MCP1640T-I/MC_技术文档

MCP1640/B/C/D

0.65V Start-up Synchronous Boost Regulator with True

Output Disconnect or Input/Output Bypass Option

Features

General Description

• Up to 96% Typical Efficiency

The MCP1640/B/C/D is a compact, high-efficiency,

fixed frequency, synchronous step-up DC-DC con-

verter. It provides an easy-to-use power supply solution

for applications powered by either one-cell, two-cell, or

three-cell alkaline, NiCd, NiMH, one-cell Li-Ion or

Li-Polymer batteries.

• 800 mA Typical Peak Input Current Limit:

- I_OUT> 100 mA @ 1.2V V_IN, 3.3V V_OUT

- I_OUT> 350 mA @ 2.4V V_IN, 3.3V V_OUT

- I_OUT> 350 mA @ 3.3V V_IN,5.0V V_OUT

• Low Start-up Voltage: 0.65V, typical 3.3V V_OUT

@ 1 mA

Low-voltage technology allows the regulator to start up

without high inrush current or output voltage overshoot

from a low 0.65V input. High efficiency is accomplished

by integrating the low resistance N-Channel Boost

switch and synchronous P-Channel switch. All

compensation and protection circuitry are integrated to

minimize external components. For standby

applications, the MCP1640 operates and consumes

only 19 µA while operating at no load and provides a

true disconnect from input to output while shut down

(EN = GND). Additional device options are available

that operate in PWM only mode and connect input to

output bypass while shut down.

• Low Operating Input Voltage: 0.35V, typical

3.3V_OUT@ 1 mA

• Adjustable Output Voltage Range: 2.0V to 5.5V

• Maximum Input Voltage  V_OUT< 5.5V

• Automatic PFM/PWM Operation (MCP1640/C):

- PFM Operation Disabled (MCP1640B/D)

- PWM Operation: 500 kHz

• Low Device Quiescent Current: 19 µA, typical

PFM Mode

• Internal Synchronous Rectifier

• Internal Compensation

A “true” load disconnect mode provides input to output

isolation while disabled by removing the normal boost

regulator diode path from input to output. A bypass

mode option connects the input to the output using the

integrated low resistance P-Channel MOSFET, which

provides a low bias keep alive voltage for circuits

operating in Deep Sleep mode. Both options consume

less than 1 µA of input current.

• Inrush Current Limiting and Internal Soft-Start

• Selectable, Logic Controlled, Shutdown States:

- True Load Disconnect Option (MCP1640/B)

- Input to Output Bypass Option (MCP1640C/D)

• Shutdown Current (All States): < 1 µA

• Low Noise, Anti-Ringing Control

• Overtemperature Protection

Output voltage is set by a small external resistor

divider. Two package options, SOT23-6 and 2x3

DFN-8, are available.

• Available Packages:

- SOT23-6

- 2x3 8-Lead DFN

Package Types

Applications

MCP1640

6-Lead SOT23

2x3 DFN*

• One, Two and Three Cell Alkaline and NiMH/NiCd

Portable Products

V_IN

V

SW

GND

EN

1

2

8

7

1

6

5

4

• Single Cell Li-Ion to 5V Converters

• Li Coin Cell Powered Devices

• Personal Medical Products

• Wireless Sensors

FB

IN

S

P

EP

9

GND

OUTS

OUTP

V_OUT

V_FB

2

3

4

6

5

GND

EN

SW

• Handheld Instruments

• GPS Receivers

* Includes Exposed Thermal Pad (EP); see Table 3-1.

• Bluetooth Headsets

• +3.3V to +5.0V Distributed Power Supply

 2010 Microchip Technology Inc.

DS22234A-page 1

MCP1640/B/C/D

L₁

4.7 µH

V_OUT

V_IN

3.3V @ 100 mA

SW

V

0.9V To 1.7V

OUT

V

IN

976 K

C_OUT

10 µF

C_IN

4.7 µF

+

V

FB

EN

562 K

GND

-

L₁

4.7 µH

V_OUT

5.0V @ 300 mA

V_IN

SW

V

3.0V To 4.2V

OUTS

V

IN

V

OUTP

976 K

C_OUT

10 µF

C_IN

4.7 µF

+

V

FB

EN

309 K

P

S

-

GND

Efficiency vs. I_OUTfor 3.3V_OUT

100.0

80.0

60.0

40.0

V_IN= 2.5V

V_IN= 0.8V

V_IN= 1.2V

0.1

1.0

10.0

100.0

1000.0

Output Current (mA)

DS22234A-page 2

 2010 Microchip Technology Inc.

MCP1640/B/C/D

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of

the device at those or any other conditions above those

indicated in the operational sections of this

specification is not intended. Exposure to maximum

rating conditions for extended periods may affect

device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

EN, FB, V_IN,V_SW, V_OUT- GND...........................+6.5V

EN, FB ...........<greater of V_OUTor V_IN> (GND - 0.3V)

Output Short Circuit Current....................... Continuous

Output Current Bypass Mode...........................400 mA

Power Dissipation ............................ Internally Limited

Storage Temperature .........................-65^oC to +150^oC

Ambient Temp. with Power Applied......-40^oC to +85^oC

Operating Junction Temperature........-40^oC to +125^oC

ESD Protection On All Pins:

HBM........................................................ 3 kV

MM........................................................300 V

DC CHARACTERISTICS

Electrical Characteristics: Unless otherwise indicated, V = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA,

IN

OUT

IN

OUT

T = +25°C.

A

o

Boldface specifications apply over the T range of -40 C to +85 C.

A

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Characteristics

Minimum Start-Up Voltage

V_IN

—

0.65

0.35

0.8

V

Note 1

Minimum Input Voltage After

Start-Up

—

Output Voltage Adjust Range

Maximum Output Current

V_OUT

I_OUT

2.0

5.5

—

V

V_OUT V_IN; Note 2

1.2V V_IN, 2.0V V_OUT

1.5V V_IN, 3.3V V_OUT

3.3V V_IN, 5.0V V_OUT

—

150

350

1.21

10

mA

V

100

—

Feedback Voltage

V_FB

I_VFB

1.175

—

1.245

—

Feedback Input Bias Current

pA

µA

—

Quiescent Current – PFM

Mode

I_QPFM

—

19

30

Measured at V_OUT= 4.0V;

EN = V_IN, I_OUT= 0 mA;

Note 3

Quiescent Current – PWM

Mode

I_QPWM

—

220

0.7

—

µA

Measured at V_OUT; EN = V_IN

I_OUT= 0 mA; Note 3

Quiescent Current – Shutdown

I_QSHDN

2.3

V_OUT= EN = GND;

Includes N-Channel and

P-Channel Switch Leakage

NMOS Switch Leakage

PMOS Switch Leakage

I_NLK

I_PLK

—

0.3

1

µA

V_IN= V_SW= 5V; V_OUT=

5.5V V_EN= V_FB= GND

0.05

0.2

V_IN= VS_W= GND;

V_OUT= 5.5V

NMOS Switch ON Resistance

PMOS Switch ON Resistance

R_DS(ON)N

R_DS(ON)P

—

0.6

0.9

—



V_IN= 3.3V, I_SW= 100 mA

Note 1: 3.3 K resistive load, 3.3V_OUT(1 mA).

2: For V_IN> V_OUT, V_OUTwill not remain in regulation.

3: _Qis measured from V_OUT; V_INquiescent current will vary with boost ratio. V_INquiescent current can be

estimated by: (I_QPFM* (V_OUT/V_IN)), (I_QPWM* (V_OUT/V_IN)).

I

4: 220 resistive load, 3.3V_OUT(15 mA).

5: Peak current limit determined by characterization, not production tested.

 2010 Microchip Technology Inc.

DS22234A-page 3

MCP1640/B/C/D

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, V = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA,

IN

OUT

IN

OUT

T = +25°C.

A

o

Boldface specifications apply over the T range of -40 C to +85 C.

A

Parameters

Sym

Min

Typ

Max

Units

Conditions

NMOS Peak Switch Current

Limit

I_N(MAX)

600

850

—

mA

Note 5

V

_OUTAccuracy

V_OUT

%

-3

-1

—

+3

1

%

Includes Line and Load

Regulation; V_IN= 1.5V

Line Regulation

Load Regulation

V_OUT

V_OUT) /

V_IN|

/

0.01

%/V

V_IN= 1.5V to 3V

I_OUT= 25 mA

V_OUT

V_OUT

/

-1

0.01

1

%

I_OUT= 25 mA to 100 mA;

V_IN= 1.5V

|

Maximum Duty Cycle

Switching Frequency

EN Input Logic High

EN Input Logic Low

EN Input Leakage Current

Soft-start Time

DC_MAX

f_SW

88

425

90

—

90

500

—

575

—

%

kHz

I_OUT= 1 mA

V_EN= 5V

V_IH

%of V_IN

µA

—

V_IL

20

—

I_ENLK

t_SS

0.005

750

—

µS

EN Low to High, 90% of

V_OUT; Note 4

—

Thermal Shutdown Die

Temperature

T_SD

150

C

Die Temperature Hysteresis

T_SDHYS

10

Note 1: 3.3 K resistive load, 3.3V_OUT(1 mA).

2: For V_IN> V_OUT, V_OUTwill not remain in regulation.

3: I_Qis measured from V_OUT; V_INquiescent current will vary with boost ratio. V_INquiescent current can be

estimated by: (I_QPFM* (V_OUT/V_IN)), (I_QPWM* (V_OUT/V_IN)).

4: 220 resistive load, 3.3V_OUT(15 mA).

5: Peak current limit determined by characterization, not production tested.

TEMPERATURE SPECIFICATIONS

Electrical Specifications:

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction Temperature

Range

T_J

-40

—

+125

°C

Steady State

Storage Temperature Range

T_A

T_J

-65

—

+150

°C

Maximum Junction Temperature

Package Thermal Resistances

Thermal Resistance, 5L-TSOT23

Thermal Resistance, 8L-2x3 DFN

Transient

_JA

—

192

93

—

°C/W EIA/JESD51-3 Standard

°C/W

DS22234A-page 4

 2010 Microchip Technology Inc.

MCP1640/B/C/D

2.0

TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are

not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD

A

V_OUT= 2.0V

27.5

100

90

80

70

60

50

40

30

20

10

V_IN= 1.6V

V_OUT= 5.0V

V_IN= 1.2V

25.0

22.5

20.0

17.5

15.0

12.5

10.0

V_IN= 0.8V

V_OUT= 3.3V

V_IN= 1.2V

PWM / PFM

PWM ONLY

V_OUT= 2.0V

0

0.01

0.1

1

10

100

1000

-40

-25

-10

5

20

35

50

65

80

I_OUT(mA)

Ambient Temperature (°C)

FIGURE 2-1:

V_OUTI_Qvs. Ambient

FIGURE 2-4:

2.0V V_OUTPFM / PWM

Temperature in PFM Mode.

Mode Efficiency vs. I_OUT.

V_OUT= 3.3V

100

90

80

70

60

50

40

30

20

10

0

V_IN= 2.5V

300

V_OUT= 5.0V

V_IN= 1.2V

275

250

225

200

175

150

V_IN= 0.8V

V_IN= 1.2V

V_OUT= 3.3V

PWM / PFM

PWM ONLY

0.01

0.1

1

10

100

1000

-40

-25

-10

5

20

35

50

65

80

I_OUT(mA)

Ambient Temperature (°C)

FIGURE 2-2:

V_OUTI_Qvs. Ambient

FIGURE 2-5:

3.3V V_OUTPFM / PWM

Temperature in PWM Mode.

Mode Efficiency vs. I_OUT

.

600

100

90

80

70

60

50

40

30

20

10

0

V_OUT= 5.0V

V_IN= 2.5V

V_OUT= 5.0V

500

V_OUT= 3.3V

V_IN= 1.8V

V_IN= 1.2V

400

V_OUT= 2.0V

300

200

100

0

PWM / PFM

PWM ONLY

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

0.01

0.1

1

10

100

1000

V_IN(V)

I_OUT(mA)

FIGURE 2-3:

Maximum I_OUTvs. V_IN.

FIGURE 2-6:

5.0V V_OUTPFM / PWM

Mode Efficiency vs. I_OUT

.

 2010 Microchip Technology Inc.

DS22234A-page 5

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD A

3.33

1.00

V_IN= 1.2V

I_OUT= 15 mA

V_OUT= 3.3V

3.325

3.32

0.85

0.70

0.55

0.40

0.25

V_IN= 1.8V

Startup

3.315

3.31

3.305

3.3

Shutdown

V_IN= 0.8V

3.295

3.29

3.285

0

20

40

60

80

100

-40

-25

-10

5

20

35

50

65

80

I_OUT(mA)

Ambient Temperature (°C)

FIGURE 2-7:

3.3V V_OUTvs. Ambient

FIGURE 2-10:

Minimum Start-up and

Temperature.

Shutdown V_INinto Resistive Load vs. I_OUT

.

3.38

3.36

3.34

3.32

3.30

525

520

515

510

505

500

495

490

485

480

V_OUT= 3.3V

V_IN= 1.5V

I_OUT= 5 mA

I_OUT= 15 mA

3.28

3.26

I_OUT= 50 mA

-10

-40

-25

5

20

35

50

65

80

-40

-25

-10

5

20

35

50

65

80

Ambient Temperature (°C)

FIGURE 2-8:

3.3V V_OUTvs. Ambient

FIGURE 2-11:

F

_OSCvs. Ambient

Temperature.

3.40

4.5

4

T_A= 85°C

I_OUT= 5 mA

V_OUT= 5.0V

3.36

3.5

3

V_OUT= 3.3V

T_A= 25°C

3.32

3.28

3.24

3.20

2.5

2

V_OUT= 2.0V

T_A= - 40°C

1.5

1

0.5

0

0.8

1.2

1.6

2

2.4

2.8

0

1

2

3

4

5

6

7

8

9

10

V_IN(V)

I_OUT(mA)

FIGURE 2-9:

3.3V V_OUTvs. V_IN.

FIGURE 2-12:

Threshold vs. I_OUT

PWM Pulse Skipping Mode

.

DS22234A-page 6

 2010 Microchip Technology Inc.

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD A

10000

PWM / PFM

PWM ONLY

V_OUT= 5.0V

1000

100

10

V_OUT= 3.3V

V_OUT= 2.0V

V_OUT= 3.3V

V_OUT= 5.0V

V_OUT= 2.0V

0.8 1.1 1.4 1.7

2

2.3 2.6 2.9 3.2 3.5

V_IN(V)

FIGURE 2-13:

Input No Load Current vs.

FIGURE 2-16:

MCP1640 3.3V V_OUTPFM

V_IN.

Mode Waveforms.

5

4

P - Channel

3

2

1

0

N - Channel

1.5

1

2

2.5

3

3.5

4

4.5

5

> V_INor V_OUT

FIGURE 2-14:

N-Channel and P-Channel

FIGURE 2-17:

MCP1640B 3.3V V_OUT

R

_DSONvs. > of V_INor V_OUT

.

PWM Mode Waveforms.

16

14

12

10

8

V_OUT= 5.0V

V_OUT= 3.3V

V_OUT= 2.0V

6

4

2

0

0.5

1

1.5

2

2.5

3

3.5

4

V_IN(V)

FIGURE 2-15:

PFM / PWM Threshold

FIGURE 2-18:

MCP1640/B High Load

Current vs. V_IN.

Waveforms.

 2010 Microchip Technology Inc.

DS22234A-page 7

MCP1640/B/C/D

Note: Unless otherwise indicated, V = EN = 1.2V, C

= C = 10 µF, L = 4.7 µH, V

= 3.3V, I

= 15 mA, T = +25°C.

IN

OUT

IN

OUT

LOAD A

FIGURE 2-19:

3.3V Start-up After Enable.

FIGURE 2-22:

MCP1640B 3.3V V_OUTLoad

Transient Waveforms.

FIGURE 2-20:

V_ENABLE

3.3V Start-up when V_IN=

FIGURE 2-23:

Transient Waveforms.

MCP1640B 2.0V V_OUTLoad

.

FIGURE 2-21:

MCP1640 3.3V V_OUTLoad

FIGURE 2-24:

3.3V V_OUTLine Transient

Transient Waveforms.

Waveforms.

DS22234A-page 8

 2010 Microchip Technology Inc.

MCP1640/B/C/D

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

MCP1640/B/C/D MCP1640/B/C/D

Pin No.

Description

SOT23

2x3 DFN

SW

1

2

3

4

5

6

5

Switch Node, Boost Inductor Input Pin

GND

EN

Ground Pin

4

1

Enable Control Input Pin

Feedback Voltage Pin

Output Voltage Pin

FB

V_OUT

V_IN

8

2

3

7

6

9

Input Voltage Pin

S_GND

P_GND

V_OUTS

V_OUTP

EP

Signal Ground Pin

Power Ground Pin

Output Voltage Sense Pin

Output Voltage Power Pin

Exposed Thermal Pad (EP); must be connected to V_SS.

—

3.1

Switch Node Pin (SW)

3.6

Power Supply Input Voltage Pin

(V )

IN

Connect the inductor from the input voltage to the SW

pin. The SW pin carries inductor current and can be as

high as 800 mA peak. The integrated N-Channel switch

drain and integrated P-Channel switch source are inter-

nally connected at the SW node.

Connect the input voltage source to V_IN. The input

source should be decoupled to GND with a 4.7 µF

minimum capacitor.

3.7

Signal Ground Pin (S

)

GND

The signal ground pin is used as a return for the

integrated V_REFand error amplifier. In the 2x3 DFN

package, the S_GNDand power ground (P_GND) pins are

connected externally.

3.2

Ground Pin (GND)

The ground or return pin is used for circuit ground con-

nection. Length of trace from input cap return, output

cap return and GND pin should be made as short as

possible to minimize noise on the GND pin. In the

SOT23-6 package, a single ground pin is used.

3.8

Power Ground Pin (P

)

GND

The power ground pin is used as a return for the high-

current N-Channel switch. In the 2x3 DFN package, the

P_GNDand signal ground (S_GND) pins are connected

externally.

3.3

Enable Pin (EN)

The EN pin is a logic-level input used to enable or

disable device switching and lower quiescent current

while disabled. A logic high (>90% of V_IN) will enable

the regulator output. A logic low (<20% of V_IN) will

ensure that the regulator is disabled.

3.9

Output Voltage Sense Pin (V

)

OUTS

The output voltage sense pin connects the regulated

output voltage to the internal bias circuits. In the 2x3

DFN package, V_OUTSand V_OUTPare connected

externally.

3.4

Feedback Voltage Pin (FB)

3.10 Output Voltage Power Pin (V

)

OUTP

The FB pin is used to provide output voltage regulation

by using a resistor divider. The FB voltage will be 1.21V

typical with the output voltage in regulation.

The output voltage power pin connects the output volt-

age to the switch node. High current flows through the

integrated P-Channel and out of this pin to the output

capacitor and output. In the 2x3 DFN package, V_OUTS

and V_OUTPare connected externally.

3.5

Output Voltage Pin (V

)

OUT

The output voltage pin connects the integrated

P-Channel MOSFET to the output capacitor. The FB

voltage divider is also connected to the V_OUTpin for

voltage regulation.

3.11 Exposed Thermal Pad (EP)

There is no internal electrical connection between the

Exposed Thermal Pad (EP) and the P_GNDand S_GND

pins. They must be connected to the same potential on

the Printed Circuit Board (PCB).

 2010 Microchip Technology Inc.

DS22234A-page 9

MCP1640/B/C/D

NOTES:

DS22234A-page 10

 2010 Microchip Technology Inc.

MCP1640/B/C/D

4.1.3

TRUE OUTPUT DISCONNECT

OPTION

4.0

4.1

DETAILED DESCRIPTION

Device Option Overview

The MCP1640/B devices incorporate a true output

disconnect feature. With the EN pin pulled low, the

output of the MCP1640/B is isolated or disconnected

from the input by turning off the integrated P-Channel

switch and removing the switch bulk diode connection.

This removes the DC path typical in boost converters,

which allows the output to be disconnected from the

input. During this mode, less than 1 µA of current is

consumed from the input (battery). True output discon-

nect does not discharge the output; the output voltage

is held up by the external C_OUTcapacitance.

The MCP1640/B/C/D family of devices is capable of

low start-up voltage and delivers high efficiency over a

wide load range for single cell, two cell, three cell

alkaline, NiMH, NiCd and single cell Li-Ion battery

inputs. A high level of integration lowers total system

cost, eases implementation and reduces board area.

The devices feature low start-up voltage, adjustable

output voltage, PWM/PFM mode operation, low I_Q,

integrated synchronous switch, internal compensation,

low noise anti-ring control, inrush current limit and soft

start. There are two feature options for the MCP1640/

B/C/D family: PWM/PFM mode or PWM mode only,

and “true output disconnect” or input bypass.

4.1.4

INPUT BYPASS OPTION

The MCP1640C/D devices incorporate the input

bypass shutdown option. With the EN input pulled low,

the output is connected to the input using the internal

P-Channel MOSFET. In this mode, the current draw

from the input (battery) is less than 1 µA with no load.

The Input Bypass mode is used when the input voltage

range is high enough for the load to operate in Sleep or

low I_Qmode. When a higher regulated output voltage is

necessary to operate the application, the EN input is

pulled high enabling the boost converter.

4.1.1

PWM/PFM MODE OPTION

The MCP1640/C devices use an automatic switchover

from PWM to PFM mode for light load conditions to

maximize efficiency over a wide range of output

current. During PFM mode, higher peak current is used

to pump the output up to the threshold limit. While

operating in PFM or PWM mode, the P-Channel switch

is used as a synchronous rectifier, turning off when the

inductor current reaches 0 mA to maximize efficiency.

In PFM mode, a comparator is used to terminate

switching when the output voltage reaches the upper

threshold limit. Once switching has terminated, the

output voltage will decay or coast down. During this

period, very low I_Qis consumed from the device and

input source, which keeps power efficiency high at light

load. The disadvantages of PWM/PFM mode are

higher output ripple voltage and variable PFM mode

frequency. The PFM mode frequency is a function of

input voltage, output voltage and load. While in PFM

mode, the boost converter pumps the output up at a

switching frequency of 500 kHz.

TABLE 4-1:

PART NUMBER SELECTION

Part

Number

PWM/

PFM

PWM True Dis Bypass

MCP1640

X

MCP1640B

MCP1640C

MCP1640D

X

4.1.2

PWM MODE ONLY OPTION

The MCP1640B/D devices disable PFM mode

switching, and operate only in PWM mode over the

entire load range. During periods of light load opera-

tion, the MCP1640B/D continues to operate at a con-

stant 500 kHz switching frequency keeping the output

ripple voltage lower than PFM mode. During PWM only

mode, the MCP1640B/D P-Channel switch acts as a

synchronous rectifier by turning off to prevent reverse

current flow from the output cap back to the input in

order to keep efficiency high. For noise immunity, the

N-Channel MOSFET current sense is blanked for

approximately 100 ns. With a typical minimum duty

cycle of 100 ns, the MCP1640B/D continues to switch

at a constant frequency under light load conditions.

Figure 2-12 represents the input voltage versus load

current for the pulse skipping threshold in PWM only

mode. At lighter loads, the MCP1640B/D devices begin

to skip pulses.

 2010 Microchip Technology Inc.

DS22234A-page 11

MCP1640/B/C/D

Figure 4-1 depicts the functional block diagram of the

MCP1640/B/C/D.

4.2

Functional Description

The MCP1640/B/C/D is a compact, high-efficiency,

fixed frequency, step-up DC-DC converter that

provides an easy-to-use power supply solution for

applications powered by either one-cell, two-cell, or

three-cell alkaline, NiCd, or NiMH, or one-cell Li-Ion or

Li-Polymer batteries.

V

OUT

INTERNAL

BIAS

V

IN

I

ZERO

DIRECTION

CONTROL

SW

EN

SOFT-START

.3V

0V

GATE DRIVE

AND

SHUTDOWN

CONTROL

LOGIC

I

LIMIT

SENSE

SLOPE

COMP.

GND

OSCILLATOR



PWM/PFM

LOGIC

1.21V

FB

EA

FIGURE 4-1:

MCP1640/B/C/D Block Diagram.

50% of its nominal value. Once the output voltage

reaches 1.6V, normal closed-loop PWM operation is

initiated.

The MCP1640/B/C/D charges an internal capacitor

with a very weak current source. The voltage on this

capacitor, in turn, slowly ramps the current limit of the

boost switch to its nominal value. The soft-start

capacitor is completely discharged in the event of a

commanded shutdown or a thermal shutdown.

4.2.1

LOW-VOLTAGE START-UP

The MCP1640/B/C/D is capable of starting from a low

input voltage. Start-up voltage is typically 0.65V for a

3.3V output and 1 mA resistive load.

When enabled, the internal start-up logic turns the

rectifying P-Channel switch on until the output

capacitor is charged to a value close to the input

voltage. The rectifying switch is current limited during

this time. After charging the output capacitor to the

input voltage, the device starts switching. If the input

voltage is below 1.6V, the device runs open-loop with a

fixed duty cycle of 70% until the output reaches 1.6V.

During this time, the boost switch current is limited to

There is no undervoltage lockout feature for the

MCP1640/B/C/D. The device will start up at the lowest

possible voltage and run down to the lowest possible

voltage. For typical battery applications, this may result

in “motor-boating” for deeply discharged batteries.

DS22234A-page 12

 2010 Microchip Technology Inc.

MCP1640/B/C/D

4.2.2

PWM MODE OPERATION

4.2.6

INTERNAL BIAS

In normal PWM operation, the MCP1640/B/C/D

operates as a fixed frequency, synchronous boost

converter. The switching frequency is internally

maintained with a precision oscillator typically set to

500 kHz. The MCP1640B/D devices will operate in

PWM only mode even during periods of light load

operation. By operating in PWM only mode, the output

ripple remains low and the frequency is constant.

Operating in fixed PWM mode results in lower

efficiency during light load operation (when compared

to PFM mode (MCP1640/C)).

The MCP1640/B/C/D gets its start-up bias from V_IN.

Once the output exceeds the input, bias comes from

the output. Therefore, once started, operation is

completely independent of V_IN. Operation is only

limited by the output power level and the input source

series resistance. Once started, the output will remain

in regulation down to 0.35V typical with 1 mA output

current for low source impedance inputs.

4.2.7

INTERNAL COMPENSATION

The error amplifier, with its associated compensation

network, completes the closed loop system by

comparing the output voltage to a reference at the

input of the error amplifier, and feeding the amplified

and inverted signal to the control input of the inner

current loop. The compensation network provides

phase leads and lags at appropriate frequencies to

cancel excessive phase lags and leads of the power

circuit. All necessary compensation components and

slope compensation are integrated.

Lossless current sensing converts the peak current sig-

nal to a voltage to sum with the internal slope compen-

sation. This summed signal is compared to the voltage

error amplifier output to provide a peak current control

command for the PWM signal. The slope

compensation is adaptive to the input and output

voltage. Therefore, the converter provides the proper

amount of slope compensation to ensure stability, but is

not excessive, which causes a loss of phase margin.

The peak current limit is set to 800 mA typical.

4.2.8

SHORT CIRCUIT PROTECTION

4.2.3

PFM MODE OPERATION

Unlike most boost converters, the MCP1640/B/C/D

allows its output to be shorted during normal operation.

The internal current limit and overtemperature

protection limit excessive stress and protect the device

during periods of short circuit, overcurrent and over-

temperature. While operating in Bypass mode, the

P-Channel current limit is inhibited to minimize

quiescent current.

The MCP1640/C devices are capable of operating in

normal PWM mode and PFM mode to maintain high

efficiency at all loads. In PFM mode, the output ripple

has a variable frequency component that changes with

the input voltage and output current. With no load, the

quiescent current draw from the output is typically

19 µA. The PFM mode can be disabled in selected

device options.

4.2.9

LOW NOISE OPERATION

PFM operation is initiated if the output load current falls

below an internally programmed threshold. The output

voltage is continuously monitored. When the output

voltage drops below its nominal value, PFM operation

pulses one or several times to bring the output back

into regulation. If the output load current rises above

the upper threshold, the MCP1640/C transitions

smoothly into PWM mode.

The MCP1640/B/C/D integrates a low noise anti-ring

switch that damps the oscillations typically observed at

the switch node of a boost converter when operating in

the discontinuous inductor current mode. This removes

the high frequency radiated noise.

4.2.10

OVERTEMPERATURE

PROTECTION

4.2.4

ADJUSTABLE OUTPUT VOLTAGE

Overtemperature protection circuitry is integrated in the

MCP1640/B/C/D. This circuitry monitors the device

junction temperature and shuts the device off if the

junction temperature exceeds the typical +150^oC

threshold. If this threshold is exceeded, the device will

automatically restart once the junction temperature

drops by 10^oC. The soft start is reset during an

overtemperature condition.

The MCP1640/B/C/D output voltage is adjustable with

a resistor divider over a 2.0V minimum to 5.5V

maximum range. High value resistors are

recommended to minimize quiescent current to keep

efficiency high at light loads.

4.2.5

ENABLE

The enable pin is used to turn the boost converter on

and off. The enable threshold voltage varies with input

voltage. To enable the boost converter, the EN voltage

level must be greater than 90% of the V_INvoltage. To

disable the boost converter, the EN voltage must be

less than 20% of the V_INvoltage.

 2010 Microchip Technology Inc.

DS22234A-page 13

MCP1640/B/C/D

NOTES:

DS22234A-page 14

 2010 Microchip Technology Inc.

MCP1640/B/C/D

5.3

Input Capacitor Selection

5.0

5.1

APPLICATION INFORMATION

Typical Applications

The boost input current is smoothed by the boost

inductor reducing the amount of filtering necessary at

the input. Some capacitance is recommended to

provide decoupling from the source. Low ESR X5R or

X7R are well suited since they have a low temperature

coefficient and small size. For most applications,

4.7 µF of capacitance is sufficient at the input. For high

power applications that have high source impedance or

long leads, connecting the battery to the input 10 µF of

capacitance is recommended. Additional input

capacitance can be added to provide a stable input

voltage.

The MCP1640/B/C/D synchronous boost regulator

operates over a wide input voltage and output voltage

range. The power efficiency is high for several decades

of load range. Output current capability increases with

input voltage and decreases with increasing output

voltage. The maximum output current is based on the

N-Channel peak current limit. Typical characterization

curves in this data sheet are presented to display the

typical output current capability.

Table 5-1 contains the recommended range for the

input capacitor value.

5.2

Adjustable Output Voltage

Calculations

To calculate the resistor divider values for the

MCP1640/B/C/D, the following equation can be used.

Where R_TOPis connected to V_OUT, R_BOTis connected

to GND and both are connected to the FB input pin.

5.4

Output Capacitor Selection

The output capacitor helps provide a stable output

voltage during sudden load transients and reduces the

output voltage ripple. As with the input capacitor, X5R

and X7R ceramic capacitors are well suited for this

application.

EQUATION 5-1:

V_OUT

The MCP1640/B/C/D is internally compensated so

output capacitance range is limited. See Table 5-1 for

the recommended output capacitor range.







– 1

------------

R_TOP= R_BOT





V_FB

While the N-Channel switch is on, the output current is

supplied by the output capacitor C_OUT. The amount of

output capacitance and equivalent series resistance

will have a significant effect on the output ripple

voltage. While C_OUTprovides load current, a voltage

drop also appears across its internal ESR that results

in ripple voltage.

Example A:

V_OUT= 3.3V

V_FB= 1.21V

R_BOT= 309 k

R_TOP= 533.7 k (Standard Value = 536 k)

Example B:

EQUATION 5-2:

V_OUT= 5.0V

V_FB= 1.21V

dV

dt







I_OUT= C_OUT ------

R_BOT= 309 k



R_TOP= 967.9 k (Standard Value = 976 k)

Where dV represents the ripple voltage and dt

represents the ON time of the N-Channel switch (D * 1/

F_SW).

There are some potential issues with higher value

resistors. For small surface mount resistors,

environment contamination can create leakage paths

that significantly change the resistor divider that effect

the output voltage. The FB input leakage current can

also impact the divider and change the output voltage

tolerance.

Table 5-1 contains the recommended range for the

input and output capacitor value.

TABLE 5-1:

CAPACITOR VALUE RANGE

C_IN

C_OUT

Min

4.7 µF

none

10 µF

Max

100 µF

 2010 Microchip Technology Inc.

DS22234A-page 15

MCP1640/B/C/D

Peak current is the maximum or limit, and saturation

current typically specifies a point at which the induc-

tance has rolled off a percentage of the rated value.

This can range from a 20% to 40% reduction in induc-

tance. As inductance rolls off, the inductor ripple cur-

rent increases as does the peak switch current. It is

important to keep the inductance from rolling off too

much, causing switch current to reach the peak limit.

5.5

Inductor Selection

The MCP1640/B/C/D is designed to be used with small

surface mount inductors; the inductance value can

range from 2.2 µH to 10 µH. An inductance value of

4.7 µH is recommended to achieve a good balance

between inductor size, converter load transient

response and minimized noise.

TABLE 5-2:

MCP1640/B/C/D

RECOMMENDED INDUCTORS

5.6

Thermal Calculations

The MCP1640/B/C/D is available in two different

packages (SOT23-6 and 2x3 DFN8). By calculating the

power dissipation and applying the package thermal

resistance, (_JA), the junction temperature is esti-

mated. The maximum continuous junction temperature

rating for the MCP1640/B/C/D is +125^oC.

Part

Number

Value

DCR

I_SAT

Size

(µH)  (typ) (A) WxLxH (mm)

Coiltronics^®

SD3110

SD3112

SD3114

SD3118

SD3812

SD25

4.7

0.285 0.68

0.246 0.80

0.251 1.14

0.162 1.31

0.256 1.13

0.0467 1.83

3.1x3.1x1.0

3.1x3.1x1.2

3.1x3.1x1.4

3.8x3.8x1.2

5.0x5.0x2.5

To quickly estimate the internal power dissipation for

the switching boost regulator, an empirical calculation

using measured efficiency can be used. Given the

measured efficiency, the internal power dissipation is

estimated by Equation 5-3.

DCR

I_SAT



(max)

Part

Number

Value

(µH)

Size

EQUATION 5-3:

(A) WxLxH (mm)

Wurth Elektronik^®

V_OUT I_OUT







------------------------------ – V_OUT I_OUT = P_Dis

WE-TPC

Type TH

4.7

0.200

0.8

2.8x2.8x1.35



Efficiency

WE-TPC

Type S

0.105 0.90 3.8x3.8x1.65

The difference between the first term, input power, and

the second term, power delivered, is the internal

MCP1640/B/C/D power dissipation. This is an estimate

assuming that most of the power lost is internal to the

MCP1640/B/C/D and not C_IN, C_OUTand the inductor.

There is some percentage of power lost in the boost

inductor, with very little loss in the input and output

capacitors. For a more accurate estimation of internal

power dissipation, subtract the I_INRMS²*L_ESRpower

dissipation.

WE-TPC

Type M

0.082 1.65

0.046 2.00

4.8x4.8x1.8

6.8x6.8x2.3

WE-TPC

Type X

DCR

I_SAT



(max)

Part

Number

Value

(µH)

Size

(A) WxLxH (mm)

Sumida^®

CMH23

4.7

0.537 0.70

0.216 0.75

2.3x2.3x1.0

3.5x4.3x0.8

5.7

PCB Layout Information

CMD4D06

CDRH4D

EPCOS^®

0.09 0.800 4.6x4.6x1.5

Good printed circuit board layout techniques are

important to any switching circuitry and switching

power supplies are no different. When wiring the

switching high current paths, short and wide traces

should be used. Therefore it is important that the input

and output capacitors be placed as close as possible to

the MCP1640/B/C/D to minimize the loop area.

B82462A2

472M000

4.7

0.084 2.00

0.04 1.8

6.0x6.0x2.5

6.3x6.3x3.0

B82462G4

472M

Several parameters are used to select the correct

inductor: maximum rated current, saturation current

and copper resistance (ESR). For boost converters, the

inductor current can be much higher than the output

current. The lower the inductor ESR, the higher the

efficiency of the converter, a common trade-off in size

versus efficiency.

The feedback resistors and feedback signal should be

routed away from the switching node and the switching

current loop. When possible, ground planes and traces

should be used to help shield the feedback signal and

minimize noise and magnetic interference.

DS22234A-page 16

 2010 Microchip Technology Inc.

MCP1640/B/C/D

Via to GND Plane

R_BOTR_TOP

+V

OUT

IN

C_IN

C_OUT

L

MCP1640

1

GND

Via for Enable

FIGURE 5-1:

MCP1640/B/C/D SOT23-6 Recommended Layout.

Wired on Bottom

Plane

L

+V

IN

+V

OUT

C_IN

C_OUT

GND

MCP1640

R_TOP

1

R_BOT

Enable

GND

FIGURE 5-2:

MCP1640/B/C/D DFN-8 Recommended Layout.

 2010 Microchip Technology Inc.

DS22234A-page 17

MCP1640/B/C/D

NOTES:

DS22234A-page 18

 2010 Microchip Technology Inc.

MCP1640/B/C/D

6.0

TYPICAL APPLICATION CIRCUITS

L₁

4.7 µH

V_OUT

MANGANESE LITHIUM

DIOXIDE BUTTON CELL

5.0V @ 5 mA

SW

V

OUT

V

IN

976 K

+

C_OUT

10 µF

C_IN

2.0V TO 3.2V

V

4.7 µF

FB

EN

-

309 K

®

GND

FROM PIC MCU I/O

Note:

For applications that can operate directly from the battery input voltage during Sleep mode and

require a higher voltage during normal run mode, the MCP1640C device provides input to output

bypass when disabled. The PIC Microcontroller is powered by the output of the MCP1640C. One

of its I/O pins is used to enable and disable the MCP1640C to control its bias voltage. While

operating in Sleep mode, the MCP1640C input quiescent current is typically less than 1 uA.

FIGURE 6-1:

Manganese Lithium Coin Cell Application using Bypass Mode.

L₁

10 µH

V_OUT

V_IN

5.0V @ 350 mA

SW

V

3.3V To 4.2V

OUTS

V

IN

V

OUTP

976 K

C_OUT

10 µF

C_IN

10 µF

+

V

FB

EN

309 K

P

S

-

GND

FIGURE 6-2:

USB On-The-Go Powered by Li-Ion.

 2010 Microchip Technology Inc.

DS22234A-page 19

MCP1640/B/C/D

NOTES:

DS22234A-page 20

 2010 Microchip Technology Inc.

MCP1640/B/C/D

7.0

7.1

PACKAGING INFORMATION

Package Marking Information (Not to Scale)

6-Lead SOT-23

Example

XXNN

BZNN

8-Lead DFN

Example

XXX

YWW

NN

AHM

945

25

Legend: XX...X Customer-specific information

Y

YY

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

WW

NNN

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

*

)

3

e

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2010 Microchip Technology Inc.

DS22234A-page 21

MCP1640/B/C/D

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DS22234A-page 22

 2010 Microchip Technology Inc.

MCP1640/B/C/D

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2010 Microchip Technology Inc.

DS22234A-page 23

MCP1640/B/C/D

!ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ"ꢐꢄꢈꢆ#ꢈꢄꢊ$ꢆꢝꢔꢆꢂꢃꢄꢅꢆꢇꢄꢌ%ꢄ&ꢃꢆꢕ'ꢖꢘꢆMꢆꢚ)ꢛ)*+,ꢆꢎꢎꢆ-ꢔꢅ.ꢆꢙ"#ꢝꢜ

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DS22234A-page 24

 2010 Microchip Technology Inc.

MCP1640/B/C/D

!ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆ"ꢐꢄꢈꢆ#ꢈꢄꢊ$ꢆꢝꢔꢆꢂꢃꢄꢅꢆꢇꢄꢌ%ꢄ&ꢃꢆꢕ'ꢖꢘꢆMꢆꢚ)ꢛ)*+,ꢆꢎꢎꢆ-ꢔꢅ.ꢆꢙ"#ꢝꢜ

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ꢋ$$ꢍ,33...ꢁ ꢃꢉꢌꢆꢉꢋꢃꢍꢁꢉꢆ 3ꢍꢈꢉ0ꢈꢒꢃꢅꢒ

 2010 Microchip Technology Inc.

DS22234A-page 25

MCP1640/B/C/D

NOTES:

DS22234A-page 26

 2010 Microchip Technology Inc.

MCP1640/B/C/D

APPENDIX A: REVISION HISTORY

Revision A (February 2010)

• Original Release of this Document.

 2010 Microchip Technology Inc.

DS22234A-page 27

MCP1640/B/C/D

NOTES:

DS22234A-page 28

 2010 Microchip Technology Inc.

MCP1640/B/C/D

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

X

PART NO.

Device

X

/XX

Examples:

Tape

and Reel

Temperature

Range

Package

a)

MCP1640-I/MC:

0.65V, Sync Reg.,

8LD-DFN pkg.

b)

MCP1640T-I/MC:

Tape and Reel,

0.65V, Sync Reg.,

8LD-DFN pkg.

Device

MCP1640:

0.65V, PWM/PFM True Disconnect,

Sync Boost Regulator

MCP1640T: 0.65V, PWM/PFM True Disconnect,

Sync Boost Regulator (Tape and Reel)

MCP1640B: 0.65V, PWM Only True Disconnect,

Sync Boost Regulator

MCP1640BT: 0.65V, PWM Only True Disconnect,

Sync Boost Regulator (Tape and Reel)

c)

d)

MCP1640B-I/MC:

0.65V, Sync Reg.,

8LD-DFN pkg.

MCP1640BT-I/MC: Tape and Reel,

0.65V, Sync Reg.,

8LD-DFN pkg.

MCP1640C: 0.65V, PWM/PFM Input to Output Bypass,

Sync Boost Regulator

MCP1640CT: 0.65V, PWM/PFM Input to Output Bypass,

Sync Boost Regulator (Tape and Reel)

MCP1640D: 0.65V, PWM Only Input to Output Bypass,

Sync Boost Regulator

MCP1640DT: 0.65V, PWM Only Input to Output Bypass,

Sync Boost Regulator (Tape and Reel)

e)

f)

MCP1640C-I/MC:

0.65V, Sync Reg.,

8LD-DFN pkg.

MCP1640CT-I/MC: Tape and Reel,

0.65V, Sync Reg.,

8LD-DFN pkg.

g)

h)

MCP1640D-I/MC::

0.65V, Sync Reg.,

8LD-DFN pkg.

MCP1640DT-I/MC:: Tape and Reel,

0.65V, Sync Reg.,

Temperature Range

Package

I

= -40C to +85C (Industrial)

8LD-DFN pkg.

CH

MC

=

Plastic Small Outline Transistor (SOT-23), 6-lead

Plastic Dual Flat, No Lead (2x3 DFN), 8-lead

i)

MCP1640T-I/CHY: Tape and Reel,

0.65V, Sync Reg.,

6LD SOT-23 pkg.

j)

MCP1640BT-I/CHY: Tape and Reel,

0.65V, Sync Reg.,

6LD SOT-23 pkg.

k)

l)

MCP1640CT-I/CHY: Tape and Reel,

0.65V, Sync Reg.,

6LD SOT-23 pkg.

MCP1640DT-I/CHY: Tape and Reel,

0.65V, Sync Reg.,

6LD SOT-23 pkg.

 2010 Microchip Technology Inc.

DS22234A-page 29

MCP1640/B/C/D

NOTES:

DS22234A-page 30

 2010 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

rfPIC and UNI/O are registered trademarks of Microchip

Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified

logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

32

PICtail, PIC logo, REAL ICE, rfLAB, Select Mode, Total

Endurance, TSHARC, UniWinDriver, WiperLock and ZENA

are trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-60932-019-5

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

 2010 Microchip Technology Inc.

DS22234A-page 31

WORLDWIDE SALES AND SERVICE

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Cleveland

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-6578-300

Fax: 886-3-6578-370

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

01/05/10

DS22234A-page 32

 2010 Microchip Technology Inc.


型号：	MCP1640T-I/MC
厂家：	MICROCHIP
描述：	0.65V Start-up Synchronous Boost Regulator with True Output Disconnect or Input/Output Bypass Option 0.65V启动同步升压稳压器具有真正输出断接和输入/输出旁路选项稳压器开关式稳压器或控制器电源电路开关式控制器光电二极管 PC
文件：	总32页 (文件大小：474K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP1640T-I/MC [MICROCHIP]

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MCP16411-I/MN

MCP16411-I/UN

MCP16411T-I/MN

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