MCP1703-3002E/DB [MICROCHIP]
250 mA, 16V, Low Quiescent Current; 250毫安， 16V ，低静态电流
| 型号： | MCP1703-3002E/DB |
| 厂家： | 
MICROCHIP |
| 描述： | 250 mA, 16V, Low Quiescent Current |
| 文件： | 总24页 (文件大小：381K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP1703
250 mA, 16V, Low Quiescent Current
Features
Description
• 2.0 µA Typical Quiescent Current
The MCP1703 is a family of CMOS low dropout (LDO)
voltage regulators that can deliver up to 250 mA of
current while consuming only 2.0 µA of quiescent
current (typical). The input operating range is specified
from 2.7V to 16.0V, making it an ideal choice for two to
six primary cell battery-powered applications, 9V alka-
line and one or two cell Li-Ion-powered applications.
• Input Operating Voltage Range: 2.7V to16.0V
• 250 mA Output Current for Output Voltages ≥ 2.5V
• 200 mA Output Current for Output Voltages < 2.5V
• Low Drop Out Voltage, 625 mV typical @ 250 mA
for VR = 2.8V
• 0.4% Typical Output Voltage Tolerance
The MCP1703 is capable of delivering 250 mA with
only 625 mV (typical) of input to output voltage differen-
tial (VOUT = 2.8V). The output voltage tolerance of the
MCP1703 is typically ±0.4% at +25°C and ±3%
maximum over the operating junction temperature
range of -40°C to +125°C. Line regulation is ±0.1%
typical at +25°C.
• Standard Output Voltage Options (1.2V, 1.5V,
1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V)
• Output voltage range 1.2V to 5.5V in 0.1V
increments (50 mV increments available upon
request)
• Stable with 1.0 µF to 22 µF output capacitance
• Short-Circuit Protection
Output voltages available for the MCP1703 range from
1.2V to 5.5V. The LDO output is stable when using only
1 µF of output capacitance. Ceramic, tantalum or
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit and overtemperature
shutdown provide a robust solution for any application.
• Overtemperature Protection
Applications
• Battery-powered Devices
• Battery-powered Alarm Circuits
• Smoke Detectors
Package options include the SOT-223-3, SOT-23A,
and SOT-89-3.
• CO2 Detectors
Related Literature
• Pagers and Cellular Phones
• Smart Battery Packs
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• Low Quiescent Current Voltage Reference
• PDAs
• AN766, “Pin-Compatible CMOS Upgrades to
BiPolar LDOs”, DS00766,
• Digital Cameras
Microchip Technology Inc., 2002
• Microcontroller Power
• Solar-Powered Instruments
• Consumer Products
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792, Microchip Technology Inc., 2001
• Battery Powered Data Loggers
Package Types
SOT-223-3
3-Pin SOT-23A
3-Pin SOT-89
VIN
VIN
4
3
2
GND VIN VOUT
1
3
1
2
3
1
2
VIN
GND VOUT
GND VOUT
© 2007 Microchip Technology Inc.
DS22049A-page 1
MCP1703
Functional Block Diagrams
MCP1703
VOUT
VIN
Error Amplifier
+VIN
Voltage
Reference
-
+
Overcurrent
Overtemperature
GND
Typical Application Circuits
MCP1703
VOUT
3.3V
VOUT
IOUT
COUT
1 µF Ceramic
50 mA
V
IN
VIN
VIN
+
9V
Battery
CIN
1 µF Ceramic
GND
DS22049A-page 2
© 2007 Microchip Technology Inc.
MCP1703
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD..................................................................................+18V
All inputs and outputs w.r.t. .............(VSS-0.3V) to (VIN+0.3V)
Peak Output Current...................................................500 mA
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature.................................+150°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM;MM)............... ≥ 4 kV; ≥ 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
LOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.
I
Parameters
Symbol
Min
Typ
Max
Units
Conditions
Input / Output Characteristics
Input Operating Voltage
VIN
Iq
2.7
—
—
16.0
5
V
Note 1
Input Quiescent Current
Maximum Output Current
2.0
—
µA
IL = 0 mA
IOUT_mA
250
50
—
—
—
—
—
—
mA
mA
mA
mA
mA
mA
For VR ≥ 2.5V
100
130
200
250
400
For VR < 2.5V, VIN ≥ 2.7V
For VR < 2.5V, VIN ≥ 2.95V
For VR < 2.5V, VIN ≥ 3.2V
For VR < 2.5V, VIN ≥ 3.45V
100
150
200
—
Output Short Circuit Current
Output Voltage Regulation
IOUT_SC
VIN = VIN(MIN) (Note 1), VOUT = GND,
Current (average current) measured
10 ms after short is applied.
VOUT
VR-3.0% VR±0.4 VR+3.0%
V
Note 2
VR-2.0%
%
VR+2.0%
VOUT Temperature Coefficient
Line Regulation
TCVOUT
—
50
150
ppm/°C
%/V
Note 3
ΔVOUT
(VOUTXΔVIN
ΔVOUT/VOUT
/
-0.3
±0.1
+0.3
(VOUT(MAX) + VDROPOUT(MAX)) ≤ VIN
≤ 16V, Note 1
)
Load Regulation
-2.5
±1.0
+2.5
%
IL = 1.0 mA to 250 mA for VR >= 2.5V
IL = 1.0 mA to 200 mA for VR < 2.5V
V
IN = 3.65V, Note 4
Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).
2: R is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
V
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temper-
ature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
© 2007 Microchip Technology Inc.
DS22049A-page 3
MCP1703
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VOUT(MAX) + VDROPOUT(MAX), Note 1,
I
LOAD = 100 µA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C.
Parameters
Dropout Voltage
Symbol
Min
Typ
Max
Units
Conditions
VDROPOUT
—
—
—
—
—
330
525
625
750
—
650
725
975
1100
—
mV
mV
mV
mV
mV
IL = 250 mA, VR = 5.0V
Note 1, Note 5
IL = 250 mA, 3.3V ≤ VR < 5.0V
IL = 250 mA, 2.8V ≤ VR < 3.3V
IL = 250 mA, 2.5V ≤ VR < 2.8V
VR < 2.5V, See Maximum Output
Current Parameter
Output Delay Time
Output Noise
TDELAY
—
1000
—
µs
VIN = 0V to 6V, VOUT = 90% VR,
RL = 50Ω resistive
eN
—
—
8
µV/(Hz)1/2 IL = 50 mA, f = 1 kHz, COUT = 1 µF
Power Supply Ripple
Rejection Ratio
PSRR
44
—
—
dB
f = 100 Hz, COUT = 1 µF, IL = 100 µA,
V
V
INAC = 100 mV pk-pk, CIN = 0 µF,
R = 1.2V
Thermal Shutdown Protection
TSD
—
150
°C
Note 1: The minimum VIN must meet two conditions: VIN ≥ 2.7V and VIN ≥ (VOUT(MAX) + VDROPOUT(MAX)).
2: R is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
V
The input voltage VIN = VOUT(MAX) + VDROPOUT(MAX) or ViIN = 2.7V (whichever is greater); IOUT = 100 µA.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured over the temper-
ature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCVOUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, 3LD-SOT-223
TA
TA
TA
-40
-40
-65
+125
+125
+150
°C
°C
°C
θJA
θJC
—
—
62
15
—
—
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
°C/W
°C/W
°C/W
Thermal Resistance, 3LD-SOT-23A
Thermal Resistance, 3LD-SOT-89
θJA
θJC
—
—
336
110
—
—
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
θJA
θJC
—
—
75
10
—
—
0.100 sq in copper on both sides of 2
sided board, with vias
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
DS22049A-page 4
© 2007 Microchip Technology Inc.
MCP1703
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
Note: Junction Temperature (T ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction
J
temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
6.00
5.00
4.00
3.00
2.00
1.00
0.00
120
100
80
60
40
20
0
VOUT = 1.2V
IOUT = 0 µA
VOUT = 1.2V
VIN = 2.7V
+130°C
-45°C
+90°C
+25°C
0°C
2
4
6
8
10
12
14
16
18
0
40
80
120
160
200
Input Voltage (V)
Load Current (mA)
FIGURE 2-1:
Quiescent Current vs. Input
FIGURE 2-4:
Ground Current vs. Load
Voltage.
Current.
6.00
5.00
4.00
3.00
2.00
1.00
120
100
80
VOUT = 2.5V
IOUT = 0 µA
VOUT = 5.0V
VIN = 6.0V
+130°C
+90°C
60
VOUT = 2.5V
VIN = 3.5V
40
+25°C
-45°C
20
0°C
0.00
2
0
0
4
6
8
10
12
14
16
18
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-2:
Quiescent Current vs. Input
FIGURE 2-5:
Ground Current vs. Load
Voltage.
Current.
6.00
5.00
4.00
3.00
2.00
3.00
VOUT = 5.0V
IOUT = 0 mA
VOUT = 1.2V
VIN = 2.7V
VOUT = 2.5V
VIN = 3.5V
IOUT = 0 µA
2.50
2.00
1.50
1.00
0.50
0.00
0°C
-45°C
+130°C
+25°C
VOUT = 5.0V
VIN = 6.0V
+90°C
1.00
6
8
10
12
14
16
18
-45
-20
5
30
55
80
105
130
Input Voltage (V)
Junction Temperature (°C)
FIGURE 2-3:
Quiescent Current vs. Input
FIGURE 2-6:
Quiescent Current vs.
Voltage.
Junction Temperature.
© 2007 Microchip Technology Inc.
DS22049A-page 5
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.240
1.230
1.220
1.210
1.200
1.190
1.180
1.24
1.23
1.22
1.21
1.20
1.19
1.18
VOUT = 1.2V
ILOAD = 0.1 mA
0°C
+25°C
-45°C
-45°C
0°C
+90°C
+130°C
+130°C
+90°C
+25°C
VIN = 3.0V
VOUT = 1.2V
2
4
6
8
10
12
14
16
18
0
20 40 60 80 100 120 140 160 180 200
Load Current (mA)
Input Voltage (V)
FIGURE 2-7:
Output Voltage vs. Input
FIGURE 2-10:
Output Voltage vs. Load
Voltage.
Current.
2.58
2.54
2.53
2.52
2.51
2.50
2.49
2.48
VIN = 3.5V
VOUT = 2.5V
V
OUT = 2.5V
ILOAD = 0.1 mA
2.56
2.54
2.52
2.50
2.48
2.46
2.44
+25°C
+90°C
+90°C
+130°C
0°C
-45°C
0°C
+130°C
+25°C
-45°C
2.47
2.46
2
4
6
8
10
12
14
16
18
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-8:
Output Voltage vs. Input
FIGURE 2-11:
Output Voltage vs. Load
Voltage.
Current.
5.16
5.06
5.04
VIN = 6V
VOUT = 5.0V
VOUT = 5.0V
ILOAD = 0.1 mA
5.12
5.08
5.04
5.00
4.96
4.92
4.88
+90°C
+130°C
5.02
5.00
4.98
4.96
4.94
4.92
+90°C
+130°C
-45°C
0°C
0°C
-45°C
+25°C
+25°C
6
8
10
12
14
16
18
0
50
100
150
200
250
Input Voltage (V)
Load Current (mA)
FIGURE 2-9:
Output Voltage vs. Input
FIGURE 2-12:
Output Voltage vs. Load
Voltage.
Current.
DS22049A-page 6
© 2007 Microchip Technology Inc.
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.00
0.90
VOUT = 2.5V
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
+130°C
+90°C
+25°C
+0°C
-45°C
0
25 50 75 100 125 150 175 200 225 250
Load Current (mA)
FIGURE 2-13:
Dropout Voltage vs. Load
FIGURE 2-16:
Dynamic Line Response.
Current.
0.50
900
800
700
600
500
400
300
200
100
0
VOUT = 2.5V
VOUT = 5.0V
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
ROUT < 0.1?
+130°C
+90°C
+25°C
+0°C
-45°C
0
25 50 75 100 125 150 175 200 225 250
Load Current (mA)
2
4
6
8
10
12
14
16
18
Input Voltage (V)
FIGURE 2-14:
Dropout Voltage vs. Load
FIGURE 2-17:
Short Circuit Current vs.
Current.
Input Voltage.
1.00
0.90
0.80
0.70
0.60
0.50
0.40
VOUT = 1.2V
OUT = 1 mA to 200 mA
VIN = 6V
VIN = 12V
I
VIN = 16V
VIN = 14V
VIN = 3.8V
0.30
0.20
VIN = 3.2V
-45
-20
5
30
55
80
105
130
Temperature (°C)
FIGURE 2-15:
Dynamic Line Response.
FIGURE 2-18:
Load Regulation vs.
Temperature.
© 2007 Microchip Technology Inc.
DS22049A-page 7
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
1.20
1.00
0.80
0.60
0.40
0.20
0.00
-0.20
-0.40
0.20
0.16
0.12
0.08
0.04
0.00
VOUT = 2.5V
VIN = 3.5V to 16V
VOUT = 2.5V
IOUT = 1 mA to 250 mA
VIN = 16V
200 mA
100 mA
250 mA
VIN = 6V
VIN = 3.5V
0 mA
VIN = 12V
VIN = 14V
-45
-20
5
30
55
80
105
130
-45
-20
5
30
55
80
105
130
Temperature (°C)
Temperature (°C)
FIGURE 2-19:
Load Regulation vs.
FIGURE 2-22:
Line Regulation vs.
Temperature.
Temperature.
1.00
0.80
0.18
0.16
VOUT = 5.0V
IOUT = 1 to 250 mA
VOUT = 5.0V
VIN = 6.0V to 16.0V
VIN = 16V
VIN = 6V
0.60
0.40
0.20
0.00
-0.20
-0.40
200mA
0.14
VIN = 12V
250 mA
0.12
VIN = 8V
0.10
0 mA
100 mA
0.08
VIN = 14V
0.06
-45
-20
5
30
55
80
105
130
-45
-20
5
30
55
80
105
130
Temperature (°C)
Temperature (°C)
FIGURE 2-20:
Load Regulation vs.
FIGURE 2-23:
Line Regulation vs.
Temperature.
Temperature.
0.16
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
VIN = 3.0 to 16.0V
VOUT = 1.2V
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
200 mA
1 mA
VR=1.2V
VIN=2.7V
0 mA
V
INAC = 100 mV p-p
IN=0 μF
IOUT=100 µA
100 mA
C
-45
-20
5
30
55
80
105
130
0.01
0.1
1
10
100
1000
Frequency (kHz)
Temperature (°C)
FIGURE 2-21:
Line Regulation vs.
FIGURE 2-24:
PSRR vs. Frequency.
Temperature.
DS22049A-page 8
© 2007 Microchip Technology Inc.
MCP1703
Note: Unless otherwise indicated: VR = 1.8V, COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
TA = +25°C, VIN = VOUT(MAX) + VDROPOUT(MAX) or 2.7V, whichever is greater.
0
-10
-20
-30
-40
VR=5.0V
-50
V
IN=6.0V
-60
-70
-80
-90
VINAC = 100 mV p-p
IN=0 μF
IOUT=100 µA
C
0.01
0.1
1
10
100
1000
Frequency (KHz)
FIGURE 2-25:
PSRR vs. Frequency.
FIGURE 2-28:
Dynamic Load Response.
100
10
IOUT=50 mA
VR=5.0V, VIN=6.0V
VR=2.8V, VIN=3.8V
1
0.1
VR=1.2V, VIN=2.7V
0.01
0.001
0.01
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-26:
Output Noise vs. Frequency.
FIGURE 2-29:
Dynamic Load Response.
FIGURE 2-27:
Power Up Timing.
© 2007 Microchip Technology Inc.
DS22049A-page 9
MCP1703
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP1703 PIN FUNCTION TABLE
Pin No.
SOT-223-3
Pin No.
SOT-23A
Pin No.
SOT-89-3
Name
Function
2
3
1
1
2
3
-
1
GND
VOUT
VIN
Ground Terminal
3
2,Tab
-
Regulated Voltage Output
Unregulated Supply Voltage
No connection
NC
3.1
Ground Terminal (GND)
3.3
Unregulated Input Voltage (VIN)
Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (2.0 µA typical) flows out of
this pin; there is no high current. The LDO output
regulation is referenced to this pin. Minimize voltage
drops between this pin and the negative side of the
load.
Connect VIN to the input unregulated source voltage.
Like all low dropout linear regulators, low source
impedance is necessary for the stable operation of the
LDO. The amount of capacitance required to ensure
low source impedance will depend on the proximity of
the input source capacitors or battery type. For most
applications, 1 µF of capacitance will ensure stable
operation of the LDO circuit. For applications that have
load currents below 100 mA, the input capacitance
requirement can be lowered. The type of capacitor
used can be ceramic, tantalum or aluminum electro-
lytic. The low ESR characteristics of the ceramic will
yield better noise and PSRR performance at high-
frequency.
3.2
Regulated Output Voltage (VOUT)
Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close to the LDO VOUT pin as is practical.
The current flowing out of this pin is equal to the DC
load current.
DS22049A-page 10
© 2007 Microchip Technology Inc.
MCP1703
4.0
4.1
DETAILED DESCRIPTION
Output Regulation
4.3
Overtemperature
A portion of the LDO output voltage is fed back to the
internal error amplifier and compared with the precision
internal band-gap reference. The error amplifier output
will adjust the amount of current that flows through the
P-Channel pass transistor, thus regulating the output
voltage to the desired value. Any changes in input
voltage or output current will cause the error amplifier
to respond and adjust the output voltage to the target
voltage (refer to Figure 4-1).
The internal power dissipation within the LDO is a
function of input-to-output voltage differential and load
current. If the power dissipation within the LDO is
excessive, the internal junction temperature will rise
above the typical shutdown threshold of 150°C. At that
point, the LDO will shut down and begin to cool to the
typical turn-on junction temperature of 130°C. If the
power dissipation is low enough, the device will
continue to cool and operate normally. If the power
dissipation remains high, the thermal shutdown
protection circuitry will again turn off the LDO,
protecting it from catastrophic failure.
4.2
Overcurrent
The MCP1703 internal circuitry monitors the amount of
current flowing through the P-Channel pass transistor.
In the event of a short-circuit or excessive output
current, the MCP1703 will turn off the P-Channel
device for a short period, after which the LDO will
attempt to restart. If the excessive current remains, the
cycle will repeat itself.
MCP1703
VOUT
VIN
Error Amplifier
+VIN
Voltage
Reference
-
+
Overcurrent
Overtemperature
GND
FIGURE 4-1: Block Diagram.
© 2007 Microchip Technology Inc.
DS22049A-page 11
MCP1703
5.2
Output
5.0
FUNCTIONAL DESCRIPTION
The maximum rated continuous output current for the
MCP1703 is 250 mA (VR ≥ 2.5V). For applications
where VR < 2.5V, the maximum output current is
200 mA.
The MCP1703 CMOS low dropout linear regulator is
intended for applications that need the lowest current
consumption while maintaining output voltage
regulation. The operating continuous load range of the
MCP1703 is from 0 mA to 250 mA (VR ≥ 2.5V). The
input operating voltage range is from 2.7V to 16.0V,
making it capable of operating from two or more alka-
line cells or single and multiple Li-Ion cell batteries.
A minimum output capacitance of 1.0 µF is required for
small signal stability in applications that have up to
250 mA output current capability. The capacitor type
can be ceramic, tantalum or aluminum electrolytic. The
esr range on the output capacitor can range from 0Ω to
2.0Ω.
5.1
Input
The input of the MCP1703 is connected to the source
of the P-Channel PMOS pass transistor. As with all
LDO circuits, a relatively low source impedance (10Ω)
is needed to prevent the input impedance from causing
the LDO to become unstable. The size and type of the
capacitor needed depends heavily on the input source
type (battery, power supply) and the output current
range of the application. For most applications (up to
100 mA), a 1 µF ceramic capacitor will be sufficient to
ensure circuit stability. Larger values can be used to
improve circuit AC performance.
5.3
Output Rise time
When powering up the internal reference output, the
typical output rise time of 1000 µs is controlled to
prevent overshoot of the output voltage.
DS22049A-page 12
© 2007 Microchip Technology Inc.
MCP1703
EQUATION 6-2:
TJ(MAX) = PTOTAL × RθJA + TAMAX
6.0
6.1
APPLICATION CIRCUITS &
ISSUES
Where:
TJ(MAX)
Typical Application
=
Maximum continuous junction
The MCP1703 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
temperature
PTOTAL
=
=
Total device power dissipation
RθJA
Thermal resistance from junction-
to-ambient
TAMAX
=
Maximum ambient temperature
MCP1703
VIN
2.7V to 4.8V
GND
VOUT
1.8V
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
VIN
CIN
VOUT
COUT
1 µF Ceramic
1 µF Ceramic
IOUT
50 mA
FIGURE 6-1: Typical Application Circuit.
EQUATION 6-3:
6.1.1
APPLICATION INPUT CONDITIONS
Package Type = SOT-23A
(TJ(MAX) – TA(MAX)
PD(MAX) = ---------------------------------------------------
RθJA
)
Input Voltage Range = 2.7V to 4.8V
IN maximum = 4.8V
OUT typical = 1.8V
IOUT 50 mA maximum
Where:
V
PD(MAX)
TJ(MAX)
=
=
Maximum device power dissipation
V
Maximum continuous junction
temperature
=
TA(MAX)
=
=
Maximum ambient temperature
6.2
Power Calculations
RθJA
Thermal resistance from junction-
to-ambient
6.2.1
POWER DISSIPATION
The internal power dissipation of the MCP1703 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(2.0 µA x VIN). The following equation can be used to
calculate the internal power dissipation of the LDO.
EQUATION 6-4:
TJ(RISE) = PD(MAX) × RθJA
Where:
TJ(RISE)
=
Rise in device junction temperature
over the ambient temperature
EQUATION 6-1:
PTOTAL
=
=
Maximum device power dissipation
PLDO = (VIN(MAX)) – VOUT(MIN)) × IOUT(MAX))
RθJA
Thermal resistance from junction to
ambient
P
LDO = LDO Pass device internal power dissipation
VIN(MAX) = Maximum input voltage
EQUATION 6-5:
VOUT(MIN) = LDO minimum output voltage
TJ = TJ(RISE) + TA
Where:
The maximum continuous operating junction
temperature specified for the MCP1703 is +125°C. To
estimate the internal junction temperature of the
MCP1703, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (RθJA). The thermal resistance from junction to
ambient for the SOT-23A pin package is estimated at
336°C/W.
TJ
=
=
Junction Temperature
TJ(RISE)
Rise in device junction temperature
over the ambient temperature
TA
=
Ambient temperature
© 2007 Microchip Technology Inc.
DS22049A-page 13
MCP1703
6.3
Voltage Regulator
TJ = TJRISE + TA(MAX)
TJ = 91.3°C
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
Maximum Package Power Dissipation at +40°C
Ambient Temperature
SOT-23A (336.0°C/Watt = RθJA
)
P
D(MAX) = (125°C - 40°C) / 336°C/W
D(MAX) = 253 milli-Watts
6.3.1
POWER DISSIPATION EXAMPLE
P
Package
SOT-89 (75°C/Watt = RθJA
)
Package Type = SOT-23A
Input Voltage
P
D(MAX) = (125°C - 40°C) / 75°C/W
D(MAX) = 1.133 Watts
P
V
IN = 2.7V to 4.8V
SOT-223 (62.9°C/Watt = RθJA
)
LDO Output Voltages and Currents
PD(MAX) = (125°C - 40°C) / 62.9°C/W
VOUT = 1.8V
PD(MAX) = 1.35 Watts
IOUT = 50 mA
Maximum Ambient Temperature
A(MAX) = +40°C
6.4
Voltage Reference
T
The MCP1703 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
many microcontroller applications, the initial accuracy
of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
by the MCP1703 LDO. The low-cost, low quiescent
current and small ceramic output capacitor are all
advantages when using the MCP1703 as a voltage
reference.
Internal Power Dissipation
Internal Power dissipation is the product of the LDO
output current times the voltage across the LDO
(VIN to VOUT).
PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x IOUT(MAX)
PLDO = (4.8V - (0.97 x 1.8V)) x 50 mA
PLDO = 152.7 milli-Watts
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The thermal
resistance from junction to ambient (RθJA) is derived
from an EIA/JEDEC standard for measuring thermal
resistance for small surface mount packages. The EIA/
JEDEC specification is JESD51-7, “High Effective Ther-
mal Conductivity Test Board for Leaded Surface Mount
Packages”. The standard describes the test method
and board specifications for measuring the thermal
resistance from junction to ambient. The actual thermal
resistance for a particular application can vary depend-
ing on many factors, such as copper area and thick-
ness. Refer to AN792, “A Method to Determine How
Much Power a SOT23 Can Dissipate in an Application”,
(DS00792), for more information regarding this
subject.
Ratio Metric Reference
PIC®
MCP1703
Microcontroller
2 µA Bias
VIN
VOUT
CIN
1 µF
VREF
COUT
1 µF
GND
ADO
AD1
Bridge Sensor
FIGURE 6-2: Using the MCP1703 as a
Voltage Reference.
6.5
Pulsed Load Applications
TJ(RISE) = PTOTAL x RqJA
For some applications, there are pulsed load current
events that may exceed the specified 250 mA
maximum specification of the MCP1703. The internal
current limit of the MCP1703 will prevent high peak
load demands from causing non-recoverable damage.
The 250 mA rating is a maximum average continuous
rating. As long as the average current does not exceed
250 mA, pulsed higher load currents can be applied to
the MCP1703. The typical current limit for the
MCP1703 is 500 mA (TA +25°C).
TJRISE = 152.7 milli-Watts x 336.0°C/Watt
T
JRISE = 51.3°C
Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below.
DS22049A-page 14
© 2007 Microchip Technology Inc.
MCP1703
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
3-Pin SOT-23A
Example:
Standard Options for SOT-23A and SOT-89
Extended Temp
Voltage * Symbol
1.2 HT
HWNN
XXNN
Symbol
Voltage *
HM
HP
HQ
HR
HS
3.0
3.3
4.0
5.0
—
3-Lead SOT-89
Example
1.5
1.8
2.5
2.8
HU
HV
HW
—
XXXYYWW
NNN
HM0719
256
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.
3-Lead SOT-223
Example:
Tab is GND
Tab is GND
Standard Options for SOT-223
Extended Temp
MCP1703
15E0719
XXXXXXX
XXXYYWW
256
NNN
Symbol
Voltage *
Symbol
Voltage *
12
15
18
25
28
1.2
1.5
1.8
2.5
2.8
30
33
40
50
—
3.0
3.3
4.0
5.0
—
1
2
3
* Custom output voltages available upon request.
Contact your local Microchip sales office for more
information.
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS22049A-page 15
MCP1703
3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e1
e
2
1
E
E1
N
b
c
A
φ
A2
L
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
Lead Pitch
N
e
3
0.95 BSC
Outside Lead Pitch
Overall Height
e1
A
1.90 BSC
0.89
0.90
0.00
2.10
1.20
2.70
0.15
0°
–
–
–
–
–
–
–
–
–
–
1.45
1.30
0.15
3.00
1.80
3.10
0.60
30°
Molded Package Thickness
Standoff
A2
A1
E
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
L
Foot Angle
φ
c
Lead Thickness
Lead Width
0.09
0.30
0.26
0.51
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-130B
DS22049A-page 16
© 2007 Microchip Technology Inc.
MCP1703
3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
H
L
N
1
2
b
b1
b1
e
E1
e1
A
C
Units
MILLIMETERS
Dimension Limits
MIN
MAX
Number of Leads
Pitch
N
e
3
1.50 BSC
3.00 BSC
Outside Lead Pitch
Overall Height
Overall Width
e1
A
1.40
3.94
2.29
2.13
4.39
1.40
0.79
0.35
0.41
0.36
1.60
4.25
2.60
2.29
4.60
1.83
1.20
0.44
0.56
0.48
H
Molded Package Width at Base
Molded Package Width at Top
Overall Length
E
E1
D
Tab Length
D1
L
Foot Length
Lead Thickness
c
Lead 2 Width
b
Leads 1 & 3 Width
b1
Notes:
1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-029B
© 2007 Microchip Technology Inc.
DS22049A-page 17
MCP1703
3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
b2
E1
E
3
2
1
e
e1
A2
c
A
φ
b
L
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Leads
Lead Pitch
N
e
3
2.30 BSC
4.60 BSC
–
Outside Lead Pitch
Overall Height
Standoff
e1
A
–
1.80
0.10
1.70
7.30
3.70
6.70
0.35
0.84
3.10
–
A1
A2
E
0.02
1.50
6.70
3.30
6.30
0.23
0.60
2.90
0.75
0°
–
Molded Package Height
Overall Width
1.60
7.00
3.50
6.50
0.30
0.76
3.00
–
Molded Package Width
Overall Length
Lead Thickness
Lead Width
E1
D
c
b
Tab Lead Width
Foot Length
b2
L
Lead Angle
φ
–
10°
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-032B
DS22049A-page 18
© 2007 Microchip Technology Inc.
MCP1703
APPENDIX A: REVISION HISTORY
Revision A (June 2007)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS22049A-page 19
MCP1703
NOTES:
DS22049A-page 20
© 2007 Microchip Technology Inc.
MCP1703
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
PART NO.
Device
X-
XX
X
X
X/
XX
a)
b)
c)
d)
e)
f)
MCP1703T-1202E/XX: Tape and Reel, 1.2V
Tape
and Reel Voltage
Output Feature Tolerance Temp. Package
Code
MCP1703T-1502E/XX: Tape and Reel, 1.5V
MCP1703T-1802E/XX: Tape and Reel, 1.8V
MCP1703T-2502E/XX: Tape and Reel, 2.5V
MCP1703T-2802E/XX: Tape and Reel, 2.8V
MCP1703T-3002E/XX: Tape and Reel, 3.0V
MCP1703T-3302E/XX: Tape and Reel, 3.3V
MCP1703T-3602E/XX: Tape and Reel, 3.6V
MCP1703T-4002E/XX: Tape and Reel, 4.0V
MCP1703T-5002E/XX: Tape and Reel, 5.0V
Device:
MCP1703: 250 mA, 16V Low Quiescent Current LDO
Tape and Reel:
Output Voltage *:
T
=
Tape and Reel
12
15
18
25
28
30
33
40
50
=
=
=
=
=
=
=
=
=
1.2V “Standard”
1.5V “Standard”
1.8V “Standard”
2.5V “Standard”
2.8V “Standard”
3.0V “Standard”
3.3V “Standard”
4.0V “Standard”
5.0V “Standard”
g)
h)
i)
j)
*Contact factory for other output voltage options.
XX
=
=
=
CB for 3LD SOT-23A package
DB for 3LD SOT-223 package
MB for 3LD SOT-89 package
Extra Feature Code:
Tolerance:
0
2
E
=
=
=
Fixed
2.0% (Standard)
-40°C to +125°C
Temperature:
Package Type:
CB
DB
MB
=
=
=
Plastic Small Outline Transistor (SOT-23A) 3-lead,
Plastic Small Outline Transistor (SOT-223) 3-lead,
Plastic Small Outline Transistor (SOT-89) 3-lead,
© 2007 Microchip Technology Inc.
DS22049A-page 21
MCP1703
NOTES:
DS22049A-page 22
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS22049A-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-11-4160-8631
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Tel: 33-1-69-53-63-20
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China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS22049A-page 24
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