MCP1320-31LE/OT [MICROCHIP]
Power Supply Management Circuit;
| 型号： | MCP1320-31LE/OT |
| 厂家： | 
MICROCHIP |
| 描述： | Power Supply Management Circuit |
| 文件： | 总52页 (文件大小：723K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP131X/2X
Voltage Supervisor
Features:
Package Types
SOT-23-5
• Low Supply Current: 1 µA (Typical),10 µA (Max.)
• Precision Monitoring Trip Point Options:
- 2.9V and 4.6V (Standard Offerings)
MCP1316/16M/20
MCP1317
VDD
WDI
RST
VSS
RST
1
2
3
5
1
2
3
VDD
WDI
5
- 2.0V to 4.7V in 100 mV Increments,
(Contact the local Microchip Sales Office)
VSS
MR
4
MR
4
• Resets Microcontroller in a Power-loss Event
• Reset Delay Time-Out Option:
MCP1318/18M/21
MCP1319/19M/22
- 1.4 ms, 30 ms, 200 ms, or 1.6s (Typical)
• Watchdog Timer Input Time-Out Options:
- 6.3 ms, 102 ms, 1.6s, or 25.6s (Typical)
• Manual Reset (MR) Input (Active-low)
• Single and Complementary Reset Output(s)
• Reset Output Options:
VDD
VDD
RST
VSS
1
2
3
5
RST
VSS
1
2
3
5
RST
4
4
RST
MR
WDI
- Push-Pull (Active-high or Active-low)
- Open-Drain (Internal or External Pull-up)
• Temperature Range:
Block Diagram
VDD
Comparator
- -40°C to +85°C for Trip Points 2.0 to 2.4V and,
- -40°C to + 125°C for Trip Points > 2.5V
+
–
RST
RST
• Voltage Range: 1.0V to 5.5V
• Lead Free Packaging
Output
Driver
Reference
Voltage
Description:
MR
The MCP131X/2X are voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. The table
below shows the available features for these devices.
Noise Filter
Watchdog
VSS
WDI
Note: Features available depend on the device.
Device Features
Reset Output A
Device
Reset Output B
WDI Input
MR Input
Pull-up
Active
Pull-up
Active
Type
Type
Resistor Level
Resistor Level
MCP1316
MCP1316M
MCP1317
MCP1318
MCP1318M
MCP1319
MCP1319M
MCP1320
MCP1321
MCP1322
Push-Pull
—
Low
Low
High
Low
Low
Low
Low
Low
Low
Low
—
—
—
—
—
—
—
—
—
—
—
—
Yes
Yes
Yes
Yes
Yes
No
Yes
Yes
Yes
No
Open-Drain
Push-Pull
Internal
—
—
—
—
—
Push-Pull
—
Push-Pull
Push-Pull
Push-Pull
Push-Pull
—
High
High
High
High
—
Open-Drain
Push-Pull
Internal
—
No
Yes
Yes
Yes
No
Open-Drain
Open-Drain
Open-Drain
Open-Drain
Internal
External
External
External
No
Yes
Yes
No
Push-Pull
Push-Pull
High
High
Yes
2005-2012 Microchip Technology Inc.
DS21985D-page 1
MCP131X/2X
NOTES:
DS21985D-page 2
2005-2012 Microchip Technology Inc.
MCP131X/2X
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage (V to V ). . . . . . . . . . . . . . . . . . . . . . 7.0V
DD
SS
Input current (V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
DD
Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA
Voltage on all inputs and outputs, except Open-Drain RST
(with no internal pull-up resistor), w.r.t. V
1.0V)
. .-0.6V to (V
+
SS
DD
Voltage on Open-Drain RST
(with no internal pull-up resistor) w.r.t. V
. . -0.6V to 13.5V
SS
Storage temperature . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Ambient temp. with power applied . . . . . . . .-40°C to +125°C
Maximum Junction temp. with power applied . . . . . . .+150°C
Power Dissipation (T +70°C):
A
5-Pin SOT-23A .......................................................240 mW
ESD protection on all pins 4 kV
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Operating Voltage Range
Specified VDD Value to VOUT Low
Operating Current:
VDD
VDD
IDD
1.0
1.0
—
—
—
5
5.5
—
10
2
V
V
I RST = 10 µA, V RST < 0.3V
Watchdog Timer Active
Watchdog Timer Inactive
µA
µA
µA
µA
—
1
—
1
2
VDD < VTRIP
—
5
10
Reset Delay Timer Active
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc.
DS21985D-page 3
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
VDD Trip Point
Sym
Min
Typ
Max
Units
Conditions
MCP13XX-20 VTRIP
(Note 6)
1.970
1.950
2.069
2.048
2.167
2.145
2.266
2.243
2.364
2.340
2.463
2.438
2.561
2.535
2.660
2.633
2.758
2.730
2.857
2.828
2.955
2.925
3.054
3.023
3.152
3.120
3.251
3.218
2.00
2.00
2.10
2.10
2.20
2.20
2.30
2.30
2.40
2.40
2.50
2.50
2.60
2.60
2.70
2.70
2.80
2.80
2.90
2.90
3.00
3.00
3.10
3.10
3.20
3.20
3.30
3.30
2.030
2.050
2.132
2.153
2.233
2.255
2.335
2.358
2.436
2.460
2.538
2.563
2.639
2.665
2.741
2.768
2.842
2.870
2.944
2.973
3.045
3.075
3.147
3.178
3.248
3.280
3.350
3.383
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
TA = +25°C (Note 1)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-21
(Note 6)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-22
(Note 6)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-23
(Note 6)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-24
(Note 6)
TA = -40°C to +85°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-25
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-26
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-27
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-28
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-29
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-30
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-31
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-32
(Note 6)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-33
(Note 6)
TA = -40°C to +125°C (Note 2)
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 4
2005-2012 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD Trip Point (Con’t) MCP13XX-34 VTRIP
(Note 6)
3.349
3.315
3.448
3.413
3.546
3.510
3.645
3.608
3.743
3.705
3.842
3.803
3.940
3.900
4.039
3.998
4.137
4.095
4.236
4.193
4.334
4.290
4.433
4.388
4.531
4.485
4.630
4.583
—
3.40
3.40
3.50
3.50
3.60
3.60
3.70
3.70
3.80
3.80
3.90
3.90
4.00
4.00
4.10
4.10
4.20
4.20
4.30
4.30
4.40
4.40
4.50
4.50
4.60
4.60
4.70
4.70
±40
3.451
3.385
3.553
3.588
3.654
3.690
3.756
3.793
3.857
3.895
3.959
3.998
4.060
4.100
4.162
4.203
4.263
4.305
4.365
4.408
4.466
4.510
4.568
4.613
4.669
4.715
4.771
4.818
—
V
V
TA = +25°C (Note 1)
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-35
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-36
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-37
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-38
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-39
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-40
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-41
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-42
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-43
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-44
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-45
(Note 6)
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-46
V
V
TA = -40°C to +125°C (Note 2)
TA = +25°C (Note 1)
MCP13XX-47
V
(Note 6)
V
TA = -40°C to +125°C (Note 2)
T
ppm/°C
VDD Trip Point Tempco
TPCO
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc.
DS21985D-page 5
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Threshold Hysteresis MCP13XX-20 VHYS
0.020
—
(Note 6)
—
0.120
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
TA = +25°C (Note 3)
TA = -40°C to +85°C
TA = +25°C (Note 3)
TA = -40°C to +85°C
TA = +25°C (Note 3)
TA = -40°C to +85°C
TA = +25°C (Note 3)
TA = -40°C to +85°C
TA = +25°C (Note 3)
TA = -40°C to +85°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
Note 3)
(Note 6)
MCP13XX-21
(Note 6)
0.021
0.022
0.023
0.024
0.025
0.026
0.027
0.028
0.029
0.030
0.031
0.032
0.033
0.126
0.132
0.138
0.144
0.150
0.156
0.162
0.168
0.174
0.180
0.186
0.192
0.198
(Note 6)
—
MCP13XX-22
(Note 6)
(Note 6)
—
MCP13XX-23
(Note 6)
(Note 6)
—
MCP13XX-24
(Note 6)
(Note 6)
—
MCP13XX-25
(Note 6)
(Note 6)
—
MCP13XX-26
(Note 6)
(Note 6)
—
MCP13XX-27
(Note 6)
(Note 6)
—
MCP13XX-28
(Note 6)
(Note 6)
—
MCP13XX-29
(Note 6)
—
MCP13XX-30
(Note 6)
(Note 6)
—
MCP13XX-31
(Note 6)
(Note 6)
—
MCP13XX-32
(Note 6)
(Note 6)
—
MCP13XX-33
(Note 6)
(Note 6)
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 6
2005-2012 Microchip Technology Inc.
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Threshold Hysteresis MCP13XX-34 VHYS
0.034
—
(Note 6)
—
0.204
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 1)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
TA = +25°C (Note 3)
TA = -40°C to +125°C
(Continued) Note 3)
(Note 6)
MCP13XX-35
(Note 6)
0.035
0.036
0.037
0.038
0.039
0.040
0.041
0.042
0.043
0.044
0.045
0.046
0.047
0.210
0.216
0.222
0.228
0.234
0.240
0.246
0.252
0.258
0.264
0.270
0.276
0.282
(Note 6)
—
MCP13XX-36
(Note 6)
(Note 6)
—
MCP13XX-37
(Note 6)
(Note 6)
—
MCP13XX-38
(Note 6)
(Note 6)
—
MCP13XX-39
(Note 6)
(Note 6)
—
MCP13XX-40
(Note 6)
(Note 6)
—
MCP13XX-41
(Note 6)
(Note 6)
—
MCP13XX-42
(Note 6)
(Note 6)
—
MCP13XX-43
(Note 6)
(Note 6)
—
MCP13XX-44
(Note 6)
(Note 6)
—
MCP13XX-45
(Note 6)
(Note 6)
—
MCP13XX-46
(Note 6)
—
MCP13XX-47
(Note 6)
(Note 6)
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
2005-2012 Microchip Technology Inc.
DS21985D-page 7
MCP131X/2X
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321 and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
RST/RST Low-Level Output Voltage
VOL
—
—
—
—
0.3
0.3
V
V
IOL = 50 µA, 1.0V VDD 1.5V
I
OL = 100 µA,
1.5V VDD 2.5V
—
—
—
—
—
0.3
0.3
—
V
V
V
IOL = 2 mA, 2.5V VDD 4.5V
I
OL = 4 mA, VDD 4.5V
RST/RST High-Level Output Voltage
(Push-Pull Outputs only)
VOH
VDD
0.7
–
IOH = 2.5 mA, VDD 2.5V
VDD
0.7
–
—
—
V
IOH = 500 µA, VDD 1.5V
Input Low Voltage (MR and WDI pins)
Input High Voltage (MR and WDI pins)
VIL
VIH
VSS
0.7 VDD
—
—
—
—
0.3VDD
VDD
13.5 (4)
V
V
V
Open-Drain High Voltage on Output
VODH
Open-Drain Output pin only,
(Note 4)
VDD = 3.0V, Time voltage >
5.5V applied 100 s,
current into pin limited to 2 mA,
+25°C operation
recommended
(Note 4, Note 5)
Input Leakage Current (MR and WDI)
IIL
—
—
—
±1
µA
µA
VSS VPIN VDD
Open-Drain Output Leakage Current
(MCP1316M, MCP1318M,
IOD
0.003
1.0
MCP1319M, MCP1320, MCP1321,
and MCP1322 only)
Pull-up Resistance
MR pin
WDI pin
RST pin
RPU
—
—
—
52
52
—
—
—
k
k
k
VDD = 5.5V
VDD = 5.5V
4.7
VDD = 5.5V,
MCP131XM devices only
Input Pin Capacitance (MR and WDI)
CI
—
—
100
—
—
pF
pF
Output Pin Capacitive Loading
(RST and RST)
CO
50
This is the tester loading to
meet the AC timing
specifications.
Note 1: Trip point is ±1.5% from typical value.
2: Trip point is ±2.5% from typical value.
3: Hysteresis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC® microcontroller applications that require the In-
Circuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for
voltage requirements). The total time that the RST pin can be above the maximum device operational
voltage (5.5V) is 100s. Current into the RST pin should be limited to 2 mA. It is recommended that the
device operational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional
information, refer to Figure 2-35.
5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; minimum order volume requirement. Information available upon request.
DS21985D-page 8
2005-2012 Microchip Technology Inc.
MCP131X/2X
VTRIPAC + VHYS
VTRIPMAX
VTRIPMIN
VDD
tRR
tRST
1V
tRST
tRPD
VTRIP
RST
RST
VDD < 1V is outside the device operating specification. The RST (or RST) output state is
unknown while VDD < 1V.
FIGURE 1-1:
TABLE 1-1:
Device Voltage and Reset Pin Waveforms.
DEVICE VOLTAGE AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VDD ramped from
TRIPMAX + 250 mV down to
Falling VDD Trip Point Detected
to RST or RST Active
tRPD
—
650
—
µs
V
VTRIPMIN – 200 mV,
VDD falling @ 5 mV/µs,
CL = 50 pF (Note 1)
VDD Rise Rate
tRR
Note 3
1.4
Reset active time
tRST
1.0
20
2.0
40
ms
ms
ms
ms
µs
Note 2
(MR Rising Edge, POR/BOR
Inactive, or WDT time out) to
RST/RST Inactive
30
Note 2
140
1120
—
200
1600
5
280
2240
—
Standard Time Out
Note 2
RST Rise Time after RST Active
tRT
For RST 10% to 90% of VDD
,
,
,
,
(Push-Pull Outputs only)
CL = 50 pF (Note 1)
RST Rise Time after RST Inactive
(Push-Pull Outputs only)
—
—
—
5
5
5
—
—
—
µs
µs
µs
For RST 10% to 90% of VDD
CL = 50 pF (Note 1)
RST Fall Time after RST Inactive
RST Fall Time after RST Active
tFT
For RST 90% to 10% of VDD
CL = 50 pF (Note 1)
For RST 90% to 10% of VDD
CL = 50 pF (Note 1)
Note 1: These parameters are for design guidance only and are not 100% tested.
2: Custom ordered Reset active time; minimum order volume requirement.
3: Designed to be independent of VDD rise rate. Device characterization was done with a rise rate as slow as
0.1 V/s (@ +25°C).
2005-2012 Microchip Technology Inc.
DS21985D-page 9
MCP131X/2X
tMR
MR
tRST
tNF
tMRD
RST
RST
FIGURE 1-2:
MR and Reset Pin Waveforms.
TABLE 1-2:
MR AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
MR Pulse Width
Sym
Min
Typ
Max
Units
Conditions
tMR
tMRD
tNF
1
—
—
—
—
µs
ns
ns
MR Active to RST/RST Active
MR Input Noise filter
—
—
235
150
VDD = 5.0V
VDD = 5.0V
Note 1: These parameters are for design guidance only and are not 100% tested.
RST
RST
tRST
WDI (Note 1)
tWP
tWD
tWD
Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.
FIGURE 1-3:
TABLE 1-3:
WDI and Reset Pin Waveforms.
WDI AND RESET PIN TIMINGS
Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.
Parameters
WDI Pulse Width
Watchdog Time-Out Period
Sym
Min
Typ
Max
Units
Conditions
tWP
tWD
50
4.3
—
6.3
—
9.3
ns
ms
ms
sec
sec
Note 1
Note 1
71
102
1.6
153
2.4
1.12
17.9
Standard Time Out
25.6
38.4
Note 1
Note 1: Custom ordered WatchDog Timer time out; minimum order volume requirement.
DS21985D-page 10
2005-2012 Microchip Technology Inc.
MCP131X/2X
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k
(only MCP1316), TA = -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Specified Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Package Thermal Resistances
Thermal Resistance, 5L-SOT-23
TA
TA
TJ
TA
-40
-40
—
—
—
—
—
+85
°C
°C
°C
°C
MCP13XX-25 (or below)
+125
+150
+150
Except MCP13XX-25 (or below)
-65
JA
—
220.7
—
°C/W
2005-2012 Microchip Technology Inc.
DS21985D-page 11
MCP131X/2X
NOTES:
DS21985D-page 12
2005-2012 Microchip Technology Inc.
MCP131X/2X
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
1.2
1
4.8V
5.0V
5.5V
1.0V 1.5V 2.0V 3.0V 4.3V
4.5V 4.8V 5.0V 5.5V
6
5
4
3
2
1
0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
150
-100
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-1:
IDD vs. Temperature (Reset
FIGURE 2-4:
IDD vs. Temperature (Reset
Power-up Timer Inactive and Watchdog Timer
Power-up Timer Active) (MCP1318M-4.6).
Inactive) (MCP1318M-4.6).
1.4
3.2V
4.0V
4.5V
5.0V
5.5V
1.0V
2.7V
4.5V
1.5V
3.2V
5.0V
2.5V
4.0V
5.5V
6
5
4
3
2
1
0
1.2
1
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
150
-100
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-5:
IDD vs. Temperature (Reset
FIGURE 2-2:
IDD vs. Temperature (Reset
Power-up Timer Active) (MCP1319-2.9).
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1319-2.9).
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
7
6
5
4
3
2
1
0
1.8
1.6
1.4
1.2
1
1.0V
2.2V
4.5V
1.5V
2.5V
5.0V
1.8V
4.0V
5.5V
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
150
-100
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-6:
Power-up Timer Active) (MCP1316-2.0).
IDD vs. Temperature (Reset
FIGURE 2-3:
Power-up Timer Inactive and Watchdog Timer
IDD vs. Temperature (Reset
Inactive) (MCP1316-2.0).
2005-2012 Microchip Technology Inc.
DS21985D-page 13
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
4.8V
5.0V
5.5V
7
6
5
4
3
2
1
0
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-7:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1318M-4.6).
MCP1319 does not
have a Watchdog Timer
FIGURE 2-8:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1319-2.9).
2.2V
2.5V
4.0V
4.5V
5.0V
5.5V
7
6
5
4
3
2
1
0
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-9:
IDD vs. Temperature
(Watchdog Timer Active) (MCP1316-2.0).
DS21985D-page 14
2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
-45°C
+25°C
+90°C
+130°C
1.2
1
6
5
4
3
2
1
0
+130°C
+90°C
0.8
0.6
0.4
0.2
0
+25°C
-45°C
0.0
2.0
4.0
6.0
4.6
4.8
5.0
5.2
5.4
5.6
VDD (V)
VDD (V)
FIGURE 2-10:
IDD vs. VDD (Reset Power-
FIGURE 2-13:
IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
up Timer Active or Watchdog Timer Active)
(MCP1318M-4.6).
(MCP1318M-4.6).
-45°C
+25°C
+90°C
+130°C
1.4
+130°C
6
5
4
3
2
1
0
1.2
+90°C
1
+25°C
0.8
0.6
-45°C
0.4
0.2
0
0.0
2.0
4.0
6.0
0.0
2.0
4.0
6.0
VDD (V)
VDD (V)
FIGURE 2-11:
IDD vs. VDD (Reset Power-
FIGURE 2-14:
IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
up Timer Active or Watchdog Timer Active)
(MCP1319-2.9).
(MCP1319-2.9).
-45°C
+25°C
+90°C
+130°C
1.8
1.6
+130°C
7
6
5
4
3
2
1
0
+90°C
+25°C
-45°C
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0.0
2.0
4.0
6.0
2.0
3.0
4.0
VDD (V)
5.0
6.0
VDD (V)
FIGURE 2-12:
IDD vs. VDD (Reset Power-
FIGURE 2-15:
IDD vs. VDD (Reset Power-
up Timer Inactive and Watchdog Timer Inactive)
up Timer Active or Watchdog Timer Active)
(MCP1316-2.0).
(MCP1316-2.0).
2005-2012 Microchip Technology Inc.
DS21985D-page 15
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
1V
2V
3V
4.3V
4.5V
4.8V
5V
5.5V
4.800
4.750
4.700
4.650
4.600
4.550
4.0
3.9
3.8
3.7
3.6
3.5
3.4
3.3
3.2
3.1
3.0
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
VTRIP Up
VHYST
VTRIP Down
-50
0
50
100
150
0.00
2.00
4.00
6.00
8.00
10.00
IOL (mA)
Temperature (°C)
FIGURE 2-16:
VTRIP and VHYST vs.
FIGURE 2-19:
VOL vs. IOL
Temperature (MCP1318M-4.6).
(MCP1318M-4.6).
1V
2.5V
2.7V
3.2V
4V
4.5V
5V
5.5V
3.020
3.5
3.4
3.4
3.3
3.3
3.2
3.2
3.1
3.1
3.0
0.16
0.14
0.12
0.1
0.08
0.06
0.04
0.02
0
VTRIP Up
3.000
VHYST
2.980
2.960
2.940
2.920
VTRIP Down
2.900
2.880
0.00
2.00
4.00
IOL (mA)
6.00
8.00
10.00
-50
0
50
100
150
Temperature (°C)
FIGURE 2-17:
V
TRIP and VHYST vs.
FIGURE 2-20:
V
OL vs. IOL
Temperature (MCP1319-2.9).
(MCP1319-2.9).
2.050
2.040
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.02
0.018
0.016
0.014
0.012
0.01
0.008
0.006
0.004
0.002
0
VTRIP Up
1V
VHYST
2.030
1.8V
2.020
2.010
VTRIP Down
2.000
1.990
0.00
0.05
0.10
0.15
0.20
0.25
-50
0
50
100
150
IOL (mA)
Temperature (°C)
FIGURE 2-18:
VTRIP and VHYST vs.
FIGURE 2-21:
VOL vs. IOL
Temperature (MCP1316-2.0).
(MCP1316-2.0).
DS21985D-page 16
2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
5
4.5
0.14
4.5V
4.3V
4
3.5
3
0.12
4 mA
3 mA
2.5
2
1.5
1
0.5
0
0.00
3V
0.08
0.06
0.04
0.02
0
1 mA
0 mA
2V
1.5V
2.00
4.00
6.00
6.00
6.00
-50
0
50
100
150
IOH (mA)
FIGURE 2-22:
(MCP1318M-4.6 @ VDD = 4.5V).
VOL vs. Temperature
FIGURE 2-25:
(MCP1318M-4.6 @ +25°C).
VOH vs. IOH
6
5
4
3
2
0.25
0.2
0.15
0.1
0.05
0
5.5V
5V
4.5V
4V
4 mA
3 mA
3.2V
2 mA
1 mA
2.7V
2.5V
1
1.5V
0
0.00
2.00
4.00
-50
0
50
100
150
IOH (mA)
FIGURE 2-23:
(MCP1319-2.9 @ VDD = 2.7V).
VOL vs. Temperature
FIGURE 2-26:
(MCP1319-2.9 @ +25°C).
VOH vs. IOH
0.016
0.014
0.012
0.01
6
5
4
3
0.2 mA
5.5V
5V
4.5V
4V
0.15 mA
0.1 mA
0.008
0.006
0.004
0.002
0
2
1
0
2.2V
2.5V
0.05 mA
0 mA
0.00
2.00
4.00
-50
0
50
100
150
IOH (mA)
Temperature (°C)
FIGURE 2-24:
VOL vs. Temperature
FIGURE 2-27:
VOH vs. IOH
(MCP1316-2-0 @ VDD = 1.8V).
(MCP1316-2.0 @ +25°C).
2005-2012 Microchip Technology Inc.
DS21985D-page 17
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
4.8 V
5 V
5.5 V
350
300
250
200
150
100
50
230
225
220
215
210
205
200
195
190
5V
5.5V
0
-100
-50
0
50
100
150
150
150
-100
-50
0
50
100
150
150
150
Temperature (°C)
Temperature (°C)
FIGURE 2-28:
(MCP1318M-4.6).
tRPD vs. Temperature
FIGURE 2-31:
(MCP1318M-4.6).
tRPU vs. Temperature
3.2 V
4 V
4.5 V
5 V
5.5 V
3.2V
4V
4.5V
5V
5.5V
250
245
240
235
230
225
220
215
210
205
200
450
400
350
300
250
200
150
100
50
0
-100
-50
0
50
100
-100
-50
0
50
100
Temperature (°C)
Temperature (°C)
FIGURE 2-29:
(MCP1319-2.9).
t
RPD vs. Temperature
FIGURE 2-32:
(MCP1319-2.9).
tRPU vs. Temperature
2.5 V
4 V
4.5 V
5 V
5.5 V
2.2 V
2.5V
4V
4.5V
5V
5.5V
250
245
240
235
230
225
220
215
210
205
200
350
300
250
200
150
100
50
0
-100
-50
0
50
100
-100
-50
0
50
100
Temperature (°C)
Temperature (°C)
FIGURE 2-30:
tRPD vs. Temperature
FIGURE 2-33:
tRPU vs. Temperature
(MCP1316-2.0).
(MCP1316-2.0).
DS21985D-page 18
2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
3.2 V
4 V
4.5 V
5 V
5.5 V
VRST=2.0V
VRST=2.9V
VRST=4.6V
3500
3000
2500
2000
1500
1000
500
350
300
250
200
150
100
50
2.0V
2.9V
0
0
-100
0.001
0.01
0.1
1
10
-50
0
50
100
150
Reset Threshold Overdrive (V) VTRIPMin - VDD
Temperature (°C)
FIGURE 2-34:
Transient Duration vs.
FIGURE 2-37:
Propagation Delay (MCP1319-2.9).
MR Low to Reset
VTRIP (min) – VDD.
2.2 V
2.5 V
4 V
4.5 V
5 V
5.5 V
2.2 V
2.5 V
4 V
4.5 V
5 V
5.5 V
0.012
450
400
350
300
250
200
150
100
50
0.01
0.008
0.006
0.004
0.002
0
0
-100
-100
-50
0
50
100
150
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-35:
Current vs. Temperature (MCP1320-2.0).
Open-Drain Leakage
FIGURE 2-38:
Propagation Delay (MCP1316-2.0).
MR Low to Reset
MCP1318M does not
have an MR pin
FIGURE 2-36:
MR Low to Reset
Propagation Delay (MCP1318M-4.6).
2005-2012 Microchip Technology Inc.
DS21985D-page 19
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
0.145
0.14
1000
900
800
700
600
500
400
300
200
100
0
5V to 4.5V
0.135
0.13
MCP1318M-4.6
0.125
0.12
5V to 0V
0.115
-100
-50
0
50
100
150
-100
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-39:
VDD Falling to Reset
FIGURE 2-42:
Normalized Reset Time-Out
Propagation Delay vs. Temperature
Period vs. Temperature (MCP1318M-4.6).
(MCP1318M-4.6).
0.15
0.145
0.14
250
5V to 2.7V
200
150
100
50
VTRIP Typ + 0.3V to
TRIP Min - 0.2V
V
MCP1319-2.9
0.135
0.13
5V to 0V
0.125
0
-100
-50
0
50
100
150
-100
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-43:
Normalized Reset Time-Out
FIGURE 2-40:
VDD Falling to Reset
Period vs. Temperature (MCP1319-2.9).
Propagation Delay vs. Temperature (MCP1319-
2.9).
0.15
0.145
0.14
250
5V to 1.8V
200
150
100
50
MCP1316-2.0
0.135
VTRIP Typ + 0.2V to
TRIP Min - 0.2V
V
0.13
5V to 0V
50
0.125
0
-100
-100
-50
0
50
100
150
-50
0
100
150
Temperature (°C)
Temperature (°C)
FIGURE 2-44:
Period vs. Temperature (MCP1316-2.0).
Normalized Reset Time-Out
FIGURE 2-41:
Propagation Delay vs. Temperature (MCP1316-
2.0).
VDD Falling to Reset
DS21985D-page 20
2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 k (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.
1.25
1.2
VRST=2.0V
VRST=2.9V
VRST=4.6V
600
500
400
300
200
100
0
1.15
1.1
MCP1318M-4.6
1.05
1
`
0.95
0.9
-100
0.001
0.01
0.1
1
10
-50
0
50
100
150
Reset Threshold Overdrive (V) VTRIPMin - VDD
Temperature (°C)
FIGURE 2-45:
Normalized Watchdog Time-
FIGURE 2-48:
Max VDD Transient Duration
Out Period vs. Temperature (MCP1318M-4.6).
vs. Reset Threshold Overdrive.
MCP1319 does not
have a Watchdog Timer
FIGURE 2-46:
Normalized Watchdog Time-
FIGURE 2-49:
“M” Part Number Pull-up
Out Period vs. Temperature (MCP1319-2.9).
Characteristics (MCP1318M-4.6).
1.25
1.2
1.15
1.1
MCP1316-2.0
1.05
1
0.95
0.9
`
-100
-50
0
50
100
150
Temperature (°C)
FIGURE 2-47:
Normalized Watchdog Time-
Out Period vs. Temperature (MCP1316-2.0).
2005-2012 Microchip Technology Inc.
DS21985D-page 21
MCP131X/2X
NOTES:
DS21985D-page 22
2005-2012 Microchip Technology Inc.
MCP131X/2X
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No.
SOT23-5
1
Buffer/
Driver
Type
Pin
Type
Device
Symbol
Function
MCP1316M (1)
MCP1318M (1)
MCP1319M (1)
MCP1320,
MCP1321,
MCP1322
,
,
,
RST
O
Open-Drain Reset Output (active-low)
Goes active (Low) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
Open-Drain = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
Open-Drain = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1316,
MCP1318,
MCP1319
O
O
Push-Pull VDD Falling:
H = VDD > VTRIP
L = VDD < VTRIP
VDD Rising:
H = VDD > VTRIP + VHYS
L = VDD < VTRIP + VHYS
MCP1317
RST
Push-Pull Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
2
All
VSS
—
P
The ground reference for the device.
Note 1: Open-Drain output with internal pull-up resistor.
2005-2012 Microchip Technology Inc.
DS21985D-page 23
MCP131X/2X
TABLE 3-1: PIN FUNCTION TABLE (CONTINUED)
Pin No.
SOT23-5
3
Buffer/
Driver
Type
Pin
Type
Device
Symbol
Function
MCP1316,
MCP1316M,
MCP1317,
MCP1320
MR
I
ST
Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, which can then be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
MCP1318,
MCP1318M,
MCP1319,
MCP1319M,
MCP1321,
MCP1322
RST
O
Push-Pull Reset Output (active-high)
Goes active (High) if one of these conditions occurs:
1. If VDD falls below the selected Reset voltage
threshold.
2. If the MR pin is forced low.
3. If the WDI pin does not detect an edge transition
within the minimum selected time-out period.
4. During power-up.
VDD Falling:
H = VDD < VTRIP
L = VDD > VTRIP
VDD Rising:
H = VDD < VTRIP + VHYS
L = VDD > VTRIP + VHYS
4
MCP1316,
MCP1316M,
MCP1317,
MCP1318,
MCP1318M,
MCP1320,
MCP1321
WDI
I
I
ST
ST
Watchdog Timer Input
The WDT period is specified at the time of device order.
The Standard WDT period is 1.6s typical.
An edge transition on the WDI pin resets the Watchdog
Timer counter (no time out). A Falling Edge is required to
start the WDT Timer.
MCP1319,
MCP1319M,
MCP1322
MR
Manual Reset input for a Reset switch.
This input allows a push button switch to be directly con-
nected to the MCP131X/2X MR pin, which can then be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces
the RST/RST pins Active.
H = Switch is open (internal pull-up resistor pulls signal
high). State of the RST/RST pins determined by
other system conditions.
5
All
VDD
—
P
The positive supply for the device.
Note 1: Open-Drain output with internal pull-up resistor.
DS21985D-page 24
2005-2012 Microchip Technology Inc.
MCP131X/2X
3.1
Ground Terminal (V
)
3.4
Manual Reset Input (MR)
SS
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
The Manual Reset (MR) input pin allows a push button
switch to easily be connected to the system. When the
push button is depressed, it forces a system Reset.
This pin has circuitry that filters noise that may be
present on the MR signal.
3.2
Supply Voltage (V
)
DD
VDD can be used for power supply monitoring or a
voltage level that requires monitoring.
The MR pin is active-low and has an internal pull-up
resistor.
3.3
Reset Output (RST and RST)
3.5
Watchdog Input
There are four types of Reset output pins. These are:
In some systems, it is desirable to have an external
Watchdog Timer to monitor the operation of the
system. This is done by requiring the embedded
controller to “pet” the Watchdog Timer within a
predetermined time frame (TWD). If the MCP131X/2X is
not “petted” within this time frame, the MCP131X/2X
will force the Reset pin(s) active.
1. Open-Drain active-low Reset, External pull-up
resistor required
2. Open-Drain active-low Reset, Internal pull-up
resistor
3. Push-Pull active-low Reset
4. Push-Pull active-high Reset
The embedded controller “pets” the MCP131X/2X by
forcing an edge transition on the WDI pin. The WDT
Timer is activated by the first falling edge on the WDI
pin.
Some devices have both an active-low and active-high
Reset output.
3.3.1
ACTIVE-LOW (RST) – OPEN-DRAIN,
EXTERNAL PULL-UP RESISTOR
The standard offering devices have a typical Watchdog
Timer period (TWD) of 1.6 s. Table 1-3 shows the
available Watchdog Timer periods.
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD
)
returns to
a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will float, and an external pull-up resistor is
required to bring the output to the high state.
3.3.2
ACTIVE-LOW (RST) – OPEN-DRAIN,
INTERNAL PULL-UP RESISTOR
The RST open-drain output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD
)
returns to
a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be pulled high by an internal pull-up
resistor (typically 4.7 k).
3.3.3
ACTIVE-LOW (RST) – PUSH-PULL
The RST push-pull output remains low while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD
)
returns to
a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the high state.
3.3.4
ACTIVE-HIGH (RST) – PUSH-PULL
The RST push-pull output remains high while VDD is
below the Reset voltage threshold (VTRIP). Once the
device voltage (VDD
)
returns to
a high level
(VTRIP + VHYS), the device will remain in Reset for the
Reset delay timer (TRST). After that time expires, the
RST pin will be driven to the low state.
2005-2012 Microchip Technology Inc.
DS21985D-page 25
MCP131X/2X
NOTES:
DS21985D-page 26
2005-2012 Microchip Technology Inc.
MCP131X/2X
4.0
OPERATIONAL DESCRIPTION
VDD
For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen-
tarily. The second most common cause is when a
slowly decaying power supply causes the
microcontroller to begin executing instructions without
sufficient voltage to sustain volatile memory (RAM),
thus producing indeterminate results. Figure 4-1 shows
a typical application circuit.
VDD
VDD
PIC®
Microcontroller
(1)
0.1
µF
RPU
MCP13XX
MCLR
(Reset input)
(active-low)
RST
RST (2)
MR
I/O
WDI
VSS
VSS
The MCP131X/2X family of voltage supervisor devices
are designed to keep a microcontroller in Reset, until
the system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level.
To system
device that
requires active-
high resets
Push button
switch
Note 1: Resistor RPU may be required with the
MCP1320, MCP1321 or MCP1322 due
to the open-drain output.
Some MCP131X/2X family members include a Watch-
dog Timer feature that after being enabled (by a falling
edge on the WDI pin), monitors the WDI pin for falling
or rising edges. If an edge transition is not detected
within the expected time frame, the MCP131X/2X
devices will force the Reset pin active. This is useful to
ensure that the embedded system’s Host Controller
program is operating as expected.
Resistor RPU may not be required with
the MCP1316M, MCP1318M or
MCP1319M due to the internal pull-up
resistor.
The MCP1316, MCP1317, MCP1318
and MCP1319 do not require the
external pull-up resistor.
Some MCP131X/2X family members include a Manual
Reset feature that allow a push button switch to be
directly connected to the MCP131X/2X devices (on the
MR pin). This allows the system to easily be reset from
the external control of the push button switch.
2: Not all devices offer the active-high
Reset output pin.
FIGURE 4-1:
Typical Application Circuit.
A superset block diagram is shown in Figure 4-2, with
device specific block diagrams shown in Figure 4-3
through Figure 4-12.
VDD
Comparator
+
RST
RST
–
Output
Driver
Reference
Voltage
MR
Noise Filter
Watchdog
VSS
WDI
Note: Features available depend on the device.
FIGURE 4-2: Family Block Diagram.
2005-2012 Microchip Technology Inc.
DS21985D-page 27
MCP131X/2X
4.0.1
DEVICE SPECIFIC BLOCK
DIAGRAMS
VDD
VDD
Comparator
Comparator
+
–
+
–
RST
RST
RST
Output
Driver
Output
Driver
Reference
Voltage
Reference
Voltage
MR
Noise Filter
Watchdog
VSS
VSS
WDI
WDI
Watchdog
FIGURE 4-3:
MCP1316 Block Diagram.
FIGURE 4-6:
MCP1318 Block Diagram.
VDD
VDD
Comparator
Comparator
+
+
RST
RST
–
–
Output
Driver
Output
Driver
RST
Reference
Voltage
Reference
Voltage
MR
Noise Filter
Watchdog
VSS
VSS
WDI
WDI
Watchdog
FIGURE 4-4:
MCP1316M Block Diagram.
FIGURE 4-7:
MCP1318M Block Diagram.
VDD
Comparator
+
RST
–
Output
Driver
Reference
Voltage
MR
Noise Filter
Watchdog
VSS
WDI
FIGURE 4-5:
MCP1317 Block Diagram.
DS21985D-page 28
2005-2012 Microchip Technology Inc.
MCP131X/2X
VDD
VDD
Comparator
Comparator
+
–
+
–
RST
RST
Output
Driver
Output
Driver
RST
RST
Reference
Voltage
Reference
Voltage
MR
Noise Filter
VSS
VSS
WDI
Watchdog
FIGURE 4-8:
MCP1319 Block Diagram.
FIGURE 4-11:
MCP1321 Block Diagram.
VDD
VDD
Comparator
Comparator
+
+
–
RST
–
Output
Driver
Output
Driver
RST
RST
RST
Reference
Voltage
Reference
Voltage
MR
MR
Noise Filter
Noise Filter
VSS
VSS
FIGURE 4-9:
MCP1319M Block Diagram.
FIGURE 4-12:
MCP1322 Block Diagram.
.
VDD
Comparator
+
–
Output
Driver
RST
VSS
Reference
Voltage
MR
Noise Filter
Watchdog
WDI
FIGURE 4-10:
MCP1320 Block Diagram.
2005-2012 Microchip Technology Inc.
DS21985D-page 29
MCP131X/2X
The Reset pin (RST or RST) will be forced active if any
of the following occur:
4.1
Reset Voltage Trip Point (VTRIP
Operation
)
• The Manual Reset input (MR) goes low
• The Watchdog Timer times out
• VDD goes below the threshold
• During device power-up
The device’s Reset voltage trip point (VTRIP) is selected
when the device is ordered. As the voltage on the
device’s VDD pin is above or below this selected trip
point, the output of the Reset pin (RST/RST) will be
forced to either the inactive or active state.
After the device exits the Reset condition, the delay
circuitry will hold the RST and RST pins active until the
appropriate Reset delay time (tRST) has elapsed.
For the voltage trip point, there is a minimum trip voltage
(VTRIPMIN) and a maximum trip voltage (VTRIPMAX). The
voltage that the device “actually” trips at will be referred
to as VTRIP. The trip voltage is specified for the falling of
the device VDD
.
There is also a hysteresis (VHYS) on the trip point. This
is so that noise on the device voltage (VDD) does not
cause the Reset pin (RST/RST) to “jitter” (change
between driving an active and inactive state).
TABLE 4-1:
Device
RESET PIN STATES
State of RST Pin when:
State of RST (3) Pin when:
Output Driver
V
VHYS
+
V +
TRIP
VDD
<
VDD
>
VDD
<
VDD >
TRIP
VHYS
VTRIP
VTRIP
MCP1316
MCP1316M
MCP1317
MCP1318
MCP1318M
MCP1319
MCP1319M
MCP1320
MCP1321
MCP1322
L
L
H
—
—
H
—
—
L
Push-pull
H (2)
Open-drain (2)
—
L
—
Push-pull
H
H
L
Push-pull
L
H (2)
H
L
Open-drain (2)
L
H
H
L
Push-pull
L
H (2)
H (1)
H (1)
H (1)
H
L
Open-drain (2)
Open-drain (1)
Open-drain (1)
Open-drain (1)
L
—
H
—
L
L
L
H
L
Note 1: Requires External Pull-up resistor.
2: Has Internal Pull-up resistor.
3: The RST pin output is always push-pull.
DS21985D-page 30
2005-2012 Microchip Technology Inc.
MCP131X/2X
4.1.1
POWER-UP/RISING VDD
FIGURE 4-13:
Reset Pin Operation on a
Power-up.
As the device VDD rises, the device’s Reset circuit will
remain active until the voltage rises above the “actual”
trip point (VTRIP) plus the hysteresis (VHYS).
4.1.2
POWER-DOWN/BROWN-OUTS
As the device powers-down/brown-outs, the voltage
(VDD) falls from a voltage above the device’s trip point
Figure 4-13 shows a power-up sequence and the
waveform of the RST and RST pins.
(VTRIP). The device’s “actual” trip point voltage (VTRIP
)
As the device powers up, the voltage will start below
the valid operating voltage of the device. At this
voltage, the Reset output value is not valid. Once the
voltage is above the minimum operating voltage (1V)
and below the selected VTRIP, the Reset output will be
active.
will be between the minimum trip point (VTRIPMIN) and
the maximum trip point (VTRIPMAX). Once the device
voltage (VDD) goes below this voltage, the Reset pin(s)
will be forced to the active state. There is a hysteresis
on this trip point. This is so noise on the device voltage
(VDD) does not cause the Reset pin (RST/RST) to
“jitter” (change between driving an active and inactive).
Once the device voltage rises above the “actual” trip
point (VTRIP) plus the hysteresis (VHYS), the Reset delay
timer (tRST) starts. When the Reset delay timer times
out, the Reset output (RST/RST) is driven inactive.
Figure 4-14 shows the waveform of the RST pin as
determined by the VDD voltage, while Table 4-1 shows
the state of the RST pin.
Note:
While the Reset delay timer (tRST) is
active, additional system current is
consumed.
4.1.2.1
Operation of RST pin with Internal
Pull-Up Resistor
Note:
Only the MCP1316M, MCP1318M and
MCP1319M devices have an open-drain
RST output pin with an internal pull-up
resistor.
VTRIP + VHYS
tRST
VTRIPMAX
VTRIPMIN
The internal pull-up resistor has a typical value of
4.7 k. The internal pull-up eliminates the need for an
external resistor.
VDD
1V
VTRIP
To reduce the current consumption of the device, when
the RST pin is driving low, the resistor is disconnected.
RST
RST
VDD
VTRIP + VHYS
VTRIPMAX
VTRIPMIN
VTRIP
VTRIP
1V
RST
tRST
tRPD
tRST
< 1V is outside the
device specifications
tRPD
FIGURE 4-14:
RST Operation as Determined by the VTRIP and VHYS.
2005-2012 Microchip Technology Inc.
DS21985D-page 31
MCP131X/2X
Figure 4-15 illustrates when the Reset delay timer
(tRST) is active or inactive.
4.2
Reset Delay Timer (t
)
RST
The Reset delay timer ensures that the MCP131X/2X
device will “hold” the embedded system in Reset until
the system voltage has stabilized. There are several
time-out options to better meet the requirements of
different applications. These Reset delay timer time-
outs are shown in Table 4-2. The Standard offering
time-out is typically 200 ms.
VDD
VTRIP
RST
tRST
The Reset delay timer (tRST) starts after the device volt-
age rises above the “actual” trip point (VTRIP) plus the
hysteresis (VHYS). When the Reset delay timer times-
out, the Reset output pin (RST/RST) is driven inactive.
Note:
While the Reset delay timer (tRST) is
active, additional system current is con-
sumed.
Reset
Delay
Timer
Reset Delay
Inactive
Timer Inactive
TABLE 4-2:
RESET DELAY TIMER
TIME OUTS (1)
See Figures 2-12,
2-10 and 2-11
See Figures 2-12,
2-10 and 2-11
tRST
Units
Min
Typ
Max
See Figures 2-15,
2-14 and 2-13
1.0
20
1.4
30
2.0
40
ms
ms
ms
sec
140
1120
200
1.6
280
2.24
FIGURE 4-15:
Waveform.
Reset Power-up Timer
4.2.1
EFFECT OF TEMPERATURE ON
RESET POWER-UP TIMER (TRPU
This is the
This is the
)
minimum time that
the Reset delay
timer will “hold” the
Reset pin active
after VDD rises
maximum time
that the Reset
delay timer will
“hold” the Reset
pin active after
VDD rises above
The Reset delay timer time-out period (tRST
)
determines how long the device remains in the Reset
condition. This time-out is affected by both the device
VDD and temperature. Typical responses for different
V
DD values and temperatures are shown in Figures 2-
above
TRIP + VHYS
33, 2-32 and 2-31.
V
VTRIP + VHYS
Note 1: Shaded rows are custom ordered time
outs.
DS21985D-page 32
2005-2012 Microchip Technology Inc.
MCP131X/2X
4.3
Negative Going VDD Transients
4.4
Manual Reset Input
The minimum pulse width (time) required to cause a
Reset may be an important criteria in the
implementation of a Power-on Reset (POR) circuit.
This time is referred to as transient duration. The
MCP131X/2X devices are designed to reject a level of
negative-going transients (glitches) on the power
supply line.
The Manual Reset input pin (MR) allows the Reset pins
(RST/RST) to be manually forced to their active states.
The MR pin has circuitry to filter noise pulses that may
be present on the pin. Figure 4-17 shows a block
diagram for using the MCP131X/2X with a push-button
switch. To minimize the required external components,
the MR input has an internal pull-up resistor.
Transient duration is the amount of time needed for
A mechanical push button or active logic signal can
drive the MR input.
these supervisory devices to respond to a drop in VDD
.
The transient duration time (tTRAN) is dependant on the
magnitude of VTRIP – VDD (overdrive). Any combination
of duration and overdrive that lies under the
duration/overdrive curve will not generate a Reset
signal. Generally speaking, the transient duration time
decreases with, and increases in, the VTRIP – VDD
voltage. Combinations of duration and overdrive that lie
above the duration/overdrive curve are detected as a
brown-out or power-down condition.
Once MR has been low for a time, tMRD (the Manual
Reset delay time), the Reset output pins are forced
active. The Reset output pins will remain in their active
states for the Reset delay timer time-out period (tRST).
Figure 4-18 shows a waveform for the Manual Reset
switch input and the Reset pins output.
+5V
VDD
Figure 4-16 shows a typical transient duration versus
Reset comparator overdrive, for which the
MCP131X/2X will not generate a Reset pulse. It shows
that the farther below the trip point the transient pulse
goes, the duration of the pulse required to cause a
Reset gets shorter. Figure 4-16 shows the transient
response characteristics for the MCP131X/2X.
MR
MCP13XX
RST
WDI
I/O
PIC® MCU
MCLR
VSS
Transient immunity can be improved by adding a
bypass capacitor (typically 0.1 µF) as close as possible
to the VDD pin of the MCP131X/2X device.
FIGURE 4-17:
Watchdog Timer.
Push Button Reset and
5V
V
V
TRIP(MAX)
TRIP(MIN)
V
- V
DD
TRIP(MIN)
t
MR
(Overdrive)
t
MR
MRD
t
TRANS
(Duration)
V
IH
V
IL
0V
Time (µs)
t
RST
FIGURE 4-16:
Transient Duration Waveform.
Example of Typical
RST
RST
The MR input typically ignores input pulses
of 100 ns.
FIGURE 4-18:
MR Input – Push Button.
4.4.1
NOISE FILTER
The noise filter filters out noise spikes (glitches) on the
Manual Reset pin (MR). Noise spikes less than 100 ns
(typical) are filtered.
2005-2012 Microchip Technology Inc.
DS21985D-page 33
MCP131X/2X
Figure 4-19 shows a block diagram for using the
MCP131X/2X with a PIC® microcontroller (MCU) and
the Watchdog input.
4.5
Watchdog Timer
The purpose of the Watchdog Timer (WDT) is to
increase system reliability. The Watchdog Timer
feature can be used to detect when the Host
Controller’s program flow is not as expected. The
Watchdog Timer monitors for activity on the Watchdog
Input pin (WDI). The WDI pin is expected to be strobed
within a given time frame. When this time frame is
exceeded, without an edge transition on the WDI pin,
the Reset pin is driven active to reset the system. This
stops the Host Controller from continuing its erratic
behavior (“run-away” code execution).
TABLE 4-3:
WATCHDOG TIMER
PERIODS (1)
tWDT
Units
Min
Typ
Max
4.3
71
6.3
102
1.6
9.3
153
2.4
38.4
ms
ms
1.12
17.9
sec
sec
The Watchdog Timer is external to the main portion of
the control system and monitors the operation of the
system. This feature is enabled by a falling edge on the
WDI pin (after device POR). Monitoring is then done by
requiring the embedded controller to force an edge
transition (falling or rising) on the WDI pin (“pet the
Watchdog”) within a predetermined time frame (TWD).
If the MCP131X/2X does not detect an edge on the
WDI pin within the expected time frame, the
MCP131X/2X device will force the Reset pin active.
25.6
If the time between
WDI edges is less
than this, it
ensures that the
MCP131X/2X
never forces a
Reset
If the time
between WDI
edges is greater
than this, it
ensures that the
MCP131X/2X
always forces a
Reset
The Watchdog Timer is in the disabled state when:
Note 1: Shaded rows are custom ordered Watch-
dog Timer Periods (tWDT) time outs. For
information on ordering devices with
these tWDT time outs, please contact your
local Microchip sales office. Minimum
purchase volumes are required.
• The Device Powers up
• A POR event occurred
• A WDT event occurred
• A Manual Reset (MR) event occurred
When the Watchdog Timer is in the disabled state, the
WDI pin has an internal smart pull-up resistor enabled.
This pull-up resistor has a typical value of 52 k. This
pull-up resistor holds the WDI signal in the high state,
until it is forced to another state.
+5V
10 k
MCP13XX
+5V
3-Terminal
Regulator
(example:
MCP1700)
After the embedded controller has initialized, if the
Watchdog Timer feature is to be used, then the embed-
ded controller can force the WDI pin low (VIL). This also
enables the Watchdog Timer feature and disables the
WDI pull-up resistor. Disabling the pull-up resistor
reduces the device’s current consumption. The pull-up
resistor will remain disconnected until the device has a
power-on, a Reset event occurs, or after the WDT time
out.
V
MCLR
RST
CC
®
PIC
MCU
0.1
µF
I/O
WDI
GND
FIGURE 4-19:
Watchdog Timer.
The software routine that strobes WDI is critical. The
code must be in a section of software that is executed
frequently enough so the time between edge
transitions is less than the Watchdog time-out period.
One common technique controls the Host Controllers
I/O line from two sections of the program. The software
might set the I/O line high while operating in the
Foreground mode and set it low while in the
Background or Interrupt modes. If both modes do not
execute correctly, the Watchdog Timer issues Reset
pulses.
Once the Watchdog Timer has been enabled, the Host
Controller must force an edge transition (falling or ris-
ing) on the WDI pin before the minimum Watchdog
Timer time out to ensure that the Watchdog Timer does
not force the Reset pins (RST/RST) to the active state.
If an edge transition does not occur before the maxi-
mum time out occurs, then the MCP131X/2X will force
the Reset pins to their active state.
The MCP131X/2X supports four time outs. The stan-
dard offering devices have a typical Watchdog Timer
period (TWDT) of 1.6 s. Table 4-3 shows the available
Watchdog Timer periods. The tWDT time-out is a
function of the device voltage and temperature.
DS21985D-page 34
2005-2012 Microchip Technology Inc.
MCP131X/2X
®
5.3
Using in PIC Microcontroller,
5.0
APPLICATION INFORMATION
ICSP™ Applications
This section shows application-related information that
may be useful for your particular design requirements.
Note:
This operation can only be done using the
device with the Open-Drain RST pin
(MCP1320, MCP1321, and MCP1322).
Devices that have the internal pull-up
resistor are not recommended due to the
current path of the internal pull-up resistor.
5.1
Supply Monitor Noise Sensitivity
The MCP131X/2X devices are optimized for fast
response to negative-going changes in VDD. Systems
with an inordinate amount of electrical noise on VDD
(such as systems using relays) may require a 0.01 µF
or 0.1 µF bypass capacitor to reduce detection
sensitivity. This capacitor should be installed as close
to the MCP131X/2X as possible to keep the capacitor
lead length short.
Figure 5-4 shows the typical application circuit for using
the MCP132X for a voltage supervisory function when
the PIC® microcontroller will be programmed via the In-
Circuit Serial Programming™ (ICSP™) feature. Addi-
tional information is available in TB087, “Using Voltage
Supervisors with PIC® Microcontroller Systems which
Implement
(DS91087).
In-Circuit
Serial
Programming™”
0.1 µF
VDD
Note:
It is recommended that the current into the
RST pin be current limited by a 1 k
resistor.
MCP131X/2X
WDI
RST
RST
MR
VSS
VDD/VPP
0.1 µF
VDD
FIGURE 5-1:
with Bypass Capacitor.
Typical Application Circuit
RPU
VDD
PIC®
Microcontroller
MCP132X
MCLR
Reset input)
(Active-Low)
5.2
Conventional Voltage Monitoring
RST
VSS
Figure 5-2 and Figure 5-3 show the MCP131X/2X in
conventional voltage monitoring applications.
1 k
VSS
+
VDD
FIGURE 5-4:
Typical Application Circuit
for PIC® Microcontroller with the ICSP™ Feature.
–
MCP131X/2X
BATLOW
RST
VSS
FIGURE 5-2:
Battery Voltage Monitor.
VDD
+
RST
Pwr
Sply
MCP131X/2X
Power Good
–
VSS
FIGURE 5-3:
Power Good Monitor.
2005-2012 Microchip Technology Inc.
DS21985D-page 35
MCP131X/2X
5.4
Modifying The Trip Point, V
5.5
MOSFET Low-Drive Protection
TRIP
Although the MCP131X/2X device has a fixed voltage
trip point (VTRIP), it is sometimes necessary to make
custom adjustments. This can be accomplished by
connecting an external resistor divider to the
MCP131X/2X VDD pin. This causes the VSOURCE
voltage to be at a higher voltage than when the
MCP131X/2X input equals its VTRIP voltage
(Figure 5-5).
Low operating power and small physical size make the
MCP131X/2X series ideal for many voltage detector
applications. Figure 5-6 shows a low-voltage gate drive
protection circuit that prevents overheating of the logic-
level MOSFET due to insufficient gate voltage. When
the input signal is below the threshold of the
MCP131X/2X, its output grounds the gate of the
MOSFET.
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 10 µA maximum operating current required by the
MCP131X/2X. A reasonable value for this bleeder
current is 1 mA (100 times the 10 µA required by the
MCP131X/2X). For example, if VTRIP = 2V and the
desired trip point is 2.5V, the value of R1 + R2 is 2.5 k
(2.5V/1 mA). The value of R1 + R2 can be rounded to
the nearest standard value and plugged into the
equation of Figure 5-5 to calculate values for R1 and
R2. 1% tolerance resistors are recommended.
VTRIP
270
VDD
VDD
RL
MTP3055EL
RST
MCP131X/2X
VSS
VSOURCE
FIGURE 5-6:
Protection.
MOSFET Low-Drive
R2
VDD
5.6
Low-Power Applications
RST
MCP131X/2X
or RST
In some low-power applications, the longer the micro-
controller (such as a PIC® MCU) can be in the “Sleep
mode”, the lower the average system current consump-
tion will be.
R1
VSS
The WDT feature can be used to “wake-up” the PIC MCU
at a regular interval to service the required tasks before
returning to sleep. This “wake-up” occurs after the PIC
MCU detects a MCLR reset during Sleep mode (for mid-
range family; POR = 1, BOR = 1, TO = 1, and PD = 1).
R
1
+ R
--------------------
V
SOURCE R1
V
TRIP
2
Where:
VSOURCE
VTRIP
=
=
Voltage to be monitored
Threshold Voltage setting
Note:
In this example, VSOURCE must be
greater than (VTRIP
)
FIGURE 5-5:
Modify Trip-Point using
External Resistor Divider.
DS21985D-page 36
2005-2012 Microchip Technology Inc.
MCP131X/2X
5.7
Controllers and Processors With
Bidirectional I/O Pins
5.8
RESET Signal Integrity During
Power-Down
Some microcontrollers have bidirectional Reset pins.
Depending on the current drive capability of the
controller pin, an indeterminate logic level may result if
there is a logic conflict. This can be avoided by adding
a 4.7 k resistor in series with the output of the
MCP131X/2X (Figure 5-7). If there are other
components in the system that require a Reset signal,
they should be buffered so as not to load the Reset line.
If the other components are required to follow the
Reset I/O of the microcontroller, the buffer should be
connected as shown with the solid line.
The MCP131X/2X Reset output is valid to VDD = 1.0V.
Below this 1.0V, the output becomes an "open circuit"
and does not sink or source current. This means
CMOS logic inputs to the microcontroller will be floating
at an undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where the Reset signal must be
maintained valid to VDD = 0V, external circuitry is
required.
For devices where the Reset signal is active-low, a pull-
down resistor must be connected from the
MCP131X/2X Reset pin(s) to ground to discharge stray
capacitances and hold the output low (Figure 5-8).
Buffered Reset
To Other System
Components
Buffer
Similarly, for devices where the Reset signal is active-
high, a pull-up resistor to VDD is required to ensure a
valid high Reset signal for VDD below 1.0V.
VDD
PIC®
MCU
This resistor value, though not critical, should be
chosen such that it does not appreciably load the Reset
pin(s) under normal operation (100 k will be suitable
for most applications).
MCP13XX
4.7 k
MCLR
GND
RST
GND
VDD
FIGURE 5-7:
MCP131X/2X Push-Pull Outputs to a
Bidirectional Reset I/O.
Interfacing the
VDD
MCP13XX
RST
R1
100 k
GND
FIGURE 5-8:
Ensuring a Valid Active-low
Reset Pin Output State as VDD Approaches 0V.
2005-2012 Microchip Technology Inc.
DS21985D-page 37
MCP131X/2X
NOTES:
DS21985D-page 38
2005-2012 Microchip Technology Inc.
MCP131X/2X
6.1
Custom Configurations
6.0
STANDARD DEVICE
OFFERINGS
Table 6-2 shows the codes that specify the desired
Reset time out (tRST) and Watchdog Timer time-out
(tWDT) for custom devices.
Table 6-1 shows the standard devices that are
available and their respective configuration. The
configuration includes:
The voltage trip point (VTRIP) is specified by the two
digits of the desired typical trip point voltage. As an
example, if the desired VTRIP selection has a typical
VTRIP of 2.7V, the code is 27.
• Voltage Trip Point (VTRIP
• Reset Time Out (tRST
• Watchdog Time Out (tWDT
)
)
)
Table 6-1 also shows the order number for that given
device configuration.
TABLE 6-1:
Device
STANDARD VERSIONS
Reset Time Out (ms)
Watchdog Time Out (s)
Reset
Threshold (V)
Minimum Typical
Minimum
Typical
Order Number
MCP1316
MCP1316
MCP1316M
MCP1316M
MCP1317
MCP1317
MCP1318
MCP1318
MCP1318M
MCP1318M
MCP1319
MCP1319
MCP1319M
MCP1319M
MCP1320
MCP1320
MCP1321
MCP1321
MCP1322
MCP1322
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
2.90
4.60
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
140
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
200
1.12
1.12
1.12
1.12
1.12
1.12
1.12
1.12
1.12
1.12
—
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
1.6
—
MCP1316T-29LE/OT
MCP1316T-46LE/OT
MCP1316MT-29LE/OT
MCP1316MT-46LE/OT
MCP1317T-29LE/OT
MCP1317T-46LE/OT
MCP1318T-29LE/OT
MCP1318T-46LE/OT
MCP1318MT-29LE/OT
MCP1318MT-46LE/OT
MCP1319T-29LE/OT
MCP1319T-46LE/OT
MCP1319MT-29LE/OT
MCP1319MT-46LE/OT
MCP1320T-29LE/OT
MCP1320T-46LE/OT
MCP1321T-29LE/OT
MCP1321T-46LE/OT
MCP1322T-29LE/OT
MCP1322T-46LE/OT
—
—
—
—
—
—
1.12
1.12
1.12
1.12
—
1.6
1.6
1.6
1.6
—
—
—
TABLE 6-2:
DELAY TIME-OUT ORDERING CODES
Typical Delay Time (ms)
Typical Delay Time (ms)
Code
Reset
1.6
WDT
6.3
Comment
Note 1
Code
Reset
200.0
200.0
200.0
WDT
6.3
Comment
Note 1
A
B
C
J
K
L
1.6
102.0
1600.0
Note 1
102.0
1600.0
Note 1
1.6
Note 1
Delay timings for standard
device offerings
D
E
F
1.6
25600.0 Note 1
M
N
P
200.0
1600.0
1600.0
1600.0
1600.0
25600.0 Note 1
30.0
30.0
30.0
30.0
6.3
Note 1
Note 1
Note 1
6.3
Note 1
Note 1
Note 1
102.0
1600.0
102.0
1600.0
G
H
Q
R
25600.0 Note 1
25600.0 Note 1
Note 1: This delay timing combination is not the standard offering. For information on ordering devices with these
delay times, contact your local Microchip sales office. Minimum purchase volumes are required.
2005-2012 Microchip Technology Inc.
DS21985D-page 39
MCP131X/2X
NOTES:
DS21985D-page 40
2005-2012 Microchip Technology Inc.
MCP131X/2X
7.0
7.1
DEVELOPMENT TOOLS
Evaluation/Demonstration Boards
The SOT-23-5/6 Evaluation Board (VSUPEV2) can be
used to evaluate the characteristics of the
MCP131X/2X devices.
This blank PCB has footprints for:
• Pull-up Resistor
• Pull-down Resistor
• Loading Capacitor
• In-line Resistor
There is also a power supply filtering capacitor.
For evaluating the MCP131X/2X devices, the selected
device should be installed into the Option A footprint.
FIGURE 1:
SOT-23-5/6 Voltage
Supervisor Evaluation Board (VSUPEV2).
This board may be purchased directly from the
Microchip web site at www.microchip.com.
2005-2012 Microchip Technology Inc.
DS21985D-page 41
MCP131X/2X
NOTES:
DS21985D-page 42
2005-2012 Microchip Technology Inc.
MCP131X/2X
8.0
8.1
PACKAGING INFORMATION
Package Marking Information
5-Pin SOT-23
Example:
QA25
Part Number
SOT-23
MCP1316T-29LE/OT
MCP1316MT-29LE/OT
MCP1317T-29LE/OT
MCP1318T-29LE/OT
MCP1318MT-29LE/OT
MCP1319T-29LE/OT
MCP1319MT-29LE/OT
MCP1320T-29LE/OT
MCP1321T-29LE/OT
MCP1322T-29LE/OT
MCP1316T-46LE/OT
MCP1316MT-46LE/OT
MCP1317T-46LE/OT
MCP1318T-46LE/OT
MCP1318MT-46LE/OT
MCP1319T-46LE/OT
MCP1319MT-46LE/OT
MCP1320T-46LE/OT
MCP1321T-46LE/OT
MCP1322T-46LE/OT
QANN
QBNN
QCNN
QDNN
QENN
QFNN
QGNN
QHNN
QJNN
QKNN
QLNN
QMNN
QPNN
QQNN
QRNN
QSNN
QTNN
QUNN
QVNN
QWNN
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2005-2012 Microchip Technology Inc.
DS21985D-page 43
MCP131X/2X
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DS21985D-page 44
2005-2012 Microchip Technology Inc.
MCP131X/2X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2005-2012 Microchip Technology Inc.
DS21985D-page 45
MCP131X/2X
8.2
Product Tape and Reel Specifications
FIGURE 8-1:
EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)
Top
Cover
Tape
A
0
W
B
K
0
0
P
TABLE 8-1:
CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Cavity
Dimensions
Output
Quantity
Units
Reel
Diameter in
mm
Dimensions
Case
Package
Outline
Type
W
P
A0
B0
mm
K0
mm
mm
mm
mm
OT
SOT-23
3L
8
4
3.23
3.17
1.37
3000
180
FIGURE 8-2:
5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Device
Marking
User Direction of Feed
Pin 1
W, Width
of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
Reverse Reel Component Orientation
DS21985D-page 46
2005-2012 Microchip Technology Inc.
MCP131X/2X
APPENDIX A: REVISION HISTORY
Revision D (August 2012)
The following is the list of modifications:
1. Updated Figure 2-22 and Figure 2-23.
Revision C (February 2012)
The following is the list of modifications:
1. Updated package temperature in the
Temperature Characteristics table.
2. Corrected text in Section 4.0, Operational
Description.
3. Updated package specification in Section 8.0,
Packaging Information to show all drawings
available.
4. Other minor typographical corrections.
Revision B (October 2007)
The following is the list of modifications:
1. Clarified that devices with a Voltage Trip Point
2.4V are tested from -40C to + 85C. Devices
with a Voltage Trip Point 2.5V are tested from
-40C to +125C.
Revision A (November 2005)
• Original Release of this Document.
2005-2012 Microchip Technology Inc.
DS21985D-page 47
MCP131X/2X
NOTES:
DS21985D-page 48
2005-2012 Microchip Technology Inc.
MCP131X/2X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
X
/
PART NO.
Device
X
XX
X
XX
a)
b)
c)
d)
MCP1316T-29LE/OT:
MCP1316T-46LE/OT:
MCP1316MT-29LE/OT: 5-Lead SOT-23-5
MCP1316MT-46LE/OT: 5-Lead SOT-23-5
5-Lead SOT-23-5
5-Lead SOT-23-5
Temperature Package
Range
Tape/Reel
Option
Time-Out
Options
VTRIP
Options
Device:
MCP1316T: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
MCP1317T-29LE/OT:
MCP1317T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
MCP1316MT: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
c)
d)
MCP1318T-29LE/OT:
5-Lead SOT-23-5
MCP1318MT-29LE/OT: 5-Lead SOT-23-5
MCP1318T-46LE/OT: 5-Lead SOT-23-5
MCP1318MT-46LE/OT: 5-Lead SOT-23-5
MCP1317T: MicroPower Voltage Detector
(Tape and Reel)
MCP1318T: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
c)
d)
MCP1319T-29LE/OT:
MCP1318MT-29LE/OT: 5-Lead SOT-23-5
MCP1319T-46LE/OT: 5-Lead SOT-23-5
MCP1318MT-46LE/OT: 5-Lead SOT-23-5
5-Lead SOT-23-5
MCP1318MT: MicroPower Voltage Detector
(Tape and Reel)
MCP1319T: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
MCP1320T-29LE/OT:
MCP1320T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
MCP1319MT: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
MCP1321T-29LE/OT:
MCP1321T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
MCP1320T: MicroPower Voltage Detector
(Tape and Reel)
a)
b)
MCP1322T-29LE/OT:
MCP1322T-46LE/OT:
5-Lead SOT-23-5
5-Lead SOT-23-5
MCP1321T: MicroPower Voltage Detector
(Tape and Reel)
MCP1322T: MicroPower Voltage Detector
(Tape and Reel)
VTRIP Options:
(Note 1)
29
46
=
=
2.90V
4.60V
Time-Out Options:
L
=
tRST = 200 ms (typ.),
(Note 1)
tWDT = 1.6 s (typ.)
Temperature Range:
I
=
=
-40°C to +85°C
(Only for trip points 2.0V to 2.4V)
-40°C to +125°C
E
(For trip point 2.5V)
Package:
OT
=
SOT-23, 5-lead
Note 1: Custom ordered voltage trip points and time outs available. Please
contact your local Microchip sales office for additional information.
Minimum purchase volumes are required.
2005-2012 Microchip Technology Inc.
DS21985D-page 49
MCP131X/2X
NOTES:
DS21985D-page 50
2005-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-513-5
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2012 Microchip Technology Inc.
DS21985D-page 51
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
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Fax: 86-23-8980-9500
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
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Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
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Tel: 216-447-0464
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Tel: 852-2401-1200
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Fax: 86-532-8502-7205
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Tel: 63-2-634-9065
Fax: 63-2-634-9069
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Fax: 65-6334-8850
Indianapolis
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Fax: 317-773-5453
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Tel: 86-24-2334-2829
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Fax: 886-3-5770-955
Los Angeles
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Tel: 86-755-8203-2660
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Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/11
DS21985D-page 52
2005-2012 Microchip Technology Inc.
相关型号：
MCP1320T-25LE/OT
ACTIVE LOW P-P WITH WDI=1.6S, RESET DELAY=200MS, VTRPD-2.5V, -40C to +125C, 5-SOT-23, T/R
MICROCHIP
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