LAN9255-V/ZMX020 [MICROCHIP]
2/3-Port EtherCAT® Device Controller with Integrated PHYs & SAM E53J 32-bit ARM® Cortex®-M4F MCU;
| 型号： | LAN9255-V/ZMX020 |
| 厂家： | 
MICROCHIP |
| 描述： | 2/3-Port EtherCAT® Device Controller with Integrated PHYs & SAM E53J 32-bit ARM® Cortex®-M4F MCU |
| 文件： | 总23页 (文件大小：1577K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LAN9255
2/3-Port EtherCAT® Device Controller with Integrated PHYs
& SAM E53J 32-bit ARM® Cortex®-M4F MCU
• Microchip LAN9253 2/3-Port EtherCAT Device
Highlights
-
Integrated 100Mbps Ethernet transceivers
• 2/3-port EtherCAT® device controller with 8 Fieldbus
Memory Management Units (FMMUs) and
8 SyncManagers
• Integrated ARM Cortex-M4F MCU with
1 Msps 12-bit ADC, SQSPI, USB LS/FS Host and
Device, Ethernet MAC, and PTC
-
-
-
-
-
-
Compliant with IEEE 802.3/802.3u (Fast Ethernet)
Signal Quality Index diagnostics
Loop-back modes
Automatic polarity detection and correction
HP Auto-MDIX
Compatible with EtherCAT P
-
-
EtherCAT device controller
-
-
-
Supports 8 FMMUs
• Integrated EtherCAT PHYs with HP Auto-MDIX
• EtherCAT cable diagnostic support
Supports 8 SyncManagers
Distributed clock support allows synchronization with
other EtherCAT devices
-
8K bytes of DPRAM
Host Bus Interface
Target Applications
-
SPI / SQI (Quad SPI) support at up to 60MHz
-
-
3rd port for flexible network configurations
Comprehensive power management features
• Motor Motion Control
• Process/Factory Automation
• Communication Modules, Interface Cards
• Sensors
• Hydraulic & Pneumatic Valve Systems
• Operator Interfaces
-
-
-
3 power-down levels
Wake on link status change (energy detect)
Magic packet wakeup, Wake on LAN (WoL),
wake on broadcast, wake on perfect DA
Wakeup indicator event signal
-
-
-
Power and I/O
-
-
Integrated power-on reset circuit
Latch-up performance exceeds 150mA
per EIA/JESD78, Class II
Key Benefits
-
-
-
-
JEDEC Class 3A ESD performance
Single 3.3V power supply (integrated 1.2V regulator)
Option for external power supplies
Local host allowed to enter sleep mode until addressed
by EtherCAT Host
• Microchip SAM E53J ARM Cortex-M4F
-
-
-
Memories
-
-
1 MB/512 KB/256 KB in-system programmable flash
256 KB /192 KB/128 KB SRAM main memory
Additional Features
System
-
-
-
-
-
-
EEPROM emulation
Enhanced EtherCAT cycle time
Transformer-less link support
Multifunction GPIOs
Ability to use low cost 25MHz crystal for reduced BOM
25MHz clock output for reference clock daisy chaining
-
-
Power-on Reset (POR) and Brown-out detection
Internal and external clock options
Power Supply
-
-
-
Idle, Standby, Hibernate, Backup, and Off sleep modes
SleepWalking peripherals
Embedded Buck/LDO regulator
• Packaging
-
-
Peripherals
Pb-free RoHS compliant 128-pin TQFP
(14mm x 14mm, 0.4mm pitch)
-
-
-
-
-
-
-
-
32-channel Direct Memory Access Controller (DMAC)
SD/MMC Host Controller (SDHC)
Quad I/O Serial Peripheral Interface (QSPI)
10/100 Ethernet MAC with 1588 PTP/TSU
Full-Speed USB 2.0 interface
32-channel Event System
Dual 1 MSPS 12-bit ADCs and DACs
Peripheral Touch Controller (PTC)
• Environmental
-
-
-
Commercial (0C to +70C)
Industrial (-40C to +85C)
Extended industrial (-40C to +105C)
2020-2021 Microchip Technology Inc.
DS00003646B-page 1
LAN9255
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Documentation
To obtain the most up-to-date version of this documentation, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS00003646B-page 2
2020-2021 Microchip Technology Inc.
LAN9255
Table of Contents
1.0 Preface ............................................................................................................................................................................................ 4
2.0 Introduction ..................................................................................................................................................................................... 5
3.0 LAN9255 Device Specifications ...................................................................................................................................................... 6
4.0 Pin Configuration ............................................................................................................................................................................ 8
5.0 Package Information ..................................................................................................................................................................... 16
Appendix A: Revision History .............................................................................................................................................................. 19
The Microchip Web Site ...................................................................................................................................................................... 20
Customer Change Notification Service ............................................................................................................................................... 20
Customer Support ............................................................................................................................................................................... 20
Product Identification System ............................................................................................................................................................. 21
2020-2021 Microchip Technology Inc.
DS00003646B-page 3
LAN9255
1.0
1.1
PREFACE
References
• Microchip LAN9253 Data Sheet: https://www.microchip.com/wwwproducts/en/LAN9253
• Microchip SAM E53J Data Sheet: http://ww1.microchip.com/downloads/en/DeviceDoc/60001507E.pdf
DS00003646B-page 4
2020-2021 Microchip Technology Inc.
LAN9255
2.0
INTRODUCTION
The LAN9255 is a System-In-Package (SIP) design that combines the Microchip LAN9253 2/3-port EtherCAT device
controller with dual integrated Ethernet PHYs and the Microchip SAM E53J ARM Cortex-M4F MCU into a single 128-
pin TQFP package.
The LAN9255 is available in commercial (0°C to +70°C), industrial (-40°C to +85°C), and extended industrial (-40°C to
+105°C) temperature ranges. A block diagram of the LAN9255 is provided in Figure 2-1.
Details on each integrated device (LAN9253 & SAM E53J) can be referenced via their respective data sheets, as out-
lined in Section 1.1, References. Any device specific details outside of those detailed in the respective data sheets are
provided in Section 3.0, LAN9255 Device Specifications. Pinout information for the LAN9255 is detailed in Section 4.0,
Pin Configuration.
FIGURE 2-1:
LAN9255 BLOCK DIAGRAM
2020-2021 Microchip Technology Inc.
DS00003646B-page 5
LAN9255
3.0
LAN9255 DEVICE SPECIFICATIONS
This section details device specifications that are unique to the LAN9255 and/or supersede those included in the
LAN9253 and SAM E53J data sheets.
3.1
Optimal Interfacing between LAN9253 and SAM E53J
The following guidelines will provide optimal interfacing between the internal LAN9253 and SAM E53J die.
• The following connections are required between die for SPI/QSPI operation:
TABLE 3-1:
SPI/QSPI CONNECTIONS
SPI Function
LAN9253 Pins
SAM E53J Pins
SCK
SCS#
SIO0
SIO1
SIO2
SIO3
41
101
38
40
42
33
34
35
36
26
24
71
• ESC EEPROM connected to the LAN9253 is optional
• Refer to the LAN9253 Data Sheet for information on configuration straps required to enable EEPROM emulation
• The 25MHz clock from the LAN9253 may be optionally used to feed the SAM E53J
3.2
Optimal EtherCAT Interfacing
• The EtherCAT RUN and EtherCAT ERROR LEDs can be used. Refer to the LAN9253 Data Sheet for additional
information.
3.2.1
IMPLEMENTING ETHERNET
RMII INTERFACE
TABLE 3-2:
RMII Function
Pin Name
LAN9255 Pin Number
TXEN
TXD0
TXD1
RXDV
RXD0
RXD1
RXER
MDIO
MDC
PA17
PA18
PA19
PA16
PA13
PA12
PA15
PA21
PA20
68
69
73
67
62
61
64
87
84
DS00003646B-page 6
2020-2021 Microchip Technology Inc.
LAN9255
3.3
Device ID
• The LAN9255 provides a dedicated device ID returned by the integrated SAM E53J. This enables developers to
distinguish between discrete SAM E53J implementations and those with the LAN9255. A list of the Device IDs for
the various ordering options is detailed in Table 3-3.
• The integrated LAN9253 returns its normal device ID.
TABLE 3-3:
DEVICE ID
CPP Number
Temp/MEM Size
UNG Part ID
LAN9255-V/ZMX020
LAN9255-I/ZMX020
LAN9255/ZMX020
LAN9255-V/ZMX019
LAN9255-I/ZMX019
LAN9255/ZMX019
LAN9255-V/ZMX018
LAN9255-I/ZMX018
LAN9255/ZMX018
105°C 1024k Memory
85°C 1024k Memory
70°C 1024k Memory
105°C 512k Memory
85°C 512k Memory
70°C 512k Memory
105°C 256k Memory
85°C 256k Memory
70°C 256k Memory
0x61830355
0x61830355
0x61830355
0x61830356
0x61830356
0x61830356
0x61830357
0x61830357
0x61830357
3.4
Extended Temperature Operation
As also noted in the LAN9253 Data Sheet, for the extended industrial temperature range option, the following restric-
tions apply:
• Internal regulator disabled
• 2.5V (typical) Ethernet magnetics voltage required
2020-2021 Microchip Technology Inc.
DS00003646B-page 7
LAN9255
4.0
PIN CONFIGURATION
This section provides pin assignment information for the LAN9255. Pin descriptions for the various LAN9253 and SAM
E53J functions should be referenced in their respective data sheets, as detailed in Section 1.1, References.
4.1
Pin Assignments
FIGURE 4-1:
PIN ASSIGNMENTS (TOP VIEW)
VDDIO_S
PB22
PB23
97
98
99
PA15
PA14
PA13
D4/AD4/DIGIO3/GPI3/GPO3/MII_LINK
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
PA12
VDDIO_J
D5/AD5/OUTVALID/SCS#
VDD33TXRX1
TXNA
RD/RD_WR/DIGIO15/GPI15/GPO15/MII_RXD3
WR/ENB/DIGIO14/GPI14/GPO14/MII_RXD2
A2/ALEHI/DIGIO10/GPI10/GPO10/LINKACTLED2/EE_EMUL_ALELO_POL/MII_LINKPOL/LEDPOL2
CS/DIGIO13/GPI13/GPO13/MII_RXD1
A4/BE1/DIGIO12/GPI12/GPO12/MII_RXD0
A3/BE0/DIGIO11/GPI11/GPO11/MII_RXDV
A1/ALELO/OE_EXT/MII_CLK25//EE_EMUL_SPI2
VDDCR
D10/AD10/DIGIO4/GPI4/GPO4/MII_TXEN
D11/AD11/DIGIO5/GPI5/GPO5/MII_TXD0/100FD_A
D12/AD12/DIGIO6/GPI6/GPO6/MII_TXD1/100FD_B
NC
PB15
PB14
VDDIO_J
PB13
TXPA
RXNA
RXPA
PA27
RESETN_E53
VDDCORE
VDD12TX1
RBIAS
VDD33BIAS
VDD12TX2
VSW
RXPB
RXNB
VDDIO_S
TXPB
TXNB
LAN9255
128-TQFP
116
117
(Top View)
118
119
120
121
122
123
124
125
126
127
128
PB12
PB11
PA30
PA31
PB30
PB31
D9/AD9/LATCH_IN/SCK
PB10
SYNC1/LATCH1/PME
D0/AD0/WD_STATE/SI/SIO0
VDDIOB
PA11
PA10
PA09
PA08
VSS
Connect exposed pad to ground with a via field
VDD33TXRX2
PB00
PB01
PB02
OSCI
Note:
When a “#” is used at the end of the signal name, it indicates that the signal is active low. For example,
RST# indicates that the reset signal is active low. Configuration straps are identified by an underlined sym-
bol name.
DS00003646B-page 8
2020-2021 Microchip Technology Inc.
LAN9255
Table 4-1 details the pin assignments in table format. As shown, select pin functions may change based on the device’s
mode of operation. For modes where a specific pin has no function, the table cell will be marked with “-”. The source die
and original source die pin number for each signal is also provided.
TABLE 4-1:
LAN9255
LAN9255 PIN ASSIGNMENTS
HBI Indexed HBI Multiplexed SPI with GPIO SPI with MII
Digital I/O
Source
Die
Source
Die Pin
Pin
Mode Pin NameMode Pin NameMode Pin NameMode Pin NameMode Pin Name
Number
LAN9253
SAM E53J
SAM E53J
LAN9253
SAM E53J
LAN9253
LAN9253
SAM E53J
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
LAN9253
SAM E53J
SAM E53J
LAN9253
1
2
OSCO
2
64
1
3
2
4
5
3
4
5
6
6
7
8
7
8
9
PB03
3
PA00
4
OSCVDD12
5
PA01
6
OSCVSS
7
VDD33
8
PA02
9
PA03
10
11
12
13
14
15
16
17
PB04
PB05
VDDCR
REG_EN
CLK_25/CLK_25_EN/XTAL_MODE
GNDANA
VDDANA
ERRLED/PME/100FD_B/LEDPOL4
ERRLED/
PME/
LEDPOL4
ERRLED/
100FD_B/
LEDPOL4
LAN9253
18
WAIT_ACK/PME
WAIT_ACK/PME/
EE_EMUL_SPI3
LATCH0
10
SAM E53J
SAM E53J
LAN9253
SAM E53J
SAM E53J
LAN9253
SAM E53J
LAN9253
SAM E53J
SAM E53J
LAN9253
SAM E53J
19
20
21
22
23
24
25
26
27
28
29
30
PB06
9
PB07
RST#
PB08
PB09
10
11
11
12
12
13
13
14
15
14
16
D2
AD2
AD1
SIO2/EE_EMUL_SPI0
SOF
EOF
PA04
SO/SIO1
PA05
D1
PA06
VDDIO_J
PA07
2020-2021 Microchip Technology Inc.
DS00003646B-page 9
LAN9255
TABLE 4-1:
LAN9255 PIN ASSIGNMENTS (CONTINUED)
LAN9255
Pin
Number
HBI Indexed HBI Multiplexed SPI with GPIO SPI with MII
Mode Pin NameMode Pin NameMode Pin NameMode Pin NameMode Pin Name
Digital I/O
Source
Die
Source
Die Pin
LAN9253
LAN9253
31
D14
D13
AD14
AD13
GPI8/GPO8
GPI7/GPO7
MII_TXD3/
TX_SHIFT1
DIGIO8
DIGIO7
15
16
32
MII_TXD2/
TX_SHIFT0
SAM E53J
SAM E53J
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
33
34
35
36
37
38
39
PA08
PA09
17
18
19
20
21
17
18
PA10
PA11
VDDIOB
D0
D9
AD0
SI/SIO0
WD_STATE
SYNC1/LATCH1/PME
SYNC1/
LATCH1
SAM E53J
LAN9253
SAM E53J
SAM E53J
SAM E53J
LAN9253
SAM E53J
SAM E53J
N/A
40
41
42
43
44
45
46
47
48
49
PB10
23
19
24
25
26
20
27
28
N/A
21
AD9
SCK
LATCH_IN
PB11
PB12
PB13
VDDIO_J
PB14
PB15
NC
LAN9253
D12
D11
D10
AD12
AD11
AD10
GPI6/GPO6
MII_TXD1/
100FD_B
DIGIO6
DIGIO5
DIGIO4
LAN9253
50
GPI5/GPO5
MII_TXD0/
100FD_A
22
LAN9253
LAN9253
LAN9253
51
52
53
GPI4/GPO4
MII_TXEN
23
24
25
VDDCR
-
A1
ALELO
MII_CLK25/
EE_EMUL_S
PI2
OE_EXT
LAN9253
LAN9253
54
55
A3
A4
BE0
BE1
GPI11/GPO11
MII_RXDV
MII_RXD0
DIGIO11
DIGIO12
26
27
GPI12/
GPO12
LAN9253
56
CS
GPI13/
MII_RXD1
DIGIO13
28
GPO13
DS00003646B-page 10
2020-2021 Microchip Technology Inc.
LAN9255
TABLE 4-1:
LAN9255
LAN9255 PIN ASSIGNMENTS (CONTINUED)
HBI Indexed HBI Multiplexed SPI with GPIO SPI with MII
Digital I/O
Source
Die
Source
Die Pin
Pin
Mode Pin NameMode Pin NameMode Pin NameMode Pin NameMode Pin Name
Number
LAN9253
57
A2
ALEHI/
EE_EMUL_A
LELO_POL
GPI10/
GPO10
LINKACT-
LED2/
MII_LINK-
POL/LED-
POL2
DIGIO10
29
LAN9253
LAN9253
58
59
WR/ENB
RD/RD_WR
GPI14/
GPO14
MII_RXD2
DIGIO14
DIGIO15
30
31
GPI15/
MII_RXD3
GPO15
LAN9253
SAM E53J
SAM E53J
SAM E53J
SAM E53J
SAM E53J
LAN9253
60
61
62
63
64
65
66
67
68
69
70
VDDIO_J
PA12
32
29
30
31
32
34
33
35
36
37
34
PA13
PA14
PA15
VDDIO_S
GPI9/GPO9
PA16
A0/D15
AD15
MII_RXER
DIGIO9
SAM E53J
SAM E53J
SAM E53J
LAN9253
PA17
PA18
SYNC0/LATCH0/PME
SYNC0/
LATCH0
LAN9253
LAN9253
SAM E53J
LAN9253
N/A
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
D3
D6
AD3
AD6
SIO3/EE_EMUL_SPI1
WD_TRIG
DIGIO0
35
36
GPI0/GPO0
PA19
MII_RXCLK
38
VDDIO_J
NC
37
N/A
38
LAN9253
SAM E53J
LAN9253
SAM E53J
LAN9253
LAN9253
LAN9253
LAN9253
SAM E53J
N/A
VDDCR
PB16
39
D7
D8
AD7
AD8
GPI1/GPO1
PB17
MII_MDC
MII_MDIO
DIGIO1
DIGIO2
39
40
GPI2/GPO2
TESTMODE
40
41
EESDA/TMS/EE_EMUL1
EESDA/TMS
EESCL/TCK
42
EESCL/TCK/EE_EMUL2
43
PA20
NC
41
N/A
N/A
N/A
NC
2020-2021 Microchip Technology Inc.
DS00003646B-page 11
LAN9255
TABLE 4-1:
LAN9255 PIN ASSIGNMENTS (CONTINUED)
LAN9255
Pin
Number
HBI Indexed HBI Multiplexed SPI with GPIO SPI with MII
Mode Pin NameMode Pin NameMode Pin NameMode Pin NameMode Pin Name
Digital I/O
Source
Die
Source
Die Pin
SAM E53J
LAN9253
LAN9253
87
88
89
PA21
42
44
45
IRQ
LATCH1
RUNLED/STATE_RUNLED/E2PSIZE/EE_EMUL0/LEDPOL3
RUNLED/
STATE_RUN-
LED/
E2PSIZE/
LEDPOL3
LAN9253
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
90
91
92
93
94
95
LINKACTLED1/TDI/CHIP_MODE1/LEDPOL1
46
43
44
45
47
48
PA22
PA23
PA24
VDDIO_J
LINKACTLED0/TDO/CHIP_MODE0/100FD_A/
LINKACT-
LED0/TDO/
CHIP_-
LINKACT-
LED0/TDO/
CHIP_-
LEDPOL0
MODE0/
MODE0/
LEDPOL0
100FD_A/
LEDPOL0
SAM E53J
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
LAN9253
LAN9253
LAN9253
LAN9253
LAN9253
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
LAN9253
LAN9253
SAM E53J
LAN9253
96
PA25
VDDIO_S
PB22
46
48
49
50
49
50
51
52
53
54
55
51
52
53
56
57
58
59
55
60
97
98
99
PB23
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
D4
D5
AD4
AD5
GPI3/GPO3
SCS#
MII_LINK
DIGIO3
OUTVALID
VDD33TXRX1
TXNA
TXPA
RXNA
RXPA
PA27
RESETN_E53
VDDCORE
VDD12TX1
RBIAS
VDD33BIAS
VDD12TX2
VSW
RXPB
DS00003646B-page 12
2020-2021 Microchip Technology Inc.
LAN9255
TABLE 4-1:
LAN9255
LAN9255 PIN ASSIGNMENTS (CONTINUED)
HBI Indexed HBI Multiplexed SPI with GPIO SPI with MII
Digital I/O
Source
Die
Source
Die Pin
Pin
Mode Pin NameMode Pin NameMode Pin NameMode Pin NameMode Pin Name
Number
LAN9253
SAM E53J
LAN9253
LAN9253
SAM E53J
SAM E53J
SAM E53J
SAM E53J
LAN9253
SAM E53J
SAM E53J
SAM E53J
LAN9253
LAN9253
SAM E53J
116
117
118
119
120
121
122
123
124
125
126
127
128
RXNB
VDDIO_S
TXPB
61
56
62
63
57
58
59
60
64
61
62
63
1
TXNB
PA30
PA31
PB30
PB31
VDD33TXRX2
PB00
PB01
PB02
OSCI
Exposed
Pad
VSS
ePad
22,33,
47,54
2020-2021 Microchip Technology Inc.
DS00003646B-page 13
LAN9255
4.1.1
INTERNAL PIN MAPPING
Figure 4-2 and Figure 4-3 detail the LAN9255 internal pin mappings between the integrated LAN9253 and SAM E53J,
respectively.
FIGURE 4-2:
LAN9253 INTERNAL PIN MAPPING
LAN9255
LAN9253
1
2
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
128
1
66
A0/D15/AD15/DIGIO9/GPI9/
GPO9/MII_RXER
A0/D15/AD15/DIGIO9/GPI9/
GPO9/MII_RXER
OSCI
OSCO
OSCI
70
OSCO
SYNC0/LATCH0/PME
SYNC0/LATCH0/PME
3
4
71
D3/AD3/WD_TRIG/SIO3/
EE_EMUL_SPI1
D3/AD3/WD_TRIG/SIO3/
EE_EMUL_SPI1
OSCVDD12
OSCVSS
VDD33
OSCVDD12
OSCVSS
VDD33
4
6
72
D6/AD6/DIGIO0/GPI0/GPO0/
MII_RXCLK
D6/AD6/DIGIO0/GPI0/GPO0/
MII_RXCLK
5
7
74
VDDIO
VDDIO_J
VDDCR
6
12
13
14
17
18
21
24
26
29
31
32
38
39
41
45
49
50
51
52
53
54
55
56
57
58
59
60
76
VDDCR
VDDCR
REG_EN
VDDCR
7
78
D7/AD7/DIGIO1/GPI1/GPO1/
MII_MDC
D7/AD7/DIGIO1/GPI1/GPO1/
MII_MDC
REG_EN
8
80
CLK_25/CLK_25_EN/
XTAL_MODE
CLK_25/CLK_25_EN/
XTAL_MODE
D8/AD8/DIGIO2/GPI2/GPO2/
MII_MDIO
D8/AD8/DIGIO2/GPI2/GPO2/
MII_MDIO
9
81
ERR_LED/PME/100FD_B/
LEDPOL4
ERR_LED/PME/100FD_B/
LEDPOL4
TESTMODE
EESDA/TMS/EE_EMUL1
EESCL/TCK/EE_EMUL2
IRQ/LATCH1
TESTMODE
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
82
WAIT_ACK/PME/LATCH0/
EE_EMUL_SPI3
WAIT_ACK/PME/LATCH0/
EE_EMUL_SPI3
EESDA/TMS/EE_EMUL1
EESCL/TCK/EE_EMUL2
IRQ/LATCH1
83
RST#
RST#
88
D2/AD2/SOF/SIO2/
EE_EMUL_SPI0
D2/AD2/SOF/SIO2/
EE_EMUL_SPI0
89
RUNLED/STATERUN_LED/
E2PSIZE/EE_EMUL0/LEDPOL3
RUNLED/STATERUN_LED/
E2PSIZE/EE_EMUL0/LEDPO L3
D1/AD1/EOF/SO/SIO1
VDDIO_J
D1/AD1/EOF/SO/SIO1
VDDIO
90
LINKACTLED1/TDI/
CHIP_MODE1/LEDPOL1
LINKACTLED1/TDI/
CHIP_MODE1/LEDPOL1
94
D14/AD14/DIGIO8/GPI8/GPO8/
MII_TXD3/TX_SHIFT1
D14/AD14/DIGIO8/GPI8/GPO8/
MII_TXD3/TX_SHIFT1
VDDIO
VDDIO_J
95
D13/AD13/DIGIO7/GPI7/GPO7/
MII_TXD2/TX_SHIFT0
D13/AD13/DIGIO7/GPI7/GPO7/
MII_TXD2/TX_SHIFT0
LINKACTLED0/TDO/
LINKACTLED0/TDO/
CHIP_MODE0/100FD_A/LEDPOL0
CHIP_MODE0/100FD_A/LEDPOL0
100
101
102
103
104
105
106
110
111
112
113
115
116
118
119
124
D4/AD4/DIGIO3/GPI3/GPO3/
MII_LINK
D4/AD4/DIGIO3/GPI3/GPO3/
MII_LINK
D0/AD0/WD_STATE/SI/SIO0
SYNC1/LATCH1/PME
D9/AD9/LATCH_IN/SCK
VDDIO_J
D0/AD0/WD_STATE/SI/SIO0
SYNC1/LATCH1/PME
D9/AD9/LATCH_IN/SCK
VDDIO
D5/AD5/OUTVALID/SCS#
VDD33TXRX1
TXNA
D5/AD5/OUTVALID/SCS#
VDD33TXRX1
TXNA
D12/AD12/DIGIO6/GPI6/GPO6/
MII_TXD1/100FD_B
D12/AD12/DIGIO6/GPI6/GPO6/
MII_TXD1/100FD_B
TXPA
TXPA
D11/AD11/DIGIO5/GPI5/GPO5/
MII_TXD0/100FD_A
D11/AD11/DIGIO5/GPI5/GPO5/
MII_TXD0/100FD_A
RXNA
RXNA
D10/AD10/DIGIO4/GPI4/GPO4/
MII_TXEN
D10/AD10/DIGIO4/GPI4/GPO4/
MII_TXEN
RXNP
RXNP
VDDCR
VDDCR
VDD12TX1
RBIAS
VDD12TX1
RBIAS
A1/ALELO/OE_EXT/
MII_CLK25/EE_EMUL_SPI2
A1/ALELO/OE_EXT/
MII_CLK25/EE_EMUL_SPI2
A3/BE0/DIGIO11/GPI11/GPO11/
MII_RXDV
A3/BE0/DIGIO11/GPI11/GPO11/
MII_RXDV
VDD33BIAS
VDD12TX2
RXPB
VDD33BIAS
VDD12TX2
RXPB
A4/BE1/DIGIO12/GPI12/GPO12/
MII_RXD0
A4/BE1/DIGIO12/GPI12/GPO12/
MII_RXD0
CS/DIGIO13/GPI13/GPO13/
MII_RXD1
CS/DIGIO13/GPI13/GPO13/
MII_RXD1
A2/ALEHI/DIGIO10/GPI10/GPO10/LINKACTLED2/
EE_EMUL_ALELO_POL/MII_LINKPOL/LEDPOL2
A2/ALEHI/DIGIO10/GPI10/GPO10/LINKACTLED2/
EE_EMUL_ALELO_POL/MII_LINKPOL/LEDPOL2
RXNB
TXPB
RXNB
WR/ENB/DIGIO14/GPI14/
GPO14/MII_RXD2
WR/ENB/DIGIO14/GPI14/
GPO14/MII_RXD2
TXPB
RD/RD_WR/DIGIO15/GPI15/
GPO15/MII_RXD3
RD/RD_WR/DIGIO15/GPI15/
GPO15/MII_RXD3
TXNB
TXNB
VDDIO_J
VDDIO
VDD33TXRX2
VDD33TXRX2
VSS
85
86
Exposed Pad
NC
NC
DS00003646B-page 14
2020-2021 Microchip Technology Inc.
LAN9255
FIGURE 4-3:
SAM E53J INTERNAL PIN MAPPING
LAN9255
SAM E53J
1
2
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
3
5
PA00
PA01
PA00
PA01
PA02
PA03
PB04
PB05
GND
VDDIO
PA16
65
67
68
69
73
77
79
84
87
91
92
93
96
VDDIO_S
3
8
PA02
PA16
PA17
PA18
PA19
PB19
PB17
PA20
PA21
PA22
PA23
PA24
PA25
4
9
PA03
PA17
5
10
11
15
16
19
20
22
23
25
27
28
30
33
34
35
36
37
PB04
PA18
6
PB05
PA19
7
GNDANA
VDDANA
PB06
GNDANA
VDDANA
PB06
PB07
PB08
PB09
PA04
PA05
PA06
PA07
PA08
PA09
PA10
PA11
VDDIOB
GND
PB19
8
PB17
9
PA20
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PB07
PA21
PB08
PA22
PB09
PA23
PA04
PA24
PA05
PA25
PA06
GND
97
PA07
VDDIO
PB22
VDDIO_S
PB22
98
PA08
99
PA09
PB23
PB23
107
108
109
PA10
PA27
PA27
PA11
RESETN
VDDCORE
GND
RESETN_E53
VDDCORE
VDDIOB
40
42
43
44
46
47
61
62
63
64
114
117
120
121
122
123
125
126
127
2
PB10
PB11
PB12
PB13
PB14
PB15
PA12
PA13
PA14
PA15
PB10
PB11
PB12
PB13
PB14
PB15
PA12
PA13
PA14
PA15
VSW
VSW
VDDIO_S
PA30
PA31
PB30
PB31
PB00
PB01
PB02
PB03
VDDIO
PA30
PA31
PB30
PB31
PB00
PB01
PB02
PB03
48
75
Exposed Pad
NC
NC
2020-2021 Microchip Technology Inc.
DS00003646B-page 15
LAN9255
5.0
PACKAGE INFORMATION
Note:
For the most current package drawings, see the Microchip Packaging Specification at
http://www.microchip.com/packaging.
FIGURE 5-1:
128-TQFP PACKAGE (DRAWING)
D
D1
128X
D
2
D1
2
0.08 C
D
96
33
97
64
E
2
A
B
E1 E
A
A
D1
2
NOTE 1
128
33
4X 32 TIPS
1
1
3
3
32
32
2
2
0.20 C A–B D
0.20 C A–B D 4X
A1
A2
A
TOP VIEW
0.05
D2
SEATING
PLANE
C
128
33
SIDE VIEW
NOTE 1
E2
97
64
96
33
e
2
128X b
0.07
C A–B
D
e
BOTTOM VIEW
Microchip Technology Drawing C04-502 Rev A Sheet 1 of 2
DS00003646B-page 16
2020-2021 Microchip Technology Inc.
LAN9255
FIGURE 5-2:
128-TQFP PACKAGE (DIMENSIONS)
T
2
T
1
R
H
R1
c
T
3
T
L
L1
SECTION A-A
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
Lead Pitch
N
e
128
0.40 BSC
Overall Height
Standoff
Molded Package Thickness
Overall Length
A
A1
A2
D
-
-
1.20
0.15
1.05
0.05
0.95
0.10
1.00
16.00 BSC
Molded Package Length
Exposed Pad Length
Overall Width
D1
D2
E
14.00 BSC
9.00
16.00 BSC
8.90
9.10
Molded Package Width
Exposed Pad Width
Lead Width
Lead Thickness
Foot Length
Footprint
Foot Angle
Lead Angle
Mold Draft Angle Top
Mold Draft Angle Bottom
Lead Bend Radius
Lead Bend Radius
E1
E2
b
14.00 BSC
8.90
0.13
0.09
0.45
9.00
0.16
-
0.60
1.00 REF
9.10
0.23
0.20
0.75
c
L
L1
T
ș1
ș2
ș3
R
0°
0°
11°
11°
0.08
0.08
-
-
7°
-
13°
13°
-
12°
12°
-
R1
-
0.20
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-181 Rev A Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS00003646B-page 17
LAN9255
FIGURE 5-3:
128-TQFP PACKAGE (LAND PATTERN)
C1
X2
EV
96
65
SILK SCREEN
ØV
97
64
EV
C2 Y2
G2
G1
Y1
128
33
1
3
32
2
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
0.40 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
Contact Pad Spacing
Contact Pad Width (X128)
Contact Pad Length (X128)
X2
Y2
C1
C2
X1
Y1
9.10
9.10
15.40
15.40
0.20
1.50
Contact Pad to Center Pad (X128) G1
Contact Pad to Contact Pad (X124) G2
2.40
0.20
Thermal Via Diameter
Thermal Via Pitch
V
EV
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2502 Rev A
DS00003646B-page 18
2020-2021 Microchip Technology Inc.
LAN9255
APPENDIX A: REVISION HISTORY
TABLE A-1:
REVISION HISTORY
Revision Level
Section/Figure/Entry
Correction
- Changed “EtherCAT Master” to “EtherCAT Host” in features
- Title of Table 3-2 changed from “RGMII Interface” to “RMII
Interface”, first column heading changed from “RGMII Function”
to “RMII Function”
- Removed “slave” and replaced with “device” in Figure 2-1.
- Added the following sentence to the end of the first bullet in
Section 3.3 Device ID:
DS00003646B
(04-09-21)
“A list of the Device IDs for the various ordering options is
detailed in Table 3-3, “Device ID”
- Added Table 3-3, “Device ID”
- Removed “Confidential - NDA Required” nomenclature from
footer.
DS00003646A
(09-15-20)
All
Initial Release
2020-2021 Microchip Technology Inc.
DS00003646B-page 19
LAN9255
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site con-
tains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this docu-
ment.
Technical support is available through the web site at: http://microchip.com/support
DS00003646B-page 20
2020-2021 Microchip Technology Inc.
LAN9255
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X]
[-X]
XXX
/
XXX
PART NO.
Device
Examples:
a)
b)
c)
d)
e)
f)
LAN9255/ZMX018
Standard Packaging (Tray),
Commercial Temperature,
Tape and Reel Temperature
Option
Range
Package
Mem. Cfg.
128-pin TQFP, 256K Memory
Device:
LAN9255
LAN9255-I/ZMX019
Standard Packaging (Tray)
Industrial Temperature,
128-pin TQFP, 512K Memory
Tape and Reel
Option:
Blank = Standard packaging (Tray)
T
= Tape and Reel(Note 1)
LAN9255-V/ZMX020
Standard Packaging (Tray)
Extended Industrial Temperature,
128-pin TQFP, 1024K Memory
Temperature
Range:
Blank
I
V
=
=
=
0C to +70C (Commercial)
-40C to +85C (Industrial)
-40C to +105C (Extended Industrial)
LAN9255T/ZMX018
Tape and Reel
Commercial Temperature,
128-pin TQFP, 256K Memory
Package:
ZMX
=
128-pin TQFP (9.0mm ePad)
Mem. Config:
018
019
020
=
=
=
256K Programmable Memory
512K Programmable Memory
1024K Programmable Memory
LAN9255T-I/ZMX019
Tape and Reel
Industrial Temperature,
128-pin TQFP, 512K Memory
LAN9255T-V/ZMX020
Tape and Reel
Extended Industrial Temperature,
128-pin TQFP, 1024K Memory
Note 1:
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Check with your Microchip Sales Office for
package availability with the Tape and Reel
option.
2020-2021 Microchip Technology Inc.
DS00003646B-page 21
LAN9255
Note the following details of the code protection feature on Microchip devices:
•
•
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device
applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application
meets with your specifications.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND
WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT
NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE
OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE,
COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP
HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW,
MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THEAMOUNT
OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or
safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages,
claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch,
MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo,
PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero,
motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux,
TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net,
PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in
other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali,
Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro,
µVision, Versatile are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.
All other trademarks mentioned herein are property of their respective companies.
© 2020-2021, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 9781522477044
For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
DS00003646B-page 22
2020-2021 Microchip Technology Inc.
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
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Tel: 61-2-9868-6733
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Tel: 91-80-3090-4444
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Germany - Heilbronn
Tel: 49-7131-72400
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Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Nanjing
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Tel: 60-4-227-8870
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Tel: 49-721-625370
China - Qingdao
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Tel: 86-532-8502-7355
Tel: 63-2-634-9065
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Itasca, IL
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Fax: 630-285-0075
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Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
Germany - Rosenheim
Tel: 49-8031-354-560
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Israel - Ra’anana
Tel: 972-9-744-7705
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
Detroit
Novi, MI
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China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Padova
Tel: 39-049-7625286
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Tel: 281-894-5983
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Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
Norway - Trondheim
Tel: 47-7288-4388
China - Zhuhai
Tel: 86-756-3210040
Poland - Warsaw
Tel: 48-22-3325737
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Raleigh, NC
Tel: 919-844-7510
Sweden - Gothenberg
Tel: 46-31-704-60-40
New York, NY
Tel: 631-435-6000
Sweden - Stockholm
Tel: 46-8-5090-4654
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
2020-2021 Microchip Technology Inc.
DS00003646B-page 23
02/28/20
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