MCP98242T-CE/MC_技术文档

MCP98242

Memory Module Temperature Sensor w/EEPROM for SPD

Features:

Description:

• Temperature Sensor + 256 Byte Serial EEPROM

• EEPROM for Serial Presence Detect (SPD)

• Optimized for Voltage Range: 3.0V to 3.6V

• Shutdown/Standby Current: 3 µA (maximum)

• 2-wire Interface: I²C™/SMBus Compatible

Microchip Technology Inc.’s MCP98242 digital

temperature sensor converts temperature from -40°C

and +125°C to a digital word. This sensor meets

JEDEC Specification JC42.4 Mobile Platform Memory

Module Thermal Sensor Component. It provides an

accuracy of ±0.5°C/±1°C (typical/maximum) from

+75°C to +95°C. In addition, this device has an internal

256 Byte EEPROM which can be used to store memory

module and vendor information.

• Available Packages: DFN-8, TDFN-8, UDFN-8,

TSSOP-8

Temperature Sensor Features:

The MCP98242 digital temperature sensor comes with

user-programmable registers that provide flexibility for

DIMM temperature-sensing applications. The registers

allow user-selectable settings such as Shutdown or

Low-Power modes and the specification of

temperature event and critical output boundaries.

When the temperature changes beyond the specified

boundary limits, the MCP98242 outputs an Event

signal. The user has the option of setting the Event

output signal polarity as either an active-low or

active-high comparator output for thermostat operation,

or as a temperature event interrupt output for

microprocessor-based systems. The Event output can

also be configured as a critical temperature output.

• Temperature-to-Digital Converter

• Operating Current: 200 µA (typical)

• Accuracy:

^{- ±0.5°C/±1°C (typ./max.)} +75°C to +95°C

- ±1°C/±2°C (typ./max.)  +40°C to +125°C

- ±2°C/±3°C (typ./max.)  -20°C to +125°C

Serial EEPROM Features:

• Operating Current:

- Write 1.1 mA (typical) for 3.5 ms (typical)

- Read 100 µA (typical)

• Permanent and Reversible Software Write-Protect

• Software Write Protection for the Lower 128 Bytes

• Organized as 1 Block of 256 Bytes (256x8)

The EEPROM is designed specifically for DRAM

DIMMs (Dual In-line Memory Modules) Serial Presence

Detect (SPD). The lower 128 bytes (address 00h to

7Fh) can be Permanent Write-Protected (PWP) or

Software Reversible Write-Protected (SWP). This

allows DRAM vendor and product information to be

stored and write-protected. The upper 128 bytes

(address 80h to FFh) can be used for general purpose

data storage. These addresses are not write-protected.

Typical Applications:

• DIMM Modules

• Laptops, Personal Computers and Servers

• Hard Disk Drives and Other PC Peripherals

This sensor has an industry standard 2-wire, I²C/

SMBus compatible serial interface, allowing up to eight

devices to be controlled in a single serial bus. To

maintain interchangeability with the I²C/SMBus

interface the electrical specifications are specified with

the operating voltage of 3.0V to 3.6V. In addition, a

40 ms (typical) time out is implemented.

DIMM MODULE

Memory

MCP98242

Package Types

Temperature Sensor + EEPROM

• ±0.5°C (typ.) Sensor

MCP98242

8-Pin DFN/TDFN/UDFN (2x3) * 8-Pin TSSOP

• 256 Byte EEPROM for SPD

V

A0

A1

V

1

2

3

1

2

8

7

8

7

6

5

DD

Event

SCLK

SDA

Event A1

EP

9

A2

SCLK

3

4

6

5

GND 4

SDA

GND

3.3V_{DD SPD}

_

SDA

SCL

Event

* Includes Exposed Thermal Pad (EP); see Table 3-1.

 2010 Microchip Technology Inc.

DS21996D-page 1

MCP98242

Notes:

DS21996D-page 2

 2010 Microchip Technology Inc.

MCP98242

†Notice: Stresses above those listed under “Maximum

ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied.

Exposure to maximum rating conditions for extended periods

may affect device reliability.

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

V

.................................................................................. 6.0V

DD

Voltage at all Input/Output pins ............... GND – 0.3V to 6.0V

Pin A0 ................................................... GND – 0.3V to 12.5V

Storage temperature .....................................-65°C to +150°C

Ambient temp. with power applied ................-40°C to +125°C

Junction Temperature (T ) ..........................................+150°C

J

ESD protection on all pins (HBM:MM) ................. (4 kV:300V)

Latch-Up Current at each pin (+25°C) ..................... ±200 mA

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to

V_DD, and T_A= -20°C to +125°C.

Parameters

Sym

Min

Typ Max Unit

Conditions

Power Supply

Operating Voltage

Operating Current

V_DD

3.0

—

3.6

V

Temperature Sensor

I_DD

—

200

500

µA

EEPROM Inactive

Sensor in Shutdown mode (for t_WC)

EEPROM write

EEPROM read

Shutdown Current

1100 2000

I_DD

100

1

500

3

Sensor in Shutdown mode

I_SHDN

EEPROM Inactive,

Sensor in Shutdown mode

Power-on-Reset (POR)

Threshold

V_POR

—

2.3

1.6

—

V

Temperature Sensor (V_DDfalling)

EEPROM (V_DDfalling) (see Section 5.4

“Summary of Temperature Sensor

Power-on Default”)

Power Supply Rejection,

T_A= +25°C

°C/V_DD

—

±0.4

—

°C/V V_DD= 3.0V to 3.6V

±0.15

°C

V_DD= 3.3V+150 mV_{PP AC}(0 to 1 MHz)

Temperature Sensor Accuracy

+75°C < T_A +95°C

+40°C < T_A +125°C

-20°C < T_A +125°C

T_A-40°C

T_ACY

-1.0 ±0.5 +1.0

°C

-2.0

-3.0

—

±1

±2

-2

+2.0

+3.0

—

Conversion Time

0.25°C/bit

t_CONV

—

65

125

ms

15 s/sec (typical) (See Section 5.2.3.3

“Temperature Resolution”)

Event Output (Open-drain)

High-level Current (leakage)

I_OH

—

1

µA

V

V_OH= V_DD

I_OL= 3 mA

Low-level Voltage

V_OL

0.4

EEPROM

Write Cycle (byte/page)

Endurance T_A= +25°C

Write-Protect High Voltage

Thermal Response

t_WC

—

1M

8

3

5

ms

—

12

cycles V_DD= 5V, Note 1

Applied at A0 pin, Note 1

V_{HI_WP}

V

Note 1: Characterized but not production tested.

 2010 Microchip Technology Inc.

DS21996D-page 3

MCP98242

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to

V_DD, and T_A= -20°C to +125°C.

Parameters

Sym

t_RES

Min

—

Typ Max Unit

Conditions

Time to 63% (89°C)

25°C (Air) to 125°C (oil bath)

DFN

0.7

1.4

—

s

TSSOP

—

Note 1: Characterized but not production tested.

INPUT/OUTPUT PIN DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground and

T_A= -20°C to +125°C.

Parameters

Sym

Min

Typ

Max Units

Conditions

Serial Input/Output (SCL, SDA, A0, A1, A2)

Input

High-level Voltage

Low-level Voltage

Input Current

V_IH

V_IL

I_IN

2.1

—

0.8

±5

V

—

µA

Output (SDA)

Low-level Voltage

V_OL

I_OH

I_OL

—

6

—

5

0.4

1

V

I_OL= 3 mA

High-level Current (leakage)

Low-level Current

µA V_OH= V_DD

mA V_OL= 0.6V

pF

—

Capacitance

C_IN

—

SDA and SCL Inputs

Hysteresis

V_HYST

—

0.5

—

V

Note: The serial inputs do not load the serial bus for V_DDrange of 1.8V to 5.5V.

GRAPHICAL SYMBOL DESCRIPTION

OUTPUT

INPUT

V_DD

Voltage

Current

Voltage

Current

V_DD

V_IH

V_OL

V_IL

I_OL

I_IN

I_OH

time

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground.

Parameters

Temperature Ranges

Sym

Min

Typ

Max

Units

Conditions

(Note 1)

Specified Temperature Range

Operating Temperature Range

Storage Temperature Range

Thermal Package Resistances

T_A

-20

-40

-65

—

+125

+150

°C

Note 1: Operation in this range must not cause T_Jto exceed Maximum Junction Temperature (+150°C).

DS21996D-page 4

 2010 Microchip Technology Inc.

MCP98242

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground.

Parameters

Thermal Resistance, 8L-DFN

Thermal Resistance, 8L-TDFN

Thermal Resistance, 8L-TSSOP

Sym

_JA

Min

—

Typ

84.5

41

Max

—

Units

°C/W

Conditions

_JA

—

_JA

—

139

—

Note 1: Operation in this range must not cause T_Jto exceed Maximum Junction Temperature (+150°C).

0

SENSOR AND EEPROM SERIAL INTERFACE TIMING SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground, T_A= -20°C to +125°C,

C_L= 80 pF, and all limits measured to 50% point.

Parameters

Sym

Min

Typ

Max

Units

Conditions

2-Wire I²C™/SMBus-Compatible Interface

Serial Port Frequency

Low Clock

f_SC

t_LOW

t_HIGH

t_R

10

4.7

4.0

—

100

—

kHz I²C™/SMBus

µs

High Clock

—

Rise Time

1000

ns

(V_{IL MAX}- 0.15V) to (V_{IH MIN}

+

-

0.15V)

Fall Time

t_F

—

300

ns

(V_{IH MIN}+ 0.15V) to (V_{IL MAX}

0.15V)

Data Setup Before SCLK High

Data Hold After SCLK Low

Start Condition Setup Time

Start Condition Hold Time

Stop Condition Setup Time

Bus Idle

t_SU-DATA

t_H-DATA

t_SU-START

t_H-START

t_SU-STOP

t_{B_FREE}

t_OUT

250

300

4.7

4.0

4.7

25

—

40

—

50

ns

µs

Time Out

ms Temp. Sensor Only (characterized

but not production tested)

TIMING DIAGRAM

Start Condition

Data Transmission

Stop Condition

 2010 Microchip Technology Inc.

DS21996D-page 5

MCP98242

NOTES:

DS21996D-page 6

 2010 Microchip Technology Inc.

MCP98242

2.0

TYPICAL PERFORMANCE CURVES

Note:

The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to V_DD, and

T_A= -20°C to +125°C.

3.0

2.0

10000

1000

100

10

V_DD= 3.3V to 3.6V

V_DD= 3.0V to 3.6V

Spec. Limits

1.0

EEPROM Write (Sensor in Shutdown Mode)

0.0

Sensor (EEPROM Inactive)

-1.0

-2.0

-3.0

EEPROM Read (Sensor in Shutdown Mode)

1

-40 -20

0

20

40

60

80 100 120

-40 -20

0

20

40

60

80 100 120

T

_A(°C)

T_A(°C)

FIGURE 2-1:

Average Temperature

FIGURE 2-4:

Supply Current vs.

Accuracy.

Temperature.

70%

3.00

T_A= +95°C

_DD= 3.3V

221 units

V_DD= 3.0V to 3.6V

60%

50%

40%

30%

20%

10%

0%

V

2.50

2.00

1.50

1.00

0.50

0.00

-40 -20

0

20

40

60

80 100 120

Temperature Accuracy (°C)

T_A(°C )

FIGURE 2-5:

Shutdown Current vs.

FIGURE 2-2:

Temperature Accuracy

Temperature.

Histogram, T_A= +95°C.

70%

3

2.5

2

T_A= +75°C

V_DD= 3.3V

221 units

60%

50%

40%

30%

20%

10%

0%

1.5

1

0.5

0

-40 -20

0

20

40

60

80 100 120

T_A(°C)

Temperature Accuracy (°C)

FIGURE 2-6:

Power-on Reset Threshold

FIGURE 2-3:

Temperature Accuracy

Voltage vs. Temperature.

Histogram, T_A= +75°C.

 2010 Microchip Technology Inc.

DS21996D-page 7

MCP98242

Note: Unless otherwise indicated, V_DD= 3.0V to 3.6V, GND = Ground, SDA/SCL pulled-up to V_DD, and

T_A= -20°C to +125°C.

48

0.4

0.3

0.2

0.1

0

V_DD= 3.0V to 3.6V

_OL= 3 mA

42 V_OL= 0.6V

I

36

30

24

18

12

SDA

Event

60

6

-40 -20

0

20

40

80 100 120

-40 -20

0

20

40

60

80 100 120

T_A(°C)

T

_A(°C)

FIGURE 2-7:

Event and SDA V_OLvs.

FIGURE 2-10:

SDA IOL vs. Temperature.

Temperature.

3.0

2.0

125

V_DD= 3.0V to 3.6V

110

95

80

65

50

35

V_DD= 3.0V

1.0

Δ°C/ΔV_DD= 0.4°C/V

V_DD= 3.6V

0.0

-1.0

-2.0

-3.0

-40 -20

0

20

40

60

80 100 120

-40 -20

0

20

40

60

80 100 120

T_A(°C)

FIGURE 2-11:

Temperature Accuracy vs.

FIGURE 2-8:

Temperature.

Conversion Rate vs.

V_DD

.

120%

100%

80%

60%

40%

20%

0%

1.0

T_A= +25°C

Δ°C/ΔV_DD, V_DD= 3.3V + 150 mV_{PP (AC)}

0.5

0.0

TSSOP-8

DFN-8

-0.5

-1.0

22°C (Air) to 125°C (Oil bath)

No decoupling capacitor

100

1,000

10,000

100,000

1,000,000

1M

1k

10k

100k

100

1k

10k

100k

1M

-2

0

2

4

6

8

10 12 14 16

Time (s)

Frequency (Hz)

FIGURE 2-12:

Response.

Package Thermal

FIGURE 2-9:

Frequency.

Power Supply Rejection vs.

DS21996D-page 8

 2010 Microchip Technology Inc.

MCP98242

3.0

PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1:

PIN FUNCTION TABLES

DFN/TDFN/

UDFN

TSSOP

Symbol

Pin Function

Slave Address

Package Type

8-Pin TSSOP

1

2

3

4

5

6

7

8

9

1

2

A0

A1

Slave Address

V

1

2

3

4

8

7

6

5

A0

A1

DD

3

A2

Slave Address

Event

SCLK

SDA

4

GND

SDA

SCLK

Event

V_DD

EP

Ground

A2

5

Serial Data Line

Serial Clock Line

Temperature Alert Output

Power Pin

GND

6

7

8

—

Exposed Thermal Pad (EP);

must be connected to V_SS

.

3.1

Address Pins (A2, A1, A0)

3.4

Serial Clock Line (SCLK)

These pins are device address input pins.

The SCLK is a clock input pin. All communication and

timing is relative to the signal on this pin. The clock is

generated by the host or master controller on the bus.

(See Section 4.0 “Serial Communication”).

The address pins correspond to the Least Significant

bits (LSb) of address bits. The Most Significant bits

(MSb) (A6, A5, A4, A3). This is shown in Table 3-2.

TABLE 3-2:

Device

MCP98242 ADDRESS BYTE

3.5

Open-Drain Temperature Alert

Output (Event)

Address Code

Slave

Address

The MCP98242 Event pin is an open-drain output. The

device outputs a signal when the ambient temperature

goes beyond the user-programmed temperature limit.

(see Section 5.2.3 “Event Output Configuration”).

A6 A5 A4 A3 A2 A1 A0

Sensor

0

1

0

1

0

EEPROM

X

EEPROM

Write-Protect

3.6

Power Pin (V

DD)

Note:

User-selectable address is shown by X.

V_DDis the power pin. The operating voltage range, as

specified in the DC electrical specification table, is

applied on this pin.

3.2

Ground Pin (GND)

The GND pin is the system ground pin.

3.7

Exposed Thermal Pad (EP)

There is an internal electrical connection between the

Exposed Thermal Pad (EP) and the GND pin; they

must be connected to the same potential on the Printed

Circuit Board (PCB).

3.3

Serial Data Line (SDA)

SDA is a bidirectional input/output pin, used to serially

transmit data to/from the host controller. This pin

requires a pull-up resistor. (See Section 4.0 “Serial

Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 9

MCP98242

NOTES:

DS21996D-page 10

 2010 Microchip Technology Inc.

MCP98242

4.1.1

DATA TRANSFER

4.0

4.1

SERIAL COMMUNICATION

2-Wire SMBus/Standard Mode

I C™ Protocol-Compatible

Interface

Data transfers are initiated by a Start condition (Start),

followed by a 7-bit device address and a read/write bit.

An Acknowledge (ACK) from the slave confirms the

reception of each byte. Each access must be

terminated by a Stop condition (Stop).

2

The MCP98242 serial clock input (SCLK) and the

bidirectional serial data line (SDA) form a 2-wire

bidirectional SMBus/Standard mode I²C compatible

communication port (refer to the Input/Output Pin DC

Characteristics Table and Sensor And EEPROM Serial

Interface Timing Specifications Table).

Repeated communication is initiated after t_B-FREE

.

This device does not support sequential register read/

write. Each register needs to be addressed using the

Register Pointer.

This device supports the Receive Protocol. The

register can be specified using the pointer for the initial

read. Each repeated read or receive begins with a Start

condition and address byte. The MCP98242 retains the

previously selected register. Therefore, it outputs data

from the previously-specified register (repeated pointer

specification is not necessary).

The following bus protocol has been defined:

TABLE 4-1:

MCP98242 SERIAL BUS

PROTOCOL DESCRIPTIONS

Term

Description

Master

The device that controls the serial bus,

typically a microcontroller.

4.1.2

MASTER/SLAVE

The bus is controlled by a master device (typically a

microcontroller) that controls the bus access and

generates the Start and Stop conditions. The

MCP98242 is a slave device and does not control other

devices in the bus. Both master and slave devices can

operate as either transmitter or receiver. However, the

master device determines which mode is activated.

Slave

The device addressed by the master,

such as the MCP98242.

Transmitter Device sending data to the bus.

Receiver

Start

Device receiving data from the bus.

A unique signal from master to initiate

serial interface with a slave.

4.1.3

START/STOP CONDITION

Stop

A unique signal from the master to

terminate serial interface from a slave.

A high-to-low transition of the SDA line (while SCLK is

high) is the Start condition. All data transfers must be

preceded by a Start condition from the master. If a Start

condition is generated during data transfer, the

MCP98242 resets and accepts the new Start condition.

Read/Write A read or write to the MCP98242

registers.

ACK

A receiver Acknowledges (ACK) the

reception of each byte by polling the

bus.

A low-to-high transition of the SDA line (while SCLK is

high) signifies a Stop condition. If a Stop condition is

introduced during data transmission, the MCP98242

releases the bus. All data transfers are ended by a Stop

condition from the master.

NAK

A receiver Not-Acknowledges (NAK) or

releases the bus to show End-of-Data

(EOD).

Busy

Communication is not possible

because the bus is in use.

4.1.4

ADDRESS BYTE

Not Busy

The bus is in the Idle state, both SDA

and SCLK remain high.

Following the Start condition, the host must transmit an

8-bit address byte to the MCP98242. The address for

the

MCP98242

Temperature

Sensor

is

Data Valid SDA must remain stable before SCLK

becomes high in order for a data bit to

be considered valid. During normal

data transfers, SDA only changes state

while SCLK is low.

‘0011,A2,A1,A0’ in binary, where the A2, A1 and A0

bits are set externally by connecting the corresponding

pins to V_DD‘1’ or GND ‘0’. The 7-bit address transmit-

ted in the serial bit stream must match the selected

address for the MCP98242 to respond with an ACK. Bit

8 in the address byte is a read/write bit. Setting this bit

to ‘1’ commands a read operation, while ‘0’ commands

a write operation (see Figure 4-1).

 2010 Microchip Technology Inc.

DS21996D-page 11

MCP98242

4.1.6

ACKNOWLEDGE (ACK)

Address Byte

Each receiving device, when addressed, is obliged to

generate an ACK bit after the reception of each byte.

The master device must generate an extra clock pulse

for ACK to be recognized.

SCLK

SDA

1

2

3

4

5

6

7

8

9

A

C

K

0 0 1 1 A2 A1 A0

The acknowledging device pulls down the SDA line for

t_SU-DATAbefore the low-to-high transition of SCLK from

the master. SDA also needs to remain pulled down for

Start

Slave

Address

Code

R/W

Address

t

_H-DATAafter a high-to-low transition of SCLK.

MCP98242 Response

During read, the master must signal an End-of-Data

(EOD) to the slave by not generating an ACK bit (NAK)

once the last bit has been clocked out of the slave. In

this case, the slave will leave the data line released to

enable the master to generate the Stop condition.

FIGURE 4-1:

Device Addressing.

4.1.5 DATA VALID

After the Start condition, each bit of data in

transmission needs to be settled for a time specified by

t_SU-DATAbefore SCLK toggles from low-to-high (see

“Sensor And EEPROM Serial Interface Timing

Specifications” on Page 5).

4.1.7

TIME OUT (MCP98242)

If the SCLK stays low or high for time specified by t_OUT

,

the MCP98242 temperature sensor resets the serial

interface. This dictates the minimum clock speed as

specified in the SMBus specification. However, the

EEPROM does not reset the serial interface.

Therefore, the master can hold the clock indefinitely to

process data from the EEPROM.

DS21996D-page 12

 2010 Microchip Technology Inc.

MCP98242

registers and a 2-wire I²C/SMBus protocol compatible

serial interface. Figure 5-1 shows a block diagram of

the register structure.

5.0

FUNCTIONAL DESCRIPTION

The MCP98242 temperature sensors consists of a

band gap type temperature sensor, a Delta-Sigma Ana-

log-to-Digital Converter (ADC), user-programmable

Temperature Sensor

EEPROM

Hysteresis

Shutdown

Critical Trip Lock

Alarm Win. Lock Bit

Clear Event

HV Generator

Event Status

Output Control

Critical Event only

Write-

Protected

Array

Band-Gap

Temperature

Sensor

Event Polarity

(00h-7Fh)

Event Comp/Int

Address

Decoder

X

Configuration

Temperature

 ADC

Standard

Array

T

UPPER

(80h-FFh)

T

LOWER

CRIT

0.5°C/bit

0.25°C/bit

0.125°C/bit

0.0625°C/bit

T

Memory

Control

Logic

Manufacturer ID

Device ID/Rev

Resolution

Capability

Write-Protect

Circuitry

Selected Resolution

Temp. Range

Accuracy

Address Decoder

Y

Output Feature

Sense Amp

R/W Control

Register

Pointer

2

SMBus/Standard I C™

Interface

SCL

SDA

Functional Block Diagram.

V_DD

Event

GND

A0

A2

A1

FIGURE 5-1:

 2010 Microchip Technology Inc.

DS21996D-page 13

MCP98242

The Capability register is used to provide bits

describing the MCP98242’s capability in measurement

resolution, measurement range and device accuracy.

The device Configuration register provides access to

configure the MCP98242’s various features. These

registers are described in further detail in the following

sections.

5.1

Registers

The MCP98242 has several registers that are

user-accessible. These registers include the Capability

register, Configuration register, Event Temperature

Upper-Boundary and Lower-Boundary Trip registers,

Critical Temperature Trip register, Temperature

register, Manufacturer Identification register and

Device Identification register.

The registers are accessed by sending a Register

Pointer to the MCP98242 using the serial interface.

This is an 8-bit write-only pointer. However, the three

Least Significant bits are used as pointers and all

unused bits (bits 7-3) need to be cleared or set to ‘0’.

Register 5-1 describes the pointer or the address of

each register.

The Temperature register is read-only, used to access

the ambient temperature data. The data is loaded in

parallel to this register after t_CONV. The Event

Temperature Upper-Boundary and Lower-Boundary

Trip registers are read/writes. If the ambient

temperature drifts beyond the user-specified limits, the

MCP98242 outputs a signal using the Event pin (refer

to Section 5.2.3 “Event Output Configuration”). In

addition, the Critical Temperature Trip register is used

to provide an additional critical temperature limit.

REGISTER 5-1:

REGISTER POINTER (WRITE ONLY)

W-0

—

W-0

—

W-0

—

W-0

—

W-0

Pointer Bits

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 7-4

Writable Bits: Write ‘0’’

Bits 7-4 must always be cleared or written to ‘0’. This device has additional registers that are reserved

for test and calibration. If these registers are accessed, the device may not perform according to the

specification.

bit 3-0

Pointer Bits:

0000= Capability register

0001= Configuration register (CONFIG)

0010= Event Temperature Upper-Boundary Trip register (T_UPPER

)

0011= Event Temperature Lower-Boundary Trip register (T_LOWER

)

0100 = Critical Temperature Trip register (T_CRIT

0101= Temperature register (T_A)

0110= Manufacturer ID register

0111= Device ID/Revision register

1000= Resolution register

)

1XXX= Reserved

DS21996D-page 14

 2010 Microchip Technology Inc.

MCP98242

TABLE 5-1:

BIT ASSIGNMENT SUMMARY FOR ALL REGISTERS (SEE SECTION 5.4)

Register

Pointer

(Hex)

Bit Assignment

MSB/

LSB

7

6

5

4

3

2

1

0

0x00

0x01

0x02

0x03

0x04

0x05

0x06

0x07

0x08

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

0

Resolution

0

Range

Accuracy

Event

SHDN

Evt Pol

0

Crt Loc

0

Win Loc

0

Int Clr

0

Hysteresis

Evt Stat

SIGN

Evt Cnt

Evt Sel

Evt Pol

7

6

5

4

2 °C

3

2

1

0

-1

-2

2 °C

0

7

6

5

4

0

SIGN

2 °C

3

2

1

0

-1

-2

2 °C

0

7

6

5

4

0

SIGN

2 °C

3

2

1

0

-1

-2

2 °C

0

7

6

5

4

T

T

T

T

T

T

SIGN

2 °C

A

CRIT

A

UPPER

A

LOWER

3

2

1

0

-1

-2

2 °C

0

1

0

1

0

1

0

1

0

1

0

 2010 Microchip Technology Inc.

DS21996D-page 15

MCP98242

5.1.1

CAPABILITY REGISTER

This is a read-only register used to identify the

temperature sensor capability. In this case, the

MCP98242 is capable of providing temperature at

0.25°C resolution, measuring temperature below and

above 0°C, providing ±1°C and ±2°C accuracy over the

active and monitor temperature ranges (respectively)

and providing user-programmable temperature event

boundary trip limits. Register 5-2 describes the

Capability register. These functions are described in

further detail in the following sections.

REGISTER 5-2:

CAPABILITY REGISTER (READ-ONLY)  ADDRESS ‘0000 0000’b

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

bit 15

bit 8

U-0

—

U-0

—

U-0

—

R-0

R-1

Resolution

Meas Range

Accuracy

Temp Alarm

bit 0

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-5

bit 4-3

Unimplemented: Read as ‘0’

Resolution:

00= 0.5°C

01= 0.25°C (power-up default)

10= 0.125°C

11= 0.0625°C

These bits reflect the selected resolution (see Section 5.2.3.3 “Temperature Resolution”)

bit 2

bit 1

Temperature Measurement Range (Meas. Range):

0= T_A0(decimal) for temperature below 0°C

1= The part can measure temperature below 0°C (power-up default)

Accuracy:

0= Accuracy ±2°C from +75°C to +95°C (Active Range) and ±3°C from +40°C to +125°C

(Monitor Range)

1= Accuracy ±1°C from +75°C to +95°C (Active Range) and ±2°C from +40°C to +125°C

(Monitor Range)

bit 0

Temperature Alarm:

0= No defined function (This bit will never be cleared or set to ‘0’).

1= The part has temperature boundary trip limits (T_UPPER/T_LOWER/T_CRITregisters) and a

temperautre event output (JC 42.4 required feature).

DS21996D-page 16

 2010 Microchip Technology Inc.

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0 0 0 0 0

W

2 1 0

Address Byte

Capability Pointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

2

A

1 0

A

S

0 0 1 1

0 0 0 0 0 0 0 0

0 0 0 0 1

1 1 1

P

R

SDA

MSB Data

Address Byte

LSB Data

Master

MCP98242

Master

FIGURE 5-2:

Timing Diagram for Reading the Capability Register (See Section 4.0 “Serial

Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 17

MCP98242

The Continuous Conversion or Shutdown mode is

selected using bit 8. In Shutdown mode, the band gap

5.1.2

SENSOR CONFIGURATION

REGISTER (CONFIG)

temperature

sensor

circuit

stops

converting

The MCP98242 has a 16-bit Configuration register

(CONFIG) that allows the user to set various functions

for a robust temperature monitoring system. Bits 10

thru 0 are used to select Event output boundary

hysteresis, device Shutdown or Low-Power mode,

temperature boundary and critical temperature lock,

temperature Event output enable/disable. In addition,

the user can select the Event output condition (output

set for T_UPPERand T_LOWERtemperature boundary or

T_CRITonly), read Event output status and set Event

output polarity and mode (Comparator Output or

Interrupt Output mode).

temperature and the Ambient Temperature register

(T_A) holds the previous successfully converted

temperature data (see Section 5.2.1 “Shutdown

Mode”). Bits

7 and 6 are used to lock the

user-specified boundaries T_UPPER, T_LOWERand T_CRIT

to prevent an accidental rewrite. Bits 5 thru 0 are used

to configure the temperature Event output pin. All

functions are described in Register 5-3 (see

Section 5.2.3 “Event Output Configuration”).

The temperature hysteresis bits 10 and 9 can be used

to prevent output chatter when the ambient

temperature

gradually

changes

beyond

the

user-specified

temperature

boundary

(see

Section 5.2.2 “Temperature Hysteresis (T_HYST)”.

REGISTER 5-3:

CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b

U-0

—

U-0

—

U-0

—

U-0

—

U-0

—

R/W-0

SHDN

T_HYST

bit 15

bit 8

R/W-0

Crit. Lock

bit 7

R/W-0

R-0

R/W-0

Event Mod.

bit 0

Win. Lock

Int. Clear

Event Stat. Event Cnt.

Event Sel.

Event Pol.

Legend:

R = Readable bit

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

-n = Value at POR

bit 15-11

bit 10-9

Unimplements: Read as ‘0’

T_UPPERand T_LOWERLimit Hysteresis (T_HYST):

00= 0°C (power-up default)

01= 1.5°C

10= 3.0°C

11= 6.0°C

This bit cannot be altered when either of the lock bits are set (bit 6 and bit 7), refer to Section 5.2.3

“Event Output Configuration”.

bit 8

Shutdown Mode (SHDN):

0= Continuous Conversion (power-up default)

1= Shutdown (Low-Power mode)

In shutdown, all power-consuming activities are disabled, though all registers can be written to or read.

This bit cannot be set ‘1’ when either of the lock bits is set (bit 6 and bit 7). However, it can be cleared

‘0’ for Continuous Conversion while locked. (Refer to Section 5.2.1 “Shutdown Mode”)

DS21996D-page 18

 2010 Microchip Technology Inc.

MCP98242

REGISTER 5-3:

CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b

bit 7

T_CRITLock Bit (Crit. Lock):

0= Unlocked. T_CRITregister can be written. (power-up default)

1= Locked. T_CRITregister cannot be written

When enabled, this bit remains set ‘1’ or locked until cleared by internal Reset (Section 5.4 “Sum-

mary of Temperature Sensor Power-on Default”). This bit does not require a double-write.

bit 6

T_UPPERand T_LOWERWindow Lock Bit (Win. Lock):

0= Unlocked. T_UPPERand T_LOWERregisters can be written. (power-up default)

1= Locked. T_UPPERand T_LOWERregisters cannot be written

When enabled, this bit remains set ‘1’ or locked until cleared by internal Reset (Section 5.4 “Sum-

mary of Temperature Sensor Power-on Default”). This bit does not require a double-write.

bit 5

bit 4

bit 3

Interrupt Clear (Int. Clear) Bit:

0= No effect (power-up default)

1= Clear interrupt output. When read this bit returns ‘0’

Event Output Status (Event Stat.) Bit:

0= Event output is not asserted by the device (power-up default)

1= Event output is asserted as a comparator/Interrupt or critical temperature output

Event Output Control (Event Cnt.) Bit:

0= Disabled (power-up default)

1= Enabled

This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).

bit 2

Event Output Select (Event Sel.) Bit:

0= Event output for T_UPPER, T_LOWERand T_CRIT(power-up default)

1= T_A> T_CRITonly. (T_UPPERand T_LOWERtemperature boundaries are disabled.)

When the Alarm Window Lock bit is set, this bit cannot be altered until unlocked (bit 6).

bit 1

bit 0

Event Output Polarity (Event Pol.) Bit:

0= Active-low (power-up default)

1= Active-high

This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).

Event Output Mode (Event Mod.) Bit:

0= Comparator output (power-up default)

1= Interrupt output

This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).

 2010 Microchip Technology Inc.

DS21996D-page 19

MCP98242

• Writing to the CONFIG Register to Enable the Event Output pin <0000 0000 0000 1000>b.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

W

0 0 0 0 0

0 0 1

2 1 0

Address Byte

Configuration Pointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A

C

K

A

C

K

0 0 0 0 0

P

0 0 0

0 0 0 0 1 0 0 0

MSB Data

LSB Data

MCP98242

• Reading the CONFIG Register.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

Note:

It is not necessary to

select the Register

Pointer if it was set

from the previous read/

write.

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0 0

0 0 1

W

2 1 0

Address Byte

Configuration Pointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

0 0 0 0 0 0 0 0

0 0 0 0 1

S 0 0 1 1

R

0 0 0

P

SDA

2 1 0

Address Byte

LSB Data

MSB Data

Master

MCP98242

FIGURE 5-3:

Timing Diagram for Writing and Reading from the Configuration Register (See

Section 4.0 “Serial Communication”).

DS21996D-page 20

 2010 Microchip Technology Inc.

MCP98242

5.1.3

UPPER/LOWER/CRITICAL

TEMPERATURE LIMIT REGISTERS

(T_UPPER/T_LOWER/T_CRIT

)

The MCP98242 has a 16-bit read/write Event output

Temperature Upper-Boundary Trip register (T_UPPER), a

16-bit Lower-Boundary Trip register (T_LOWER) and a

16-bit Critical Boundary Trip register (T_CRIT) that

contains 11-bit data in two’s complement format

(0.25 °C). This data represents the maximum and

minimum temperature boundary or temperature

window that can be used to monitor ambient

temperature. If this feature is enabled (Section 5.1.2

“Sensor Configuration Register (CONFIG)”) and the

ambient temperature exceeds the specified boundary

or window, the MCP98242 asserts an Event output.

(Refer

to

Section 5.2.3

“Event

Output

Configuration”).

REGISTER 5-4:

UPPER/LOWER/CRITICAL TEMPERATURE LIMIT REGISTER (T_UPPER/T_LOWER

_CRIT)  ADDRESS ‘0000 0010’b/‘0000 0011’b‘0000 0100’b

/

T

U-0

—

U-0

—

U-0

R/W-0

2⁷°C

R/W-0

2⁶°C

R/W-0

2⁵°C

R/W-0

2⁴°C

—

Sign

bit 15

bit 8

bit 0

R/W-0

2³°C

R/W-0

2²°C

R/W-0

2¹°C

R/W-0

2⁰°C

R/W-0

2^-1°C

R/W-0

2^-2°C

U-0

—

U-0

—

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-13

bit 12

Unimplemented: Read as ‘0’

Sign:

0= T_A0°C

1= T_A 0°C

bit 11-2

T_UPPER/T_LOWER/T_CRIT:

Temperature boundary trip data in two’s complement format.

bit 1-0

Unimplemented: Read as ‘0’

Note:

This table shows two 16-bit registers for T_UPPER, T_LOWERand T_CRITlocated at ‘0000 0010b’,

‘0000 0011b’ and ‘0000 0100b’, respectively.

 2010 Microchip Technology Inc.

DS21996D-page 21

MCP98242

• Writing 90°C to the T_UPPERRegister <0000 0101 1010 0000>b.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

W

0 0 0 0 0 0 1 0

2 1 0

Address Byte

T_UPPERPointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A

C

K

A

C

K

0 0 0 0 0

P

1 0 1

1 0 1 0 0 0 0 0

MSB Data

LSB Data

MCP98242

• Reading from the T_UPPERRegister.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

Note:

It is not necessary to

select the Register

Pointer if it was set from

the previous read/write.

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0 0

0 1 0

W

2 1 0

Address Byte

T_UPPERPointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

0 0 0 0 0 1 0 1

1 0 1 0 0

S 0 0 1 1

R

0 0 0

P

SDA

2 1 0

Address Byte

LSB Data

MSB Data

Master

MCP98242

FIGURE 5-4:

Timing Diagram for Writing and Reading from the T_UPPERRegister (See Section 4.0

“Serial Communication”).

DS21996D-page 22

 2010 Microchip Technology Inc.

MCP98242

5.1.4

AMBIENT TEMPERATURE

REGISTER (T_A)

EQUATION 5-1:

DECIMAL CODE TO

TEMPERATURE

CONVERSION

The MCP98242 uses a band gap temperature sensor

circuit to output analog voltage proportional to absolute

temperature. An internal  ADC is used to convert the

analog voltage to a digital word. The converter

resolution is set to 0.25 °C + sign (11-bit data). The

digital word is loaded to a 16-bit read-only Ambient

Temperature register (T_A) that contains 11-bit

temperature data in two’s complement format.

T_A= Code  2^–4

Where:

T_A= Ambient Temperature (°C)

Code = MCP98242 temperature output

magnitude in decimal (bits 0-11)

The T_Aregister bits (bits 12 thru 0) are double-buffered.

Therefore, the user can access the register while, in the

background, the MCP98242 performs an analog-to-

digital conversion. The temperature data from the 

ADC is loaded in parallel to the T_Aregister at t_CONV

refresh rate.

In addition, the T_Aregister uses three bits (bits 15, 14

and 13) to reflect the Event pin state. This allows the

user to identify the cause of the Event output trigger

(see Section 5.2.3 “Event Output Configuration”);

bit 15 is set to ‘1’ if T_Ais greater than or equal to T_CRIT

bit 14 is set to ‘1’ if T_Ais greater than T_UPPERand bit 13

is set to ‘1’ if T_Ais less than T_LOWER

,

The T_Amagnitude in decimal to ambient temperature

conversion is shown in Equation 5-1:

.

The T_Aregister bit assignment and boundary

conditions are described in Register 5-5.

REGISTER 5-5:

AMBIENT TEMPERATURE REGISTER (T_A)  ADDRESS ‘0000 0101’b

R-0

T_Avs. T_CRITT_Avs. T_UPPERT_Avs. T_LOWER

bit 15

SIGN

2⁷°C

2⁶°C

2⁵°C

2⁴°C

bit 8

R-0

2³°C

R-0

2²°C

R-0

2¹°C

R-0

2⁰°C

R-0

2^-1°C

R-0

2^-2°C

R-0

—

R-0

—

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15

bit 14

bit 13

bit 12

T_Avs. T_CRIT⁽1⁾Bit:

0 = T_AT_CRIT

1 = T_AT_CRIT

T_Avs. T_UPPER⁽1⁾Bit:

0= T_AT_UPPER

1= T_AT_UPPER

T_Avs. T_LOWER⁽1⁾Bit:

0= T_AT_LOWER

1= T_AT_LOWER

SIGN Bit:

0= T_A0°C

1= T_A 0°C

bit 11-2

bit 1-0

Ambient Temperature (T_A) Bits:

10-bit Ambient Temperature data in two’s complement format.

T_A: Data in 2’s complement format. Depending on the status of the Resolution Register (Register 5-8),

these bits may display 2^-3°C (0.125°C) and 2^-4°C (0.0625°C), respectively.

Note 1: Not affected by the status of the Event output Configuration (bits 5 to 0 of CONFIG), Register 5-3.

 2010 Microchip Technology Inc.

DS21996D-page 23

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

Note:

It is not necessary to

select the Register

Pointer if it was set

from the previous read/

write.

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0 0

1 0 1

W

2 1 0

Address Byte

T_APointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

0 0 0 0 0

S 0 0 1 1

R

0 0 1

1 0 0 1 0 1 0 0

P

SDA

2 1 0

Address Byte

LSB Data

MSB Data

Master

MCP98242

FIGURE 5-5:

Timing Diagram for Reading +25.25°C Temperature from the T_ARegister (See

Section 4.0 “Serial Communication”).

DS21996D-page 24

 2010 Microchip Technology Inc.

MCP98242

5.1.5

MANUFACTURER ID REGISTER

This register is used to identify the manufacturer of the

device in order to perform manufacturer specific

operation. The Manufacturer ID for the MCP98242 is

0x0054 (hexadecimal).

REGISTER 5-6:

MANUFACTURER ID REGISTER (READ-ONLY)  ADDRESS ‘0000 0110’b

R-0

Manufacturer ID

bit 15

R-0

bit 8

bit 0

R-1

R-0

R-1

R-0

R-1

R-0

Manufacturer ID

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-0

.

Device Manufacturer Identification Number

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

Note:

It is not necessary to

select the Register

Pointer if it was set

from the previous read/

write.

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0

0

1 1 0

W

2 1 0

Address Byte

Manuf. ID Pointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

0 0 0 0 0 0 0 0

0 1 0 1 0

S 0 0 1 1

R

1 0 0

P

SDA

2 1 0

Address Byte

LSB Data

MSB Data

Master

MCP98242

FIGURE 5-6:

Timing Diagram for Reading the Manufacturer ID Register (See Section 4.0 “Serial

Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 25

MCP98242

5.1.6

DEVICE ID AND REVISION

REGISTER

The upper byte of this register is used to specify the

device identification and the lower byte is used to

specify device revision. The device ID for the

MCP98242 is 0x21 (hex).

The revision begins with 0x00 (hex) for the first release,

with the number being incremented as revised versions

are released.

REGISTER 5-7:

DEVICE ID AND DEVICE REVISION (READ-ONLY)  ADDRESS ‘0000 0111’b

R-0

R-1

R-0

Device ID

bit 15

R-0

bit 8

bit 0

R-0

R-1

Device Revision

bit 7

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 15-8

bit 7-0

Device ID: Bit 15 to bit 8 are used for device ID

Device Revision: Bit 7 to bit 0 are used for device revision

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

Note:

It is not necessary to

select the Register

Pointer if it was set

from the previous read/

write.

SCLK

SDA

A

C

K

A

C

K

A

S 0 0 1 1

0 0 0 0 0 1 1 1

W

2 1 0

Address Byte

Device ID Pointer

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

N

A

K

A

0 0 1 0 0 0 0 0

S 0 0 1 1

0 0 0 0 0 0 0 0

P

R

SDA

2 1 0

Address Byte

LSB Data

MSB Data

Master

MCP98242

FIGURE 5-7:

Timing Diagram for Reading Device ID and Device Revision Register (See Section 4.0

“Serial Communication”).

DS21996D-page 26

 2010 Microchip Technology Inc.

MCP98242

5.1.7

RESOLUTION REGISTER

This register allows the user to change the sensor

resolution (see Section 5.2.3.3 “Temperature

Resolution”). The POR default resolution is 0.25°C.

The selected resolution is also reflected in the

Capability register (see Register 5-2).

REGISTER 5-8:

RESOLUTION  ADDRESS ‘0000 1000’b

U-0

—

U-0

—

R/W-0

—

Resolution

bit 7

bit 0

Legend:

R = Readable bit

-n = Value at POR

W = Writable bit

‘1’ = Bit is set

U = Unimplemented bit, read as ‘0’

‘0’ = Bit is cleared x = Bit is unknown

bit 7-2

bit 1-0

Unimplemented: Read as ‘0’

Resolution:

00= LSB = 0.5°C (t_CONV= 30 ms typical)

01= LSB = 0.25°C (power-up default, t_CONV= 65 ms typical)

10= LSB = 0.125°C (t_CONV= 130 ms typical)

11= LSB = 0.0625°C (t_CONV= 260 ms typical)

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

A

C

K

A

C

K

A

C

K

A

S 0 0 1 1

W

0 0 0 0 1 0 0 0

0 0 0 0 0

SDA

0 1 1

P

2 1 0

Address Byte

Resolution Pointer

Data

MCP98242

FIGURE 5-8:

Timing Diagram for Changing T_AResolution to 0.0625°C <0000 0011>b (See

Section 4.0 “Serial Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 27

MCP98242

The Event output can also be used as a critical

temperature output using bit 2 of CONFIG (critical

output only). When this feature is selected, the Event

output becomes a comparator output. In this mode, the

interrupt output configuration (bit 0 of CONFIG) is

ignored.

5.2

SENSOR FEATURE DESCRIPTION

5.2.1

SHUTDOWN MODE

Shutdown mode disables all power-consuming

activities (including temperature sampling operations)

while leaving the serial interface active. This mode is

selected by setting bit 8 of CONFIG to ‘1’. In this mode,

the device consumes I_SHDN. It remains in this mode

until bit 8 is cleared ‘0’ to enable Continuous

Conversion mode, or until power is recycled.

5.2.3.1

Comparator Mode

Comparator mode is selected using bit 0 of CONFIG. In

this mode, the Event output is asserted as active-high

or active-low using bit 1 of CONFIG. Figure 5-2 shows

the conditions that toggle the Event output.

The Shutdown bit (bit 8) cannot be set to ‘1’ while bits

6 and 7 of CONFIG (Lock bits) are set to ‘1’. However,

it can be cleared ‘0’ or returned to Continuous

Conversion while locked.

If the device enters Shutdown mode with asserted

Event output, the output remains asserted during

Shutdown. The device must be operating in

Continuous Conversion mode for t_CONV; the T_Avs.

T_UPPER, T_LOWERand T_CRITboundary conditions need

to be satisfied in order for the Event output to deassert.

In Shutdown mode, all registers can be read or written.

However, the serial bus activity increases the shutdown

current. In addition, if the device is shutdown while the

Event pin is asserted as active-low or deasserted

active-low (see Section 5.2.3.1 “Comparator Mode”),

the device will retain the active-low state. This

increases the shutdown current due to the additional

Event output pull-down current.

Comparator mode is useful for thermostat-type

applications, such as turning on a cooling fan or

triggering a system shutdown when the temperature

exceeds a safe operating range.

5.2.3.2

Interrupt Mode

5.2.2

TEMPERATURE HYSTERESIS

(T_HYST

A hysteresis of 0°C, 1.5°C, 3°C or 6°C can be selected

for the T_UPPERT_LOWERand T_CRITtemperate

)

In the Interrupt mode, the Event output is asserted as

active-high or active-low (depending on the polarity

configuration) when T_Adrifts above or below T_UPPER

and T_LOWERlimits. The output is deasserted by setting

bit 5 (Interrupt Clear) of CONFIG. Note that when

switching from Comparator mode to Interrupt mode, it

is recommended to send interrupt clear command (set

bit 5) to reset the interrupt flag. Shutting down the

device will not reset or deassert the Event output. This

mode cannot be selected when the Event output is

used as critical temperature output only, using bit 2 of

CONFIG. This mode is designed for interrupt driven

microcontroller-based systems. The microcontroller

receiving the interrupt will have to acknowledge the

interrupt by setting bit 5 of CONFIG register from the

MCP98242.

,

boundaries using bits 10 and 9 of CONFIG. The

hysteresis applies for decreasing temperature only (hot

to cold), or as temperature drifts below the specified

limit.

The T_UPPER, T_LOWERand T_CRITboundary conditions

are described graphically in Figure 5-2.

5.2.3

EVENT OUTPUT CONFIGURATION

The Event output can be enabled using bit 3 of

CONFIG (Event output control bit) and can be

configured as either a comparator output or as Interrupt

Output mode using bit 0 of CONFIG (Event mode). The

polarity can also be specified as an active-high or

active-low using bit 1 of CONFIG (Event polarity).

5.2.3.3

Temperature Resolution

When the ambient temperature increases above the

critical temperature limit, the Event output is forced to a

comparator output (regardless of bit 0 of CONFIG).

When the temperature drifts below the critical

temperature limit minus hysteresis, the Event output

automatically returns to the state specified by bit 0 of

CONFIG.

The MCP98242 is capable of providing a temperature

data with 0.5°C to 0.0625°C resolution. The Resolution

can be selected using the Resolution register

(Register 5-8) which is located in address

‘00001000’b. This address location is not specified in

JEDEC Standard JC42.4. However, it provides

additional flexibility while being functionally compatible

with JC42.4 and provide a 0.25°C resolution at 125 ms

(maximum). The selected resolution can be read by

user using bit 4 and bit 3 of the Capability register

(Register 5-2). A 0.25°C resolution is set as POR

default by factory.

The status of the Event output can be read using bit 4

of CONFIG (Event status).

Bit 7 and 6 of the CONFIG register can be used to lock

the T_UPPER, T_LOWERand T_CRITregisters. The bits

prevent false triggers at the Event output due to an

accidental rewrite to these registers.

DS21996D-page 28

 2010 Microchip Technology Inc.

MCP98242

TABLE 5-2:

TEMPERATURE

CONVERSION TIME

t_CONV

(ms)

Samples/sec

(typical)

Resolution

0.5°C

30

65

33

15

0.25°C

(POR default)

0.125°C

130

260

8

4

0.0625°C

T_CRIT- T_HYST

T_CRIT

T_UPPER- T_HYST

T_UPPER

T_A

T_LOWER-T_HYST

T_LOWER

T_LOWER-T_HYST

Comparator

Interrupt

S/w Int. Clear

Critical Only

Note:

1

3

5

1

4

*

6 4

2

Event Output

Comparator Interrupt

T_ABits

14

Event Output Boundary

Conditions

Note

Critical

15

13

1

2

3

4

5

6

T_A T_LOWER

T_A T_LOWER- T_HYST

T_A T_UPPER

H

L

H

L

H

L

0

1

0

1

0

1

0

1

0

T_A T_UPPER- T_HYST

T_A T_CRIT

T_A T_CRIT- T_HYST

H

*

When T_A T_CRITand T_A T_CRIT- T_HYSTthe Event output is Comparator mode and bits 0 of

CONFIG (Event output mode) is ignored.

FIGURE 5-9:

Event Output Condition.

 2010 Microchip Technology Inc.

DS21996D-page 29

MCP98242

5.3

EEPROM FEATURE

DESCRIPTION

5.3.1

BYTE WRITE

To write a byte in the MCP98242 EEPROM, the master

has to specify the memory location or address. Once

the address byte is transmitted correctly followed by a

word address, the word address is stored in the

EEPROM Address Pointer. The following byte is data

to be stored in the specified memory location.

Figure 5-10 shows the timing diagram.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

C

K

A

S 1 0 1 0

X

W

X

P

2 1 0

Address Byte

Word Address

Data

MCP98242

FIGURE 5-10:

Timing Diagram for Byte Write (See Section 4.0 “Serial Communication”).

DS21996D-page 30

 2010 Microchip Technology Inc.

MCP98242

5.3.2

PAGE WRITE

Note:

Page write operations are limited to writing

bytes within a single physical page,

regardless of the number of bytes actually

being written. Physical page boundaries

start at addresses that are integer

multiples of the page buffer size (or ‘page

size’) and end at addresses that are

integer multiples of [page size - 1]. If a

Page Write command attempts to write

across a physical page boundary, the

result is that the data wraps around to the

beginning of the current page (overwriting

data previously stored there), instead of

being written to the next page, as might be

expected. It is therefore necessary for the

application software to prevent page write

operations that would attempt to cross a

page boundary.

The write Address Byte, word address and the first data

byte are transmitted to the MCP98242 in the same way

as in a byte write. Instead of generating a Stop

condition, the master transmits up to 15 additional data

bytes to the MCP98242, which are temporarily stored

in the on-chip page buffer and will be written into the

memory after the master has transmitted a Stop

condition. Upon receipt of each word, the four lower

order Address Pointer bits are internally incremented

by one. The higher order four bits of the word address

remain constant. If the master should transmit more

than 16 bytes prior to generating the Stop condition, the

address counter will roll over and the previously

received data will be overwritten. As with the byte write

operation, once the Stop condition is received, an

internal write cycle will begin (Figure 5-11).

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 1 0 1 0

W

X

2 1 0

Address Byte

Word Address (n)

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A

C

K

A

C

K

A

C

K

X

P

Data at (n)

Data at (n+1)

Data at (n+15)

MCP98242

Note:

MCP98242

‘n’ is the initial address for a page.

MCP98242

FIGURE 5-11:

Timing Diagram for Page Write (See Section 4.0 “Serial Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 31

MCP98242

To access write protection, the device address code of

the Address Byte is set to ‘0110’ instead of ‘1010’.

The ‘1010’ Address code is used to access the mem-

ory area and the ‘0110’ address code is used to

access the write protection. Once the device is write-

protected it will not acknowledge certain commands.

Table 5-3 shows the corresponding Address Bytes for

the write-protect feature.

5.3.3

WRITE PROTECTION

The MCP98242 has a Software Write-Protect (SWP)

feature that allows the lower half array (addresses

00h - 7Fh) to be write-protected or permanently

write-protected (PWP). The write-protected area can

be cleared by sending Clear Write-Protect (CWP)

command. However, once the PWP is executed the

protected memory can not be cleared. The device will

not respond to the CWP command.

TABLE 5-3:

WRITE-PROTECT DEVICE ADDRESSING

Address Pins

Address Byte

Slave Address

EEPROM

Operation

A2

A1

A0

Address Code

R/W

A2

A1

A0

SWP

CWP

WRITE

READ

WRITE

READ

WRITE

READ

GND GND V_{HI_A0}

0110

0

1

0

1

0

1

0

1

GND V_DDV_{HI_A0}

0110

0

X

1

X

1

X

PWP (Note)

X

Note:

The address pins are ‘X’ or don’t cares. However, the slave address bits need to match the address pins.

TABLE 5-4:

Status

DEVICE RESPONSE WHEN WRITING DATA OR ACCESSING SWP/CWP/PWP

Command

ACK Address ACK Data Byte ACK Write Cycle

Not

Protected

SWP/CWP/PWP

Page/byte write

SWP

ACK

X

ACK

X

Data

X

ACK

Yes

No

Address

Protected

with

SWP

NoACK

ACK

X

NoACK

ACK

NoACK

ACK

CWP

X

Yes

No

PWP

ACK

X

ACK

Page/byte write lower 128 bytes

SWP/CWP/PWP

Page/byte write lower 128 bytes

ACK

Address

X

ACK

Data

X

NoACK

Permanently

Protected

NoACK

ACK

NoACK

ACK

No

Address

Data

No

Note:

X is defined as ‘don’t care’.

DS21996D-page 32

 2010 Microchip Technology Inc.

MCP98242

The Slave Address bits need to correspond to the

address pin logic configuration. For SWP, a high

voltage V_{HI_WP}needs to be applied to the A0 pin and

the corresponding slave address needs to be set to ‘1’,

as shown in Table 5-3. Both A2 and A1 pins are

grounded and the corresponding slave address bits are

set to ‘0’.

5.3.3.1

Software Write-Protect (SWP)

The SWP feature is invoked by writing to the

write-protect register. This is done by sending an

Address Byte similar to a normal Write command.

Figure 5-14 shows the timing diagram. SWP can be

cleared

using

the

CWP

command.

See

Section 5.3.3.2 “Clear Write-Protect (CWP)”.

The device response in this mode is shown in

Table 5-4 and Table 5-5.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

C

K

S 0 1 1 0 0 0 1

X

W

X

P

Address Byte

Word Address

Data

MCP98242

Note:

Apply V_{HI_WP}at A0 pin and connect GND to A1 and A2 pins to initiate SWP cycle.

FIGURE 5-12:

Communication”).

Timing Diagram for Setting Software Write-Protect (See Section 4.0 “Serial

The Slave Address bits need to correspond to the

address pin logic configuration. For CWP, a high

voltage V_{HI_WP}needs to be applied to the A0 pin and

the corresponding slave address needs to be set to ‘1’.

The A1 pin is set to V_DDand the corresponding slave

address bit is set to ‘1’. And A2 pin is set to ground

and the corresponding slave address bits are set to ‘0’.

Table 5-3 shows the bit configuration. The device

response in this mode is shown in Table 5-4 and

Table 5-5.

5.3.3.2

Clear Write-Protect (CWP)

The CWP feature is invoked by writing to the clear

write-protect register. This is done by sending an

Address Byte similar to a normal Write command.

Figure 5-14 shows the timing diagram. CWP clears

SWP only. PWP can not be cleared using this

command.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

C

K

S 0 1 1 0 0 1 1

W

X

P

Address Byte

Word Address

Data

MCP98242

Note:

Apply V_{HI_WP}at A0 pin, apply V_DDat A1 pin, connect A2 pin to GND to initiate CWP cycle.

FIGURE 5-13:

Timing Diagram for Setting Clear Write-Protect (See Section 4.0 “Serial

Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 33

MCP98242

5.3.3.3

PWP (Permanent Write-Protect)

Note: Once the Permanent Write-Protect is

executed, it cannot be reversed, even if

the device power is cycled.

Once the PWP register is written, the lower half of the

memory will be permanent protected and the device

will not acknowledge any command. The protected

area of the memory can not be cleared, reversed, or

re-written. If a write is attempted to the protected area,

the device will acknowledge the address byte and word

address but not the data byte. (See Table 5-4 and

Table 5-5).

Unlike SWP and CWP, a V_{HI_WP}is not applied on the

A0 pin to execute PWP. The state of A2, A1, and A0 is

user selectable. However, the address pin states need

to match the slave address bits, as shown in Table 5-3.

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

C

K

A

S 0 1 1 0

W

X

P

2 1 0

Address Byte

Word Address

Data

MCP98242

Note:

Unlike SWP and CWP, a V_{HI_WP}is not applied on the A0 pin to execute PWP.

FIGURE 5-14:

Timing Diagram for Setting Permanently Write-Protect (See Section 4.0 “Serial

Communication”).

DS21996D-page 34

 2010 Microchip Technology Inc.

MCP98242

5.3.4

READ OPERATION

Read operations are initiated in the same way as write

operations, with the exception that the R/W bit of the

slave address is set to ‘1’. There are three basic types

of read operations: current address read, random read,

and sequential read.

TABLE 5-5:

Status

DEVICE RESPONSE WHEN READING SWP/CWP/PWP

Command

ACK

Address

ACK

Data Byte

ACK

Not Protected

SWP/CWP/PWP

SWP

ACK

NoACK

ACK

X

NoACK

X

NoACK

Protected with SWP

CWP

PWP

ACK

Permanently Protected

SWP/CWP/PWP

NoACK

Note:

X is defined as ‘don’t care’.

5.3.4.1

Current Address Read

The MCP98242 contains an address counter that

maintains the address of the last word accessed,

internally incremented by ‘1’. Therefore, if the previous

access (either a read or write operation) was to

address n, the next current address read operation

would access data from address n+1. Upon receipt of

the slave address with R/W bit set to ‘1’, the MCP98242

issues an Acknowledge and transmits the 8-bit data

word. The master will not acknowledge (NAK) the

transfer but does generate a Stop condition and the

MCP98242 discontinues transmission (Figure 5-15).

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

N

A

K

A

S 1 0 1 0

R

0 0 0 0 0 0 0 0

P

2 1 0

Address Byte

Current Word Address

Master

MCP98242

Note:

In this example, the current word address is the

previously accessed address location n plus 1.

FIGURE 5-15:

Reading Current Word Address (See Section 4.0 “Serial Communication”).

 2010 Microchip Technology Inc.

DS21996D-page 35

MCP98242

5.3.4.2

Random Read

Random read operations allow the master to access

any memory location in a random manner. To perform

this type of read operation, the word address must first

be set. This is done by sending the word address to the

MCP98242 as part of a write operation. Once the word

address is sent, the master generates a Start condition

following the Acknowledge. This terminates the write

operation, but not before the internal Address Pointer is

set. The master then issues the Address Byte again,

but with the R/W bit set to a ‘1’. The MCP98242 then

issues an Acknowledge and transmits the 8-bit data

word. The master will not acknowledge the transfer but

does generate a Stop condition and the MCP98242

discontinues transmission (Figure 5-16).

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 1 0 1 0

0 0 0 0 0

0 0 0

W

2 1 0

Address Byte

Word Address (n)

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

N

A

K

A

S 1 0 1 0

R

X

P

2 1 0

Address Byte

Data at (n)

Master

MCP98242

Note:

In this example, ‘n’ is the current Address Word which ‘00’h and the data is the byte at address ‘n’.

FIGURE 5-16:

Timing Diagram for Random Read (See Section 4.0 “Serial Communication”).

DS21996D-page 36

 2010 Microchip Technology Inc.

MCP98242

To provide sequential reads, the MCP98242 contains

an internal Address Pointer, which is incremented by

one at the completion of each operation. This Address

Pointer allows the entire memory contents to be serially

read during one operation.

5.3.4.3

Sequential Read

Sequential reads are initiated in the same way as a

random read, with the exception that after the

MCP98242 transmits the first data byte, the master

issues an Acknowledge, as opposed to a Stop condi-

tion in a random read. This directs the MCP98242 to

transmit the next sequentially addressed 8-bit word

(Figure 5-17).

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

SCLK

SDA

A

C

K

A

C

K

A

S 1 0 1 0

R

X

2 1 0

Data (n)¹

Address Byte

MCP98242

1

2

3

4

5

6

7

8

1

2

3

4

5

6

7

8

A

C

K

A

N

A

K

C

X

P

K

Data at (n+m)⁽¹⁾

Data at (n+1)

Data at (n+2)

MCP98242

Master

Note 1: ‘n’ is the initial address location and ‘m’ is the final address location (‘n+m’ < 256).

Timing Diagram for Sequential Read (See Section 4.0 “Serial Communication”).

FIGURE 5-17:

5.3.5

STANDBY MODE

The design will incorporate a low-power Standby mode

(I_SHDN). Standby mode will be entered after a normal

termination of any operation and after all internal

functions are complete. This would include any error

conditions occurring, such as improper number of clock

cycles or improper instruction byte as defined

previously.

 2010 Microchip Technology Inc.

DS21996D-page 37

MCP98242

5.4

Summary of Temperature Sensor

Power-on Default

The MCP98242 temperature sensor has an internal

Power-on Reset (POR) circuit. If the power supply

voltage V_DDglitches down to the V_PORthreshold, the

device resets the registers to the power-on default

settings.

Table 5-6 shows the power-on default summary.

TABLE 5-6:

POWER-ON DEFAULTS

Registers

Default Register

Power-up Default

Data (Hexadecimal)

Register Description

Address (Hexadecimal)

Register Label

0.25°

Measures temperature below 0°C

±1°C accuracy over active range

Temperature event output

0x00

Capability

0x000F

Comparator mode

Active-Low output

Event and critical output

Output disabled

Event not asserted

Interrupt cleared

0x01

CONFIG

0x0000

Event limits unlocked

Critical limit unlocked

Continuous conversion

0°C Hysteresis

0x02

0x03

0x04

0x05

0x06

0x07

0x08

T_UPPER

T_LOWER

0x0000

0x0054

0x2001

0x01

0°C

T_CRIT

0°C

T_A

0°C

Manufacturer ID

Device ID/ Device Revision

Resolution

0x0054 (hex)

0x2001 (hex)

0x01 (hex)

DS21996D-page 38

 2010 Microchip Technology Inc.

MCP98242

6.2

Layout Considerations

6.0

6.1

APPLICATIONS INFORMATION

Connecting to the Serial Bus

The MCP98242 does not require any additional

components besides the master controller in order to

measure temperature. However, it is recommended

that a decoupling capacitor of 0.1 µF to 1 µF be used

between the V_DDand GND pins. A high-frequency

ceramic capacitor is recommended. It is necessary for

the capacitor to be located as close as possible to the

power and ground pins of the device in order to provide

effective noise protection.

The SDA and SCLK serial interface pins are

open-drain pins that require pull-up resistors. This

configuration is shown in Figure 6-1.

V_DD

MCP98242

6.3

Thermal Considerations

R

A potential for self-heating errors can exist if the

MCP98242 SDA, SCLK and Event lines are heavily

loaded with pull-ups (high current). Typically, the

self-heating error is negligible because of the relatively

small current consumption of the MCP98242. A

temperature accuracy error of approximately 0.5°C

could result from self-heating if the communication pins

sink/source the maximum current specified.

SDA

SCLK

Event

Master

Slave

Pull-up Resistors On Serial

FIGURE 6-1:

Interface.

For example, if the Event output is loaded to maximum

I_OL, Equation 6-1 can be used to determine the effect

of self-heating.

The number of devices connected to the bus is limited

only by the maximum rise and fall times of the SDA and

SCLK lines. Unlike I²C specifications, SMBus does not

specify a maximum bus capacitance value. Rather, the

SMBus specification requires that the maximum

current through the pull-up resistor be 350 µA and

minimum 100 µA. Because of this, the value of the

pull-up resistors will vary depending on the system’s

bias voltage (V_DD). The pull-up resistor values for a

3.3 V system ranges 9 k to 33 k. Minimizing bus

capacitance is still very important as it directly affects

the rise and fall times of the SDA and SCLK lines.

EQUATION 6-1:

EFFECT OF

SELF-HEATING

T

=  V

 I

+ V

 I

+ V

 I 



JA DD DD

OL_Event OL_Event

OL_SDA OL_SDA

Where:

T_= T_{J -}T_A

T_J= Junction Temperature

T_A= Ambient Temperature

Although SMBus specifications only require the SDA

and SCLK lines to pull-down 350 µA, with a maximum

voltage drop of 0.4 V, the MCP98242 is designed to

meet a maximum voltage drop of 0.4 V, with 3 mA of

current. This allows lower pull-up resistor values to be

used, allowing the MCP98242 to handle higher bus

capacitance. In such applications, all devices on the

bus must meet the same pull-down current

requirements.

_JA= Package Thermal Resistance

V_{OL_Event, SDA}= Event and SDA Output V_OL

(0.4 V_max

I_{OL_Event, SDA}= Event and SDA Output I_OL

(3 mA_max

)

At room temperature (T_A= +25°C) with maximum

I_DD= 500 µA and V_DD= 3.6V, the self-heating due to

power dissipation T_is 0.2°C for the DFN-8 package

and 0.5°C for the TSSOP-8 package.

A possible configuration using multiple devices on the

SMBus is shown in Figure 6-2.

SDA SCLK

MCP98242

24LCS52

Temperature

Sensor

EEPROM

FIGURE 6-2:

SMBus.

Multiple Devices on DIMM

 2010 Microchip Technology Inc.

DS21996D-page 39

MCP98242

NOTES:

DS21996D-page 40

 2010 Microchip Technology Inc.

MCP98242

7.0

7.1

PACKAGING INFORMATION

Package Marking Information

8-Lead DFN (MC)

Example:

XXX

YWW

NN

ABJ

010

25

8-Lead TDFN (MNY)

Example:

XXX

YWW

NN

ABX

010

25

8-Lead UDFN (MUY)

Example:

XXX

YWW

NN

ABX

010

25

Example:

8-Lead TSSOP (ST)

242B

E010

256

XXXX

YYWW

NNN

Legend: XX...X Customer-specific information

Y

Year code (last digit of calendar year)

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

e

3

Pb-free JEDEC designator for Matte Tin (Sn)

*

This package is Pb-free. The Pb-free JEDEC designator (

can be found on the outer packaging for this package.

)

e3

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

 2010 Microchip Technology Inc.

DS21996D-page 41

MCP98242

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D

b

N

L

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E

EXPOSED PAD

NOTE 1

2

1

2

D2

BOTTOM VIEW

TOP VIEW

A

NOTE 2

ꢭꢄꢃꢏꢇꢢꢮꢯꢯꢮꢢꢣꢩꢣꢪꢡ

A3

A1

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ꢀꢁꢹꢥ

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ꢑꢒꢊꢃꢉꢥ

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ꢙꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢑꢉꢒꢅꢘꢉꢆꢌꢅꢕꢄꢌꢅꢕꢐꢅꢑꢕꢐꢌꢅꢌꢍꢜꢕꢇꢌꢋꢅꢏꢃꢌꢅꢔꢉꢐꢇꢅꢉꢏꢅꢌꢄꢋꢇꢁ

ꢝꢁ ꢂꢉꢖꢚꢉꢛꢌꢅꢃꢇꢅꢇꢉꢗꢅꢇꢃꢄꢛꢈꢊꢉꢏꢌꢋꢁ

ꢞꢁ ꢟꢃꢑꢌꢄꢇꢃꢕꢄꢃꢄꢛꢅꢉꢄꢋꢅꢏꢕꢊꢌꢐꢉꢄꢖꢃꢄꢛꢅꢜꢌꢐꢅꢠꢡꢢꢣꢅꢤꢀꢞꢁꢥꢢꢁ

ꢦꢡꢧꢨ ꢦꢉꢇꢃꢖꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢁꢅꢩꢘꢌꢕꢐꢌꢏꢃꢖꢉꢊꢊꢒꢅꢌꢍꢉꢖꢏꢅꢆꢉꢊꢈꢌꢅꢇꢘꢕꢗꢄꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢇꢁ

ꢪꢣꢫꢨ ꢪꢌꢎꢌꢐꢌꢄꢖꢌꢅꢟꢃꢑꢌꢄꢇꢃꢕꢄꢓꢅꢈꢇꢈꢉꢊꢊꢒꢅꢗꢃꢏꢘꢕꢈꢏꢅꢏꢕꢊꢌꢐꢉꢄꢖꢌꢓꢅꢎꢕꢐꢅꢃꢄꢎꢕꢐꢑꢉꢏꢃꢕꢄꢅꢜꢈꢐꢜꢕꢇꢌꢇꢅꢕꢄꢊꢒꢁ

ꢢꢃꢖꢐꢕꢖꢘꢃꢜ ꢩꢌꢖꢘꢄꢕꢊꢕꢛꢒ ꢟꢐꢉꢗꢃꢄꢛ ꢧꢴꢞꢺꢀꢙꢝꢧ

DS21996D-page 42

 2010 Microchip Technology Inc.

MCP98242

ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢗꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢟꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢍꢏꢑꢤ

ꢑꢒꢊꢃꢥ ꢫꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅꢡꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ

ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢃꢄꢛ

 2010 Microchip Technology Inc.

DS21996D-page 43

MCP98242

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS21996D-page 44

 2010 Microchip Technology Inc.

MCP98242

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

 2010 Microchip Technology Inc.

DS21996D-page 45

MCP98242

ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢑꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢦꢧꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢨꢍꢏꢑꢤ

ꢑꢒꢊꢃꢥ ꢫꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅꢡꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ

ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢃꢄꢛ

DS21996D-page 46

 2010 Microchip Technology Inc.

MCP98242

ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢩꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢧꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢩꢍꢏꢑꢤ

ꢑꢒꢊꢃꢥ ꢫꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅꢡꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ

ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢃꢄꢛ

 2010 Microchip Technology Inc.

DS21996D-page 47

MCP98242

ꢀꢁꢂꢃꢄꢅꢆꢇꢈꢄꢉꢊꢋꢌꢆꢍꢎꢄꢈꢆꢏꢈꢄꢊꢐꢆꢑꢒꢆꢂꢃꢄꢅꢆꢇꢄꢌꢓꢄꢔꢃꢆꢕꢖꢩꢘꢆꢙꢆꢚꢛꢜꢛꢝꢞꢧꢆꢠꢠꢆꢡꢒꢅꢢꢆꢣꢩꢍꢏꢑꢤ

ꢑꢒꢊꢃꢥ ꢫꢕꢐꢅꢏꢘꢌꢅꢑꢕꢇꢏꢅꢖꢈꢐꢐꢌꢄꢏꢅꢜꢉꢖꢚꢉꢛꢌꢅꢋꢐꢉꢗꢃꢄꢛꢇꢓꢅꢜꢊꢌꢉꢇꢌꢅꢇꢌꢌꢅꢏꢘꢌꢅꢢꢃꢖꢐꢕꢖꢘꢃꢜꢅꢂꢉꢖꢚꢉꢛꢃꢄꢛꢅꢡꢜꢌꢖꢃꢎꢃꢖꢉꢏꢃꢕꢄꢅꢊꢕꢖꢉꢏꢌꢋꢅꢉꢏꢅ

ꢘꢏꢏꢜꢨꢬꢬꢗꢗꢗꢁꢑꢃꢖꢐꢕꢖꢘꢃꢜꢁꢖꢕꢑꢬꢜꢉꢖꢚꢉꢛꢃꢄꢛ

DS21996D-page 48

 2010 Microchip Technology Inc.

MCP98242

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 2010 Microchip Technology Inc.

DS21996D-page 49

MCP98242

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS21996D-page 50

 2010 Microchip Technology Inc.

MCP98242

APPENDIX A: REVISION HISTORY

Revision D (October 2010)

The following is the list of modifications:

1. Added the UDFN package.

Revision C (July 2009)

The following is the list of modifications:

1. Updated the DFN/TDFN package throughout

document.

2. Updated Table 5-1 and Table 5-6.

3. Updated Register 5-3, Register 5-5, Register 5-

7 and Register 5-8.

4. Updated Section 5.1.6 “Device ID and

Revision Register”.

5. Added Section 5.2.3.2 “Interrupt Mode”.

6. Updated Figure 5-9.

7. Section 7.0

“Packaging

Information”:

Updated package outline drawings.

Revision B (February 2008)

The following is the list of modifications:

1. Added TDFN package throughout document.

Revision A (September 2006)

• Original Release of this Document.

 2010 Microchip Technology Inc.

DS21996D-page 51

MCP98242

NOTES:

DS21996D-page 52

 2010 Microchip Technology Inc.

MCP98242

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Examples:

PART NO.

Device

–X

X

/XXX

a)

MCP98242-BE/MC: Extended Temp.,

Grade Temperature Package

Range

8LD DFN pkg.

b)

MCP98242T-BE/MC: Tape and Reel,

Extended Temp.,

8LD DFN pkg.

Device:

Grade:

MCP98242: Digital Temperature Sensor

MCP98242T: Digital Temperature Sensor

(Tape and Reel)

c)

d)

MCP98242-BE/ST: Extended Temp.,

8LD TSSOP pkg.

MCP98242T-BE/ST: Tape and Reel,

Extended Temp.,

B

=

±1°C (max.) from +75°C to +95°C,

±2°C (max.) from +40°C to +125°C, and

±3°C (max.) from -20°C to +125°C

8LD TSSOP pkg.

e)

f)

MCP98242-BE/MNY: Extended Temp.,

8LD TDFN (nickel

palladium gold) pkg.

Temperature Range:

Package:

E

-40°C to +125°C

MCP98242-BE/MUY: Extended Temp.,

8LD UDFN (nickel

palladium gold) pkg.

MC

= Dual Flat No Lead (2x3 mm Body), 8-lead,

MCBAC⁽¹⁾= Dual Flat No Lead (2x3 mm Body), 8-lead,

MUY⁽²⁾

MNY⁽²⁾

=

Dual Flat No Lead (2x3 mm Body), 8-lead,

MNYBAC^(1,2)= Dual Flat No Lead (2x3 mm Body), 8-lead,

ST

=

Plastic Thin Shrink Small Outline

(4x4 mm Body), 8-lead

Note 1: “Y” is Nickel Palladium Gold manufacturing designator. Only available

on the TDFN and UDFN packages for this family of products.

2: “BAC” is a non-standard reel manufacturing designator. It designates

parts in 8 mm wide by 4 mm wide pitch (Tape and Reel) on a 13 inch

reel with 11k base quantity.

 2010 Microchip Technology Inc.

DS21996D-page 53

MCP98242

NOTES:

DS21996D-page 54

 2010 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

32

PIC logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,

dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,

ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial

Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified

logo, MPLIB, MPLINK, mTouch, Omniscient Code

Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,

PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,

TSHARC, UniWinDriver, WiperLock and ZENA are

trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-60932-688-3

Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC^®MCUs and dsPIC^®DSCs, KEELOQ^®code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

 2010 Microchip Technology Inc.

DS21996D-page 55

Worldwide Sales and Service

AMERICAS

ASIA/PACIFIC

EUROPE

Corporate Office

Asia Pacific Office

Suites 3707-14, 37th Floor

Tower 6, The Gateway

Harbour City, Kowloon

Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

India - Bangalore

Tel: 91-80-3090-4444

Fax: 91-80-3090-4123

Austria - Wels

Tel: 43-7242-2244-39

Fax: 43-7242-2244-393

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Fax: 480-792-7277

Technical Support:

http://support.microchip.com

Web Address:

www.microchip.com

Denmark - Copenhagen

Tel: 45-4450-2828

Fax: 45-4485-2829

India - New Delhi

Tel: 91-11-4160-8631

Fax: 91-11-4160-8632

France - Paris

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

India - Pune

Tel: 91-20-2566-1512

Fax: 91-20-2566-1513

Australia - Sydney

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Atlanta

Duluth, GA

Tel: 678-957-9614

Fax: 678-957-1455

Germany - Munich

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Japan - Yokohama

Tel: 81-45-471- 6166

Fax: 81-45-471-6122

China - Beijing

Tel: 86-10-8528-2100

Fax: 86-10-8528-2104

Italy - Milan

Tel: 39-0331-742611

Fax: 39-0331-466781

Korea - Daegu

Tel: 82-53-744-4301

Fax: 82-53-744-4302

Boston

China - Chengdu

Tel: 86-28-8665-5511

Fax: 86-28-8665-7889

Westborough, MA

Tel: 774-760-0087

Fax: 774-760-0088

Netherlands - Drunen

Tel: 31-416-690399

Fax: 31-416-690340

Korea - Seoul

China - Chongqing

Tel: 86-23-8980-9588

Fax: 86-23-8980-9500

Tel: 82-2-554-7200

Fax: 82-2-558-5932 or

82-2-558-5934

Chicago

Itasca, IL

Tel: 630-285-0071

Fax: 630-285-0075

Spain - Madrid

Tel: 34-91-708-08-90

Fax: 34-91-708-08-91

China - Hong Kong SAR

Tel: 852-2401-1200

Fax: 852-2401-3431

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857

Fax: 60-3-6201-9859

Cleveland

UK - Wokingham

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Independence, OH

Tel: 216-447-0464

Fax: 216-447-0643

China - Nanjing

Tel: 86-25-8473-2460

Fax: 86-25-8473-2470

Malaysia - Penang

Tel: 60-4-227-8870

Fax: 60-4-227-4068

Dallas

Addison, TX

Tel: 972-818-7423

Fax: 972-818-2924

China - Qingdao

Tel: 86-532-8502-7355

Fax: 86-532-8502-7205

Philippines - Manila

Tel: 63-2-634-9065

Fax: 63-2-634-9069

Detroit

China - Shanghai

Tel: 86-21-5407-5533

Fax: 86-21-5407-5066

Singapore

Tel: 65-6334-8870

Fax: 65-6334-8850

Farmington Hills, MI

Tel: 248-538-2250

Fax: 248-538-2260

China - Shenyang

Tel: 86-24-2334-2829

Fax: 86-24-2334-2393

Taiwan - Hsin Chu

Tel: 886-3-6578-300

Fax: 886-3-6578-370

Kokomo

Kokomo, IN

Tel: 765-864-8360

Fax: 765-864-8387

China - Shenzhen

Tel: 86-755-8203-2660

Fax: 86-755-8203-1760

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Fax: 886-7-330-9305

Los Angeles

Mission Viejo, CA

Tel: 949-462-9523

Fax: 949-462-9608

China - Wuhan

Tel: 86-27-5980-5300

Fax: 86-27-5980-5118

Taiwan - Taipei

Tel: 886-2-2500-6610

Fax: 886-2-2508-0102

Santa Clara

China - Xian

Tel: 86-29-8833-7252

Fax: 86-29-8833-7256

Thailand - Bangkok

Tel: 66-2-694-1351

Fax: 66-2-694-1350

Santa Clara, CA

Tel: 408-961-6444

Fax: 408-961-6445

China - Xiamen

Tel: 86-592-2388138

Fax: 86-592-2388130

Toronto

Mississauga, Ontario,

Canada

Tel: 905-673-0699

Fax: 905-673-6509

China - Zhuhai

Tel: 86-756-3210040

Fax: 86-756-3210049

08/04/10

DS21996D-page 56

 2010 Microchip Technology Inc.


型号：	MCP98242T-CE/MC
厂家：	MICROCHIP
描述：	2-Wire Interface Temperature Sensor with EEPROM, -40C to +125C, 8-DFN, T/R 可编程只读存储器电动程控只读存储器电可擦编程只读存储器输出元件传感器换能器
文件：	总56页 (文件大小：789K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCP98242T-CE/MC [MICROCHIP]

相关型号：

MCP98242T-CE/ST

MCP98242_09

MCP98243

MCP98243-BE/MC

MCP98243-BE/MNY

MCP98243-BE/MUY

MCP98243-BE/ST

MCP98243T

MCP98243T-BE/MC

MCP98243T-BE/MCAA

MCP98243T-BE/MCAB

MCP98243T-BE/MNY