MCP111-300E/LB [MICROCHIP]
Micropower Voltage Detector;型号: | MCP111-300E/LB |
厂家: | MICROCHIP |
描述: | Micropower Voltage Detector |
文件: | 总32页 (文件大小:396K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP111/112
Micropower Voltage Detector
Features
Package Types
• Ultra-Low Supply Current: 1.75 µA (Max.)
• Precision Monitoring Options Of:
3-Pin SOT23-3/SC-70
3-Pin SOT-89
VDD
- 1.90V, 2.32V, 2.63V, 2.90V, 2.93V, 3.08V,
4.38V and 4.63V
VOUT
1
2
• Resets Microcontroller in a Power-Loss Event
• Active-Low VOUT Pin:
VDD
3
MCP111/112
- MCP111 Active-Low, Open-Drain
- MCP112 Active-Low, Push-Pull
VSS
1
2
3
VOUT
V
DD VSS
• Available in SOT23-3, TO-92, SC-70 and
SOT-89-3 Packages
3-Pin TO-92
• Temperature Range:
- Extended: -40°C to +125°C
(except MCP1XX-195)
- Industrial: -40°C to +85°C (MCP1XX-195 Only)
VOUT
VSS
VDD
• Pb-Free Devices
Applications
Block Diagram
• Critical Microcontroller and Microprocessor
Power-Monitoring Applications
V
DD
• Computers
• Intelligent Instruments
• Portable Battery-Powered Equipment
Comparator
V
OUT
+
–
Output
Driver
General Description
The MCP111/112 are voltage-detecting devices
designed to keep a microcontroller in reset until the
system voltage has stabilized at the appropriate level
for reliable system operation. These devices also
operate as protection from brown-out conditions when
the system supply voltage drops below the specified
threshold voltage level. Eight different trip voltages are
available.
Band Gap
Reference
V
SS
DEVICE FEATURES
Output
SOT-23/SC70
Package Pin Out
(Pin # 1, 2, 3)
ResetDelay
Device
Comment
(typ.)
Type
Pull-up Resistor
MCP111
MCP112
MCP102
Open-drain
Push-pull
Push-pull
External
No
No
No
VOUT, VSS, VDD
VOUT, VSS, VDD
RST, VDD, VSS
No
120 ms
See MCP102/103/121/131 Data Sheet
(DS20001906)
MCP103
Push-pull
No
120 ms
120 ms
120 ms
VSS, RST, VDD
RST, VDD, VSS
RST, VDD, VSS
See MCP102/103/121/131 Data Sheet
(DS20001906)
MCP121 Open-drain
MCP131 Open-Drain
External
See MCP102/103/121/131 Data Sheet
(DS20001906)
Internal (~95 k)
See MCP102/103/121/131 Data Sheet
(DS20001906)
2004-2016 Microchip Technology Inc.
DS20001889F-page 1
MCP111/112
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDD...................................................................................7.0V
Input current (VDD) .......................................................10 mA
Output current (RST) ....................................................10 mA
Rated Rise Time of VDD.............................................100V/µs
All inputs and outputs (except RST) w.r.t. VSS
..............................................................-0.6V to (VDD + 1.0V)
RST output w.r.t. VSS .......................................-0.6V to 13.5V
Storage temperature .....................................65°C to + 150°C
Ambient temp. with power applied ...............-40°C to + 125°C
Maximum Junction temp. with power applied ...............150°C
ESD protection on all pins2 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111),
TA = -40°C to +125°C.
Parameters
Operating Voltage Range
Symbol
Min.
Typ.
Max.
Units
Conditions
VDD
VDD
IDD
1.0
—
5.5
V
V
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Specified VDD Value to VOUT low
Operating Current
1.0
—
I RST = 10 µA, V RST < 0.2V
—
< 1
1.75
1.929
1.948
2.355
2.378
2.670
2.696
2.944
2.973
2.974
3.003
3.126
3.157
4.446
4.490
4.700
4.746
—
VDD Trip Point
MCP1XX-195
VTRIP
1.872
1.853
2.285
2.262
2.591
2.564
2.857
2.828
2.886
2.857
3.034
3.003
4.314
4.271
4.561
4.514
—
1.900
1.900
2.320
2.320
2.630
2.630
2.900
2.900
2.930
2.930
3.080
3.080
4.380
4.380
4.630
4.630
±100
TA = +25°C (Note 1)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
Note 2
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
TA = +25°C (Note 1)
Note 2
TA = +25°C (Note 1)
Note 2
TA = +25°C (Note 1)
Note 2
TA = +25°C (Note 1)
Note 2
TA = +25°C (Note 1)
Note 2
TA = +25°C (Note 1)
Note 2
VDD Trip Point Tempco
TTPCO
ppm/°
C
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: This specification allows this device to be used in PIC® microcontroller applications that require the In-Circuit Serial
Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). This
specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (VOUT). The total
time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the VOUT
pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C
to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.
4: This parameter is established by characterization and is not 100% tested.
DS20001889F-page 2
2004-2016 Microchip Technology Inc.
MCP111/112
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111),
TA = -40°C to +125°C.
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
TA = +25°C
Threshold Hysteresis
min. = 1%, max = 6%)
MCP1XX-195
MCP1XX-240
MCP1XX-270
MCP1XX-290
MCP1XX-300
MCP1XX-315
MCP1XX-450
MCP1XX-475
VHYS
0.019
0.023
0.026
0.029
0.029
0.031
0.044
0.046
—
—
—
—
—
—
—
—
—
—
—
0.114
0.139
0.158
0.174
0.176
0.185
0.263
0.278
0.4
V
V
V
V
V
V
V
V
V
V
VOUT Low-level Output Voltage
VOL
VOH
IOL = 500 µA, VDD = VTRIP(MIN)
VOUT High-level Output Voltage
VDD – 0.6
—
IOH = 1 mA, For only MCP112
(push-pull output)
Open-drain High Voltage on Output
VODH
—
—
13.5 (3)
V
MCP111 only,
V
DD = 3.0V, Time voltage >
5.5V applied 100s,
current into pin limited to
2 mA, +25°C operation
recommended
Note 3, Note 4
Open-drain Output Leakage Current
IOD
—
0.1
—
µA
(MCP111 only)
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: This specification allows this device to be used in PIC® microcontroller applications that require the In-Circuit Serial
Programming™ (ICSP™) feature (see device-specific programming specifications for voltage requirements). This
specification DOES NOT allow a continuous high voltage to be present on the open-drain output pin (VOUT). The total
time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100 sec. Current into the VOUT
pin should be limited to 2 mA. It is recommended that the device operational temperature be maintained between 0°C
to 70°C (+25°C preferred). For additional information, please refer to Figure 2-28.
4: This parameter is established by characterization and is not 100% tested.
2004-2016 Microchip Technology Inc.
DS20001889F-page 3
MCP111/112
VTRIP
1V
VDD
tRPU
tRPD
VOH
1V
VOL
VOUT
tRT
FIGURE 1-1:
Timing Diagram.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP111), TA = -40°C to +125°C.
Parameters
Symbol Min.
Typ.
Max.
Units
Conditions
VDD Detect to VOUT Inactive
tRPU
µs
Figure 1-1 and CL = 50 pF
(Note 1)
—
90
—
VDD Detect to VOUT Active
tRPD
µs
µs
VDD ramped from VTRIP(MAX) +
—
130
5
—
—
250 mV down to VTRIP(MIN)
250 mV, per Figure 1-1,
CL = 50 pF (Note 1)
–
VOUT Rise Time After VOUT Active
tRT
For VOUT 10% to 90% of final
value per Figure 1-1, CL = 50 pF
—
(Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(MCP111 only), TA = -40°C to +125°C.
Parameters
Symbol Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
Specified Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 3L-SOT23
Thermal Resistance, 3L-SC-70
Thermal Resistance, 3L-TO-92
Thermal Resistance, 3L-SOT-89
TA
TA
TJ
TA
-40
-40
—
—
—
—
—
+85
°C
°C
°C
°C
MCP1XX-195
Except MCP1XX-195
+125
+150
+150
-65
JA
JA
JA
JA
—
—
—
—
336
340
—
—
—
—
°C/W
°C/W
°C/W
°C/W
131.9
110
DS20001889F-page 4
2004-2016 Microchip Technology Inc.
MCP111/112
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
1.6
1.4
1.2
1
1.6
1.4
1.2
1
MCP111-195
MCP111-195
5.5V
5.0V
+125°C
4.0V
+85°C
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
2.8V
-40°C
2.1V
1.7V
+25°C
1.0V
1.0
2.0
3.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-1:
I
vs. Temperature
FIGURE 2-4:
I
vs. V (MCP111-195).
DD
DD
DD
(MCP111-195).
1.6
1.2
5.5V
5.0V
MCP112-300
MCP112-300
1.4
1.2
1
1
0.8
0.6
0.4
0.2
0
4.0V
+125°C
2.8V
1.7V
0.8
0.6
0.4
0.2
0
+85°C
-40°C
2.1V
1.0V
+25°C
3.0
1.0
2.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-5:
I
vs. V (MCP112-300).
FIGURE 2-2:
I
vs. Temperature
DD
DD
DD
(MCP112-300).
1.6
1
MCP112-475
MCP112-475
0.9
5.5V
2.1V
1.4
1.2
1
0.8
4.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5.0V
2.8V
0.8
0.6
0.4
0.2
0
+125°C
+85°C
1.7V
-40°C
1.0V
+25°C
3.0
1.0
2.0
4.0
5.0
6.0
VDD (V)
Temperature (°C)
FIGURE 2-6:
I
vs. V (MCP112-475).
FIGURE 2-3:
I
vs. Temperature
DD
DD
DD
(MCP112-475).
2004-2016 Microchip Technology Inc.
DS20001889F-page 5
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
MCP111-195
1.950
1.945
1.940
1.935
1.930
1.925
1.920
1.915
1.910
1.905
1.900
1.895
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0.000
VDD = 1.7V
VTRIP, V increasing
0.100
0.080
0.060
0.040
0.020
0.000
VHYS, Hysteresis
+125°C
MCP111-195
max temp is
+85°C
+85°C
-40°C
VTRIP, V decreasing
+25°C
-60
-10
40
90
140
0.00
0.25
0.50
IOL (mA)
0.75
1.00
Temperature (°C)
FIGURE 2-7:
V
and V
vs.
FIGURE 2-10:
V
vs. I
OL OL
TRIP
HYST
Temperature (MCP111-195).
(MCP111-195 @ V = 1.7V).
DD
0.080
MCP112-300
VDD = 2.7V
3.040
0.100
0.098
0.096
0.094
0.092
0.090
0.088
0.086
0.084
0.082
0.070
VTRIP, V increasing
3.020
0.060
3.000
2.980
2.960
2.940
2.920
2.900
VHYS, Hysteresis
+125°C
0.050
0.040
0.030
0.020
0.010
0.000
+85°C
MCP112-300
-40°C
0.75
+25°C
VTRIP, V decreasing
0.00
0.25
0.50
1.00
-60
-10
40
90
140
IOL (mA)
Temperature (°C)
FIGURE 2-8:
V
and V
vs.
FIGURE 2-11:
V
vs. I
OL OL
TRIP
HYST
Temperature (MCP112-300).
(MCP112-300 @ V = 2.7V).
DD
0.050
4.800
0.180
0.170
0.160
0.150
0.140
0.130
0.120
0.110
0.100
MCP112-475
VTRIP, V increasing
4.780
4.760
4.740
4.720
4.700
4.680
4.660
4.640
4.620
4.600
4.580
V
DD = 4.4V
0.040
0.030
0.020
0.010
0.000
VHYS, Hysteresis
MCP112-475
+125°C
+85°C
-40°C
0.75
+25°C
VTRIP, V decreasing
-60
-20
20
60
100
140
0.00
0.25
0.50
1.00
IOL (mA)
Temperature (°C)
FIGURE 2-9:
V
and V
vs.
FIGURE 2-12:
V
vs. I
OL OL
TRIP
HYST
Temperature (MCP112-475).
(MCP112-475 @ V = 4.4V).
DD
DS20001889F-page 6
2004-2016 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.120
3.150
3.100
3.050
3.000
2.950
2.900
MCP111-195
VDD = 1.7 V
IOL = 1.00 mA
MCP112-300
VDD = 3.1V
0.100
0.080
0.060
0.040
0.020
0.000
IOL = 0.75 mA
IOL = 0.50 mA
-40 °C
+85 °C
+25 °C
IOL = 0.25 mA
IOL = 0.00 mA
80
+125 °C
-40
0
40
Temperature (°C)
120
0.00
0.25
0.50
0.75
1.00
IOL (mA)
FIGURE 2-13:
V
vs. Temperature
FIGURE 2-16:
V
vs. I
OH OH
OL
(MCP111-195 @ V = 1.7V).
(MCP112-300 @ V = 3.1V).
DD
DD
0.080
4.820
4.800
4.780
4.760
4.740
4.720
4.700
4.680
MCP112-475
DD = 4.8V
MCP112-300
VDD = 2.7V
IOL = 1.00 mA
0.070
V
0.060
0.050
0.040
0.030
0.020
0.010
0.000
IOL = 0.75 mA
IOL = 0.50 mA
+25 °C
-40 °C
IOL = 0.25 mA
IOL = 0.00 mA
+85 °C
+125 °C
-40
0
40
80
120
0.00
0.25
0.50
OL (mA)
0.75
1.00
Temperature (°C)
I
FIGURE 2-14:
V
vs. Temperature
FIGURE 2-17:
V
vs. I
OH OH
OL
(MCP112-300 @ V = 2.7V).
(MCP112-475 @ V = 4.8V).
DD
DD
0.050
600
IOL = 1.00 mA
MCP112-475
VDD = 4.4V
0.040
500
MCP111-195
IOL = 0.75 mA
IOL = 0.50 mA
400
300
200
100
0
MCP112-300
MCP112-475
0.030
0.020
0.010
0.000
IOL = 0.25 mA
IOL = 0.00 mA
0.001
0.01
0.1
1
10
-40
0
40
80
120
VTRIP(min) - VDD
Temperature (°C)
FIGURE 2-15:
V
vs. Temperature
FIGURE 2-18:
Typical Transient Response
OL
(MCP112-475 @ V = 4.4V).
(25 °C).
DD
2004-2016 Microchip Technology Inc.
DS20001889F-page 7
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
350
300
250
200
150
100
50
400
350
300
250
200
150
100
50
MCP111-195
MCP111-195
VDD decreasing from:
5V - 1.7V
VDD increasing from:
0V - 2.1V
VDD decreasing from:
TRIP(max) + 0.25V to VTRIP(min) - 0.25V
V
VDD increasing from:
0V - 2.8V
VDD increasing
from: 0V - 4.0V
VDD decreasing from:
5V - 0V
VDD increasing
from: 0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
t
vs. Temperature
FIGURE 2-22:
t
vs. Temperature
RPD
RPU
(MCP111-195).
(MCP111-195).
140
120
100
80
160
MCP112-300
MCP112-300
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 3.1V
140
120
100
80
VDD increasing from:
0V - 3.3V
VDD decreasing from:
5V - 2.7V
VDD increasing from:
0V - 4.0V
60
60
40
40
VDD decreasing from:
5V - 0V
20
20
VDD increasing from:
0V - 5.5V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-20:
t
vs. Temperature
FIGURE 2-23:
t
vs. Temperature
RPD
RPU
(MCP112-300).
(MCP112-300).
250
250
200
150
100
50
MCP112-475
MCP112-475
VDD decreasing from:
5V - 4.4V
VDD increasing from:
0V - 4.9V
200
150
100
50
VDD increasing from:
0V - 5.0V
VDD decreasing from:
VTRIP(max) + 0.25V to VTRIP(min) - 0.25V
VDD increasing from:
0V - 5.5V
VDD decreasing from:
5V - 0V
0
0
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-21:
t
vs. Temperature
FIGURE 2-24:
t
vs. Temperature
RPD
RPU
(MCP112-475).
(MCP112-475).
DS20001889F-page 8
2004-2016 Microchip Technology Inc.
MCP111/112
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP111;
see Figure 4-1), TA = -40°C to +125°C.
0.1500
0.1400
0.1300
0.1200
0.1100
0.1000
0.0900
0.0800
60
55
MCP112-475
MCP111-195
50
45
40
35
30
25
20
VDD increasing from:
0V - 2.1V
VDD increasing from:
0V - 5.0V
VDD increasing from:
0V - 4.9V
VDD increasing from:
0V - 5.5V
VDD increasing
from: 0V - 4.0V
VDD increasing from:
0V - 5.5V
VDD increasing from:
VDD increasing from:
0V - 4.8V
0V - 2.8V
-40
-15
10
35
60
85
110
-40
-15
10
35
60
85
110
Temperature (°C)
Temperature (°C)
FIGURE 2-25:
t
vs. Temperature
FIGURE 2-27:
t
vs. Temperature
RT
RT
(MCP111-195).
(MCP112-475).
0.4
1.E-02
10m
VDD increasing from:
0V - 3.1V
VDD increasing from:
1.E-03
1m
0.35
1.E-04
100µ
0V - 3.3V
0.3
0.25
0.2
1.E-05
10µ
1.E-06
1µ
125°C
25°C
1.E-07
100n
1.E-08
10n
VDD increasing from:
0V - 5.5V
1.E-09
0.15
0.1
1n
1.E-10
100p
VDD increasing from:
0V - 4.0V
1.E-11
10p
- 40°C
1.E-12
1p
0.05
0
MCP112-300
1.E-13
100f
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
-40
-15
10
35
60
85
110
Pull-Up Voltage (V)
Temperature (°C)
FIGURE 2-26:
(MCP112-300).
t
vs. Temperature
FIGURE 2-28:
Current vs. Voltage Applied to V
Open-Drain Leakage
RT
Pin
OUT
(MCP111-195).
2004-2016 Microchip Technology Inc.
DS20001889F-page 9
MCP111/112
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Symbol
Function
SOT-23-3
SC-70
SOT-89-3
T0-92
1
1
1
VOUT
Output State
VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
2
3
3
2
4
3
2
VSS
VDD
VDD
Ground reference
Positive power supply
Positive power supply
—
—
DS20001889F-page 10
2004-2016 Microchip Technology Inc.
MCP111/112
4.1
VTRIP Operation
4.0
APPLICATION INFORMATION
The voltage trip point (VTRIP) is determined on the falling
edge of VDD. The actual voltage trip point (VTRIPAC) will
be between the minimum trip point (VTRIPMIN) and the
maximum trip point (VTRIPMAX). There is a hysteresis on
this trip point to remove any “jitter” that would occur on
the VOUT pin when the device VDD is at the trip point.
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes is a brown-out condition, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a slowly
decaying power supply causes the microcontroller to
begin executing instructions without sufficient voltage to
sustain SRAM, thus producing indeterminate results.
Figure 4-1 shows a typical application circuit.
Figure 4-2 shows the state of the VOUT pin as
determined by the VDD voltage. The VTRIP specification
is for falling VDD voltages. When the VDD voltage is
rising, the VOUT pin will not be driven high until VDD is at
VTRIP + VHYS
.
VDD
3
VDD
VDD
PIC®
Microcontroller
0.1
µF
RPU
(1)
MCP11X
1
VOUT
MCLR
(Reset Input)
VSS
2
GND
Note 1: RPU may be required with the MCP111
due to the open-drain output. Resistor
RPU is not required with the MCP112.
FIGURE 4-1:
Typical Application Circuit.
VDD
VTRIPAC + VHYSAC
VTRIPMAX
VTRIPMIN
VTRIPAC
VTRIPAC
1V
VOUT
< 1 V is outside the
device specifications
FIGURE 4-2:
V
Operation as Determined by the V
and V
.
HYS
OUT
TRIP
Figure 4-3 shows a typical transient duration vs. reset
comparator overdrive for which the MCP111/112 will
not generate a reset pulse. It shows that the farther
below the trip point the transient pulse goes, the
duration of the pulse required to cause a reset gets
shorter. Figure 2-18 shows the transient response
characteristics for the MCP111/112.
4.2
Negative Going VDD Transients
The minimum pulse width (time) required to cause a
reset may be an important criteria in the implementa-
tion of a Power-on Reset (POR) circuit. This time is
referred to as transient duration, defined as the amount
of time needed for these supervisory devices to
respond to a drop in VDD. The transient duration time is
dependent on the magnitude of VTRIP – VDD. Generally
speaking, the transient duration decreases with
A 0.1 µF bypass capacitor, mounted as close as
possible to the VDD pin, provides additional transient
immunity (refer to Figure 4-1).
increases in VTRIP – VDD
.
2004-2016 Microchip Technology Inc.
DS20001889F-page 11
MCP111/112
4.3
Effect of Temperature on Time-Out
Period (tRPU
)
5V
VTRIP(MAX)
VTRIP(MIN)
The time-out period (tRPU) determines how long the
device remains in the reset condition. This is affected
by both VDD and temperature. The graph shown in
Figures 2-22, 2-23 and 2-24 show the typical response
for different VDD values and temperatures.
V
TRIP(MIN) - VDD
tTRANS
Time (µs)
0V
4.4
Using in PIC® Microcontroller
ICSP™ Applications (MCP111
only)
FIGURE 4-3:
Example of Typical
Transient Duration Waveform.
Figure 4-4 shows the typical application circuit for using
the MCP111 for voltage supervisory function when the
PIC microcontroller will be programmed via the In-Cir-
cuit Serial Programming™ (ICSP) feature. Additional
information is available in TB087, “Using Voltage
Supervisors with PIC® Microcontroller Systems which
Implement
In-Circuit
Serial
Programming™”,
DS91087.
Note:
It is recommended that the current into the
RST pin be current limited by a 1 k
resistor.
VDD/VPP
0.1 µF
VDD
RPU
VDD
PIC®
MCU
MCP111
MCLR
(reset input)
(Active-Low)
RST
VSS
1 k
VSS
FIGURE 4-4:
for PIC Microcontroller with the ICSP™ feature.
Typical Application Circuit
®
DS20001889F-page 12
2004-2016 Microchip Technology Inc.
MCP111/112
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Lead TO-92
Example:
Device
Code
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP111
240E
MCP111-240E/TO
MCP111-270E/TO
MCP111-290E/TO
MCP111-300E/TO
MCP111-315E/TO
MCP111-450E/TO
MCP111-475E/TO
MCP111-195I/TO
240E
270E
290E
300E
315E
450E
475E
195I
TO^
e3
626256
Example:
MP25
3-Lead SOT-23
Device
Code
MCP111T-195I/TT
MCP111T-240ETT
MPNN
MQNN
MCP111T-270E/TT MGNN
MCP111T-290E/TT
MCP111T-300E/TT
NHNN
MJNN
XXNN
MCP111T-315E/TT MKNN
MCP111T-450E/TT MLNN
MCP111T-475E/TT MMNN
MCP112T-195I/TT
MCP112T-240ETT
MRNN
MSNN
MCP112T-270E/TT MANN
MCP112T-290E/TT MBNN
MCP112T-300E/TT MCNN
MCP112T-315E/TT MDNN
MCP112T-450E/TT MENN
MCP112T-475E/TT MFNN
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
e
3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2004-2016 Microchip Technology Inc.
DS20001889F-page 13
MCP111/112
Package Marking Information (Continued)
3-Lead SC-70
Example:
EP25
Device
MCP111T-195I/LB
Code
EPNN
MCP111T-240E/LB EQNN
MCP111T-270E/LB EGNN
MCP111T-290E/LB EHNN
MCP111T-300E/LB
EJNN
MCP111T-315E/LB EKNN
MCP111T-450E/LB ELNN
MCP111T-475E/LB EMNN
MCP112T-195I/LB
ERNN
MCP112T-240E/LB ESNN
MCP112T-270E/LB EANN
MCP112T-290E/LB EBNN
MCP112T-300E/LB ECNN
MCP112T-315E/LB EDNN
MCP112T-450E/LB EENN
MCP112T-475E/LB EFNN
3-Lead SOT-89
Example:
Device
Code
MCP111T-195I/MB
MCP111T-240EMB
MCP111T-270E/MB
MCP111T-290E/MB
MCP111T-300E/MB
MCP111T-315E/MB
MCP111T-450E/MB
MCP111T-475E/MB
MCP112T-195I/MB
MCP112T-240EMB
MCP112T-270E/MB
MCP112T-290E/MB
MCP112T-300E/MB
MCP112T-315E/MB
MCP112T-450E/MB
MCP112T-475E/MB
MP
MQ
MG
NH
MJ
MP1626
256
NNN
MK
ML
MM
MR
MS
MA
MB
MC
MD
ME
MF
DS20001889F-page 14
2004-2016 Microchip Technology Inc.
MCP111/112
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2004-2016 Microchip Technology Inc.
DS20001889F-page 15
MCP111/112
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DS20001889F-page 16
2004-2016 Microchip Technology Inc.
MCP111/112
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2004-2016 Microchip Technology Inc.
DS20001889F-page 17
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
e
e
B
E
2
1
E1
2X
0.15 C
2X
N
3X TIPS
0.30 C
0.15 C
3X b
0.10
C A B
TOP VIEW
c
A2
A
C
SEATING
PLANE
A1
L
SIDE VIEW
END VIEW
Microchip Technology Drawing C04-060C Sheet 1 of 2
DS20001889F-page 18
2004-2016 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Pitch
N
e
3
0.65 BSC
Overall Height
Standoff
Molded Package Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
A
A1
A2
D
D2
E
E1
b
L
c
0.80
0.00
0.80
-
-
1.10
0.10
1.00
-
2.00 BSC
2.60
2.10 BSC
1.25 BSC
-
2.50
2.70
0.15
0.10
0.20
0.40
0.46
0.26
Terminal Length
Lead Thickness
0.20
-
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-060C Sheet 2 of 2
2004-2016 Microchip Technology Inc.
DS20001889F-page 19
MCP111/112
3-Lead Plastic Small Outline Transistor (LB) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
2
1
SILK SCREEN
C
G
Y
3
X
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
0.65 BSC
2.20
MIN
1.25
MAX
Contact Pitch
E
C
X
Y
G
Contact Pad Spacing
Contact Pad Width
Contact Pad Length
Distance Between Pads
0.50
0.85
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2060B
DS20001889F-page 20
2004-2016 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (MB) - [SOT-89]
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2004-2016 Microchip Technology Inc.
DS20001889F-page 21
MCP111/112
3-Lead Plastic Small Outline Transistor (MB) - [SOT-89]
Note: )RUꢀWKHꢀPRVWꢀFXUUHQWꢀSDFNDJHꢀGUDZLQJVꢇꢀSOHDVHꢀVHHꢀWKHꢀ0LFURFKLSꢀ3DFNDJLQJꢀ6SHFLILFDWLRQꢀORFDWHGꢀDW
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DS20001889F-page 22
2004-2016 Microchip Technology Inc.
MCP111/112
3-Lead Plastic Small Outline Transistor (MB) - [SOT-89]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
X2
Y1
Y3
Y4
Y2
Y
G
X
SILK SCREEN
C
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
C
1.50 (BSC)
0.900
X (3 PLACES)
X1
1.733
X2 (2 PLACES)
0.416
G (2 PLACES)
0.600
Y (2 PLACES)
1.300
Y1
Y2
Y3
Y4
3.125
1.475
0.825
1.000
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2029C
2004-2016 Microchip Technology Inc.
DS20001889F-page 23
MCP111/112
5.2
Product Tape and Reel Specifications
Top
Cover
Tape
A0
W
B0
P
K0
FIGURE 5-1:
Embossed Carrier Dimensions (8, 12, 16 and 24 mm tape only).
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Dimensions
Cavity
Dimensions
Output
Quantity
Units
Reel
Diameter in
mm
Case
Outline
Package
Type
W
P
A0
mm
B0
mm
K0
mm
mm
mm
TT
LB
SOT-23B
SC-70
3L
3L
8
8
4
4
3.15
2.4
2.77
2.4
1.22
1.19
3000
3000
180
180
User Direction of Feed
Device
Marking
W
PIN 1
P
Standard Reel Component Orientation
FIGURE 5-2:
3-Lead SOT-23/SC70 Device Tape and Reel Specifications.
DS20001889F-page 24
2004-2016 Microchip Technology Inc.
MCP111/112
User Direction of Feed
P
Device
Marking
MARK
FACE
MARK
FACE
MARK
FACE
Seal
Tape
Back
Tape
W
Note:
Bent leads are for Tape and Reel only.
FIGURE 5-3:
TO-92 Devices.
User Direction of Feed
W, Width
of Carrier
Tape
Pin 1
Pin 1
P, Pitch
Reverse Reel Component Orientation
Standard Reel Component Orientation
FIGURE 5-4:
SOT-89 Devices.
2004-2016 Microchip Technology Inc.
DS20001889F-page 25
MCP111/112
NOTES:
DS20001889F-page 26
2004-2016 Microchip Technology Inc.
MCP111/112
APPENDIX A: REVISION HISTORY
Revision F (July 2016)
The following is the list of modifications:
1. Updated Table 3-1.
2. Updated Section 5.0 “Packaging informa-
tion”.
3. Minor typographical corrections.
Revision E (January 2013)
• Added a note to each package outline drawing.
Revision D (June 2005)
1. Added
SOT-89-3
package
information
throughout.
Revision C (March 2005)
The following is the list of modifications:
1. Added Section 4.4 “Using in PIC® Microcon-
troller ICSP™ Applications (MCP111 only)”
on using the MCP111 in PIC microcontroller
ICSP applications.
2. Added VODH specifications in Section 1.0
“Electrical
Characteristics”
(for
ICSP
applications).
3. Added Figure 2-28.
4. Added devices features table to page 1.
5. Updated SC-70 package markings and added
Pb-free marking information to Section 5.0
“Packaging information”.
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
1. Corrected package marking information in
Section 5.0 “Packaging information”.
Revision A (May 2004)
• Original release of this document.
2004-2016 Microchip Technology Inc.
DS20001889F-page 27
MCP111/112
NOTES:
DS20001889F-page 28
2004-2016 Microchip Technology Inc.
MCP111/112
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X
XXX
X
XX
a)
MCP111T-195I/TT: Tape and Reel,
Temperature Package
Range
Tape/Reel
Option
Monitoring
Options
1.95V option, open-drain,
-40°C to +85°C,
SOT-23B package.
b)
MCP111T-315E/LB: Tape and Reel,
3.15V option, open-drain,
-40°C to +125°C,
SC-70-3 package.
Device:
MCP111: MicroPower Voltage Detector, open-drain
MCP111T: MicroPower Voltage Detector, open-drain
(Tape and Reel)
c)
d)
MCP111-300E/TO: 3.00V option, open-drain,
-40°C to +125°C,
TO-92-3 package.
MCP111-315E/MB: 3.15V option, open-drain,
-40°C to +125°C,
MCP112: MicroPower Voltage Detector, push-pull
MCP112T: MicroPower Voltage Detector, push-pull
(Tape and Reel)
Monitoring Options:
195 = 1.90V
240 = 2.32V
270 = 2.63V
290 = 2.90V
300 = 2.93V
315 = 3.08V
450 = 4.38V
475 = 4.63V
SOT-89-3 package.
a)
b)
MCP112T-290E/TT: Tape and Reel,
2.90V option, push-pull, -
40°C to +125°C,
SOT-23B-3 package.
MCP112T-475E/LB: Tape and Reel,
4.75V option, push-pull,
-40°C to +125°C,
SC-70-3 package.
MCP112-450E/TO: 4.5V option, push-pull,
-40°C to +125°C,
TO-92-3 package.
MCP112-315E/MB: 3.15V option, push-pull,
-40°C to +125°C,
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C (MCP11X-195 only)
-40°C to +125°C (Except MCP11X-195 only)
c)
d)
LB
MB
TO
TT
=
=
=
=
SC-70, 3-lead
SOT-89, 3-lead
TO-92, 3-lead
SOT-23B, 3-lead
SOT-89-3 package.
2004-2016 Microchip Technology Inc.
DS20001889F-page 29
MCP111/112
NOTES:
DS20001889F-page 30
2004-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITYꢀMANAGEMENTꢀꢀSYSTEMꢀ
CERTIFIEDꢀBYꢀDNVꢀ
© 2004-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0860-4
== ISO/TSꢀ16949ꢀ==ꢀ
2004-2016 Microchip Technology Inc.
DS20001889F-page 31
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
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Web Address:
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Japan - Tokyo
Tel: 81-3-6880- 3770
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China - Dongguan
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Italy - Venice
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Chicago
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Netherlands - Drunen
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Indianapolis
Noblesville, IN
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Fax: 317-773-5453
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Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
China - Xian
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Fax: 86-29-8833-7256
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Tel: 66-2-694-1351
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Canada - Toronto
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Fax: 905-695-2078
06/23/16
DS20001889F-page 32
2004-2016 Microchip Technology Inc.
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