MCP101-485I/TO [MICROCHIP]

1-CHANNEL POWER SUPPLY SUPPORT CKT, PBCY3, TO-92, 3 PIN;
MCP101-485I/TO
型号: MCP101-485I/TO
厂家: MICROCHIP    MICROCHIP
描述:

1-CHANNEL POWER SUPPLY SUPPORT CKT, PBCY3, TO-92, 3 PIN

文件: 总16页 (文件大小:221K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MCP100/101  
Microcontroller Supervisory Circuit with Push-Pull Output  
FEATURES  
PACKAGES  
TO-92 with ‘D’ Bondout  
• Holds microcontroller in reset until supply voltage  
reaches stable operating level  
• Resets microcontroller during power loss  
• Precision monitoring of 3V, 3.3V and 5V systems  
• 7 voltage trip points available  
RST  
or  
RST  
VSS  
VDD  
• Active low RESET pin (MCP100/101) or active  
high RESET (DSTEMP)  
• Push-pull output  
TO-92 with ‘H’ Bondout  
• Holds RESET/RESET for 350 ms (typical)  
• RESET/RESET to VDD = 1.0V  
• Accuracy of ±125 mV for 5V systems and ±75 mV  
for 3V systems over temperature  
VDD  
VSS  
• 45 µA typical operating current  
Temperature range:  
RST  
or  
RST  
- Industrial (I): -40°C to +85°C  
DESCRIPTION  
SOT-23-3  
The Microchip Technology Inc. MCP100/101 is a volt-  
age supervisory device designed to keep a microcon-  
troller in reset until the system voltage has reached the  
proper level and stabilized. It also operates as protec-  
tion from brown-out conditions when the supply voltage  
drops below a safe operating level. Both devices are  
available with a choice of seven different trip voltages  
and both have push-pull outputs. The MCP100/101 has  
a low active RESET pin and the DSTEMP has a high  
active RESET pin. The MCP100/101 will assert the  
RESET/RESET signal whenever the voltage on the  
VDD pin is below the trip-point voltage.  
RST  
or  
RST  
VDD  
VSS  
BLOCK DIAGRAM  
VDD  
Comparator  
+
-
Delay  
Circuit  
Output  
Driver  
RESET  
or  
RESET  
Bandgap  
Reference  
2001 Microchip Technology Inc.  
DS11187E-page 1  
MCP100/101  
1.0  
1.1  
ELECTRICAL CHARACTERISTICS  
*Notice: Stresses above those listed under Maximum  
Ratingsmay cause permanent damage to the device.  
This is a stress rating only and functional operation of  
the device at those or any other conditions above those  
indicated in the operational listings of this specification  
is not implied. Exposure to maximum rating conditions  
for extended periods may affect device reliability.  
Maximum Ratings*  
VDD........................................................................7.0V  
All inputs and outputs w.r.t. VSS .....-0.6V to VDD +1.0V  
Storage temperature ..........................-65°C to +150°C  
Ambient temp. with power applied .....-65°C to +125°C  
ESD protection on all pins ..................................... ≥ 2 kV  
DC AND AC CHARACTERISTICS  
All parameters apply at the specified VDD= 1.0 - 5.5V  
temp and voltage ranges unless  
otherwise noted.  
Industrial (I):  
-40°C to +85°C  
Parameter  
Symbol  
Min. Typ. Max. Units  
Test Conditions  
Operating Voltage Range  
VDD Value to RESET/RESET  
Operating Current  
VDD  
1.0  
1.0  
45  
5.5  
V
V
VDD  
MIN  
IDD  
60  
µA  
V
VDD = 5.5V (no load)  
VDD Trip Point  
MCP10X-270  
VTRIP  
2.55  
2.85  
3.0  
4.25  
4.35  
4.50  
4.60  
2.625 2.7  
2.925 3.0  
3.075 3.15  
4.375 4.50  
4.475 4.60  
4.625 4.75  
4.725 4.85  
MCP10X-300  
MCP10X-315  
MCP10X-450  
MCP10X-460  
MCP10X-475  
MCP10X-485  
RESET Low Level  
Output Voltage  
(MCP100)  
MCP100-270  
MCP100-300  
MCP100-315  
VOL  
0.4  
V
IOL = 3.2 mA,  
VDD = VTRIP  
MIN  
MCP100-450  
MCP100-460  
MCP100-475  
MCP100-485  
0.6  
IOL = 8.5 mA,  
VDD = VTRIP  
MIN  
RESET High Level  
Output Voltage  
(MCP100)  
MCP100-XXX  
(All VTRIP Points)  
VOH  
VOL  
VDD-0.7  
V
V
IOH = 3 mA,  
VDD > VTRIP  
MAX  
RESET Low Level  
Output Voltage  
(MCP101)  
MCP101-270  
MCP101-300  
MCP101-315  
0.4  
0.6  
IOL = 3.2 mA,  
VDD > VTRIP  
MAX  
MCP101-450  
MCP101-460  
MCP101-475  
MCP101-485  
IOL = 8.5 mA,  
VDD > VTRIP  
MAX  
RESET High level  
Output Voltage  
(MCP101)  
MCP101-XXX  
(All VTRIP Points)  
VOH  
VDD-0.7  
V
IOH = 3 mA,  
VDD = VTRIP  
MIN  
Threshold Hysteresis  
VHYS  
tRPU  
50  
mV  
ms  
VDD Detect to RESET/RESET  
Inactive  
150  
350  
700  
VDD Detect to RESET/RESET  
tRPD  
10  
µs  
VDD ramped from  
VTRIPMAX + 250 mV down to  
VTRIPMIN - 250 mV  
DS11187E-page 2  
2001 Microchip Technology Inc.  
MCP100/101  
VTRIP  
VDD  
tRPU  
tRPD  
VOL  
VOH  
VOL  
RESET  
(MCP100)  
RESET  
(MCP101)  
Figure 1-1: MCP100/101 Timing Diagram  
2001 Microchip Technology Inc.  
DS11187E-page 3  
MCP100/101  
2.0  
2.1  
APPLICATIONS INFORMATION  
The Need for Supervisory Circuits  
5V  
For many of todays microcontroller applications, care  
must be taken to prevent low power conditions that  
can cause many different system problems. The most  
common causes are brown-out conditions where the  
system supply drops below the operating level momen-  
tarily, and the second, is when a slowly decaying power  
supply causes the microcontroller to begin executing  
instructions without enough voltage to sustain SRAM  
and producing indeterminate results.  
VTRIP  
VTRIP  
MAX  
MIN  
(VTRIPMIN - VDD)  
Transient  
Duration  
0
TIME  
0
VDD  
VDD  
Microcontroller  
VDD  
Bypass  
Capacitor  
10  
8
MCP100  
TA = +25°C  
VSS  
MCLR  
or  
RESET  
RST  
6
Transients above the  
curve will cause a reset  
4
VSS  
2
Transients below  
the curve will NOT  
cause a reset  
0
0
1
2
3
4
5
Figure 2-1: Typical Application  
2.2 Negative Going VDD Transients  
VTRIP - VDD (V)  
Many system designers implementing POR circuits are  
concerned about the minimum pulse width required  
to cause a reset. Figure 2-2 shows typical transient  
duration vs. reset comparator overdrive for which the  
MCP100/101 will not generate a reset pulse. It shows  
that the farther below the trip point the transient pulse  
goes, the duration of the pulse required to cause a  
reset gets shorter. A 0.1 µF bypass cap mounted as  
close as possible to the VDD pin provides additional  
transient immunity.  
Figure 2-2: Typical Transient Response  
DS11187E-page 4  
2001 Microchip Technology Inc.  
MCP100/101  
2.3  
Effect of Temperature on Timeout  
Period (tRPU)  
1.002  
1.000  
0.998  
0.996  
0.994  
0.992  
0.997  
The timeout period (tRPU) determines how long the  
device remains in the reset condition. This is controlled  
by an internal RC timer and is effected by both VDD  
and temperature. The graph shown in Figure 2-3  
shows typical response for different VDD values and  
temperatures.  
700  
600  
VDD = 6V  
-40 -20  
0
20  
40  
60  
80 100  
500  
TEMPERATURE (°C)  
VDD = 5V  
*Multiply value at 25°C by this  
factor to determine the value at  
temperature  
400  
300  
VDD = 4V  
Figure 2-5: Normalized VTRIP vs. Temperature  
200  
100  
VDD = 3V  
800  
-40 -20  
0
20  
40  
60  
80 100  
VDD = 2.5V  
TEMPERATURE (°C)  
700  
VDD = 1.5V  
VDD = 3.5V  
600  
Figure 2-3: Typical tRPU vs. Temperature  
500  
400  
VDD = 4.5V  
60  
300  
200  
VDD = 5V  
50  
VDD = 5.5V  
100  
TA = +25°C  
40  
0
0
2
4
6
8
10 12 14 16 18 20  
30  
IOL (mA)  
VDD = 3V  
VDD = 4V  
20  
Figure 2-6: VOL vs. IOL  
10  
0
-40 -20  
0
20  
40  
60  
80 100  
TEMPERATURE (°C)  
Figure 2-4: IDD vs. Temperature  
2001 Microchip Technology Inc.  
DS11187E-page 5  
MCP100/101  
1.3  
1.2  
1.08  
1.06  
1.04  
1.02  
1.00  
0.98  
0.96  
0.94  
0.92  
0.90  
0.88  
1.1  
VDD = 4.5V  
IOH = 8.5mA  
1.00  
0.9  
VDD = 3V  
IOH = 3.2mA  
0.8  
0.7  
-40 -20  
0
20  
40  
60  
80 100  
-40 -20  
0
20  
40  
60  
80 100  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
*Multiply value at 25°C by this  
factor to determine the value at  
temperature  
*Multiply value at 25°C by this  
factor to determine the value at  
temperature  
Figure 2-7: Normalized IOL vs. Temperature  
Figure 2-9: Normalized VOH vs. Temperature  
800  
VDD = 2.5V  
VDD = 3.5V  
700  
600  
500  
400  
VDD = 5V  
300  
200  
100  
TA = +25°C  
0
0
2
4
6
8
10  
IOH (mA)  
Figure 2-8: VDD - VOH vs. IOH  
DS11187E-page 6  
2001 Microchip Technology Inc.  
MCP100/101  
3.0  
3.1  
PACKAGING INFORMATION  
Package Marking Information  
3-Lead Plastic Transistor Outline (TO-92)  
Example:  
XXXXXX  
XXXXXX  
XXXXXX  
YWWNNN  
MCP100  
XXXXXX  
XXXXXX  
YWWNNN  
3-Lead Plastic Small Outline Transistor (SOT23)  
Example:  
XXNN  
RKNN  
SOT23 PARTS LABELING:  
The table below identifies the first 2 characters (XX) in the 4-character field  
(XXNN) for marking of the 3-Lead SOT23 package.  
Mark  
Part Number  
Mark  
Part Number  
QJ  
QK  
QL  
MCP100T-270I/TT  
MCP100T-300I/TT  
MCP100T-315I/TT  
MCP100T-450I/TT  
MCP100T-460I/TT  
MCP100T-475I/TT  
MCP100T-485I/TT  
RJ  
RK  
RL  
MCP101T-270I/TT  
MCP101T-300I/TT  
MCP101T-315I/TT  
MCP101T-450I/TT  
MCP101T-460I/TT  
MCP101T-475I/TT  
MCP101T-485I/TT  
QM  
QN  
QO  
QP  
RM  
RN  
RO  
RP  
Legend: XX...X  
Customer specific information*  
YY  
WW  
NNN  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week 01)  
Alphanumeric traceability code  
Note:  
In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line thus limiting the number of available characters  
for customer specific information.  
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.  
For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.  
For QTP devices, any special marking adders are included in QTP price.  
2001 Microchip Technology Inc.  
DS11187E-page 7  
MCP100/101  
3.2  
Package Detail Information  
3-Lead Plastic Transistor Outline (TO) (TO-92)  
E1  
D
n
1
L
1
2
3
α
B
p
c
A
R
β
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
3
MAX  
n
p
Number of Pins  
3
Pitch  
.050  
.143  
.186  
.183  
.090  
.555  
.017  
.019  
5
1.27  
Bottom to Package Flat  
Overall Width  
A
E1  
D
R
L
.130  
.155  
3.30  
4.45  
3.62  
4.71  
4.64  
2.29  
14.10  
0.43  
0.48  
5
3.94  
.175  
.170  
.085  
.500  
.014  
.016  
4
.195  
.195  
.095  
.610  
.020  
.022  
6
4.95  
4.95  
2.41  
15.49  
0.51  
0.56  
6
Overall Length  
4.32  
2.16  
12.70  
0.36  
0.41  
4
Molded Package Radius  
Tip to Seating Plane  
Lead Thickness  
Lead Width  
c
B
α
Mold Draft Angle Top  
Mold Draft Angle Bottom  
β
2
3
4
2
3
4
*Controlling Parameter  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010(0.254mm) per side.  
JEDEC Equivalent: TO-92  
Drawing No. C04-101  
DS11187E-page 8  
2001 Microchip Technology Inc.  
MCP100/101  
3-Lead Plastic Small Outline Transistor (TT) (SOT23)  
E
E1  
2
B
p1  
D
n
p
1
α
c
A
A2  
A1  
φ
β
L
Units  
INCHES*  
NOM  
MILLIMETERS  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
MAX  
n
p
Number of Pins  
3
3
Pitch  
.038  
.076  
.040  
.037  
.002  
.093  
.051  
.115  
.018  
5
0.96  
1.92  
1.01  
0.95  
0.06  
2.37  
1.30  
2.92  
0.45  
5
p1  
Outside lead pitch (basic)  
Overall Height  
A
A2  
A1  
E
.035  
.044  
0.89  
1.12  
Molded Package Thickness  
.035  
.000  
.083  
.047  
.110  
.014  
0
.040  
.004  
.104  
.055  
.120  
.022  
10  
0.88  
0.01  
2.10  
1.20  
2.80  
0.35  
0
1.02  
0.10  
2.64  
1.40  
3.04  
0.55  
10  
Standoff  
§
Overall Width  
Molded Package Width  
Overall Length  
E1  
D
Foot Length  
L
φ
Foot Angle  
c
Lead Thickness  
Lead Width  
.004  
.015  
0
.006  
.017  
5
.007  
.020  
10  
0.09  
0.37  
0
0.14  
0.44  
5
0.18  
0.51  
10  
B
α
β
Mold Draft Angle Top  
Mold Draft Angle Bottom  
0
5
10  
0
5
10  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010(0.254mm) per side.  
JEDEC Equivalent: TO-236  
Drawing No. C04-104  
2001 Microchip Technology Inc.  
DS11187E-page 9  
MCP100/101  
Systems Information and Upgrade Hot Line  
ON-LINE SUPPORT  
The Systems Information and Upgrade Line provides  
system users a listing of the latest versions of all of  
Microchip's development systems software products.  
Plus, this line provides information on how customers  
can receive any currently available upgrade kits.The  
Hot Line Numbers are:  
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ConnectingtotheMicrochipInternetWebSite  
The Microchip web site is available by using your  
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The file transfer site is available by using an FTP ser-  
vice to connect to:  
ftp://ftp.microchip.com  
The web site and file transfer site provide a variety of  
services. Users may download files for the latest  
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Users Guides, Articles and Sample Programs. A vari-  
ety of Microchip specific business information is also  
available, including listings of Microchip sales offices,  
distributors and factory representatives. Other data  
available for consideration is:  
Latest Microchip Press Releases  
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Design Tips  
Device Errata  
Job Postings  
Microchip Consultant Program Member Listing  
Links to other useful web sites related to  
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Conferences for products, Development Systems,  
technical information and more  
Listing of seminars and events  
DS11187E-page 10  
2001 Microchip Technology Inc.  
MCP100/101  
READER RESPONSE  
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-  
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation  
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-7578.  
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.  
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RE:  
From:  
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Telephone: (_______) _________ - _________  
FAX: (______) _________ - _________  
Application (optional):  
Would you like a reply?  
Y
N
Literature Number:  
DS11187E  
Device:  
MCP100/101  
Questions:  
1. What are the best features of this document?  
2. How does this document meet your hardware and software development needs?  
3. Do you find the organization of this data sheet easy to follow? If not, why?  
4. What additions to the data sheet do you think would enhance the structure and subject?  
5. What deletions from the data sheet could be made without affecting the overall usefulness?  
6. Is there any incorrect or misleading information (what and where)?  
7. How would you improve this document?  
8. How would you improve our software, systems, and silicon products?  
2001 Microchip Technology Inc.  
DS11187E-page 11  
MCP100/101  
NOTES:  
DS11187E-page 12  
2001 Microchip Technology Inc.  
MCP100/101  
NOTES:  
2001 Microchip Technology Inc.  
DS11187E-page 13  
MCP100/101  
PRODUCT IDENTIFICATION SYSTEM  
To order or to obtain information (e.g., on pricing or delivery), please refer to the factory or the listed sales offices.  
PART NO.  
Device  
X
X
X
/XX  
Examples:  
RESET/  
Bondout Temperature  
Option Range  
Package  
a)  
b)  
c)  
d)  
MCP100/101270DI/TO = Vtrip range of  
2.55V - 2.70V, Bonding Option D, Industrial  
Temp., TO-92 package  
MCP100/101T450I/TT  
4.25V - 4.50V, Industrial Temp., SOT-23  
package  
DSTEMP270HI/TO = Vtrip range of 2.55V -  
2.70V, Bonding Option H, Industrial Temp.,  
TO-92 package  
RESET  
VTRIP  
Voltage  
= Vtrip range of  
Device:  
MCP100/101:Supervisor circuit with active low RESET  
output  
MCP100/101T:Supervisor circuit with active low RESET  
output (tape & reel)  
DSTEMP:  
Supervisor circuit with active high RESET  
output  
DSTEMPT315I/TT = Vtrip range of 3.00V -  
3.15V, Industrial Temp., SOT-23 package  
DSTEMPT: Supervisor circuit with active high RESET  
output (tape & reel)  
TO-92 with  
TO-92 with  
RESET/RESET VTRIP 270  
=
=
=
=
=
=
=
2.55 VTRIP 2.70  
2.85 VTRIP 3.00  
3.00 VTRIP 3.15  
4.25 VTRIP 4.50  
4.35 VTRIP 4.60  
4.50 VTRIP 4.75  
4.60 VTRIP 4.85  
HBondout  
DBondout  
Voltage:  
300  
315  
450  
460  
475  
485  
RST  
VDD  
or  
VSS  
VSS  
RST  
VDD  
RST  
or  
RST  
Bondout Option:  
(TO-92 Only)  
D
H
=
=
D Bond Option (see bond option chart)  
H Bond Option  
SOT-23-3  
Temperature Range:  
Package:  
I
=
-40°C to +85°C (only offered in I)  
RST  
or  
TO  
TT  
=
=
TO-92 (3-lead) [offered in bags only]  
SOT-23 (3-lead) [offered in tape & reel only]  
RST  
VSS  
VDD  
Sales and Support  
Data Sheets  
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-  
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:  
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Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.  
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DS11187E-page 14  
2001 Microchip Technology Inc.  
MCP100/101  
All rights reserved. Copyright © 2001, Microchip  
Technology Incorporated, USA. Information contained  
in this publication regarding device applications and the  
like is intended through suggestion only and may be  
superseded by updates. No representation or warranty  
is given and no liability is assumed by Microchip  
Technology Incorporated with respect to the accuracy  
or use of such information, or infringement of patents or  
other intellectual property rights arising from such use  
or otherwise. Use of Microchips products as critical  
components in life support systems is not authorized  
except with express written approval by Microchip. No  
licenses are conveyed, implicitly or otherwise, under  
any intellectual property rights. The Microchip logo and  
name are registered trademarks of Microchip  
Technology Inc. in the U.S.A. and other countries. All  
rights reserved. All other trademarks mentioned herein  
are the property of their respective companies. No  
licenses are conveyed, implicitly or otherwise, under  
any intellectual property rights.”  
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The Microchip name, logo, PIC, PICmicro,  
PICMASTER, PICSTART, PRO MATE, KEELOQ,  
SEEVAL, MPLAB and The Embedded Control  
Solutions Company are registered trademarks of  
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Microchip Technology Incorporated in the U.S.A.  
Serialized Quick Term Programming (SQTP) is a  
service mark of Microchip Technology Incorporated in  
the U.S.A.  
All other trademarks mentioned herein are property of  
their respective companies.  
© 2001, Microchip Technology Incorporated, Printed in  
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Microchip received QS-9000 quality system  
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devices, Serial EEPROMs and microperipheral  
products. In addition, Microchips quality  
system for the design and manufacture of  
development systems is ISO 9001 certified.  
2001 Microchip Technology Inc.  
DS11187E-page 15  
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ASIA/PACIFIC (continued)  
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01/30/01  
All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 2/01  
Printed on recycled paper.  
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by  
updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is  
assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual  
property rights arising from such use or otherwise. Use of Microchips products as critical components in life support systems is not authorized except with  
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-  
tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights  
reserved. All other trademarks mentioned herein are the property of their respective companies.  
DS11187E-page 16  
2001 Microchip Technology Inc.  

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