MCP6H01T-E/LT [MICROCHIP]
OP-AMP, 3500 uV OFFSET-MAX, 1.2 MHz BAND WIDTH, PDSO5, PLASTIC, SC-70, 5 PIN;
| 型号： | MCP6H01T-E/LT |
| 厂家： | 
MICROCHIP |
| 描述： | OP-AMP, 3500 uV OFFSET-MAX, 1.2 MHz BAND WIDTH, PDSO5, PLASTIC, SC-70, 5 PIN 放大器 光电二极管 |
| 文件： | 总46页 (文件大小：1047K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MCP6H01/2/4
1.2 MHz, 16V Op Amps
Features:
Description:
• Input Offset Voltage: ±0.7 mV (typical)
• Quiescent Current: 135 µA (typical)
• Common Mode Rejection Ratio: 100 dB (typical)
• Power Supply Rejection Ratio: 102 dB (typical)
• Rail-to-Rail Output
Microchip’s MCP6H01/2/4 family of operational amplifi-
ers (op amps) has a wide supply voltage range of 3.5V
to 16V and rail-to-rail output operation. This family is
unity gain stable and has a gain bandwidth product of
1.2 MHz (typical). These devices operate with a
single-supply voltage as high as 16V, while only
drawing 135 µA/amplifier (typical) of quiescent current.
• Supply Voltage Range:
- Single-Supply Operation: 3.5V to 16V
- Dual-Supply Operation: ±1.75V to ±8V
• Gain Bandwidth Product: 1.2 MHz (typical)
• Slew Rate: 0.8V/µs (typical)
The MCP6H01/2/4 family is offered in single
(MCP6H01), dual (MCP6H02) and quad (MCP6H04)
configurations. All devices are fully specified in
extended temperature range from -40°C to +125°C.
• Unity Gain Stable
Package Types
• Extended Temperature Range: -40°C to +125°C
• No Phase Reversal
MCP6H01
SC70-5, SOT 23-5
Applications:
V
V
1
2
3
5
OUT
DD
V
SS
• Automotive Power Electronics
• Industrial Control Equipment
• Battery Powered Systems
V
+
V –
IN
4
IN
MCP6H01
SOIC
MCP6H02
• Medical Diagnostic Instruments
SOIC
NC
V
V
1
8
7
6
5
1
2
3
4
8
NC
V
OUTA
DD
Design Aids:
V
V
V
2
3
4
7
6
5
V
–
+
V
–
INA
DD
OUTB
IN
• SPICE Macro Models
• FilterLab® Software
V
–
V
V
+
INA
OUT
INB
IN
NC
+
V
V
INB
SS
SS
• MAPS (Microchip Advanced Part Selector)
• Analog Demonstration and Evaluation Boards
• Application Notes
MCP6H02
2x3 TDFN
MCP6H01
2x3 TDFN
NC
V
OUTA
1
8
7
1
8
7
NC
V
V
V
DD
Typical Application
V
–
+
V
–
INA
V
V
2
2
IN
DD
OUTB
EP
9
EP
9
V
V
+
INA
–
IN
3
4
6
5
3
4
6
5
OUT
INB
R1
R2
V
V
NC
V
+
V1
VREF
SS
SS
INB
VDD
MCP6H04
SOIC, TSSOP
VOUT
MCP6H01
V
1
2
3
4
5
6
7
14
13
12
11
10
9
V
OUTD
OUTA
V
V
V
–
V
–
+
IND
INA
+
V
IND
INA
V
SS
V2
DD
V
V
V
+
V
V
+
INC
INB
R2
R1
–
–
INB
INC
8
V
Difference Amplifier
OUTC
OUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2010-2011 Microchip Technology Inc.
DS22243D-page 1
MCP6H01/2/4
NOTES:
DS22243D-page 2
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
1.0
1.1
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
V
– V ..........................................................................17V
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
DD
SS
Current at Input Pins......................................................±2 mA
Analog Inputs (V +, V -)††.............V – 1.0V to V + 1.0V
IN
IN
SS
DD
All Other Inputs and Outputs ............V – 0.3V to V + 0.3V
SS
DD
Difference Input Voltage..........................................V – V
DD
SS
Output Short-Circuit Current...................................continuous
Current at Output and Supply Pins ..............................±65 mA
Storage Temperature.....................................-65°C to +150°C
†† See 4.1.2 “Input Voltage Limits”.
Maximum Junction Temperature (T )...........................+150°C
J
ESD protection on all pins (HBM; MM) 2 kV; 200V
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +3.5V to +16V, VSS = GND, TA = +25°C,
VCM = VDD/2 – 1.4V, VOUT VDD/2, VL = VDD/2 and RL = 10 kto VL. (Refer to Figure 1-1).
Parameters
Input Offset
Sym
Min
Typ
Max
Units
Conditions
Input Offset Voltage
VOS
-3.5
—
±0.7
±2.5
102
+3.5
—
mV
Input Offset Drift with Temperature
Power Supply Rejection Ratio
Input Bias Current and Impedance
Input Bias Current
VOS/TA
PSRR
µV/°C TA = -40°C to +125°C
dB
87
—
IB
IB
—
—
—
—
—
—
10
600
—
—
25
—
—
—
pA
pA TA = +85°C
IB
10
nA TA = +125°C
Input Offset Current
IOS
ZCM
ZDIFF
±1
pA
Common Mode Input Impedance
Differential Input Impedance
Common Mode
1013||6
1013||6
||pF
||pF
Common Mode Input Voltage Range
Common Mode Rejection Ratio
VCMR
VSS 0.3
—
VDD 2.3
V
CMRR
78
93
—
dB VCM = -0.3V to 1.2V,
VDD = 3.5V
82
84
98
—
—
dB
V
V
CM = -0.3V to 2.7V,
DD = 5V
100
dB VCM = -0.3V to 12.7V,
VDD = 15V
Open-Loop Gain
DC Open-Loop Gain (Large Signal)
AOL
95
115
—
dB 0.2V < VOUT <(VDD
0.2V)
–
2010-2011 Microchip Technology Inc.
DS22243D-page 3
MCP6H01/2/4
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = +3.5V to +16V, VSS = GND, TA = +25°C,
VCM = VDD/2 – 1.4V, VOUT VDD/2, VL = VDD/2 and RL = 10 kto VL. (Refer to Figure 1-1).
Parameters
Sym
Min
Typ
Max
Units
Conditions
Output
High-Level Output Voltage
Low-Level Output Voltage
Output Short-Circuit Current
VOH
3.490
4.985
3.495
4.993
—
—
V
V
V
V
V
V
VDD = 3.5V
0.5V input overdrive
VDD = 5V
0.5V input overdrive
14.970 14.980
—
VDD = 15V
0.5V input overdrive
VOL
—
—
—
0.005
0.007
0.020
0.010
0.015
0.030
VDD = 3.5V
0.5 V input overdrive
VDD = 5V
0.5 V input overdrive
V
DD = 15V
0.5 V input overdrive
ISC
—
—
—
±27
±45
±50
—
—
—
mA VDD = 3.5V
mA VDD = 5V
mA VDD = 15V
Power Supply
Supply Voltage
VDD
IQ
3.5
±1.75
—
—
—
16
±8
V
V
Single-supply operation
Dual-supply operation
Quiescent Current per Amplifier
125
175
µA IO = 0, VDD = 3.5V
VCM = VDD/4
—
—
130
135
180
185
µA IO = 0, VDD = 5V
VCM = VDD/4
µA IO = 0, VDD = 15V
VCM = VDD/4
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND,
VCM = VDD/2 - 1.4V, VOUT VDD/2, VL = VDD/2, RL = 10 kto VL and CL = 60 pF. (Refer to Figure 1-1).
Parameters
Sym
Min
Typ
Max
Units
Conditions
AC Response
Gain Bandwidth Product
Phase Margin
GBWP
PM
—
—
—
1.2
57
—
—
—
MHz
°C
G = +1V/V
Slew Rate
SR
0.8
V/µs
Noise
Input Noise Voltage
Input Noise Voltage Density
Eni
eni
—
—
—
—
12
35
30
1.9
—
—
—
—
µVp-p f = 0.1 Hz to 10 Hz
nV/Hz f = 1 kHz
nV/Hz f = 10 kHz
fA/Hz f = 1 kHz
Input Noise Current Density
ini
DS22243D-page 4
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +3.5V to +16V and VSS = GND.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Operating Temperature Range
Storage Temperature Range
TA
TA
-40
-65
—
—
+125
+150
°C
°C
Note 1
Thermal Package Resistances
Thermal Resistance, 5L-SC70
Thermal Resistance, 5L-SOT-23
Thermal Resistance, 8L-2x3 TDFN
Thermal Resistance, 8L-SOIC
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
JA
JA
JA
JA
JA
JA
—
—
—
—
—
—
331
256
41
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
149.5
95.3
100
Note 1: The internal junction temperature (TJ) must not exceed the absolute maximum specification of +150°C.
1.2
Test Circuits
CF
6.8 pF
The circuit used for most DC and AC tests is shown in
Figure 1-1. This circuit can independently set VCM and
V
OUT (refer to Equation 1-1). Note that VCM is not the
RG
100 k
RF
circuit’s common mode voltage ((VP + VM)/2), and that
VOST includes VOS plus the effects (on the input offset
100 k
VDD/2
VP
error, VOST) of temperature, CMRR, PSRR and AOL
.
VDD
VIN+
EQUATION 1-1:
CB1
100 nF
CB2
1 µF
GDM = RF RG
MCP6H0X
VCM = VP + VDD 2 2
VOST = VIN– – VIN+
VIN–
VOUT = VDD 2 + VP – VM + VOST 1 + GDM
VOUT
VM
RL
CL
Where:
RG
RF
10 k
60 pF
100 k
100 k
GDM = Differential Mode Gain
(V/V)
VCM = Op Amp’s Common Mode
(V)
CF
6.8 pF
Input Voltage
VL
VOST = Op Amp’s Total Input Offset
(mV)
Voltage
FIGURE 1-1:
AC and DC Test Circuit for
Most Specifications.
2010-2011 Microchip Technology Inc.
DS22243D-page 5
MCP6H01/2/4
NOTES:
DS22243D-page 6
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
21%
18%
15%
12%
9%
1000
800
TA = +125°C
TA = +85°C
2550 Samples
600
T
A = +25°C
TA = -40°C
400
200
0
-200
-400
-600
-800
-1000
6%
VDD = 5V
3%
Representative Part
0%
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Common Mode Input Voltage (V)
Input Offset Voltage (mV)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Input Offset Voltage vs.
Common Mode Input Voltage.
35%
1000
TA = +125°C
2550 Samples
TA = - 40°C to +125°C
800
600
30%
25%
20%
15%
10%
5%
TA = +85°C
TA = +25°C
TA = -40°C
400
200
0
-200
-400
-600
-800
-1000
VDD = 15V
Representative Part
0%
-0.5 1.5 3.5 5.5 7.5 9.5 11.5 13.5 15.5
Common Mode Input Voltage (V)
Input Offset Voltage Drift (µV/°C)
FIGURE 2-2:
Input Offset Voltage Drift.
FIGURE 2-5:
Input Offset Voltage vs.
Common Mode Input Voltage.
1000
800
1000
TA = +125°C
Representative Part
800
T
T
T
A = +85°C
A = +25°C
A = -40°C
600
VDD = 15V
600
400
400
200
200
VDD = 5V
0
0
-200
-400
-600
-800
-1000
-0.5
-200
-400
VDD = 3.5V
Representative Part
VDD = 3.5V
-600
-800
-1000
0.0
0.5
1.0
1.5
2.0
2.5
0
2
4
6
8
10
12
14
16
Common Mode Input Voltage (V)
Output Voltage (V)
FIGURE 2-3:
Common Mode Input Voltage.
Input Offset Voltage vs.
FIGURE 2-6:
Output Voltage.
Input Offset Voltage vs.
2010-2011 Microchip Technology Inc.
DS22243D-page 7
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
1000
800
120
110
100
90
PSRR+
Representative Part
CMRR
600
400
PSRR-
200
80
TA = +125°C
TA = +85°C
TA = +25°C
0
70
-200
-400
-600
-800
-1000
60
T
A = -40°C
50
40
Representative Part
30
20
10
100
1k
10k
100k
1M
0
2
4
6
8
10 12 14 16 18
Power Supply Voltage (V)
Frequency (Hz)
FIGURE 2-7:
Input Offset Voltage vs.
FIGURE 2-10:
CMRR, PSRR vs.
Power Supply Voltage.
Frequency.
1,000
130
120
110
100
90
PSRR
100
10
CMRR @ VDD = 15V
@ VDD = 5V
80
@ VDD = 3.5V
70
60
50
-50
-25
0
25
50
75
100
125
1
10
100
1k
10k 100k
Ambient Temperature (°C)
Frequency (Hz)
FIGURE 2-8:
Input Noise Voltage Density
FIGURE 2-11:
CMRR, PSRR vs. Ambient
vs. Frequency.
Temperature.
50
45
40
35
30
25
100n
VDD = 15V
10n
Input Bias Current
1n
100p
f = 1 kHz
VDD = 16V
20
15
10
10p
Input Offset Current
1p
-1
1
3
5
7
9
11
13
15
Common Mode Input Voltage (V)
Ambient Temperature (°C)
FIGURE 2-9:
Input Noise Voltage Density
FIGURE 2-12:
Input Bias, Offset Currents
vs. Common Mode Input Voltage.
vs. Ambient Temperature.
DS22243D-page 8
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
100n
120
100
80
60
40
20
0
0
TA = +125°C
Open-Loop Gain
-30
10n
-60
Open-Loop Phase
1n
100p
-90
-120
-150
-180
-210
TA = +85°C
10p
VDD = 15V
1p
-20
1.0E-01 1.0E+00 1.0E+01 1.0E+02
1.0E+04
1.0E+06 1.0E+07
0.1
1
10 100 11.0Ek+03 10k 110.00E+k05 1M 10M
0
2
4
6
8
10
12
14
16
Frequency (Hz)
Common Mode Input Voltage (V)
FIGURE 2-13:
Input Bias Current vs.
FIGURE 2-16:
Open-Loop Gain, Phase vs.
Common Mode Input Voltage.
Frequency.
200
190
180
160
150
140
130
120
110
100
VDD = 15V
170
VDD = 5V
160
150
140
130
120
110
100
90
VDD = 3.5V
VSS + 0.2V < VOUT < VDD - 0.2V
90
80
80
3
5
7
9
11
13
15
17
-50
-25
0
25
50
75
100 125
Ambient Temperature (°C)
Power Supply Voltage (V)
FIGURE 2-14:
Quiescent Current vs.
FIGURE 2-17:
DC Open-Loop Gain vs.
Ambient Temperature.
Power Supply Voltage.
200
180
160
140
120
100
80
150
140
130
120
110
100
90
VDD = 15V
DD = 5V
VDD = 3.5V
V
TA = +125°C
60
T
T
T
A = +85°C
A = +25°C
A = -40°C
40
80
20
0.00
0.05
Output Voltage Headroom (V)
DD - VOH or VOL - VSS
0.10
0.15
0.20
0.25
0.30
0
0
2
4
6
8
10
12
14
16
V
Power Supply Voltage (V)
FIGURE 2-15:
Quiescent Current vs.
FIGURE 2-18:
DC Open-Loop Gain vs.
Power Supply Voltage.
Output Voltage Headroom.
2010-2011 Microchip Technology Inc.
DS22243D-page 9
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
160
140
120
100
80
70
60
50
40
30
20
10
0
TA = +125°C
A = +85°C
TA = +25°C
A = -40°C
T
T
60
Input Referred
40
0
2
4
6
8
10
12
14
16
100
1k
10k
100k
Power Supply Voltage (V)
Frequency (Hz)
FIGURE 2-19:
Channel-to-Channel
FIGURE 2-22:
Output Short Circuit Current
Separation vs. Frequency (MCP6H02 only).
vs. Power Supply Voltage.
100
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
180
160
140
120
100
80
Gain Bandwidth Product
VDD = 15V
10
VDD = 5V
Phase Margin
VDD = 3.5V
60
1
40
VDD = 3.5V
20
0
0.1
100
1k
10k
100k
1M
-50 -25
0
25
50
75 100 125
Ambient Temperature (°C)
Frequency (Hz)
FIGURE 2-20:
Gain Bandwidth Product,
FIGURE 2-23:
Output Voltage Swing vs.
Phase Margin vs. Ambient Temperature.
Frequency.
1.8
180
160
140
120
100
80
10000
1000
100
1.6
Gain Bandwidth Product
VDD = 15V
1.4
1.2
1.0
VDD - VOH
Phase Margin
0.8
0.6
0.4
60
10
40
VOL - VSS
VDD = 15V
0.2
20
0.0
0
1
-50 -25
0
25
50
75 100 125
0.01
0.1
1
10
100
Ambient Temperature (°C)
Output Current (mA)
FIGURE 2-21:
Gain Bandwidth Product,
FIGURE 2-24:
Output Voltage Headroom
Phase Margin vs. Ambient Temperature.
vs. Output Current.
DS22243D-page 10
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5V to +16V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
8
7
6
5
4
3
2
1000
100
10
VDD = 5V
VDD - VOH
VDD - VOH
VOL - VSS
VOL - VSS
VDD = 5V
1
0.1
-50
-25
0
25
50
75
100
125
0.01
0.1
1
10
100
Output Current (mA)
Ambient Temperature (°C)
FIGURE 2-25:
Output Voltage Headroom
FIGURE 2-28:
Output Voltage Headroom
vs. Output Current.
vs. Ambient Temperature.
8
7
1000
VDD = 3.5V
100
6
VDD - VOH
5
10
VOL - VSS
4
VOL - VSS
1
VDD = 3.5V
3
2
VDD - VOH
0.1
-50
-25
0
25
50
75
100
125
0.0
0.1
1.0
10.0
Output Current (mA)
Ambient Temperature (°C)
FIGURE 2-26:
Output Voltage Headroom
FIGURE 2-29:
Output Voltage Headroom
vs. Output Current.
vs. Ambient Temperature.
1.0
0.9
0.8
0.7
0.6
22
21
20
VDD - VOH
19
18
17
16
15
Falling Edge, VDD = 15V
Rising Edge, VDD = 15V
0.5
0.4
0.3
0.2
VOL - VSS
VDD = 15V
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-27:
Output Voltage Headroom
FIGURE 2-30:
Slew Rate vs. Ambient
vs. Ambient Temperature.
Temperature.
2010-2011 Microchip Technology Inc.
DS22243D-page 11
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5 V to +16 V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
16
14
12
10
8
Falling Edge, VDD = 5V
Rising Edge, VDD = 5V
6
Falling Edge, VDD = 3.5V
Rising Edge, VDD = 3.5V
VDD = 15V
G = +1V/V
4
2
0
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
Time (20 µs/div)
FIGURE 2-31:
Slew Rate vs. Ambient
FIGURE 2-34:
Large Signal Non-Inverting
Temperature.
Pulse Response.
16
14
12
10
8
VDD = 15V
G = -1V/V
6
VDD = 15V
G = +1V/V
4
2
0
Time (2 µs/div)
Time (20 µs/div)
FIGURE 2-32:
Small Signal Non-Inverting
FIGURE 2-35:
Large Signal Inverting Pulse
Pulse Response.
Response.
17
15
13
VDD = 15V
G = -1V/V
VOUT
VIN
11
9
7
5
VDD = 15V
G = +2V/V
3
1
-1
Time (2 µs/div)
Time (0.1 ms/div)
FIGURE 2-33:
Small Signal Inverting Pulse
FIGURE 2-36:
The MCP6H01/2/4 Shows
Response.
No Phase Reversal.
DS22243D-page 12
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +3.5 V to +16 V, VSS = GND, VCM = VDD/2 - 1.4V, VOUT VDD/2,
VL = VDD/2, RL = 10 kto VL and CL = 60 pF.
1m
1000
100
10
100µ
10µ
1µ
100n
TA = +125°C
A = +85°C
T
10n
TA = +25°C
TA = -40°C
1
n
GN:
101V/V
11V/V
1V/V
100p
10p
1p
1
100
10k
1M
110
1k
100k
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
IN (V)
V
Frequency (Hz)
FIGURE 2-37:
Closed Loop Output
FIGURE 2-38:
Measured Input Current vs.
Impedance vs. Frequency.
Input Voltage (below VSS).
2010-2011 Microchip Technology Inc.
DS22243D-page 13
MCP6H01/2/4
NOTES:
DS22243D-page 14
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP6H02
MCP6H01
MCP6H04
Symbol
Description
SC70-5,
SOT-23-5
SOIC,
TSSOP
SOIC 2x3 TDFN SOIC 2x3 TDFN
1
4
6
2
6
2
1
2
3
8
5
6
1
2
3
8
5
6
1
2
3
4
5
6
VOUT, VOUTA Analog Output (op amp A)
VIN–, VINA
VIN+, VINA
VDD
–
+
Inverting Input (op amp A)
Non-inverting Input (op amp A)
Positive Power Supply
3
3
3
5
7
7
—
—
—
—
—
—
VINB
+
–
Non-inverting Input (op amp B)
Inverting Input (op amp B)
VINB
—
—
—
—
2
—
—
—
—
7
7
7
VOUTB
VOUTC
Analog Output (op amp B)
Analog Output (op amp C)
Inverting Input (op amp C)
Non-inverting Input (op amp C)
Negative Power Supply
—
—
—
4
—
—
—
4
8
—
—
9
VINC
–
+
—
—
10
11
12
13
14
—
—
VINC
4
4
VSS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
9
VIND
+
Non-inverting Input (op amp D)
Inverting Input (op amp D)
Analog Output (op amp D)
No Internal Connection
—
—
VIND–
—
—
VOUTD
NC
1, 5, 8
—
1, 5, 8
9
EP
Exposed Thermal Pad (EP); must
be connected to VSS
.
3.1
Analog Outputs
3.3
Power Supply Pins
The output pins are low-impedance voltage sources.
The positive power supply (VDD) is 3.5V to 16V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
3.2
Analog Inputs
and VDD
.
The non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
Typically, these parts can be used in single-supply
operation or dual-supply operation. Also, VDD will need
bypass capacitors.
3.4
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
2010-2011 Microchip Technology Inc.
DS22243D-page 15
MCP6H01/2/4
NOTES:
DS22243D-page 16
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
4.0
APPLICATION INFORMATION
VDD
The MCP6H01/2/4 family of op amps is manufactured
using Microchip’s state-of-the-art CMOS process and
is specifically designed for low-power, high-precision
applications.
D1 D2
V1
V2
VOUT
4.1
Inputs
PHASE REVERSAL
MCP6H0X
4.1.1
The MCP6H01/2/4 op amps are designed to prevent
phase reversal when the input pins exceed the supply
voltages. Figure 2-36 shows the input voltage
exceeding the supply voltage without any phase
reversal.
FIGURE 4-2:
Inputs.
Protecting the Analog
A significant amount of current can flow out of the
inputs when the common mode voltage (VCM) is below
ground (VSS), see Figure 2-38.
4.1.2
INPUT VOLTAGE LIMITS
4.1.3
INPUT CURRENT LIMITS
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the voltages at
the input pins (see Section 1.1 “Absolute Maximum
Ratings †”).
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the currents
into the input pins (see Section 1.1 “Absolute
Maximum Ratings †”).
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors against many (but not all)
over-voltage conditions, and to minimize the input bias
current (IB).
Figure 4-3 shows one approach to protecting these
inputs. The resistors R1 and R2 limit the possible
currents in or out of the input pins (and the ESD diodes,
D1 and D2). The diode currents will go through either
VDD or VSS.
Bond
VDD
VDD
Pad
D1 D2
R1
Bond
Pad
Bond
Pad
Input
Stage
V1
V2
VIN+
VIN–
MCP6H0X
VOUT
R2
Bond
Pad
VSS
R3
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
VSS – (minimum expected V1)
R1 >
R2 >
2 mA
VSS – (minimum expected V2)
2 mA
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that go well above VDD. Their
breakdown voltage is high enough to allow normal
operation, but not low enough to protect against slow
overvoltage (beyond VDD) events. Very fast ESD
events (that meet the specification) are limited so that
damage does not occur.
FIGURE 4-3:
Protecting the Analog
Inputs.
4.1.4
NORMAL OPERATION
The inputs of the MCP6H01/2/4 op amps connect to a
differential PMOS input stage. It operates at a low
common mode input voltage (VCM), including ground.
With this topology, the device operates with a VCM up
to VDD – 2.3V and 0.3V below VSS (refer to Figure 2-3
through 2-5). The input offset voltage is measured at
VCM = VSS – 0.3V and VDD – 2.3V to ensure proper
operation.
In some applications, it may be necessary to prevent
excessive voltages from reaching the op amp inputs;
Figure 4-2 shows one approach to protecting these
inputs.
2010-2011 Microchip Technology Inc.
DS22243D-page 17
MCP6H01/2/4
For a unity gain buffer, VIN must be maintained below
VDD – 2.3V for correct operation.
1000
1k
VDD = 16V
RL = 10 kΩ
4.2
Rail-to-Rail Output
100
10
1
GN:
The output voltage range of the MCP6H01/2/4 op amps
is 0.020V (typical) and 14.980V (typical) when
RL = 10 k is connected to VDD/2 and VDD = 15V.
Refer to Figures 2-24 through 2-29 for more
information.
1 V/V
2 V/V
5 V/V
4.3
Capacitive Loads
10p
100p
1n
10n
0.1µ
1µ
Normalized Load Capacitance; CL/GN (F)
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity-gain buffer (G = +1V/V) is the
most sensitive to capacitive loads, all gains show the
same general behavior.
FIGURE 4-5:
for Capacitive Loads.
Recommended RISO Values
4.4
Supply Bypass
With this family of operational amplifiers, the power
supply pin (VDD for single supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high-frequency performance. It can use a bulk
capacitor (i.e., 1 µF or larger) within 100 mm to provide
large, slow currents. This bulk capacitor can be shared
with other analog parts.
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = + 1V/V), a small series
resistor at the output (RISO in Figure 4-4) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will generally be lower than the bandwidth
with no capacitance load.
4.5
Unused Op Amps
An unused op amp in a quad package (MCP6H04)
should be configured as shown in Figure 4-6. These
circuits prevent the output from toggling and causing
crosstalk. Circuit A sets the op amp at its minimum
noise gain. The resistor divider produces any desired
reference voltage within the output voltage range of the
op amp, and the op amp buffers that reference voltage.
Circuit B uses the minimum number of components
and operates as a comparator, but it may draw more
current.
–
RISO
VOUT
MCP6H0X
+
VIN
CL
FIGURE 4-4:
Stabilizes Large Capacitive Loads.
Output Resistor, RISO
Figure 4-5 gives the recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit’s noise gain. For non-inverting gains, GN and the
Signal Gain are equal. For inverting gains, GN is
1 + |Signal Gain| (e.g., -1V/V gives GN = +2V/V).
¼ MCP6H04 (A)
¼ MCP6H04 (B)
VDD
VDD
VDD
R1
VREF
After selecting RISO for your circuit, double check the
resulting frequency response peaking and step
response overshoot. Modify RISO’s value until the
response is reasonable. Bench evaluation and
simulations with the MCP6H01/2/4 SPICE macro
model are helpful.
R2
R
2
V
= V
--------------------
REF
DD
R
+ R
1
2
FIGURE 4-6:
Unused Op Amps.
DS22243D-page 18
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
4.6
PCB Surface Leakage
4.7
Application Circuits
DIFFERENCE AMPLIFIER
In applications where low input bias current is critical,
PCB surface leakage effects need to be considered.
Surface leakage is caused by humidity, dust or other
contamination on the board. Under low-humidity condi-
tions, a typical resistance between nearby traces is
1012. A 15V difference would cause 15 pA of current
to flow; which is greater than the MCP6H01/2/4 family’s
bias current at +25°C (10 pA, typical).
4.7.1
The MCP6H01/2/4 op amps can be used in current
sensing applications. Figure 4-8 shows a resistor
(RSEN) that converts the sensor current (ISEN) to
voltage, as well as a difference amplifier that amplifies
the voltage across the resistor while rejecting common
mode noise. R1 and R2 must be well matched to obtain
an acceptable Common Mode Rejection Ratio
(CMRR). Moreover, RSEN should be much smaller than
R1 and R2 in order to minimize the resistive loading of
the source.
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-7.
To ensure proper operation, the op amp common mode
input voltage must be kept within the allowed range.
The reference voltage (VREF) is supplied by a
low-impedance source. In single-supply applications,
VREF is typically VDD/2.
Guard Ring
VIN– VIN+
VSS
.
R1
R2
VREF
VDD
VOUT
FIGURE 4-7:
for Inverting Gain.
Example Guard Ring Layout
ISEN
RSEN
MCP6H01
1. Non-inverting Gain and Unity-Gain Buffer:
a. Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
R2
R1
b. Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
RSEN << R1, R2
R2
2. Inverting Gain and Trans-impedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
VOUT = V1 – V2 ----- + VREF
R1
a. Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
FIGURE 4-8:
Using Difference Amplifier.
High Side Current Sensing
b. Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
2010-2011 Microchip Technology Inc.
DS22243D-page 19
MCP6H01/2/4
4.7.2
TWO OP AMP INSTRUMENTATION
AMPLIFIER
4.7.3
PHOTODETECTOR AMPLIFIER
The MCP6H01/2/4 op amps can be used to easily
convert the signal from a sensor that produces an
output current (such as a photo diode) into voltage (a
trans-impedance amplifier). This is implemented with a
single resistor (R2) in the feedback loop of the
amplifiers shown in Figure 4-10. The optional capacitor
(C2) sometimes provides stability for these circuits.
The MCP6H01/2/4 op amps are well suited for
conditioning sensor signals in battery-powered
applications. Figure 4-9 shows
instrumentation amplifier using the MCP6H02, which
works well for applications requiring rejection of
common mode noise at higher gains.
a two op amp
A photodiode configured in Photovoltaic mode has a
zero voltage potential placed across it. In this mode,
the light sensitivity and linearity is maximized, making it
best suited for precision applications. The key amplifier
specifications for this application are: low input bias
current, common mode input voltage range (including
ground), and rail-to-rail output.
To ensure proper operation, the op amp common mode
input voltage must be kept within the allowed range.
The reference voltage (VREF) is supplied by a low-
impedance source. In single-supply applications, VREF
is typically VDD/2.
RG
C2
R1
R2
R2
R1
VREF
R2
VOUT
VOUT
V2
V1
ID1
½
VDD
½
MCP6H02
MCP6H02
–
D1
Light
MCP6H01
+
R1 2R1
VOUT = V1 – V2 1 + ----- + -------- + VREF
R2 RG
VOUT = ID1*R2
FIGURE 4-9:
Instrumentation Amplifier.
Two Op Amp
FIGURE 4-10:
Photodetector Amplifier.
To obtain the best CMRR possible, and not limit the
performance by the resistor tolerances, set a high gain
with the RG resistor.
DS22243D-page 20
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
5.4
Analog Demonstration and
Evaluation Boards
5.0
DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6H01/2/4 family of op amps.
Microchip offers
a
broad spectrum of Analog
Demonstration and Evaluation Boards that are designed
to help you achieve faster time to market. For a com-
plete listing of these boards and their corresponding
user’s guides and technical information, visit the
Microchip web site: www.microchip.com/analogtools.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6H01/2/4
op amp is available on the Microchip web site at
www.microchip.com. The model was written and tested
in PSPICE owned by Orcad (Cadence). For other
simulators, it may require translation.
Some boards that are especially useful include:
• MCP6XXX Amplifier Evaluation Board 1
• MCP6XXX Amplifier Evaluation Board 2
• MCP6XXX Amplifier Evaluation Board 3
• MCP6XXX Amplifier Evaluation Board 4
• Active Filter Demo Board Kit
• 5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board,
P/N SOIC8EV
The model covers a wide aspect of the op amp’s
electrical specifications. Not only does the model cover
voltage, current and resistance of the op amp, but it
also covers the temperature and noise effects on the
behavior of the op amp. The model has not been
verified outside the specification range listed in the op
amp data sheet. The model behaviors under these con-
ditions cannot be guaranteed to match the actual op
amp performance.
5.5
Application Notes
The following Microchip analog design note and appli-
cation notes are available on the Microchip web site at
www.microchip.com/appnotes, and are recommended
as supplemental reference resources.
Moreover, the model is intended to be an initial design
tool. Bench testing is a very important part of any
design and cannot be replaced with simulations. Also,
simulation results using this macro model need to be
validated by comparing them to the data sheet
specifications and characteristic curves.
• ADN003: “Select the Right Operational Amplifier
for your Filtering Circuits”, DS21821
• AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
• AN723: “Operational Amplifier AC Specifications
and Applications”, DS00723
• AN884: “Driving Capacitive Loads With Op
Amps”, DS00884
• AN990: “Analog Sensor Conditioning Circuits –
An Overview”, DS00990
• AN1177: “Op Amp Precision Design: DC Errors”,
DS01177
• AN1228: “Op Amp Precision Design: Random
Noise”, DS01228
• AN1297: “Microchip’s Op Amp SPICE Macro
Models”’ DS01297
5.2
FilterLab Software
Microchip’s FilterLab software is an innovative software
tool that simplifies analog active filter (using op amps)
design. Available at no cost from the Microchip web site
at www.microchip.com/filterlab, the FilterLab design
tool provides full schematic diagrams of the filter circuit
with component values. It also outputs the filter circuit
in SPICE format, which can be used with the macro
model to simulate actual filter performance.
5.3
MAPS (Microchip Advanced Part
Selector)
• AN1332: “Current Sensing Circuit Concepts and
Fundamentals”’ DS01332
These application notes and others are listed in:
• “Signal Chain Design Guide”, DS21825
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip web site at www.microchip.com/
maps, MAPS is an overall selection tool for Microchip’s
product portfolio that includes analog, memory, MCUs
and DSCs. Using this tool, you can define a filter to sort
features for a parametric search of devices and export
side-by-side technical comparison reports. Helpful links
are also provided for data sheets, purchases and
sampling of Microchip parts.
2010-2011 Microchip Technology Inc.
DS22243D-page 21
MCP6H01/2/4
NOTES:
DS22243D-page 22
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6H01)
Example
Device
Code
DH25
MCP6H01
DHNN
Note: Applies to 5-Lead SC-70.
5-Lead SOT-23 (MCP6H01)
Example:
Device
MCP6H01
Note: Applies to 5-Lead SOT-23.
Code
2ANN
2A25
XXNN
8-Lead SOIC (150 mil) (MCP6H01, MCP6H02)
Example:
XXXXXXXX
MCP6H01E
e
3
XXXXYYWW
SN^1103
NNN
256
8-Lead 2x3 TDFN (MCP6H01, MCP6H02)
Example:
AAL
103
25
Legend: XX...X Customer-specific information
Y
YY
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
WW
NNN
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
*
)
3
e
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2010-2011 Microchip Technology Inc.
DS22243D-page 23
MCP6H01/2/4
Package Marking Information
14-Lead SOIC (150 mil) (MCP6H04)
Example:
XXXXXXXXXXX
XXXXXXXXXXX
MCP6H04
e
3
E/SL^
YYWWNNN
1103256
Example:
14-Lead TSSOP (MCP6H04)
XXXXXXXX
YYWW
6H04E/ST
1103
256
NNN
DS22243D-page 24
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
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ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢸꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢸꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢸꢃꢋꢍꢒ
ꢟ
ꢅ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢗꢁꢴꢟꢉꢠꢜꢡ
ꢗꢁꢶꢗ
ꢗꢁꢶꢗ
ꢗꢁꢗꢗ
ꢀꢁꢶꢗ
ꢀꢁꢀꢟ
ꢀꢁꢶꢗ
ꢗꢁꢀꢗ
ꢗꢁꢗꢶ
ꢗꢁꢀꢟ
ꢷ
ꢷ
ꢷ
ꢘꢁꢀꢗ
ꢀꢁꢘꢟ
ꢘꢁꢗꢗ
ꢗꢁꢘꢗ
ꢷ
ꢀꢁꢀꢗ
ꢀꢁꢗꢗ
ꢗꢁꢀꢗ
ꢘꢁꢞꢗ
ꢀꢁꢹꢟ
ꢘꢁꢘꢟ
ꢗꢁꢞꢴ
ꢗꢁꢘꢴ
ꢗꢁꢞꢗ
ꢎ
ꢳ
ꢷ
ꢜꢔꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢺꢗꢴꢀꢠ
2010-2011 Microchip Technology Inc.
DS22243D-page 25
MCP6H01/2/4
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS22243D-page 26
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢏꢒꢖꢆꢗꢍꢏꢒꢁꢞꢟꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
b
N
E
E1
3
2
1
e
e1
D
A2
c
A
φ
A1
L
L1
ꢬꢆꢃꢍꢇꢕꢭꢮꢮꢭꢕꢌꢣꢌꢯꢜ
ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢉꢮꢃꢄꢃꢍꢇ
ꢕꢭꢰ
ꢰꢱꢕ
ꢕꢛꢲ
ꢰꢐꢄꢳꢅꢓꢉꢈꢑꢉꢪꢃꢆꢇꢰ
ꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢟ
ꢅ
ꢗꢁꢻꢟꢉꢠꢜꢡ
ꢱꢐꢍꢇꢃꢋꢅꢉꢮꢅꢊꢋꢉꢪꢃꢍꢎꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢵꢅꢃꢚꢒꢍ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢜꢍꢊꢆꢋꢈꢑꢑ
ꢱꢥꢅꢓꢊꢏꢏꢉꢸꢃꢋꢍꢒ
ꢕꢈꢏꢋꢅꢋꢉꢪꢊꢎꢨꢊꢚꢅꢉꢸꢃꢋꢍꢒ
ꢱꢥꢅꢓꢊꢏꢏꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢉꢮꢅꢆꢚꢍꢒ
ꢧꢈꢈꢍꢔꢓꢃꢆꢍ
ꢧꢈꢈꢍꢉꢛꢆꢚꢏꢅ
ꢮꢅꢊꢋꢉꢣꢒꢃꢎꢨꢆꢅꢇꢇ
ꢮꢅꢊꢋꢉꢸꢃꢋꢍꢒ
ꢅꢀ
ꢛ
ꢛꢘ
ꢛꢀ
ꢌ
ꢌꢀ
ꢂ
ꢮ
ꢀꢁꢻꢗꢉꢠꢜꢡ
ꢗꢁꢻꢗ
ꢗꢁꢶꢻ
ꢗꢁꢗꢗ
ꢘꢁꢘꢗ
ꢀꢁꢹꢗ
ꢘꢁꢙꢗ
ꢗꢁꢀꢗ
ꢗꢁꢹꢟ
ꢗꢼ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢷ
ꢀꢁꢞꢟ
ꢀꢁꢹꢗ
ꢗꢁꢀꢟ
ꢹꢁꢘꢗ
ꢀꢁꢶꢗ
ꢹꢁꢀꢗ
ꢗꢁꢴꢗ
ꢗꢁꢶꢗ
ꢹꢗꢼ
ꢮꢀ
ꢀ
ꢎ
ꢳ
ꢗꢁꢗꢶ
ꢗꢁꢘꢗ
ꢗꢁꢘꢴ
ꢗꢁꢟꢀ
ꢜꢔꢊꢃꢉꢝ
ꢀꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢇꢉꢂꢉꢊꢆꢋꢉꢌꢀꢉꢋꢈꢉꢆꢈꢍꢉꢃꢆꢎꢏꢐꢋꢅꢉꢄꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢁꢉꢕꢈꢏꢋꢉꢑꢏꢊꢇꢒꢉꢈꢓꢉꢔꢓꢈꢍꢓꢐꢇꢃꢈꢆꢇꢉꢇꢒꢊꢏꢏꢉꢆꢈꢍꢉꢅꢖꢎꢅꢅꢋꢉꢗꢁꢀꢘꢙꢉꢄꢄꢉꢔꢅꢓꢉꢇꢃꢋꢅꢁ
ꢘꢁ ꢂꢃꢄꢅꢆꢇꢃꢈꢆꢃꢆꢚꢉꢊꢆꢋꢉꢍꢈꢏꢅꢓꢊꢆꢎꢃꢆꢚꢉꢔꢅꢓꢉꢛꢜꢕꢌꢉꢝꢀꢞꢁꢟꢕꢁ
ꢠꢜꢡꢢ ꢠꢊꢇꢃꢎꢉꢂꢃꢄꢅꢆꢇꢃꢈꢆꢁꢉꢣꢒꢅꢈꢓꢅꢍꢃꢎꢊꢏꢏꢤꢉꢅꢖꢊꢎꢍꢉꢥꢊꢏꢐꢅꢉꢇꢒꢈꢦꢆꢉꢦꢃꢍꢒꢈꢐꢍꢉꢍꢈꢏꢅꢓꢊꢆꢎꢅꢇꢁ
ꢕꢃꢎꢓꢈꢎꢒꢃꢔ ꢣꢅꢎꢒꢆꢈꢏꢈꢚꢤ ꢂꢓꢊꢦꢃꢆꢚ ꢡꢗꢞꢺꢗꢻꢀꢠ
2010-2011 Microchip Technology Inc.
DS22243D-page 27
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 28
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2011 Microchip Technology Inc.
DS22243D-page 29
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 30
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
ꢠꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢍꢜꢖꢆꢡꢆꢜꢄꢓꢓꢔꢢꢣꢆꢟꢤꢥꢚꢆꢎꢎꢆꢦꢔꢅꢧꢆꢗꢍꢏꢨꢘꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2010-2011 Microchip Technology Inc.
DS22243D-page 31
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 32
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2011 Microchip Technology Inc.
DS22243D-page 33
MCP6H01/2/4
ꢠꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢩꢐꢄꢈꢆꢪꢈꢄꢊꢣꢆꢜꢔꢆꢂꢃꢄꢅꢆꢇꢄꢌꢫꢄꢬꢃꢆꢕꢭꢜꢖꢆꢡꢆꢞꢮꢟꢮꢚꢤꢙꢀꢆꢎꢎꢆꢦꢔꢅꢧꢆꢗꢒꢩꢪꢜꢛ
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
DS22243D-page 34
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2011 Microchip Technology Inc.
DS22243D-page 35
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 36
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
ꢜꢔꢊꢃꢝ ꢧꢈꢓꢉꢍꢒꢅꢉꢄꢈꢇꢍꢉꢎꢐꢓꢓꢅꢆꢍꢉꢔꢊꢎꢨꢊꢚꢅꢉꢋꢓꢊꢦꢃꢆꢚꢇꢩꢉꢔꢏꢅꢊꢇꢅꢉꢇꢅꢅꢉꢍꢒꢅꢉꢕꢃꢎꢓꢈꢎꢒꢃꢔꢉꢪꢊꢎꢨꢊꢚꢃꢆꢚꢉꢜꢔꢅꢎꢃꢑꢃꢎꢊꢍꢃꢈꢆꢉꢏꢈꢎꢊꢍꢅꢋꢉꢊꢍꢉ
ꢒꢍꢍꢔꢢꢫꢫꢦꢦꢦꢁꢄꢃꢎꢓꢈꢎꢒꢃꢔꢁꢎꢈꢄꢫꢔꢊꢎꢨꢊꢚꢃꢆꢚ
2010-2011 Microchip Technology Inc.
DS22243D-page 37
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 38
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2011 Microchip Technology Inc.
DS22243D-page 39
MCP6H01/2/4
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22243D-page 40
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
APPENDIX A: REVISION HISTORY
Revision D (December 2011)
The following is the list of modifications:
1. Added the SC70-5 and SOT-23-5 packages for
the MCP6H01 device and updated all related
information throughout the document.
Revision C (March 2011)
The following is the list of modifications:
1. Added new device MCP6H04.
2. Updated Table 3-1 with MCP6H04 pin names
and details.
Revision B (October 2010)
The following is the list of modifications:
1. Updated Section 4.1 “Inputs”.
Revision A (March 2010)
• Original Release of this Document.
2010-2011 Microchip Technology Inc.
DS22243D-page 41
MCP6H01/2/4
NOTES:
DS22243D-page 42
2010-2011 Microchip Technology Inc.
MCP6H01/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
-X
PART NO.
Device
/XX
a)
MCP6H01T-E/LT:
Tape and Reel,
5LD SC70 pkg
Tape and Reel,
5LD SOT-23 pkg
8LD SOIC pkg
Tape and Reel,
8LD SOIC pkg
Tape and Reel,
8LD 2x3 TDFN pkg
8LD SOIC pkg
Tape and Reel,
8LD SOIC pkg
Tape and Reel
8LD 2x3 TDFN pkg
14LD SOIC pkg
Tape and Reel,
14LD SOIC pkg
14LD SOIC pkg
Tape and Reel,
14LD TSSOP pkg
Temperature
Range
Package
b)
MCP6H01T-E/OT:
c)
d)
MCP6H01-E/SN:
MCP6H01T-E/SN:
Device:
MCP6H01T:
Single Op Amp (Tape and Reel)
(SC-70, SOT-23)
Single Op Amp
Single Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(SOIC and 2x3 TDFN)
Quad Op Amp
e)
MCP6H01T-E/MNY:
MCP6H01:
MCP6H01T:
f)
g)
MCP6H02-E/SN:
MCP6H02T-E/SN:
MCP6H02:
MCP6H02T:
h)
MCP6H02T-E/MNY:
MCP6H04:
MCP6H04T:
i)
j)
MCP6H04-E/SL:
MCP6H04T-E/SL:
Quad Op Amp (Tape and Reel) (SOIC
and TSSOP)
k)
l)
MCP6H04-E/ST:
MCP6H04T-E/ST:
Temperature Range:
Package:
E
=
-40°C to +125°C
LT
OT
=
=
Plastic Package (SC-70), 5-lead
Plastic Small Outline Transistor (SOT-23), 5-lead
MNY *
= Plastic Dual Flat, No Lead, (2x3 TDFN) 8-lead
SN
SL
ST
=
=
=
Lead Plastic Small Outline (150 mil Body), 8-lead
Plastic Small Outline, (150 mil Body), 14-lead
Plastic Thin Shrink Small Outline (150 mil Body),
14-lead
* Y = Nickel palladium gold manufacturing designator. Only
available on the TDFN package.
2010-2011 Microchip Technology Inc.
DS22243D-page 43
MCP6H01/2/4
NOTES:
DS22243D-page 44
2010-2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-927-4
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2010-2011 Microchip Technology Inc.
DS22243D-page 45
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
11/29/11
DS22243D-page 46
2010-2011 Microchip Technology Inc.
相关型号：
MCP6H01T-E/MNY
OP-AMP, 3500 uV OFFSET-MAX, 1.2 MHz BAND WIDTH, PDSO8, 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8
MICROCHIP
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