggered input with pull-up.
Note:
Note:
Note:
The pull-up is only enabled if the pin is set as
a GPIO.
GPIO0 through GPIO3 are available for the
LAN7430 and LAN7431.
GPIO4 through GPIO11 are available only for
the LAN7431.
Test Pin
TEST
VIS
(PD)
This pin is used to enable test modes and must be con-
nected to ground for proper functional operation.
System Reset
RESET_N
VIS
System reset. This pin is active low.
Note:
If this signal is unused it must be pulled up to
VDDVARIO.
Indicator LEDs
LED0
LED1
LED2
LED3
VOD12
VOS12
(LAN7430 only)
LED signal sourced from Gigabit Ethernet PHY.
Note:
When enabled as LED outputs, the pins are
either open-Drain or open-Source drivers.
External PHYBias
Resistor
ISET
AI
This pin should be connect to ground through a 6.04K 1%
resistor.
JTAG
JTAG Test Mux
Select
TMS
TCK
VIS
VIS
JTAG test mode select.
JTAG Test Clock
JTAG test clock.
Note:
The maximum operating frequency of this clock
is half of the system clock.
JTAG Test Data
Input
TDI
VIS
JTAG data input
JTAG Test Data
Output
TDO
VO12
JTAG data output.
DS00002631D-page 22
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Type
Description
Configuration Straps
VIS (LAN7431 only)
(PD)
MII Enable
Configuration
Strap
MII_EN
When pulled high, the port operates in MII mode. When
pulled low or floated, the port operates in RGMII mode.
See Section 3.4, "Configuration Straps" for additional
information.
Note:
The internal pull-down is disabled once the
strap is latched.
Note:
If an external pull-up is used, it should be
connected to VDDVARIO_B.
Advance Power
Management Dis-
able
ADV_PM_DISABLE
VIS
(PD)
When pulled high, the following bits default low. When
pulled low or floated, the register bits default high.
Configuration
Strap
• Clock Power Management in Link Capabilities
• L1 PM Substates Supported in L1 PM Substates
Capabilities
• ASPM L1.1 Supported in L1 PM Substates Capabili-
ties
• ASPM L1.2 Supported in L1 PM Substates Capabili-
ties
• PCI-PM L1.1 Supported in L1 PM Substates Capa-
bilities
• PCI-PM L1.2 Supported in L1 PM Substates Capa-
bilities
Note:
Regardless of the strap default, the bits may be
loaded from OTP or EEPROM. The default is
used in the absence of a programmed OTP or
EEPROM.
Note:
Note:
The internal pull-down is disabled once the
strap is latched.
If an external pull-up is used, it should be
connected to VDDVARIO.
Power / Ground
Ethernet PHY
+1.2V Analog
Power Supply
AVDD12
P
1.2V power for PLL/DLL
Ethernet PHY
+2.5V / 3.3V Ana-
log Power Supply
AVDDH_1
P
2.5V or 3.3V power for analog IO
LAN7430 only
This pin provides power for Gigabit PHY transmitter,
bandgap reference, and crystal oscillator amplifier.
LAN7431 only
This pin provides power for bandgap reference and crys-
tal oscillator amplifier.
Ethernet PHY
+2.5V / 3.3V Ana-
log Power Supply
AVDDH_2
P
2.5V or 3.3V power for analog IO
(LAN7430 only)
This pin provides power for Gigabit PHY transmitter.
2018-2019 Microchip Technology Inc.
DS00002631D-page 23
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Type
Symbol
Description
1.2V power for analog core
Ethernet PHY
+1.2V Analog
Power Supply
AVDDL_1
P
Ethernet PHY
+1.2V Analog
Power Supply
AVDDL_2
P
1.2V power for analog core
(LAN7430 only)
This is an additional power pin for the 1.2V analog core.
PCIe PHY High
Voltage Supply
VPH
VPTX
P
P
P
P
2.5V PCIe PHY power
PCIe PHY Trans-
mit Supply
1.2V PCIe PHY TX power
1.2V PCIe PHY power
PCIe PHY Analog
and Digital Supply
VP
Variable I/O
Power Supply
Input Group A
VDDVARIO
1.8V - 3.3V variable supply for IOs
Variable I/O
Power Supply
Input Group B
VDDVARIO_B
P
1.8V - 3.3V variable supply for RGMII and MII related IOs
(LAN7431 only)
This is the power pin for the RGMII and MII related IOs
(TXD3, TXD2, TXD1, TXD0, TX_ER/MII_EN, TX_CTL/
TX_EN, TXC/TX_CLK, RXC/RX_CLK, RX_CTL/RX_DV,
RXD0, RXD1, RXD2, RXD3, CLK125/RX_ER, REF-
CLK_25/GPIO11, COL/GPIO10, CRS).
OTP Power
VDD_OTP
P
3.3V to OTP charge pump
3.3V supply voltage for PCIe I/Os
(CLKREQ#, WAKE#, PERST#)
Switcher Input
Voltage
VDD_SW_IN
P
P
1.8V - 3.3V input voltage for switching regulator
Switcher Feed-
back
VDD12_SW_FB
Feedback pin for the integrated switching regulator
Note:
Tie this pin to VDD_SW_IN to disable the
switching regulator.
Switcher +1.2V
Unfiltered Output
Voltage
VDD12_SW_OUT
VDD_REG_IN
P
P
1.2V output voltage from switching regulator
LDO Input Voltage
3.3V input supply to the integrated LDO
Note:
If this supply is set to 2.5V than it shall be
externally connected to VDD25_REG_OUT.
See Section 4.0, "Power Connectivity" for
details.
LDO Output
VDD25_REG_OUT
VDD12CORE
P
P
2.5V output supply from the integrated LDO
This is used to supply power to the PCIE PHY and
optionally to the Gigabit Ethernet PHY AFE.
Digital Core +1.2V
Power Supply
Input
1.2V digital core power.
DS00002631D-page 24
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 3-3:
Name
PIN DESCRIPTIONS (CONTINUED)
Buffer
Symbol
Type
Description
PCIe Ground
GD_1
GD_2
GD_3
P
PCIe ground.
Ground
VSS
P
Common ground.
This exposed pad must be connected to the ground plane
with a via array.
3.4
Configuration Straps
Configuration straps are latched on Power-On Reset (POR) and External Chip Reset (RESET_N) and are identified by
an underlined symbol name. Configuration straps are multi-function pins that are driven as outputs during normal oper-
ation. During a Power-On Reset (POR) or an External Chip Reset (RESET_N), these outputs are not driven. The high
or low state of the signal is latched following deassertion of the reset and is used to determine the default configuration
of a particular feature. The following configuration strap signals are available:
• ADV_PM_DISABLE
• MII_EN (LAN7431 only)
Configuration straps include internal resistors in order to prevent the signal from floating when unconnected. If a partic-
ular configuration strap is connected to a load, an external pull-up or pull-down should be used to augment the internal
resistor to ensure that it reaches the required voltage level prior to latching. The internal resistor can also be overridden
by the addition of an external resistor. When externally pulling configuration straps high, the strap should be tied to
VDDVARIO or VDDVARIO_B as indicated in the pin descriptions.
The system designer must ensure that configuration straps meet the timing requirements specified in Section 7.6.3,
"Power-On Configuration Strap Timing" and Section 7.6.4, "Reset Pin Configuration Strap Timing". If configuration
straps are not at the correct voltage level prior to being latched, the device may capture incorrect strap values.
Note:
Configuration straps must never be driven as inputs. If required, configuration straps can be augmented,
or overridden with external resistors.
2018-2019 Microchip Technology Inc.
DS00002631D-page 25
LAN7430/LAN7431
4.0
POWER CONNECTIVITY
This section details the power connectivity of the LAN7430 and LAN7431 in various configurations. Power sequence
timing is detailed in Section 7.6.2, "Power Sequence Timing".
4.1
LAN7430 Power Connectivity
The following diagrams illustrate the power connectivity for LAN7430 with on-chip regulators enabled and disabled.
FIGURE 4-1:
LAN7430 POWER CONNECTIVITY ON-CHIP REGULATORS ENABLED
+1.8 V to
+3.3 V
VDDVARIO
(1 pin)
VDD12CORE
IO Pads
(3 pins)
Core Logic &
Ethernet PHY
digital
+3.3 V
VDD_OTP
(1 pin)
3.3 / 1.2 OTP
AVDDL
(2 pins)
Ethernet PHY
Analog
+3.3 V
optional 3.3V
PHY
AVDDH
operation
(2 pins)
Ethernet PHY
Bandgap and Osc
AVDD12
(1 pin)
Ethernet PHY PLL
VP
(1 pin)
VPTX
(1 pin)
PCIe PHY
VPH
(1 pin)
+1.8 V to
+3.3 V
Internal 1.2 V
3.3 uH
Switching Regulator
VDD12_SW_OUT
(1 pin)
VDD_SW_IN
OUT
IN
(1 pin)
REF
VDD12_SW_FB
(1 pin)
FEEDBACK
10 µF
0.1uF <0.05
Internal 2.5 V LDO
Regulator
ESR
VDD_REG_IN
(1 pin)
VDD25_REG_OUT
IN
OUT
(1 pin)
ENABLE
1.0 µF
VSS
(exposed pad)
<1 ESR
Note: Bypass and bulk caps as needed for PCB.
Ferrites on AVDDL and AVDD12 may be combined.
DS00002631D-page 26
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
FIGURE 4-2:
LAN7430 POWER CONNECTIVITY ON-CHIP REGULATORS DISABLED
+1.8 V to
+3.3 V
+1.2 V
VDDVARIO
(1 pin)
VDD12CORE
IO Pads
(3 pins)
Core Logic &
Ethernet PHY
digital
+3.3 V
VDD_OTP
(1 pin)
3.3 / 1.2 OTP
AVDDL
(2 pins)
Ethernet PHY
Analog
+3.3 V
optional 3.3V
PHY
AVDDH
operation
(2 pins)
Ethernet PHY
Bandgap and Osc
AVDD12
(1 pin)
Ethernet PHY PLL
VP
(1 pin)
VPTX
PCIe PHY
(1 pin)
VPH
(1 pin)
+1.8 V to
+3.3 V
Internal 1.2 V
+1.8 V to
+3.3 V
NC
Switching Regulator
VDD12_SW_OUT
(1 pin)
VDD12_SW_FB
(1 pin)
VDD_SW_IN
OUT
IN
(1 pin)
REF
FEEDBACK
+2.5 V
+2.5 V
Internal 2.5 V LDO
Regulator
VDD_REG_IN
(1 pin)
VDD25_REG_OUT
IN
OUT
(1 pin)
ENABLE
VSS
(exposed pad)
Note: Bypass and bulk caps as needed for PCB.
Ferrites on AVDDL and AVDD12 may be combined.
2018-2019 Microchip Technology Inc.
DS00002631D-page 27
LAN7430/LAN7431
4.2
LAN7431 Power Connectivity
The following diagram illustrates the power connectivity for LAN7431 with on-chip regulators enabled and disabled.
FIGURE 4-3:
LAN7431 POWER CONNECTIVITY ON-CHIP REGULATORS ENABLED
+1.8 V to
+3.3 V
VDDVARIO
(7 pins)
VDD12CORE
IO Pads
(3 pins)
Core Logic &
Ethernet PHY
digital
+3.3 V
VDD_OTP
(1 pin)
3.3 / 1.2 OTP
AVDDL
(1 pin)
Ethernet PHY
Analog
+3.3 V
optional 3.3V
PHY
AVDDH
operation
(1 pin)
Ethernet PHY
Bandgap and Osc
AVDD12
(1 pin)
Ethernet PHY PLL
VP
(1 pin)
VPTX
PCIe PHY
(1 pin)
VPH
(1 pin)
+1.8 V to
+3.3 V
Internal 1.2 V
3.3 uH
Switching Regulator
VDD12_SW_OUT
(1 pin)
VDD_SW_IN
OUT
IN
(1 pin)
REF
VDD12_SW_FB
(1 pin)
FEEDBACK
10 µF
0.1uF <0.05
Internal 2.5 V LDO
Regulator
ESR
VDD_REG_IN
(1 pin)
VDD25_REG_OUT
IN
OUT
(1 pin)
ENABLE
1.0 µF
VSS
(exposed pad)
<1 ESR
Note: Bypass and bulk caps as needed for PCB.
Ferrites on AVDDL and AVDD12 may be combined.
DS00002631D-page 28
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
FIGURE 4-4:
LAN7431 POWER CONNECTIVITY ON-CHIP REGULATORS DISABLED
+1.8 V to
+3.3 V
+1.2 V
VDDVARIO
(7 pins)
VDD12CORE
IO Pads
(3 pins)
Core Logic &
Ethernet PHY
digital
+3.3 V
VDD_OTP
(1 pin)
3.3 / 1.2 OTP
AVDDL
(1 pin)
Ethernet PHY
Analog
+3.3 V
optional 3.3V
PHY
AVDDH
operation
(1 pin)
Ethernet PHY
Bandgap and Osc
AVDD12
(1 pin)
Ethernet PHY PLL
VP
(1 pin)
VPTX
PCIe PHY
(1 pin)
VPH
(1 pin)
+1.8 V to
+3.3 V
Internal 1.2 V
+1.8 V to
+3.3 V
NC
Switching Regulator
VDD12_SW_OUT
(1 pin)
VDD12_SW_FB
(1 pin)
VDD_SW_IN
OUT
IN
(1 pin)
REF
FEEDBACK
+2.5 V
+2.5 V
Internal 2.5 V LDO
Regulator
VDD_REG_IN
(1 pin)
VDD25_REG_OUT
IN
OUT
(1 pin)
ENABLE
VSS
(exposed pad)
Note: Bypass and bulk caps as needed for PCB.
Ferrites on AVDDL and AVDD12 may be combined.
2018-2019 Microchip Technology Inc.
DS00002631D-page 29
LAN7430/LAN7431
5.0
5.1
DEVICE CONFIGURATION
Device Drivers
Microchip provides LAN7430/LAN7431 software device drivers for the following operating systems:
• Windows 10
• Windows 8.x
• Windows 7
• Windows OneCore
• Linux
• Android
To download the latest LAN7430/LAN7431 drivers, refer to the Microchip product pages at www.microchip.com/
LAN7430 and www.microchip.com/LAN7431.
5.2
Programming Tools
The LAN7430/LAN7431 supports a large number of configurable features. Microchip provides a comprehensive soft-
ware programming tool, MPLAB Connect Configurator (formerly ProTouch2), for EEPROM and OTP configuration of
various device functions and registers. All configuration is to be performed via the MPLAB Connect Configurator pro-
gramming tool. For additional information on this tool, refer to th MPLAB Connect Configurator programming tool prod-
uct page at http://www.microchip.com/design-centers/usb/mplab-connect-configurator.
Note:
Device configuration straps are detailed in Section 3.4, "Configuration Straps," on page 25.
Refer to Section 6.10, "EEPROM Controller (EEP)" and Section 6.11, "One Time Programmable Memory
(OTP)" for detailed information on each device interface.
DS00002631D-page 30
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
6.0
FUNCTIONAL DESCRIPTIONS
This section provides additional details of the major features supported by the LAN7430/LAN7431.
• PCI Express PHY (PCIe PHY)
• PCI Express Endpoint Controller (PCIe EP)
• Gigabit Ethernet Media Access Controller (MAC)
• RGMII (LAN7431 Only)
• Gigabit Ethernet PHY (GPHY) (LAN7430 Only)
• IEEE 1588v2 (PTP)
• Receive Filtering Engine (RFE)
• DMA Controller (DMAC)
• FIFO Controller (FCT)
• EEPROM Controller (EEP)
• One Time Programmable Memory (OTP)
• Resets
• Power Management
• Integrated Voltage Regulators
• JTAG
• Miscellaneous
6.1
PCI Express PHY (PCIe PHY)
The PCIe PHY forms the physical interface between the device’s PCIe endpoint control and the PCIe host bus. It sup-
ports chip-to-chip and card-to-card connectivity across a combination of printed circuit board, connectors, backplane
wiring or cables.
The PCIe PHY is compliant with all of the required features of the PCIe Base Specification, Revision 3.1 (for legacy 2.5
GT/s support).
The low power L1, L1.1 and L1.2 sub-states are supported per the PCIe Base 3.1 Specification.
6.1.1
FEATURES
• 2.5 GT/s data transmission rate
• PIPE3 compliant Transceiver Interface
• Integrated PHY includes transmitter, receiver, PLL, and digital core
• Programmable RX equalization
• Designed for excellent performance margin and receiver sensitivity
• Low jitter PLL technology with excellent supply isolation
The PHY supports a 2.5 GT/s data rate. Since bytes are encoded using the 8b/10b mechanism, this equates to a 2.0
Gbps data rate.
This device supports a PCIe link width of one lane.
6.1.2
REFERENCE CLOCK
The PHY utilizes an external 100MHz differential reference clock, supplied by the host system. PCIe architecture
defines three clock distribution methods: common clock, data clock, and separate clock. The LAN7430/LAN7431
devices support the common clock method where both end devices, such as a host and the device, are using the same
clock source. The details of the common clock method are provided in the PCIe specification.
6.1.3
TERMINATION RESISTANCE
The PHY includes on chip terminations for the TX and RX I/Os.
Termination on the PCIe reference clock pins is provided by the host.
6.1.3.1
Termination Resistance Tuning
The PHY uses an external resistor to calibrate the termination impedances of the high speed inputs and outputs of the
PHY. A 200 Ohm +/-1% resistor should be connected from the RESREF pin to ground.
2018-2019 Microchip Technology Inc.
DS00002631D-page 31
LAN7430/LAN7431
6.1.4
TERMINATION CAPACITORS
The TX pins require series capacitors in the range of 100nF to 200nF.
6.1.5
BEACONING
The PHY supports the PCIe beaconing wake-up mechanism.
6.2
PCI Express Endpoint Controller (PCIe EP)
The device integrates a PCIe 3.1 Endpoint controller that includes the following common PCIe features:
• Split transaction, packet-based protocol
• Common flat address space for load/store access
- 32 and 64-bit memory address spaces
- I/O address space
- Configuration address space
• Transaction layer mechanism
• Credit-based flow control
• Various packet sizes and formats
• Reset and initialization
• Data integrity support
• Link layer retry for recovery following error detection
• 8b/10b encoding with running disparity
• In-band messaging
• Power management:
- Wake capability from D3cold state
- Compliant with ACPI, PCI-PM software model
- Active state power management
Additional functional features supported include:
• All non-optional features of the PCI Express Base 3.1 Specification
• The following optional features of the specification:
- Latency Tolerance Reporting (LTR)
- Completion Timeout Ranges
- Function Level Reset (FLR)
- L1 Substates (L1SS, L1.1SS, L1.2SS)
- Optimized Buffer Fill and Flush (OBFF)
- Readiness Notifications (RN)
- PCI Express Active State Power Management (ASPM)
- PCI Express Advanced Error Reporting (AER) with Multiple Header Logging
- Device Serial Number
- ECRC generation and checking
• x1 Gen1 Lane @ 2.5 GT/s
• Advanced Power and Clock Management
• Configurable Max_Payload_Size (128 bytes to 512 bytes)
• MSI and MSI-X with Per-Vector Masking (PVM)
• INTx Legacy interrupt emulation
• Type 0 Configuration space
DS00002631D-page 32
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
6.3
Gigabit Ethernet Media Access Controller (MAC)
The Ethernet Media Access controller (MAC) incorporates the essential protocol requirements for operating an Ether-
net/IEEE 802.3-compliant node and interfaces to the integrated Gigabit Ethernet PHY (LAN7430 only), or MII/RGMII
interface (LAN7431 only). The MAC can operate in full-duplex 1000 Mbps or half/full-duplex 10/100 Mbps mode.
When operating in half-duplex mode, the MAC complies fully with Section 4 of ISO/IEC 8802-3 (ANSI/IEEE standard)
and ANSI/IEEE 802.3 standards. When operating in full-duplex mode, the MAC complies with IEEE 802.3x full-duplex
operation standard.
The MAC provides programmable enhanced features designed to minimize Host supervision, bus utilization, and pre-
or post-message processing. These features include the ability to disable retries after a collision, dynamic FCS (Frame
Check Sequence) generation on a frame-by-frame basis, automatic pad field insertion and deletion to enforce minimum
frame size attributes, and automatic retransmission and detection of collision frames.
The primary attributes of the MAC are:
• Interfaces to the internal Gigabit Ethernet PHY (LAN7430 only), or MII/RGMII interface (LAN7431 only)
• Transmit and receive message data encapsulation
• Framing (frame boundary delimitation, frame synchronization)
• Error detection (physical medium transmission errors)
- Including Length Field testing
• FCS checking/stripping/generation
• Preamble stripping/generation
• Media access management
• Medium allocation (collision detection, except in full-duplex operation)
• Contention resolution (collision handling, except in full-duplex operation)
• Flow control during full-duplex mode
• Decoding of control frames (PAUSE command) and disabling the transmitter
• Generation of control frames (PAUSE command)
• Maintains minimum inter packet gap (IPG)
• Magic packet/Wake-On-LAN (WOL) detection
• Remote wakeup frame detection
• Neighbor Solicitation offload
• ARP offload
• Implements Simple Network Management Protocol (SNMP) and Remote Monitoring (RMON) management
counter sets
• Jumbo frames supported up to 9220 bytes
6.4
RGMII (LAN7431 Only)
The integrated Reduced Gigabit Media Independent Interface (RGMII) is a Dual Data Rate (DDR) interface that consists
of a transmit path and a receive path. Both paths have an independent clock (TXC & RXC), 4 data signals, and a control
signal. Because of this design, RGMII does not have distinct PHY/MAC roles and special hardware considerations are
not required for a MAC-to-MAC connection. When source-synchronous clocking is used for MAC-to-MAC connections,
the clock signal that is output (by either path) is synchronous with the related data signals. This requires the PCB to be
designed to add a 1.5-2 ns delay to the clock signal to meet the setup and hold times on the sink. The RGMII interface
supports both Version 1.3 and Version 2.0 of the RGMII specification. Version 1.3 of the RGMII Specification requires a
1.5 to 2ns clock delay via a PCB trace delay. Version 2.0 of the RGMII Specification introduces the option of an on-chip
Internal Delay (ID). These distinct RGMII modes of operation are referred to as “Non-ID Mode” and “ID Mode”, respec-
tively.
The LAN7431 requires an external 125MHz clock reference on the CLK125 pin. The LAN7431 MAC may receive a 125
MHz reference clock from the partner PHY or MAC, which is used for generating the RGMII TXC signal. If this option is
not available, the Generate CLK125 MHz Enable (CLK125_EN) field of the Hardware Configuration Register
(HW_CFG) shall be set. When set, the device will generate the 125 MHz clock internally. For the processor MAC, sev-
eral options are possible:
• The 125MHz clock reference is available internally.
2018-2019 Microchip Technology Inc.
DS00002631D-page 33
LAN7430/LAN7431
• The 125MHz clock is provided from an external clock source.
• The LAN7431 can output a 25MHz reference Clock that can be converted for generating the RGMII TXC Signal.
Table 6-1 describes the RGMII signals. Refer to the RGMII Version 2.0 Specification for more detailed information.
TABLE 6-1:
RGMII SIGNAL DEFINITION
RGMII Signal
Name
Pin Type
(with respect to LAN7431)
Pin Type
(with respect to MAC)
Description
TXC
Output
Input
Transmit Reference Clock
(125MHz for 1000Mbps, 25MHz for 100
Mbps, 2.5MHz for 10 Mbps)
TX_CTL
TXD[3:0]
RXC
Output
Output
Input
Input
Input
Transmit Control
Transmit Data [3:0]
Output
Receive Reference Clock
(125MHz for 1000Mbps, 25MHz for 100
Mbps, 2.5MHz for 10 Mbps)
RX_CTL
RXD[3:0]
Input
Input
Output
Output
Receive Control
Receive Data [3:0]
The LAN7431 RGMII pin connections to a MAC are detailed in Figure 6-1.
FIGURE 6-1:
RGMII SIGNAL DIAGRAM
LAN7431 MAC Interface
MAC Interface
RGMII
RXC
RX_CTL
RXD[3:0]
TXC
TX_CTL
TD[3:0]
RXC
RX_CTL
RXD[3:0]
TXC
TX_CTL
TXD[3:0]
CLK125
ETH Ref CLK
125MHz
OSC
DS00002631D-page 34
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
6.5
Gigabit Ethernet PHY (GPHY) (LAN7430 Only)
The device (LAN7430 only) incorporates a low-power Gigabit Ethernet PHY (GPHY) transceiver that is fully compliant
with the IEEE 802.3, 802.3u, 802.3ab, and 802.3az (Energy Efficient Ethernet) standards. It provides a low electromag-
netic interference (EMI) line driver, and integrated line side termination resistors that conserve both power and printed
circuit board (PCB) space.
The mixed signal and digital signal processing (DSP) architecture of the Ethernet PHY assures robust performance
even under less-than-favorable environmental conditions. It supports both half-duplex and full-duplex 10BASE-T and
100BASE-TX, and full-duplex 1000BASE-T communication speeds over Category 5 (Cat5) unshielded twisted pair
(UTP) cable at distances greater than 100m, displaying excellent tolerance to NEXT, FEXT, echo, and other types of
ambient environment and system electronic noise. The Ethernet PHY implements Auto-Negotiation to automatically
determine the best possible speed and duplex mode of operation. Auto-MDIX support allows the use of direct connect
or cross-over LAN cables.
The Ethernet PHY is configurable via the Ethernet PHY Control and Status. These registers are accessed indirectly
through the Ethernet MAC via the MII Access Register (MII_ACCESS) and MII Data Register (MII_DATA).
The Gigabit Ethernet PHY has the following main features:
• Auto-Negotiation to Automatically Select the Highest Link-Up Speed (10/100/1000 Mbps) and Duplex (Half/Full)
• Voltage-mode Line driver with On-Chip Termination Resistors for the Differential Pairs
• Jumbo Frame Support Up to 16 KB (MAC supports 9220 bytes)
• Energy-Detect Power-Down Mode for Reduced Power Consumption When the Cable is not attached
• Energy Efficient Ethernet (EEE) Support with Low-Power Idle (LPI) Mode and Clock Stoppage for 100BASE-TX/
1000BASE-T and Transmit Amplitude Reduction with 10BASE-Te Option
• Programmable LED Outputs for Link, Activity, and Speed
• Baseline Wander Correction
• TDR-based Cable Diagnostic to Identify Faulty Copper Cabling
• Loopback Modes for Diagnostics
• Automatic MDI/MDI-X Crossover to Detect and Correct Pair Swap at All Speeds of Operation
• Automatic Detection and Correction of Pair Swaps, Pair Skew, and Pair Polarity
• Power-Down and Power-Saving Modes
• Signal Quality Indication
6.6
IEEE 1588v2 (PTP)
The device provides hardware support for the IEEE 1588-2008 (v2) Precision Time Protocol (PTP), allowing clock syn-
chronization with remote Ethernet devices, packet time stamping, and time driven event generation.
The device may function as a master or a slave clock per the IEEE 1588-2008 specification. End-to-end and peer-to-
peer link delay mechanisms are supported as are one-step and two-step operations.
A32-bit seconds and 30-bit nanoseconds tunable clock is provided that is used as the time source for all PTP timestamp
related functions. A 1588 Clock Events sub-module provides 1588 Clock comparison based interrupt generation and
timestamp related GPIO event generation. GPIO pins can be used to trigger a timestamp capture when configured as
an input, or output a signal based on a 1588 Clock timer compare event.
All features of the IEEE 1588 unit can be monitored and configured via their respective configuration and status regis-
ters.
6.6.1
IEEE 1588-2008
IEEE 1588-2008 specifies a Precision Time Protocol (PTP) used by master and slave clock devices to pass time infor-
mation in order to achieve clock synchronization. Ten network message types are defined:
• Sync
• Follow_Up
• Delay_Req
• Delay_Resp
• PDelay_Req
• PDelay_Resp
2018-2019 Microchip Technology Inc.
DS00002631D-page 35
LAN7430/LAN7431
• PDelay_Resp_Follow_Up
• Announce
• Signaling
• Management
The first seven message types are used for clock synchronization. Using these messages, the protocol software may
calculate the offset and network delay between timestamps, adjusting the slave clock frequency as needed. Refer to
the IEEE 1588-2008 protocol for message definitions and proper usage.
A PTP domain is segmented into PTP sub-domains, which are then segmented into PTP communication paths. Within
each PTP communication path there is a maximum of one master clock, which is the source of time for each slave clock.
The determination of which clock is the master and which clock(s) is(are) the slave(s) is not fixed, but determined by
the IEEE 1588-2008 protocol. Similarly, each PTP sub-domain may have only one master clock, referred to as the
Grand Master Clock.
PTP communication paths are conceptually equivalent to Ethernet collision domains and may contain devices which
extend the network. However, unlike Ethernet collision domains, the PTP communication path does not stop at a net-
work switch, bridge, or router. This leads to a loss of precision when the network switch/bridge/router introduces a vari-
able delay. Boundary clocks are defined which conceptually bypass the switch/bridge/router (either physically or via
device integration). Essentially, a boundary clock acts as a slave to an upstream master, and as a master to a down
stream slave. A boundary clock may contain multiple ports, but a maximum of one slave port is permitted.
Although boundary clocks solve the issue of the variable delay influencing the synchronization accuracy, they add clock
jitter as each boundary clock tracks the clock of its upstream master. Another approach that is supported is the concept
of transparent clocks. These devices measure the delay they have added when forwarding a message (the residence
time) and report this additional delay either in the forwarded message (one-step) or in a subsequent message (two-
step).
The PTP relies on the knowledge of the path delays between the master and the slave. With this information, and the
knowledge of when the master has sent the packet, a slave can calculate its clock offset from the master and make
appropriate adjustments. There are two methods of obtaining the network path delay. Using the end-to-end method,
packets are exchanged between the slave and the master. Any intermediate variable bridge or switch delays are com-
pensated by the transparent clock method described above. Using the round trip time and accounting for the residence
time reported, the slave can calculate the mean delay from the master. Each slave sends and receives its own mes-
sages and calculates its own delay. While the end-to-end method is the simplest, it does add burden on the master since
the master must process packets from each slave in the system. This is amplified when boundary clocks are replaced
by transparent clocks. Also, the end-to-end delays must be recalculated if there is a change in the network topology.
Using the peer-to-peer method, packets are exchanged only between adjacent master, slaves and transparent clocks.
Each peer pair calculates the receive path delay. As time synchronization packets are forwarded between the master
and the slave, the transparent clock adds the pre-measured receive path delay into the residence time. The final
receiver adds its receive path delay. Using the peer-to-peer method, the full path delay is accounted for without the mas-
ter having to service each slave. The peer-to-peer method better supports network topology changes since each path
delay is kept up-to-date regardless of the port status.
The PTP implementation consists of the following major function blocks:
• PTP Timestamp
This block provides time stamping and packet modification functions.
• 1588 Clock
This block provides a tunable clock that is used as the time source for all PTP timestamp related functions.
• 1588 Clock Events
This block provides clock comparison-based interrupt generation and timestamp related GPIO event generation.
• 1588 GPIOs
This block provides for time stamping GPIO input events and for outputting clock comparison-based interrupt sta-
tus.
• 1588 Interrupts
This block provides interrupt generation, masking and status.
• 1588 Registers
This block provides contains all configuration, control and status registers.
DS00002631D-page 36
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
6.7
Receive Filtering Engine (RFE)
The RFE receives Ethernet frames from the Ethernet MAC, processes them, and passes them to the RX FIFO Controller
(FCT). The RFE is responsible for filtering the received Ethernet frames, verifying the TCP/UDP/ICMP/IGMP and IP
checksum, and removing the VLAN tag.
When receiving a frame from the MAC, the RFE will obtain the frame data and status information. Upon completion of
frame processing, the RFE encapsulates its status with the status information obtained from the MAC, and passes this
information (along with the frame data) on to the FCT in the form of RX Command A, RX Command B, RX Command
C and RX Command D. The RFE also passes the receive timestamp from the 1588 module to the FCT.
The RFE, if enabled, can remove a VLAN tag from the frame. VLAN tag stripping is controlled by the Enable VLAN Tag
Stripping bit of the Receive Filtering Engine Control Register (RFE_CTL). If this bit is set, the tag will be stripped. If clear,
the RFE will not modify the frame in any way.
If multiple VLAN tags are present in a frame, the RFE only removes the first tag (adjacent to the MAC source address).
The RFE provides the Layer 3 Checksum (if enabled) and VLAN ID via RX Command B, while RX Command A, RX
Command C and RX Command D contain the frame’s status.
When the RFE determines a frame has a checksum error, it sets the appropriate error bits in RX Command A to identify
the error condition.
The FCT does not rewind frames that failed checksum validation from the FCT RX FIFO.
The RFE also determines the correct RX FCT channel in which to place the frame, based on various priorities methods
or MAC source or destination address or based on the Microsoft Receive Side Scaling specification. In order to minimize
delays through the RFE, data is processed on the fly and stored into all FIFOs in parallel. Once a determination is made
as to the correct destination FIFOs, the other FIFOs are instructed to drop the packet.
6.8
DMA Controller (DMAC)
The DMA Controller (DMAC) consists of independent receive (RX) and transmit (TX) DMACs, a series of arbiters, and
a control and status register space (CSRs). The TX DMAC transfers Ethernet frames from host memory to the FIFO
Controller (FCT), while the RX DMAC transfers Ethernet frames from the FCT to host memory. Both the RX and TX
DMACs have independent channels allocated to them (4 RX, 1 TX), through which the data transfer occurs.
Both the RX and TX DMACs utilize descriptors to efficiently move data from source to destination with minimal CPU
intervention. Descriptors are data structures in host memory that inform the DMAC of the location of data buffers in host
memory. In the case of the RX DMAC, it also provides a mechanism for communicating status to the CPU on completion
of DMA transactions. The host is responsible for setting up the descriptor rings and allocating RX descriptor buffers. TX
descriptor buffers are allocated and placed into the ring as needed. Each channel has its own descriptor ring and data
buffers. Descriptors are cached on chip to help absorb host bus latency.
The DMAC can be programmed to assert an interrupt for situations such as frame transmit or receive transfer com-
pleted, and other conditions.
6.9
FIFO Controller (FCT)
The FIFO controller uses internal RAMs to buffer RX and TX traffic. Host transmit data, via the DMAC, is directly stored
into the FCT TX FIFO(s). The FCT is responsible for extracting Ethernet frames from the host data and passing the
frames to the MAC.
Received Ethernet Frames are stored into the FCT RX FIFOs and become the basis for DMAC to host memory trans-
fers.
6.9.1
RX PATH (ETHERNET TO HOST)
The Receive direction buffer space consists of four parallel, independent channels. Each of the four 32 KB RX FIFOs
buffer Ethernet frames received from the RFE. The DMAC transfers these frames from the FCT to the host system mem-
ory. Host software will ultimately reassemble the Ethernet frames from the DMAC transfers.
2018-2019 Microchip Technology Inc.
DS00002631D-page 37
LAN7430/LAN7431
6.9.2
TX PATH (HOST TO ETHERNET)
The 20 KB TX FIFO buffers data transferred by the DMAC from system memory. The FCT is responsible for extracting
the Ethernet frames embedded in the data and passing them to the MAC.
The FCT receives valid data from the DMAC and writes it into the TX FIFO. The write side of the FCT does not perform
any processing on the data. No provisions for rewind on the write side are required, as the DMAC manages its own
buffer RAM and performs rewinds in the event that a DMA transfer is errored. When the FCT writes the Ethernet frame
into the FCT TX FIFO RAM, it prepends a DWORD in front of the TX Command Words, used for internal processing,
that contains the length of the Ethernet frame. The read side of the FCT TX FIFO is responsible for extracting the Ether-
net frames.
6.10 EEPROM Controller (EEP)
The device may use an external EEPROM to store the default values for the PCIe controller and the MAC address. The
EEPROM controller supports most “93C56 or 93C66” type 256/512 byte EEPROMs. A total of nine address bits are
used.
After a system-level reset occurs, the device loads the default values from EEPROM. The device is connected to the
PCIe bus but responds with CRS until this process is completed. The EEPROM controller also allows the Host to read,
write and erase the contents of the Serial EEPROM.
Note:
A Microwire-style 2K/4K EEPROM that is organized for 256/512 x 8-bit operation must be used.
Note:
All EEPROM configuration is to be performed via the MPLAB Connect Configurator programming tool.
Refer to Section 5.2, "Programming Tools" for additional information.
6.10.1
EEPROM AND OTP RELATIONSHIP
A detected external EEPROM alway takes precedence over the OTP. When determining the source to configure the
device the following order is used.
1. EEPROM Configuration
2. OTP Configuration
3. CSR defaults
The Configuration and Status Registers defaults are used if neither the EEPROM nor OTP is determined to be config-
ured.
6.10.2
EEPROM / OTP AUTO-LOAD
Certain system level resets (PCIe Fundamental Reset, Hot Resets, Function-Level Reset (FLR), Power Management
Soft Reset, Power-On Reset (POR), External Chip Reset (RESET_N) and Soft Reset) may cause the EEPROM or OTP
contents to be auto-loaded into the device.
Depending on the reset event, either the PCIe Configuration registers, the system Configuration Status Registers, or
both are programmed. See Section 6.12, "Resets" for additional information.
APPLICATION NOTE: Certain reset events cause a restoration from previously read EEPROM / OTP values
rather than rereading the EEPROM or OTP.
6.10.2.1
Magic Byte
6.10.2.1.1
EEPROM
After a reset, the EEPROM loader attempts to read the first byte of data from the EEPROM. If the value A5h or AAh is
read from the first address, then the EEPROM loader will assume that a programmed external Serial EEPROM is pres-
ent. A value of AAh in the first address indicates that only the MAC address is to be read and used.
6.10.2.1.2
OTP
As with the EEPROM, a signature is required to define whether or not the OTP has been programmed. If the value F3h
or F7h is found at byte 0, the OTP shall be determined to be programmed.
DS00002631D-page 38
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
A signature of F3h indicates that the device is configured using values (MAC Address and subsequent as per EEPROM
Contents) from byte offset 1 in the OTP. A value of F7h indicates that the device is configured loading values (MAC
Address and subsequent as per EEPROM Contents) from byte offset 513 in the OTP.
APPLICATION NOTE: The dual signatures enable a mechanism for the OTP to be programmed twice. This may
prove useful for initial bring up of the device where inadvertently mis-programming the
device could render it non-functional. This scheme requires that when an signature of F3h
is used that only the first 512 bytes (0 through 511) of the OTP are programmed. In the
event that the OTP was mis-configured the device can be “saved” by changing the
signature on byte 0 from F3h to F7h and writing the new content starting at byte 513.
As with the EEPROM, if a valid signature is not present at byte 0, the OTP shall be deemed to not be programmed and
the hardware shall not use it for configuring the device. Unlike the EEPROM, there is no signature value (e.g. AAh) that
indicates that only the MAC address is to be loaded.
6.10.2.2
Blank / No EEPROM
If A5h or AAh (EEPROM) or F3h or F7h (OTP) is not read from the first address, the EEPROM loader will end initializa-
tion. The device default values will be assumed unless a configured OTP is present.
Where there is no EEPROM or OTP, it is the responsibility of the Host LAN driver software to set the IEEE 802.3 address
by writing to the MAC Receive Address High Register (RX_ADDRH) and MAC Receive Address Low Register (RX_AD-
DRL).
6.11 One Time Programmable Memory (OTP)
The device integrates a 1K One Time Programmable (OTP) memory to store various configuration data and serve as
an EEPROM replacement to reduce bill of material costs. The OTP supports single bit writes and 8-bit reads. An
included OTP interrupt is available to indicate when the OTP is ready. The OTP provides a configurable standby mode
that reduces its power when operations have been completed.
OTP may potentially co-exist with an external EEPROM. Refer to Section 6.10.1, "EEPROM and OTP Relationship" for
additional details.
Certain system level resets may cause the OTP contents to be auto-loaded into the device. Refer to Section 6.10.2,
"EEPROM / OTP Auto-Load" for additional details.
Note:
All OTP configuration is to be performed via the MPLAB Connect Configurator programming tool. Refer to
Section 5.2, "Programming Tools" for additional information.
6.12 Resets
The device provides the following chip-level reset sources:
• Power-On Reset (POR)
• External Chip Reset (RESET_N)
• PCIe Fundamental Reset
• Hot Resets
• Function-Level Reset (FLR)
• Soft Reset
• Soft-Lite Reset
• Power Management Soft Reset
Additionally, the device provides non-chip-level resets:
• Ethernet PHY Software Reset
• External PHY Reset
2018-2019 Microchip Technology Inc.
DS00002631D-page 39
LAN7430/LAN7431
6.12.1
POWER-ON RESET (POR)
A Power-On Reset (POR) occurs whenever power is initially applied to the device, or if power is removed and reapplied
to the device. A timer within the device will assert the internal reset for approximately 20 ms. EEPROM/OTP contents
are loaded by this reset. Configuration straps are also loaded by this reset.
The POR is a combination of four separate POR circuits that measure the voltage on the following domains:
• 3.3V to 1.8V (set for 1.8V typical) - VDDVARIO, VDDVARIO_B
• 1.2V - AVDD12, AVDDL_1, AVDDL_2, VPTX, VP, VDD12CORE (monitored on AVDD12 and VDD12CORE)
• 2.5V - VPH, AVDDH_1, AVDDH_2 (monitored on VDD25_REG_OUT)
• 3.3V - VDD_OTP, AVDDH_1, AVDDH_2 (monitored on VDD_OTP)
6.12.2
EXTERNAL CHIP RESET (RESET_N)
A hardware reset will occur when the RESET_N pin is driven low. Assertion of RESET_N is not required at power-on.
However, if used, RESET_N must be driven low for a minimum period as defined in Section 7.6.4, "Reset Pin Configu-
ration Strap Timing". The RESET_N pin is not pulled-high internally and must be connected to VDDVARIO if unused.
Note:
If configured, the EEPROM/OTP contents are reloaded by this reset. The configuration straps are also
loaded by this reset.
6.12.3
PCIE FUNDAMENTAL RESET
The PCIe fundamental reset uses the PERST# pin, which indicates that the PCIe main power and reference clock are
valid. It is used as a cold reset when the device operates from the main PCIe power source. It is used as a warm reset
when the device operates from the auxiliary PCIe power source and indicates, to the still powered and operational
device, that the main power and / or reference clock are not valid.
Note:
Resets occur on the release of PERST#, not on the active level.
6.12.3.1
Warm Reset
A warm reset occurs when the device is operating on auxiliary power or multiplexed main / auxiliary power (VAUX_DET
pin = 1) and PERST# is asserted. The device enters the D3cold state. Warm reset is normally preceded by the PCIe link
being placed into the L2/L3 Ready state. The D3cold state is exited when PERST# deasserts.
6.12.4
HOT RESETS
Hot resets include
• An in-band mechanism for propagating Conventional Reset across a Link
• An in-band mechanism for software to force a Link into Electrical Idle, disabling the Link
• The Data Link Layer reporting DL_Down status.
6.12.5
FUNCTION-LEVEL RESET (FLR)
Function-Level Reset is a software issued reset triggered when the Initiate Function Level Reset bit in the PCIe Device
Control configuration register is set. It is used to reset the device without affection the link state. An FLR starts, is pro-
cessed and then exits.
During an FLR:
• All requests and completions for the function that arrived from the wire before the FLR started are handled by
silently dropping them.
• All requests following the FLR are discarded using Unsupported Request (UR) (for posted and non-posted
requests), and using Unexpected Completion (UC) for completions. Therefore, the software driver should put the
function into a quiescent state (by clearing the BME or otherwise) before initiating an FLR so that the function
does not issue requests in close proximity to the FLR event. Otherwise, any completions from these requests will
dropped later on.
• The function should not issue requests during FLR. Otherwise, completions from these requests (received by the
device after the function has exited FLR) are treated as unexpected and dropped.
• Any outstanding INTx interrupt asserted by the function must be deasserted by sending the corresponding Deas-
sert_INTx Message.
DS00002631D-page 40
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
• The device’s non-PCIe functionality is reset.
• The FLR routine exits.
6.12.6
SOFT RESET
This is a software issued reset when the Soft Reset (SRST) bit in the Hardware Configuration Register (HW_CFG) is
set. It is used to completely reset the device as if it was a cold reset.
As with a POR and RESET_N:
• The entire device is reset.
• A timer within the device will assert the internal reset for approximately 20 ms.
• The EEPROM/OTP contents are loaded by this reset.
Note:
This reset will cause a detach from the PCIe bus, which may cause host software issues if unexpected.
6.12.7
SOFT-LITE RESET
This is a software issued reset when the Soft Lite Reset (LRST) bit in the Hardware Configuration Register (HW_CFG)
is set. It is used to reset only the device function without resetting the PCIe portion.
Note:
Software must stop all RX and TX channels of the DMA controller before setting this bit.
Software must disable all interrupts before setting this bit.
Software must not access any device Control and Status Registers (PCIe Configuration Space registers
excluded) for at least 5µS after setting Soft Lite Reset (LRST).
Software should verify that Soft Lite Reset (LRST) has self-cleared before performing any device opera-
tions or setting any device CSRs (PCIe Configuration Space registers excluded)
APPLICATION NOTE: Although some registers are returned to their last EEPROM or OTP specified default upon
a Soft Like Reset (LRST), the device does not automatically reload its full configuration
(including the User Initialization Table) from OTP or EEPROM. If necessary or desired,
software may issue a Host Initiated EEPROM or OTP Reload.
6.12.8
POWER MANAGEMENT SOFT RESET
This reset is created when the device’s power state is changed from D3hot to D0u by writing a 00b to the PowerState
field in the Power Management Control/Status PCIe configuration register while the No_Soft_Reset field is clear.
6.12.9
ETHERNET PHY SOFTWARE RESET
The Ethernet PHY software reset is triggered via the Ethernet PHY Reset (ETH_PHY_RST) bit in the Power Manage-
ment Control Register (PMT_CTL). It holds the Ethernet PHY reset for a minimum of 2 ms.
For the LAN7431 (external Ethernet PHY), the PHY_RESET_N pin is asserted during this reset. The Device Ready
(READY) bit in the Power Management Control Register (PMT_CTL) asserts after the 2 ms PHY_RESET_N assertion
interval completes. An optional 125ms delay can be enabled to allow for the external PHY to become ready. This is
enabled with the External PHY Ready Delay Enable (EXT_PHY_RDY_EN) bit.
For the LAN7430 (internal Ethernet PHY), the Device Ready (READY) asserts when the internal PHY is functional, fol-
lowing the reset.
Note:
The Ethernet PHY Software Reset is not a chip-level reset. It resets only the Ethernet PHY.
6.12.10 EXTERNAL PHY RESET
The LAN7431 uses the dedicated PHY_RESET_N pin for automatically resetting the external Ethernet PHY. This pin
automatically asserts as part of the reset sequence. The PHY_RESET_N may also be asserted by an Ethernet PHY
Software Reset.
2018-2019 Microchip Technology Inc.
DS00002631D-page 41
LAN7430/LAN7431
6.13 Power Management
The device supports two categories of Power Management (PM) operations to control the device state (D-state) and
link state of the PCIe PHY and Endpoint Controller functional blocks.
Software PCI Compatible PM (PCI-PM) allows the host software to direct the function to enter into the D3hot and D3cold
low-power states. This indirectly causes a change in the link power state. The L1 state is entered when the device is
programmed to a non-D0 state. Further entry into L1.1 and L1.2 sub-states is initiated by the downstream port. Clock
power management during the L1 state provides for the removal of the PCIe reference clock.
Native PCIe PM Mechanisms include Active State PM (ASPM) which, while in the L0 state, detects idle on the link for a
specific time duration and automatically transitions the link to the L0s or L1 power states. L1 Sub-states are also sup-
ported that disables components on a link to further reduce idle power consumption while the link is in the L1 state,
including almost complete removal of power for the high speed PHY circuits.
The power management functions include:
• Enabling the host to place the device in a reduced power state, by selectively disabling internal clocks and power-
ing down the Ethernet PHY (LAN7430 only).
• Providing for detection of various wakeup events.
• Providing a host-readable READY flag which is set when the device is fully operational.
• Controlling the loading of OTP or EEPROM values after a system reset.
• Supporting D0 and D3hot and D3cold states
• Supporting L0s, L1 states and L1.1 and L1.2 Sub-states
Power Management Event (PME) functions include:
• Supporting PCIe WAKE# and Beaconing.
• Supporting PCIe PME Messaging.
• Supporting GPIO, Link Change, Ethernet Frame as sources for wakeup.
6.13.1
PCIe DEVICE STATES
The device supports the mandatory D0 (herein referred to as D0u (uninitialized), D0a (active)), D3hot, and D3cold power
states. The optional D1 and D2 states are not support by the device.
The device can signal a wake event detection by sending a PME message and asserting wakeup via Beaconing and
the WAKE# pin. The PME messaging can be generated in all states, except the D0u and D3cold state. Wakeup via Bea-
coning and the WAKE# pin can be generated in all states, including the D3cold state, except D0u.
The device can send PME messaging and assert wakeup upon detection of various power management events, such
as an Ethernet “Wake On LAN”, Energy Efficient Ethernet activity, PHY link and energy detection and GPIO events. As
a result, the host can reconfigure the power management state.
As a single function device, the device implements power management capabilities and power management control/
status registers, which are mapped into the PCIe configuration space. The PME_Support and Aux_Current fields of the
Power Management Capabilities register is dependent on the setting of the external VAUX_DET pin. The Data_Scale
and Data_Select fields of the Power Management Capabilities register will always return zero, as the Data Register is
not implemented.
The descriptions that follow refer to the “PME Context”. PME Context is defined as:
• The PME_Status and PME_En fields in the PCIe Power Management Control/Status configuration register
• The Aux Power PM Enable field in the PCIe Device Control configuration register
• The Wakeup Source Register (WK_SRC) register
Device power management states are directly controlled by software by writing the Power State field in the PCIe Power
Management Control/Status configuration register.
In addition, the device utilizes two control signals. These are PERST#, to determine when main power is valid, and
VAUX_DET to determine if auxiliary power exists.
Note:
If alternate usage of the VAUX_DET pin (e.g. GPIO3, LED3 or TMS) is enabled, the input value of the pin
is overridden to a low value.
DS00002631D-page 42
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
PME wakeup is enabled via the PME_En field in the PCIe Power Management Control/Status configuration register.
Although this does not directly affect the power state transitions, it does affect the allowable current draw while in certain
states. As an alternate, the Aux Power PM Enable field in the PCIe Device Control configuration register also allows
current draw while in certain states without enabling the PME function.
6.13.1.1
D0
D0 is divided into two distinct substates, the “un-initialized” substate and the “active” substate. When a component
comes out of Conventional Reset, all Functions of the component enter the D0uninitialized (D0u) state. When a Function
completes FLR, it enters the D0u state. After configuration is complete, a Function enters the D0active (D0a) state, the
fully operational state for a PCI Express Function. A Function enters the D0a state whenever any single or combination
of the Function’s Memory Space Enable, I/O Space Enable, or Bus Master Enable bits have been set.
Note:
A Function remains in D0a even if these enable bits are subsequently cleared.
6.13.1.2
D3
D3 support is required (both the D3cold and the D3hot states). Functions supporting PME generation from D3 must sup-
port it for both D3cold and the D3hot states.
Functional context is required to be maintained by Functions in the D3hot state if the No_Soft_Reset field in the PCIe
Power Management Control/Status configuration register is Set. In this case, software is not required to re-initialize the
Function after a transition from D3hot to D0 (the Function will be in the D0active state). If the No_Soft_Reset bit is Clear,
functional context is not required to be maintained by the Function in the D3hot state. As a result, in this case software
is required to fully re-initialize the Function after a transition to D0 as the Function will be in the D0uninitialized state.
The Function will be reset if the Link state has transitioned to the L2/L3 Ready state regardless of the value of the No_-
Soft_Reset bit.
6.13.1.2.1
D3hot
While in the D3hot state, a Function must not initiate any Request TLPs on the Link with the exception of a PME Mes-
sage. Completion TLPs may still be sent.
Configuration and Message requests are the only TLPs accepted by a Function in the D3hot state. All other received
Requests must be handled as Unsupported Requests, and all received Completions may optionally be handled as
Unexpected Completions.
If an error caused by a received TLP (e.g., an Unsupported Request) is detected while in D3hot, and reporting is enabled,
the Link must be returned to L0 if it is not already in L0 and an error Message must be sent. If an error caused by an
event other than a received TLP (e.g., a Completion Timeout) is detected while in D3hot, an error Message may option-
ally be sent when the Function is programmed back to the D0 state. Once in D3hot the Function can later be transitioned
into D3cold (by removing power from its host component).
Note that D3hot is also a useful state for reducing power consumption by idle components in an otherwise running sys-
tem.
6.13.1.2.2
D3cold
A Function transitions to the D3cold state when its main power is removed. A power-on sequence with its associated
cold reset transitions a Function from the D3cold state to the D0uninititialized state. At this point, software must perform a
full initialization of the Function in order to re-establish all functional context, completing the restoration of the Function
to its D0active state. This device has the option to reset only the PCIe controller and maintain the device’s functional con-
text.
Functions that support wakeup functionality from D3cold must maintain their PME context for inspection by PME service
routine software during the course of the resume process. A Function’s PME assertion is acknowledged when system
software performs a “write 1 to clear” configuration transaction to the asserting Function’s PME_Status bit of its PCI-PM
compatible PCIe Power Management Control/Status configuration register.
An auxiliary power source must be used to support PME event detection within a Function, Link reactivation, and to
preserve PME context from within D3cold. Note that once the I/O Hierarchy has been brought back to a fully communi-
cating state, as a result of the Link reactivation, the waking agent then propagates a PME Message to the root of the
Hierarchy indicating the source of the PME event.
2018-2019 Microchip Technology Inc.
DS00002631D-page 43
LAN7430/LAN7431
6.13.2
PCIe LINK STATES (LOW POWER SUB-STATES)
The link states are not visible to PCI-PM legacy compatible software and are either derived from the power management
D-states of the corresponding components connected to that Link or by ASPM protocols.
The PCIe specification describes the rules and conditions for entry and exit of the link states.
The device supports the following Link power management states:
L0 - Active state
In this state, the main power supplies, reference clocks and the devices internal PLL are active. The platform’s Vaux
may or may not be active.
All PCI Express transactions and other operations are enabled.
L0 support is required for both ASPM and PCI-PM compatible power management.
L0 is available while in D0. It is also temporarily used in D3hot for messages during this state.
L0s – A low resume latency, energy saving “standby” state
In this state, the main power supplies, reference clocks and the devices internal PLL are active. The platform’s Vaux
may or may not be active.
TLP and DLLP transmission is disabled for a Port whose Link is in Tx_L0s.
The Physical Layer provides mechanisms for quick transitions from this state to the L0 state. When common (distrib-
uted) reference clocks are used on both sides of a Link, the transition time from L0s to L0 is typically less than 100 Sym-
bol Times.
It is possible for the Transmit side of one component on a Link to be in L0s while the Transmit side of the other compo-
nent on the Link is in L0.
L0s is not applicable to PCI-PM compatible power management and is optionally used by ASPM power management.
L0s is only available while in D0.
L1 – Higher latency, lower power “standby” state
In this state, the main power supplies are active. Reference clocks must remain active during L1, except as permitted
by Clock Power Management (using CLKREQ#) and/or L1 PM Sub-states when enabled. The devices internal PLL is
active, based on the availability of the reference clock. The platform’s Vaux may or may not be active.
TLP and DLLP transmission is disabled for a Link in L1.
Two power management Messages provide support for the PCI-PM L1 state:
• PM_Enter_L1 (DLLP)
• PM_Request_Ack (DLLP)
The L1 state is entered whenever all Functions of a Downstream component on a given Link are programmed to a D-
state other than D0. It may also be optionally entered by ASPM power management while in the D0 state.
The PCIe specification describes the rules for entry and exit of the link states. Exit from L1 is initiated by an Upstream-
initiated transaction targeting a Downstream component, or by the Downstream component’s initiation of a transaction
heading Upstream. Transition from L1 to L0 is typically a few microseconds.
L1 support is required for PCI-PM compatible power management and is optionally used by ASPM.
L1 Clock Power Management
If L1 Sub-states (below) are not enabled, the reference clock may still be removed and the PLL turned off. This function
is controlled by the Enable Clock Power Management field in the PCIe Link Control configuration register. Software
must only set this field if the Clock Power Management bit of the Link Capabilities register is a 1.
L1 Clock PM and L1 Sub-states work orthogonal to each other. However, L1 Sub-states takes precedence over Clock
PM. This means that when the entry conditions for any L1 Sub-state are satisfied then the device executes the corre-
sponding L1 Substate protocol.
DS00002631D-page 44
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
L1 PM Sub-states – optional L1.1 and L1.2 sub-states of the L1 low power Link state for PCI-PM and ASPM are sup-
ported by the device.
L1.0 Sub-state
This sub-state corresponds to the conventional L1 Link state, when L1 PM Sub-states are enabled by setting one or
more of the enable bits in the PCIe L1 PM Substates Control 1 configuration register but the device is not in either of
those sub-states.
This sub-state is entered whenever the Link enters L1.
The port is required to be enabled to detect Electrical Idle and the Link common mode voltages are maintained.
L1.1 Sub-state
The port is not required to be enabled to detect Electrical Idle but the Link common mode voltages are maintained.
The bidirectional open-drain clock request (CLKREQ#) signal controls entry and exit from this state. After the link has
entered L1 through the normal L1 negotiation, the device can initiate the sequence for entering L1.1 by three-stating the
CLKREQ# output buffer. The entry sequence can only proceed if the DSP is also three-stating its CLKREQ# output buf-
fer, resulting in the bidirectional CLKREQ# signal being pulled up to 1. Otherwise CLKREQ# will remain asserted at 0
and the link state will stay in L1.0.
The exit sequence can be initiated by either port by asserting CLKREQ# to 0.
L1.2 Sub-state
The port is not required to be enabled to detect Electrical Idle nor maintain the Link common mode voltages.
The bidirectional open-drain clock request (CLKREQ#) signal controls entry and exit from this state. After the link has
entered L1 through the normal L1 negotiation, the device can initiate the sequence for entering L1.2 by three-stating the
CLKREQ# output buffer. The entry sequence can only proceed if the DSP is also three-stating its CLKREQ# output buf-
fer, resulting in the bidirectional CLKREQ# signal being pulled up to 1. Otherwise CLKREQ# will remain asserted at 0
and the link state will stay in L1.0.
The exit sequence can be initiated by either port by asserting CLKREQ# to 0.
L1.2 is further subdivided into L1.2.Entry, L1.2.Idle and L1.2.Exit.
Table 6-2 details the various L1 sub-state exit latencies.
TABLE 6-2:
L1 Sub-state
L1
L1 SUB-STATE EXIT LATENCIES
Exit Latency (uS)
<7
L1 with CLKREQ# (CPM)
<68
<68
<88
L1.1
L1.2
6.13.3
LATENCY TOLERANCE REPORTING (LTR) MECHANISM
The Latency Tolerance Reporting (LTR) mechanism enables the endpoint to report the service latency requirements for
Memory Reads and Writes to the Root Complex. Power management policies for central platform resources (such as
main memory, RC internal interconnects, and snoop resources) can be implemented to consider the endpoint service
requirements. The Root Complex is not required to honor the requested service latencies, but is strongly encouraged
to provide a worst case service latency that does not exceed the latencies indicated by the LTR mechanism.
This device supports LTR as indicated by the LTR Mechanism Supported bit in the PCIe Device Capabilities 2 configu-
ration register. LTR is enabled via the LTR Mechanism Enable bit in the PCIe Device Control 2 configuration register.
The LTR mechanism tells the host the latency tolerance the device has in response to a request from the device. This
allows the host to judiciously decide how long to wait before servicing the interrupt from the device. System power con-
sumption is optimized by enabling the Host CPU and memory sub-system to utilize the device’s latency, and power
down and stay in their low power states longer.
2018-2019 Microchip Technology Inc.
DS00002631D-page 45
LAN7430/LAN7431
6.14 Integrated Voltage Regulators
The LAN7430/LAN7431 includes both a switching regulator and LDO to facilitate ease of integration and to allow oper-
ation off of a single power supply.
6.14.1
SWITCHING REGULATOR
The switching regulator supplies 1.2 volts to the main core digital logic, the I/O pads and the Gigabit Ethernet PHY’s
digital logic, all via the VDD12CORE inputs. It also supplies the 1.2V power to the Gigabit Ethernet PHY’s analog sec-
tions and the PCIe PHY’s analog, digital and transmit sections, all via external connections. It operates from a 1.8V to
3.3V input supply and can supply up to 600mA output current.
When the VDD12_SW_FB pin is connected to the 1.2V regulated voltage, the switching regulator is enabled and
receives 1.8V to 3.3V on the VDD_SW_IN pin.
The switching regulator requires an external LC filter to generate the 1.2V regulated voltage. A 3.3uH inductor should
be connected between the switching regulator’s output, VDD12_SW_OUT pin, and the 1.2V regulated supply. A 10uF
ceramic capacitor, along with a noise filtering 0.1uF ceramic, should be connected from the 1.2V regulated supply to
ground.
Over-Current Protection and Short-Circuit Protection are supported.
The switching regulator can be disabled to allow for an external 1.2V supply. When the VDD12_SW_FB pin is connected
to the VDD_SW_IN pin, the switching regulator is disabled. However, 1.8V to 3.3V must still be supplied to the
VDD_SW_IN pin.
Refer to Section 4.0, "Power Connectivity" for additional details.
6.14.2
LOW-DROPOUT REGULATOR
The LDO regulator supplies 2.5 volts to the PCIe PHY and the Gigabit Ethernet PHY, all via external connections. It
operates from a 3.3V input supply and can supply up to 250mA output current. The Gigabit Ethernet PHY can alterna-
tively be powered by an external 3.3V supply.
When the VDD_REG_IN pin is connected to 3.3V, the LDO regulator is enabled. A 1.0 uF 0.1-ohm ESR capacitor must
be connected to the VDD25_REG_OUT pin.
The LDO regulator can be bypassed to allow for an external 2.5V supply. When the VDD25_REG_OUT pin is connected
to the VDD_REG_IN pin, the LDO regulator is disabled. However, 2.5V must still be supplied to the VDD_REG_IN pin.
Refer to Section 4.0, "Power Connectivity" for additional details.
6.15 JTAG
The integrated IEEE 1149.1 compliant TAP Controller supports boundary scan and various test modes via the JTAG test
port. The interface consists of four pins (TDO, TDI, TCK and TMS) and includes a state machine, data register array,
and an instruction register. The JTAG pins are described in Table 3-3, “Pin Descriptions,” on page 16. The JTAG inter-
face conforms to the IEEE Standard 1149.1 - 2001 Standard Test Access Port (TAP) and Boundary-Scan Architecture.
All input and output data is synchronous to the TCK test clock input. TAP input signals TMS and TDI are clocked into
the test logic on the rising edge of TCK, while the output signal TDO is clocked on the falling edge.
The JTAG functionality is selected when the TEST pin is asserted. The implemented IEEE 1149.1 instructions and their
op codes are shown in Table 6-3. The JTAG IDs for each version of the device are shown in Table 6-4. Refer to Section
7.6.8, "JTAG Timing" for detailed JTAG timing specifications.
DS00002631D-page 46
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 6-3:
IEEE 1149.1 OP CODES
Instruction
Op Code
Comment
BYPASS 0
BYPASS 1
28’h0000000
28’hFFFFFFF
28’hFFFFFF8
28’hFFFFFE8
28’hFFFFFEF
28’hFFFFFFE
28’hFFFFFCF
Mandatory Instruction
Mandatory Instruction
Mandatory Instruction
Mandatory Instruction
Optional Instruction
Optional Instruction
Optional Instruction
SAMPLE / PRELOAD
EXTEST
CLAMP
ID_CODE
HIGHZ
TABLE 6-4:
JTAG ID
Device
JTAG ID
LAN7430
LAN7431
001E1445h
001F1445h
6.16 Miscellaneous
6.16.1
GENERAL PURPOSE INPUTS/OUTPUTS (GPIOS)
The GPIO controller is comprised of 4 (for the LAN7430) or 12 (for the LAN7431) programmable input / output pins
(GPIO[11:0]). These pins are individually configurable via the GPIO configuration registers. Push/pull and open-drain
output buffers are supported for each GPIO. When a GPIO pin is set to an output, the input buffer and pull-up are dis-
abled. When a GPIO pin is set as an input, the pull-up is enabled. Each GPIO has the ability to be used as a 1588 input
or output.
Note:
Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive
signals external to the device. When connected to a load that must be pulled high, an external resistor must
be added.
6.16.2
GENERAL PURPOSE TIMER (GPT)
The device includes a programmable general purpose timer that can be used to generate periodic system interrupts.
The resolution of this timer is 100uS. The GPT is loaded and enabled via the General Purpose Timer Configuration Reg-
ister. Once the enabled general purpose timer counts down to zero, the general purpose timer interrupt is asserted to
alert the user.
2018-2019 Microchip Technology Inc.
DS00002631D-page 47
LAN7430/LAN7431
7.0
7.1
OPERATIONAL CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage (VDDVARIO, VDDVARIO_B, VDD_SW_IN, VDD_REG_IN, VDD_OTP) (Note 7-1) ......-0.5 V to +4.6 V
+2.5/3.3 V Analog Supply Voltage (AVDDH_1, AVDDH_2) (Note 7-1).....................................................-0.5 V to +4.6 V
+2.5 V Analog Supply Voltage (VPH) (Note 7-1)......................................................................................-0.5 V to +3.2 V
+1.2 V Analog Supply Voltage (AVDD12, AVDDL_1, AVDDL_2, VPTX, VP) (Note 7-1)..........................-0.5 V to +1.5 V
+1.2 V Digital Supply Voltage (VDD12CORE) (Note 7-1) ........................................................................-0.5 V to +1.5 V
Positive voltage on input signal pins, with respect to ground..................................................................................+4.6 V
Negative voltage on input signal pins, with respect to ground ................................................................................ -0.5 V
Storage Temperature...............................................................................................................................-65°C to +150°C
Lead Temperature Range............................................................................................Refer to JEDEC Spec. J-STD-020
HBM ESD Performance ..........................................................................................................................................+/-2kV
Note 7-1
When powering this device from laboratory or system power supplies, it is important that the absolute
maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage
spikes on their outputs when AC power is switched on or off. In addition, voltage transients on the
AC power line may appear on the DC output. If this possibility exists, it is suggested that a clamp
circuit be used.
*Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating
only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional
operation of the device at any condition exceeding those indicated in Section 7.2, "Operating Conditions**", Section 7.5,
"DC Specifications", or any other applicable section of this specification is not implied.
7.2
Operating Conditions**
Supply Voltage (VDD_SW_IN)............................................................................................................+1.62 V to +3.63 V
Supply Voltage (VDDVARIO, VDDVARIO_B) .....................................................................................+1.62 V to +3.63 V
Supply Voltage (VDD_REG_IN, VDD_OTP).......................................................................................+2.97 V to +3.63 V
+2.5/3.3 V Ethernet PHY Analog Supply Voltage (AVDDH_1, AVDDH_2)........................... Note 7-2 +2.33 V to +2.75 V
............................................................................................................................................................+2.97 V to +3.63 V
+2.5 V PCIe PHY Analog Supply Voltage (VPH).................................................................................+2.33 V to +2.75 V
+1.2 V PCIe PHY Analog Supply Voltage (VPTX, VP)........................................................................+1.12 V to +1.32 V
+1.2 V Ethernet PHY Analog Supply Voltage (AVDD12, AVDDL_1, AVDDL_2) .................................+1.14 V to +1.32 V
Digital Supply Voltage (VDD12CORE)................................................................................................+1.14 V to +1.32 V
Positive voltage on input signal pins, with respect to ground................................................................................+3.63 V
Negative voltage on input signal pins, with respect to ground ................................................................................ -0.3 V
Ambient Operating Temperature in Still Air (TA).................................................................................................. Note 7-3
Note 7-2
The 10BASE-T transmit amplitude will not pass the 10BASE-T spec limits over process, voltage, and
temperature at 2.5V (nominal).
Note 7-3
0°C to +70°C for commercial version, -40°C to +85°C for industrial version, -40°C to +105°C for
automotive version.
DS00002631D-page 48
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.3
Package Thermal Specifications
7.3.1
48-SQFN (LAN7430 ONLY)
TABLE 7-1:
48-SQFN PACKAGE THERMAL PARAMETERS
Symbol
°C/W
Velocity (Meters/s)
JA
26.4
23.1
0.2
0
1
JT
JC
0
0.3
1
1.8
N/A
Note:
Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.
72-SQFN (LAN7431 ONLY)
7.3.2
TABLE 7-2:
72-SQFN PACKAGE THERMAL PARAMETERS
Symbol
°C/W
Velocity (Meters/s)
JA
JT
JC
20.6
18.0
0.1
0
1
0
0.2
1
1.6
N/A
Note:
Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.
2018-2019 Microchip Technology Inc.
DS00002631D-page 49
LAN7430/LAN7431
7.4
Power Consumption
7.4.1
LAN7430 POWER CONSUMPTION
TABLE 7-3:
LAN7430 POWER CONSUMPTION
Mode
3.3V Typical
Current (mA)
Typical Power (mW)
Suspend
Without WoL support
44
208
107
57
145
686
353
188
251
231
936
901
832
814
927
842
766
759
439
347
284
281
572
485
444
437
571
475
413
409
459
366
304
300
416
347
270
267
389
300
238
234
WoL - 1000BASE-T
WoL - 100BASE-TX
WoL - 10BASE-Te
WoL - 100BASE-TX EEE
76
WoL - 1000BASE-T EEE
70
Active
Operation
L0s
284
273
252
247
281
255
232
230
133
105
86
L1
L1 with CPM
L1.SS
L0s
Idle
L1
L1 with CPM
L1.SS
L0s
Idle
w/EEE
L1
L1 with CPM
L1.SS
L0s
85
Active
Operation
173
147
134
132
173
144
125
124
139
111
92
L1
L1 with CPM
L1.SS
L0s
Idle
L1
L1 with CPM
L1.SS
L0s
Idle
w/EEE
L1
L1 with CPM
L1.SS
L0s
91
Active
Operation
126
105
82
L1
L1 with CPM
L1.SS
L0s
81
Idle
118
91
L1
L1 with CPM
L1.SS
72
71
DS00002631D-page 50
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 7-3:
LAN7430 POWER CONSUMPTION (CONTINUED)
3.3V Typical
Current (mA)
Mode
Typical Power (mW)
Energy Detect Power
Down
L0s
105
79
347
260
194
191
L1
L1 with CPM
L1.SS
59
58
7.4.2
LAN7431 POWER CONSUMPTION
TABLE 7-4:
LAN7431 POWER CONSUMPTION
Mode
Typical
Current (mA)
Typical Power (mW)
VDDVARIO
1.8V
23
33
38
90
75
63
62
6
41
83
2.5V
3.3V
125
297
248
208
205
11
3.3V (VDD_SW_IN,
VDD_REG_IN,
VDD_OTP)
L0s
L1
L1 with CPM
L1.SS
1.8V
VDDVARIO
2.5V
8
20
3.3V
11
90
75
63
62
2
36
3.3V (VDD_SW_IN,
VDD_REG_IN,
VDD_OTP)
L0s
297
248
208
205
4
L1
L1 with CPM
L1.SS
1.8V
VDDVARIO
2.5V
3
8
3.3V
5
17
3.3V (VDD_SW_IN,
VDD_REG_IN,
VDD_OTP)
L0s
90
65
50
49
2
297
215
165
162
4
L1
L1 with CPM
L1.SS
1.8V
VDDVARIO
2.5V
3
8
3.3V
8
26
3.3V (VDD_SW_IN,
VDD_REG_IN,
VDD_OTP)
L0s
90
75
63
62
297
248
208
205
L1
L1 with CPM
L1.SS
2018-2019 Microchip Technology Inc.
DS00002631D-page 51
LAN7430/LAN7431
TABLE 7-4:
LAN7431 POWER CONSUMPTION (CONTINUED)
Typical
Current (mA)
Mode
Typical Power (mW)
VDDVARIO
1.8V
2
3
4
2.5V
8
3.3V
8
26
3.3V (VDD_SW_IN,
VDD_REG_IN,
VDD_OTP)
L0s
90
65
50
49
297
215
165
162
L1
L1 with CPM
L1.SS
7.5
DC Specifications
TABLE 7-5:
NON-VARIABLE I/O DC ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Units
Notes
IS Type Input Buffer
Low Input Level
VIL
VIH
0.8
V
V
Schmitt trigger
Schmitt trigger
High Input Level
2.0
Schmitt Trigger Hysteresis
VHYS
100
127
245
10
3
mV
(VIHT - VILT
)
Input Leakage
(VIN = VSS or VDD_OTP)
IIH
-10
µA
pF
Note 7-4
Input Capacitance
OD4 Type Buffer
CIN
2
Low Output Level
VOL
0.2
0.5
V
IOL = -4 mA
Note 7-5
ICLK Type Input Buffer
Low Input Level
High Input Level
Input Leakage
VIL
VIH
IIH
V
V
2.0
-10
10
µA
Note 7-4
Note 7-5
This specification applies to all inputs and tri-stated bi-directional pins.
XI can optionally be driven from a 25 MHz single-ended clock oscillator to which these specifications
apply.
DS00002631D-page 52
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 7-6:
VARIABLE I/O DC ELECTRICAL CHARACTERISTICS
Typ Typ Typ
1.8 2.5 3.3
Parameter
Symbol
Min
Max
Units
Notes
VIS Type Input Buffer
Low Input Level
VIL
VIH
0.39*VDDVARI
O
V
V
High Input Level
0.63*VDDVARI
O
Schmitt Falling Trip Point
Schmitt Rising Trip Point
Schmitt Trigger Hysteresis
VT-
0.80 1.09 1.42
0.94 1.22 1.54
V
Schmitt trigger
Schmitt trigger
0.67
0.81
100
1.61
1.74
245
VT+
VHYS
V
141
123
127
mV
(VIHT - VILT
)
Input Leakage
IIH
µA
Note 7-6
(VIN = VSS or VDDVARIO)
-10
10
Input Capacitance
CIN
2
2
2
pF
3
Pull-Up Impedance
(VIN = VSS)
RDPU
70
70
70
KΩ
59.1
19.7
59.4
19.7
82.1
Pull-Up Current
(VIN = VSS)
IDPU
RDPD
IDPD
26
70
26
36
70
36
47
70
47
µA
KΩ
µA
61.4
82.7
61.1
Pull-Down Impedance
(VIN = VDDVARIO)
Pull-Down Current
(VIN = VDDVARIO)
VO8 Type Buffer
Low Output Level
VOL
VOH
0.4
V
V
IOL = -8 mA
IOH = 8 mA
High Output Level
VOD8 Type Buffer
VDDVARIO-0.4
Low Output Level
VO12 Type Buffer
VOL
0.4
0.4
V
IOL = -8 mA
Low Output Level
VOL
VOH
V
V
IOL = -12 mA
IOH = 12 mA
High Output Level
VOD12 Type Buffer
VDDVARIO-0.4
Low Output Level
VOL
0.4
V
V
IOL = -12 mA
IOH = 12 mA
VOS12 Type Buffer
High Output Level
VOH
VDDVARIO-0.4
2018-2019 Microchip Technology Inc.
DS00002631D-page 53
LAN7430/LAN7431
TABLE 7-6:
VARIABLE I/O DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Typ Typ Typ
1.8 2.5 3.3
Parameter
Symbol
Min
Max
Units
Notes
RGMII_I Type Buffer
Low Input Level
VIL
VIH
0.4*VDDVARIO
V
V
High Input Level
0.6*VDDVARIO
0.74
Schmitt Falling Trip Point
Schmitt Rising Trip Point
Schmitt Trigger Hysteresis
VT-
0.89 1.08 1.39
0.96 1.18 1.50
1.57
1.69
150
V
Schmitt trigger
Schmitt trigger
VT+
VHYS
0.84
V
58
66
110
122
mV
(VIHT - VILT
)
Input Leakage
(VIN = VSS or VDDVARIO)
IIH
-15
15
3
µA
pF
Input Capacitance
CIN
2
2
2
RGMII_O Type Buffer
Low Output Level
High Output Level
Output Impedance
VOL
VOH
RO
0.4
V
V
Ω
IOL = -6 mA
IOH = 6 mA
0.7*VDDVARIO
50
50
50
Note 7-6
This specification applies to all inputs and three-stated bi-directional pins.
TABLE 7-7:
1000BASE-T TRANSCEIVER CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Units
Notes
Peak Differential Output Voltage
IEEE 802.3 clause 40.6.1.2.1
VOP
670
820
mV
Note 7-7
Signal Amplitude Symmetry
IEEE 802.3 clause 40.6.1.2.1
VSS
VSC
VOD
1
2
%
Note 7-7
Note 7-8
Note 7-7
Note 7-9
Signal Scaling
IEEE 802.3 clause 40.6.1.2.1
%
Output Droop
IEEE 802.3 clause 40.6.1.2.2
73.1
%
Transmission Distortion
10
mV
IEEE 802.3 clause 40.6.1.2.4
Note 7-7
Note 7-8
Note 7-9
IEEE 802.ab Test Mode 1
From 1/2 of average VOP, Test Mode 1
IEEE 802.ab distortion processing
DS00002631D-page 54
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
TABLE 7-8:
100BASE-TX TRANSCEIVER CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Units
Notes
Peak Differential Output Voltage
ANSI X3.263 clause 9.1.2.2
VOUT
±0.95
-
±1.05
V
Note 7-10
Signal Amplitude Symmetry
ANSI X3.263 clause 9.1.4
VSS
TRF
-
-
-
2
5
%
nS
nS
nS
%
Note 7-10
Note 7-10
Note 7-10
Note 7-11
Signal Rise and Fall Time
ANSI X3.263 clause 9.1.6
3
-
Rise and Fall Symmetry
ANSI X3.263 clause 9.1.6
TRFS
DCD
VOS
0.5
±0.25
5
Duty Cycle Distortion
ANSI X3.263 clause 9.1.8
Overshoot and Undershoot
ANSI X3.263 clause 9.1.3
-
-
Output Jitter
ANSI X3.263 clause 9.1.9
0.7
0.65
1.4
nS
V
Note 7-12
Reference Voltage of ISET (using 6.04kΩ -
VSET
1% resistor)
Note 7-10
Note 7-11
Note 7-12
Measured at line side of transformer, line replaced by 100 (+/- 1%) resistor.
Offset from 16nS pulse width at 50% of pulse peak.
Peak to Peak, measured differentially.
TABLE 7-9:
10BASE-T/10BASE-Te TRANSCEIVER CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Units
Notes
Transmitter Peak Differential Output Volt-
age
VOUT
10BASE-T
2.2
2.5
2.8
V
Note 7-13
IEEE 802.3 clause 14.3.1.2.1
VOUT
10BASE-Te
1.54
1.96
3.5
V
Note 7-13
Note 7-14
Output Jitter
1.8
nS
IEEE 802.3 clause 14.3.1.2.3
Signal Rise and Fall Time
TRF
VDS
25
nS
Receiver Differential Squelch Threshold
IEEE 802.3 clause 14.3.1.3.2
300
400
mV
Note 7-15
Note 7-13
Note 7-14
Note 7-15
Min/max voltages guaranteed as measured with 100 resistive load.
Measured differentially following the twisted-pair model with a 100 resistive load.
5MHz square wave.
TABLE 7-10: PCIe TRANSCEIVER CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Units
Notes
Receiver Input Leakage
(terminations off)
III
2
µA
Transmitter Input Leakage
PCIe Clock Input Leakage
III
III
25
32
µA
nA
2018-2019 Microchip Technology Inc.
DS00002631D-page 55
LAN7430/LAN7431
7.6
AC Specifications
This section details the various AC timing specifications of the device.
Note:
Note:
The MII timing adheres to or exceeds the IEEE 802.3 specification. Refer to the IEEE 802.3 specification
for additional MII timing information.
The RGMII timing adheres to or exceeds the HP RGMII Specification Version 2.0. Refer to this specification
for additional RGMII timing information.
7.6.1
EQUIVALENT TEST LOAD
Output timing specifications assume a 25pF equivalent test load, unless otherwise noted, as illustrated in Figure 7-1.
FIGURE 7-1:
OUTPUT EQUIVALENT TEST LOAD
OUTPUT
25 pF
7.6.2
POWER SEQUENCE TIMING
This section details the device power sequencing requirements. The VDDVARIO, VDDVARIO_B, VDD_SW_IN,
VDD_REG_IN, VDD_OTP, AVDDH_1 and AVDDH_2 power supplies must all reach operational levels within the spec-
ified time period tpon, as shown in Figure 7-2. When operating with the internal regulators disabled, VDD12CORE,
AVDD12, AVDDL_1, AVDDL_2, VPH, VPTX and VP are also included in this requirement, as shown in Figure 7-3.
In addition, all of the power supplies must reach 80% of their operating voltage level within 15ms. This requirement can
be safely ignored if using an external reset as shown in Section 7.6.4.
Device power supplies can turn off in any order provided they all reach 0 volts within the specified time period tpoff
.
FIGURE 7-2:
POWER SEQUENCE TIMING (INTERNAL REGULATORS)
tpon
tpoff
VDDVARIO,
VDDVARIO_B
VDD_SW_IN, VDD_REG_IN,
VDD_OTP, AVDDH_1, AVDDH_2
DS00002631D-page 56
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
FIGURE 7-3:
POWER SEQUENCE TIMING (EXTERNAL REGULATORS)
tpon
tpoff
VDDVARIO,
VDDVARIO_B
VDD_SW_IN, VDD_REG_IN,
VDD_OTP, AVDDH_1, AVDDH_2
VDD12CORE, AVDD12, AVDDL_1,
AVDDL_2, VPH, VPTX, VP
TABLE 7-11: POWER SEQUENCING TIMING VALUES
Symbol
Description
Power supply turn on time
Min
Typ
Max
Units
tpon
tpoff
50
ms
ms
Power supply turn off time
500
7.6.3
POWER-ON CONFIGURATION STRAP TIMING
Figure 7-4 illustrates the configuration strap timing requirements, in relation to power-on, for applications where
RESET_N is not used at power-on. The operational level (Vopp) for the external power supply is detailed in Section 7.2,
"Operating Conditions**," on page 48.
FIGURE 7-4:
POWER-ON CONFIGURATION STRAP TIMING
All External
Vopp
Power Supplies
tcsh
Configuration
Strap Pins
todad
Output Drive
TABLE 7-12: POWER-ON CONFIGURATION STRAP TIMING
Symbol
Description
Min
Typ
Max
Units
tcsh
Configuration strap hold after external power supply at
operational level
22
ms
todad
Output drive after straps latched
3
µs
2018-2019 Microchip Technology Inc.
DS00002631D-page 57
LAN7430/LAN7431
7.6.4
RESET PIN CONFIGURATION STRAP TIMING
Figure 7-5 illustrates the RESET_N timing requirements and its relation to the configurations traps. Assertion of
RESET_N is not a requirement. However, if used, it must be asserted for the minimum period specified.
FIGURE 7-5:
RESET_N CONFIGURATION STRAP TIMING
trstia
RESET_N
tcss
tcsh
Configuration
Strap Pins
todad
Output Drive
TABLE 7-13: RESET_N CONFIGURATION STRAP TIMING
Symbol
Description
RESET_N input assertion time
Min
Typ
Max
Units
trstia
tcss
1
200
10
3
us
ns
ns
µs
Configuration strap setup before RESET_N deassertion
Configuration strap hold after RESET_N deassertion
Output drive after RESET_N deassertion
tcsh
todad
DS00002631D-page 58
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.6.5
MII TIMING (100BASE-TX, 10BASE-T) (LAN7431 ONLY)
This section specifies the LAN7431 MII interface transmit and receive timing.
FIGURE 7-6:
MII TRANSMIT TIMING
tclkp
tclkh tclkl
TX_CLK
tval
tval
thold
TXD[3:0],
TX_ER
thold
tval
TX_EN
TABLE 7-14: MII TRANSMIT TIMING VALUES
Symbol
Description
Min
Max
Units
Notes
tclkp
tclkh
tclkl
tval
TX_CLK period
Note 7-16
tclkp*0.4
tclkp*0.4
ns
ns
ns
ns
TX_CLK high time
TX_CLK low time
tclkp*0.6
tclkp*0.6
22.0
TXD[3:0], TX_EN, TX_ER output valid from ris-
ing edge of TX_CLK
Note 7-17
Note 7-17
thold
TXD[3:0], TX_EN, TX_ER output hold from ris-
ing edge of TX_CLK
0
ns
Note 7-16
Note 7-17
40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
Timing was designed for system load between 10 pf and 25 pf.
2018-2019 Microchip Technology Inc.
DS00002631D-page 59
LAN7430/LAN7431
FIGURE 7-7:
MII RECEIVE TIMING
tclkp
tclkh tclkl
RX_CLK
tsu thold
tsu thold
thold
RXD[3:0],
RX_ER
thold
tsu
RX_DV
TABLE 7-15: MII RECEIVE TIMING VALUES
Symbol
Description
Min
Max
Units
Notes
tclkp
tclkh
tclkl
tsu
RX_CLK period
Note 7-18
ns
ns
ns
ns
RX_CLK high time
RX_CLK low time
tclkp*0.4
tclkp*0.4
8.0
tclkp*0.6
tclkp*0.6
RXD[3:0], RX_DV, RX_ER setup time to rising
edge of RX_CLK
Note 7-19
Note 7-19
thold
RXD[3:0], RX_DV, RX_ER hold time after rising
edge of RX_CLK
9.0
ns
Note 7-18
Note 7-19
40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
Timing was designed for system load between 10 pf and 25 pf.
DS00002631D-page 60
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.6.6
RGMII TIMING (LAN7431 ONLY)
This section specifies the LAN7431 RGMII interface transmit and receive timing. The RGMII interface supports the inde-
pendent enabling/disabling of the TXC and RXC delays, each with unique timing properties. The RGMII timing with the
TXC/RXC delays enabled/disabled are detailed in the following sub-sections.
Note:
All RGMII timing specifications assume a point-to-point test circuit as defined in Figure 3 of the RGMII spec-
ification 2.0.
7.6.6.1
RGMII Transmit Timing (TXC Internal Delay Enabled - MAC Provides Delayed Clock)
FIGURE 7-8:
RGMII TRANSMIT TIMING (TXC INTERNAL DELAY ENABLED)
ttxc
tclkh tclkl
TXC
tsetup
thold
tsetup
thold
TXD
[3:0]
TXD
[7:4]
TXD[3:0]
TX_CTL
tsetup
thold
tsetup
thold
TXEN
TXER
TABLE 7-16: RGMII TRANSMIT TIMING VALUES (TXC INTERNAL DELAY ENABLED)
Symbol
Description
Min
Typ
Max
Units
ttxc
tclkh
tclkl
TXC period
Note 7-20
Note 7-23
Note 7-23
1.5
Note 7-21
Note 7-22
Note 7-24
Note 7-24
ns
%
%
ns
TXC high time
TXC low time
50
50
tsetup
TXD[3:0], TX_CTL setup time to edge of TXC
(at transmitter output)
thold
TXD[3:0], TX_CTL hold time after edge of TXC
1.5
ns
(at transmitter output)
Note 7-20
7.2ns for 1000BASE-T operation, 36ns for 100BASE-TX operation, 360ns for 10BASE-T operation.
Minimum limits are non-sustainable long term.
Note 7-21
Note 7-22
8ns for 1000BASE-T operation, 40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
8.8ns for 1000BASE-T operation, 44ns for 100BASE-TX operation, 440ns for 10BASE-T operation.
Maximum limits are non-sustainable long term.
Note 7-23
Note 7-24
45% for 1000BASE-T operation, 40% for 100BASE-TX or 10BASE-T operation.
55% for 1000BASE-T operation, 60% for 100BASE-TX or 10BASE-T operation.
2018-2019 Microchip Technology Inc.
DS00002631D-page 61
LAN7430/LAN7431
7.6.6.2
RGMII Transmit Timing (TXC Internal Delay Disabled - PCB Provides Delayed Clock)
FIGURE 7-9:
RGMII TRANSMIT TIMING (TXC INTERNAL DELAY DISABLED)
ttxc
tclkh tclkl
TXC
tskew
tskew
TXD
[3:0]
TXD
[7:4]
TXD[3:0]
TX_CTL
tskew
tskew
TXEN
TXER
TABLE 7-17: RGMII TRANSMIT TIMING VALUES (TXC INTERNAL DELAY DISABLED)
Symbol
Description
Min
Typ
Max
Units
ttxc
tclkh
tclkl
TXC period
Note 7-25
Note 7-28
Note 7-28
-400
Note 7-26
Note 7-27
Note 7-29
Note 7-29
400
ns
%
%
ps
TXC high time
TXC low time
50
50
tskew
Data to clock output skew (at transmitter output)
Note 7-25
7.2ns for 1000BASE-T operation, 36ns for 100BASE-TX operation, 360ns for 10BASE-T operation.
Minimum limits are non-sustainable long term.
Note 7-26
Note 7-27
8ns for 1000BASE-T operation, 40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
8.8ns for 1000BASE-T operation, 44ns for 100BASE-TX operation, 440ns for 10BASE-T operation.
Maximum limits are non-sustainable long term.
Note 7-28
Note 7-29
45% for 1000BASE-T operation, 40% for 100BASE-TX or 10BASE-T operation.
55% for 1000BASE-T operation, 60% for 100BASE-TX or 10BASE-T operation.
DS00002631D-page 62
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.6.6.3
RGMII Receive Timing (RXC Internal Delay Enabled - MAC Provides Delay on Clock Input)
FIGURE 7-10:
RGMII RECEIVE TIMING (RXC INTERNAL DELAY ENABLED)
trxc
tclkh tclkl
RXC
thold
thold
tsetup
tsetup
RXD
[3:0]
RXD
[7:4]
RXD[3:0]
RX_CTL
thold
thold
tsetup
tsetup
RXDV
RXER
TABLE 7-18: RGMII RECEIVE TIMING VALUES (RXC INTERNAL DELAY ENABLED)
Symbol
Description
Min
Typ
Max
Units
trxc
tclkh
tclkl
RXC period
Note 7-30
Note 7-33
Note 7-33
Note 7-31
Note 7-32
Note 7-34
Note 7-34
ns
%
%
ns
RXC high time
RXC low time
50
50
tsetup
RXD[3:0], RX_CTL setup time to edge of RXC
-0.9
Note 7-35
thold
RXD[3:0], RX_CTL hold time after edge of RXC
2.7
ns
Note 7-30
7.2ns for 1000BASE-T operation, 36ns for 100BASE-TX operation, 360ns for 10BASE-T operation.
Minimum limits are non-sustainable long term.
Note 7-31
Note 7-32
8ns for 1000BASE-T operation, 40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
8.8ns for 1000BASE-T operation, 44ns for 100BASE-TX operation, 440ns for 10BASE-T operation.
Maximum limits are non-sustainable long term.
Note 7-33
Note 7-34
Note 7-35
45% for 1000BASE-T operation, 40% for 100BASE-TX or 10BASE-T operation.
55% for 1000BASE-T operation, 60% for 100BASE-TX or 10BASE-T operation.
A negative setup means that the data can arrive after the clock.
2018-2019 Microchip Technology Inc.
DS00002631D-page 63
LAN7430/LAN7431
7.6.6.4
RGMII Receive Timing (RXC Internal Delay Disabled - PHY Provides Delayed Clock)
FIGURE 7-11:
RGMII RECEIVE TIMING (RXC INTERNAL DELAY DISABLED)
trxc
tclkh tclkl
RXC
tsetup
thold
tsetup
thold
RXD
[3:0]
RXD
[7:4]
RXD[3:0]
RX_CTL
tsetup
thold
tsetup
thold
RXDV
RXER
TABLE 7-19: RGMII RECEIVE TIMING VALUES (RXC INTERNAL DELAY DISABLED)
Symbol
Description
Min
Typ
Max
Units
trxc
tclkh
tclkl
RXC period
Note 7-36
Note 7-39
Note 7-39
0.8
Note 7-37
Note 7-38
Note 7-40
Note 7-40
ns
%
RXC high time
RXC low time
50
50
%
tsetup
thold
RXD[3:0], RX_CTL input setup to edge of RXC
RXD[3:0], RX_CTL input hold from edge of RXC
ns
ns
0.8
Note 7-36
7.2ns for 1000BASE-T operation, 36ns for 100BASE-TX operation, 360ns for 10BASE-T operation.
Minimum limits are non-sustainable long term.
Note 7-37
Note 7-38
8ns for 1000BASE-T operation, 40ns for 100BASE-TX operation, 400ns for 10BASE-T operation.
8.8ns for 1000BASE-T operation, 44ns for 100BASE-TX operation, 440ns for 10BASE-T operation.
Maximum limits are non-sustainable long term.
Note 7-39
Note 7-40
45% for 1000BASE-T operation, 40% for 100BASE-TX or 10BASE-T operation.
55% for 1000BASE-T operation, 60% for 100BASE-TX or 10BASE-T operation.
DS00002631D-page 64
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.6.7
MDIO INTERFACE TIMING (LAN7431 ONLY)
This section specifies the LAN7431 MDIO interface timing.
FIGURE 7-12:
MDIO INTERFACE TIMING
tclkp
tclkh tclkl
MDC
tohold
tval
tohold
MDIO
(Data-Out)
tsu tihold
MDIO
(Data-In)
TABLE 7-20: MDIO INTERFACE TIMING VALUES
Symbol
Description
Min
Max
Units
Notes
tclkp
tclkh
tclkl
tval
MDC period
400
ns
ns
ns
ns
Note 7-41
Note 7-41
Note 7-41
Note 7-42
MDC high time
MDC low time
180 (90%)
180 (90%)
MDIO (write to PHY) output valid from rising
edge of MDC
250
tohold
tsu
MDIO (write to PHY) output hold from rising
edge of MDC
50
70
0
ns
ns
ns
Note 7-42
Note 7-43
Note 7-43
MDIO (read from PHY) input setup time to rising
edge of MDC
tihold
MDIO (read from to PHY) input hold time after
rising edge of MDC
Note 7-41
Note 7-42
Note 7-43
The MDIO Interface outputs a nominal 400 ns clock with a 50/50 duty cycle.
The MDIO Interface changes output data a nominal 120 ns following the rising edge of MDC.
The MDIO Interface samples input data a nominal 40 ns prior to the rising edge of MDC.
2018-2019 Microchip Technology Inc.
DS00002631D-page 65
LAN7430/LAN7431
7.6.8
JTAG TIMING
This section specifies the JTAG timing of the device.
FIGURE 7-13:
JTAG TIMING
ttckp
ttckhl
ttckhl
TCK
(Input)
tsu
th
TDI, TMS
(Inputs)
tdov
tdohinvld
TDO
(Output)
TABLE 7-21: JTAG TIMING VALUES
Symbol
Description
Min
Typ
Max
Units
ttckp
ttckhl
tsu
TCK clock period
40
ttckp*0.4
10
ns
ns
ns
ns
ns
ns
TCK clock high/low time
ttckp*0.6
TDI, TMS setup to TCK rising edge
TDI, TMS hold from TCK rising edge
TDO output valid from TCK falling edge
TDO output invalid from TCK falling edge
th
10
tdov
15
tdoinvld
0
Note:
JTAG timing values are with respect to an equivalent test load of 25 pF.
DS00002631D-page 66
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
7.6.9
EEPROM TIMING
FIGURE 7-14:
EEPROM TIMING
tcsl
EECS
tckcyc
tckh tckl
tcklcsl
tcshckh
EECLK
tckldis
tckhinvld
tdvckh
EEDIO (output)
EEDIO (input)
tdsckh
tdhckh
tdhcsl
tcshdv
EEDIO (input)
(VERIFY)
TABLE 7-22: EEPROM TIMING VALUES
Symbol
Description
EECLK Cycle time
Min
Typ
Max
Units
tckcyc
tckh
1110
550
550
1070
30
1130
570
570
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
EECLK High time
EECLK Low time
tckl
tcshckh
tcklcsl
tdvckh
tckhinvld
tdsckh
tdhckh
tckldis
tcshdv
tdhcsl
tcsl
EECS high before rising edge of EECLK
EECLK falling edge to EECS low
EEDIO valid before rising edge of EECLK
EEDIO invalid after rising edge EECLK
EEDIO setup to rising edge of EECLK
EEDIO hold after rising edge of EECLK
EECLK low to data disable (OUTPUT)
EEDIO valid after EECS high (VERIFY)
EEDIO hold after EECS low (VERIFY)
EECS low
550
550
90
0
580
600
0
1070
2018-2019 Microchip Technology Inc.
DS00002631D-page 67
LAN7430/LAN7431
7.7
Clock Circuit
The device can accept either a 25MHz crystal (preferred) or a 25 MHz single-ended clock oscillator (+/- 50ppm) input.
If the single-ended clock oscillator method is implemented, XO should be left unconnected and XI should be driven with
a nominal 0-3.3V clock signal. The input clock duty cycle is 40% minimum, 50% typical and 60% maximum.
It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals
(XI/XO). See Table 7-23 for the recommended crystal specifications.
TABLE 7-23: CRYSTAL SPECIFICATIONS
Parameter
Symbol
Min
Nom
AT, typ
Fundamental Mode
Parallel Resonant Mode
Max
Units
Notes
Crystal Cut
Crystal Oscillation Mode
Crystal Calibration Mode
Frequency
Frequency Tolerance @ 25oC
Frequency Stability Over Temp
Frequency Deviation Over Time
Total Allowable PPM Budget
Shunt Capacitance
Ffund
Ftol
-
25.000
-
MHz
PPM
PPM
PPM
PPM
pF
-
-
-
-
-
-
-
+/-50
Note 7-44
Note 7-44
Note 7-45
Note 7-46
Ftemp
Fage
-
+/-50
+/-3 to 5
-
-
-
-
+/-50
CO
CL
6
Load Capacitance
25
pF
Motional Inductance
LM
PW
R1
10
mH
uW
Drive Level
-
-
100
Equivalent Series Resistance
Operating Temperature Range
XI Pin Capacitance
-
-
50
Ohm
oC
Note 7-47
-
Note 7-48
-
-
2 typ
2 typ
-
-
pF
Note 7-49
Note 7-49
XO Pin Capacitance
pF
Note 7-44
The maximum allowable values for Frequency Tolerance and Frequency Stability are application
dependent. Since any particular application must meet the IEEE +/-50 PPM Total PPM Budget, the
combination of these two values must be approximately +/-45 PPM (allowing for aging).
Note 7-45
Note 7-46
Note 7-47
Note 7-48
Note 7-49
Frequency Deviation Over Time is also referred to as Aging.
The total deviation for the Transmitter Clock Frequency is specified by IEEE 802.3u as +/- 50 PPM.
0oC for commercial version, -40oC for industrial and automotive versions.
+70oC for commercial version, +85oC for industrial version, +105°C for automotive version.
This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included
in this value. The XO/XI pin and PCB capacitance values are required to accurately calculate the
value of the two external load capacitors. These two external load capacitors determine the accuracy
of the 25.000 MHz frequency.
DS00002631D-page 68
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
8.0
8.1
PACKAGE INFORMATION
48-SQFN (LAN7430, 5.3x5.3mm Exposed Pad)
Note:
Package offerings are under review and are subject to change. For the most current package drawings,
please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
FIGURE 8-1:
48-SQFN PACKAGE (DRAWING)
2018-2019 Microchip Technology Inc.
DS00002631D-page 69
LAN7430/LAN7431
FIGURE 8-2:
48-SQFN PACKAGE (DIMENSIONS)
DS00002631D-page 70
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
8.2
72-SQFN (LAN7431, 7.9x7.9mm Exposed Pad)
Note:
Package offerings are under review and are subject to change. For the most current package drawings,
please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
FIGURE 8-3:
72-SQFN PACKAGE (DRAWING)
2018-2019 Microchip Technology Inc.
DS00002631D-page 71
LAN7430/LAN7431
FIGURE 8-4:
72-SQFN PACKAGE (DIMENSIONS)
DS00002631D-page 72
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1:
REVISION HISTORY
Revision Level & Date
Section/Figure/Entry
Correction
DS00002631D (06-25-19)
DS00002631C (04-17-19)
DS00002631B (10-24-18)
Section 7.4, "Power Consumption"
Product Identification System
Section 6.1.2, "Reference Clock"
“Preliminary” removed from tables 7-3
and 7-4.
Page modified to include automotive
part numbers.
Added the following: “PCIe architecture
defines three clock distribution methods:
common clock, data clock, and separate
clock. The LAN7430/LAN7431 devices
support the common clock method
where both end devices, such as a host
and the device, are using the same
clock source. The details of the common
clock method are provided in the PCIe
specification.”
Section 3.3, "Pin Descriptions"
Updated TEST pin description for clarity.
Cover, Section 2.1, "General Descrip- Removed references to “IEEE 1149.6”.
tion", Section 6.1, "PCI Express PHY
(PCIe PHY)"
Section 6.12.7, "Soft-Lite Reset"
Added application note regarding LRST
configuration reload.
Table 6-3, "IEEE 1149.1 Op Codes" Removed EXTEST_PULSE and
EXTEST_TRAIN entries from table.
Table 7-1, "48-SQFN Package Ther- Corrected JC velocity columns to indi-
mal Parameters" and Table 7-2, "72- cate “N/A”.
SQFN Package Thermal Parameters"
Table 7-4, "LAN7431 Power Con-
sumption"
Corrected part number in table title.
Section 6.4, "RGMII (LAN7431 Only)" Added new section.
All Initial Release.
DS00002631A (02-09-18)
2018-2019 Microchip Technology Inc.
DS00002631D-page 73
LAN7430/LAN7431
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
X
XXX
PART NO.
Device
/
XXX
Examples:
a)
b)
c)
d)
e)
f)
LAN7430/Y9X
Tape and Reel Temperature
Option
Range
Package
Automotive
Code
Tray, 0C to +70C, 48-pin SQFN
LAN7430T/Y9X
Tape & reel, 0C to +70C, 48-pin SQFN
Device:
LAN7430= PCIe to GigE Controller with Ethernet PHY
LAN7431= PCIe to GigE Controller with MII/RGMII
LAN7430-I/Y9X
Tray, -40C to +85C, 48-pin SQFN
Tape and Reel
Option:
Blank = Standard packaging (tray)
T
LAN7430T-I/Y9X
Tape & reel, -40C to +85C, 48-pin SQFN
= Tape and Reel (Note 1)
LAN7431/YXX
Tray, 0C to +70C, 72-pin SQFN
Temperature
Range:
Blank
-I
-V
=
=
=
0C to +70C (Commercial)
-40C to +85C (Industrial)
-40C to +105C (Automotive)
LAN7431T/YXX
Tape & reel, 0C to +70C, 72-pin SQFN
Package:
Y9X
YXX
=
=
48-pin SQFN (LAN7430 Only)
72-pin SQFN (LAN7431 Only)
g)
h)
i)
LAN7431-I/YXX
Tray, -40C to +85C, 72-pin SQFN
LAN7431T-I/YXX
Tape & reel, -40C to +85C, 72-pin SQFN
Automotive Code: Vxx
=
3 character code with “V” prefix,
specifying automotive product. (LAN7431 Only)
LAN7431-V/YXXVAO
Tray, -40C to +105C, 72-pin SQFN,
Automotive
j)
LAN7431T-V/YXXVAO
Tape & reel, -40C to +105C, 72-pin SQFN,
Automotive
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identi-
fier is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DS00002631D-page 74
2018-2019 Microchip Technology Inc.
LAN7430/LAN7431
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
2018-2019 Microchip Technology Inc.
DS00002631D-page 75
LAN7430/LAN7431
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch,
MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero,
motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux,
TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in
other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
All other trademarks mentioned herein are property of their respective companies.
© 2018-2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN:
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
DS00002631D-page 76
2018-2019 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Finland - Espoo
Tel: 358-9-4520-820
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Web Address:
www.microchip.com
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
Germany - Garching
Tel: 49-8931-9700
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
Germany - Haan
Tel: 49-2129-3766400
Austin, TX
Tel: 512-257-3370
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Germany - Heilbronn
Tel: 49-7131-72400
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
Germany - Karlsruhe
Tel: 49-721-625370
China - Qingdao
Philippines - Manila
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
Tel: 248-848-4000
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
Houston, TX
Tel: 281-894-5983
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
2018-2019 Microchip Technology Inc.
DS00002631D-page 77
05/14/19
相关型号：
LAN7431-V/YXXVAO
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
MICROCHIP
LAN7431/YXX
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
MICROCHIP
LAN7431T-I/YXX
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
MICROCHIP
LAN7431T-V/YXXVAO
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
MICROCHIP
LAN7431T/YXX
Low Power PCIe to Gigabit Ethernet Controller with Integrated Ethernet MAC / PHY
MICROCHIP
LAN7500-ABZJ
Serial I/O Controller, 0 Channel(s), 60MBps, CMOS, 8 X 8 MM, ROHS COMPLIANT, QFN-56
SMSC
LAN7500-ABZJ
0 CHANNEL(S), 480M bps, SERIAL COMM CONTROLLER, QCC56, 8 X 8 MM, ROHS COMPLIANT, QFN-56
MICROCHIP
LAN7500I-ABZJ
0 CHANNEL(S), 480M bps, SERIAL COMM CONTROLLER, QCC56, 8 X 8 MM, ROHS COMPLIANT, QFN-56
MICROCHIP
©2020 ICPDF网 联系我们和版权申明