MCP1802-1802I/OT_技术文档

MCP1802

300 mA, High PSRR, Low Quiescent Current LDO

Features

Description

• 300 mA Maximum Output Current

• Low Drop Out Voltage, 200 mV typical @ 100 mA

• 25 µA Typical Quiescent Current

• 0.01 µA Typical Shutdown Current

• Input Operating Voltage Range: 2.0V to10.0V

• Standard Output Voltage Options:

- (0.9V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V, 6.0V)

• Output voltage accuracy:

The MCP1802 is a family of CMOS low dropout (LDO)

voltage regulators that can deliver up to 300 mA of

current while consuming only 25 µA of quiescent

current (typical). The input operating range is specified

from 2.0V to 10.0V, making it an ideal choice for two to

six primary cell battery-powered applications, 9V alka-

line and one or two cell Li-Ion-powered applications.

The MCP1802 is capable of delivering 100 mA with

only 200 mV (typical) of input to output voltage differen-

tial (V_OUT= 3.0V). The output voltage tolerance of the

MCP1802 at +25°C is typically ±0.4% with a maximum

of ±2%. Line regulation is ±0.01% typical at +25°C.

- ±2% (V_R> 1.5V), ±30 mV (V_R≤ 1.5V)

• Stable with Ceramic output capacitors

• Current Limit Protection

The LDO output is stable with a minimum of 1 µF of

output capacitance. Ceramic, tantalum or aluminum

electrolytic capacitors can all be used for input and

output. Overcurrent limit with current foldback provides

short-circuit protection. A shutdown (SHDN) function

allows the output to be enabled or disabled. When

disabled, the MCP1802 draws only 0.01 µA of current

(typical).

• Shutdown pin

• High PSRR: 70 dB typical @ 10 kHz

Applications

• Battery-powered Devices

• Battery-powered Alarm Circuits

• Smoke Detectors

The MCP1802 is available in a SOT-23-5 package.

• CO²Detectors

• Pagers and Cellular Phones

• Wireless Communications Equipment

• Smart Battery Packs

Package Types

SOT-23-5

• Low Quiescent Current Voltage Reference

• PDAs

V_OUT

5

NC

4

• Digital Cameras

• Microcontroller Power

• Solar-Powered Instruments

• Consumer Products

• Battery Powered Data Loggers

1

2

3

V_INV_SSSHDN

Related Literature

• AN765, “Using Microchip’s Micropower LDOs”,

DS00765, Microchip Technology Inc., 2002

• AN766, “Pin-Compatible CMOS Upgrades to

BiPolar LDOs”, DS00766,

Microchip Technology Inc., 2002

• AN792, “A Method to Determine How Much

Power a SOT23 Can Dissipate in an Application”,

DS00792, Microchip Technology Inc., 2001

DS22053B-page 1

MCP1802

Functional Block Diagram

MCP1802

+V_IN

V_OUT

V_IN

+V_IN

SHDN

Shutdown

Control

Voltage

Reference

-

+

Current Limiter

Error Amplifier

GND

Typical Application Circuit

MCP1802

V_IN

V_OUT

5

1

V_INV_OUT

SOT-23-5

3.3V @ 40 mA

mA

C_OUT

1 µF Ceramic

2

3

GND

+

9V

Battery

4

SHDN NC

C_IN

1 µF

Ceramic

DS22053B-page 2

MCP1802

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and functional operation of

the device at those or any other conditions above those

indicated in the operational listings of this specification

is not implied. Exposure to maximum rating conditions

for extended periods may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage ................................................................. +12V

Output Current (Continuous) ..................... P_D/(V_IN-V_OUT)mA

Output Current (Peak) ............................................... 500 mA

Output Voltage ............................... (V_SS-0.3V) to (V_IN+0.3V)

SHDN Voltage..................................(V_SS-0.3V) to (V_IN+0.3V)

Continuous Power Dissipation:

5-Pin SOT-23-5 .................................................... 250 mW

ELECTRICAL CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all limits are established for V_IN= V_R+ 1.0V, Note 1, C_OUT= 1 µF (X7R),

_IN= 1 µF (X7R), V_SHDN= V_IN, T_A= +25°C

C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input / Output Characteristics

Input Operating Voltage

Input Quiescent Current

Shutdown Current

V_IN

I_q

2.0

—

25

10.0

50

V

Note 1

µA

mA

I_L= 0 mA

SHDN = 0V

I_SHDN

I_{OUT_mA}

—

0.01

0.10

Maximum Output Current

300

260

—

V_R≥ 2V, V_IN= V_R+1.0V

1.5V ≤ V_R< 2.0V, V_IN=3.0V

1.0V ≤ V_R< 1.5V, V_IN= V_R+1.5V

0.9V ≤ V_R< 1.0V, V_IN=2.5V

Current Limiter

I_LIMIT

I_{OUT_SC}

V_OUT

—

380

50

—

mA

V

if V_R≤ 1.75V, then V_IN= V_R+ 2.0V

V_R≥ 1.45V, I_OUT= 30 mA, Note 2

V_R< 1.45V, I_OUT= 30 mA

Output Short Circuit Current

Output Voltage Regulation

V_R-2.0%

V_R-30 mV

—

V_R

V_R+2.0%

V_R+30 mV

—

V_R

V_OUTTemperature

Coefficient

TCV_OUT

100

ppm/°C

%/V

I_OUT= 30 mA, -40°C ≤ T_A≤ +85°C,

Note 3

Line Regulation

ΔV_OUT

/

-0.2

±0.01

+0.2

(V_R+ 1V) ≤ V_IN≤ 10V, Note 1

V_R> 1.75V, I_OUT= 30 mA

V_R≤ 1.75V, I_OUT= 10 mA

(V_OUTXΔV_IN

)

Load Regulation

ΔV_OUT/V_OUT

—

15

—

50

100

mV

I_L= 1.0 mA to 100 mA, Note 4

I_L= 1.0 mA to 300 mA,

Dropout Voltage

Note 1, Note 5

V_DROPOUT

—

60

200

80

90

I_L= 30 mA, 3.1V ≤ V_R≤ 6.0V

I_L= 100 mA, 3.1V ≤ V_R≤ 6.0V

I_L= 30 mA, 2.0V ≤ V_R< 3.1V

I_L= 100 mA, 2.0V ≤ V_R< 3.1V

I_L= 30 mA, V_R< 2.0V

250

120

350

240

2.07 - V_R2.10 - V_R

2.23 - V_R2.33 - V_R

V

I_L= 100 mA, V_R< 2.0V

Power Supply Ripple

Rejection Ratio

PSRR

e_N

70

—

dB

f = 10 kHz, I_L= 50 mA, V_INAC= 1V

pk-pk, C_IN= 0 µF,

if V_R< 1.5V, then V_IN= 2.5V

Output Noise

—

0.46

—

μV/√Hz

I_OUT= 100 mA, f = 1 kHz, C_OUT

=

1 μF (X7R Ceramic), V_OUT= 2.5V

Note 1: The minimum V_INmust meet two conditions: V_IN≥ 2.0V and V_IN≥ (V_R+ 1.0V).

2: V_Ris the nominal regulator output voltage. For example: V_R= 1.8V, 2.5V, 3.0V, 3.3V, or 5.0V.

The input voltage V_IN= V_R+ 1.0V or Vi_IN= 2.0V (whichever is greater); I_OUT= 100 µA.

3: TCV_OUT= (V_OUT-HIGH- V_OUT-LOW) *10⁶/ (V_R* ΔTemperature), V_OUT-HIGH= highest voltage measured over the temper-

ature range. V_OUT-LOW= lowest voltage measured over the temperature range.

4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCV_OUT

.

5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of V_R+ 1.0V or 2.0V, whichever is greater.

DS22053B-page 3

MCP1802

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise specified, all limits are established for V_IN= V_R+ 1.0V, Note 1, C_OUT= 1 µF (X7R),

C_IN= 1 µF (X7R), V_SHDN= V_IN, T_A= +25°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Shutdown Input

Logic High Input

Logic Low Input

V_SHDN-HIGH

V_SHDN-LOW

1.6

—

V

—

0.25

Note 1: The minimum V_INmust meet two conditions: V_IN≥ 2.0V and V_IN≥ (V_R+ 1.0V).

2: _Ris the nominal regulator output voltage. For example: V_R= 1.8V, 2.5V, 3.0V, 3.3V, or 5.0V.

The input voltage V_IN= V_R+ 1.0V or Vi_IN= 2.0V (whichever is greater); I_OUT= 100 µA.

V

3: TCV_OUT= (V_OUT-HIGH- V_OUT-LOW) *10⁶/ (V_R* ΔTemperature), V_OUT-HIGH= highest voltage measured over the temper-

ature range. V_OUT-LOW= lowest voltage measured over the temperature range.

4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCV_OUT

.

5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of V_R+ 1.0V or 2.0V, whichever is greater.

TEMPERATURE SPECIFICATIONS

Parameters

Temperature Ranges

Sym

Min

Typ

Max

Units

Conditions

Operating Temperature Range

Storage Temperature Range

Thermal Package Resistance

Thermal Resistance, SOT-23-5

T_A

-40

-55

+85

°C

Tstg

+125

θ_JA

θ_JC

—

256

81

—

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board

°C/W

DS22053B-page 4

MCP1802

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated: V_R= 3.3V, C_OUT= 1 µF Ceramic (X7R), C_IN= 1 µF Ceramic (X7R), I_L= 100 µA,

T_A= +25°C, V_IN= V_R+ 1.0V, SOT-23-5.

Note: Junction Temperature (T ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature.

J

The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.

26.00

25.00

24.00

23.00

22.00

21.00

20.00

80

70

60

50

40

30

20

10

0

V_OUT= 0.9V

_OUT= 0 µA

V_OUT= 0.9V

_IN= 2.0V

I

V

+25°C

+90°C

0°C

-45°C

2

4

6

8

10

0

30

60

90

120

150

90

Input Voltage (V)

Load Current (mA)

FIGURE 2-1: Quiescent Current vs. Input

FIGURE 2-4: Ground Current vs Load

Current.

Voltage.

29.00

90

80

70

V_OUT= 3.3V

I_OUT= 0 µA

28.00

27.00

26.00

25.00

24.00

+90°C

V_OUT= 3.3V

_IN= 4.3V

60

V

V_OUT= 6.0V

_IN= 7.0V

50

40

30

20

V

-45°C

+25°C

0°C

4

5

6

7

8

9

10

0

25

50

75

100

125

Input Voltage (V)

Load Current (mA)

FIGURE 2-2: Quiescent Current vs. Input

FIGURE 2-5: Ground Current vs Load

Current.

Voltage.

31.00

30.00

V_OUT= 6.0V

_OUT= 0 µA

V_OUT= 6.0V

_IN= 7.0V

I_OUT= 0mA

I

V

30.00

29.00

28.00

27.00

26.00

25.00

28.00

26.00

24.00

22.00

20.00

+90°C

+25°C

-45°C

V_OUT= 0.9V

_IN= 2.0V

V

V_OUT= 3.3V

_IN= 4.3V

0°C

V

7

7.5

8

8.5

9

9.5

10

-45

-22.5

0

22.5

45

67.5

Input Voltage (V)

Junction Temperature (°C)

FIGURE 2-3: Quiescent Current vs. Input

FIGURE 2-6: Quiescent Current vs. Junction

Voltage.

Temperature.

DS22053B-page 5

MCP1802

Note: Unless otherwise indicated: V_R= 3.3V, C_OUT= 1 µF Ceramic (X7R), C_IN= 1 µF Ceramic (X7R), I_L= 100 µA,

T_A= +25°C, V_IN= V_R+ 1.0V, SOT-23-5.

0.925

0.920

0.915

0.910

0.905

0.900

0.895

0.920

0.915

0.910

0.905

0.900

0.895

0.890

0.885

0.880

V_OUT= 0.9V

I_LOAD= 1 mA

0°C

V_IN= 2.0V

_OUT= 0.9V

V

+25

-45°C

0°C

+25°C

-45°C

+90°C

2

3

4

5

6

7

8

9

10

0

25

50

75

100

125

150

Input Voltage (V)

Load Current (mA)

FIGURE 2-7: Output Voltage vs. Input

FIGURE 2-10: Output Voltage vs. Load

Voltage.

Current.

3.34

V_OUT= 3.3V

I_LOAD= 1 mA

V_IN= 4.3V

V_OUT= 3.3V

0°C

3.33

3.32

3.31

3.30

3.29

3.28

3.27

3.26

3.25

3.33

3.32

3.31

3.30

3.29

3.28

3.27

3.26

-45°C

+25°C

0°C

+25°C

-45°C

+90°C

4

5

6

7

8

9

10

0

25

50

75

100

125

150

Input Voltage (V)

Load Current (mA)

FIGURE 2-8: Output Voltage vs. Input

FIGURE 2-11: Output Voltage vs. Load

Voltage.

Current.

6.06

V_IN= 7.0V

V_OUT= 6.0V

I_LOAD= 1 mA

6.04

6.02

6.00

5.98

5.96

5.94

5.92

6.04

6.02

6.00

5.98

5.96

5.94

+25°C

0°C

-45°C

+25°C

+90°C

-45°C

+90°C

7

7.5

8

8.5

9

9.5

10

0

25

50

75

100

125

150

Input Voltage (V)

Load Current (mA)

FIGURE 2-9: Output Voltage vs. Input

FIGURE 2-12: Output Voltage vs. Load

Voltage.

Current.

DS22053B-page 6

MCP1802

Note: Unless otherwise indicated: V_R= 3.3V, C_OUT= 1 µF Ceramic (X7R), C_IN= 1 µF Ceramic (X7R), I_L= 100 µA,

T_A= +25°C, V_IN= V_R+ 1.0V, SOT-23-5.

0.30

V_OUT= 3.3V

0.25

0.20

0.15

0.10

0.05

0.00

+90°C

+25°C

-45°C

+0°C

0

25

50

75

100

125

150

Load Current (mA)

FIGURE 2-13: Dropout Voltage vs. Load

FIGURE 2-16: Dynamic Line Response.

Current.

160

0.30

V_OUT= 3.3V

_OUT< 0.1Ω

V_OUT= 6.0V

140

120

100

80

R

0.25

+90°C

-45°C

0.20

0.15

0.10

0.05

0.00

+25°C

60

+0°C

40

20

0

1

2

3

4

5

6

7

8

9

10

0

25

50

75

100

125

150

Input Voltage (V)

Load Current (mA)

FIGURE 2-17: Short Circuit Current vs. Input

FIGURE 2-14: Dropout Voltage vs. Load

Voltage.

Current.

-1.40

V_OUT= 0.9V

I

_OUT= 0.1 mA to 150 mA

-1.50

-1.60

-1.70

-1.80

-1.90

V_IN= 10V

V_IN= 8V

V_IN= 6V

V_IN= 4V

V_IN= 2V

-45

-22.5

0

22.5

45

67.5

90

Temperature (°C)

FIGURE 2-18: Load Regulation vs.

FIGURE 2-15: Dynamic Line Response.

Temperature.

DS22053B-page 7

MCP1802

Note: Unless otherwise indicated: V_R= 3.3V, C_OUT= 1 µF Ceramic (X7R), C_IN= 1 µF Ceramic (X7R), I_L= 100 µA,

T_A= +25°C, V_IN= V_R+ 1.0V, SOT-23-5.

0.00

-0.10

-0.20

-0.30

-0.40

-0.50

-0.60

0.020

0.015

0.010

0.005

0.000

-0.005

-0.010

V_OUT= 3.3V

V_IN= 4.3V to 10V

V_OUT= 3.3V

_OUT= 0.1 mA to 150 mA

150 mA

I

100 mA

50 mA

V_IN= 8V

10 mA

V_IN= 6V

V_IN= 10V

V_IN= 4.3V

1 mA

-45

-22.5

0

22.5

45

67.5

90

-45

-22.5

0

22.5

45

67.5

90

Temperature (°C)

FIGURE 2-19: Load Regulation vs.

FIGURE 2-22: Line Regulation vs.

Temperature.

0.10

0.020

150 mA

0.015

V_OUT= 6.0V

I_OUT= 0.1 mA to 150 mA

V_OUT= 6.0V

V_IN= 7.0V to 10.0V

100 mA 50 mA

0.00

-0.10

-0.20

-0.30

0.010

0.005

0.000

-0.005

-0.010

-0.015

V_IN= 8V

V_IN= 9V

V_IN= 10V

V_IN= 7V

1 mA

10 mA

-45

-22.5

0

22.5

45

67.5

90

-45

-22.5

0

22.5

45

67.5

90

Temperature (°C)

FIGURE 2-20: Load Regulation vs.

FIGURE 2-23: Line Regulation vs.

Temperature.

0.020

0

V_IN= 2.0 to 10.0V

V_OUT= 0.9V

V_R=3.3V

-10

0.015

0.010

0.005

0.000

-0.005

-0.010

V

_IN=4.3V

_INAC= 100 mV p-p

150 mA

-20

-30

-40

-50

-60

-70

-80

-90

100 mA

C

_IN=0 μF

50 mA

10 mA

I

_OUT=100 µA

1 mA

-45

-22.5

0

22.5

45

67.5

90

0.01

0.1

1

10

100

1000

Temperature (°C)

Frequency (KHz)

FIGURE 2-21: Line Regulation vs.

FIGURE 2-24: PSRR vs. Frequency.

Temperature.

DS22053B-page 8

MCP1802

Note: Unless otherwise indicated: V_R= 3.3V, C_OUT= 1 µF Ceramic (X7R), C_IN= 1 µF Ceramic (X7R), I_L= 100 µA,

T_A= +25°C, V_IN= V_R+ 1.0V, SOT-23-5.

0

V_R= 6.0V

-10

V_IN= 7.0V

V

C

_INAC= 100 mV p-p

_IN= 0 μF

I_OUT= 100 µA

-20

-30

-40

-50

-60

-70

-80

-90

0.01

0.1

1

10

100

1000

Frequency (KHz)

FIGURE 2-25: PSRR vs Frequency.

FIGURE 2-28: Dynamic Load Response.

FIGURE 2-26: Power Up Timing.

FIGURE 2-29: Power Up Timing From SHDN.

10

5.0V

I_OUT= 100 mA

1

0.1

0.01

2.5V

0.001

0.01

0.1

1

10

100

1000

Frequency (KHz)

FIGURE 2-27: Dynamic Load Response.

FIGURE 2-30: Noise Graph.

DS22053B-page 9

MCP1802

NOTES:

DS22053B-page 10

MCP1802

3.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLE

Name

Pin No.

SOT-23-5

Function

1

2

3

4

5

V_IN

GND

SHDN

NC

Unregulated Supply Voltage

Ground Terminal

Shutdown

No connection

V_OUT

Regulated Voltage Output

3.1

Unregulated Input Voltage (V_IN)

3.3

Shutdown Input (SHDN)

Connect V_INto the input unregulated source voltage.

Like all low dropout linear regulators, low source

impedance is necessary for the stable operation of the

LDO. The amount of capacitance required to ensure

low source impedance will depend on the proximity of

the input source capacitors or battery type. For most

applications, 0.1 µF of capacitance will ensure stable

operation of the LDO circuit. The type of capacitor

used can be ceramic, tantalum or aluminum electro-

lytic. The low ESR characteristics of the ceramic will

yield better noise and PSRR performance at high-

frequency.

The SHDN input is used to turn the LDO output voltage

on and off. When the SHDN input is at a logic-high

level, the LDO output voltage is enabled. When the

SHDN input is pulled to a logic-low level, the LDO

output voltage is disabled and the LDO enters a low

quiescent current shutdown state where the typical qui-

escent current is 0.01 µA. The SHDN pin does not

have an internal pullup or pulldown resistor. The the

SHDN pin must be connected to either V_INor GND to

prevent the device from becoming unstable.

3.4

Regulated Output Voltage (V_OUT)

Connect V_OUTto the positive side of the load and the

positive terminal of the output capacitor. The positive

side of the output capacitor should be physically

located as close to the LDO V_OUTpin as is practical.

The current flowing out of this pin is equal to the DC

load current.

3.2

Ground Terminal (GND)

Regulator ground. Tie GND to the negative side of the

output and the negative side of the input capacitor.

Only the LDO bias current (25 µA typical) flows out of

this pin; there is no high current. The LDO output

regulation is referenced to this pin. Minimize voltage

drops between this pin and the negative side of the

load.

DS22053B-page 11

MCP1802

NOTES:

DS22053B-page 12

MCP1802

4.0

4.1

DETAILED DESCRIPTION

Output Regulation

4.4

Output Capacitor

A portion of the LDO output voltage is fed back to the

internal error amplifier and compared with the precision

internal bandgap reference. The error amplifier output

will adjust the amount of current that flows through the

P-Channel pass transistor, thus regulating the output

voltage to the desired value. Any changes in input

voltage or output current will cause the error amplifier

to respond and adjust the output voltage to the target

voltage (refer to Figure 4-1).

The MCP1802 requires a minimum output capacitance

of 1 µF for output voltage stability. Ceramic capacitors

are recommended because of their size, cost and

environmental robustness qualities.

Aluminum-electrolytic and tantalum capacitors can be

used on the LDO output as well. The output capacitor

should be located as close to the LDO output as is

practical. Ceramic materials X7R and X5R have low

temperature coefficients and are well within the

acceptable ESR range required. A typical 1 µF X7R

0805 capacitor has an ESR of 50 milli-ohms.

4.2

Overcurrent

Larger LDO output capacitors can be used with the

MCP1802 to improve dynamic performance and power

supply ripple rejection performance. Aluminum-elec-

trolytic capacitors are not recommended for low

temperature applications of ≤ 25°C.

The MCP1802 internal circuitry monitors the amount of

current flowing through the P-Channel pass transistor.

In the event that the load current reaches the current

limiter level of 380 mA (typical), the current limiter

circuit will operate and the output voltage will drop. As

the output voltage drops, the internal current foldback

circuit will further reduce the output voltage causing the

output current to decrease. When the output is

shorted, a typical output current of 50 mA flows.

4.5

Input Capacitor

Low input source impedance is necessary for the LDO

output to operate properly. When operating from

batteries, or in applications with long lead length

(> 10 inches) between the input source and the LDO,

some input capacitance is recommended. A minimum

of 0.1 µF to 4.7 µF is recommended for most

applications.

4.3

Shutdown

The SHDN input is used to turn the LDO output voltage

on and off. When the SHDN input is at a logic-high

level, the LDO output voltage is enabled. When the

SHDN input is pulled to a logic-low level, the LDO

output voltage is disabled and the LDO enters a low

quiescent current shutdown state where the typical

quiescent current is 0.01 µA. The SHDN pin does not

have an internal pullup or pulldown resistor. Therefore

the SHDN pin must be pulled either high or low to

prevent the device from becoming unstable. The

internal device current will increase when the device is

operational and current flows through the pullup or pull-

down resistor to the SHDN pin internal logic. The

SHDN pin internal logic is equivalent to an inverter

input.

For applications that have output step load

requirements, the input capacitance of the LDO is very

important. The input capacitance provides the LDO

with a good local low-impedance source to pull the

transient currents from in order to respond quickly to

the output load step. For good step response

performance, the input capacitor should be of

equivalent (or higher) value than the output capacitor.

The capacitor should be placed as close to the input of

the LDO as is practical. Larger input capacitors will also

help reduce any high-frequency noise on the input and

output of the LDO and reduce the effects of any

inductance that exists between the input source

voltage and the input capacitance of the LDO.

DS22053B-page 13

MCP1802

+V_IN

V_OUT

V_IN

+V_IN

SHDN

Shutdown

Control

Voltage

Reference

-

+

Current Limiter

Error Amplifier

GND

FIGURE 4-1: Block Diagram.

DS22053B-page 14

MCP1802

5.2

Output

5.0

FUNCTIONAL DESCRIPTION

The maximum rated continuous output current for the

MCP1802 is 300 mA.

The MCP1802 CMOS low dropout linear regulator is

intended for applications that need the low current

consumption while maintaining output voltage

regulation. The operating continuous load range of the

MCP1802 is from 0 mA to 300 mA. The input operating

voltage range is from 2.0V to 10.0V, making it capable

of operating from three or more alkaline cells or single

and multiple Li-Ion cell batteries.

A minimum output capacitance of 1.0 µF is required for

small signal stability in applications that have up to

300 mA output current capability. The capacitor type

can be ceramic, tantalum or aluminum electrolytic.

5.1

Input

The input of the MCP1802 is connected to the source

of the P-Channel PMOS pass transistor. As with all

LDO circuits, a relatively low source impedance (10Ω)

is needed to prevent the input impedance from causing

the LDO to become unstable. The size and type of the

capacitor needed depends heavily on the input source

type (battery, power supply) and the output current

range of the application. For most applications a 0.1 µF

ceramic capacitor will be sufficient to ensure circuit

stability. Larger values can be used to improve circuit

AC performance.

DS22053B-page 15

MCP1802

NOTES:

DS22053B-page 16

MCP1802

EQUATION 6-2:

T_J(MAX)= P_TOTAL× Rθ_JA+ T_AMAX

6.0

6.1

APPLICATION CIRCUITS &

ISSUES

Where:

T_J(MAX)

Typical Application

=

Maximum continuous junction

temperature

The MCP1802 is most commonly used as a voltage

regulator. Its low quiescent current and low dropout

voltage make it ideal for many battery-powered

applications.

P_TOTAL

=

Total device power dissipation

Rθ_JA

Thermal resistance from

junction to ambient

T_AMAX

=

Maximum ambient temperature

MCP1802

SHDN

GND

V_IN

The maximum power dissipation capability for a

package can be calculated given the junction-to-

ambient thermal resistance and the maximum ambient

temperature for the application. The following equation

can be used to determine the package maximum

internal power dissipation.

NC

V_OUT

1.8V

V_IN

2.4V to 5.0V

V

OUT

I_OUT

50 mA

C_IN

1 µF

Ceramic

C_OUT

1 µF Ceramic

EQUATION 6-3:

(T_J(MAX)– T_A(MAX)

P_D(MAX)= ---------------------------------------------------

Rθ_JA

)

FIGURE 6-1: Typical Application Circuit.

6.1.1

APPLICATION INPUT CONDITIONS

Package Type = SOT-23-5

Where:

P_D(MAX)

=

Maximum device power

dissipation

Input Voltage Range = 2.4V to 5.0V

_INmaximum = 5.0V

_OUTtypical = 1.8V

I_OUT50 mA maximum

T_J(MAX)

Maximum continuous junction

temperature

V

T_A(MAX)

=

Maximum ambient temperature

=

Rθ_JA

Thermal resistance from

junction to ambient

6.2

Power Calculations

6.2.1

POWER DISSIPATION

EQUATION 6-4:

T_J(RISE)= P_D(MAX)× Rθ_JA

The internal power dissipation of the MCP1802 is a

function of input voltage, output voltage and output

current. The power dissipation, as a result of the

quiescent current draw, is so low, it is insignificant

(25.0 µA x V_IN). The following equation can be used to

calculate the internal power dissipation of the LDO.

Where:

T_J(RISE)

=

Rise in device junction

temperature over the ambient

temperature

EQUATION 6-1:

P_TOTAL

=

Maximum device power

dissipation

P_LDO= (V_IN(MAX))– V_OUT(MIN)) × I_OUT(MAX))

Rθ_JA

Thermal resistance from

junction to ambient

Where:

P_LDO

=

LDO Pass device internal power

dissipation

EQUATION 6-5:

V_IN(MAX)

=

Maximum input voltage

T_J= T_J(RISE)+ T_A

V_OUT(MIN)

LDO minimum output voltage

Where:

The maximum continuous operating temperature

specified for the MCP1802 is +85°C. To estimate the

internal junction temperature of the MCP1802, the total

internal power dissipation is multiplied by the thermal

resistance from junction to ambient (Rθ_JA). The thermal

resistance from junction to ambient for the SOT-23-5

package is estimated at 256°C/W.

T_J

=

Junction Temperature

T_J(RISE)

Rise in device junction

temperature over the ambient

temperature

T_A

=

Ambient temperature

DS22053B-page 17

MCP1802

6.3

Voltage Regulator

Junction Temperature Estimate

To estimate the internal junction temperature, the

calculated temperature rise is added to the ambient or

offset temperature. For this example, the worst-case

junction temperature is estimated in the following table.

Internal power dissipation, junction temperature rise,

junction temperature and maximum power dissipation

are calculated in the following example. The power

dissipation, as a result of ground current, is small

enough to be neglected.

T_J= T_JRISE+ T_A(MAX)

T_J= 81.42°C

6.3.1

POWER DISSIPATION EXAMPLE

Maximum Package Power Dissipation at +25°C

Ambient Temperature

Package

Package Type = SOT-23-5

Input Voltage

SOT-23-5 (256°C/Watt = Rθ_JA

)

P_D(MAX)= (85°C - 25°C) / 256°C/W

V_IN= 2.4V to 5.0V

P_D(MAX)= 234 milli-Watts

LDO Output Voltages and Currents

V_OUT= 1.8V

6.4

Voltage Reference

I

_OUT= 50 mA

Maximum Ambient Temperature

_A(MAX)= +40°C

The MCP1802 can be used not only as a regulator, but

also as a low quiescent current voltage reference. In

many microcontroller applications, the initial accuracy

of the reference can be calibrated using production test

equipment or by using a ratio measurement. When the

initial accuracy is calibrated, the thermal stability and

line regulation tolerance are the only errors introduced

by the MCP1802 LDO. The low cost, low quiescent

current and small ceramic output capacitor are all

advantages when using the MCP1802 as a voltage

reference.

T

Internal Power Dissipation

Internal Power dissipation is the product of the LDO

output current times the voltage across the LDO

(V_INto V_OUT).

P_LDO(MAX)= (V_IN(MAX)- V_OUT(MIN)) x I_OUT(MAX)

P_LDO= (5.0V - (0.98 x 1.8V)) x 50 mA

P_LDO= 161.8 milli-Watts

Device Junction Temperature Rise

Ratio Metric Reference

The internal junction temperature rise is a function of

internal power dissipation and the thermal resistance

from junction to ambient for the application. The

thermal resistance from junction to ambient (Rθ_JA) is

derived from an EIA/JEDEC standard for measuring

thermal resistance for small surface mount packages.

The EIA/JEDEC specification is JESD51-7, “High

Effective Thermal Conductivity Test Board for Leaded

Surface Mount Packages”. The standard describes the

test method and board specifications for measuring the

thermal resistance from junction to ambient. The actual

thermal resistance for a particular application can vary

depending on many factors, such as copper area and

thickness. Refer to AN792, “A Method to Determine

How Much Power a SOT23 Can Dissipate in an

Application”, (DS00792), for more information

regarding this subject.

PIC^®

MCP1802

Microcontroller

25 µA Bias

V_IN

V_OUT

GND

C_IN

1 µF

V_REF

C_OUT

1 µF

ADO

AD1

Bridge Sensor

FIGURE 6-2: Using the MCP1802 as a

Voltage Reference.

6.5

Pulsed Load Applications

For some applications, there are pulsed load current

events that may exceed the specified 300 mA

maximum specification of the MCP1802. The internal

current limit of the MCP1802 will prevent high peak

load demands from causing non-recoverable damage.

The 300 mA rating is a maximum average continuous

rating. As long as the average current does not exceed

300 mA nor the max power dissipation of the packaged

device, pulsed higher load currents can be applied to

the MCP1802. The typical current limit for the

MCP1802 is 380 mA (T_A+25°C).

T_J(RISE)= P_TOTALx Rq_JA

T_JRISE= 161.8 milli-Watts x 256.0°C/Watt

T

_JRISE= 41.42°C

DS22053B-page 18

MCP1802

7.0

7.1

PACKAGING INFORMATION

Package Marking Information

Example:

5-Lead SOT-23

Standard Options for SOT-23

9XNN

XXNN

Symbol

Voltage *

Symbol

Voltage *

9X8#

9XB#

9XK#

9XT#

0.9

1.2

1.8

2.5

9XZ#

9B2#

9BM#

9BZ#

3.0

3.3

5.0

6.0

1

* Custom output voltages available upon request.

Contact your local Microchip sales office for more

information.

Legend: XX...X Customer-specific information

Y

YY

WW

NNN

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

DS22053B-page 19

MCP1802

5-Lead Plastic Small Outline Transistor (OT) [SOT-23]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

b

N

E

E1

3

2

1

e

e1

D

A2

c

A

φ

A1

L

L1

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Lead Pitch

N

e

5

0.95 BSC

Outside Lead Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Foot Angle

Lead Thickness

Lead Width

e1

A

A2

A1

E

E1

D

L

1.90 BSC

0.90

0.89

0.00

2.20

1.30

2.70

0.10

0.35

0°

–

1.45

1.30

0.15

3.20

1.80

3.10

0.60

0.80

30°

L1

φ

c

0.08

0.20

0.26

0.51

b

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-091B

DS22053B-page 20

MCP1802

APPENDIX A: REVISION HISTORY

Revision B (January 2009)

The following is the list of modifications:

1. Added Shutdown Input information to the

“Electrical characteristics” table.

2. Added Figure 2-30.

Revision A (June 2007)

• Original Release of this Document.

DS22053B-page 19

MCP1802

NOTES:

DS22053B-page 20

MCP1802

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

X-

XX

X

X/

XX

a)

b)

c)

d)

e)

f)

MCP1802T-0902I/OT: Tape and Reel, 0.9V

Tape

and Reel Voltage

Output Feature Tolerance Temp. Package

Code

MCP1802T-1202I/OT: Tape and Reel, 1.2V

MCP1802T-1802I/OT: Tape and Reel, 1.8V

MCP1802T-2502I/OT: Tape and Reel, 2.5V

MCP1802T-3002I/OT: Tape and Reel, 3.0V

MCP1802T-3302I/OT: Tape and Reel, 3.3V

MCP1802T-5002I/OT: Tape and Reel, 5.0V

MCP1802T-6002I/OT: Tape and Reel, 6.0V

Device:

MCP1802: 150 mA, Low Quiescent Current LDO

Tape and Reel:

Output Voltage *:

T

=

Tape and Reel

09

12

18

25

30

33

50

60

=

0.9V “Standard”

1.2V “Standard”

1.8V “Standard”

2.5V “Standard”

3.0V “Standard”

3.3V “Standard”

5.0V “Standard”

6.0V “Standard”

g)

h)

*Contact factory for other output voltage options.

Extra Feature Code:

Tolerance:

0

=

Fixed

2

2.0% (Standard)

Temperature:

I

-40°C to +85°C

Package Type:

OT

Plastic Small Outline Transistor (SOT-23) 5-lead,

DS22053B-page 21

MCP1802

NOTES:

DS22053B-page 22

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NSO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

PICSTART, rfPIC, SmartShunt and UNI/O are registered

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

FilterLab, Linear Active Thermistor, MXDEV, MXLAB,

SEEVAL, SmartSensor and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, In-Circuit Serial

Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB

Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,

PICDEM.net, PICtail, PIC³²logo, PowerCal, PowerInfo,

PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total

Endurance, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

DS22053B-page 23

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4080

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

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Fax: 82-53-744-4302

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China - Chengdu

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Fax: 86-28-8665-7889

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Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

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Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

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Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Cleveland

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Hsin Chu

Tel: 886-3-572-9526

Fax: 886-3-572-6459

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Kaohsiung

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

02/04/09

DS22053B-page 24


型号：	MCP1802-1802I/OT
厂家：	MICROCHIP
描述：	IC,VOLT REGULATOR,FIXED,+1.8V,CMOS,TSOP,5PIN,PLASTIC 光电二极管输出元件调节器
文件：	总26页 (文件大小：438K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP1802-1802I/OT [MICROCHIP]

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