MCP1640-ICHY_技术文档

MCP1640/B/C/D

0.65V Start-Up Synchronous Boost Regulator

with True Output Disconnect or Input/Output Bypass Option

Features

General Description

• Up to 96% Typical Efficiency

The MCP1640/B/C/D is a compact, high-efficiency,

fixed frequency, synchronous step-up DC-DC con-

verter. It provides an easy-to-use power supply solution

for applications powered by either single-cell, two-cell,

or three-cell alkaline, NiCd, NiMH, and single-cell Li-Ion

or Li-Polymer batteries.

• 800 mA Typical Peak Input Current Limit:

- I_OUT> 100 mA @ 1.2V V_IN, 3.3V V_OUT

- I_OUT> 350 mA @ 2.4V V_IN, 3.3V V_OUT

- I_OUT> 350 mA @ 3.3V V_IN, 5.0V V_OUT

• Low Start-Up Voltage: 0.65V, typical 3.3V V_OUT

@ 1 mA

Low-voltage technology allows the regulator to start-up

without high inrush current or output voltage overshoot

from a low 0.65V input. High efficiency is accomplished

by integrating the low resistance N-Channel Boost

switch and synchronous P-Channel switch. All

compensation and protection circuitry is integrated to

minimize the number of external components. For

standby applications, the MCP1640 consumes only

19 µA while operating at no load, and provides a true

disconnect from input to output while in Shutdown

(EN = GND). Additional device options are available by

operating in PWM-Only mode and connecting input to

output while the device is in Shutdown.

• Low Operating Input Voltage: 0.35V, typical

3.3V_OUT@ 1 mA

• Adjustable Output Voltage Range: 2.0V to 5.5V

• Maximum Input Voltage  V_OUT< 5.5V

• Automatic PFM/PWM Operation (MCP1640/C):

- PFM Operation Disabled (MCP1640B/D)

- PWM Operation: 500 kHz

• Low Device Quiescent Current: 19 µA, typical

PFM Mode (not switching)

• Internal Synchronous Rectifier

• Internal Compensation

The “true” load disconnect mode provides input-to-out-

put isolation while the device is disabled by removing

the normal boost regulator diode path from input-to-

output. The Input-to-Output Bypass mode option con-

nects the input to the output using the integrated low

resistance P-Channel MOSFET, which provides a low

bias voltage for circuits operating in Deep Sleep mode.

Both options consume less than 1 µA of input current.

• Inrush Current Limiting and Internal Soft Start

• Selectable, Logic Controlled Shutdown States:

- True Load Disconnect Option (MCP1640/B)

- Input to Output Bypass Option (MCP1640C/D)

• Shutdown Current (All States): < 1 µA

• Low Noise, Anti-Ringing Control

• Overtemperature Protection

Output voltage is set by a small external resistor

divider. Two package options are available, 6-Lead

SOT-23 and 8-Lead 2 x 3 mm DFN.

• Available Packages:

- 6-Lead SOT-23

- 8-Lead 2 x 3 mm DFN

Package Types

Applications

MCP1640

6-Lead SOT-23

8-Lead 2 x 3 DFN*

• One, Two and Three Cell Alkaline and NiMH/NiCd

Portable Products

V_IN

V

SW

GND

EN

1

2

8

7

1

6

5

4

• Single-Cell Li-Ion to 5V Converters

• Li Coin Cell Powered Devices

• Personal Medical Products

• Wireless Sensors

FB

IN

S

P

EP

9

GND

OUTS

OUTP

V_OUT

V_FB

2

3

4

6

5

GND

EN

SW

• Handheld Instruments

• GPS Receivers

* Includes Exposed Thermal Pad (EP); see Table 3-1.

• Bluetooth Headsets

• +3.3V to +5.0V Distributed Power Supply

 2010-2015 Microchip Technology Inc.

DS20002234D-page 1

MCP1640/B/C/D

Typical Application

L₁

4.7 µH

V_OUT

V_IN

0.9V to 1.7V

3.3V @ 100 mA

SW

V_OUT

V_IN

976 k

C_OUT

10 µF

C_IN

4.7 µF

+

V_FB

EN

562 k

GND

-

L₁

4.7 µH

V_OUT

5.0V @ 300 mA

V_IN

3.0V to 4.2V

SW

V_OUTS

V_OUTP

V_IN

976 k

C_OUT

10 µF

C_IN

4.7 µF

+

V_FB

EN

309 k

P_GND

S_GND

-

Efficiency vs. I_OUTfor 3.3V_OUT

100.0

80.0

60.0

40.0

V_IN= 2.5V

V_IN= 0.8V

V_IN= 1.2V

0.1

1.0

10.0

100.0

1000.0

Output Current (mA)

DS20002234D-page 2

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of

the device at those or any other conditions above those

indicated in the operational sections of this

specification is not intended. Exposure to maximum

rating conditions for extended periods may affect

device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

EN, V_FB, V_IN,V_SW, V_OUT- GND .........................+6.5V

EN, V_FB....<maximum of V_OUTor V_IN> (GND – 0.3V)

Output Short-Circuit Current ...................... Continuous

Output Current Bypass Mode...........................400 mA

Power Dissipation ............................ Internally Limited

Storage Temperature .........................-65°C to +150°C

Ambient Temp. with Power Applied......-40°C to +85°C

Operating Junction Temperature........-40°C to +125°C

ESD Protection On All Pins:

HBM........................................................ 3 kV

MM.........................................................300V

DC CHARACTERISTICS

Electrical Characteristics: Unless otherwise indicated, V_IN= 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V,

_OUT= 15 mA, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

I

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Input Characteristics

Minimum Start-Up Voltage

V_IN

—

0.65

0.35

0.8

V

Note 1

Minimum Input Voltage After

Start-Up

—

Output Voltage Adjust Range

Maximum Output Current

V_OUT

I_OUT

2.0

—

5.5

—

V

V_OUT V_IN; Note 2

1.2V V_IN, 2.0V V_OUT

1.5V V_IN, 3.3V V_OUT

3.3V V_IN, 5.0V V_OUT

150

350

1.21

10

mA

V

—

Feedback Voltage

V_FB

I_VFB

1.175

—

1.245

—

Feedback Input Bias Current

pA

µA

Quiescent Current – PFM

Mode

I_QPFM

—

19

30

Measured at V_OUT= 4.0V;

EN = V_IN, I_OUT= 0 mA;

Note 3

Quiescent Current – PWM

Mode

I_QPWM

I_QSHDN

I_NLK

—

220

0.7

—

2.3

—

µA

Measured at V_OUT= 4.0V;

EN = V_IN,I_OUT= 0 mA;

Note 3

Quiescent Current – Shutdown

NMOS Switch Leakage

V_OUT= EN = GND;

Includes N-Channel and

P-Channel Switch Leakage

0.3

V_IN= V_SW= 5V;

V_OUT= 5.5V

V_EN= V_FB= GND

PMOS Switch Leakage

I_PLK

0.05

—

V_IN= VS_W= GND;

V_OUT= 5.5V

Note 1: 3.3 k resistive load, 3.3V_OUT(1 mA).

2: For V_IN> V_OUT, V_OUTwill not remain in regulation.

3: _QOUTis measured at V_OUT; V_OUTis externally supplied with a voltage higher than the nominal 3.3V output

I

(device is not switching); no load; V_INquiescent current will vary with boost ratio. V_INquiescent current

can be estimated by: (I_QPFM* (V_OUT/V_IN)), (I_QPWM* (V_OUT/V_IN)).

4: Peak current limit determined by characterization, not production tested.

5: 220 resistive load, 3.3V_OUT(15 mA).

 2010-2015 Microchip Technology Inc.

DS20002234D-page 3

MCP1640/B/C/D

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, V_IN= 1.2V, C_OUT= C_IN= 10 µF, L = 4.7 µH, V_OUT= 3.3V,

I

_OUT= 15 mA, T_A= +25°C. Boldface specifications apply over the T_Arange of -40°C to +85°C.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

NMOS Switch On Resistance

PMOS Switch On Resistance

R_DS(ON)N

R_DS(ON)P

I_N(MAX)

—

0.6

0.9

—



V_IN= 3.3V, I_SW= 100 mA

Note 4

NMOS Peak Switch Current

Limit

600

850

mA

V_OUTAccuracy

Line Regulation

Load Regulation

V_OUT

%

-3

-1

—

+3

1

%

%/V

%

Includes Line and Load

Regulation; V_IN= 1.5V

V_OUT/V_OUT

/V_IN|

)

0.01

V_IN= 1.5V to 3V

I_OUT= 25 mA

V_OUT/V_OUT

|

1

I_OUT= 25 mA to 100 mA;

V_IN= 1.5V

Maximum Duty Cycle

Switching Frequency

EN Input Logic High

EN Input Logic Low

EN Input Leakage Current

Soft-Start Time

DC_MAX

f_SW

88

425

90

—

90

500

—

575

—

%

kHz

V_IH

%of V_INI_OUT= 1 mA

V_IL

—

20

—

I_ENLK

t_SS

—

0.005

750

µA

µS

V_EN= 5V

—

EN Low-to-High,

90% of V_OUT; Note 5

Thermal Shutdown Die

Temperature

T_SD

—

150

—

C

Die Temperature Hysteresis

T_SDHYS

—

10

Note 1: 3.3 k resistive load, 3.3V_OUT(1 mA).

2: For V_IN> V_OUT, V_OUTwill not remain in regulation.

3: I_QOUTis measured at V_OUT; V_OUTis externally supplied with a voltage higher than the nominal 3.3V output

(device is not switching); no load; V_INquiescent current will vary with boost ratio. V_INquiescent current

can be estimated by: (I_QPFM* (V_OUT/V_IN)), (I_QPWM* (V_OUT/V_IN)).

4: Peak current limit determined by characterization, not production tested.

5: 220 resistive load, 3.3V_OUT(15 mA).

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, V = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA.

OUT

IN

OUT

IN

OUT

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

T_J

-40

—

+125

°C

Steady State

Transient

Storage Temperature Range

T_A

T_J

-65

—

+150

°C

Maximum Junction Temperature

Package Thermal Resistances

Thermal Resistance, 6LD-SOT-23

Thermal Resistance, 8LD-2x3 DFN

_JA

—

190.5

75

—

°C/W

DS20002234D-page 4

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

2.0

TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD

A

27.5

100

V_IN= 1.6V

V_IN= 1.2V

V_OUT= 2.0V

90

80

70

60

50

40

30

20

10

0

V_OUT= 5.0V

25.0

22.5

20.0

17.5

15.0

12.5

10.0

V_IN= 0.8V

V_IN= 1.2V

V_OUT= 3.3V

V_OUT= 2.0V

PWM / PFM

PWM Only

-40 -25 -10

5

20

35

50

65

80

0.01

0.1

1

10

I_OUT(mA)

100

1000

Ambient Temperature (°C)

FIGURE 2-1:

Temperature in PFM Mode.

V_OUTI_Qvs. Ambient

FIGURE 2-4:

Efficiency vs. I_OUT

2.0V V_OUTPFM/PWM Mode

.

100

90

80

70

60

50

40

30

20

10

0

300

V_IN= 2.5V

V_OUT= 3.3V

V_IN= 1.2V

V_OUT= 5.0V

V_OUT= 3.3V

275

250

225

200

175

150

V_IN= 0.8V

V_IN= 1.2V

PWM / PFM

PWM Only

-40 -25 -10

5

20

35

50

65

80

0.01

0.1

1

10

I_OUT(mA)

100

1000

Ambient Temperature (°C)

FIGURE 2-2:

Temperature in PWM Mode.

V

_OUTI_Qvs. Ambient

FIGURE 2-5:

Efficiency vs. I_OUT

3.3V V_OUTPFM/PWM Mode

.

100

90

80

70

60

50

40

30

20

10

0

600

V_IN= 3.6V

V_OUT= 5.0V

500

400

300

200

100

0

V_OUT= 3.3V

V_IN= 1.8V

V_IN= 1.2V

V_OUT= 2.0V

PWM / PFM

PWM Only

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

0.01

0.1

1

10

I_OUT(mA)

100

1000

V_IN(V)

FIGURE 2-3:

Maximum I_OUTvs. V_INAfter

FIGURE 2-6:

5.0V V_OUTPFM/PWM Mode

Start-Up, V_OUT10% Below Regulation Point.

Efficiency vs. I_OUT.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 5

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD A

1.00

3.33

V_IN= 1.2V

I_OUT= 15 mA

V_OUT= 3.3V

3.325

3.32

0.85

0.70

0.55

0.40

0.25

V_IN= 1.8V

3.315

3.31

Startup

3.305

3.3

Shutdown

V_IN= 0.8V

3.295

3.29

3.285

-40 -25 -10

5

20

35

50

65

80

0

20

40

60

80

100

Ambient Temperature (°C)

I_OUT(mA)

FIGURE 2-7:

3.3V V_OUTvs. Ambient

FIGURE 2-10:

Minimum Start-Up and

Temperature.

Shutdown V_INinto Resistive Load vs. I_OUT

.

3.38

525

520

515

510

505

500

495

490

485

480

V_IN= 1.5V

V_OUT= 3.3V

3.36

3.34

3.32

3.30

3.28

3.26

I_OUT= 5 mA

I_OUT= 15 mA

I_OUT= 50 mA

-40 -25 -10

5

20

35

50

65

80

-40 -25 -10

5

20

35

50

65

80

Ambient Temperature (°C)

FIGURE 2-8:

3.3V V_OUTvs. Ambient

FIGURE 2-11:

F

_OSCvs. Ambient

Temperature.

4.5

4

3.40

I_OUT= 5 mA

V_OUT= 5.0V

T_A= +85°C

3.36

3.32

3.28

3.24

3.20

3.5

3

T_A= +25°C

V_OUT= 3.3V

V_OUT= 2.0V

2.5

2

T_A= -40°C

1.5

1

0.5

0

1

2

3

4

5

6

7

8

9

10

0.8

1.2

1.6

2

2.4

2.8

I_OUT(mA)

V_IN(V)

FIGURE 2-9:

3.3V V_OUTvs. V_IN.

FIGURE 2-12:

Threshold vs. I_OUT

PWM Pulse-Skipping Mode

.

DS20002234D-page 6

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD A

10000

PWM / PFM

PWM Only

1000

100

10

V_OUT= 5.0V

V_OUT= 3.3V

V_OUT= 2.0V

V_OUT= 5.0V

V_OUT= 2.0V

V_OUT= 3.3V

0.8 1.1 1.4 1.7

2

2.3 2.6 2.9 3.2 3.5

V_IN(V)

FIGURE 2-13:

Input No Load Current vs.

FIGURE 2-16:

MCP1640 3.3V V_OUTPFM

V_IN.

Mode Waveforms.

5

4

IOUT = 1 mA

V^OUT

20 mV/DIV

AC

P - Channel

Coupled

3

2

1

0

V^SW

2V/DIV

I^L

0.05 mA/DIV

N - Channel

1

1.5

2

2.5

3

3.5

4

4.5

5

1 µs/DIV

> V_INor V_OUT

FIGURE 2-14:

N-Channel and P-Channel

FIGURE 2-17:

MCP1640B 3.3V V_OUT

R

_DSONvs. > of V_INor V_OUT

.

PWM Mode Waveforms.

60

50

40

30

20

10

0

V_OUT= 5.0V

V_OUT= 3.3V

V_OUT= 2.0V

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

V_IN(V)

FIGURE 2-15:

Average of PFM/PWM

FIGURE 2-18:

MCP1640/B High Load

Threshold Current vs. V_IN.

Waveforms.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 7

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD

A

MCP1640B PWM

Mode Only

V^OUT

100 mV/DIV

AC

VOUT

1V/DIV

Coupled

I^STEP= 1 mA to 75 mA

VIN

1V/DIV

I^OUT

50 mA/DIV

VEN

1V/DIV

500 µs/DIV

100 µs/DIV

FIGURE 2-19:

3.3V Start-Up After Enable.

FIGURE 2-22:

MCP1640B 3.3V V_OUTLoad

Transient Waveforms.

MCP1640B PWM

Mode Only

VOUT

1V/DIV

V^OUT

50 mV/DIV

AC

Coupled

I^STEP= 1 mA to 50 mA

V^IN

1V/DIV

I^OUT

50 mA/DIV

V^EN

1V/DIV

100 µs/DIV

500 µs/DIV

FIGURE 2-20:

3.3V Start-Up when

FIGURE 2-23:

MCP1640B 2.0V V_OUTLoad

V_IN= V_ENABLE

.

Transient Waveforms.

PFM

MODE

PWM

MODE

V^OUT

50 mV/DIV

AC

100 mV/DIV

AC

Coupled

I^STEP= 1 mA to 75 mA

V^IN

1V/DIV

VSTEP from

1V to 2.5V

I^OUT

50 mA/DIV

200 µs/DIV

100 µs/DIV

FIGURE 2-21:

MCP1640 3.3V V_OUTLoad

FIGURE 2-24:

3.3V V_OUTLine Transient

Transient Waveforms.

Waveforms.

DS20002234D-page 8

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

MCP1640/B/C/D MCP1640/B/C/D

Symbol

Description

2x3 DFN

SOT-23

1

2

4

—

3

V_FB

S_GND

P_GND

EN

Feedback Voltage Pin

Signal Ground Pin

3

Power Ground Pin

4

Enable Control Input Pin

5

1

SW

Switch Node, Boost Inductor Input Pin

6

—

6

V_OUTPOutput Voltage Power Pin

V_OUTSOutput Voltage Sense Pin

7

8

V_IN

EP

Input Voltage Pin

9

—

2

Exposed Thermal Pad (EP); must be connected to V_SS

—

GND

V_OUT

Ground Pin

5

Output Voltage Pin

3.1

Feedback Voltage Pin (V

)

3.6

Output Voltage Power Pin (V

)

FB

OUTP

The output voltage power pin connects the output

voltage to the switch node. High current flows through

the integrated P-Channel and out of this pin to the

output capacitor and the output. In the 2x3 DFN

package, V_OUTPand V_OUTSare connected externally.

The V_FBpin is used to provide output voltage regulation

by using a resistor divider. Feedback voltage will be

1.21V typical with the output voltage in regulation.

3.2

Signal Ground Pin (S

)

GND

3.7

Output Voltage Sense Pin (V

)

OUTS

The signal ground pin is used as a return for the

integrated V_REFand error amplifier. In the 2x3 DFN

package, the S_GNDand power ground (P_GND) pins are

connected externally.

The output voltage sense pin connects the regulated

output voltage to the internal bias circuits. In the

2x3 DFN package, the V_OUTSand output voltage

power (V_OUTP) pins are connected externally.

3.3

Power Ground Pin (P

)

GND

3.8

Power Supply Input Voltage Pin (V )

IN

The power ground pin is used as a return for the

high-current N-Channel switch. In the 2x3 DFN

package, the P_GNDand S_GNDpins are connected

externally.

Connect the input voltage source to V_IN. The input

source should be decoupled to GND with a 4.7 µF

minimum capacitor.

3.9

Exposed Thermal Pad (EP)

3.4

Enable Pin (EN)

There is no internal electrical connection between the

Exposed Thermal Pad (EP) and the S_GNDand P_GND

pins. They must be connected to the same potential on

the Printed Circuit Board (PCB).

The EN pin is a logic-level input used to enable or

disable device switching and lower quiescent current

while disabled. A logic high (>90% of V_IN) will enable

the regulator output. A logic low (<20% of V_IN) will

ensure that the regulator is disabled.

3.10 Ground Pin (GND)

The ground or return pin is used for circuit ground

connection. Length of trace from input cap return,

output cap return, and GND pin should be made as

short as possible to minimize noise on the GND pin. In

the SOT-23-6 package, a single ground pin is used.

3.5

Switch Node Pin (SW)

Connect the inductor from the input voltage to the SW

pin. The SW pin carries inductor current and can be as

high as 800 mA peak. The integrated N-Channel switch

drain and integrated P-Channel switch source are

internally connected at the SW node.

3.11 Output Voltage Pin (V

)

OUT

The output voltage pin connects the integrated

P-Channel MOSFET to the output capacitor. The FB

voltage divider is also connected to the V_OUTpin for

voltage regulation.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 9

MCP1640/B/C/D

NOTES:

DS20002234D-page 10

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

For noise immunity, the N-Channel MOSFET current

sense is blanked for approximately 100 ns. With a typ-

ical minimum duty cycle of 100 ns, the MCP1640B/D

continues to switch at a constant frequency under light

load conditions. Figure 2-12 represents the input volt-

age versus load current for the pulse skipping threshold

in PWM-Only mode. At lighter loads, the MCP1640B/D

devices begin to skip pulses.

4.0

4.1

DETAILED DESCRIPTION

Device Option Overview

The MCP1640/B/C/D family of devices is capable of

low start-up voltage and delivers high efficiency over a

wide load range for single-cell, two-cell, or three-cell

alkaline, NiCd, NiMH and single-cell Li-Ion battery

inputs. A high level of integration lowers total system

cost, eases implementation and reduces board area.

4.1.3

TRUE OUTPUT DISCONNECT

MODE OPTION

The devices feature low start-up voltage, adjustable

output voltage, PWM/PFM mode operation, low I_Q,

integrated synchronous switch, internal compensation,

low noise anti-ring control, inrush current limit, and soft

start.

The MCP1640/B devices incorporate a true output

disconnect feature. With the EN pin pulled low, the

output of the MCP1640/B is isolated or disconnected

from the input by turning off the integrated P-Channel

switch and removing the switch bulk diode connection.

This removes the DC path that is typical in boost con-

verters, which allows the output to be disconnected

from the input. During this mode, less than 1 µA of cur-

rent is consumed from the input (battery). True output

disconnect does not discharge the output; the output

voltage is held up by the external C_OUTcapacitance.

There are two options for the MCP1640/B/C/D family:

• PWM/PFM mode or PWM-Only mode

• “True Output Disconnect” mode or Input-to-Output

Bypass mode

4.1.1

PWM/PFM MODE OPTION

The MCP1640/C devices use an automatic switchover

from PWM to PFM mode for light load conditions to

maximize efficiency over a wide range of output

current. During PFM mode, higher peak current is used

to pump the output up to the threshold limit. While

operating in PFM or PWM mode, the P-Channel switch

is used as a synchronous rectifier, turning off when the

inductor current reaches 0 mA to maximize efficiency.

4.1.4

INPUT BYPASS MODE OPTION

The MCP1640C/D devices incorporate the Input

Bypass shutdown option. With the EN input pulled low,

the output is connected to the input using the internal

P-Channel MOSFET. In this mode, the current draw

from the input (battery) is less than 1 µA with no load.

Input Bypass mode is used when the input voltage

range is high enough for the load to operate in Sleep or

Low I_Qmode. When a higher regulated output voltage

is necessary to operate the application, the EN input is

pulled high, enabling the boost converter.

In PFM mode, a comparator is used to terminate

switching when the output voltage reaches the upper

threshold limit. Once switching has terminated, the

output voltage will decay or coast down. During this

period, very low I_Qis consumed from the device and

input source, which keeps power efficiency high at light

load.

TABLE 4-1:

PART NUMBER SELECTION

Input

Part

Number

PWM/ PWM

PFM -Only Disconnect Output

Bypass

True

-to-

The disadvantages of PWM/PFM mode are higher out-

put ripple voltage and variable PFM mode frequency.

The PFM mode frequency is a function of input voltage,

output voltage and load. While in PFM mode, the boost

converter pumps the output up at a switching frequency

of 500 kHz.

MCP1640

X

MCP1640B

MCP1640C

MCP1640D

X

4.1.2

PWM-ONLY MODE OPTION

The MCP1640B/D devices disable PFM mode

switching, and operate only in PWM mode over the

entire load range. During periods of light load opera-

tion, the MCP1640B/D continues to operate at a con-

stant 500 kHz switching frequency, keeping the output

ripple voltage lower than PFM mode.

During PWM-Only mode, the MCP1640B/D P-Channel

switch acts as a synchronous rectifier by turning off (to

prevent reverse current flow from the output cap back

to the input) in order to keep efficiency high.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 11

MCP1640/B/C/D

Figure 4-1 depicts the functional block diagram of the

MCP1640/B/C/D.

4.2

Functional Description

The MCP1640/B/C/D is a compact, high-efficiency,

fixed frequency, step-up DC-DC converter that

provides an easy-to-use power supply solution for

applications powered by either single-cell, two-cell, or

three-cell alkaline, NiCd, NiMH, and single-cell Li-Ion or

Li-Polymer batteries.

V

OUT

Internal

Bias

V

IN

I

ZERO

Direction

Control

SW

EN

Soft Start

.3V

0V

Gate Drive

and

Shutdown

Control

Logic

I

LIMIT

SENSE

Slope

Comp.

GND

Oscillator

S

PWM/PFM

Logic

1.21V

FB

EA

FIGURE 4-1:

MCP1640/B/C/D Block Diagram.

current is limited to 50% of its nominal value. Once the

output voltage reaches 1.6V, normal closed-loop PWM

operation is initiated.

The MCP1640/B/C/D charges an internal capacitor

with a very weak current source. The voltage on this

capacitor, in turn, slowly ramps the current limit of the

boost switch to its nominal value. The soft-start

capacitor is completely discharged in the event of a

commanded shutdown or a thermal shutdown.

4.2.1

LOW-VOLTAGE START-UP

The MCP1640/B/C/D is capable of starting from a low

input voltage. Start-up voltage is typically 0.65V for a

3.3V output and 1 mA resistive load.

When enabled, the internal start-up logic turns the

rectifying P-Channel switch on until the output

capacitor is charged to a value close to the input

voltage. The rectifying switch is current-limited to

approximately 100 mA during this time. This will affect

the start-up under higher load currents, and the device

may not start to the nominal value. After charging the

output capacitor to the input voltage, the device starts

switching. If the input voltage is below 1.6V, the device

runs open-loop with a fixed duty cycle of 70% until the

output reaches 1.6V. During this time, the boost switch

There is no undervoltage lockout feature for the

MCP1640/B/C/D. The device will start-up at the lowest

possible voltage and run down to the lowest possible

voltage. For typical battery applications, this may result

in “motor-boating” (emitting a low-frequency tone) for

deeply discharged batteries.

DS20002234D-page 12

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

4.2.2

PWM-ONLY MODE OPERATION

4.2.5

ENABLE PIN

In normal PWM operation, the MCP1640/B/C/D

operates as a fixed frequency, synchronous boost

converter. The switching frequency is internally

maintained with a precision oscillator typically set to

500 kHz. The MCP1640B/D devices will operate in

PWM-Only mode even during periods of light load

operation. By operating in PWM-Only mode, the output

ripple remains low and the frequency is constant.

Operating in fixed PWM mode results in lower

efficiency during light load operation (when compared

to PFM mode (MCP1640/C)).

The enable pin is used to turn the boost converter on

and off. The enable threshold voltage varies with input

voltage. To enable the boost converter, the EN voltage

level must be greater than 90% of the V_INvoltage. To

disable the boost converter, the EN voltage must be

less than 20% of the V_INvoltage.

4.2.6

INTERNAL BIAS

The MCP1640/B/C/D gets its start-up bias from V_IN.

Once the output exceeds the input, bias comes from

the output. Therefore, once started, operation is

completely independent of V_IN. Operation is only

limited by the output power level and the input source

series resistance. When started, the output will remain

in regulation down to 0.35V typical with 1 mA output

current for low source impedance inputs.

Lossless current sensing converts the peak current sig-

nal to a voltage to sum with the internal slope compen-

sation. This summed signal is compared to the voltage

error amplifier output to provide a peak current control

command for the PWM signal. The slope

compensation is adaptive to the input and output

voltage. Therefore, the converter provides the proper

amount of slope compensation to ensure stability, but is

not excessive, which causes a loss of phase margin.

The peak current limit is set to 800 mA typical.

4.2.7

INTERNAL COMPENSATION

The error amplifier, with its associated compensation

network, completes the closed-loop system by

comparing the output voltage to a reference at the

input of the error amplifier, and feeding the amplified

and inverted signal to the control input of the inner

current loop. The compensation network provides

phase leads and lags at appropriate frequencies to

cancel excessive phase lags and leads of the power

circuit. All necessary compensation components and

slope compensation are integrated.

4.2.3

PFM MODE OPERATION

The MCP1640/C devices are capable of operating in

normal PWM mode and PFM mode to maintain high

efficiency at all loads. In PFM mode, the output ripple

has a variable frequency component that changes with

the input voltage and output current. The value of the

output capacitor changes the low-frequency compo-

nent ripple. Output ripple peak-to-peak values are not

affected by the output capacitor. With no load, the qui-

escent current draw from the output is typically 19 µA.

This is not a switching current and is not dependent on

the input and output parameters. The no-load input cur-

rent drawn from the battery depends on the above

parameters. Its variation is shown in Figure 2-13. The

PFM mode can be disabled in selected device options.

4.2.8

SHORT CIRCUIT PROTECTION

Unlike most boost converters, the MCP1640/B/C/D

allows its output to be shorted during normal operation.

The internal current limit and overtemperature

protection limit excessive stress and protect the device

during periods of short circuit, overcurrent and over-

temperature. While operating in Bypass mode, the

P-Channel current limit is inhibited to minimize

quiescent current.

PFM operation is initiated if the output load current falls

below an internally programmed threshold. The output

voltage is continuously monitored. When the output

voltage drops below its nominal value, PFM operation

pulses one or several times to bring the output back

into regulation. If the output load current rises above

the upper threshold, the MCP1640/C transitions

smoothly into PWM mode.

4.2.9

LOW NOISE OPERATION

The MCP1640/B/C/D integrates a low noise anti-ring

switch that damps the oscillations typically observed at

the switch node of a boost converter when operating in

the Discontinuous Inductor Current mode. This

removes the high-frequency radiated noise.

4.2.4

ADJUSTABLE OUTPUT VOLTAGE

4.2.10

OVERTEMPERATURE

PROTECTION

The MCP1640/B/C/D output voltage is adjustable with

a resistor divider over a 2.0V minimum to 5.5V

maximum range. High-value resistors can be used to

minimize quiescent current to keep efficiency high at

light loads.

Overtemperature protection circuitry is integrated into

the MCP1640/B/C/D. This circuitry monitors the device

junction temperature and shuts the device off if the

junction temperature exceeds the typical +150°C

threshold. If this threshold is exceeded, the device will

automatically restart when the junction temperature

drops by 10°C. The soft start is reset during an

overtemperature condition.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 13

MCP1640/B/C/D

NOTES:

DS20002234D-page 14

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

For boost converters, the removal of the feedback

resistors during operation must be avoided. In this

case, the output voltage will increase above the

absolute maximum output limits of the MCP1640/B/C/D

and damage the device.

5.0

5.1

APPLICATION INFORMATION

Typical Applications

The MCP1640/B/C/D synchronous boost regulator

operates over a wide input and output voltage range.

The power efficiency is high for several decades of load

range. Output current capability increases with input

voltage and decreases with increasing output voltage.

The maximum output current is based on the

N-Channel peak current limit. Typical characterization

curves in this data sheet are presented to display the

typical output current capability.

The maximum device output current is dependent upon

the input and output voltage. For example, to ensure a

100 mA load current for V_OUT= 3.3V, a minimum of

1.0-1.1V input voltage is necessary. If an application is

powered by one Li-Ion battery (V_INfrom 3.0V to 4.2V),

the minimum load current the MCP1640/B/C/D can

deliver is close to 300 mA at 5.0V output and a

maximum of 500 mA (Figure 2-3).

5.2.1

V_IN> V_OUTSITUATION

5.2

Adjustable Output Voltage

Calculations and

Maximum Output Current

For V_IN> V_OUT, the output voltage will not remain in

regulation. V_IN> V_OUTis an unusual situation for a

boost converter, and there is a common issue when

two Alkaline cells (2 x 1.6V typical) are used to boost to

3.0V output. The Input-to-Output Bypass option is

recommended to be used in this situation until the

batteries’ voltages go down to a safe headroom. A

minimum headroom of approximately 150 to 200 mV

between V_OUTand V_INmust be ensured, unless a low-

frequency, high-amplitude output ripple on V_OUTis

expected. The ripple and its frequency is V_INand load

dependent. The higher the V_IN, the higher the ripple

and the lower its frequency.

To calculate the resistor divider values for the

MCP1640/B/C/D, the following equation can be used,

where R_TOPis connected to V_OUT, R_BOTis connected

to GND and both are connected to the FB input pin.

EQUATION 5-1:

V









OUT

R

= R

 ---------------- – 1



TOP

BOT

V



FB

EXAMPLE 1:

5.3

Input Capacitor Selection

V_OUT

V_FB

=

3.3V

The boost input current is smoothed by the boost induc-

tor reducing the amount of filtering necessary at the

input. Some capacitance is recommended to provide

decoupling from the source. Low ESR X5R or X7R are

well suited since they have a low temperature coefficient

and small size. For most applications, 4.7 µF of capaci-

tance is sufficient at the input. For high-power applica-

tions that have high source impedance or long leads,

connecting the battery to the input 10 µF of capacitance

is recommended. Additional input capacitance can be

added to provide a stable input voltage.

1.21V

R_BOT

R_TOP

309 k

533.7 k (Standard Value = 536 k)

EXAMPLE 2:

V_OUT

V_FB

=

5.0V

1.21V

R_BOT

R_TOP

309 k

Table 5-1 contains the recommended range for the

input capacitor value.

967.9 k (Standard Value = 976 k)

The internal error amplifier is of transconductance type; its

gain is not related to the resistors' value. There are some

potential issues with higher-value resistors. For small

surface-mount resistors, environment contamination can

create leakage paths that significantly change the resistor

divider ratio and modify the output voltage tolerance.

5.4

Output Capacitor Selection

The output capacitor helps provide a stable output

voltage during sudden load transients and reduces the

output voltage ripple. As with the input capacitor, X5R

and X7R ceramic capacitors are well suited for this appli-

cation. Using other capacitor types (aluminum or tanta-

lum) with large ESR has an impact on the converter's

efficiency and maximum output power (see AN1337).

Smaller feedback resistor values will increase the

current drained from the battery by a few µA, but will

result in good regulation over the entire temperature

range and environment conditions. The feedback input

leakage current can also impact the divider and change

the output voltage tolerance.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 15

MCP1640/B/C/D

The MCP1640/B/C/D is internally compensated, so

output capacitance range is limited (see Table 5-1 for

the recommended output capacitor range). An output

capacitance higher than 10 µF adds a better load-step

response and high-frequency noise attenuation, espe-

cially while stepping from light current loads (PFM

mode) to heavy current loads (PWM mode). Over-

shoots and undershoots during pulse load application

are reduced by adding a zero in the compensation

loop. A small capacitance (for example 100 pF) in par-

allel with an upper feedback resistor will reduce output

spikes, especially in PFM mode.

5.5

Inductor Selection

The MCP1640/B/C/D is designed to be used with small

surface-mount inductors; the inductance value can

range from 2.2 µH to 10 µH. An inductance value of

4.7 µH is recommended to achieve a good balance

between inductor size, converter load transient

response and minimized noise.

TABLE 5-2:

MCP1640/B/C/D

RECOMMENDED INDUCTORS

Size

WxLxH

(mm)

Part Number

While the N-Channel switch is on, the output current is

supplied by the output capacitor C_OUT. The amount of

output capacitance and equivalent series resistance

will have a significant effect on the output ripple

voltage. While C_OUTprovides load current, a voltage

drop also appears across its internal ESR that results

in ripple voltage.

Coilcraft

EPL2014-472

EPL3012-472

MSS4020-472

LPS6225-472

Coiltronics^®

SD3110

4.7

0.23

0.165

0.115

0.065

1.06 2.0x2.0x1.4

1.1

1.5

3.2

3.0x3.0x1.3

4.0x4.0x2.0

6.0x6.0x2.4

EQUATION 5-2:

4.7

0.285

0.246

0.251

0.162

0.256

0.68 3.1x3.1x1.0

0.80 3.1x3.1x1.2

1.14 3.1x3.1x1.4

1.31 3.8x3.8x1.2

1.13 3.8x3.8x1.2

dV

dt







I

= C

 ------

SD3112

OUT



Where:

dV = ripple voltage

dt = On time of the N-Channel switch

SD3114

SD3118

SD3812

SD25

0.0467 1.83 5.0x5.0x2.5

(D x 1/F_SW

)

Würth Elektronik^®

WE-TPC Type TH

WE-TPC Type S

WE-TPC Type M

WE-TPC Type X

Table 5-1 contains the recommended range for the

input and output capacitor value.

4.7

0.200

0.105

0.082

0.046

0.8 2.8x2.8x1.35

0.90 3.8x3.8x1.65

1.65 4.8x4.8x1.8

2.00 6.8x6.8x2.3

TABLE 5-1:

CAPACITOR VALUE RANGE

C_IN

C_OUT

Sumida Corporation

Min.

4.7 µF

—

10 µF

CMH23

4.7

0.537

0.216

0.09

0.70 2.3x2.3x1.0

0.75 3.5x4.3x0.8

0.800 4.6x4.6x1.5

Max.

100 µF

CMD4D06

CDRH4D

4.7

TDK-EPCOS

B82462A2472M000 4.7

B82462G4472M 4.7

0.084

0.04

2.00 6.0x6.0x2.5

1.8

6.3x6.3x3.0

Several parameters are used to select the correct

inductor: maximum rated current, saturation current

and copper resistance (ESR). For boost converters, the

inductor current is much higher than the output current;

the average of the inductor current is equal to the input

current drawn from the input. The lower the inductor

ESR, the higher the efficiency of the converter. This is

a common trade-off in size versus efficiency.

Peak current is the maximum or the limit, and

saturation current typically specifies a point at which

the inductance has rolled off a percentage of the rated

value. This can range from a 20% to 40% reduction in

inductance. As inductance rolls off, the inductor ripple

current increases; as does the peak switch current. It is

important to keep the inductance from rolling off too

much, causing switch current to reach the peak limit.

DS20002234D-page 16

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

estimate, assuming that most of the power lost is

internal to the MCP1640/B/C/D and not C_IN, C_OUTand

the inductor. There is some percentage of power lost in

the boost inductor, with very little loss in the input and

output capacitors. For a more accurate estimation of

internal power dissipation, subtract the I_INRMS²x L_ESR

power dissipation.

5.6

Thermal Calculations

The MCP1640/B/C/D is available in two different

packages: 6-Lead SOT-23 and 8-Lead 2 x 3 DFN. The

junction temperature is estimated by calculating the

power dissipation and applying the package thermal

resistance (_JA). The maximum continuous junction

temperature rating for the MCP1640/B/C/D is +125°C.

To quickly estimate the internal power dissipation for

the switching boost regulator, an empirical calculation

using measured efficiency can be used. Given the

measured efficiency, the internal power dissipation is

estimated by Equation 5-3.

5.7

PCB Layout Information

Good printed circuit board layout techniques are

important to any switching circuitry, and switching

power supplies are no different. When wiring the

switching high-current paths, short and wide traces

should be used. Therefore, it is important that the input

and output capacitors be placed as close as possible to

the MCP1640/B/C/D to minimize the loop area.

EQUATION 5-3:

V

 I

OUT OUT

The feedback resistors and feedback signal should be

routed away from the switching node and the switching

current loop. When possible, ground planes and traces

should be used to help shield the feedback signal and

minimize noise and magnetic interference.







------------------------------------- – V

 I

OUT OUT

 = P



Dis

Efficiency

The difference between the first term – input power,

and the second term – power delivered, is the internal

MCP1640/B/C/D power dissipation. This is an

Via to GND Plane

R_BOTR_TOP

+V

OUT

IN

C_IN

C_OUT

L

MCP1640

1

GND

Via for Enable

FIGURE 5-1:

MCP1640/B/C/D SOT-23-6 Recommended Layout.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 17

MCP1640/B/C/D

Wired on Bottom

Plane

L

+V

IN

+V

OUT

C_IN

C_OUT

GND

MCP1640

R_TOP

1

R_BOT

Enable

GND

FIGURE 5-2:

MCP1640/B/C/D DFN-8 Recommended Layout.

DS20002234D-page 18

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

6.0

TYPICAL APPLICATION CIRCUITS

L₁

4.7 µH

V_OUT

5.0V @ 5 mA

Manganese Lithium

Dioxide Button Cell

SW

V_OUT

V_IN

976 k

+

C_OUT

10 µF

C_IN

4.7 µF

2.0V to 3.2V

V_FB

EN

-

309 k

From PIC^®MCU I/O

GND

Note:

For applications that can operate directly from the battery input voltage during Sleep mode and

require a higher voltage during Normal Run mode, the MCP1640C device provides Input to

Output Bypass when disabled. The PIC^®microcontroller is powered by the output of the

MCP1640C. One of its I/O pins is used to enable and disable the MCP1640C. While operating

in Sleep mode, the MCP1640C input quiescent current is typically less than 1 µA.

FIGURE 6-1:

Manganese Lithium Coin Cell Application Using Bypass Mode.

L₁

10 µH

V_OUT

V_IN

5.0V @ 350 mA

SW

V_OUTS

V_OUTP

3.3V To 4.2V

V_IN

976 k

C_OUT

10 µF

C_IN

10 µF

+

-

V_FB

EN

309 k

P_GND

S_GND

FIGURE 6-2:

USB On-The-Go Powered by Li-Ion.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 19

MCP1640/B/C/D

NOTES:

DS20002234D-page 20

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

7.0

7.1

PACKAGING INFORMATION

Package Marking Information

6-Lead SOT-23

Example

BZ25

Part Number

Code

MCP1640T-I/CHY

MCP1640BT-I/CHY

MCP1640CT-I/CHY

MCP1640DT-I/CHY

BZNN

BWNN

BXNN

BYNN

8-Lead DFN

Example

Part Number

Code

MCP1640-I/MC

AHM

AHP

AHQ

AHR

MCP1640T-I/MC

MCP1640B-I/MC

MCP1640BT-I/MC

MCP1640C-I/MC

MCP1640CT-I/MC

MCP1640D-I/MC

MCP1640DT-I/MC

AHM

340

25

Legend: XX...X Customer-specific information

Y

YY

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

WW

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Pb-free JEDEC^®designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

e

3

*

)

3

e

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 21

MCP1640/B/C/D

6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

4

N

E

E1

PIN 1 ID BY

LASER MARK

1

2

3

e

e1

D

c

A

φ

A2

L

A1

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

N

e

6

0.95 BSC

Outside Lead Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Foot Angle

Lead Thickness

Lead Width

e1

A

A2

A1

E

E1

D

L

1.90 BSC

0.90

0.89

0.00

2.20

1.30

2.70

0.10

0.35

0°

–

1.45

1.30

0.15

3.20

1.80

3.10

0.60

0.80

30°

L1

I

c

b

0.08

0.20

0.26

0.51

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-028B

DS20002234D-page 22

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

6-Lead Plastic Small Outline Transistor (CHY) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2010-2015 Microchip Technology Inc.

DS20002234D-page 23

MCP1640/B/C/D

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DS20002234D-page 24

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2010-2015 Microchip Technology Inc.

DS20002234D-page 25

MCP1640/B/C/D

NOTES:

DS20002234D-page 26

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

APPENDIX A: REVISION HISTORY

Revision D (September 2015)

The following is the list of modifications:

1. Deleted maximum values for NMOS Switch

Leakage and PMOS Switch Leakage parame-

ters in DC Characteristics table.

2. Updated Figure 2-15 in Section 2.0 “Typical

Performance Curves”.

3. Minor typographical corrections.

Revision C (November 2014)

The following is the list of modifications:

1. Updated Features list.

2. Updated values in the DC Characteristics and

Temperature Specifications tables.

3. Updated Figures 2-6 and 2-15.

4. Updated Section 4.2.1 “Low-Voltage Start-

Up”.

5. Updated Section 5.2 “Adjustable Output

Voltage Calculations and Maximum Output

Current”.

6. Updated Section 5.4 “Output Capacitor

Selection”.

7. Updated markings and SOT-23 package specifi-

cation drawings for CHY designator in

Section 7.0 “Packaging Information”.

8. Minor editorial corrections.

Revision B (March 2011)

The following is the list of modifications:

1. Updated Table 5-2.

2. Added the package markings tables in

Section 7.0 “Packaging Information”.

Revision A (February 2010)

Original release of this document.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 27

MCP1640/B/C/D

NOTES:

DS20002234D-page 28

 2010-2015 Microchip Technology Inc.

MCP1640/B/C/D

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

(1)

[X]

PART NO.

Device

X

/XX

a)

MCP1640-I/MC:

0.65V, PWM/PFM

True Disconnect

Sync Reg.,

Tape

and Reel

Temperature

Range

Package

8LD-DFN pkg.

0.65V, PWM/PFM

True Disconnect

Sync Reg.,

8LD-DFN pkg.

Tape and Reel

b)

MCP1640T-I/MC:

MCP1640B-I/MC:

Device

MCP1640:

0.65V, PWM/PFM True Disconnect,

Sync Boost Regulator

MCP1640B: 0.65V, PWM Only True Disconnect,

Sync Boost Regulator

MCP1640C: 0.65V, PWM/PFM Input to Output Bypass,

Sync Boost Regulator

MCP1640D: 0.65V, PWM Only Input to Output Bypass,

Sync Boost Regulator

c)

d)

0.65V, PWM-Only

True Disconnect

Sync Reg.,

8LD-DFN pkg.

Tape and Reel Option

T

blank

= Tape and Reel ⁽¹⁾

= DFN only

MCP1640BT-I/MC: 0.65V, PWM-Only

True Disconnect

Sync Reg.,

8LD-DFN pkg.

Tape and Reel

Temperature Range

Package

I

= -40C to +85C (Industrial)

CHY* =Plastic Small Outline Transistor (SOT-23), 6-lead

MC =Plastic Dual Flat, No Lead (2x3 DFN), 8-lead

e)

f)

MCP1640C-I/MC:

0.65V, PWM/PFM

Input-to-Output Bypass

Sync Reg.,

*Y = Nickel palladium gold manufacturing designator.

8LD-DFN pkg.

MCP1640CT-I/MC: 0.65V, PWM/PFM

Input-to-Output Bypass

Sync Reg.,

8LD-DFN pkg.

Tape and Reel

g)

h)

MCP1640D-I/MC:

0.65V, PWM-Only

Input-to-Output Bypass

Sync Reg.,

8LD-DFN pkg.

MCP1640DT-I/MC: 0.65V, PWM-Only

Input-to-Output Bypass

Sync Reg.,

8LD-DFN pkg.

Tape and Reel

i)

MCP1640T-I/CHY: 0.65V, PWM/PFM

True Disconnect

Sync Reg.,

6LD SOT-23 pkg.

Tape and Reel

j)

MCP1640BT-I/CHY: 0.65V, PWM-Only

True Disconnect

Sync Reg.,

6LD SOT-23 pkg.

Tape and Reel

k)

l)

MCP1640CT-I/CHY: 0.65V, PWM/PFM

Input-to-Output Bypass

Sync Reg.,

6LD SOT-23 pkg.

Tape and Reel

MCP1640DT-I/CHY: 0.65V, PWM-Only

Input-to-Output Bypass

Sync Reg.,

6LD SOT-23 pkg.

Tape and Reel

Note 1:

Tape and Reel identifier only appears in the

catalog part number description. This identi-

fier is used for ordering purposes and is not

printed on the device package. Check with

your Microchip Sales Office for package

availability with the Tape and Reel option.

 2010-2015 Microchip Technology Inc.

DS20002234D-page 29

MCP1640/B/C/D

NOTES:

DS20002234D-page 30

 2010-2015 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,

LANCheck, MediaLB, MOST, MOST logo, MPLAB,

32

OptoLyzer, PIC, PICSTART, PIC logo, RightTouch, SpyNIC,

SST, SST Logo, SuperFlash and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

The Embedded Control Solutions Company and mTouch are

registered trademarks of Microchip Technology Incorporated

in the U.S.A.

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,

CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit

Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,

KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB

Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,

Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,

PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,

Total Endurance, TSHARC, USBCheck, VariSense,

ViewSpan, WiperLock, Wireless DNA, and ZENA are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

Silicon Storage Technology is a registered trademark of

Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology

Germany II GmbH & Co. KG, a subsidiary of Microchip

Technology Inc., in other countries.

All other trademarks mentioned herein are property of their

respective companies.

ISBN: 978-1-63277-829-1

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

== ISO/TS 16949 ==

 2010-2015 Microchip Technology Inc.

DS20002234D-page 31

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://www.microchip.com/

support

Asia Pacific Office

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

Hong Kong

Tel: 852-2943-5100

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Web Address:

www.microchip.com

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

Germany - Dusseldorf

Tel: 49-2129-3766400

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

China - Beijing

Tel: 86-10-8569-7000

Fax: 86-10-8528-2104

Germany - Karlsruhe

Tel: 49-721-625370

India - Pune

Tel: 91-20-3019-1500

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Austin, TX

Tel: 512-257-3370

Japan - Osaka

Tel: 81-6-6152-7160

Fax: 81-6-6152-9310

Boston

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Japan - Tokyo

Tel: 81-3-6880- 3770

Fax: 81-3-6880-3771

China - Dongguan

Tel: 86-769-8702-9880

Italy - Venice

Tel: 39-049-7625286

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

China - Hangzhou

Tel: 86-571-8792-8115

Fax: 86-571-8792-8116

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

Cleveland

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

China - Hong Kong SAR

Tel: 852-2943-5100

Fax: 852-2401-3431

Poland - Warsaw

Tel: 48-22-3325737

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

Sweden - Stockholm

Tel: 46-8-5090-4654

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Detroit

Novi, MI

UK - Wokingham

Tel: 44-118-921-5800

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Tel: 248-848-4000

Fax: 44-118-921-5820

Houston, TX

Tel: 281-894-5983

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Indianapolis

Noblesville, IN

Tel: 317-773-8323

Fax: 317-773-5453

China - Shenzhen

Tel: 86-755-8864-2200

Fax: 86-755-8203-1760

Taiwan - Hsin Chu

Tel: 886-3-5778-366

Fax: 886-3-5770-955

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-213-7828

Taiwan - Taipei

Tel: 886-2-2508-8600

Fax: 886-2-2508-0102

New York, NY

Tel: 631-435-6000

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

San Jose, CA

Tel: 408-735-9110

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Canada - Toronto

Tel: 905-673-0699

Fax: 905-673-6509

07/14/15

DS20002234D-page 32

 2010-2015 Microchip Technology Inc.


型号：	MCP1640-ICHY
厂家：	MICROCHIP
描述：	0.65V Start-Up Synchronous Boost Regulator with True Output Disconnect or Input/Output Bypass Option
文件：	总32页 (文件大小：511K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP1640-ICHY [MICROCHIP]

相关型号：

MCP1640-IMC

MCP1640B

MCP1640B-I/CH

MCP1640B-I/MC

MCP1640B-ICH

MCP1640B-ICHY

MCP1640B-IMC

MCP1640BT

MCP1640BT-I

MCP1640BT-I/CH

MCP1640BT-I/CHY

MCP1640BT-I/MC