MCRF202-I/WB_技术文档

MCRF202

125 kHz Passive RFID Device with Sensor Input

Features

Package Type

PDIP/SOIC

• External sensor input

VA

1

8

VB

• Data polarity changes with sensor input condition

• Read-only data transmission

NC

2

3

4

7

6

5

NC

TEST

VSS

VCC

SENSOR

• 96- or 128-bits of factory programming user

memory (also supports 48- and 64-bit protocols)

• Operates up to 400 kHz carrier frequency

• Low-power operation

Description

The MCRF202 is a passive Radio Frequency Identifi-

cation (RFID) device that provides an RF interface for

reading the contents of a user memory array. This

device is specially designed to detect the logic state of

an external sensor, and alters its data transmissions,

based on the condition of the sensor input. The device

outputs a normal bit data stream if the sensor input has

a logic ‘1’ state, but outputs an inverted data stream for

a logic ‘0’ state. In this way, the reader can monitor the

state (condition) of the external sensor input by

detecting whether the data from the device is a normal

or inverted data stream.

• Modulation options:

- ASK, FSK, PSK

• Data Encoding options:

- NRZ Direct, Differential Biphase Manchester

Biphase

• Die, Wafer, PDIP or SOIC package option

• Factory programming and device serialization

Applications

• Insect control

• Industrial tagging

The device is powered by rectifying the incoming RF

carrier signal that is transmitted from the reader. When

the device develops sufficient DC voltage, it transmits

the contents of its memory array by modulating the

incoming RF carrier signal. The reader is able to detect

the modulation and decodes the data being transmit-

ted. Code length, modulation option, encoding option,

and bit rate are set at the factory to fit the needs of

particular applications.

RF

Signal

External

Reader

Sensor

Switch

MCRF202

Data

The MCRF202 is available in die, wafer, PDIP and

SOIC packages. The encoding, modulation, bit rate

options, and data fields are specified by the customer

and programmed by Microchip Technology Inc. prior to

shipment. See Technical Bulletin TB023 for more

information on factory serialization (SQTP™).

 2003 Microchip Technology Inc.

DS21308E-page 1

MCRF202

Block Diagram

Sensor

Input

Data

Modulation

Control Logic

Inverter

Clock

12-bit

Configuration

Register

VA

VB

Generator

External Coil

and Capacitor

Connections

VCC

VSS

Row

Decode

Mod

Circuit

Rectifier and

AC Clamp

128-bit

EEPROM

Memory Array

Baud

Power-On

Reset

Rate

Reset

Timing

Column

Decode

Counter

DS21308E-page 2

 2003 Microchip Technology Inc.

MCRF202

1.0

1.1

ELECTRICAL CHARACTERISTICS

(†)

Absolute Maximum Ratings

Storage temperature ..............................................................................................................................- 65°C to +150°C

Ambient temperature with power applied................................................................................................-40°C to +125°C

Maximum current into coil pads ..............................................................................................................................50 mA

† NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 1-1:

AC AND DC CHARACTERISTICS

All parameters apply across the

specified operating ranges

unless otherwise noted.

Industrial (I): TA = -40°C to +85°C

Parameter

Sym

Min

Typ

Max

Units

Conditions

Clock frequency

Data retention

FCLK

100

200

—

50

5

400

—

kHz

Years

µA

25°C

Coil current (Dynamic)

ICD

IDD

—

Operating current with no VCC

load

—

µA

VCC = 2V

No load to VCC pad

Operating current with VCC load

IDL

—

10

—

µA

VCC = 2V

VCC load through switch

to sensor

Turn-on-voltage (Dynamic) for

modulation

VAVB

VCC

CIN

RS

10

2

—

VPP

VDC

pF

Input Capacitance

—

2

—

Between VA and VB

SENSOR pull-down

SENSOR trigger threshold

400

0.5

800

1.0

1200

1.5

kΩ

V

VS

 2003 Microchip Technology Inc.

DS21308E-page 3

MCRF202

2.1.3

VCC REGULATOR

2.0

FUNCTIONAL DESCRIPTION

The device generates a DC supply voltage from the

unregulated coil voltage. The Vcc pin can be used to

power a separate low-current device (read range will

be affected).

The device contains three major building blocks. They

are RF front-end and sensor input, configuration and

control logic, and memory sections. The Block Diagram

is shown on page 1.

2.1.4

CLOCK GENERATOR

2.1

RF Front-End and Sensor Input

This circuit generates a clock based on the carrier

frequency from the reader. This clock is used to derive

all timing in the MCRF202, including the baud rate and

modulation rate.

The RF front-end of the device includes circuits for

rectification of the carrier, VDD (operating voltage), and

high-voltage clamping to prevent excessive voltage

from being applied to the device. This section also

generates a system clock from the incoming carrier

signal and modulates the carrier signal to transmit data

to the reader.

2.1.5

POWER-ON RESET

This circuit generates a Power-on Reset when the tag

first enters the interrogator field. The Reset releases

when sufficient power has developed on the VDD

regulator to allow correct operation.

2.1.1

RECTIFIER – AC CLAMP

The AC voltage generated by the external tuned LC

circuit is full wave rectified. This unregulated voltage is

used as the maximum DC supply voltage for the rest of

the device and for the VCC supply to the external

sensor or switch. Any excessive voltage on the tuned

circuit is clamped by the internal circuitry to a safe level

to prevent damage to the IC.

2.1.6

SENSOR INPUT AND DATA

INVERTER

The SENSOR input responds to logic high or logic low

voltages to drive the internal inverter on or off. A logic

high results in normal tag operation; a logic low at

SENSOR input activates an inverter, which inverts the

entire data stream prior to modulation.

2.1.2

MODULATION CIRCUIT

The SENSOR input has an internal pull-down resistor

of 800 kΩ (typical). See Figure 2-4 for application

details.

The MCRF202 sends the encoded data to the reader

by AM-modulating the coil voltage across the tuned LC

circuit. A modulation transistor is placed between the

antenna coil pads (VA and VB). The transistor turns on

and off based on the modulation signal. As a result, the

amplitude of the antenna coil voltage varies with the

modulation signal. See Figure 2-1 for details.

FIGURE 2-1:

MODULATION SIGNAL AND MODULATED SIGNAL

MCRF202

VA

Mod.

Signal

L

C

Mod. TR

VB

Amplitude

Modulation Signal

Modulated Signal

(across V and VB)

t

A

DS21308E-page 4

 2003 Microchip Technology Inc.

MCRF202

2.2.3

MODULATION OPTION

2.2

Configuration Register and

Control Logic

CB8 and CB9 determine the modulation protocol of the

encoded data. The available choices are:

The configuration register determines the operational

parameters of the device. It directly controls logic

blocks which generate the baud rate, memory size,

encoded data, modulation protocol, etc. CB11 is

always a zero. Once the array is successfully pro-

grammed at the factory, the lock bit CB12 is set. When

the lock bit is set, programming and erasing the device

becomes permanently disabled. Table 2-1 contains a

description of the control register bit functions.

• ASK

• FSK

• PSK_1

• PSK_2

When ASK (direct) option is chosen, the encoded data

is fed into the modulation transistor without change.

When FSK option is chosen, the encoded data is rep-

resented by:

2.2.1

BAUD RATE TIMING OPTION

a) Sets of 10 RF carrier cycles (first 5 cycles →

higher amplitude, the last 5 cycles → lower

amplitude) for logic “high” level.

The chip will access data at a baud rate determined by

bits CB2, CB3, and CB4 of the configuration register.

For example, MOD32 (CB2 = 0, CB3 = 1, CB4 = 1) has

32 RF cycles per bit. This gives the data rate of 4 kHz

for the RF carrier frequency of 128 kHz.

b) Sets of 8 RF carrier cycles (first 4 cycles →

higher amplitude, the last 4 cycles → lower

amplitude) for logic “low” level.

For example, FSK signal for MOD40 is represented:

2.2.2

DATA ENCODING OPTION

a) 4 sets of 10 RF carrier cycles for data ‘1’.

b) 5 sets of 8 RF carrier cycles for data ‘0’.

This logic acts upon the serial data being read from the

EEPROM. The logic encodes the data according to the

configuration bits CB6 and CB7. CB6 and CB7 deter-

mine the data encoding method. The available choices

are:

Refer to Figure 2-2 for the FSK signal with MOD40

option.

The PSK_1 represents change in the phase of the

modulation signal at the change of the encoded data.

For example, the phase changes when the encoded

data is changed from ‘1’ to ‘0’, or from ‘0’ to ‘1’.

• Non-return to zero-level (NRZ_L)

• Biphase_S (Differential)

• Biphase_L (Manchester)

• Inverted Manchester

The PSK_2 represents change in the phase at the

change on ‘1’. For example, the phase changes when

the encoded data is changed from ‘0’ to ‘1’, or from ‘1’

to ‘1’.

FIGURE 2-2:

ENCODED DATA AND FSK OUTPUT SIGNAL FOR MOD40 OPTION

Encoded Data ‘1’

Encoded Data ‘0’

5 cycles (HI)

5 cycles (LO)

4 cycles (HI)

4 cycles (LO)

40 RF cycles

 2003 Microchip Technology Inc.

DS21308E-page 5

MCRF202

FIGURE 2-3:

PSK DATA MODULATION

‘1’

‘0’

‘1’

Encoded Data

(NRZ_L)

PSK_ 1

Change on Data

PP

PSK _2

Change on ‘1’

P

PP

2.2.4

MEMORY ARRAY LOCK BIT (CB12)

2.4

Examples of Configuration

Settings

The CB12 bit must be a ‘1’ for a factory programmed

device.

EXAMPLE 2-1:

“88D” CONFIGURATION

2.3

Memory Section

The “88D” (hex) configuration is interpreted as

follows:

The device has 128 bits of one-time programmable

(OTP) memory. The user can choose 96 or 128 bits by

selecting the CB1 bit in the configuration register. See

Table 2-1 for more details.

CB1

CB12

“88D” → 1000-1000-1101

Referring to Table 2-1, the “88D” configuration

represents:

2.3.1

COLUMN AND ROW DECODER

LOGIC AND BIT COUNTER

Modulation = PSK_1

PSK rate = rf/2

The column and row decoders address the EEPROM

array at the clock rate and generate a serial data

stream for modulation. This data stream can be up to

128 bits in length. The size of the data stream is user

programmable with CB1 and can be set to 96 or 128

bits. Data lengths of 48 and 64 bits are available by

programming the data twice in the array, end-to-end.

Data encoding = NRZ_L (direct)

Baud rate = rf/32 = MOD32

Memory size: 128 bits

Programmed device

EXAMPLE 2-2:

“80A” CONFIGURATION

The column and row decoders route the proper voltage

to the array for programming and reading. In the

programming modes, each individual bit is addressed

serially from bit 1 to bit 128.

The “80A” (hex) configuration is interpreted as

follows:

CB1

CB12

“80A” → 1000-0000-1010

The MSB corresponds to CB12 and the LSB

corresponds to CB1 of the configuration register.

Therefore, we have:

CB12=1

CB8=0

CB4=1

CB11=0

CB7=0

CB3=0

CB10=0

CB6=0

CB2=1

CB9=0

CB5=0

CB1=0

Referring to Table 2-1, the “80A” configuration

represents:

Programmed device, FSK protocol, NRZ_L

(direct) encoding, MOD50 (baud rate = rf/50),

96 bits.

DS21308E-page 6

 2003 Microchip Technology Inc.

MCRF202

TABLE 2-1:

CONFIGURATION REGISTER

CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1

ARRAY SIZE

CB1 = 1 128-bit user array

CB1 = 0 96-bit user array

TIMING

CB2 CB3 CB4

Rate

0

1

0

1

0

1

0

1

0

1

0

1

0

1

MOD128

MOD100

MOD80

MOD32

MOD64

MOD50

MOD40

MOD16

NOT USED

CB5 = 0

DATA ENCODING

CB6 = 0; CB7 = 0 NRZ_L (Direct)

CB6 = 0; CB7 = 1 Biphase_S (Differential)

CB6 = 1; CB7 = 0 Biphase_L (Manchester)

CB6 = 1; CB7 = 1 (Inverted Manchester)

MODULATION OPTIONS

CB8 = 0; CB9 = 0 FSK 0 = Fc/8, 1 = Fc/10

CB8 = 0; CB9 = 1 Direct

CB8 = 1; CB9 = 0 PSK_1

(phase change on change of data)

CB8 = 1; CB9 = 1 PSK_2

(phase change at beginning of a one)

PSK RATE OPTION

CB10 = 1 clk/4 carrier

CB10 = 0 clk/2 carrier

(NOT USED)

CB11 = 0

ARRAY LOCK BIT

CB12 = 1

 2003 Microchip Technology Inc.

DS21308E-page 7

MCRF202

FIGURE 2-4:

TYPICAL APPLICATION CIRCUITS

Using MCRF202 with an external passive switch or sensor

RF Carrier

Signal

I

Input capacitance: 2 pF

Vss

From

Oscillator

125 kHz

Pad VA

Vcc

External

Switch

or Sensor

4.91 mH

(L)

330 pF

(C)

L

SENSOR

Pad VB

To Reader

MCRF202

Data Detection

Data

Circuit

C

1

f

= ------------------- = 1 2 5 kHz

2π LC

res

Device Output

External Switch CLOSED (Logic “1” in SENSOR Input):Normal Data Stream

External Switch OPEN (Logic “0” in SENSOR Input): Inverted Data Stream

Using MCRF202 with an external, self-powered system

RF Carrier

Signal

Input capacitance: 2 pF

Vss

I

From

oscillator

125 kHz

Pad VA

Vcc

Self-Powered

External System

330 pF

(C)

4.91 mH

L

(L)

SENSOR

Pad VB

To Reader

MCRF202

Data Detection

Data

Circuit

C

1

f

= ------------------- = 1 2 5 kHz

2π LC

res

Device Output

Logic “1” in SENSOR Input:

Logic “0” in SENSOR Input:

Normal Data Stream

Inverted Data Stream

Using MCRF202 with a low-resistance pull-down

RF Carrier

Signal

I

Input capacitance: 2 pF

Vss

From

oscillator

125 kHz

Pad VA

Vcc

SW

External

Resistor

4.91 mH

(L)

330 pF

(C)

L

SENSOR

Pad VB

To Reader

MCRF202

Data Detection

Data

Circuit

C

1

f

= ------------------- = 1 2 5 kHz

res

2π LC

Device Output

External Switch CLOSED (Logic “1” in SENSOR Input): Normal Data Stream

External Switch OPEN (Logic “0” in SENSOR Input): Inverted Data Stream

DS21308E-page 8

 2003 Microchip Technology Inc.

MCRF202

TABLE 3-1:

PAD COORDINATES (µM)

3.0

MECHANICAL

SPECIFICATIONS FOR DIE

AND WAFER

Passivation

Openings

Pad

Name

Pad

Width

Pad

Height

FIGURE 3-1:

DIE PLOT

Center Center

X

Y

VSS

VCC SENSOR TEST

VA

90.0

105.3

90.0

112.5

90.0

427.50 -734.17

-408.60 -734.17

-417.60 722.47

-164.70 723.82

VB

VSS

VCC

SENSOR

TEST

69.30

723.82

325.35

Note 1: All coordinates are referenced from the

center of the die.

2: Die size: 1.1215 mm x 1.7384 mm.

TABLE 3-2:

Name

PAD FUNCTION TABLE

Function

VA, VB

VSS

Coil and capacitor connections

Device ground

VB

VA

VCC

DC supply out from device

Sensor input

SENSOR

TEST

Do Not Connect, Test pin

 2003 Microchip Technology Inc.

DS21308E-page 9

MCRF202

TABLE 3-3:

DIE MECHANICAL DIMENSIONS

Specifications

Min

Typ

Max

Unit

Comments

Note 1, Note 2

Bond pad opening

—

3.5 x 3.5

89 x 89

—

mil

µm

Die backgrind thickness

—

7

—

mil

µm

Sawed 6” wafer on frame

(option = WF) Note 3

177.8

—

11

279.4

—

mil

µm

Unsawed wafer

(option = W) Note 3

Die backgrind thickness tolerance

Die passivation thickness (multilayer)

—

±1

±25.4

mil

µm

—

0.9050

—

µm

Note 4

Die Size:

Die size X*Y before saw (step size)

Die size X*Y after saw

—

44.15 x 68.44

42.58 x 66.87

—

mil

—

Note 1: The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at

least 0.1 mil.

2: Metal Pad Composition is 98.5% Aluminum with 1% Si and 0.5% Cu.

3: As the die thickness decreases, susceptibility to cracking increases. It is recommended that the die be as

thick as the application will allow.

4: The Die Passivation thickness can vary by device depending on the mask set used:

- Layer 1: Oxide (undopped oxide 0.135 µm)

- Layer 2: PSG (dopped oxide, 0.43 µm)

- Layer 3: Oxynitride (top layer, 0.34 µm)

5: The conversion rate is 25.4 µm/mil.

Notice: Extreme care is urged in the handling and assembly of die products since they are susceptible to

mechanical and electrostatic damage.

TABLE 3-4:

WAFER MECHANICAL SPECIFICATIONS

Specifications

Min

Typ

Max

Unit

Comments

Wafer Diameter

Die separation line width

Dice per wafer

—

8

80

—

inch 150 mm

µm

die

14,000

24

Batch size

wafer

DS21308E-page 10

 2003 Microchip Technology Inc.

MCRF202

4.0

FAILED DIE IDENTIFICATION

6.0

NOTICE ON DIE AND WAFER

HANDLING

Every die on the wafer is electrically tested according

to the data sheet specifications and visually inspected

to detect any mechanical damage such as mechanical

cracks and scratches.

The device is very susceptible to Electrostatic

Discharge (ESD). ESD can cause critical damage to

the device. Special attention is needed during the

handling process.

Any failed die in the test or visual inspection is identified

by black colored inking. Therefore, any die covered

with black ink should not be used.

Any ultraviolet (UV) light can erase the memory cell

contents of an unpackaged device. Fluorescent lights

and sun light can also erase the memory cell although

it takes more time than UV lamps. Therefore, keep any

unpackaged devices out of UV light and also avoid

direct exposure from strong fluorescent lights and sun

light.

The ink dot specification:

• Ink dot size: minimum 20 µm x 20 µm

• Position: central third of die

• Color: black

Certain integrated circuit (IC) manufacturing, chip-on-

board (COB) and tag assembly operations may use UV

light. Operations such as backgrind, de-tape, certain

cleaning operations, epoxy or glue cure should be done

without exposing the die surface to UV light.

5.0

WAFER DELIVERY

DOCUMENTATION

Each wafer container is marked with the following

information:

Using x-ray for die inspection will not harm the die, nor

erase memory cell contents.

• Microchip Technology Inc. MP Code

• Lot Number

• Total number of wafer in the container

• Total number of good dice in the container

• Average die per wafer (DPW)

• Scribe number of wafer with number of good dice.

 2003 Microchip Technology Inc.

DS21308E-page 11

MCRF202

7.0

7.1

PACKAGING INFORMATION

Package Marking Information

8-Lead PDIP (300 mil)

Example:

MCRF202

XXXXXXXX

XXXXXNNN

YYWW

0025

8-Lead SOIC (150 mil)

Example:

XXXXXXX

XXXYYWW

MCRF202

XXX0025

NNN

Legend: XX...X Customer specific information*

YY

WW

NNN

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*

Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

DS21308E-page 12

 2003 Microchip Technology Inc.

MCRF202

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

E1

D

2

n

1

α

E

A2

A

L

c

A1

β

B1

B

p

eB

Units

INCHES*

NOM

MILLIMETERS

NOM

Dimension Limits

MIN

MAX

MIN

MAX

n

p

Number of Pins

Pitch

8

.100

.155

.130

2.54

3.94

3.30

Top to Seating Plane

A

.140

.170

3.56

4.32

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

A2

A1

E

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

5

.145

2.92

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

5

3.68

.313

.250

.373

.130

.012

.058

.018

.370

10

.325

.260

.385

.135

.015

.070

.022

.430

15

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

10

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

15

E1

D

Tip to Seating Plane

Lead Thickness

L

c

Upper Lead Width

B1

B

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

§

eB

α

β

5

10

15

5

10

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

 2003 Microchip Technology Inc.

DS21308E-page 13

MCRF202

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

n

1

h

α

45°

c

A2

A

φ

β

L

A1

Units

INCHES*

NOM

MILLIMETERS

Dimension Limits

MIN

MAX

MIN

NOM

8

MAX

n

p

Number of Pins

Pitch

8

.050

.061

.056

.007

.237

.154

.193

.015

.025

4

1.27

Overall Height

A

.053

.069

1.35

1.32

1.55

1.42

0.18

6.02

3.91

4.90

0.38

0.62

4

1.75

Molded Package Thickness

Standoff

A2

A1

E

.052

.004

.228

.146

.189

.010

.019

0

.061

.010

.244

.157

.197

.020

.030

8

1.55

0.25

6.20

3.99

5.00

0.51

0.76

8

§

0.10

5.79

3.71

4.80

0.25

0.48

0

Overall Width

Molded Package Width

Overall Length

E1

D

Chamfer Distance

Foot Length

h

L

φ

Foot Angle

c

Lead Thickness

Lead Width

.008

.013

0

.009

.017

12

.010

.020

15

0.20

0.33

0

0.23

0.42

12

0.25

0.51

15

B

α

Mold Draft Angle Top

Mold Draft Angle Bottom

β

0

12

15

0

12

15

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

DS21308E-page 14

 2003 Microchip Technology Inc.

MCRF202

ON-LINE SUPPORT

SYSTEMS INFORMATION AND

UPGRADE HOT LINE

Microchip provides on-line support on the Microchip

World Wide Web site.

The Systems Information and Upgrade Line provides

system users a listing of the latest versions of all of

Microchip's development systems software products.

Plus, this line provides information on how customers

can receive the most current upgrade kits. The Hot Line

Numbers are:

The web site is used by Microchip as a means to make

files and information easily available to customers. To

view the site, the user must have access to the Internet

and a web browser, such as Netscape^®or Microsoft^®

Internet Explorer. Files are also available for FTP

download from our FTP site.

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

Connecting to the Microchip Internet

Web Site

042003

The Microchip web site is available at the following

URL:

www.microchip.com

The file transfer site is available by using an FTP

service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of

services. Users may download files for the latest

Development Tools, Data Sheets, Application Notes,

User's Guides, Articles and Sample Programs. A

variety of Microchip specific business information is

also available, including listings of Microchip sales

offices, distributors and factory representatives. Other

data available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked

Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to

Microchip Products

• Conferences for products, Development Systems,

technical information and more

• Listing of seminars and events

 2003 Microchip Technology Inc.

DS21308E-page 15

MCRF202

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-

uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation

can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

Reader Response

Total Pages Sent ________

RE:

From:

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

FAX: (______) _________ - _________

Application (optional):

Would you like a reply?

Y

N

MCRF202

DS21308E

Literature Number:

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21308E-page 16

 2003 Microchip Technology Inc.

MCRF202

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

-X

/XXX

XXX

Examples:

a)

MCRF202-I/WQ99= 125 kHz, industrial

temperature, wafer package, factory

programmed, sensor input, "Q99" sample

customer code.

Temperature Package Configuration

Range

Device:

MCRF202 = 125 kHz MicroID tag with Sensor input,

96/128-bit

Temperature Range:

Package:

I

=

-40°C to +85°C

WF

W

S

=

Sawed wafer on frame (7 mil backgrind)

Wafer (11 mil backgrind)

Dice in waffle pack (11 mil backgrind)

Sawed, Bumped wafer on frame

(11 mil backgrind)

WFB

WB

SB

SN

P

=

Bumped wafer (11 mil backgrind)

Bumped die in waffle pack (11 mil backgrind)

Plastic SOIC (150 mil body) 8-lead

Plastic DIP (300 mil body) 8-lead

Configuration:

SQTP Customer Identifier. Assigned during the SQTP

(factory programming) approval process. Usually QXX

where XX is an integer used to track customer data files.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-

mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

2003 Microchip Technology Inc.

DS21308E-page17

MCRF202

NOTES:

DS21308E-page18

2003 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is intended through suggestion only

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

No representation or warranty is given and no liability is

assumed by Microchip Technology Incorporated with respect

to the accuracy or use of such information, or infringement of

patents or other intellectual property rights arising from such

use or otherwise. Use of Microchip’s products as critical com-

ponents in life support systems is not authorized except with

express written approval by Microchip. No licenses are con-

veyed, implicitly or otherwise, under any intellectual property

rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE and PowerSmart are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,

SEEVAL, SmartShunt and The Embedded Control Solutions

Company are registered trademarks of Microchip Technology

Incorporated in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net,

dsPICworks, ECAN, ECONOMONITOR, FanSense,

FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,

ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,

MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,

PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,

Select Mode, SmartSensor, SmartTel and Total Endurance

are trademarks of Microchip Technology Incorporated in the

U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark

of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in October

2003 . The Company’s quality system processes and procedures are

for its PICmicro^®8-bit MCUs, KEELOQ^®code hopping devices, Serial

EEPROMs, microperipherals, non-volatile memory and analog

products. In addition, Microchip’s quality system for the design and

manufacture of development systems is ISO 9001:2000 certified.

 2003 Microchip Technology Inc.

DS21308E-page 19

WORLDWIDE SALES AND SERVICE

Korea

AMERICAS

ASIA/PACIFIC

168-1, Youngbo Bldg. 3 Floor

Samsung-Dong, Kangnam-Ku

Seoul, Korea 135-882

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or

82-2-558-5934

Corporate Office

Australia

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7200

Suite 22, 41 Rawson Street

Epping 2121, NSW

Australia

Fax: 480-792-7277

Technical Support: 480-792-7627

Web Address: http://www.microchip.com

Tel: 61-2-9868-6733

Fax: 61-2-9868-6755

Singapore

200 Middle Road

#07-02 Prime Centre

Singapore, 188980

Tel: 65-6334-8870 Fax: 65-6334-8850

China - Beijing

Unit 706B

Wan Tai Bei Hai Bldg.

No. 6 Chaoyangmen Bei Str.

Beijing, 100027, China

Tel: 86-10-85282100

Fax: 86-10-85282104

Atlanta

3780 Mansell Road, Suite 130

Alpharetta, GA 30022

Tel: 770-640-0034

Fax: 770-640-0307

Taiwan

Kaohsiung Branch

30F - 1 No. 8

Min Chuan 2nd Road

Kaohsiung 806, Taiwan

Tel: 886-7-536-4818

Fax: 886-7-536-4803

Boston

China - Chengdu

2 Lan Drive, Suite 120

Westford, MA 01886

Tel: 978-692-3848

Fax: 978-692-3821

Rm. 2401-2402, 24th Floor,

Ming Xing Financial Tower

No. 88 TIDU Street

Chengdu 610016, China

Tel: 86-28-86766200

Taiwan

Taiwan Branch

11F-3, No. 207

Tung Hua North Road

Taipei, 105, Taiwan

Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Chicago

333 Pierce Road, Suite 180

Itasca, IL 60143

Tel: 630-285-0071

Fax: 630-285-0075

Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza

No. 71 Wusi Road

Dallas

Fuzhou 350001, China

Tel: 86-591-7503506

Fax: 86-591-7503521

EUROPE

Austria

Durisolstrasse 2

A-4600 Wels

Austria

Tel: 43-7242-2244-399

Fax: 43-7242-2244-393

Denmark

Regus Business Centre

Lautrup hoj 1-3

4570 Westgrove Drive, Suite 160

Addison, TX 75001

Tel: 972-818-7423

Fax: 972-818-2924

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza

223 Hing Fong Road

Kwai Fong, N.T., Hong Kong

Tel: 852-2401-1200

Fax: 852-2401-3431

Detroit

Tri-Atria Office Building

32255 Northwestern Highway, Suite 190

Farmington Hills, MI 48334

Tel: 248-538-2250

China - Shanghai

Room 701, Bldg. B

Far East International Plaza

No. 317 Xian Xia Road

Shanghai, 200051

Tel: 86-21-6275-5700

Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza

No. 5022 Binhe Road, Futian District

Shenzhen 518033, China

Tel: 86-755-82901380

Fax: 86-755-8295-1393

China - Shunde

Fax: 248-538-2260

Ballerup DK-2750 Denmark

Tel: 45-4420-9895 Fax: 45-4420-9910

Kokomo

France

2767 S. Albright Road

Kokomo, IN 46902

Tel: 765-864-8360

Fax: 765-864-8387

Parc d’Activite du Moulin de Massy

43 Rue du Saule Trapu

Batiment A - ler Etage

91300 Massy, France

Tel: 33-1-69-53-63-20

Fax: 33-1-69-30-90-79

Los Angeles

18201 Von Karman, Suite 1090

Irvine, CA 92612

Tel: 949-263-1888

Fax: 949-263-1338

Germany

Steinheilstrasse 10

D-85737 Ismaning, Germany

Tel: 49-89-627-144-0

Fax: 49-89-627-144-44

Phoenix

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: 480-792-7966

Fax: 480-792-4338

Room 401, Hongjian Building

No. 2 Fengxiangnan Road, Ronggui Town

Shunde City, Guangdong 528303, China

Tel: 86-765-8395507 Fax: 86-765-8395571

Italy

Via Quasimodo, 12

20025 Legnano (MI)

Milan, Italy

China - Qingdao

Rm. B505A, Fullhope Plaza,

No. 12 Hong Kong Central Rd.

Qingdao 266071, China

Tel: 86-532-5027355 Fax: 86-532-5027205

San Jose

Tel: 39-0331-742611

Fax: 39-0331-466781

Netherlands

P. A. De Biesbosch 14

NL-5152 SC Drunen, Netherlands

Tel: 31-416-690399

1300 Terra Bella Avenue

Mountain View, CA 94043

Tel: 650-215-1444

Toronto

India

6285 Northam Drive, Suite 108

Mississauga, Ontario L4V 1X5, Canada

Tel: 905-673-0699

Divyasree Chambers

1 Floor, Wing A (A3/A4)

No. 11, O’Shaugnessey Road

Bangalore, 560 025, India

Tel: 91-80-2290061 Fax: 91-80-2290062

Japan

Fax: 31-416-690340

United Kingdom

505 Eskdale Road

Winnersh Triangle

Fax: 905-673-6509

Wokingham

Berkshire, England RG41 5TU

Tel: 44-118-921-5869

Fax: 44-118-921-5820

Benex S-1 6F

3-18-20, Shinyokohama

Kohoku-Ku, Yokohama-shi

Kanagawa, 222-0033, Japan

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

11/24/03

DS21308E-page 20

 2003 Microchip Technology Inc.


型号：	MCRF202-I/WB
厂家：	MICROCHIP
描述：	125 kHz Passive RFID Device with Sensor Input 125千赫无源RFID器件与传感器输入传感器
文件：	总20页 (文件大小：331K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MCRF202-I/WB [MICROCHIP]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB