MCP6043-I/SNG [MICROCHIP]
OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8;
| 型号： | MCP6043-I/SNG |
| 厂家： | 
MICROCHIP |
| 描述： | OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8 光电二极管 |
| 文件： | 总40页 (文件大小：1161K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP6041/2/3/4
600 nA, Rail-to-Rail Input/Output Op Amps
Features
Description
• Low Quiescent Current: 600 nA/amplifier (typical)
• Rail-to-Rail Input/Output
The MCP6041/2/3/4 family of operational amplifiers
(op amps) from Microchip Technology Inc. operate with
a single supply voltage as low as 1.4V, while drawing
less than 1 µA (maximum) of quiescent current per
amplifier. These devices are also designed to support
rail-to-rail input and output operation. This combination
of features supports battery-powered and portable
applications.
• Gain Bandwidth Product: 14 kHz (typical)
• Wide Supply Voltage Range: 1.4V to 6.0V
• Unity Gain Stable
• Available in Single, Dual, and Quad
• Chip Select (CS) with MCP6043
• Available in 5-lead and 6-lead SOT-23 Packages
• Temperature Ranges:
The MCP6041/2/3/4 amplifiers have a gain-bandwidth
product of 14 kHz (typical) and are unity gain stable.
These specifications make these op amps appropriate
for low frequency applications, such as battery current
monitoring and sensor conditioning.
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
The MCP6041/2/3/4 family operational amplifiers are
offered in single (MCP6041), single with Chip Select
(CS) (MCP6043), dual (MCP6042), and quad
(MCP6044) configurations. The MCP6041 device is
available in the 5-lead SOT-23 package, and the
MCP6043 device is available in the 6-lead SOT-23
package.
Applications
• Toll Booth Tags
• Wearable Products
• Temperature Measurement
• Battery Powered
Design Aids
Package Types
• SPICE Macro Models
• FilterLab® Software
MCP6041
PDIP, SOIC, MSOP
MCP6043
PDIP, SOIC, MSOP
• MAPS (Microchip Advanced Part Selector)
• Analog Demonstration and Evaluation Boards
• Application Notes
NC 1
8
7
6
NC
V
NC 1
8 CS
2
3
4
V
V
–
+
2
3
4
7
6
V
V
–
+
V
V
IN
DD
IN
DD
V
IN
OUT
IN
OUT
5 NC
V
5 NC
V
SS
SS
Related Devices
MCP6041
SOT-23-5
MCP6043
SOT-23-6
• MCP6141/2/3/4: G = +10 Stable Op Amps
V
1
5
V 1
OUT
6
V
V
V
Typical Application
OUT
DD
DD
2
3
2
3
5 CS
V
V
SS
SS
IDD
VDD
4
–
4 V
–
V
+
V +
IN
IN
IN
IN
1.4V
to
6.0V
10
MCP6042
PDIP, SOIC, MSOP
MCP6044
PDIP, SOIC, TSSOP
VOUT
MCP604X
100 k
V
1
2
3
4
5
6
7
14
13
12
V
V
V
V
1
2
3
4
8
7
6
V
V
V
OUTA
OUTD
OUTA
DD
V
–
+
–
V
–
INA
IND
INA
OUTB
1 M
V
+
V
+
–
INA
IND
INA
INB
11 V
V
5 V
+
V
DD
SS
SS
INB
VDD – VOUT
10
9
V
V
+
V
V
+
IDD = -----------------------------------------
INB
INC
10 V/V 10
–
–
INC
INB
High Side Battery Current Sensor
8 V
V
OUTB
OUTC
2001-2013 Microchip Technology Inc.
DS21669D-page 1
MCP6041/2/3/4
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
V
– V ........................................................................7.0V
SS
DD
Current at Input Pins .....................................................±2 mA
Analog Inputs (V +, V –) ............. V – 1.0V to V + 1.0V
†† See Section 4.1 “Rail-to-Rail Input”
IN
IN
SS
DD
All Other Inputs and Outputs.......... V – 0.3V to V + 0.3V
SS
DD
Difference Input voltage ...................................... |V – V
|
DD
SS
Output Short Circuit Current ..................................continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature....................................–65°C to +150°C
Junction Temperature..................................................+150°C
ESD protection on all pins (HBM; MM) 4 kV; 200V
DC ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, V = +1.4V to +5.5V, V = GND, T = 25°C, V
= V /2,
DD
SS
A
CM
DD
V
V /2, V = V /2, and R = 1 Mto V (refer to Figure 1-2 and Figure 1-3).
OUT
DD L DD L L
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Offset
Input Offset Voltage
Drift with Temperature
V
-3
—
—
—
±2
+3
—
—
mV
V
V
V
= V
SS
OS
CM
CM
CM
V /T
µV/°C
µV/°C
= V , T = -40°C to +85°C
OS
A
SS
A
V /T
±15
= V
,
OS
A
SS
T = +85°C to +125°C
A
Power Supply Rejection
PSRR
70
85
—
dB
V
= V
CM SS
Input Bias Current and Impedance
Input Bias Current
I
I
I
—
—
—
—
—
—
1
20
—
100
5000
—
pA
pA
B
B
B
Industrial Temperature
T = +85°
A
Extended Temperature
1200
1
pA
T = +125°
A
Input Offset Current
I
pA
OS
13
Common Mode Input Impedance
Differential Input Impedance
Common Mode
Z
10 ||6
—
||pF
||pF
CM
13
Z
10 ||6
—
DIFF
Common-Mode Input Range
Common-Mode Rejection Ratio
V
V
0.3
—
80
75
80
V
+0.3
DD
V
CMR
SS
CMRR
CMRR
CMRR
62
—
dB
dB
dB
V
V
V
= 5V, V
= 5V, V
= 5V, V
= -0.3V to 5.3V
= 2.5V to 5.3V
= -0.3V to 2.5V
DD
DD
DD
CM
CM
CM
60
60
—
—
Open-Loop Gain
DC Open-Loop Gain (large signal)
A
95
115
—
dB
R = 50 k to V ,
OL
L
L
V
= 0.1V to V 0.1V
OUT
DD
Output
Maximum Output Voltage Swing
V
, V
V
+ 10
—
—
V
10
mV
mV
R = 50 k to V ,
L L
0.5V input overdrive
OL
OH
SS
DD
Linear Region Output Voltage Swing
Output Short Circuit Current
V
V
+ 100
V
100
R = 50 k to V ,
OVR
SS
DD
L
L
A
V
V
95 dB
OL
I
—
—
2
—
mA
mA
= 1.4V
= 5.5V
SC
DD
DD
I
20
—
SC
Power Supply
Supply Voltage
V
1.4
0.3
—
6.0
1.0
V
(Note 1)
I = 0
O
DD
Quiescent Current per Amplifier
I
0.6
µA
Q
Note 1: All parts with date codes November 2007 and later have been screened to ensure operation at V = 6.0V. However,
DD
the other minimum and maximum specifications are measured at 1.4V and/or 5.5V.
DS21669D-page 2
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
AC ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, V = +1.4V to +5.5V, V = GND, T = 25°C, V
= V /2,
DD
DD
SS
A
CM
V
V /2, V = V /2, R = 1 Mto V , and C = 60 pF (refer to Figure 1-2 and Figure 1-3).
OUT
DD L DD L L L
Parameters
Sym
Min
Typ
Max Units
Conditions
AC Response
Gain Bandwidth Product
Slew Rate
GBWP
SR
—
—
—
14
3.0
65
—
—
—
kHz
V/ms
°
Phase Margin
PM
G = +1 V/V
Noise
Input Voltage Noise
Input Voltage Noise Density
Input Current Noise Density
E
e
—
—
—
5.0
170
0.6
—
—
—
µV
f = 0.1 Hz to 10 Hz
ni
P-P
nV/Hz f = 1 kHz
fA/Hz f = 1 kHz
ni
i
ni
MCP6043 CHIP SELECT (CS) ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, V = +1.4V to +5.5V, V = GND, T = 25°C, V
= V /2,
DD
DD
SS
A
CM
V
V /2, V = V /2, R = 1 Mto V , and C = 60 pF (refer to Figure 1-2 and Figure 1-3).
DD L DD L L L
OUT
Parameters
Sym
Min
Typ
Max
Units
Conditions
CS Low Specifications
CS Logic Threshold, Low
CS Input Current, Low
V
V
—
5
V +0.3
SS
V
IL
SS
I
—
—
pA
CS = V
CSL
SS
CS High Specifications
CS Logic Threshold, High
CS Input Current, High
CS Input High, GND Current
V
V
–0.3
—
5
V
DD
V
IH
DD
I
—
—
pA
pA
pA
CS = V
CS = V
CS = V
CSH
DD
DD
DD
I
—
—
-20
20
—
—
SS
Amplifier Output Leakage, CS High
Dynamic Specifications
I
OLEAK
CS Low to Amplifier Output Turn-on Time
t
—
2
50
ms
G = +1V/V, CS = 0.3V to
= 0.9V /2
ON
V
OUT
DD
CS High to Amplifier Output High-Z
Hysteresis
t
—
—
10
—
—
µs
V
G = +1V/V, CS = V –0.3V to
DD
OFF
V
= 0.1V /2
OUT
DD
V
0.6
V
= 5.0V
DD
HYST
VIL
CS
VIH
tOFF
tON
VOUT
High-Z
High-Z
-0.6 µA
(typical)
ISS
-20 pA
(typical)
-20 pA
(typical)
ICS
5 pA
(typical)
FIGURE 1-1:
Chip Select (CS) Timing
Diagram (MCP6043 only).
2001-2013 Microchip Technology Inc.
DS21669D-page 3
MCP6041/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, V = +1.4V to +5.5V, V = GND.
DD
SS
Parameters
Sym Min
Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range
T
-40
-40
-40
-65
—
—
—
—
+85
°C
°C
°C
°C
Industrial Temperature parts
Extended Temperature parts
(Note 1)
A
T
+125
+125
+150
A
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23
Thermal Resistance, 6L-SOT-23
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
T
A
T
A
—
—
—
—
—
—
—
—
256
230
85
—
—
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
JA
JA
JA
JA
JA
JA
JA
163
206
70
120
100
JA
Note 1: The MCP6041/2/3/4 family of Industrial Temperature op amps operates over this extended range, but with reduced
performance. In any case, the internal Junction Temperature (T ) must not exceed the Absolute Maximum specification
J
of +150°C.
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-3. The bypass
capacitors are laid out according to the rules discussed
in Section 4.6 “Supply Bypass”.
VDD
1 µF
0.1 µF
VIN
VOUT
RL
RN
RG
MCP604X
CL
RF
VDD/2
VL
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
VDD
1 µF
0.1 µF
VDD/2
VOUT
RL
RN
RG
MCP604X
CL
RF
VIN
VL
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
DS21669D-page 4
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
2.0
TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
18%
10%
245 Samples
1124 Samples
16%
14%
12%
10%
8%
1 Representative Lot
A = +85°C to +125°C
9%
8%
7%
6%
5%
4%
3%
2%
1%
0%
V
DD = 1.4V and 5.5V
T
V
CM = VSS
VDD = 1.4V
VCM = VSS
6%
4%
2%
0%
-3
-2
-1
0
1
2
3
-32 -28 -24 -20 -16 -12 -8
-4
0
4
Input Offset Voltage (mV)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage Drift
with TA = +85°C to +125°C and VDD = 1.4V.
24%
12%
239 Samples
22%
1124 Samples
A = -40°C to +85°C
11%
10%
9%
8%
7%
6%
5%
4%
3%
2%
1%
0%
1 Representative Lot
T
20%
T
A = +85°C to +125°C
V
V
DD = 1.4V
CM = VSS
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
VDD = 5.5V
VCM = VSS
-10 -8 -6 -4 -2
0
2
4
6
8
10
-32 -28 -24 -20 -16 -12 -8
-4
0
4
Input Offset Voltage Drift (µV/°C)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-2:
Input Offset Voltage Drift
FIGURE 2-5:
Input Offset Voltage Drift
with TA = -40°C to +85°C.
with TA = +25°C to +125°C and VDD = 5.5V.
2000
2000
VDD = 1.4V
Representative Part
VDD = 5.5V
Representative Part
1500
1500
1000
500
0
1000
500
0
TA = +125°C
TA = +125°C
-500
-1000
-1500
-2000
-500
-1000
-1500
-2000
TA
TA
TA
=
=
=
+85°C
+25°C
-40°C
TA
TA
TA
=
=
=
+85°C
+25°C
-40°C
Common Mode Input Voltage (V)
Common Mode Input Voltage (V)
FIGURE 2-3:
Input Offset Voltage vs.
FIGURE 2-6:
Input Offset Voltage vs.
Common Mode Input Voltage with VDD = 1.4V.
Common Mode Input Voltage with VDD = 5.5V.
2001-2013 Microchip Technology Inc.
DS21669D-page 5
MCP6041/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
6
5
500
450
400
350
300
250
4
VDD = 1.4V
VIN
VOUT
3
2
VDD = 5.5V
1
VDD = 5.0V
G = +2 V/V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
-1
0
5
Ti1m0e (5 ms/1d5iv)
20
25
FIGURE 2-7:
Input Offset Voltage vs.
FIGURE 2-10:
The MCP6041/2/3/4 family
Output Voltage.
shows no phase reversal.
1000
300
f = 1 kHz
VDD = 5.0V
250
200
150
100
50
0
100
0.1
1
10
100
1000
Frequency (Hz)
Common Mode Input Voltage (V)
FIGURE 2-8:
Input Noise Voltage Density
FIGURE 2-11:
Input Noise Voltage Density
vs. Frequency.
vs. Common Mode Input Voltage.
90
80
70
60
50
40
30
100
95
Referred to Input
PSRR
(VCM = VSS
90
)
85
80
75
70
PSRR–
PSRR+
CMRR
CMRR
(VDD = 5.0V, VCM = -0.3V to +5.3V)
20
0.1
1
10
100
1000
-50
-25
0
25
50
75
100
125
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-9:
CMRR, PSRR vs.
FIGURE 2-12:
CMRR, PSRR vs. Ambient
Frequency.
Temperature.
DS21669D-page 6
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
10k
100 0
1001000k
10010k
VDD = 5.5V
CM = VDD
VDD = 5.5V
V
1k
1000
IB
TA = +125°C
TA = +85°C
100
100
100
100
IB
10
10
10
10
| IOS
|
| IOS
|
1
1
1
1
0.1
0.1
0.1
0.1
45
55
65
75
85
95 105 115 125
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-13:
Input Bias, Offset Currents
FIGURE 2-16:
Input Bias, Offset Currents
vs. Ambient Temperature.
vs. Common Mode Input Voltage.
120
0
130
120
Gain
100
-30
VDD = 5.5V
110
80
60
40
20
0
-60
Phase
-90
100
VDD = 1.4V
-120
-150
-180
-210
90
80
70
VOUT = 0.1V to VDD – 0.1V
-20
60
1.E+02
0.001 0.01 0.1
1
10 100 1k 10k 100k
100
1k
1.E+03
10k
1.E+04
100k
1.E+05
1.E- 1.E- 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 1.E+
03 02 01 F0r0eque0n1cy (0H2z) 03 04 05
Load Resistance (ꢀ)
FIGURE 2-14:
Open-Loop Gain, Phase vs.
FIGURE 2-17:
DC Open-Loop Gain vs.
Frequency.
Load Resistance.
140
130
120
110
100
90
140
RL = 50 kꢁ
130
120
110
100
90
VDD = 5.5V
VDD = 1.4V
RL = 50 kΩ
VDD = 5.0V
VOUT = 0.1V to VDD - 0.1V
80
0.00
0.05
0.10
0.15
0.20
0.25
80
Output Voltage Headroom;
VDD VOH or VOL VSS (V)
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-15:
DC Open-Loop Gain vs.
FIGURE 2-18:
DC Open-Loop Gain vs.
Power Supply Voltage.
Output Voltage Headroom.
2001-2013 Microchip Technology Inc.
DS21669D-page 7
MCP6041/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
130
120
110
100
90
20
18
16
14
12
10
8
100
90
80
70
60
50
40
30
20
10
0
PM
(G = +1)
GBWP
6
80
4
VDD = 5.0V
70
2
RL = 100 kΩ
Input Referred
0
60
100
1k
10k
1.E+02
1.E+03
1.E+04
Frequency (Hz)
Common Mode Input Voltage
FIGURE 2-19:
Channel-to-Channel
FIGURE 2-22:
Gain Bandwidth Product,
Separation vs. Frequency (MCP6042 and
MCP6044 only).
Phase Margin vs. Common Mode Input Voltage.
18
16
14
12
10
8
90
80
70
60
50
40
30
20
10
0
18
90
80
70
60
50
40
30
20
10
0
PM
(G = +1)
16
14
12
10
8
PM
(G = +1)
GBWP
GBWP
6
6
4
4
2
2
VDD = 5.5V
VDD = 1.4V
0
0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-23:
Gain Bandwidth Product,
FIGURE 2-20:
Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature with
VDD = 5.5V.
Phase Margin vs. Ambient Temperature with
VDD = 1.4V.
35
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
30
25
20
15
10
5
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-24:
Output Short Circuit Current
FIGURE 2-21:
Quiescent Current vs.
vs. Power Supply Voltage.
Power Supply Voltage.
DS21669D-page 8
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
1000
100
10
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VDD = 5.5V
RL = 50 kΩ
VOL – VSS
VDD – VOH
VOL – VSS
VDD – VOH
1
0.01
0.1
1
10
-50
-25
0
25
50
75
100 125
Output Current Magnitude (mA)
Ambient Temperature (°C)
FIGURE 2-25:
Output Voltage Headroom
FIGURE 2-28:
Output Voltage Headroom
vs. Output Current Magnitude.
vs. Ambient Temperature.
5.5
10
VDD = 5.5V
5.0
4.5
4.0
3.5
3.0
2.5
2.0
VDD = 5.5V
High-to-Low
Low-to-High
VDD = 1.4V
1
1.5
VDD = 1.4V
1.0
0.5
0.0
0.1
-50
-25
0
25
50
75
100
125
10
100
1.E+02
Frequency (Hz)
1k
10k
1.E+04
1.E+01
1.E+03
Ambient Temperature (°C)
FIGURE 2-26:
Slew Rate vs. Ambient
FIGURE 2-29:
Maximum Output Voltage
Temperature.
Swing vs. Frequency.
25
20
15
10
5
25
20
15
10
5
G = +1 V/V
RL = 50 kΩ
G = -1 V/V
L = 50 kΩ
R
0
0
-5
-5
-10
-15
-20
-25
-10
-15
-20
-25
0.0 0.1 0.2 0.3 Ti0m.4e (100.05µs0/d.6iv) 0.7 0.8 0.9 1.0
0.0 0.1 0.2 0.3 Ti0m.4e (100.05 µs0/d.6iv) 0.7 0.8 0.9 1.0
FIGURE 2-27:
Pulse Response.
Small Signal Non-inverting
FIGURE 2-30:
Response.
Small Signal Inverting Pulse
2001-2013 Microchip Technology Inc.
DS21669D-page 9
MCP6041/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 1 M to VL, and CL = 60 pF.
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VDD = 5.0V
VDD = 5.0V
G = +1 V/V
RL = 50 kΩ
G = -1 V/V
RL = 50 kΩ
0
1
2
3
Tim4 e (15ms/d6iv)
7
8
9
10
0
1
2
3
Tim4 e (15ms/d6iv)
7
8
9
10
FIGURE 2-31:
Large Signal Non-inverting
FIGURE 2-34:
Large Signal Inverting Pulse
Pulse Response.
Response.
5.0
5.0
4.5
4.0
3.5
3.0
VDD = 5.0V
VOUT Active
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
CS
2.5
0.0
VDD = 5.0V
CS
3.0
CS
Low-to-High
High-to-Low
2.5
Output On
2.0
1.5
1.0
0.5
0.0
-0.5
VOUT
Hysteresis
VOUT High-Z
High-Z
High-Z
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
CS Input Voltage (V)
0
1
2
3Tim4e (15ms6/div)7
8
9
10
FIGURE 2-32:
Chip Select (CS) to
FIGURE 2-35:
Chip Select (CS) Hysteresis
Amplifier Output Response Time (MCP6043
only).
(MCP6043 only).
1.E1-00m2
1m
1.E-03
100µ
1.E-04
10µ
1.E-05
1µ
1.E-06
100n
1.E- 7
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
+125°C
+85°C
+25°C
-40°C
1p
1.E-12
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
FIGURE 2-33:
Input Current vs. Input
Voltage (below VSS).
DS21669D-page 10
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP6041
PIN FUNCTION TABLE
MCP6042
MCP6043
MCP6044
PDIP,
SOIC,
MSOP
PDIP,
SOIC,
MSOP
PDIP,
SOIC, SOT-23-6
MSOP
PDIP,
SOIC,
TSSOP
Symbol
Description
SOT-23-5
6
2
1
1
2
6
2
1
4
1
2
VOUT, VOUTA Analog Output (op amp A)
4
VIN–, VINA
VIN+, VINA
VDD
–
Inverting Input (op amp A)
Non-inverting Input (op amp A)
Positive Power Supply
3
3
3
3
3
3
+
7
5
8
7
6
4
—
—
—
—
—
—
4
—
—
—
—
—
—
2
5
—
—
—
—
—
—
4
—
—
—
—
—
—
2
5
VINB
+
–
Non-inverting Input (op amp B)
Inverting Input (op amp B)
Analog Output (op amp B)
Analog Output (op amp C)
Inverting Input (op amp C)
Non-inverting Input (op amp C)
Negative Power Supply
6
6
VINB
7
7
VOUTB
VOUTC
—
—
—
4
8
9
VINC
–
+
10
11
12
13
14
VINC
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
VIND
+
Non-inverting Input (op amp D)
Inverting Input (op amp D)
Analog Output (op amp D)
VIND
–
VOUTD
—
—
—
—
—
8
5
—
—
CS
NC
Chip Select
1, 5, 8
1, 5
—
No Internal Connection
3.1
Analog Outputs
3.4
Power Supply Pins
The output pins are low-impedance voltage sources.
The positive power supply pin (VDD) is 1.4V to 6.0V
higher than the negative power supply pin (VSS). For
normal operation, the other pins are at voltages
3.2
Analog Inputs
between VSS and VDD
.
The non-inverting and inverting inputs are high-imped-
ance CMOS inputs with low bias currents.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
3.3
Chip Select Digital Input
This is a CMOS, Schmitt-triggered input that places the
part into a low power mode of operation.
2001-2013 Microchip Technology Inc.
DS21669D-page 11
MCP6041/2/3/4
dump any currents onto VDD. When implemented as
shown, resistors R1 and R2 also limit the current
through D1 and D2.
4.0
APPLICATIONS INFORMATION
The MCP6041/2/3/4 family of op amps is manufactured
using Microchip’s state of the art CMOS process.
These op amps are unity gain stable and suitable for a
wide range of general purpose, low-power applica-
tions.
VDD
See Microchip’s related MCP6141/2/3/4 family of op
amps for applications, at a gain of 10 V/V or higher,
needing greater bandwidth.
D1
R1
V1
D2
VOUT
MCP604X
4.1
Rail-to-Rail Input
V2
R2
4.1.1
PHASE REVERSAL
The MCP6041/2/3/4 op amps are designed to not
exhibit phase inversion when the input pins exceed the
supply voltages. Figure 2-10 shows an input voltage
exceeding both supplies with no phase inversion.
R3
VSS – (minimum expected V1)
R1 >
R2 >
2 mA
VSS – (minimum expected V2)
2 mA
4.1.2
INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass
quick ESD events within the specified limits.
FIGURE 4-2:
Inputs.
Protecting the Analog
It is also possible to connect the diodes to the left of the
resistor R1 and R2. In this case, the currents through
the diodes D1 and D2 need to be limited by some other
mechanism. The resistors then serve as in-rush current
limiters; the DC current into the input pins (VIN+ and
VIN–) should be very small.
A significant amount of current can flow out of the
inputs (through the ESD diodes) when the common
mode voltage (VCM) is below ground (VSS); see
Figure 2-33. Applications that are high impedance may
need to limit the useable voltage range.
Bond
VDD
Pad
4.1.3
NORMAL OPERATION
Bond
Pad
Bond
Pad
Input
Stage
VIN+
VIN–
The input stage of the MCP6041/2/3/4 op amps uses
two differential input stages in parallel. One operates at
a low common mode input voltage (VCM), while the
other operates at a high VCM. With this topology, the
device operates with a VCM up to 300 mV above VDD
and 300 mV below VSS. The input offset voltage is
measured at VCM = VSS – 0.3V and VDD + 0.3V to
ensure proper operation.
Bond
Pad
VSS
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
There are two transitions in input behavior as VCM is
changed. The first occurs, when VCM is near
VSS + 0.4V, and the second occurs when VCM is near
VDD – 0.5V (see Figure 2-3 and Figure 2-6). For the
best distortion performance with non-inverting gains,
avoid these regions of operation.
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the currents
(and voltages) at the input pins (see Absolute Maxi-
mum Ratings † at the beginning of Section 1.0 “Elec-
trical Characteristics”). Figure 4-2 shows the
recommended approach to protecting these inputs.
The internal ESD diodes prevent the input pins (VIN+
and VIN–) from going too far below ground, and the
resistors R1 and R2 limit the possible current drawn out
of the input pins. Diodes D1 and D2 prevent the input
pins (VIN+ and VIN–) from going too far above VDD, and
DS21669D-page 12
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
4.2
Rail-to-Rail Output
4.4
Capacitive Loads
There are two specifications that describe the output
swing capability of the MCP6041/2/3/4 family of op
amps. The first specification (Maximum Output Voltage
Swing) defines the absolute maximum swing that can
be achieved under the specified load condition. Thus,
the output voltage swings to within 10 mV of either sup-
ply rail with a 50 k load to VDD/2. Figure 2-10 shows
how the output voltage is limited when the input goes
beyond the linear region of operation.
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. A unity gain buffer (G = +1) is the most
sensitive to capacitive loads, although all gains show
the same general behavior.
The second specification that describes the output
swing capability of these amplifiers is the Linear Output
Voltage Range. This specification defines the maxi-
mum output swing that can be achieved while the
amplifier still operates in its linear region. To verify
linear operation in this range, the large signal DC
Open-Loop Gain (AOL) is measured at points inside the
supply rails. The measurement must meet the specified
AOL condition in the specification table.
When driving large capacitive loads with these op
amps (e.g., > 60 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-3) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will be generally lower than the bandwidth
with no capacitive load.
RISO
4.3
Output Loads and Battery Life
VOUT
MCP604X
VIN
CL
The MCP6041/2/3/4 op amp family has outstanding
quiescent current, which supports battery-powered
applications. There is minimal quiescent current
glitching when Chip Select (CS) is raised or lowered.
This prevents excessive current draw, and reduced
battery life, when the part is turned off or on.
FIGURE 4-3:
Stabilizes Large Capacitive Loads.
Output Resistor, RISO
Figure 4-4 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit’s noise gain. For non-inverting gains, GN and the
Signal Gain are equal. For inverting gains, GN is
1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V).
Heavy resistive loads at the output can cause
excessive battery drain. Driving a DC voltage of 2.5V
across a 100 k load resistor will cause the supply cur-
rent to increase by 25 µA, depleting the battery 43
times as fast as IQ (0.6 µA, typical) alone.
High frequency signals (fast edge rate) across
capacitive loads will also significantly increase supply
current. For instance, a 0.1 µF capacitor at the output
presents an AC impedance of 15.9 k (1/2fC) to a
100 Hz sinewave. It can be shown that the average
power drawn from the battery by a 5.0 Vp-p sinewave
(1.77 Vrms), under these conditions, is
100,000
100k
10k
10,000
GN = +1
G
G
N = +2
N ꢁ +5
EQUATION 4-1:
PSupply = (VDD - VSS) (IQ + VL(p-p) f CL )
1k
1,000
= (5V)(0.6 µA + 5.0Vp-p · 100Hz · 0.1µF)
10p
100p
1.E+02
1n
1.E+03
10n
1.E+04
1.E+01
Normalized Load Capacitance; CL/GN (F)
= 3.0 µW + 50 µW
FIGURE 4-4:
for Capacitive Loads.
Recommended RISO Values
This will drain the battery 18 times as fast as IQ alone.
After selecting RISO for your circuit, double check the
resulting frequency response peaking and step
response overshoot. Modify RISO’s value until the
response is reasonable. Bench evaluation and
simulations with the MCP6041/2/3/4 SPICE macro
model are helpful.
2001-2013 Microchip Technology Inc.
DS21669D-page 13
MCP6041/2/3/4
4.5
MCP6043 Chip Select
4.8
PCB Surface Leakage
The MCP6043 is a single op amp with Chip Select
(CS). When CS is pulled high, the supply current drops
In applications where low input bias current is critical,
printed circuit board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow, which is greater than the
MCP6041/2/3/4 family’s bias current at +25°C (1 pA,
typical).
to 50 nA (typical) and flows through the CS pin to VSS
.
When this happens, the amplifier output is put into a
high impedance state. By pulling CS low, the amplifier
is enabled. If the CS pin is left floating, the amplifier
may not operate properly. Figure 1-1 shows the output
voltage and supply current response to a CS pulse.
4.6
Supply Bypass
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
Figure 4-6 shows an example of this type of layout.
With this family of operational amplifiers, the power
supply pin (VDD for single supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high frequency performance. It can use a bulk
capacitor (i.e., 1 µF or larger) within 100 mm to provide
large, slow currents. This bulk capacitor is not required
for most applications and can be shared with nearby
analog parts.
Guard Ring
VIN– VIN+
4.7
Unused Op Amps
An unused op amp in a quad package (MCP6044)
should be configured as shown in Figure 4-5. These
circuits prevent the output from toggling and causing
crosstalk. Circuit A sets the op amp at its minimum
noise gain. The resistor divider produces any desired
reference voltage within the output voltage range of the
op amp; the op amp buffers that reference voltage.
Circuit B uses the minimum number of components
and operates as a comparator, but it may draw more
current.
FIGURE 4-6:
for Inverting Gain.
Example Guard Ring Layout
1. Non-inverting Gain and Unity Gain Buffer:
a) Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
2. Inverting Gain and Transimpedance Gain
(convert current to voltage, such as photo
detectors) amplifiers:
¼ MCP6044 (A)
VDD
¼ MCP6044 (B)
VDD
a) Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
VDD
R1
R2
VREF
b) Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
R2
VREF = VDD ------------------
R1 + R2
FIGURE 4-5:
Unused Op Amps.
DS21669D-page 14
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
4.9.2
INSTRUMENTATION AMPLIFIER
4.9
Application Circuits
The MCP6041/2/3/4 op amp is well suited for
conditioning sensor signals in battery-powered
applications. Figure 4-8 shows a two op amp instru-
mentation amplifier, using the MCP6042, that works
well for applications requiring rejection of Common
mode noise at higher gains. The reference voltage
(VREF) is supplied by a low impedance source. In single
supply applications, VREF is typically VDD/2.
.
4.9.1
BATTERY CURRENT SENSING
The MCP6041/2/3/4 op amps’ Common Mode Input
Range, which goes 0.3V beyond both supply rails,
supports their use in high-side and low-side battery
current sensing applications. The very low quiescent
current (0.6 µA, typical) helps prolong battery life, and
the rail-to-rail output supports detection low currents.
Figure 4-7 shows a high-side battery current sensor
circuit. The 10 resistor is sized to minimize power
losses. The battery current (IDD) through the 10
resistor causes its top terminal to be more negative
than the bottom terminal. This keeps the Common
mode input voltage of the op amp below VDD, which is
within its allowed range. The output of the op amp will
also be below VDD, which is within its Maximum Output
Voltage Swing specification.
RG
R1
R2
R2
R1
VOUT
VREF
V2
V1
½
½
MCP6042
MCP6042
.
IDD
VDD
R1 2R1
1.4V
to
6.0V
VOUT = V1 – V2 1 + ----- + -------- + VREF
10
R2 RG
VOUT
MCP604X
1 M
100 k
FIGURE 4-8:
Two Op Amp
Instrumentation Amplifier.
VDD – VOUT
IDD = -----------------------------------------
10 V/V 10
FIGURE 4-7:
High-Side Battery Current
Sensor.
2001-2013 Microchip Technology Inc.
DS21669D-page 15
MCP6041/2/3/4
• P/N SOIC14EV: 14-Pin SOIC/TSSOP/DIP Evalu-
ation Board
5.0 DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6041/2/3/4 family of op amps.
• MCP6XXX Amplifier Evaluation Board 1
• MCP6XXX Amplifier Evaluation Board 2
• MCP6XXX Amplifier Evaluation Board 3
• MCP6XXX Amplifier Evaluation Board 4
• Active Filter Demo Board Kit
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6041/2/3/4
op amps is available on the Microchip web site at
www.microchip.com. This model is intended to be an
initial design tool that works well in the op amp’s linear
region of operation over the temperature range. See
the model file for information on its capabilities.
5.5
Application Notes
The following Microchip Application Notes are avail-
able on the Microchip web site at www.microchip.com/
appnotes and are recommended as supplemental ref-
erence resources:
Bench testing is a very important part of any design and
cannot be replaced with simulations. Also, simulation
results using this macro model need to be validated by
comparing them to the data sheet specifications and
characteristic curves.
ADN003: “Select the Right Operational Amplifier for
your Filtering Circuits”, DS21821
AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
®
5.2
FilterLab Software
AN723: “Operational Amplifier AC Specifications and
Applications”, DS00723
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the
Microchip web site at www.microchip.com/filterlab, the
FilterLab design tool provides full schematic diagrams
of the filter circuit with component values. It also
outputs the filter circuit in SPICE format, which can be
used with the macro model to simulate actual filter
performance.
AN884: “Driving Capacitive Loads With Op Amps”,
DS00884
AN990: “Analog Sensor Conditioning Circuits – An
Overview”, DS00990
These application notes and others are listed in the
design guide:
“Signal Chain Design Guide”, DS21825
5.3
MAPS (Microchip Advanced Part
Selector)
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip website at www.microchip.com/
maps, the MAPS is an overall selection tool for
Microchip’s product portfolio that includes Analog,
Memory, MCUs and DSCs. Using this tool you can
define a filter to sort features for a parametric search of
devices and export side-by-side technical comparison
reports. Helpful links are also provided for data sheets,
purchase, and sampling of Microchip parts.
5.4
Analog Demonstration and
Evaluation Boards
Microchip offers
a
broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market. For
a
complete listing of these boards and their
corresponding user’s guides and technical information,
visit the Microchip web site at www.microchip.com/
analogtools.
Some boards that are especially useful are:
• P/N SOIC8EV: 8-Pin SOIC/MSOP/TSSOP/DIP
Evaluation Board
DS21669D-page 16
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Example:
7X25
Example:
5-Lead SOT-23 (MCP6041)
I-Temp
Code
E-Temp
Code
Device
XXNN
MCP6041/T-E/OT
SPNN
7XNN
Note:
Parts with date codes prior to
November 2012 have their package
markings in the SBNN format.
6-Lead SOT-23 (MCP6043)
I-Temp
Code
E-Temp
Code
Device
MCP6043T-E/CH
XXNN
SC25
SCNN
SDNN
Example:
8-Lead MSOP
XXXXXX
6043I
YWWNNN
304256
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
MCP6041
MCP6041
I/P 256
1304
e
3
I/P256
OR
OR
YYWW
1304
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
MCP6042
I/SN1304
MCP6042I
e
3
SN 1304
NNN
256
256
Legend: XX...X Customer-specific information
Y
YY
WW
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
N
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2001-2013 Microchip Technology Inc.
DS21669D-page 17
MCP6041/2/3/4
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6044)
Example:
MCP6044-I/P
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
1304256
MCP6044
e
3
E/P
OR
1304256
14-Lead SOIC (150 mil) (MCP6044)
Example:
MCP6044ISL
XXXXXXXXXX
XXXXXXXXXX
e
3
I/SL^
YYWWNNN
1304256
MCP6044
OR
E/SL^
e3
1304256
Example:
14-Lead TSSOP (MCP6044)
6044ST
XXXXXXXX
YYWW
1304
256
NNN
6044EST
1304
OR
256
DS21669D-page 18
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢏꢒꢖꢆꢗꢍꢏꢒꢁꢘꢙꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢟ
ꢅ
ꢗꢁꢴꢟꢉꢠꢜꢡ
ꢱꢐꢍꢇꢃꢋꢅꢉꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢹꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢅꢀ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢀꢁꢴꢗꢉꢠꢜꢡ
ꢗꢁꢴꢗ
ꢗꢁꢷꢴ
ꢗꢁꢗꢗ
ꢘꢁꢘꢗ
ꢀꢁꢸꢗ
ꢘꢁꢙꢗ
ꢗꢁꢀꢗ
ꢗꢁꢸꢟ
ꢗꢻ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢶ
ꢀꢁꢞꢟ
ꢀꢁꢸꢗ
ꢗꢁꢀꢟ
ꢸꢁꢘꢗ
ꢀꢁꢷꢗ
ꢸꢁꢀꢗ
ꢗꢁꢺꢗ
ꢗꢁꢷꢗ
ꢸꢗꢻ
ꢮꢀ
ꢀ
ꢎ
ꢳ
ꢗꢁꢗꢷ
ꢗꢁꢘꢗ
ꢗꢁꢘꢺ
ꢗꢁꢟꢀ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢴꢀꢠ
2001-2013 Microchip Technology Inc.
DS21669D-page 19
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 20
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc.
DS21669D-page 21
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 22
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc.
DS21669D-page 23
MCP6041/2/3/4
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢐꢄꢈꢆꢟꢑꢁꢂꢋꢑꢃꢆꢕꢇꢖꢆꢠꢆꢙꢡꢡꢆꢎꢋꢈꢆꢢꢔꢅꢣꢆꢗꢇꢞꢟꢇꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
A1
c
e
eB
b1
b
ꢬꢆꢃꢍꢇꢭꢰꢡꢵꢌꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢣꢈꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢷ
ꢅ
ꢛ
ꢁꢀꢗꢗꢉꢠꢜꢡ
ꢶ
ꢶ
ꢁꢘꢀꢗ
ꢁꢀꢴꢟ
ꢶ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢠꢊꢇꢅꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢜꢒꢈꢐꢏꢋꢅꢓꢉꢍꢈꢉꢜꢒꢈꢐꢏꢋꢅꢓꢉꢹꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢣꢃꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢬꢔꢔꢅꢓꢉꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢎ
ꢳꢀ
ꢳ
ꢅꢠ
ꢁꢀꢀꢟ
ꢁꢗꢀꢟ
ꢁꢘꢴꢗ
ꢁꢘꢞꢗ
ꢁꢸꢞꢷ
ꢁꢀꢀꢟ
ꢁꢗꢗꢷ
ꢁꢗꢞꢗ
ꢁꢗꢀꢞ
ꢶ
ꢁꢀꢸꢗ
ꢶ
ꢁꢸꢀꢗ
ꢁꢘꢟꢗ
ꢁꢸꢺꢟ
ꢁꢀꢸꢗ
ꢁꢗꢀꢗ
ꢁꢗꢺꢗ
ꢁꢗꢀꢷ
ꢶ
ꢁꢸꢘꢟ
ꢁꢘꢷꢗ
ꢁꢞꢗꢗ
ꢁꢀꢟꢗ
ꢁꢗꢀꢟ
ꢁꢗꢙꢗ
ꢁꢗꢘꢘ
ꢁꢞꢸꢗ
ꢮꢈꢦꢅꢓꢉꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢯꢈꢦꢉꢜꢔꢊꢎꢃꢆꢚꢉꢉꢽ
ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢽꢉꢜꢃꢚꢆꢃꢑꢃꢎꢊꢆꢍꢉꢡꢒꢊꢓꢊꢎꢍꢅꢓꢃꢇꢍꢃꢎꢁ
ꢸꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢁꢗꢀꢗꢾꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢞꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢꢉꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢀꢷꢠ
DS21669D-page 24
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
ꢤꢥꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢞꢐꢄꢈꢆꢟꢑꢁꢂꢋꢑꢃꢆꢕꢇꢖꢆꢠꢆꢙꢡꢡꢆꢎꢋꢈꢆꢢꢔꢅꢣꢆꢗꢇꢞꢟꢇꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
N
NOTE 1
E1
3
1
2
D
E
A2
A
L
c
A1
b1
b
e
eB
ꢬꢆꢃꢍꢇꢭꢰꢡꢵꢌꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢣꢈꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢀꢞ
ꢅ
ꢁꢀꢗꢗꢉꢠꢜꢡ
ꢶ
ꢛ
ꢶ
ꢁꢘꢀꢗ
ꢁꢀꢴꢟ
ꢶ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢠꢊꢇꢅꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢜꢒꢈꢐꢏꢋꢅꢓꢉꢍꢈꢉꢜꢒꢈꢐꢏꢋꢅꢓꢉꢹꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢹꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢣꢃꢔꢉꢍꢈꢉꢜꢅꢊꢍꢃꢆꢚꢉꢪꢏꢊꢆꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢬꢔꢔꢅꢓꢉꢮꢅꢊꢋꢉꢹꢃꢋꢍꢒ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢎ
ꢳꢀ
ꢳ
ꢅꢠ
ꢁꢀꢀꢟ
ꢁꢗꢀꢟ
ꢁꢘꢴꢗ
ꢁꢘꢞꢗ
ꢁꢙꢸꢟ
ꢁꢀꢀꢟ
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ꢁꢀꢸꢗ
ꢶ
ꢁꢸꢀꢗ
ꢁꢘꢟꢗ
ꢁꢙꢟꢗ
ꢁꢀꢸꢗ
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ꢶ
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ꢁꢀꢟꢗ
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ꢁꢞꢸꢗ
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ꢛꢔꢊꢃꢉꢜ
ꢀꢁ ꢪꢃꢆꢉꢀꢉꢥꢃꢇꢐꢊꢏꢉꢃꢆꢋꢅꢖꢉꢑꢅꢊꢍꢐꢓꢅꢉꢄꢊꢤꢉꢥꢊꢓꢤꢩꢉꢳꢐꢍꢉꢄꢐꢇꢍꢉꢳꢅꢉꢏꢈꢎꢊꢍꢅꢋꢉꢦꢃꢍꢒꢉꢍꢒꢅꢉꢒꢊꢍꢎꢒꢅꢋꢉꢊꢓꢅꢊꢁ
ꢘꢁ ꢽꢉꢜꢃꢚꢆꢃꢑꢃꢎꢊꢆꢍꢉꢡꢒꢊꢓꢊꢎꢍꢅꢓꢃꢇꢍꢃꢎꢁ
ꢸꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢁꢗꢀꢗꢾꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢞꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢꢉꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢼꢗꢗꢟꢠ
2001-2013 Microchip Technology Inc.
DS21669D-page 25
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 26
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc.
DS21669D-page 27
MCP6041/2/3/4
ꢝꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢏꢦꢖꢆꢠꢆꢛꢄꢓꢓꢔꢧꢨꢆꢙꢩꢪꢡꢆꢎꢎꢆꢢꢔꢅꢣꢆꢗꢍꢏꢟꢫꢚ
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS21669D-page 28
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc.
DS21669D-page 29
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 30
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
ꢛꢔꢊꢃꢜ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2001-2013 Microchip Technology Inc.
DS21669D-page 31
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 32
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc.
DS21669D-page 33
MCP6041/2/3/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21669D-page 34
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
APPENDIX A: REVISION HISTORY
Revision D (March 2013)
The following is the list of modifications:
1. Updated the boards list in Section 5.4 “Analog
Demonstration and Evaluation Boards”.
2. Removed the Mindi™ Circuit Designer &
Simulator section.
3. Updated the E-Temp Code value for the 5-Lead
SOT-23 package in Section 6.0 “Packaging
Information”.
Revision C (February 2008)
The following is the list of modifications:
1. Updated Figure 2-4 and Figure 2-5.
2. Updated trademark and Sales listing pages.
3. Expanded this op amp family:
4. Added the SOT-23-6 package for the MCP6043
op amp with Chip Select.
5. Added Extended Temperature (-40°C to
+125°C) parts.
6. Expanded Analog Input Absolute Max Voltage
Range (applies retroactively).
7. Expanded operating VDD to a maximum of 6.0V.
8. Section 1.0
“Electrical
Characteristics”
updated.
9. Section 2.0 “Typical Performance Curves”
updated.
10. Section 3.0 “Pin Descriptions” added.
11. Section 4.0“ApplicationsInformation”added.
12. Added Section 4.7 “Unused Op Amps”.
13. Updated input stage explanation.
14. Section 5.0 “Design Aids” updated.
15. Section 6.0“PackagingInformation”updated.
16. Added SOT-23-6 package.
17. Corrected package marking information.
18. Appendix A: “Revision History” added.
Revision B (June 2002)
The following is the list of modifications.
• Undocumented changes.
Revision A (August 2001)
• Original data sheet release.
2001-2013 Microchip Technology Inc.
DS21669D-page 35
MCP6041/2/3/4
NOTES:
DS21669D-page 36
2001-2013 Microchip Technology Inc.
MCP6041/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
a) MCP6041-I/P:
PART NO.
Device
X
/XX
Industrial Temperature,
8LD PDIP package.
Temperature Package
Range
b)
MCP6041T-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
Device:
MCP6041: Single Op Amp
MCP6041T Single Op Amp
(Tape and Reel for SOT-23, SOIC, MSOP)
MCP6042 Dual Op Amp
MCP6042T Dual Op Amp
a)
b)
MCP6042-I/SN: Industrial Temperature,
8LD SOIC package.
MCP6042T-E/MS: Tape and Reel,
Extended Temperature,
8LD MSOP package.
(Tape and Reel for SOIC and MSOP)
MCP6043 Single Op Amp w/ Chip Select
MCP6043T Single Op Amp w/ Chip Select
(Tape and Reel for SOT-23, SOIC, MSOP)
MCP6044 Quad Op Amp
MCP6044T Quad Op Amp
a)
b)
MCP6043-I/P:
Industrial Temperature,
8LD PDIP package.
MCP6043T-E/CH: Tape and Reel,
Extended Temperature,
6LD SOT-23 package.
(Tape and Reel for SOIC and TSSOP)
a)
b)
MCP6044-I/SL: Industrial Temperature,
14LD SOIC package.
MCP6044T-E/ST: Tape and Reel,
Extended Temperature,
Temperature Range:
Package:
I
E
=
=
-40°C to +85°C
-40°C to +125°C
14LD TSSOP package.
CH = Plastic Small Outline Transistor (SOT-23),
6-lead (Tape and Reel - MCP6043 only)
MS = Plastic Micro Small Outline (MSOP), 8-lead
OT = Plastic Small Outline Transistor (SOT-23),
5-lead (Tape and Reel - MCP6041 only)
P
= Plastic DIP (300 mil Body), 8-lead, 14-lead
SL = Plastic SOIC (150 mil Body), 14-lead
SN = Plastic SOIC (150 mil Body), 8-lead
ST = Plastic TSSOP (4.4 mm Body), 14-lead
2001-2013 Microchip Technology Inc.
DS21669D-page 37
MCP6041/2/3/4
NOTES:
DS21669D-page 38
2001-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-042-9
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2001-2013 Microchip Technology Inc.
DS21669D-page 39
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS21669D-page 40
2001-2013 Microchip Technology Inc.
相关型号：
MCP6043T-I/CH
OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDSO6, PLASTIC, SOT-23, 6 PIN
MICROCHIP
MCP6043T-I/P
OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDIP8, 0.300 INCH, PLASTIC, DIP-8
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OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8
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OP-AMP, 3000 uV OFFSET-MAX, 0.014 MHz BAND WIDTH, PDSO8, 0.150 INCH, LEAD FREE, PLASTIC, SOIC-8
MICROCHIP
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