MCP6007-E/MSVAO [MICROCHIP]
1 MHz Operational Amplifier with EMI Filtering;型号: | MCP6007-E/MSVAO |
厂家: | MICROCHIP |
描述: | 1 MHz Operational Amplifier with EMI Filtering |
文件: | 总46页 (文件大小:3293K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP6006/6R/6U/7/9
1 MHz Operational Amplifier with EMI Filtering
Description
Features
The Microchip Technology Inc. MCP6006/6R/6U/7/9
operational amplifier operates with a single supply
voltage as low as 1.8V, while drawing low quiescent
current (70 µA, maximum per amplifier). This op amp
also has low input offset voltage (±1.6 mV, maximum),
and rail-to-rail input and output operation. In addition, the
MCP6006/6R/6U/7/9 is unity gain stable and has a gain
bandwidth product of 1 MHz (typical). This combination
of features supports battery-powered and portable
applications.
• Low Quiescent Current:
- 70 µA (maximum)/amplifier
• Low Input Offset Voltage:
- ±1.6 mV (maximum)
• Enhanced EMI Protection:
- Electromagnetic Interference Rejection Ratio
(EMIRR) at 1.8 GHz: 95 dB
• Supply Voltage Range: 1.8V to 5.5V
• Gain Bandwidth Product: 1 MHz (typical)
• Rail-to-Rail Input/Output
The MCP6006/6R/6U/7/9 has enhanced EMI protec-
tion, minimizing electromagnetic interference from
external sources. This feature makes it well-suited for
EMI-sensitive applications, such as power lines, radio
stations and mobile communications.
• Unity Gain Stable
• No Phase Reversal
• Quick Start-up Time: 6 µs (typical)
• Small Packages
This product family is offered in single (MCP6006), dual
(MCP6007) and quad (MCP6009) packages. All
devices are designed using an advanced CMOS pro-
cess and fully specified in the extended temperature
range from -40°C to +125°C.
• Extended Temperature Range: -40°C to +125°C
• AEC Q100 Qualified, Grade 1
Applications
• Smoke Detectors
• Automotive, see Product Identification System
(Automotive)
Package Types
• Battery-Powered Systems
• Sensor Conditioning
• Battery Current Monitoring
MCP6006
5-Lead SC70, SOT-23
MCP6006R
5-Lead SOT-23
VOUT
VSS
VDD
1
2
3
5
VOUT
VDD
VSS
1
2
3
5
4
Design Aids
V
+
V -
IN
4
V
+
V -
IN
IN
IN
• SPICE Macro Models
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
MCP6006U
5-Leadꢀ6&ꢁꢂꢃ SOT-23
V
+
VDD
1
2
3
5
IN
VSS
MCP6009
14-Lead TSSOP, SOIC
Start-up Time
V
-
VOUT
4
IN
Start-up Time vs. Nearest Competitor
VOUTD
VOUTA
1
2
3
4
5
6
7
14
13
12
11
10
9
MCP6007
VIND
VIND
VSS
-
VINA
VINA
-
+
8-Lead SOIC, MSOP
VDD
+
V
= 100 mV
PP
IN
VDD
VOUTA
1
2
3
4
8
7
6
5
VINC
VINC
+
-
VOUTB
VINB
VINB
+
-
VINA
VINA
-
+
VINB
VINB
-
+
VOUTC
VOUTB
VSS
8
Time (10 µs/div)
2020-2021 Microchip Technology Inc.
DS20006411B-page 1
MCP6006/6R/6U/7/9
1.0
1.1
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
VDD – VSS .....................................................................................................................................................................6V
Current at Analog Input Pins (VIN+, VIN-)................................................................................................................±5 mA
Analog Inputs (VIN+, VIN-)††..................................................................................................... VSS – 0.5V to VDD + 0.5V
Difference Input Voltage ................................................................................................................................ |VDD – VSS
|
Output Short-Circuit Current (Note 1) .............................................................................................................Continuous
Storage Temperature...............................................................................................................................-65°C to +150°C
Maximum Junction Temperature (TJ) ....................................................................................................................+150°C
ESD Protection on All Pins (HBM; CDM; MM) 3 kV; 2 kV; 300V
Note 1: Short-circuit to ground, one amplifier per package.
†
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
†† See Section 4.1.2 “Input Voltage Limits”.
1.2
Specifications
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4,
VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Input Offset
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Offset Voltage
VOS
-1.6
—
—
1.6
—
mV
Input Offset Drift with
Temperature
VOS/TA
±0.6
µV/°C TA= -40°C to +125°C
Power Supply Rejection Ratio
PSRR
80
95
—
dB
Input Bias Current and Impedance
Input Bias Current
IB
—
—
—
—
—
—
±1
19
—
—
—
—
—
—
pA
pA
pA
TA = +85°C
200
TA = +125°C
Input Offset Current
IOS
ZCM
±1
pA
Common-Mode Input Impedance
Differential Input Impedance
1013||6
1013||1
||pF
|pF
ZDIFF
DS20006411B-page 2
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4,
OUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
V
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Common-Mode
Common-Mode Input Voltage
Range
VCMR
VSS – 0.3
—
—
90
VDD + 0.3
VDD + 0.1
—
V
VSS – 0.1
TA= -40°C to +125°C
Common-Mode Rejection Ratio
CMRR
—
dB
dB
dB
dB
dB
V
DD = 5.5V,
VCM = -0.3V to 4.1V
DD = 5.5V,
VCM = -0.3V to 5.8V
DD = 1.8V,
VCM = -0.3V to 2.1V
DD = 5.5V, VCM = -0.3V
60
60
50
50
76
76
76
76
—
—
—
—
V
V
V
to 5.8V (MCP6006/6R/6U)
VDD = 1.8V, VCM = -0.3V
to 2.1V (MCP6006/6R/6U)
Open-Loop Gain
DC Open-Loop Gain
(Large Signal)
AOL
105
126
—
dB
0.2 < VOUT < (VDD – 0.2V)
Output
High-Level Output Voltage
VOH
VOL
ISC
VDD – 10 VDD – 6
VDD – 80 VDD – 54
—
—
mV
VDD = 5.5V, RL = 10 k
VDD = 5.5V, RL = 1 k
VDD = 5.5V, RL = 10 k
VDD = 5.5V, RL = 1 k
VDD = 1.8V
Low-Level Output Voltage
Output Short-Circuit Current
—
—
—
—
VSS + 6 VSS + 10
SS + 54 VSS + 80
V
±6
—
—
mA
mA
±30
VDD = 5.5V
Power Supply
Supply Voltage
VDD
IQ
1.8
—
—
—
—
50
6
5.5
70
—
V
Quiescent Current per Amplifier
Start-up Time
µA
µs
dB
IO = 0
tstart
VDD = 0V to 5.5V
Crosstalk
140
—
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
AC Response
Sym.
Min.
Typ.
Max.
Units
Conditions
Gain Bandwidth Product
Phase Margin
GBWP
PM
—
—
—
—
1
70
1.9
3
—
—
—
—
MHz
°
G = +1 V/V
DD = 5.5V
Slew Rate
SR
V/µs
µs
V
Settling Time
ts
To 0.1%, VDD = 5V,
2V step, G = +1
—
—
3.5
—
—
To 0.01%, VDD = 5V,
2V step, G = +1
Total Harmonic Distortion + Noise THD + N
0.0025
%
VDD = 5V, Vo = 1VRMS,
G = +1, f = 1kHz, 80 kHz
measurement BW
2020-2021 Microchip Technology Inc.
DS20006411B-page 3
MCP6006/6R/6U/7/9
AC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Noise
Input Noise Voltage
Eni
eni
—
—
—
—
—
—
—
—
—
3.3
25
—
—
—
—
—
—
—
—
—
µVP-P
f = 0.1 Hz to 10 Hz
Input Noise Voltage Density
nV/Hz f = 1 kHz
nV/Hz f = 10 kHz
fA/Hz f = 1 kHz
22
Input Noise Current Density
ini
0.6
60
Electromagnetic Interference
Rejection Ratio
EMIRR
dB
VIN = 100 mVPK, 400 MHz
VIN = 100 mVPK, 900 MHz
VIN = 100 mVPK, 1800 MHz
VIN = 100 mVPK, 2400 MHz
VIN = 100 mVPK, 5800 MHz
90
95
100
100
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Temperature Ranges
Sym.
Min.
Typ.
Max.
Units
Conditions
Operating Temperature Range
TA
TA
-40
-65
—
—
+125
+150
°C
°C
Note 1
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5-Lead SC70
Thermal Resistance, 5-Lead SOT-23
Thermal Resistance, 8-Lead MSOP
Thermal Resistance, 8-Lead SOIC
Thermal Resistance, 14-Lead TSSOP
Thermal Resistance, 14-Lead SOIC
JA
JA
JA
JA
JA
JA
—
—
—
—
—
—
331
221
206
150
100
120
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Note 1: The internal Junction Temperature (TJ) must not exceed the absolute maximum specification of +150°C.
DS20006411B-page 4
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.1
DC Inputs
600
400
200
0
40
VDD = 5.5V
1900 Samples
TA = +25°C
35
30
25
20
15
10
5
TA = -40°C
A = +25°C
T
VDD = 1.8V
VDD = 5.5V
-200
-400
-600
TA = +85°C
A = +125°C
T
0
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Common Mode Voltage (V)
Input Offset Voltage (μV)
FIGURE 2-1:
Input Offset Voltage
FIGURE 2-4:
Input Offset Voltage vs.
Histogram.
Common-Mode Input Voltage.
40
200
150
114 Samples
TA = -40°C to +125°C
35
30
25
20
15
10
5
100
50
VDD = 5.5V
VDD = 5.5V
0
VDD = 1.8V
VDD = 1.8V
-50
-100
-150
-200
VCM = VSS
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
Input Offset Voltage Drift (μV/°C)
FIGURE 2-2:
Input Offset Voltage Drift
FIGURE 2-5:
Input Offset Voltage vs.
Histogram.
Output Voltage.
1000
800
600
400
200
0
-200
-400
-600
-800
500
400
300
200
100
0
-100
-200
-300
-400
-500
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
VCM = VSS
VDD = 1.8V
-1000
-0.4-0.2
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Input Common Mode Voltage (V)
Supply Voltage (V)
FIGURE 2-3:
Input Offset Voltage vs.
FIGURE 2-6:
Input Offset Voltage vs.
Common-Mode Input Voltage.
Power Supply Voltage.
2020-2021 Microchip Technology Inc.
DS20006411B-page 5
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
5
4
3
2
1
140
130
120
110
100
90
VDD = 5.5V
VDD = 5.5V
VDD = 1.8V
IOS
0
-1
-2
-3
-4
-5
IB+
IB-
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 2-7:
Input Bias, Offset Current
FIGURE 2-10:
DC Open-Loop Gain vs.
vs. Common-Mode Voltage.
Ambient Temperature.
400
0.001
1m
VDD = 5.5V
0.0001
100μ
300
0.00001
10μ
TA = +125°C
200
100
0
0.000001
1μ
0.0000001
100n
TA = +125°C
TA = +85°C
1E-08
10n
T
A = +85°C
TA = +25°C
TA = -40°C
1E-09
1n
-100
-200
1E-10
100p
1E-11
10p
-1 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
VIN (V)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
FIGURE 2-8:
Input Bias Current vs.
FIGURE 2-11:
Measured Input Current vs.
Common-Mode Input Voltage.
Input Voltage (below V ).
SS
110
VDD = +5.5V
105
100
95
90
85
80
75
70
PSRR
CMRR (VCM = -0.1V to +5.6V)
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
FIGURE 2-9:
CMRR, PSRR vs. Ambient
Temperature.
DS20006411B-page 6
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.2
Other DC Voltages and Currents
80
70
60
50
40
30
20
50
40
30
20
10
+125ᵒC
+85ᵒC
+25ᵒC
-40ᵒC
VDD = +5.5V
VDD = +1.8V
0
-10
-20
-30
-40
-50
Per Amplifier
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
-50
-25
0
25
50
75
100
125
Power Supply Voltage (V)
Ambient Temperature (°C)
FIGURE 2-12:
Quiescent Current vs.
FIGURE 2-15:
Output Short-Circuit Current
Ambient Temperature.
vs. Power Supply Voltage.
80
70
60
50
40
400
350
300
250
200
150
100
50
VDD = 1.8V
VOL
TA = -40°C
30
20
10
0
TA = +25°C
TA = +85°C
TA = +125°C
VOH
Per Amplifier
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
0.0
1.0
2.0
3.0
4.0
Output Current Magnitude (mA)
FIGURE 2-13:
Quiescent Current vs.
FIGURE 2-16:
Output Voltage Headroom
Power Supply Voltage.
vs. Output Current.
100
90
80
300
250
200
150
100
50
70
60
50
40
30
20
10
0
VDD = 1.8V
VOH
VOL - V
VDD = 5.5V
Per Amplifier
VDD = 5.5V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Common Mode Input Voltage (V)
0.0
2.0
4.0
6.0
8.0
10.0
Output Current Magnitude (mA)
FIGURE 2-14:
Quiescent Current vs.
FIGURE 2-17:
Output Voltage Headroom
Common-Mode Input Voltage.
vs. Output Current.
2020-2021 Microchip Technology Inc.
DS20006411B-page 7
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.3
Frequency Response
140
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
160
140
120
100
80
Representative Part
120
100
80
60
40
20
0
Gain Bandwidth Product
CMRR
PSRR-
PSRR+
60
Phase Margin
40
20
VDD = 1.8V
0
-50
-25
0
25
50
75
100 125
1k
100
10k
Frequency (Hz)
100k
1M
Ambient Temperature (°C)
FIGURE 2-18:
CMRR, PSRR vs.
FIGURE 2-21:
Gain Bandwidth Product,
Frequency.
Phase Margin vs. Ambient Temperature.
140
120
100
80
225
180
135
90
10000
1000
100
Phase
60
45
GN:
101 V/V
11 V/V
1 V/V
40
0
Gain
10
1
20
-45
-90
-135
0
VDD = 5.5V
1k
10k
100k
-20
0.1
1
10 100 1k 10k 100k 1M 10M
111.0111213116
Frequency (Hz)
Frequency (Hz)
FIGURE 2-19:
Open-Loop Gain, Phase vs.
FIGURE 2-22:
Closed-Loop Output
Frequency.
Impedance vs. Frequency.
120
100
80
60
40
20
0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
160
140
Gain Bandwidth Product
120
100
80
60
40
Phase Margin
20
0
VIN = 100 mVPK
VDD = 5.5V
VDD = 5.5V
-50
-25
0
25
50
75
100 125
10
10M
100
100M
1000
1G
10000
10G
Ambient Temperature (°C)
Frequency (Hz)
FIGURE 2-20:
Gain Bandwidth Product,
FIGURE 2-23:
EMIRR vs. Frequency.
Phase Margin vs. Ambient Temperature.
DS20006411B-page 8
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
10
120
100
80
60
40
20
0
VDD = 5.5V
1
EMIRR @ 2400 MHz
EMIRR @ 1800 MHz
EMIRR @ 900 MHz
EMIRR @ 400 MHz
0.1
0.01
0.1
RF Input Peak Voltage (VPK
1
10k
1M
10M
1k
100k
)
Frequency (Hz)
FIGURE 2-24:
EMIRR vs. RF Input
FIGURE 2-26:
Maximum Output Voltage
Peak-to-Peak Voltage.
Swing vs. Frequency.
0
-20
-40
-60
-80
-100
-120
-140
E
1k
E
10k
E
100k
Frequency (Hz)
1M
10M
FIGURE 2-25:
Channel Separation vs.
Frequency.
2020-2021 Microchip Technology Inc.
DS20006411B-page 9
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.4
Input Noise
40
35
30
25
20
15
10
5
VDD = 5.5V
VCM = 2.5V
G = 1
-10
-30
BW = 80 kHz
f = 1 kHz
VDD = 1.8V
-50
G = -1, RL = 2 kΩ
G = +1, RL = 2 kΩ
VDD = 5.5V
-70
-90
G = -1, RL = 10 kΩ
G = +1, RL = 10 kΩ
f = 10 kHz
-110
0
0.001
0.01
0.1
1
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Amplitude (VRMS
)
Common Mode Input Voltage (V)
FIGURE 2-27:
Input Noise Voltage Density
FIGURE 2-30:
THD + N vs. Amplitude.
vs. Common-Mode Voltage.
10
10μ
101μ
100n
10n
1n
0.1
1
10
100
1k
10k
100k
11 1.+0 11 113 1
Frequency (Hz)
FIGURE 2-28:
vs. Frequency.
Input Noise Voltage Density
FIGURE 2-31:
Noise.
0.1 Hz to 10 Hz Voltage
-50
VDD = 5.5V
VCM = 2.5V
G = 1
-60
-70
BW = 80 kHz
VOUT = 0.5VRMS
RL = 2 kΩ
-80
-90
RL = 10 kΩ
-100
-110
100
1k
Frequency (Hz)
10k
FIGURE 2-29:
THD + N vs. Frequency.
DS20006411B-page 10
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.5
Time Response
6
5
4
3
2
1
0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Falling Edge, VDD =5.5V
VIN
VOUT
Rising Edge, VDD =5.5V
Rising Edge, VDD =1.8V
Falling Edge, VDD =1.8V
VDD = 5.5V
G = +1 V/V
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
Time (10 μs/div)
FIGURE 2-32:
Slew Rate vs. Ambient
FIGURE 2-35:
Large Signal Noninverting
Temperature.
Pulse Response.
VOUT
VIN
VDD = 5.5V
G = +1 V/V
Time (10 μs/div)
FIGURE 2-33:
Small Signal Noninverting
FIGURE 2-36:
Large Signal Inverting Pulse
Pulse Response.
Response.
7
6
5
VIN
VIN
VOUT
4
VDD = 5.5V
G = -1 V/V
3
2
VDD = 5.5V
G = +1 V/V
1
0
VOUT
-1
Time (10 μs/div)
Time (0.1 ms/div)
FIGURE 2-34:
Small Signal Inverting Pulse
FIGURE 2-37:
The MCP6006/6R/6U/7/9
Response.
Device Shows No Phase Reversal.
2020-2021 Microchip Technology Inc.
DS20006411B-page 11
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
6
5
4
3
2
1
0
60
50
40
30
20
10
0
VDD = 5.5V
No Bypass Capacitors
VIN = 100mVPP
Overshoot (+)
Overshoot (-)
VIN = 100 mV
G = +1 V/V
VOUT
tstart
0
200
400
600
800
1000
Capacitive Load (pF)
Time (10 μs/div)
FIGURE 2-38:
Start-up Time.
FIGURE 2-39:
Overshoot vs. Capacitive
Load.
DS20006411B-page 12
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1, Table 3-2, and Table 3-3.
TABLE 3-1:
PIN FUNCTION TABLE – SINGLES
MCP6006
MCP6006R
MCP6006U
Symbol
Description
Analog Output
5-Lead SC70, SOT-23
5-Lead SOT-23
5-Lead SC70, SOT-23
1
2
3
4
5
1
5
3
4
2
4
2
1
3
5
VOUT
VSS
Negative Power Supply
Noninverting Input
Inverting Input
VIN+
VIN-
VDD
Positive Power Supply
TABLE 3-2:
PIN FUNCTION TABLE – DUALS
MCP6007
Symbol
Description
8-Lead MSOP, SOIC
1
2
3
4
5
6
7
8
VOUTA
Analog Output; Op Amp A
Inverting Input; Op Amp A
Noninverting Input; Op Amp A
Negative Power Supply
VINA
VINA
VSS
-
+
VINB+
Noninverting Input; Op Amp B
Inverting Input; Op Amp B
Analog Output; Op Amp B
Positive Power Supply
VINB
-
VOUTB
VDD
TABLE 3-3:
PIN FUNCTION TABLE – QUADS
MCP6009
Symbol
Description
14-Lead TSSOP, SOIC
1
2
VOUTA
Analog Output; Op Amp A
VINA
VINA
VDD
-
Inverting Input; Op Amp A
Noninverting Input; Op Amp A
Positive Power Supply
3
+
4
5
VINB
+
Noninverting Input; Op Amp B
Inverting Input; Op Amp B
Analog Output; Op Amp B
Analog Output; Op Amp C
Inverting Input; Op Amp C
Noninverting Input; Op Amp C
Negative Power Supply
6
VINB
-
7
VOUTB
VOUTC
VINC
VINC
VSS
8
9
-
10
11
12
13
14
+
VIND
+
Noninverting Input; Op Amp D
Inverting Input; Op Amp D
Analog Output; Op Amp D
VIND
-
VOUTD
2020-2021 Microchip Technology Inc.
DS20006411B-page 13
MCP6006/6R/6U/7/9
3.1
Analog Outputs
3.3
Power Supply Pins (VSS, VDD)
The analog output pins (VOUTx) are low-impedance
voltage sources.
The positive power supply (VDD) is 1.8V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD
.
3.2
Analog Inputs
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD needs
bypass capacitors.
The noninverting and inverting inputs (VINx+, VINx-) are
high-impedance CMOS inputs with low bias currents.
DS20006411B-page 14
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
4.1.3
INPUT CURRENT LIMITS
4.0
APPLICATION INFORMATION
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the currents into
the input pins (see Section 1.1, Absolute Maximum
Ratings†).
The MCP6006/6R/6U/7/9 operational amplifier is unity
gain stable and suitable for a wide range of general
purpose applications.
Figure 4-2 shows one approach to protecting these
inputs. The resistors, R1 and R2, limit the possible
currents in or out of the input pins through the ESD
4.1
Rail-to-Rail Input
4.1.1
PHASE REVERSAL
diodes to either VDD or VSS
.
The MCP6006/6R/6U/7/9 op amp is designed to
prevent phase reversal, when the input pins exceed the
supply voltages. Figure 2-37 shows the input voltage
exceeding the supply voltage with no phase reversal.
VDD
4.1.2
INPUT VOLTAGE LIMITS
V1
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the voltages at the
input pins (see Section 1.1, Absolute Maximum
Ratings†).
+
VOUT
R1
MCP6006
V2
–
R2
The Electrostatic Discharge (ESD) protection on the
inputs can be depicted as shown in Figure 4-1. This
structure was chosen to protect the input transistors
against many, but not all, overvoltage conditions and to
minimize the Input Bias (IB) current.
VSS – min(V1, V2)
5 mA
min(R1, R2) >
min(R1, R2) >
max(V1,V2) – VDD
5 mA
FIGURE 4-2:
Protecting the Analog Inputs.
VDD
-IN
‐
VDD
OUT
VSS
+IN
+
VSS
FIGURE 4-1:
Simplified Analog Input ESD
Structures.
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that go well above VDD; their
breakdown voltage is high enough to allow normal
operation. At 0.5V above VDD or below VSS, the input
currents are typically less than 5 mA. Very fast ESD
events that meet the specification are limited so that
damage does not occur.
2020-2021 Microchip Technology Inc.
DS20006411B-page 15
MCP6006/6R/6U/7/9
Figure 4-4 shows the output voltage for the MCP6007
and a similar op amp from a competitor, while Figure 4-5
shows the inrush current. When power is first applied to
the MCP6007, the output is turned off (Point B) and
driven by the load. After 6 µs, the output is turned on
(Point C) and VOUT follows the input sine wave. Mean-
while, the competitor’s output is uncontrolled during the
first 4 µs (Point A) and has some distortion on the output
(Point D) prior to turning on after 50 µs (Point E).
4.1.4
NORMAL OPERATION
The input stage of the MCP6006/6R/6U/7/9 op amp
uses two differential input stages in parallel. One oper-
ates at a low Common-Mode Input Voltage (VCM), while
the other operates at a high VCM. With this topology,
the device operates with a VCM of up to 300 mV above
VDD and 300 mV below VSS. The input offset voltage is
measured at VCM = VSS – 0.3V and VDD + 0.3V to
ensure proper operation.
The transition between the input stages occurs when
VCM is near VDD – 0.9V (see Figures 2-3 and 2-4). For
the best distortion performance and gain linearity with
noninverting gains, avoid this region of operation.
A
B
4.2
Rail-to-Rail Output
D
The output voltage range of the MCP6006/6R/6U/7/9
op amp is 0.006V (typical) and 5.494V (typical) when
RL = 10 k is connected to VDD/2 and VDD = 5.5V.
Refer to Figures 2-16 and 2-17 for more information.
E
C
FIGURE 4-4:
Start-up Time Voltages.
4.3
Start-up
The MCP6006/6R/6U/7/9 family of parts quickly
controls the output when power (VDD) is initially applied
to the device (start-up). Bypass capacitors are
removed during the start-up testing to minimize inrush
currents (see Figure 4-3). When the op amp is con-
trolled and is off, the output impedance is high and
VOUT is VL or 1V. When the op amp turns on, the output
becomes low-impedance and VOUT follows the input
sine wave; this is used as the start-up time.
FIGURE 4-5:
I
During Start-up.
DD
VDD
3V
0
+
-
VDD
VSS
VOUT
RL
VL = 1V
Start-up Test Circuit.
FIGURE 4-3:
DS20006411B-page 16
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
4.4
Capacitive Loads
Guard Ring
VIN- VIN+
VSS
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity gain buffer (G = +1 V/V) is the
most sensitive to the capacitive loads, all gains show
the same general behavior.
FIGURE 4-7:
for Inverting Gain.
Example Guard Ring Layout
When driving large capacitive loads with the
MCP6006/6R/6U/7/9 op amp, a small series resistor at
the output (RISO in Figure 4-6) improves the feedback
loop’s phase margin (stability) by making the output
load resistive at higher frequencies. The bandwidth will
be generally lower than the bandwidth with no
capacitance load.
1. Noninverting Gain and Unity Gain Buffer:
a) Connect the noninverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN-). This biases the guard ring to the
Common-mode input voltage.
2. Inverting Gain and Transimpedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
–
RISO
VOUT
a) Connect the guard ring to the noninverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
op amp (e.g., VDD/2 or ground).
MCP6006
+
VIN
CL
b) Connect the inverting pin (VIN-) to the input
with a wire that does not touch the PCB
surface.
FIGURE 4-6:
Stabilizes Large Capacitive Loads.
Output Resistor, R
,
ISO
4.5
Supply Bypass
4.7
Unused Op Amps
The MCP6006/6R/6U/7/9 op amp’s power supply pin
(VDD for single-supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
high-frequency performance. It can use a bulk capaci-
tor (i.e., 1 µF or larger) within 100 mm to provide large,
slow currents. This bulk capacitor can be shared with
other analog parts.
An unused op amp in a dual (MCP6007) or quad
(MCP6009) package should be configured as shown in
Figure 4-8. These circuits prevent the output from
toggling and causing crosstalk. Circuit A sets the
op amp at its minimum noise gain. The resistor divider
produces any desired reference voltage within the out-
put voltage range of the op amp; the op amp buffers
that reference voltage. Circuit B uses the minimum
number of components.
4.6
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow, which is greater than the
MCP6006/6R/6U/7/9’s bias current at +25°C (±1 pA,
typical).
¼ MCP6009 (A)
VDD
¼ MCP6009 (B)
VDD
VDD
R1
R2
VREF
R2
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-7.
VREF = VDD
R1 + R2
FIGURE 4-8:
Unused Op Amps.
2020-2021 Microchip Technology Inc.
DS20006411B-page 17
MCP6006/6R/6U/7/9
.
4.8
Electromagnetic Interference
Rejection Ratio (EMIRR)
Definitions
VDD
VREF
V
DD
–
+
The Electromagnetic Interference (EMI) is the
disturbance that affects an electrical circuit due to
either electromagnetic induction or electromagnetic
radiation emitted from an external source.
V
OUT
MCP6006
R1
The parameter which describes the EMI robustness of
an op amp is the Electromagnetic Interference Rejec-
tion Ratio (EMIRR). It quantitatively describes the
effect that an RF interfering signal has on op amp
performance. Internal passive filters make EMIRR
better compared with older parts. This means that with
good PCB layout techniques, your EMC performance
should be better.
FIGURE 4-9:
CO Gas Sensor Circuit.
4.9.2 PRESSURE SENSOR AMPLIFIER
The MCP6006/6R/6U/7/9 is well-suited for conditioning
sensor signals in battery-powered applications. Many
sensors are configured as Wheatstone bridges. Strain
gauges and pressure sensors are two common
examples.
EMIRR is defined as:
EQUATION 4-1:
Figure 4-10 shows a strain gauge amplifier, using the
MCP6006/6R/6U/7/9 Enhanced EMI protection device.
The difference amplifier with EMI robustness op amp is
used to amplify the signal from the Wheatstone bridge.
The two op amps, configured as buffers and connected
at outputs of pressure sensors, prevent resistive load-
ing of the bridge by resistors, R1 and R2. Resistors, R1,
R2 and R3, R5, need to be chosen with very low
tolerance to match the CMRR.
VRF
-------------
EMIRRdB= 20 log
VOS
Where:
VRF = Peak Amplitude of
RF Interfering Signal (VPK
)
VOS = Input Offset Voltage Shift (V)
4.9
Application Circuits
VDD
VDD
R3
10 k
R+∆R
R-∆R
4.9.1
CARBON MONOXIDE GAS SENSOR
½ MCP6007
-
+
VDD
R1
100
A Carbon Monoxide (CO) gas detector is a device that
detects the presence of carbon monoxide gas. Usually
this is battery powered and transmits audible and
visible warnings.
Vb
VOUT
MCP6006
-
+
Va
R2
VDD
100
The sensor responds to CO gas by reducing its resis-
tance proportionaly to the amount of CO present in the
air exposed to the internal element. On the sensor
module, this variable is part of a voltage divider formed
by the internal element and potentiometer R1. The
output of this voltage divider is fed into the noninverting
inputs of the MCP6006 op amp. The device is config-
ured as a buffer with unity gain and is used to provide
a nonloaded test point for sensor sensitivity.
R4
10 kΩ
-
+
R-∆R
R+∆R
½ MCP6007
10k
-------------
VOUT = Va – Vb
100
Strain Gauge
FIGURE 4-10:
Pressure Sensor Amplifier.
Because this sensor can be corrupted by parasitic
electromagnetic signals, the MCP6006 op amp can be
used for conditioning this sensor.
In Figure 4-9, the variable resistor is used to calibrate
the sensor in different environments.
DS20006411B-page 18
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5.3
Application Notes
5.0
DESIGN AIDS
The following Microchip Analog Design Notes and Appli-
cation Notes are available on the Microchip website at
www.microchip.com/appnotes and are recommended
as supplemental reference resources:
Microchip provides the basic design tools needed for
the MCP6006/6R/6U/7/9 op amp.
5.1
Microchip Advanced Part Selector
(MAPS)
• ADN003 – “Select the Right Operational Amplifier
for your Filtering Circuits”, Microchip Technology
Inc. (DS21821)
MAPS is a software tool that helps semiconductor
professionals efficiently identify the Microchip
devices that fit a particular design requirement.
Available at no cost from the Microchip website at
www.microchip.com/ maps, MAPS is an overall selec-
tion tool for Microchip’s product portfolio that includes
Analog, Memory, MCUs and DSCs. Using this tool, you
can define a filter to sort features for a parametric
search of devices and export side-by-side technical
comparison reports. Helpful links are also provided for
data sheets, purchase and sampling of Microchip parts.
• AN722 – “Operational Amplifier Topologies and
DC Specifications”, Microchip Technology Inc.
(DS00722)
• AN723 – “Operational Amplifier AC Specifications
and Applications”, Microchip Technology Inc.
(DS00723)
• AN884 – “Driving Capacitive Loads With
Op Amps”, Microchip Technology Inc. (DS00884)
• AN990 – “Analog Sensor Conditioning
Circuits – An Overview”, Microchip Technology
Inc. (DS00990)
5.2
Analog Demonstration and
Evaluation Boards
• AN1177 – “Op Amp Precision Design: DC Errors”,
Microchip Technology Inc. (DS01177)
Microchip offers
a broad spectrum of Analog
• AN1228 – “Op Amp Precision Design: Random
Noise”, Microchip Technology Inc. (DS01228)
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market.
For a complete listing of these boards and their
corresponding user’s guides and technical informa-
tion, visit the Microchip website at:
• AN1258 – “Op Amp Precision Design: PCB
Layout Techniques”, Microchip Technology Inc.
(DS01258).
These application notes and others are listed in the
design guide:
www.microchipdirect.com.
Some boards that are especially useful are:
• “Signal Chain Design Guide”, Microchip
Technology inc. (DS21825).
• MCP6XXX Amplifier Evaluation Board 2
(P/N DS51668)
• MCP6XXX Amplifier Evaluation Board 3
(P/N DS51673)
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
(P/N SOIC8EV)
• 5/6-Pin SOT-23 Evaluation Board
(P/N VSUPEV2)
• 14-Pin SOIC/TSSOP/DIP Evaluation Board
(P/N SOIC14EV)
2020-2021 Microchip Technology Inc.
DS20006411B-page 19
MCP6006/6R/6U/7/9
NOTES:
DS20006411B-page 20
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SC70 (MCP6006/6U)
Example
Device
Marking
MCP6006
GANN
GFNN
XXNN
GA25
MCP6006U
Example:
5-Lead SOT-23 (MCP6006/6U/6R)
Device
Marking
MCP6006
AAA5
AAA6
AAA7
MCP6006U
XXXXY
AAA50
MCP6006R
WWNNN
31256
Note: Applies to 5-Lead SOT-23.
8-Lead SOIC (MCP6007)
Example:
XXXXXXXX
XXXXYYWW
MCP6007
e
3
SN 2031
NNN
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2020-2021 Microchip Technology Inc.
DS20006411B-page 21
MCP6006/6R/6U/7/9
Package Marking Information (Continued)
8-Lead MSOP (MCP6007)
Example:
XXXXXX
6007E
YWWNNN
031256
14-Lead SOIC (MCP6009)
Example:
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
MCP6009
e
3
E/SL
3124256
14-Lead TSSOP (MCP6009)
Example:
MCP6009E
2031
XXXXXXXX
YYWW
256
NNN
DS20006411B-page 22
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
e
e
B
E
3
1
E1
2X
0.15 C
4
N
5X TIPS
0.30 C
NOTE 1
2X
0.15 C
5X b
0.10
C A B
TOP VIEW
c
A2
A
C
SEATING
PLANE
A1
L
SIDE VIEW
END VIEW
Microchip Technology Drawing C04-061-LT Rev E Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 23
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Overall Height
Standoff
Molded Package Thickness
Overall Length
Overall Width
N
5
e
0.65 BSC
A
A1
A2
D
E
0.80
0.00
0.80
-
-
-
1.10
0.10
1.00
2.00 BSC
2.10 BSC
Molded Package Width
Terminal Width
Terminal Length
E1
b
L
c
1.25 BSC
0.15
0.10
0.08
-
0.20
-
0.40
0.46
0.26
Lead Thickness
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-061-LT Rev E Sheet 2 of 2
DS20006411B-page 24
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
Gx
SILK SCREEN
3
4
2
1
5
C
G
Y
X
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
0.65 BSC
2.20
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width
Contact Pad Length
Distance Between Pads
Distance Between Pads
X
Y
G
Gx
0.45
0.95
1.25
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2061-LT Rev E
2020-2021 Microchip Technology Inc.
DS20006411B-page 25
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.20 C 2X
D
e1
A
D
N
E/2
E1/2
E1
E
(DATUM D)
(DATUM A-B)
0.15 C D
2X
NOTE 1
1
2
e
B
NX b
0.20
C A-B D
TOP VIEW
A
A2
A1
A
0.20 C
SEATING PLANE
A
SEE SHEET 2
C
SIDE VIEW
Microchip Technology Drawing C04-091-OT Rev F Sheet 1 of 2
DS20006411B-page 26
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Outside lead pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
N
5
e
0.95 BSC
1.90 BSC
e1
A
A2
A1
E
E1
D
L
0.90
0.89
-
-
-
-
1.45
1.30
0.15
2.80 BSC
1.60 BSC
2.90 BSC
0.30
-
0.60
Footprint
Foot Angle
Lead Thickness
Lead Width
L1
0.60 REF
I
0°
0.08
0.20
-
-
-
10°
0.26
0.51
c
b
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 27
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
SILK SCREEN
5
Y
Z
C
G
1
2
E
GX
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
0.95 BSC
2.80
MAX
Contact Pitch
E
C
Contact Pad Spacing
Contact Pad Width (X5)
Contact Pad Length (X5)
Distance Between Pads
Distance Between Pads
Overall Width
X
Y
G
GX
Z
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2091-OT Rev F
DS20006411B-page 28
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
2X
0.10 C A–B
2X
0.10 C A–B
1
2
NOTE 1
e
NX b
0.25
C A–B D
B
NOTE 5
TOP VIEW
0.10 C
0.10 C
C
A2
A
SEATING
PLANE
8X
SIDE VIEW
A1
h
R0.13
R0.13
h
H
0.23
L
SEE VIEW C
(L1)
VIEW A–A
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 29
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
N
8
e
1.27 BSC
A
-
-
-
-
1.75
-
0.25
A2
A1
E
1.25
0.10
§
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (Optional)
Foot Length
E1
D
h
3.90 BSC
4.90 BSC
0.25
0.40
-
-
0.50
1.27
L
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
L1
1.04 REF
0°
0.17
0.31
5°
-
-
-
-
-
8°
c
b
0.25
0.51
15°
5°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 2 of 2
DS20006411B-page 30
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Contact Pitch
E
C
X1
Y1
1.27 BSC
5.40
Contact Pad Spacing
Contact Pad Width (X8)
Contact Pad Length (X8)
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev F
2020-2021 Microchip Technology Inc.
DS20006411B-page 31
MCP6006/6R/6U/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006411B-page 32
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2020-2021 Microchip Technology Inc.
DS20006411B-page 33
MCP6006/6R/6U/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006411B-page 34
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
NOTE 5
A
D
E
N
E
2
E2
2
E1
2X
0.10 C D
NOTE 1
2X N/2 TIPS
0.20 C
1
2
3
e
NX b
0.25
C A–B D
0.10 C
NOTE 5
B
TOP VIEW
C
A2
A
SEATING
PLANE
14X
0.10 C
SIDE VIEW
A1
h
h
R0.13
H
R0.13
c
SEE VIEW C
L
VIEW A–A
(L1)
VIEW C
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 35
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
N
14
1.27 BSC
e
A
-
-
-
-
1.75
-
0.25
A2
A1
E
1.25
0.10
§
Overall Width
6.00 BSC
Molded Package Width
Overall Length
Chamfer (Optional)
Foot Length
E1
D
h
L
L1
3.90 BSC
8.65 BSC
0.25
0.40
-
-
0.50
1.27
Footprint
1.04 REF
Lead Angle
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
0°
0°
0.10
0.31
5°
-
-
-
-
-
-
-
8°
0.25
0.51
15°
15°
c
b
5°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall
not exceed 0.15 mm per end. Dimension E1 does not include interlead flash
or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 2 of 2
DS20006411B-page 36
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
14
SILK SCREEN
C
Y
1
2
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
MIN
NOM
1.27 BSC
5.40
MAX
Contact Pitch
Contact Pad Spacing
Contact Pad Width (X14)
E
C
X
0.60
1.55
Contact Pad Length (X14)
Y
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2065-SL Rev D
2020-2021 Microchip Technology Inc.
DS20006411B-page 37
MCP6006/6R/6U/7/9
14ꢀLead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
E
N
E
2
E1
2
E1
2X 7 TIPS
0.20 C B A
1
2
e
TOP VIEW
A
A
C
A2
A
SEATING
PLANE
A1
14X
14X b
0.10 C
0.10
C B A
SIDE VIEW
SEE DETAIL B
VIEW A–A
Microchip Technology Drawing C04-087 Rev D Sheet 1 of 2
DS20006411B-page 38
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14ꢀLead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(ș2)
R1
H
R2
c
L
ș1
(L1)
(ș3)
DETAIL B
Units
Dimension Limits
MILLIMETERS
MIN
NOM
MAX
Number of Terminals
Pitch
Overall Height
N
14
0.65 BSC
–
–
1.00
5.00
e
A
A1
A2
D
–
1.20
0.15
1.05
5.10
Standoff
0.05
0.80
4.90
Molded Package Thickness
Overall Length
Overall Width
E
6.40 BSC
Molded Package Width
Terminal Width
Terminal Thickness
Terminal Length
Footprint
Lead Bend Radius
Lead Bend Radius
Foot Angle
E1
b
c
4.30
0.19
0.09
0.45
4.40
–
–
0.60
4.50
0.30
0.20
0.75
L
L1
R1
R2
ș1
ș2
ș3
1.00 REF
0.09
0.09
0°
–
–
–
–
–
–
–
8°
–
Mold Draft Angle
Mold Draft Angle
12° REF
12° REF
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087 Rev D Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 39
MCP6006/6R/6U/7/9
14ꢀLead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
G
SILK SCREEN
C
Y
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Contact Pitch
Contact Pad Spacing
Contact Pad Width (Xnn)
E
C
X
0.65 BSC
5.90
0.45
1.45
Contact Pad Length (Xnn)
Contact Pad to Contact Pad (Xnn)
Y
G
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2087 Rev D
DS20006411B-page 40
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
APPENDIX A: REVISION HISTORY
Revision B (June 2021)
Below is a list of changes:
• Updated mentions of the MCP6006 device
throughout the document.
• Updated Figure 4-2.
• Updated Section 6.0, Packaging Information.
• Updated the Product Identification System to
include Automotive models.
• Minor corrections and editorial changes.
Revision A (September 2020)
• Original Release of this Document.
2020-2021 Microchip Technology Inc.
DS20006411B-page 41
MCP6006/6R/6U/7/9
NOTES:
DS20006411B-page 42
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
XXX(2)
Class
Examples:
PART NO.
Device
[X](1)
-X
/XX
a)
b)
c)
d)
e)
MCP6006T-E/LT:
MCP6006T-E/OT:
Tape and Reel,
Tape and Reel Temperature Package
Option
Range
Extended Temperature,
5-Lead SC70 Package.
Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
Device: MCP6006T
Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6006RT Single Op Amp (Tape and Reel) (SOT-23)
MCP6006RT-E/OT: Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
MCP6006UT-E/LT: Tape and Reel,
MCP6006UT Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6007
MCP6007T
MCP6009
MCP6009T
Dual Op Amp
Dual Op Amp (Tape and Reel for SOIC, MSOP)
Quad Op Amp
Extended Temperature,
5-Lead SC70 Package.
MCP6006UT-E/OT: Tape and Reel,
Quad Op Amp (Tape and Reel for SOIC, TSSOP)
Extended Temperature,
5-Lead SOT-23 Package.
Temperature Range:
E
=
-40°C to +125°C
a)
b)
c)
MCP6007-E/SN:
MCP6007-E/MS:
MCP6007T-E/SN:
Extended Temperature,
8-Lead SOIC Package.
Extended Temperature,
8-Lead MSOP Package.
Tape and Reel,
Package: LT
=
=
Plastic Package (SC70), 5-Lead (MCP6006 only)
OT
Plastic Small Outline Transistor (SOT-23),
5-Lead (MCP6006 only)
Extended Temperature,
8-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
8-Lead MSOP Package.
SN
=
Plastic Small Outline (3.90 mm), 8-Lead
(MCP6007 only)
d)
MCP6007T-E/MS:
MS
ST
=
=
Plastic MSOP, 8-Lead (MCP6007 only)
Plastic Thin Shrink Small Outline (4.4 mm),
14-Lead (MCP6009 only)
SL
=
Plastic Small Outline, (3.90 mm),
14-Lead (MCP6009 only)
a)
b)
c)
MCP6009-E/ST:
MCP6009-E/SL:
MCP6009T-E/ST:
Extended Temperature,
14-Lead TSSOP Package.
Extended Temperature,
14-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
14-Lead TSSOP Package.
Tape and Reel,
Class
(Blank)
VAO
=
=
Non-Automotive
Automotive
d)
MCP6009T-E/SL:
Note 1: The Tape and Reel identifier only appears in the catalog part number
description. This identifier is used for ordering purposes and is not
printed on the device package. Check with your Microchip Sales Office
for package availability with the Tape and Reel option.
Extended Temperature,
14-Lead SOIC Package.
2: Automotive parts are AEC-Q100 qualified, Grade 1.
2020-2021 Microchip Technology Inc.
DS20006411B-page 43
MCP6006/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM (AUTOMOTIVE)
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office..
Examples:
XXX(2)
Class
PART NO.
Device
[X](1)
-X
/XX
a)
b)
c)
d)
e)
MCP6006T-E/LTVAO:
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SC70 Package.
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel Temperature Package
Option
Range
MCP6006T-E/OTVAO:
Device: MCP6006T
Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6006UT-E/OTVAO: Tape and Reel, Automotive,
Extended Temperature,
MCP6006RT Single Op Amp (Tape and Reel)
(SOT-23)
5-Lead SOT-23 Package.
MCP6006UT Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6006RT-E/OTVAO: Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
MCP6007
Dual Op Amp
MCP6006UT-E/LTVAO: Tape and Reel, Automotive,
Extended Temperature,
MCP6007T
Dual Op Amp (Tape and Reel for
SOIC, MSOP)
5-Lead SC70 Package.
MCP6009
Quad Op Amp
a)
b)
c)
MCP6007-E/SNVAO:
MCP6007-E/MSVAO:
MCP6007T-E/SNVAO:
Extended Temperature,
Automotive,
8-Lead SOIC Package.
Extended Temperature,
Automotive,
8-Lead MSOP Package.
Tape and Reel,
Automotive,
Extended Temperature,
8-Lead SOIC Package.
Tape and Reel, Automotive,
Extended Temperature,
8-Lead MSOP Package.
MCP6009T
Quad Op Amp (Tape and Reel for
SOIC, TSSOP)
Temperature Range:
E
=
-40°C to +125°C
Package: LT
=
=
Plastic Package (SC70), 5-Lead
OT
Plastic Small Outline Transistor
(SOT-23), 5-Lead
SN
=
Plastic Small Outline (3.90 mm),
8-Lead
d)
MCP6007T-E/MSVAO:
MS
ST
=
=
Plastic MSOP, 8-Lead
Plastic Thin Shrink Small Outline
(4.4 mm), 14-Lead
a)
b)
c)
d)
MCP6009-E/STVAO:
MCP6009-E/SLVAO:
MCP6009T-E/STVAO:
MCP6009T-E/SLVAO:
Extended Temperature,
Automotive,
14-Lead TSSOP Package.
Extended Temperature,
Automotive,
14-Lead SOIC Package.
Tape and Reel, Automotive,
Extended Temperature,
14-Lead TSSOP Package.
Tape and Reel, Automotive,
Extended Temperature,
14-Lead SOIC Package.
SL
=
Plastic Small Outline, (3.90 mm),
14-Lead
Class
(Blank)
VAO
=
=
Non-Automotive
Automotive
Note 1: The Tape and Reel identifier only appears in the catalog
part number description. This identifier is used for order-
ing purposes and is not printed on the device package.
Check with your Microchip Sales Office for package
availability with the Tape and Reel option.
2: Automotive parts are AEC-Q100 qualified, Grade 1.
DS20006411B-page 44
2020-2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
•
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Infor-
mation regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NON-
INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDI-
RECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUEN-
TIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life sup-
port and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020-2021, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
ISBN: 978-1-5224-8232-1
2020-2021 Microchip Technology Inc.
DS20006411B-page 45
Worldwide Sales and Service
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DS20006411B-page 46
2020-2021 Microchip Technology Inc.
02/28/20
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