MCP6564T-E/STVAO [MICROCHIP]
Comparator;MCP6561/1R/1U/2/4
1.8V Low-Power Push-Pull Output Comparator
Description
Features
• Propagation Delay at 1.8VDD
:
The Microchip Technology, Inc. MCP6561/1R/1U/2/4
families of CMOS/TTL compatible comparators are
offered in single, dual, and quad configurations.
- 56 ns (typical) High-to-Low
- 49 ns (typical) Low-to-High
These comparators are optimized for low power 1.8V,
single-supply applications with greater than rail-to-rail
input operation. The internal input hysteresis eliminates
output switching due to internal input noise voltage,
reducing current draw. The push-pull output of the
MCP6561/1R/1U/2/4 family supports rail-to-rail output
swing, and interfaces with CMOS/TTL logic. The output
toggle frequency can reach a typical of 4 MHz (typical)
while limiting supply current surges and dynamic power
consumption during switching.
• Low Quiescent Current: 100 µA (typical)
• Input Offset Voltage: ±3 mV (typical)
• Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V
• CMOS/TTL-Compatible Output
• Wide Supply Voltage Range: 1.8V to 5.5V
• Available in Single, Dual, and Quad
• Packages: SC70-5, SOT-23-5, SOIC, MSOP,
TSSOP
This family operates with single supply voltage of 1.8V
to 5.5V while drawing less than 100 µA/comparator of
quiescent current (typical).
Typical Applications
• Laptop Computers
• Mobile Phones
• Hand-held Electronics
• RC Timers
Package Types
MCP6561
MCP6562
• Alarm and Monitoring Circuits
• Window Comparators
• Multivibrators
SOT-23-5, SC70-5
SOIC, MSOP
V
OUT
V
1
2
3
4
1
2
3
5
8
7
6
5
OUTA
DD
DD
V
+
-
OUTB
-INB
SS
-INA
+IN
4
-IN
+
-
Design Aids
+INA
+INB
V
SS
• Microchip Advanced Part Selector (MAPS)
• Analog Demonstration and Evaluation Boards
• Application Notes
MCP6561R
MCP6564
SOT-23-5
SOIC, TSSOP
OUT
V
SS
1
1
2
3
5
4
OUTD
OUTA
14
Related Devices
V
+
2
3
4
-
+
DD
-
-IND
13
12
11
10
9
-INA
• Open-Drain Output: MCP6566/6R/6U/7/9
+IN
-IN
+IND
+INA
V
V
DD
SS
Typical Application
+INC
-INC
+INB
-INB
5
6
7
-
-
+
+
MCP6561U
VDD
VIN
SOT-23-5
OUTB
8
OUTC
VOUT
VDD
5
VIN+
VSS
1
+
VDD
MCP656X
2
3
-
VIN–
OUT
4
R2
RF
R3
2009-2013 Microchip Technology Inc.
DS22139C-page 1
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 2
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
1.0
1.1
ELECTRICAL
CHARACTERISTICS
Maximum Ratings †
V
- V ....................................................................... 6.5V
SS
DD
Analog Input (V ) †† .....................V - 1.0V to V + 1.0V
IN
SS
DD
†† See Section 4.1.2 “Input Voltage and Current Limits”
All other inputs and outputs............V - 0.3V to V + 0.3V
SS
DD
Difference Input voltage ......................................|V - V
|
SS
DD
Output Short Circuit Current .................................... ±25 mA
Current at Input Pins .................................................. ±2 mA
Current at Output and Supply Pins .......................... ±50 mA
Storage temperature ................................... -65°C to +150°C
Ambient temp. with power applied .............. -40°C to +125°C
Junction temp............................................................ +150°C
ESD protection on all pins (HBM/MM)4 kV/300V
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated: V = +1.8V to +5.5V, V = GND, T = +25°C, V + = V /2, V - = V ,
DD
SS
A
IN
DD
IN
SS
R = 10 k to V /2 (see Figure 1-1).
L
DD
Parameters
Symbol
Min
Typ
Max
Units
Conditions
Power Supply
Supply Voltage
V
1.8
60
63
—
100
70
5.5
130
—
V
DD
Quiescent Current per comparator
Power Supply Rejection Ratio
Input
I
µA
dB
I
= 0
Q
OUT
PSRR
V
= V
CM SS
Input Offset Voltage
Input Offset Drift
V
-10
—
—
—
—
—
1.0
—
—
3
2
1
1
+10
—
mV
µV/°C
pA
V
V
V
= V (Note 1)
OS
CM
CM
CM
SS
V /T
= V
OS
SS
Input Offset Current
Input Bias Current
I
—
= V
OS
SS
I
—
pA
T = +25°C, V - = V /2
A IN DD
B
60
—
pA
T = +85°C, V - = V /2
A IN DD
1500
—
5000
5.0
—
pA
T = +125°C, V - = V /2
A IN DD
Input Hysteresis Voltage
V
mV
V
= V (Notes 1, 2)
HYST
CM
SS
Input Hysteresis Linear Temp. Co.
TC
TC
10
µV/°C
1
2
2
Input Hysteresis Quadratic Temp.
Co.
0.3
—
µV/°C
Common-mode Input Voltage
Range
V
V
V
0.2
—
—
66
63
65
V
V
+0.2
V
V
V
V
V
V
V
= 1.8V
= 5.5V
CMR
SS
DD
DD
DD
CM
CM
CM
0.3
+0.3
SS
DD
Common-mode Rejection Ratio
CMRR
54
—
dB
= -0.3V to V +0.3V, V = 5.5V
DD DD
50
54
—
—
—
—
—
—
dB
= V /2 to V +0.3V, V = 5.5V
DD DD DD
dB
= -0.3V to V /2, V = 5.5V
DD DD
13
Common-mode Input Impedance
Differential Input Impedance
Push-Pull Output
Z
10 ||4
||pF
||pF
CM
13
Z
10 ||2
DIFF
High-Level Output Voltage
V
V
0.7
—
—
—
V
V
I
= -3 mA/-8 mA with V = 1.8V/5.5V
OH
DD
OUT DD
(Note 3)
Low-Level Output Voltage
V
—
0.6
I
OUT
= 3 mA/8 mA with V = 1.8V/5.5V
OL
DD
(Note 3)
Short Circuit Current
I
—
—
±30
8
—
—
mA
pF
Note 3
SC
Output Pin Capacitance
C
OUT
Note 1: The input offset voltage is the center of the input-referred trip points. The input hysteresis is the difference between the
input-referred trip points.
2
2:
V
at different temperatures is estimated using V
(T ) = V
+ (T - 25°C) TC + (T - 25°C) TC .
HYST
HYST
A
HYST @ +25°C
A
1
A
2
3: Limit the output current to Absolute Maximum Rating of 50 mA.
2009-2013 Microchip Technology Inc.
DS22139C-page 3
MCP6561/1R/1U/2/4
AC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated: V = +1.8V to +5.5V, V = GND, T = +25°C, V + = V /2, V - = V
,
DD
SS
A
IN
DD
IN
SS
R = 10 k to V /2, and C = 25 pF. (see Figure 1-1).
L
DD
L
Parameters
Symbol
Min
Typ
Max
Units
Conditions
Propagation Delay
High-to-Low,100 mV Overdrive
t
t
—
—
—
—
—
56
34
80
80
80
80
—
ns
ns
ns
ns
ns
V
V
V
V
= V /2, V = 1.8V
DD DD
PHL
PLH
PDS
CM
CM
CM
CM
= V /2, V = 5.5V
DD
DD
Low-to-High, 100 mV Overdrive
49
= V /2, V = 1.8V
DD DD
47
= V /2, V = 5.5V
DD DD
Skew 1
t
±10
Output
Rise Time
t
—
—
—
—
—
20
20
4
—
—
—
—
—
ns
ns
R
Fall Time
t
F
Maximum Toggle Frequency
f
MHz
MHz
V
V
= 5.5V
= 1.8V
TG
DD
2
DD
Input Voltage Noise 2
E
350
µV
10 Hz to 10 MHz
NI
P-P
Note 1: Propagation Delay Skew is defined as: t
2: ENI is based on SPICE simulation.
= t
- t
.
PDS
PLH PHL
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated: VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Temperature Ranges
Symbol
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, SC70-5
Thermal Resistance, SOT-23-5
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
TA
TA
TA
-40
-40
-65
—
—
—
+125
+125
+150
°C
°C
°C
JA
JA
JA
JA
JA
JA
—
—
—
—
—
—
331
220.7
149.5
211
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
95.3
100
1.2
Test Circuit Configuration
This test circuit configuration is used to determine the
AC and DC specifications.
VDD
MCP656X
200 k
200 k
200 k
IOUT
VOUT
25 pF
200 k
VSS = 0V
VIN = VSS
FIGURE 1-1:
AC and DC Test Circuit for
the Push-Pull Output Comparators.
DS22139C-page 4
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
30%
50%
VDD = 1.8V
VDD = 5.5V
VDD = 5.5V
CM = VSS
Avg. = -0.9 mV
StDev = 2.1 mV
3588 units
VDD = 1.8V
VCM = VSS
Avg. = -0.1 mV
StDev = 2.1 mV
3588 units
Avg. = 3.4 mV
StDev = 0.2 mV
3588 units
Avg. = 3.6 mV
StDev = 0.1 mV
3588 units
25%
20%
15%
10%
5%
V
40%
30%
20%
10%
0%
0%
-10 -8 -6 -4 -2
0
2
4
6
8
10
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
HYST (mV)
V
OS (mV)
V
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Hysteresis Voltage.
60%
60%
VCM = VSS
Avg. = 0.9 µV/°C
StDev = 6.6 µV/°C
1380 Units
VDD = 1.8V
VDD = 5.5V
50%
40%
30%
20%
10%
0%
50%
40%
30%
20%
10%
0%
Avg. = 12 µV/°C
StDev = 0.6 µV/°C
Avg. = 10.4 µV/°C
StDev = 0.6 µV/°C
TA = -40°C to +125°C
1380 Units
TA = -40°C to 125°C
V
CM = VSS
-60 -48 -36 -24 -12
0
12 24 36 48 60
0
2
4
6
8
10 12 14 16 18 20
V
OS Drift (µV/°C)
VHYST Drift, TC1 (µV/°C)
FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Hysteresis Voltage
Drift - Linear Temp. Co. (TC1).
7.0
30%
VDD = 5.5V
VIN+ = VDD/2
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
VDD = 5.5V
VDD = 1.8V
Avg. = 0.25 µV/°C2
Avg. = 0.3 µV/°C2
VOUT
StDev = 0.1 µV/°C2
StDev = 0.2 µV/°C2
VIN
-
20%
10%
0%
1380 Units
TA = -40°C to +125°C
VCM = VSS
-0.50 -0.25 0.00
0.25
0.50
0.75
1.00
Time (3 µs/div)
VHYST Drift, TC2 (µV/°C2)
FIGURE 2-3:
Input vs. Output Signal, No
FIGURE 2-6:
Input Hysteresis Voltage
Phase Reversal.
Drift - Quadratic Temp. Co. (TC2).
2009-2013 Microchip Technology Inc.
DS22139C-page 5
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
3.0
2.0
5.0
4.0
3.0
2.0
1.0
VCM = VSS
VCM = VSS
VDD= 5.0V
VDD= 1.8V
1.0
0.0
-1.0
-2.0
-3.0
VDD= 1.8V
VDD= 5.5V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
FIGURE 2-7:
Input Offset Voltage vs.
FIGURE 2-10:
Input Hysteresis Voltage vs.
Temperature.
Temperature.
4.0
5.0
4.0
3.0
2.0
VDD = 1.8V
TA= +125°C
TA= +125°C
TA= +85°C
2.0
0.0
TA= +25°C
TA= -40°C
TA= +25°C
TA= +85°C
TA= -40°C
-2.0
-4.0
VDD = 1.8V
1.0
-0.3 0.0
-0.3 0.0 0.3 0.6
0.9 1.2 1.5 1.8 2.1
VCM (V)
0.3
0.6
0.9
1.2
1.5
1.8
2.1
VCM (V)
FIGURE 2-8:
Input Offset Voltage vs.
FIGURE 2-11:
Input Hysteresis Voltage vs.
Common-mode Input Voltage.
Common-mode Input Voltage.
3.0
5.0
4.0
VDD = 5.5V
2.0
1.0
TA= -40°C
TA= +25°C
0.0
3.0
TA= -40°C
-1.0
-2.0
-3.0
TA= +25°C
2.0
TA= +85°C
TA= +85°C
TA= +125°C
TA= +125°C
VDD = 5.5V
1.0
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-0.5
0.5
1.5
2.5
3.5
4.5
5.5
VCM (V)
VCM (V)
FIGURE 2-9:
Input Offset Voltage vs.
FIGURE 2-12:
Input Hysteresis Voltage vs.
Common-mode Input Voltage.
Common-mode Input Voltage.
DS22139C-page 6
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
3.0
2.0
5.0
4.0
3.0
2.0
1.0
TA= +125°C
TA= +85°C
TA= -40°C
TA= +25°C
TA= +85°C
TA= +125°C
1.0
TA= +25°C
TA= -40°C
0.0
-1.0
-2.0
-3.0
1.5
2.5
3.5
DD (V)
4.5
5.5
1.5
2.5
3.5
4.5
5.5
V
VDD (V)
FIGURE 2-13:
Input Offset Voltage vs.
FIGURE 2-16:
Input Hysteresis Voltage vs.
Supply Voltage vs. Temperature.
Supply Voltage vs. Temperature.
50%
140.0
120.0
100.0
80.0
VDD = 5.5V
VDD = 1.8V
40%
Avg. = 97 µA
StDev= 4 µA
1794 units
Avg. = 88 µA
StDev= 4 µA
1794 units
30%
60.0
20%
10%
0%
TA= -40°C
TA= +25°C
40.0
TA= +85°C
TA= +125°C
20.0
0.0
60
70
80
90
100 110 120 130
0.0
1.0
2.0
3.0
4.0
5.0
6.0
IQ (µA)
VDD (V)
FIGURE 2-14:
Quiescent Current.
FIGURE 2-17:
Quiescent Current vs.
Supply Voltage vs Temperature.
130
130
VDD = 1.8V
VDD = 5.5V
120
120
110
100
90
110
100
90
Sweep VIN+ ,VIN- = VDD/2
Sweep VIN+ ,VIN- = VDD/2
Sweep VIN- ,VIN+ = VDD/2
Sweep VIN- ,VIN+ = VDD/2
80
80
70
70
60
60
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
VCM (V)
VCM (V)
FIGURE 2-15:
Quiescent Current vs.
FIGURE 2-18:
Quiescent Current vs.
Common-mode Input Voltage.
Common-mode Input Voltage.
2009-2013 Microchip Technology Inc.
DS22139C-page 7
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
400
350
300
250
200
150
100
50
120
80
0dB Output Attenuation
VDD = 5.5V
TA= -40°C
TA= +25°C
TA= +85°C
TA= +125°C
100 mV Over-Drive
VCM = VDD/2
R
L = Open
40
0
-40
-80
-120
TA= -40°C
VDD = 1.8V
TA= +25°C
TA= +85°C
TA= +125°C
0.0
1.0
2.0
3.0
4.0
5.0
6.0
10
10
100
100
1k
10k
100k
1M
10M
1000 10000 100000 100000 1E+07
V
DD (V)
Toggle Frequency (Hz)
0
FIGURE 2-19:
Quiescent Current vs.
FIGURE 2-22:
Short Circuit Current vs.
Toggle Frequency.
Supply Voltage vs. Temperature.
1000
1400
VDD= 1.8V
VDD= 5.5V
1200
1000
800
600
400
200
0
VDD - VOH
VDD - VOH
800
VOL
TA = 125°C
TA = 85°C
TA = 25°C
TA = -40°C
600
400
200
0
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
VOL
0.0
3.0
6.0
9.0
12.0
15.0
0
5
10
15
20
25
IOUT (mA)
I
OUT (mA)
FIGURE 2-20:
Output Headroom vs.
FIGURE 2-23:
Output Headroom vs.Output
Output Current.
Current.
50%
50%
40%
30%
20%
10%
0%
VDD= 1.8V
100 mV Over-Drive
VCM = VDD/2
tPHL
VDD= 5.5V
Avg. = 33 ns
StDev= 1 ns
198 units
100mV Over-Drive
VCM = VDD/2
40%
tPLH
tPHL
Avg. = 47 ns
StDev= 2 ns
198 units
Avg. = 54.4 ns
StDev= 2 ns
198 units
30%
20%
10%
0%
tPLH
Avg. = 44.6 ns
StDev= 2.7 ns
198 units
30 35 40 45 50 55 60 65 70 75 80
Prop. Delay (ns)
30 35 40 45 50 55 60 65 70 75 80
Prop. Delay (ns)
FIGURE 2-21:
Low-to-High and High-to-
FIGURE 2-24:
Low-to-High and High-to-
Low Propagation Delays.
Low Propagation Delays .
DS22139C-page 8
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
80
70
60
50
40
30
20
50%
40%
30%
20%
10%
0%
100 mV Over-Drive
CM = VDD/2
100 mV Over-Drive
VCM = VDD/2
V
tPLH , VDD = 1.8V
VDD= 1.8V
t
PHL , VDD = 1.8V
Avg. = -7.3 ns
StDev= 0.8 ns
198 units
VDD= 5.5V
Avg. = 11.6 ns
StDev= 2 ns
198 units
tPLH , VDD = 5.5V
tPHL , VDD = 5.5V
-20 -15 -10
-5
0
5
10
15
20
-50
-25
0
25
50
75
100
125
Temperature (°C)
Prop. Delay Skew (ns)
FIGURE 2-25:
Propagation Delay Skew.
FIGURE 2-28:
Propagation Delay vs.
Temperature.
260
210
160
110
60
140
120
100
80
VCM = VDD/2
VCM = VDD/2
tPHL , 10 mV Over-Drive
t
PLH , 10 mV Over-Drive
tPLH , VDD = 1.8V
tPHL , VDD = 1.8V
tPLH , VDD = 5.5V
tPHL , VDD = 5.5V
tPHL , 100 mV Over-Drive
PLH , 100 mV Over-Drive
60
t
40
20
10
1
1.5
2.5
3.5
4.5
5.5
10
100
1000
V
DD (V)
Over-Drive (mV)
FIGURE 2-26:
Propagation Delay vs.
FIGURE 2-29:
Propagation Delay vs. Input
Supply Voltage.
Over-Drive.
80
80
VDD= 1.8V
VDD= 5.5V
100 mV Over-Drive
100 mV Over-Drive
70
60
50
40
30
20
70
60
50
40
30
20
tPHL
tPLH
tPHL tPLH
0.00
0.50
1.00
1.50
2.00
0.0
1.0
2.0
3.0
4.0
5.0
6.0
VCM (V)
VCM (V)
FIGURE 2-27:
Propagation Delay vs.
FIGURE 2-30:
Propagation Delay vs.
Common-mode Input Voltage.
Common-mode Input Voltage.
2009-2013 Microchip Technology Inc.
DS22139C-page 9
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
1000
100
10
30%
25%
20%
15%
10%
5%
VCM = VSS
100mV Over-Drive
CM = VDD/2
V
Avg. = 200 µV/V
StDev= 94 µV/V
3588 units
VDD = 1.8V, tPLH
VDD = 1.8V, tPHL
VDD = 5.5V, tPLH
VDD = 5.5V, tPHL
1
0.1
0.01
0%
0.001 0.01
10
0.1
100
1
10
10
1000
1
1000 10000 100000 1E+06
-600
-400
-200
0
200
400
600
Capacitive Load (nf)
PSRR (µV/V)
FIGURE 2-31:
Propagation Delay vs.
FIGURE 2-34:
Power Supply Rejection
Capacitive Load.
Ratio (PSRR).
10m
1E+11
30%
VCM = -0.2V to VDD + 0.2V
VCM = VDD/2 to VDD+ 0.2V
Avg. = 0.6 mV
StDev= 0.1 mV
Avg. = 0.7 mV
StDev= 1 mV
1E+10m9
10µ
1E+07
20%
10%
0%
100n
TA= -40°C
TA= +25°C
TA= +85°C
1E+05
VCM = -0.2V to VDD/2
Avg. = 0.5 mV
1n
StDev= 0.1 mV
1E+03
VDD= 1.8V
3588 units
TA= +125°C
10p
1E+01
0.1p
1E-01
-0.8
-0.6
-0.4
-0.2
0
-5 -4 -3 -2 -1
0
1
2
3
4
5
Input Voltage (V)
CMRR (mV/V)
FIGURE 2-32:
Input Bias Current vs. Input
FIGURE 2-35:
Common-mode Rejection
Voltage vs Temperature.
Ratio (CMRR).
80
30%
VCM = -0.3V to VDD + 0.3V
Avg. = 0.1 mV
StDev= 0.4 mV
VCM = VDD/2 to VDD+ 0.3V
Input Referred
Avg. = 0.03 mV
StDev= 0.7 mV
78
VCM = VSS
VDD = 1.8V to 5.5V
20%
10%
0%
PSRR
CMRR
76
74
72
70
VCM = -0.3V to VDD/2
Avg. = 0.2 mV
StDev= 0.4 mV
VDD= 5.5V
3588 units
VCM = -0.3V to VDD + 0.3V
VDD = 5.5V
-50
-25
0
25
50
75
100
125
-2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5
CMRR (mV/V)
Temperature (°C)
FIGURE 2-33:
Common-mode Rejection
FIGURE 2-36:
Common-mode Rejection
Ratio and Power Supply Rejection Ratio vs.
Temperature.
Ratio (CMRR).
DS22139C-page 10
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: Unless otherwise indicated, VDD = +1.8V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND,
RL = 10 k to VDD/2, and CL = 25 pF.
10000
10000
1000
100
10
VDD = 5.5V
IB @ TA=
IB @ TA=
VDD = 5.5V
1000
100
10
VIN+ = 2Vpp (sine)
1
|IOS| @ TA= 125°C
|IOS|@ TA= 85°C
0.1
1
0.01
0.001
0.1
1k
10M
100
10k
100k
1M
0
1
2
3
4
5
6
100
1000
10000 100000 1000000 1E+07
Input Frequency (Hz)
V
CM (V)
FIGURE 2-37:
Output Jitter vs. Input
FIGURE 2-39:
Input Offset Current and
Frequency.
Input Bias Current vs. Common-mode Input
Voltage vs. Temperature.
1000
100
IB
10
1
|IOS|
0.1
25
50
75
100
125
Temperature (°C)
FIGURE 2-38:
Input Offset Current and
Input Bias Current vs. Temperature.
2009-2013 Microchip Technology Inc.
DS22139C-page 11
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 12
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MCP6561 MCP6561R MCP6561U
SC70-5,
MCP6562
MCP6564
Symbol
Description
MSOP,
SOIC
SOIC,
TSSOP
SOT-23-5
SOT-23-5
SOT-23-5
1
4
1
4
3
1
2
1
2
OUT, OUTA Digital Output (comparator A)
4
VIN–, VINA
VIN+, VINA
VDD
–
Inverting Input (comparator A)
Non-inverting Input (comparator A)
Positive Power Supply
3
3
1
3
3
+
5
2
5
8
4
—
—
—
—
—
—
2
—
—
—
—
—
—
5
—
—
—
—
—
—
2
5
5
VINB
+
–
Non-inverting Input (comparator B)
Inverting Input (comparator B)
Digital Output (comparator B)
Digital Output (comparator C)
Inverting Input (comparator C)
Non-inverting Input (comparator C)
Negative Power Supply
6
6
VINB
7
7
OUTB
OUTC
—
—
—
4
8
9
VINC
–
+
10
11
12
13
14
VINC
VSS
—
—
—
—
—
—
—
—
—
—
—
—
VIND
+
Non-inverting Input (comparator D)
Inverting Input (comparator D)
Digital Output (comparator D)
VIND
–
OUTD
3.1
Analog Inputs
3.3
Power Supply (V and V
)
DD
SS
The comparator non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
The positive power supply pin (VDD) is 1.8V to 5.5V
higher than the negative power supply pin (VSS). For
normal operation, the other pins are at voltages
between VSS and VDD
.
3.2
Digital Outputs
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need a local bypass capacitor (typically 0.01 µF to
0.1 µF) within 2 mm of the VDD pin. These can share a
bulk capacitor with nearby analog parts (within
100 mm), but it is not required.
The comparator outputs are CMOS, push-pull digital
outputs. They are designed to be compatible with
CMOS and TTL logic and are capable of driving heavy
DC or capacitive loads.
2009-2013 Microchip Technology Inc.
DS22139C-page 13
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 14
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
4.0
APPLICATIONS INFORMATION
Bond
VDD
The MCP6561/1R/1U/2/4 family of push-pull output
comparators are fabricated on Microchip’s state-of-the-
art CMOS process. They are suitable for a wide range
of high speed applications requiring low power
consumption.
Pad
Bond
Pad
Bond
Pad
Input
Stage
VIN+
VIN–
4.1
Comparator Inputs
4.1.1
NORMAL OPERATION
Bond
Pad
VSS
The input stage of this family of devices uses three
differential input stages in parallel: one operates at low-
input voltages, one at high-input voltages, and one at
mid-input voltage. With this topology, the input voltage
range is 0.3V above VDD and 0.3V below VSS, while
providing low offset voltage through out the Common-
mode range. The input offset voltage is measured at
both VSS - 0.3V and VDD + 0.3V to ensure proper
operation.
FIGURE 4-2:
Structures.
Simplified Analog Input ESD
In order to prevent damage and/or improper operation
of these amplifiers, the circuits they are in must limit the
currents (and voltages) at the VIN+ and VIN– pins (see
Maximum Ratings † at the beginning of Section 1.0
“Electrical Characteristics”). Figure 4-3 shows the
recommended approach to protecting these inputs.
The internal ESD diodes prevent the input pins (VIN+
and VIN–) from going too far below ground, and the
resistors R1 and R2 limit the possible current drawn out
of the input pin. Diodes D1 and D2 prevent the input pin
(VIN+ and VIN–) from going too far above VDD. When
implemented as shown, resistors R1 and R2 also limit
the current through D1 and D2.
The MCP6561/1R/1U/2/4 family has internally-set
hysteresis VHYST that is small enough to maintain input
offset accuracy and large enough to eliminate output
chattering caused by the comparator’s own input noise
voltage E . Figure 4-1 depicts this behavior. Input
NI
offset voltage (VOS) is the center (average) of the
(input-referred) low-high and high-low trip points. Input
hysteresis voltage (VHYST) is the difference between
the same trip points.
VDD
25
20
15
10
5
VDD = 5.0V
D1
V1
+
VIN
–
5
R1
VOUT
MCP656X
VOUT
4
–
3
0
D2
2
-5
Hysteresis
1
-10
-15
-20
-25
-30
V2
0
R2
R3
VSS – (minimum expected V1)
2 mA
R1
R2
Time (100 ms/div)
VSS – (minimum expected V2)
2 mA
FIGURE 4-1:
Comparators’ Internal Hysteresis Eliminates
Output Chatter Caused by Input Noise Voltage.
The MCP6561/1R/1U/2/4
FIGURE 4-3:
Inputs.
Protecting the Analog
4.1.2
INPUT VOLTAGE AND CURRENT
LIMITS
It is also possible to connect the diodes to the left of the
resistors R1 and R2. In this case, the currents through
the diodes D1 and D2 need to be limited by some other
mechanism. The resistor then serves as in-rush current
limiter; the DC current into the input pins (VIN+ and
VIN–) should be very small.
The ESD protection on the inputs can be depicted as
shown in Figure 4-2. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass ESD
events within the specified limits.
2009-2013 Microchip Technology Inc.
DS22139C-page 15
MCP6561/1R/1U/2/4
A significant amount of current can flow out of the
inputs when the Common-mode voltage (VCM) is below
ground (VSS); see Figure 2-32. Applications that are
high impedance may need to limit the usable voltage
range.
4.3.1
NON-INVERTING CIRCUIT
Figure 4-4 shows a non-inverting circuit for single-
supply applications using just two resistors. The
resulting hysteresis diagram is shown in Figure 4-5.
4.1.3
PHASE REVERSAL
VDD
The MCP6561/1R/1U/2/4 comparator family uses
CMOS transistors at the input. They are designed to
prevent phase inversion when the input pins exceed
the supply voltages. Figure 2-3 shows an input voltage
exceeding both supplies with no resulting phase
inversion.
VREF
-
VOUT
MCP656X
+
VIN
4.2
Push-Pull Output
R1
RF
Non-inverting Circuit with
The push-pull output is designed to be compatible with
CMOS and TTL logic, while the output transistors are
configured to give rail-to-rail output performance. They
are driven with circuitry that minimizes any switching
current (shoot-through current from supply-to-supply)
when the output is transitioned from high-to-low, or
from low-to-high (see Figure 2-15 and Figure 2-18 for
more information).
FIGURE 4-4:
Hysteresis for Single-Supply.
VOUT
VDD
VOH
High-to-Low
Low-to-High
4.3
Externally Set Hysteresis
Greater flexibility in selecting hysteresis (or input trip
points) is achieved by using external resistors.
Hysteresis reduces output chattering when one input is
slowly moving past the other. It also helps in systems
where it is best not to cycle between high and low
states too frequently (e.g., air conditioner thermostatic
control). Output chatter also increases the dynamic
supply current.
VIN
VOL
VSS
VSS
VTHL VTLH
VDD
FIGURE 4-5:
Non-inverting Circuit.
Hysteresis Diagram for the
The trip points for Figure 4-4 and Figure 4-5 are:
EQUATION 4-1:
R
R
1
1
V
= V
1 +------ – V
------
TLH
REF
OL
R
R
F
F
R
R
1
1
V
= V
1 +------ – V
------
THL
REF
OH
R
R
F
F
Where:
VTLH
VTHL
=
trip voltage from low-to-high
trip voltage from high-to-low
=
DS22139C-page 16
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Where:
4.3.2
INVERTING CIRCUIT
Figure 4-6 shows an inverting circuit for single-supply
using three resistors. The resulting hysteresis diagram
is shown in Figure 4-7.
R2R3
R23 = ------------------
R2 + R3
R3
VDD
V23 = ------------------ VDD
R2 + R3
VIN
Using this simplified circuit, the trip voltage can be
calculated using the following equation:
VDD
VOUT
MCP656X
R2
R3
EQUATION 4-2:
R23
RF
OH
VTHL = V
---------------------- + V ---------------------
23
RF
R
23 + R
R23 + RF
F
R23
RF
R23 + RF
OL
VTLH = V
Where:
---------------------- + V ---------------------
23
R
23 + R
F
FIGURE 4-6:
Inverting Circuit With
Hysteresis.
VTLH
VTHL
=
=
trip voltage from low-to-high
trip voltage from high-to-low
VOUT
Figure 2-20, and Figure 2-23 can be used to determine
typical values for VOH and VOL
VDD
VOH
.
Low-to-High
High-to-Low
4.4
Bypass Capacitors
With this family of comparators, the power supply pin
(VDD for single supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
edge rate performance.
VOL
VSS
VIN
VSS
VTLH VTHL
VDD
FIGURE 4-7:
Inverting Circuit.
Hysteresis Diagram for the
4.5
Capacitive Loads
Reasonable capacitive loads (e.g., logic gates) have
little impact on propagation delay (see Figure 2-31).
The supply current increases with increasing toggle
frequency (Figure 2-19), especially with higher
capacitive loads. The output slew rate and propagation
delay performance will be reduced with higher
capacitive loads.
In order to determine the trip voltages (VTHL and VTLH
)
for the circuit shown in Figure 4-6, R2 and R3 can be
simplified to the Thevenin equivalent circuit with
respect to VDD, as shown in Figure 4-8.
VDD
-
VOUT
MCP656X
+
VSS
V23
R23
RF
Thevenin Equivalent Circuit.
FIGURE 4-8:
2009-2013 Microchip Technology Inc.
DS22139C-page 17
MCP6561/1R/1U/2/4
4.6
PCB Surface Leakage
4.7
PCB Layout Technique
In applications where low input bias current is critical,
PCB (Printed Circuit Board) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow. This is greater than the
MCP6561/1R/1U/2/4 family’s bias current at +25°C
(1 pA, typical).
When designing the PCB layout, it is critical to note that
analog and digital signal traces are adequately
separated to prevent signal coupling. If the comparator
output trace is at close proximity to the input traces,
then large output voltage changes from VSS to VDD, or
visa versa, may couple to the inputs and cause the
device output to oscillate. To prevent such oscillation,
the output traces must be routed away from the input
pins. The SC70-5 and SOT-23-5 are relatively immune
because the output pin OUT (pin 1) is separated by the
power pin VDD/VSS (pin 2) from the input pin +IN (as
long as the analog and digital traces remain separated
throughout the PCB). However, the pinouts for the dual
and quad packages (SOIC, MSOP, TSSOP) have OUT
and -IN pins (pin 1 and 2) close to each other. The
recommended layout for these packages is shown in
Figure 4-10.
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-9.
IN-
IN+
VSS
OUTA
-INA
VDD
OUTB
-INB
+INA
Guard Ring
Example Guard Ring Layout
VSS
+INB
FIGURE 4-9:
for Inverting Circuit.
FIGURE 4-10:
Recommended Layout.
1. Inverting Configuration (Figures 4-6 and 4-9):
4.8
Unused Comparators
a) Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
comparator (e.g., VDD/2 or ground).
An unused amplifier in a quad package (MCP6564)
should be configured as shown in Figure 4-11. This
circuit prevents the output from toggling and causing
crosstalk. It uses the minimum number of components
and draws minimal current (see Figure 2-15 and
Figure 2-18).
b) Connect the inverting pin (VIN-) to the input
pad without touching the guard ring.
2. Non-inverting Configuration (Figure 4-4):
a) Connect the non-inverting pin (VIN+) to the
input pad without touching the guard ring.
¼ MCP6564
b) Connect the guard ring to the inverting input
pin (VIN-).
VDD
–
+
FIGURE 4-11:
Unused Comparators.
DS22139C-page 18
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
4.9.3
BISTABLE MULTIVIBRATOR
4.9
Typical Applications
A simple bistable multivibrator design is shown in
Figure 4-14. VREF needs to be between the power
supplies (VSS = GND and VDD) to achieve oscillation.
4.9.1
PRECISE COMPARATOR
Some applications require higher DC precision. An
easy way to solve this problem is to use an amplifier
(such as the MCP6291) to gain-up the input signal
before it reaches the comparator. Figure 4-12 shows
an example of this approach.
The output duty cycle changes with VREF
.
R1
R2
VDD
VREF
VDD
VREF
MCP6561
VOUT
MCP6291
VDD
VIN
C1
R3
R1
R2
VREF
VOUT
MCP656X
FIGURE 4-14:
Bistable Multivibrator.
FIGURE 4-12:
Precise Inverting
Comparator.
4.9.2
WINDOWED COMPARATOR
Figure 4-13 shows one approach to designing a
windowed comparator. The AND gate produces a logic
‘1’ when the input voltage is between VRB and VRT
(where VRT > VRB).
VDD
VRT
1/2
MCP6562
VIN
1/2
MCP6562
VRB
FIGURE 4-13:
Windowed Comparator.
2009-2013 Microchip Technology Inc.
DS22139C-page 19
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 20
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
5.3
Application Notes
5.0
5.1
DESIGN AIDS
The following Microchip Application Note is available
on the Microchip web site at www.microchip.com and is
recommended as a supplemental reference resource:
Microchip Advanced Part Selector
(MAPS)
• AN895, “Oscillator Circuits For RTD Temperature
Sensors”, DS00895
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip web site at www.microchip.com/
maps, the MAPS is an overall selection tool for
Microchip’s product portfolio that includes Analog,
Memory, MCUs and DSCs. Using this tool you can
define a filter to sort features for a parametric search of
devices and export side-by-side technical comparison
reports. Helpful links are also provided for data sheets,
purchase, and sampling of Microchip parts.
5.2
Analog Demonstration and
Evaluation Boards
Microchip offers
a
broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market. For
a
complete listing of these boards and their
corresponding user’s guides and technical information,
visit the Microchip web site at www.microchip.com/
analogtools. Three of our boards that are especially
useful are:
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board,
P/N SOIC8EV
• 14-Pin SOIC/TSSOP/DIP Evaluation Board,
P/N SOIC14EV
• 5/6-Pin SOT23 Evaluation Board, P/N VSUPEV2
2009-2013 Microchip Technology Inc.
DS22139C-page 21
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 22
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6561)
Example:
BC25
XXNN
5-Lead SOT-23 (MCP6561, MCP6561R, MCP6561U)
Example:
Device
MCP6561T
Code
WBNN
WANN
WKNN
XXNN
WA25
MCP6561RT
MCP6561UT
Note: Applies to 5-Lead SOT-23.
Example:
8-Lead MSOP (MCP6562)
XXXXXX
YWWNNN
6562E
302256
8-Lead SOIC (150 mil) (MCP6562)
Example:
XXXXXXXX
XXXXYYWW
MCP6562E
SN^1302
e
3
NNN
256
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2009-2013 Microchip Technology Inc.
DS22139C-page 23
MCP6561/1R/1U/2/4
Package Marking Information (Continued)
14-Lead SOIC (150 mil) (MCP6564)
Example:
XXXXXXXXXX
XXXXXXXXXX
MCP6564
E/SL^
1302256
e3
YYWWNNN
14-Lead TSSOP (MCP6564)
Example:
MCP6564E
XXXXXXXX
YYWW
1302
256
NNN
DS22139C-page 24
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢂꢒꢖꢆꢗꢍꢘꢙꢚꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
D
b
1
3
2
E1
E
4
5
e
e
A
A2
c
A1
L
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢸꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢸꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢸꢃꢋꢍꢒ
ꢟ
ꢅ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢗꢁꢴꢟꢉꢠꢜꢡ
ꢗꢁꢶꢗ
ꢗꢁꢶꢗ
ꢗꢁꢗꢗ
ꢀꢁꢶꢗ
ꢀꢁꢀꢟ
ꢀꢁꢶꢗ
ꢗꢁꢀꢗ
ꢗꢁꢗꢶ
ꢗꢁꢀꢟ
ꢷ
ꢷ
ꢷ
ꢘꢁꢀꢗ
ꢀꢁꢘꢟ
ꢘꢁꢗꢗ
ꢗꢁꢘꢗ
ꢷ
ꢀꢁꢀꢗ
ꢀꢁꢗꢗ
ꢗꢁꢀꢗ
ꢘꢁꢞꢗ
ꢀꢁꢹꢟ
ꢘꢁꢘꢟ
ꢗꢁꢞꢴ
ꢗꢁꢘꢴ
ꢗꢁꢞꢗ
ꢎ
ꢳ
ꢷ
ꢜꢔꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢺꢗꢴꢀꢠ
2009-2013 Microchip Technology Inc.
DS22139C-page 25
MCP6561/1R/1U/2/4
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS22139C-page 26
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢏꢒꢖꢆꢗꢍꢏꢒꢁꢞꢟꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢟ
ꢅ
ꢗꢁꢻꢟꢉꢠꢜꢡ
ꢱꢐꢍꢇꢃꢋꢅꢉꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢸꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢸꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢸꢃꢋꢍꢒ
ꢅꢀ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢀꢁꢻꢗꢉꢠꢜꢡ
ꢗꢁꢻꢗ
ꢗꢁꢶꢻ
ꢗꢁꢗꢗ
ꢘꢁꢘꢗ
ꢀꢁꢹꢗ
ꢘꢁꢙꢗ
ꢗꢁꢀꢗ
ꢗꢁꢹꢟ
ꢗꢼ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢀꢁꢞꢟ
ꢀꢁꢹꢗ
ꢗꢁꢀꢟ
ꢹꢁꢘꢗ
ꢀꢁꢶꢗ
ꢹꢁꢀꢗ
ꢗꢁꢴꢗ
ꢗꢁꢶꢗ
ꢹꢗꢼ
ꢮꢀ
ꢀ
ꢎ
ꢳ
ꢗꢁꢗꢶ
ꢗꢁꢘꢗ
ꢗꢁꢘꢴ
ꢗꢁꢟꢀ
ꢜꢔꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢺꢗꢻꢀꢠ
2009-2013 Microchip Technology Inc.
DS22139C-page 27
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 28
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS22139C-page 29
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 30
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS22139C-page 31
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 32
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS22139C-page 33
MCP6561/1R/1U/2/4
ꢠꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢍꢜꢖꢆꢡꢆꢜꢄꢓꢓꢔꢢꢣꢆꢟꢤꢥꢚꢆꢎꢎꢆꢦꢔꢅꢧꢆꢗꢍꢏꢨꢘꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS22139C-page 34
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS22139C-page 35
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 36
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2009-2013 Microchip Technology Inc.
DS22139C-page 37
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 38
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS22139C-page 39
MCP6561/1R/1U/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22139C-page 40
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
APPENDIX A: REVISION HISTORY
Revision C (February 2013)
The following is the list of modifications:
1. Added the Analog Input (VIN) parameter in
Section 1.0 “Electrical Characteristics”.
2. Updated the package drawing section.
Revision B (August 2009)
The following is the list of modifications:
1. Added MCP6561U throughout the document.
2. Updated package drawing section.
Revision A (March 2009)
• Original Release of this Document.
2009-2013 Microchip Technology Inc.
DS22139C-page 41
MCP6561/1R/1U/2/4
NOTES:
DS22139C-page 42
2009-2013 Microchip Technology Inc.
MCP6561/1R/1U/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
–
PART NO.
Device
X
/XX
Examples:
a)
MCP6561T-E/LT: Tape and Reel,
Temperature
Range
Package
Extended Temperature,
5LD SC70 package.
b)
MCP6561T-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
Device:
MCP6561T:
Single Comparator (Tape and Reel)
(SC70, SOT-23)
MCP6561RT: Single Comparator (Tape and Reel)
(SOT-23 only)
MCP6561UT: Single Comparator (Tape and Reel)
(SOT-23 only)
a)
a)
MCP6561RT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
MCP6562:
MCP6562T:
MCP6564:
MCP6564T:
Dual Comparator
Dual Comparator (Tape and Reel)
Quad Comparator
MCP6561UT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
Quad Comparator(Tape and Reel)
a)
b)
MCP6562-E/MS:
MCP6562-E/SN:
Extended Temperature,
8LD MSOP package.
Extended Temperature,
8LD SOIC package.
Temperature Range:
Package:
E
=
-40 C to +125 C
LT
=
Plastic Small Outline Transistor (SC70), 5-lead
OT = Plastic Small Outline Transistor, 5-lead
MS = Plastic Micro Small Outline Transistor, 8-lead
SN = Plastic Small Outline Transistor, 8-lead
a)
b)
MCP6564T-E/SL: Tape and Reel,
Extended Temperature,
ST
SL
=
=
Plastic Thin Shrink Small Outline Transistor, 14-lead
Plastic Small Outline Transistor, 14-lead
14LD SOIC package.
MCP6564T-E/ST:
Tape and Reel,
Extended Temperature,
14LD TSSOP package.
2009-2013 Microchip Technology Inc.
DS22139B-page 43
MCP6561/1R/1U/2/4
NOTES:
DS22139B-page 44
2009-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-031-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2009-2013 Microchip Technology Inc.
DS22139C-page 45
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/12
DS22139C-page 46
2009-2013 Microchip Technology Inc.
相关型号:
©2020 ICPDF网 联系我们和版权申明