MCP79400 [MICROCHIP]
I2C? Real-Time Clock/Calendar with SRAM, Unique ID and Battery Switchover; I2C ?实时时钟/日历与SRAM ,唯一ID和电池切换型号: | MCP79400 |
厂家: | MICROCHIP |
描述: | I2C? Real-Time Clock/Calendar with SRAM, Unique ID and Battery Switchover |
文件: | 总38页 (文件大小:564K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MCP79400/MCP79401/MCP79402
I2C™ Real-Time Clock/Calendar with SRAM, Unique ID
and Battery Switchover
Device Selection Table
Description:
SRAM
(Bytes)
The MCP7940X series of low-power Real-Time Clocks
(RTC) uses digital timing compensation for an accurate
clock/calendar, a programmable output control for
versatility, a power sense circuit that automatically
switches to the backup supply, and nonvolatile memory
for data storage. Using a low-cost 32.768 kHz crystal,
it tracks time using several internal registers. For
communication, the MCP7940X uses the I2C™ bus.
Part Number
Unique ID
MCP79400
MCP79401
MCP79402
64
64
64
Blank
EUI-48™
EUI-64™
Features:
• Real-Time Clock/Calendar (RTCC), Battery
Backed:
The clock/calendar automatically adjusts for months
with fewer than 31 days, including corrections for
leap years. The clock operates in either the 24-hour
or 12-hour format with an AM/PM indicator and
settable alarm(s) to the second, minute, hour, day of
the week, date or month. Using the programmable
CLKOUT, frequencies of 32.768, 8.192 and 4.096
kHz and 1 Hz can be generated from the external
crystal.
- Hours, Minutes, Seconds, Day of Week, Day,
Month and Year
- Dual alarm with single output
• On-Chip Digital Trimming/Calibration:
- Range -127 to +127 ppm
- Resolution 1 ppm
• Programmable Open-Drain Output Control:
- CLKOUT with 4 selectable frequencies
- Alarm output
Along with the battery-backed SRAM memory, a 64-bit
protected EEPROM space is available for a unique ID
or MAC address to be programmed at the factory or by
the end user.
• 64 Bytes SRAM, Battery Backed
• 64-Bit Unique ID:
The device is fully accessible through the serial
interface while VCC is between 1.8V and 5.5V, but can
operate down to 1.3V for timekeeping and SRAM
retention only.
- User or factory programmable
- Protected EEPROM
- EUI-48™ or EUI-64™ MAC address
The RTC series of devices are available in the standard
8-lead SOIC, TSSOP, MSOP and 2x3 TDFN packages.
- Custom ID programming
• Automatic VCC Switchover to VBAT Backup
Supply
Package Types
• Power-Fail Time-Stamp for Battery Switchover
• Low-Power CMOS Technology:
MSOP
X1
1
8
VCC
- Dynamic Current: 400 A max read
- Dynamic Current: 400 A max SRAM
X2
VBAT
VSS
2
3
4
7
6
5
MFP
SCL
SDA
TDFN
- Battery Backup Current: <700nA @ 1.8V
• 100 kHz and 400 kHz Compatibility
• ESD Protection >4,000V
X1
1
VCC
MFP
SCL
SDA
8
7
6
5
2
3
4
X2
VBAT
SOIC, TSSOP
• 1 Million Erase/Write Cycles for Unique ID
VSS
• Packages include 8-Lead SOIC, TSSOP, 2x3
TDFN, MSOP
1
2
3
4
8
7
6
5
X1
VCC
X2
VBAT
VSS
MFP
SCL
SDA
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
2011 Microchip Technology Inc.
DS25009A-page 1
MCP7940X
FIGURE 1-1:
TYPICAL OPERATING
CIRCUIT
X1
X2
RTCC
VCC
MFP
SCL
SDA
Time-Stamp/
Alarms
SRAM
VBAT
VSS
VBAT Switch
I2C™
ID
DS25009A-page 2
2011 Microchip Technology Inc.
MCP7940X
1.0
ELECTRICAL CHARACTERISTICS
(†)
Absolute Maximum Ratings
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics:
Industrial (I): VCC = +1.8V to 5.5V
DC CHARACTERISTICS
TA = -40°C to +85°C
Param.
Sym.
No.
Characteristic
Min.
Typ.
Max.
Units
Conditions
—
SCL, SDA pins
—
0.7 VCC
—
—
—
—
V
—
—
D1
D2
VIH
VIL
High-level input voltage
Low-level input voltage
0.3 VCC
0.2 VCC
V
VCC = 2.5V to 5.5V
D3
D4
VHYS
VOL
Hysteresis of Schmitt
Trigger inputs
(SDA, SCL pins)
0.05
VCC
—
V
V
(Note 1)
Low-level output voltage
(MFP, SDA)
—
0.40
IOL = 3.0 ma @ VCC = 4.5V
IOL = 2.1 ma @ VCC = 2.5V
D5
D6
D7
ILI
Input leakage current
Output leakage current
—
—
—
±1
±1
10
A
A
pF
VIN = VSS or VCC
ILO
VOUT = VSS or VCC
CIN,
Pin capacitance
VCC = 5.0V (Note 1)
COUT
(SDA, SCL and MFP)
TA = 25°C, f = 400 kHz
D8
D9
ICC Read Operating current
—
—
—
—
—
—
400
3
A
mA
A
A
A
nA
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V
ID
ICC Write
ICC Read Operating current
300
400
5
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SCL = 400 kHz
VCC = 5.5V, SCL = SDA = VCC
VBAT = 1.8V @ 25°C
SRAM
ICC Write
D10
D11
ICCS
IBAT
Standby current (Note 2)
VBAT Standby Current
700
—
(Note 2)
D12
D13
D14
D15
VTRIP
VBAT Change Over
1.3
300
0
1.7
—
V
s
s
V
1.5V typical at TAMB = 25°C
From VTRIP (max) to VTRIP (min)
From VTRIP (min) to VTRIP (max)
—
VCCFT VCC Fall Time (Note 1)
VCCRT VCC Rise Time (Note 1)
—
VBAT
VBAT Voltage Range
1.3
5.5
(Note 1)
Note 1: This parameter is periodically sampled and not 100% tested.
2: Standby with oscillator running
2011 Microchip Technology Inc.
DS25009A-page 3
MCP7940X
TABLE 1-2:
AC CHARACTERISTICS
Electrical Characteristics:
AC CHARACTERISTICS
Industrial (I):
VCC = +1.8V to 5.5V
TA = -40°C to +85°C
Param.
Symbol
No.
Characteristic
Clock frequency
Min.
Max.
Units
Conditions
1
2
3
4
5
6
7
FCLK
THIGH
TLOW
TR
—
—
100
400
kHz
1.8V VCC < 2.5V
2.5V VCC 5.5V
Clock high time
Clock low time
4000
600
—
—
ns
ns
ns
ns
ns
ns
1.8V VCC < 2.5V
2.5V VCC 5.5V
4700
1300
—
—
1.8V VCC < 2.5V
2.5V VCC 5.5V
SDA and SCL rise time
(Note 1)
—
—
1000
300
1.8V VCC < 2.5V
2.5V VCC 5.5V
TF
SDA and SCL fall time
(Note 1)
—
—
1000
300
1.8V VCC < 2.5V
2.5V VCC 5.5V
THD:STA Start condition hold time
TSU:STA Start condition setup time
4000
600
—
—
1.8V VCC < 2.5V
2.5V VCC 5.5V
4700
600
—
—
1.8V VCC < 2.5V
2.5V VCC 5.5V
8
9
THD:DAT Data input hold time
TSU:DAT Data input setup time
0
—
ns
ns
250
100
—
—
1.8V VCC < 2.5V
2.5V VCC 5.5V
10
11
12
TSU:STO Stop condition setup time
4000
600
—
—
ns
ns
ns
1.8V VCC < 2.5V
2.5V VCC 5.5V
TAA
Output valid from clock
—
—
3500
900
1.8V VCC < 2.5V
2.5V VCC 5.5V
TBUF
Bus free time: Time the bus
must be free before a new
transmission can start
4700
1300
—
—
1.8V VCC < 2.5V
2.5V VCC 5.5V
13
14
15
TSP
TWC
—
Input filter spike suppression
(SDA and SCL pins)
—
—
50
5
ns
(Note 1 and Note 2)
Write cycle time (byte or
page)
ms
—
Endurance
1M
—
cycles 25°C, VCC = 5.5V Page mode
(Note 3)
Note 1: Not 100% tested.
2: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
3: This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained from Microchip’s web site
at www.microchip.com.
DS25009A-page 4
2011 Microchip Technology Inc.
MCP7940X
FIGURE 1-2:
BUS TIMING DATA
5
4
D4
2
SCL
7
3
10
8
9
SDA
In
6
13
12
11
SDA
Out
2011 Microchip Technology Inc.
DS25009A-page 5
MCP7940X
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
FIGURE 2-1:
DEVICE PINOUTS
SOIC/DFN/MSOP/TSSOP
X1
1
8
Vcc
X2
2
3
4
7
6
5
MFP
SCL
SDA
V
BAT
Vss
2.1
Serial Data (SDA)
This is a bidirectional pin used to transfer addresses
and data into and out of the device. It is an open-drain
terminal, therefore, the SDA bus requires a pull-up
resistor to VCC (typically 10 k for 100 kHz, 2 kfor
400 kHz). For normal data transfer SDA is allowed to
change only during SCL low. Changes during SCL high
are reserved for indicating the Start and Stop
conditions.
2.2
Serial Clock (SCL)
This input is used to synchronize the data transfer from
and to the device.
TABLE 2-1:
Pin Name
PIN DESCRIPTIONS
Pin Function
Vss
SDA
SCL
X1
Ground
Bidirectional Serial Data
Serial Clock
Xtal Input, External Oscillator Input
Xtal Output
X2
VBAT
MFP
Vcc
Battery Backup Input (3V Typ)
Multi Function Pin
+1.8V to +5.5V Power Supply
DS25009A-page 6
2011 Microchip Technology Inc.
MCP7940X
2
3.1.1.4
Data Valid (D)
3.0
3.1
I C BUS CHARACTERISTICS
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
2
I C Interface
The MCP7940X supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as transmitter, and a device
receiving data as receiver. The bus has to be controlled
by a master device which generates the Start and Stop
conditions, while the MCP7940X works as slave. Both
master and slave can operate as transmitter or receiver
but the master device determines which mode is
activated.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device.
3.1.1.5
Acknowledge
3.1.1
BUS CHARACTERISTICS
Each receiving device, when addressed, is obliged to
generate an Acknowledge signal after the reception of
each byte. The master device must generate an extra
clock pulse which is associated with this Acknowledge
bit.
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Note: The MCP7940X does not generate any
Acknowledge bits while an internal Unique
ID programming cycle is in progress, but
the user may still access the SRAM and
RTCC registers.
Accordingly, the following bus conditions have been
defined (Figure 3-1).
A device that acknowledges must pull down the SDA
line during the Acknowledge clock pulse in such a way
that the SDA line is stable-low during the high period of
the Acknowledge-related clock pulse. Of course, setup
and hold times must be taken into account. During
reads, a master must signal an end of data to the slave
by NOT generating an Acknowledge bit on the last byte
that has been clocked out of the slave. In this case, the
slave (MCP7940X) will leave the data line high to
enable the master to generate the Stop condition.
3.1.1.1
Both data and clock lines remain high.
3.1.1.2 Start Data Transfer (B)
Bus not Busy (A)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
3.1.1.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must end with a Stop condition.
FIGURE 3-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C) (A)
SCL
SDA
Start
Condition
Address or
Acknowledge
Valid
Data
Allowed
to Change
Stop
Condition
2011 Microchip Technology Inc.
DS25009A-page 7
MCP7940X
FIGURE 3-2:
ACKNOWLEDGE TIMING
Acknowledge
Bit
1
2
3
4
5
6
7
8
9
1
2
3
SCL
SDA
Data from transmitter
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
3.1.2
DEVICE ADDRESSING AND OPERATION
selected. The next byte received defines the address of
the data byte (Figure 3-3). The upper address bits are
transferred first, followed by the Least Significant bits
(LSb).
A control byte is the first byte received following the
Start condition from the master device (Figure 3-2).
The control byte consists of a control code; for the
MCP7940X this is set as ‘1010111’ for read and write
operations for the Unique ID after the correct unlock
sequence.
Following the Start condition, the MCP7940X monitors
the SDA bus, checking the device type identifier being
transmitted. Upon receiving an ‘1010111’ or
‘1101111’ code, the slave device outputs an
Acknowledge signal on the SDA line. Depending on the
state of the R/W bit, the MCP7940X will select a read
or write operation.
The control byte for accessing the SRAM and RTCC
registers are set to ‘1101111’. The RTCC registers and
the SRAM share the same address space.
The last bit of the control byte defines the operation to
be performed. When set to a ‘1’ a read operation is
selected, and when set to a ‘0’ a write operation is
FIGURE 3-3:
ADDRESS SEQUENCE BIT ASSIGNMENTS
Unique ID CONTROL BYTE
ADDRESS BYTE
A
0
A
2
A
1
1
0
1
0
1
1
1 R/W
1
1
1
0
1
CONTROL
CODE
X = Don’t Care
SRAM RTCC CONTROL BYTE
ADDRESS BYTE
A
0
1
1
0
1
1
1
1
R/W
•
•
•
•
•
•
X
CONTROL
CODE
X = Don’t Care
DS25009A-page 8
2011 Microchip Technology Inc.
MCP7940X
3.1.3
ACKNOWLEDGE POLLING
Since the device will not acknowledge a Unique ID
command during an ID write cycle, this can be used to
determine when the cycle is complete. This feature can
be used to maximize bus throughput. Once the Stop
condition for a Write command has been issued from
the master, the device initiates the internally timed write
cycle. ACK polling can be initiated immediately. This
involves the master sending a Start condition, followed
by the control byte for a Write command (R/W = 0). If
the device is still busy with the write cycle, then no ACK
will be returned. If no ACK is returned, then the Start bit
and control byte must be resent. If the cycle is
complete, then the device will return the ACK, and the
master can then proceed with the next Read or Write
command. See Figure 3-4 for the flow diagram.
FIGURE 3-4:
ACKNOWLEDGE
POLLING FLOW
Send
ID Write Command
Send Stop
Condition to
Initiate ID Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
NO
YES
Next
Operation
2011 Microchip Technology Inc.
DS25009A-page 9
MCP7940X
• Addresses 0x00h-0x06h are the RTCC Time and
Date registers. These are read/write registers.
Care must be taken when writing to these regis-
ters while the oscillator is running.
4.0
RTCC FUNCTIONALITY
The MCP7940X family is a highly integrated RTCC.
On-board time and date counters are driven from a low-
power oscillator to maintain the time and date. An
integrated VCC switch enables the device to maintain
the time and date and also the contents of the SRAM
during a VCC power failure.
• Incorrect data can appear in the Time and Date
registers if a write is attempted during the time-
frame where these internal registers are being
incremented. The user can minimize the likeli-
hood of data corruption by insuring that any writes
to the Time and Date registers occur before the
contents of the second register reach a value of
0x59H.
4.1
RTCC MEMORY MAP
The RTCC registers are contained in addresses
0x00h-0x1fh. 64 bytes of user-accessable SRAM are
located in the address range 0x20-0x5f. The SRAM
memory is a separate block from the RTCC control
and Configuration registers. All SRAM locations are
battery-backed-up during a VCC power fail. Unused
locations are not accessible, MCP7940X will noACK
after the address byte if the address is out of range.
The shaded areas are not implemented and read as
‘0’. No error checking is provided when loading time
and date registers.
• Addresses 0x07h-0x09h are the device Configu-
ration, Calibration and ID Unlock registers.
• Addresses 0x0Ah-0x10h are the Alarm 0 regis-
ters. These are used to set up the Alarm 0, the
Interrupt polarity and the Alarm 0 compare.
• Addresses 0x11h-0x17h are the same as 0x0Bh-
0x11h but are used for Alarm 1.
• Addresses 0x18h-0x1Fh are used for the time-
stamp feature.
The Memory Map is shown in Table 4-1.
TABLE 4-1:
RTCC MEMORY MAP
Reset
State
Address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Function
Seconds
Range
00-59
00h
01h
02h
ST
10 Seconds
10 Minutes
Seconds
00h
00h
00h
Minutes
Hour
Minutes
Hours
00-59
10 Hour
AM/PM
10 Hour
VBAT
1-12 + AM/PM
00 - 23
12/24
03h
OSCON
VBATEN
Day
Day
1-7
01h
04h
05h
06h
07h
08h
09h
10 Date
Date
Month
Year
Date
01-31
01-12
00-99
01h
01h
01h
80h
00h
00h
LP
10 Month
Month
10 Year
Year
OUT
SQWE
ALM1
ALM0
EXTOSC RS2
RS1
RS0
Control Reg.
Calibration
Unlock ID
CALIBRATION
UNIQUE UNLOCK ID SEQUENCE
0Ah
0Bh
0Ch
10 Seconds
10 Minutes
Seconds
Seconds
Minutes
Hours
00-59
00h
00h
00h
Minutes
Hour
00 - 59
10 Hour
AM/PM
10 Hours
ALM0C0
1-12 + AM/PM
00-23
12/24
0Dh
0Eh
0Fh
10h
ALM0POL
ALM0C2
ALM0C1
ALM0IF
Day
Day
1-7
01h
01h
01h
01h
10 Date
10 Month
Reserved – Do not use
Date
Date
01-31
01-12
Month
Month
Reserved
11h
12h
13h
10 Seconds
Seconds
Minutes
Hour
Seconds
Minutes
Hours
00-59
00-59
00h
00h
00h
10 Minutes
10 Hour
AM/PM
10 Hours
ALM1C0
1-12 + AM/PM
00-23
12/24
14h
15h
16h
17h
18h
19h
ALM1POL
ALM1C2
ALM1C1
ALM1IF
Day
Day
1-7
01h
01h
01h
01h
00h
00h
10 Date
10 Month
Reserved – Do not use
10 Minutes
Date
Date
01-31
01-12
Month
Month
Reserved
Minutes
Hour
10 Hour
AM/PM
10 Hours
12/24
Day
1Ah
1Bh
10 Date
10 Month
Date
00h
00h
Month
DS25009A-page 10
2011 Microchip Technology Inc.
MCP7940X
TABLE 4-1:
RTCC MEMORY MAP (CONTINUED)
Reset
State
Address
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Function
Range
1Ch
1Dh
10 Minutes
Minutes
00h
00h
10 Hour
AM/PM
10 Hours
Hour
12/24
Day
1Eh
1Fh
10 Date
10 Month
Date
00h
00h
Month
4.1.1
RTCC REGISTER ADDRESSES
• Bit 7 is the OUT bit. This sets the logic level on the
MFP when not using this as a square wave out-
put.
0x00h – Contains the BCD seconds and 10 seconds.
The range is 00 to 59. Bit 7 in this register is used to
start or stop the on-board crystal oscillator. Setting this
bit to a ‘1’ starts the oscillator and clearing this bit to a
‘0’ stops the on-board oscillator.
• Bit 6 is the SQWE bit. Setting this bit enables the
divided output from the crystal oscillator.
• Bits 5:4 determine which alarms are active.
- 00 – No Alarms are active
- 01 – Alarm 0 is active
0x01h – Contains the BCD minutes and 10 minutes.
The range is 00 to 59.
- 10 – Alarm 1 is active
0x02h – Contains the BCD hour in bits 3:0. Bits 5:4
contain either the 10 hour in BCD for 24-hour format or
the AM/PM indicator and the 10-hour bit for 12-hour
format. Bit 6 determines the hour format. Setting this
bit to ‘0’ enables 24-hour format, setting this bit to ‘1’
enables 12-hour format.
- 11 – Both Alarms are active
• Bit 3 is the EXTOSC enable bit. Setting this bit will
allow an external 32.768 kHz signal to drive the
RTCC registers eliminating the need for an
external crystal.
0x03h – Contains the BCD day. The range is 1-7.
Additional bits are also used for configuration and
status.
• Bit 2:0 sets the internal divider for the 32.768 kHz
oscillator to be driven to the MFP. The duty cycle is
50%. The output is responsive to the Calibration
register. The following frequencies are available:
• Bit 3 is the VBATEN bit. If this bit is set, the
internal circuitry is connected to the VBAT pin
when VCC fails. If this bit is ‘0’ then the VBAT pin is
disconnected and the only current drain on the
external battery is the VBAT pin leakage.
- 000 – 1 Hz
- 001 – 4.096 kHz
- 010 – 8.192 kHz
- 011 – 32.768 kHz
• Bit 4 is the VBAT bit. This bit is set by hardware
when the VCC fails and the VBAT is used to power
the Oscillator and the RTCC registers. This bit is
cleared by software. Clearing this bit will also
clear all the time-stamp registers.
- 1xx enables the Cal output function. Cal
output appears on MFP if SQWE is set (64
Hz Nominal).
Note:
The RTCC counters will continue to
increment during the calibration.
• Bit 5 is the OSCON bit. This is set and cleared by
hardware. If this bit is set, the oscillator is running,
if cleared, the oscillator is not running. This bit
does not indicate that the oscillator is running at
the correct frequency. The RTCC will wait 32
oscillator cycles before the bit is set. The RTCC
will wait roughly 32 clock cycles to clear this bit.
0x08h is the Calibration register. This is an 8-bit
register that is used to add or subtract clocks from the
RTCC counter every minute. The MSB is the sign bit
and indicates if the count should be added or
subtracted. The remaining 7 bits, with each bit adding
or subtracting 2 clocks, give the user the ability to add
or subtract up to 254 clocks per minute.
0x04h – Contains the BCD date and 10 date. The
range is 01-31.
0x09h is the unlock sequence address. To unlock write
access to the unique ID area in the EEPROM, a
sequence must be written to this address in separate
commands. The process is fully detailed in
Section 4.2.1 “Unlock Sequence”.
0x05h – Contains the BCD month. Bit 4 contains the
10 month. Bit 5 is the Leap Year bit, which is set during
a leap year and is read-only.
0x06h – Contains the BCD year and 10 year. The
Range is 00-99.
0x0Ah-0x0fh and 0x11-0x16h are the Alarm 0 and
Alarm 1 registers. The bits are the same as the RTCC
bits with the following differences:
0x07h – Is the Control register.
Locations 0x10h and 0x17h are reserved and should
not be used to allow for future device compatibility.
0x0Dh/0x14h has additional bits for alarm configu-
ration.
2011 Microchip Technology Inc.
DS25009A-page 11
MCP7940X
• ALMxPOL: This bit specifies the level that the
MFP will drive when the alarm is triggered.
ALM2POL is a copy of ALM1POL. The default
state of the MFP when used for alarms is the
inverse of ALM1POL.
4.2
FEATURES
4.2.1
UNLOCK SEQUENCE
The unique ID location is user accessible by using the
unlock ID sequence.
• ALMxIF: This is the Alarm Interrupt Fag. This bit is
set in hardware if the alarm was triggered. The bit
is cleared in software.
The unique ID location is 64-bits (8 bytes) and is
stored in EEPROM locations 0xF0 to 0xF7. This
location can be read at any time, however, a write is
inhibited until unlocked.
• ALMxC2:0: These Configuration bits determine
the alarm match. The logic will trigger the alarm
based on one of the following match conditions:
To unlock the write access to this location the following
sequence must be completed:
000
001
010
–
–
–
Seconds match
Minutes match
• A single write of 0x55h to address 0x09. Stop
• A single write of 0xAAh to address 0x09. Stop
Hours match (takes into account 12/24
hour)
This will allow the unique EEPROM locations to be
written.
011
–
Matches the current day, interrupt at
12.00.00 a.m. Example: 12 midnight on
After the byte or page write to these locations, the
write sequence is initiated by the Stop condition. At
this time, the ID locations are locked and no further
writes are possible to this location unless a complete
unlock sequence is repeated.
100 – Date
101 – RESERVED
110 – RESERVED
111 – Seconds, Minutes, Hour, Day, Date,
Month
• The 12/24-hour bits 0xCh.6 and 0x13h.6 are cop-
ies of the bit in 0x02h.6. The bits are read-only.
0x18h-0x1Bh are used for the timesaver function.
These registers are loaded at the time when VCC fails
and the RTCC operates on the VBAT. The VBAT bit is
also set at this time. These registers are cleared when
the VBAT bit is cleared in software.
0x1Ch-0x1Fh are used for the timesaver function.
These registers are loaded at the time when VCC is
restored and the RTCC switches to VDD. These
registers are cleared when the VBAT bit is cleared in
software.
Note: It is strongly recommended that the
timesaver function only be used when the
oscillator is running. This will ensure
accurate functionality.
DS25009A-page 12
2011 Microchip Technology Inc.
MCP7940X
4.2.2
CALIBRATION
RS2
RS1
RS0
Output Signal
The MCP7940X utilizes digital calibration to correct for
inaccuracies of the input clock source (either external
or crystal). Calibration is enabled by setting the value
of the Calibration register at address 08H. Calibration
is achieved by adding or subtracting a number of input
clock cycles per minute in order to achieve ppm level
adjustments in the internal timing function of the
MCP7940X.
0
0
0
0
0
0
1
1
0
1
0
1
32768
8
4
1
With regards to the calibration function, the Calibration
register setting has no impact upon the MFP output
clock signal when bits RS1 and RS0 are set to ‘11’.
The setting of the Calibration register to a non-zero
value (i.e., values other than 00H or 80H) enables the
calibration function which can be observed on the
MFP output pin. The calibration function can be
expressed in terms of the number of input clock cycles
added/subtracted from the internal timing function.
The MSB of the Calibration register is the sign bit, with
a ‘1’ indicating subtraction and a ‘0’ indicating addition.
The remaining seven bits in the register indicate the
number of input clock cycles (multiplied by two) that
are subtracted or added per minute to the internal
timing function.
The internal timing function can be monitored using
the MFP open-drain output pin by setting bit [6]
(SQWE) and bits [2:0] (RS2, RS1, RS0) of the control
register at address 07H. Note that the MFP output
waveform is disabled when the MCP7940X is running
in VBAT mode. With the SQWE bit set to ‘1’, there are
two methods that can be used to observe the internal
timing function of the MCP7940X:
With bits RS1 and RS0 set to ‘00’, the calibration
function can be expressed as:
Toutput
where:
Toutput
Tinput
=
(32768 +/- (2 * CALREG)) Tinput
=
=
=
clock period of MFP output signal
clock period of input signal
CALREG
decimal value of Calibration
register setting and the sign is
determined by the MSB of
Calibration register.
A. RS2 BIT SET TO ‘0’
With the RS2 bit set to ‘0’, the RS1 and RS0 bits
enable the following internal timing signals to be
output on the MFP pin:
Since the calibration is done once per minute (i.e.,
when the internal minute counter is incremented), only
one cycle in sixty of the MFP output waveform is
affected by the calibration setting. Also note that the
duty cycle of the MFP output waveform will not
necessarily be at 50% when the calibration setting is
applied.
RS2
RS1
RS0
Output Signal
0
0
0
0
0
0
1
1
0
1
0
1
1 Hz
4.096 kHz
8.192 kHz
32.768 kHz
With bits RS1 and RS0 set to ‘01’ or ‘10’, the
calibration function can not be expressed in terms of
the input clock period. In the case where the MSB of
the Calibration register is set to ‘0’, the waveform
appearing at the MFP output pin will be “delayed”,
once per minute, by twice the number of input clock
cycles defined in the Calibration register. The MFP
waveform will appear as:
The frequencies listed in the table presume an input
clock source of exactly 32.768 kHz. In terms of the
equivalent number of input clock cycles, the table
becomes:
FIGURE 4-1:
RS1 AND RS0 WITH AND WITHOUT CALIBRATION
Delay
2011 Microchip Technology Inc.
DS25009A-page 13
MCP7940X
In the case where the MSB of the Calibration register
is set to ‘1’, the MFP output waveforms that appear
when bits RS1 and RS0 are set to ‘01’ or ‘10’ are not
as responsive to the setting of the Calibration register.
For example, when outputting the 4.096 kHz
waveform (RS1, RS0 set to ‘01’), the output waveform
is generated using only eight input clock cycles.
Consequently, attempting to subtract more than eight
input clock cycles from this output does not have a
meaningful effect on the resulting waveform. Any
effect on the output will appear as a modification in
both the frequency and duty cycle of the waveform
appearing on the MFP output pin.
4.2.3
MFP
Pin 7 is a multi-function pin and supports the following
functions:
• Use of the OUT bit in the Control register for
single bit I/O
• Alarm Outputs – Available in VBAT mode
• FOUT mode – driven from a FOSC divider – Not
available in VBAT mode
The internal control logic for the MFP is connected to
the switched internal supply bus, this allows operation
in VBAT mode. The Alarm Output is the only mode that
operates in VBAT mode, other modes are suspended.
B.RS2 BIT SET TO ‘1’
4.2.4
VBAT
With the RS2 bit set to ‘1’, the following internal timing
If the VBAT feature is not being used, the VBAT pin
should be connected to GND. A low-value series
resistor is recommended between the external battery
and the VBAT pin.
signal is output on the MFP pin:
RS2
RS1
RS0
Output Signal
1
x
x
64.0 Hz
The VBAT point is defined as 1.5V typical. When VDD
falls below 1.5V the system will continue to operate
the RTCC and SRAM using the VBAT supply. The
following conditions apply:
The frequency listed in the table presumes an input
clock source of exactly 32.768 kHz. In terms of the
equivalent number of input clock cycles, the table
becomes:
TABLE 4-2:
RS2
RS1
RS0
Output Signal
Supply
Read/Write Powered
Condition
Access
By
1
x
x
512
VCC < VTRIP, VCC < VBAT
VCC > VTRIP, VCC < VBAT
VCC > VTRIP, VCC > VBAT
No
Yes
Yes
VBAT
VCC
VCC
Unlike the method previously described, the
calibration setting is continuously applied and affects
every cycle of the output waveform. This results in the
modulation of the frequency of the output waveform
based upon the setting of the Calibration register.
4.2.5
CRYSTAL SPECS
Using this setting, the calibration function can be
expressed as:
The MCP7940X has been designed to operate with a
standard 32 kHz crystal. Devices with a specified load
capacitance of either 12pF or 6pF can be used. The
end user should fully validate the chosen crystal across
all the expected design parameters of the system to
ensure correct operation.
Toutput
where:
Toutput
Tinput
=
(2 * (256 +/- (2 * CALREG))) Tinput
=
=
=
clock period of MFP output signal
clock period of input signal
The following crystals have been tested and shown to
work with the MCP7940X:
CALREG
decimal value of the Calibration
register setting, and the sign is
determined by the MSB of the
Calibration register.
• CM200S 12pF surface mount crystals from
Citizen
• ECS-.327 12pF surface mount crystals from ECS
INC
• CFS206 12pF leaded crystals from Citizen
Since the calibration is done every cycle, the frequency
of the output MFP waveform is constant.
This is not a definitive list and all crystals should be
tested in the target application across all temperature,
voltage and other significant environmental conditions.
DS25009A-page 14
2011 Microchip Technology Inc.
MCP7940X
4.2.6
POWER-FAIL TIME-STAMP
The MCP7940X family of RTCC devices feature a
power-fail time-stamp feature. This feature will save
the time at which VCC crosses the VTRIP voltage. To
use this feature, a VBAT supply must be present and
the oscillator must also be running.
There are two separate sets of registers that are used
to record this information:
• The first set located at 0x18h through 0x1Bh are
loaded at the time when VCC fails and the RTCC
operates on the VBAT. The VBAT (register 0x03h
bit 4) bit is also set at this time.
• The second set of registers, located at 0x1Ch
through 0x1Fh, are loaded at the time when VCC
is restored and the RTCC switches to VCC.
The power-fail time-stamp registers are cleared when
the VBAT bit is cleared in software.
2011 Microchip Technology Inc.
DS25009A-page 15
MCP7940X
removed, provided the VBAT supply is present and
enabled. The Unique ID is nonvolatile memory and
does not require the VBAT supply for retention.
5.0
ON BOARD MEMORY
The MCP7940X has both on-board Unique ID memory
and battery-backed SRAM. The SRAM is arranged as
64 x 8 bytes and is retained when the VCC supply is
5.1
SRAM
FIGURE 5-1:
SRAM/RTCC BYTE WRITE
S
BUS ACTIVITY
T
S
CONTROL
BYTE
ADDRESS
BYTE
MASTER
A
R
T
T
DATA
O
P
SDA LINE
S 1 1 0 1 1
0
x
1 1
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 5-2:
SRAM/RTCC MULTIPLE BYTE WRITE
S
T
A
R
T
S
T
O
P
CONTROL
BYTE
ADDRESS
BYTE
BUS ACTIVITY
MASTER
DATA BYTE 0
DATA BYTE N
SDA LINE
x
P
1 1 1
S 1 1 0 1
0
A
C
K
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
The 64 bytes of user SRAM are at location 0x20h and
can be accessed during an RTCC update. Upon POR
the SRAM will be in an undefined state.
Note: Entering an address past 5F for an SRAM
operation will result in the MCP7940X not
acknowledging the address.
Writing to the SRAM and RTCC is accomplished in a
similar way to writing to the EEPROM (as described
later in this document) with the following consider-
ations:
• There is no page. The entire 64 bytes of SRAM or
32 bytes of RTCC register can be written in one
command.
• The SRAM allows an unlimited number of read/
write cycles with no cell wear out.
• The RTCC and SRAM are not accessible when
the device is running on the external VBAT.
• The RTCC and SRAM are separate blocks. The
SRAM array may be accessed during an RTCC
update.
• Read and write access is limited to either the
RTCC register block or the SRAM array. The
Address Pointer will rollover to the start of the
addressed block.
• Data written to the RTCC and SRAM are on a per
byte basis.
DS25009A-page 16
2011 Microchip Technology Inc.
MCP7940X
5.2
ID
ID BYTE WRITE
5.2.1
Following the Start condition from the master, the
control code and the R/W bit (which is a logic low) are
clocked onto the bus by the master transmitter. This
indicates to the addressed slave receiver that a byte
with a word address will follow after it has generated an
Acknowledge bit during the ninth clock cycle.
Therefore, the next byte transmitted by the master is
the word address and will be written into the Address
Pointer of the MCP7940X. After receiving another
Acknowledge signal from the MCP7940X, the master
device transmits the data word to be written into the
addressed memory location. The MCP7940X
acknowledges again and the master generates a Stop
condition. This initiates the internal write cycle, and,
during this time, the MCP7940X does not generate
Acknowledge signals for Unique ID Write commands. If
an attempt is made to write to an address and the
protection is set then the device will acknowledge the
command but no write cycle will occur, no data will be
written, and the device will immediately accept a new
command. After a Byte Write command, the internal
address counter will point to the address location
following the one that was just written.
Note:
Addressing undefined ID locations will
result in the MCP7940X not acknowledg-
ing the address.
2011 Microchip Technology Inc.
DS25009A-page 17
MCP7940X
FIGURE 5-3:
ID BYTE WRITE
S
T
A
R
T
BUS ACTIVITY
MASTER
S
T
O
P
CONTROL
BYTE
ADDRESS
BYTE
DATA
SDA LINE
S 1 0 1 0 1 1 1 0
1
1 1 1
0
• • •
P
A
C
K
A
C
K
A
C
K
BUS ACTIVITY
the control byte again but with the R/W bit set to a one.
The MCP7940X will then issue an Acknowledge and
transmit the 8-bit data word. The master will not
acknowledge the transfer but it does generate a Stop
condition which causes the MCP7940X to discontinue
5.2.2
READ OPERATION
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
control byte is set to one. There are three basic types
of read operations: current address read, random read,
and sequential read. The SRAM array can be read in
the same way as the ID using the control byte for the
SRAM ‘1101111’ with a valid address.
transmission (Figure 5-6). After
a random read
command, the internal address counter will point to the
address location following the one that was just read.
5.2.2.3
Sequential Read
5.2.2.1
Current Address Read
Sequential reads are initiated in the same way as a
random read except that after the MCP7940X transmits
the first data byte, the master issues an Acknowledge
as opposed to the Stop condition used in a random
read. This Acknowledge directs the MCP7940X to
transmit the next sequentially addressed 8-bit word
(Figure 5-7). Following the final byte transmitted to the
master, the master will NOT generate an Acknowledge
but will generate a Stop condition. To provide
sequential reads, the MCP7940X contains an internal
Address Pointer which is incremented by one at the
completion of each operation. This Address Pointer
allows the entire memory contents to be serially read
during one operation. The internal Address Pointer will
automatically roll over to the start of the Block.
The MCP7940X contains an address counter that
maintains the address of the last word accessed,
internally incremented by one. Therefore, if the
previous read access was to address n (n is any legal
address), the next current address read operation
would access data from address n + 1.
Upon receipt of the control byte with R/W bit set to one,
the MCP7940X issues an Acknowledge and transmits
the 8-bit data word. The master will not acknowledge
the transfer but does generate a Stop condition and the
MCP7940X discontinues transmission (Figure 5-5).
FIGURE 5-4:
CURRENT ADDRESS
READ (ID SHOWN)
S
T
A
R
T
S
T
O
P
BUS ACTIVITY
MASTER
CONTROL
BYTE
DATA
BYTE
SDA LINE
1 1 0
1 1
•
S 1 0 1 0
1
• •
P
1 1 1
A
C
K
N
O
BUS ACTIVITY
A
C
K
5.2.2.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
MCP7940X as part of a write operation (R/W bit set to
‘0’). After the word address is sent, the master
generates a Start condition following the Acknowledge.
This terminates the write operation, but not before the
internal Address Pointer is set. Then, the master issues
DS25009A-page 18
2011 Microchip Technology Inc.
MCP7940X
FIGURE 5-5:
RANDOM READ (UNIQUE ID SHOWN)
S
T
A
R
T
S
T
A
R
T
BUS ACTIVITY
MASTER
S
CONTROL
BYTE
ADDRESS
BYTE
CONTROL
BYTE
DATA
T
BYTE
O
P
SDA LINE
S 1 0 1 0
0
1 1 1
S 1 0 1 0
1
P
A
C
K
A
C
K
N
O
A
C
K
A
C
K
BUS ACTIVITY
FIGURE 5-6:
SEQUENTIAL READ (UNIQUE ID SHOWN)
S
T
O
P
CONTROL
BYTE
BUS ACTIVITY
MASTER
DATA n
DATA n + 1
DATA n + 2
DATA n + X
P
SDA LINE
A
C
K
A
C
K
A
C
K
A
C
K
N
O
A
C
K
BUS ACTIVITY
5.3
Unique ID
The MCP7940X features an additional 64-bit unique ID
area.
The unique ID is located at addresses 0xF0 through
0xF7. Reading the unique ID requires the user to
simply address these bytes.
The unique ID area is protected to prevent unintended
writes to these locations. The unlock sequence is
detailed in 4.2.1 “Unlock Sequence”.
The unique ID can be factory programmed on some
devices to provide a unique IEEE EUI-48 or EUI-64
value. In addition, customer-provided codes can also
be programmed.
2011 Microchip Technology Inc.
DS25009A-page 19
MCP7940X
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
8-Lead SOIC (3.90 mm)
Example:
79400I
XXXXXT
e
3
XXYYWW
SN
1109
13F
NNN
Example:
8-Lead TSSOP
9400
I109
13F
XXXX
TYWW
NNN
Example:
8-Lead MSOP
XXXXX
79401I
YWWNNN
10913F
8-Lead 2x3 TDFN
Example:
XXX
YWW
NN
AAS
109
13
1st Line Marking Codes
Part Number
TSSOP
9400
MSOP
TDFN
AAS
MCP79400
MCP79401
MCP79402
Note:
79400T
79401T
79402T
9401
9402
AAT
AAU
T = Temperature grade
NN = Alphanumeric traceability code
Legend: XX...X Customer-specific information
Y
Year code (last digit of calendar year)
YY
WW
NNN
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS25009A-page 20
2011 Microchip Technology Inc.
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011 Microchip Technology Inc.
DS25009A-page 21
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25009A-page 22
2011 Microchip Technology Inc.
MCP7940X
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DS25009A-page 23
MCP7940X
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8
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ꢀꢁꢁꢄꢃAꢆꢈꢋꢄꢅ
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ꢀꢁꢁꢄꢉꢂꢌꢈꢄ
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1ꢐꢔꢔꢃꢘ8ꢀ
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ꢇ
7
ꢔꢐꢒꢔ
ꢔꢐ<ꢔ
ꢓꢗꢊꢃꢉꢤ
1ꢐ (ꢌꢈꢃ1ꢃ3ꢌ"#ꢊꢍꢃꢌꢈ%ꢆ6ꢃ)ꢆꢊꢄ#ꢂꢆꢃ!ꢊꢑꢃ3ꢊꢂꢑ'ꢃ7#ꢄꢃ!#"ꢄꢃ7ꢆꢃꢍꢁꢇꢊꢄꢆ%ꢃ&ꢌꢄꢅꢌꢈꢃꢄꢅꢆꢃꢅꢊꢄꢇꢅꢆ%ꢃꢊꢂꢆꢊꢐ
ꢒꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈ"ꢃꢓꢃꢊꢈ%ꢃ81ꢃ%ꢁꢃꢈꢁꢄꢃꢌꢈꢇꢍ#%ꢆꢃ!ꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢐꢃꢎꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢃ"ꢅꢊꢍꢍꢃꢈꢁꢄꢃꢆ6ꢇꢆꢆ%ꢃꢔꢐ1;ꢃ!!ꢃꢉꢆꢂꢃ"ꢌ%ꢆꢐ
<ꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈꢌꢈꢋꢃꢊꢈ%ꢃꢄꢁꢍꢆꢂꢊꢈꢇꢌꢈꢋꢃꢉꢆꢂꢃꢕꢏꢎ8ꢃ=1ꢖꢐ;ꢎꢐ
>ꢏ?* >ꢊ"ꢌꢇꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈꢐꢃꢗꢅꢆꢁꢂꢆꢄꢌꢇꢊꢍꢍꢑꢃꢆ6ꢊꢇꢄꢃ3ꢊꢍ#ꢆꢃ"ꢅꢁ&ꢈꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ"ꢐ
ꢘ8ꢀ* ꢘꢆ)ꢆꢂꢆꢈꢇꢆꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈ'ꢃ#"#ꢊꢍꢍꢑꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ'ꢃ)ꢁꢂꢃꢌꢈ)ꢁꢂ!ꢊꢄꢌꢁꢈꢃꢉ#ꢂꢉꢁ"ꢆ"ꢃꢁꢈꢍꢑꢐ
ꢎꢌꢇꢂꢁꢇꢅꢌꢉ ꢗꢆꢇꢅꢈꢁꢍꢁꢋꢑ ꢓꢂꢊ&ꢌꢈꢋ ?ꢔꢖꢟꢔꢚJ>
DS25009A-page 24
2011 Microchip Technology Inc.
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011 Microchip Technology Inc.
DS25009A-page 25
MCP7940X
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢩꢋꢌꢖꢗꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢇꢄꢌꢧꢄꢪꢃꢆꢒꢩꢍꢔꢆꢠꢩꢍꢏꢇꢣ
ꢓꢗꢊꢃꢤ ꢀꢁꢂꢃꢄꢅꢆꢃ!ꢁ"ꢄꢃꢇ#ꢂꢂꢆꢈꢄꢃꢉꢊꢇ$ꢊꢋꢆꢃ%ꢂꢊ&ꢌꢈꢋ"'ꢃꢉꢍꢆꢊ"ꢆꢃ"ꢆꢆꢃꢄꢅꢆꢃꢎꢌꢇꢂꢁꢇꢅꢌꢉꢃ(ꢊꢇ$ꢊꢋꢌꢈꢋꢃꢏꢉꢆꢇꢌ)ꢌꢇꢊꢄꢌꢁꢈꢃꢍꢁꢇꢊꢄꢆ%ꢃꢊꢄꢃ
ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
D
N
E
E1
NOTE 1
2
b
1
e
c
φ
A2
A
L
L1
A1
@ꢈꢌꢄ"
ꢎꢙAAꢙꢎ8ꢗ8ꢘꢏ
ꢓꢌ!ꢆꢈ"ꢌꢁꢈꢃAꢌ!ꢌꢄ"
ꢎꢙE
EGꢎ
ꢎꢕH
E#!7ꢆꢂꢃꢁ)ꢃ(ꢌꢈ"
(ꢌꢄꢇꢅ
E
ꢆ
ꢚ
ꢔꢐJ;ꢃ>ꢏ?
G3ꢆꢂꢊꢍꢍꢃKꢆꢌꢋꢅꢄ
ꢎꢁꢍ%ꢆ%ꢃ(ꢊꢇ$ꢊꢋꢆꢃꢗꢅꢌꢇ$ꢈꢆ""
ꢏꢄꢊꢈ%ꢁ))ꢃ
G3ꢆꢂꢊꢍꢍꢃNꢌ%ꢄꢅ
ꢎꢁꢍ%ꢆ%ꢃ(ꢊꢇ$ꢊꢋꢆꢃNꢌ%ꢄꢅ
G3ꢆꢂꢊꢍꢍꢃAꢆꢈꢋꢄꢅ
ꢀꢁꢁꢄꢃAꢆꢈꢋꢄꢅ
ꢕ
ꢛ
ꢔꢐꢝ;
ꢔꢐꢔꢔ
ꢛ
ꢔꢐꢚ;
1ꢐ1ꢔ
ꢔꢐꢜ;
ꢔꢐ1;
ꢕꢒ
ꢕ1
8
81
ꢓ
ꢛ
ꢖꢐꢜꢔꢃ>ꢏ?
<ꢐꢔꢔꢃ>ꢏ?
<ꢐꢔꢔꢃ>ꢏ?
ꢔꢐJꢔ
A
ꢔꢐꢖꢔ
ꢔꢐꢚꢔ
ꢀꢁꢁꢄꢉꢂꢌꢈꢄ
ꢀꢁꢁꢄꢃꢕꢈꢋꢍꢆ
A1
ꢀ
ꢔꢐꢜ;ꢃꢘ8ꢀ
ꢛ
ꢔꢞ
ꢚꢞ
Aꢆꢊ%ꢃꢗꢅꢌꢇ$ꢈꢆ""
Aꢆꢊ%ꢃNꢌ%ꢄꢅ
ꢇ
7
ꢔꢐꢔꢚ
ꢔꢐꢒꢒ
ꢛ
ꢛ
ꢔꢐꢒ<
ꢔꢐꢖꢔ
ꢓꢗꢊꢃꢉꢤ
1ꢐ (ꢌꢈꢃ1ꢃ3ꢌ"#ꢊꢍꢃꢌꢈ%ꢆ6ꢃ)ꢆꢊꢄ#ꢂꢆꢃ!ꢊꢑꢃ3ꢊꢂꢑ'ꢃ7#ꢄꢃ!#"ꢄꢃ7ꢆꢃꢍꢁꢇꢊꢄꢆ%ꢃ&ꢌꢄꢅꢌꢈꢃꢄꢅꢆꢃꢅꢊꢄꢇꢅꢆ%ꢃꢊꢂꢆꢊꢐ
ꢒꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈ"ꢃꢓꢃꢊꢈ%ꢃ81ꢃ%ꢁꢃꢈꢁꢄꢃꢌꢈꢇꢍ#%ꢆꢃ!ꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢐꢃꢎꢁꢍ%ꢃ)ꢍꢊ"ꢅꢃꢁꢂꢃꢉꢂꢁꢄꢂ#"ꢌꢁꢈ"ꢃ"ꢅꢊꢍꢍꢃꢈꢁꢄꢃꢆ6ꢇꢆꢆ%ꢃꢔꢐ1;ꢃ!!ꢃꢉꢆꢂꢃ"ꢌ%ꢆꢐ
<ꢐ ꢓꢌ!ꢆꢈ"ꢌꢁꢈꢌꢈꢋꢃꢊꢈ%ꢃꢄꢁꢍꢆꢂꢊꢈꢇꢌꢈꢋꢃꢉꢆꢂꢃꢕꢏꢎ8ꢃ=1ꢖꢐ;ꢎꢐ
>ꢏ?* >ꢊ"ꢌꢇꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈꢐꢃꢗꢅꢆꢁꢂꢆꢄꢌꢇꢊꢍꢍꢑꢃꢆ6ꢊꢇꢄꢃ3ꢊꢍ#ꢆꢃ"ꢅꢁ&ꢈꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ"ꢐ
ꢘ8ꢀ* ꢘꢆ)ꢆꢂꢆꢈꢇꢆꢃꢓꢌ!ꢆꢈ"ꢌꢁꢈ'ꢃ#"#ꢊꢍꢍꢑꢃ&ꢌꢄꢅꢁ#ꢄꢃꢄꢁꢍꢆꢂꢊꢈꢇꢆ'ꢃ)ꢁꢂꢃꢌꢈ)ꢁꢂ!ꢊꢄꢌꢁꢈꢃꢉ#ꢂꢉꢁ"ꢆ"ꢃꢁꢈꢍꢑꢐ
ꢎꢌꢇꢂꢁꢇꢅꢌꢉ ꢗꢆꢇꢅꢈꢁꢍꢁꢋꢑ ꢓꢂꢊ&ꢌꢈꢋ ?ꢔꢖꢟ111>
DS25009A-page 26
2011 Microchip Technology Inc.
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011 Microchip Technology Inc.
DS25009A-page 27
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS25009A-page 28
2011 Microchip Technology Inc.
MCP7940X
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011 Microchip Technology Inc.
DS25009A-page 29
MCP7940X
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢫꢐꢄꢈꢆꢬꢈꢄꢊꢙꢆꢓꢗꢆꢂꢃꢄꢅꢆꢇꢄꢌꢧꢄꢪꢃꢆꢒꢩꢓꢔꢆꢕꢆꢭꢮꢚꢮꢝꢛꢯꢰꢆꢎꢎꢆꢞꢗꢅꢟꢆꢠꢥꢫꢬꢓꢣ
ꢓꢗꢊꢃꢤ ꢀꢁꢂꢃꢄꢅꢆꢃ!ꢁ"ꢄꢃꢇ#ꢂꢂꢆꢈꢄꢃꢉꢊꢇ$ꢊꢋꢆꢃ%ꢂꢊ&ꢌꢈꢋ"'ꢃꢉꢍꢆꢊ"ꢆꢃ"ꢆꢆꢃꢄꢅꢆꢃꢎꢌꢇꢂꢁꢇꢅꢌꢉꢃ(ꢊꢇ$ꢊꢋꢌꢈꢋꢃꢏꢉꢆꢇꢌ)ꢌꢇꢊꢄꢌꢁꢈꢃꢍꢁꢇꢊꢄꢆ%ꢃꢊꢄꢃ
ꢅꢄꢄꢉ*++&&&ꢐ!ꢌꢇꢂꢁꢇꢅꢌꢉꢐꢇꢁ!+ꢉꢊꢇ$ꢊꢋꢌꢈꢋ
DS25009A-page 30
2011 Microchip Technology Inc.
MCP7940X
APPENDIX A: REVISION HISTORY
Revision A (04/2011)
Original release of this document.
2011 Microchip Technology Inc.
DS25009A-page 31
MCP7940X
NOTES:
DS25009A-page 32
2011 Microchip Technology Inc.
MCP79400/MCP79401/MCP79402
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• Development Systems Information Line
Customers
should
contact
their
distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Technical support is available through the web site
at: http://microchip.com/support
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2011 Microchip Technology Inc.
DS25009A-page 33
MCP79400/MCP79401/MCP79402
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO:
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Telephone: (_______) _________ - _________
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Literature Number: DS25009A
Application (optional):
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Y
N
Device: MCP7940X
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS25009A-page 34
2011 Microchip Technology Inc.
MCP7940X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Not every possible ordering
combination is listed below.
X
/XX
PART NO.
Device
Examples:
a) MCP79400-I/SN: Industrial Temperature,
SOIC package.
Temperature Package
Range
b) MCP79400T-I/SN: Industrial Tempera-
ture, SOIC package, Tape and Reel.
2
Device:
MCP79400
=
1.8V - 5.5V I C™ Serial RTCC
2
MCP79400T= 1.8V - 5.5V I C Serial RTCC
c) MCP79400T-I/MNY: Industrial Tempera-
ture, TDFN package.
(Tape and Ree)
2
TM
TM
MCP79401
=
1.8V - 5.5V I C Serial RTCC, EUI-48
d) MCP79401-I/SN: Industrial Temperature,
2
TM
MCP79401T= 1.8V - 5.5V I C Serial RTCC, EUI-48
SOIC package, EUI-48
.
(Tape and Reel)
e) MCP79401-I/MS: Industrial Temperature
2
TM
TM
MCP79402
=
1.8V - 5.5V I C Serial RTCC, EUI-64
TM
MSOP package, EUI-48
.
2
MCP79402T= 1.8V - 5.5V I C Serial RTCC, EUI-64
(Tape and Reel)
f)
MCP79402-I/SN: Industrial Temperature,
TM
SOIC package, EUI-64
.
g)
h)
MCP79402-I/ST: Industrial Temperature,
TM
Temperature
Range:
I
=
-40°C to +85°C
TSSOP package, EUI-64
.
MCP79402-I/ST: Industrial Temperature,
TM
TSSOP package, Tape and Reel, EUI-64
.
Package:
SN
ST
=
=
8-Lead Plastic Small Outline (3.90 mm body)
8-Lead Plastic Thin Shrink Small Outline
(4.4 mm)
MS
MNY
=
=
8-Lead Plastic Micro Small Outline
8-Lead Plastic Dual Flat, No Lead
(1)
Note 1: ’Y’ indicates a Nickel Palladium Gold (NiPdAu) finish.
2011 Microchip Technology Inc.
DS25009A-page 35
MCP7940X
NOTES:
DS25009A-page 36
2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-087-5
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2011 Microchip Technology Inc.
DS25009A-page 37
Worldwide Sales and Service
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Tel: 480-792-7200
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Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
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Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Atlanta
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Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Fax: 886-7-330-9305
Los Angeles
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Toronto
Mississauga, Ontario,
Canada
China - Zhuhai
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-756-3210040
Fax: 86-756-3210049
02/18/11
DS25009A-page 38
2011 Microchip Technology Inc.
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