MCP1799 [MICROCHIP]
80 mA High-Voltage Automotive LDO;
| 型号： | MCP1799 |
| 厂家： | 
MICROCHIP |
| 描述： | 80 mA High-Voltage Automotive LDO |
| 文件： | 总25页 (文件大小：1083K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP1799
80 mA High-Voltage Automotive LDO
Features
Description
• AEC-Q100 with Grade 0 and PPAP Capable
• Wide Input Voltage Range: 4.5V to 45V
- Under Voltage Lock Out: 2.8V typical
The MCP1799 is a high-voltage, low-dropout (LDO)
regulator, capable of generating 80 mA output current.
The input voltage range of 4.5V to 45V makes it ideal in
12V to 36V power rails and in high-voltage battery
packs.
• Extended Working Temperature Range: -40°C to
+150°C
The MCP1799 comes in two standard fixed output-
voltage versions: 3.3V and 5.0V. The regulator output
is stable with 1 µF ceramic capacitors. The device is
protected from short circuit events by the current limit
function and from over heating by means of thermal
shutdown protection.
• Standard Output Regulated Voltages (VR): 3.3V
and 5.0V
- Tolerance ±2%
• Low Quiescent Supply Current: 25 µA typical
• Output Current Capability: 80 mA typical
• Stable with 1 µF Ceramic Output Capacitor
• Short Circuit Protection
• Thermal Shutdown Protection:
- +180°C typical
The device itself has a low ground current of 45 µA
typical, while delivering maximum output current of 80
mA. Without load the device consumes 25 µA typical.
- Hysteresis: 22°C typical
• High PSRR:
- 70 dB @ 1 kHz typical
• Available in the Following Packages:
- 3-Lead SOT-23
- 3-Lead SOT-223
Applications
• Automotive Electronics
• Microcontroller Biasing
• Cordless Power Tools, Home Appliances
E-bikes, drones, etc.
• Smoke Detectors and Other Alarm Sensors
Typical Application
VBAT = 12 to 36V
LOAD
VOUT
VIN
CIN
1 µF
COUT
1 µF
MCP1799
GND
2019 Microchip Technology Inc.
DS20006248A-page 1
MCP1799
Package Types
3-Pin SOT-23
3-Pin SOT-223
GND
VIN
3
4
1
2
3
1
2
VIN
GNDVOUT
GND VOUT
2019 Microchip Technology Inc.
DS20006248A-page 2
MCP1799
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ..........................................................................................................................................................+66.0V
Maximum Voltage on VIN ......................................................................................................(GND - 0.3V) to (VIN+0.3V)
Maximum Voltage on VOUT- ............................................................................................................(GND - 0.3V) to 5.5V
Internal Power Dissipation .......................................................................... ............................Internally-Limited (Note 3)
Output Short Circuit Current..........................................................................................................................Continuous
Storage Temperature ............................................................................................................................. -55°C to +175°C
Maximum Junction Temperature, TJ ..................................................................................................................... +185°C
Operating Junction Temperature, TJ .......................................................................................................-40°C to +150°C
ESD protection on all pins:
HBM....................................................................................................................................................................... ≥ 4 kV
CDM...................................................................................................................................................................... ≥ 750V
MM.........................................................................................................................................................................≥ 400V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 6.2V(for VR =5V), VIN = 4.5V(for VR =3.3V), IOUT = 1 mA,
CIN = COUT = 1.0 µF ceramic (X7R), TA = +25°C. Boldface type applies for ambient temperatures TA of -40°C to
+150°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
4.5
6.2
—
—
45
45
VR = 3.3V, IOUT ≤ 80 mA
VR = 5V, IOUT ≤ 80 mA
Input Operating Voltage
VIN
V
Input Voltage to Turn On
Output
VUVLO_High
VUVLO_Low
—
—
2.8
2.6
—
—
rising VIN, VIN = 0 to VIN(MIN)
falling VIN, VIN = VIN(MIN) to 0
V
Input Voltage to Turn Off
Output
Output Voltage Range
Input Quiescent Current
Ground Current
VOUT
IQ
VR-2%
—
VR
25
45
VR+2%
45
(Note 1)
µA
µA
IOUT = 0A
IOUT = 80 mA
IGND
—
110
Maximum
Output Current
IOUT
80
—
—
mA
(Note 3)
VOUT
(VOUTxVIN)
/
4.5V ≤ VIN ≤ 45V for VR = 3.3V
6.2V ≤ VIN ≤ 45V for VR = 5V
Line Regulation
-0.05
±0.02
+0.05
%/V
Note 1: VR is the nominal regulator output voltage.
2: Load regulation is measured at a constant ambient temperature using a DC current source. Load
regulation is tested over a load range 1 mA to the maximum specified output current.
3: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). See Section
“Temperature Specifications” for more information. Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating.
Sustained junction temperatures above +150°C might impact the device reliability.
4: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2%
below its nominal value that was measured with an input voltage of VIN = VR + 1.2V.
5: PSRR measurement is carried out with CIN = 0 µF, VIN = 7V, IOUT = 50 mA, VINAC = 0.4Vpkpk
6: Not production tested.
2019 Microchip Technology Inc.
DS20006248A-page 3
MCP1799
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 6.2V(for VR =5V), VIN = 4.5V(for VR =3.3V), IOUT = 1 mA,
CIN = COUT = 1.0 µF ceramic (X7R), TA = +25°C. Boldface type applies for ambient temperatures TA of -40°C to
+150°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Load Regulation
I
OUT = 1 mA to 80 mA
VOUT/VOUT
IOUT_CL
-0.8
±0.4
150
+0.8
215
%
(Note 2)
Output Current Limit
—
mA
mA
mV
VIN = VIN(MIN), VOUT > 0.1V,
(Note 6)
Output Peak Current
Limit
IOUT_PCL
1700
300
2500
1100
Dropout Voltage
VDROPOUT
—
—
—
IOUT = 80 mA (Note 4)
AC Performance
f = 100 Hz to 100 kHz
Output Noise
eN
500
—
—
µVrms VIN = 12V, VR = 5V
OUT = 10 mA(Note 6)
I
70
70
35
f = 100 Hz (Note 5) (Note 6)
f = 1 kHz (Note 5) (Note 6)
f = 100 kHz (Note 5) (Note 6)
Power Supply Ripple
Rejection Ratio
PSRR
dB
Note 1: VR is the nominal regulator output voltage.
2: Load regulation is measured at a constant ambient temperature using a DC current source. Load
regulation is tested over a load range 1 mA to the maximum specified output current.
3: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air. (i.e., TA, TJ, JA). See Section
“Temperature Specifications” for more information. Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating.
Sustained junction temperatures above +150°C might impact the device reliability.
4: Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2%
below its nominal value that was measured with an input voltage of VIN = VR + 1.2V.
5: PSRR measurement is carried out with CIN = 0 µF, VIN = 7V, IOUT = 50 mA, VINAC = 0.4Vpkpk
6: Not production tested.
2019 Microchip Technology Inc.
DS20006248A-page 4
MCP1799
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Thermal Shutdown
TSD
180
22
°C
°C
Rising Temperature
Falling Temperature
Thermal Shutdown Hysteresis TSD
—
Thermal Package Resistances
Thermal Resistance,
SOT23-3LD
JA
JC
JA
JC
—
—
—
—
212
139
70
—
—
—
—
°C/W JEDEC® standard 4 layer FR4 board
with 1 oz. copper
Thermal Resistance,
SOT223-3LD
60
2019 Microchip Technology Inc.
DS20006248A-page 5
MCP1799
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, CIN = COUT = 1 µF ceramic (X7R), IOUT = 1 mA, TA = +25°C, VIN = VR + 1.2V.
FIGURE 2-1:
Voltage (VR = 3.3V).
Output Voltage vs. Input
Output Voltage vs. Input
Output Voltage vs. Output
FIGURE 2-4:
Current (VR = 5.0V).
Output Voltage vs. Output
FIGURE 2-2:
Voltage (VR = 5.0V).
FIGURE 2-5:
Current.
Dropout Voltage vs. Output
0.05
0.00
IOUT = 1 mA to 80 mA
VR = 3.3V
VIN = 4.5V
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-40 -15
10
35
60
85 110 135 160
Ambient Temperature (°C)
FIGURE 2-3:
FIGURE 2-6:
Load Regulation vs.
Current (VR = 3.3V).
Ambient Temperature (VR = 3.3V).
2019 Microchip Technology Inc.
DS20006248A-page 6
MCP1799
Note: Unless otherwise indicated, CIN = COUT = 1 µF ceramic (X7R), IOUT = 1 mA, TA = +25°C, VIN = VR + 1.2V.
0.05
IOUT = 1 mA to 80 mA
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
VR = 5.0V
VIN = 6.2V
-40 -15
10
35
60
85 110 135 160
Ambient Temperature (°C)
FIGURE 2-7:
Load Regulation vs.
FIGURE 2-10:
Quiescent Current vs.Input
Ambient Temperature (VR = 5.0V).
Voltage (VR = 3.3V).
FIGURE 2-8:
Line Regulation vs. Ambient
FIGURE 2-11:
Quiescent Current vs.Input
Temperature (VR = 3.3V).
Voltage (VR = 5.0V).
FIGURE 2-9:
Line Regulation vs. Ambient
FIGURE 2-12:
Ground Current vs. Output
Temperature (VR = 5.0V).
Current (VR = 3.3V).
2019 Microchip Technology Inc.
DS20006248A-page 7
MCP1799
Note: Unless otherwise indicated, CIN = COUT = 1 µF ceramic (X7R), IOUT = 1 mA, TA = +25°C, VIN = VR + 1.2V.
0
-10
VR = 3.3V
CIN = not used
COUT = 1 μF
-20
-30
-40
-50
-60
-70
-80
-90
-100
VIN = 7V + 0.4VPKPK
0.01
0.1
1
10
100
1000
Frequency (kHz)
FIGURE 2-13:
Ground Current vs. Output
FIGURE 2-16:
Power Supply Ripple
Current (VR = 5.0V).
Rejection Ratio vs. Frequency (VR = 3.3V).
0
-10
VR = 5.0V
100.000
10.000
1.000
CIN = not used
COUT = 1 μF
-20
-30
-40
-50
-60
-70
-80
-90
-100
VIN = 7V + 0.4VPKPK
0.100
0.010
0.001
VIN [V] = 12
VOUT [V] = 3.3
load [mA] = 10
COUT [μF] = 1
Output Noise 10 Hz - 100 kHz [μVrms] = 295.78
0.01
0.1
1
10
100
1000 10000
0.01
0.1
1
10
100
1000
Frequency (kHz)
Frequency (kHz)
FIGURE 2-14:
Noise vs. Frequency
FIGURE 2-17:
Power Supply Ripple
(VR = 3.3V).
Rejection Ratio vs. Frequency (VR = 5.0V).
100.000
10.000
1.000
0.100
VIN [V] = 12
VOUT [V] = 5
load [mA] = 10
COUT [μF] = 1
0.010
Output Noise 10 Hz - 100 kHz [μVrms] = 444.13
0.001
0.01
0.1
1
10
100
1000 10000
Frequency (kHz)
FIGURE 2-15:
Noise vs. Frequency
(VR = 5.0V).
2019 Microchip Technology Inc.
DS20006248A-page 8
MCP1799
Note: Unless otherwise indicated, CIN = COUT = 1 µF ceramic (X7R), IOUT = 1 mA, TA = +25°C, VIN = VR + 1.2V.
IOUT = 10 mA
VOUT
50 mV/div, BW = 20 MHz
3.3V DC Offset
VOUT
50 mV/div, BW = 20 MHz
5V DC Offset
Step from 6.2V to 14V
Step from 1 mA to 80 mA
Rise and Fall
Slope = 1V/µs
IOUT
50 mA/div
VIN
5V/div, BW = 20 MHz
6.2V DC Offset
40 µs/div
40 µs/div
FIGURE 2-18:
Load Step Response
FIGURE 2-21:
Line Step Response
(VR = 3.3V).
(VR = 5.0V).
I
OUT = 10 mA
14V
Rise Slope = 1V/µs
VOUT
50 mV/div, BW = 20 MHz
5V DC Offset
VIN
5V/div
Step from 1 mA to 80 mA
IOUT
50 mA/div
VOUT
1V/Div
200 µs/div
40 µs/div
FIGURE 2-22:
Start-up (VR = 3.3V).
FIGURE 2-19:
Load Step Response
(VR = 5.0V).
IOUT = 10 mA
IOUT = 10 mA
14V
Rise Slope = 1V/µs
VOUT
50 mV/div, BW = 20 MHz
3.3V DC Offset
VIN
5V/div
Step from 4.5V to 14V
Rise and Fall
Slope = 1V/µs
VOUT
VIN
1V/Div
5V/div, BW = 20 MHz
4.5V DC Offset
200 µs/div
40 µs/div
FIGURE 2-23:
Start-up (VR = 5.0V).
FIGURE 2-20:
Line Step Response
(VR = 3.3V).
2019 Microchip Technology Inc.
DS20006248A-page 9
MCP1799
Note: Unless otherwise indicated, CIN = COUT = 1 µF ceramic (X7R), IOUT = 1 mA, TA = +25°C, VIN = VR + 1.2V.
IOUT = 10 mA
IOUT = 10 mA
45V
45V
Rise Slope = 1V/µs
Rise Slope = 1V/µs
VIN
VIN
10V/div
10V/div
VOUT
VOUT
200 µs/div
200 µs/div
1V/div
1V/div
FIGURE 2-24:
Start-up (VR = 3.3V).
FIGURE 2-25:
Start-up (VR = 5V).
2019 Microchip Technology Inc.
DS20006248A-page 10
MCP1799
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
SOT 23-3
PIN FUNCTION TABLE
SOT 223-3
Symbol
Description
1
2
2
3
1
4
GND
VOUT
VIN
Ground
Regulated Output Voltage VR
Input Voltage Supply
3
—
TAB
Exposed Thermal Pad, connected internally to GND
3.1
Ground Pin (GND)
3.3
Input Voltage Supply Pin (V )
IN
For optimal noise and Power Supply Rejection Ratio
(PSRR) performance, the GND pin of the LDO should
be tied to an electrically “quiet” circuit ground. This will
ensure the LDO power supply rejection ratio and noise
device performance. The GND pin of the LDO conducts
only ground current, so a wide trace is not required. For
applications that have switching or noisy inputs, tie the
GND pin to the return of the output capacitor. Ground
planes help lower the inductance and as a result,
reduce the effect of fast current transients.
Connects the voltage source to VIN. If the input voltage
source is located several inches away from the LDO, or
the input source is a battery, it is recommended that an
input capacitor be used. A typical input capacitance
value of 1 µF to 10 µF should be sufficient for most
applications. The type of capacitor used is ceramic.
However, the low ESR characteristics of the ceramic
capacitor will yield better noise and PSRR performance
at high frequency.
3.2
Regulated Output Voltage Pin
(V
)
OUT
The VOUT pin is the regulated output voltage VR of the
LDO. A minimum output capacitance of 1 µF is
required for the LDO to ensure the stability in all the typ-
ical applications. The MCP1799 is stable with ceramic
capacitors. See Section 4.2, Output Capacitance
Requirements for output capacitor selection guidance.
2019 Microchip Technology Inc.
DS20006248A-page 11
MCP1799
4.0
4.1
DETAILED DESCRIPTION
Device Overview
The MCP1799 is an AEC-Q100 qualified LDO, capable
of delivering 80 mA of current, over the entire operating
temperature range. The part is stable with a minimum
1 µF output ceramic capacitor, has current limit
protection and extended working temperature range:
-40° to +150°. The device also features a PSRR of
70 dB typical for 100 Hz frequency.
FIGURE 4-1:
Simplified Functional Block Diagram.
4.3
4.2 Output Capacitance Requirements
Input Capacitance Requirements
The MCP1799 requires a minimum output capacitance
of 1 µF for output voltage stability. The output capacitor
should be located as close to the LDO output as it is
practical. The device is designed to work with low ESR
ceramic capacitors. Ceramic materials X8R\L or X7R
have low temperature coefficients and are well within
the acceptable ESR range required. A typical 1 µF X7R
0805 capacitor has an ESR of 50 m. It is
recommended to use an appropriate voltage rating
capacitor, and the derating of the capacitance as a
function of voltage and temperature needs to be taken
into account. For improved transitory behavior over the
entire temperature range, a 2.2 µF output capacitor is
recommended. The ceramic capacitor type should be
X7R or X8R/L because their dielectrics are rated for use
with temperatures between -40°C to +125° or -55°C to
+150°C, respectively.
Low input-source impedance is necessary for the LDO
output to operate properly. When operating from
batteries, or in applications with long lead length
(>10 inches) between the input source and the LDO,
adding input capacitance is recommended. A minimum
of 1 µF to 10 µF of capacitance is sufficient for most
applications. Given the high input voltage capability of
the MCP1799, of up to 45V DC, it is recommended to
use an appropriate voltage rating capacitor, and the de-
rating of the capacitance as a function of voltage and
temperature needs to be taken into account. The
ceramic capacitor type should be X7R or X8R\L
because their dielectrics are rated for use with
temperatures between -40°C to +125°C or -55°C to
+150°C, respectively.
2019 Microchip Technology Inc.
DS20006248A-page 12
MCP1799
Note that the VOUT pin can withstand a maximum of
-0.3VDC (see Absolute Maximum Ratings †). This
can be achieved by placing a Schottky diode with the
cathode to VOUT and anode to ground.
4.4
Circuit Protection
The MCP1799 features current limit protection during
an output short circuit event that occurs in normal oper-
ation.
Thermal shutdown functionality is present on the
device and adds to the protection features of the part.
Thermal shutdown gets triggered at typical value of
+180°C and has a typical hysteresis of 22°C.
The MCP1799 was tested using the AEC-Q100 test
set-up in Figure 4-2. The testing conditions require the
use of very high parasitic inductances on the input and
output. For cases like this, it is required to prevent the
output voltage going below ground with more than 1V.
Lshort = 5 µH
Lshort = 5 µH
VOUT
VIN
ON
CIN
COUT
Rshort = 10 mΩ
Rshort = 100 mΩ
MCP1799
Ideal
1 µF
1 µF
Supply
100V
50V
OFF
GND
GND
GND
FIGURE 4-2:
Short Circuit Test Set-Up.
4.5
Dropout Operation
4.6
Input UVLO
For VR = 5V, MCP1799 can be found operating in a
dropout condition (the minimum input voltage is 4.5V),
which can happen during a cold crank event, when the
supply voltage can drop down to 3V. It is preferred to
make sure that the part does not operate in dropout
during DC operation so that the AC performance is
maintained.
On the rising edge of the VIN input, the internal
architecture adds 550 µs delay before allowing the
regulator output to turn on. After this 550 µs delay, the
regulator starts charging the load capacitor as the
output rises from 0V to its regulated value. The
charging current amplitude will be limited by the short
circuit current value of the device.
The device has a dropout voltage of approximately
300 mV at full load and room temperature, but because
of the extended temperature range at +150°C, due to
increased leakage at hot, it reaches up to 1100 mV. For
a 5V output, the minimum supply voltage required in
order to have a regulated output, within specification, is
6.2V.
The UVLO block helps prevent false start-ups, during
the power-up sequence, until the input voltage reaches
a value of 2.8V. The minimum input voltage required for
normal operation is 4.5V.
4.7
Package and Device
Qualifications
The MCP1799 are AEC-Q100, grade 0 and PPAP
capable. The Grade qualification allows the
MCP1799 to be used within an extended temperature
range, from -40°C to +150°C.
IOUT = 10 mA
R = 5V
11V
0
V
VIN
2V/div
3V
VOUT
2V/div
200 ms/div
FIGURE 4-3:
Line Step from Dropout.
2019 Microchip Technology Inc.
DS20006248A-page 13
MCP1799
5.0
5.1
APPLICATION INFORMATION
Typical Application
The MCP1799 is used for applications that require
high input voltage and are prone to high transient
voltages on the input.
VBAT = 4.5V to 45V
µController
VOUT
VIN
CIN
1 µF
COUT
1 µF
MCP1799
ꢂꢁ0V DC
ꢀꢁV DC
GND
FIGURE 5-1:
Typical Application Circuit using a High Voltage Battery Pack.
The total power dissipated within the MCP1799 is the
sum of the power dissipated in the LDO pass device
5.2
Power Calculations
POWER DISSIPATION
and the P(IGND) term. Because of the CMOS
5.2.1
construction, the typical IGND for the MCP1799 is
typical 50 µA at full load. Operating at a maximum VIN
of 45V results in a power dissipation of 2.25 mW.
For most applications, this is small compared to the
LDO pass device power dissipation, and can be
neglected.
The internal power dissipation within the MCP1799 is a
function of input voltage, output voltage, output current
and quiescent current. Equation 5-1 can be used to
calculate the internal power dissipation for the LDO.
EQUATION 5-1:
The maximum continuous operating junction
temperature specified for the MCP1799 is +150°C. To
estimate the internal junction temperature of the
MCP1799, the total internal power dissipation is
multiplied by the thermal resistance from junction-to-
ambient (RJA) of the device. For example, the thermal
resistance from junction-to-ambient for the 3-Lead
SOT-223 package is estimated at 70°C/W.
PLDO = VINMAX – VOUTMIN IOUTMAX
Where:
PLDO = Internal power dissipation of the
LDO pass device
VIN(MAX) = Maximum input voltage
VOUT(MIN) = LDO minimum output voltage
IOUT(MAX) = Maximum output current
EQUATION 5-3:
In addition to the LDO pass element power dissipation,
there is power dissipation within the MCP1799 as a
result of quiescent or ground current. The power
dissipation, as a result of the ground current, can be
calculated by applying Equation 5-2:
TJMAX = PLDO JA + TAMAX
Where:
TJ(MAX) = Maximum continuous junction
temperature
PLDO = Total power dissipation of the device
EQUATION 5-2:
JA = Thermal resistance from junction-to-
PIGND = VINMAX IGND
ambient
Where:
TA(MAX) = Maximum ambient temperature
PI(GND) = Power dissipation due to the ground
current of the LDO
The maximum power dissipation capability for a pack-
age can be calculated given the junction-to-ambient
thermal resistance and the maximum ambient tem-
perature for the application. Equation 5-4 can be used
to determine the package maximum internal power
dissipation.
VIN(MAX) = Maximum input voltage
IGND = Current flowing into the GND pin
2019 Microchip Technology Inc.
DS20006248A-page 14
MCP1799
EQUATION 5-4:
IOUT = 50 mA
Maximum Ambient Temperature
A(MAX) = +60°C
Internal Power Dissipation
TJMAX – TAMAX
PDMAX = ---------------------------------------------------
JA
T
Where:
PD(MAX) = Maximum power dissipation of the
device
P
LDO(MAX) = (VIN(MAX) – VOUT(MIN)) x IOUT(MAX)
PLDO = (14.7 – 4.9) x 50 mA
TJ(MAX) = Maximum continuous junction
temperature
PLDO = 0.49 Watts
5.3.1.1
Device Junction Temperature Rise
TA(MAX) = Maximum ambient temperature
JA = Thermal resistance from
The internal junction temperature rise is a function of
internal power dissipation and of the thermal resistance
from junction-to-ambient for the application. The
thermal resistance from junction-to-ambient (JA) is
derived from EIA/JEDEC standards for measuring
thermal resistance. The EIA/JEDEC specification is
JESD51. The standard describes the test method and
board specifications for measuring the thermal
resistance from junction-to-ambient. The actual
thermal resistance for a particular application can vary
depending on many factors such as copper area and
thickness. Refer to Application Note AN792, “A Method
to Determine How Much Power a SOT23 Can
Dissipate in an Application” (DS00792), for more
information regarding this subject.
junction-to-ambient
EQUATION 5-5:
TJRISE = PDMAX JA
Where:
TJ(RISE) = Rise in the device junction
temperature over the ambient
temperature
PD(MAX) = Maximum power dissipation of the
device
JA = Thermal resistance from junction-to-
ambient
EXAMPLE 5-2:
EQUATION 5-6:
TJ(RISE) = PLDO(Max) x JA
TJ(RISE) = 0.49W x 70°C/W
TJ = TJRISE + TA
T
J(RISE) = 34.3°C
Where:
TJ = Junction temperature
5.3.1.2 Junction Temperature Estimate
TJ(RISE) = Rise in the device junction
temperature over the ambient
temperature
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below:
TA = Ambient temperature
EXAMPLE 5-3:
TJ = TJ(RISE) + TA(MAX)
TJ = 34.3°C + 60.0°C
TJ = 94.3°C
5.3
Typical Application Examples
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation as a result of ground current is small
enough to be neglected.
5.3.1.3
Maximum Package Power
Dissipation at +60°C Ambient
Temperature
5.3.1
POWER DISSIPATION EXAMPLE
EXAMPLE 5-1:
Package
EXAMPLE 5-4:
3Lead SOT223 (JA = 70°C/W):
Package Type = 3 Lead SOT223
Input Voltage
P
D(MAX) = (150°C - 60°C)/70°C/W
D(MAX) = 1.28W
P
V
IN = 14V ± 5%
LDO Output Voltage and Current
OUT = 5V
V
2019 Microchip Technology Inc.
DS20006248A-page 15
MCP1799
6.0
BATTERY PACK APPLICATION
The features of the MCP1799 make it a candidate for
use in smart battery packs. The high input voltage
range of up to 45V and the transient voltage capability
makes it ideal for powering low power microcontrollers
used for monitoring battery health.
Power
Disconnect
Current
Sense
+VBAT
VBAT_1
VBAT_2
µController
MCP1799
VBAT_n-1
VBAT_n
Voltage
Sense
Network
-VBAT
FIGURE 6-1:
Smart Battery Pack Application Example.
2019 Microchip Technology Inc.
DS20006248A-page 16
MCP1799
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
3-Lead SOT-23
Example
Part Number
Code
330256
MCP1799T-3302H/TT
MCP1799T-5002H/TT
330256
500256
;;;111
3-Lead SOT-223
Example
;;;;;;;
;;;<<::
MCP1799
3301932
256
111
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
e
3
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2019 Microchip Technology Inc.
DS20006248A-page 17
MCP1799
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2019 Microchip Technology Inc.
DS20006248A-page 18
MCP1799
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2019 Microchip Technology Inc.
DS20006248A-page 19
MCP1799
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2019 Microchip Technology Inc.
DS20006248A-page 20
MCP1799
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2019 Microchip Technology Inc.
DS20006248A-page 21
MCP1799
APPENDIX A: REVISION HISTORY
Revision A (September 2019)
• Initial release of this document.
2019 Microchip Technology Inc.
DS20006248A-page 22
MCP1799
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
(1)
PART NO.
Device
X
-XX
X
X/
XX
X
a)
b)
c)
d)
e)
f)
MCP1799T-3302H/TT: Tape and Reel,
3.3V output voltage,
Automotive temperature,
3-LD SOT-23 package
Tape and Output Featured
Reel
Temp. Package
Tolerance
Voltage
Code
MCP1799T-5002H/TT: Tape and Reel,
5.0V output voltage,
Automotive temperature,
3-LD SOT-23 package
Device:
MCP1799: High-voltage, low-dropout
LDO Regulator, Tube
MCP1799T: High-voltage, low-dropout
MCP1799-3302H/DB: Tube,
LDO Regulator, Tape and Reel
3.3V output voltage,
Automotive temperature,
3-LD SOT-223 package
Standard Output
Voltages:
33
50
=
=
3.3V
5.0V
MCP1799-5002H/DB: Tube,
5.0V output voltage,
Automotive temperature,
3-LD SOT-223 package
Temperature:
Feature Code:
Tolerance:
H
0
2
=
=
=
-40C to +150C
Fixed
MCP1799T-3302H/DB: Tape and Reel,
3.3V output voltage,
Automotive temperature,
3-LD SOT-223 package
MCP1799T-5002H/DB: Tape and Reel,
Standard Accuracy
5.0V output voltage,
Automotive temperature,
3-LD SOT-223 package
Package Type:
TT
=
=
3-Lead Plastic Small Outline Transistor, SOT-23
3-Lead Plastic Small Outline Transistor, SOT-223
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DB
2019 Microchip Technology Inc.
DS20006248A-page 23
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4995-9
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 Microchip Technology Inc.
DS20006248A-page 24
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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Corporate Office
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2019 Microchip Technology Inc.
DS20006248A-page 25
05/14/19
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