MCP1711-25I/5X [MICROCHIP]
FIXED POSITIVE LDO REGULATOR;
| 型号： | MCP1711-25I/5X |
| 厂家： | 
MICROCHIP |
| 描述： | FIXED POSITIVE LDO REGULATOR |
| 文件： | 总36页 (文件大小：1982K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP1711
150 mA Ultra-Low Quiescent Current, Capacitorless LDO Regulator
Features
General Description
• Low Quiescent Current: 600 nA
• Input Voltage Range: 1.4V to 6.0V
The MCP1711 is a highly accurate CMOS low dropout
(LDO) voltage regulator that can deliver up to 150 mA
of current while consuming only 0.6 µA of quiescent
current (typical). The input operating range is specified
from 1.4V to 6.0V, making it an ideal choice for mobile
applications and one-cell Li-Ion powered applications.
• Standard Output Voltages: 1.2V, 1.8V, 1.9V, 2.0V,
2.2V, 2.5V, 3.0V, 3.3V, 5.0V
• Output Accuracy: ±20 mV for 1.2V and 1.8V
Options and ±1% for VR 2.0V
The MCP1711 is capable of delivering 150 mA output
current with only 0.32V (typical) for VR = 5.0V, and
1.41V (typical) for VR = 1.2V of input-to-output voltages
differential. The output voltage accuracy of the
MCP1711 is typically ± 0.02V for VR < 2.0V and ±1% for
VR 2.0V at +25°C. The temperature stability is
approximately ±50 ppm/°C. Line regulation is
±0.01%/V typical at +25°C.
• Temperature Stability: ±50 ppm/°C
• Maximum Output Current: 150 mA
• Low ON Resistance: 3.3 @ VR = 3.0V
• Standby Current: 10 nA
• Protection Circuits: Current Limiter, Short Circuit,
Foldback
• SHDN Pin Function: ON/OFF Logic = Enable
High
The output voltages available for the MCP1711 range
from 1.2V to 5.0V. The LDO output is stable even if an
output capacitor is not connected, due to an excellent
internal phase compensation. However, for better tran-
sient responses, the output capacitor should be added.
The MCP1711 is compatible with low ESR ceramic
output capacitors.
• COUT Discharge Circuit when SHDN Function is
Active
• Output Capacitor: Low Equivalent Series
Resistance (ESR) Ceramic, Capacitorless
Compatible
• Operating Temperature: -40°C to +85°C
(Industrial)
Overcurrent limit and short-circuit protection embed-
ded into the device provide a robust solution for any
application.
• Available Packages:
- 4-Lead 1 x 1 mm UQFN
- 5-Lead SOT-23
The MCP1711 has a true current foldback feature.
When the load decreases beyond the MCP1711 load
rating, the output current and output voltage will
foldback toward 80 mA (typical) at approximately 0V
output. When the load impedance increases and
returns to the rated load, the MCP1711 will follow the
same foldback curve as the device comes out of
current foldback.
• Environmentally Friendly: EU RoHS Compliant,
Lead-Free
Applications
• Energy Harvesting
• Long-Life, Battery-Powered Applications
• Portable Electronics
If the device is in Shutdown mode, by inputting a
low-level signal to the SHDN pin, the current
consumption is reduced to less than 0.1 µA (typically
0.01 µA). In Shutdown mode, if the output capacitor is
used, it will be discharged via the internal dedicated
switch and, as a result, the output voltage quickly
returns to 0V.
• Ultra-Low Consumption “Green” Products
• Mobile Devices/Terminals
• Wireless LAN
• Modules (Wireless, Cameras)
Related Literature
The package options for the MCP1711 are the 4-lead
1 x 1 mm UQFN and the 5-lead SOT-23, which make
the device ideal for small and compact applications.
• AN765, Using Microchip’s Micropower LDOs
(DS00765), Microchip Technology Inc.
• AN766,Pin-CompatibleCMOSUpgradestoBipolar
LDOs (DS00766), Microchip Technology Inc.
• AN792, A Method to Determine How Much Power
a SOT23 Can Dissipate in an Application
(DS00792), Microchip Technology Inc.
2015-2016 Microchip Technology Inc.
DS20005415D-page 1
MCP1711
Package Types
Typical Application Circuit
MCP1711
1x1 UQFN*
Top View
MCP1711
SOT-23
Top View
MCP1711
1x1 UQFN and SOT-23
VOUT
NC
4
MCP1711
VIN
4
VIN
SHDN
V
OUT
5
V
V
OUT
3
IN
CIN
C
OUT
0.1 µF
Ceramic
EP
5
SHDN
ON
GND
2
1
3
OFF
VIN GND SHDN
1
2
VOUT
GND
* Includes Exposed Thermal Pad (EP);
see Table 3-1
Functional Block Diagram
PMOS
VIN
VOUT
Current
Limit
R1
–
Ref
Err Amp
+
DT
RDCHG
R2
SHDN to each block
ON/OFF
Control
SHDN
Discharge transistor (DT)
DS20005415D-page 2
2015-2016 Microchip Technology Inc.
MCP1711
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage, VIN.....................................................................................................................................................+6.5V
VIN, SHDN.................................................................................................................................................. -0.3V to +6.5V
Output Current, IOUT (1).........................................................................................................................................470mA
Output Voltage, VOUT (2)....................................................................................................... -0.3V to VIN + 0.3V or +6.5V
Power Dissipation
5-Lead SOT-23 ..................................................... 600 mW (JEDEC 51-7 FR-4 board with thermal vias) or 250 mW (3)
4-Lead 1 x 1 mm UQFN........................................ 550 mW (JEDEC 51-7 FR-4 board with thermal vias) or 100 mW (3)
Storage Temperature .............................................................................................................................. -55°C to +125°C
Operating Ambient Temperature............................................................................................................... -40°C to +85°C
ESD Protection on all pins ...........................................................................................................±1 kV HBM, ±200V MM
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Note 1: Provided that the device is used in the range of IOUT PD/(VIN - VOUT).
2: The maximum rating corresponds to the lowest value between VIN + 0.3V or +6.5V.
3: The device is mounted on one layer PCB with minimal copper that does not provide any additional cooling.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VSHDN = VIN, IOUT = 1 mA, CIN = COUT = 0 µF, VIN = 3.5V for
VR < 2.5V and VIN = VR + 1V for VR 2.5V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input-Output Characteristics
Input Voltage
VIN
1.4
VR - 0.02
VR x 0.99
150
-16
—
VR
VR
—
6.0
VR + 0.02
VR x 1.01
—
V
V
IOUT = 1 µA
Output Voltage
VOUT
VR < 2.0V
VR 2.0V
Maximum Output Current
Load Regulation
IOUT
mA
mV
VOUT
±3
+16
1 µA IOUT 1 mA
1 mA IOUT 150 mA
IOUT = 50 mA
-50
±17
+50
(2)
Dropout Voltage (1)
VDROPOUT1
VDROPOUT2
Iq
—
VDROP1
V
(2)
—
VDROP2
IOUT = 150 mA
VR < 1.9V
Input Quiescent Current
—
0.60
0.65
0.80
0.01
1.27
1.50
1.80
0.10
µA
—
1.9V VR < 4.0V
VR 4.0V
—
Input Quiescent Current
for SHDN mode
ISHDN
—
µA
VIN = 6.0V
VSHDN = VIN
Line Regulation
VOUT
(VIN x VOUT
/
-0.13
-0.19
±0.01
±0.01
+0.13
+0.19
%/V
I
OUT = 1 µA
)
VR + 0.5V VIN 6.0V
I
OUT = 1 mA
VR 1.2V,VR + 0.5V VIN
6.0V
Note 1: The dropout voltage is defined as the input to output differential at which the output voltage drops 2%
below the output voltage value that was measured with an applied input voltage of VIN = VR + 1V.
2:
VDROP1, VDROP2: Dropout Voltage (Refer to the DC Characteristics Voltage Table).
2015-2016 Microchip Technology Inc.
DS20005415D-page 3
MCP1711
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VSHDN = VIN, IOUT = 1 mA, CIN = COUT = 0 µF, VIN = 3.5V for
VR < 2.5V and VIN = VR + 1V for VR 2.5V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Output Voltage
VOUT
/
—
±50
—
ppm/°C IOUT = 10 mA
Temperature Stability
Current Limit
(T x VOUT
)
-40°C TA +85°C
VOUT = 0.95 x VR
ILIMIT
150
—
270
80
—
—
mA
mA
Output Short-Circuit
Foldback Current
IOUT_SC
VOUT = GND
COUT Auto-Discharge
Resistance
RDCHG
en
280
—
450
30
640
—
SHDN = GND
VOUT = VR
Noise
µV(rms) CIN = COUT = 1 µF, IOUT = 50
mA, f = 10 Hz to 100 kHz
Shutdown Input
SHDN Logic High Input
Voltage
VSHDN-HIGH
VSHDN-LOW
0.91
0
—
—
6.00
0.38
V
V
SHDN Logic Low Input
Voltage
SHDN High-Level Current
SHDN Low-Level Current
ISHDN-HIGH
ISHDN-LOW
-0.1
-0.1
—
—
+0.1
+0.1
µA
µA
VIN = 6.0V
VIN = 6.0V
SHDN = GND
Note 1: The dropout voltage is defined as the input to output differential at which the output voltage drops 2%
below the output voltage value that was measured with an applied input voltage of VIN = VR + 1V.
2:
VDROP1, VDROP2: Dropout Voltage (Refer to the DC Characteristics Voltage Table).
DC CHARACTERISTICS VOLTAGE TABLE
Nominal
Output
Voltage
Output Voltage (V)
Dropout Voltage (V)
VOUT
VDROP1
Typ.
VDROP1
Max.
VDROP2
Typ.
VDROP2
Max.
VR (V)
Min.
Max.
1.2
1.8
1.9
2.0
2.2
2.5
3.0
3.3
5.0
1.1800
1.7800
1.8800
1.9800
2.1780
2.4750
2.9700
3.2670
4.9500
1.2200
1.8200
1.9200
2.0200
2.2220
2.5250
3.0300
3.3330
5.0500
0.87
0.47
0.42
0.37
0.31
0.26
0.17
0.17
0.10
1.23
0.72
0.64
0.58
0.47
0.40
0.26
0.26
0.16
1.41
0.99
0.92
0.86
0.75
0.67
0.50
0.50
0.32
1.93
1.40
1.29
1.20
1.05
0.92
0.67
0.67
0.43
DS20005415D-page 4
2015-2016 Microchip Technology Inc.
MCP1711
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max. Units
Conditions
Operating Ambient Temperature Range
Junction Operating Temperature
Storage Temperature Range
TA
TJ
TA
-40
-40
-55
—
—
—
+85
+125
+125
°C
°C
°C
Package Thermal Resistances
Thermal Resistance, 1 x 1 UQFN-4Ld
JA
—
181.82
—
°C/W JEDEC 51-7 FR4 board with
thermal vias
JA
JC
JA
—
—
—
1000
15
—
—
—
°C/W Note 2
°C/W
Thermal Resistance, SOT-23-5Ld
166.67
°C/W JEDEC 51-7 FR4 board with
thermal vias
JA
JC
—
—
400
81
—
—
°C/W Note 2
°C/W
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the max-
imum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2: The device is mounted on one layer PCB with minimal copper that does not provide any additional cooling.
2015-2016 Microchip Technology Inc.
DS20005415D-page 5
MCP1711
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
1.20
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VR = 5.0V
VR = 1.2V
1.00
0.80
0.60
0.40
0.20
0.00
TA = +85°C
TA = +85°C
TA = +25°C
TA = +25°C
TA = -40°C
TA = -40°C
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage (V)
Input Voltage (V)
FIGURE 2-1:
Quiescent Current vs. Input
FIGURE 2-4:
Quiescent Current vs. Input
Voltage.
Voltage.
1.2
1
45
VR = 1.2V
VR = 1.8V
40
35
30
25
20
15
10
5
0.8
0.6
0.4
0.2
TA = +85°C
TA = -40°C
4
TA = +25°C
2
0
0
0
0
1
3
5
6
30
60
90
120
150
Input Voltage (V)
Load Current (mA)
FIGURE 2-2:
Quiescent Current vs. Input
FIGURE 2-5:
Ground Current vs. Load
Voltage.
Current.
1.20
1.00
0.80
0.60
0.40
0.20
45
VR = 3.3V
VR = 1.8V
TA = +85°C
40
35
30
25
20
15
10
5
TA = -40°C
TA = +25°C
0.00
0
0
1
2
3
4
5
6
0
30
60
90
120
150
Input Voltage (V)
Load Current (mA)
FIGURE 2-3:
Quiescent Current vs. Input
FIGURE 2-6:
Ground Current vs. Load
Voltage.
Current.
DS20005415D-page 6
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
.
40
VR = 3.3V
35
3.5V
30
tr = 5 µs
25
20
15
10
5
VIN
0V
VOUT (DC Coupled, 1V/Div)
IOUT = 1 µA
VOUT
IOUT = 150 mA
IOUT = 10 mA
Time = 80 µs/Div
0
VR = 1.8V
0
30
60
90
120
150
Load Current (mA)
FIGURE 2-7:
Ground Current vs. Load
FIGURE 2-10:
Start-Up from VIN.
Current.
45
VR = 5.0V
40
4.3V
35
30
25
20
15
10
5
tr = 5 µs
IOUT = 1 µA
VIN
0V
VOUT (DC Coupled, 1V/Div)
IOUT = 150 mA
IOUT = 10 mA
VOUT
0
0
V
R = 3.3V
Time = 80 µs/Div
30
60
90
120
150
Load Current (mA)
FIGURE 2-11:
Start-Up from VIN.
FIGURE 2-8:
Ground Current vs. Load
Current.
3.5V
tr = 5 µs
6.0 V
0V
VIN
tr = 5 µs
VIN
0V
IOUT = 1 µA
VOUT (DC Coupled, 2V/Div)
VOUT (DC Coupled, 0.5V/Div)
IOUT = 1 µA
IOUT = 150 mA
IOUT = 150 mA
IOUT = 10 mA
VOUT
VOUT
IOUT = 10 mA
VR = 5.0V
VR = 1.2V
Time = 80 µs/Div
Time = 80 µs/Div
FIGURE 2-12:
Start-Up from VIN.
FIGURE 2-9:
Start-Up from VIN.
2015-2016 Microchip Technology Inc.
DS20005415D-page 7
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
6.0 V
3.5V
tr = 5 µs
tr = 5 µs
VIN
0V
VIN
0V
VOUT (DC Coupled, 2V/Div)
V
OUT (DC Coupled, 0.5V/Div)
IOUT = 10 mA
IOUT = 10 mA
IOUT = 100 mA
IOUT = 100 mA
VOUT
IOUT
IOUT = 150 mA
Time = 80 µs/Div
I
OUT = 150 mA
VR = 1.2V
CIN = COUT = 1 µF
V
C
R = 5.0V
IN = COUT = 1 µF
Time = 80 µs/Div
FIGURE 2-13:
Start-Up from VIN.
FIGURE 2-16:
Start-Up from VIN.
3.5V
3.5V
tr = 5 µs
tr = 5 µs
0V
VIN
0V
EN
VOUT (DC Coupled, 1V/Div)
V
OUT (DC Coupled, 0.5V/Div)
IOUT = 1 µA
IOUT = 10 mA
IOUT = 100 mA
VOUT
I
OUT = 150 mA
VOUT
IOUT = 150 mA
IOUT = 10 mA
V
R = 1.8V
CIN = COUT = 1 µF
Time = 80 µs/Div
VR = 1.2V
Time = 80 µs/Div
FIGURE 2-14:
Start-Up from VIN.
FIGURE 2-17:
Start-Up from SHDN.
4.3V
3.5V
tr = 5 µs
OUT = 10 mA
tr = 5 µs
VIN
0V
0V
SHDN
VOUT (DC Coupled, 1V/Div)
I
VOUT (DC Coupled, 1V/Div)
IOUT = 100 mA
IOUT = 1 µA
VOUT
VOUT
IOUT = 150 mA
Time = 80 µs/Div
I
OUT = 150 mA
V
R = 3.3V
IOUT = 10 mA
CIN = COUT = 1 µF
VR = 1.8V
Time = 80 µs/Div
FIGURE 2-15:
Start-Up from VIN.
FIGURE 2-18:
Start-Up from SHDN.
DS20005415D-page 8
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
2.00
VR = 1.8V
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
4.3V
VIN = 2.5V
VIN = 6.0V
tr = 5 µs
0V
SHDN
VOUT (DC Coupled, 1V/Div)
IOUT = 1 µA
VIN = 4.5V
VIN = 3.5V
IOUT = 150 mA
IOUT = 10 mA
VOUT
V
R = 3.3V
Time = 80 µs/Div
0
50
100
150
200
250
300
Output Current (mA)
FIGURE 2-19:
Start-Up from SHDN.
FIGURE 2-22:
Output Voltage vs. Output
Current.
3.50
VR = 3.3V
3.00
6.0 V
2.50
2.00
1.50
1.00
0.50
0.00
VIN = 5.0V
VIN = 3.6V
tr = 5 µs
SHDN
0V
VIN = 4.3V
VOUT (DC Coupled, 2V/Div)
VIN = 6.0V
IOUT = 1 µA
IOUT = 150 mA
VOUT
IOUT = 10 mA
VR = 5.0V
0
50
100
150
200
250
300
350
Time = 80 µs/Div
Output Current (mA)
FIGURE 2-23:
Output Voltage vs. Output
FIGURE 2-20:
Start-Up from SHDN.
Current.
1.40
1.20
1.00
0.80
0.60
0.40
0.20
5.50
5.00
VR = 1.2V
VR = 5.0V
4.50
VIN = 3.5V
VIN = 4.5V
VIN = 2.5V
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
VIN = 5.5V
VIN = 6.0V
VIN = 6.0V
VIN = 5.2V
0.00
0
50
100
150
200
250
0
50 100 150 200 250 300 350 400
Output Current (mA)
Output Current (mA)
FIGURE 2-21:
Output Voltage vs. Output
FIGURE 2-24:
Output Voltage vs. Output
Current.
Current.
2015-2016 Microchip Technology Inc.
DS20005415D-page 9
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
5.50
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
VR = 5.0V
VR = 1.2V
TA = +85°C
TA = +25°C
TA = +85°C
TA = +25°C
TA = -40°C
TA = -40°C
0
50
100
150
200
250
0
50
100 150 200 250 300 350
Output Current (mA)
Output Current (mA)
FIGURE 2-25:
Output Voltage vs. Output
FIGURE 2-28:
Output Voltage vs. Output
Current.
Current.
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
VR = 1.8V
VR = 1.2V
TA = +85°C
IOUT = 1 µA
IOUT = 1 mA
TA = +25°C
IOUT = 10 mA
IOUT = 100 mA
TA = -40°C
0
50
100
150
200
250
300
0
1
2
3
4
5
6
Output Current (mA)
Input Voltage (V)
FIGURE 2-26:
Output Voltage vs. Output
FIGURE 2-29:
Output Voltage vs. Input
Current.
Voltage.
2.00
1.80
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
3.50
VR = 1.8V
VR = 3.3V
3.00
2.50
2.00
1.50
1.00
0.50
0.00
TA = +85°C
TA = -40°C
IOUT = 100 mA
IOUT = 10 mA
IOUT = 1 mA
TA = +25°C
IOUT = 1 µA
0
1
2
3
4
5
6
0
50
100
150
200
250
300
350
Output Current (mA)
Input Voltage (V)
FIGURE 2-27:
Output Voltage vs. Output
FIGURE 2-30:
Output Voltage vs. Input
Current.
Voltage.
DS20005415D-page 10
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
VR = 3.3V
VR = 1.8V
IOUT = 1 µA
IOUT = 100 mA
IOUT = 100 mA
IOUT = 10 mA
IOUT = 1 mA
IOUT = 10 mA
IOUT = 1 mA
IOUT = 1 µA
3
-40
-15
10
35
60
85
0
1
2
4
5
6
Ambient Temperature (°C)
Input Voltage (V)
FIGURE 2-31:
Output Voltage vs. Input
FIGURE 2-34:
Output Voltage vs. Ambient
Voltage.
Temperature.
3.60
5.50
VR = 3.3V
VRR= 5.0V
5.00
4.50
4.00
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
3.55
IOUT = 1 µA
3.50
3.45
3.40
3.35
3.30
3.25
3.20
IOUT = 1 mA
IOUT = 100 mA
IOUT = 10 mA
IOUT = 1 mA
IOUT = 1 µA
IOUT = 10 mA
IOUT = 100 mA
35
-40
-15
10
60
85
0
1
2
3
4
5
6
Ambient Temperature (°C)
Input Voltage (V)
FIGURE 2-35:
Output Voltage vs. Ambient
FIGURE 2-32:
Output Voltage vs. Input
Temperature.
Voltage.
5.20
1.25
1.24
1.23
1.22
1.21
1.20
1.19
1.18
VR = 5.0V
VR = 1.2V
5.15
IOUT = 1 µA
IOUT = 100 mA
5.10
5.05
5.00
4.95
4.90
4.85
4.80
IOUT = 10 mA
IOUT = 1 mA
IOUT = 10 mA
IOUT = 100 mA
IOUT = 1 mA
IOUT = 1 µA
1.17
1.16
1.15
-40
-15
10
35
60
85
-40
-15
10
35
60
85
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-36:
Output Voltage vs. Ambient
FIGURE 2-33:
Output Voltage vs. Ambient
Temperature.
Temperature.
2015-2016 Microchip Technology Inc.
DS20005415D-page 11
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
1800
1600
1400
1200
1000
800
450
400
350
300
250
200
150
100
50
VR = 1.2V
VR = 5.0V
TA = +85°C
TA = -40°C
TA = +85°C
TA = +25°C
TA = +25°C
600
400
TA = -40°C
200
0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Output Current (mA)
Load Current (mA)
FIGURE 2-37:
Dropout Voltage vs. Output
FIGURE 2-40:
Dropout Voltage vs. Output
Current.
Current.
1400
1200
1000
800
600
400
200
0
1.00
0.80
0.60
0.40
0.20
VR = 1.8V
VR = 1.2V to 5.0V
SHDN High Level
TA = +85°C
TA = +25°C
SHDN Low Level
TA = -40°C
0.00
-40
0
25
50
75
100
125
150
-15
10
35
60
85
Ambient Temperature (°C)
Output Current (mA)
FIGURE 2-38:
Dropout Voltage vs. Output
FIGURE 2-41:
Shutdown Threshold
Current.
Voltage vs. Ambient Temperature.
500
450
VR = 3.3V
TA = +85°C
4.5V
400
350
300
250
200
150
100
50
VIN
tf = 5 µs
tr = 5 µs
3.5V
V
OUT (AC Coupled, 500 mV/Div)
TA = +25°C
TA = -40°C
VOUT
VR = 1.2V
V
IN = 3.5V to 4.5V
0
Time = 80 µs/Div
IOUT = 10 mA
0
25
50
75
100
125
150
Load Current (mA)
FIGURE 2-39:
Dropout Voltage vs. Output
FIGURE 2-42:
Dynamic Line Response.
Current.
DS20005415D-page 12
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
4.5V
5.3V
VIN
VIN
tr = 5 µs
tf = 5 µs
4.3V
tr = 5 µs
tf = 5 µs
3.5V
VOUT (AC Coupled, 500 mV/Div)
VOUT (AC Coupled, 500 mV/Div)
VOUT
VOUT
VR = 3.3V
VIN = 4.3V to 5.3V
V
V
R = 1.2V
IN = 3.5V to 4.5V
Time = 80 µs/Div
Time = 80 µs/Div
IOUT = 10 mA
IOUT = 100 mA
FIGURE 2-43:
Dynamic Line Response.
FIGURE 2-46:
Dynamic Line Response.
5.3V
tr = 5 µs
OUT (AC Coupled, 500 mV/Div)
4.5V
VIN
tf = 5 µs
VIN
tr = 5 µs
4.3V
3.5V
tf = 5 µs
V
VOUT (AC Coupled, 500 mV/Div)
VOUT
VOUT
VR = 3.3V
VR = 1.8V
VIN = 4.3V to 5.3V
IOUT = 100 mA
VIN = 3.5V to 4.5V
IOUT = 10 mA
Time = 80 µs/Div
Time = 80 µs/Div
FIGURE 2-44:
Dynamic Line Response.
FIGURE 2-47:
Dynamic Line Response.
4.5V
6.0V
VIN
5.2V
tr = 5 µs
tf = 5 µs
VIN
tr = 5 µs
3.5V
tf = 5 µs
V
OUT (AC Coupled, 500 mV/Div)
VOUT (AC Coupled, 500 mV/Div)
VOUT
VOUT
VR = 5.0V
VR = 1.8V
VIN = 5.2V to 6.0V
IOUT = 10 mA
V
IN = 3.5V to 4.5V
Time = 80 µs/Div
Time = 80 µs/Div
IOUT = 100 mA
FIGURE 2-45:
Dynamic Line Response.
FIGURE 2-48:
Dynamic Line Response.
2015-2016 Microchip Technology Inc.
DS20005415D-page 13
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
150 mA
6.0V
tr = 5 µs
VIN
IOUT
tr1
5.5V
tf = 5 µs
tf = 5 µs
1 mA
VOUT (AC Coupled, 500 mV/Div)
V
OUT (AC Coupled, 1V/Div)
VOUT
VOUT
V
R = 1.2V
V
R = 5.0V
VIN = 3.5V
VIN = 5.5V to 6.0V
IOUT = 100 mA
IOUT = 1 mA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
Time = 80 µs/Div
FIGURE 2-49:
Dynamic Line Response.
FIGURE 2-52:
Dynamic Load Response.
150 mA
150 mA
C
IN = COUT = 1 µF
tr1
IOUT
IOUT
tr1
tf = 5 µs
tf = 5 µs
1 µA
VOUT (AC Coupled, 1V/Div)
VOUT (AC Coupled, 1V/Div)
V
V
OUT
OUT
VR = 1.2V
VIN = 3.5V
VR = 1.2V
VIN = 3.5V
I
OUT = 1 µA to 150 mA
Time = 200 µs/Div
IOUT = 1 mA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
1 tr set time = 5 µs
FIGURE 2-50:
Dynamic Load Response.
FIGURE 2-53:
Dynamic Load Response.
150 mA
C
IN = COUT = 1 µF
150 mA
tr1
IOUT
tf = 5 µs
IOUT
tr1
tf = 5 µs
1 µA
1 µA
VOUT (AC Coupled, 1V/Div)
V
OUT (AC Coupled, 1V/Div)
V
OUT
V
OUT
V
R = 1.8V
VIN = 3.5V
OUT = 1 µA to 150 mA
V
R = 1.2V
VIN = 3.5V
OUT = 1 µA to 150 mA
I
I
Time = 200 µs/Div
1 tr set time = 5 µs
Time = 200 µs/Div
1 tr set time = 5 µs
FIGURE 2-51:
Dynamic Load Response.
FIGURE 2-54:
Dynamic Load Response.
DS20005415D-page 14
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
150 mA
C
IN = COUT = 1 µF
150 mA
IOUT
tr1
1 µA
tr1
IOUT
tf = 5 µs
tf = 5 µs
1 µA
VOUT (AC Coupled, 1V/Div)
VOUT (AC Coupled, 1V/Div)
V
OUT
V
OUT
VR = 3.3V
VIN = 4.3V
IOUT = 1 µA to 150 mA
V
R = 1.8V
VIN = 3.5V
IOUT = 1 µA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
Time = 200 µs/Div
1 tr set time = 5 µs
FIGURE 2-55:
Dynamic Load Response.
FIGURE 2-58:
Dynamic Load Response.
150 mA
150 mA
CIN = COUT = 1 µF
tr1
IOUT
IOUT
tr1
tf = 5 µs
tf = 5 µs
1 mA
1 µA
V
OUT (AC Coupled, 1V/Div)
V
OUT (AC Coupled, 1V/Div)
V
OUT
V
OUT
V
R = 1.8V
VIN = 3.5V
OUT = 1 mA to 150 mA
V
V
R = 3.3V
IN = 4.3V
I
Time = 200 µs/Div
1 tr set time = 5 µs
IOUT = 1 µA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
FIGURE 2-56:
Dynamic Load Response.
FIGURE 2-59:
Dynamic Load Response.
150 mA
C
IN = COUT = 1 µF
150 mA
tr1
tr1
tf = 5 µs
IOUT
tf = 5 µs
IOUT
1 mA
1 mA
V
OUT (AC Coupled, 1V/Div)
VOUT
V
OUT
VR = 3.3V
VIN = 4.3V
IOUT = 1 mA to 150 mA
V
R = 1.8V
VIN = 3.5V
IOUT = 1 mA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
Time = 200 µs/Div
1 tr set time = 5 µs
FIGURE 2-57:
Dynamic Load Response.
FIGURE 2-60:
Dynamic Load Response.
2015-2016 Microchip Technology Inc.
DS20005415D-page 15
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
150 mA
IOUT
1 mA
150 mA
C
IN = COUT = 1 µF
tr1
IOUT
tr1
tf = 5 µs
tf = 5 µs
1 mA
OUT (AC Coupled, 1V/Div)
V
OUT (AC Coupled, 1V/Div)
V
VOUT
V
OUT
VR = 5.0V
VIN = 6.0V
V
R = 3.3V
VIN = 4.3V
OUT = 1 mA to 150 mA
IOUT = 1 mA to 150 mA
Time = 200 µs/Div
1 tr set time = 5 µs
I
Time = 200 µs/Div
1 tr set time = 5 µs
FIGURE 2-61:
Dynamic Load Response.
FIGURE 2-64:
Dynamic Load Response.
150 mA
150 mA
CIN = COUT = 1 µF
tr1
IOUT
tr1
tf = 5 µs
tf = 5 µs
IOUT
1 µA
1 mA
V
OUT (AC Coupled, 1V/Div)
VOUT (AC Coupled, 1V/Div)
VOUT
V
OUT
VR = 5.0V
VIN = 6.0V
V
V
R = 5.0V
IN = 6.0V
IOUT = 1 µA to 150 mA
Time = 200 µs/Div
IOUT = 1 mA to 150 mA
Dynamic Load Response.
CIN = 1 μF, COUT = 1 μF, IOUT = 50 mA
Time = 200 µs/Div
1 tr set time = 5 µs
1 tr set time = 5 µs
FIGURE 2-62:
Dynamic Load Response.
FIGURE 2-65:
100
10
150 mA
tr1
C
IN = COUT = 1 µF
tf = 5 µs
IOUT
1 µA
1
VR = 3.3V
VIN = 4.3V
VOUT (AC Coupled, 1V/Div)
0.1
0.01
VR = 5.0V
VIN = 6.0V
VR = 1.8V
VIN = 3.5V
V
OUT
VR = 5.0V
VIN = 6.0V
0.001
0.01
IOUT = 1 µA to 150 mA
Time = 200 µs/Div
0.1
1
10
100
1000
1 tr set time = 5 µs
Frequency (kHz)
FIGURE 2-63:
Dynamic Load Response.
FIGURE 2-66:
Output Noise vs. Frequency.
DS20005415D-page 16
2015-2016 Microchip Technology Inc.
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
IOUT = 150 mA
IOUT = 150 mA
IOUT = 10 mA
IOUT = 10 mA
VR = 1.2V
VR = 1.8V
VIN = 3.5V
V
IN = 3.5V
VINAC = 0.5Vpk-pk
V
INAC = 0.5Vpk-pk
C
C
IN = 0 µF
OUT = 0 µF
C
IN = 0 µF
COUT = 1 µF
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-67:
Power Supply Ripple
FIGURE 2-70:
Power Supply Ripple
Rejection vs. Frequency.
Rejection vs. Frequency.
0
0
-10
IOUT = 150 mA
-10
IOUT = 150 mA
-20
-20
-30
-40
-50
-60
-70
-80
-90
-100
-30
-40
-50
-60
-70
-80
IOUT = 10 mA
VR = 3.3V
IOUT = 10 mA
VR = 1.2V
VIN = 3.5V
VIN = 4.3V
VINAC = 0.5Vpk-pk
CIN = 0 µF
COUT = 0 µF
V
INAC = 0.5Vpk-pk
C
IN = 0 µF
-90
-100
COUT = 1 µF
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-68:
Power Supply Ripple
FIGURE 2-71:
Power Supply Ripple
Rejection vs. Frequency.
Rejection vs. Frequency.
0
0
IOUT = 150 mA
IOUT = 150 mA
-10
-10
-20
-30
-40
-50
-20
-30
-40
-50
-60
-70
-80
-90
-100
-60
-70
-80
-90
-100
IOUT = 10 mA
IOUT = 10 mA
VR = 3.3V
VR = 1.8V
VIN = 4.3V
VIN = 3.5V
VINAC = 0.5Vpk-pk
VINAC = 0.5Vpk-pk
CIN = 0 µF
COUT = 0 µF
C
IN = 0 µF
COUT = 1 µF
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-69:
Power Supply Ripple
FIGURE 2-72:
Power Supply Ripple
Rejection vs. Frequency.
Rejection vs. Frequency.
2015-2016 Microchip Technology Inc.
DS20005415D-page 17
MCP1711
Note: Unless otherwise indicated, VIN = 3.5V for VR < 2.5V or VIN = VR + 1V for VR 2.5V, IOUT = 1 mA,
CIN = COUT = 0 µF, VSHDN = VIN, TA = +25°C.
0
IOUT = 150 mA
-10
-20
-30
-40
-50
IOUT = 10 mA
-60
-70
-80
-90
VR = 5.0V
IN = 5.75V
V
VINAC = 0.5Vpk-pk
C
IN = 0 µF
C
OUT = 0 µF
-100
0.01
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-73:
Power Supply Ripple
Rejection vs. Frequency.
0
-10
IOUT = 150 mA
-20
-30
-40
-50
-60
-70
-80
-90
-100
IOUT = 10 mA
VR = 5.0V
IN = 5.75V
V
VINAC = 0.5Vpk-pk
C
C
IN = 0 µF
OUT = 1 µF
0.01
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-74:
Power Supply Ripple
Rejection vs. Frequency.
DS20005415D-page 18
2015-2016 Microchip Technology Inc.
MCP1711
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP1711
MCP1711
1X1 UQFN
Symbol
Description
Unregulated Input Supply Voltage
SOT-23
4
2
1
2
VIN
GND
SHDN
NC
Ground Terminal
3
3
Shutdown Input
—
1
4
Not Connected (SOT-23 only)
Regulated Voltage Output
Exposed Thermal Pad (1x1 UQFN only)
5
VOUT
EP
5
—
3.1
Unregulated Input Voltage (V )
3.3
Shutdown Input (SHDN)
IN
The SHDN input is used to turn the LDO output voltage
on and off.
Connect the VIN pin to the output of the unregulated
source voltage. Like all low dropout linear regulators,
low-source impedance is necessary for ensuring stable
operation of the LDO. The amount of capacitance
required to ensure low-source impedance will depend
on the proximity of the input source capacitors or bat-
tery type. For most applications, 0.1 µF of capacitance
will ensure stable operation of the LDO circuit. If the
output capacitor is used, the input capacitor should
have a capacitance value equal to or greater than the
output capacitor for performance applications.
When the SHDN input is at logic High level, the LDO
output voltage is enabled. When the SHDN pin is pulled
to a logic Low level, the LDO output voltage is disabled.
When the SHDN pin is pulled low, the VOUT pin is
pulled down to the ground level via, parallel to the feed-
back resistors (R1 and R2), and the COUT discharge
resistance (RDCHG).
The output voltage becomes unstable when the SHDN
pin is left floating.
The input capacitor will supply the load current during
transients and improve performance. For applications
that have low load currents, the input capacitance
requirement can be lowered.
3.4
Not Connected Pin (NC)
The SOT-23 package has
a pin that is not
connected.This pin should be either left floating or tied
to the ground plane.
The type of capacitor used may be ceramic, tantalum or
aluminum electrolytic. The low ESR characteristics of
the ceramic will yield better noise and Power Supply
Rejection Ratio (PSRR) performance at high
frequency.
3.5
Regulated Output Voltage (V
)
OUT
Connect the VOUT pin to the positive side of the load
and to the positive side of the output capacitor (if used).
The positive side of the output capacitor should be
physically located as close as possible to the LDO
VOUT pin. The current flowing out of this pin is equal to
the DC load current.
3.2
Ground Terminal (GND)
This is the regulator ground. Tie GND to the negative
side of the output capacitor (if used) and to the negative
side of the input capacitor. Only the LDO bias current
flows out of this pin, so there is no high current. The
LDO output regulation is referenced to this pin.
Minimize voltage drops between this pin and the
negative side of the load. If a PCB ground plane is not
used, minimize the length of the trace between the
GND pin and the ground line.
3.6
Exposed Thermal Pad (EP)
The 4-lead 1 x 1 UQFN package has an exposed metal
pad on the bottom of the package. The exposed metal
pad gives the device better thermal characteristics by
providing a good thermal path to either a PCB isolated
plane or a PCB ground plane. The exposed pad of the
package is not internally connected to GND.
2015-2016 Microchip Technology Inc.
DS20005415D-page 19
MCP1711
4.3
Output Capacitor
4.0
DEVICE OVERVIEW
The MCP1711 can provide a stable output voltage even
without an additional output capacitor due to its excel-
lent internal phase compensation, so that a minimum
output capacitance is not required. In order to improve
the load step response and PSRR, an output capacitor
can be added. A value in the range of 0.1 µF to 1.0 µF
is recommended for most applications. The capacitor
should be placed as close as possible to the VOUT pin
and the GND pin. The device is compatible with low
ESR ceramic capacitors. Ceramic materials like X7R
and X5R have low temperature coefficients and are
well within the acceptable ESR range required. A
typical 1 µF X7R 0805 capacitor has an ESR of 50 m.
The MCP1711 device is a 150 mA output current,
low-dropout (LDO) voltage regulator. The low dropout
voltage at high current makes it ideal for battery-pow-
ered applications. The input voltage ranges from 1.4V
to 6.0V. Unlike other high output current LDOs, the
MCP1711 typically draws only 600 nA quiescent cur-
rent and maximum 45 µA ground current at 150 mA
load. MCP1711 has a shutdown control input pin
(SHDN). The output voltage options are fixed.
4.1
LDO Output Voltage
The MCP1711 LDO has a fixed output voltage. The
output voltage range is 1.2V to 5.0V.
4.4
Input Capacitor
4.2
Output Current and Current
Limiting
Low-input source impedance is necessary for the LDO
output to operate properly. When operating from batter-
ies, or in applications with long lead length
(> 10 inches) between the input source and the LDO,
some input capacitance is recommended. A minimum
of 0.1 µF to 1.0 µF is recommended for most applica-
tions. For applications that have output step load
requirements, the input capacitance of the LDO is very
important. The input capacitance provides the LDO
with a good local low-impedance source to pull the
transient current from, so it responds quickly to the out-
put load step. For good step response performance,
the input capacitor should be of an equivalent or higher
value than the output capacitor. The capacitor should
be placed as close to the input of the LDO as is practi-
cal. Larger input capacitors will also help reduce any
high-frequency noise on the input and output of the
LDO as well as reduce the effects of any inductance
that exists between the input source voltage and the
input capacitance of the LDO.
The MCP1711 is tested and ensured to supply a
maximum of 150 mA of output current. The device can
provide a highly accurate output voltage even if the
output current is only 1 µA (very light load).
The MCP1711 also features a true output current fold-
back. If an excessive load, due to a low impedance
short-circuit condition at the output load, is detected,
the output current and voltage will fold back towards
80 mA and 0V, respectively. The output voltage and
current will resume normal levels when the excessive
load is removed. If the overload condition is a soft over-
load, the MCP1711 will supply higher load currents of
up to 270 mA typical. This allows for device usage in
applications that have pulsed load currents having an
average output current value of 150 mA or less.
DS20005415D-page 20
2015-2016 Microchip Technology Inc.
MCP1711
4.5
Shutdown Input (SHDN)
The MCP1711 internal circuitry can be shut down via
the signal from the SHDN pin. The SHDN input is an
active-low input signal that turns the LDO on and off.
The shutdown threshold is a fixed voltage level. The
minimum value of this shutdown threshold required to
turn the output on is 0.91V. The maximum value
required to turn the output off is 0.38V.
In Shutdown mode, the VOUT pin will be pulled down to
the ground level via, parallel to feedback resistors and
COUT discharge resistance RDCHG. In this state, the
application is protected from a glitch operation caused
by the electric charge at the output capacitor. More-
over, the discharge time of the output capacitor is set by
the COUT auto-discharge resistance (RDCHG) and the
output capacitor COUT. By setting the time constant of a
COUT auto-discharge resistance value (RDCHG) and the
output capacitor value (COUT) as = COUT x RDCHG
,
the output voltage after discharge via the internal
switch is calculated using Equation 4-1:
Note:
The RDCHG depends on VIN; when VIN is
high the RDCHG is low.
EQUATION 4-1:
VOUTt = VOUT e–t
or
t = lnVOUT VOUTt
Where:
VOUT(t) = The output voltage during discharging
VOUT = The initial output voltage
t = Discharge time
= COUT x RDCHG
4.6
Dropout Voltage
Dropout Voltage is defined as the input-to-output
voltage differential at which the output voltage drops
2% below the nominal value that was measured with a
VR + 1.0V differential applied. See Section 1.0
“Electrical Characteristics”, for minimum and
maximum voltage specifications.
2015-2016 Microchip Technology Inc.
DS20005415D-page 21
MCP1711
The thermal resistance from junction-to-ambient for the
5-Lead SOT-23 package is estimated at:
5.0
APPLICATION CIRCUITS AND
ISSUES
• 166.67°C with JEDEC 51-7 FR-4 board with
thermal vias and
5.1
Typical Application
• 400 °C/W when the device is not mounted on the
PCB, or is mounted on the one layer PCB with
minimal copper that doesn't provide any
additional cooling.
The MCP1711 is most commonly used as a voltage
regulator. Its low quiescent current and low dropout
voltage make it ideal for a multitude of battery-powered
applications.
EQUATION 5-2:
V
= 1.8V
OUT
MCP1711
TJMAX = PTOTAL RJA + TAMAX
VIN
I
= 50 mA
OUT
VIN VOUT
3.6V to 4.8V
CIN
COUT
Where:
TJ(MAX) = Maximum continuous junction
temperature
SHDN
GND
PTOTAL = Total device power dissipation
RJA = Thermal resistance from junction to
Application Input conditions
Package Type = 5-Lead SOT-23
ambient
TA(MAX) = Maximum ambient temperature
Input Voltage Range = 3.5V to 4.8V
VIN maximum = 4.8V
The maximum power dissipation capability for a
package can be calculated if given the
junction-to-ambient thermal resistance (RJA) and the
maximum ambient temperature for the application.
Equations 5-3 to 5-5 can be used to determine the
package maximum internal power dissipation:
VOUT typical = 1.8V
IOUT = 50 mA maximum
FIGURE 5-1:
Typical Application Circuit.
5.2
Power Calculations
EQUATION 5-3:
5.2.1
POWER DISSIPATION
TJMAX – TAMAX
PDMAX = -------------------------------------------------
RJA
The internal power dissipation of the MCP1711 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low that it is insignificant
(0.6 µA x VIN). To calculate the internal power
dissipation of the LDO use Equation 5-1:
Where:
PD(MAX) = Maximum device power dissipation
TJ(MAX) = Maximum continuous junction
temperature
EQUATION 5-1:
TA(MAX) = Maximum ambient temperature
PLDO = VIN(MAX – VOUT(MIN IOUTMAX
RJA = Thermal resistance from junction to
ambient
Where:
PLDO = LDO pass device internal power
dissipation
EQUATION 5-4:
VIN(MAX) = Maximum input voltage
TJRISE = PDMAX RJA
VOUT(MIN) = LDO minimum output voltage,
including the line and load
regulations
Where:
The maximum continuous operating junction
temperature specified for the MCP1711 is +125°C. To
estimate the internal junction temperature of the
MCP1711, the total internal power dissipation is
multiplied by the thermal resistance from
junction-to-ambient (RJA).
TJ(RISE) = Rise in device junction temperature
over the ambient temperature
PD(MAX) = Maximum device power dissipation
RJA = Thermal resistance from junction to
ambient
DS20005415D-page 22
2015-2016 Microchip Technology Inc.
MCP1711
EQUATION 5-5:
5.3.1.1
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The ther-
mal resistance from junction to ambient (RJA) is
derived from an EIA/JEDEC standard for measuring
thermal resistance for small surface mount packages.
TJ = TJRISE + TA
Where:
TJ = Junction temperature
TJ(RISE) = Rise in device junction temperature
over the ambient temperature
The EIA/JEDEC specification is JESD51-7, High
Effective Thermal Conductivity Test Board for Leaded
Surface Mount Packages. The standard describes the
test method and board specifications for measuring the
thermal resistance from junction to ambient. The actual
thermal resistance for a particular application can vary
depending on many factors, such as copper area and
thickness. Refer to AN792 – A Method to Determine
How Much Power a SOT-23 Can Dissipate in an
Application (DS00792), for more information regarding
this subject.
TA = Ambient temperature
5.3
Voltage Regulator
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
EXAMPLE 5-2:
5.3.1
POWER DISSIPATION EXAMPLE
TJ(RISE) = PTOTAL x RJA
TJRISE = 153.5 mW x 400.0°C/W
TJRISE = 61.4°C
EXAMPLE 5-1:
Package
POWER DISSIPATION
Package Type = SOT-23
Input Voltage
5.3.1.2
Junction Temperature Estimate
VIN = 3.5V to 4.8V
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated:
LDO Output Voltages and Currents
VOUT = 1.8V
I
OUT = 50 mA
EXAMPLE 5-3:
Maximum Ambient Temperature
A(MAX) = +40°C
TJ = TJRISE + TA(MAX)
T
TJ = 61.4°C + 40°C = 101.4°C
Internal Power Dissipation
Internal Power dissipation is the product of the LDO
output current times the voltage across the LDO
(VIN to VOUT).
5.3.1.3
Maximum Package
Power Dissipation Example
at +40°C Ambient Temperature
PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x
IOUT(MAX)
EXAMPLE 5-4:
VOUT(MIN) = 1.78V - 0.05V = 1.73V, where
1.78V is the minimum output
SOT-23 (400.0 °C/W = RJA
)
voltage due to accuracy, and
0.05V is the load regulation; due
to very small input voltage range,
the line regulation is neglected
PD(MAX) = (125°C - 40°C)/400°C/W
PD(MAX) = 212 mW
PLDO
PLDO
=
=
(4.8V - 1.73V) x 50 mA
153.5 mW
2015-2016 Microchip Technology Inc.
DS20005415D-page 23
MCP1711
5.4
Voltage Reference
The MCP1711 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
many microcontroller applications, the initial accuracy
of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
by the MCP1711 LDO. The low cost, low quiescent cur-
rent and small ceramic output capacitor are all
advantages when using the MCP1711 as a voltage
reference.
Ratio Metric Reference
PIC®
Microcontroller
MCP1711
0.6 µA Bias
V
V
VREF
OUT
IN
C
C
OUT
IN
0.1µF
0.1µF
GND
ADO
AD1
Bridge Sensor
Using the MCP1711 as a Voltage Reference.
FIGURE 5-2:
5.5
Pulsed Load Applications
For some applications, there are pulsed load current
events that may exceed the specified 150 mA
maximum specification of the MCP1711. The internal
current limit of the MCP1711 will prevent high
peak-load demands from causing nonrecoverable
damage. The 150 mA rating is a maximum average
continuous rating. As long as the average current does
not exceed 150 mA, higher pulsed load currents can be
applied to the MCP1711. The typical current limit for the
MCP1711 is 270 mA (TA = +25°C).
DS20005415D-page 24
2015-2016 Microchip Technology Inc.
MCP1711
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
4-Lead UQFN (1x1x0.6 mm)
Example
Device
Code
MCP1711T-12I/5X P2NN
MCP1711T-18I/5X P8NN
MCP1711T-20I/5X PANN
MCP1711T-22I/5X PCNN
MCP1711T-25I/5X PFNN
MCP1711T-30I/5X PNNN
MCP1711T-33I/5X PSNN
XX
NN
P2
56
5-Lead SOT-23
Example
Device
Code
MCP1711T-12I/OT 9A2xx
MCP1711T-18I/OT 9A8xx
MCP1711T-19I/OT 9A9xx
MCP1711T-22I/OT 9ACxx
MCP1711T-25I/OT 9AFxx
MCP1711T-30I/OT 9ANxx
MCP1711T-33I/OT 9ASxx
MCP1711T-50I/OT 9BAxx
9A802
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015-2016 Microchip Technology Inc.
DS20005415D-page 25
MCP1711
4-Lead Plastic Ultra Thin Quad Flatpack No-Leads (5X) - 1x1x0.6mm [UQFN]
(Formerly USPQ-4B04)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
3
(DATUM A)
(DATUM B)
2X
0.05 C
2X
1
2
TOP VIEW
0.05 C
A
C
SEATING
PLANE
SIDE VIEW
e
L3
D2
1
2
3
L2
L1
N
E2
3X CH
4X b
3X CH
BOTTOM VIEW
Microchip Technology Drawing C04-393B Sheet 1 of 2
DS20005415D-page 26
2015-2016 Microchip Technology Inc.
MCP1711
4-Lead Plastic Ultra Thin Quad Flatpack No-Leads (5X) - 1x1x0.6mm [UQFN]
(Formerly USPQ-4B04)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
N
4
e
0.65 BSC
-
1.00 BSC
0.48
1.00 BSC
0.48
0.25
0.25
0.32
0.07
0.18
Overall Height
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Terminal Width
Terminal Length
Terminal Length
-
A
E
E2
D
D2
b
L1
L2
L3
CH
-
0.60
0.53
0.43
0.43
0.20
0.20
0.27
0.02
-
0.53
0.30
0.30
0.37
0.12
-
Terminal Chamfer
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-393B Sheet 2 of 2
2015-2016 Microchip Technology Inc.
DS20005415D-page 27
MCP1711
4-Lead Plastic Ultra Thin Quad Flatpack No-Leads (5X) - 1x1x0.6mm [UQFN]
(Formerly USPQ-4B04)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
4X X1
3X X2
X4
4X Y3
4
3X Y1
Y2
2
1
Y4
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
E
0.65 BSC
0.25
0.18
0.48
0.40
0.47
0.22
0.48
X1
X2
X4
Y1
Y2
Y3
Y4
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2393B
DS20005415D-page 28
2015-2016 Microchip Technology Inc.
MCP1711
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2015-2016 Microchip Technology Inc.
DS20005415D-page 29
MCP1711
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005415D-page 30
2015-2016 Microchip Technology Inc.
MCP1711
APPENDIX A: REVISION HISTORY
Revision D (October 2016)
The following is the list of modifications:
• Added the 2.0V output voltage option (for the
UQFN package) and related information
throughout the document
• Minor typographical corrections.
Revision C (March 2016)
• Minor typographical corrections.
Revision B (October 2015)
The following is the list of modifications:
• Updated thermal resistances in Section 1.0,
Electrical Characteristics.
• Updated Section 2.0, Typical Performance
Curves with new load step screen-shots.
Revision A (June 2015)
• Original release of this document.
2015-2016 Microchip Technology Inc.
DS20005415D-page 31
MCP1711
NOTES:
DS20005415D-page 32
2015-2016 Microchip Technology Inc.
MCP1711
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
(1)
-X
X
/XX
[X]
PART NO.
Device
a)
b)
c)
d)
e)
MCP1711T-12I/OT:
Tape and Reel,
Output
Voltage
Package
Tape and Reel
Option
Temperature
Range
1.2V Output Voltage,
Industrial temperature,
5LD SOT-23
MCP1711T-18I/OT:
MCP1711T-19I/OT:
MCP1711T-22I/OT:
MCP1711T-25I/OT:
Tape and Reel,
Device:
MCP1711:
150 mA Ultra-Low Quiescent Current,
Capacitorless LDO Regulator
1.8V Output Voltage,
Industrial temperature,
5LD SOT-23
Output Voltage:
12
=
=
=
=
=
=
=
=
=
1.2V
Tape and Reel,
18
19
20
22
25
30
33
50
1.8V
1.9V
2.0V
2.2V
2.5V
3.0V
3.3V
5.0V
1.9V Output Voltage,
Industrial temperature,
5LD SOT-23
Tape and Reel,
2.2V Output Voltage,
Industrial temperature,
5LD SOT-23
Tape and Reel,
Temperature
Range:
I
=
-40°C to +85°C (Industrial)
2.5V Output Voltage,
Industrial temperature,
5LD SOT-23
Packages:
OT
5X
=
=
Plastic Small Outline Transistor, 5-Lead SOT-23
Plastic Ultra Thin Quad Flatpack No-Leads,
4-Lead 1x1 UQFN
f)
MCP1711T-30I/OT:
MCP1711T-33I/OT:
MCP1711T-50I/OT:
Tape and Reel,
3.0V Output Voltage,
Industrial temperature,
5LD SOT-23
g)
h)
Tape and Reel,
3.3V Output Voltage,
Industrial temperature,
5LD SOT-23
Tape and Reel,
5.0V Output Voltage,
Industrial temperature,
5LD SOT-23
a)
b)
c)
d)
e)
MCP1711T-12I/5X:
MCP1711T-18I/5X:
MCP1711T-20I/5X:
MCP1711T-22I/5X:
MCP1711T-25I/5X:
Tape and Reel,
1.2V Output Voltage,
Industrial temperature,
4LD UQFN
Tape and Reel,
1.8V Output Voltage,
Industrial temperature,
4LD UQFN
Tape and Reel,
2.0V Output Voltage,
Industrial temperature,
4LD UQFN
Tape and Reel,
2.2V Output Voltage,
Industrial temperature,
4LD UQFN
Tape and Reel,
2.5V Output Voltage,
Industrial temperature,
4LD UQFN
f)
MCP1711T-30I/5X:
Tape and Reel,
3.0V Output Voltage,
Industrial temperature,
4LD UQFN
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
2015-2016 Microchip Technology Inc.
DS20005415D-page 33
MCP1711
NOTES:
DS20005415D-page 34
2015-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-1009-6
== ISO/TS 16949 ==
2015-2016 Microchip Technology Inc.
DS20005415D-page 35
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Technical Support:
http://www.microchip.com/
support
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Tel: 86-592-2388138
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Denmark - Copenhagen
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Hong Kong
Tel: 852-2943-5100
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India - Bangalore
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Tel: 81-6-6152-7160
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Tel: 39-0331-742611
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Indianapolis
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Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
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Taiwan - Taipei
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New York, NY
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San Jose, CA
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China - Xian
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Fax: 86-29-8833-7256
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Tel: 66-2-694-1351
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Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
06/23/16
DS20005415D-page 36
2015-2016 Microchip Technology Inc.
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