概述
规格参数
数据手册MCP9700AT-H/TO 概述
Low-Power Linear Active Thermistor⢠ICs 低功耗线性有源Thermistorâ ?? ¢集成电路 温度传感器
MCP9700AT-H/TO 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 包装说明： | LEAD FREE, PLASTIC, TO-92, 3 PIN |
| Reach Compliance Code： | compliant | 风险等级： | 5.69 |
| Is Samacsys： | N | 最大精度（摄氏度）： | 6 Cel |
| 主体宽度： | 3.683 mm | 主体高度： | 4.826 mm |
| 主体长度或直径： | 4.826 mm | 外壳： | PLASTIC |
| JESD-609代码： | e3 | 线性度（Cel）： | 0.5 Cel |
| 安装特点： | THROUGH HOLE MOUNT | 最大工作电流： | 0.012 mA |
| 最高工作温度： | 150 °C | 最低工作温度： | -40 °C |
| 封装形状/形式： | RECTANGULAR | 传感器/换能器类型： | TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT |
| 最大供电电压： | 5.5 V | 最小供电电压： | 2.3 V |
| 表面贴装： | NO | 端子面层： | Matte Tin (Sn) |
| 端接类型： | SOLDER | Base Number Matches： | 1 |
MCP9700AT-H/TO 数据手册
通过下载MCP9700AT-H/TO数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载MCP9700/9700A
MCP9701/9701A
Low-Power Linear Active Thermistor™ ICs
Features
Description
• Tiny Analog Temperature Sensor
• Available Packages:
The MCP9700/9700A and MCP9701/9701A family of
Linear Active Thermistor™ Intergrated Circuit (IC) is an
analog temperature sensor that converts temperature
to analog voltage. It’s a low-cost, low-power sensor
with an accuracy of ±2°C from 0°C to +70°C
(MCP9700A/9701A) ±4°C from 0°C to +70°C
(MCP9700/9701) while consuming 6 µA (typical) of
operating current.
- SC70-5, SOT-23-5, TO-92-3
• Wide Temperature Measurement Range:
- -40°C to +125°C (Extended Temperature)
- -40°C to +150°C (High Temperature)
(MCP9700/9700A)
• Accuracy:
Unlike resistive sensors (such as thermistors), the
Linear Active Thermistor IC does not require an
additional signal-conditioning circuit. Therefore, the
biasing circuit development overhead for thermistor
solutions can be avoided by implementing this low-cost
device. The voltage output pin (VOUT) can be directly
connected to the ADC input of a microcontroller. The
MCP9700/9700A and MCP9701/9701A temperature
coefficients are scaled to provide a 1°C/bit resolution
for an 8-bit ADC with a reference voltage of 2.5V and
5V, respectively.
- ±2°C (max.), 0°C to +70°C (MCP9700A/9701A)
- ±4°C (max.), 0°C to +70°C (MCP9700/9701)
• Optimized for Analog-to-Digital Converters
(ADCs):
- 10.0 mV/°C (typical) MCP9700/9700A
- 19.5 mV/°C (typical) MCP9701/9701A
• Wide Operating Voltage Range:
- VDD = 2.3V to 5.5V MCP9700/9700A
- VDD = 3.1V to 5.5V MCP9701/9701A
• Low Operating Current: 6 µA (typical)
• Optimized to Drive Large Capacitive Loads
The MCP9700/9700A and MCP9701/9701A provide a
low-cost solution for applications that require measure-
ment of a relative change of temperature. When
measuring relative change in temperature from +25°C,
an accuracy of ±1°C (typical) can be realized from 0°C
to +70°C. This accuracy can also be achieved by
applying system calibration at +25°C.
Typical Applications
• Hard Disk Drives and Other PC Peripherals
• Entertainment Systems
• Home Appliance
In addition, this family is immune to the effects of
parasitic capacitance and can drive large capacitive
loads. This provides Printed Circuit Board (PCB) layout
design flexibility by enabling the device to be remotely
located from the microcontroller. Adding some
capacitance at the output also helps the output
transient response by reducing overshoots or
undershoots. However, capacitive load is not required
for sensor output stability.
• Office Equipment
• Battery Packs and Portable Equipment
• General Purpose Temperature Monitoring
Package Type
3-Pin TO-92
MCP9700/9701
Only
3-Pin SOT-23
MCP9700/9700A
MCP9701/9701A
5-Pin SC70
MCP9700/9700A
MCP9701/9701A
GND
3
NC
NC
1
2
3
5
1 2 3
GND
VOUT
VDD
4
Bottom
View
1
2
1
VDD
VOUT
VDD VOUT GND
© 2009 Microchip Technology Inc.
DS21942E-page 1
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 2
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
†Notice: Stresses above those listed under “Maximum
1.0
ELECTRICAL
CHARACTERISTICS
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
VDD:...................................................................... 6.0V
Storage temperature: ........................ -65°C to +150°C
Ambient Temp. with Power Applied:.. -40°C to +150°C
Output Current .................................................±30 mA
Junction Temperature (TJ): ................................ 150°C
ESD Protection On All Pins (HBM:MM): ....(4 kV:200V)
Latch-Up Current at Each Pin: ...................... ±200 mA
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Power Supply
Sym
Min
Typ
Max
Unit
Conditions
Operating Voltage Range
VDD
VDD
2.3
3.1
—
—
5.5
5.5
V
V
MCP9700/9700A
MCP9701/9701A
Operating Current
IDD
—
—
6
12
—
µA
Power Supply Rejection
Sensor Accuracy (Notes 1, 2)
TA = +25°C
Δ°C/ΔVDD
0.1
°C/V
TACY
TACY
TACY
TACY
TACY
TACY
TACY
TACY
—
±1
±1
±1
±1
±2
±2
±2
±2
—
°C
°C
°C
°C
°C
°C
°C
°C
TA = 0°C to +70°C
-2.0
-2.0
-2.0
-4.0
-4.0
-4.0
-4.0
+2.0
+4.0
+4.0
+4.0
+6.0
+6.0
+6.0
MCP9700A/9701A
MCP9700A
TA = -40°C to +125°C
TA = -10°C to +125°C
TA = 0°C to +70°C
MCP9701A
MCP9700/9701
MCP9700
TA = -40°C to +125°C
TA = -10°C to +125°C
TA = -40°C to +150°C
MCP9701
High Temperature,
MCP9700 only
Sensor Output
Output Voltage, TA = 0°C
Output Voltage, TA = 0°C
Temperature Coefficient
V0°C
V0°C
TC
—
—
—
—
—
—
—
—
500
400
10.0
19.5
±0.5
—
—
—
mV
mV
MCP9700/9700A
MCP9701/9701A
—
mV/°C MCP9700/9700A
mV/°C MCP9701/9701A
TC
—
Output Non-linearity
Output Current
VONL
IOUT
ZOUT
—
°C
µA
Ω
TA = 0°C to +70°C (Note 2)
100
—
Output Impedance
Output Load Regulation
20
IOUT = 100 µA, f = 500 Hz
ΔVOUT
ΔIOUT
/
1
—
Ω
TA = 0°C to +70°C,
IOUT = 100 µA
Turn-on Time
tON
—
800
—
µs
Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2. Also refer to Figure 2-16.
3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
© 2009 Microchip Technology Inc.
DS21942E-page 3
MCP9700/9700A and MCP9701/9701A
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Sym
Min
Typ
Max
Unit
Conditions
Typical Load Capacitance
CLOAD
—
—
1000
pF
The MCP9700/9700A and
MCP9701/9701A family is
characterized and produc-
tion tested with a capacitive
load of 1000 pF.
SC-70 Thermal Response to 63%
TO-92 Thermal Response to 63%
tRES
tRES
—
—
1.3
—
—
s
s
30°C (Air) to +125°C
(Fluid Bath) (Note 3)
1.65
Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2. Also refer to Figure 2-16.
3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
M
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameters
Temperature Ranges
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (Note 1)
TA
TA
TA
-40
-10
-40
—
—
—
+125
+125
+150
°C
°C
°C
MCP9700/9700A
MCP9701/9701A
High Temperature,
MCP9700 only
Operating Temperature Range
TA
TA
TA
-40
-40
-65
—
—
—
+125
+150
+150
°C
°C
°C
Extended Temperature
High Temperature
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 5LD SC70
Thermal Resistance, 3LD SOT-23
Thermal Resistance, 3LD TO-92
θJA
θJA
θJA
—
—
—
331
308
146
—
—
—
°C/W
°C/W
°C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
DS21942E-page 4
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
6.0
5.0
4.0
3.0
2.0
1.0
0.0
-1.0
-2.0
6.0
4.0
MCP9701
VDD= 5.0V
MCP9701A
VDD= 5.0V
Spec. Limits
2.0
Spec. Limits
0.0
-2.0
-4.0
MCP9700
VDD= 3.3V
MCP9700A VDD= 3.3V
-50 -25 25
0
50
75 100 125 150
-50 -25
0
25
50
75 100 125 150
TA (°C)
TA (°C)
FIGURE 2-1:
Accuracy vs. Ambient
FIGURE 2-4:
Accuracy vs. Ambient
Temperature (MCP9700A/9701A).
Temperature (MCP9700/9701).
6.0
0.2
MCP9700
MCP9700A
VDD = 5.5V
MCP9701/
MCP9701A
VDD= 5.5V
VDD= 3.1V
MCP9701/MCP9701A
VDD = 5.0V
ILOAD = 100 µA
4.0
0.1
0
VDD = 2.3V
2.0
0.0
-2.0
-4.0
MCP9700/MCP9700A
VDD = 3.3V
-0.1
-0.2
-50 -25
0
25
50
75 100 125 150
-50 -25
0
25
50 75 100 125 150
TA (°C)
TA (°C)
FIGURE 2-2:
Accuracy vs. Ambient
FIGURE 2-5:
Changes in Accuracy vs.
Temperature, with V
.
Ambient Temperature (Due to Load).
DD
12.0
10.0
8.0
4.0
MCP9700/MCP9700A
MCP9701/MCP9701A
VDD = 3.3V
MCP9701
MCP9701A
3.0
IOUT = 50 µA
IOUT = 100 µA
IOUT = 200 µA
6.0
2.0
1.0
0.0
MCP9700/MCP9700A
4.0
2.0
0.0
-50 -25
0
25
50
75 100 125 150
-50
-25
0
25
T
50
A (°C)
75
100
125
TA (°C)
FIGURE 2-3:
Supply Current vs.
FIGURE 2-6:
Load Regulation vs.
Temperature.
Ambient Temperature.
© 2009 Microchip Technology Inc.
DS21942E-page 5
MCP9700/9700A and MCP9701/9701A
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
35%
30%
25%
20%
15%
10%
5%
35%
30%
25%
20%
15%
10%
5%
MCP9701
VDD = 5.0V
108 samples
VDD = 3.3V
108 samples
MCP9700A
MCP9701A
MCP9700
MCP9701
0%
0%
V0°C (mV)
V0°C (mV)
FIGURE 2-7:
Output Voltage at 0°C
FIGURE 2-10:
Output Voltage at 0°C
(MCP9700/9700A).
(MCP9701/9701A).
45%
45%
MCP9700
MCP9701
40%
40%
MCP9700A
35%
MCP9701A
35%
VDD = 3.3V
VDD = 5.0V
108 samples
30%
25%
20%
15%
10%
5%
30%
25%
20%
15%
10%
5%
108 samples
0%
0%
TC (mV/°C)
TC (mV/°C)
FIGURE 2-8:
Occurrences vs.
FIGURE 2-11:
Occurrences vs.
Temperature Coefficient (MCP9700/9700A).
Temperature Coefficient (MCP9701/9701A).
0.30
0.30
MCP9701/MCP9701A
MCP9700/MCP9700A
VDD= 2.3V to 5.5V
DD= 3.1Vto5.5V
0.25
0.25
0.20
0.15
0.10
0.05
0.00
0.20
0.15
0.10
MCP9701/MCP9701A
= 3.1Vto4.0V
DD
MCP9700/MCP9700A
VDD= 2.3V to 4.0V
0.05
0.00
-50 -25
0
25
50
75 100 125 150
-50
-25
0
25
50
75
100 125
TA (°C)
TA (°C)
FIGURE 2-9:
Power Supply Rejection
FIGURE 2-12:
Power Supply Rejection
(Δ°C/ΔV ) vs. Ambient Temperature.
(Δ°C/ΔV ) vs. Temperature.
DD
DD
DS21942E-page 6
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
TA = +26°C
MCP9701
MCP9701A
MCP9700
MCP9700A
-50
-25
0
25
50
75
100 125
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
TA (°C)
VDD (V)
FIGURE 2-13:
Output Voltage vs. Power
FIGURE 2-16:
Output Voltage vs. Ambient
Supply.
Temperature.
2.5
30.0
VDD_STEP = 5V
TA = 26°C
VDD_RAMP = 5V/ms
1.7
IDD
TA = +26°C
18.0
1.5
1.0
0.5
0.0
IDD
0.8
6.0
6
0.0
-6.0
VOUT
4
VOUT
2
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (ms)
Time (ms)
FIGURE 2-14:
Output vs. Settling Time to
FIGURE 2-17:
Output vs. Settling Time to
step V
.
Ramp V
.
DD
DD
1000
100
10
130
105
80
VDD = 5.0V
IOUT = 100 µA
TA = +26°C
SC70-5
1 in. x 1 in. Copper Clad PCB
Leaded, without PCB
SC70-5
SOT-23-3
55
TO-92-3
30
1
-2
0
2
4
6
8
10 12 14 16 18
0.
0.1
1
100
100
1k
1000
10k
100k
10
10
1
10000 100000
Frequency (Hz)
Time (s)
FIGURE 2-15:
Thermal Response (Air to
FIGURE 2-18:
Output Impedance vs.
Fluid Bath).
Frequency.
© 2009 Microchip Technology Inc.
DS21942E-page 7
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 8
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
SC70
Pin No.
SOT-23
Pin No.
TO-92
Symbol
Function
1
2
3
4
5
—
3
—
3
NC
GND
VOUT
VDD
NC
No Connect (this pin is not connected to the die).
Power Ground Pin
2
2
Output Voltage Pin
1
1
Power Supply Input
—
—
No Connect (this pin is not connected to the die).
3.1
Power Ground Pin (GND)
3.3
Power Supply Input (VDD)
GND is the system ground pin.
The operating voltage as specified in the “DC
Electrical Characteristics” table is applied to VDD
.
3.2
Output Voltage Pin (VOUT)
3.4
No Connect Pin (NC)
The sensor output can be measured at VOUT. The
voltage range over the operating temperature range for
the MCP9700/9700A is 100 mV to 1.75V and for the
MCP9701/9701A, 200 mV to 3V .
This pin is not connected to the die. It can be used to
improve thermal conduction to the package by
connecting it to a Printed Circuit Board (PCB) trace
from the thermal source.
© 2009 Microchip Technology Inc.
DS21942E-page 9
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 10
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
4.0
APPLICATIONS INFORMATION
3.0
The Linear Active Thermistor™ IC uses an internal
diode to measure temperature. The diode electrical
characteristics have a temperature coefficient that
provides a change in voltage based on the relative
ambient temperature from -40°C to 150°C. The change
in voltage is scaled to a temperature coefficient of
10.0 mV/°C (typical) for the MCP9700/9700A and
19.5 mV/°C (typical) for the MCP9701/9701A. The out-
put voltage at 0°C is also scaled to 500 mV (typical)
and 400 mV (typical) for the MCP9700/9700A and
MCP9701/9701A, respectively. This linear scale is
described in the first-order transfer function shown in
Equation 4-1 and Figure 2-16.
2.0
1.0
0.0
-1.0
-2.0
-3.0
VDD= 3.3V
10 Samples
-50
-25
0
25
50
A (°C)
75
100
125
T
FIGURE 4-2:
Relative Accuracy to +25°C
vs. Temperature.
EQUATION 4-1:
SENSOR TRANSFER
FUNCTION
The change in accuracy from the calibration
temperature is due to the output non-linearity from the
first-order equation, as specified in Equation 4-2. The
accuracy can be further improved by compensating for
the output non-linearity.
VOUT = TC • TA + V0°C
Where:
TA = Ambient Temperature
For higher accuracy using a sensor compensation
technique, refer to AN1001 “IC Temperature Sensor
VOUT = Sensor Output Voltage
Accuracy
Compensation
with
a
PICmicro®
V0°C = Sensor Output Voltage at 0°C
(See DC Electrical Characteristics
table)
Microcontroller” (DS01001). The application note
shows that if the MCP9700 is compensated in addition
to room temperature calibration, the sensor accuracy
can be improved to ±0.5°C (typical) accuracy over the
operating temperature (Figure 4-3).
TC = Temperature Coefficient
(See DC Electrical Characteristics
table)
6.0
100 Samples
VDD
VDD
4.0
Spec. Limits
2.0
VOUT
GND
ANI
PICmicro®
MCU
0.0
MCP9700
+ s
Average
- s
-2.0
-4.0
VSS
VSS
-50
-25
0
25
50
75
100 125
Temperature (°C)
FIGURE 4-1:
Typical Application Circuit.
FIGURE 4-3:
MCP9700/9700A Calibrated
Sensor Accuracy.
4.1
Improving Accuracy
The compensation technique provides
a
linear
The MCP9700/9700A and MCP9701/9701A accuracy
can be improved by performing a system calibration at
a specific temperature. For example, calibrating the
system at +25°C ambient improves the measurement
accuracy to a ±0.5°C (typical) from 0°C to +70°C, as
shown in Figure 4-2. Therefore, when measuring
relative temperature change, this family measures
temperature with higher accuracy.
temperature reading. A firmware look-up table can be
generated to compensate for the sensor error.
© 2009 Microchip Technology Inc.
DS21942E-page 11
MCP9700/9700A and MCP9701/9701A
4.2
Shutdown Using Microcontroller
I/O Pin
4.4
Thermal Considerations
The MCP9700/9700A and MCP9701/9701A family
measures temperature by monitoring the voltage of a
diode located in the die. A low-impedance thermal path
between the die and the PCB is provided by the pins.
Therefore, the sensor effectively monitors the
temperature of the PCB. However, the thermal path for
the ambient air is not as efficient because the plastic
device package functions as a thermal insulator from
the die. This limitation applies to plastic-packaged
silicon temperature sensors. If the application requires
measuring ambient air, consider using the TO-92
package.
The MCP9700/9700A and MCP9701/9701A family of
low operating current of 6 µA (typical) makes it ideal for
battery-powered
applications.
However,
for
applications that require tighter current budget, this
device can be powered using a microcontroller Input/
Output (I/O) pin. The I/O pin can be toggled to shut
down the device. In such applications, the
microcontroller internal digital switching noise is
emitted to the MCP9700/9700A and MCP9701/9701A
as power supply noise. This switching noise compro-
mises measurement accuracy. Therefore, a decoupling
capacitor and series resistor will be necessary to filter
out the system noise.
The MCP9700/9700A and MCP9701/9701A is
designed to source/sink 100 µA (max.). The power
dissipation due to the output current is relatively
insignificant. The effect of the output current can be
described using Equation 4-2.
4.3
Layout Considerations
The MCP9700/9700A and MCP9701/9701A family
does not require any additional components to operate.
However, it is recommended that a decoupling
capacitor of 0.1 µF to 1 µF be used between the VDD
and GND pins. In high-noise applications, connect the
power supply voltage to the VDD pin using a 200Ω
resistor with a 1 µF decoupling capacitor. A high
frequency ceramic capacitor is recommended. It is
necessary for the capacitor to be located as close as
possible to the VDD and GND pins in order to provide
effective noise protection. In addition, avoid tracing
digital lines in close proximity to the sensor.
EQUATION 4-2:
EFFECT OF SELF-
HEATING
TJ – TA = θJA(VDD DD
I
+ (VDD – VOUT)IOUT)
Where:
TJ = Junction Temperature
TA = Ambient Temperature
θJA = Package Thermal Resistance
(331°C/W)
VOUT = Sensor Output Voltage
IOUT = Sensor Output Current
IDD = Operating Current
VDD = Operating Voltage
At TA = +25°C (VOUT = 0.75V) and maximum
specification of IDD = 12 µA, VDD 5.5V and
=
IOUT = +100 µA, the self-heating due to power
dissipation (TJ – TA) is 0.179°C.
DS21942E-page 12
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Lead SOT-23
Example:
Device
MCP9700T
Code
XXNN
AE25
AENN
AFNN
AMNN
APNN
MCP9700AT
MCP9701T
MCP9701AT
Note: Applies to 3-Lead SOT-23
3-Lead TO-92
Example:
XXXXXX
XXXXXX
XXXXXX
YWWNNN
MCP
9700E
e
3
TO^^
916256
5-Lead SC70
Example:
Device
MCP9700T
Code
XXNN
AU25
AUNN
AXNN
AVNN
AYNN
MCP9700AT
MCP9701T
MCP9701AT
Note: Applies to 5-Lead SC70.
Legend: XX...X Customer-specific information
Y
YY
WW
NNN
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
e
3
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (
can be found on the outer packaging for this package.
)
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS21942E-page 13
MCP9700/9700A and MCP9701/9701A
ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢂꢒꢖꢆꢗꢍꢘꢙꢚꢛ
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ꢌ##ꢎ+22---ꢁꢄꢃꢊꢍꢇꢊꢌꢃꢎꢁꢊꢇꢄ2ꢎꢉꢊ/ꢉꢓꢃꢆꢓ
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)ꢕ*+ )ꢉ ꢃꢊꢈꢂꢃꢄꢅꢆ ꢃꢇꢆꢁꢈꢗꢌꢅꢇꢍꢅ#ꢃꢊꢉꢋꢋꢘꢈꢅ&ꢉꢊ#ꢈ,ꢉꢋ$ꢅꢈ ꢌꢇ-ꢆꢈ-ꢃ#ꢌꢇ$#ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢅ ꢁ
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DS21942E-page 14
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
ꢜꢔꢊꢃꢝ .ꢇꢍꢈ#ꢌꢅꢈꢄꢇ #ꢈꢊ$ꢍꢍꢅꢆ#ꢈꢎꢉꢊ/ꢉꢓꢅꢈ!ꢍꢉ-ꢃꢆꢓ 0ꢈꢎꢋꢅꢉ ꢅꢈ ꢅꢅꢈ#ꢌꢅꢈꢏꢃꢊꢍꢇꢊꢌꢃꢎꢈ1ꢉꢊ/ꢉꢓꢃꢆꢓꢈꢕꢎꢅꢊꢃ%ꢃꢊꢉ#ꢃꢇꢆꢈꢋꢇꢊꢉ#ꢅ!ꢈꢉ#ꢈ
ꢌ##ꢎ+22---ꢁꢄꢃꢊꢍꢇꢊꢌꢃꢎꢁꢊꢇꢄ2ꢎꢉꢊ/ꢉꢓꢃꢆꢓ
© 2009 Microchip Technology Inc.
DS21942E-page 15
MCP9700/9700A and MCP9701/9701A
ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢈꢆꢏꢐꢊꢈꢋꢑꢃꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢕꢒꢒꢖꢆꢗꢍꢏꢒꢁ! ꢛ
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DS21942E-page 16
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
ꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢒꢓꢄꢑꢉꢋꢉꢊꢔꢓꢆꢏꢐꢊꢈꢋꢑꢃꢆꢕꢒꢏꢖꢆꢗꢒꢏꢁ"!ꢛ
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)ꢕ*+ )ꢉ ꢃꢊꢈꢂꢃꢄꢅꢆ ꢃꢇꢆꢁꢈꢗꢌꢅꢇꢍꢅ#ꢃꢊꢉꢋꢋꢘꢈꢅ&ꢉꢊ#ꢈ,ꢉꢋ$ꢅꢈ ꢌꢇ-ꢆꢈ-ꢃ#ꢌꢇ$#ꢈ#ꢇꢋꢅꢍꢉꢆꢊꢅ ꢁ
ꢏꢃꢊꢍꢇꢊꢌꢃꢎ ꢗꢅꢊꢌꢆꢇꢋꢇꢓꢘ ꢂꢍꢉ-ꢃꢆꢓ *ꢐꢖꢜꢀꢐꢀ)
© 2009 Microchip Technology Inc.
DS21942E-page 17
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 18
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
APPENDIX A: REVISION HISTORY
Revision E (April 2009)
The following is the list of modifications:
1. Added High Temperature option throughout
document.
2. Updated plots to reflect the high temperature
performance.
3. Updated Package Outline drawings.
4. Updated Revision history.
Revision D (October 2007)
The following is the list of modifications:
1. Added the 3-lead SOT-23 devices to data sheet.
2. Replaced Figure 2-15.
3. Updated Package Outline Drawings.
Revision C (June 2006)
The following is the list of modifications:
1. Added the MCP9700A and MCP9701A devices
to data sheet.
2. Added TO92 package for the MCP9700/
MCP9701.
Revision B (October 2005)
The following is the list of modifications:
1. Added Section 3.0 “Pin Descriptions”.
2. Added the Linear Active Thermistor™ IC
trademark.
3. Removed the 2nd order temperature equation
and the temperature coeficient histogram.
4. Added a reference to AN1001 and correspond-
ing verbiage.
5. Added Figure 4-2 and corresponding verbiage.
Revision A (November 2005)
• Original Release of this Document.
© 2009 Microchip Technology Inc.
DS21942E-page 19
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 20
© 2009 Microchip Technology Inc.
MCP9700/9700A and MCP9701/9701A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Examples:
–
PART NO.
Device
X
/XX
a)
MCP9700T-E/LT: Linear Active Thermistor™
IC, Tape and Reel,
Temperature
Range
Package
5LD SC70 package.
b)
c)
MCP9700-E/TO:
Linear Active Thermistor™
IC, 3LD TO-92 package.
MCP9700T-E/TO: Linear Active Thermistor™
IC, Tape and Reel,
Device:
MCP9700T:
Linear Active Thermistor™ IC,
Tape and Reel, Pb free
3LD SOT-23 package.
Linear Active Thermistor™
IC, Tape and Reel,
High Temperature,
5LD SC70 package.
MCP9700AT: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9701T:
d)
MCP9700T-H/LT:
Linear Active Thermistor™ IC,
Tape and Reel, Pb free
MCP9701AT: Linear Active Thermistor™ IC,
Tape and Reel, Pb free
a)
b)
MCP9700AT-E/LT: Linear Active Thermistor™
IC, Tape and Reel,
5LD SC70 package.
MCP9700AT-E/TO: Linear Active Thermistor™
IC, Tape and Reel,
° °
-40 C to +125 C
-40 C to +150 C (MCP9700 only)
Temperature Range:
Package:
E
H
=
=
°
°
3LD SOT-23 package.
LT
=
Plastic Small Outline Transistor, 5-lead
TO = Plastic Small Outline Transistor, 3-lead
TT Plastic Small Outline Transistor, 3-lead
a)
MCP9701T-E/LT: Linear Active Thermistor™
IC, Tape and Reel,
=
5LD SC70 package.
b)
c)
MCP9701-E/TO:
Linear Active Thermistor™
IC, 3LD TO-92 package.
MCP9701T-E/TO: Linear Active Thermistor™
IC, Tape and Reel,
3LD SOT-23 package.
a)
b)
MCP9701AT-E/LT: Linear Active Thermistor™
IC, Tape and Reel,
5LD SC70 package.
MCP9701AT-E/TO: Linear Active Thermistor™
IC, Tape and Reel,
3LD SOT-23 package.
© 2009 Microchip Technology Inc.
DS21942E-page 21
MCP9700/9700A and MCP9701/9701A
NOTES:
DS21942E-page 22
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS21942E-page 23
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Boston
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Seoul
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Cleveland
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Santa Clara
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/26/09
DS21942E-page 24
© 2009 Microchip Technology Inc.
MCP9700AT-H/TO 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| MCP9700AT-H/TT | MICROCHIP | Low-Power Linear Active Thermistor⢠ICs | 获取价格 |
|
| MCP9700B | MICROCHIP | Linear Active Thermistor ICs are sensors whose output voltage is directly proportional to measured | 获取价格 |
|
| MCP9700T | MICROCHIP | Low-Power Linear Active Thermistor⢠ICs | 获取价格 |
|
| MCP9700T-E/LT | MICROCHIP | Low-Power Linear Active Thermistor⑩ ICs | 获取价格 |
|
| MCP9700T-E/TO | MICROCHIP | Low-Power Linear Active Thermistor⑩ ICs | 获取价格 |
|
| MCP9700T-E/TT | MICROCHIP | Low-Power Linear Active Thermistor⢠ICs | 获取价格 |
|
| MCP9700T-ELT | MICROCHIP | Low-Power Linear Active Thermistor ICs | 获取价格 |
|
| MCP9700T-H/LT | MICROCHIP | Low-Power Linear Active Thermistor⢠ICs | 获取价格 |
|
| MCP9700T-H/LTVAO | MICROCHIP | Analog Voltage Output Sensor, Rectangular, Surface Mount | 获取价格 |
|
| MCP9700T-H/TO | MICROCHIP | Low-Power Linear Active Thermistor⢠ICs | 获取价格 |
|
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