MCP102-300_技术文档

MCP111/112

Micropower Voltage Detector

Features

Package Types

• Ultra-low supply current: 1.75 µA (max.)

• Precision monitoring options of:

3-Pin SOT23-3/SC-70

3-Pin SOT-89

V_DD

- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,

4.38V and 4.63V

V_OUT

1

2

• Resets microcontroller in a power-loss event

• Active-low V_OUTpin:

V_DD

3

MCP111/112

- MCP111 active-low, open-drain

- MCP112 active-low, push-pull

V_SS

1

2

3

V_OUTV

_DDV_SS

• Available in SOT23-3, TO-92, SC-70 and

SOT-89-3 packages

3-Pin TO-92

• Temperature Range:

- Extended: -40°C to +125°C

(except MCP1XX-195)

- Industrial: -40°C to +85°C (MCP1XX-195 only)

V_OUT

V_SS

V_DD

• Pb-free devices

Applications

Block Diagram

• Critical Microcontroller and Microprocessor

Power-Monitoring Applications

V_DD

• Computers

• Intelligent Instruments

• Portable Battery-Powered Equipment

Comparator

V_OUT

+

–

Output

Driver

Description

The MCP111/112 are voltage-detecting devices

designed to keep a microcontroller in reset until the

system voltage has stabilized at the appropriate level

for reliable system operation. These devices also

operate as protection from brown-out conditions when

the system supply voltage drops below the specified

threshold voltage level. Eight different trip voltages are

available.

Band Gap

Reference

V_SS

TABLE 1:

DEVICE FEATURES

Output

Reset Delay Package Pin Out

(typ) (Pin # 1, 2, 3)

Device

Comment

Type

Pull-up Resistor

MCP111 Open-drain

MCP112 Push-pull

MCP102 Push-pull

External

No

V

, V , V

OUT SS

DD

V

, V , V

OUT SS

DD

No

120 ms

RST, V , V

See MCP102/103/121/131 Data Sheet

(DS21906)

DD

SS

MCP103 Push-pull

MCP121 Open-drain

No

VSS, RST, V

See MCP102/103/121/131 Data Sheet

(DS21906)

DD

External

RST, V , V

See MCP102/103/121/131 Data Sheet

(DS21906)

DD

SS

MCP131 Open-Drain Internal (~95 kΩ)

RST, V , V

See MCP102/103/121/131 Data Sheet

DD

SS

(DS21906)

DS21889D-page 1

MCP111/112

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V

DD

Input current (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA

DD

Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA

Rated Rise Time of V

. . . . . . . . . . . . . . . . . . . . . . 100V/µs

DD

All inputs and outputs (except RST) w.r.t. V

SS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.6V to (V + 1.0V)

DD

RST output w.r.t. V

. . . . . . . . . . . . . . . . . . . -0.6V to 13.5V

SS

Storage temperature . . . . . . . . . . . . . . . . . . .65°C to + 150°C

Ambient temp. with power applied . . . . . . . -40°C to + 125°C

Maximum Junction temp. with power applied . . . . . . . .150°C

ESD protection on all pins. . . . . . . . . . . . . . . . . . . . . . . . . ≥ 2 kV

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),

DD

PU

T = -40°C to +125°C.

A

Parameters

Operating Voltage Range

Sym

Min

Typ

Max

Units

Conditions

V

1.0

—

5.5

V

µA

V

DD

Specified V Value to V

low

1.0

—

I

= 10 µA, V

< 0.2V

RST

DD

OUT

RST

Operating Current

I

—

< 1

1.75

1.929

1.948

2.355

2.378

2.670

2.696

2.944

2.973

2.974

3.003

3.126

3.157

4.446

4.490

4.700

4.746

—

V

Trip Point

MCP1XX-195

V

1.872

1.853

2.285

2.262

2.591

2.564

2.857

2.828

2.886

2.857

3.034

3.003

4.314

4.271

4.561

4.514

—

1.900

2.320

2.630

2.900

2.930

3.080

4.380

4.630

±100

T = +25°C (Note 1)

A

DD

TRIP

T = -40°C to +85°C (Note 2)

A

MCP1XX-240

MCP1XX-270

MCP1XX-290

MCP1XX-300

MCP1XX-315

MCP1XX-450

MCP1XX-475

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

T = +25°C (Note 1)

A

Note 2

V

Trip Point Tempco

T

ppm/°

C

DD

TPCO

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.

®

3: This specification allows this device to be used in PICmicro microcontroller applications that require the In-Circuit

Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements).

This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V

). The

OUT

total time that the V

pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the

OUT

V

pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between

OUT

0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.

4: This parameter is established by characterization and is not 100% tested.

DS21889D-page 2

MCP111/112

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for V = 1V to 5.5V, R = 100 kΩ (only MCP111),

DD

PU

T = -40°C to +125°C.

A

Parameters

Sym

Min

Typ

Max

Units

Conditions

T = +25°C

Threshold Hysteresis

(min. = 1%, max = 6%)

MCP1XX-195

MCP1XX-240

MCP1XX-270

MCP1XX-290

MCP1XX-300

MCP1XX-315

MCP1XX-450

MCP1XX-475

V

0.019

0.023

0.026

0.029

0.031

0.044

0.046

—

0.114

0.139

0.158

0.174

0.176

0.185

0.263

0.278

0.4

V

HYS

A

V

Low-level Output Voltage

V

I

= 500 µA, V = V

OL DD TRIP(MIN)

OUT

OL

High-level Output Voltage

V

– 0.6

—

= 1 mA, For only MCP112

OH

OUT

OH

DD

(push-pull output)

(3)

Open-drain High Voltage on Output

V

—

13.5

V

MCP111 only,

ODH

V

= 3.0V, Time voltage >

DD

5.5V applied ≤ 100s,

current into pin limited to

2 mA, +25°C operation

recommended

Note 3, Note 4

Open-drain Output Leakage Current

I

—

0.1

—

µA

OD

(MCP111 only)

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.

®

3: This specification allows this device to be used in PICmicro microcontroller applications that require the In-Circuit

Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements).

This specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (V

). The

OUT

total time that the V

pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the

OUT

V

pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between

OUT

0°C to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.

4: This parameter is established by characterization and is not 100% tested.

DS21889D-page 3

MCP111/112

V_TRIP

1V

V_DD

t_RPU

t_RPD

V_OH

1V

V_OL

V_OUT

t_RT

FIGURE 1-1:

Timing Diagram.

AC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ

(only MCP111), T_A= -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Figure 1-1 and C = 50 pF

(Note 1)

V

Detect to V

Inactive

t

—

90

—

µs

L

DD

OUT

RPU

t

V

ramped from V

+

TRIP(MAX)

Detect to V

Active

—

130

5

—

µs

RPD

DD

OUT

250 mV down to V

–

TRIP(MIN)

250 mV, per Figure 1-1,

C = 50 pF (Note 1)

L

V

Rise Time After V

Active

t

For V

10% to 90% of final

OUT

RT

value per Figure 1-1, C = 50 pF

L

(Note 1)

Note 1: These parameters are for design guidance only and are not 100% tested.

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ

(only MCP111), T_A= -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Specified Temperature Range

Maximum Junction Temperature

Storage Temperature Range

Package Thermal Resistances

Thermal Resistance, 3L-SOT23

Thermal Resistance, 3L-SC-70

Thermal Resistance, 3L-TO-92

Thermal Resistance, 3L-SOT-89

T_A

T_J

T_A

-40

—

+85

°C

MCP1XX-195

+125

+150

Except MCP1XX-195

-65

θ_JA

—

336

340

—

°C/W

131.9

110

DS21889D-page 4

MCP111/112

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ (only MCP111;

see Figure 4-1), T_A= -40°C to +125°C.

1.6

1.4

1.2

1

1.6

1.4

1.2

1

MCP111-195

5.5V

5.0V

+125°C

4.0V

+85°C

0.8

0.6

0.4

0.2

0

0.8

0.6

0.4

0.2

0

2.8V

-40°C

2.1V

1.7V

+25°C

1.0V

1.0

2.0

3.0

4.0

5.0

6.0

V_DD(V)

Temperature (°C)

FIGURE 2-1:

I_DDvs. Temperature

FIGURE 2-4:

I_DDvs. V_DD(MCP111-195).

(MCP111-195).

1.6

1.2

5.5V

5.0V

MCP112-300

1.4

1.2

1

0.8

0.6

0.4

0.2

0

4.0V

2.8V

1.7V

+125°C

0.8

0.6

0.4

0.2

0

+85°C

2.1V

-40°C

1.0V

+25°C

1.0

2.0

3.0

4.0

_DD(V)

5.0

6.0

V

Temperature (°C)

FIGURE 2-5:

I_DDvs. V_DD(MCP112-300).

FIGURE 2-2:

I_DDvs. Temperature

(MCP112-300).

1.6

1

MCP112-475

0.9

5.5V

2.1V

1.4

1.2

1

0.8

4.0V

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0

5.0V

2.8V

0.8

0.6

0.4

0.2

0

+125°C

+85°C

1.7V

1.0V

-40°C

+25°C

1.0

2.0

3.0

4.0

5.0

6.0

V_DD(V)

Temperature (°C)

FIGURE 2-6:

I_DDvs. V_DD(MCP112-475).

FIGURE 2-3:

I_DDvs. Temperature

(MCP112-475).

DS21889D-page 5

MCP111/112

Note: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ (only MCP111;

see Figure 4-1), T_A= -40°C to +125°C.

0.120

MCP111-195

1.950

1.945

1.940

1.935

1.930

1.925

1.920

1.915

1.910

1.905

1.900

1.895

0.050

0.045

0.040

0.035

0.030

0.025

0.020

0.015

0.010

0.005

0.000

V_DD= 1.7V

V_TRIP, V increasing

0.100

0.080

0.060

0.040

0.020

0.000

V_HYS, Hysteresis

+125°C

MCP111-195

max temp is

+85°C

-40°C

V_TRIP, V decreasing

+25°C

-60

-10

40

90

140

0.00

0.25

0.50

0.75

1.00

Temperature (°C)

I

_OL(mA)

FIGURE 2-7:

V_TRIPand V_HYSTvs.

FIGURE 2-10:

V_OLvs. I_OL

Temperature (MCP111-195).

(MCP111-195 @ V_DD= 1.7V).

0.080

MCP112-300

0.070

3.040

0.100

0.098

0.096

0.094

0.092

0.090

0.088

0.086

0.084

0.082

V_TRIP, V increasing

V_DD= 2.7V

3.020

0.060

0.050

0.040

0.030

0.020

0.010

0.000

3.000

2.980

2.960

2.940

2.920

2.900

V_HYS, Hysteresis

+125°C

+85°C

MCP112-300

-40°C

0.75

+25°C

V_TRIP, V decreasing

0.00

0.25

0.50

1.00

-60

-10

40

90

140

I_OL(mA)

Temperature (°C)

FIGURE 2-8:

V_TRIPand V_HYSTvs.

FIGURE 2-11:

V_OLvs. I_OL

Temperature (MCP112-300).

(MCP112-300 @ V_DD= 2.7V).

0.050

4.800

0.180

0.170

0.160

0.150

0.140

0.130

0.120

0.110

0.100

MCP112-475

V_TRIP, V increasing

4.780

4.760

4.740

4.720

4.700

4.680

4.660

4.640

4.620

4.600

4.580

V_DD= 4.4V

0.040

V_HYS, Hysteresis

MCP112-475

+125°C

0.030

+85°C

0.020

-40°C

0.75

0.010

+25°C

V_TRIP, V decreasing

0.000

-60

-20

20

60

100

140

0.00

0.25

0.50

1.00

I_OL(mA)

Temperature (°C)

FIGURE 2-9:

V_TRIPand V_HYSTvs.

FIGURE 2-12:

V_OLvs. I_OL

Temperature (MCP112-475).

(MCP112-475 @ V_DD= 4.4V).

DS21889D-page 6

MCP111/112

Note: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ (only MCP111;

see Figure 4-1), T_A= -40°C to +125°C.

0.120

3.150

3.100

3.050

3.000

2.950

2.900

MCP111-195

V_DD= 1.7 V

I_OL= 1.00 mA

MCP112-300

V_DD= 3.1V

0.100

0.080

0.060

0.040

0.020

0.000

I_OL= 0.75 mA

I_OL= 0.50 mA

-40 °C

+85 °C

+25 °C

I_OL= 0.25 mA

I_OL= 0.00 mA

80

+125 °C

-40

0

40

120

0.00

0.25

0.50

0.75

1.00

I_OL(mA)

Temperature (°C)

FIGURE 2-13:

V_OLvs. Temperature

FIGURE 2-16:

V_OHvs. I_OH

(MCP111-195 @ V_DD= 1.7V).

(MCP112-300 @ V_DD= 3.1V).

0.080

4.820

4.800

4.780

4.760

4.740

4.720

4.700

4.680

MCP112-475

_DD= 4.8V

MCP112-300

V_DD= 2.7V

I_OL= 1.00 mA

0.070

V

0.060

0.050

0.040

0.030

0.020

0.010

0.000

I_OL= 0.75 mA

I_OL= 0.50 mA

+25 °C

-40 °C

I_OL= 0.25 mA

I_OL= 0.00 mA

+85 °C

+125 °C

-40

0

40

80

120

0.00

0.25

0.50

I_OL(mA)

0.75

1.00

Temperature (°C)

FIGURE 2-14:

V_OLvs. Temperature

FIGURE 2-17:

V_OHvs. I_OH

(MCP112-300 @ V_DD= 2.7V).

(MCP112-475 @ V_DD= 4.8V).

0.050

600

I_OL= 1.00 mA

MCP112-475

V_DD= 4.4V

0.040

500

400

300

200

100

0

MCP111-195

I_OL= 0.75 mA

I_OL= 0.50 mA

MCP112-300

MCP112-475

0.030

0.020

0.010

0.000

I_OL= 0.25 mA

I_OL= 0.00 mA

0.001

0.01

0.1

1

10

-40

0

40

80

120

Temperature (°C)

V_TRIP(min) - V_DD

FIGURE 2-15:

V_OLvs. Temperature

FIGURE 2-18:

Typical Transient Response

(MCP112-475 @ V_DD= 4.4V).

(25 °C).

DS21889D-page 7

MCP111/112

Note: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ (only MCP111;

see Figure 4-1), T_A= -40°C to +125°C.

400

350

300

250

200

150

100

50

350

300

250

200

150

100

50

MCP111-195

V_DDdecreasing from:

5V - 1.7V

V_DDincreasing from:

0V - 2.1V

V_DDdecreasing from:

_TRIP(max)+ 0.25V to V_TRIP(min)- 0.25V

V

V_DDincreasing from:

0V - 2.8V

V_DDincreasing

from: 0V - 4.0V

V_DDdecreasing from:

5V - 0V

V_DDincreasing

from: 0V - 5.5V

0

-40

-15

10

35

60

85

110

-40

-15

10

35

60

85

110

Temperature (°C)

FIGURE 2-19:

t_RPDvs. Temperature

FIGURE 2-22:

t_RPUvs. Temperature

(MCP111-195).

140

120

100

80

160

MCP112-300

V_DDdecreasing from:

V_DDincreasing from:

0V - 3.1V

140

120

100

80

V_TRIP(max)+ 0.25V to V_TRIP(min)- 0.25V

V_DDincreasing from:

0V - 3.3V

V_DDdecreasing from:

5V - 2.7V

V_DDincreasing from:

0V - 4.0V

60

40

V_DDdecreasing from:

5V - 0V

20

V_DDincreasing from:

0V - 5.5V

0

-40

-15

10

35

60

85

110

-40

-15

10

35

60

85

110

Temperature (°C)

FIGURE 2-20:

t_RPDvs. Temperature

FIGURE 2-23:

t_RPUvs. Temperature

(MCP112-300).

250

200

150

100

50

MCP112-475

V_DDdecreasing from:

5V - 4.4V

V_DDincreasing from:

0V - 4.9V

200

150

100

50

V_DDincreasing from:

0V - 5.0V

V_DDdecreasing from:

V_TRIP(max)+ 0.25V to V_TRIP(min)- 0.25V

V_DDincreasing from:

0V - 5.5V

V_DDdecreasing from:

5V - 0V

0

-40

-15

10

35

60

85

110

-40

-15

10

35

60

85

110

Temperature (°C)

FIGURE 2-21:

t_RPDvs. Temperature

FIGURE 2-24:

t_RPUvs. Temperature

(MCP112-475).

DS21889D-page 8

MCP111/112

Note: Unless otherwise indicated, all limits are specified for V_DD= 1V to 5.5V, R_PU= 100 kΩ (only MCP111;

see Figure 4-1), T_A= -40°C to +125°C.

0.1500

0.1400

0.1300

0.1200

0.1100

0.1000

0.0900

0.0800

60

55

MCP112-475

MCP111-195

V_DDincreasing from:

50

V_DDincreasing from:

0V - 2.1V

45

0V - 5.0V

V_DDincreasing from:

0V - 4.9V

V_DDincreasing from:

0V - 5.5V

V_DDincreasing

from: 0V - 4.0V

40

35

30

V_DDincreasing from:

0V - 5.5V

V_DDincreasing from:

0V - 4.8V

25

20

0V - 2.8V

-40

-15

10

35

60

85

110

-40

-15

10

35

60

85

110

Temperature (°C)

FIGURE 2-25:

t_RTvs. Temperature

FIGURE 2-27:

t_RTvs. Temperature

(MCP111-195).

(MCP112-475).

0.4

1.E-02

10m

V_DDincreasing from:

0V - 3.1V

V_DDincreasing from:

1.E-03

1m

0.35

1.E-04

100µ

0V - 3.3V

0.3

0.25

0.2

1.E-05

10µ

1.E-06

1µ

125°C

25°C

1.E-07

100n

1.E-08

10n

V_DDincreasing from:

0V - 5.5V

1.E-09

0.15

0.1

1n

1.E-10

100p

V_DDincreasing from:

1.E-11

0V - 4.0V

10p

- 40°C

1.E-12

1p

0.05

0

MCP112-300

35

1.E-13

100f

0

1

2

3

4

5

6

7

8

9

10 11 12 13 14

-40

-15

10

60

85

110

Pull-Up Voltage (V)

Temperature (°C)

FIGURE 2-26:

t_RTvs. Temperature

FIGURE 2-28:

Open-Drain Leakage

(MCP112-300).

Current vs. Voltage Applied to V_OUTPin

(MCP111-195).

DS21889D-page 9

MCP111/112

3.0

PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Pin No.

Symbol

Function

SOT-23-3

SC-70

SOT-89-3

T0-92

1

V_OUT

Output State

V_DDFalling:

H = V_DD> V_TRIP

L = V_DD< V_TRIP

V_DDRising:

H = V_DD> V_TRIP+ V_HYS

L = V_DD< V_TRIP+ V_HYS

2

3

2

3

4

3

2

V_SS

V_DD

Ground reference

Positive power supply

—

DS21889D-page 10

MCP111/112

4.1

V_TRIPOperation

4.0

APPLICATION INFORMATION

The voltage trip point (V_TRIP) is determined on the falling

edge of V_DD. The actual voltage trip point (V_TRIPAC) will

be between the minimum trip point (V_TRIPMIN) and the

maximum trip point (V_TRIPMAX). There is a hysteresis on

this trip point to remove any “jitter” that would occur on

the V_OUTpin when the device V_DDis at the trip point.

For many of today’s microcontroller applications, care

must be taken to prevent low-power conditions that can

cause many different system problems. The most

common causes are brown-out conditions, where the

system supply drops below the operating level momen-

tarily. The second most common cause is when a slowly

decaying power supply causes the microcontroller to

begin executing instructions without sufficient voltage to

sustain SRAM, thus producing indeterminate results.

Figure 4-1 shows a typical application circuit.

Figure 4-2 shows the state of the V_OUTpin as

determined by the V_DDvoltage. The V_TRIPspecification

is for falling V_DDvoltages. When the V_DDvoltage is

rising, the V_OUTpin will not be driven high until V_DDis at

V_TRIP+ V_HYS.

V_DD

3

V_DD

PICmicro^®

Microcontroller

0.1

µF

R_PU

MCP11X

(1)

1

V_OUT

MCLR

(Reset Input)

V_SS

2

GND

Note 1: R_PUmay be required with the MCP111

due to the open-drain output. Resistor

R_PUis not required with the MCP112.

FIGURE 4-1:

Typical Application Circuit.

V_DD

V_TRIPAC+ V_HYSAC

V_TRIPMAX

V_TRIPMIN

V_TRIPAC

1V

V_OUT

< 1 V is outside the

device specifications

FIGURE 4-2:

V_OUTOperation as Determined by the V_TRIPand V_HYS.

DS21889D-page 11

MCP111/112

4.2

Negative Going V_DDTransients

4.3

Effect of Temperature on Time-out

Period (t

)

RPU

The minimum pulse width (time) required to cause a

reset may be an important criteria in the implementa-

tion of a Power-on Reset (POR) circuit. This time is

referred to as transient duration, defined as the amount

of time needed for these supervisory devices to

respond to a drop in V_DD. The transient duration time is

dependant on the magnitude of V_TRIP– V_DD. Generally

speaking, the transient duration decreases with

The time-out period (t_RPU) determines how long the

device remains in the reset condition. This is affected

by both V_DDand temperature. The graph shown in

Figures 2-22, 2-23 and 2-24 show the typical response

for different V_DDvalues and temperatures.

®

4.4

Using in PICmicro

increases in V_TRIP– V_DD

.

Microcontroller ICSP™

Applications (MCP111 only)

Figure 4-3 shows a typical transient duration vs. reset

comparator overdrive for which the MCP111/112 will

not generate a reset pulse. It shows that the farther

below the trip point the transient pulse goes, the

duration of the pulse required to cause a reset gets

shorter. Figure 2-18 shows the transient response

characteristics for the MCP111/112.

Figure 4-4 shows the typical application circuit for using

the MCP111 for voltage supervisory function when the

PICmicro microcontroller will be programmed via the

In-Circuit

Serial

Programming™

(ICSP)

feature. Additional information is available in TB087,

“Using Voltage Supervisors with PICmicro^®Microcon-

troller Systems which Implement In-Circuit Serial

Programming™”, DS91087.

A 0.1 µF bypass capacitor, mounted as close as

possible to the V_DDpin, provides additional transient

immunity (refer to Figure 4-1).

Note:

It is recommended that the current into the

RST pin be current limited by a 1 kΩ

resistor.

5V

V

TRIP(MAX)

TRIP(MIN)

V_DD/V_PP

V

- V

DD

TRIP(MIN)

0.1 µF

V_DD

R_PU

V_DD

t

PICmicro^®

TRANS

MCU

MCP111

0V

Time (µs)

MCLR

(reset input)

(Active-Low)

FIGURE 4-3:

Transient Duration Waveform.

Example of Typical

RST

V_SS

1 kΩ

V_SS

FIGURE 4-4:

Typical Application Circuit

for PICmicro^®Microcontroller with the ICSP™

feature.

DS21889D-page 12

MCP111/112

5.0

5.1

PACKAGING INFORMATION

Package Marking Information

3-Lead TO-92

Example:

XXXXXX

YWWNNN

MCP111

290E

TO^^

e3

547256

3-Pin SOT-23

Example:

Part Number

SOT-23

Part Number

SOT-23

MCP111T-195I/TT

MCP111T-240ETT

MPNN MCP112T-195I/TT

MQNN MCP112T-240ETT

MRNN

MSNN

XXNN

MCP111T-270E/TT MGNN MCP112T-270E/TT MANN

MCP111T-290E/TT NHNN MCP112T-290E/TT MBNN

MCP111T-300E/TT

MCP111T-315E/TT MKNN MCP112T-315E/TT MDNN

MCP111T-450E/TT MLNN MCP112T-450E/TT MENN

MJNN MCP112T-300E/TT MCNN

MCP111T-475E/TT MMNN MCP112T-475E/TT MFNN

3-Pin SOT-89

Example:

Part Number

SOT-89

Part Number

SOT-89

MCP111T-195I/MB

MCP111T-240EMB

MCP111T-270E/MB

MCP111T-290E/MB

MCP111T-300E/MB

MCP111T-315E/MB

MCP111T-450E/MB

MCP111T-475E/MB

MP

MQ

MG

NH

MJ

MCP112T-195I/MB

MCP112T-240EMB

MCP112T-270E/MB

MCP112T-290E/MB

MCP112T-300E/MB

MCP112T-315E/MB

MCP112T-450E/MB

MCP112T-475E/MB

MR

MS

MA

MB

MC

MD

ME

MF

XXYYWW

NNN

MK

ML

MM

Legend: XX...X Customer-specific information

Y

Year code (last digit of calendar year)

WW

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS21889D-page 13

MCP111/112

Package Marking Information (Continued)

3-Pin SC-70

Example:

SC-70

Part Number

SC-70

MCP111T-195I/LB

MCP111T-240E/LB

MCP111T-270E/LB

MCP111T-290E/LB

MCP111T-300E/LB

MCP111T-315E/LB

MCP111T-450E/LB

EPN

EQN

EGN

EHN

EJN

EKN

ELN

MCP112T-195I/LB

ERN

XXN

MCP112T-240E/LB ESN

MCP112T-270E/LB EAN

MCP112T-290E/LB EBN

MCP112T-300E/LB ECN

MCP112T-315E/LB EDN

MCP112T-450E/LB EEN

Top Side

MCP111T-475E/LB EMN MCP112T-475E/LB EFN

OR

Example:

Part Number

SC-70

Part Number

SC-70

MCP111T-195I/LB

EPNN MCP112T-195I/LB

ERNN

MCP111T-240E/LB EQNN MCP112T-240E/LB ESNN

MCP111T-270E/LB EGNN MCP112T-270E/LB EANN

MCP111T-290E/LB EHNN MCP112T-290E/LB EBNN

MCP111T-300E/LB EJNN MCP112T-300E/LB ECNN

MCP111T-315E/LB EKNN MCP112T-315E/LB EDNN

MCP111T-450E/LB ELNN MCP112T-450E/LB EENN

MCP111T-475E/LB EMNN MCP112T-475E/LB EFNN

XXNN

Top Side

DS21889D-page 14

MCP111/112

3-Lead Plastic Small Outline Transistor (MB) (SOT89)

H

E

B1

3

B

D1

D

p1

2

1

p

R

B1

L

E1

A

C

Units

INCHES

MILLIMETERS*

Dimension Limits

MIN

MAX

MIN

1.50 BSC

MAX

p

Pitch

.059 BSC

.118 BSC

.055

p1

Outside lead pitch (basic)

Overall Height

3.00 BSC

1.40

A

H

E

.063

1.60

Overall Width

.155

.167

.102

.090

.181

.072

3.94

4.25

2.60

2.29

4.60

1.83

Molded Package Width at Base

Molded Package Width at Top

Overall Length

.090

2.29

E1

D

D1

R

.084

2.13

.173

4.40

Tab Length

.064

1.62

Tab Corner Radii

Foot Length

.010

0.254

0.89

L

c

.035

.047

.017

.022

.019

1.20

0.44

0.56

0.48

Lead Thickness

.014

0.35

Lead 2 Width

B

.017

0.43

Leads 1 & 3 Width

B1

.014

0.36

*Controlling Parameter

Notes:

Dimensions D and E1 do not include mold or flash protrusions. Mold flash or protrusions

shall not exceed .005" (0.127mm) per side.

JEDEC Equivalent: TO-243

Drawing No. C04-29

Revised 07-24-03

DS21889D-page 15

MCP111/112

3-Lead Plastic Small Outline Transistor (TT) (SOT-23)

E

E1

2

B

p1

D

n

p

1

α

c

A

A2

A1

φ

β

L

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

3

MAX

n

p

Number of Pins

3

Pitch

.038

.076

.040

.037

.002

.093

.051

.115

.018

5

0.96

1.92

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.035

.044

0.89

0.88

1.01

0.95

0.06

2.37

1.30

2.92

0.45

5

1.12

1.02

0.10

2.64

1.40

3.04

0.55

10

Molded Package Thickness

.035

.000

.083

.047

.110

.014

0

.040

.004

.104

.055

.120

.022

10

Standoff

§

0.01

2.10

1.20

2.80

0.35

0

Overall Width

Molded Package Width

Overall Length

E1

D

Foot Length

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.004

.015

0

.006

.017

5

.007

.020

10

0.09

0.37

0

0.14

0.44

5

0.18

0.51

10

B

α

β

Mold Draft Angle Top

Mold Draft Angle Bottom

0

5

10

0

5

10

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-236

Drawing No. C04-104

DS21889D-page 16

MCP111/112

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

E

E1

B

2

1

p1

D

3

p

a

A2

A

c

A1

b

L

Units

Dimension Limits

INCHES

3

MILLIMETERS*

MIN MAX

MIN

MAX

Number of Pins

Pitch

3

p

.026 BSC.

.051 BSC.

.031

.000

.071

.045

.071

.004

.003

.006

8°

0.65 BSC.

1.30 BSC.

0.80

p1

Outside lead pitch (basic)

Overall Height

A

A2

A1

E

.043

1.10

Molded Package Thickness

Standoff

.039

.0004

.094

.053

.089

.016

.010

.016

12°

0.80

1.00

.010

2.40

1.35

2.25

0.41

0.25

0.40

12°

0.00

Overall Width

1.80

Molded Package Width

Overall Length

E1

D

1.15

1.80

Foot Length

L

c

0.10

Lead Thickness

0.08

Lead Width

B

a

0.15

Mold Draft Angle Top

Mold Draft Angle Bottom

8°

b

8°

12°

8°

12°

*Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions

shall not exceed .005" (0.127mm) per side.

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

DS21889D-page 17

MCP111/112

3-Lead Plastic Transistor Outline (TO) (TO-92)

E1

D

n

1

L

1

2

3

α

B

p

c

A

R

β

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

3

MAX

n

p

Number of Pins

3

Pitch

.050

.143

.186

.183

.090

.555

.017

.019

5

1.27

Bottom to Package Flat

Overall Width

A

E1

D

R

L

.130

.155

3.30

4.45

3.62

4.71

4.64

2.29

14.10

0.43

0.48

5

3.94

.175

.170

.085

.500

.014

.016

4

.195

.095

.610

.020

.022

6

4.95

2.41

15.49

0.51

0.56

6

Overall Length

4.32

2.16

12.70

0.36

0.41

4

Molded Package Radius

Tip to Seating Plane

Lead Thickness

Lead Width

c

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

2

3

4

2

3

4

*Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-92

Drawing No. C04-101

DS21889D-page 18

MCP111/112

5.2

Product Tape and Reel Specifications

EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)

FIGURE 5-1:

Top

Cover

Tape

A

0

W

B

K

0

P

TABLE 1:

CARRIER TAPE/CAVITY DIMENSIONS

Carrier

Cavity

Dimensions

Output

Quantity

Units

Reel

Diameter in

mm

Dimensions

Case

Package

Outline

Type

W

P

A0

B0

mm

K0

mm

TT

LB

SOT-23B

SC-70

3L

8

4

3.15

2.4

2.77

2.4

1.22

1.19

3000

180

FIGURE 5-2:

3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS

User Direction of Feed

Device

Marking

W

PIN 1

P

Standard Reel Component Orientation

DS21889D-page 19

MCP111/112

FIGURE 5-3:

TO-92 DEVICES

User Direction of Feed

P

Device

Marking

MARK

FACE

MARK

FACE

MARK

FACE

Seal

Tape

Back

Tape

W

Note:

Bent leads are for Tape and Reel only.

FIGURE 5-4:

SOT-89 DEVICES

User Direction of Feed

W, Width

of Carrier

Tape

Pin 1

P, Pitch

Reverse Reel Component Orientation

Standard Reel Component Orientation

DS21889D-page 20

MCP111/112

APPENDIX A: REVISION HISTORY

Revision D (June 2005)

1. Added

SOT-89-3

package

information

throughout.

Revision C (March 2005)

The following is the list of modifications:

1. Added Section 4.4 “Using in PICmicro®

Microcontroller ICSP™ Applications

(MCP111 only)” on using the MCP111 in

PICmicro microcontroller ICSP applications.

2. Added V_ODHspecifications in Section 1.0

“Electrical

Characteristics” (for

ICSP

applications).

3. Added Figure 2-28.

4. Added devices features table to page 1.

5. Updated SC-70 package markings and added

Pb-free marking information to Section 5.0

“Packaging information”.

6. Added Appendix A: “Revision History”.

Revision B (August 2004)

1. Corrected package marking information in

Section 5.0 “Packaging information”

Revision A (May 2004)

• Original Release of this Document.

DS21889D-page 21

MCP111/112

NOTES:

DS21889D-page 22

MCP111/112

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X

XXX

X

XX

a)

MCP111T-195I/TT: Tape and Reel,

Temperature Package

Range

Tape/Reel

Option

Monitoring

Options

1.95V option, open-drain,

-40°C to +85°C,

SOT-23B package.

b)

MCP111T-315E/LB: Tape and Reel,

3.15V option, open-drain,

-40°C to +125°C,

SC-70-3 package.

Device:

MCP111: MicroPower Voltage Detector, open-drain

MCP111T: MicroPower Voltage Detector, open-drain

(Tape and Reel)

c)

d)

MCP111-300E/TO: 3.00V option, open-drain,

-40°C to +125°C,

TO-92-3 package.

MCP111-315E/MB: 3.15V option, open-drain,

-40°C to +125°C,

MCP112: MicroPower Voltage Detector, push-pull

MCP112T: MicroPower Voltage Detector, push-pull

(Tape and Reel)

Monitoring Options:

195 = 1.90V

240 = 2.32V

270 = 2.63V

290 = 2.90V

300 = 2.93V

315 = 3.08V

450 = 4.38V

475 = 4.63V

SOT-89-3 package.

a)

b)

MCP112T-290E/TT: Tape and Reel,

2.90V option, push-pull, -

40°C to +125°C,

SOT-23B-3 package.

MCP112T-475E/LB: Tape and Reel,

4.75V option, push-pull,

-40°C to +125°C,

SC-70-3 package.

MCP112-450E/TO: 4.5V option, push-pull,

-40°C to +125°C,

TO-92-3 package.

MCP112-315E/MB: 3.15V option, push-pull,

-40°C to +125°C,

Temperature Range:

Package:

I

E

=

-40°C to +85°C (MCP11X-195 only)

-40°C to +125°C (Except MCP11X-195 only)

c)

d)

LB

MB

TO

TT

=

SC-70, 3-lead

SOT-89, 3-lead

TO-92, 3-lead

SOT-23B, 3-lead

SOT-89-3 package.

DS21889D-page 23

MCP111/112

NOTES:

DS21889D-page 24

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,

WRITTEN OR ORAL, STATUTORY OR OTHERWISE,

RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. Use of Microchip’s products as critical components in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, and

SmartShunt are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fuzzyLAB, In-Circuit Serial

Programming, ICSP, ICEPIC, Linear Active Thermistor,

MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,

PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,

PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,

Smart Serial, SmartTel, Total Endurance and WiperLock are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS21889D-page 25

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

India - Bangalore

Tel: 91-80-2229-0061

Fax: 91-80-2229-0062

Austria - Weis

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Denmark - Ballerup

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-5160-8631

Fax: 91-11-5160-8632

China - Chengdu

Tel: 86-28-8676-6200

Fax: 86-28-8676-6599

France - Massy

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Japan - Kanagawa

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

Atlanta

China - Fuzhou

Tel: 86-591-8750-3506

Fax: 86-591-8750-3521

Germany - Ismaning

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Korea - Seoul

Alpharetta, GA

Tel: 770-640-0034

Fax: 770-640-0307

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Boston

Malaysia - Penang

Tel:011-604-646-8870

Fax:011-604-646-5086

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Philippines - Manila

Tel: 011-632-634-9065

Fax: 011-632-634-9069

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

England - Berkshire

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Dallas

Addison, TX

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Tel: 972-818-7423

Fax: 972-818-2924

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

China - Shunde

Detroit

Tel: 86-757-2839-5507

Fax: 86-757-2839-5571

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

China - Qingdao

Tel: 86-532-502-7355

Fax: 86-532-502-7205

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

Taiwan - Hsinchu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

San Jose

Mountain View, CA

Tel: 650-215-1444

Fax: 650-961-0286

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

04/20/05

DS21889D-page 26


型号：	MCP102-300
厂家：	MICROCHIP
描述：	Micropower Voltage Detector
文件：	总26页 (文件大小：296K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP102-300 [MICROCHIP]

相关型号：

MCP102-300E/LB

MCP102-300E/SNG

MCP102-300E/TO

MCP102-300E/TT

MCP102-300I/LB

MCP102-300I/TO

MCP102-300I/TT

MCP102-315

MCP102-315E/LB

MCP102-315E/SNG

MCP102-315E/TO

MCP102-315E/TT