MCP73834T [MICROCHIP]
Stand-Alone Linear Li-Ion / Li-Polymer Charge Management Controller;型号: | MCP73834T |
厂家: | MICROCHIP |
描述: | Stand-Alone Linear Li-Ion / Li-Polymer Charge Management Controller |
文件: | 总26页 (文件大小:1456K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP73833/4
Stand-Alone Linear Li-Ion / Li-Polymer Charge
Management Controller
Features
Description
• Complete Linear Charge Management Controller
The MCP73833/4 is a highly advanced linear charge
management controller for use in space-limited, cost
sensitive applications. The MCP73833/4 is available in
a 10-Lead, 3mm x 3mm DFN package or a 10-Lead,
MSOP package. Along with its small physical size, the
low number of external components required makes
the MCP73833/4 ideally suited for portable applica-
tions. For applications charging from a USB port, the
MCP73833/4 can adhere to all the specifications
governing the USB power bus.
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
• Constant Current / Constant Voltage Operation
with Thermal Regulation
• High Accuracy Preset Voltage Regulation:
- 4.2V, 4.35V, 4.4V, or 4.5V, + 0.75%
• Programmable Charge Current: 1A Maximum
• Preconditioning of Deeply Depleted Cells
- Selectable Current Ratio
The MCP73833/4 employs a constant current/constant
voltage charge algorithm with selectable precondition-
ing and charge termination. The constant voltage
regulation is fixed with four available options: 4.20V,
4.35V, 4.40V, or 4.50V, to accomodate new, emerging
battery charging requirements. The constant current
value is set with one external resistor. The
MCP73833/4 limits the charge current based on die
temperature during high power or high ambient condi-
tions. This thermal regulation optimizes the charge
cycle time while maintaining device reliability.
- Selectable Voltage Threshold
• Automatic End-of-Charge Control
- Selectable Current Threshold
- Selectable Safety Time Period
• Automatic Recharge
- Selectable Voltage Threshold
• Two Charge Status Outputs
• Cell Temperature Monitor
Several options are available for the preconditioning
threshold, preconditioning current value, charge
termination value, and automatic recharge threshold.
The preconditioning value and charge termination
value are set as a ratio, or percentage, of the
programmed constant current value. Preconditioning
can be set to 100%. Refer to Section 1.0 “Electrical
Characteristics” for available options and the
“Product Indentification System” for standard
options.
• Low-Dropout Linear Regulator Mode
• Automatic Power-Down when Input Power
Removed
• Under Voltage Lockout
• Numerous Selectable Options Available for a
Variety of Applications:
- Refer to Section 1.0 “Electrical
Characteristics” for Selectable Options
- Refer to the ”Product Identification
System” for Standard Options
The MCP73833/4 is fully specified over the ambient
temperature range of -40°C to +85°C.
• Available Packages:
- 3mm x 3mm DFN-10
- MSOP-10
Package Types
DFN-10
V
V
1
2
3
4
5
10
9
V
V
DD
DD
BAT
BAT
Applications
THERM
STAT1
STAT2
8
7
PG(TE)
PROG
• Lithium-Ion / Lithium-Polymer Battery Chargers
• Personal Data Assistants
• Cellular Telephones
6
V
SS
MSOP-10
V
V
1
10
V
V
DD
BAT
• Digital Cameras
2
3
4
5
9
8
7
6
DD
BAT
• MP3 Players
STAT1
STAT2
THERM
PG(TE)
PROG
• Bluetooth Headsets
• USB Chargers
V
SS
© 2006 Microchip Technology Inc.
DS22005A-page 1
MCP73833/4
Typical Application
1A Li-Ion Battery Charger
1,2
9,10
VIN
VDD
VBAT
Single
Li-Ion
Cell
+
-
1 µF
1 µF
3
4
7
8
6
5
THERM
STAT1
470Ω
470Ω
470Ω
STAT2 PROG
1 kΩ
T
10 kΩ
PG
VSS
MCP73833
Functional Block Diagram
V
DD
Direction
Control
10 µA
6 µA
V
BAT
CURRENT
LIMIT
G=0.001
+
-
1 kΩ
G=0.001
PROG
CA
+
-
Reference
Generator
111 kΩ
V
(1.21V)
REF
310 kΩ
72.7 kΩ
10 kΩ
+
-
PRECONDITION
470.6 kΩ
48 kΩ
6 µA
+
-
TERMINATIO N
CHARGE
+
-
6 kΩ
VA
+
-
157.3 kΩ
50 µA
+
-
SHDN
LDO
175 kΩ
+
-
STAT1
STAT2
PG (TE)
Charge
Control,
Timer,
and
Status
Logic
54 kΩ
+
-
121 kΩ
UVLO
HTVT
LTVT
V
SS
+
-
470.6kΩ
THERM
+
-
121 kΩ
1 MΩ
DS22005A-page 2
© 2006 Microchip Technology Inc.
MCP73833/4
*Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings
VDD........................................................................7.0V
All Inputs and Outputs w.r.t. VSS .....-0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ . Internally Limited
Storage temperature ..........................-65°C to +150°C
ESD protection on all pins:
Human Body Model (HBM)
(1.5 kΩ in Series with 100 pF)............................... ≥ 4 kV
Machine Model (MM)
(200 pF, No Series Resistance) ...........................300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typ)+0.3V] to 6V, TA=-40°C to 85°C.
Typical values are at +25°C, VDD= [VREG(Typ)+1.0V]
Parameters
Supply Input
Sym
Min
Typ
Max
Units
Conditions
Supply Voltage
VDD
3.75
—
—
6
6
V
V
Charging
VREG(Typ)
+0.3V
Charge Complete, Standby
Supply Current
ISS
—
—
—
2000
150
3000
300
µA
µA
µA
Charging
Charge Complete
100
300
Standby (No Battery or PROG
Floating)
—
50
100
µA
Shutdown (VDD < VBAT, or
V
DD < VSTOP)
UVLO Start Threshold
UVLO Stop Threshold
UVLO Hysteresis
VSTART
VSTOP
VHYS
3.4
3.3
—
3.55
3.45
100
3.7
3.6
—
V
V
VDD Low to High
VDD High to Low
mV
Voltage Regulation (Constant Voltage Mode, System Test Mode)
Regulated Output Voltage
VREG
4.168
4.318
4.367
4.467
—
4.20
4.35
4.40
4.50
0.10
4.232
4.382
4.433
4.533
0.30
V
V
VDD=[VREG(Typ)+1V]
IOUT=10 mA
V
TA=-5°C to +55°C
V
Line Regulation
|(ΔVBAT/VBAT
)
|
%/V
VDD=[VREG(Typ)+1V] to 6V
/ΔVDD
|
I
OUT=10 mA
IOUT=10 mA to 100 mA
DD=[VREG(Typ)+1V]
Load Regulation
|ΔVBAT/ VBAT
—
0.10
0.30
%
V
Supply Ripple Attenuation
PSRR
—
—
—
58
47
25
—
—
—
dB
dB
dB
IOUT=10 mA, 10Hz to 1 kHz
IOUT=10 mA, 10Hz to 10 kHz
IOUT=10 mA, 10Hz to 1 MHz
Current Regulation (Fast Charge Constant Current Mode)
Fast Charge Current Regulation
IREG
90
100
110
mA
mA
PROG = 10 kΩ
PROG = 1.0 kΩ
TA=-5°C to +55°C
PROG < 833Ω
900
1000
1100
Maximum Output Current Limit
IMAX
—
1200
—
mA
© 2006 Microchip Technology Inc.
DS22005A-page 3
MCP73833/4
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typ)+0.3V] to 6V, TA=-40°C to 85°C.
Typical values are at +25°C, VDD= [VREG(Typ)+1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current Ratio
IPREG / IREG
7.5
15
30
—
10
20
12.5
25
50
—
%
%
PROG = 1.0 kΩ to 10 kΩ
TA=-5°C to +55°C
40
%
100
66.5
71.5
100
%
Precondition Voltage Threshold
Ratio
VPTH / VREG
64
69
—
70
75
—
%
VBAT Low to High
VBAT High to Low
%
Precondition Hysteresis
VPHYS
mV
Charge Termination
Charge Termination Current Ratio
ITERM / IREG
3.75
5.6
7.5
15
5
6.25
9.4
%
%
%
%
PROG = 1.0 kΩ to 10 kΩ
7.5
10
20
TA=-5°C to +55°C
12.5
25
Automatic Recharge
Recharge Voltage Threshold Ratio
VRTH / VREG
—
—
94.0
96.5
—
—
%
%
VBAT High to Low
Pass Transistor ON-Resistance
ON-Resistance
RDSON
—
300
—
mΩ
VDD = 3.75V
TJ = 105°C
Battery Discharge Current
Output Reverse Leakage Current
IDISCHARGE
—
—
—
—
0.15
0.25
0.15
-5.5
2
2
µA
µA
µA
µA
PROG Floating
VDD < VBAT
2
VDD < VSTOP
-15
Charge Complete
Status Indicators - STAT1, STAT2, PG
Sink Current
ISINK
VOL
ILK
—
—
—
15
0.4
25
1
mA
V
Low Output Voltage
ISINK = 4 mA
Input Leakage Current
PROG Input
0.01
1
µA
High Impedance, 6V on pin
Charge Impedance Range
Standy Impedance
RPROG
RPROG
1
—
—
20
kΩ
kΩ
70
200
Minimum Impedance for
Standby
Thermistor Bias
Thermistor Current Source
Thermistor Comparator
Upper Trip Threshold
ITHERM
47
50
53
µA
2 kΩ < RTHERM < 50 kΩ
VTHERM Low to High
VTHERM High to Low
VT1
VT1HYS
VT2
1.20
—
1.23
-50
1.26
—
V
mV
V
Upper Trip Point Hysteresis
Lower Trip Threshold
0.235
—
0.25
50
0.265
—
Lower Trip Point Hysteresis
System Test (LDO) Mode
Input High Voltage Level
THERM Input Sink Current
Bypass Capacitance
VT2HYS
mV
(V -0.1)
DD
VIH
—
6
—
20
—
—
V
ISINK
CBAT
3
1
µA
µF
µF
Stand-by or system test mode
IOUT < 250 mA
—
—
4.7
IOUT > 250 mA
DS22005A-page 4
© 2006 Microchip Technology Inc.
MCP73833/4
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typ)+0.3V] to 6V, TA=-40°C to 85°C.
Typical values are at +25°C, VDD= [VREG(Typ)+1.0V]
Parameters
Sym
Min
Typ
Max
Units
Conditions
Automatic Power Down
Automatic Power Down Entry
Threshold
VPD
—
—
VBAT
50 mV
+
—
—
V
V
2.3V < VBAT < VREG
VDD Falling
Automatic Power Down Exit Thresh-
old
VPDEXIT
VBAT
150 mV
+
2.3V < VBAT < VREG
VDD Rising
Timer Enable Input (TE)
Input High Voltage Level
Input Low Voltage Level
Input Leakage Current
Thermal Shutdown
VIH
VIL
ILK
2.0
—
—
—
—
0.6
1
V
V
—
0.01
µA
VTE = 6V
Die Temperature
TSD
—
—
150
10
—
—
°C
°C
Die Temperature Hysteresis
TSDHYS
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typ)+0.3V] to 6V, TA=-40°C to 85°C.
Typical values are at +25°C, VDD= [VREG(Typ)+1.0V]
Parameters
UVLO Start Delay
Sym
Min
Typ
Max
Units
Conditions
tSTART
—
—
5
ms
VDD Low to High
Current Regulation
Transition Time Out of Preconditioning
Current Rise Time Out of Preconditioning
Preconditioning Comparator Filter Time
Termination Comparator Filter Time
Charge Comparator Filter Time
Thermistor Comparator Filter Time
Elapsed Timer
tDELAY
tRISE
tPRECON
tTERM
tCHARGE
tTHERM
—
—
—
—
1
ms
ms
ms
ms
ms
ms
VBAT<VPTH to VBAT>VPTH
IOUT Rising to 90% of IREG
Average VBAT Rise/Fall
Average IOUT Falling
1
0.4
0.4
0.4
0.4
1.3
1.3
1.3
1.3
3.2
3.2
3.2
3.2
Average VBAT Falling
Average THERM Rise/Fall
Elapsed Timer Period
tELAPSED
0
0
0
Hours Timer Disabled
3.6
5.4
7.2
4.0
6.0
8.0
4.4
6.6
8.8
Hours
Hours
Hours
Status Indicators
Status Output turn-off
Status Output turn-on
tOFF
tON
—
—
—
—
200
200
µs
µs
ISINK = 1 mA to 0 mA
ISINK = 0 mA to 1 mA
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typ)+0.3V] to 6V.
Typical values are at +25°C, VDD= [VREG(Typ)+1.0V]
Parameters
Temperature Ranges
Symbol
Min
Typ
Max
Units
Conditions
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, MSOP-10
TA
TA
TA
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
θJA
θJA
—
—
113
41
—
—
°C/W
°C/W
4-Layer JC51-7 Standard
Board, Natural Convection
Thermal Resistance, 3mm x 3mm DFN-10
4-Layer JC51-7 Standard
Board, Natural Convection
© 2006 Microchip Technology Inc.
DS22005A-page 5
MCP73833/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = 5.2V, VREG = 4.20V, IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
4.210
4.205
4.200
4.195
4.190
4.185
4.180
4.175
4.170
1000
100
10
MCP73833
IOUT = 10 mA
IOUT = 100 mA
IOUT = 500 mA
IOUT = 900 mA
1
3
5
7
9
11 13 15 17 19 21
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Programming Resistor (k:)
Supply Voltage (V)
FIGURE 2-1:
Battery Regulation Voltage
FIGURE 2-4:
Charge Current (I
) vs.
OUT
(V
) vs. Supply Voltage (V ).
Programming Resistor (R
).
BAT
DD
PROG
4.220
104
103
102
101
100
99
MCP73833
RPROG = 10 k:
IOUT = 10 mA
IOUT = 100 mA
4.210
4.200
4.190
4.180
IOUT = 500 mA
98
4.170
IOUT = 900 mA
97
4.160
96
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Supply Voltage (V)
Ambient Temperature (°C)
FIGURE 2-2:
Battery Regulation Voltage
FIGURE 2-5:
Charge Current (I
) vs.
OUT
(V ) vs. Ambient Temperature (T ).
Supply Voltage (V ).
BAT
A
DD
1004
1002
1000
998
996
994
992
990
988
986
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
RPROG = 1 k:
+85°C
-40°C
+25°C
3.00
3.20
3.40
3.60
3.80
4.00
4.20
4.50
4.75
5.00
5.25
5.50
5.75
6.00
Battery Regulation Voltage (V)
Supply Voltage (V)
FIGURE 2-3:
Output Leakage Current
FIGURE 2-6:
Charge Current (I
) vs.
OUT
(I ) vs. Battery Regulation Voltage
Supply Voltage (V ).
DISCHARGE
DD
(V
).
BAT
DS22005A-page 6
© 2006 Microchip Technology Inc.
MCP73833/4
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, VDD = 5.2V, VREG = 4.20V, IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
52.0
51.5
51.0
50.5
50.0
49.5
49.0
48.5
48.0
120
100
80
60
40
20
0
RPROG = 10 k:
Junction Temperature (°C)
Ambient Temperature (°C)
FIGURE 2-7:
Charge Current (I
) vs.
FIGURE 2-10:
Thermistor Bias Current
OUT
Junction Temperature (T ).
(I
) vs. Ambient Temperature (T ).
J
THRERM
A
0
-10
-20
-30
-40
-50
-60
-70
1200
1000
800
600
400
200
0
VAC = 100 mVp-p
IOUT = 10 mA
COUT = 4.7 µF, X7R
Ceramic
RPROG = 1 k:
0.01
0.1
1
10
100
1000
Junction Temperature (°C)
Frequency (kHz)
FIGURE 2-8:
Charge Current (I
) vs.
FIGURE 2-11:
Power Supply Ripple
OUT
Junction Temperature (T ).
Rejection (PSRR).
J
52.0
51.5
51.0
50.5
50.0
49.5
49.0
48.5
48.0
0
VAC = 100 mVp-p
IOUT = 100 mA
COUT = 4.7 µF, X7R
Ceramic
-10
-20
-30
-40
-50
-60
4.50
4.75
5.00
5.25
5.50
5.75
6.00
0.01
0.1
1
10
100
1000
Supply Voltage (V)
Frequency (kHz)
FIGURE 2-9:
Thermistor Bias Current
FIGURE 2-12:
Power Supply Ripple
(I
) vs. Supply Voltage (V ).
Rejection (PSRR).
THRERM
DD
© 2006 Microchip Technology Inc.
DS22005A-page 7
MCP73833/4
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, VDD = 5.2V, VREG = 4.20V, IOUT = 10 mA and TA= +25°C, Constant-voltage mode.
14
12
10
8
0.10
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
-0.20
0.10
0.05
0.05
0.00
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
6
4
2
IOUT = 10 mA
COUT = 4.7 µF, X7R
Ceramic
COUT = 4.7 µF, X7R
Ceramic
0
-2
Time (µs)
Time (µs)
FIGURE 2-13:
Line Transient Response.
FIGURE 2-16:
Load Transient Response.
14
12
10
8
0.10
0.05
0.00
-0.05
-0.10
-0.15
5.0
4.0
3.0
2.0
200
160
120
80
6
4
MCP73833-FCI/MF
DD = 5.2V
RPROG = 10.0 k:
2
IOUT = 100 mA
COUT = 4.7 µF, X7R
Ceramic
-0.20
-0.25
-0.30
1.0
0.0
40
V
0
-2
0
Time (Minutes)
Time (µs)
FIGURE 2-14:
Line Transient Response.
FIGURE 2-17:
Complete Charge Cycle
(180 mA Li-Ion Battery).
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
-0.05
0.04
0.02
0.00
-0.02
-0.04
-0.06
5.0
4.0
3.0
2.0
1.0
0.0
200
160
120
80
-0.08
MCP73833-FCI/MF
VDD = 5.2V 40
RPROG = 10.0 k:
COUT = 4.7 µF, X7R
Ceramic
-0.10
-0.12
0
0
2
4
6
8
10
Time (µs)
Time (Minutes)
FIGURE 2-15:
Load Transient Response.
FIGURE 2-18:
Charge Cycle Start -
Preconditioning (180 mAh Li-Ion Battery).
DS22005A-page 8
© 2006 Microchip Technology Inc.
MCP73833/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
Function
DFN
MSOP
1
2
1
2
VDD
VDD
Battery Management Input Supply
Battery Management Input Supply
Charge Status Output
3
3
STAT1
STAT2
VSS
4
4
Charge Status Output
5
5
Battery Management 0V Reference
6
6
PROG
PG, TE
THERM
VBAT
Current Regulation Set and Charge Control Enable
7
7
MCP73833: Power Good output, MCP73834: Timer Enable input
Thermistor input
8
8
9
9
Battery Charge Control Output
10
10
VBAT
Battery Charge Control Output
3.1
Battery Management Input Supply
(VDD
3.6
Timer Enable Input (TE)
MCP73834 Only
)
A supply voltage of [VREG (typ.) + 0.3V] to 6V is
recommended. Bypass to VSS with a minimum of 1 µF.
The timer enable (TE) input option is used to enable or
disable the internal timer. A low signal on this pin
enables the internal timer and a high signal disables
the internal timer. The TE input can be used to disable
the timer when the charger is supplying current to
charge the battery and power the system load. The TE
input is compatible with 1.8V logic.
3.2
Charge Status Outputs (STAT1,
STAT2)
STAT1 and STAT2 are open-drain logic outputs for con-
nection to a LED for charge status indication.
Alternatively, a pull-up resistor can be applied for
interfacing to a host microcontroller.
3.7
Thermistor Input (THERM)
An internal 50 µA current source provides the bias for
most common 10 kΩ negative-temperature coefficient
thermistors (NTC). The MCP73833/4 compares the
voltage at the THERM pin to factory set thersholds of
1.20V and 0.25V, typically.
3.3
Battery Management 0V Reference
(VSS)
Connect to negative terminal of battery and input
supply.
3.8
Battery Charge Control Output
(VBAT
3.4
Current Regulation Set (PROG)
)
Preconditioning, fast charge, and termination currents
are scaled by placing a resistor from PROG to VSS
Connect to positive terminal of battery. Drain terminal
of internal P-channel MOSFET pass transistor. Bypass
to VSS with a minimum of 1 µF to ensure loop stability
when the battery is disconnected.
.
The charge management controller can be disabled by
allowing the PROG input to float.
3.5
Power Good Indication (PG)
MCP73833 Only
The power good (PG) option is a pseudo open-drain
output. The PG output can sink current, but not source
current. However, there is a diode path back to the
input, and, as such, the PG output should only be
pulled up to the input. The PG output is low whenever
the input to the MCP73833 is above the UVLO
threshold and greater than the battery voltage.
© 2006 Microchip Technology Inc.
DS22005A-page 9
MCP73833/4
4.0
FUNCTIONAL DESCRIPTION
The MCP73833/4 is a highly advanced linear charge
management controller. Refer to the functional block
diagram and Figure 4-1 that depicts the operational
flow algorithm from charge initiation to completion and
automatic recharge.
* Continuously Monitored
SHUTDOWN MODE *
< V
V
DD
UVLO
V
< V
BAT
DD
STAT1 = HI-Z
STAT2 = HI-Z
PG = HI-Z
SYSTEM TEST (LDO) MODE
> (V - 100 mv)
STANDBY MODE *
V
THERM
DD
V
(V
+ 100 mv)
BAT
REG
PROG > 20 kΩ
PROG > 200 kΩ
STAT1 = LOW
STAT2 = LOW
PG = LOW
STAT1 = HI-Z
STAT2 = HI-Z
PG = LOW
Timer Suspended
V
< V
PTH
BAT
PRECONDITIONING MODE
Charge Current (I
PREG
STAT1 = LOW
STAT2 = Hi-Z
PG = LOW
Timer Reset
V
> V
PTH
BAT
V
> V
PTH
BAT
FAST CHARGE MODE
TIMER FAULT
TEMPERATURE FAULT
Charge Current (I
No Charge Current
No Charge Current
REG
STAT1 = LOW
STAT1 = Hi-Z
STAT1 = Hi-Z
STAT2 = Hi-Z
PG = LOW
Timer Enabled
STAT2 = Hi-Z
PG = LOW
Timer Suspended
STAT2 = Hi-Z
PG = LOW
Timer Suspended
Timer Expired
< V
RTH
V
BAT
V
= V
REG
BAT
CONSTANT VOLTAGE MODE
Charge Voltage (V
REG
STAT1 = LOW
STAT2 = Hi-Z
PG = LOW
V
< I
TERM
BAT
Timer Expired
CHARGE COMPLETE MODE
No Charge Current
STAT1 = HI-Z
STAT2 = LOW
PG = LOW
Timer Reset
FIGURE 4-1:
Flow Chart.
DS22005A-page 10
© 2006 Microchip Technology Inc.
MCP73833/4
4.1
Under Voltage Lockout (UVLO)
4.4
Constant Current - Fast Charge
Mode
An internal under voltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
shutdown mode until the input supply rises above the
UVLO threshold. The UVLO circuitry has a built in
hysteresis of 100 mV.
During the constant current mode, the programmed
charge current is supplied to the battery or load. The
charge current is established using a single resistor
from PROG to VSS. The program resistor and the
charge current are calculated using Equation 4-1:
In the event a battery is present when the input power
is applied, the input supply must rise +150 mV above
the battery voltage before the MCP73833/4 becomes
operational.
EQUATION 4-1:
1000V
IREG = ----------------
RPROG
Where:
RPROG
IREG
The UVLO circuit places the device in shutdown mode
if the input supply falls to within +50 mV of the battery
voltage.
=
=
kilo-ohms
milliampere
The UVLO circuit is always active. At any time the input
supply is below the UVLO threshold or within +50 mV
of the voltage at the VBAT pin, the MCP73833/4 is
placed in a shutdown mode.
Constant current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG
.
When constant current mode is invoked, the internal
timer is reset.
During any UVLO condition, the battery reverse
discharge current shall be less than 2 µA.
4.4.1
TIMER EXPIRED DURING CONSTANT
CURRENT - FAST CHARGE MODE
4.2
Charge Qualification
If the internal timer expires before the recharge voltage
threshold is reached, a timer fault is indicated and the
charge cycle terminates. The MCP73833/4 remains in
this condition until the battery is removed, the input
power is removed, or the PROG pin is opened. If the
battery is removed or the PROG pin is opened, the
MCP73833/4 enters the Standby mode where it
remains until a battery is reinserted or the PROG pin is
reconnected. If the input power is removed, the
MCP73833/4 is in Shutdown. When the input power is
reapplied, a normal start-up sequence ensues.
For a charge cycle to begin, all UVLO conditions must
be met and a battery or output load must be present.
A charge current programming resistor must be
connected from PROG to VSS. If the PROG pin is open
or floating, the MCP73833/4 is disabled and the battery
reverse discharge current is less than 2 µA. In this
manner, the PROG pin acts as a charge enable and
can be used as a manual shutdown.
If the input supply voltage is above the UVLO
threshold,
but
below
VREG(Typ)+0.3V,
the
MCP73833/4 will pulse the STAT1 and PG outputs as
the device determines if a battery is present.
4.5
Constant Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 4.20V,
4.35V, 4.40V, or 4.50V with a tolerance of ± 0.75%.
4.3
Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73833/4 enters a
preconditioning or trickle charge mode. The
preconditioning threshold is factory set. Refer to
4.6
Charge Termination
Section 1.0
“Electrical
Characteristics”
for
preconditioning threshold options.
The charge cycle is terminated when, during constant
voltage mode, the average charge current diminishes
below a percentage of the programmed charge current
(established with the value of the resistor connected to
the PROG pin) or the internal timer has expired. A 1 ms
filter time on the termination comparator ensures that
transient load conditions do not result in premature
charge cycle termination. The percentage or ratio of the
current is factory set. The timer period is factory set
and can be disabled. Refer to Section 1.0 “Electrical
Characteristics” for charge termination current ratio
and timer period options.
In this mode, the MCP73833/4 supplies a percentage
of the charge current (established with the value of the
resistor connected to the PROG pin) to the battery. The
percentage or ratio of the current is factory set. Refer to
Section 1.0
“Electrical
Characteristics”
for
preconditioning current options.
When the voltage at the VBAT pin rises above the pre-
conditioning threshold, the MCP73833/4 enters the
constant current or fast charge mode.
The charge current is latched off and the MCP73833/4
enters a charge complete mode.
© 2006 Microchip Technology Inc.
DS22005A-page 11
MCP73833/4
4.7
Automatic Recharge
4.9
Thermal Shutdown
The MCP73833/4 continuously monitors the voltage at
the VBAT pin in the charge complete mode. If the
voltage drops below the recharge threshold, another
charge cycle begins and current is once again supplied
to the battery or load. The recharge threshold is factory
set. Refer to Section 1.0 “Electrical Characteristics”
for recharge threshold options.
The MCP73833/4 suspends charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by approximately
+10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
4.8
Thermal Regulation
The MCP73833/4 limits the charge current based on
the die temperature. The thermal regulation optimizes
the charge cycle time while maintaining device reliabil-
ity. Figure 4-2 depicts the thermal regulation for the
MCP73833/4.
1200
RPROG = 1 kΩ
1000
800
600
400
200
0
Junction Temperature (°C)
FIGURE 4-2:
Thermal Regulation.
DS22005A-page 12
© 2006 Microchip Technology Inc.
MCP73833/4
pass transistor and holding the timer value. The charge
cycle resumes when the voltage at the THERM pin
returns to the normal range.
5.0
DETAILED DESCRIPTION
5.1
Analog Circuitry
If temperature monitoring is not required, place a
standard 10 kΩ resistor from THERM to VSS
5.1.1
BATTERY MANAGEMENT INPUT
SUPPLY (V
)
DD
5.1.4.1
System Test (LDO) Mode
The VDD input is the input supply to the MCP73833/4.
The MCP73833/4 automatically enters a Power-down
mode if the voltage on the VDD input falls below the
UVLO voltage (VSTOP). This feature prevents draining
the battery pack when the VDD supply is not present.
The MCP73833/4 can be placed in a system test mode.
In this mode, the MCP73833/4 operates as a low
dropout linear regulator (LDO). The output voltage is
regulated to the factory set voltage regulation option.
The available output current is limitted to the
programmed fast charge current. For stability, the VBAT
output must be bypassed to VSS with a minimum
capacitance of 1 µF for output currents up to 250 mA.
A minimum capacitance of 4.7 µF is required for output
currents above 250 mA.
5.1.2
CURRENT REGULATION SET
(PROG)
Fast charge current regulation can be scaled by placing
a programming resistor (RPROG) from the PROG input
to VSS. The program resistor and the charge current
are calculated using the Equation 5-1:
The system test mode is entered by driving the THERM
input greater than (VDD-100 mV) with no battery
connected to the output. In this mode, the MCP73833/4
can be used to power the system without a battery
present.
EQUATION 5-1:
1000V
RPROG
IREG = ----------------
Where:
RPROG
IREG
Note 1: ITHERM is disabled during shutdown,
=
=
kilo-ohms
milliampere
stand-by, and system test modes.
2: A pull-down current source on the
THERM input is active only in stand-by
and system test modes.
The preconditioning trickle-charge current and the
charge termination current are ratiometric to the fast
charge current based on the selected device options.
3: During system test mode, the PROG
input sets the available output current
limit.
5.1.3
BATTERY CHARGE CONTROL
OUTPUT (V
)
BAT
4: System test mode shall be exited by
releasing the THERM input or cycling
input power.
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73833/4
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
5.2
Digital Circuitry
5.2.1
STATUS INDICATORS AND POWER
GOOD (PG - OPTION)
5.1.4
TEMPERATURE QUALIFICATION
(THERM)
The charge status outputs have two different states:
Low (L), and High Impedance (Hi-Z). The charge status
outputs can be used to illuminate LEDs. Optionally, the
charge status outputs can be used as an interface to a
host microcontroller. Table 5-1 summarize the state of
the status outputs during a charge cycle.
The MCP73833/4 continuously monitors battery
temperature during a charge cycle by measuring the
voltage between the THERM and VSS pins. An internal
50 µA current source provides the bias for most
common 10 kΩ negative-temperature coefficient
(NTC) or positive-temperature coefficient (PTC)
thermistors.The current source is controlled, avoiding
measurement sensitivity to fluctuations in the supply
voltage (VDD). The MCP73833/4 compares the voltage
at the THERM pin to factory set thersholds of 1.20V
and 0.25V, typically. Once a volage outside the
thresholds is detected during a charge cycle, the
MCP73833/4 immediately suspends the charge cycle.
The MCP73833/4 suspends charge by turning off the
TABLE 5-1:
STATUS OUTPUTS
CHARGE CYCLE STATE
STAT1 STAT2
PG
Shutdown
Hi-Z
Hi-Z
L
Hi-Z
Hi-Z
Hi-Z
L
Hi-Z
L
Standby
Charge in Progress
Charge Complete (EOC)
Temperature Fault
Timer Fault
L
Hi-Z
Hi-Z
Hi-Z
L
L
Hi-Z
Hi-Z
L
L
L
System Test Mode
L
© 2006 Microchip Technology Inc.
DS22005A-page 13
MCP73833/4
5.2.2
POWER GOOD (PG) OPTION
5.2.4
DEVICE DISABLE (PROG)
The power good (PG) option is a pseudo open-drain
output. The PG output can sink current, but not source
current. However, there is a diode path back to the
input, and as such, the PG output should only be pulled
up to the input. The PG output is low whenever the
input to the MCP73833 is above the UVLO threshold
and greater than the battery voltage. If the supply volt-
age is above the UVLO, but below VREG(Typ)+0.3V,
the MCP73833 will pulse the PG output as the device
determines if a battery is present.
The current regulation set input pin (PROG) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or
initiate a recharge cycle.
Placing a programming resistor from the PROG input to
VSS enables the device. Allowing the PROG input to
float or by applying a logic-high input signal, disables
the device and terminates a charge cycle. When
disabled, the device’s supply current is reduced to
100 µA, typically.
5.2.3
TIMER ENABLE (TE) OPTION
The timer enable (TE) input option is used to enable or
disable the internal timer. A low signal on this pin
enables the internal timer and a high signal disables
the internal timer. The TE input can be used to disable
the timer when the charger is supplying current to
charge the battery and power the system load. The TE
input is compatible with 1.8V logic.
DS22005A-page 14
© 2006 Microchip Technology Inc.
MCP73833/4
6.0
APPLICATIONS
The MCP73833/4 is designed to operate in conjunction
with a host microcontroller or in stand-alone applica-
tions. The MCP73833/4 provides the preferred charge
algorithm for Lithium-Ion and Lithium-Polymer cells
Constant-current followed by Constant-voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figures 6-2 and 6-3 depict the
accompanying charge profile.
Li-Ion Battery Charger
1,2
9,10
VBAT
VDD
+
-
Single
Li-Ion
Cell
C
IN
COUT
LED LED LED
3
4
7
8
6
5
STAT1
STAT2
PG
THERM
PROG
VSS
Regulated
Wall Cube
RLED
RT1
RLED
RPROG RT2
T 10 kΩ
RLED
MCP73833
FIGURE 6-1:
Typical Application Circuit.
6.1
Application Circuit Design
5.0
4.0
3.0
2.0
1.0
0.0
2.00
1.60
1.20
0.80
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
MCP73833-FCI/MF
DD = 5.2V
PROG = 1.00 k:
0.40
0.00
V
R
Time (Minutes)
6.1.1
COMPONENT SELECTION
FIGURE 6-2:
Typical Charge Profile with
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
Thermal Regulation (1700 mAh Li-Ion Battery).
5.0
4.0
3.0
2.0
1.0
0.0
2.00
1.60
1.20
0.80
0.40
0.00
6.1.1.1
Current Programming Resistor
(R
)
PROG
The preferred fast charge current for Lithium-Ion cells
is at the 1C rate, with an absolute maximum current at
the 2C rate. For example, a 500 mAh battery pack has
a preferred fast charge current of 500 mA. Charging at
this rate provides the shortest charge cycle times
without degradation to the battery pack performance or
life.
MCP73833-FCI/MF
DD = 5.2V
RPROG = 1.00 k:
V
Time (Minutes)
FIGURE 6-3:
Typical Charge Cycle Start
with Thermal Regulation (1700 mAh Li-Ion
Battery).
© 2006 Microchip Technology Inc.
DS22005A-page 15
MCP73833/4
6.1.1.2
Thermal Considerations
6.1.1.5
Charge Inhibit
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-current mode. In
this case, the power dissipation is:
The current regulation set input pin (PROG) can be
used to terminate a charge at any time during the
charge cycle, as well as to initiate a charge cycle or
initiate a recharge cycle.
Placing a programming resistor from the PROG input to
VSS enables the device. Allowing the PROG input to
float or by applying a logic-high input signal, disables
the device and terminates a charge cycle. When
disabled, the device’s supply current is reduced to
100 µA, typically.
PowerDissipation = (V
– V
) × I
PTHMIN REGMAX
DDMAX
Where:
VDDMAX
IREGMAX
VPTHMIN
=
=
=
the maximum input voltage
the maximum fast charge current
6.1.1.6
Temperature Monitoring
the minimum transition threshold
voltage
The charge temperature window can be set by placing
fixed value resistors in series-parallel with a thermistor.
The resistance values of RT1 and RT2 can be
calculated with the following equations in order to set
the temperature window of interest.
Power dissipation with a 5V, ±10% input voltage source
is:
PowerDissipation = (5.5V – 2.7V) × 550mA = 1.54W
For NTC thermistors:
RT2 × RCOLD
24kΩ = RT1 + ---------------------------------
RT2 + RCOLD
This power dissipation with the battery charger in the
MSOP-10 package will cause thermal regulation to be
entered as depicted in Figure 6-3. Alternatively, the
3 mm x 3 mm DFN package could be utilized to reduce
charge cycle times.
RT2 × RHOT
5kΩ = RT1 + ----------------------------
R
T2 + RHOT
Where:
T1 is the fixed series resistance
6.1.1.3
External Capacitors
R
The MCP73833/4 is stable with or without a battery
load. In order to maintain good AC stability in the Con-
stant-voltage mode, a minimum capacitance of 4.7 µF
is recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and interconnec-
tions appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant-voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
RT2 is the fixed parallel resistance
RCOLD is the thermistor resistance at the
lower temperature of interest
RHOT is the thermistor resistance at the upper
temperature of interest.
For example, by utilizing a 10 kΩ at 25C NTC
thermistor with a sensitivity index, β, of 3892, the
charge temperature range can be set to 0C - 50C by
placing a 1.54 kΩ resistor in series (RT1), and a
69.8 kΩ resistor in parallel (RT2) with the thermistor as
depicted in Figure 6-1.
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 4.7 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability for output
currents up to a 500 mA.
6.1.1.7
Charge Status Interface
A status output provides information on the state of
charge. The output can be used to illuminate external
LEDs or interface to a host microcontroller. Refer to
Table 5-1 for a summary of the state of the status
output during a charge cycle.
6.1.1.4
Reverse-Blocking Protection
The MCP73833/4 provides protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
DS22005A-page 16
© 2006 Microchip Technology Inc.
MCP73833/4
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
recommended to minimize voltage drops along the
high current-carrying PCB traces.
If the PCB layout is used as a heatsink, adding many
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figures 6-4 and 6-5 depict a
typical layout with PCB heatsinking.
MCP73833
VSS
CIN
VDD
COUT
VBAT
STAT1
THERM
STAT2
PG
RPROG
FIGURE 6-4:
Typical Layout (Top).
VSS
VDD
VBAT
FIGURE 6-5:
Typical Layout (Bottom).
© 2006 Microchip Technology Inc.
DS22005A-page 17
MCP73833/4
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
10-Lead DFN
Example:
Marking
Code
Marking
Code
Part Number *
Part Number *
1
2
3
4
5
10
9
1
10
9
XXXX
XYWW
NNN
AAAA
0633
256
2
3
4
5
MCP73833-AMI/MF
MCP73833-BZI/MF
MCP73833-FCI/MF
MCP73833-GPI/MF
MCP73833-NVI/MF
MCP73833-CNI/MF
AAAA
AAAB
AAAC
AAAD
AAAF
AAAK
8
8
7
7
MCP73834-FCI/MF
MCP73834-GPI/MF
MCP73834-NVI/MF
MCP73834-CNI/MF
BAAC
BAAD
BAAF
BAAK
6
6
* Consult Factory for Alternative Device Options.
Example:
10-Lead MSOP
Marking
Code
Marking
Code
Part Number *
Part Number *
MCP73833-AMI/UN
MCP73833-BZI/UN
MCP73833-FCI/UN
MCP73833-GPI/UN
MCP73833-NVI/UN
MCP73833-CNI/UN
833AMI
8336SI
633256
XXXXXX
YWWNNN
833BZI
833FCI MCP73834-FCI/UN
833GPI MCP73834-GPI/UN
833NVI MCP73834-NVI/UN
833CNI MCP73834-CNI/UN
834FCI
834GPI
834NVI
834CNI
* Consult Factory for Alternative Device Options.
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS22005A-page 18
© 2006 Microchip Technology Inc.
MCP73833/4
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
b
p
E
n
L
K
D
D2
EXPOSED
METAL
PAD
2
1
PIN 1
ID INDEX
AREA
E2
(NOTE 2)
TOP VIEW
BOTTOM VIEW
(NOTE 1)
A
EXPOSED
TIE BAR
(NOTE 3)
A3
A1
Units
INCHES
NOM
MILLIMETERS
NOM
10
*
Dimension Limits
MIN
MAX
MIN
MAX
n
e
Number of Pins
Pitch
10
.020 BSC
0.50 BSC
0.90
Overall Height
Standoff
A
.031
.035
.039
0.80
1.00
0.05
A1
A3
E
.000
.001
.002
0.00
0.02
Lead Thickness
Overall Length
.008 REF.
0.20 REF.
3.00
.112
.082
.112
.051
.008
.012
.008
.118
.094
.118
.065
.010
.016
—
.124
.096
.124
.067
.015
.020
—
2.85
2.08
2.85
1.30
0.18
0.30
0.20
3.15
2.45
3.15
1.70
0.30
0.50
—
(
Note 3
)
Exposed Pad Length
Overall Width
E2
D
2.39
3.00
(
Note 3
)
Exposed Pad Width
Lead Width
D2
b
1.65
0.25
Contact Length §
Contact-to-Exposed Pad §
L
0.40
K
—
*
§
Controlling Parameter
Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: Not Registered
Drawing No. C04-063
Revised 09-12-05
© 2006 Microchip Technology Inc.
DS22005A-page 19
MCP73833/4
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Note:
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
1
n
B
c
α
φ
A2
A
A1
L
β
(F)
Units
Dimension Limits
INCHES
NOM
MILLIMETERS
*
MIN
MAX
MIN
NOM
MAX
n
p
Number of Pins
Pitch
10
10
.020 BSC
.033
0.50 BSC
Overall Height
A
A2
A1
E
.043
–
0.75
0.00
–
1.10
0.95
0.15
Molded Package Thickness
Standoff
.030
.000
.037
.006
0.85
Overall Width
.193 BSC
.118 BSC
.118 BSC
4.90 BSC
Molded Package Width
Overall Length
Foot Length
E1
D
3.00 BSC
3.00 BSC
L
.016
.024
.037 REF
.031
0.40
0.60
0.95 REF
0.80
Footprint
F
φ
Foot Angle
0°
.003
.006
5°
–
–
8°
.009
.012
15°
0°
0.08
0.15
5°
–
–
8°
0.23
0.30
15°
c
Lead Thickness
Lead Width
B
.009
–
0.23
–
α
Mold Draft Angle Top
Mold Draft Angle Bott om
β
5°
–
15°
5°
–
15°
*
Controlling Parameter
Notes:
Dimensions D and E1 donot include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimnesion, usually witho ut tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-187 BA
Drawing No. C04-021
Revised 09-16-05
DS22005A-page 20
© 2006 Microchip Technology Inc.
MCP73833/4
APPENDIX A: REVISION HISTORY
Revision A (September 2006)
• Original Release of this Document.
© 2006 Microchip Technology Inc.
DS22005A-page 23
MCP73833/4
NOTES:
DS22005A-page 24
© 2006 Microchip Technology Inc.
MCP73833/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples: * *
PART NO.
Device
XX
X/
XX
a)
b)
c)
d)
e)
f)
MCP73833-AMI/UN: 10-lead MSOP pkg.
Output Temp. Package
Options*
MCP73833-BZI/UN: 10-lead MSOP pkg.
MCP73833-CNI/MF: 10-lead DFN pkg.
MCP73833-FCI/UN: 10-lead MSOP pkg.
MCP73833-GPI/UN: 10-lead MSOP pkg.
MCP73833-NVI/MF: 10-lead DFN pkg.
Device:
MCP73833: 1A Fully Integrated Charger,
PG function on pin 7
MCP73833T: 1A Fully Integrated Charger,
PG function on pin 7
a)
b)
c)
d)
MCP73834-CNI/MF: 10-lead DFN pkg.
MCP73834-FCI/UN: 10-lead MSOP pkg.
MCP73834-GPI/UN: 10-lead MSOP pkg.
MCP73834-NVI/MF: 10-lead DFN pkg.
(Tape and Reel)
MCP73834: 1A Fully Integrated Charger,
TE function on pin 7
MCP73834T: 1A Fully Integrated Charger,
TE function on pin 7
(Tape and Reel)
* * Consult Factory for Alternative Device Options
Output Options * *
* Refer to table below for different operational options.
* * Consult Factory for Alternative Device Options.
Temperature:
I
=
-40°C to +85°C
Package Type:
MF
UN
=
=
Plastic Dual Flat No Lead (DFN)
(3x3x0.9 mm Body), 10-lead
Plastic Micro Small Outline Package (MSOP),
10-lead
Part Number
VREG
IPREG/IREG
VPTH/VREG
ITERM/IREG
VRTH/VREG
Timer Period
MCP73833-AMI/MF
MCP73833-BZI/MF
MCP73833-CNI/MF
MCP73833-FCI/MF
MCP73833-GPI/MF
MCP73833-NVI/MF
4.20V
4.20V
4.20V
4.20V
4.20V
4.35V
10%
100%
10%
71.5%
N/A
7.5%
7.5%
20%
96.5%
96.5%
94%
0 hours
0 hours
4 hours
6 hours
6 hours
6 hours
71.5%
71.5%
N/A
10%
7.5%
7.5%
7.5%
96.5%
96.5%
96.5%
100%
10%
71.5%
MCP73833-AMI/UN
MCP73833-FCI/UN
4.20V
4.20V
10%
10%
71.5%
71.5%
7.5%
7.5%
96.5%
96.5%
0 hours
6 hours
MCP73834-BZI/MF
MCP73834-CNI/MF
MCP73834-FCI/MF
MCP73834-NVI/MF
4.20V
4.20V
4.20V
4.35V
100%
10%
10%
10%
N/A
7.5%
20%
96.5%
94%
0 hours
4 hours
6 hours
6 hours
71.5%
71.5%
71.5%
7.5%
7.5%
96.5%
96.5%
MCP73834-FCI/UN
4.20V
10%
71.5%
7.5%
96.5%
6 hours
© 2006 Microchip Technology Inc.
DS22005A-page 25
MCP73833/4
NOTES:
DS22005A-page 26
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS22005A-page 27
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Habour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
Austria - Wels
Tel: 43-7242-2244-3910
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Gumi
Tel: 82-54-473-4301
Fax: 82-54-473-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Penang
Tel: 60-4-646-8870
Fax: 60-4-646-5086
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
08/29/06
DS22005A-page 28
© 2006 Microchip Technology Inc.
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