MCP1804T-3302I/OT 概述
150 mA, 28V LDO Regulator With Shutdown 150毫安, 28V LDO稳压器关闭 稳压芯片 线性稳压器IC
MCP1804T-3302I/OT 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOT-23 |
包装说明: | SOT-23,5PIN | 针数: | 5 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 13 weeks |
风险等级: | 1.61 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 158962 |
Samacsys Pin Count: | 5 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | SOT23 (5-Pin) | Samacsys Footprint Name: | 5-Lead (OT) SOT-23 |
Samacsys Released Date: | 2015-04-16 09:48:08 | Is Samacsys: | N |
可调性: | FIXED | 最大回动电压 1: | 1.7 V |
标称回动电压 1: | 1.3 V | 最大绝对输入电压: | 30 V |
最大输入电压: | 28 V | 最小输入电压: | 5.3 V |
JESD-30 代码: | R-PDSO-G5 | JESD-609代码: | e3 |
长度: | 2.9 mm | 最大电网调整率: | 0.225% |
最大负载调整率: | 0.09% | 湿度敏感等级: | 1 |
功能数量: | 1 | 输出次数: | 1 |
端子数量: | 5 | 工作温度TJ-Max: | 125 °C |
工作温度TJ-Min: | -40 °C | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流 1: | 0.15 A |
最大输出电压 1: | 3.366 V | 最小输出电压 1: | 3.234 V |
标称输出电压 1: | 3.3 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LSSOP | 封装等效代码: | TSOP5/6,.11,37 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
包装方法: | TAPE AND REEL | 认证状态: | Not Qualified |
调节器类型: | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR | 座面最大高度: | 1.45 mm |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Matte Tin (Sn) - annealed | 端子形式: | GULL WING |
端子节距: | 0.95 mm | 端子位置: | DUAL |
最大电压容差: | 2% | 宽度: | 1.55 mm |
Base Number Matches: | 1 |
MCP1804T-3302I/OT 数据手册
通过下载MCP1804T-3302I/OT数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载MCP1804
150 mA, 28V LDO Regulator With Shutdown
Features
Description
• 150 mA Output Current
The MCP1804 is a family of CMOS low dropout (LDO)
voltage regulators that can deliver up to 150 mA of
current while consuming only 50 µA of quiescent
current (typical, 1.8V ≤ VOUT ≤ 5.0V). The input
operating range is specified from 2.0V to 28.0V.
• Low Drop Out Voltage, 260 mV typical @ 20 mA,
VR = 3.3V
• 50 µA Typical Quiescent Current
• 0.01 µA Typical Shutdown Current
• Input Operating Voltage Range: 2.0V to 28.0V
The MCP1804 is capable of delivering 100 mA with
only 1300 mV (typical) of input to output voltage
differential (VOUT = 3.3V). The output voltage tolerance
of the MCP1804 at +25°C is a maximum of ±2%. Line
regulation is ±0.15% typical at +25°C.
• Standard Output Voltage Options
(1.8V, 2.5V, 3.0V, 3.3V, 5.0V, 10.0V, 12.0V)
• Output Voltage Accuracy: ±2%
• Output voltages from 1.8V to 18.0V in 0.1V
increments are available upon request
The LDO input and output is stable with 0.1 µF of input
and output capacitance. Ceramic, tantalum or
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit with current foldback
to 40 mA (typical) provides short-circuit protection.
A shutdown (SHDN) function allows the output to be
enabled or disabled. When disabled, the MCP1804
draws only 0.01 µA of current (typical).
• Stable with Ceramic output capacitors
• Current Limit Protection With Current Foldback
• Shutdown pin
• High PSRR: 50 dB typical @ 1 kHz
Applications
Package options include the SOT-23-5 (SOT-25), SOT-
89-3, SOT-89-5, and SOT-223-3.
• Cordless Phones, Wireless Communications
• PDAs, Notebook and Netbook Computers
• Digital Cameras
Package Types
• Microcontroller Power
SOT-23-5
SOT-89-5
• Car Audio and Navigation Systems
• Home Appliances
VIN
5
VOUT
SHDN
4
NC
4
5
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., ©2002
(Top View)
2
• AN766, “Pin-Compatible CMOS Upgrades to
BiPolar LDOs”, DS00766, Microchip Technology
Inc., ©2002
1
2
3
1
3
VIN GND NC
VOUT
GND SHDN
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792, Microchip Technology Inc., ©2001
SOT-223
SOT-89-3
(Top View)
(Top View)
1
2
3
1
2
3
VIN
VIN
VOUT
VOUT
GND
VSS
© 2009 Microchip Technology Inc.
DS22200A-page 1
MCP1804
Functional Block Diagram
VOUT
VIN
*
Thermal
Protection
SHDN
Shutdown
Control
Voltage
Reference
-
+
Current Limiter
Error Amplifier
GND
*5-Pin Versions Only
Typical Application Circuit
MCP1804
VIN
VOUT
5.0V @ 30 mA
VIN VOUT
5
4
1
SOT-25
GND
COUT
1 µF Ceramic
2
3
+
12V
Battery
NC
SHDN
CIN
1 µF
Ceramic
DS22200A-page 2
© 2009 Microchip Technology Inc.
MCP1804
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ...................................................... +30V
Output Current (Continuous)........... PD/(VIN-VOUT)mA
Output Current (Peak)......................................300 mA
Output Voltage ..................... (VSS-0.3V) to (VIN+0.3V)
SHDN Voltage................................(VSS-0.3V) to +30V
Continuous Power Dissipation:
SOT-25......................................................... 250 mW
SOT-89......................................................... 500 mW
SOT-223....................................................... 300 mW
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 2.0V, Note 1,
COUT = 1 µF (X7R), CIN = 1 µF (X7R), VSHDN = VIN, TA = +25°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input / Output Characteristics
Input Operating
Voltage
VIN
2.0
—
28.0
V
Note 1
Input Quiescent
Current
Iq
IL = 0 mA
—
—
—
—
50
60
105
115
µA
µA
µA
µA
1.8V ≤ VOUT ≤ 5.0V
5.1V ≤ VOUT ≤ 12.0V
12.1V ≤ VOUT ≤ 18.0V
SHDN = 0V
65
125
0.10
Shutdown Current
ISHDN
0.01
Maximum Output
Current
IOUT_mA
VIN = VR + 3.0V
100
150
—
—
—
—
—
—
—
mA
mA
mA
mA
VOUT < 3.0V
VOUT ≥ 3.0V
Current Limiter
ILIMIT
200
40
Output Short Circuit
Current
IOUT_SC
—
Output Voltage
Regulation
VOUT
VR-2.0%
—
VR
VR+2.0%
—
V
IOUT = 10 mA, Note 2
VOUT Temperature
TCVOUT
±100
ppm/°C IOUT = 20 mA,
-40°C ≤ TA ≤ +85°C, Note 3
Coefficient
Line Regulation
ΔVOUT
/
(VR + 2V) ≤ VIN ≤ 28V, Note 1
(VOUTXΔVIN)
—
—
0.05
0.15
0.10
0.30
%/V
%/V
IOUT = 5 mA
I
OUT = 13 mA
Note 1: The minimum VIN must meet one condition: VIN ≥ (VR + 2.0V).
2: VR is the nominal regulator output voltage with an input voltage of VIN = VR + 2.0V.
For example: VR = 1.8V, 2.5V, 3.0V, 3.3V, etc.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured
over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
Changes in output voltage due to heating effects are determined using thermal regulation specification
TCVOUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
measured value with an applied input voltage of VR + 2.0V.
© 2009 Microchip Technology Inc.
DS22200A-page 3
MCP1804
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 2.0V, Note 1,
COUT = 1 µF (X7R), CIN = 1 µF (X7R), VSHDN = VIN, TA = +25°C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Load Regulation
ΔVOUT/VOUT
IL = 1.0 mA to 50 mA, Note 4
1.8V ≤ VOUT ≤ 5.0V
5.1V ≤ VOUT ≤ 12.0V
12.1V ≤ VOUT ≤ 18.0V
IL = 20 mA
—
—
—
50
90
mV
mV
mV
110
180
175
275
Dropout Voltage
VDROPOUT
Note 1, Note 5
—
—
—
—
—
—
—
—
—
—
550
450
390
310
260
220
190
170
130
120
710
600
520
450
360
320
280
230
190
170
V
V
V
V
V
V
V
V
V
V
1.8V ≤ VR ≤ 1.9V
2.0V ≤ VR ≤ 2.1V
2.2V ≤ VR ≤ 2.4V
2.5V ≤ VR ≤ 2.9V
3.0V ≤ VR ≤ 3.9V
4.0V ≤ VR ≤ 4.9V
5.0V ≤ VR ≤ 6.4V
6.5V ≤ VR ≤ 8.0V
8.1V ≤ VR ≤ 10.0V
10.1V ≤ VR ≤ 18.0V
IL = 100 mA
—
—
—
—
—
—
—
—
—
—
1.1
0
2200
1900
1700
1500
1300
1100
1000
800
700
650
—
2700
2600
2200
1900
1700
1500
1300
1150
950
V
V
V
V
V
V
V
V
V
V
V
V
µA
1.8V ≤ VR ≤ 1.9V
2.0V ≤ VR ≤ 2.1V
2.2V ≤ VR ≤ 2.4V
2.5V ≤ VR ≤ 2.9V
3.0V ≤ VR ≤ 3.9V
4.0V ≤ VR ≤ 4.9V
5.0V ≤ VR ≤ 6.4V
6.5V ≤ VR ≤ 8.0V
8.1V ≤ VR ≤ 10.0V
10.1V ≤ VR ≤ 18.0V
VIN = 28V
850
SHDN “H” Voltage
SHDN “H” Voltage
SHDN Current
VSHDN_H
VSHDN_L
ISHDN
VIN
—
0.35
0.1
VIN = 28V
-0.1
—
VIN = 28V, VSHDN = GND or VIN
Note 1: The minimum VIN must meet one condition: VIN ≥ (VR + 2.0V).
2: VR is the nominal regulator output voltage with an input voltage of VIN = VR + 2.0V.
For example: VR = 1.8V, 2.5V, 3.0V, 3.3V, etc.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured
over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
Changes in output voltage due to heating effects are determined using thermal regulation specification
TCVOUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
measured value with an applied input voltage of VR + 2.0V.
DS22200A-page 4
© 2009 Microchip Technology Inc.
MCP1804
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = VR + 2.0V, Note 1,
OUT = 1 µF (X7R), CIN = 1 µF (X7R), VSHDN = VIN, TA = +25°C
C
Parameters
Sym
Min
Typ
Max
Units
Conditions
Power Supply Ripple
Rejection Ratio
PSRR
—
50
—
dB
f = 1 kHz, IL = 20 mA,
VINAC = 0.5V pk-pk, CIN = 0 µF
Thermal Shutdown
Protection
TSD
—
—
150
25
—
—
°C
°C
TJ
Thermal Shutdown
Hysteresis
ΔTSD
Note 1: The minimum VIN must meet one condition: VIN ≥ (VR + 2.0V).
2: VR is the nominal regulator output voltage with an input voltage of VIN = VR + 2.0V.
For example: VR = 1.8V, 2.5V, 3.0V, 3.3V, etc.
3: TCVOUT = (VOUT-HIGH - VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = highest voltage measured
over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range.
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
Changes in output voltage due to heating effects are determined using thermal regulation specification
TCVOUT
.
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
measured value with an applied input voltage of VR + 2.0V.
TEMPERATURE SPECIFICATIONS
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, SOT-25
TA
-40
-55
+85
°C
°C
Tstg
+125
θJA
θJC
—
—
256
81
—
—
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
°C/W
°C/W
°C/W
Thermal Resistance, SOT-89
Thermal Resistance, SOT-223
θJA
θJC
—
—
180
100
—
—
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
θJA
θJC
—
—
62
15
—
—
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
© 2009 Microchip Technology Inc.
DS22200A-page 5
MCP1804
NOTES:
DS22200A-page 6
© 2009 Microchip Technology Inc.
MCP1804
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VIN=SHDN=4.8V
VR=1.8V
VR=2.8V
VIN=2.8V
℃
Ta=-40
VIN=3.8V
VIN=4.8V
℃
Ta=25
Ta=85
℃
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Output Current (mA)
Output Current (mA)
FIGURE 2-1:
Output Voltage vs. Output
FIGURE 2-4:
Output Voltage vs. Output
Current.
Current.
6.0
5.0
4.0
3.0
2.0
1.0
6.0
5.0
4.0
3.0
2.0
1.0
VIN=SHDN=8.0V
VR=5V
VR=5.0V
VIN=6V
VIN=7V
VIN=8V
℃
Ta=-40
℃
℃
Ta=25
Ta=85
0.0
0
0.0
0
50
100
150
200
250
300
50
100
150
200
250
300
Output Current (mA)
Output Current (mA)
FIGURE 2-2:
Output Voltage vs. Output
FIGURE 2-5:
Output Voltage vs. Output
Current.
Current.
14.0
12.0
10.0
8.0
14.0
12.0
10.0
8.0
VIN=SHDN=15V
VR=12V
VR=12V
VIN=13V
VIN=14V
VIN=15V
6.0
6.0
4.0
4.0
℃
Ta=-40
℃
Ta=25
℃
Ta=85
2.0
2.0
0.0
0
0.0
0
50
100
150
200
250
300
50
100
150
200
250
300
Output Current (mA)
Output Current (mA)
FIGURE 2-3:
Output Voltage vs. Output
FIGURE 2-6:
Output Voltage vs. Output
Current.
Current.
© 2009 Microchip Technology Inc.
DS22200A-page 7
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
2.1
2.0
1.9
1.8
1.7
1.6
1.5
2.1
2.0
1.9
1.8
1.7
1.6
1.5
VR=1.8V
VR=1.8V
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
0.8
1.3
1.8
2.3
2.8
3.3
3.8
4
8
12
16
20
24
28
Input Voltage (V)
Input Voltage (V)
FIGURE 2-7:
Output Voltage vs. Input
FIGURE 2-10:
Output Voltage vs. Input
Voltage.
Voltage.
6.0
5.8
5.6
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
4.0
6.0
5.8
5.6
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
8
VR=5V
VR=5V
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
12
16
20
24
28
4.5
5.0
Input Voltage (V)
5.5
6.0
Input Voltage (V)
FIGURE 2-8:
Output Voltage vs. Input
FIGURE 2-11:
Output Voltage vs. Input
Voltage.
Voltage.
15.0
14.0
13.0
12.0
11.0
10.0
15.0
14.0
13.0
12.0
11.0
10.0
VR=12V
VR=12V
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
9.0
14
9.0
10
16
18
20
22
24
26
28
11
12
13
14
Input Voltage (V)
Input Voltage (V)
FIGURE 2-9:
Output Voltage vs. Input
FIGURE 2-12:
Output Voltage vs. Input
Voltage.
Voltage.
DS22200A-page 8
© 2009 Microchip Technology Inc.
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
70
60
50
40
30
20
10
0
VR=1.8V
VR=1.8V
℃
℃
Ta=85
Ta=25
℃
Ta=-40
℃
℃
Ta=85
Ta=25
℃
Ta=-40
0
25
50
75
100
125
150
0
4
8
12
16
20
24
28
Output Current (mA)
Input Voltage (V)
FIGURE 2-13:
Dropout Voltage vs. Load
FIGURE 2-16:
Supply Current vs. Input
Current.
Voltage.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
70
60
50
40
30
20
10
0
VR=5V
VR=5V
℃
Ta=85
Ta=25
℃
℃
Ta=-40
℃
℃
Ta=85
Ta=25
℃
Ta=-40
0.0
0
25
50
75
100
125
150
0
4
8
12
16
20
24
28
Output Current (mA)
Input Voltage (V)
FIGURE 2-14:
Dropout Voltage vs. Load
FIGURE 2-17:
Supply Current vs. Input
Current.
Voltage.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
70
60
50
40
30
20
10
0
VR=12V
VR=12V
℃
Ta=85
℃
Ta=25
℃
Ta=-40
℃
Ta=85
℃
Ta=25
℃
Ta=-40
0.0
0
25
50
75
100
125
150
0
4
8
12
16
20
24
28
Output Current (mA)
Input Voltage (V)
FIGURE 2-15:
Dropout Voltage vs. Load
FIGURE 2-18:
Supply Current vs. Input
Current.
Voltage.
© 2009 Microchip Technology Inc.
DS22200A-page 9
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
70
60
50
40
30
20
10
0
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
VR=1.8V
VR=1.8V
IOUT=1mA
IOUT=10mA
IOUT=20mA
-50
-25
0
25
50
75
100
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
)
Ambient Temperature (°C
FIGURE 2-19:
Supply Current vs. Input
FIGURE 2-22:
Output Voltage vs. Ambient
Voltage.
Temperature.
70
60
50
40
30
20
10
0
5.20
5.15
5.10
5.05
5.00
4.95
4.90
4.85
VR=5V
VR=5V
IOUT=1mA
IOUT=10mA
IOUT=20mA
4.80
-50
-40
-20
0
20
40
60
80
100
-25
0
25
50
75
100
)
Ambient Temperature (°C
Ambient Temperature (°C)
FIGURE 2-20:
Supply Current vs. Input
FIGURE 2-23:
Output Voltage vs. Ambient
Voltage.
Temperature.
70
60
50
40
30
20
10
0
12.5
12.4
12.3
12.2
12.1
12.0
11.9
11.8
11.7
11.6
11.5
-50
VR=12V
VR=12V
IOUT=1mA
IOUT=10mA
IOUT=20mA
-40
-20
0
20
40
60
80
100
-25
0
25
50
75
100
Ambient Temperature (°C)
)
Ambient Temperature (°C
FIGURE 2-21:
Supply Current vs. Input
FIGURE 2-24:
Output Voltage vs. Ambient
Voltage.
Temperature.
DS22200A-page 10
© 2009 Microchip Technology Inc.
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
7.3
6.3
5.3
4.3
3.3
2.3
1.3
3.38
3.36
3.34
3.32
3.30
3.28
3.26
7.3
6.3
5.3
4.3
3.3
2.3
1.3
3.38
3.36
3.34
3.32
3.30
3.28
3.26
VR=3.3V
OUT=30 mA
VIN
VR=3.3V
IOUT=1 mA
I
VIN
VOUT
VOUT
Time (1ms/div)
Time (1ms/div)
FIGURE 2-25:
Dynamic Line Response.
FIGURE 2-28:
Dynamic Line Response.
9
8
7
6
5
4
3
5.08
9
8
7
6
5
4
3
5.08
VR=5V
VR=5V
IOUT 1 mA
VIN
IOUT=30 mA
5.06
5.04
5.02
5.00
4.98
4.96
5.06
VIN
5.04
5.02
VOUT
VOUT
5.00
4.98
4.96
Time (1ms/div)
Time (1ms/div)
FIGURE 2-26:
Dynamic Line Response.
FIGURE 2-29:
Dynamic Line Response.
16
15
14
13
12
11
10
12.08
16
15
14
13
12
11
10
12.08
VR=12V
IOUT=1 mA
VR=12V
OUT=30 mA
VIN
I
VIN
12.06
12.04
12.02
12.00
11.98
11.96
12.06
12.04
12.02
12.00
11.98
11.96
VOUT
VOUT
Time (1ms/div)
Time (1ms/div)
FIGURE 2-27:
Dynamic Line Response.
FIGURE 2-30:
Dynamic Line Response.
© 2009 Microchip Technology Inc.
DS22200A-page 11
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
3.6
3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
150
120
90
60
30
0
8
6
8
7
6
5
4
3
2
1
0
VR=3.3V
VIN
VOUT
4
2
0
VOUT
-2
-4
-6
-8
Output Current
VR=3.3V
OUT=1 mA
I
Time (1ms/div)
Time (1ms/div)
FIGURE 2-31:
Dynamic Load Response.
FIGURE 2-34:
Startup Response.
5.4
5.3
5.2
5.1
5.0
4.9
4.8
4.7
4.6
4.5
4.4
150
8
6
8
7
6
5
4
3
2
1
0
VR = 5V
VIN
120
4
VOUT
2
90
0
VOUT
60
-2
-4
-6
-8
Output Current
30
VR=3.3V
IOUT=30 mA
0
Time (1ms/div)
Time (1ms/div)
FIGURE 2-32:
Dynamic Load Response.
FIGURE 2-35:
Startup Response.
12.6
12.4
12.2
12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
150
8
6
8
7
6
5
4
3
2
1
0
VR = 12V
VIN
120
4
VOUT
2
90
60
VOUT
0
-2
-4
-6
-8
IOUT
30
VR=5.0V
I
OUT=1 mA
0
Time (1ms/div)
Time (1ms/div)
FIGURE 2-33:
Dynamic Load Response.
FIGURE 2-36:
Startup Response.
DS22200A-page 12
© 2009 Microchip Technology Inc.
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
8
6
8
7
6
5
4
3
2
1
0
8
6
8
7
6
5
4
3
2
1
0
SHDN
VIN
4
4
2
2
VOUT
VOUT
0
0
-2
-4
-6
-8
-2
-4
-6
-8
VR=5.0V
IOUT=30 mA
VR=3.3V
IOUT=1 mA
Time (1ms/div)
Time (1ms/div)
FIGURE 2-37:
Startup Response.
FIGURE 2-40:
SHDN Response.
15
10
5
18
15
12
9
8
6
8
7
6
5
4
3
2
1
0
VIN
SHDN
4
2
VOUT
VOUT
0
0
-2
-4
-6
-8
-5
6
VR=12V
IOUT=1 mA
VR=5V
-10
-15
3
IOUT=1 mA
0
Time (1ms/div)
Time (1ms/div)
FIGURE 2-38:
Startup Response.
FIGURE 2-41:
SHDN Response.
15
10
5
18
15
12
9
15
10
5
18
15
12
9
VIN
SHDN
VOUT
VOUT
0
0
-5
6
-5
6
-10
-15
3
VR=12V
IOUT=30 mA
-10
-15
3
VR=12V
I
OUT=1 mA
0
0
Time (1ms/div)
Time (1ms/div)
FIGURE 2-39:
Startup Response.
FIGURE 2-42:
SHDN Response.
© 2009 Microchip Technology Inc.
DS22200A-page 13
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
8
6
8
7
6
5
4
3
2
1
0
90
80
70
60
50
40
30
20
10
0
VOUT=3.3V
CIN=0
SHDN
I
OUT=1 mA
4
VIN_AC=0.5Vp-p
2
VOUT
0
-2
-4
-6
-8
VR=3.3V
IOUT=30 mA
0.01
0.1
1
10
100
100
100
Time (1ms/div)
Ripple Frequency: f (kHz)
FIGURE 2-43:
SHDN Response.
FIGURE 2-46:
PSRR 3.3V @ 1 mA.
8
6
8
90
80
70
60
50
40
30
20
10
VOUT=5V
CIN=0
IOUT=1 mA
VIN_AC=0.5Vp-p
7
6
5
4
3
2
1
0
SHDN
VOUT
4
2
0
-2
-4
-6
-8
VR=5V
IOUT=30 mA
0
0.01
0.1
1
10
Time (1ms/div)
Ripple Frequency: f (kHz)
FIGURE 2-44:
SHDN Response.
FIGURE 2-47:
PSRR 5.0V @ 1 mA.
15
10
5
18
90
80
70
60
50
40
30
20
10
0
VOUT=12V
CIN=0
IOUT=1 mA
SHDN
15
12
9
V
IN_AC=0.5Vp-p
VOUT
0
-5
6
-10
-15
3
VR=12V
OUT=30 mA
I
0
0.01
0.1
1
10
Time (1ms/div)
Ripple Frequency: f (kHz)
FIGURE 2-45:
SHDN Response.
FIGURE 2-48:
PSRR 12.0V @ 1 mA.
DS22200A-page 14
© 2009 Microchip Technology Inc.
MCP1804
Note: Unless otherwise indicated: COUT = 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), TA = +25°C, VIN = VR + 2.0V.
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
VOUT=3.3V
CIN=0
IOUT=30 mA
VOUT=12V
CIN=0
I
OUT=30 mA
V
IN_AC=0.5Vp-p
VIN_AC=0.5Vp-p
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Ripple Frequency: f (kHz)
Ripple Frequency: f (kHz)
FIGURE 2-49:
PSRR 3.3V @ 30 mA.
FIGURE 2-51:
PSRR 12.0V @ 30 mA.
90
80
70
60
50
40
30
20
VOUT=5V
CIN=0
I
OUT=30 mA
VIN_AC=0.5Vp-p
10
0
0.01
0.1
1
10
100
Ripple Frequency: f (kHz)
FIGURE 2-50:
PSRR 5.0V @ 30 mA.
© 2009 Microchip Technology Inc.
DS22200A-page 15
MCP1804
NOTES:
DS22200A-page 16
© 2009 Microchip Technology Inc.
MCP1804
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP1804 PIN FUNCTION TABLE
MCP1804
Symbol
Description
SOT-223-3,
SOT-89-5
SOT-25
SOT89-3
1
2
3
4
5
5
3
2, TAB
—
VIN
GND
NC
Unregulated Supply Voltage
2,TAB
Ground Terminal
No connection
4
3
1
—
SHDN
VOUT
Shutdown
1
Regulated Voltage Output
3.1
Unregulated Input Voltage (VIN)
3.3
Shutdown Input (SHDN)
Connect VIN to the input unregulated source voltage.
Like all low dropout linear regulators, low source
impedance is necessary for the stable operation of the
LDO. The amount of capacitance required to ensure
low source impedance will depend on the proximity of
the input source capacitors or battery type. For most
applications, 0.1 µF to 1.0 µF of capacitance will
ensure stable operation of the LDO circuit. The type of
capacitor used can be ceramic, tantalum or aluminum
electrolytic. The low ESR characteristics of the ceramic
will yield better noise and PSRR performance at
high-frequency.
The SHDN input is used to turn the LDO output voltage
on and off. When the SHDN input is at a logic-high
level, the LDO output voltage is enabled. When the
SHDN input is pulled to a logic-low level, the LDO
output voltage is disabled and the LDO enters a low
quiescent current shutdown state where the typical
quiescent current is 0.01 µA. The SHDN pin does not
have an internal pullup or pulldown resistor. The SHDN
pin must be connected to either VIN or GND to prevent
the device from becoming unstable.
3.4
Regulated Output Voltage (VOUT)
Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close to the LDO VOUT pin as is practical.
The current flowing out of this pin is equal to the DC
load current. For most applications, 0.1 µF to 1.0 µF of
capacitance will ensure stable operation of the LDO
circuit. Larger values may be used to improve dynamic
load response. The type of capacitor used can be
ceramic, tantalum or aluminum electrolytic. The low
ESR characteristics of the ceramic will yield better
noise and PSRR performance at high-frequency.
3.2
Ground Terminal (GND)
Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (50 to 60 µA typical) flows
out of this pin; there is no high current. The LDO output
regulation is referenced to this pin. Minimize voltage
drops between this pin and the negative side of the
load.
© 2009 Microchip Technology Inc.
DS22200A-page 17
MCP1804
NOTES:
DS22200A-page 18
© 2009 Microchip Technology Inc.
MCP1804
4.4
Output Capacitor
4.0
4.1
DETAILED DESCRIPTION
Output Regulation
The MCP1804 requires a minimum output capacitance
of 0.1 µF to 1.0 µF for output voltage stability. Ceramic
capacitors are recommended because of their size,
cost and environmental robustness qualities.
A portion of the LDO output voltage is fed back to the
internal error amplifier and compared with the precision
internal bandgap reference. The error amplifier output
will adjust the amount of current that flows through the
P-Channel pass transistor, thus regulating the output
voltage to the desired value. Any changes in input
voltage or output current will cause the error amplifier
to respond and adjust the output voltage to the target
voltage (refer to Figure 4-1).
Aluminum-electrolytic and tantalum capacitors can be
used on the LDO output as well. The output capacitor
should be located as close to the LDO output as is
practical. Ceramic materials X7R and X5R have low
temperature coefficients.
Larger LDO output capacitors can be used with the
MCP1804 to improve dynamic performance and power
supply ripple rejection performance. Aluminum-
electrolytic capacitors are not recommended for low
temperature applications of < -25°C.
4.2
Overcurrent
The MCP1804 internal circuitry monitors the amount of
current flowing through the P-Channel pass transistor.
In the event that the load current reaches the current
limiter level of 200 mA (typical), the current limiter
circuit will operate and the output voltage will drop. As
the output voltage drops, the internal current foldback
circuit will further reduce the output voltage causing the
output current to decrease. When the output is shorted,
a typical output current of 50 mA flows.
4.5
Input Capacitor
Low input source impedance is necessary for the LDO
output to operate properly. When operating from
batteries, or in applications with long lead length
(> 10 inches) between the input source and the LDO,
some input capacitance is recommended. A minimum
of 0.1 µF to 1.0 µF is recommended for most
applications.
4.3
Shutdown
For applications that have output step load
requirements, the input capacitance of the LDO is very
important. The input capacitance provides the LDO
with a good local low-impedance source to pull the
transient currents from in order to respond quickly to
the output load step. For good step response
performance, the input capacitor should be of
equivalent or higher value than the output capacitor.
The capacitor should be placed as close to the input of
the LDO as is practical. Larger input capacitors will also
help reduce any high-frequency noise on the input and
output of the LDO and reduce the effects of any
inductance that exists between the input source
voltage and the input capacitance of the LDO.
The SHDN input is used to turn the LDO output voltage
on and off. When the SHDN input is at a logic-high
level, the LDO output voltage is enabled. When the
SHDN input is pulled to a logic-low level, the LDO
output voltage is disabled and the LDO enters a low
quiescent current shutdown state where the typical
quiescent current is 0.01 µA. The SHDN pin does not
have an internal pullup or pulldown resistor. Therefore
the SHDN pin must be pulled either high or low to
prevent the device from becoming unstable. The
internal device current will increase when the device is
operational and current flows through the pullup or
pull-down resistor to the SHDN pin internal logic. The
SHDN pin internal logic is equivalent to an inverter
input.
4.6
Thermal Shutdown
The MCP1804 thermal shutdown circuitry protects the
device when the internal junction temperature reaches
the typical thermal limit value of +150°C. The thermal
limit shuts off the output drive transistor. Device output
will resume when the internal junction temperature falls
below the thermal limit value by an amount equal to the
thermal limit hysteresis value of +25°C.
© 2009 Microchip Technology Inc.
DS22200A-page 19
MCP1804
VOUT
VIN
*
Thermal
Protection
SHDN
Shutdown
Control
Voltage
Reference
-
+
Current Limiter
Error Amplifier
GND
*
5-Pin Versions Only
FIGURE 4-1:
Block Diagram.
DS22200A-page 20
© 2009 Microchip Technology Inc.
MCP1804
5.2
Output
5.0
FUNCTIONAL DESCRIPTION
The maximum rated continuous output current for the
MCP1804 is 150 mA.
The MCP1804 CMOS linear regulator is intended for
applications that need the low current consumption
while maintaining output voltage regulation. The
operating continuous load range of the MCP1804 is
from 0 mA to 150 mA. The input operating voltage
range is from 2.0V to 28.0V, making it capable of
operating from a single 12V battery or single and
multiple Li-Ion cell batteries.
A minimum output capacitance of 0.1 µF to 1.0 µF is
required for small signal stability in applications that
have up to 150 mA output current capability. The
capacitor type can be ceramic, tantalum or aluminum
electrolytic.
5.1
Input
The input of the MCP1804 is connected to the source
of the P-Channel PMOS pass transistor. As with all
LDO circuits, a relatively low source impedance
(< 10Ω) is needed to prevent the input impedance from
causing the LDO to become unstable. The size and
type of the capacitor needed depends heavily on the
input source type (battery, power supply) and the
output current range of the application. For most
applications
a 0.1 µF ceramic capacitor will be
sufficient to ensure circuit stability. Larger values can
be used to improve circuit AC performance.
© 2009 Microchip Technology Inc.
DS22200A-page 21
MCP1804
NOTES:
DS22200A-page 22
© 2009 Microchip Technology Inc.
MCP1804
The maximum continuous operating temperature
specified for the MCP1804 is +85°C. To estimate the
internal junction temperature of the MCP1804, the total
internal power dissipation is multiplied by the thermal
resistance from junction to ambient (RθJA). The thermal
resistance from junction to ambient for the SOT-25 pin
package is estimated at 256°C/W.
6.0
6.1
APPLICATION CIRCUITS AND
ISSUES
Typical Application
The MCP1804 is most commonly used as a voltage
regulator. It’s low quiescent current and wide input volt-
age make it ideal for Li-Ion and 12V battery-powered
applications.
EQUATION 6-2:
TJ(MAX) = PTOTAL × RθJA + TAMAX
Where:
NC
SHDN
TJ(MAX)
=
Maximum continuous junction
temperature.
GND
VIN
VOUT
1.8V
PTOTAL
RqJA
=
=
Total device power dissipation.
VIN
4.2V
VOUT
Thermal resistance from junction to
ambient.
IOUT
50 mA
CIN
1 µF
Ceramic
COUT
1 µF Ceramic
TAMAX
=
Maximum ambient temperature.
The maximum power dissipation capability for a
package can be calculated given the junction-
to-ambient thermal resistance and the maximum
ambient temperature for the application. The following
equation can be used to determine the package
maximum internal power dissipation.
FIGURE 6-1:
Typical Application Circuit.
6.1.1
Package Type
Input Voltage Range = 3.8V to 4.2V
APPLICATION INPUT CONDITIONS
= SOT25
EQUATION 6-3:
V
V
IN maximum
OUT typical
= 4.6V
(TJ(MAX) – TA(MAX)
PD(MAX) = ---------------------------------------------------
RθJA
)
= 1.8V
IOUT
= 50 mA maximum
Where:
6.2
Power Calculations
PD(MAX)
=
=
Maximum device power dissipation.
TJ(MAX)
Maximum continuous junction
temperature.
6.2.1
POWER DISSIPATION
The internal power dissipation of the MCP1804 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(50.0 µA x VIN). The following equation can be used to
calculate the internal power dissipation of the LDO.
TA(MAX)
RqJA
=
=
Maximum ambient temperature.
Thermal resistance from junction to
ambient.
EQUATION 6-4:
TJ(RISE) = PD(MAX) × RθJA
EQUATION 6-1:
Where:
PLDO = (VIN(MAX)) – VOUT(MIN)) × IOUT(MAX))
TJ(RISE)
=
Rise in device junction temperature over
the ambient temperature.
Where:
PTOTAL
RqJA
=
=
Maximum device power dissipation.
PLDO
=
LDO Pass device internal power
dissipation
Thermal resistance from junction to
ambient.
VIN(MAX)
=
=
Maximum input voltage
EQUATION 6-5:
TJ = TJ(RISE) + TA
VOUT(MIN)
LDO minimum output voltage
Where:
TJ
TJ(RISE)
=
=
Junction Temperature.
Rise in device junction temperature over
the ambient temperature.
TA
=
Ambient temperature.
© 2009 Microchip Technology Inc.
DS22200A-page 23
MCP1804
6.3.1.2
Junction Temperature Estimate
6.3
Voltage Regulator
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below.
Internal power dissipation, junction temperature rise,
junction temperature and maximum power dissipation
are calculated in the following example. The power
dissipation, as a result of ground current, is small
enough to be neglected.
TJ = TJRISE + TA(MAX)
TJ = 76.3°C
6.3.1
POWER DISSIPATION EXAMPLE
Package:
Maximum Package Power Dissipation at +25°C
Ambient Temperature (minimum PCB footprint)
Package Type = SOT-25
Input Voltage:
SOT-25 (256°C/Watt = RθJA):
VIN = 3.8V to 4.6V
P
D(MAX) = (85°C - 25°C) / 256°C/W
D(MAX) = 234 milli-Watts
LDO Output Voltages and Currents:
P
VOUT = 1.8V
SOT-89 (180°C/Watt = RθJA):
I
OUT = 50 mA
P
D(MAX) = (85°C - 25°C) / 180°C/W
D(MAX) = 333 milli-Watts
Maximum Ambient Temperature:
A(MAX) = +40°C
P
T
Internal Power Dissipation:
6.4
Voltage Reference
Internal Power dissipation is the product of the LDO
output current times the voltage across the LDO
(VIN to VOUT).
The MCP1804 can be used not only as a regulator, but
also as a low quiescent current voltage reference. In
many microcontroller applications, the initial accuracy
of the reference can be calibrated using production test
equipment or by using a ratio measurement. When the
initial accuracy is calibrated, the thermal stability and
line regulation tolerance are the only errors introduced
by the MCP1804 LDO. The low cost, low quiescent
current and small ceramic output capacitor are all
advantages when using the MCP1804 as a voltage
reference.
PLDO(MAX) = (VIN(MAX) - VOUT(MIN)) x
IOUT(MAX)
PLDO = (4.6V - (0.98 x 1.8V)) x 50 mA
PLDO = 141.8 milli-Watts
6.3.1.1
Device Junction Temperature Rise
The internal junction temperature rise is a function of
internal power dissipation and the thermal resistance
from junction to ambient for the application. The thermal
resistance from junction to ambient (RθJA) is derived
from an EIA/JEDEC standard for measuring thermal
resistance for small surface mount packages. The EIA/
JEDEC specification is JESD51-7, “High Effective
Thermal Conductivity Test Board for Leaded Surface
Mount Packages”. The standard describes the test
method and board specifications for measuring the
thermal resistance from junction to ambient. The actual
thermal resistance for a particular application can vary
depending on many factors, such as copper area and
thickness. Refer to AN792, “A Method to Determine
How Much Power a SOT23 Can Dissipate in an
Application” (DS00792), for more information regarding
this subject.
Ratio Metric Reference
PICmicro®
MCP1804
Microcontroller
50 µA Bias
VIN
VOUT
GND
CIN
1 µF
VREF
COUT
1 µF
ADO
AD1
Bridge Sensor
FIGURE 6-2:
voltage reference.
Using the MCP1804 as a
TJ(RISE) = PTOTAL x RqJA
TJRISE = 141.8 milli-Watts x 256.0°C/Watt
T
JRISE = 36.3°C
DS22200A-page 24
© 2009 Microchip Technology Inc.
MCP1804
6.5
Pulsed Load Applications
For some applications, there are pulsed load current
events that may exceed the specified 150 mA
maximum specification of the MCP1804. The internal
current limit of the MCP1804 will prevent high peak
load demands from causing non-recoverable damage.
The 150 mA rating is a maximum average continuous
rating. As long as the average current does not exceed
150 mA nor the max power dissipation of the packaged
device, pulsed higher load currents can be applied to
the MCP1804. The typical current limit for the
MCP1804 is 200 mA (TA = +25°C).
© 2009 Microchip Technology Inc.
DS22200A-page 25
MCP1804
NOTES:
DS22200A-page 26
© 2009 Microchip Technology Inc.
MCP1804
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Example:
5-Lead SOT-23
Part Number
Code
MCP1804T-1802I/OT
MCP1804T-2502I/OT
MCP1804T-3002I/OT
MCP1804T-3302I/OT
MCP1804T-5002I/OT
MCP1804T-A002I/OT
MCP1804T-C002I/OT
80KNN
80TNN
80ZNN
812NN
81MNN
839NN
83ZNN
XXNN
80K25
3-Lead SOT-89
Example:
Part Number
Code
MCP1804T-1802I/MB
MCP1804T-2502I/MB
MCP1804T-3002I/MB
MCP1804T-3302I/MB
MCP1804T-5002I/MB
MCP1804T-A002I/MB
MCP1804T-C002I/MB
84KNN
84TNN
84ZNN
852NN
85MNN
879NN
87ZNN
XXXYYWW
NNN
84K25
5-Lead SOT-89
Example:
Part Number
Code
MCP1804T-1802I/MT
MCP1804T-2502I/MT
MCP1804T-3002I/MT
MCP1804T-3302I/MT
MCP1804T-5002I/MT
MCP1804T-A002I/MT
MCP1804T-C002I/MT
80KNN
80TNN
80ZNN
812NN
81MNN
839NN
83ZNN
XXXYYWW
NNN
80K25
Example:
3-Lead SOT-223
Part Number
Code
MCP1804T-1802I/DB
MCP1804T-2502I/DB
MCP1804T-3002I/DB
MCP1804T-3302I/DB
MCP1804T-5002I/DB
MCP1804T-A002I/DB
MCP1804T-C002I/DB
84KNN
84TNN
84ZNN
852NN
85MNN
879NN
87ZNN
XXXXXXX
XXXYYWW
84K25
NNN
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
WW
NNN
e
3
e
3
*
)
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS22200A-page 27
MCP1804
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ꢌ##ꢎ+22---ꢁꢄꢃꢊꢍꢇꢊꢌꢃꢎꢁꢊꢇꢄ2ꢎꢉꢊ/ꢉꢓꢃꢆꢓ
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ꢏꢙ5
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.ꢇꢇ#ꢈꢔꢆꢓꢋꢅ
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M
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4ꢀ
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8
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ꢛꢔꢊꢃꢉꢜ
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)ꢕ*+ )ꢉ ꢃꢊꢈꢂꢃꢄꢅꢆ ꢃꢇꢆꢁꢈꢗꢌꢅꢇꢍꢅ#ꢃꢊꢉꢋꢋꢘꢈꢅ&ꢉꢊ#ꢈ,ꢉꢋ$ꢅꢈ ꢌꢇ-ꢆꢈ-ꢃ#ꢌꢇ$#ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢅ ꢁ
ꢏꢃꢊꢍꢇꢊꢌꢃꢎ ꢗꢅꢊꢌꢆꢇꢋꢇꢓꢘ ꢂꢍꢉ-ꢃꢆꢓ *ꢐꢖꢞꢐꢛꢀ)
DS22200A-page 28
© 2009 Microchip Technology Inc.
MCP1804
ꢙꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢝꢃꢄꢅꢃꢓꢆꢕ !ꢖꢆꢗꢍꢏꢒꢁ"#ꢚ
ꢛꢔꢊꢃꢜ .ꢇꢍꢈ#ꢌꢅꢈꢄꢇ #ꢈꢊ$ꢍꢍꢅꢆ#ꢈꢎꢉꢊ/ꢉꢓꢅꢈ!ꢍꢉ-ꢃꢆꢓ 0ꢈꢎꢋꢅꢉ ꢅꢈ ꢅꢅꢈ#ꢌꢅꢈꢏꢃꢊꢍꢇꢊꢌꢃꢎꢈ1ꢉꢊ/ꢉꢓꢃꢆꢓꢈꢕꢎꢅꢊꢃ%ꢃꢊꢉ#ꢃꢇꢆꢈꢋꢇꢊꢉ#ꢅ!ꢈꢉ#ꢈ
ꢌ##ꢎ+22---ꢁꢄꢃꢊꢍꢇꢊꢌꢃꢎꢁꢊꢇꢄ2ꢎꢉꢊ/ꢉꢓꢃꢆꢓ
D
D1
E
H
L
N
1
2
b
b1
b1
e
E1
e1
A
C
3ꢆꢃ#
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ꢂꢃꢄꢅꢆ ꢃꢇꢆꢈ4ꢃꢄꢃ#
ꢏꢙ5
ꢏꢔ7
5$ꢄ8ꢅꢍꢈꢇ%ꢈ4ꢅꢉ!
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6,ꢅꢍꢉꢋꢋꢈ<ꢃ!#ꢌ
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6,ꢅꢍꢉꢋꢋꢈ4ꢅꢆꢓ#ꢌ
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ꢐꢁꢜ=
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ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢆ ꢃꢇꢆ ꢈꢂꢈꢉꢆ!ꢈ"ꢈ!ꢇꢈꢆꢇ#ꢈꢃꢆꢊꢋ$!ꢅꢈꢄꢇꢋ!ꢈ%ꢋꢉ ꢌꢈꢇꢍꢈꢎꢍꢇ#ꢍ$ ꢃꢇꢆ ꢁꢈꢏꢇꢋ!ꢈ%ꢋꢉ ꢌꢈꢇꢍꢈꢎꢍꢇ#ꢍ$ ꢃꢇꢆ ꢈ ꢌꢉꢋꢋꢈꢆꢇ#ꢈꢅ&ꢊꢅꢅ!ꢈꢐꢁꢀꢑꢒꢈꢄꢄꢈꢎꢅꢍꢈ ꢃ!ꢅꢁ
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)ꢕ*+ )ꢉ ꢃꢊꢈꢂꢃꢄꢅꢆ ꢃꢇꢆꢁꢈꢗꢌꢅꢇꢍꢅ#ꢃꢊꢉꢋꢋꢘꢈꢅ&ꢉꢊ#ꢈ,ꢉꢋ$ꢅꢈ ꢌꢇ-ꢆꢈ-ꢃ#ꢌꢇ$#ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢅ ꢁ
ꢏꢃꢊꢍꢇꢊꢌꢃꢎ ꢗꢅꢊꢌꢆꢇꢋꢇꢓꢘ ꢂꢍꢉ-ꢃꢆꢓ *ꢐꢖꢞꢐꢑꢛ)
© 2009 Microchip Technology Inc.
DS22200A-page 29
MCP1804
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢝꢃꢄꢅꢃꢓꢆꢕ ꢒꢖꢆꢗꢍꢏꢒꢁ"#ꢚ
ꢛꢔꢊꢃꢜ .ꢇꢍꢈ#ꢌꢅꢈꢄꢇ #ꢈꢊ$ꢍꢍꢅꢆ#ꢈꢎꢉꢊ/ꢉꢓꢅꢈ!ꢍꢉ-ꢃꢆꢓ 0ꢈꢎꢋꢅꢉ ꢅꢈ ꢅꢅꢈ#ꢌꢅꢈꢏꢃꢊꢍꢇꢊꢌꢃꢎꢈ1ꢉꢊ/ꢉꢓꢃꢆꢓꢈꢕꢎꢅꢊꢃ%ꢃꢊꢉ#ꢃꢇꢆꢈꢋꢇꢊꢉ#ꢅ!ꢈꢉ#ꢈ
ꢌ##ꢎ+22---ꢁꢄꢃꢊꢍꢇꢊꢌꢃꢎꢁꢊꢇꢄ2ꢎꢉꢊ/ꢉꢓꢃꢆꢓ
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b2
b1
b1
N
L
L
1
2
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e
e1
H
E
D
A
C
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ꢔ
9
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4
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(
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ꢐꢁꢖꢀ
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ꢐꢁꢜꢑ
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ꢐꢁꢖ;
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8ꢀ
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ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢆ ꢃꢇꢆ ꢈꢂꢈꢉꢆ!ꢈ"ꢈ!ꢇꢈꢆꢇ#ꢈꢃꢆꢊꢋ$!ꢅꢈꢄꢇꢋ!ꢈ%ꢋꢉ ꢌꢈꢇꢍꢈꢎꢍꢇ#ꢍ$ ꢃꢇꢆ ꢁꢈꢏꢇꢋ!ꢈ%ꢋꢉ ꢌꢈꢇꢍꢈꢎꢍꢇ#ꢍ$ ꢃꢇꢆ ꢈ ꢌꢉꢋꢋꢈꢆꢇ#ꢈꢅ&ꢊꢅꢅ!ꢈꢐꢁꢀꢑꢒꢈꢄꢄꢈꢎꢅꢍꢈ ꢃ!ꢅꢁ
ꢑꢁ ꢂꢃꢄꢅꢆ ꢃꢇꢆꢃꢆꢓꢈꢉꢆ!ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢃꢆꢓꢈꢎꢅꢍꢈꢔꢕꢏ"ꢈ'ꢀꢖꢁ(ꢏꢁ
)ꢕ*+ )ꢉ ꢃꢊꢈꢂꢃꢄꢅꢆ ꢃꢇꢆꢁꢈꢗꢌꢅꢇꢍꢅ#ꢃꢊꢉꢋꢋꢘꢈꢅ&ꢉꢊ#ꢈ,ꢉꢋ$ꢅꢈ ꢌꢇ-ꢆꢈ-ꢃ#ꢌꢇ$#ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢅ ꢁ
ꢏꢃꢊꢍꢇꢊꢌꢃꢎ ꢗꢅꢊꢌꢆꢇꢋꢇꢓꢘ ꢂꢍꢉ-ꢃꢆꢓ *ꢐꢖꢞꢐꢜꢐ)
DS22200A-page 30
© 2009 Microchip Technology Inc.
MCP1804
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© 2009 Microchip Technology Inc.
DS22200A-page 31
MCP1804
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DS22200A-page 32
© 2009 Microchip Technology Inc.
MCP1804
APPENDIX A: REVISION HISTORY
Revision A (September 2009)
• Original Release of this Document.
© 2009 Microchip Technology Inc.
DS22200A-page 31
MCP1804
NOTES:
DS22200A-page 32
© 2009 Microchip Technology Inc.
MCP1804
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
XX
T
-XX
Examples:
a)
MCP1804T-1802I/OT:
MCP1804T-2502I/OT:
1.8V, 5-LD SOT-23
2.5V, 5-LD SOT-23
3.0V, 5-LD SOT-23
3.3V, 5-LD SOT-23
5.0V, 5-LD SOT-23
10V, 5-LD SOT-23
12V, 5-LD SOT-23
Temperature
Range
Package
Output
Voltage
Tolerance
Tape
and
Reel
Voltage
b)
c)
d)
e)
f)
MCP1804T-3002I/OT:
MCP1804T-3302I/OT:
MCP1804T-5002I/OT:
MCP1804T-A002I/OT:
MCP1804T-C002I/OT:
Device
MCP1804T:
LDO Voltage Regulator (Tape and Reel)
g)
Voltage Options
18
25
30
33
50
A0
C0
=
=
=
=
=
=
=
1.8V
2.5V
3.0V
3.3V
5.0V
10V
a)
b)
c)
d)
e)
f)
MCP1804T-1802I/MB:
MCP1804T-2502I/MB:
MCP1804T-3002I/MB:
MCP1804T-3302I/MB:
MCP1804T-5002I/MB:
MCP1804T-A002I/MB:
MCP1804T-C002I/MB:
1.8V, 5-LD SOT-89
2.5V, 5-LD SOT-89
3.0V, 5-LD SOT-89
3.3V, 5-LD SOT-89
5.0V, 5-LD SOT-89
10V, 5-LD SOT-89
12V, 5-LD SOT-89
12V
g)
Output Voltage
Tolerance
02
I
=
±2%
a)
b)
c)
d)
e)
f)
MCP1804T-1802I/MT:
MCP1804T-2502I/MT:
MCP1804T-3002I/MT:
MCP1804T-3302I/MT:
MCP1804T-5002I/MT:
MCP1804T-A002I/MT:
MCP1804T-C002I/MT:
1.8V, 5-LD SOT-89
2.5V, 5-LD SOT-89
3.0V, 5-LD SOT-89
3.3V, 5-LD SOT-89
5.0V, 5-LD SOT-89
10V, 5-LD SOT-89
12V, 5-LD SOT-89
Temperature Range
Package
= -40°C to +85°C (Industrial)
DB
MB
MT
OT
=
=
=
=
3-lead Plastic Small OutlineTransistor (SOT-223)
3-lead Plastic Small OutlineTransistor (SOT-89)
5-lead Plastic Small OutlineTransistor (SOT-89)
5-lead Plastic Small OutlineTransistor (SOT-23)
g)
a)
b)
c)
d)
e)
f)
MCP1804T-1802I/DB:
MCP1804T-2502I/DB:
MCP1804T-3002I/DB:
MCP1804T-3302I/DB:
MCP1804T-5002I/DB:
MCP1804T-A002I/DB:
1.8V, 3-LD SOT-223
2.5V, 3-LD SOT-223
3.0V, 3-LD SOT-223
3.3V, 3-LD SOT-223
5.0V, 3-LD SOT-223
10V, 3-LD SOT-223
g)
MCP1804T-C002I/DB: 12V, 3-LD SOT-223
© 2009 Microchip Technology Inc.
DS22200A-page 33
MCP1804
NOTES:
DS22200A-page 34
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS22200A-page 35
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Cleveland
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/26/09
DS22200A-page 36
© 2009 Microchip Technology Inc.
MCP1804T-3302I/OT 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
MCP1804T-3302I/MT | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 功能相似 | |
MCP1804T-3302I/DB | MICROCHIP | 3.3 V FIXED POSITIVE LDO REGULATOR, 1.7 V DROPOUT, PDSO3, PLASTIC, SOT-223, 4 PIN | 功能相似 |
MCP1804T-3302I/OT 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
MCP1804T-3302IDB | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-3302IMB | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-3302IMT | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-3302IOT | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-5002I | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-5002I/DB | MICROCHIP | 5 V FIXED POSITIVE LDO REGULATOR, 1.3 V DROPOUT, PDSO3, PLASTIC, SOT-223, 4 PIN | 获取价格 | |
MCP1804T-5002I/DM | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-5002I/MB | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-5002I/MT | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 | |
MCP1804T-5002I/OT | MICROCHIP | 150 mA, 28V LDO Regulator With Shutdown | 获取价格 |
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