MCP130T-300HI/TO [MICROCHIP]
IC,VOLT DETECTOR,FIXED,+2.93V,CMOS,SIP,3PIN,PLASTIC;型号: | MCP130T-300HI/TO |
厂家: | MICROCHIP |
描述: | IC,VOLT DETECTOR,FIXED,+2.93V,CMOS,SIP,3PIN,PLASTIC |
文件: | 总16页 (文件大小:157K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP120/130
Microcontroller Supervisory Circuit with Open Drain Output
FEATURES
PACKAGES
• Holds microcontroller in reset until supply voltage
reaches stable operating level
TO-92 WITH
TO-92 with
‘F’ BONDOUT
‘D’ Bondout
• Resets microcontroller during power loss
• Precision monitoring of 3V, 3.3V and 5V systems
• 7 voltage trip points available
• Active low RESET pin
VSS
VDD
RST
VSS
VDD
• Open drain output
RST
• Internal pull-up resistor (5 kΩ) for MCP130
• Holds RESET for 350 ms (typical)
• RESET to VCC = 1.0V
MCP120
MCP130
MCP130
• Accuracy of ±125 mV for 5V systems and ±75 mV
for 3V systems over temperature
TO-92 with
‘G’ Bondout
TO-92 with
‘H’ Bondout
• 45 µA typical operating current
• Temperature range:
- Industrial (I): -40°C to +85°C
VDD
VDD
VSS
RST
DESCRIPTION
VSS
RST
The Microchip Technology Inc. MCP120/130 is a volt-
age supervisory device designed to keep a microcon-
troller in reset until the system voltage has reached the
proper level and stabilized. It also operates as protec-
tion from brown-out conditions when the supply voltage
drops below a safe operating level. Both devices are
available with a choice of seven different trip voltages
and both have open drain outputs. The MCP130 has an
internal 5 kΩ pullup resistor. Both devices have active
low RESET pins. The MCP120/130 will assert the
RESET signal whenever the voltage on the VDD pin is
below the trip-point voltage.
MCP120
MCP120
MCP130
SOT-23-3
150mil SOIC
RST
VDD
1
2
3
4
8
7
6
5
NC
NC
NC
NC
RST
VSS
NC
VDD
VSS
MCP120
MCP130
MCP120
MCP130
BLOCK DIAGRAM
VDD
5kΩ internal
pull-up on
Comparator
MCP130
only
+
-
Delay
Circuit
Output
Driver
RESET
Bandgap
Reference
2001 Microchip Technology Inc.
DS11184D-page 1
MCP120/130
1.0
1.1
ELECTRICAL CHARACTERISTICS
Maximum Ratings*
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
VDD........................................................................7.0V
All inputs and outputs w.r.t. VSS .....-0.6V to VDD +1.0V
Storage temperature ..........................-65°C to +150°C
Ambient temp. with power applied.....-65°C to +125°C
ESD protection on all pins ..................................... ≥ 2 kV
DC AND AC CHARACTERISTICS
All parameters apply at the
specified temp and voltage
ranges unless otherwise noted.
VDD = 1.0 - 5.5V
Industrial (I): -40°C to +85°C
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Operating Voltage Range
VDD Value to RESET
Operating Current
VDD
1.0
1.0
—
—
—
45
5.5
—
V
V
VDD
MIN
IDD
60
µA
V
VDD = 5.5V (no load)
VDD Trip Point MCP1X0-270
MCP1X0-300
VTRIP
2.55
2.85
3.0
4.25
4.35
4.50
4.60
2.625
2.925
3.075
4.375
4.475
4.625
4.725
2.7
3.0
MCP1X0-315
MCP1X0-450
MCP1X0-460
MCP1X0-475
3.15
4.50
4.60
4.75
4.85
MCP1X0-485
RESET Low
Level Output
Voltage
MCP1X0-270
MCP1X0-300
MCP1X0-315
VOL
—
—
0.4
V
V
IOL = 3.2 mA,
VDD = VTRIP
MIN
MCP1X0-450
MCP1X0-460
MCP1X0-475
MCP1X0-485
—
—
0.6
IOL = 8.5 mA,
VDD = VTRIP
MIN
RESET High
Level Output
Voltage
MCP130-xxx
(All VTRIP
Points)
VOH
VDD-0.7
—
—
IOH = 50 µA,VDD > VTRIP
MAX
(MCP130 Only)
Pull-up Resistor (MCP130 Only)
Output Leakage (MCP120 Only)
Threshold Hysteresis
—
—
5
1
—
—
kΩ
µA
mV
ms
µs
VHYS
tRPU
tRPD
—
50
350
10
—
VDD Detect to RESET Inactive
VDD Detect to RESET
150
—
700
—
VDD ramped from VTRIP
MAX +
250 mV down to VTRIP
250 mV
-
MIN
Note: Typical values are for 25°C and VDD = 5.0V
2001 Microchip Technology Inc.
DS11184D-page 2
MCP120/130
VTRIP
VDD
tRPU
tRPD
VOH
RESET
VOH
Figure 1-1: MCP120/130 Timing Diagram
2001 Microchip Technology Inc.
DS11184D-page 3
MCP120/130
2.0
2.1
APPLICATIONS INFORMATION
The Need for Supervisory Circuits
5V
For many of today’s microcontroller applications, care
must be taken to prevent low power conditions that can
cause many different system problems. The most com-
mon causes are brown-out conditions where the sys-
tem supply drops below the operating level momentar-
ily, and the second, is when a slowly decaying power
supply causes the microcontroller to begin executing
instructions without enough voltage to sustain SRAM
and producing indeterminate results.
VTRIP
VTRIP
MAX
MIN
(VTRIPMIN - VDD)
Transient
Duration
0
TIME
0
VDD
VDD
Microcontroller
VDD
10
8
Bypass
Capacitor
MCP120
TA = +25°C
VSS
MCLR
or
RESET
RST
6
Transients above the
curve will cause a reset
4
VSS
2
Transients below
the curve will NOT
cause a reset
0
Figure 2-1: Typical Application
2.2 Negative Going VDD Transients
0
1
2
3
4
5
VTRIP - VDD (V)
Many system designers implementing POR circuits are
concerned about the minimum pulse width required to
cause a reset. Figure 2-2 shows typical transient
voltage below the trip point (VTRIP - VDD) vs. transient
duration. It shows that the farther below the trip point
the transient pulse goes, the duration of the pulse
required to cause a reset gets shorter. A 0.1 µF bypass
cap mounted as close as possible to the VDD pin pro-
vides additional transient immunity.
Figure 2-2: Typical Transient Response
DS11184D-page 4
2001 Microchip Technology Inc.
MCP120/130
2.3
Effect of Temperature on Timeout
Period (tRPU)
1.002
1.000
0.998
0.996
0.994
0.992
0.997
The timeout period (tRPU) determines how long the
device remains in the reset condition. This is controlled
by an internal RC timer and is effected by both VDD
and temperature. The graph shown in Figure 2-3
shows typical response for different VDD values and
temperatures.
700
600
VDD = 6V
-40 -20
0
20
40
60
80 100
500
TEMPERATURE (°C)
VDD = 5V
* Multiply value at 25°C by this
factor to determine the value at
temperature
400
300
Figure 2-5: Normalized VTRIP vs. Temperature
VDD = 4V
200
100
VDD = 3V
800
VDD = 2.5V
-40 -20
0
20
40
60
80 100
700
TEMPERATURE (°C)
VDD = 1.5V
VDD = 3.5V
600
500
400
Figure 2-3: tRPU vs. Temperature
VDD = 4.5V
60
300
200
VDD = 5V
50
VDD = 5.5V
100
TA = +25°C
40
0
0
2
4
6
8
10 12 14 16 18 20
30
IOL (mA)
VDD = 3V
VDD = 4V
20
Figure 2-6: VOL vs. IOL
10
0
1.3
1.2
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
1.1
Figure 2-4: IDD vs. Temperature
1.00
0.9
0.8
0.7
-40 -20
0
20
40
60
80 100
TEMPERATURE (°C)
* Multiply value at 25°C by this
factor to determine the value at
temperature
Figure 2-7: Normalized IOL vs. Temperature
2001 Microchip Technology Inc.
DS11184D-page 5
MCP120/130
3.0
3.1
PACKAGING INFORMATION
Package Marking Information
3-Lead Plastic Transistor Outline (TO-92)
Example:
MCP120
XXXXXX
XXXXXX
XXXXXX
YWWNNN
XXXXXX
XXXXXX
YWWNNN
8-Lead Plastic Small Outline (SOIC)
Example:
XXXXXXXX
XXXXYYWW
MCP120
XXXXYYWW
NNN
NNN
3-Lead Plastic Small Outline Transistor (SOT23)
XXNN
Example:
PKNN
SOT23 PARTS LABELING:
The table below identifies the first 2 characters (XX) in the 4-character field
(XXNN) for marking of the 3-Lead SOT23 package.
Mark
Part Number
Mark
Part Number
SJ
SK
SL
MCP120T-270I/TT
MCP120T-300I/TT
MCP120T-315I/TT
MCP120T-450I/TT
MCP120T-460I/TT
MCP120T-475I/TT
MCP120T-485I/TT
PJ
PK
PL
MCP130T-270I/TT
MCP130T-300I/TT
MCP130T-315I/TT
MCP130T-450I/TT
MCP130T-460I/TT
MCP130T-475I/TT
MCP130T-485I/TT
SM
SN
SO
SP
PM
PN
PO
PP
Legend: XX...X Customer specific information*
YY
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*
Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
For OTP marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
DS11184D-page 6
2001 Microchip Technology Inc.
MCP120/130
3.2
Package Detail Information
3-Lead Plastic Transistor Outline (TO) (TO-92)
E1
D
n
1
L
1
2
3
α
B
p
c
A
R
β
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
3
3
Pitch
.050
.143
.186
.183
.090
.555
.017
.019
5
1.27
3.62
4.71
4.64
2.29
14.10
0.43
0.48
5
Bottom to Package Flat
Overall Width
A
E1
D
R
L
.130
.155
3.30
3.94
.175
.170
.085
.500
.014
.016
4
.195
.195
.095
.610
.020
.022
6
4.45
4.32
2.16
12.70
0.36
0.41
4
4.95
4.95
2.41
15.49
0.51
0.56
6
Overall Length
Molded Package Radius
Tip to Seating Plane
Lead Thickness
Lead Width
c
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
2
3
4
2
3
4
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
2001 Microchip Technology Inc.
DS11184D-page 7
MCP120/130
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
E
E1
2
B
p1
D
n
p
1
α
c
A
A2
A1
φ
β
L
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
3
MAX
n
p
Number of Pins
3
Pitch
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
0.96
1.92
p1
Outside lead pitch (basic)
Overall Height
A
A2
A1
E
.035
.044
0.89
0.88
1.01
0.95
0.06
2.37
1.30
2.92
0.45
5
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
Molded Package Thickness
.035
.000
.083
.047
.110
.014
0
.040
.004
.104
.055
.120
.022
10
Standoff
§
0.01
2.10
1.20
2.80
0.35
0
Overall Width
Molded Package Width
Overall Length
E1
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.004
.015
0
.006
.017
5
.007
.020
10
0.09
0.37
0
0.14
0.44
5
0.18
0.51
10
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
5
10
0
5
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS11184D-page 8
2001 Microchip Technology Inc.
MCP120/130
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
A1
Units
INCHES*
NOM
MILLIMETERS
Dimension Limits
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
8
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
Overall Height
A
.053
.069
1.35
1.75
Molded Package Thickness
Standoff
A2
A1
E
.052
.004
.228
.146
.189
.010
.019
0
.061
.010
.244
.157
.197
.020
.030
8
1.32
0.10
5.79
3.71
4.80
0.25
0.48
0
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
§
Overall Width
Molded Package Width
Overall Length
E1
D
Chamfer Distance
Foot Length
h
L
φ
Foot Angle
c
Lead Thickness
Lead Width
.008
.013
0
.009
.017
12
.010
.020
15
0.20
0.33
0
0.23
0.42
12
0.25
0.51
15
B
α
β
Mold Draft Angle Top
Mold Draft Angle Bottom
0
12
15
0
12
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
2001 Microchip Technology Inc.
DS11184D-page 9
MCP120/130
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DS11184D-page 10
2001 Microchip Technology Inc.
MCP120/130
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-7578.
Please list the following information, and use this outline to provide us with your comments about this Data Sheet.
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Telephone: (_______) _________ - _________
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Application (optional):
Would you like a reply?
Y
N
Literature Number:
DS11184D
Device:
MCP120/130
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
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8. How would you improve our software, systems, and silicon products?
2001 Microchip Technology Inc.
DS11184D-page 11
MCP120/130
NOTES:
DS11184D-page 12
2001 Microchip Technology Inc.
MCP120/130
NOTES:
2001 Microchip Technology Inc.
DS11184D-page 13
MCP120/130
PRODUCT IDENTIFICATION SYSTEM
To order or to obtain information (e.g., on pricing or delivery), please refer to the factory or the listed sales offices.
PART NO.
Device
X
X
X
/XX
Examples:
RESET/
Bondout Temperature
Option Range
Package
a)
MCP120–270I/SN = VTRIP range of 2.55V -
RESET
VTRIP
Voltage
2.70V, Industrial Temp., SOIC package
b)
MCP120–300DI/TO = VTRIP range of 2.85V -
3.00V, Bonding Option D, Industrial Temp.,
TO-92 package
Device:
MCP120:
Supervisor circuit with open drain output
c)
d)
e)
MCP120T–315I/TT = VTRIP range of 3.00V -
3.15V, Industrial Temp., SOT-23 package
MCP120T: Supervisor circuit with open drain output
(tape & reel)
MCP130:
Supervisor circuit with open drain output and
internal pull-up resistor
MCP130–450I/SN = VTRIP range of 4.25V -
4.50V, Industrial Temp., SOIC package
MCP130T: Supervisor circuit with open drain output and
internal pull-up resistor (tape & reel)
MCP130–460FI/TO = VTRIP range of 4.35V -
4.60V, Bonding Option F, Industrial Temp.,
TO-92 package
RESET/RESET VTRIP 270
Voltage
=
=
=
=
=
=
=
2.55 ≤ VTRIP ≤ 2.70
2.85 ≤ VTRIP ≤ 3.00
3.00 ≤ VTRIP ≤ 3.15
4.25 ≤ VTRIP ≤ 4.50
4.35 ≤ VTRIP ≤ 4.60
4.50 ≤ VTRIP ≤ 4.75
4.60 ≤ VTRIP ≤ 4.85
f)
MCP130T–475I/TT = Tape & Reel, VTRIP
range of 4.50V - 4.75V, Industrial Temp.,
SOT-23 package
300
315
450
460
475
485
TO-92 with
‘D’ Bondout
TO-92 with
‘F’ Bondout
Bondout Option:
(TO-92 Only)
D
F
G
H
=
=
=
=
D Bond Option (see bond option chart)
F Bond Option
G Bond Option
H Bond Option
RST
VSS
VSS
VDD
VDD
RST
Temperature Range:
Package:
I
=
-40°C to +85°C (only offered in I)
MCP120
MCP130
MCP130
SN
TO
TT
=
=
=
SOIC (8-lead, 150 mil body)
TO-92 (3-lead) [offered in bags only]
SOT-23 (3-lead) [offered in tape & reel only]
TO-92 with
‘G’ Bondout
TO-92 with
‘H’ Bondout
VDD
RST
VDD
VSS
VSS
RST
MCP120
MCP120
MCP130
Sales and Support
Data Sheets
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DS11184D-page 14
2001 Microchip Technology Inc.
MCP120/130
“All rights reserved. Copyright © 2001, Microchip
Technology Incorporated, USA. Information contained
in this publication regarding device applications and the
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superseded by updates. No representation or warranty
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© 2001, Microchip Technology Incorporated, Printed in
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2001 Microchip Technology Inc.
DS11184D-page 15
WORLDWIDE SALES AND SERVICE
New York
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
ASIA/PACIFIC (continued)
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea
Tel: 631-273-5305 Fax: 631-273-5335
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Rocky Mountain
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 408-436-7950 Fax: 408-436-7955
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-7456
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
Atlanta
500 Sugar Mill Road, Suite 200B
Atlanta, GA 30350
Tel: 65-334-8870 Fax: 65-334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Tel: 770-640-0034 Fax: 770-640-0307
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Suite 22, 41 Rawson Street
Epping 2121, NSW
Austin
Analog Product Sales
8303 MoPac Expressway North
Suite A-201
Austin, TX 78759
Tel: 512-345-2030 Fax: 512-345-6085
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
EUROPE
Denmark
Microchip Technology Denmark ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
Microchip Technology Beijing Office
Unit 915
New China Hong Kong Manhattan Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Boston
Analog Product Sales
Unit A-8-1 Millbrook Tarry Condominium
97 Lowell Road
Concord, MA 01742
Tel: 978-371-6400 Fax: 978-371-0050
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
France
China - Shanghai
Microchip Technology Shanghai Office
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Arizona Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Arizona Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Dallas
Hong Kong
Microchip Asia Pacific
RM 2101, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Dayton
Two Prestige Place, Suite 130
Miamisburg, OH 45342
Tel: 937-291-1654 Fax: 937-291-9175
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Germany
Analog Product Sales
Lochhamer Strasse 13
D-82152 Martinsried, Germany
Tel: 49-89-895650-0 Fax: 49-89-895650-22
India
Microchip Technology Inc.
India Liaison Office
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Divyasree Chambers
Italy
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Arizona Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Japan
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
Microchip Technology Intl. Inc.
Benex S-1 6F
Tel: 949-263-1888 Fax: 949-263-1338
United Kingdom
Arizona Microchip Technology Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Mountain View
Analog Product Sales
1300 Terra Bella Avenue
Mountain View, CA 94043-1836
Tel: 650-968-9241 Fax: 650-967-1590
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
01/30/01
All rights reserved. © 2001 Microchip Technology Incorporated. Printed in the USA. 2/01
Printed on recycled paper.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by
updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual
property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, except as maybe explicitly expressed herein, under any intellec-
tual property rights. The Microchip logo and name are registered trademarks of Microchip Technology Inc. in the U.S.A. and other countries. All rights
reserved. All other trademarks mentioned herein are the property of their respective companies.
DS11184D-page 16
2001 Microchip Technology Inc.
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